A water-conducting laser blocking protection method

Abstract

The present invention discloses a water-conducting laser blocking protection method, comprising the following steps: adding powdered super absorbent resin to the interlayer of a workpiece to be processed; injecting water into the powdered super absorbent resin to change it into a colloid, the colloid fills the interlayer of the workpiece to be processed, the refractive index of the colloid is greater than or equal to 1.35, and the colloid is used to block the water-conducting laser. The present invention uses super absorbent resin as a filling material, which is in powder form before absorbing water and can be filled into the cavity or interlayer of the workpiece to be processed. Since the powdered super absorbent resin can be filled into a special-shaped interlayer structure at will, it has very good applicability; after filling, water is injected to make the super absorbent resin fully absorb water to form a compact colloid, which can destroy the total reflection of the water-conducting laser and form diffuse reflection, thereby destroying the aggregation of the laser, and the energy cannot be gathered at a certain point. The colloid can block the cutting ability of the water-conducting laser and play a protective role.

Description

Technical Field

[0001] The invention relates to the field of laser processing, and in particular to a water-conducting laser blocking protection method. Background Art

[0002] With the development of science and technology, laser processing technology is becoming more and more important in the field of production and manufacturing, and its proportion is increasing. Laser cutting can cut materials that cannot be processed by traditional machine tools. However, there are still some problems with laser technology when cutting multi-layer materials. When the laser cuts through the cutting layer, it often causes damage to the second layer of material that needs to be protected. Therefore, the laser needs to be accurately blocked to prevent it from damaging the second layer of material. The commonly used blocking method is to use fillers to block it.

[0003] Chinese patent CN106457476A discloses a laser system, which is used to cut one layer of a double-layer material, with a gap between the double-layer materials. The laser system includes a laser device and a beam interrupting element. The laser device is used to cut one layer of the double-layer material. The beam interrupting element is configured to fill the gap between the two layers of material. The effect of the beam interrupting element on the laser beam is sufficient to reduce the energy density or intensity of the focused laser beam to a level below a threshold required for cutting, ablation, perforation, etc. of the stacked layer protected by the beam interrupting element.

[0004] However, the gaps of the workpieces to be processed are regular or irregular in many situations. The interruption element is usually a hardware structure and cannot effectively fill the gaps of the workpieces to be processed, thereby failing to fully protect the second layer of material. Secondly, the interruption element may be sintered on the inner surface of the workpiece to be processed during use, making the subsequent cleaning of the workpiece to be processed difficult or even scrapped, and the interruption element will have a certain amount of loss, increasing the cutting cost.

[0005] Therefore, there is an urgent need for a water-conducting laser blocking protection method that can be applied to different workpieces to be processed to solve the above problems. Summary of the invention

[0006] The object of the present invention is to provide a water-conducting laser blocking protection method, which can perform laser blocking protection on a double-layer special-shaped workpiece to be processed.

[0007] In order to solve the above technical problems, the present invention provides a water-conducting laser blocking protection method, comprising the following steps:

[0008] S1, adding a powdered super absorbent resin to the interlayer of the workpiece to be processed;

[0009] S2. Inject water into the powdered super absorbent resin to turn it into a colloid. The colloid fills the interlayer of the workpiece to be processed. The refractive index of the colloid is greater than or equal to 1.35. The colloid is used to block the water-conducting laser.

[0010] Furthermore, the colloid is in a compressed state in the interlayer or cavity of the workpiece to be processed.

[0011] Furthermore, after use, the colloid is dried to be restored to a powder state.

[0012] Furthermore, the interlayers of the workpiece to be processed are of irregular shapes.

[0013] Furthermore, a water-conducting laser device is used to generate laser to cut the workpiece to be processed.

[0014] Furthermore, the material of the super absorbent resin is sodium polyacrylate.

[0015] Furthermore, the workpiece to be processed includes a cutting layer and a protective layer, and the spot diameter formed by the laser irradiation on the cutting layer is 1-10 mm; the spot diameter range of the laser when irradiating the protective layer surface after passing through the colloid is 10-80 mm.

