A solderless LED package bracket and a packaging method thereof

Abstract

The application discloses a solderless LED packaging support and a packaging method thereof, which comprises a substrate, a conductive plate and a support plate, a plurality of support clamping plates are arranged at equal intervals on the support plate, a clamping hole is arranged at the top center of each support clamping plate, a positioning assembly is arranged on each support clamping plate, the positioning assembly comprises a positioning box, a limiting seat, a positioning box, a limiting groove and an LED assembly arranged in the limiting groove, the LED assembly comprises an LED frame and an LED chip, the support plate and the positioning assembly are arranged, so that the LED assembly can be fixed on the support plate through the positioning assembly, the positioning assembly is arranged, so that when the LED assembly is used, the bottom of the LED frame in the LED assembly can be inserted into the limiting groove, two clamping blocks on the LED frame can be inserted into the slot, and the LED frame can be disassembled by lifting the LED frame upwards.

Description

Technical Field

[0001] This invention belongs to the field of LED packaging bracket technology, specifically a wire-free LED packaging bracket and its packaging method. Background Technology

[0002] LED packaging technology is largely developed and evolved from discrete device packaging technology. Generally, the die of a discrete device is sealed within a package, the main function of which is to protect the die and complete electrical interconnections. However, LED packaging is responsible for outputting electrical signals, protecting the die for normal operation, and outputting visible light. It has design and technical requirements for both electrical and optical parameters, making it impossible to simply apply discrete device packaging to LEDs.

[0003] Patent CN202111581415.9 discloses an LED packaging method, including bonding a die in a die-bonding area on a substrate, dispensing adhesive in the die-bonding area to form an adhesive layer, laying a strip of fluorescent glass between two first dams in a vacuum environment, the fluorescent glass being laid along the Y-axis above multiple die-bonding areas, baking the fluorescent glass and adhesive layer, and cutting the substrate to form individual LEDs. LEDs produced using this method have the characteristics of high color uniformity, high intensity, and excellent airtightness. Patent CN20212332832... 6.1 discloses a device comprising a fixed base, a first fixed block, a first movable block, a first fixed rod, a first connecting rod, a second fixed block, a second movable block, a second fixed rod, a second connecting rod, an adjusting block, and a limiting rod. This device can quickly move the adjusting block to the corresponding limiting hole position, providing relatively stable fixation of the LED packaging bracket and making the LED packaging bracket easy to disassemble and adjust. However, in use, the LED component is fixed to the packaging bracket by wire bonding, which makes it inconvenient to disassemble and assemble the LED component. When the LED component is damaged, it is inconvenient to remove, repair, and replace the LED component. In view of this, we propose a wire-free LED packaging bracket and its packaging method.

[0004] The information disclosed in this background section is intended only to enhance the understanding of the overall background of the invention and should not be construed as an admission or in any way implying that the information constitutes prior art known to those skilled in the art. Summary of the Invention

[0005] The purpose of this invention is to provide a wire-free LED packaging bracket and its packaging method to solve the above-mentioned problems in the prior art.

[0006] To achieve the above objectives, the present invention provides a wire-free LED packaging bracket, comprising a substrate and two conductive plates arranged side by side on the substrate. A bracket plate is fixedly mounted on the top of the substrate, and the bracket plate is provided with a plurality of bracket clamps arranged at equal intervals. A clamping hole is opened at the top center of the bracket clamp. Each bracket clamp is provided with a positioning component. The positioning component includes a positioning box and a limiting seat disposed at the bottom of the positioning box. A limiting groove is opened in the positioning box, and an LED component is installed in the limiting groove. The LED component includes an LED frame disposed at the bottom of the limiting groove and an LED chip installed in the LED frame.

[0007] In the technical solution of the present invention, the substrate has circular holes at the four corners, and the bottom of the support plate has a ring that matches the position of each circular hole. The ring is inserted into the circular hole, and the bottom of the substrate is connected to each ring by bolts.

