Camera module and optical device

Abstract

Embodiments include a fixed unit including a magnet, and a mobile unit including a first circuit board arranged spaced apart from the fixed unit, a position sensor arranged on the first circuit board, a coil facing the magnet, and a separation member arranged between the first circuit board and the coil, wherein the separation member includes a hole, and the position sensor is at least partially arranged in the hole of the separation member and overlaps the magnet in an optical axis direction.

Description

Technical Field

[0001] The implementation relates to a camera module and an optical device including the camera module. Background Technology

[0002] It is difficult to apply the technology of voice coil motors (VCMs) used in existing general camera modules to ultra-small, low-power camera modules, and therefore related research has been actively carried out.

[0003] The demand for and production of electronic products, such as smartphones and mobile phones equipped with cameras, has increased. Cameras for mobile phones are evolving towards higher resolution and miniaturization. Consequently, actuators are also evolving towards miniaturization, larger aperture, and greater functionality. To achieve high-resolution cameras for mobile phones, it is necessary to improve the performance of cameras for mobile phones and their additional functions, such as autofocus, image stabilization, and zoom. Summary of the Invention

[0004] Technical issues

[0005] The embodiment provides a camera module and an optical device including the camera module, which are capable of performing accurate OIS feedback operations and thus ensuring the reliability of OIS operations.

[0006] Technical solution

[0007] In one embodiment, the camera module includes a fixed portion and a movable portion. The fixed portion includes a magnet, and the movable portion includes: a first circuit board spaced apart from the fixed portion; a position sensor disposed on the first circuit board; a coil disposed facing the magnet; and a spacer disposed between the first circuit board and the coil, wherein the spacer has a hole, and the position sensor is configured such that at least a portion of the position sensor is disposed in the hole of the spacer and overlaps with the magnet in the optical axis direction.

[0008] The spacer's aperture may overlap with at least a portion of the coil in the optical axis direction. The position sensor may not overlap with the coil in the optical axis direction. The coil may have a hole formed in its center, and the spacer's aperture may overlap with the coil's hole in the optical axis direction. The position sensor may overlap with both the coil's hole and the spacer's hole in the optical axis direction.

[0009] A space may be defined between the magnet and the position sensor. The camera module may also include a resilient support member that connects to both the fixed portion and the movable portion. The fixed portion may include a second circuit board, and the resilient support member can electrically connect the first circuit board to the second circuit board. A coil may be connected to a spacer and can be electrically connected to the first circuit board.

[0010] In another embodiment, the camera module includes: a lens; an image sensor disposed at a position corresponding to the lens; a drive unit configured to move the image sensor; a circuit board disposed spaced apart from the lens; a position sensor disposed on the circuit board; and a spacer disposed on the circuit board, wherein the drive unit includes a magnet and a coil facing the magnet, wherein the spacer is disposed between the circuit board and the coil to space the coil apart from the position sensor, and wherein the image sensor moves in a direction perpendicular to the optical axis.

[0011] In another embodiment, the camera module includes a fixed portion and a movable portion. The fixed portion includes a magnet, and the movable portion includes: a first circuit board spaced apart from the fixed portion; a holder disposed on the first circuit board; a coil disposed on the holder facing the magnet; a position sensor disposed on the first circuit board facing the magnet; and a support member connected to both the fixed portion and the movable portion. The movable portion moves in a direction perpendicular to the optical axis by the interaction between the magnet and the coil, and the coil does not overlap with the magnet in the direction perpendicular to the optical axis.

[0012] A position sensor can be mounted on a first circuit board and can be positioned so as not to overlap with a coil in the optical axis direction. A mounting portion may include a second circuit board, which is spaced apart from the first circuit board. A support member may be coupled to the second circuit board at one end and to the first circuit board at the other end. The support member can connect the first circuit board to the second circuit board.

[0013] The coil may have a hole formed in its center, and the position sensor may be positioned below the hole in the spacer and may overlap with the hole in the spacer in the optical axis direction.

[0014] The retainer may have a through-hole that corresponds to a position sensor in the optical axis direction, and the position sensor may be disposed in the through-hole of the retainer. The retainer may include a coupling protrusion projecting from its upper surface, and a coil may be coupled to the coupling protrusion.

[0015] The movable part may include an image sensor mounted on a first circuit board. The four corners of the first circuit board may be provided with protrusions projecting from the side surfaces of the first circuit board, and the lower surface of the holder may have a seating groove in which the protrusions of the first circuit board are disposed.

[0016] The coil may include a first coil unit to a fourth coil unit respectively disposed at a first corner to a fourth corner of the retainer. The magnet may include a first magnet corresponding to the first coil unit, a second magnet corresponding to the second coil unit, a third magnet corresponding to the third coil unit, and a fourth magnet corresponding to the fourth coil unit. The position sensor may include a first sensor disposed below the first coil unit, a second sensor disposed below the second coil unit, and a third sensor disposed below the third coil unit. The first to fourth coil units can be activated individually.

[0017] The first through third coil units can be activated individually, and the fourth coil unit can be activated together with one of the first through third coil units.

[0018] In another embodiment, the camera module includes a fixed portion and a movable portion. The fixed portion includes a magnet, and the movable portion includes: a first circuit board spaced apart from the fixed portion; a coil facing the magnet; a holder disposed between the first circuit board and the coil; and a position sensor disposed on the first circuit board facing the magnet. The coil has a first hole therein, the holder has a second hole formed at a position corresponding to the first hole, and at least a portion of the position sensor is disposed in the second hole in the holder.

[0019] Beneficial effects

[0020] As is apparent from the above description, since the implementation is configured such that the OIS position sensor does not overlap with the OIS coil unit in a direction perpendicular to the optical axis, the influence of the magnetic field of the OIS coil unit on the output of the OIS position sensor can be reduced, accurate OIS feedback operation can be performed, and the reliability of OIS operation can be ensured.

[0021] Furthermore, since the implementation method eliminates the influence of the magnetic field generated from the coil on the output of the position sensor, accurate OIS feedback operation can be performed and the reliability of OIS operation can be ensured. Attached Figure Description

[0022] Figure 1 This is a perspective view of a camera module according to an embodiment of the present invention;

[0023] Figure 2 yes Figure 1 An exploded perspective view of the camera module shown;

[0024] Figure 3 yes Figure 1 The image shows a perspective view of the camera module with the cover component removed.

[0025] Figure 4 yes Figure 2 An exploded perspective view of the AF (autofocus) operation unit shown in the figure;

[0026] Figure 5 yes Figure 4 A perspective view of the coil frame, sensing magnet, balancing magnet, first coil, circuit board, first position sensor, and capacitor shown.

[0027] Figure 6 It is a three-dimensional view of the coil frame, housing, circuit board, and upper elastic component;

[0028] Figure 7 It is a bottom perspective view of the housing, coil frame, lower elastic component, magnet and circuit board;

[0029] Figure 8 This is a plan view of the image sensor unit;

[0030] Figure 9 This is an exploded stereoscopic view of the image sensor unit;

[0031] Figure 10 yes Figure 9 A perspective view of the second circuit board and housing shown;

[0032] Figure 11 yes Figure 9 A perspective view of the second circuit board, housing, and magnet shown in the figure;

[0033] Figure 12a It is an exploded perspective view of the retainer, the second coil, the first circuit board, the second position sensor, the image sensor, the support member, and the connecting elastic member;

[0034] Figure 12b yes Figure 12a A perspective view of the holder, second coil, first circuit board, second position sensor, filter holder, and filter shown;

[0035] Figure 13a yes Figure 12a A perspective view of the bottom of the retainer shown;

[0036] Figure 13b This is a bottom view of the retainer and the first circuit board;

[0037] Figure 14 It is an exploded perspective view of the retainer, image sensor, first circuit board, support member and connecting elastic member;

[0038] Figure 15 This is a bottom view of the retainer, the first circuit board, and the connecting elastic member;

[0039] Figure 16 This is a bottom view of the retainer, the first circuit board, the connecting elastic member, and the insulating member;

[0040] Figure 17 This is a magnified view of a portion of the connecting elastic component;

[0041] Figure 18 It is a three-dimensional diagram of a connecting spring and a supporting component;

[0042] Figure 19a yes Figure 1 The cross-sectional view of the camera module shown is taken along line AB;

[0043] Figure 19b yes Figure 1 The cross-sectional view of the camera module shown is taken along line CD;

[0044] Figure 20 yes Figure 1 The cross-sectional view of the camera module shown is taken along line IJ;

[0045] Figure 21 yes Figure 8 A cross-sectional view of the image sensor unit shown, taken along line EF;

[0046] Figure 22 This is a view illustrating a connecting elastic member according to another embodiment;

[0047] Figure 23 This is an exploded perspective view of a camera module according to another embodiment of the present invention;

[0048] Figure 24 This is a view illustrating the arrangement of the magnet, OIS coil unit, OIS position sensor, holder, and first circuit board according to an embodiment.

[0049] Figure 25 This is a view illustrating the arrangement of the magnet, OIS coil unit, OIS position sensor, first circuit board, and holder according to a comparative example;

[0050] Figure 26 This is a view illustrating the frequency response characteristics of the drive signal input to the OIS coil unit and the output of the OIS position sensor;

[0051] Figure 27 The diagram illustrates the input based on... Figure 24 A view of the frequency response characteristics of the drive signal of the OIS coil unit and the output of the OIS position sensor in the embodiment shown;

[0052] Figure 28 This is a perspective view of the camera module according to the implementation method;

[0053] Figure 29 yes Figure 28 An exploded perspective view of the camera module shown;

[0054] Figure 30 The cover component has been removed. Figure 28 An assembled 3D view of the camera module shown;

[0055] Figure 31 yes Figure 29 An exploded perspective view of the AF operation unit shown in the figure;

[0056] Figure 32 yes Figure 31 A perspective view of the coil frame, sensing magnet, balancing magnet, first coil, circuit board, first position sensor, and capacitor shown.

[0057] Figure 33 It is a 3D view of the coil frame, housing, and circuit board;

[0058] Figure 34 It is a bottom perspective view of the housing, coil frame, lower elastic component, magnet and circuit board;

[0059] Figure 35 yes Figure 29 A plan view of the image sensor unit shown;

[0060] Figure 36 yes Figure 35 An exploded perspective view of the image sensor unit shown;

[0061] Figure 37 This is a 3D view of the first circuit board and the housing;

[0062] Figure 38 yes Figure 36 A perspective view of the first circuit board, housing, and magnet shown in the figure;

[0063] Figure 39a It is an exploded perspective view of the second circuit board, the second coil, the second position sensor, the image sensor, the support member, and the retainer;

[0064] Figure 39b yes Figure 39a A plan view of the third circuit board, the second coil, and the second position sensor shown;

[0065] Figure 40 yes Figure 36 An exploded perspective view of the second circuit board, image sensor, support member, retainer, and connecting elastic member shown in the figure;

[0066] Figure 41 yes Figure 35The bottom view of the image sensor unit shown has the bottom cover removed;

[0067] Figure 42 This is a magnified view of a portion of the connecting elastic component;

[0068] Figure 43 This is a view illustrating a connecting spring that connects to an elastic member;

[0069] Figure 44a yes Figure 28 The cross-sectional view of the camera module shown is taken along line AB;

[0070] Figure 44b yes Figure 28 The cross-sectional view of the camera module shown is taken along line CD;

[0071] Figure 45 yes Figure 28 The cross-sectional view of the camera module shown is taken along line IJ;

[0072] Figure 46 yes Figure 35 A cross-sectional view of the image sensor unit shown, taken along line EF;

[0073] Figure 47 yes Figure 35 The image sensor shown is a cross-sectional view taken along line GH.

[0074] Figure 48 It is a 3D view of the camera module with the bottom cover removed and cut open;

[0075] Figure 49 This is a view illustrating the process of mounting an image sensor, a filter holder, and a filter onto a fourth circuit board;

[0076] Figure 50 This is a view illustrating a controller according to an embodiment;

[0077] Figure 51 This is a view illustrating an implementation of a correction value stored in memory;

[0078] Figure 52 It's a diagram. Figure 51 A view showing the method for setting the correction value;

[0079] Figure 53 Another implementation of the correction value stored in memory is illustrated;

[0080] Figure 54 It's a diagram. Figure 53 A view showing the method for setting the correction value;

[0081] Figure 55 This is a view illustrating the arrangement of OIS position sensors according to another embodiment;

[0082] Figure 56 This is a view illustrating a controller according to another embodiment;

[0083] Figure 57 It is a flowchart illustrating the operation of the controller according to an embodiment;

[0084] Figure 58 This is a table illustrating an implementation method for correcting the output of an OIS position sensor;

[0085] Figure 59 This is a table illustrating another implementation of correcting the output of an OIS position sensor;

[0086] Figure 60 It is a view illustrating the code values ​​of the output of the first sensor, which correspond to or match the displacement of the movable part of the OIS in the X-axis direction;

[0087] Figure 61 This is a view illustrating the frequency response characteristics of the drive signal input to the OIS coil unit and the output of the OIS position sensor;

[0088] Figure 62 It is a perspective view illustrating an optical device according to an embodiment; and

[0089] Figure 63 It's a diagram. Figure 62 The diagram shows a view of the configuration of the optical device. Detailed Implementation

[0090] In the following, embodiments of the present invention will be described in detail with reference to the accompanying drawings.

[0091] The technical concept of this invention can be implemented in many different forms and should not be construed as limited to the embodiments set forth herein. One or more components of the embodiments may be selectively combined or substituted with each other without departing from the spirit and scope of the invention.

[0092] Unless otherwise specifically defined, the terminology (including technical and scientific terms) used in embodiments of this invention shall have the same meaning as commonly understood by one of ordinary skill in the art to which this invention pertains. It will also be understood that common terms, such as those defined in dictionaries, shall be interpreted as having the same meaning as they have in the context of the relevant art.

[0093] The terminology used in embodiments of this invention is for the purpose of describing particular embodiments only and is not intended to limit the invention. As used in this disclosure and the appended claims, the singular form is intended to include the plural form as well, unless the context clearly indicates otherwise. The phrase “at least one (or one or more of A, B, and C)” can be interpreted as including one or more of all combinations of A, B, and C.

[0094] Furthermore, when describing the components of the present invention, terms such as "first," "second," "A," "B," "(a)," or "(b)" may be used. Since these terms are provided merely to distinguish the components from one another, they do not limit the nature, sequence, or order of the components.

[0095] It should be understood that when an element is referred to as “connected,” “linked,” or “attached” to another element, the element may be directly “connected,” “linked,” or “attached” to the other element, or may be “connected,” “linked,” or “attached” to the other element via other elements placed between it. Furthermore, it will be understood that when an element is referred to as being formed “on” or “below” another element, the element may be directly located “on” or “below” the other element, or may be indirectly associated with the other element, wherein one or more intermediate elements are disposed between the element and the other element. Additionally, it will be understood that “on” or “below” an element may refer to the upward or downward direction of the element.

[0096] In the following text, the AF operating unit may be alternatively referred to as the "lens moving unit," "VCM (voice coil motor)," "actuator," or "lens moving device." In the following text, the term "coil" may be used interchangeably with "coil unit," and the term "elastic member" may be used interchangeably with the terms "elastic unit" or "spring."

[0097] In the following description, "terminal" may be alternatively referred to as "pad", "electrode", "conductive layer" or "joint portion".

[0098] In the following text, “code value” may be alternatively referred to as “data value” or “numeric value”.

[0099] In the following text, "camera module" may be referred to as "camera", "imaging device" or "camera equipment".

[0100] For ease of description, although a rectangular coordinate system (x, y, z) is used to describe the camera module according to the embodiment, other coordinate systems may be used to describe the lens moving device, and the embodiment is not limited to this. In the figures, the X-axis and Y-axis directions refer to directions perpendicular to the optical axis, i.e., the Z-axis. The Z-axis direction, which is the direction of the optical axis OA, may be referred to as the "first direction," the X-axis direction may be referred to as the "second direction," and the Y-axis direction may be referred to as the "third direction."

[0101] The camera module according to an embodiment of the present invention is capable of performing an "autofocus function". Here, the "autofocus function" is used to automatically focus an image of an object onto the surface of the image sensor.

[0102] Additionally, the camera module according to the embodiment can perform a "shake correction" function. Here, the "shake correction" function can be used to prevent the outline of the captured image from becoming blurred due to vibrations caused by the user's hand shaking when capturing still images.

[0103] Figure 1 This is a perspective view of a camera module 10 according to an embodiment of the present invention. Figure 2 yes Figure 1 An exploded perspective view of the camera module 10 shown. Figure 3 yes Figure 1 The image shows an assembled perspective view of the camera module with the cover member 300 removed. Figure 4 yes Figure 2 An exploded perspective view of the AF operation unit 100 shown. Figure 5 yes Figure 4 The diagram shows a perspective view of the coil holder 110, sensing magnet 180, balancing magnet 185, first coil 120, circuit board 190, first position sensor 170, and capacitor 195. Figure 6 It is a perspective view of the coil frame 110, housing 140, circuit board 190 and upper elastic member 150. Figure 7 This is a bottom perspective view of the housing 140, coil frame 110, lower elastic member 160, magnet 130, and circuit board 190.

[0104] Reference Figures 1 to 7 The camera module 10 may include an AF operation unit 100 and an image sensor unit 350.

[0105] The camera module 10 may also include at least one of a cover member 300, a lens module 400, a base 210, and a bottom cover 219. The cover member 300, the base 210, and the bottom cover 219 may define a housing.

[0106] The AF operation unit 100 can be connected to the lens module 400 and can move the lens module 400 along the optical axis OA or in a direction parallel to the optical axis to perform the autofocus function of the camera module 10.

[0107] The image sensor unit 350 may include an image sensor 810, and the image sensor 810 may be moved in a direction perpendicular to the optical axis, or the image sensor 810 may be tilted or rotated relative to the optical axis. The image sensor unit 350 may perform hand shake correction functions.

[0108] For example, the image sensor 810 can rotate about at least one of the x-axis, y-axis, and z-axis.

[0109] For example, the image sensor 810 can move along at least one of the x-axis, y-axis and z-axis directions.

[0110] For example, the image sensor 810 may be tilted relative to at least one of the x-axis, y-axis, and z-axis.

[0111] The AF operation unit 100 may alternatively be referred to as a "lens moving unit" or "lens moving device". Alternatively, the AF operation unit 100 may alternatively be referred to as a "first actuator" or "AF operation drive unit".

[0112] For the movement of the OIS (Optical Image Stabilizer), the image sensor 810, instead of the lens module 400, can be moved in a direction perpendicular to the optical axis by the image sensor unit 350.

[0113] The image sensor unit 350 may alternatively be referred to as an "image sensor moving unit" or "image sensor shifting unit," "sensor moving unit," or "sensor shifting unit." Alternatively, the image sensor unit 350 may alternatively be referred to as a "second actuator" or "OIS driving unit."

[0114] Reference Figure 4 The AF operation unit 100 may include a coil frame 110, a first coil 120, a magnet 130, and a housing 140.

[0115] The AF operation unit 100 may also include an upper elastic member 150 and a lower elastic member 160.

[0116] The AF operation unit 100 may include a first position sensor 170, a circuit board 190, and a sensing magnet 180 for AF feedback operation. The AF operation unit 100 may also include at least one of a balancing magnet 185 and a capacitor 195.

[0117] The coil holder 110 can be disposed in the housing 140 so that it can be moved along the optical axis direction OA or a first direction (e.g., the Z-axis direction) by means of the electromagnetic interaction between the first coil 120 and the magnet 130.

[0118] The coil holder 110 may have a hole to which the lens module 400 is coupled or mounted. For example, the hole in the coil holder 110 may be a through hole formed along the optical axis through the coil holder 110, and may have a circular, elliptical, or polygonal shape, but is not limited thereto.

[0119] The lens module 400 may include at least one lens and / or lens barrel.

[0120] For example, lens module 400 may include at least one lens and a lens barrel for receiving the at least one lens. However, the configuration of the lens module is not limited to a lens barrel, and the lens module may have any configuration as long as it can support at least one lens.

[0121] For example, the lens module 400 can be threaded onto the coil holder 110. Alternatively, the lens module 400 can be attached to the coil holder 110 using, for example, an adhesive (not shown). Light that has passed through the lens module 400 can be radiated to the image sensor 810 through the filter 610.

[0122] The coil holder 110 may include protrusions 111 disposed on its outer surface.

[0123] For example, although protrusion 111 may protrude in a direction parallel to a line perpendicular to the optical axis OA, this disclosure is not limited thereto.

[0124] The protrusion 111 of the coil holder 110 can correspond to the groove 25a in the housing 140, and can be disposed in the groove 25a in the housing 140, so as to minimize the rotation of the coil holder 110 about the optical axis or prevent the rotation of the coil holder 110 about the optical axis from exceeding a predetermined range.

[0125] In addition, the protrusion 111 can be used as a stop, which is configured to move the coil frame 110 within a predetermined range along the optical axis direction (e.g., along the direction from the upper elastic member 150 toward the lower elastic member 160) in response to external impacts, etc.

[0126] The coil holder 110 may have a first clearance groove 112a formed in its upper surface to avoid spatial interference with the first frame connector 153 of the upper elastic member 150. The coil holder 110 may have a second clearance groove 112b formed in its lower surface to avoid spatial interference with the second frame connector 163 of the lower elastic member 160.

[0127] The coil holder 110 may include a first connector 116a configured to connect and secure to the upper resilient member 150. For example, although the first connector 116a of the coil holder 110 may have a flat shape, this disclosure is not limited thereto. In another embodiment, the first connector 116a of the coil holder 110 may have the shape of a protrusion or a groove.

[0128] The coil holder 110 may include a second connector 116b configured to connect and secure to the lower resilient member 160. For example, although the second connector 116b may have a flat shape, this disclosure is not limited thereto. In another embodiment, the second connector 116b may have a protruding or recessed shape.

[0129] Reference Figure 5 The outer surface of the coil holder 110 may have a groove formed therein, in which the first coil 120 is seated, fitted, or disposed. The groove in the coil holder 110 may have a shape corresponding to the shape of the first coil 120, i.e., a closed curve shape (e.g., a ring shape).

[0130] The coil holder 110 may have a first mounting groove therein, in which the sensing magnet 180 is mounted, fitted, fixed, or disposed. Furthermore, the coil holder 110 may have a second mounting groove on its outer surface, in which the balancing magnet 185 is mounted, fitted, fixed, or disposed. For example, the first and second mounting grooves in the coil holder 110 may be formed on opposite outer surfaces of the coil holder 110.

[0131] The first coil 120 can be disposed at the coil holder 110 or connected to the coil holder 110. For example, the first coil 120 can be disposed on the outer surface of the coil holder 110.

[0132] The first coil 120 may be wound around the outer surface of the coil frame 110 along the optical axis OA in the winding direction, but is not limited thereto.

[0133] Although the first coil 120 can be directly wound around the outer surface of the coil holder 110, this disclosure is not limited thereto. In another embodiment, the first coil 120 may be implemented as a coil loop wound around the coil holder 110, or as a coil block having an angled shape.

[0134] Power or drive signals can be supplied to coil 120.

[0135] The power or drive signal supplied to the first coil 120 can be a DC signal, an AC signal, or a signal containing both DC and AC components, and can be voltage-type or current-type.

[0136] When a drive signal (e.g., drive current) is supplied to the first coil 120, an electromagnetic force can be generated through electromagnetic interaction with the first magnet, thereby causing the coil frame 110 to move along the direction of the optical axis OA by means of the generated electromagnetic force.

[0137] At the initial position of the AF operating unit, the coil holder 110 can move upward or downward, which is called bidirectional drive of the AF operating unit. Alternatively, at the initial position of the AF operating unit, the coil holder 110 can move upward (or forward), which is called unidirectional drive.

[0138] At the initial position of the AF operation unit, the first coil 120 can be configured to correspond to the magnet 130 disposed at the housing 140 in a direction parallel to a line perpendicular to the optical axis OA and extending through the optical axis.

[0139] For example, the AF operation unit may include a coil holder 110 and components connected to the coil holder 110 (e.g., a first coil 120, a sensing magnet 180, and a balancing magnet 185). The AF operation unit may also include a lens module 400.

[0140] The initial position of the AF operating unit can be the initial position of the AF operating unit when no power is applied to the first coil 120, or the position of the AF operating unit caused by the elastic deformation of the upper elastic member 150 and the lower elastic member 160 due to the weight of the AF operating unit.

[0141] In addition, the initial position of the coil frame 110 can be the position of the AF operating unit when gravity acts in the direction from the coil frame 110 to the base 210 or when gravity acts in the direction from the base 210 to the coil frame 110.

[0142] The sensing magnet 180 can provide a magnetic field detected by the first position sensor 170, and the balancing magnet 185 can be used to counteract the influence of the magnetic field of the sensing magnet 180 and establish weight balance relative to the sensing magnet 180.

[0143] The sensing magnet 180 can be alternatively referred to as the "sensor magnet".

[0144] The sensing magnet 180 can be located at the coil holder 110 or can be connected to the coil holder 110.

[0145] The sensing magnet 180 can be configured to face the first position sensor 170.

[0146] The balancing magnet 185 can be disposed at the coil holder 110 or connected to the coil holder 110. For example, the balancing magnet 185 can be positioned opposite the sensing magnet 180.

[0147] Although each of the sensing magnet 180 and the balancing magnet 185 may be a unipolar magnetized magnet having one N pole and one S pole, this disclosure is not limited thereto. In another embodiment, each of the sensing magnet 180 and the balancing magnet 185 may be a bipolar magnetized magnet having two N poles and two S poles, or a quadrupole magnetized magnet.

[0148] The sensing magnet 180 can move along the optical axis together with the coil holder 110, and the first position sensor 170 can detect the strength or force of the magnetic field of the sensing magnet 180 moving along the optical axis, and can output an output signal corresponding to the detection result.

[0149] For example, the strength or force of the magnetic field detected by the first position sensor 170 can change depending on the displacement of the coil holder 110 in the optical axis direction. Therefore, the first position sensor 170 can output an output signal proportional to the strength of the detected magnetic field, and the output signal from the first position sensor 170 can be used to detect the displacement of the coil holder 110 in the optical axis direction.

[0150] The housing 140 houses the coil holder 110 and supports the magnet 130, the first position sensor 170, and the circuit board 190.

[0151] Reference Figure 4 , Figure 6 and Figure 7 The housing 140 can be constructed as a hollow cylinder. For example, the housing 140 can have polygonal (e.g., rectangular or octagonal) or circular holes, and the opening in the housing 140 can be a through hole formed through the housing 140 along the optical axis.

[0152] The housing 140 may include a side portion and a corner, the side portion corresponding to or facing the side plate 302 of the cover member 300, and the corner corresponding to or facing the corner of the cover member 300.

[0153] To prevent direct collision with the inner surface of the upper plate 301 of the cover member 300, the housing 140 may include a stop 145 disposed on its upper portion, upper surface or upper end.

[0154] To prevent the lower surface of housing 140 from colliding with the circuit board 800 of image sensor 350, housing 140 may also include a stop protruding from its lower surface. Here, the stop 145 may alternatively be referred to as a "boss" or "protrusion".

[0155] Reference Figure 4 The housing 140 may have a mounting recess (or seating recess) 14a configured to receive the circuit board 190 therein. The mounting recess 14a may have a shape corresponding to the shape of the circuit board 190.

[0156] Reference Figure 6 The housing 140 may have an opening 141 through which terminals B1 to B6 of the terminal members 95 of the circuit board 190 are exposed. The opening 141 may be formed in a side portion of the housing 140.

[0157] The upper portion, upper end, or upper surface of the housing 140 may be provided with at least one first connector, which will be connected to the first outer frame 152 of the upper elastic member 150.

[0158] The lower portion, lower end, or lower surface of the housing 140 may be provided with a second connector that connects and secures to the second outer frame 162 of the lower elastic member 160. For example, each of the first and second connectors of the housing 140 may have the shape of a protrusion, a groove, or a flat surface.

[0159] Magnet 130 may be disposed at housing 140. For example, magnet 130 may be disposed at a side portion of housing 140. Magnet 130 may be an AF operating magnet for AF operation.

[0160] For example, although magnet 130 may include a first magnet 130-1 and a second magnet 130-2 disposed on two side portions positioned opposite each other, this disclosure is not limited thereto. In another embodiment, magnet 130 may be disposed at a corner of housing 140.

[0161] Magnet 130 may include two or more magnets.

[0162] At the initial position of the AF operation unit, the first magnet 130 can be positioned in the housing to partially overlap with the first coil 120 in a direction parallel to a line perpendicular to and extending through the optical axis OA.

[0163] Although each of the first magnet 130-1 and the second magnet 130-2 may be a unipolar magnetized magnet, this disclosure is not limited thereto. In another embodiment, each of the first magnet 130-1 and the second magnet 130-2 may be a bipolar magnetized magnet having two N poles and two S poles, or a quadrupole magnetized magnet.

[0164] The circuit board 190 may be disposed at the housing 140, and the first position sensor 170 may be disposed at or mounted to the circuit board 190. For example, the circuit board 190 may be disposed in a mounting recess 14a in the housing 140, and the terminals of the circuit board 140 may be exposed to the outside of the housing 140 through an opening 141 in the housing 140.

[0165] The circuit board 190 may include a terminal component (or terminal unit) 95, the terminal component 95 including a plurality of terminals B1 to B6, the plurality of terminals B1 to B6 being electrically connected to an external terminal or external device, and the plurality of terminals B1 to B6 being electrically connected to a first position sensor 170.

[0166] The first position sensor 170 can be disposed on a first surface of the circuit board 190, and a plurality of terminals B1 to B6 can be disposed on a second surface of the circuit board 190. Here, the second surface of the circuit board 190 can be the surface opposite to the first surface of the circuit board 190. For example, the first surface of the circuit board 190 can be the surface of the circuit board 190 facing the coil holder 110 or the sensing magnet 180.

[0167] For example, circuit board 190 can be implemented as a printed circuit board or a flexible printed circuit board (FPCB).

[0168] The circuit board 190 may include a circuit pattern or wiring (not shown) for electrically connecting the first terminal B1 to the sixth terminal B6 to the first position sensor 170.

[0169] The first position sensor 170 can detect the magnetic field or the intensity of the magnetic field of the sensing magnet 180 mounted on the coil frame 110 during the movement of the coil frame 110, and can output an output signal corresponding to the detection result.

[0170] The first position sensor 170 may be implemented as a single Hall sensor. The first position sensor 170 may include two input terminals and two output terminals, with a drive signal or power supplied to the two input terminals and the sensed voltage (or output voltage) output through the two output terminals.

[0171] For example, the drive signal can be supplied to the first position sensor 170 through the first terminal B1 and the second terminal B2 of the circuit board 190, and the output of the first position sensor 170 can be output to the outside through the third terminal B3 and the fourth terminal B4.

[0172] The fifth terminal B5 and the sixth terminal B6 of the circuit board 190 can be electrically connected to at least one of the upper elastic member 150 and the lower elastic member 160 in order to supply a drive signal to the first coil 120.

[0173] For example, the fifth terminal B5 and the sixth terminal B6 of the circuit board 190 can be electrically connected to the first elastic member 150-1 and the second elastic member 150-2 of the upper elastic member 150 so as to supply a drive signal to the first coil 120 through the first elastic member 150-1 and the second elastic member 150-2.

