Self-repairing degradable epoxy resin and its preparation method and application

Abstract

The present invention provides a self-healing degradable epoxy resin and its preparation method and application. The structure of the self-healing epoxy resin is shown in the following formula (I), and R1, R2, R3, and R4 are each independently selected from substituted or unsubstituted C1-C10 alkylene groups. The ester bond structure contained in the self-healing degradable epoxy resin structure provided by the application gives the epoxy resin the characteristics of easy degradation, recyclability, and self-healing. The flexible Si-O-Si structure contained in the structure gives the epoxy resin excellent thermal stability and toughness, thereby not only solving the problem of traditional epoxy resins being difficult to degrade and non-recyclable after molding, but also solving the problem of poor toughness and thermal stability after molding of traditional epoxy resins, and has broad application prospects.

Description

Technical Field

[0001] The present invention relates to the technical field of epoxy resins, and in particular to a self-repairing degradable epoxy resin and a preparation method and application thereof. Background Art

[0002] Thermosetting resins are an indispensable component of daily life and industry. Epoxy resin, as one of the main thermosetting resins, is widely used in transportation, construction, home furnishings, and electronic appliances due to its advantages such as good dimensional stability, creep resistance, and electrical insulation. However, traditional epoxy resins form an irreversible cross-linked network after curing, exhibiting insoluble and infusible properties. This makes it impossible to degrade, recycle, and reprocess after molding, resulting in serious resource waste and environmental pollution. Therefore, in order to better utilize epoxy resins and their composite materials, there is an urgent need to develop an epoxy resin that is easily degradable and recyclable. Summary of the Invention

[0003] The main purpose of the present invention is to provide a self-healing epoxy resin and its preparation method and application, so as to solve the problem that traditional epoxy resin forms an irreversible cross-linked network after curing, and cannot be degraded, recycled and reprocessed after molding, thereby causing serious waste of resources and environmental pollution.

[0004] In order to achieve the above object, according to one aspect of the present invention, a self-repairing degradable epoxy resin is provided. The structure of the self-repairing epoxy resin is shown in the following formula (I):

[0005]

[0006] R1, R2, R3, and R4 are each independently selected from substituted or unsubstituted C1-C10 alkylene groups.

[0007] Furthermore, R1 and R2 are each independently selected from substituted or unsubstituted C2-C4 alkylene; R3 is selected from substituted or unsubstituted C1-C3 alkylene; and R4 is selected from substituted or unsubstituted C4-C10 alkylene.

[0008] Furthermore, R1 and R2 are each independently selected from substituted or unsubstituted propylene, substituted or unsubstituted methylethylene; R3 is selected from substituted or unsubstituted ethylene; and R4 is selected from substituted or unsubstituted octylene and decylene.

[0009] According to one aspect of the present invention, a method for preparing the self-healing degradable epoxy resin is provided, the method comprising: step S1, mixing a silicon-containing diamine compound and an epoxy halide in a solvent to carry out a substitution reaction to obtain an intermediate product system, and purifying the intermediate product system to obtain an epoxidized siloxane; step S2, mixing the epoxidized siloxane with a dicarboxylic acid compound to carry out an ester exchange reaction to obtain a self-healing degradable epoxy resin; wherein the silicon-containing diamine compound has a structure as shown in formula (II), the epoxy halide has a structure as shown in formula (III), the epoxidized siloxane has a structure as shown in formula (IV), and the dicarboxylic acid compound has a structure as shown in formula (V).

[0010]

[0011] HOOC-R4-COOH

[0012] Formula (V);

[0013] R1, R2, R3, and R4 each have the same meaning as in the first aspect above, and X represents a halogen.

[0014] Furthermore, in step S1, the temperature of the substitution reaction is 45-55° C., and the reaction time is 3-6 h.

[0015] Furthermore, the molar ratio of the epoxy halide to the silicon-containing diamine compound is 40 to 50:1.

