A light-sensitive assembly with an anti-shake function and a corresponding camera module

Abstract

The present application relates to a light-sensitive assembly with an anti-shake function, comprising: a circuit board; a light-sensitive chip mounted on the upper surface of the circuit board; a base located below the circuit board and connected to the circuit board through a support shaft; a support seat surrounding the periphery of the base, and the top surface of the support seat is adapted to mount a lens assembly; and a driving module comprising a plurality of sub-lifting driving modules, which are arranged between the base and the circuit board and distributed around the support shaft. The present application also provides a corresponding camera module. The present application can realize the anti-shake function of the light-sensitive assembly at a small space cost, and can realize optical anti-shake in multiple degrees of freedom.

Description

[0001] Related applications

[0002] This application claims priority to Chinese Patent Application No. 202010299235.0, filed on April 16, 2020, entitled "Image sensor with image stabilization and corresponding camera module", the entire contents of which are incorporated herein by reference. Technical Field

[0003] This invention relates to the field of camera module technology, and more specifically, to a photosensitive component with image stabilization and a corresponding camera module. Background Technology

[0004] With the widespread adoption of mobile electronic devices, the technology behind camera modules used in these devices to help users capture images (such as videos or photos) has developed rapidly. In recent years, camera modules have been widely used in numerous fields, including medical, security, and industrial production. Currently, in the consumer electronics field (such as mobile phones), optical image stabilization (OIS) has become a common feature of camera modules. When electronic devices (such as smartphones) take pictures, shaking is inevitable due to various reasons. For example, when shooting with a smartphone, the photographer often finds it difficult to hold the phone steady for an extended period, and button presses during shooting can also cause instability. These situations all lead to image shake in the viewfinder, affecting the image quality of the camera module. Currently, optical image stabilization is usually achieved through optical image stabilizers (OIS). In existing technology, camera modules with optical image stabilization typically incorporate an OIS within the optical lens. Specifically, to improve the image quality of camera modules, most current solutions involve equipping the lens with a voice coil motor (VCM). The VCM drives the lens movement, correcting lens shake and effectively improving image quality. However, the image stabilization effect of a VCM integrated into the optical lens is limited. Firstly, camera modules rely on image sensors for imaging, and in many real-world shooting scenarios, it's not just the optical lens that shakes; the image sensor may also experience shake. For example, if the photographer shakes the phone due to instability, not only will the optical lens shift, but the image sensor will also shift, and simply adjusting the optical lens may not be sufficient to correct the viewfinder shift. Secondly, the driving capability of the VCM integrated into the optical lens is also limited. For example, the VCM's travel is limited, making it difficult to correct large-amplitude shake.

[0005] To effectively improve the image quality of camera modules, existing technologies include image stabilization techniques targeting the image sensor. For example, some have proposed placing a gimbal at the bottom of the image sensor, mounting it on the gimbal to achieve image stabilization. However, the gimbal structure occupies a significant amount of space, increasing the phone's thickness, which contradicts the current trend towards thinner and lighter smartphones. Furthermore, due to the gimbal's large size, adopting this gimbal-based image stabilization solution could significantly increase the design complexity of smartphones, which have extremely limited internal space, and encroach on the space of other modules (such as the battery).

[0006] Therefore, there is an urgent need for a miniaturized image stabilization solution for photosensitive components. Summary of the Invention

[0007] The purpose of this invention is to overcome the shortcomings of the prior art and provide a miniaturized image stabilization solution for photosensitive components.

[0008] To address the aforementioned technical problems, the present invention provides a photosensitive component with image stabilization function, comprising: a circuit board; a photosensitive chip mounted on the upper surface of the circuit board; a base located below the circuit board and connected to the circuit board via a support shaft; a support seat surrounding the periphery of the base, and the top surface of the support seat being adapted to mount a lens assembly; and a drive module including multiple sub-lifting drive modules disposed between the base and the circuit board and distributed around the support shaft.

[0009] The multiple sub-lifting drive modules are respectively located at different positions on the support shaft.

[0010] Each of the sub-lifting drive modules is adapted to drive the circuit board to rise or fall at its location, and the tilt angle of the circuit board relative to the base is adjusted by controlling the magnitude of the driving force and the lifting direction of each sub-lifting drive module.

[0011] The circuit board is rectangular; the multiple sub-lifting drive modules are respectively located at the four corners of the circuit board.

[0012] The sub-lifting drive module includes a first magnetic element connected to the bottom surface of the circuit board and a second magnetic element connected to the base.

[0013] The first magnetic element includes a metal core connected to the bottom surface of the circuit board and a coil disposed on the metal core; or the first magnetic element is a magnet.

[0014] The second magnetic element includes a metal core connected to the top surface of the base and a coil disposed on the metal core.

[0015] The second magnetic element is a magnet, which is embedded or partially embedded in the base.

[0016] The support shaft is elastic.

[0017] The support shaft is made of shape memory alloy.

[0018] The photosensitive component also includes an elastic support element connecting the base and the circuit board, and multiple elastic support elements provide distributed elastic support at multiple locations on the circuit board.

[0019] The elastic support element includes multiple springs, with the two ends of each spring connected to the bottom surface of the circuit board and the top surface of the base, respectively.

[0020] The plurality of sub-lifting drive modules are also adapted to synchronously drive the circuit board to rise or fall, so as to adjust the height of the circuit board relative to the base.

[0021] The driving module further includes a second driving module, which includes a shape memory alloy push rod, a push rod block, a bottom extension block, and a base extension block. The base extension block extends upward from the top surface of the base. The two ends of the shape memory alloy push rod are respectively connected to the base extension block and the push rod block. The bottom extension block extends from the bottom surface of the circuit board. The push rod block and the side surface of the bottom extension block are arranged opposite to each other.

[0022] Wherein, when the shape memory alloy push rod is at room temperature, the push rod block and the side of the bottom extension block are spaced apart; the shape memory alloy push rod is adapted to extend after the temperature rises, so that the push rod block contacts and pushes the bottom extension block to move in the horizontal direction.

[0023] The driving module further includes a second driving module, which includes a bottom extension block and a shape memory alloy wire; one end of the shape memory alloy wire is connected to the bottom extension block, and the other end is connected to the support base; the bottom extension block is formed by extending downward from the bottom surface of the circuit board.