[0008] In the technical solution of the present invention, a rectangular groove is provided on the top of the substrate, and two transverse slots are provided on the bottom of the rectangular groove. The conductive plate is snapped into the transverse slots, and a contact layer is laid on the conductive plate. Two symmetrically arranged locking plates are provided on the bottom of the limiting groove, and a slot is formed between the front and rear positions of the two locking plates.

[0009] In the technical solution of the present invention, the bottom of the LED frame is inserted between the two card plates, and two card blocks are provided on the front and rear walls of the LED frame. The card blocks are inserted and cooperate with the slots. An opening slot is provided on the LED frame above the card blocks. Two electrode tubes are provided inside the front and rear frames of the LED frame, and a heat-conducting plate is provided at the bottom of the LED chip.

[0010] In the technical solution of the present invention, the bottom of the electrode tube passes through the positioning box and is fixed to the contact layer, the top of the electrode tube extends into the opening groove, the bottom of the heat-conducting plate is bonded to the bottom wall of the LED frame, two silver wires are connected to the LED chip, and the ends of the silver wires are provided with plugs.

[0011] In the technical solution of the present invention, two power supply pins are provided on the top of the heat-conducting plate located on the left and right sides of the LED chip. The ends of the power supply pins are inserted into the opening slots located on the same side and are connected to the top of the electrode tube. The first end of the power supply pins is provided with a side slot, and the silver wire is installed in the side slot through a plug-in.

[0012] In the technical solution of the present invention, a lens is fixedly installed on the top of the LED chip located in the limiting groove, and the bottom of the lens is fixed to the top of the LED frame with glue. The lens is made of transparent epoxy film plastic.

[0013] In the technical solution of the present invention, the method includes the above-described wire-free LED packaging bracket, and includes the following steps:

[0014] S1: First, the positioning component is installed in the rectangular groove on the top of the substrate and fixed to the substrate with bolts. The positioning box is then restricted within the card hole by the limiting seat.

[0015] S2: Next, install the LED frame inside the LED assembly into the positioning box through the limiting groove, so that the bottom of the LED frame is inserted between the two card plates at the bottom of the positioning box, so that the card blocks on the front and rear sides of the LED frame are inserted into the side grooves, and finally insert the electrode tube into the front and rear side walls of the LED frame, so that the top of the electrode tube is connected to the opening groove, and the bottom of the electrode tube is abutted and fixed to the top of the contact layer.

[0016] S3: Next, connect the LED chip to the two silver wires so that the ends of the power supply pins are inserted into the opening slots respectively, so that the ends of the power supply pins are fixed to the top of the electrode tube. Insert one end of the silver wire into the side slot at the beginning of the power supply pin through the plug.

[0017] S4: Finally, glue the lens to the top of the LED chip and the top of the card.

[0018] In summary, due to the adoption of the above technical solution, the beneficial effects of the present invention are:

[0019] 1. In this invention, the LED assembly is fixed to the bracket plate by the positioning component. The positioning component ensures that when in use, the bottom of the LED frame inside the LED assembly can be inserted into the limiting groove, the two clips on the LED frame can be inserted into the slots, and the LED frame can be lifted upwards to disassemble the LED frame.

[0020] 2. In this invention, by setting the plug and power supply pin at the end of the silver wire, the plug can be inserted into the side groove at the beginning of the power supply pin, reducing the use of wire bonding to solder the silver wire, fixing the beginning of the power supply pin to the top of the electrode tube, and making the electrode tube abut and fix to the conductive plate on the substrate. Attached Figure Description

[0021] Figure 1 This is a simplified schematic diagram of the overall structure of the present invention;

[0022] Figure 2 This is a structural diagram of the substrate and positioning components in this invention;

[0023] Figure 3 This is a diagram of the substrate structure in this invention;

[0024] Figure 4This is a structural diagram of the conductive plate in this invention;

[0025] Figure 5 This is a structural diagram of the support plate in this invention;

[0026] Figure 6 This is a structural diagram of the positioning box in this invention;

[0027] Figure 7 For the present invention Figure 6 Enlarged view of the structure at point A in the image;

[0028] Figure 8 This is a structural diagram of the LED component in this invention;

[0029] Figure 9 For the present invention Figure 8 Enlarged view of the structure at point B in the image;

[0030] Figure 10 This is a cross-sectional view of the LED component structure in this invention;

[0031] Figure 11 For the present invention Figure 10 Enlarged view of the structure at point C.

