connector

Abstract

A connector is provided that improves the characteristic impedance of a UTP module. The connector includes a first connector (10) and a second connector (11) that can be mated with each other. The first connector (10) has a UTP module (15). The UTP module (15) has a UTP inner conductor (65) that is connected to a wire (53) of a UTP cable (12). The second connector (11) has a conductive shielding member (21) that covers the outer periphery of the UTP inner conductor (65) when the first connector (10) and the second connector (11) are mated.

Description

Technical Field

[0001] This disclosure relates to connectors. Background Technology

[0002] Patent Document 1 discloses a connector comprising an STP (Shielded Twisted Pair) module and a UTP (UnShielded Twisted Pair) module. The UTP and STP modules are referred to as terminal modules in Patent Document 1. The UTP module has a UTP inner conductor that serves as a terminal component, connecting to the wires of the UTP cable. The STP module has an STP inner conductor that serves as a terminal component, connecting to the wires of the STP cable. The STP module is used in situations requiring higher communication speeds than the UTP module. In the case of Patent Document 1, the housing can be shared when changing from a first specification using an STP module to a second specification using a UTP module. Furthermore, technologies disclosed in Patent Documents 2-5 are also known as connector-related technologies.

[0003] Existing technical documents

[0004] Patent documents

[0005] Patent Document 1: Japanese Patent Application Publication No. 2017-126408

[0006] Patent Document 2: Japanese Patent Application Publication No. 2004-327419

[0007] Patent Document 3: Japanese Patent Application Publication No. 7-22107

[0008] Patent Document 4: Japanese Patent Application Publication No. 6-36829

[0009] Patent Document 5: Japanese Patent Application Publication No. 2-109279 Summary of the Invention

[0010] The problem that the invention aims to solve

[0011] In the case of Patent Document 1, an impedance adjustment member, which serves as a fastening ring, is installed on the wire of the UTP cable to adjust the characteristic impedance. However, for example, when the fastening ring is shortened to meet the requirements of connector miniaturization, there is a problem of characteristic impedance degradation.

[0012] Therefore, this disclosure aims to provide a connector that can improve the characteristic impedance of a UTP module.

[0013] Solution for solving the problem

[0014] The connector disclosed herein comprises a first connector and a second connector capable of mating with each other. The first connector has a UTP module having a UTP inner conductor that is wire-connected to a UTP cable. The second connector has a conductive shielding member that covers the outer periphery of the UTP inner conductor when the first connector and the second connector are mated.

[0015] Invention Effects

[0016] According to this disclosure, a connector that can improve the characteristic impedance of a UTP module is available. Attached Figure Description

[0017] Figure 1 This is a side sectional view of the connector in this embodiment, taken at the location of the cavity housing the UTP module in the mating state of the first connector and the second connector.

[0018] Figure 2 This is a side sectional view taken at the location of the cavity housing the STP module, with the first and second connectors in the mated state.

[0019] Figure 3 This is the rear view of the second housing.

[0020] Figure 4 It is a 3D view of the shielding component.

[0021] Figure 5 This is the rear view of the first housing.

[0022] Figure 6 This is an exploded 3D view of the STP module.

[0023] Figure 7 This is a 3D diagram of the STP module.

[0024] Figure 8 This is an exploded 3D view of the UTP module.

[0025] Figure 9 This is a 3D diagram of the UTP module. Detailed Implementation

[0026] [Description of embodiments of this disclosure]

[0027] First, the implementation methods of this disclosure are listed and explained.

[0028] The connector disclosed herein,

[0029] (1) It has a first connector and a second connector that can be interlocked, the first connector having a UTP module having a UTP inner conductor that is wired to a UTP cable, and the second connector having a conductive shielding member that covers the outer periphery of the UTP inner conductor when the first connector and the second connector are interlocked.

[0030] In this way, when the outer periphery of the UTP inner conductor is covered by a shielding component, the characteristic impedance of the UTP module can be improved.