[0024] The driving module further includes a second driving module, which includes a bottom extension block and a shape memory alloy wire; one end of the shape memory alloy wire is connected to the bottom extension block, and the other end is connected to the base extension block; the base extension block is formed by extending upward from the top surface of the base, and the bottom extension block is formed by extending downward from the bottom surface of the circuit board.

[0025] The driving module further includes a second driving module, which includes a bottom extension block, a shape memory alloy push rod, and a push rod block. The two ends of the shape memory alloy push rod are respectively connected to the support base and the push rod block. The bottom extension block extends downward from the bottom surface of the circuit board, and the push rod block is arranged opposite to the side surface of the bottom extension block.

[0026] The drive module includes at least one x-axis drive module and at least one y-axis drive module, wherein the x-axis drive module is the second drive module arranged along the x-axis direction and is adapted to drive the circuit board to move along the x-axis, and the y-axis drive module is the second drive module arranged along the y-axis direction and is adapted to drive the circuit board to move along the y-axis.

[0027] The x-axis drive module is arranged on the x-axis of the circuit board, where the x-axis is the central axis of the circuit board that is parallel to the x-axis.

[0028] The y-axis drive module is arranged on the circuit board along the y-axis, where the y-axis is the central axis of the circuit board parallel to the y-axis.

[0029] The circuit board has an even number of x-axis drive modules, which are symmetrically arranged on both sides of the x-axis of the circuit board. The circuit board is driven to translate along the x-axis by synchronously applying driving force by the x-axis drive modules on both sides of the x-axis. Torque is generated by applying driving force by the x-axis drive module located on one side of the x-axis, thereby driving the circuit board to rotate around the z-axis. The x-axis is the central axis of the circuit board that is parallel to the x-axis.

[0030] The circuit board has an even number of y-axis drive modules, which are symmetrically arranged on both sides of the y-axis centerline. The circuit board is driven to translate along the y-axis by synchronously applying driving force from the y-axis drive modules on both sides of the y-axis centerline. Torque is generated by the combined driving force applied from the x-axis drive module on one side of the x-axis centerline and the y-axis drive module on one side of the y-axis centerline, thereby driving the circuit board to rotate around the z-axis. The y-axis centerline is the central axis of the circuit board parallel to the y-axis.

[0031] The photosensitive component further includes: a metal wire, the two ends of which are electrically connected to the circuit board and the photosensitive chip respectively; a filter located above the photosensitive chip; and a filter holder formed on the upper surface of the circuit board and surrounding the photosensitive chip, wherein the filter is mounted on the filter holder.

[0032] The filter holder is a molded part on the upper surface of the circuit board, which is formed by a molding process, and the metal wire is covered by the molded part.

[0033] The support base and the base are integrally formed.

[0034] According to another aspect of this application, a camera module is also provided, comprising: an optical lens; and any of the photosensitive components described above, wherein the optical lens is mounted on the support of the photosensitive component.

[0035] The optical lens has a motor, the bottom of which is mounted on the top surface of the support of the photosensitive component.

[0036] Compared with the prior art, this application has at least one of the following technical effects:

[0037] 1. This application can achieve image stabilization of the image sensor with a small space cost.

[0038] 2. This application enables controlled movement of a circuit board and its attached chips in the z-axis direction, the Rx rotation direction, and the Ry rotation direction. Here, the x-axis and y-axis are mutually perpendicular radial coordinate axes, with the radial direction parallel to the photosensitive surface of the photosensitive chip. The z-axis is the axial (or height) coordinate axis, i.e., the coordinate axis in the direction of the normal to the photosensitive surface. Rx represents the direction of rotation around the x-axis, Ry represents the direction of rotation around the y-axis, and Rz represents the direction of rotation around the z-axis.

[0039] 3. This application can realize controlled movement of the circuit board and the chip attached thereon in the x-axis direction, y-axis direction and / or Rz-axis rotation direction.

[0040] 4. This application can achieve controlled movement of the circuit board in the z-axis direction, the Rx rotation direction, and the Ry rotation direction by using an electromagnet formed by an extension post on the bottom surface of the circuit board.

[0041] 5. This application can realize controlled movement of the circuit board in the x-axis direction, y-axis direction and / or Rz-axis rotation direction through SMA-based components.

[0042] 6. This application can overcome the drawback of traditional module image stabilization which can only move the lens, and make its image stabilization more accurate by moving the chip.

[0043] 7. The anti-shake structure provided in this application has strong feasibility and design flexibility, which is conducive to mass production. Attached Figure Description

[0044] Figure 1 A side view schematic diagram of a photosensitive component with image stabilization function according to one embodiment of this application is shown;

[0045] Figure 2 A top view of the circuit board 10 and the driving module's location in one embodiment of this application is shown;

[0046] Figure 3 This illustration shows a schematic diagram of the structure and working mechanism of a sub-lift drive module in one embodiment of this application;

[0047] Figure 4 A schematic diagram illustrating the structure and working mechanism of a sub-lift drive module in another embodiment of this application is shown;

[0048] Figure 5 The diagram shows a side view of the structure and working mechanism of a sub-lift drive module in another embodiment of this application;

[0049] Figure 6 A side view of an x-axis drive module according to one embodiment of this application is shown;

[0050] Figure 7 A top view of a horizontal drive module in one embodiment of this application is shown;

[0051] Figure 8 A side view of an x-axis drive module according to another embodiment of this application is shown;

[0052] Figure 9 A top view schematic diagram of a horizontal drive module with Rz rotation function in one embodiment of this application is shown. Detailed Implementation

[0053] To better understand this application, various aspects of this application will be described in more detail with reference to the accompanying drawings. It should be understood that these detailed descriptions are merely illustrative of exemplary embodiments of this application and are not intended to limit the scope of this application in any way. Throughout the specification, the same reference numerals refer to the same elements. The expression "and / or" includes any and all combinations of one or more of the associated listed items.

[0054] It should be noted that in this specification, the terms "first," "second," etc., are used only to distinguish one feature from another and do not imply any limitation on the features. Therefore, without departing from the teachings of this application, the first subject discussed below may also be referred to as the second subject.

[0055] In the accompanying drawings, the thickness, size, and shape of the objects have been slightly exaggerated for ease of illustration. The drawings are for illustrative purposes only and are not drawn to scale.