[0016] Furthermore, in step S1, the substitution reaction is carried out under the action of a first catalyst, the catalyst is an alkaline solution, preferably the alkaline solution is a sodium hydroxide solution, and more preferably the mass concentration of the sodium hydroxide solution is 30% to 55%.

[0017] Furthermore, the solvent is a C1-C4 alcohol, more preferably ethanol.

[0018] Furthermore, the volume ratio of ethanol to the silicon-containing diamine compound is 35 to 40: 1. Furthermore, in step S1, purification of the intermediate product system comprises a first distillation, washing, a second distillation and drying performed sequentially.

[0019] Furthermore, the detergent used for washing is n-hexane, and the molar ratio of n-hexane to epoxy halide is 35-40:1.

[0020] Furthermore, the drying temperature is 50-65° C., and the drying time is 8-14 hours.

[0021] Furthermore, in step S2, the temperature of the transesterification reaction is 90 to 180° C. and the time is 1 to 8 hours;

[0022] Furthermore, the molar ratio of the epoxidized siloxane to the dicarboxylic acid compound is 1.6 to 2.6:1.

[0023] Furthermore, in step S2, the mixing temperature is 90-100°C and the mixing time is 5-25 minutes. According to a third aspect of the present invention, there is provided an application of any of the self-healing degradable epoxy resins provided in the first aspect or the self-healing degradable epoxy resins obtained by any of the preparation methods provided in the second aspect in the fields of transportation, construction, home furnishings, and electronic appliances.

[0024] By applying the technical solution provided in the present application, the ester bond structure contained in the self-healing degradable epoxy resin structure provided in the present application gives the epoxy resin the characteristics of easy degradation, recyclability and self-healing. The flexible Si-O-Si structure contained in the structure gives the epoxy resin excellent thermal stability and toughness, thereby not only solving the problem that traditional epoxy resins are difficult to degrade and non-recyclable after molding, but also solving the problem of poor toughness and thermal stability of traditional epoxy resins after molding, and has broad application prospects. BRIEF DESCRIPTION OF THE DRAWINGS

[0025] The accompanying drawings, which constitute part of this application, are intended to provide a further understanding of the present invention. The exemplary embodiments of the present invention and their descriptions are intended to explain the present invention and do not constitute an undue limitation of the present invention. In the accompanying drawings:

[0026] Figure 1 An optical microscope photograph of a self-healing test of a self-healing degradable epoxy resin provided in Example 1 of the present invention is shown. DETAILED DESCRIPTION

[0027] It should be noted that, in the absence of conflict, the embodiments and features of the embodiments in this application can be combined with each other. The present invention will be described in detail below with reference to the accompanying drawings and in combination with the embodiments.

[0028] As analyzed in the background technology of this application, traditional epoxy resins form irreversible cross-linked networks after curing, showing insoluble and infusible properties. As a result, they cannot be degraded, recycled, or reprocessed after molding, resulting in significant resource waste and environmental pollution. To address this problem, this application provides a self-healing biodegradable epoxy resin, a preparation method, and applications thereof.

[0029] In a typical embodiment of the present application, a self-healing degradable epoxy resin is provided. The structure of the self-healing degradable epoxy resin is shown in the following formula (I), wherein R1, R2, R3, and R4 are each independently selected from substituted or unsubstituted C1 to C10 alkylene groups.

[0030]

[0031] By applying the technical solution provided in the present application, the ester bond structure contained in the self-healing degradable epoxy resin structure provided in the present application gives the epoxy resin the characteristics of easy degradation, recyclability and self-healing. The flexible Si-O-Si structure contained in the structure gives the epoxy resin excellent thermal stability and toughness, thereby not only solving the problem that traditional epoxy resins are difficult to degrade and non-recyclable after molding, but also solving the problem of poor toughness and thermal stability of traditional epoxy resins after molding, and has broad application prospects.