[0032] Explanation of reference numerals in the attached figures:

[0033] 1. Substrate; 10. Circular hole; 11. Rectangular groove; 110. Horizontal slot; 12. Conductive plate; 120. Contact layer;

[0034] 2. Support plate; 20. Ring; 21. Support clip; 22. Clip hole;

[0035] 3. Positioning component; 30. Positioning box; 301. Limiting seat; 302. Limiting groove; 303. Card plate; 3030. Slot;

[0036] 4. LED assembly; 40. LED frame; 401. Electrode tube; 402. Opening slot; 403. Card block; 41. LED chip; 410. Silver wire; 4101. Insert; 411. Heat conduction plate; 412. Power supply pin; 4120. Side slot; 42. Lens; Detailed Implementation

[0037] The specific embodiments of the present invention will now be described in detail with reference to the accompanying drawings, but it should be understood that the scope of protection of the present invention is not limited to the specific embodiments.

[0038] Unless otherwise expressly stated, throughout the specification and claims, the term "comprising" or its variations such as "including" or "comprises" shall be understood to include the stated elements or components without excluding other elements or other components.

[0039] Reference Figures 1-11 The present invention relates to a bonding wire-free LED packaging bracket and its packaging method, comprising a substrate 1 and two conductive plates 12 arranged side by side on the substrate 1. A rectangular groove 11 is formed on the top of the substrate 1, and two transverse slots 110 are formed on the bottom of the rectangular groove 11. A contact layer 120 is laid on the conductive plate 12. Power is provided to the LED assembly 4 through the conductive plate 12. The conductive plate 12 is snapped into the transverse slots 110 through the through hole on the left side wall of the substrate 1. A plurality of bracket plates 21 are arranged at equal intervals on the bracket plate 21. A slot 22 is formed at the center of the top of the bracket plate 21. The slot 22 is used to install the positioning box 30.

[0040] In this invention, the four corners of the substrate 1 are provided with circular holes 10, and the bottom of the support plate 2 is provided with a ring 20 that matches the position of each circular hole 10. The ring 20 is inserted into the circular hole 10 to ensure the positional accuracy when the support plate 2 and the substrate 1 are covered. Then, the bottom of the substrate 1 is connected to each ring 20 by bolts, so that the positioning box 30 is stably fixed in the rectangular groove 11 on the top of the substrate 1. The substrate 1 provides support for the positioning component 3.

[0041] Specifically, each bracket plate 21 is equipped with a positioning component 3. The positioning component 3 includes a positioning box 30 and a limiting seat 301 set at the bottom of the positioning box 30. A limiting groove 302 is opened in the positioning box 30. Two symmetrically arranged plates 303 are set on the bottom of the limiting groove 302. A slot 3030 is formed between the front and rear positions of the two plates 303. The limiting groove 302 is used to install the LED component 4. The limiting seat 301, the plates 303 and the positioning box 30 are designed as an integral structure. The two plates 303 limit the bottom of the LED component 4, so that the LED component 4 can be fixed in the positioning box 30, and it is also convenient to disassemble and replace the LED component 4.

[0042] Furthermore, the bottom of the LED frame 40 is inserted between two clips 303. The clips 303 facilitate the assembly and disassembly of the LED frame 40. Two clips 403 are provided on the front and rear walls of the LED frame 40. The clips 403 are engaged with the slots 3030. The clips 403 are used to fix the LED frame 40. An opening slot 402 is provided on the LED frame 40 above the clips 403. Two electrode tubes 401 are provided inside the front and rear frames of the LED frame 40. A heat-conducting plate 411 is provided at the bottom of the LED chip 41. The heat-conducting plate 411 can provide heat dissipation for the LED chip 41. An insert 4101 is provided at the end of the silver wire 410.