[0174] In another embodiment, the first position sensor 170 may be implemented as a driver IC including a Hall sensor. For example, the first position sensor 170 may include a Hall sensor and a driver. Here, the first position sensor 170 may include: first to fourth terminals, by means of which data is transmitted to and received from the outside via data communication using a protocol such as I2C communication; and fifth and sixth terminals, by means of which drive signals are directly supplied to the first coil 120. The first to fourth terminals of the first position sensor 170 may be electrically connected to the first to fourth terminals B1 to B4 of the circuit board 190.

[0175] The fifth and sixth terminals of the first position sensor 170 can be electrically connected to the first coil 120 via at least one of the upper elastic member 150 and the lower elastic member 160 to supply a drive signal to the first coil 120. For example, the fifth and sixth terminals of the first position sensor 170 can be electrically connected to the first elastic member 150-1 and the second elastic member 150-2 to supply a drive signal to the first coil 120. The capacitor 195 can be disposed on or mounted on the first surface of the circuit board 190.

[0176] The capacitor 195 may be configured to have a chip shape. Here, the chip may include a first terminal corresponding to one end of the capacitor 195 and a second terminal corresponding to the other end of the capacitor 195. The capacitor 195 may alternatively be referred to as a "capacitive element" or a "condenser".

[0177] Capacitor 195 can be electrically connected in parallel with the first terminal B1 and the second terminal B2 of circuit board 190, supplying power (or drive signal) to position sensor 170 from the outside through the first terminal B1 and the second terminal B2. Alternatively, capacitor 195 can be electrically connected in parallel with the terminal of the first position sensor 170, which is electrically connected to the first terminal B1 and the second terminal B2 of circuit board 190.

[0178] Since capacitor 195 is electrically connected in parallel with the first terminal B1 and the second terminal B2 of circuit board 190, capacitor 195 can be used as a smoothing circuit to eliminate the ripple components included in the power signals GND and VDD supplied from the outside to the first position sensor 170, and thus can supply a stable and consistent power signal to the first position sensor 170.

[0179] The upper elastic member 150 can be connected to the upper part, upper end or upper surface of the coil frame 110 and the upper part, upper end or upper surface of the housing 140, and the lower elastic member 160 can be connected to the lower part, lower end or lower surface of the coil frame 110 or the upper part, upper end and upper surface of the housing 140.

[0180] The upper elastic member 150 and the lower elastic member 160 can elastically support the coil frame 110 relative to the housing 140.

[0181] For example, the upper elastic member 150 may include a first elastic member 150-1 and a second elastic member 150-2. Although the lower elastic member 160 is... Figure 4 The implementation may be a single unit or a single structure, but this disclosure is not limited thereto.

[0182] In another embodiment, at least one of the upper and lower elastic members may include a plurality of elastic elements or springs, which are electrically isolated or spaced apart from each other.

[0183] The upper elastic member 150 may further include: a first inner frame 151, which is connected or fixed to the upper portion, upper surface or upper end of the coil frame 110; a first outer frame 152, which is connected or fixed to the upper portion, upper surface or upper end of the housing 140; and a first frame connector 153, which connects the first inner frame 151 to the first outer frame 152.

[0184] The lower elastic member 160 may include: a second inner frame 161, which is connected or fixed to the lower portion, lower surface or lower end of the coil frame 110; a second outer frame 162, which is connected or fixed to the lower portion, lower surface or lower end of the housing 140; and a second frame connector 163, which connects the second inner frame 161 to the second outer frame 162.

[0185] Each of the first frame connector 153 and the second frame connector 163 may be bent or flexed (or may be shaped into a curve) at least once in order to define a predetermined pattern.

[0186] Each of the upper elastic member 150 and the lower elastic member 160 may be made of a conductive material.

[0187] Reference Figure 4 and Figure 5The circuit board 190 may include two pads 5a and 5b. For example, although the first pad 5a may be disposed on the second surface of the circuit board 190 and the second pad 5b may be disposed on the first surface of the circuit board 190, this disclosure is not limited thereto. In another embodiment, both the first pad and the second pad may be formed on only one of the first surface and the second surface of the circuit board 190.

[0188] The first pad 5a and the second pad 5b can be electrically connected to the fifth terminal B5 and the sixth terminal B6 of the circuit board 190. For example, the first pad 5a can be connected to the first elastic member 150-1, and the second pad 5b can be connected to the second elastic member 150-2.

[0189] For example, the first outer frame of the first elastic member 150-1 may include a first connector 4a configured to connect to a first pad 5a, and the first outer frame of the second elastic member 150-2 may include a second connector 4b configured to connect to a second pad 5b.

[0190] For example, one end of the first coil 120 may be connected to the first elastic member 150-1, and the other end of the first coil 120 may be connected to the second elastic member 150-2.

[0191] In another embodiment, the upper elastic member 150 may be coupled to the first pad 5a of the circuit board 190 for conductive connection, and the lower elastic member 160 may be coupled to the second pad 5b of the circuit board 190 for conductive connection. In another embodiment, the lower elastic member 160 may include two lower elastic members, and each of the two lower elastic members may be coupled or conductively connected to a corresponding one of the first pad 5a and the second pad 5b of the circuit board 190. The first coil 120 may be conductively connected to the two lower elastic members.

[0192] Figure 8 This is a plan view of the image sensor unit 350. Figure 9 This is an exploded stereo view of the image sensor unit 350. Figure 10 yes Figure 9 A perspective view of the second circuit board 800 and housing 450 shown. Figure 11 yes Figure 9 The figure shows a perspective view of the second circuit board 800, housing 450, and magnet 23. Figure 12a It is an exploded perspective view of the retainer 270, the second coil 230, the first circuit board 250, the second position sensor 240, the image sensor 810, the support member 220, and the connecting elastic member 280. Figure 12b yes Figure 12aThe figure shows a perspective view of the holder 270, the second coil 230, the first circuit board 250, the second position sensor 240, the filter holder 600, and the filter 610. Figure 13a yes Figure 12a The bottom perspective view of the retainer 270 shown. Figure 13b This is a bottom view of the retainer 270 and the first circuit board 250. Figure 14 This is an exploded perspective view of the retainer 270, image sensor 810, first circuit board 250, support member 220 and connecting elastic member 280. Figure 15 This is a bottom view of the retainer 270, the first circuit board 250, and the connecting elastic member 280. Figure 16 This is a bottom view of the retainer 270, the first circuit board 250, the connecting elastic member 280, and the insulating member 285. Figure 17 This is a partial enlarged view of the connecting elastic member 280. Figure 18 It is a perspective view of a connecting spring 281 and a support member 220. Figure 19a yes Figure 1 The image shows a cross-sectional view of the camera module taken along line AB. Figure 19b yes Figure 1 The cross-sectional view of the camera module 10 shown is taken along line CD. Figure 20 yes Figure 1 The cross-sectional view of the camera module 10 shown is taken along line IJ. Figure 21 yes Figure 8 The image sensor unit 350 shown is a cross-sectional view taken along line EF.

[0193] Reference Figures 8 to 21 The image sensor unit 350 may include a fixed part and a movable part. The fixed part includes a magnet 23, and the movable part includes a first circuit board 250 spaced apart from the fixed part, a second position sensor 240 disposed on the first circuit board 250, a second coil 230 disposed facing the magnet 23, and a spacer disposed between the first circuit board 250 and the second coil 230.

[0194] The spacer may be, for example, a retainer 270. The retainer 270 may also be used interchangeably with the spacer. The spacer may include one or more holes 41A to 41C.

[0195] At least a portion of the second position sensor 240 may be disposed in holes 41A to 41C in the spacer and may overlap with the magnet 23 in the optical axis direction.

[0196] The holes 41A to 41C in the spacer may overlap with at least a portion of the second coil 230 in the optical axis direction.

[0197] The second position sensor 240 may not overlap with the second coil 230 in the optical axis direction.

[0198] The second coil 230 may have a hole 11A formed in its center, and each of the holes 41A to 41C in the spacer may overlap with the hole 11A in the second coil 230 in the optical axis direction.

[0199] The second position sensor 240 can overlap with each of the holes 11A in the second coil 230 and holes 41A to 41C in the spacer in the optical axis direction.

[0200] A space may be defined between the magnet 130 and the second position sensor 240. For example, at least a portion of the second coil 230 and / or at least a portion of the spacer may not be placed in or may be placed in the space between the magnet 130 and the second position sensor 240.

[0201] The image sensor unit 250 may include resilient support members 220 and 280, which are coupled to both the fixed portion and the movable portion. The resilient support members 220 and 280 can flexibly support the movable portion relative to the fixed portion. The resilient support members 220 and 280 may alternatively be referred to as "support members" or "resilient members".

[0202] The fixing portion may include a second circuit board 800 spaced apart from the first circuit board 250, and the elastic support members 220 and 280 may electrically connect the first circuit board 800 to the second circuit board 800.

[0203] The second coil 230 can be connected to the spacer and can be electrically connected to the first circuit board 250.

[0204] A camera module according to an embodiment of the present invention may include a lens module (or lens) 400, an image sensor 810 disposed at a position corresponding to the lens, a drive unit configured to move the image sensor 810, a first circuit board 250 spaced apart from the lens, a second position sensor 240 disposed on the first circuit board 250, and a spacer disposed on the first circuit board 250. For example, the drive unit may include a magnet 23 and a second coil 230 disposed facing the magnet 23, and the spacer may be disposed between the first circuit board 250 and the second coil 230 to space the second coil 230 apart from the second position sensor 240. The image sensor 810 may be moved in a direction perpendicular to the optical axis.

[0205] Alternatively, the image sensor unit according to an embodiment of the present invention may include a fixed portion having a magnet 23, a movable portion having a first circuit board 250 spaced apart from the fixed portion, a retainer 270 disposed on the first circuit board 230, a second coil 230 disposed on the retainer 270 to face the magnet 23, a second position sensor 240 disposed on the first circuit board 250 to face the magnet 23, and elastic support members 220 and 280 connected to both the fixed portion and the movable portion.

[0206] The movable part can move in a direction perpendicular to the optical axis through the interaction between the magnet 23 and the second coil 230, and the second coil 240 can be in a direction perpendicular to the optical axis without overlapping with the second position sensor 240.

[0207] The elastic support members 220 and 280 can be connected to the second circuit board 800 at one end and to the first circuit board 250 at the other end. In other words, the elastic support members 220 and 280 can connect the first circuit board 800 to the second circuit board 800.

[0208] The second coil 230 may have a hole 11A formed in its center, and the second position sensor 240 may be disposed below the hole 11A in the second coil 230 so as to overlap with the hole 11A in the optical axis direction.

[0209] The retainer 270 may have a through-hole corresponding to the second position sensor 240, and the second position sensor 240 may be disposed in the through-hole in the retainer 270. For example, the second position sensor 240 may overlap with the retainer 270 in a direction perpendicular to the optical axis.

[0210] The four corners of the first circuit board 260 may be provided with protrusions 52A to 52D protruding from the side surface of the first circuit board, and the lower surface of the retainer 270 may be formed therein with a seating groove 53A to 53D, and the protrusions 52A to 52D of the first circuit board 250 are disposed in the seating groove 53A to 53D.

[0211] The second coil 230 may include a first coil unit 230-1 to a fourth coil unit 230-4 disposed at a first corner to a fourth corner of the retainer 270, and the magnet 23 may include a first magnet 23A corresponding to the first coil unit 230-1, a second magnet 23B corresponding to the second coil unit 230-2, a third magnet 23C corresponding to the third coil unit 230-3, and a fourth magnet 23D corresponding to the fourth coil unit 230-4.

[0212] The second position sensor 240 may include a first sensor 240a disposed below the first coil unit 230-1, a second sensor 240b disposed below the second coil unit 230-2, and a third sensor 240c disposed below the third coil unit 230-3.

[0213] For example, each of the first coil unit 230-1 to the fourth coil unit 230-4 can be activated independently. In other words, the first coil unit 230-1 to the fourth coil unit 230-4 can be activated by their respective drive signals.

[0214] In another embodiment, the first coil unit 230-1 to the third coil unit 230-3 can be activated independently, and the fourth coil unit 230-4 can be activated together with one of the first coil unit 230-1 to the third coil unit 230-3. For example, the first coil unit 230-1 to the third coil unit 230-3 can be activated by different drive signals, and the fourth coil unit 230-4 can be activated together with one of the first coil unit 230-1 to the third coil unit 230-3 by the same drive signal.

[0215] For example, the image sensor unit 350 may include a second circuit board 800, a magnet 23, a holder 270, a first circuit board 250, a second coil 230, a second position sensor 240, and an image sensor 810. The image sensor unit 350 may also include a connecting elastic member 280 and a support member 220.

[0216] The image sensor unit 350 may also include a housing 450 configured to receive at least a portion of the second circuit board 800.

[0217] The second circuit board 800 can be used to supply signals from the outside to the image sensor unit 350 or to supply signals from the image sensor unit 320 to the outside.

[0218] The second circuit board 800 can be alternatively referred to as a fixed circuit board, auxiliary circuit board, fixed board, etc.

[0219] Reference Figure 9 and Figure 10 The second circuit board 800 may include: a first region 801 corresponding to the AF operation unit 100; a second region 802 where a connector 840 is disposed; and a third region 803 connecting the first region 801 to the second region 802. The connector 840 may be electrically connected to the second region 802 of the second circuit board 800 and may include a port configured to be electrically connected to an external device.

[0220] Although each of the first region 801 and the second region 802 of the second circuit board 800 may include a flexible substrate and a rigid substrate, and the third region 803 may include a flexible substrate, this disclosure is not limited thereto. In another embodiment, at least one of the first region 801 to the third region 803 of the second circuit board 800 may include at least one of a rigid substrate and a flexible substrate.

[0221] The first region 801 can be alternatively referred to as the first substrate, the second region 802 can be alternatively referred to as the second substrate, and the third region 803 can be alternatively referred to as the third substrate.

[0222] The second circuit board 800 may have holes 800A corresponding to the holes in the coil holder 110, the lens module 400, and / or the image sensor 810. For example, the holes 800A in the second circuit board 800 may be formed in the first region 801.

[0223] Reference Figure 10 , Figure 11 and Figure 19a At least a portion of the lens module 400 may extend through a hole 800A in the second circuit board 800 and may be positioned below the second surface 44B of the second circuit board 800.

[0224] The lens module 400 can be disposed on the first circuit board 250. For example, the lens module 400 can be positioned on the filter 610 disposed at the filter holder 600.

[0225] For example, the lower portion, lower end, or lower surface of the lens or lens barrel of the lens module 400 may extend through the hole 800A in the second circuit board 800 and may be positioned below the second surface 44B of the second circuit board 800.

[0226] For example, the lower portion, lower end, or lower surface of the lens or lens barrel of the lens module 400 may be positioned above the first surface 60A of the first circuit board 250.

[0227] Furthermore, the lower portion, lower end, or lower surface of the lens or lens barrel of the lens module 400 can be positioned above the hole 70 in the retainer 270.

[0228] Although the second circuit board 800 may be configured to have a polygonal shape (e.g., a quadrilateral, a rectangle, or a square) when viewed from above, this disclosure is not limited thereto. In another embodiment, the second circuit board 800 may be configured to have another shape, such as a circular shape. Furthermore, although the hole 800A in the second circuit board 800 may be configured to have a polygonal shape (e.g., a quadrilateral, a square, or a rectangle), this disclosure is not limited thereto. In another embodiment, the hole 800A may be configured to have another shape, such as a circular shape.

[0229] The second circuit board 800 may include at least one pad corresponding to the support member 220. For example, at least one pad of the second circuit board 800 may include a plurality of pads 800B. Here, pad 800B may alternatively be referred to as a “lead pattern”, “lead member” or “hole”.

[0230] The second circuit board 800 may have at least one hole corresponding to the support member 220, and the hole may be formed through the second circuit board 800. For example, the second circuit panel 800 may include a plurality of through holes corresponding to a plurality of support members.

[0231] For example, each of the multiple pads 800B may have a hole formed through the second circuit board 800 along the optical axis.

[0232] Each of the plurality of pads 800B may be formed as a hole surrounding the second circuit board 800, and may also include a lead pattern or a conductive layer.

[0233] The support member 220 can be soldered to the pad 800B while extending through a hole in the second circuit board 800, and can be electrically connected to the lead pattern disposed around the pad 800A.

[0234] For example, multiple pads 800B may be spaced apart from each other at a predetermined interval to surround the hole 800A in the second circuit board 800. For example, multiple pads 800B may be disposed between the hole 800A in the second circuit board 800 and the side of the second circuit board 800.

[0235] The second circuit board 800 may have at least one connection hole 800C configured to connect to a connection protrusion 45B of the housing 450. Although the connection hole 800C may be a through hole formed through the second circuit board 800, this disclosure is not limited thereto. In another embodiment, the connection hole 800C may be a recess.

[0236] For example, although the connection hole 800C may be implemented as a plurality of connection holes formed in the corners of the second circuit board 800, which are opposite each other in the diagonal direction, this disclosure is not limited thereto. The connection hole may be located near the side of the second circuit board 800 or between the side of the second circuit board 800 and the hole 800A.

[0237] The second circuit board 800 may include at least one terminal, for example, multiple terminals 7A to 7F.

[0238] Multiple terminals 7A to 7F may be formed on a first surface (e.g., upper surface) 44A of the second circuit board 800. For example, multiple terminals 7A to 7F may be disposed on a side of the second circuit board 800 adjacent to a corner of the second circuit board 800.

[0239] Each of the multiple terminals 7A to 7F can be electrically connected to a corresponding terminal B1 to B6 of the circuit board 190 via a conductive adhesive member or solder.

[0240] For example, the second circuit board 800 may include a terminal member 80A, with a plurality of terminals 7A to 7F formed at the terminal member 80A. Although the terminal member 80A protrudes from one side of the second circuit board 800 in a direction perpendicular to the optical axis, this disclosure is not limited thereto. In another embodiment, the terminal member 80A may not protrude from one side of the second circuit board 800.

[0241] The image sensor unit 350 may also include a housing 450, in which the second circuit board 800 is disposed, seated, or received.

[0242] The housing 450 can be attached to at least a portion of the second circuit board 800. The housing 450 can receive the magnet 23 therein and can alternatively be referred to as a "magnet holder".

[0243] For example, the second circuit board 800 may be disposed below the AF operation unit 100 and may be connected to the AF operation unit 100. For example, an adhesive member 310 may be disposed between the second circuit board 800 and the AF operation unit 100 to connect the second circuit board 800 and the AF operation unit 100 to each other.

[0244] For example, the adhesive member 310 may be disposed between the first surface 44A of the second circuit board 800 and the lower portion, lower surface or lower end of the housing 140 of the AF operation unit 100 in order to connect them to each other.

[0245] In another embodiment, the housing 140 of the AF operation unit 100 may also be connected to the housing 450 of the image sensor unit 350. For example, the upper portion, upper end, or upper surface of the image sensor unit 350 may also be connected to the lower portion, lower end, or lower surface of the housing 140 of the AF operation unit 100 via an adhesive member or a connecting structure.

[0246] The housing 450 may be disposed below the second circuit board 800. For example, the AF operation unit 100 may be disposed above the first circuit board 800, and the housing 450 may be disposed below the second circuit board 800.

[0247] The housing 450 may have a shape corresponding to or consistent with the first region 801 of the second circuit board 800. Although the housing 450 may be configured to have a polygonal shape (e.g., a quadrilateral shape, a square shape, or a rectangular shape) when viewed from above, this disclosure is not limited thereto. In another embodiment, the housing 450 may be configured to have a circular or elliptical shape.

[0248] The housing 450 may have a hole 450A formed therein. At least a portion of the hole 450A in the housing 450 may correspond to or overlap with a hole 800A in the second circuit board 800.

[0249] Although the hole 450A in the housing 450 may be configured to have a polygonal shape (e.g., a quadrilateral or octagonal shape), a circular shape, or a cross shape when viewed from above, this disclosure is not limited thereto. The hole 450A in the housing 450 may be a through hole formed through the housing 450 along the optical axis.

[0250] The housing 450 may include at least one connecting protrusion 45B projecting from the upper surface of its body 42. For example, the connecting protrusion 45B may project from the upper surface of the housing 450 in a direction from the upper surface of the housing 450 toward the second surface (e.g., the lower surface) 44B of the second circuit board 800.

[0251] The housing 450 may include clearance areas 45 corresponding to a plurality of pads 800B. The clearance areas 45 may be formed at positions corresponding to the support member 220 to avoid spatial interference between the housing 450 and the support member 220.

[0252] Reference Figures 1 to 10 The second circuit board 800 may include terminals 7A to 7F corresponding to terminals B1 to B6 of the circuit board 190 of the AF operation unit 100.

[0253] Each of terminals 7A to 7F of the second circuit board 800 can be electrically connected to a corresponding terminal among terminals B1 to B6 of the circuit board 190 of the AF operation unit 100. Drive signals or power can be supplied to the first position sensor 170 through the second circuit board 800, and the output of the first position sensor 170 can be output to the second circuit board 800. Furthermore, drive signals or power can be supplied to the first coil 120 through the second circuit board 800.

[0254] Reference Figure 11 The second circuit board 800 may include a connector 840 disposed in the second region 802. For example, the connector 840 may be disposed on a surface (e.g., the lower surface or the upper surface) of the second region 802 of the second circuit board 800.

[0255] The housing 450 may include a seating portion 8A in which the magnet 23 is received, disposed, or seated. The seating portion 8A may be formed in the lower surface of the housing 450.

[0256] For example, the seating portion 8A may be a recessed groove from the lower surface of the housing 450, and may have a shape corresponding to the shape of the magnet 23.

[0257] For example, although the seating portion 8A may be formed in a corner of the housing 450, this disclosure is not limited thereto. In another embodiment, the seating portion 8A may be formed in a side of the housing 450.

[0258] For example, although the housing 450 may include four seating portions 8A respectively formed at its four corners, this disclosure is not limited thereto. In another embodiment, the housing 450 may include a plurality of seating portions corresponding to the number of magnets 23.

[0259] The magnet 23 can be attached or joined to the seating portion 8A of the housing 450 via an adhesive member. Here, a guide groove 9A can be formed in the seating portion 8A of the housing 450 to guide the adhesive member. The guide groove 9A can be used to evenly distribute the adhesive member in the seating portion 8A.

[0260] The magnet 23 may be disposed at the housing 450. For example, although the magnet 23 may be disposed at a corner of the housing 140, this disclosure is not limited thereto. In another embodiment, the magnet 23 may be disposed at a side portion of the housing 450.

[0261] Magnet 23 can be used to provide a magnetic field that interacts with the second coil 230 to perform OIS (Optical Image Stabilization) for the purpose of hand shakiness correction.

[0262] For example, magnet 23 may include a plurality of magnets 23A to 23D. Each of magnets 23A to 23D may be located at a corresponding corner of the housing 450.

[0263] Although each of the magnets 23A to 23D can be a unipolar magnetized magnet with one N pole and one S pole, this disclosure is not limited thereto. In another embodiment, each of the magnets 23A to 23D can be a bipolar magnetized magnet with two N poles and two S poles, or a quadrupole magnetized magnet.

[0264] When each of the magnets 23A to 23D is a bipolar magnet, each of the magnets 23A to 23D may include a first magnet portion, a second magnet portion, and a partition wall disposed between the first magnet portion and the second magnet portion. Here, the partition wall may also be alternatively referred to as a "non-magnetic partition wall".

[0265] For example, each of the first and second magnet portions may include an N pole, a S pole, and a junction portion located between the N pole and the S pole. The junction portion may be a portion that is substantially non-magnetic and has a region with almost no polarity, and may be a portion that is naturally formed to form a magnet comprising an N pole and an S pole.

[0266] A separator can separate or isolate the first magnetic portion from the second magnetic portion, and can be a portion that is essentially non-magnetic or non-polar. For example, the separator can be a non-magnetic material, air, etc. A non-magnetic separator can be considered a "neutral region" or "neutral portion".

[0267] The partition wall can be an artificially formed portion when the first magnet portion and the second magnet portion are magnetized, and the width of the partition wall can be greater than the width of the joint portion.

[0268] For example, although the partition walls of each of the magnets 23A to 23D may be oriented in a direction parallel to the second circuit board 800 or the first circuit board 250, this disclosure is not limited thereto. In another embodiment, the partition walls may be oriented in a direction perpendicular to the second circuit board 800 or the first circuit board 250.

[0269] For example, each of the four magnets 23A to 23D can be positioned at a corresponding corner of the four corners of the housing 450. For example, although two magnets (e.g., 23A and 23B) positioned at two adjacent corners of the housing 450 can be oriented perpendicular to each other, and two magnets (e.g., 23A and 23C; 23B and 23D) positioned at two corners of the housing 450 facing each other diagonally can be oriented parallel to each other, this disclosure is not limited thereto.

[0270] For example, the interiors of magnets 23A to 23D can have the same polarity. Furthermore, the exteriors of magnets 23A to 23D can have the same polarity.

[0271] For example, the interior of each of magnets 23A to 23D can be magnetized as the N pole, and the exterior of each of magnets 23A to 23D can be magnetized as the S pole. In a variant, the interior of each of magnets 23A to 23D can be magnetized as the S pole, and the exterior of each of magnets 22A to 22D can be magnetized as the N pole.

[0272] The retainer 270 may be disposed below the second circuit board 800. The retainer 270 may be spaced apart from the second circuit board 800 and may be connected to the first circuit board 250.

[0273] The retainer 270 can receive or support the second coil 230. The retainer 270 can be used to support the second coil 230 such that the second coil 230 is spaced apart from the circuit board 250.

[0274] For example, the lower portion, lower surface, or lower end of the retainer 270 may be connected to the upper portion, upper surface, or upper end of the first circuit board 250.

[0275] Reference Figure 13a and Figure 13b The lower surface 42B of the retainer 270 may include a first surface 36A and a second surface 36B. The second surface 36B may have a height difference relative to the first surface 36A in the optical axis direction. For example, the second surface 36B may be positioned above the first surface 36A. For example, the second surface 36B may be positioned closer to the upper surface 42A of the retainer 270 than the first surface 36A. For example, the distance between the upper surface 42A and the second surface 36B of the retainer 270 may be smaller than the distance between the upper surface 42A and the first surface 36A of the retainer 270.

[0276] The retainer 270 may include a third surface 36C connecting the first surface 36A to the second surface 36B. For example, although the first surface 36A and the second surface 36B may be parallel to each other, and the third surface 36C may be perpendicular to the first surface 36A and / or the second surface 36B, this disclosure is not limited thereto. In another embodiment, the included angle defined between the third surface 36C and the first surface 36A (or the second surface 36B) may be an acute angle or an obtuse angle.

[0277] The first surface 36A can be located at the periphery of the lower surface 42B of the retainer 270, and the second surface 36B can be located in the central region of the retainer 270.

[0278] The retainer 270 may have a hole 70 therein corresponding to a region on the upper surface of the circuit board 250.

[0279] Although the hole 70 in the retainer 270 may have a polygonal shape when viewed from above, such as a quadrilateral, circular, or elliptical shape, this disclosure is not limited thereto. The hole 70 may have any shape of various shapes.

[0280] For example, the hole 70 in the retainer 270 may be configured to have a shape or size that exposes the image sensor 810 and some components disposed on the first circuit board 250. For example, the surface area of ​​the hole 70 in the retainer 270 may be smaller than the surface area of ​​the first surface 60A of the first circuit board 250.

[0281] For example, the hole 70 can be formed through the second surface 36B of the lower surface 42B of the retainer 270.

[0282] The retainer 270 may have holes 41A, 41B, and 41C corresponding to the second position sensor 240. For example, the retainer 270 may have holes 41A, 41B, and 41C formed at positions corresponding to the first to third sensors 240a, 240b, and 240c, respectively.

[0283] For example, holes 41A, 41B, and 41C can be positioned adjacent to the corners of retainer 270. Retainer 270 may also have a dummy hole 41D formed adjacent to a corner of retainer 270, which does not correspond to any of the second position sensors in the second position sensor 240. The dummy hole 41D can be used to achieve weight balancing of the OIS movable unit during OIS operation. In another embodiment, dummy hole 41D may not be formed.

[0284] Holes 41A, 41B, and 41C may be formed through the retainer 270 along the optical axis. For example, although holes 41A, 41B, and 41C may be formed in the second surface 36B of the lower surface 42B of the retainer 270, this disclosure is not limited thereto. In another embodiment, holes 41A, 41B, and 41C in the retainer 270 may be omitted.

[0285] An injection hole 33A may be formed in the lower surface 42B of the retainer 270 to correspond to an injection hole in a mold configured to inject material for forming the retainer 270.

[0286] The first circuit board 250 may be disposed on the second surface 36B of the lower surface 42B of the retainer 270. The first circuit board 250 may alternatively be referred to as a "sensor board", "main board", "main circuit board", "sensor circuit board" or "removable circuit board".

[0287] In all embodiments, the first circuit board 250 may alternatively be referred to as the "second board" or "second circuit board", and the second circuit board 800 may alternatively be referred to as the "first board" or "first circuit board".

[0288] The first surface 60A of the first circuit board 250 can be connected or attached to the second surface 36B of the lower surface 42B of the retainer 270 via an adhesive member.

[0289] Here, the first surface 60A of the circuit board 250 may be the surface facing the second circuit board 800 or the AF operation unit 100 and on which the image sensor 810 is arranged. The second surface 60B of the circuit board 250 may be the surface opposite to the first surface 60A of the circuit board 250.

[0290] The lower surface 42B of the retainer 270 may have a seating groove 53A to 53D therein, and at least a portion of the circuit board 250 is fitted and disposed in the seating groove 53A to 53D.

[0291] The seating recesses 53A to 53D can be formed in the four corners of the lower surface 42B of the retainer 270, respectively, so as to correspond to the protrusions 52A to 52D of the first circuit board 250.

[0292] For example, the first surface 36A of the lower surface 42B of the retainer 270 may surround the protrusions 52A to 52D of the circuit board 250, and the lateral surfaces 52A to 52D of the first circuit board 250 may face the third surface 36C of the retainer 270. An adhesive member may be disposed between the protrusions 52A to 52D of the first circuit board 250 and the seating recesses 53A to 53D in the retainer 270 to attach the protrusions to the seating recesses.

[0293] The protrusions 52A to 52D of the first circuit board 250 can be used to increase the connection force between the retainer 2170 and the first circuit board 250 and to prevent the circuit board 250 from rotating and thus becoming misaligned.

[0294] The protrusions 52A to 52D of the first circuit board 250 can overlap with the mounting recesses 51A to 51D in the holder 270 in the optical axis direction. Furthermore, the holes 41A, 41B, and 41C can overlap with at least a portion of the mounting recesses 53A, 53B, and 53C in the holder 270 in the optical axis direction. Additionally, the holes 41A, 41B, and 41C can overlap with at least a portion of the protrusions 52A to 52C on the first circuit board 250.

[0295] At least one groove 272 may be formed in the first surface 36A of the lower surface 42B of the retainer 270 so as to be recessed from the first surface 36A. For example, the retainer 270 may have a plurality of grooves (e.g., four grooves) corresponding to a plurality of sides (e.g., four sides) of the lower surface 42B.