[0032] In order to further improve the degradability, it is preferred that R1 and R2 are each independently selected from substituted or unsubstituted C2~C4 alkylene groups, such as ethylene, propylene, isopropylene, butylene, etc.; R3 is selected from substituted or unsubstituted C1~C3 alkylene groups, such as methyl and ethylene, etc.; R4 is selected from substituted or unsubstituted C4~C10 alkylene groups, such as butylene, octylene, decylene, etc.

[0033] In some embodiments of the present application, preferably, R1 and R2 are each independently selected from substituted or unsubstituted propylene, substituted or unsubstituted methylethylene, R3 is selected from substituted or unsubstituted ethylene; and when R4 is selected from substituted or unsubstituted decylene or decylene, the self-healing degradable epoxy resin has better mechanical properties, degradability and self-healing properties.

[0034] In a second typical embodiment of the present application, a method for preparing a self-healing degradable epoxy resin is also provided, the preparation method comprising: step S1, mixing a silicon-containing diamine compound and an epoxy halide in a solvent to carry out a substitution reaction to obtain an intermediate product system, and purifying the intermediate product system to obtain an epoxidized siloxane; step S2, mixing the epoxidized siloxane with a dicarboxylic acid compound to carry out an ester exchange reaction to obtain a self-healing degradable epoxy resin; wherein the silicon-containing diamine compound has a structure as shown in the following formula (II), the epoxy halide has a structure as shown in the following formula (III), the epoxidized siloxane has a structure as shown in the following formula (IV); and the dicarboxylic acid compound has a structure as shown in the following formula (V);

[0035]

[0036]

[0037] HOOC-R4-COOH

[0038] Formula (V);

[0039] The above R1, R2, R3, and R4 each have the same meaning as in the above first exemplary embodiment, and X represents a halogen, such as chlorine, bromine, iodine, and the like.

[0040] By applying the technical solution of the present application, the preparation method of the self-healing degradable epoxy resin provided by the present application first introduces epoxy groups into the silicon-containing diamine compound through a substitution reaction, and then forms ester bonds through an ester exchange reaction. The process is simple and easy to operate, and can be applied to industrial production, reducing preparation costs.

[0041] In order to further improve the efficiency of the substitution reaction, preferably, in step S1, the substitution reaction temperature is 45 to 55° C. and the reaction time is 3 to 6 hours.

[0042] In order to further improve the yield of epoxidized siloxane, the molar ratio of the epoxy halide to the silicon-containing diamine compound is preferably 40 to 50:1.

[0043] In order to prevent the presence of gases such as oxygen in the atmosphere from affecting the substitution reaction in step S1, the substitution reaction is preferably carried out under the protection of an inert gas or nitrogen.

[0044] Typically but not limitatively, the temperature of the substitution reaction is 45°C, 48°C, 50°C, 52°C, or 55°C; the reaction time is 3h, 3.5h, 4h, 5h, 6h, or a range consisting of any two values; the molar ratio of the epoxy halide to the silicon-containing diamine compound is 40:1, 42:1, 45:1, 48:1, 50:1, or a range consisting of any two values.

[0045] In order to further improve the efficiency of the substitution reaction, preferably, in step S1, the substitution reaction is carried out under the action of a first catalyst, and the catalyst is an alkaline solution. From the perspective of reducing costs, the alkaline solution is preferably a sodium hydroxide solution, especially when the mass concentration of the sodium hydroxide solution is 30% to 55%, which is more conducive to improving the catalytic efficiency.

[0046] In order to further promote sufficient contact between the silicon-containing diamine compound and the epoxy halide in the solvent, the solvent is preferably a C1-C4 alcohol, such as methanol, ethanol, propanol or n-butanol. From the perspective of environmental protection and cost reduction, ethanol is further preferred.

[0047] In order to further improve the yield of epoxidized siloxane, the volume ratio of ethanol to silicon-containing diamine compound is preferably 35 to 40:1.