[0043] In addition, an LED assembly 4 is installed in the limiting groove 302. The LED assembly 4 includes an LED frame 40 set at the bottom of the limiting groove 302 and an LED chip 41 installed in the LED frame 40. Two silver wires 410 are connected to the LED chip 41. Two power supply pins 412 are provided on the top of the heat-conducting plate 411 located on the left and right sides of the LED chip. The bottom of the electrode tube 401 passes through the positioning box 30 and is fixed to the contact layer 120, so that the conductive plate 12 transmits the current through the contact layer 120 to the electrode tube 401. The current is then transmitted from the electrode tube 401 to the power supply pins 412 and the silver wires 410 in sequence, and finally the current is delivered to the LED chip 41. The top of the electrode tube 401 extends into the opening groove 402, and the bottom of the heat-conducting plate 411 is bonded to the bottom wall of the LED frame 40.

[0044] It is worth noting that the end of the power supply pin 412 is inserted into the opening slot 402 on the same side and is plugged into the top of the electrode tube 401. The first end of the power supply pin 412 has a side slot 4120. The silver wire 410 is installed in the side slot 4120 through the plug 4101. The power supply pin 412 is fixed on the top of the heat conduction plate 411. The plug 4101 facilitates the connection between the silver wire 410 and the power supply pin 412, replacing the use of solder wire and improving the assembly efficiency of the LED component 4.

[0045] Finally, a lens 42 is fixedly installed on the top of the LED chip 41 located in the limiting groove 302. The bottom of the lens 42 is fixed to the top of the LED frame 40 with glue. The lens 42 is made of transparent epoxy film plastic. The lens 42 helps to improve the light output efficiency of the LED.

[0046] A method for bonding a wire-free LED package, the method comprising a wire-free LED package holder, specifically including the following steps:

[0047] S1: First, install the positioning component 3 in the rectangular groove 11 on the top of the substrate 1, then fix the bracket plate 2 to the substrate 1 with bolts, and restrict the positioning box 30 in the card hole 22 by the limiting seat 301.

[0048] S2: Next, the LED frame 40 in the LED assembly 4 is installed in the positioning box 30 through the limiting groove 302, so that the bottom of the LED frame 40 is inserted between the two card plates 303 at the bottom of the positioning box 30, so that the card blocks 403 on the front and rear sides of the LED frame 40 are inserted into the slots 3030. Finally, the electrode tube 401 is inserted into the front and rear side walls of the LED frame 40, so that the top of the electrode tube 401 is connected to the opening groove 402, so that the bottom of the electrode tube 401 is abutted and fixed to the top of the contact layer 120.

[0049] S3: Next, connect the LED chip 41 to the two silver wires 410, so that the ends of the power supply pins 412 are inserted into the opening slots 402 respectively, so that the ends of the power supply pins 412 are inserted and fixed to the top of the electrode tube 401, and insert one end of the silver wires 410 into the side slots 4120 at the beginning of the power supply pins 412 through the plug 4101.

[0050] S4: Finally, attach the lens 42 to the top of the LED chip 41 and the top of the card plate 303 with glue.

[0051] The foregoing description of specific exemplary embodiments of the invention is for illustrative and explanatory purposes. These descriptions are not intended to limit the invention to the precise forms disclosed, and it will be apparent that many changes and variations can be made in accordance with the foregoing teachings. The exemplary embodiments were chosen and described in order to explain the specific principles of the invention and its practical application, thereby enabling those skilled in the art to implement and utilize various different exemplary embodiments of the invention, as well as various different choices and variations. The scope of the invention is intended to be defined by the claims and their equivalents.