[0296] The groove 272 may include: a bottom 72A that is recessed from a first surface 36A of the lower surface 42B of the retainer 270 so as to have a height difference therebetween in the optical axis direction; and a lateral sidewall 72B that connects the bottom 72A to the first surface 36A.

[0297] For example, the bottom 72A of the groove 272 can be positioned closer to the upper surface 42A of the retainer 270 than the first surface 36A of the lower surface 42B of the retainer 270. Furthermore, the bottom 72A of the groove 272 can be positioned between the first surface 36A and the second surface 36B of the lower surface 42B of the retainer 270.

[0298] The retainer 270 may have at least one hole 270A through which the support member 220 extends. For example, the retainer 270 may have multiple holes 270A corresponding to multiple support members 220. The holes 270A can be used to avoid spatial interference with the support members. In another embodiment, the retainer 270 may have a relief groove or relief portion instead of a hole to avoid spatial interference with the support members.

[0299] For example, a plurality of holes 270A may be provided or arranged to surround the hole 70 in the retainer 270 and spaced apart from each other at regular intervals. For example, a plurality of holes 270A may be arranged in the region between the hole 70 in the retainer 270 and the side portion of the retainer 270.

[0300] For example, hole 270A may be a through hole formed through retainer 270. Multiple holes 270A in retainer 270 may overlap with grooves 272 in retainer 270 in the optical axis direction. For example, each of the multiple holes 270A may be open at the bottom 72A of groove 272. The ends of the multiple holes 270A open at the bottom 72A of groove 272 may be positioned to have a height difference relative to a first surface 36A of the lower surface 42B of retainer 270 in the optical axis direction.

[0301] For example, multiple holes 270A may be formed through the bottom 72A of the groove 272 in the retainer 270.

[0302] The groove 272 in the retainer 270 is used to prevent spatial interference with the retainer 270 when the connecting elastic member 280 elastically deforms during OIS operation, thereby allowing the connecting elastic member 280 to easily elastically deform.

[0303] The lower surface 42B of the retainer 270 may be provided with a protrusion 275. For example, the protrusion 275 may be formed on the first surface 36A of the lower surface 42B of the retainer 270.

[0304] The protrusion 275 of the retainer 270 can protrude from the first surface 36A of the lower surface 42B of the retainer 270 in the direction toward the bottom of the base 210.

[0305] The protrusion 275 of the retainer 270 may protrude further than the connecting elastic member 280 in the direction toward the bottom of the base 210. Alternatively, the protrusion 275 of the retainer 270 may protrude further than the solder 902 that connects the connecting elastic member 280 to the support member 220 in the direction toward the bottom of the base 210.

[0306] For example, the first distance in the optical axis direction between the protrusion 275 of the retainer 270 and the bottom of the base 210 can be smaller than the second distance between the connecting elastic member 280 and the bottom of the base 210. For example, the first distance can be smaller than the third distance between the solder 902 and the bottom of the base 210.

[0307] The protrusion 275 can be used as a stop, which is configured to prevent the first surface 36A of the lower surface 42B of the retainer 270, the connecting elastic member 280 and / or the solder 902 from colliding with the bottom of the base 210 in the event of an external impact.

[0308] For example, although the protrusion 275 may be located at the corner of the lower surface 42B of the retainer 270, this disclosure is not limited thereto. In another embodiment, the protrusion 275 may be located on the side of the lower surface 42B of the retainer 270, or between the side of the lower surface 42B of the retainer 270 and the hole 70.

[0309] The first circuit board 250 can be located below the second circuit board 800.

[0310] For example, the first circuit board 250 may be positioned below the retainer 270.

[0311] Despite Figure 12a In this embodiment, the first circuit board 250, where the image sensor 810 is disposed, comprises a single circuit board, but the present disclosure is not limited thereto. In another embodiment, the first circuit board 250 may include: a third board on which the image sensor 810 is disposed; and a fourth board electrically connected to the third board. The fourth board may be electrically connected to the second circuit board 800 via a support member 220 and a connecting elastic member 280.

[0312] Although the periphery of the first circuit board 250, for example, may have a shape that matches or corresponds to the lower surface 42B of the retainer 270 when viewed from above, this disclosure is not limited thereto.

[0313] The first circuit board 250 may include one or more protrusions 52A to 52D projecting from its lateral side surface 21A.

[0314] For example, protrusions 52A to 52D can be formed at the four corners of the first circuit board 250, respectively.

[0315] Reference Figure 13b The first circuit board 250 may include a first protrusion 52A to a fourth protrusion 52D, which are respectively formed at the four corners of the first circuit board 250.

[0316] Each of the first protrusion 52A to the fourth protrusion 52D can protrude from the lateral side surface 21A of the first circuit board 250 in at least one of the +x-axis direction, the -x-axis direction, the +y-axis direction, and the -y-axis direction.

[0317] For example, each of the first protrusion 52A and the third protrusion 52C may protrude from the lateral side surface 21A of the first circuit board 250 in both the x-axis and y-axis directions. Each of the second protrusion 52B and the fourth protrusion 52D may each protrude in the y-axis direction and may protrude in opposite directions relative to each other.

[0318] The first circuit board 250 may include at least one terminal 262 corresponding to a connecting spring 281 of the support member 220 or the connecting elastic member 280.

[0319] For example, the first circuit board 250 may include a plurality of terminals 262 disposed or arranged on the second surface 60B of the first circuit board 250 and spaced apart from each other. For example, the terminals 262 may be disposed adjacent to the lateral side surface 21A of the first circuit board 250. The number of terminals 262 is not limited to this. Figure 14 The number shown, and may be more or less than Figure 14 The number of terminals 262 shown.

[0320] For example, terminal 262 of the first circuit board 250 may be electrically connected to the support member 220. For example, terminal 262 of the first circuit board 250 may be electrically connected to the connecting spring 281.

[0321] The first circuit board 250 may include terminals E1 to E8 configured to be electrically connected to the second coil 230. Here, terminals E1 to E8 may alternatively be referred to as “pads” or “bonding portions.” Terminals E1 to E8 of the first circuit board 250 may be disposed or arranged on a first surface 60A of the first circuit board 250.

[0322] The first circuit board 250 can be a printed circuit board (PCB) or a flexible printed circuit board (FPCB).

[0323] The first circuit board 250 may have a mounting region 260A in which the image sensor 810 is disposed. For example, the mounting region 260A may be disposed on a first surface (e.g., the upper surface) 60A of the first circuit board 250. For example, a hole 70 in the holder 270 may allow the image sensor 810 disposed in the mounting region 260A through the hole 70 to be open or exposed.

[0324] The second coil 230 can be located at the retainer 270.

[0325] For example, the second coil 230 can be disposed on the upper surface 42A of the retainer 270.

[0326] The second coil 230 can be positioned below the housing 450. The second coil 230 can be positioned below the magnet 23.

[0327] For example, the second coil 230 can be configured on the upper surface 42A of the holder 270 to correspond to, face, or overlap with the magnet 23 disposed at the housing 450 in the direction of the optical axis OA.

[0328] The second coil 230 can be connected to the retainer 270. For example, the second coil 230 can be connected to the upper surface 42A of the retainer 270. The upper surface 42A of the retainer 270 can be provided with at least one connecting protrusion configured to connect to the second coil 230.

[0329] The connecting protrusion 51 can protrude from the upper surface 42A of the retainer 270 in a direction toward the second circuit board 800. For example, the connecting protrusion 51 can be formed adjacent to each of the holes 41A to 41D in the retainer 270.

[0330] For example, two connecting protrusions 51A and 51B may be provided or arranged at the retainer 270 to correspond to each of the holes 41A to 41D, and a hole (e.g., 41A) may be formed between the two connecting protrusions 51A and 51B.

[0331] For example, the second coil 230 may include multiple coil units 230-1 to 230-4. For example, although the second coil 230 may include four coil units, this disclosure is not limited thereto.

[0332] Each of the multiple coil units 230-1 to 230-4 can face or overlap with a corresponding magnet among the magnets 23A to 23D disposed at housing 450 in the optical axis (OA) direction.

[0333] Although each of the coil units 230-1 to 230-4 can be configured as a coil block having a closed curve shape or a ring shape, this disclosure is not limited thereto. For example, each of the coil units 230-1 to 230-4 may include an FP (fine patterned) coil. In another embodiment, the coil units 230-1 to 230-4 may be formed on a separate circuit component other than the first circuit board 250.

[0334] For example, each of the four coil units 230-1 to 230-4 can be located at a corresponding corner of the four corners of the retainer 270.

[0335] Each of the coil units 230-1 to 230-4 can be connected to the two connecting protrusions 51A and 51B of its corresponding retainer 270. For example, each of the coil units 230-1 to 230-4 can be directly wound around the two corresponding connecting protrusions 51A and 51B of the retainer 270.

[0336] Coil units 230-1 to 230-4 may correspond to or face the corresponding protrusions 52A to 52D of circuit board 250 in the optical axis direction. For example, at least a portion of each of coil units 230-1 to 230-4 may overlap with a corresponding one of the protrusions 52A to 42D of circuit board 250 in the optical axis direction.

[0337] The second coil 230 can be electrically connected to the first circuit board 250, so that power or drive signals are supplied to the second coil 230 through the first circuit board 250.

[0338] The power or drive signal supplied to the second coil 230 can be a DC signal, an AC signal, or a signal containing both DC and AC components, and can be voltage-type or current-type.

[0339] Here, current can be applied independently to at least three of the four coil units.

[0340] In the first embodiment, the second coil 230 can be controlled through three channels.

[0341] For example, among the first to fourth coil units, only the first to third coil units can be electrically isolated from each other, and the fourth coil unit can be electrically connected in series to one of the first to third coil units. Here, three pairs of leads can be drawn from the second coil 230, that is, a total of six leads.

[0342] In the second embodiment, the second coil 230 can be controlled via four separate channels. Here, the four coil units can be electrically isolated from each other. A forward current and a reverse current can be selectively applied to each coil unit. Here, four pairs of leads, i.e., a total of eight leads, can be drawn from the second coil 230.

[0343] For example, two coil units 230-1 and 230-3 facing each other diagonally may extend or be oriented along a first axial direction (e.g., along the y-axis), and two other coil units 230-2 and 230-4 facing each other diagonally may extend or be oriented along a second axial direction (e.g., along the x-axis). Here, the first axial direction may be perpendicular to the second axial direction.

[0344] The long sides of the first coil unit 230-1 and the third coil unit 230-3 can be set to be parallel to each other. The long sides of the second coil unit 230-2 and the fourth coil unit 230-4 can be set to be parallel to each other. The long sides of the first coil unit 230-1 and the second coil unit 230-2 may not be set to be parallel to each other. Here, the long sides of the first coil unit 230-1 and the second coil unit 230-2 can be set such that imaginary lines extending from them intersect each other. For example, the direction along which the first coil unit 230-1 is oriented and the direction along which the second coil unit 230-2 is oriented can be perpendicular to each other.

[0345] In another embodiment, at least one of the four coil units can be driven separately from the remaining coil units. In another embodiment, the four coil units can be driven individually.

[0346] For example, one end of the first coil unit 230-1 may be connected to a first terminal E1, and the other end of the first coil unit 230-1 may be connected to a second terminal E2. A first drive signal may be provided to the first terminal E1 and the second terminal E2 to activate the first coil unit 230-1. The first terminal E1 and the second terminal E2 may be arranged to be spaced apart from each other in a direction parallel to the long side of the first coil unit 230-1 (e.g., along the y-axis).

[0347] One end of the second coil unit 230-2 can be connected to the third terminal E3, and the other end of the second coil unit 230-2 can be connected to the fourth terminal E4. A second drive signal can be provided to the third terminal E3 and the fourth terminal E4 to activate the second coil unit 230-2. The third terminal E3 and the fourth terminal E4 can be arranged to be spaced apart from each other in a direction parallel to the long side of the second coil unit 230-2 (e.g., along the x-axis).

[0348] One end of the third coil unit 230-3 can be connected to the fifth terminal E5, and the other end of the third coil unit 230-3 can be connected to the sixth terminal E6. A third drive signal can be provided to the fifth terminal E5 and the sixth terminal E6 to activate the third coil unit 230-3. The fifth terminal E5 and the sixth terminal E6 can be arranged to be spaced apart from each other in a direction parallel to the long side of the third coil unit 230-3 (e.g., along the y-axis).

[0349] One end of the fourth coil unit 230-4 can be connected to the seventh terminal E7, and the other end of the fourth coil unit 230-4 can be connected to the eighth terminal E8. The seventh terminal E7 and the eighth terminal E8 can be provided with a fourth drive signal to activate the fourth coil unit 230-4. The seventh terminal E7 and the eighth terminal E8 can be arranged to be spaced apart from each other in a direction parallel to the long side of the fourth coil unit 230-4 (e.g., along the x-axis).

[0350] The first terminal E1 to the eighth terminal E8 can be located in an area on the upper surface 60A of the first circuit board 250 between the coil units 230-1 to 230-4 and the image sensor 810.

[0351] The hole 70 in the retainer 270 can expose terminals E1 to E8 of the first circuit board 250. The lower surfaces of the coil units 230-1 to 230-4 can be positioned above terminals E1 to E8 of the first circuit board 250.

[0352] For example, terminals E1 to E8 of the first circuit board 250 can be positioned below the upper surface 60A of the retainer 270.

[0353] In one implementation, two coil units facing each other diagonally (e.g., 230-1 and 230-3) can be directly connected in series and can be activated by a signal drive signal. Meanwhile, two coil units facing each other diagonally (e.g., 230-2 and 230-4) can be electrically isolated from each other and can be activated individually by different drive signals.

[0354] In another embodiment, the four coil units 230-1 to 230-4 can be isolated from each other in terms of conductivity and can be activated individually by different individual drive signals.

[0355] Each coil unit in coil units 230-1 to 230-4 may have an opening or hole formed in its center, and two connecting protrusions 51A and 51B may be fitted into the opening 11A in each coil unit in coil units 230-1 to 230-4 (see...). Figure 12a Connect it to opening 11A.

[0356] For example, at least a portion of each of the coil units 230-1 to 230-4 may overlap with a corresponding one of the magnets 23A to 23D disposed at the housing 450.

[0357] The OIS movable unit, including the image sensor 810, can perform hand shake correction by moving along a second and / or a third direction, such as along the x-axis and / or along the y-axis, through the interaction between magnets 23A to 23D and coil units 230-1 to 230-4 to which a drive signal is applied. A description of the OIS movable unit will be given later.

[0358] The second position sensor 240 can be disposed, coupled, or mounted to a first surface (e.g., the upper surface) 60A of the first circuit board 250. The second position sensor 240 can detect the displacement of the OIS movable unit in a direction perpendicular to the optical axis OA, such as the displacement or tilt of the OIS movable unit in a direction perpendicular to the optical axis, or the rotation of the OIS movable unit about the optical axis.

[0359] Here, the first position sensor 170 may be alternatively referred to as the "AF position sensor", and the second position sensor 240 may be alternatively referred to as the "OIS position sensor".

[0360] For example, a second position sensor 240 can be provided at each of the protrusions 52A to 52C of the first circuit board 250.

[0361] The second position sensor 240 can be located below the second coil 230.

[0362] The second position sensor 240 may not overlap with the second coil 230 in a direction perpendicular to the optical axis. For example, the sensing element of the second position sensor 240 may not overlap with the second coil 230 in a direction perpendicular to the optical axis. This sensing element may be an element configured to detect a magnetic field.

[0363] For example, the center of the second position sensor 240 may not overlap with the second coil 230 in a direction perpendicular to the optical axis. Alternatively, the center of the second position sensor 240 may be the spatial center in the x-axis and y-axis directions of the xy-coordinate plane perpendicular to the optical axis. Or, the center of the second position sensor 240 may be the spatial center in the x-axis, y-axis, and z-axis directions.

[0364] In another embodiment, at least a portion of the second position sensor 240 may overlap with the second coil 230 in a direction perpendicular to the optical axis. For example, the upper region 2A of the second position sensor 240 (see...) Figure 26 At least a portion of the second position sensor 240 may overlap with the second coil 230 in a direction perpendicular to the optical axis. The lower region 2B of the second position sensor 240 may overlap with the second coil 230 in a direction perpendicular to the optical axis. The upper region 2A may be the region between the midpoint of the length of the second position sensor 240 and the upper surface of the second position sensor 240, and the lower region 2B may be the remaining region of the second position sensor 240, with the lower region 2B positioned below the upper region 2A.

[0365] For example, the second position sensor 240 may overlap with holes 41A to 41C in the holder 270 in the optical axis direction. For example, the second position sensor 240 may overlap with opening 11A or hole in the second coil 230 in the optical axis direction. For example, at least a portion of holes 41A to 41C in the holder 270 may overlap with opening 11A or hole in the second coil 230 in the optical axis direction.

[0366] The second position sensor 240 may include one or more sensors 240a, 240b, and 240c. For example, the second position sensor 230 may include three sensors 240a, 240b, and 240c.

[0367] Each of the first to third sensors 240a, 240b, and 240c can be implemented as a single Hall sensor, or as a driver IC including a Hall sensor. The description of the first position sensor 170 can be applied to the first to third sensors 240a, 240b, and 240c with or without modification.

[0368] Each of the first to third sensors 240a, 240b, and 240c can be electrically connected to a predetermined corresponding terminal in terminal 262 of the first circuit board 250. For example, a corresponding drive signal can be applied to each of the first to third sensors 240a, 240b, and 240c via terminal 262, and the output signal of each of the first to third sensors can be output to other predetermined terminals in terminal 262.

[0369] For example, six or four different terminals of the terminals 262 of the first circuit board 250 can be assigned to each of the first to third sensors 240a, 240b and 240c.

[0370] For example, when each of the first to third sensors 240a, 240b, and 240c is a Hall sensor, four terminals can be assigned to each of the first to third sensors 240a, 240b, and 240c. For example, these four terminals can be two input terminals and two output terminals.

[0371] For example, when each of the first to third sensors 240a, 240b, and 240c is a driver IC including a Hall sensor, six terminals can be assigned to each of the first to third sensors 240a, 240b, and 240c. The description of position sensor 170 can be applied, with or without modification, to the conductive connections between each of the first to third sensors 240a, 240b, and 240c and terminals 262 of the first circuit board 250, and to the relationship between the drive signal and the output of the position sensor.

[0372] For example, since the four coil units 230-1 to 230-4 are controlled by three channels, each of the first to third sensors 240a, 240b and 240c can be set in one of the corresponding three coil units 230-1 to 230-3, and the remaining coil unit 230-4 may not be equipped with a sensor.

[0373] For example, each of coil units 230-1 to 230-4 can be configured to have an opening 11A (see...) Figure 12a ( ), or the form of a ring of holes or cavities. For example, each of the first to third sensors 240a, 240b and 240c may be located below the opening 11A, hole or cavity of the corresponding one of the coil units 230-1 to 230-3.

[0374] For example, each of the first to third sensors 240a, 240b and 240c can be arranged in a corresponding one of the holes 41A to 41C of the retainer 270.

[0375] For example, each of the first to third sensors 240a, 240b, and 240c may not overlap with a corresponding one of the coil units 230-1 to 230-3 in a direction perpendicular to the optical axis. The first to third sensors 240a, 240b, and 240c may overlap with the holder 270 in a direction perpendicular to the optical axis.

[0376] For example, coil units 230-1 to 230-4 can be disposed on the upper surface 42A of the holder 270, and the first to third sensors 240a, 240b, and 240c can be disposed on the first surface 60A of the first circuit board 250. The upper surface 42A of the holder 270 can be positioned higher than the first surface 60A of the first circuit board 250.

[0377] For example, the upper surface 42A of the retainer 270 may have a height difference relative to the first surface 60A of the first circuit board 250.

[0378] For example, the height difference in the optical axis direction between the upper surface 42a of the holder 270 and the first surface 60A of the first circuit board 250 can be greater than the length in the optical axis direction of each of the first to third sensors 240a, 240b, and 240c. In another embodiment, the height difference in the optical axis direction between the upper surface 42a of the holder 270 and the first surface 60A of the first circuit board 250 can be equal to the length in the optical axis direction of each of the first to third sensors 240a, 240b, and 240c.

[0379] All motions of the image sensor 810 in the x-axis and y-axis directions, as well as rotation of the image sensor 810 about the z-axis, can be detected by three sensors 240a, 240b, and 240c.

[0380] One of the three sensors 240a, 240b, and 240c (e.g., 240a) can detect the amount of motion and / or displacement of the OIS movable unit in the x-axis direction. Another of the three sensors 240a, 240b, and 240c (e.g., 240b) can detect the amount of motion and / or displacement of the OIS movable unit in the y-axis direction. The remaining one of the three sensors 240a, 240b, and 240c can detect the amount of motion and / or displacement of the OIS movable unit in the x-axis and / or y-axis directions. The output of two or more of the three sensors 240a, 240b, and 240c can be used to detect the rotational motion of the OIS movable unit about the Z-axis.

[0381] Reference Figure 12bWhen a drive signal (e.g., drive current) is applied to the first coil unit 230-1 and the third coil unit 230-3, but not to the second coil unit 230-2 or the fourth coil unit 230-4, the direction of the first electromagnetic force generated by the interaction between the first coil unit 230-1 and the first magnet 23A and the direction of the third electromagnetic force generated by the interaction between the third coil unit 230-3 and the third magnet 23C can be the same direction, for example, the x-axis direction (e.g., the +x-axis direction or the -x-axis direction), and the OIS movable unit can move (displace) along the x-axis direction (e.g., along the +x-axis direction or the -x-axis direction).

[0382] For example, when a drive signal (e.g., drive current) is applied to the second coil unit 230-2 and the fourth coil unit 230-4, but not to the first coil unit 230-1 or the third coil 230-3, the direction of the second electromagnetic force generated by the interaction between the second coil unit 230-2 and the second magnet 23B and the direction of the fourth electromagnetic force generated by the interaction between the fourth coil unit 230-4 and the fourth magnet 23D can be the same direction, for example, the y-axis direction (e.g., the +y-axis direction or the -y-axis direction), and the OIS movable unit can move (displace) along the y-axis direction (e.g., along the +y-axis direction or the -y-axis direction).

[0383] For example, when a drive signal is applied to each of the first coil unit 230-1 to the fourth coil unit 230-4, the directions of the first electromagnetic force and the third electromagnetic force are opposite to each other, the directions of the second electromagnetic force and the fourth electromagnetic force are opposite to each other, and the direction in which the OIS movable unit rotates due to the first electromagnetic force and the third electromagnetic force is the same as the direction in which the OIS movable unit rotates due to the second electromagnetic force and the fourth electromagnetic force. The OIS movable unit can rotate or roll about the optical axis or the z-axis.

[0384] When the second coil 230 is controlled through three channels, the OIS movable unit can be rolled using the first coil unit 230-1 and the third coil unit 230-3 or the second coil unit 230-2 and the fourth coil unit 230-4.

[0385] exist Figure 12a and 12b In the embodiment shown, the second position sensor 240 may include three sensors 240a, 240b and 240c.

[0386] For example, the first sensor 240a can be arranged at the first corner of the first surface 60A of the first circuit board 250, the second sensor 240b can be arranged at the second corner of the first surface 60A of the first circuit board 250, and the third sensor 240c can be arranged at the third corner of the first surface 60A of the first circuit board 250. A sensor may not be placed at the fourth corner of the first surface 60A of the first circuit board 250.

[0387] The first corner and the third corner of the first surface 60A of the first circuit board 250 can face each other in a diagonal direction, and the second corner and the fourth corner of the first surface 60A can face each other in a diagonal direction.

[0388] For example, the first sensor 240a can be disposed on the first surface (or upper surface) 60A of the first protrusion 52A of the first circuit board 250, and can overlap with the first protrusion 52A in the optical axis direction.

[0389] The second sensor 240b can be disposed on the first surface (or upper surface) 60A of the second protrusion 52B of the first circuit board 250, and can overlap with the second protrusion 52B in the optical axis direction.

[0390] The third sensor 240c can be disposed on the first surface (or upper surface) 60A of the third protrusion 52C of the first circuit board 250, and can overlap with the third protrusion 52C in the optical axis direction.

[0391] For example, although the first sensor 240a may not overlap with the first coil unit 230-1 in the optical axis OA direction, the second sensor 240b may not overlap with the second coil unit 230-2 in the optical axis OA direction, and the third sensor 240c may not overlap with the third coil unit 230-3 in the optical axis OA direction, this disclosure is not limited thereto. In another embodiment, at least a portion of each of the first to third sensors may overlap with a corresponding one of the first to third coil units in the optical axis direction.

[0392] The first sensor 240a can overlap with the first magnet 23A in the optical axis direction, the second sensor 240b can overlap with the second magnet 23B in the optical axis direction, and the third sensor 240c can overlap with the third magnet 23C in the optical axis direction.

[0393] Although the second position sensor 240 includes three sensors, in another embodiment, the second position sensor 240 may include two sensors. For example, in another embodiment, one of the first sensor 240a and the third sensor 240c may be omitted.

[0394] The image sensor unit 350 may include at least one of a motion sensor 820, a controller 830, a memory 512, and capacitors 81A and 81B.

[0395] The motion sensor 820, controller 830, memory 512, and capacitors 81A and 81B can be set or mounted to one of the second circuit board 800 and the first circuit board 250.

[0396] For example, motion sensor 820, memory 512 and capacitor 81A can be disposed on the second surface 44B of the second circuit board 800.

[0397] The controller 830 and capacitor 81B can be disposed on the first surface 60A of the first circuit board 250. For example, the controller 830 can be disposed in the first region S1 of the first circuit board 250 (see...). Figure 12a The first region S1 may be the region located between the image sensor 810 and the first lateral surface or first side of the first circuit board 250.

[0398] The second region S2 of the first circuit board 250 may be provided with wiring or data lines through which data from the image sensor 810 is transmitted to the second circuit board 800. The first region S1 may be the region opposite the second region S2 with respect to the image sensor 810. The second region S2 may be the region adjacent to the third region 803 of the second circuit board 800. The image sensor 810 may be sensitive to noise generated by the wiring or data lines, and the operation and performance of the image sensor 810 may be degraded due to noise.

[0399] When the controller 830 is located in the second region S2 of the first circuit board 250, noise may be generated by wiring or data lines due to the presence of the controller 830, thereby degrading the operation and performance of the image sensor 810.

[0400] For example, a motion sensor 820 located on a second circuit board 800 can be electrically connected to a controller 830 located on a first circuit board 250 via a support member 220 and a connecting elastic member 280.

[0401] The motion sensor 820 can output information about the rotational angular velocity caused by the motion of the camera module 10. The motion sensor 820 can be implemented as a dual-axis or three-axis gyroscope sensor or an angular velocity sensor.

[0402] The memory 512 can store code values ​​based on the displacement of the coil holder 110 in the optical axis direction for use in AF feedback operation. Furthermore, the memory 512 can store code values ​​based on the displacement of the OIS movable unit in a direction perpendicular to the optical axis direction for use in OIS feedback operation. Additionally, the memory 512 can store algorithms or programs for the operation of the controller 830.

[0403] For example, although memory 512 may be, for example, EEPROM (Electrically Erasable Programmable Read-Only Memory), this disclosure is not limited thereto.

[0404] The controller 830 can be electrically connected to the first position sensor 170 and the second position sensor 240.

[0405] The controller 830 can use the first code value stored in the memory 512 to control the output signal of the first position sensor 170 and the drive signal supplied to the first coil 120, thereby performing feedback autofocus operation.

[0406] In addition, the controller 830 can use the second code value stored in the memory 512 to control the output signal supplied from the second position sensor 240 and the drive signal supplied to the second coil 230, thereby performing feedback OIS operation.

[0407] Although the controller 830 may be of the type of driver IC, this disclosure is not limited thereto. For example, the controller 830 may be electrically connected to terminal 262 of the first circuit board 250.

[0408] Reference Figure 14 The first circuit board 250 may include a terminal 262 electrically connected to the connecting elastic member 280. The second terminal 262 may alternatively be referred to as a "second terminal portion" or a "second terminal unit".

[0409] For example, terminals 262 of the first circuit board 250 can be connected to the connecting elastic member 270 via solder or conductive adhesive. For example, terminals 262 can be implemented as multiple terminals.

[0410] For example, the second terminal 262 of the first circuit board 250 may be disposed on the second surface (e.g., the lower surface) 60B of the first circuit board 250, and may correspond to or face the connecting spring 281 of the connecting elastic member 270 in the optical axis direction.

[0411] The second terminal 262 of the first circuit board 250 may overlap with at least a portion of the corresponding connecting spring 281. Although the first circuit board 250 may be a printed circuit board or a flexible printed circuit board (FPCB), this disclosure is not limited in this respect.

[0412] The first circuit board 250 can be disposed between the retainer 270 and the connecting elastic member 280.

[0413] The connecting elastic member 280 can be coupled to the retainer 270. The connecting elastic member 280 can be used to allow movement of the OIS movable unit and to allow conductive transmission of signals. In other words, the connecting elastic member 280 can electrically connect the support member 220 to the terminal 262 of the first circuit board 250.

[0414] For example, the connecting elastic member 280 may be located below the retainer 270.

[0415] For example, the connecting elastic member 280 may be attached to the lower surface 42B of the retainer 270 via an adhesive member. For example, the connecting elastic member 280 may be attached to the first surface 36A of the lower surface 42B of the retainer 270.

[0416] The connecting elastic member 280 can electrically connect the support member 220 to the first circuit board 250, and may include an elastically deformable portion. The elastically deformable portion of the connecting elastic member 280 can be connected to the support member 220.

[0417] The connecting elastic member 280 may include a connecting spring 281 corresponding to the support member 220.

[0418] For example, the connecting elastic member 280 may include a plurality of connecting springs 281. The plurality of connecting springs 281 may correspond to each support member 220.

[0419] Multiple connecting springs 281 can be configured to be electrically isolated or spaced apart from each other.

[0420] The connecting spring 281 may be made of a conductive material, such as a metal like copper or a copper alloy.

[0421] For example, the connecting spring 281 may be made of at least one selected from gold (Au), silver (Ag), platinum (Pt), titanium (Ti), tin (Sn), copper (Cu), and zinc (Zn). Furthermore, the connecting elastic member 280 may be made of paste or solder paste, which includes at least one selected from gold (Au), silver (Ag), platinum (Pt), titanium (Ti), tin (Sn), copper (Cu), and zinc (Zn) having excellent bonding strength.

[0422] For example, the connecting spring 281 can be made of a metallic material with a tensile strength of 1000 MPa or higher. For example, the connecting spring 281 can be made of a binary or ternary alloy including copper.

[0423] Reference Figures 15 to 18The connecting spring 281 may include: a first connector 31 connected to a terminal 262 of a first circuit board 250; a second connector 32 connected to a support member 220; and a connector 33 connecting the first connector 31 to the second connector 32.

[0424] The first connector 31 connecting the spring 281 can be supported by the retainer 270. For example, the first connector 31 can be disposed on the first surface 36A of the lower surface 42B of the retainer 270 and can be supported by the lower surface 42B of the retainer 270.

[0425] For example, the first connector 31 may be disposed on the first surface 36A of the lower surface 42B of the retainer 270 adjacent to at least one recess 272 in the retainer 270.