[0031] (2) Preferably, the first connector has an STP module and a first housing. The STP module has an inner STP conductor that is wire-connected to the STP cable and an outer conductor that is shielded to the STP cable. The shielding member contacts the outer conductor when the first connector and the second connector are engaged. The first housing has multiple cavities in which the UTP module and the STP module are respectively housed.

[0032] Thus, when the UTP module and STP module are housed in the same first housing, it is not a problem to provide separate housings corresponding to the UTP specification of the UTP module and the STP specification of the STP module. Furthermore, it is also not a problem to provide separate housings corresponding to the UTP and STP specifications for the second connector, which is the mating counterpart of the first housing. For example, if the second connector is a board connector, it is sufficient to provide a single housing shared by the UTP and STP specifications on the circuit board. Therefore, compared to providing separate housings, the connector's footprint can be reduced, achieving space saving. In addition, since mating operations do not need to be performed according to each UTP and STP specification individually, the number of mating operations can be reduced, resulting in excellent workability.

[0033] (3) Preferably, the shielding member has a plurality of cylindrical portions, the UTP inner conductor and the outer conductor are respectively disposed on the inner side of the plurality of cylindrical portions, and the outer conductor is in contact with the inner surface of the cylindrical portion.

[0034] In this way, by configuring the inner and outer conductors of the UTP module on the inside of each cylinder, both the shielding of the STP module and the characteristic impedance of the UTP module can be well adjusted. Furthermore, multiple cylinders can be selected for use, either partially or entirely, thus offering excellent versatility.

[0035] (4) Preferably, the UTP module has a conductive impedance adjustment member installed on the UTP cable, and the plurality of cavities have the same length. The length of the impedance adjustment member is set to be the length that is accommodated inside the cavity when the UTP module is housed in the cavity.

[0036] Thus, when the UTP module and STP module are housed in cavities of equal length, and the impedance adjustment member is set to be the length accommodated inside the cavity, the length of the UTP module becomes the same as the length of the STP module. As a result, the impedance adjustment member becomes shorter, potentially leading to an increase in characteristic impedance and degradation. However, in this configuration, because the outer periphery of the UTP inner conductor is covered by a shielding member, the characteristic impedance can be maintained or improved. Furthermore, since the UTP inner conductor is not normally covered by metal or the like, its characteristic impedance tends to increase; there is a history of using longer impedance adjustment members to reduce this characteristic impedance.

[0037] (5) Preferably, the shielding component is molded.

[0038] In this way, when the shielding component is molded, the shielding performance can be improved.

[0039] [Details of the embodiments of this disclosure]

[0040] The following is a reference to the appendix. Figure 1 Specific examples of embodiments of this disclosure will be described below. Furthermore, the invention is not limited to these examples, but is intended to include all modifications within the meaning and scope of the claims, as indicated by the claims.

[0041] like Figure 1 and Figure 2 As shown, the connector in this embodiment includes a first connector 10 and a second connector 11 that can be interlocked. The first connector 10 is provided on the UTP cable 12 for transmitting communication signals (see reference). Figure 1 ) and STP cable 13 (refer to) Figure 2 The end of the ) includes a first housing 14 and a UTP module 15 (see reference). Figure 1 ) and STP module 16 (refer to Figure 2 The second connector 11 is mounted on the circuit board 17 and includes a second housing 18, a second dielectric 19, a terminal 20, and a shielding member 21. Furthermore, in the following description, regarding the front-to-back direction, the faces of the first connector 10 and the second connector 11 that are opposite each other at the start of engagement are referred to as the front side. The vertical direction is based on the vertical direction of each figure.