[0048] In order to prevent the solvent or unreacted epoxy halide in the intermediate product system from affecting the subsequent transesterification reaction, preferably, step S1, the purification of the intermediate product system includes a first distillation, washing, a second distillation and drying. The first distillation removes the solvent and the unreacted epoxy halide. In order to further remove the solvent and other substances remaining on the surface of the product after the first distillation, a detergent is preferably used for washing, preferably n-hexane, so that the solvent and other substances are removed more completely. Then, the n-hexane and other substances are removed by a second distillation. Finally, drying is used to avoid impurities such as moisture remaining on the surface of the product.

[0049] To further improve the washing efficiency, the molar ratio of n-hexane to epoxy halide is preferably 35 to 40: 1. To further improve the drying efficiency, the drying temperature is preferably 50 to 65° C. and the drying time is preferably 8 to 14 hours.

[0050] Typically but not limitatively, in step S1, when the solvent is ethanol, the volume ratio of ethanol to the silicon-containing diamine compound is 35:1, 36:1, 37:1, 38:1, 39:1, 40:1 or a range consisting of any two values; in the purification stage, when the detergent is n-hexane, the molar ratio of n-hexane to the epoxy halide is 35:1, 36:1, 37:1, 38:1, 39:1, 40:1 or a range consisting of any two values; in the purification stage, the drying temperature is, for example, 50°C, 52°C, 55°C, 58°C, 60°C, 62°C, 65°C or a range consisting of any two values; the drying time is, for example, 8h, 9h, 10h, 12h, 14h or a range consisting of any two values.

[0051] In order to further improve the efficiency of transesterification, preferably, in step S2, the temperature of the transesterification reaction is 90 to 180° C. and the time is 1 to 8 hours.

[0052] In order to further improve the mechanical properties of the self-healing degradable epoxy resin and reduce the waste of the dicarboxylic acid compound, it is preferred that in step S2, the molar ratio of the epoxidized siloxane to the dicarboxylic acid compound is 1.6 to 2.6:1.

[0053] Since the epoxidized siloxane and the dicarboxylic acid compound will solidify after transesterification, the epoxidized siloxane and the dicarboxylic acid compound are first mixed uniformly at low temperature and then heated to perform transesterification reaction and solidification. The preferred mixing temperature is 90-100° C. and the mixing time is 5-25 minutes.

[0054] Typically but not limitatively, in step S2, the temperature of the transesterification reaction is 90° C., 100° C., 110° C., 120° C., 130° C., 140° C., 150° C., 160° C., 170° C., 180° C., or a range consisting of any two values; the time of the transesterification reaction is 1 h, 2 h, 3 h, 4 h, 5 h, 6 h, 7 h, 8 h, or a range consisting of any two values; the molar ratio of the epoxidized siloxane to the dicarboxylic acid compound is 1.6:1, 1.8:1, 2:1, 2.2:1, 2.5:1, 2.6:1, or a range consisting of any two values; the temperature of the mixing of the epoxidized siloxane and the dicarboxylic acid is 90° C., 92° C., 95° C., 98° C., 100° C., and the mixing time is 5 min, 8 min, 10 min, 12 min, 15 min, 18 min, 20 min, 22 min, 25 min, or a range consisting of any two values.

[0055] In some embodiments of the present application, the process for preparing the self-healing degradable epoxy resin is as follows:

[0056]

[0057] In the third typical embodiment of the present application, there is also provided the application of any self-repairing degradable epoxy resin provided in the above-mentioned first typical embodiment or the self-modifying degradable epoxy resin obtained according to any preparation method provided in the above-mentioned second typical embodiment in the fields of transportation, construction, home and electronic appliances.

[0058] The beneficial effects of the present application will be described below with reference to examples and comparative examples.