[0426] For example, the first connector 31 may include: a first portion 31a, which is supported by a retainer 270 and connected to a connector 33; and a second portion 31b, which is connected to the first portion 31a and connected to a terminal 262 of the first circuit board 250.

[0427] For example, the first portion 31a of the first connector 31 may overlap with the first surface 36A of the lower surface 42B of the retainer 270 in the optical axis direction and may be connected to the first surface 36A.

[0428] The second portion 31b of the first connector 31 may not overlap with the lower surface 42B of the retainer 270 in the optical axis direction. At least a portion of the second portion 31b of the first connector 31 may overlap with the terminal 262 of the first circuit board 250 in the optical axis direction.

[0429] For example, the second part 31b can protrude from the inner surface of the retainer 270 in the direction toward the terminal 262 of the first circuit board 250.

[0430] For example, the second portion 31b of the first connector 31 can be positioned opposite to the portion 19A described below: at portion 19A, the first connector 31 is engaged with the connector 33.

[0431] The width of the first portion 31a of the first connector 31 may be greater than the width of the other portions 31b and 33 to increase the bonding force with the insulating member 285 and the retainer 270.

[0432] For example, the width W1 of the first portion 31a of the first connector 31 can be greater than the width W2 of the second portion 31b. In other words, the surface area of ​​the first portion 31a of the first connector 31 can be greater than the surface area of ​​the second portion 31b. This is done to relatively increase the width W1 (or surface area) of the first portion 31 supported by the retainer 270 so that the first portion 31a can be stably supported by the retainer 270.

[0433] Here, widths W1 and W2 can be the lengths of the first connector 31 in a direction perpendicular to the direction toward the terminal 262 of the first circuit board 250.

[0434] In another embodiment, the width W1 of the first portion 31a may be equal to or less than the width W2 of the second portion 31b.

[0435] The second connector 32 can be connected to one end (e.g., the lower end) of the support member 220 via solder 902 or conductive adhesive member.

[0436] For example, the second connector 32 can be configured to overlap with the hole 270a in the retainer 270 in the optical axis direction.

[0437] The second connector 32 may have a hole 32A through which the support member 220 extends.

[0438] The end of the support member 220 that passes through the hole 32A in the second connector 32 can be directly connected to the second connector 32 via a conductive adhesive member or solder 902, and the second connector 32 can be electrically connected to the support member 220.

[0439] For example, the second connector 32 may include a hole 32A and a region around the hole 32A, which serves as a region for providing solder 902 to connect the connector 32 to the support member 220. Although the second connector 32 is configured to... Figure 16 While the second connector 32 may have a circular shape, this disclosure is not limited thereto. In another embodiment, the second connector 32 may be configured to have a polygonal shape (e.g., a quadrilateral shape) or an elliptical shape.

[0440] For example, the diameter K of the second connector 32 may be smaller than the width W1 of the first portion 31a of the first connector 31. In another embodiment, the diameter K of the second connector 32 may be equal to or greater than the width W1 of the first portion 31a of the first connector 31.

[0441] The connector 33 can connect the first portion 31a of the first connector 31 to the second connector 32, and may include at least one linear portion and at least one curved portion.

[0442] For example, the curved portion can be configured to extend to the left or right from the linear portion perpendicular to the optical axis. For example, although connector 33 can be configured to have a spiral shape, this disclosure is not limited thereto.

[0443] For example, connector 33 may include a bent portion that extends clockwise or counterclockwise. In other words, connector 33 can be bent in a direction corresponding to the rotation of the image sensor in the Z-axis direction. Therefore, connector 33 can minimize damage to the connecting spring 281 when the image sensor rotates in the Z-axis direction, resulting in preventing cracks in the connecting spring 281 and preventing the connecting spring 281 from separating from the insulating member 285.

[0444] For example, connector 33 may include: a first linear portion 33-1, which is connected to the first connector 31; a first bent portion 34-1, which extends from the first linear portion 33-1 in a bent direction; a second linear portion 33-2, which is connected to the first bent portion 34-1; a third bent portion 34-2, which extends from the second linear portion 33-2 in a bent direction; and a third linear portion 33-3, which extends from the second linear portion 33-2 in a bent direction. 33-3 is connected to the second curved portion 34-2; a third curved portion 34-3 extends from the third linear portion 33-3 in a curved direction along a third lateral direction; a fourth linear portion 33-3 is connected to the third curved portion 34-3; a fourth curved portion 34-4 extends from the fourth linear portion 33-4 in a curved direction along a fourth lateral direction; and a fifth linear portion 33-5 connects the fourth curved portion 34-4 to the second connector 32. For example, although each of the first lateral direction to the fourth lateral direction can be to the left, this disclosure is not limited thereto. In another embodiment, at least one of the first lateral direction to the fourth lateral direction can be to the right.

[0445] At least one of the bent portions 34-1 to 34-5 of connector 33 may be configured to have a circular shape.

[0446] The width of each of the first linear portions 33-1 to the fifth linear portions 33-5 may differ from the width of each of the first curved portions 34-1 to the fourth curved portions 34-4. For example, since stress is concentrated in the curved portions, the width of each of the first curved portions 34-1 to the fourth curved portions 34-4 may be greater than the width of each of the first linear portions 33-1 to the fifth linear portions 33-5, thereby preventing damage to the connector 33 caused by the stress applied to the connector 33.

[0447] The connecting spring 281 may have different widths at different parts of its structure.

[0448] The width of connector 33 can be smaller than the width of the first part 31a in order to apply elastic force.

[0449] The width W3 of connector 33 can be smaller than any of the width W1 of the first portion 31a of the first connector 31, the width W2 of the second portion 31b of the first connector 31, and the diameter K of the second connector 32. Therefore, the connecting spring 281 can flexibly support the OIS movable unit and allow the OIS movable unit to move easily in a direction perpendicular to the optical axis.

[0450] For example, connector 33 can have a width from 20 μm to 1000 μm.

[0451] For example, if the width of connector 33 is less than 20 μm, the overall stiffness of the connecting spring 281 may decrease, and therefore the reliability of the connecting spring 281 may decrease. Meanwhile, if the width of connector 33 is greater than 100 μm, the elastic force of the connecting spring 281 may decrease, and therefore the voltage required to activate the second coil 230 configured to shift the OIS movable unit may increase, thereby increasing power consumption.

[0452] In another embodiment, the width of connector 33 may be equal to or greater than the diameter K of second connector 32.

[0453] The thickness t1 of the first connector 31, the thickness t2 of the connector 33, and the thickness of the second connector 32 can be the same. In another embodiment, at least one of the thickness t1 of the first connector 31, the thickness t2 of the connector 33, and the thickness of the second connector 32 can be different from the remaining thicknesses. For example, the thickness t2 of the connector 33 can be less than the thickness of the first connector 31 and the thickness of the second connector 32.

[0454] The second connector 32 and connector 33 may overlap with the groove 272 in the retainer 270 in the optical axis direction. For example, the second connector 32 and connector 33 may be disposed in the groove 272 in the retainer 270. For example, the second connector 32 and / or connector 33 may be disposed spaced apart from the retainer 270.

[0455] Reference Figure 15 and Figure 16 The connecting elastic member 280 may include multiple connecting springs. The multiple connecting springs may be classified into multiple groups. For example, the multiple groups may alternatively be referred to as "multiple connectors", "multiple elastic parts" or "multiple connecting elastic members".

[0456] For example, the connecting elastic member 280 may include four groups 1A to 4A corresponding to the four side portions (four lateral side surfaces) of the first circuit board 250 or the four side portions (or four lateral side surfaces) of the retainer 270.

[0457] Each of the multiple groups 1A to 4A may include multiple connecting springs 1-1 to 1-9, 2-1 to 2-9, 3-1 to 3-9, or 4-1 to 4-9.

[0458] Furthermore, the terminals 262 of the first circuit board 250 can be classified into multiple groups corresponding to groups 1A to 4A of the connecting elastic members 280. Each of the multiple groups of the first circuit board 250 may include multiple terminals P1 to P9, S1 to S9, R1 to R9, or Q1 to Q9.

[0459] For example, each of the plurality of terminals P1 to P9, S1 to S9, R1 to R9 and Q1 to Q9 of the first circuit board 250 can be soldered to a corresponding one of the plurality of connecting springs 1-1 to 1-9, 2-1 to 2-9, 3-1 to 3-9 and 4-1 to 4-9.

[0460] For example, the number of connecting springs included in multiple groups 1A to 4A can be the same.

[0461] In another embodiment, the number of connecting springs included in the two groups positioned opposite each other can be the same.

[0462] In another embodiment, the number of connecting springs included in two adjacent groups of connecting elastic members 280 may differ from each other. In another embodiment, the number of connecting springs included in at least one of the plurality of groups 1A to 4A may differ from the number of connecting springs included in each of the remaining groups.

[0463] For example, in order to flexibly support the OIS movable unit in a balanced state, the multiple groups 1A to 4A of the connecting elastic members 280 can be arranged to be bi-radially symmetrical about the center point 403.

[0464] In another embodiment, the multiple groups 1A to 4A of the connecting elastic member 280 can be configured to be radially symmetrical about the center point 403.

[0465] For example, retainer 270 may include four corners 30A to 30D. The first group 1A and the third group 3A may be arranged opposite each other in the lateral direction, and the second group 2A and the fourth group 4A may be arranged opposite each other in the longitudinal direction. The lateral and longitudinal directions may intersect each other.

[0466] The first group 1A can be disposed in the first region of the second surface 70B of the retainer 270 between the first corner 30A and the second corner 30B, and the second group 2A can be disposed in the second region of the second surface 70B of the retainer 270 between the second corner 30B and the third corner 30C. The third group 3A can be disposed in the third region of the second surface 70B of the retainer 270 between the third corner 30C and the fourth corner 30D, and the fourth group 4A can be disposed in the fourth region of the second surface 70B of the retainer 270 between the fourth corner 30D and the first corner 30A.

[0467] The first corner 30A and the third corner 30C of the retainer 270 can be positioned opposite each other in the first diagonal direction, and the second corner 30B and the fourth corner 30D of the retainer 270 can be positioned opposite each other in the second diagonal direction. The first diagonal direction and the second diagonal direction can be perpendicular to each other.

[0468] The centers of the first group 1A and the third group 3A can be positioned offset in the opposite direction relative to the first center line 401, and the centers of the second group 2A and the fourth group 4A can be positioned offset in the opposite direction relative to the second center line 402.

[0469] Here, the center of each group can be the spatial center of the total length along the direction in which the connecting springs included in that group are arranged. The total length can be the distance between the first and last connecting springs in each group.

[0470] For example, the first center line 401 may be a line extending through the center 403 and parallel to the direction from a first region of the retainer 270 in which the first group 1A is disposed toward a third region of the retainer 270 in which the third group 3A is disposed. Alternatively, the first center line 401 may be a line extending through the center 403 and parallel to the first outer surface of the retainer 270.

[0471] For example, the second center line 402 may be a line extending through the center 403 and parallel to the direction from the second region of the retainer 270 in which the second group is disposed toward the fourth region of the retainer 270 in which the fourth group is disposed. Alternatively, the second center line 402 may be a line extending through the center 403 and perpendicular to the first outer surface of the retainer 270.

[0472] For example, center 403 can be the center of hole 70 in retainer 270, the center of first circuit board 250, or the spatial center of connecting elastic member.

[0473] For example, the number of connecting springs in the first group 1A (or the third group 3A) located on one side (e.g., the right side) of the first centerline 401 and the number of connecting springs in the first group 1A (or the third group 3A) located on the other side (e.g., the left side) of the first centerline 401 can be different from each other.

[0474] For example, the number of connecting springs in the second group 2A (or the fourth group 4A) located on one side (e.g., the right side) of the second centerline 402 and the number of connecting springs in the second group 2A (or the fourth group 4A) located on the other side (e.g., the left side) of the second centerline 402 can be different from each other.

[0475] Reference Figure 16 The connecting elastic member 280 may also include an insulating member 285. The insulating member 285 may alternatively be referred to as an "insulating layer". For example, the insulating member 285 may include polyimide.

[0476] The insulating member 285 may surround at least a portion of the connecting spring 281. For example, the insulating member 285 may surround at least a portion of the first portion 31a of the connecting spring 281. For example, the upper surface of the first portion 31a of the connecting spring 281 may be coupled to the first surface 36A of the lower surface 42A of the retainer 270, and the insulating member 285 may cover the lower surface of the first portion 31a of the connecting spring 281.

[0477] The adhesive frame can be placed or disposed between the insulating member 285 and the connecting spring 281, and between the insulating member 285 and the dummy members 28-1 to 28-4, so as to attach them to each other.

[0478] For example, the second part 31b of the first connector 31 connecting the spring 281, the second connector 32, and the connector 33 may be exposed from the insulating member 285.

[0479] Insulating member 285 can connect the connecting springs 1-1 to 1-9, 2-1 to 2-9, 3-1 to 3-9 and 4-1 to 4-9 of groups 1A to 4A to each other.

[0480] The insulating member 285 can support the connecting springs 1-1 to 1-9, 2-1 to 2-9, 3-1 to 3-9 and 4-1 to 4-9 of the connecting elastic member 280, and can be coupled or attached to the first surface 36A of the lower surface 42B of the retainer 270.

[0481] The connecting elastic member 280 may also include one or more dummy members 28-1 to 28-4.

[0482] For example, dummy components 28-1 to 28-4 may be spaced apart from connecting springs 1-1 to 1-9, 2-1 to 2-9, 3-1 to 3-9 and 4-1 to 4-9, and may be disposed on the lower surface 42B of retainer 270.

[0483] The insulating member 285 may surround or cover at least a portion of the dummy members 28-1 to 28-4. Therefore, the shape of the insulating member 285 can be firmly maintained to improve the adhesion between the insulating member 285 and the retainer 270.

[0484] The dummy components 28-1 to 28-4 can be alternatively referred to as “reinforcing parts” or “reinforcing patterns” because they enhance the stiffness of the connecting elastic component 280.

[0485] Each of the dummy components 28-1 to 28-4 may be attached to the lower surface 42B of the retainer 270 via an adhesive and may have at least one through hole 28A or groove to increase the connection force between the dummy component and the retainer 270.

[0486] The dummy components 28-1 to 28-4 may not be electrically connected to the connecting springs 1-1 to 1-9, 2-1 to 2-9, 3-1 to 3-9, and 4-1 to 4-9. Although the dummy components 28-1 to 28-4 are not electrically connected to each other, this disclosure is not limited thereto. In another embodiment, the dummy components may be connected to each other.

[0487] For example, the insulating member 285 may have holes or cavities therein. For example, although the insulating member 285 may be configured to have a polygonal shape when viewed from above, such as an annular shape that is quadrilateral in shape, the present disclosure is not limited thereto.

[0488] For example, although the connecting elastic member 280 may include four dummy members 28-1 to 28-4, the number of dummy members is not limited thereto. In another embodiment, the number of dummy members may be any number greater than or equal to 1.

[0489] For example, each of the dummy components 28-1 to 28-4 can be disposed between two adjacent groups 1A and 2A, 2A and 3A, 3A and 4A, or 4A and 1A of the connecting elastic component 280.

[0490] For example, the connecting elastic member 280 may include a dummy member 28-3 disposed on the insulating member 285 at a first corner or first corner region between the first group 1A and the second group 2A, a dummy member 28-2 disposed on the insulating member 285 at a second corner or second corner region between the second group 2A and the third group 3A, a dummy member 28-1 disposed on the insulating member 285 at a third corner or third corner region between the third group 3A and the fourth group 4A, and a dummy member 28-4 disposed on the insulating member 285 at a fourth corner or fourth corner region between the fourth group 4A and the first group 1A.

[0491] Each of the dummy components 28-1 to 28-4 may have a clearance portion configured to avoid spatial interference with the protrusion 275 of the retainer 270. Although the clearance portion 27A may be configured to have a groove or a hole, this disclosure is not limited thereto.

[0492] Reference Figure 16 The insulating member 285 may include a body 85A and an extension 85B. The body 85A is disposed on a first portion 31a of the first connector 31 connecting springs 1-1 to 1-9, 2-1 to 2-9, 3-1 to 3-9 and 4-1 to 4-9, a portion of the lower surface 43B of the retainer 270 and some portions of the dummy members 28-1 to 28-4. The extension 85B extends toward other portions of the dummy members 28-1 to 28-4.

[0493] For example, the body 85A of the insulating member 285 may be disposed on the first surface 36A of the lower surface 42B of the retainer 270 adjacent to the hole 70 in the retainer 270, and may be configured to have a ring having a closed curve shape. For example, although the body 85A may be configured to have a quadrilateral ring, the present disclosure is not limited thereto. In another embodiment, the body 85A may be configured to have a circular or polygonal ring.

[0494] For example, the body 85A may have a hole or cavity therein that corresponds, overlaps or aligns with the hole 800A in the second circuit board 800 and the hole in the retainer 270 in the optical axis direction.

[0495] Although the extension 85B can be configured to have a linear shape, this disclosure is not limited thereto. In another embodiment, the extension 85B can be configured to have at least one of a linear shape and a curved shape. For example, the extension 85B may include a plurality of extensions that may be spaced apart from each other. For example, the extension 85B may extend from the body 85A toward the outer surface of the retainer 270. For example, the extension may be configured to surround the groove 272 in the retainer 270.

[0496] The extension 85B can be used to increase the contact area with each of the dummy members 28-1 to 28-4, thereby further increasing the stiffness of the connecting elastic member 280.

[0497] The support member 220 can electrically connect the second circuit board 800 to the connecting elastic member 280.

[0498] Support member 220 may include multiple sets of support members corresponding to groups 1A to 4A of connecting elastic members 280. Each of the multiple groups may include multiple support members (or wiring).

[0499] For example, support member 220 may include multiple support members corresponding to multiple connecting springs. The support members may alternatively be referred to as "wiring".

[0500] The support member 220 can be connected to the second circuit board 800 at one end and to the second connector 32 of the connecting spring 281 at the other end.

[0501] For example, one end of the support member 220 can be connected to a first surface (e.g., upper surface) 44A of the second circuit board 800 via a hole 800A in the second circuit board 800 through a first solder 901. For example, one end of the support member 220 can be connected and electrically connected to a terminal 800B of the second circuit board 800.

[0502] The other end of the support member 220 can be connected to the lower portion or lower surface of the second connector 32 of the connecting spring 281 via the second solder 902 through the hole 32A in the second connector 32.

[0503] The support member 220 can extend through the clearance area 45 in the housing 450 and the hole 270a in the retainer 270, thereby avoiding spatial interference with the housing 450 and the retainer 270.

[0504] Each of the support members 220 may be implemented as a conductive member that provides elastic support, such as a suspension wire, leaf spring, or coil spring.

[0505] The image sensor unit 350 may also include a filter 610. The image sensor unit 350 may also include a filter holder 600, in which the filter 610 is disposed, seated, or received. The filter holder 600 may alternatively be referred to as a "sensor base".

[0506] The filter 610 can be used to prevent light within a specific frequency band passing through the lens barrel 400 from being introduced into the image sensor 810.

[0507] The filter 610 may be, for example, an infrared light blocking filter, but is not limited thereto. For example, the filter 610 may be oriented parallel to the XY plane perpendicular to the optical axis OA.

[0508] The filter 610 can be positioned below the lens module 400.

[0509] The filter holder 600 can be located below the AF operation unit 100. For example, the filter holder 600 can be located on the first circuit board 250.

[0510] The filter holder 600 can be coupled to the area surrounding the image sensor 810 on the first surface 60A of the first circuit board 250, and can be exposed through holes 800A in the second circuit board 800 and holes 70 in the holder 270. For example, the filter holder 600 can be exposed through holes 800A in the second circuit board 800 and holes 70 in the holder 270.

[0511] For example, the filter holder 600 may be coupled to a region of the first surface (e.g., the upper surface) surrounding the first circuit board 250, specifically a mounting region 260A. Although the mounting region 260A is associated with... Figure 12a The first surface 60A of the first circuit board 250 is the same as that of the first surface, but this disclosure is not limited thereto. In another embodiment, the seating area 260A may be a recess or a protrusion.

[0512] In another embodiment, the filter holder 600 may be coupled to the holder 270 or the AF operation unit 100.

[0513] The hole 70 in the retainer 270 can expose the filter retainer 600 disposed at the first circuit board 250 and the filter 610 disposed at the filter retainer 600 through the hole 70.

[0514] The filter holder 600 may have an aperture 61A formed in the area where the filter 610 is mounted or disposed, so as to allow light that has passed through the filter 610 to enter the image sensor 810. The aperture 61A in the filter holder 600 may be configured as a through-hole formed through the filter holder 600 in the optical axis direction. For example, the aperture 61A in the filter holder 600 may be formed through the center of the filter holder 600 and may be positioned corresponding to or facing the image sensor 810.

[0515] The filter holder 600 may have a seating portion 500 in which the filter 610 is seated. The filter 610 may be disposed, seated, or mounted in the seating portion 500. The seating portion 500 may be formed to surround the aperture 61A. In another embodiment, the seating portion 500 of the filter holder 600 may be configured to have a protrusion projecting from the upper surface of the filter 610.

[0516] The image sensor unit 350 may also include an adhesive member 612 disposed between the filter 610 and the mounting portion 500, and the filter 610 may be coupled or attached to the filter holder 600 via the adhesive member 612.

[0517] The image sensor unit 350 may also include an adhesive member 61 disposed between the filter holder 600 and the first circuit board 250, and the filter holder 600 may be connected or attached to the first circuit board 260 via the adhesive member 61.

[0518] For example, adhesive components 612 and 61 can be epoxy resin, thermosetting adhesive, or UV-curing adhesive.

[0519] The camera module 10 may also include at least one of a cover member 300, a base 210, and a bottom cover 219 to house the AF operation unit 100 and the image sensor unit 350 therein, to protect the AF operation unit 100 and the image sensor unit 350 from external impacts and to prevent the introduction of external foreign objects.

[0520] The cover member 300 can be configured as a box, open at the bottom, and includes a top plate 301 and a side plate 302. The side plate 302 of the cover member 300 can be attached to the outer surface of the housing 140 of the AF operating unit 100. In another embodiment, the lower portion of the side plate 302 of the cover member 300 can be attached to the base 210.

[0521] The upper plate 301 of the cover member 300 can be configured to have a polygonal shape, such as a quadrilateral shape, an octagonal shape, etc. The cover member 300 may have a hole 303 therein, which is formed through the upper plate 301 to expose a lens (not shown) connected to the coil holder 110 to external light. One of the side plates 302 of the cover member 300 may be provided with a groove 304 through which the terminal member 95 of the circuit board 910 is exposed.

[0522] The base 210 may be disposed below the retainer 270. The base 210 may be configured to have a shape that is consistent with or corresponds to the shape of the cover member 300, the housing 450 or the retainer 270, such as a quadrilateral shape.

[0523] For example, the base 210 may include a lower plate 210A disposed below the retainer 270 and a side plate 210B extending from the lower plate 210A toward the second circuit board 800. The base 210 may have a hole 210C formed through the lower plate 210A.

[0524] The hole 210C in the base 210 can be a through hole formed through the base 210 along the optical axis. In another embodiment, the base 210 may not have the hole 210C therein.

[0525] For example, the side plate 210B of the base 210 can be connected to the housing 450. In another embodiment, the side plate 210B of the base 210 can be connected to the side plate 302 of the cover member 300.

[0526] The bottom cover 219 may be disposed below the base 210 to close the hole 210C in the base 210. In another embodiment, the bottom cover 219 may be omitted.

[0527] In the following text, the fixed portion (e.g., "OIS fixed portion") and the movable portion (e.g., "OIS movable portion") of the image sensor unit 350 will be described in relation to OIS operation.

[0528] Image sensor unit 350 may include a fixed OIS portion, a movable OIS portion, and elastic support members 220 and 280 connected to the two portions to connect them to each other. The movable OIS portion may move relative to the fixed OIS portion in a direction perpendicular to the optical axis OA. The elastic support members 220 and 280 may alternatively be referred to as "support members" or "elastic members".

[0529] The movable OIS portion, located below the fixed OIS portion, can be spaced a predetermined distance from the fixed OIS portion by means of elastic support members 220 and 280. Specifically, the movable OIS portion can move relative to the fixed OIS portion via the support member 220 and the connecting elastic member 280, by the electromagnetic force generated by the interaction between the magnet 23 and the coil 230.

[0530] One end of the elastic support members 220 and 280 (e.g., one end of support member 220) can be connected to the second circuit board 800, and the other end of the elastic support members 220 and 280 (e.g., the first connector 31 connecting spring 281) can be connected to the first circuit board 250.

[0531] The second circuit board 800 and the first circuit board 250 can be electrically connected to each other via elastic support members 220 and 280.

[0532] The movable part of the OIS can move relative to the fixed part of the OIS in a direction perpendicular to the optical axis by the electromagnetic force generated by the interaction between the second coil 230 and the magnet 23.

[0533] For example, through the interaction between magnet 23 and second coil 230, image sensor 810 can be shifted or tilted in a direction perpendicular to optical axis OA, or it can be rotated about optical axis OA. For example, the optical axis direction can be a direction perpendicular to a surface of image sensor 810. For example, a surface of image sensor 810 can be the upper surface of image sensor 810. Alternatively, a surface of image sensor 810 can be a surface corresponding to or facing the lower surface of lens module 400 or filter 610. For example, a surface of image sensor 810 can be an active area.

[0534] With the help of the support member 220 and the connecting elastic member 280, the movable part of the OIS can be elastically supported and can move in a direction perpendicular to the optical axis.

[0535] The OIS fixing portion may include a second circuit board 800, a housing 450, and a magnet 23. Furthermore, the OIS fixing portion may include at least one of a base 210, a cover member 300, and a bottom cover 219. Additionally, the OIS fixing portion may include elements coupled to the second circuit board 800, such as a motion sensor 820 and a capacitor 81A.

[0536] The movable part of the OIS may include a first circuit board 250, a retainer 270, a second coil 230, and an image sensor 810.

[0537] Furthermore, the movable part of the OIS may include components connected to the first circuit board 250, such as the second position sensor 240, the controller 830, the memory 512, and the capacitor 81B. Additionally, the movable part of the OIS may include a filter holder 600 and a filter 610.

[0538] For example, the movable part of the OIS may include: a first circuit board 250 connected to a connecting elastic member 280; a retainer 270 connected to the first circuit board 260; and an image sensor 810 disposed at the first circuit board 250 and elastically supported by a support member 220 and a connecting elastic member 280.

[0539] The magnet 23 can be disposed at the fixed part of the OIS, and the second coil 230 can be disposed at the movable part of the OIS. By means of the interaction between the magnet 23 and the second coil 230, the movable part of the OIS can move or tilt relative to the fixed part of the OIS.

[0540] Reference Figure 19a In order to use the electromagnetic force generated by the interaction between the magnet 23 and the second coil 230 to move and tilt the movable part of the OIS relative to the fixed part of the OIS, the movable part of the OIS can be spaced apart from the fixed part of the OIS.

[0541] For example, the first circuit board 250 and the image sensor 801 may be spaced apart from the second circuit board 800, the housing 450 and the base 210.

[0542] For example, at the initial position of the movable part of the OIS, the outer surface of the retainer 270 can be spaced apart from the inner surface of the base 210 by a predetermined distance d1.

[0543] Furthermore, for example, at the initial position of the OIS movable portion, the lower surface of the retainer 270 and the lower surface of the first circuit board 250 may be spaced apart from the front surface (or upper surface) of the base 210 by a predetermined distance H1. Furthermore, at the initial position of the OIS movable portion, the lower surface of the retainer 270 and the lower surface of the first circuit board 250 may be spaced apart from the front surface (or upper surface) of the bottom cover 219.

[0544] Furthermore, at the initial position of the OIS movable part, the solder 902 can be spaced apart from the front surface (or upper surface) of the base 210 by a predetermined distance.

[0545] The initial position of the movable part of the OIS can be the initial position of the movable part of the OIS when no power is applied to the second coil 230, or the position of the movable part of the OIS as a result of the elastic deformation of the support member 220 and the connecting elastic member 280 solely due to the weight of the movable part of the OIS.

[0546] In addition, the initial position of the movable part of the OIS can be the position of the movable part of the OIS when gravity acts in the direction from the second circuit board 800 to the first circuit board 250 or when gravity acts in the direction from the first circuit board 250 to the second circuit board 800.

[0547] The image sensor 810 may be any of, but is not limited to, a charge-coupled device (CCD), a metal-oxide-semiconductor (MOS), a CPD image sensor, and a CID image sensor.

[0548] Although the first circuit board 250 may be implemented as a single circuit board in an embodiment, this disclosure is not limited thereto. In another embodiment, the first circuit board may include a third board and a fourth board, each of the third board and the fourth board may include additional terminals configured to be electrically connected to each other, and the first connector 31 of the connecting resilient member 280 may be electrically connected to one of the third board and the fourth board.

[0549] Figure 22 The figure illustrates a connecting elastic member 280-1 according to another embodiment.

[0550] Reference Figure 22 The connecting elastic member 280-1 may include a plate portion 280A and an elastic portion 280B. The plate portion 280A may alternatively be referred to as a "plate member", "circuit board", "board" or "circuit member".

[0551] The board portion 280A may include a plurality of terminals 41 corresponding to terminals 262 of the first circuit board 250.

[0552] The plate portion 280A may have a hole 79 therein corresponding to the hole 70 in the retainer 270. The hole 79 in the plate portion 280A may be a through hole formed through the plate portion 280A along the optical axis.

[0553] For example, the hole 79 in the board portion 280A can expose the second surface 60B of the first circuit board 250 and the terminal 262 of the first circuit board 250.

[0554] The terminal 41 of the board portion 280A may include a first portion 41a and a second portion 41b. The first portion 41a of the terminal 41 may be disposed in the board portion 280A, and the second portion 41b of the terminal 41 may be exposed to the outside from the board portion 280A and may be connected to the terminal 262 of the first circuit board 250 via solder.

[0555] The plate portion 280A may be disposed on the first surface 36A of the lower surface 42B of the retainer 270, and may be connected or attached to the first surface 36A of the lower surface 42B of the retainer 270 via an adhesive member.

[0556] For example, board portion 280A can be implemented as a printed circuit board or a flexible printed circuit board (FPCB).

[0557] The elastic portion 280B can be exposed from the plate portion 280A and can be connected to the terminal 41 of the plate portion 280A.

[0558] The resilient portion 280B may include a connector 32A connected to the support member 220 and a connector 33A connecting the connecting portion 32A to the terminal 41.

[0559] The terminals 41 of the elastic portion 280B and the plate portion 280A can correspond to Figure 18 The connecting spring 281 shown is shown.

[0560] For example, the first portion 41a of terminal 41 can correspond to Figure 18The first portion 31a of the connecting spring 281 shown, and the second portion 41b of the terminal 41 can correspond to Figure 18 The second part 31b of the connecting spring 281 shown. The description of the first part 31a and the second part 31b of the connecting spring 281 may be applied to the first part 41a and the second part 41b of the terminal 41 with or without modification.