[0042] <Second Shell>

[0043] The second housing 18 is formed using an insulating synthetic resin material and has a square-shaped fitting cylindrical portion 22 (is... Figure 3 (Front side, not shown). For example... Figure 3As shown, a pair of through holes 23 are formed on the rear wall 33 of the fitting cylinder portion 22. Each through hole 23 has an opening shape that extends relatively long in the left-right direction. In addition, a plurality of press-in recesses 24 are formed on the rear wall 33 of the fitting cylinder portion 22. Each press-in recess 24 is rectangular when viewed from the rear and opens on the rear surface of the rear wall 33. In addition, each press-in recess 24 communicates with the inner peripheral surface of the through hole 23. Specifically, each press-in recess 24 opens at two locations on the left and right of the upper surface of the upper through hole 23, at one location at the upper and lower center of the left and right surfaces of the upper through hole 23, at two locations on the left and right of the lower through hole 23, and at one location at the upper and lower center of the left and right surfaces of the lower through hole 23. Details are not shown, but a locking portion 25 is formed on the inner surface of the upper wall of the fitting cylinder portion 22.

[0044] <Second Dielectric>

[0045] The second dielectric 19 is formed into a block shape using an insulating synthetic resin material, such as... Figure 1 and Figure 2 As shown, it has a pair of mounting holes 26 extending through the front and rear directions (in) Figure 1 and Figure 2 (Only one is shown in the figure). The terminal 20 is pressed into the mounting hole 26 of the second dielectric 19 from the rear. In this embodiment, the second dielectric 19 is composed of a lower dielectric 27 disposed in the lower through hole 23 and an upper dielectric 28 disposed in the upper through hole 23. The lower dielectric 27 and the upper dielectric 28 are provided in two sets, one pair each, in the second connector 11, respectively in the left and right directions (…). Figure 1 and Figure 2 The paper is arranged in the direction of its thickness.

[0046] <Terminal>

[0047] Terminal 20 is made of a conductive metal plate, such as Figure 1 and Figure 2 As shown, it is generally formed into an elongated shape. Terminal 20 has an inner conductor connection portion 29 and a substrate connection portion 30. The inner conductor connection portion 29 extends in the front-rear direction and is pressed and held to the second dielectric 19 at its rear. In this embodiment, terminal 20 is composed of two types: a short-sized lower terminal 31 pressed into the lower dielectric 27 and a long-sized upper terminal 32 inserted into the upper dielectric 28.

[0048] The front portion of the inner conductor connection portion 29 protrudes forward from the second dielectric 19 and is electrically connected to the UTP inner conductor 65 of the UTP module 15 (described later) or the STP inner conductor 46 of the STP module 16 (described later). The substrate connection portion 30 is arranged behind the second dielectric 19, extending downward from the rear end of the inner conductor connection portion 29. The lower end of the substrate connection portion 30 is inserted into a through-hole (not shown) on the circuit board 17 and soldered to a conductive portion of the circuit board 17 for connection.

[0049] <Shielding Components>

[0050] The shielding member 21 is a cast body, and in this embodiment, it is configured as a die-cast member made of zinc alloy. The shielding member 21 is assembled to the second housing 18 from the rear. Figure 4 As shown, the shielding member 21 has a protrusion 34, a surrounding portion 35 protruding rearward from the protrusion 34, and a plurality of cylindrical portions 36 protruding forward from the protrusion 34. The protrusion 34 has a rectangular shape in both front and rear views. Figure 1 and Figure 2 As shown, the protrusion 34 is configured to cover the rear surface of the rear wall 33 of the fitting cylinder portion 22 when it is assembled into the second housing 18.

[0051] The enclosure 35, when viewed from the rear (not shown), forms a door-shaped frame and is open at the rear and bottom. The interior of the enclosure 35, not shown in detail, is divided into left and right sections, each housing an upper dielectric 28 and a lower dielectric 27. A pair of mounting protrusions 37 are formed on each side of the lower end of the enclosure 35. The shielding member 21 is positioned on the circuit board 17 by inserting each mounting protrusion 37 into a mounting hole (not shown) on the circuit board 17.

[0052] like Figure 4 As shown, each cylindrical portion 36 is formed into a rectangular tube that extends in the left-right direction, and all are formed with the same shape. Each cylindrical portion 36 has a pair of left and right portions arranged in both the upper and lower layers. The inner circumference of each cylindrical portion 36 extends through a portion 34, communicating with the inner part of the surrounding portion 35. (As shown...) Figure 1 and Figure 2 As shown, upper dielectric material 28 is inserted and held in each of the upper cylindrical portions 36. Lower dielectric material 27 is inserted and held in each of the lower cylindrical portions 36.