[0059] Example 1

[0060] This embodiment 1 provides a self-repairing degradable epoxy resin, which has a structure shown in the following formula (1):

[0061]

[0062] The self-repairing degradable epoxy resin is prepared according to the following steps:

[0063] (1) Under inert gas protection, 1,3-bis(3-aminopropyl)-1,1,3,3-tetramethyldisiloxane (PATS) (1 mmol) was dissolved in ethanol (100 mL). After stirring for 30 min, epichlorohydrin (40 mmol) was slowly added dropwise and stirred at 45°C for 6 h. Then, 4 g of 50% (w / v) NaOH aqueous solution was slowly added. After stirring at 45°C for 1 h, ethanol and epichlorohydrin were distilled off to obtain an intermediate product. The intermediate product was dissolved in n-hexane (100 mL) for washing, n-hexane was distilled off, and the mixture was dried in a vacuum oven at 65°C for 8 h to obtain epoxysiloxane (ETOD). The structure of PATS is shown in the following formula (2).

[0064]

[0065] (2) ETOD (16 mmol) and sebacic acid (SA) (10 mmol) were stirred at 100°C for 5 min to mix evenly, and then the mixture was poured into a PTFE (polytetrafluoroethylene) mold for temperature curing. The curing temperature and time were 90°C / 2h, 110°C / 2h, and 130°C / 2h, respectively. After curing, a self-healing and degradable epoxy resin was obtained, wherein SA had the structure shown in the following formula (3):

[0066]

[0067] Example 2

[0068] This embodiment provides a self-repairing degradable epoxy resin. The structure of the self-repairing degradable epoxy resin is the same as that of Example 1. The preparation method thereof is as follows:

[0069] (1) Under inert gas protection, PATS (1 mmol) was dissolved in ethanol (113 mL). After stirring for 5 min, epichlorohydrin (50 mmol) was slowly added dropwise and stirred at 55°C for 3 h. Then, 6 g of 50% (w / v) NaOH aqueous solution was slowly added. After stirring at 30°C for 3 h, ethanol and epichlorohydrin were distilled off to obtain an intermediate product. The intermediate product was dissolved in n-hexane (120 mL) for washing, and the n-hexane was distilled off. After drying in a vacuum oven at 50°C for 14 h, epoxysiloxane (ETOD) was obtained.

[0070] (2) After ETOD (20 mmol) and SA (10 mmol) were stirred at 100 °C for 5 min to mix evenly, the mixture was poured into a PTFE (polytetrafluoroethylene) mold for temperature curing. The curing temperature and time were 100 °C / 1 h, 150 °C / 1 h, and 180 °C / 2 h, respectively. After curing, a self-healing and degradable epoxy resin was obtained.

[0071] Example 3

[0072] This embodiment provides a self-repairing degradable epoxy resin. The structure of the self-repairing degradable epoxy resin is the same as that of Example 1. The preparation method thereof is as follows:

[0073] (1) Under inert gas protection, PATS (1 mmol) was dissolved in ethanol (108 mL). After stirring for 20 min, epichlorohydrin (45 mmol) was slowly added dropwise and stirred at 40°C for 4 h. Then, 4 g (0.1 mol) of 50% (w / v) NaOH aqueous solution was slowly added. After stirring at 40°C for 2 h, ethanol and epichlorohydrin were distilled off to obtain an intermediate product. The intermediate product was dissolved in n-hexane (105 mL) for washing, and the n-hexane was distilled off. After drying in a vacuum oven at 55°C for 12 h, epoxysiloxane (ETOD) was obtained.

[0074] (2) ETOD (26 mmol) and SA (10 mmol) were stirred at 95 °C for 15 min to mix evenly, and then the mixture was poured into a PTFE (polytetrafluoroethylene) mold for temperature curing. The curing temperature and time were 90 °C / 1 h, 130 °C / 1 h, and 150 °C / 2 h, respectively. After curing, a self-healing and degradable epoxy resin was obtained.