[0056] It should also be understood that the terms "comprising," "including," "having," "containing," and / or "comprising," when used in this specification, indicate the presence of the stated features, integrals, steps, operations, elements, and / or components, but do not exclude the presence or addition of one or more other features, integrals, steps, operations, elements, components, and / or combinations thereof. Furthermore, when expressions such as "at least one of..." appear after a list of listed features, they modify the entire listed feature, not individual elements in the list. Additionally, when describing embodiments of this application, the word "may" is used to mean "one or more embodiments of this application." And the term "exemplary" is intended to refer to an example or illustration.

[0057] As used herein, the terms “basically,” “approximately,” and similar terms are used as terms of approximation rather than terms of degree, and are intended to describe inherent biases in measured or calculated values ​​that will be recognized by those skilled in the art.

[0058] Unless otherwise specified, all terms used herein (including technical and scientific terms) shall have the same meaning as commonly understood by one of ordinary skill in the art to which this application pertains. It should also be understood that terms (e.g., those defined in common dictionaries) shall be interpreted as having the meaning consistent with their meaning in the context of the relevant art and shall not be interpreted in an idealized or overly formal sense unless expressly so specified herein.

[0059] It should be noted that, unless otherwise specified, the embodiments and features described in this application can be combined with each other.

[0060] The present invention will be further described below with reference to the accompanying drawings and specific embodiments.

[0061] Figure 1 A side view schematic diagram of a photosensitive component with image stabilization function according to one embodiment of this application is shown. (Reference) Figure 1In this embodiment, the photosensitive assembly 100 includes a circuit board 10, a photosensitive chip 20 attached to the upper surface of the circuit board 10, a molding portion 30 formed on the upper surface of the circuit board 10 and surrounding the photosensitive chip 20, and a filter 40 (sometimes also called a color filter) mounted on the surface of the molding portion 30. In this embodiment, a support shaft 70 is connected to the bottom surface of the circuit board 10, and the support shaft 70 can be located in the central region of the circuit board 10. A base 60 is connected to the bottom end of the support shaft 70, and the edge portion of the base 60 can be connected to a support seat 61 (the support seat 61 can also be integrally formed with the base 60). The support seat 61 can be annular and surrounds the circuit board 10, maintaining a certain distance from the circuit board 10 to allow the circuit board 10 a certain horizontal movement space, and the top surface of the support seat 61 is higher than the top surface of the molding portion 30. The top surface of the support seat 61 can be used to support and bond the bottom surface of the optical lens assembly, thereby forming a complete camera module. In this embodiment, the photosensitive chip 20 can be electrically connected to the circuit board 10 via a wire bonding process. The metal wires (e.g., gold wire 12) used for the electrical connection can be covered by the molding portion 30 to reduce the height and lateral dimensions of the photosensitive assembly 100. Here, height refers to the dimension in the direction of the optical axis of the camera module (i.e., the normal direction of the photosensitive surface), and lateral dimension refers to the dimension in the direction perpendicular to the optical axis of the camera module. In this embodiment, a drive module 50 is provided between the bottom surface of the circuit board 10 and the base 60 to achieve controlled movement of the circuit board 10 relative to the base 60. When the photosensitive chip 20 vibrates, the drive device can drive the circuit board 10 to move, thereby moving the photosensitive chip 20 attached to the circuit board 10 to compensate for the vibration. In this embodiment, the photosensitive chip 20 is directly fixed to the upper surface of the circuit board 10. The photosensitive chip 20 and the circuit board 10 are connected by gold wires 12. The gold wires 12 are encapsulated in the base of the filter 40 (i.e., the molding part 30 mentioned above) using a molding process, which protects the gold wires 12 from breakage due to frequent movement of the circuit board 10. Simultaneously, the molding process effectively reduces the height of the module base 60. The optical lens can be directly fixed to the support base 61 with adhesive (in another embodiment, the top of the support base 61 can be designed with a threaded structure matching the optical lens, and the optical lens can be fixed to the support base 61 using the threaded structure). Due to the shaking of the shooting device, the components installed inside the shooting device will also shake accordingly. When the detection device detects this shaking, it can control the drive module 50 to drive the photosensitive chip 20 to perform corresponding shaking compensation, avoiding the adverse effects of shaking on the shooting process, thereby effectively improving the imaging quality of the module. The chip-based image stabilization structure is adopted. When the position of the image sensor 20 is offset relative to the optical axis of the lens (for example, when the shooting device shakes, causing the position of the image sensor 20 to move accordingly), the position detection module (…). Figure 1 (Not shown in the image) The offset of the photosensitive chip 20 can be detected and transmitted to the control center. The control center, according to a pre-set program, controls the photosensitive chip 20 to move to a certain extent to compensate for the effects caused by jitter. The drive module 50 provides power for the movement of the photosensitive chip 20 and the circuit board 10 as a whole, enabling the chip to move to a suitable position to compensate for jitter, thereby effectively improving the imaging quality of the module.

[0062] Furthermore, Figure 2 This diagram shows a top view illustrating the location of the circuit board 10 and the driver module in one embodiment of this application. (See reference) Figure 2 The driving module includes a multi-point lifting driving module. Typically, the photosensitive chip is rectangular. The multi-point lifting driving module may include four sub-lifting driving modules corresponding to the four corners of the photosensitive chip, namely, a first sub-lifting driving module 1, a second sub-lifting driving module 3, a third sub-lifting driving module 4, and a fourth sub-lifting driving module 6. The support shaft 70 may be elastic (e.g., elastic under specific conditions) to provide elastic support for the circuit board 10. Figure 2 The circuit board 10 is represented by a dashed line. The circuit board 10 includes a circuit board body, a flexible connecting strip 10a, and a connector 10b. The flexible connecting strip 10a connects the circuit board body and the connector 10b. In this text, the center of the circuit board 10 refers to the center of the circuit board body, which will not be elaborated further below. In this embodiment, when the four sub-lifting drive modules lift simultaneously (the direction of their driving force is parallel to the z-axis), the circuit board 10 is lifted as a whole, i.e., moves upward along the z-axis; when the four sub-lifting drive modules lower simultaneously, the circuit board 10 is moved downward as a whole, i.e., moves downward along the z-axis. Here, the z-axis is the normal direction of the photosensitive surface. In this embodiment, the sub-lifting drive modules can be implemented using the electromagnetic drive principle. Two electromagnets are respectively placed at corresponding positions on the bottom surface of the circuit board 10 and the top surface of the base 60. By controlling the magnitude and direction of the coil current, the magnitude of the interaction force between the magnetic poles of the two electromagnets can be controlled, thereby causing the circuit board 10 to move. In this embodiment, the multi-point lifting drive module can not only drive the circuit board 10 and the photosensitive chip to move along the z-axis, but also drive the circuit board 10 and the photosensitive chip to adjust their tilt angle in both pitch and yaw directions. Here, pitch can be denoted as Rx, representing rotation around the x-axis, and yaw can be denoted as Ry, representing rotation around the y-axis. Specifically, each sub-lifting drive module can be implemented based on the electromagnetic drive principle.