[0053] like Figure 4As shown, each of the upper cylindrical portions 36 is connected to an upper base portion 39 that extends in the left-right direction at its base end side, which is connected to the protrusion 34. The outer peripheral surface of the upper base portion 39 is arranged to surround the base end sides of each of the upper cylindrical portions 36. On the outer peripheral surface of the upper base portion 39, a plurality of press-in portions 40 are formed protruding at intervals in the circumferential direction. Each press-in portion 40 is formed into a block shape with a rectangular cross-section and is connected to the front surface of the protrusion 34. Each press-in portion 40 is positioned corresponding to each press-in recess 24.

[0054] Similarly, the base end of each lower cylindrical portion 36 is also connected to the lower base portion 41, and multiple press-in portions 40 are formed on the outer peripheral surface of the lower base portion 41 at positions corresponding to each press-in recess 24. When the shielding member 21 is assembled to the second housing 18, the upper base portion 39 and the lower base portion 41 are respectively inserted into the upper through hole 23 and the lower through hole 23, and each press-in portion 40 is pressed into each press-in recess 24. Thus, the shielding member 21 is held in the second housing 18. The second dielectric 19 is inserted into each cylindrical portion 36 from the rear, and the front part of the inner conductor connection portion 29 is configured to protrude into each cylindrical portion 36. In addition, the UTP module 15 or the STP module 16 is inserted into each cylindrical portion 36 from the front. Because each cylindrical portion 36 does not have openings such as holes, it can effectively suppress noise intrusion and leakage, and has excellent shielding performance and characteristic impedance adjustment performance.

[0055] <First Shell>

[0056] The first housing 14 is formed using an insulating synthetic resin material and has a rectangular outer perimeter shape. For example... Figure 1 and Figure 2 As shown, the first housing 14 is fitted into the fitting cylindrical portion 22 of the second housing 18. In the first housing 14, a plurality of cavities 42 are formed through it in the front-rear direction. Each cavity 42 is individually formed at a position corresponding to each cylindrical portion 36. Figure 5 As shown, each cavity 42 has the same opening shape and the front and rear lengths are also set to be the same.

[0057] On the upper surface of the inner wall of each cavity 42, a spear-shaped portion 43 is formed protruding forward. The spear-shaped portion 43 can elastically deform in the upward and downward directions. Figure 5 As shown, rearward surfaces 44 are formed in pairs at the left and right ends of the lower inner wall of each cavity 42. The UTP module 15 or STP module 16 is inserted into each cavity 42 from the rear. The UTP module 15 or STP module 16 is restricted from rearward disengagement by engaging with the spear-shaped portion 43 (see reference). Figure 1 and Figure 2) and can limit the detachment forward by touching the rear surface 44. In addition, each cavity 42 has a front-back length that exceeds the front-back lengths of the UTP module 15 and the STP module 16 respectively, and can accommodate the entire UTP module 15 and the STP module 16 respectively.

[0058] As Figure 5 shown, a lock arm 45 is formed on the upper wall of the first housing 14. The lock arm 45 can be elastically deformed in the up-down direction. The first connector 10 is inserted into the fitting cylinder portion 22 from Figure 3 the inside of the paper surface of the figure, and is locked with the locking portion 25 by the lock arm 45, so that the first connector 10 and the second connector 11 are held in a fitted state.

[0059] <STP module>

[0060] As Figure 6 shown, the STP module 16 has two STP inner conductors 46, an STP upper dielectric 47, an STP lower dielectric 48, an outer conductor 49, and an outer conductor cover 50.