[0016] Compared with the prior art, the present invention has at least the following beneficial effects:

[0017] A highly water-absorbent resin is used as a filling material. The highly water-absorbent resin is in powder form before absorbing water and can be filled into the cavity or interlayer of a workpiece to be processed. It can be applicable to interlayer structures of different shapes or special-shaped interlayer structures, and can effectively solve the problem in the prior art that a beam interruption element cannot be filled into a very complex cavity or interlayer. Since the powdered highly water-absorbent resin can be filled into a special-shaped interlayer structure at will, it has very good applicability. After filling, water is injected to allow the highly water-absorbent resin to fully absorb water to form a compact colloid, which fills the special-shaped interlayer structure. The refractive index of the colloid is greater than or equal to 1.35, which can destroy the total reflection of the water-conducting laser and form diffuse reflection, thereby destroying the aggregation of the laser, causing it to diffuse, so that the energy cannot be gathered at a certain point, and thus cutting cannot be achieved. The colloid can block the cutting ability of the water-conducting laser and play a protective role.

[0018] Furthermore, after drying, the colloid can be restored to powder, which is convenient for subsequent cleaning, does not cause any damage to the workpiece, and can be reused, reducing the cutting cost. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] Figure 1 It is a schematic diagram of reflection in a water beam and a colloid of the water-guided laser blocking protection method of the present invention;

[0020] Figure 2This is a schematic diagram of the structure of the water-guided laser blocking protection method of the present invention for blocking and protecting traditional lasers. DETAILED DESCRIPTION

[0021] The water-conducting laser blocking protection method of the present invention will be described in more detail below in conjunction with a schematic diagram, wherein a preferred embodiment of the present invention is shown. It should be understood that those skilled in the art can modify the present invention described herein while still achieving the beneficial effects of the present invention. Therefore, the following description should be understood as being widely known to those skilled in the art and not as a limitation of the present invention.

[0022] The present invention is described in more detail in the following paragraphs by way of example with reference to the accompanying drawings. The advantages and features of the present invention will become more apparent from the following description and claims. It should be noted that the drawings are in very simplified form and in non-precise proportions, and are only used to facilitate and clearly assist in illustrating the purpose of the embodiments of the present invention.

[0023] like Figure 1-2 As shown, an embodiment of the present invention provides a water-conducting laser blocking protection method, comprising the following steps:

[0024] S1, adding a powdered super absorbent resin to the interlayer of the workpiece to be processed;

[0025] S2, water is injected into the powdered super absorbent resin to turn it into colloid 33, the colloid 3 fills the interlayer of the workpiece to be processed, the refractive index of the colloid 3 is greater than or equal to 1.35, and the colloid 3 is used to block the water-guided laser. The colloid 3 is in a compressed state in the interlayer of the workpiece to be processed.

[0026] Furthermore, the workpiece to be processed includes a cutting layer 4 and a protective layer 5, and the diameter d1 of the light spot 7 formed by the laser 2 irradiating the cutting layer 4 is 1-10 mm; the diameter d2 of the light spot 6 when the laser 2 passes through the colloid 3 and irradiates the surface of the protective layer 5 is in the range of 10-80 mm, and the interlayers of the workpiece to be processed are irregular shapes.

[0027] In this embodiment, a highly water-absorbent resin is used as a filling material and filled into the interlayer of the workpiece to be processed, and water is injected to fully mix the highly water-absorbent resin and water to form a compact colloid 3. The colloid 3 is opaque milky white, has a high water content, and is highly flame retardant. The refractive index of the laser in the colloid 3 is approximately greater than 1.4, and the refractive index of the laser in water is approximately 1.33. When the water-guided laser reaches the interlayer of the workpiece to be processed from the cutting layer 4, when it encounters the water-absorbent resin colloid 3, the spot formed by the laser becomes larger, and the water beam is blocked and dispersed by the colloid 3. The water-air medium wall on which the water-guided laser depends for propagation is destroyed, and the laser cannot continue to fully reflect. Therefore, from the moment the water beam contacts the colloid 3, the focusing property of the laser is broken and the energy is dispersed. After diffuse reflection, countless weak lasers with lower energy levels are partially absorbed by water and partially absorbed by the colloid 3.

[0028] In summary, compared with the traditional use of other fillers or interrupting elements, the super absorbent resin, due to its high water absorbency, can be easily filled into the interlayer of the workpiece to be processed before absorbing water. The colloid 3 formed by absorption can fill the interior of the interlayer, which is convenient for fully protecting the protective layer 5. At the same time, due to the high flame retardancy of the colloid 3, the situation in which the filler is sintered on the inner surface of the workpiece can be effectively avoided.