[0561] Furthermore, the connector 32A of the flexible part 280B can correspond to Figure 18 The second connector 32 of the connecting spring 281 shown, and the connector 33A of the elastic portion 280B can correspond to Figure 18 The connector 33 of the connecting spring 281 is shown. The description of the second connector 32 and connector 33 of the connecting spring 281 can be applied to the connector 32A and connector 33A of the elastic part 280B with or without modification.

[0562] right Figure 15 and Figure 16 The description of groups 1A to 4A of the connecting elastic members 280 shown can be applied with or without modification. Figure 24 The connecting elastic member 280-1 shown is illustrated.

[0563] Board portion 280A may include Figure 15 and Figure 16 The dummy components 28-1 to 28-4 shown are described herein, and the description of dummy components 28-1 to 28-4 may be applied to the dummy components of plate portion 280A with or without modification.

[0564] Figure 23 This is an exploded perspective view of a camera module 20 according to another embodiment of the present invention. Figure 23 In and Figure 2 The same reference numerals in the accompanying drawings indicate the same parts, and a brief description of the same parts is given or omitted.

[0565] Reference Figure 23 The camera module 20 may include a lens module 400 and an image sensor unit 350.

[0566] Figure 23 The lens module 400 of the camera module 20 shown may or may not move along the optical axis, and may be fixed along the optical axis.

[0567] also, Figure 23 The lens module 400 shown may or may not move in a direction perpendicular to the optical axis OA, and may be fixed in a direction perpendicular to the optical axis OA.

[0568] Camera module 20 may also include Figure 2 The cover member 300 shown is shown.

[0569] For example, the lens module 400 may be coupled, attached, or fixed to the retainer 600 and the second circuit board 800. For example, the lower portion, lower end, or lower surface of the lens module 400 may be coupled, attached, or fixed to the upper surface of the retainer 600 or the upper surface of the second circuit board 800.

[0570] In addition, the lens module 400 can be connected, attached, or fixed to the cover member 300.

[0571] As camera technology advances, image resolution increases, leading to a corresponding increase in the size of image sensors. This increase in sensor size also increases the size of the lens module and the actuators used to move it. Consequently, not only the weight of the lens module itself increases, but also the weight of the other actuator components used to move it.

[0572] According to an embodiment of the present invention, autofocus is performed using an AF operation unit (or a first actuator) 100 that operates in a lens-shifting manner, and optical image stabilization (OIS) is performed using an image sensor unit (or a second actuator) 350 that operates in an image sensor-shifting manner, thereby improving the reliability of the camera device.

[0573] This implementation can perform 5-axis hand shake correction by using sensor displacement. For example, 5-axis hand shake can include two angular hand shakes (e.g., pitch and yaw), two displacement hand shakes (e.g., x-axis displacement and y-axis displacement), and one rotational hand shake (e.g., roll).

[0574] Figure 24 The illustration shows the arrangement of the magnet 23A, OIS coil unit 230-1, OIS position sensor 240a, holder 270 and first circuit board 250 according to an embodiment. Figure 25 The illustration shows the arrangement of the magnet 60, OIS coil unit 40, OIS position sensor 50, first circuit board 30 and holder 30 according to a comparative example.

[0575] exist Figure 25 In the comparative example shown, the OIS coil unit 40 and the OIS position sensor 50 may be disposed or mounted on a first surface (e.g., the upper surface) of the first circuit board 30. The retainer 20 may be disposed below the first circuit board 30.

[0576] The OIS coil unit 40 may have an opening or hole formed in its center, and the OIS position sensor 50 may be disposed in the opening or holder of the OIS coil unit 40. The OIS position sensor 50 may overlap with the OIS coil unit 40 in a direction perpendicular to the optical axis or in a direction parallel to the upper surface of the first circuit board 30. In other words, the OIS coil unit 50 and the OIS position sensor 50 may be arranged adjacent to the first surface (e.g., the upper surface) of the first circuit board 30.

[0577] When a drive signal is applied to the OIS coil unit 40 for OIS operation, a magnetic field can be generated from the OIS coil unit 40. To perform accurate OIS feedback operation, the OIS position sensor 50 must output an output corresponding to the detection result of the magnetic field generated solely by the magnet 60 fixed to the OIS fixed portion. However, due to the OIS coil unit 40 and the OIS position sensor 50... Figure 25 In the comparative example shown, the OIS position sensor 50 is arranged adjacent to each other, so the output of the OIS position sensor 50 may be greatly affected by the magnetic field generated by the OIS coil unit 40, thereby degrading the accuracy and reliability of the OIS feedback operation.

[0578] Furthermore, since the OIS position sensor 50 and the OIS coil unit 40 overlap each other in a direction perpendicular to the optical axis, the output of the OIS position sensor 50 may be greatly affected by the magnetic field generated by the OIS coil unit 40, thereby degrading the accuracy and reliability of the OIS feedback operation.

[0579] Figure 26 The diagram illustrates the frequency response characteristics of the drive signal input to the OIS coil unit 40 and the output of the OIS position sensor 50. Figure 26 In the diagram, the x-axis indicates frequency, and the y-axis indicates gain. g1 indicates the frequency response characteristics with respect to gain.

[0580] Reference Figure 26 Due to the influence of the magnetic field generated from the OIS coil unit 40, phenomenon 38A may occur, namely, the output of the OIS position sensor 50 decreases abnormally within a certain frequency range (e.g., 200Hz to 300Hz). Because of this phenomenon 38A, the reliability of the OIS feedback operation may deteriorate.

[0581] On the contrary, in Figure 24 In the embodiment shown, the OIS position sensor (e.g., 240a) may be disposed below the OIS coil unit (e.g., 230-1), and the OIS position sensor (e.g., 240a) and the OIS coil unit (e.g., 230-1) may not overlap each other in a direction perpendicular to the optical axis or in a direction parallel to the upper surface of the first circuit board 250.

[0582] For example, the distance D12 between magnet 23A and OIS coil unit 230-1 in the optical axis direction can be in the range of 0.05mm to 0.2mm. For example, D12 can be in the range of 0.1mm to 0.18mm. Specifically, D12 can be in the range of 0.12mm to 0.15mm.

[0583] Furthermore, for example, the length D13 of the OIS coil unit 230-1 in the optical axis direction can be in the range of 0.1 mm to 0.5 mm. Specifically, D13 can be in the range of 0.2 mm to 0.4 mm. More specifically, D13 can be in the range of 0.25 mm to 0.3 mm.

[0584] For example, the distance D11 between magnet 23A and OIS position sensor (e.g., 240a) in the optical axis direction can be in the range of 0.25 mm to 0.8 mm. Specifically, D11 can be in the range of 0.3 mm to 0.5 mm. More specifically, D11 can be in the range of 0.35 mm to 0.47 mm.

[0585] If D11 is greater than 0.8 mm, the strength of the magnetic field of magnet 23A detected by OIS position sensor 240a may be attenuated, and therefore the sensitivity of OIS position sensor 240a may be degraded.

[0586] If D11 is less than 0.25 mm, the length D13 of the OIS coil unit 230-1 in the optical axis direction must be reduced to prevent the OIS coil unit and the OIS position sensor from overlapping each other in the direction perpendicular to the optical axis. In this case, the electromagnetic force generated by the interaction between the OIS coil unit and the magnet may be reduced.

[0587] Meanwhile, the thickness D14 of the OIS position sensor 240a can be in the range of 0.2 mm to 0.4 mm. Specifically, D14 can be in the range of 0.23 mm to 0.3 mm.

[0588] For example, the thickness D15 of the upper plate of the retainer 270 can be in the range of 0.2 mm to 0.3 mm. Specifically, D15 can be in the range of 0.2 mm to 0.25 mm. For example, D15 can be the distance between the upper surface 42A of the retainer 270 and the second surface 36B of the lower surface 42B of the retainer 270.

[0589] For example, the distance between the lower surface (or end) of the OIS coil unit 230-1 and the upper surface of the OIS position sensor 240a (hereinafter referred to as the "first distance") can be in the range of 0.01 mm to 0.2 mm. Specifically, the first distance can be in the range of 0.02 mm to 0.1 mm. More specifically, the first distance can be in the range of 0.02 mm to 0.05 mm.

[0590] If the first distance is greater than 0.2 mm, the distance between the OIS position sensor 240a and the magnet 23A may increase excessively, and the output of the OIS position sensor 240a may decrease, thereby reducing sensitivity. If the first distance is less than 0.01 mm, the degree to which the output of the OIS position sensor 240a is affected by the magnetic field of the OIS coil unit 230-1 may increase with the increase of the first distance. However, the degree to which the output of the OIS position sensor 240a is affected by the magnetic field of the OIS coil unit 230-1 may be less than... Figure 26 The degree in the comparison example shown.

[0591] In another embodiment, the lower surface (or lower end) of the OIS coil unit 230-1 and the upper surface of the OIS position sensor 240a can be flush with each other, and the first distance can be zero.

[0592] Compared to the comparative example, the OIS position sensor 240a can be spaced further away from the OIS coil unit 230-1 and can avoid overlapping with the OIS coil unit 230-1 in the direction perpendicular to the optical axis. Therefore, according to the embodiment of the present invention, the influence of the magnetic field of the OIS coil unit 40 on the output of the OIS position sensor can be suppressed or reduced, and the accuracy and reliability of the OIS feedback operation can be ensured.

[0593] Figure 27 The diagram illustrates the following: Figure 24 The frequency response characteristics of the embodiment shown relate to the drive signal input to the OIS coil unit 230-1 and the output of the OIS position sensor 240a. Figure 27 In the diagram, the x-axis indicates frequency, and the y-axis indicates gain. g2 indicates the frequency response characteristics with respect to gain. In the following text, Figure 26 The frequency response in the case is referred to as "Case 1", and Figure 27 The frequency response characteristics in this case are referred to as "Case 2".

[0594] In case 2, phenomenon 38A, which occurred in case 1, is reduced or does not occur (38B).

[0595] In Case 1, due to the influence of the magnetic field of OIS coil unit 40, an abnormal decrease in gain (approximately -47dB) was observed in the 200Hz to 300Hz range. Therefore, the reliability of OIS feedback operation may be degraded.

[0596] Conversely, because the effect of the magnetic field of OIS coil unit 230-1 is weakened or attenuated, the gain in the 200Hz to 300Hz range is found to be significantly increased (approximately -37dB) compared to the gain in CASE1. In other words, normal frequency response characteristics can be obtained because the effect of the magnetic field of OIS coil unit 230-1 is weakened or attenuated.

[0597] According to an embodiment of the present invention, since the influence of the magnetic field of the OIS coil unit 230-1 on the output of the OIS position sensor 240a is reduced, the recognition rate of the OIS position sensor 240a relative to the magnetic field of the magnet 23A can be improved. Therefore, it is possible to prevent... Figure 26 The phenomenon 38A shown in the diagram occurs, and OIS feedback operation can be performed with high accuracy and reliability. Therefore, the reliability of camera module shake correction can be ensured.

[0598] right Figures 23 to 27 The description may be applied, with or without modification, to coil units 230-2 to 230-4, OIS position sensors 240b and 240c, and magnets 23B to 23D.

[0599] Figure 28 This is a perspective view of the camera module 1010 according to the embodiment. Figure 29 yes Figure 28 An exploded perspective view of the camera module 1010 shown. Figure 30 It is the removal of cover component 1300. Figure 28 The image shows an assembled 3D view of the camera module. Figure 31 yes Figure 29 An exploded perspective view of the AF operation unit 1100 shown. Figure 32 yes Figure 31 The diagram shows a perspective view of the coil holder 1110, sensing magnet 1180, balancing magnet 1185, first coil 1120, circuit board 1190, first position sensor 1170, and capacitor 1195. Figure 33 This is a perspective view of the coil frame 1110, housing 1140, and circuit board 1190. Figure 34 This is a bottom perspective view of the housing 1140, coil frame 1110, lower elastic member 1160, magnet 1130, and circuit board 1190.

[0600] Reference Figures 28 to 34The camera module 1010 may include an AF operation unit 1100 and an image sensor unit 1350.

[0601] The camera module 1010 may include at least one of a cover member 1300, a lens module 1400, and a base 1210. The cover member 1300 and the base 1210 may define a housing.

[0602] The AF operation unit 1100 can be connected to the lens module 1400 so that the lens module 1400 can move along the optical axis OA or in a direction parallel to the optical axis OA, and can perform the autofocus function of the camera module 1010.

[0603] Image sensor unit 1350 may include image sensor 1810. Image sensor unit 1350 can move image sensor 1810 in a direction perpendicular to the optical axis, and can tilt or rotate image sensor 1810 about the optical axis. Image sensor unit 1350 can be used to perform image stabilization correction for camera module 1010.

[0604] For example, the image sensor 1810 can rotate about at least one of the x-axis, y-axis, and z-axis.

[0605] For example, the image sensor 1810 can move along at least one of the x-axis, y-axis and z-axis directions.

[0606] For example, the image sensor 1810 may be tilted relative to at least one of the x-axis, y-axis, and z-axis.

[0607] The AF operation unit 1100 may alternatively be referred to as a "lens moving unit" or "lens moving device". Alternatively, the AF operation unit 1100 may alternatively be referred to as a "first actuator" or "AF drive unit".

[0608] For OIS (Optical Image Stabilization) operation, the image sensor 1810 can be moved by the image sensor unit 1350 instead of the lens module 1400 in a direction perpendicular to the optical axis.

[0609] The image sensor unit 1350 may alternatively be referred to as an "image sensor moving unit," "image sensor shifting unit," "sensor moving unit," or "sensor shifting unit." Alternatively, the image sensor unit 1350 may alternatively be referred to as a "second actuator" or "OIS driving unit."

[0610] Reference Figure 31 The AF operation unit 1100 may include a coil frame 1110, a first coil 1120, a magnet 1130, and a housing 1140.

[0611] The AF operation unit 1100 may also include an upper elastic member 1150 and a lower elastic member 1160.

[0612] For AF feedback operation, the AF operation unit 1100 may include a first position sensor 1170, a circuit board 1190, and a sensing magnet 1180. The AF operation unit 1100 may also include at least one of a balancing magnet 1185 and a capacitor 1195.

[0613] The coil holder 1110 can be disposed in the housing 1140 and can be moved along the optical axis OA or along a first direction (e.g., along the z-axis) by the electromagnetic interaction between the first coil 1120 and the magnet 1130.

[0614] The coil holder 1110 may have a hole to which the lens module 1400 is coupled or mounted. For example, the hole in the coil holder 1110 may be a through hole formed along the optical axis through the coil holder 1110, and may have a circular, elliptical, or polygonal shape, but is not limited thereto.

[0615] The lens module 1400 may include at least one lens and / or lens barrel.

[0616] For example, lens module 1400 may include one or more lenses and a lens barrel that receives the one or more lenses. However, the construction of the lens module is not limited to a lens barrel. The lens module can have any construction as long as it can support one or more lenses.

[0617] For example, the lens module 1400 can be threaded onto the coil holder 1110. Alternatively, the lens module 1400 can be attached to the coil holder 1110 via an adhesive (not shown). Light that has passed through the lens module 1400 can be radiated to the image sensor 1810 through the filter 1610.

[0618] The coil holder 1110 may include protrusions 1111 formed on its outer surface.

[0619] For example, although the protrusion 1111 may protrude in a direction parallel to a line perpendicular to the optical axis OA, this disclosure is not limited thereto.

[0620] The protrusion 1111 of the coil holder 1110 may correspond to the recessed portion 1025a in the housing 1140, and may be fitted or disposed in the recessed portion 1025a in the housing 1140 to suppress or prevent the coil holder 1110 from rotating out of a predetermined range about the optical axis. In addition, the protrusion 1111 may serve as a stop portion configured to move the coil holder 1110 within a predetermined range only along the optical axis direction (e.g., along the direction from the upper elastic member 1150 toward the lower elastic member 1160) in response to external impacts, etc.

[0621] The coil holder 1110 may have a first clearance groove 1112a formed in its upper surface to avoid spatial interference with the first connector 1153 of the upper elastic member 1150. Furthermore, the coil holder 1110 may have a second clearance groove 1112b formed in its lower surface to avoid spatial interference with the second frame connector 1163 of the lower elastic member 1160.

[0622] The coil holder 1110 may include a first connector 1116a configured to connect or secure to the upper resilient member 1150. For example, although the first connector 1116a of the coil holder 1110 may be configured to have a flat shape, this disclosure is not limited thereto. In another embodiment, the first connector 1116a may take the form of a protrusion or a groove.

[0623] The coil holder 1110 may include a second connector 1116b configured to connect and secure to the lower resilient member 1160. For example, although the second connector 1116b may be configured to have a flat shape, this disclosure is not limited thereto. In another embodiment, the second connector 1116b may take the form of a protrusion or a groove.

[0624] Reference Figure 32 The outer surface of the coil holder 1110 may have a groove formed therein, in which the first coil 1120 is seated, fitted, or disposed. The groove in the coil holder 1110 may have a shape corresponding to the shape of the first coil 1120, i.e., a closed curve shape (e.g., an annular shape).

[0625] The coil holder 1110 may have a first mounting groove therein, in which the sensing magnet 1180 is mounted, fitted, fixed, or disposed. Furthermore, the outer surface of the coil holder 1110 may have a second mounting groove therein, in which the balancing magnet 1185 is mounted, fitted, fixed, or disposed. For example, the first and second mounting grooves in the coil holder 1110 may be formed in the outer surfaces of the coil holder 1110 facing each other.

[0626] The first coil 1120 can be disposed at or connected to the coil holder 1110. For example, the first coil 1120 can be disposed on the outer surface of the coil holder 1110.

[0627] For example, although the first coil 1120 may surround the outer surface of the coil holder 1110 in the direction of rotation about the optical axis OA, the present disclosure is not limited thereto.

[0628] Although the first coil 1120 can be directly wound around the outer surface of the coil holder 1110, this disclosure is not limited thereto. In another embodiment, the first coil 1120 can be implemented as a coil loop or a corner loop and can be arranged around the coil holder 1110.

[0629] Power or drive signals can be supplied to the first coil 1120.

[0630] The power or drive signal supplied to the first coil 1120 can be a DC signal, an AC signal, or a signal containing both DC and AC components, and can be voltage-type or current-type.

[0631] When a drive signal (e.g., drive current) is supplied to the first coil 1120, an electromagnetic force can be generated through the electromagnetic interaction between the first coil 1120 and the magnet 1130, and the coil frame 1110 can move along the optical axis direction OA through the generated electromagnetic force.

[0632] The coil holder 1110 can move up or down from the initial position of the AF operating unit, which is referred to as bidirectional drive of the AF operating unit. Alternatively, the coil holder 1110 can move up (or forward) from the initial position of the AF operating unit, which is referred to as unidirectional drive of the AF operating unit.

[0633] At the initial position of the AF operation unit, the first coil 1120 can correspond to or overlap with the magnet 1130 disposed at the housing 1140 in a direction parallel to a line perpendicular to the optical axis OA and extending through the optical axis.

[0634] For example, the AF operation unit may include a coil holder 1110 and components coupled to the coil holder 1110 (e.g., a first coil 1120, a sensing magnet 1180, and a balancing magnet 1185). The AF operation unit may also include a lens module 1400.

[0635] The initial position of the AF operating unit can be the initial position of the AF operating unit when no power is applied to the coil 120, or the position of the AF operating unit caused by the elastic deformation of the upper elastic member 150 and the lower elastic member 160 due to the weight of the AF operating unit.

[0636] In addition, the initial position of the coil frame 110 can be the position of the AF operating unit when gravity acts in the direction from the coil frame 110 to the base 210 or when gravity acts in the direction from the base 210 to the coil frame 110.

[0637] The sensing magnet 1180 can provide a magnetic field detected by the first position sensor 1170, and the balancing magnet 1185 can be used to counteract the influence of the magnetic field of the sensing magnet 1180 and establish weight balance relative to the sensing magnet 1180.

[0638] The sensing magnet 1180 may alternatively be referred to as the "sensing magnet".

[0639] The sensing magnet 1180 can be located at the coil holder 1110, or it can be connected to the coil holder 1110.

[0640] The sensing magnet 1180 can be configured to face the first position sensor 1170.

[0641] The balancing magnet 1185 can be located at the coil holder 1110, or can be connected to the coil holder 1110. For example, the balancing magnet 1185 can be positioned opposite the sensing magnet 1180.

[0642] Although each of the sensing magnet 1180 and the balancing magnet 1185 can be a unipolar magnetized magnet with one N pole and one S pole, this disclosure is not limited thereto. In another embodiment, each of the sensing magnet 1180 and the balancing magnet 1185 can be a bipolar magnetized magnet with two N poles and two S poles, or a quadrupole magnetized magnet.

[0643] The sensing magnet 1180 can move along the optical axis together with the coil holder 1110, and the first position sensor 1170 can detect the strength or force of the magnetic field of the sensing magnet 1180 moving along the optical axis, and can output an output signal corresponding to the detection result.

[0644] For example, the strength or force of the magnetic field detected by the first position sensor 1170 can change based on the displacement of the coil holder 1110 in the optical axis direction. Therefore, the first position sensor 1170 can output an output signal proportional to the strength of the detected magnetic field, and the output signal from the first position sensor 1170 can be used to detect the displacement of the coil holder 1110 in the optical axis direction.

[0645] The housing 1140 houses the coil holder 1110 and supports the magnet 1130, the first position sensor 1170, and the circuit board 1190.

[0646] Reference Figure 31 , Figure 33 and Figure 34 The housing 1140 can be constructed as a hollow cylinder. For example, the housing 1140 can have a polygonal (e.g., rectangular or octagonal) or circular hole, and the hole in the housing 1140 can be a through hole formed through the housing 1140 along the optical axis.

[0647] The housing 1140 may include a side portion and a corner, the side portion corresponding to or facing the side plate 1302 of the cover member 1300, and the corner corresponding to or facing the corner of the cover member 1300.

[0648] To prevent direct collision with the inner surface of the upper plate 1301 of the cover member 1300, the housing 1140 may include a stop 1145 disposed on its upper portion, upper surface or upper end.

[0649] To prevent the lower surface of housing 1140 from colliding with the circuit board 1800 of image sensor 1350, housing 1140 may also include a stop 1147 protruding from its lower surface. Here, stop 1147 may alternatively be referred to as a "boss" or "protrusion".

[0650] Reference Figure 31 The housing 1140 may have a mounting recess (or seating recess) 1014a configured to receive the circuit board 1190 therein. The mounting recess 1014a may have a shape corresponding to the shape of the circuit board 1190.

[0651] Reference Figure 33 The housing 1140 may have an opening 141 through which terminals K1 to K6 of the terminal members 1195 of the circuit board 1190 are exposed. The opening 1141 may be formed in a side portion of the housing 1140.

[0652] The upper portion, upper end, or upper surface of the housing 1140 may be provided with at least one first connector, which will be connected to the first outer frame 1152 of the upper elastic member 1150.

[0653] The lower portion, lower end, or lower surface of the housing 1140 may be provided with a second connector that connects and secures to the second outer frame 1162 of the lower elastic member 1160. For example, each of the first and second connectors of the housing 1140 may have the shape of a protrusion, a groove, or a flat surface.

[0654] Magnet 1130 may be disposed at housing 1140. For example, magnet 1130 may be disposed at a side portion of housing 1140. Magnet 1130 may be an AF operating magnet for AF operation.

[0655] For example, although magnet 1130 may include a first magnet and a second magnet disposed on two side portions positioned opposite each other, this disclosure is not limited thereto. In another embodiment, magnet 1130 may be disposed at a corner of housing 1140.

[0656] Magnet 1130 may include two or more magnets.

[0657] At the initial position of the AF operation unit, the first magnet 1130 can be positioned at the housing 1140 to partially overlap with the first coil 1120 in a direction parallel to a line perpendicular to and extending through the optical axis OA.

[0658] Although each of the first magnet 1130-1 and the second magnet 1130-2 may be a unipolar magnetized magnet, this disclosure is not limited thereto. In another embodiment, each of the first magnet 1130-1 and the second magnet 1130-2 may be a bipolar magnetized magnet having two N poles and two S poles, or a quadrupole magnetized magnet.

[0659] The circuit board 1190 may be disposed at the housing 1140, and the first position sensor 1170 may be disposed at or mounted to the circuit board 1190. For example, the circuit board 1190 may be disposed in a mounting recess 1014a in the housing 1140, and the terminals of the circuit board 1190 may be exposed to the outside of the housing 1140 through an opening 1141 in the housing 1140.

[0660] The circuit board 1190 may include a terminal component (or terminal unit) 1095, which includes a plurality of terminals K1 to K6 electrically connected to an external terminal or external device, and the plurality of terminals K1 to K6 may be electrically connected to a first position sensor 1170.

[0661] The first position sensor 1170 can be disposed on the first surface of the circuit board 1190, and multiple terminals K1 to K6 can be disposed on the second surface of the circuit board 1190. Here, the second surface of the circuit board 1190 can be the surface opposite to the first surface of the circuit board 1190. For example, the first surface of the circuit board 1190 can be the surface of the circuit board 1190 facing the coil holder 1110 or the sensing magnet 1180.

[0662] For example, circuit board 1190 can be implemented as a printed circuit board or an FPCB.

[0663] The circuit board 1190 may include a circuit pattern or wiring (not shown) for electrically connecting the first terminal K1 to the sixth terminal K6 to the first position sensor 1170.

[0664] The first position sensor 1170 can detect the magnetic field or the intensity of the magnetic field of the sensing magnet 1180 mounted on the coil frame 1110 during the movement of the coil frame 1110, and can output an output signal corresponding to the detection result.

[0665] The first position sensor 1170 may be implemented as a single Hall sensor. The first position sensor 1170 may include two input terminals and two output terminals, with a drive signal or power supplied to the two input terminals and an induced voltage (or output voltage) output through the two output terminals.

[0666] For example, the drive signal can be supplied to the first position sensor 1170 through the first terminal K1 and the second terminal K2 of the circuit board 1190, and the output of the first position sensor 1170 can be output to the outside through the third terminal K3 and the fourth terminal K4.

[0667] The fifth terminal K5 and the sixth terminal K6 of the circuit board 1190 can be electrically connected to at least one of the upper elastic member 1150 and the lower elastic member 1160 in order to supply a drive signal to the first coil 1120.

[0668] In another embodiment, the first position sensor 1170 may be implemented as a driver IC including a Hall sensor. For example, the first position sensor 1170 may include a Hall sensor and a driver. Here, the first position sensor 1170 may include: first to fourth terminals, through which data is transmitted to and received from the outside using data communication via a protocol such as I2C communication; and fifth and sixth terminals, through which drive signals are directly supplied to the first coil 1120. The first to fourth terminals of the first position sensor 1170 may be electrically connected to the first terminals K1 to the fourth terminals K4 of the circuit board 1190. The fifth and sixth terminals of the first position sensor 1170 may be electrically connected to the first coil 1120 via at least one of the upper elastic member 1150 and the lower elastic member 1160 to supply drive signals to the first coil 1120.

[0669] Capacitor 1195 may be disposed on or mounted on a first surface of circuit board 1190. Capacitor 1195 may be configured to have a chip shape. Here, the chip may include: a first terminal corresponding to one end of capacitor 1195; and a second terminal corresponding to the other end of capacitor 1195. Capacitor 1195 may alternatively be referred to as a "capacitive element" or "energy storage device".

[0670] Capacitor 1195 can be electrically connected in parallel with the first terminal K1 and the second terminal K2 of circuit board 1190, supplying power (or drive signal) to position sensor 1170 from the outside through the first terminal K1 and the second terminal K2. Alternatively, capacitor 1195 can be electrically connected in parallel with the terminals of the first position sensor 1170, which are electrically connected to the first terminal K1 and the second terminal K2 of circuit board 1190.

[0671] Since capacitor 1195 is electrically connected in parallel with the first terminal K1 and the second terminal K2 of circuit board 1190, capacitor 1195 can be used as a smoothing circuit to eliminate the ripple components included in the power signals GND and VDD supplied from the outside to the first position sensor 1170, and thus can supply a stable and consistent power signal to the first position sensor 1170.

[0672] The upper elastic member 1150 can be connected to the upper part, upper end or upper surface of the coil frame 1110 and the upper part, upper end or upper surface of the housing 1140, and the lower elastic member 1160 can be connected to the lower part, lower end or lower surface of the coil frame 1110 or the upper part, upper end or upper surface of the housing 1140.

[0673] The upper elastic member 1150 and the lower elastic member 1160 can elastically support the coil frame 1110 relative to the housing 1140.

[0674] Although each of the upper elastic member 1150 and the lower elastic member 1160 is Figure 31 The implementation may be a single unit or a single structure, but this disclosure is not limited thereto.

[0675] In another embodiment, at least one of the upper and lower elastic members may include a plurality of elastic elements or springs that are electrically isolated or spaced apart from each other.

[0676] The upper elastic member 1150 may also include a first inner frame 1151 connected or fixed to the upper part, upper surface or upper end of the coil frame 1110, a first outer frame 1152 connected or fixed to the upper part, upper surface or upper end of the housing 1140, and a first frame connector 1153 connecting the first inner frame 1151 to the first outer frame 1152.

[0677] The lower elastic member 1160 may include a second inner frame 1161 connected or fixed to the lower portion, lower surface or lower end of the coil frame 1110, a second outer frame 1162 connected or fixed to the lower portion, lower surface or lower end of the housing 1140, and a second frame connector 1163 connecting the second inner frame 1161 to the second outer frame 1162.

[0678] Each of the first frame connector 1153 of the upper elastic member 150 and the second frame connector 1163 of the lower elastic member 160 can be bent or flexed (or can be formed into a curve) at least once in order to define a predetermined pattern.

[0679] Each of the upper elastic member 1150 and the lower elastic member 1160 may be made of a conductive material.

[0680] Reference Figure 31 and Figure 32 The first surface of the circuit board 1190 may be provided with two pads 1005a and 1005b, which are electrically connected to the fifth terminal K5 and the sixth terminal K6 of the circuit board 1190. The upper elastic member 1150 may include a first engagement portion 1004a, which is coupled or electrically connected to the first pad 1005a, and the lower elastic member 1160 may include a second engagement portion 1004b, which is electrically connected to the second pad 1005b. The first coil 1120 may be coupled to the upper elastic member 1150 at one end and to the lower elastic member 1160 at the other end.

[0681] In another embodiment, the upper elastic member 1150 or the lower elastic member 1160 may include two elastic members, and each of the two elastic members may be coupled or electrically connected to a corresponding one of the first and second pads of the circuit board 1190. The first coil 1120 may be electrically connected to the two elastic members.