[0061] The STP inner conductor 46 is a female terminal and is formed by bending a conductive metal plate or the like. The STP inner conductor 46 has a cylindrical box portion 51 at the front and an open cylindrical tube portion 52 at the rear. When the first connector 10 and the second connector 11 are fitted, the front portion of the inner conductor connection portion 29 is inserted into the box portion 51 and is electrically connected thereto. The tube portion 52 is connected to the wire 53 of the STP cable 13.

[0062] The STP cable 13 is a shielded twisted pair cable, and includes two wires 53, a shield 54 such as a braid that covers the outer circumferences of the respective wires 一起, and an insulating sheath 55 that covers the outer circumference of the shield 54.

[0063] At the end of the STP cable 13, the sheath 55 is removed, and the respective wires 53 are exposed side by side. The end of the shield 54 is folded back from the end of the sheath 55 and is exposed on the outer circumferential side of the sheath 55. The portions of the respective wires 53 that are exposed between the end of the sheath 55 and the STP inner conductor 46 are connected to each other by a clamp 56 that adjusts the characteristic impedance.

[0064] The STP upper dielectric 47 and the STP lower dielectric 4 are formed of an insulating synthetic resin material, and are combined with each other in the up-down direction to form an integral STP dielectric 57. The two STP inner conductors 46 are respectively accommodated in the STP dielectric 57 in a state of being connected to the wires 53 and arranged side by side in the left-right direction.

[0065] The outer conductor 49 is formed by bending a conductive metal plate or the like. As Figure 6As shown, the outer conductor 49 has a fitting portion 58 in the shape of a rectangular tube that is long in the front-rear direction, and a shield connection portion 59 that is connected to the shield 54 of the STP cable 13 as shown in Figure 2 . The STP dielectric 57 is inserted and housed in the tube portion 36 from the rear. The STP inner conductor 46 is electrically insulated from the outer conductor 49 by the STP dielectric 57. As shown in Figure 6 , a plurality of elastic contact portions 60 are formed in the fitting portion 58 by cutting and punching. When the first connector 10 and the second connector 11 are fitted together, the fitting portion 58 is inserted into the tube portion 36 of the shield member 21, and each elastic contact portion 60 contacts the inner surface of the tube portion 36. Thereby, the outer conductor 49 and the shield member 21 are electrically connected.

[0066] The shield connection portion 59 is formed in a strip-like shape that extends rearward from the lower rear edge of the fitting portion 58. As shown in Figure 2 , the shield connection portion 59 is disposed below the shield 54 and is connected to the shield 54 by the pressing force of a shield tube portion 64 of the outer conductor cover 50, which will be described later.

[0067] The outer conductor cover 50 is formed by bending a conductive metal plate or the like. The rear portion of the fitting portion 58 of the outer conductor 49 is disposed inside the front portion of the outer conductor cover 50. As shown in Figure 6 , a square opening hole 61 and a housing locking portion 62 that protrudes upward from the front edge of the opening hole 61 are formed in the upper wall of the front portion of the outer conductor cover 50. Strip-like stopper portions 63 that protrude downward are formed on the left and right side walls of the front portion of the outer conductor cover 50. When the STP module 16 is inserted into the cavity 42 of the first housing 14 from the rear, as shown in Figure 2 , the spear-shaped portion 43 is arranged to be inserted into the opening hole 61 and can be locked with the housing locking portion 62, and the STP module 16 is prevented from coming off in the cavity 42. In addition, by the contact of each stopper portion 63 with the rear surface 44 of the first housing 14, the STP module 16 stops advancing in the cavity 42.

[0068] A shield tube portion 64 is formed at the rear portion of the outer conductor cover 50. As shown in Figure 2 , the shield tube portion 64 disposes the shield connection portion 59 of the outer conductor 49 inside and is crimped and connected to the shield 54 of the STP cable 13. In addition, for the shield tube portion 64 of Figure 6 , for convenience, a deformed state in which it is crimped to the shield 54 of the STP cable 13 is shown. Correctly, the shield tube portion 64 is formed in an open tube shape before deformation.