[0029] like Figure 2 As shown, in a specific embodiment, the water-conducting laser blocking protection can also protect the traditional laser 8, which mainly includes electrospark machining and ultrafast laser machining. The traditional laser propagates through the air, focuses at the cutting point, and diverges after penetrating the cutting point. The divergent laser beam encounters the resin colloid 3, forms diffuse reflection between the water and the resin particles, and eventually becomes a light group. The energy is dispersed and absorbed by the colloid 3, thereby protecting the lower layer material. The colloid 3 is in an extruded state in the interlayer, and the high-pressure air cannot blow away the colloid 3 in a short time, that is, the lower layer material in the protective state of the colloid 3 will not be exposed to the laser for a short time under the action of the high-pressure air.

[0030] In a specific embodiment, the super absorbent resin material is sodium polyacrylate.

[0031] Before absorbing water, the polymer chains of sodium polyacrylate are entangled with each other and cross-linked into a network structure, thereby achieving overall tightening. When in contact with water, water molecules penetrate into sodium polyacrylate through capillary action and diffusion, and the ionized groups on the chain are ionized in water. The polymer chain stretches and swells due to the electrostatic repulsion between the same ions on the chain. Due to the requirement of electrical neutrality, the counter ions cannot migrate to the outside of the resin, and the ion concentration difference between the solution inside and outside the resin forms a reverse osmotic pressure. Under the action of reverse osmotic pressure, water further enters the resin to form a hydrogel. At the same time, the cross-linked network structure and hydrogen bonding of the resin itself limit the unlimited expansion of the gel.

[0032] Furthermore, after use, the colloid 3 is dried to be restored to a powder state. After drying, the highly absorbent resin can be restored to a powder state, which is very convenient to clean and reuse, with low cost and environmental protection.

[0033] In summary, the present embodiment proposes a water-conducting laser blocking protection method. The present method uses a highly water-absorbent resin as a filling material. The highly water-absorbent resin is in powder form before absorbing water and can be filled into the cavity or interlayer of the workpiece to be processed. It can be applicable to interlayer structures of different shapes or special-shaped interlayer structures, and can effectively solve the problem that the beam interruption element in the prior art cannot be filled in a very complex cavity or interlayer. Since the powdered highly water-absorbent resin can be filled in a special-shaped interlayer structure at will, it has very good applicability. After filling, water is injected to allow the highly water-absorbent resin to fully absorb water to form a compact colloid, which fills the special-shaped interlayer structure. The refractive index of the colloid is greater than or equal to 1.35, which can destroy the total reflection of the water-conducting laser and form diffuse reflection, thereby destroying the aggregation of the laser, causing it to diffuse, so that the energy cannot be gathered at a certain point, and thus cutting cannot be achieved. The colloid can block the cutting ability of the water-conducting laser and play a protective role.

[0034] Furthermore, after drying, the colloid can be restored to powder, which is convenient for subsequent cleaning, does not cause any damage to the workpiece, and can be reused, reducing the cutting cost.

[0035] Obviously, those skilled in the art can make various changes and modifications to the present invention without departing from the spirit and scope of the present invention. Thus, if these modifications and variations of the present invention fall within the scope of the claims of the present invention and their equivalents, the present invention is also intended to include these modifications and variations.

Claims

1. A water-conducting laser blocking protection method, characterized in that: The following steps are involved: S1, adding a powdered super absorbent resin to the interlayer of the workpiece to be processed; S2, injecting water into the powdered super absorbent resin to turn it into a colloid, wherein the colloid fills the interlayer of the workpiece to be processed, and the refractive index of the colloid is greater than or equal to 1.35, and the colloid is used to block the water-conducted laser; after use, drying the colloid to restore it to a powder state; The colloid is in a compressed state in the sandwich of the workpiece to be processed; The interlayers of the workpiece to be processed are irregular in shape; Use water-guided laser equipment to generate laser to cut the workpiece to be processed; The material of the highly absorbent resin is sodium polyacrylate; The workpiece to be processed includes a cutting layer and a protective layer. The diameter of the light spot formed by the laser irradiation on the cutting layer is 1-10 mm. The diameter of the light spot when the laser passes through the colloid and irradiates the surface of the protective layer is in the range of 10-80 mm.

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