[0063] Furthermore, Figure 3 A schematic diagram of a sub-lift drive module according to one embodiment of this application is shown. (Reference) Figure 3In this embodiment, the sub-lifting drive module may include a first magnetic element 51a and a second magnetic element 51b. The first magnetic element 51a may be mounted (e.g., adhered to) the bottom surface of the circuit board 10, and the second magnetic element 51b may be mounted (e.g., adhered to) the upper surface of the base 60. In one example, the first magnetic element 51a may include a columnar metal core and a coil surrounding the metal core, the metal core being mounted (e.g., attached to) the bottom surface of the circuit board 10. The coil may be electrically connected to the circuit board 10, thereby controlling the magnitude and direction of the coil current through the circuitry arranged in the circuit board 10, thus controlling the direction and magnitude of the magnetic field of the first magnetic element 51a. Similarly, the second magnetic element 51b may also include a columnar metal core and a coil surrounding the metal core, the metal core being mounted on the upper surface of the base 60. The coil of the second magnetic element 51b may be electrically connected to the base 60 to control the direction and magnitude of the magnetic field of the second magnetic element 51b. The bottom surface of the first magnetic element 51a faces the top surface of the second magnetic element 51b. Thus, by controlling the direction of the current in the coils of the first and second magnetic elements 51a and 51b, the first and second magnetic elements 51a and 51b can be made to repel or attract each other. When the first and second magnetic elements 51a and 51b repel each other, the circuit board 10 is raised at the location of the sub-lifting drive module; when the first and second magnetic elements 51a and 51b attract each other, the circuit board 10 is lowered at the location of the sub-lifting drive module. The four sub-lifting drive modules located at the four corners have the same working principle and structure. When the four drive modules cooperate with each other, the circuit board 10 can be made to pitch (Rx) and / or sway left and right (Ry) as expected.

[0064] More specifically, the working principle of pitch (Rx) and lateral (Ry) sway is as follows: When the circuit board 10 needs to tilt, the second sub-lift drive module 3 and the fourth sub-lift drive module 6 are supplied with current of a specified direction and magnitude. Due to the mutual repulsion of the electromagnets, the circuit board 10 is lifted to a certain height at the corresponding position, achieving pitch sway. Simultaneously, the first sub-lift drive module 1 and the third sub-lift drive module 4 can be de-energized. Thus, when the positions of the second sub-lift drive module 3 and the fourth sub-lift drive module 6 are lifted by force, the positions of the first sub-lift drive module 1 and the third sub-lift drive module 4 will decrease, thus correcting the overall pitch position of the circuit board 10. Since the photosensitive chip is attached to the circuit board 10, the pitch position of the photosensitive chip will also be corrected along with the circuit board 10. If it is necessary to improve the response speed of adjusting the chip's tilt angle, the second sub-lift drive module 3 and the fourth sub-lift drive module 6 can be set to work simultaneously, while the first sub-lift drive module 1 and the third sub-lift drive module 4 work concurrently. In this embodiment, the electromagnets of the second sub-lift drive module 3 and the fourth sub-lift drive module 6 generate a repulsive force, while the electromagnets of the first sub-lift drive module 1 and the third sub-lift drive module 4 generate an attractive force. Since the driving force received by the circuit board 10 can be doubled, the pitch position adjustment of the chip can be completed in a short time. Furthermore, in this embodiment, the magnitude and direction of the coil current can be set according to actual needs, thereby adjusting the pitch angle of the photosensitive chip.

[0065] The principle of tilt correction in the left-right (Ry) direction is the same as that in the pitch direction. If it is necessary to improve the response speed of the photosensitive chip, multiple sub-lift drive modules can operate simultaneously. For example, the electromagnets of the first sub-lift drive module 1 and the second sub-lift drive module 3 generate a repulsive force, while the third sub-lift drive module 4 and the fourth sub-lift drive module 6 generate an attractive force, so as to adjust the position of the photosensitive chip in the left-right sway direction in a short time. Alternatively, in another example, only one pair of sub-lift drive modules (e.g., the first sub-lift drive module 1 and the second sub-lift drive module 3) can be energized, while another pair (e.g., the third sub-lift drive module 4 and the fourth sub-lift drive module 6) is not energized. This also achieves adjustment of the photosensitive chip's position in the left-right sway direction. Furthermore, in this embodiment, the magnitude and direction of the coil current can be set according to actual needs to adjust the left-right sway angle of the photosensitive chip. Furthermore, power can be supplied to only one of the sub-lift drive modules (e.g., the first sub-lift drive module 1) in one orientation, thereby adjusting the tilt angle of the circuit board 10 in that orientation (this tilt angle adjustment actually includes the adjustment of the pitch and yaw components).

[0066] Furthermore, in another embodiment of this application, in the sub-lifting drive module, the metal core can be directly formed on the bottom of the circuit board 10. For example, when the circuit board 10 is a PCB board (sometimes called a rigid board), the metal core can be formed directly on the bottom of the circuit board 10 by a copper plating process (or other metal implantation processes). The PCB board itself can be a multilayer board formed by alternating laminates of conductive and insulating layers. Different conductive layers can be electrically connected through vias, which are often filled with copper or other conductive materials. The process of forming the metal core can be implemented with reference to the copper plating process for forming vias. The root of the metal core can be formed inside the circuit board 10 and then extend out of the bottom surface of the circuit board 10. A pre-made coil can be wound on the metal core. It should be noted that the metal core and the conductive coil can be isolated by an insulating layer. In one embodiment, the insulating layer can be part of the pre-made coil, that is, the coil includes the insulating layer before the metal core is wound. Similarly, the metal core connected to the base 60 can also be directly formed on the upper surface of the base 60 by a copper plating process (or other metal implantation processes).