[0069] <UTP module>

[0070] As shown in Figure 8 , the UTP module 15 has two UTP inner conductors 65, a UTP upper dielectric 66, a UTP lower dielectric 67, and an impedance adjustment member 68.

[0071] The UTP inner conductor 65 is a female terminal with the same shape as the STP inner conductor 46, and like the STP inner conductor 46, it has a housing portion 51 and a sheath portion 52. The sheath portion 52 is connected to the wires 53 of the UTP cable 12. The UTP cable 12 is an unshielded twisted-pair cable, constructed by removing the shield 54 from the STP cable 13. That is, the UTP cable 12 is constructed using two wires 53 and a sheath 55.

[0072] The upper UTP dielectric 66 and the lower UTP dielectric 67 are formed of insulating synthetic resin material and are combined with each other in the vertical direction to form a single UTP dielectric 69. The two UTP inner conductors 65 are respectively housed in the UTP dielectric 69 in the left-right direction in a state of connection with the wire 53.

[0073] A housing locking portion 70 is formed protruding from the upper surface of the upper dielectric 66 of the UTP. When the upper dielectric 66 of the UTP is inserted into the cavity 42 of the first housing 14 from the rear, as... Figure 1 As shown, the spear-shaped portion 43 is configured to engage with the housing locking portion 70, preventing the UTP module 15 from detaching within the cavity 42. Additionally, as... Figure 8 As shown, a pair of locking protrusions 71 are formed at the lower ends of the left and right sides of the UTP upper dielectric 66.

[0074] The UTP lower dielectric 67 has a plate-shaped main body 72 and a pair of elastic locking portions 73 extending from the left and right side edges of the main body 72 at the front and back. Figure 9 As shown, the locking protrusions 71 are engaged by the elastic locking parts 73, thereby keeping the UTP dielectric 69 in a combined state. A stepped stop surface 74 facing forward is formed on the lower surface of the UTP lower dielectric 67. The stop surface 74 contacts the rear surface 44 of the first housing 14, thereby stopping the UTP module 15 from advancing within the cavity 42.

[0075] A flat mounting surface 75 is formed on the upper surface of the rear portion of the main body 72. On the upper surface of the main body 72, a stepped portion 76 is provided in front of the pair of elastic locking portions 73 on the rear side, defining the front end of the mounting surface 75. The upper surface of the front portion of the main body 72 is configured to be one level higher than the mounting surface 75 by means of the stepped portion 76.

[0076] The impedance adjustment member 68 is formed by bending a conductive metal sheet, etc. The impedance adjustment member 68 includes a press-fit portion 77, such as... Figure 1 As shown, the outer circumferential surface of the sheath 55 of the UTP cable 12 is rolled into a cylindrical shape and pressed against it; and the flat mounting portion 78, as shown... Figure 8As shown, the impedance adjustment member 68 protrudes forward from the lower edge of the front end of the crimping portion 77 and extends further to the left and right sides. The mounting surface 75 of the UTP lower dielectric 67 is disposed opposite to the mounting portion 78, so that the mounting portion 78 is located further forward than each of the elastic locking portions 73 on the rear side. Furthermore, the impedance adjustment member 68 is prevented from floating upward by the UTP upper dielectric 66 assembled to the UTP lower dielectric 67.

[0077] <Function>

[0078] like Figure 7 As shown, the STP module 16 is formed in a state where it is connected to the end of the STP cable 13. The inner STP conductor 46 is housed inside the STP module 16, while the outer conductor 49 and outer conductor cover 50 are arranged to protrude from the outside of the STP module 16. On the other hand, as... Figure 9 As shown, the UTP module 15 is formed in a state where it is connected to the end of the UTP cable 12. The UTP inner conductor 65 is housed inside the UTP module 15, and the UTP dielectric 69 is configured to be exposed on the outside of the UTP module 15.

[0079] The UTP module 15 and the STP module 16 have the same or nearly the same front-to-back length and outer diameter. Both the UTP module 15 and the STP module 16 are housed within the first housing 14. The first housing 14 has multiple cavities 42 formed to separately house the UTP module 15 and the STP module 16. Each cavity 42 is formed with the same shape.