[0682] Figure 35 yes Figure 29 The image sensor unit 1350 shown is a plan view. Figure 36 yes Figure 35 An exploded perspective view of the image sensor unit 1350 shown. Figure 37 This is a perspective view of the first circuit board 1800 and the housing 1450. Figure 38 yes Figure 36 The first circuit board 1800, housing 1450 and magnet 1023 shown are in perspective view. Figure 39a This is an exploded perspective view of the second circuit board 1900, the second coil 1230, the second position sensor 1240, the image sensor 1810, the support member 1220, and the retainer 1270. Figure 39b yes Figure 39a The plan view of the third circuit board 1250, the second coil 1230 and the second position sensor 1240 shown. Figure 40 yes Figure 36An exploded perspective view of the second circuit board 1900, image sensor 1810, support member 1220, retainer 1270 and connecting elastic member 1280 shown. Figure 41 yes Figure 35 The image sensor unit 1350 shown is a bottom view from which the bottom cover 1219 has been removed. Figure 42 yes Figure 42 A partially enlarged view of the connecting elastic member 1280 shown. Figure 43 This is a view illustrating the connecting springs 1001A, 1002A, 1003A, and 1004A that connect the elastic member 1280. Figure 44a yes Figure 28 The cross-sectional view of the camera module 1010 shown is taken along line AB. Figure 44b yes Figure 28 The cross-sectional view of the camera module 1010 shown is taken along line CD. Figure 45 yes Figure 28 The cross-sectional view of the camera module 1010 shown is taken along line IJ. Figure 46 yes Figure 35 The image sensor unit 1350 shown is a cross-sectional view taken along line EF. Figure 47 yes Figure 35 The image sensor 1801 shown is a cross-sectional view taken along line GH. Figure 48 This is a perspective view of the camera module 1010 with the bottom cover 1219 removed and cut open.

[0683] Reference Figures 35 to 48 The image sensor unit 1350 may include a first circuit board 1800, a magnet 1023, a second circuit board 1900, a second coil 1230, an image sensor 1810, a connecting elastic member 1280, and a support member 1220.

[0684] The image sensor unit 1350 may also include a housing 1450 configured to receive at least a portion of the first circuit board 1800.

[0685] The first circuit board 1800 can be used to supply signals to the image sensor unit 1350 from the outside or to output signals from the image sensor unit 1350 to the outside.

[0686] Reference Figure 36 and Figure 37The first circuit board may include: a first region 1801 corresponding to the AF operation unit 1100; a second region 1802 where a connector is disposed; and a third region 1803 connecting the first region 1801 to the second region 1802. The connector may be electrically connected to the second region 1802 of the second circuit board 1800 and may include a port configured to be electrically connected to an external device.

[0687] Although each of the first region 1801 and the second region 1802 of the second circuit board 1800 may include a flexible substrate and a rigid substrate, and the third region 803 may include a flexible substrate, this disclosure is not limited thereto. In another embodiment, at least one of the first region 1801 to the third region 1803 of the first circuit board 1800 may include at least one of a rigid substrate and a flexible substrate.

[0688] The first circuit board 1800 may include a hole 1800A, which corresponds to a hole in the coil holder 1110 of the AF operation unit 1100, the lens module 1400, and / or the image sensor 1810. For example, the hole 1800A in the first circuit board 1800 may be formed in a first region 1801.

[0689] Reference Figure 44a At least a portion of the lens module 1400 may extend through a hole 1800A in the first circuit board 1800 and may be positioned below the second surface 1044B of the first circuit board 1800.

[0690] Lens module 1400 can be disposed on second circuit board 1900. For example, lens module 1400 can be positioned on third circuit board 1250. For example, lens module 1400 can be positioned above hole 1501 in third circuit board 1250.

[0691] For example, the lower portion, lower end, or lower surface of the lens or lens barrel of the lens module 1400 may extend through the hole 1800A in the first circuit board 1800 and may be positioned below the second surface 1044B of the first circuit board 1800.

[0692] Furthermore, the lower portion, lower end, or lower surface of the lens or lens barrel of the lens module 1400 may be positioned on the first surface (e.g., the upper surface) 1051A of the second circuit board 1900 (or the third circuit board 1250).

[0693] Furthermore, the lower portion, lower end, or lower surface of the lens or lens barrel of the lens module 1400 can be positioned above the hole 1501 of the third circuit board 1250.

[0694] Although the first circuit board 1800 may be configured to have a polygonal shape (e.g., a quadrilateral, a square, or a rectangle) when viewed from above, this disclosure is not limited thereto. In another embodiment, the first circuit board 1800 may be configured to have a circular shape, etc. Furthermore, although the hole 1800A in the first circuit board 1800 may be configured to have a polygonal shape (e.g., a quadrilateral, a square, or a rectangle) when viewed from above, this disclosure is not limited thereto. In another embodiment, the hole 1800A may be configured to have a circular shape, etc.

[0695] The first circuit board 1800 may include at least one pad corresponding to the support member 1220. For example, at least one pad of the first circuit board 1800 may include a plurality of pads 1800B. Here, pad 1800B may alternatively be referred to as a “lead pattern”, “lead member” or “hole”.

[0696] The first circuit board 1800 may have at least one hole corresponding to the support member 1220, and the hole may be formed through the first circuit board 1800. For example, the first circuit board 1800 may have a plurality of through holes corresponding to a plurality of support members.

[0697] For example, each of the plurality of pads 1800B may have a hole formed therein, which is formed through the first circuit board 1800 in the direction of the optical axis OA. Each of the plurality of pads 1800B may surround the hole and may also include a lead pattern or conductive layer.

[0698] The support member 1220 may extend through a hole in the pad 1800B and may be soldered to the pad 1800B to electrically connect to a lead pattern disposed around the hole in the pad 1800B.

[0699] For example, multiple pads 1800B may be spaced apart from each other at regular intervals to surround the hole 1800A in the first circuit board 1800. For example, multiple pads 1800B may be located in the area between the hole 1800A in the first circuit board 1800 and the side of the first circuit board 1800.

[0700] The first circuit board 1800 may have at least one connection hole 1800C, which is configured to connect to a connection protrusion 1045B of the housing 1450. Although the connection hole 1800C may be a through hole formed in the first circuit board 1800 along the optical axis, this disclosure is not limited thereto. In another embodiment, the connection hole 1800C may be in the form of a recess.

[0701] For example, although the connection hole 1800C may be formed in a corner of the first circuit board 1800 that is diagonally opposite to each other, this disclosure is not limited thereto. In another embodiment, the connection hole may be positioned adjacent to a side of the circuit board 1800 or positioned between a side of the circuit board and the hole 1800A.

[0702] The first circuit board 1800 may include at least one terminal, for example, multiple terminals 1080A.

[0703] Multiple terminals 1080A may be formed on a first surface (e.g., upper surface) 44A of the first circuit board 1800. For example, multiple terminals 1080A may be disposed on a side of the first circuit board 1800 adjacent to a corner of the first circuit board 1800.

[0704] Each of the multiple terminals 1080A can be electrically connected to a corresponding terminal among terminals K1 to K6 of the circuit board 1190 via a conductive adhesive member or solder.

[0705] For example, the first circuit board 1800 may include a terminal member 1085 on which a plurality of terminals 1080A are formed. The terminal member 1085 may protrude from one side of the first circuit board 1800 in a direction perpendicular to the optical axis.

[0706] The image sensor unit 1350 may also include a housing 1450, in which the first circuit board 1800 is disposed, seated, or received.

[0707] The housing 1450 may receive at least a portion (e.g., a first region) of the first circuit board 1800. The housing 1450 may receive a magnet 1023 and may alternatively be referred to as a "magnet holder".

[0708] The housing 1450 may be disposed below the housing 1140 of the AF operation unit 1100 and may be connected to the housing 1140 of the image sensor unit 1350. For example, the upper portion, upper end, or upper surface of the housing 1450 may be connected to the lower portion, lower end, or lower surface of the housing 1140 of the AF operation unit 1100 via an adhesive member or a connecting structure.

[0709] Here, the connection structure may include a first connector disposed at the lower portion, lower end, or lower surface of the housing 1140 of the AF operation unit 1100, and a second connector disposed at the upper portion, upper end, or upper surface of the housing 1450 of the image sensor unit 1350. The first connector may be configured to have a protrusion shape or a groove (or hole) shape, and the second connector may be configured to have a groove (or hole) shape or a protrusion shape.

[0710] In another embodiment, the housing 1140 of the AF operation unit 1100 may be attached to the first circuit board 1800 via an adhesive member.

[0711] The housing 1450 may be located below the first circuit board 1800. For example, the AF operation unit 1100 may be located above the first circuit board 1800, and the housing 1450 may be located below the first circuit board 1800.

[0712] The housing 1450 may have a shape corresponding to or consistent with the first region 1801 of the first circuit board 1800. Although the housing 1450 may be configured to have a polygonal shape (e.g., a quadrilateral shape, a square shape, or a rectangular shape) when viewed from above, this disclosure is not limited thereto. In another embodiment, the housing 1450 may be configured to have a circular or elliptical shape.

[0713] The housing 1450 may have a hole 1450A therein. At least a portion of the hole 1450A in the housing 1450 may correspond to or overlap with a hole 1800A in the first circuit board 1800.

[0714] Although the hole 1450A in the housing 1450 may be configured to have a polygonal (e.g., quadrilateral or octagonal), circular, or cross-shaped shape when viewed from above, this disclosure is not limited thereto. The hole 1450A in the housing 1450 may be a through hole formed through the housing 1450 along the optical axis.

[0715] For example, housing 1450 may include a body 1042 configured to support at least a portion (e.g., first region 1801) of first circuit board 1800, a protrusion 1043 projecting from body 1042 along optical axis OA, and a hole 1450A formed through body 1042.

[0716] The housing 1450 may include at least one connecting protrusion 1045B that protrudes from the upper surface of the body 1042. For example, the connecting protrusion 1045B may protrude from the upper surface of the body 1044 in a direction toward the second surface (e.g., the lower surface) 1044B of the first circuit board 1800.

[0717] The housing 1450 may include clearance areas 1041 corresponding to a plurality of pads 1800B. The clearance areas 1041 may be formed at positions corresponding to the support member 1220 to avoid spatial interference between the housing 1450 and the support member 1220.

[0718] The protrusion 1043 of the housing 1450 may include a first opening 1046 configured to expose a portion of a first region 1801 of the first circuit board 1800 to the outside and a second opening 1047 configured to expose a terminal 1080A formed at the terminal member 1085 to the outside.

[0719] For example, the second opening 1047 in the housing 1450 can be formed in the optical axis OA direction at a position corresponding to the opening 1141 in the housing 1140 of the AF operation unit 1100.

[0720] Reference Figure 28 and Figure 37 The first circuit board 1800 may include a terminal 1080A corresponding to the terminals K1 to K6 of the circuit board 1190 of the AF operation unit 1100.

[0721] Each terminal 1080A of the first circuit board 1800 can be connected via solder or conductive components to a corresponding terminal among terminals K1 to K6 of the circuit board 1190 of the AF operation unit 1100.

[0722] Each terminal 1080A of the first circuit board 1800 can be electrically connected to a corresponding terminal among terminals K1 to K6 of the circuit board 1190 of the AF operation unit 1100. Drive signals or power can be supplied to the first position sensor 1170 through the first circuit board 1800, and the output of the first position sensor 1170 can be output to the first circuit board 1800. Furthermore, drive signals or power can be supplied to the first coil 1120 through the first circuit board 1800.

[0723] Reference Figure 28 The first circuit board 1800 may include a connector disposed in the second region 1802. For example, the connector may be disposed on a surface (e.g., the upper surface or the lower surface) of the second region 1802 of the first circuit board 1800.

[0724] The housing 1450 may include a seating portion 1008A, in which the magnet 1023 is received, disposed, or seated. The seating portion 1008A may be located at the body 1042 of the housing 1450.

[0725] For example, the seating portion 1008A may be formed in a corner of the housing 1450. For example, the seating portion 1008A may be configured to have a recessed groove from the lower surface of the body 1042, and may have a shape corresponding to the magnet 1023. For example, although the housing 1450 may include seating portions 1008A respectively formed in the four corners of the housing 1450, this disclosure is not limited thereto. In another embodiment, the housing 1450 may include a plurality of seating portions corresponding to the number of magnets 1023.

[0726] Magnet 1023 may be disposed at housing 1450. For example, although magnet 1023 may be disposed at a corner of housing 1140, this disclosure is not limited thereto. In another embodiment, magnet 1023 may be disposed at a side portion of housing 1450.

[0727] Magnet 1023 can be used to supply a magnetic field that interacts with the second coil 1230 to perform OIS (Optical Image Stabilization) for the purpose of hand shakiness correction.

[0728] For example, magnet 1023 may include a plurality of magnets 1023A to 1023D. Each of magnets 1023A to 1023D may be located at a corresponding corner of the corner of housing 1450.

[0729] Although each of the magnets 1023A to 1023D may be a unipolar magnetized magnet having one N pole and one S pole, this disclosure is not limited thereto. In another embodiment, each of the magnets 1023A to 1023D may be a bipolar magnetized magnet having two N poles and two S poles, or a quadrupole magnetized magnet.

[0730] For example, each of the four magnets 1023A to 1023D can be positioned at a corresponding corner of the four corners of the housing 1450. For example, although two magnets (e.g., 1023A and 1023B) positioned at two adjacent corners of the housing 1450 can be oriented perpendicular to each other, and two magnets (e.g., 1023A and 1023C; 1023B and 1023D) positioned at two corners of the housing 1450 facing each other diagonally can be oriented parallel to each other, this disclosure is not limited thereto.

[0731] For example, the internal portions of magnets 1023A to 1023D may have the same polarity. Furthermore, the external portions of magnets 1023A to 1023D may have the same polarity.

[0732] For example, the internal portion of each of magnets 1023A to 1023D can be magnetized as the N pole, and the external portion of each of magnets 1023A to 1023D can be magnetized as the S pole. In a modified version, the internal portion of each of magnets 1023A to 1023D can be magnetized as the S pole, and the external portion of each of magnets 1023A to 1023D can be magnetized as the N pole.

[0733] Reference Figures 36 to 40 The second circuit board may be disposed below the first circuit board 1800. The second circuit board 1900 may include a third circuit board 1250 and a fourth circuit board 1260. The fourth circuit board 1260 may alternatively be referred to as a "connector board".

[0734] For example, the third circuit board 1250 can be located below the first circuit board 1800.

[0735] The third circuit board 1250 may have a hole 1501 therein, the hole 1501 corresponding to or facing the hole in the coil holder 1110, the hole in the housing 1450 and / or the hole 1800A in the first circuit board 1800.

[0736] For example, the hole 1501 in the third circuit board 1250 can be a through hole formed through the third circuit board 1250 along the optical axis direction, and can be positioned at the center of the third circuit board 1250.

[0737] Although the shape of the third circuit board 1250, such as the outer periphery shape, may be a shape that is consistent with or corresponds to the upper surface of the base 1210 when viewed from above, such as a quadrilateral shape, this disclosure is not limited thereto.

[0738] Furthermore, although the hole 1501 in the third circuit board 1250 may have a polygonal shape, such as a quadrilateral shape, a circular shape, or an elliptical shape, this disclosure is not limited thereto.

[0739] The third circuit board 1250 may have a plurality of holes 1250A corresponding to the plurality of pads 1800B of the first circuit board 1800. Although the plurality of holes 1250A in the third circuit board 1250 may be through-holes formed in the third circuit board 1250 along the direction of the optical axis OA, this disclosure is not limited thereto. In another embodiment, the plurality of holes in the third circuit board 1250 may be clearance recesses or clearance portions configured to avoid spatial interference with the support member 1220.

[0740] For example, a plurality of holes 1250A in the third circuit board 1250 can be arranged to surround the holes 1501 in the third circuit board 1250 and spaced apart from each other at regular intervals. For example, a plurality of holes 1250A can be formed in the holes 1501 of the third circuit board 1250 and in the side portion of the third circuit board 1250.

[0741] The third circuit board 1250 may have at least one connection hole 1025A configured to connect to the protrusion 1273 of the retainer 1270. Although the connection hole 1025A in the third circuit board 1250 may be a through hole formed in the third circuit board 1250 along the optical axis, this disclosure is not limited thereto. In another embodiment, the connection hole 1025A may be in the form of a recess.

[0742] For example, although the connection hole 1025A may be formed in at least one corner of the third circuit board 1250, the present disclosure is not limited thereto. The connection hole 1025A may also be positioned adjacent to the side of the third circuit board 1250 or positioned between the side of the third circuit board 1250 and the hole 1501.

[0743] Reference Figure 40 The third circuit board 1250 may include a plurality of terminals 1251. For example, the plurality of terminals 1251 may be disposed on a second surface 1051B (e.g., the lower surface) of the third circuit board 1250 and spaced apart from each other. The second surface 1051B may be a surface opposite to the first surface 1051A. The number of terminals 1251 is not limited to this. Figure 40 The number shown, and may be greater than or less than Figure 40 The number shown.

[0744] For example, multiple terminals 1251 may be disposed in the region between a hole 1501 in the third circuit board 1250 and a side portion of the third circuit board 1250. For example, multiple terminals 1251 may be disposed closer to the hole 1501 in the third circuit board 1250 than to the multiple holes 1250A.

[0745] The third circuit board 1250 may include pads 1009A to 1009H configured to be electrically connected to the second coil 1230. Here, the pads may be alternatively referred to as “terminals” or “joint portions”. The pads 1009A to 1009H of the third circuit board 1250 may be electrically connected to a plurality of terminals 1251 of the third circuit board 1250.

[0746] The third circuit board 1250 can be a printed circuit board or a flexible printed circuit board (FPCB).

[0747] The second coil 1230 may be disposed on or mounted on the first surface (e.g., the upper surface) 1051A of the third circuit board 1250.

[0748] The second coil 1230 can be located below the housing 1450. The second coil 1230 can be located below the magnet 1023.

[0749] For example, the second coil 1230 can be disposed on the circuit board 1250 so that it corresponds to, faces or overlaps with the magnet 1023 disposed on the housing 1450 in the direction of the optical axis OA.

[0750] For example, the second coil 1230 may include multiple coil units 1230-1 to 1230-4. For example, the second coil 1230 may include four coil units.

[0751] Each of the multiple coil units 1230-1 to 1230-4 can face or overlap with a corresponding magnet among the magnets 1023A to 1023D disposed at the housing 1450 in the direction of the optical axis OA.

[0752] Although each coil unit in the coil unit may take the form of a coil block having a closed curve shape or a ring shape, this disclosure is not limited thereto. For example, each coil unit in the coil unit may include an FP (fine patterned) coil. In another embodiment, the coil unit may be formed on a circuit component other than the third circuit board 1250. In another embodiment, the coil unit may be formed directly in the circuit board 1250.

[0753] For example, four coil units 1230-1 to 1230-4 may be disposed or formed at the corners or corner areas of the quadrilateral circuit board 1250.

[0754] The second coil 1230 can be conductively connected to the third circuit board 1250, and thus power or a drive signal can be supplied to the second coil 1230 through the third circuit board 1250. The power or drive signal supplied to the second coil 1230 can be a DC signal, an AC signal, or a signal containing both DC and AC components, and can be voltage-type or current-type.

[0755] Here, current can be applied independently to at least three of the four coil units.

[0756] In the first embodiment, the second coil 1230 can be controlled through three channels.

[0757] For example, among the first to fourth coil units, only the first to third coil units can be electrically isolated from each other, and the fourth coil unit can be electrically connected in series to one of the first to third coil units. Here, three pairs of leads can be drawn from the second coil 1230, that is, a total of six leads.

[0758] In the second embodiment, the second coil 1230 can be controlled via four separate channels. Here, the four coil units can be electrically isolated from each other. A forward current and a reverse current can be selectively applied to each coil unit. Here, four pairs of leads can be drawn from the second coil 1230, i.e., a total of eight leads.

[0759] For example, two coil units 1230-1 and 1230-3 facing each other diagonally may extend or be oriented along a first axial direction (e.g., along the y-axis), and two other coil units 1230-2 and 1230-4 facing each other diagonally may extend or be oriented along a second axial direction (e.g., along the x-axis). Here, the first axial direction may be perpendicular to the second axial direction.

[0760] The long sides of the first coil unit 1230-1 and the third coil unit 1230-3 can be set to be parallel to each other. The long sides of the second coil unit 1230-2 and the fourth coil unit 1230-4 can be set to be parallel to each other. The long sides of the first coil unit 1230-1 and the second coil unit 1230-2 may not be set to be parallel to each other. Here, the long sides of the first coil unit 1230-1 and the second coil unit 1230-2 can be set such that imaginary lines extending from them intersect each other. For example, the direction along which the first coil unit 1230-1 is oriented and the direction along which the second coil unit 1230-2 is oriented can be perpendicular to each other.

[0761] In another embodiment, at least one of the four coil units can be driven separately from the remaining coil units. In another embodiment, the four coil units can be driven individually.

[0762] For example, the first coil unit 1230-1 may be connected at one end to the first pad 1009A and at the other end to the second pad 1009B. A first drive signal may be supplied to the first pad 1009A and the second pad 1009B to activate the first coil unit 1230-1.

[0763] The third coil unit 1230-3 can be connected at one end to the third pad 1009C and at the other end to the fourth pad 1009D. A second drive signal can be supplied to the third pad 1009C and the fourth pad 1009D to activate the third coil unit 1230-3.

[0764] The second coil unit 1230-2 can be connected at one end to the fifth pad 1009E and at the other end to the sixth pad 1009F. A third drive signal can be supplied to the fifth pad 1009E and the sixth pad 1009F to activate the second coil unit 1230-2.

[0765] The fourth coil unit 1230-4 can be connected at one end to the seventh pad 1009G and at the other end to the eighth pad 1009H. A fourth drive signal can be supplied to the seventh pad 1009G and the eighth pad 1009H to activate the fourth coil unit 1230-4.

[0766] In one implementation, two coil units facing each other diagonally (e.g., 1230-1 and 1230-3) can be directly connected in series and can be activated by a single drive signal. Meanwhile, two coil units facing each other diagonally (e.g., 1230-2 and 1230-4) can be electrically isolated from each other and can be activated individually by different drive signals.

[0767] In another embodiment, the four coil units 1230-1 to 1230-4 can be isolated from each other in terms of conductivity and can be activated individually by different individual drive signals.

[0768] By means of the interaction between magnets 1023A to 1023D and coil units 1230-1 to 1230-4 to which a drive signal is applied, the OIS movable unit of the image sensor 1810 can move along a second and / or a third direction, such as along the x-axis and / or y-axis, thereby performing hand shake correction. A description of the OIS movable unit will be given later.

[0769] The image sensor unit 1350 may also include a second position sensor 1240 for feedback of OIS operation.

[0770] The second position sensor 1240 can be disposed, coupled, or mounted to the first surface (e.g., the upper surface) 1051A of the third circuit board 1250. The second position sensor 1240 can detect the displacement of the OIS movable unit in a direction perpendicular to the optical axis OA, such as the displacement or tilt of the OIS movable unit in a direction perpendicular to the optical axis, or the rotation of the OIS movable unit about the optical axis.

[0771] Here, the first position sensor 1170 may be alternatively referred to as the "AF position sensor", and the second position sensor 1240 may be alternatively referred to as the "OIS position sensor".

[0772] The second position sensor 1240 may include one or more sensors 1240a, 1240b and 1240c.

[0773] For example, the second position sensor 1240 may include three sensors 1240a, 1240b and 1240c.

[0774] Each of the first to third sensors 1240a, 1240b, and 1240c can be implemented as a single Hall sensor, or as a driver IC including a Hall sensor. The description of the first position sensor 1170 can be applied to the first to third sensors 1240a, 1240b, and 1240c with or without modification.

[0775] Each of the first to third sensors 1240a, 1240b, and 1240c can be electrically connected to a predetermined corresponding terminal in terminal 262 of the first circuit board 1250. For example, a drive signal can be applied to each of the first to third sensors 1240a, 1240b, and 240c via terminal 1251, and the output signal of each of the first to third sensors can be output to other predetermined terminals in terminal 1251.

[0776] For example, since four coil units 1230-1 to 1230-4 are controlled by three channels, each of the first to third sensors 1240a, 1240b and 1240c can be set in one of the corresponding three coil units 1230-1 to 1230-3, and the remaining coil unit 1230-4 may not be equipped with a sensor.

[0777] For example, each of the coil units 1230-1 to 1230-4 can be configured as a ring having an opening, hole, or cavity therein. For example, each of the first to third sensors 1240a, 1240b, and 1240c can be disposed in the opening, hole, or cavity of a corresponding one of the coil units 1230-1 to 1230-3.

[0778] For example, coil units 1230-1 to 1230-4 and sensors 1240a, 1240b and 1240c can be disposed on the same flat surface as the first surface of the first circuit board 1900.

[0779] All motions of the image sensor 1810 in the x-axis and y-axis directions, as well as rotation of the image sensor 1810 about the z-axis, can be detected by three sensors 1240a, 1240b, and 1240c.

[0780] One of the three sensors 1240a, 1240b, and 1240c (e.g., 1240a) can detect the amount of motion and / or displacement of the OIS movable unit in the x-axis direction. Another of the three sensors 1240a, 1240b, and 1240c (e.g., 1240b) can detect the amount of motion and / or displacement of the OIS movable unit in the y-axis direction. The remaining one of the three sensors 1240a, 1240b, and 1240c can detect the amount of motion and / or displacement of the OIS movable unit in the x-axis and / or y-axis directions. The output of two or more of the three sensors 1240a, 1240b, and 1240c can be used to detect the rotational motion of the OIS movable unit about the z-axis.

[0781] When a drive signal (e.g., drive current) is applied to the first coil unit 1230-1 and the third coil unit 1230-3, but not to the second coil unit 1230-2 or the fourth coil unit 1230-4, the direction of the first electromagnetic force generated by the interaction between the first coil unit 1230-1 and the first magnet 1023A and the direction of the third electromagnetic force generated by the interaction between the third coil unit 1230-3 and the third magnet 1023C can be the same direction, for example, the x-axis direction (e.g., the +x-axis direction or the -x-axis direction), and the OIS movable unit can move (displace) along the x-axis direction (e.g., along the +x-axis direction or the -x-axis direction).

[0782] For example, when a drive signal (e.g., drive current) is applied to the second coil unit 1230-2 and the fourth coil unit 1230-4, but not to the first coil unit 1230-1 or the third coil unit 1230-3, the direction of the second electromagnetic force generated by the interaction between the second coil unit 1230-2 and the second magnet 1023B and the direction of the fourth electromagnetic force generated by the interaction between the fourth coil unit 1230-4 and the fourth magnet 1023D can be the same direction, for example, the y-axis direction (e.g., the +y-axis direction or the -y-axis direction), and the OIS movable unit can move (displace) along the y-axis direction (e.g., along the +y-axis direction or the -y-axis direction).

[0783] For example, when a drive signal is applied to each of the first coil unit 1230-1 to the fourth coil unit 1230-4, the directions of the first electromagnetic force and the third electromagnetic force are opposite to each other, the directions of the second electromagnetic force and the fourth electromagnetic force are opposite to each other, and the rotation direction of the OIS movable unit caused by the first electromagnetic force and the third electromagnetic force is the same as the rotation direction of the OIS movable unit caused by the second electromagnetic force and the fourth electromagnetic force, so that the OIS movable unit can rotate or roll about the optical axis or the z-axis.

[0784] When the second coil 1230 is controlled through three channels, the OIS movable unit can be rolled using the first coil unit 1230-1 and the third coil unit 1230-3 or the second coil unit 1230-2 and the fourth coil unit 1230-4.

[0785] exist Figure 39a and Figure 39b In the embodiment shown, the second position sensor 1240 may include three sensors 1240a, 1240b and 1240c.

[0786] For example, the first sensor 1240a can be disposed on the first surface (e.g., the upper surface) 1051A of the circuit board 1250 in the first coil unit 1230-1, the third sensor 1240c can be disposed on the first surface (e.g., the upper surface) 1051A of the circuit board 1250 in the third coil unit 1230-3, and the second sensor 1240b can be disposed on the upper surface of the circuit board 1250 in the second coil unit 1230-2.

[0787] For example, although the first sensor 1240a may not overlap with the first coil unit 1230-1 in the direction of the optical axis OA, the third sensor 1240c may not overlap with the third coil unit 1230-3 in the direction of the optical axis OA, and the second sensor 1240b may not overlap with the second coil unit 1230-2 in the direction of the optical axis OA, this disclosure is not limited thereto. In another embodiment, both the sensor and the coil unit may at least partially overlap each other in the direction of the optical axis.

[0788] The first sensor 1240a can overlap with the magnet 1023A in the optical axis direction, the third sensor 1240c can overlap with the magnet 1023C in the optical axis direction, and the second sensor 1240b can overlap with the magnet 1023B in the optical axis direction.

[0789] Furthermore, the first sensor 1240a may overlap with the first coil unit 1230-1 in a direction perpendicular to the optical axis OA, the third sensor 1240c may overlap with the third coil unit 1230-3 in a direction perpendicular to the optical axis OA, and the second sensor 1240b may overlap with the second coil unit 1230-2 in a direction perpendicular to the optical axis OA. In another embodiment, the sensors and coil units may not overlap each other in a direction perpendicular to the optical axis OA.

[0790] In another embodiment, the second position sensor 1240 may include a first sensor and a second sensor. In another embodiment, one of the first sensor 1240a and the third sensor 1240c may be omitted.

[0791] The image sensor unit 1350 may include at least one of a motion sensor 1820, a controller 1830, a memory 1512, and a capacitor 1514.

[0792] The motion sensor 1820, controller 1830, memory 1512 and capacitor 1514 can be set or mounted to one of the first circuit board 1800 and the third circuit board 1250.

[0793] For example, motion sensor 1820 and memory 1512 can be disposed on the second surface 1044B of the first circuit board 1800, and controller 1830 and capacitor 1514 can be disposed on the first surface 1051A of the third circuit board 1250.

[0794] The motion sensor 1820 can be electrically connected to the controller 1830 via wiring or circuit patterns formed on the third circuit board 1250.

[0795] The motion sensor 1820 can output information about the rotational angular velocity caused by the motion of the camera module 1010. The motion sensor 1820 can be implemented as a dual-axis or three-axis gyroscope sensor or an angular velocity sensor.

[0796] The memory 1512 can store code values ​​based on the displacement of the coil holder 1110 in the optical axis direction for use in AF feedback operation. Furthermore, the memory 1512 can store code values ​​based on the displacement of the OIS movable unit in the direction perpendicular to the optical axis direction for use in OIS feedback operation. Additionally, the memory 1512 can store algorithms or programs for the operation of the controller 1830.

[0797] Furthermore, memory 1512 can store the correction value CV. The correction value CV can be alternatively referred to as the "error correction value". A description of the correction value CV will be given later.

[0798] For example, although memory 1512 may be, for example, EEPROM (Electrically Erasable Programmable Read-Only Memory), this disclosure is not limited thereto.

[0799] The controller 1830 can be electrically connected to the first position sensor 1170 and the second position sensor 1240.

[0800] The controller 1830 can use the first code value stored in the memory 1512 to control the output signal of the first position sensor 1170 and the drive signal supplied to the first coil 1120, thereby performing feedback autofocus operation.

[0801] In addition, the controller 1830 can use the second code value stored in the memory 1512 to control the output signal supplied from the second position sensor 1240 and the drive signal supplied to the second coil 1230, thereby performing feedback OIS operation.

[0802] Although the controller 1830 may be of the type of driver IC, this disclosure is not limited thereto. For example, the controller 1830 may be electrically connected to terminal 1251 of the first circuit board 1250.

[0803] The fourth circuit board 1260 may be disposed below the third circuit board 1250. The fourth circuit board 1260 may alternatively be referred to as the "third circuit board".

[0804] Although the fourth circuit board 1260 may be configured to have a polygonal shape (e.g., a quadrilateral shape, a square shape, or a rectangular shape) when viewed from above, this disclosure is not limited thereto. In another embodiment, the fourth circuit board 1260 may be formed to have a circular or elliptical shape.