[0067] Furthermore, in another embodiment of this application, in the sub-lifting drive module, the metal core can be prefabricated and then attached (e.g., bonded) to the bottom surface of the circuit board 10. In this embodiment, the coil structure for forming a magnetic field can be directly fabricated on the surface of the metal core using an etching process (or other micromachining process). The coil structure and the metal core can be isolated by an insulating layer. This insulating layer can be a process layer in the etching process (or other micromachining process). For example, an insulating layer can be fabricated on the surface of the metal core first, then a metal layer can be laid, and then the metal layer can be etched to form the required coil structure. Similarly, the metal core connected to the base 60 can also be prefabricated and then bonded to the base 60. Furthermore, the coil structure for forming a magnetic field can be directly fabricated on the surface of the metal core using an etching process (or other micromachining process). In practical implementation, a large number of metal cores with coil structures can be batch-fabricated on a single substrate, and then individual metal cores with coil structures can be obtained by cutting, thereby improving production efficiency.

[0068] Furthermore, in one embodiment of this application, in the sub-lifting drive module, a magnet made of permanent magnet material can be used instead of an electromagnet attached to (e.g., bonded to) the bottom surface 11 of the circuit board 10. At the base 60, the electromagnet can be attached to (e.g., bonded to) the top surface of the base 60, thereby allowing the sub-lifting drive module to control the relative position and orientation of the circuit board 10 and the base 60 by controlling the direction and magnitude of the coil current. In one embodiment of this application, the base 60 can be implemented using a PCB board, in which circuitry can be laid out. This allows a portion of the circuitry on the circuit board 10 to be transferred to the base 60 (i.e., a portion of the functional circuitry can be built into the base 60), thereby reducing the wiring difficulty of the circuit board 10 and also helping to reduce the area and / or thickness of the circuit board 10. The base 60 can be directly connected to the motherboard of the terminal device to achieve power supply.

[0069] Furthermore, in one embodiment of this application, the metal core and coil on the upper surface of the base 60 can be replaced by a magnet. The magnet can be embedded in the base 60. Figure 4 The diagram illustrates the structure and working mechanism of a sub-lifting drive module in a modified embodiment of this application, wherein the second magnetic element 51b is a magnet embedded in the base 60, or a portion of the magnet may be embedded in the base 60. Figure 5 A schematic diagram of the structure and working mechanism of a sub-lifting drive module in a modified embodiment of this application is shown, wherein the second magnetic element 51b is a magnet, a portion of which is embedded in the base 60. This reduces the height occupied by the second magnetic element 51b connected to the base 60, thereby reducing the gap between the bottom surface 11 of the circuit board 10 and the upper surface of the base 60, and thus reducing the thickness of the photosensitive component. Furthermore, when the second magnetic element 51b of the base 60 is a magnet, the base 60 may not require circuitry; in this case, the base 60 may not need to use components such as a PCB board to implement the circuit structure. For example, the base 60 can be a molded board manufactured using a molding process. During molding, the magnet can be embedded or partially embedded in the module board. The support base 61 on the periphery of the base 60 can also be integrally formed using a molding process.

[0070] Furthermore, still referencing Figure 1In one embodiment of this application, multiple springs can be provided between the bottom surface of the circuit board 10 and the upper surface of the base 60. These springs can provide auxiliary support. Specifically, springs distributed at various locations can assist the central support shaft 70 in supporting the circuit board 10 and the various components fabricated or mounted on the circuit board 10. Multiple springs can be distributed around each of the sub-lifting drive modules. The springs can be helical, with their two ends connected to the bottom surface of the circuit board 10 and the upper surface of the base 60, respectively. The sub-lifting drive modules are generally strip-shaped and located inside the helical springs. The distributed arrangement of multiple springs can assist the support shaft 70, providing good support for the circuit board 10. Since this support is elastic, the drive module can still drive the circuit board 10 to move, thereby adjusting its position. The size and material of the springs can be determined according to actual conditions to ensure they have appropriate elasticity, thus enabling the springs to both provide auxiliary support for the circuit board and avoid hindering the drive module's operation (in other words, the spring arrangement does not place excessive demands on the drive module's driving force). For example, for each sub-lifting drive module, multiple springs with small elastic coefficients can be arranged around it to provide auxiliary support while avoiding obstruction to the drive of the sub-lifting drive module. Of course, the arrangement of the springs is not limited to their distribution around the sub-lifting drive modules. For example, in another embodiment, all or some of the springs can be arranged between the sub-lifting drive modules (e.g., at a distance from each sub-lifting drive module). This arrangement can also assist in supporting the shaft 70, providing good support for the circuit board 10, while the drive module can still drive the circuit board 10 to move, thereby adjusting its position. In other embodiments, the springs can be replaced with elastic components of other shapes, as long as they provide auxiliary support for the circuit board 10 and the components fabricated or mounted on the circuit board 10, and the arrangement of these springs does not affect the drive structure's drive of the circuit board 10 in different directions.

[0071] Furthermore, in one embodiment of this application, the support shaft 70 may be an elastic component to allow the circuit board 10 to move in both lifting and lowering directions.

[0072] Furthermore, in one embodiment of this application, the support shaft 70 can be made of shape memory alloys (SMA). Thus, by changing the temperature of the support shaft 70, it can be made to possess a certain degree of elasticity. This elasticity is sometimes referred to as the pseudoelasticity or superelasticity of the shape memory alloy. Utilizing the pseudoelasticity or superelasticity of the shape memory alloy, the support shaft 70 can be allowed to undergo a certain degree of deformation, thereby realizing the lifting, pitching, and lateral swaying movements of the circuit board 10 under the drive of each sub-lifting drive module.

[0073] In some embodiments of this application, the stretchability of shape memory alloys (SMAs) is utilized. Thermoelastic martensitic phase transformation occurs within the material of a shape memory alloy, enabling components made from it to recover their original shape after deformation. Typically, shape memory alloys can possess a high-temperature austenitic phase and a low-temperature martensitic phase. Depending on different thermodynamic loading conditions, shape memory alloys can exhibit both properties. Some shape memory alloys exhibit a one-way memory effect; for example, a shape memory alloy deformed at a lower temperature can recover its original shape upon heating. This effect can be used to fabricate SMA push rods as described in some embodiments (described in more detail below). Some shape memory alloys recover their high-temperature phase shape when the temperature rises and their low-temperature phase shape when the temperature falls, exhibiting a two-way memory effect. These types of shape memory alloys can also be used to fabricate SMA components as described in some embodiments of this application. After the SMA component undergoes a thermoelastic martensitic phase transformation, the resulting martensite can stretch as the temperature decreases and contract as the temperature increases. Therefore, this type of shape memory alloy can be used as a material for fabricating SMA wires in some embodiments (a more detailed description of the application of SMA wires in this application will be provided below).