[0075] Example 4

[0076] ETOD (12 mmol) and SA (10 mmol) prepared in Example 1 were stirred at 100°C for 5 min to mix uniformly, and then poured into a PTFE (polytetrafluoroethylene) mold for temperature curing. The curing temperature and time were 90°C / 2h, 110°C / 2h, and 130°C / 2h, respectively. After curing, a self-healing and degradable epoxy resin was obtained.

[0077] Example 5

[0078] ETOD (30 mmol) and SA (10 mmol) prepared in Example 3 were stirred at 95°C for 15 min to mix evenly, and then poured into a PTFE (polytetrafluoroethylene) mold for temperature curing. The curing temperature and time were 90°C / 1 h, 130°C / 1 h, and 150°C / 2 h, respectively. After curing, a self-healing and degradable epoxy resin was obtained.

[0079] Test Example 1

[0080] The epoxidized siloxane obtained in step (1) of Example 1 and the self-repairing degradable epoxy resin obtained in step (2) were subjected to infrared spectrum tests respectively. The infrared spectrum of the epoxidized siloxane was at 1029 cm -1 、2943cm -1、914cm -1 There are absorption peaks at 1029 cm -1 is the Si-O bond absorption peak, 2943 cm -1 C—H bond absorption peak, 914 cm -1 is the epoxy group absorption peak; the infrared spectrum of the self-healing degradable epoxy resin is at 1031cm -1 、2940cm -1 、3450cm -1 There are absorption peaks at 1031 cm -1 is the Si-O bond absorption peak, 2940cm -1 C—H bond absorption peak, 3450 cm -1 It is a hydroxyl group.

[0081] Test Example 2

[0082] The self-healing degradable epoxy resin provided in the above embodiment was prepared into samples with a size of 50 mm × 50 mm × 5 mm. Each sample was immersed in 300 mL of ethanol at 110°C for 2 h. The undissolved sample was collected by filtration and weighed after drying. The degradation amount was calculated, and the results are shown in Table 1 below.

[0083] Table 1

[0084] Degradation amount (%) Example 1 99.6 Example 2 99.7 Example 3 99.8 Example 4 83.2 Example 5 85.3

[0085] Test Example 3

[0086] (1) The self-repairing degradable epoxy resin provided in the above embodiment was prepared into dumbbell-shaped samples, and the tensile strength was tested. The thermal decomposition temperature was tested by thermogravimetric analysis. The results are shown in Table 2.

[0087] (2) The epoxy resins provided in the above examples were subjected to degradation and recovery experiments and then made into samples of the same size for tensile strength and thermal decomposition temperature tests. The results are shown in Table 2 below.

[0088] Among them, the degradation and recycling steps are: first soak the self-healing degradable epoxy resin with a size of 100mm×100mm×50mm in 1000mL of ethanol, soak it at 110℃ for 2h, distill off the ethanol, collect the residue, and cure the residue in a hot press at 130℃ for 1h to obtain the epoxy resin sample after degradation and recycling.

[0089] Table 2

[0090]

[0091]

[0092] Test Example 4

[0093] The self-repairing degradable epoxy resin provided in Example 1 was subjected to a self-repairing test. The specific steps were as follows: the self-repairing degradable epoxy resin was used to scratch a crack with a width of 36 μm, and an optical microscope was used to take a picture. Figure 1 As shown in Figure (a), the epoxy resin with cracks was placed in an oven at 150°C and heated for 5 minutes. The epoxy resin was then taken out and photographed using an optical microscope. Figure 1 As shown in Figure (b), the epoxy resin with cracks was placed at 150°C and heated for 5 minutes (a total of 10 minutes). After that, it was taken out and photographed using an optical microscope. Figure 1 As shown in Figure (c), by comparing Figure 1 As can be seen from the crack conditions in Figures (a), (b) and (c), the self-healing degradable epoxy resin provided in Example 1 has excellent self-healing ability.