[0805] For example, the surface area of ​​the front surface of the fourth quadrilateral circuit board 1260 can be larger than the surface area of ​​the hole 1501 in the third circuit board 1250. For example, the lower part of the hole 1501 in the third circuit board 1250 can be closed or blocked by the fourth circuit board 1260.

[0806] When viewed from above or below, the outer surface (or outer side) of the fourth circuit board 1260 can be positioned between the outer surface (or outer side) of the third circuit board 1250 and the hole 1501 of the third circuit board 1250.

[0807] The fourth circuit board 1260 may include a mounting region 1260A in which the image sensor 1810 is disposed. For example, a first surface (e.g., the upper surface) 1060A of the fourth circuit board 1260 may have a mounting region 1260A in which the image sensor 1810 is disposed or coupled. For example, the mounting region 1260A may be configured to align with a hole 1501 in the third circuit board 1250.

[0808] Reference Figure 39a and Figure 39b The fourth circuit board 1260 may include a first terminal 1261 configured to be electrically connected to a terminal 1251 of the third circuit board 1250. The first terminal 1261 may alternatively be referred to as a "first terminal portion" or a "first terminal unit". For example, the first terminal 1261 may include a plurality of first terminals.

[0809] For example, the first terminal 1261 of the fourth circuit board 1260 can be connected to the terminal 1251 of the third circuit board 1250 via solder or conductive adhesive.

[0810] For example, the first terminal 1261 of the fourth circuit board 1260 may be disposed on the first surface (e.g., the upper surface) 1060A of the fourth circuit board 1260, and may correspond to, face or overlap with the terminal 1251 of the third circuit board 1250 in the optical axis direction.

[0811] Reference Figure 40 The fourth circuit board 1260 may include a second terminal 1262, which is electrically connected to the connecting elastic member 1280. The second terminal 1262 may alternatively be referred to as a "second terminal portion" or a "second terminal unit".

[0812] For example, the second terminal 1262 of the fourth circuit board 1260 can be connected via solder 1038 (see...). Figure 41 The second terminal 1262 may be connected to the connecting elastic member 1280 via a conductive adhesive component or a conductive adhesive component. For example, the second terminal 1262 may include a plurality of second terminals.

[0813] For example, the second terminal 1262 of the fourth circuit board 1260 may be disposed on the second surface (e.g., the lower surface) 1060B of the fourth circuit board 1260, and may correspond to, face, or overlap with the connecting spring 1281 of the connecting elastic member 1280 in the optical axis direction. The second surface 1060B may be the surface opposite to the first surface 1060A.

[0814] Although the fourth circuit board 1260 may be a printed circuit board or an FPCB, this disclosure is not limited thereto.

[0815] The retainer 1270 may be disposed below the third circuit board 1250 to support the third circuit board 1250. For example, the second surface 1051B of the third circuit board 1250 may contact the upper surface of the retainer 1270.

[0816] For example, the retainer 1270 may be disposed between the third circuit board 1250 and the connecting elastic member 1280.

[0817] The retainer 1270 may include a protrusion 1276 projecting from its upper surface toward the third circuit board 1250. The protrusion 1276 may be used to support a lateral side surface of the third circuit board 1250, or may serve as an assembly guide configured to allow the third circuit board 1250 to be easily set or seated in the retainer 1270. The protrusion 1276 may alternatively be referred to as a “guide portion” or a “guide protrusion”.

[0818] The protrusion 1276 can contact the outer surface of the third circuit board 1250 while the third circuit board 1250 is seated on the retainer 1270. For example, the protrusion 1276 may include a plurality of (e.g., four) protrusions, and the plurality of protrusions 1276 may contact all four outer surfaces of the third circuit board 1250.

[0819] For example, although protrusion 1276 is in Figure 39a The image is shown as being formed on the outer surface of the sides of the retainer 1270 facing each other, but the present disclosure is not limited thereto.

[0820] While the outer periphery of the retainer 1270 may have a quadrilateral shape, such as a square or a rectangle, when viewed from above or below, this disclosure is not limited thereto. In another embodiment, the outer periphery of the retainer 1270 may have a circular or elliptical shape.

[0821] The retainer 1270 may include a protrusion 1273 corresponding to or facing a connection hole 1025A in the third circuit board 1250. The protrusion 1273 on the retainer 1270 may protrude from a first surface 1070A of the retainer 1270 and may be coupled to the connection hole 1025A in the third circuit board 1250. Therefore, the retainer 1270 and the third circuit board 1250 can be coupled to each other. The first surface 1070A of the retainer 1270 may be a surface facing a second surface 1060B of the third circuit board 1250.

[0822] The retainer 1270 may have a hole 1071 corresponding to the fourth circuit board 1260.

[0823] Although the hole 1071 in the retainer 1270 may have a quadrilateral shape, such as a square or rectangular shape, this disclosure is not limited thereto. In another embodiment, the hole 1071 may have a circular or elliptical shape.

[0824] For example, although the hole 1071 in the retainer 1270 may have a shape that is consistent with or the same as that of the fourth circuit board 1260, this disclosure is not limited thereto. The size or surface area of ​​the hole 1071 in the retainer 1270 may be larger than the size or surface area of ​​the first surface 1060A or the second surface 1060B of the fourth circuit board 1260. The fourth circuit board 1260 may be disposed inside the hole 1071 in the retainer 1270.

[0825] For example, the retainer 1270 can be shaped to surround the fourth circuit board 1260.

[0826] The retainer 1270 may have a plurality of holes 1270A corresponding to a plurality of holes 1250A in the third circuit board 1250. Although the plurality of holes 1270A in the retainer 1270 may be through holes formed in the retainer 1270 along the direction of the optical axis OA, this disclosure is not limited thereto. In another embodiment, the plurality of holes 1270A in the retainer 1270 may be clearance grooves or clearance portions to avoid spatial interference with the support member 1220.

[0827] For example, a plurality of holes 1270A in the retainer 1270 may be configured to surround the hole 1071 in the retainer 1270 and be spaced apart from each other at regular intervals. For example, the plurality of holes 1270A may be located in the region between the hole 1071 in the retainer 1270 and the side portion of the retainer 1270.

[0828] Reference Figure 40 The second surface 1070B of the retainer 1270 may be provided with a protrusion 1275. The protrusion 1275 of the retainer 1270 may protrude from the second surface 1070B of the retainer 1270 toward the bottom of the base 1210.

[0829] The protrusion 1275 of the retainer 1270 may protrude further than the connecting elastic member 1280 toward the bottom of the base 1210. Alternatively, the protrusion 1275 of the retainer 1270 may protrude further than the solder 1902 that connects the connecting elastic member 1280 to the support member 1220 toward the bottom of the base 1210.

[0830] For example, the first distance in the optical axis direction between the protrusion 1275 of the retainer 1270 and the bottom of the base 1210 can be less than the second distance between the connecting elastic member 1280 and the bottom of the base 120. For example, the first distance can be less than the third distance between the solder 1902 and the bottom of the base 120.

[0831] The protrusion 1275 can serve as a stop, which is configured to prevent the second surface 1070B of the retainer 1270, the connecting elastic member 1280 and / or the solder 1902 from directly colliding with the bottom of the base 1210.

[0832] For example, although the protrusion 1275 may be located at the corner of the second surface 1070B of the retainer 1270, this disclosure is not limited thereto. In another embodiment, the protrusion 1275 may be located on the side of the second surface 1070B of the retainer 1270, or between the side of the second surface 1070B of the retainer 1270 and the hole 1071.

[0833] Reference Figure 42 The retainer 1270 may have at least one groove 1272 recessed from its second surface 1070B.

[0834] For example, the retainer 1270 may have multiple grooves (e.g., four grooves) corresponding to multiple sides (e.g., four side faces) of the second surface 1070B.

[0835] Each groove in the groove 1272 may include: a bottom 1272a having a height difference relative to the second surface 1070B in the direction of the optical axis OA; and a sidewall 1272b connecting the bottom 1272a to the second surface 1070B.

[0836] For example, the bottom 1272a of the groove 1272 can be positioned closer to the first surface 1070A of the retainer 1270 than to the second surface 1070B of the retainer 1270.

[0837] A plurality of holes 1270A in the retainer 1270 may overlap with a groove 1272 in the retainer 1270 in the optical axis direction. For example, each of the plurality of holes 1270A may have an opening formed in the bottom 1272a of the groove 1272. The opening of each of the plurality of holes 1270A formed in the bottom 1272a may have a height difference relative to the second surface 1070B of the retainer 1270 in the optical axis direction.

[0838] For example, multiple holes 1270A may be formed through the bottom 1272a of the groove 1272 in the retainer 1270.

[0839] Here, the groove 1272 in the retainer 1270 can be used to avoid spatial interference between the connecting elastic member 1280 and the retainer 1270, so as to allow easy elastic deformation when the connecting elastic member 1280 elastically deforms during OIS operation.

[0840] The connecting elastic member 1280 can be coupled to the retainer 1270. The connecting elastic member 1280 can be used to allow movement of the OIS movable unit and to allow the transmission of conductive signals. For example, the connecting elastic member 1280 can electrically connect the support member 1220 to the terminal 1262 of the fourth circuit board 1260.

[0841] For example, the connecting elastic member 1280 may be disposed below the retainer 1270.

[0842] The connecting elastic member 1280 can be connected to the second surface 1070B of the retainer 1270 via an adhesive member or the like.

[0843] The connecting elastic member 1280 can electrically connect the support member 1220 to the fourth circuit board 1260, and may include an elastically deformable portion. The elastically deformable portion of the connecting elastic member 1280 can be connected to the support member 1220.

[0844] The connecting elastic member 1280 may include a connecting spring 1281 corresponding to the support member 1220 (see [link]). Figure 40 ). Figure 18 The description of the connecting spring 1281 shown can be applied to the connecting spring 1281 with or without modification.

[0845] For example, the connecting elastic member 1280 may include a plurality of connecting springs 1281. The plurality of connecting springs 1281 may correspond to a corresponding support member 1220. The plurality of connecting springs 1281 may be configured to be electrically isolated or spaced apart from each other.

[0846] Each of the connecting springs 1281 may include a first connector 31 connected to a second terminal 1262 of a fourth circuit board 1260, a second connector 32 connected to a support member 1220, and a connector 33 connecting the first connector 31 to the second connector 32.

[0847] The first connector 31 connecting the spring 1281 can be supported by the retainer 1270. For example, the first connector 31 can be disposed on the second surface 1070B of the retainer 1270 and can be supported by the second surface 1070B of the retainer 1270.

[0848] For example, the first connector 31 may be disposed on the second surface 1070B of the retainer 1270 adjacent to at least one recess 1272 in the retainer 1270.

[0849] For example, the first connector 31 may include a first part 31a and a second part 31b, the first part 31a being supported by a retainer 1270 and connected to a connector 33, and the second part 31b being connected to the first part 31a and connected to a second terminal 1262 of a fourth circuit board 1260.

[0850] For example, a first portion 31a of the first connector 31 may overlap with the second surface 1070B of the retainer 1270 in the optical axis direction, and a second portion 31b may not overlap with the second surface 1070B of the retainer 1270 in the optical axis direction. At least a portion of the second portion 31b of the first connector 31 may overlap with the second terminal 1252 of the fourth circuit board 1260 in the optical axis direction. For example, the second portion 31b may protrude in a direction from the inner surface of the retainer 1270 toward the second terminal 1252 of the fourth circuit board 1260.

[0851] The second connector 32 may be attached to one end (e.g., the lower end) of the support member 1220 via solder 1902 or a conductive adhesive member. For example, the second connector 32 may be configured to overlap with a hole 1270A in the retainer 1270 in the optical axis direction. The second connector 32 may have a hole 32A through which the support member 1220 extends.

[0852] One end of the support member 1220 passing through the hole 32A in the second connector 32 can be directly connected to the second connector 32 via a conductive adhesive member or solder 1902, thereby allowing the second connector 32 to be electrically connected to the support member 1220.

[0853] For example, the second connector 32 is a region where solder 1902 is configured to connect to the support member 1220. The second connector 32 may include a hole 32A and a region surrounding the hole 32A. Although the second connector 32 may be configured to have a circular shape, this disclosure is not limited thereto. In another embodiment, the second connector 32 may be configured to have a polygonal shape (e.g., a quadrilateral shape) or an elliptical shape.

[0854] The second connector 32 and connector 33 may overlap with the groove 1272 in the retainer 1270 in the optical axis direction. For example, the second connector 32 and connector 33 may be disposed in the groove 1272 in the retainer 1270. For example, the second connector 32 and / or connector 33 may be disposed spaced apart from the retainer 1270.

[0855] For example, the connecting elastic member 1280 may include four groups 1001A, 1002A, 1003A and 1004A, which correspond to the four side portions (lateral side surfaces) of the fourth circuit board 1260 or the four side portions (or lateral side surfaces) of the retainer 1270.

[0856] Each of the multiple groups 1001A, 1002A, 1003A and 1004A may include multiple connecting springs 1001-1 to 1001-9, 1002-1 to 1002-9, 1003-1 to 1003-9 and 1004-1 to 1004-9.

[0857] Furthermore, the terminals 262 of the fourth circuit board 1260 can be classified into multiple groups corresponding to groups 1001A to 1004A of the connecting elastic members 1280. Each of the multiple groups of the fourth circuit board 1260 may include multiple terminals P1 to P9, S1 to S9, R1 to R9, or Q1 to Q9.

[0858] For example, each of the multiple terminals P1 to P9, S1 to S9, R1 to R9 and Q1 to Q9 of the fourth circuit board 1260 can be soldered to a corresponding connecting spring among the multiple connecting springs 1001-1 to 1001-9, 1002-1 to 1002-9, 1003-1 to 1003-9 and 1004-1 to 1004-9.

[0859] right Figure 15 The description of groups 1A, 2A, 3A, and 4A of the connecting elastic members 280 shown can be applied with or without modification. Figure 43 The multiple groups 1001A, 1002A, 1003A and 1004A of the connecting elastic member 1280 shown.

[0860] Reference Figure 41 The connecting elastic member 1280 may further include a body 1085A and an insulating member 1285 including an extension 1085B. The connecting elastic member 1280 may also include one or more dummy members (or dummy patterns) 1028-1 to 1028-4. The description of the insulating member 285 and the dummy members 28-1 to 28-4 may be applied to the insulating member 1285 and the dummy members 1028-1 to 1028-4 with or without modification.

[0861] For example, insulating member 1285 may support connecting springs 1001-1 to 1001-9, 1002-1 to 1002-9, 1003-1 to 1003-9 and 1004-1 to 1004-9, and may be coupled or attached to the second surface 1070B of retainer 1270.

[0862] For example, the insulating member 1285 may have holes or cavities therein. The holes or cavities in the insulating member 1285 may correspond, overlap or align with holes 1800A in the first circuit board 1800, holes 1501 in the third circuit board 1250 and holes 1071 in the retainer 1270 in the optical axis direction.

[0863] For example, the body 1085A may have a hole or cavity that corresponds, overlaps or aligns with at least one of the holes 1800A in the first circuit board 1800, 1501 in the third circuit board 1250 and 1071 in the holder 1270 in the optical axis direction.

[0864] The extension 1085B can extend from the body 1085A toward the outer surface of the retainer 1270. For example, the extension 1085B can be configured to surround the groove 1272 in the retainer 1270.

[0865] The support member 1220 can electrically connect the first circuit board 1800 to the connecting elastic member 1280.

[0866] The support member 1220 may include multiple groups corresponding to groups 1001A, 1002A, 1003A, and 1004A of the connecting elastic member 1280. Each of the multiple groups of the support member may include multiple support members (or wiring).

[0867] For example, support member 1220 may include multiple support members corresponding to multiple connecting springs. Support member 1220 may alternatively be referred to as "wiring".

[0868] The support member 1220 can be connected to the first circuit board 1800 at one end and to the second connector 32 of the connecting spring 1281 at the other end.

[0869] For example, one end of the support member 1220 may extend through a hole 1800B in the first circuit board 1800 and may be coupled to a first surface (e.g., upper surface) 1044A of the first circuit board 1800 via a first solder 1901, and the other end of the support member 1220 may extend through a hole 32A in a second connector 32 connecting the spring 1281 and may be coupled to a lower portion or lower surface of the second connector 32 via the first solder 1901. For example, one end of the support member 1220 may be coupled and electrically connected to a terminal 1800B of the first circuit board 1800.

[0870] The support member 1220 can extend through the clearance area 1041 of the housing 1450, the hole 1250A in the third circuit board 1250 and the hole 270A in the retainer 1270, and can avoid spatial interference with the housing 1450, the second circuit board 1250 and the retainer 1270.

[0871] The support member 1220 may be implemented as a conductive member that provides elastic support, such as a suspension wire, leaf spring, or coil spring.

[0872] The image sensor unit 1350 may also include a filter 1610. The image sensor unit 1350 may also include a filter holder 1600, in which the filter 1610 is disposed, seated, or received. The filter holder 1600 may alternatively be referred to as a "sensor base".

[0873] The filter 1610 can be used to prevent light of a certain frequency range from passing through the lens barrel 1400 from incident on the image sensor 1810. Figure 9 The description of the filter shown can be applied to filter 1610 with or without modification.

[0874] For example, the filter holder 1600 may be positioned below the AF operation unit 1100. For example, the filter holder 1600 may be positioned above the fourth circuit board 1260.

[0875] The filter holder 1600 can be coupled to the area of ​​the fourth circuit board located around the image sensor 1810 and can be exposed through holes 1800A in the first circuit board 1800 and holes 1501 in the third circuit board 1250. For example, the filter holder 1600 can be seen through holes 1800A in the first circuit board 1800 and holes 1501 in the third circuit board 1250.

[0876] For example, a filter holder may be attached to an area of ​​the first surface (e.g., the upper surface) of the fourth circuit board 1260 located around the seating area 1260A. Although the seating area 1260A may be... Figure 39a The fourth circuit board 1260 has the same surface as the first surface, but this disclosure is not limited thereto. In another embodiment, the seating area 1260A may be a recess or a protrusion.

[0877] The hole 1501 in the third circuit board 1250 can expose the filter holder 1600 disposed on the fourth circuit board 1260, and the filter 1610 disposed on the filter holder 1600 through the hole.

[0878] The filter holder 1600 may have an aperture 1061A formed in a region for mounting or setting the filter 1610, so as to allow light that has passed through the filter 1610 to be incident on the image sensor 1810. The aperture 1061A in the filter holder 1600 may be in the form of a through-hole formed in the filter holder 1600 along the optical axis. For example, the aperture 1061A in the filter holder 1600 may be formed through the center of the filter holder 1600 so as to correspond to or face the image sensor 1810. The filter holder 1600 may have a mounting portion 1500 recessed from its upper surface to receive the filter 1610 therein. The filter 1610 may be disposed, mounted, or installed in the mounting portion 1500. The mounting portion 1500 may be configured to surround the aperture 1061A. In another embodiment, the seating portion 1500 of the filter holder 1600 may be configured to have a protrusion extending from the upper surface of the filter 1610.

[0879] The image sensor 1350 may also include an adhesive member 1612 disposed between the filter 1610 and the mounting portion 1500. Therefore, the filter 1610 can be coupled or attached to the filter holder 1600 via the adhesive member 1612. For example, the adhesive members 1612 and 1611 may be epoxy resin, thermosetting adhesive, or UV-curing adhesive.

[0880] The camera module 1010 may also include a cover member 1300 and a base 1210 to receive the AF operation unit 1100 and the image sensor unit 1350 therein, protect the AF operation unit 1100 and the image sensor unit 1350 from external impacts, and prevent the introduction of foreign objects from the outside.

[0881] The cover member 1300 can be configured as a box, open at its lower surface and including a top plate 1301 and a side plate 1302. The lower portion of the side plate 1302 of the cover member 1300 can be connected to the base 1210. The top plate 1301 of the cover member 1300 can be configured to have a polygonal shape, for example, a quadrilateral or an octagonal shape.

[0882] The cover member 1300 may have a hole 1303 formed in its upper plate 1301 through which a lens (not shown) connected to the coil holder 1110 is exposed to external light. One of the side plates 1302 of the cover member 1300 may be provided with a hole 1304 through which the terminal members 1905 of the circuit board 1190 are exposed.

[0883] The base 1210 may be disposed below the retainer 1270. The base 1210 may have a shape that is consistent with or corresponds to the cover member 1300, for example, a quadrilateral shape.

[0884] For example, although the base 1210 may have a hole in the form of a through hole formed through the base 1210 in the optical direction, the hole may be omitted in another embodiment.

[0885] The base 1210 may have a stepped portion 1211 (see...) Figure 44a When the cover member 1300 is adhesively fixed to the stepped portion 1211, adhesive is applied to the stepped portion. Here, the stepped portion 1211 can guide the side plate 1302 of the cover member 1300 connected to the stepped portion 1211. The stepped portion 1211 of the base 1210 can be attached or fixed to the lower end of the side plate 1302 of the cover member 1300 using adhesives or the like.

[0886] Although the lower portion or lower side of the base 1210 may be closed or blocked by the bottom cover 1219, this disclosure is not limited thereto. In another embodiment, the bottom cover 1219 may be omitted.

[0887] The fixed and movable portions of the image sensor unit 1350 according to the embodiment will be described in relation to OIS operation.

[0888] The image sensor unit 1350 may include a fixed portion, a movable portion (or moving portion), and resilient support members 1220 and 1280 configured to connect and connect the fixed portion to the movable portion. The movable portion may alternatively be referred to as the "OIS movable portion" (or "OIS moving portion"). The OIS movable portion may be movable relative to the fixed portion in a direction perpendicular to the optical axis OA.

[0889] With the aid of elastic support members 1220 and 1280, the movable part of the OIS, which is disposed below the fixed part of the OIS, can be positioned at a predetermined distance from the fixed part. In other words, with the movable part suspended from the fixed part via the support member 1220, the movable part can be moved relative to the fixed part by the electromagnetic force generated by the interaction between the magnet 1023 and the coil.

[0890] One end of the elastic support members 1220 and 1280 (e.g., one end of support member 1220) can be connected to the first circuit board 1800, and the other end of the elastic support members 1220 and 1280 (e.g., the first connector 31 connecting spring 1281) can be connected to the second circuit board 1900, for example, the fourth circuit board 1260.

[0891] The first circuit board 1800 can be electrically connected to the second circuit board 1900, such as the fourth circuit board 1260, via the elastic support members 1220 and 1280.

[0892] The movable part of the OIS can move relative to the fixed part in a direction perpendicular to the optical axis by means of the electromagnetic force generated by the interaction between the second coil 1230 and the magnet 1023.

[0893] For example, through the interaction between magnet 1023 and coil 1230, image sensor 1810 can be shifted or tilted in a direction perpendicular to optical axis OA, or it can be rotated about optical axis OA. For example, the optical axis direction can be a direction perpendicular to a surface of image sensor 1810. For example, a surface of image sensor 1810 can be the upper surface of image sensor 1810. Alternatively, a surface of image sensor 1810 can be a surface corresponding to or facing the lower surface of lens module 1400 or filter 1610. For example, a surface of image sensor 1810 can be an active area.

[0894] With the help of the support member 1220 and the connecting elastic member 1280, the OIS movable unit can be elastically supported and can move in a direction perpendicular to the optical axis.

[0895] The fixing portion may include a first circuit board 1800, a housing 1450, and a magnet 1023. Furthermore, the fixing portion may include at least one of a base 1210, a cover member 1300, and a bottom cover 1219. Additionally, the fixing portion may include elements connected to the first circuit board 1800, such as a motion sensor 1820 and a capacitor.

[0896] The movable part of the OIS may include a third circuit board 1250, a second coil 1230, a fourth circuit board 1260, and an image sensor 1810. Additionally, the movable part of the OIS may include a retainer 1270.

[0897] Furthermore, the movable portion of the OIS may include components connected to the third circuit board 1250, such as a second position sensor 1240, a motion sensor 1820, a controller 1830, a memory 1512, and a capacitor 1514. Additionally, the movable portion of the OIS may include a filter holder 1600 and a filter 1610.

[0898] For example, the movable part of the OIS may include a fourth circuit board 1260 connected to the connecting elastic member 1280, an image sensor 1810 and a third circuit board 1260 connected to the fourth circuit board 1260, and a retainer 1270 connected to the third circuit board 1250, and may be elastically supported by the support member 1220 and the connecting elastic member 1280.

[0899] The magnet 1023 can be disposed at the fixed part, and the second coil 1230 can be disposed at the OIS movable unit. The OIS movable part can move or tilt relative to the fixed part by means of the electromagnetic force generated by the interaction between the magnet 1023 and the second coil 1230.

[0900] Reference Figure 46 and Figure 47 In order to allow the movable part of the OIS to move or tilt relative to the fixed part by means of the electromagnetic force generated by the interaction between the magnet 1023 and the second coil 1230, the movable part of the OIS can be spaced apart from the fixed part of the OIS.

[0901] For example, the retainer 1270, the second circuit board 1900, and the image sensor 1810 may be spaced apart from the first circuit board 1800, the housing 1450, and the base 1210.

[0902] For example, at the initial position of the movable part of the OIS, the outer surface of the retainer 1270 can be spaced apart from the inner surface of the base 1210 by a predetermined distance d1.

[0903] Furthermore, at the initial position of the movable OIS portion, the lower surfaces of the retainer 1270 and the fourth circuit board 1260 may be spaced apart from the front (or upper) surface of the base 1210 by a predetermined distance H1. For example, at the initial position of the movable OIS portion, the lower surfaces of the retainer 1270 and the fourth circuit board 1260 may be spaced apart from the front (or upper) surface of the bottom cover 1219.

[0904] For example, at the initial position of the OIS movable portion, the solder 1902 may be spaced apart from the front surface (or upper surface) of the bottom cover 1219 by a predetermined distance H2. Furthermore, at the initial position of the OIS movable portion, the solder 1902 may be spaced apart from the front surface (or upper surface) of the base 1210.

[0905] The initial position of the OIS movable unit can be the initial position of the OIS movable part when no power or drive signal is applied to the second coil 1230, or the position of the OIS movable part caused by the elastic deformation of the support member 1220 and the connecting elastic member 1280 solely due to the weight of the OIS movable part.

[0906] In addition, the initial position of the movable part of the OIS can be the position of the movable part of the OIS when gravity acts in the direction from the first circuit board 1800 to the third circuit board 1250 or when gravity acts in the direction from the third circuit board 1250 to the first circuit board 1800.

[0907] Figure 49 The illustration shows the process of mounting the image sensor 1810, the filter holder 1600, and the filter 1610 to the fourth circuit board 1260.

[0908] Reference Figure 49 The image sensor 1810 can first be connected, fixed or attached to the mounting area 1260A (S110) of the fourth circuit board 1260 by chip bonding.

[0909] Although the image sensor 1810 may be one of a charge-coupled device (CCD), a metal-oxide-semiconductor MOS, a CPD image sensor, and a CID image sensor, this disclosure is not limited thereto.

[0910] Subsequently, the image sensor 1810 can be connected to the fourth circuit board 1260 via wiring 1088, so that the image sensor 1810 is electrically connected to the fourth circuit board 1260 (S120).

[0911] Subsequently, the filter holder 1600, on which the filter 1601 is mounted, can be mounted on the third circuit board 1260 via adhesive member 1061 (S130). For example, the filter 1610 can be attached to the filter holder 1600 via adhesive member 1612, and then the filter holder 1600 can be attached to the fourth circuit board 1260. In another embodiment, the filter holder 1600 can be attached to the fourth circuit board 1260, and then the filter 1610 can be attached to the filter holder 1600.

[0912] In the comparative example, the image sensor can be mounted on an additional sensor board, and then the sensor board can be connected to a fourth circuit board.

[0913] In the comparative example, the sensor board can be soldered to the fourth circuit board. Soldering is an additional process and makes it difficult to connect the sensor board to the fourth circuit board. Furthermore, in the comparative example, noise may be generated at the image sensor during the soldering of the sensor board to the fourth circuit board, and the image sensor may be affected by the noise. Additionally, in the comparative example, due to tolerance stacking during the soldering process of the sensor board, there may be difficulties in aligning the lens module with the image sensor and aligning the lens module with the cover member.

[0914] In this embodiment, the sensor board in the comparative example is fused to a fourth circuit board to achieve a single integrated fourth circuit board 1260. In this example, the image sensor 1810 is moved from above the image sensor unit 1350 to the fourth circuit board and then bonded to the fourth circuit board 1260 via chip bonding, and the image sensor is electrically connected to the fourth circuit board via wire bonding. Subsequently, the filter holder 1600 and the filter 1610 are moved from above the image sensor unit 1350 to the fourth circuit board 1260 and coupled to the fourth circuit board 1260.

[0915] Compared to the comparative example, this embodiment simplifies the camera assembly process. Furthermore, it reduces the number of solder points in the signal path of the image sensor and prevents the image sensor from becoming inoperable or suppresses image noise.

[0916] Furthermore, compared to the comparative example, this embodiment simplifies the assembly process and thus eliminates tolerance stacking. Therefore, it is also advantageous in managing the alignment of the lens module 1400.

[0917] Furthermore, compared to the comparative example, this embodiment can provide the effect of reducing material costs and manufacturing costs by reducing the number of parts and processes.

[0918] although Figure 39a and Figure 40 The illustration shows an embodiment in which the third circuit board 1250 and the fourth circuit board 1260 are separately disposed, and the terminals 1251 of the third circuit board 1250 and the terminals 1261 of the fourth circuit board 1260 are connected to each other to electrically connect the third circuit board 1250 to the fourth circuit board 1260. However, the embodiments of the present invention are not limited to this. In another embodiment, the third circuit board and the fourth circuit board may be integrally formed into a single board. Here, the terminals 1262 of the fourth circuit board may be formed on the rear surface of the single board and may be connected to the connecting elastic member 1280.

[0919] Figure 22The connecting elastic member 280-1 shown can be another embodiment of the connecting elastic member 1280. Therefore, Figure 22 The description of the connecting elastic member 280-1 shown can be applied to the connecting elastic member 1280 with or without modification.

[0920] For example, the surface area of ​​the hole 79 in the board portion 280A may be larger than the surface area of ​​the second surface 1060B of the fourth circuit board 1260. For example, the hole in the board portion 280A may expose the second surface 1060B of the fourth circuit board 1260 and the terminals 262 of the fourth circuit board 1260 passing through the hole.

[0921] The plate portion 280A may be disposed on the second surface 1070B of the retainer 1270 and may be connected or attached to the second surface 1070B of the retainer 1270 via an adhesive member or the like.

[0922] In another embodiment, Figure 29 The image sensor unit 1350 shown can replace Figure 23 The image sensor unit 250 shown is used. For example, a camera module 20 according to another embodiment may include a lens module 1400 and an image sensor unit 1350, and Figure 23 The description can be applied with or without modification.