[0074] Furthermore, for some shape memory alloys, martensitic phase transformation can be induced not only by temperature but also by stress. For this stress-induced martensitic phase transformation, the transformation temperature is linearly related to the stress. Utilizing this characteristic, the support shaft 70 in some embodiments of this application can be fabricated. Under the action of a drive module (e.g., a multi-point lifting drive module), the stress in the support shaft 70 changes, thereby inducing a martensitic phase transformation, which in turn changes the length of the support shaft 70, giving it a certain degree of elasticity (here, elasticity refers to the pseudoelasticity or hyperelasticity of SMA).

[0075] Furthermore, in one embodiment of this application, the driving module may further include a horizontal driving module. The horizontal driving module may also be referred to as a radial driving module. The horizontal or radial direction can be understood as various directions of movement parallel to the photosensitive surface of the photosensitive chip. Still referring to... Figure 2 The radial drive module may include a first x-axis drive module 2 and a second x-axis drive module 5, which can be implemented based on shape memory alloy technology. Figure 6 A side view of an x-axis drive module according to one embodiment of this application is shown. (Reference) Figure 6 The x-axis drive module includes a base extension block 62, an SMA push rod 52, a push rod block 53, and a bottom extension block 13. The base extension block 62 extends upward from the top surface of the base 60. The bottom extension block 13 extends downward from the bottom surface of the circuit board 10. The bottom extension block 13 can be pre-formed and then bonded to the bottom surface of the circuit board 10, or it can be made directly on the circuit board 10 (e.g., using a copper plating process). The SMA push rod 52 is made of SMA material (i.e., shape memory alloy). One end of the SMA push rod 52 is connected to the base extension block 62, and the other end is connected to the push rod block 53. The SMA push rod 52 can be in a horizontal position, and the push rod block 53 and the bottom extension block 13 are arranged opposite each other (relative arrangement refers to relative positioning, with the side of the push rod block 53 and the side of the bottom extension block 13 close to each other and approximately parallel). In the non-working state, there can be a gap between the two (push rod block 53 and bottom extension block 13). When the SMA push rod 52 is within a certain temperature range, it will extend and retract with temperature changes. Therefore, controlling the temperature of the SMA push rod 52 (e.g., heating it up) allows it to extend, causing the push rod block 53 to contact the side of the bottom extension block 13. As the SMA push rod 52 continues to extend, the push rod block 53 will push the bottom extension block 13 to move in the positive x-axis direction (see reference). Figure 6 This causes the circuit board 10 and the chips on it to move in the positive x-axis direction. In this embodiment, the central support shaft 70 can have a certain degree of elasticity, thereby allowing the circuit board 10 to move in the positive x-axis direction under the push of the SMA push rod 52. Figure 6 This can be considered a schematic diagram of the working principle of the second x-axis drive module 5. The first x-axis drive module 2 can adopt a similar working mechanism to enable the circuit board 10 and the chips on the circuit board 10 to move in the negative x-axis direction.

[0076] Furthermore, Figure 7 A top view schematic diagram of a horizontal drive module according to one embodiment of this application is shown. (Reference) Figure 7In this embodiment, the horizontal drive module may include two x-axis drive modules and two y-axis drive modules. The two x-axis drive modules may be arranged along the x-axis at both ends of the support shaft 70, and the two y-axis drive modules may be arranged along the y-axis at both ends of the support shaft 70. The specific design and arrangement of the y-axis drive modules can be referred to the description of the x-axis drive modules above, and will not be repeated here.

[0077] Furthermore, in one embodiment of this application, the SMA push rod can be self-heated by an electric current to reach the temperature required for extending the SMA push rod. The SMA push rod can be arranged in a folded shape. The leads of the connecting circuit board can be arranged along the support shaft to connect to the two electrodes (input electrode and output electrode) of the SMA push rod. Due to the folded shape, both electrodes of the SMA push rod can be arranged at the end connected to the support shaft. The folded part of the SMA push rod is considered as the other end of the SMA push rod, and the push rod block can be connected to the SMA push rod at this end, that is, connected to the SMA push rod at the folded part.

[0078] Furthermore, Figure 8 A side view schematic diagram of an x-axis drive module according to another embodiment of this application is shown. (Reference) Figure 8 In this embodiment, the horizontal drive module can be implemented based on the SMA line 54, with both ends of the SMA line 54 connected to the bottom extension block 13 and the support base 61, respectively. The two ends of the SMA line 54 are taut, forming a certain tension. By controlling the temperature, the SMA line 54 can be contracted, thereby causing the bottom extension block 13 and the circuit board 10 to move in the positive x-axis direction. Specifically, an SMA line 54 that contracts with increasing temperature can be used. The support shaft 70 can have a certain elasticity, and in its natural state, the support shaft 70 can be biased towards the negative x-axis direction. Heating causes the SMA line 54 to contract to overcome the elasticity of the support shaft 70, pulling the support shaft 70 towards the center, thus completing the calibration of the reference state. Based on this reference state, when the temperature continues to rise, the SMA line 54 can continue to contract to achieve movement of the circuit board 10 in the positive x-axis direction, while cooling can control the degree of contraction of the SMA line 54 to weaken, and under the action of the elasticity of the support shaft 70, movement of the circuit board 10 in the negative x-axis direction can be achieved. In other words, in this embodiment, bidirectional movement along the x-axis can be achieved using a single x-axis drive module. However, this application is not limited to this type of x-axis drive module. For example, in another embodiment, two x-axis drive modules based on SMA lines 54 can be symmetrically arranged. By simultaneously controlling the temperature of both x-axis drive modules, causing the SMA lines 54 of one x-axis drive module to contract while the SMA lines 54 of the other x-axis drive module extend (or the degree of contraction decreases), movement of the circuit board 10 in the positive or negative x-axis direction can be achieved.