[0094] The above are merely preferred embodiments of the present invention and are not intended to limit the present invention. Those skilled in the art will readily appreciate that various modifications and variations of the present invention are possible. Any modifications, equivalent substitutions, or improvements made within the spirit and principles of the present invention shall be included within the scope of protection of the present invention.

Claims

1. A self-repairing degradable epoxy resin, characterized in that: The structure of the self-repairing degradable epoxy resin is shown in the following formula (I): Formula (I); R1 and R2 are each independently selected from unsubstituted C2-C4 alkylene; R3 is selected from unsubstituted C1-C3 alkylene; and R4 is selected from unsubstituted C4-C10 alkylene.

2. The self-repairing degradable epoxy resin according to claim 1, characterized in that: The R1 and R2 are each independently selected from unsubstituted propylene and unsubstituted methylethylene; Said R3 is selected from unsubstituted ethylene; The R4 is selected from unsubstituted octylene and decylene.

3. The method for preparing the self-repairing degradable epoxy resin according to claim 1 or 2, characterized in that: The preparation method comprises: Step S1, mixing a silicon-containing diamine compound and an epoxy halide in a solvent to carry out a substitution reaction to obtain an intermediate product system, and purifying the intermediate product system to obtain epoxysiloxane; Step S2, mixing the epoxidized siloxane with a dicarboxylic acid compound to perform an ester exchange reaction to obtain a self-repairing degradable epoxy resin; Wherein, the silicon-containing diamine compound has a structure as shown in the following formula (II), the epoxy halide has a structure as shown in the following formula (III), the epoxy siloxane has a structure as shown in the following formula (IV); and the dicarboxylic acid compound has a structure as shown in the following formula (V); Formula (II); Formula (III); Formula (IV); Formula (V); R1, R2, R3, and R4 each have the same meaning as in claim 1 or 2, and X represents a halogen.

4. The preparation method according to claim 3, characterized in that In step S1, the temperature of the substitution reaction is 45-55° C., and the reaction time is 3-6 hours.

5. The preparation method according to claim 3, characterized in that The molar ratio of the epoxy halide to the silicon-containing diamine compound is 40-50:

1.

6. The preparation method according to claim 3, characterized in that In the step S1, the substitution reaction is carried out under the action of a first catalyst, and the catalyst is an alkaline solution.

7. The preparation method according to claim 6, characterized in that The alkaline solution is a sodium hydroxide solution.

8. The preparation method according to claim 7, characterized in that The mass concentration of the sodium hydroxide solution is 30% to 55%.

9. The preparation method according to claim 3, characterized in that The solvent is a C1~C4 alcohol.

10. The preparation method according to claim 9, characterized in that The solvent is ethanol.

11. The preparation method according to claim 3, characterized in that In step S1, the purification of the intermediate product system includes a first distillation, washing, a second distillation and drying performed in sequence.

12. The preparation method according to claim 11, characterized in that The washing agent used in the washing is n-hexane, and the molar ratio of the n-hexane to the epoxy halide is 35-40:

1.

13. The preparation method according to claim 11, characterized in that The drying temperature is 50-65° C. and the drying time is 8-14 hours.

14. The preparation method according to claim 3, characterized in that In step S2, the temperature of the transesterification reaction is 90-180° C., and the time is 1-8 hours.

15. The preparation method according to claim 3, characterized in that The molar ratio of the epoxidized siloxane to the dicarboxylic acid compound is 1.6-2.6:

1.

16. The preparation method according to claim 3, characterized in that In step S2, the mixing temperature is 90-100° C. and the mixing time is 5-25 minutes.

17. Use of the self-healing degradable epoxy resin according to claim 1 or 2, or the self-healing degradable epoxy resin obtained by the preparation method according to any one of claims 3 to 16 in the fields of transportation, construction, home furnishing, and electronic appliances.

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