[0080] Therefore, the UTP module 15 and STP module 16 can be housed in appropriate cavities 42 within the first housing 14. That is, the arrangement of the UTP module 15 and STP module 16 housed in each cavity 42 is arbitrary, and can be determined, for example, based on the arrangement of the conductive portions of the circuit board 17. Furthermore, the number of each UTP module 15 and STP module 16 is also arbitrary, and it is not necessary to house the UTP module 15 and STP module 16 in all cavities 42.

[0081] Figure 2 This example illustrates the case where two STP modules 16 are housed within the cavities 42 of the upper and lower layers on the left and right sides. For example... Figure 2 As shown, with the first connector 10 and the second connector 11 engaged, the front part of the STP module 16 is inserted into the corresponding cylindrical portion 36 of the shielding member 21, and the outer conductor 49 is connected to the cylindrical portion 36 via each elastic contact portion 60. Thus, a shielding structure that is continuous in the front-to-back direction is formed between the first connector 10 and the second connector 11.

[0082] in addition, Figure 1 This example illustrates the case where two UTP modules 15 are housed within cavities 42 on the upper and lower layers of the left and right sides. For example... Figure 1As shown, with the first connector 10 and the second connector 11 engaged, the front of the UTP module 15 is inserted into the corresponding cylindrical portion 36 of the shielding member 21, and the cylindrical portion 36 is configured to cover the outer periphery of the connection portion of the housing 51 of the UTP inner conductor 65 and the inner conductor connection portion 29 of the terminal 20. Thus, an adjustment portion 79 for adjusting characteristic impedance is formed on the outer periphery of the UTP inner conductor 65, separated by the UTP dielectric 69. Furthermore, the UTP module 15 is configured in a state where it does not contact the cylindrical portion 36.

[0083] In this embodiment, due to the requirement for connector miniaturization, it is sometimes difficult to ensure the front-to-back length of cavity 42 sufficiently. In addition, UTP module 15 and STP module 16 are set to have the same or nearly the same front-to-back length, so the front-to-back length of UTP module 15 is shorter than that of the conventional type, and sometimes the front-to-back length of impedance adjustment member 68 housed in UTP module 15 is also shorter than that of the conventional type.

[0084] However, in this embodiment, as described above, the adjustment section 79 is formed by covering the outer periphery of the UTP inner conductor 65 with the cylindrical portion 36, which can compensate for the reduction in characteristic impedance adjustment function caused by the shortening of the size of the impedance adjustment member 68, and further improve the characteristic impedance adjustment function.

[0085] Furthermore, in this embodiment, since the UTP module 15 and the STP module 16 are housed in a common first housing 14, it is not necessary to provide separate UTP housings for the UTP module 15 and separate STP housings for the STP module 16. In other words, in this embodiment, it is not necessary to provide connectors corresponding to the UTP and STP specifications separately, thus reducing the number of components. In particular, since the second connector 11 is mounted on the circuit board 17, the connector area occupied on the surface of the circuit board 17 can be reduced, contributing to space saving. Additionally, the fitting operation does not need to be performed according to each UTP and STP specification individually, thus reducing the number of fitting operations and improving workability.

[0086] Furthermore, in this embodiment, the shielding member 21 has a plurality of cylindrical portions 36, and depending on the specifications, the UTP module 15 and the STP module 16 can be selectively housed in part or all of each cylindrical portion 36, thus providing excellent versatility.

[0087] [Other embodiments of this disclosure]

[0088] The embodiments disclosed herein should be considered illustrative in all respects, and not restrictive.

[0089] As another implementation, the first connector may also be configured to have only a UTP module and not an STP module.

[0090] As another embodiment, the first connector may also be configured to not have an impedance adjustment member, and only use the cylindrical portion for characteristic impedance adjustment. For example, if the front-to-back length of the UTP module cannot be sufficiently guaranteed from the viewpoint of connector miniaturization, the impedance adjustment member can be omitted from the first connector.