[0079] Furthermore, in one embodiment of this application, the SMA line 54 can be self-heated by an electric current, thereby achieving controlled extension and retraction of the SMA line 54. The current to the SMA line 54 can be directly provided by the base 60, which can be molded into a hollow structure, directly leading the connection point of the SMA line 54 out from the base. Other lines can also be directly placed inside the base 60, thereby better protecting the circuit. In this embodiment, a portion of the circuitry of the circuit board 10 can be transferred to the base 60 (i.e., a portion of the functional circuitry can be built into the base 60), thereby reducing the wiring difficulty of the circuit board 10 and also helping to reduce the area and / or thickness of the circuit board 10. The base 60 can be directly connected to the motherboard of the terminal device to achieve power supply.

[0080] In the above embodiments, the SMA wire may not be rigid, and therefore can have a smaller wire diameter, thereby saving SMA material.

[0081] Furthermore, in one embodiment of this application, the horizontal drive module can be implemented based on an SMA line. Specifically, the horizontal drive module may include a bottom extension block and an SMA line. One end of the SMA line is connected to the bottom extension block, and the other end is connected to a base extension block. The base extension block extends upward from the top surface of the base, and the bottom extension block extends downward from the bottom surface of the circuit board. The position of the base extension block can be referenced... Figure 6 .and Figure 6Compared to the previous embodiment, this embodiment replaces the SMA push rod and its push rod block with an SMA line. Further, in one embodiment of this application, the horizontal drive module may include an x-axis drive module and a y-axis drive module. Both the x-axis drive module and the y-axis drive module can be implemented based on SMA lines. That is, the two ends of the SMA line can be connected to the bottom extension block 13 and the support base 61, respectively. The two ends of the SMA line are tightened to form a certain tension. By controlling the temperature, the SMA line can be contracted, thereby causing the bottom extension block 13 and the circuit board 10 to move in the positive or negative direction of the x-axis or y-axis. It should be noted that in this embodiment, the SMA lines of the x-axis drive module and the SMA lines of the y-axis drive module are perpendicular to each other. In actual operation, the mutual influence of the two axes needs to be considered. For example, the contraction or extension of the x-axis SMA line may cause the y-axis SMA line to tilt to a certain extent, thereby changing the required length of the y-axis SMA line. That is, the y-axis SMA line may need to be adapted to accommodate the movement of the circuit board 10 in the x-axis direction. Conversely, the extension and retraction of the SMA line on the y-axis also requires the SMA line on the x-axis to adapt to the movement of the circuit board 10 in the y-axis direction. In one embodiment, the required displacement vector of the circuit board 10 can be pre-calculated, and then the required lengths of the SMA lines on the x-axis and y-axis based on the displacement vector can be calculated. The extension and retraction of the SMA lines on the x-axis and y-axis can be controlled according to the calculated lengths. In this embodiment, bidirectional movement of the x-axis and y-axis, as well as combined movement in the x-axis and y-axis directions (i.e., vector displacement with both x-axis and y-axis components) can be achieved through a single x-axis drive module, a single y-axis drive module, and the elasticity of the support shaft 70 itself. In another embodiment, bidirectional movement of the x-axis and y-axis, as well as combined movement in the x-axis and y-axis directions, can be achieved using two symmetrically arranged x-axis drive modules and two symmetrically arranged y-axis drive modules.

[0082] Furthermore, in one embodiment of this application, in the horizontal drive module, at least one x-axis drive module can be offset from the center of the support axis 70 (here, offset can be understood as: the central axis of the SMA line or SMA push rod of the x-axis drive module does not coincide with the x-axis central axis ax1 of the circuit board 10, see reference). Figure 9In a certain position, the SMA lines of the x-axis drive module generate a certain torque (torque with the center of rotation around the support shaft 70) when contracting or extending, thereby realizing the rotation of the circuit board 10 around the z-axis, i.e., rotation in the Rz direction. Here, the z-axis direction is the normal direction of the photosensitive surface of the photosensitive chip. In another embodiment of this application, in the horizontal drive module, at least one x-axis drive module and at least one y-axis drive module can both be offset from the center of the support shaft 70 by a certain position, so that the SMA lines of the x-axis drive module and the y-axis drive module generate a certain torque when contracting or extending, thereby realizing the rotation of the circuit board 10 around the z-axis, i.e., rotation in the Rz direction. This design can increase the total torque provided by the horizontal drive module, which helps to improve the response speed in the Rz direction, thereby enhancing the anti-shake capability in the Rz direction.

[0083] Furthermore, Figure 9 A top view schematic diagram of a horizontal drive module with Rz rotation function according to one embodiment of this application is shown. (Reference) Figure 9 In this embodiment, there may be an even number of x-axis drive modules, and the even number of x-axis drive modules are symmetrically arranged on both sides of the x-axis centerline ax1 of the circuit board 10. The circuit board 10 is driven to translate along the x-axis by the synchronous application of driving force by the x-axis drive modules on both sides of the x-axis centerline ax1. Torque is generated by the application of driving force by the x-axis drive module located on one side of the x-axis centerline ax1, thereby driving the circuit board 10 to rotate around the z-axis. The x-axis centerline ax1 is the centerline of the circuit board 10 that is parallel to the x-axis.

[0084] Furthermore, still referencing Figure 9 In one embodiment of this application, the y-axis drive module may be an even number, and the even number of y-axis drive modules are symmetrically arranged on both sides of the y-axis centerline ax2 of the circuit board 10; wherein, the circuit board 10 is driven to translate along the y-axis by the synchronous application of driving force by the y-axis drive modules on both sides of the y-axis centerline ax2; and torque is generated by the joint application of driving force by the x-axis drive module located on one side of the x-axis centerline ax1 and the y-axis drive module located on one side of the y-axis centerline ax2, thereby driving the circuit board 10 to rotate around the z-axis; wherein the y-axis centerline ax2 is the centerline of the circuit board 10 parallel to the y-axis. (Reference) Figure 9 The solid arrows indicate the driving forces of the x-axis and y-axis drive modules when the drive circuit board rotates clockwise in the Rz direction. The SMA push rods of the y-axis drive module to the left of the y-axis centerline ax2 and the x-axis drive module below the x-axis centerline ax1 both extend due to heat, thus producing... Figure 9The solid arrows indicate the driving force, which in turn generates a clockwise torque centered on the support shaft (i.e., the circuit board center). The dashed arrows mark the driving forces of the x-axis and y-axis drive modules when the circuit board rotates counter-clockwise in the Rz direction. The SMA push rods of the y-axis drive module to the right of the y-axis ax2 and the x-axis drive module above the x-axis ax1 are both heated and extended, thus generating... Figure 9 The driving force indicated by the dashed arrow generates a counterclockwise torque with the center of rotation around the support shaft (i.e., the center of the circuit board).