Claims

1. A wire-free LED packaging bracket, comprising a substrate (1) and two conductive plates (12) arranged side by side on the substrate (1), characterized in that: A bracket plate (2) is fixedly installed on the top of the substrate (1). The bracket plate (2) is provided with a plurality of bracket plates (21) arranged at equal intervals. A card hole (22) is opened at the top center of the bracket plate (21). Each bracket plate (21) is provided with a positioning component (3). The positioning component (3) includes a positioning box (30) and a limiting seat (301) provided at the bottom of the positioning box (30). A limiting groove (302) is opened in the positioning box (30). An LED component (4) is installed in the limiting groove (302). The LED component (4) includes an LED frame (40) provided at the bottom of the limiting groove (302) and an LED chip (41) installed in the LED frame (40). The base plate (1) has four round holes (10) at its four corners. The bottom of the support plate (2) has a ring (20) that matches the position of each round hole (10). The ring (20) is inserted into the round hole (10). The bottom of the base plate (1) is connected to each ring (20) by bolts. The top of the substrate (1) is provided with a rectangular groove (11), and two horizontal slots (110) are provided on the bottom of the rectangular groove (11). The conductive plate (12) is snapped into the horizontal slots (110), and a contact layer (120) is laid on the conductive plate (12). The bottom of the limiting groove (302) is provided with two symmetrically arranged locking plates (303), and a slot (3030) is formed between the front and rear positions of the two locking plates (303). The bottom of the LED frame (40) is inserted between the two card plates (303). The front and rear walls of the LED frame (40) are provided with two card blocks (403). The card blocks (403) are inserted into the slot (3030). An opening slot (402) is provided on the LED frame (40) above the card blocks (403). Two electrode tubes (401) are provided inside the front and rear frames of the LED frame (40). A heat-conducting plate (411) is provided at the bottom of the LED chip (41). The bottom of the electrode tube (401) passes through the positioning box (30) and is fixed to the contact layer (120). The top of the electrode tube (401) extends into the opening groove (402). The bottom of the heat-conducting plate (411) is bonded to the bottom wall of the LED frame (40). Two silver wires (410) are connected to the LED chip (41). The end of the silver wire (410) is provided with a plug (4101). Two power supply pins (412) are provided on the top of the heat-conducting plate (411) located on the left and right sides of the LED chip (41). The end of the power supply pin (412) is inserted into the opening groove (402) located on the same side and is connected to the top of the electrode tube (401). The first end of the power supply pin (412) is provided with a side groove (4120). The silver wire (410) is installed in the side groove (4120) through the plug (4101).

2. The wire-free LED packaging bracket as described in claim 1, characterized in that: A lens (42) is fixedly installed on the top of the LED chip (41) located in the limiting groove (302). The bottom of the lens (42) is fixed to the top of the LED frame (40) with glue. The lens (42) is made of transparent epoxy film plastic.

3. A method for bonding a wire-free LED package, the method comprising the wire-free LED package bracket according to any one of claims 1-2, characterized in that: Includes the following steps: S1: First, install the positioning component (3) in the rectangular groove (11) on the top of the substrate (1), then fix the bracket plate (2) to the substrate (1) with bolts, and restrict the positioning box (30) in the card hole (22) by the limiting seat (301); S2: Next, the LED frame (40) inside the LED assembly (4) is installed in the positioning box (30) through the limiting groove (302), so that the bottom of the LED frame (40) is inserted between the two card plates (303) at the bottom of the positioning box (30), so that the card blocks (403) on the front and rear sides of the LED frame (40) are inserted into the slots (3030), and finally the electrode tube (401) is inserted into the front and rear side walls of the LED frame (40), so that the top of the electrode tube (401) is connected to the opening groove (402), and the bottom of the electrode tube (401) is abutted and fixed to the top of the contact layer (120); S3: Next, connect the LED chip (41) to the two silver wires (410), so that the ends of the power supply pins (412) are inserted into the opening slots (402) respectively, so that the ends of the power supply pins (412) are inserted and fixed to the top of the electrode tube (401), and insert one end of the silver wires (410) into the side slot (4120) at the beginning of the power supply pins (412) through the plug (4101). S4: Finally, the lens (42) is glued to the top of the LED chip (41) and the top of the card plate (303).

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