[0923] For example, according to another embodiment, the lens module 1400 of the camera module 20 may not move in the optical axis direction, but may be fixed in the optical axis direction. For example, in another embodiment, the lens module 1400 may not move in the direction perpendicular to the optical axis, and may be held in the direction perpendicular to the optical axis. The camera module 20 may also include Figure 29 The cover member 1300 is shown. For example, the lens module 1400 may be coupled, attached, or fixed to the retainer 1600 or the first circuit board 1800. For example, the lower portion, lower end, or lower surface of the lens module 1400 may be coupled, attached, or fixed to the upper surface of the retainer 1600 or the upper surface of the first circuit board 1800. Alternatively, for example, the lens module 1400 may be coupled, attached, or fixed to the cover member 1300.

[0924] As camera technology advances, image resolution increases, leading to a corresponding increase in the size of image sensors. This increase in sensor size consequently increases the size of the lens module and the actuators used to move the lens module. Consequently, not only does the weight of the lens module increase, but the weight of the other actuator components used for its movement also increases.

[0925] According to an embodiment of the present invention, an AF operation unit (or first actuator) 1100 operating in a lens-shifting manner is used to perform autofocus, and an image sensor unit (or second actuator) 1350 operating in an image sensor-shifting manner is used to perform optical image stabilization (OIS), thereby improving the reliability of the camera device.

[0926] This implementation can perform 5-axis hand shake correction using sensor shifting. For example, 5-axis hand shake can include two angular hand shakes (e.g., pitch and yaw), two shift hand shakes (e.g., x-axis shift and y-axis shift), and one rotational hand shake (e.g., roll).

[0927] Figure 50 The diagram illustrates a controller 820 according to an embodiment. Figure 51 An embodiment of the correction values ​​stored in memory 1512 is illustrated. Figure 52 The settings are shown in the diagram. Figure 51 The view shows the method for correcting the values.

[0928] Reference Figure 50 and Figure 52 The controller 830 may include a correction unit 812 and a drive unit 813. The controller 830 may also include an analog-to-digital converter 811.

[0929] The controller 830 can receive the output of the OIS position sensor. The controller 830 can receive the calibration value CV stored in the memory 1512. For example, the OIS position sensor can be a first sensor 1240a, a second sensor 1240b, or a third sensor 1240c.

[0930] For example, the output of an OIS position sensor can be an analog signal or a digital signal.

[0931] For example, when the OIS position sensor includes only a Hall sensor, the output of the OIS position sensor can be an analog signal, and the controller 830 may also include an analog-to-digital converter 811 configured to convert the output of the OIS position sensor, which is an analog signal, into a digital signal (or digital value). Hereinafter, the digital value may be alternatively referred to as a "digital code".

[0932] For example, when the OIS position sensor is a driver IS that includes a Hall sensor, the output of the OIS position sensor can be a digital signal or a digital value, and the analog-to-digital converter 811 can be omitted.

[0933] The calibration unit 812 can calibrate the output of the OIS position sensor based on the calibration value CV received from the memory 1512.

[0934] For example, the correction unit 812 can output the result CS obtained by subtracting the correction value CV from the output of the OIS position sensor. In another embodiment, the correction unit 812 can output the result obtained by adding the correction value CV to the output of the OIS position sensor. This is done to eliminate the output of the OIS position sensor caused by the influence or interference of the magnetic field of the OIS coil 1230. Here, the OIS coil 1230 can be a coil corresponding to the OIS position sensor. For example, the first OIS coil unit 1230-1 can correspond to the first sensor 1240a, the second OIS coil unit 1230-2 can correspond to the second sensor 1240b, and the third OIS coil unit 1230-3 can correspond to the third sensor 1240c.

[0935] For example, although the correction unit 812 may include at least one of logic gates, comparators, subtractors, and adders, this disclosure is not limited thereto. The correction unit 812 may have any other configuration, as long as it has a circuit configuration capable of changing or correcting the output of the OIS position sensor based on the correction value CV.

[0936] The drive unit 813 can receive the output CS of the correction unit 812, control the drive signal DS for driving the OIS coil 1230 corresponding to the OIS position sensor based on the received output of the correction unit 813, and supply the controller drive signal DS to the OIS coil 1220.

[0937] Reference Figure 51 The memory 1512 can store correction values ​​corresponding to the drive values ​​used to drive the OIS coils 1230-1, 1230-2, and 1230-3. The correction values ​​can be stored in the form of a lookup table. Here, the drive values ​​can be alternatively referred to as "drive code values," "code values," or "control values."

[0938] The driving values ​​used to drive OIS coils 1230-1, 1230-2, and 1230-3 may include driving code values ​​(A1 to An, where n is a natural or rational number greater than 1) corresponding to the OIS travel range. For example, the driving value may be a digital value or digital code consisting of K bits (e.g., K is a natural or rational number greater than 1). Here, OIS travel can be the displacement of the movable part of the OIS in a direction perpendicular to the optical axis, and the OIS travel range can be the range (or area) of movement of the movable part of the OIS in a direction perpendicular to the optical axis.

[0939] The correction value may include correction code values ​​(C1 to Cn) corresponding to the driving code values ​​(A1 to An, where n is a natural or rational number greater than 1).

[0940] When a drive current corresponding to drive values ​​A1 to An is applied to an OIS coil (e.g., 1230-1) in the absence of a magnet (e.g., 1023A to 1023D), a magnetic field can be generated from the OIS coil (e.g., 1230-1) by the applied drive current. The OIS position sensor (e.g., 1240a) can output an output (or output signal) corresponding to the detection result of the magnetic field of the OIS coil (e.g., 1230-1).

[0941] Here, the output of the first sensor 1240a can be caused by the magnetic field generated by the applied drive current. Since the magnetic field is an undesirable factor that hinders the proper operation of OIS, it is preferable to eliminate the magnetic field for the purpose of proper OIS operation.

[0942] The correction values ​​C1 to Cn can be set based on the output of the first sensor 1240a. For example, the correction values ​​C1 to Cn can be the output of a position sensor corresponding to the detection result of the magnetic field of the OIS coil (e.g., 1230-1), and can be digital values.

[0943] although Figure 52 The illustration shows a first sensor 1240a and a first OIS coil 1230-1 corresponding to the first sensor 1240, but the description can be applied to a second sensor 1240b and a second OIS coil 1220-2 corresponding to the second sensor 1240b, and a third sensor 1240c and a third OIS coil 1240-3 corresponding to the third sensor 1240c.

[0944] For example, although the memory 1512 may include lookup tables storing correction values ​​corresponding to the first to third OIS position sensors 1240a, 1240b, and 1240c, this disclosure is not limited thereto. In another embodiment, a lookup table may be used... Figure 52 The single lookup table shown is used to correct the respective outputs of the first to third sensors 1240a, 1240b and 1240c.

[0945] Figure 53 Another embodiment of the correction value CV1 stored in memory 1512 is illustrated. Figure 54 The settings are shown in the diagram. Figure 53 The view shows the method for calculating the correction value CV1. Although the correction value CV is... Figure 52 The setting is performed with magnets 1023A to 1023D removed from camera module 1010, but the correction value CV1 can also be set in... Figure 54 The settings are configured in the camera module 1010 with magnets 1023A to 1023D in the specified state.

[0946] First, at the initial position of the movable part of the OIS, the OIS position sensor (e.g., 1240a) can detect the strength of the magnetic field of the magnet (e.g., 1023A) corresponding to the OIS position sensor (e.g., 1240a) and can output an output corresponding to the detection result. The digital value M1 or digital code corresponding to the output of the OIS position sensor (e.g., 1240a) at the initial position of the movable part of the OIS can be stored in the memory 1512.

[0947] M1 can be the output of an OIS position sensor (e.g., 1240a) caused by the magnetic field of a magnet (e.g., 1023A) when no drive signal is applied to OIS coils 1230-1 to 1230-4.

[0948] For example, the output of the OIS position sensor at the initial position of the movable part of the OIS can be a digital value, and the digital value can be converted from an analog signal.

[0949] For example, the correction value CV1 can be referred to as the "first correction value," and M1 can be referred to as the "second correction value." The memory 1512 can store the first correction value CV1 and the second correction value M1. The first correction value CV1 and the second correction value M1 can be numeric values ​​or numeric codes, and can be stored in the memory 1512 in the form of a lookup table.

[0950] Subsequently, the magnet (e.g., 1023A) disposed in the camera module 1010 can be fixed in a non-movable manner by means of a fixing device such as a clamp. When a drive current corresponding to the drive values ​​A1 to An is applied to the OIS coil (e.g., 1230-1), a magnetic field can be generated from the OIS coil (e.g., 1230-1) by the drive current applied to the OIS coil.

[0951] The position sensor (e.g., 1240a) can output an output (or output signal) corresponding to the detection results of the first magnetic field and the second magnetic field.

[0952] For example, the first magnetic field can be the magnetic field of a magnet (e.g., 1023A) at the initial position of the movable part of the OIS, and the second magnetic field can be the electromagnetic field of the OIS coil (e.g., 1230-1) generated by the drive current corresponding to the drive values ​​A1 to An.

[0953] The first correction value CV1 can be set based on the output of the first sensor 1240a. For example, the first correction value CV1 can be the output of the OIS position sensor (e.g., 1240a) that corresponds to the detection results of the magnetic field of the magnet (e.g., 23A) at the initial position of the movable part of the OIS and the magnetic field of the OIS coil (e.g., 1230-1) generated by the drive current corresponding to the drive values ​​A1 to An, and the first correction value CV1 can be a digital value.

[0954] For example, the first correction values ​​B1 to Bn can be obtained by adding the output of the OIS position sensor (e.g., 1240a) caused by the first magnetic field to the output of the OIS position sensor (e.g., 1240a) caused by the second magnetic field.

[0955] In another embodiment, memory 1512 may store a third correction value therein. The third correction value may be one of the values ​​(B1-M1 to Bn-M1) obtained by subtracting the second correction value M1 from the first correction value CV1.

[0956] although Figure 53 The illustration shows a first sensor 1240 and a first OIS coil 1230-1 corresponding to the first sensor 1240a, but its description may be applied, with or without modification, to a second sensor 1240b and a second OIS coil 1230-2 corresponding to the second sensor 1240b, and a third sensor 1240c and a third OIS coil 1230-3 corresponding to the third sensor 1240c.

[0957] Figure 55 The illustration shows the arrangement of an OIS position sensor 1240a according to another embodiment. Figure 55 The description of the OIS position sensor 1240a shown can be applied to other sensors 1240b and 1230c with or without modification.

[0958] Reference Figure 55 The OIS position sensor (e.g., 1240a) can be positioned below the corresponding OIS coil (e.g., 1230-1). This is to reduce the impact on the position sensor output caused by the magnetic field of the OIS coil unit (e.g., 1230-1).

[0959] For example, the OIS position sensor 1240a may not overlap with the OIS coil unit 1230-1 in a direction perpendicular to the optical axis. For example, the OIS position sensor (e.g., 1240a) may be disposed below the second circuit board 1900 and may not overlap with the OIS coil unit (e.g., 1230-1) in the optical axis direction.

[0960] Figure 55 The embodiment shown may include a retainer 1270-1 instead of Figure 39a The retainer 1270 shown is shown.

[0961] Holder 1270-1 may be disposed below the first circuit board 1800. Holder 1270-1 may be disposed spaced apart from the first circuit board 1900, and holder 1270 may be connected to the second circuit board 1900.

[0962] Holder 1270-1 may receive or support the second coil 1230. Holder 1270-2 may be used to support the second winding 1240 in order to space the second coil 1240 from the second circuit board 1900.

[0963] For example, the lower portion, lower surface, or lower end of the retainer 1270-1 may be connected to the upper portion, upper surface, or upper end of the second circuit board 1900.

[0964] Holder 1270-1 may have a hole 1041A corresponding to OIS position sensor 1240. For example, holder 1270-2 may have a hole 1041A formed at a position corresponding to each of the first to third sensors 1240a, 1240b, and 1240c. For example, hole 1041A may be a through-hole formed through holder 1270-1. OIS position sensor 1240 may be disposed in hole 1041A in holder 1270-1.

[0965] Despite Figure 55 The embodiment shown reduces the impact of the magnetic field of the OIS coil unit (e.g., 1230-1) on the output of the OIS position sensor, but the output can still be affected by the magnetic field. Therefore, for more accurate OIS feedback operation, Figures 50 to 54 and Figures 56 to 58 The description can also be applied to Figure 55 The implementation shown is as follows.

[0966] In another embodiment. Figures 50 to 54 and Figures 54 to 58 The description may be applied with or without modification. Figures 1 to 27 The implementation shown is as follows.

[0967] Figure 56 The figure shows a controller 830A according to another embodiment.

[0968] Reference Figure 56 The controller 830A may include a correction unit 812A, an analog-to-digital converter (ADC) 811A, a drive unit 813, and a digital-to-analog converter (DAC) 814.

[0969] When the output of the first sensor 1240a is an analog signal (e.g., analog voltage or current), the correction unit 812A can receive the output of the OIS position sensor 1240a as an analog signal.

[0970] The digital-to-analog converter (DAC) 814 can receive correction values ​​CV and CV1 from the memory 1512 and can use the received correction values ​​CV and CV1 to create an analog signal AS.

[0971] The calibration unit 812A can receive the output of the OIS position sensor (e.g., 1240a) corresponding to the drive value (e.g., A1 to An) and the output of the digital-to-analog converter 814.

[0972] For example, the correction unit 812A can output the difference between the output of the OIS position sensor (e.g., 1240a) and the output of the digital-to-analog converter 814.

[0973] For example, the correction unit 812A can output the result CS1 obtained by subtracting the output AS of the digital-to-analog converter 814 from the output HT of the OIS position sensor (e.g., 1240a). For example, the correction unit 812A can be implemented as a comparator, differential amplifier, operational amplifier, etc.

[0974] For example, the correction unit 812A can perform differential amplification on the output HT of the OIS position sensor (e.g., 1240a) and the output AS of the digital-to-analog converter 814, and can output a differential amplified signal CS1.

[0975] The analog-to-digital converter 811A can perform analog-to-digital conversion on the output CS1 of the correction unit 812A, and can output a digital value DCS or digital code corresponding to the result of the analog-to-digital conversion.

[0976] The drive unit 813 can receive the output DCS of the analog-to-digital converter 811A, and can control the drive signal DS for activating the OIS coil 230 corresponding to the OIS position sensor based on the received output DCS, and can supply the controlled drive signal DS to the OIS coil 230.

[0977] Figure 50 and Figure 56 The description can be applied to other position sensors 1240b and 1240c.

[0978] Figure 57 It is a flowchart illustrating the operation of the controllers 830 and 830A according to the embodiments.

[0979] Reference Figure 57The controllers 830 and 830A apply or supply a drive signal (S1110) to the OIS coil unit (e.g., 1230-1) that corresponds to a drive value (e.g., A2) for moving the OIS drive unit, such as the image sensor 1810, to a target position within the OIS travel range.

[0980] The controllers 830 and 830A receive the output of the OIS position sensor (e.g., 1240a) corresponding to the OIS coil unit (e.g., 1230-1) (S1120).

[0981] The controllers 830 and 830A receive from the memory 1512 a correction value (e.g., C2) corresponding to the drive value (e.g., A2) (S1130).

[0982] The controllers 830 and 830A correct the output of the OIS position sensor (e.g., 1240a) based on the correction value (e.g., H2) (S1140).

[0983] For example, controllers 830 and 830A can subtract a correction value (e.g., C2) from the output of an OIS position sensor (e.g., 1240a) and can output the result of the subtraction.

[0984] Figure 58 This is a table illustrating an implementation of correcting the output of an OIS position sensor (e.g., 1240a). Figure 58 Can be used Figure 51 The lookup table shown.

[0985] Reference Figure 58 The controllers 830 and 830A can subtract the correction values ​​C1 to Cn stored in the lookup table from the outputs H1 to Hn of the OIS position sensors (e.g., 1240a) corresponding to the drive values ​​A1 to An, and can output the result of the subtraction (H1 - C1 to Hn - Cn).

[0986] Figure 59 This is a table illustrating another implementation of calibrating the output of an OIS position sensor (e.g., 1240a). Figure 59 Can be used Figure 53 The lookup table shown.

[0987] Reference Figure 59 The controllers 830 and 830A can use the first correction values ​​B1 to Bn and the second correction value stored in the lookup table to correct the outputs H1 to Hn of the OIS position sensor (e.g., 1240a) corresponding to the drive values ​​A1 to An, and can output the correction results.

[0988] For example, controllers 830 and 830A can subtract first correction values ​​B1 to Bn from the outputs H1 to Hn of the OIS position sensors (e.g., 1240a) corresponding to drive values ​​A1 to An, and can output values ​​H1-B1+M1 to Hn-Bn+M1 obtained by adding the second correction value M1 to the subtraction result.

[0989] In another embodiment, controllers 830, 830A can be used Figure 53 The third correction value shown is used to correct the outputs H1 to Hn of the OIS position sensor (e.g., 1240a) corresponding to the drive values ​​A1 to An, and the correction result can be output.

[0990] For example, controllers 830 and 830A can subtract third correction values ​​B1 to Bn from the outputs H1 to Hn of the OIS position sensors (e.g., 1240a) corresponding to the drive values ​​A1 to An, and can output the result of the subtraction.

[0991] The controllers 830 and 830A use the calibrated output of the OIS position sensor (e.g., 1240a) to control the drive value or drive signal (S1150) used to activate the OIS coil.

[0992] The memory 1512 can store code values ​​of the output of the OIS position sensor that correspond to or match the displacement of the OIS movable part for use in OIS feedback operation.

[0993] For example, memory 1512 may store code values ​​of the output of an OIS position sensor that correspond to or match the displacement of the OIS movable part in the x-axis direction, and code values ​​of the output of an OIS position sensor (e.g., the second sensor 1240b) that correspond to or match the displacement of the OIS movable part in the y-axis direction.

[0994] Alternatively, for example, memory 1512 may store code values ​​of the output of an OIS position sensor (e.g., third sensor 1240c) that correspond to or match the displacement of the OIS movable portion in the x-axis direction or the y-axis direction.

[0995] Figure 60 The diagram illustrates the code values ​​_1 to _n of the output of the first sensor 1240a, which correspond to or match the displacements DP1 to DPn of the movable part of the OIS in the x-axis direction.

[0996] When drive signals are supplied to the coil unit (e.g., 1230-1) according to drive values ​​A1 to An via simulation or experiment, the movable part of the OIS moves, and a code value (or "coordinate code value") of the output of the first sensor 1240a that matches the displacement of the movable part of the OIS is obtained. This procedure is called "calibration".

[0997] Furthermore, through calibration, the code value of the output of the second sensor 1240b, which corresponds to or matches the displacement of the movable part of the OIS in the y-axis direction, can be obtained.

[0998] The displacement of the movable part of the OIS can be defined or determined by coordinate code values ​​created through calibration, and the reliability of these coordinate code values ​​can be ensured through repeated simulations and experiments. OIS feedback operations can be performed based on reliable coordinate code values.

[0999] For example, controllers 830 and 830A can be used as Figures 51 to 53 The output of the OIS position sensor (e.g., 1240a) is calibrated in the manner described herein. Figure 60 The coordinate code values ​​shown are compared from code_1 to code_n, and the driving value or driving signal used to activate the OIS coil can be controlled based on the comparison result.

[1000] In another embodiment, Figure 51 The correction value CV shown is Figure 53 The first, second, or third correction value shown can be applied to coordinate code values ​​created through calibration. In other words, coordinate code values ​​created through calibration can be corrected or adjusted, and the corrected coordinate code values ​​can be used to control the drive value or drive signal used to activate the OIS coil.

[1001] For example, a new coordinate code value can be set by subtracting the correction value CV (or the third correction value) from the coordinate code values ​​code_1 to code_n created through calibration, and the newly set coordinate code value can be used to control the drive value or drive signal used to activate the OIS coil.

[1002] like Figure 39a , Figure 39b and Figure 45 As shown in the figure, OIS coil units 1230-1 to 1230-4 and OIS position sensors 1240a to 1240c can be set or mounted on the first surface 1051A of the third circuit board 1250.

[1003] For example, an OIS coil unit (e.g., 1230-1) may have an opening or hole formed in its center, and an OIS position sensor (e.g., 1240a) may be disposed in the opening or hole in the OIS coil unit (e.g., 1230-1) corresponding to the OIS position sensor (e.g., 1240a).

[1004] For example, the OIS position sensor (e.g., 1240a) may overlap with the OIS coil unit (e.g., 1230-1) corresponding to the OIS position sensor (e.g., 1240a) in a direction perpendicular to the optical axis or in a direction parallel to the upper surface of the second circuit board 1900.

[1005] As described above, the OIS coil units 1230-1 to 1230-4 and the OIS position sensors 1240a to 1240c corresponding to the OIS coil elements 1230-1 to 1230-4 respectively can be configured to be adjacent to the first surface 1051A of the third circuit board 1250.

[1006] When a drive signal is applied to the OIS coil unit (e.g., 1230-1) for OIS operation, a magnetic field can be generated from the OIS coil unit (e.g., 1230-1). For accurate OIS feedback operation, the output of the OIS position sensor 1240a must correspond to the detection result of the magnetic field generated solely by the magnet 1023A fixed to the OIS fixed portion. However, since the OIS coil unit 1230-1 and the OIS position sensor 1240a are arranged adjacent to each other, the output of the OIS position sensor 1240a may be greatly affected by the magnetic field generated by the OIS coil 1230-1, and therefore the accuracy and reliability of the OIS feedback operation may be degraded.

[1007] Figure 61 The diagram illustrates the frequency response characteristics of the drive signal input to the OIS coil unit (e.g., 1230-1) and the output of the OIS position sensor (e.g., 1240a). Figure 61 In the diagram, the x-axis indicates the frequency, and the y-axis indicates the gain.

[1008] Reference Figure 61 In OIS coil units (e.g., 1230-1), the following phenomenon 1038A (referred to as the "Carbri phenomenon") may occur. In this phenomenon, the output of the OIS position sensor increases or decreases abnormally in the frequency range between 200Hz and 300Hz due to the influence of the magnetic field.

[1009] In this embodiment, by correcting or eliminating the influence on the output of the OIS position sensor (e.g., 1240a) caused by the magnetic field generated from the OIS coil unit during OIS operation, the aforementioned Capri phenomenon can be prevented, and the OIS feedback operation can be performed accurately and reliably, thereby ensuring the reliability of camera module shake correction.

[1010] Furthermore, since the reliability of OIS feedback operation can be ensured even when the OIS position sensor and OIS coil unit are arranged adjacent to each other, the technology used to calibrate the output of the OIS position sensor can be used to improve the flexibility of setting up the OIS position sensor and OIS coil unit to reduce the mechanical height of the camera module and ensure that there is enough space on the third circuit board 1250 to set up other components.

[1011] The camera module 10 or 20 according to this embodiment may be included in an optical instrument designed to form an image of an object in space using properties of light such as reflection, refraction, absorption, interference, and diffraction, to expand the field of view, record or reproduce an image obtained through a lens, perform optical measurements, or propagate or transmit an image. For example, although the optical instrument according to the embodiment may be a mobile phone, cellular phone, smartphone, portable smart device, digital camera, laptop computer, digital broadcast terminal, PDA (Personal Digital Assistant), PMP (Portable Multimedia Player), navigation device, etc., this disclosure is not limited thereto. Furthermore, any device capable of capturing images or photographs is possible.

[1012] Figure 62 This is a perspective view of the optical device 200A according to an embodiment. Figure 63 It's a diagram. Figure 62 The diagram shows a view of the configuration of the optical device.

[1013] Reference Figure 62 and Figure 63 The optical device 200A may include a body 850, a wireless communication unit 710, an audio / video (A / V) input unit 720, a sensing unit 740, an input / output unit 750, a memory unit 760, an interface unit 770, a controller 780, and a power supply unit 790.

[1014] Figure 62 The body 850 shown in the figure has a strip shape, but is not limited to it, and can be any of various types such as sliding, folding, swinging or rotating, wherein two or more sub-bodies are connected to be able to move relative to each other.

[1015] The body 850 may include a housing (outer shell, casing, cover, etc.) that defines the appearance of the terminal. For example, the body 850 may be divided into a front housing 851 and a rear housing 852. Various electronic components of the terminal may be accommodated in the space defined between the front housing 851 and the rear housing 852.

[1016] The wireless communication unit 710 may include one or more modules that enable wireless communication between the optical device 200A and the wireless communication system or between the optical device 200A and the network in which the optical device 200A resides. For example, the wireless communication unit 710 may include a broadcast receiving module 711, a mobile communication module 712, a wireless internet module 713, a near-field communication module 714, and a location information module 715.

[1017] The A / V input unit 720 is used to input audio or video signals and may include, for example, a camera 721 and a microphone 722.

[1018] Camera 721 may include camera module 10, 20 or 1010 according to the embodiment.

[1019] The sensing unit 740 can sense the current state of the optical device 200A, such as whether the optical device 200A is on or off, its position, the presence of user touch, its orientation, or its acceleration / deceleration, and can generate sensing signals to control the operation of the optical device 200A. When the optical device 200A is, for example, a slider mobile phone, the sensing unit 740 can sense whether the slider mobile phone is on or off. Furthermore, the sensing unit 740 can sense the power supply from the power supply unit 790, the connection between the interface unit 770 and external devices, etc.

[1020] The input / output unit 750 is used to generate, for example, visual, auditory, or tactile inputs or outputs. The input / output unit 750 can generate input data to control the operation of the optical device 200A, and can display information processed in the optical device 200A.

[1021] The input / output unit 750 may include a keyboard unit 730, a display module 751, a sound output module 752, and a touch screen panel 753. The keyboard unit 720 can generate input data in response to input on the keyboard.

[1022] Display module 751 may include a plurality of pixels, the colors of which change according to an electrical signal applied thereto. For example, display module 751 may include at least one of a liquid crystal display, a thin-film transistor liquid crystal display, an organic light-emitting diode, a flexible display, and a 3D display.

[1023] The audio output module 752 can output audio data received from the wireless communication unit 710 in, for example, call signal receiving mode, call mode, recording mode, voice recognition mode or broadcast receiving mode, or it can output audio data stored in the memory unit 760.

[1024] The touchscreen panel 753 can convert the capacitance change caused by the user touching a specific area of ​​the touchscreen into an electrical input signal.

[1025] The memory unit 760 can temporarily store programs for processing and control by the controller 780, as well as input / output data (e.g., telephone numbers, messages, audio data, still images, moving images, etc.). For example, the memory unit 760 can store images captured by the camera 721, such as pictures or moving images.

[1026] Interface unit 770 serves as a path through which the lens moving device connects to an external device connected to optical device 200A. Interface unit 770 can receive power or data from external components and can transmit power or data to corresponding components within optical device 200A, or transmit data from within optical device 200A to external components. For example, interface unit 770 may include a wired / wireless headset port, an external charger port, a wired / wireless data port, a memory card port, a port for connecting to a device equipped with an identification module, an audio input / output (I / O) port, a video input / output port, a headphone port, etc.

[1027] The controller 780 can control the gene...

Claims

1. A camera module, comprising: The fixing part includes a magnet; as well as The movable portion includes: a first circuit board spaced apart from the fixed portion; a position sensor disposed on the first circuit board; an image sensor disposed on the first circuit board; a coil positioned facing the magnet; and a spacer disposed between the first circuit board and the coil. The spacer is configured to support the coil, thereby spacing the coil from the first circuit board. The movable portion is configured to move in a direction perpendicular to the optical axis through the interaction between the magnet and the coil. The spacer has a hole, and at least a portion of the position sensor is disposed in the hole of the spacer and overlaps with the magnet in the optical axis direction. The coil is disposed on the upper surface of the spacer and does not overlap with the hole of the spacer in the direction perpendicular to the optical axis.

2. The camera module according to claim 1, wherein, The hole in the spacer overlaps with at least a portion of the coil in the optical axis direction.

3. The camera module according to claim 1, wherein, The position sensor does not overlap with the coil in a direction perpendicular to the optical axis.

4. The camera module according to claim 1, wherein, The coil has a hole formed in the center of the coil, and the hole of the spacer overlaps with the hole of the coil in the optical axis direction.

5. The camera module according to claim 1, wherein, The position sensor overlaps with both the hole in the coil and the hole in the spacer in the optical axis direction.

6. The camera module according to claim 1, wherein, A space is defined between the magnet and the position sensor.

7. The camera module of claim 1 further includes an elastic support member connected to both the fixed portion and the movable portion to flexibly support the movable portion relative to the fixed portion.

8. The camera module according to claim 7, wherein, The fixed portion includes a second circuit board, and the elastic support member electrically connects the first circuit board to the second circuit board.

9. The camera module according to claim 1, wherein, The coil is connected to the spacer and is electrically connected to the first circuit board.

10. A camera module, comprising: lens; An image sensor, wherein the image sensor is disposed at a position corresponding to the lens; A driving unit configured to move the image sensor; A circuit board, the circuit board being spaced apart from the lens; A position sensor, which is mounted on the circuit board; as well as Spacers, the spacers being disposed on the circuit board. The driving unit includes a magnet and a coil facing the magnet. The spacer is disposed between the circuit board and the coil to separate the coil from the position sensor, and The image sensor moves in a direction perpendicular to the optical axis through the electromagnetic interaction between the magnet and the coil. The coil is disposed on the upper surface of the spacer and does not overlap with the position sensor in the direction perpendicular to the optical axis.

11. A camera module, comprising: The fixing part includes a magnet; The movable portion includes: a first circuit board spaced apart from the fixed portion; a retainer disposed on the first circuit board; a coil disposed on the upper surface of the retainer facing the magnet; and a position sensor disposed on the first circuit board facing the magnet; and A support member, which connects to both the fixed portion and the movable portion. The movable portion moves in a direction perpendicular to the optical axis through the interaction between the magnet and the coil, and the retainer is configured to support the coil such that the coil is spaced apart from the first circuit board and does not overlap with the position sensor in the direction perpendicular to the optical axis.

12. The camera module according to claim 11, wherein, The position sensor is mounted on the first circuit board and does not overlap with the coil in the optical axis direction.

13. The camera module according to claim 11, wherein, The fixing part includes a second circuit board, which is configured to be spaced apart from the first circuit board.

14. The camera module according to claim 13, wherein, One end of the support member is connected to the second circuit board, and the other end of the support member is connected to the first circuit board.

15. The camera module according to claim 11, wherein, The coil has a hole formed in the center of the coil, and the position sensor is disposed below the hole of the coil and overlaps with the hole of the coil in the optical axis direction.

16. The camera module according to claim 11, wherein, The retainer has a through hole that corresponds to the position sensor in the optical axis direction, and the position sensor is disposed in the through hole of the retainer.

17. The camera module according to claim 11, wherein, The retainer includes a coupling protrusion projecting from the upper surface of the retainer, and the coil is coupled to the coupling protrusion.

18. The camera module according to claim 11, wherein, The movable part includes an image sensor mounted on the first circuit board.

19. The camera module according to claim 11, wherein, The coil includes a first coil unit to a fourth coil unit respectively disposed at the first to fourth corners of the retainer. The magnets include a first magnet corresponding to the first coil unit, a second magnet corresponding to the second coil unit, a third magnet corresponding to the third coil unit, and a fourth magnet corresponding to the fourth coil unit. The position sensor includes a first sensor disposed below the first coil unit, a second sensor disposed below the second coil unit, and a third sensor disposed below the third coil unit.

20. The camera module according to claim 19, wherein, The first through fourth coil units are configured to be activated individually.

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