[0091] In another implementation, the UTP module may also be configured to contact the inner surface of the cylinder.

[0092] As another implementation, the cylindrical portion of the shielding member may also be configured to cover multiple UTP modules and STP modules together.

[0093] As another implementation, the shielding member may also be a member formed by bending a conductive metal sheet or the like.

[0094] Explanation of reference numerals in the attached figures

[0095] 10: Connector 1

[0096] 11: Second connector

[0097] 12: UTP cable

[0098] 13: STP cable

[0099] 14: First shell

[0100] 15: UTP module

[0101] 16: STP Module

[0102] 17: Circuit board

[0103] 18: Second shell

[0104] 19: Second dielectric

[0105] 20: Terminal

[0106] 21: Shielding components

[0107] 22: Fitting barrel

[0108] 23: Through hole

[0109] 24: Press into the recess

[0110] 25: Locking section

[0111] 26: Mounting holes

[0112] 27: Lower dielectric layer

[0113] 28: Upper dielectric

[0114] 29: Inner conductor connection part

[0115] 30: Substrate connection portion

[0116] 31: Lower terminal

[0117] 32: Upper terminal

[0118] 33: Posterior wall

[0119] 34: Protruding part

[0120] 35: Enclosure

[0121] 36: Cylinder section

[0122] 37: Assembly protrusion

[0123] 39: Upper base section

[0124] 40: Press-in section

[0125] 41: Lower base section

[0126] 42: cavity

[0127] 43: Spear-shaped part

[0128] 44: Rear surface

[0129] 45: Locking arm

[0130] 46: STP inner conductor

[0131] 47: Top dielectric of STP

[0132] 48: STP underside dielectric

[0133] 49: External conductor

[0134] 50: Outer conductor cover

[0135] 51: Box Section

[0136] 52: Cylinder section

[0137] 53: Electrical wire

[0138] 54: Shielding

[0139] 55: Sheath

[0140] 56: Clamping component

[0141] 57: STP dielectric

[0142] 58: Chimeric part

[0143] 59: Shielded connection part

[0144] 60: Elastic contact part

[0145] 61: Opening hole

[0146] 62: Housing locking part

[0147] 63: Stop section

[0148] 64: Shielding cylinder section

[0149] 65: UTP inner conductor

[0150] 66: UTP top dielectric

[0151] 67: UTP underside dielectric

[0152] 68: Impedance Adjustment Component

[0153] 69: UTP dielectric

[0154] 70: Housing locking part

[0155] 71: Locking Protrusion

[0156] 72: Main body

[0157] 73: Elastic locking part

[0158] 74: Stop surface

[0159] 75: Assembly Surface

[0160] 76: Step section

[0161] 77: Crimping section

[0162] 78: Setting Department

[0163] 79: Adjustment Department

Claims

1. A connector comprising a first connector and a second connector capable of mating with each other, The first connector has a UTP module. The UTP module has a UTP inner conductor that is wired to the UTP cable. The second connector has a conductive shielding member that covers the outer periphery of the UTP inner conductor when the first connector and the second connector are engaged. The first connector has an STP module and a first housing. The STP module has an inner STP conductor that is wired to the STP cable and an outer conductor that is wired to the shield of the STP cable. The shielding member contacts the outer conductor when the first connector and the second connector are engaged. The first housing has multiple cavities. The UTP module and the STP module are respectively housed in multiple cavities. The shielding component has multiple cylindrical sections. The UTP inner conductor and the outer conductor are respectively disposed on the inner side of the plurality of cylindrical portions. The outer conductor is in contact with the inner surface of the cylindrical section.

2. The connector of claim 1, wherein, The UTP module has a conductivity impedance adjustment component installed on the UTP cable. Each of the multiple cavities has the same length. The length of the impedance adjustment member is set to the length that is accommodated inside the cavity when the UTP module is housed in the cavity.

3. The connector of claim 1 or claim 2, wherein, The shielding component is molded.

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