[0085] In one embodiment of this application, multiple sub-driving modules can be disposed between the circuit board 10 of the photosensitive component and the base 60. These sub-driving modules can be arranged in an array. Some of the sub-driving modules are the sub-lifting driving modules, and others are sub-horizontal driving modules (their structure can be consistent with the x-axis or y-axis driving modules in any of the previous embodiments). In the sub-lifting driving modules, the metal core is disposed on the bottom surface of the circuit board 10. In the sub-horizontal driving modules, the bottom extension block 13 is disposed on the bottom surface of the circuit board 10. These metal cores or extension blocks on the bottom surface of the circuit board 10 not only help to realize the movement of the circuit board 10 and the chip in various degrees of freedom, but also help to strengthen the structural strength of the circuit board 10, thereby reinforcing the photosensitive chip and thus avoiding or suppressing the warping of the photosensitive chip due to various interference factors such as external force, temperature, and humidity. Currently, camera modules are developing towards larger chip sizes (larger photosensitive surfaces). Due to the increased chip area, how to solve the chip warping problem during manufacturing and use has become a difficult point in the technological advancement of camera modules. In this embodiment, since the bottom surface of the circuit board 10 is provided with an array of multiple metal cores or extension blocks, the chip anti-shake function can be achieved while also strengthening the structural strength of the circuit board 10, helping to solve the problem of large-size chips being easily bent during module assembly and use. It should be noted that the multiple metal cores or extension blocks on the bottom surface of the circuit board 10 are not limited to a regular array arrangement; even if these metal cores or extension blocks are irregularly scattered, the structural strength of the circuit board 10 can still be strengthened, helping to solve the problem of large-size chips being easily bent during module assembly and use.

[0086] In the above embodiments, the sub-lifting drive modules are all based on the electromagnetic drive principle. However, this application is not limited to this. In another embodiment of this application, four SMA elements can be set at the four corners of the circuit board 10 as connectors between the circuit board 10 and the base 60. The operation of these four connectors can be independent or synchronous. Utilizing the characteristics of SMA, more precise tilt (i.e., angle of inclination) adjustment of the circuit board 10 can be achieved by cooperating in multiple directions. In the initial state, the SMA elements can support the circuit board 10 and connect the circuit board 10 and the base 60. When an external influence causes the SMA elements to deform, it can drive the corresponding position of the circuit board 10 (i.e., the position connected to the SMA element) to move in a certain set direction, thereby adjusting the chip position. This method can achieve both left-right swaying and pitch swaying of the chip.

[0087] Furthermore, in one embodiment of this application, a camera module is also provided, which may include an optical lens and a photosensitive component with image stabilization as described in any of the preceding embodiments. The optical lens may be mounted on the top surface of the support 61 of the photosensitive component. In this embodiment, the photosensitive chip can be moved in a controlled manner relative to the support 61 in multiple directions, thereby providing image stabilization capability for the camera module.

[0088] Furthermore, in one embodiment of this application, the camera module may include an optical lens and a photosensitive component with image stabilization as described in any of the preceding embodiments. The optical lens may include a motor, which provides optical image stabilization and focusing functions. The bottom surface of the motor may be mounted on the top surface of the support 61 of the photosensitive component. In this embodiment, the lens and the photosensitive chip can be adjusted independently relative to the support 61, thereby better achieving image stabilization and improving shooting quality. In the camera module of this embodiment, the photosensitive component can achieve controlled movement of the chip in multiple directions with a reduced volume, achieving chip image stabilization while ensuring device miniaturization, thus contributing to a reduction in the size of the camera module.

[0089] The above description is merely a preferred embodiment of this application and an explanation of the technical principles employed. Those skilled in the art should understand that the scope of the invention involved in this application is not limited to technical solutions formed by specific combinations of the above-described technical features, but should also cover other technical solutions formed by arbitrary combinations of the above-described technical features or their equivalents without departing from the inventive concept. For example, technical solutions formed by substituting the above-described features with (but not limited to) technical features with similar functions disclosed in this application.

Claims

1. A photosensitive component with image stabilization function, characterized in that, include: Circuit board; A photosensitive chip, which is attached to the circuit board; A base located below the circuit board and connected to the circuit board via a support shaft, wherein the support shaft is elastic; A support base, wherein the support base is located at the edge portion of the base, the support base surrounds the circuit board, and there is a gap between the support base and the circuit board, the support base being used to mount an optical lens; as well as A drive module is disposed between the bottom surface of the circuit board and the base. It includes a multi-point lifting drive module to realize the controlled movement of the circuit board relative to the base, so that the photosensitive chip can perform shake compensation independently of the optical lens.

2. The photosensitive component according to claim 1, characterized in that, The multi-point lifting drive module includes four sub-lifting drive modules corresponding to the four corners of the photosensitive chip. The four sub-lifting drive modules are configured to have the direction of the driving force parallel to the z-axis. When the four sub-lifting drive modules lift simultaneously, the circuit board is lifted as a whole.

3. The photosensitive component according to claim 2, characterized in that, When the four sub-lifting drive modules descend simultaneously, the circuit board moves downward.

4. The photosensitive component according to claim 2, characterized in that, The circuit board is rectangular; the sub-lifting drive modules are respectively located at the four corners of the circuit board.

5. The photosensitive component according to claim 2, characterized in that, The sub-lifting drive module includes a first magnetic element connected to the bottom surface of the circuit board and a second magnetic element connected to the base.

6. The photosensitive component according to claim 5, characterized in that, The first magnetic element includes a metal core connected to the bottom surface of the circuit board and a coil disposed on the metal core; or the first magnetic element is a magnet.

7. The photosensitive component according to claim 5, characterized in that, The second magnetic element includes a metal core connected to the top surface of the base and a coil disposed on the metal core.

8. The photosensitive component according to claim 5, characterized in that, The second magnetic element is a magnet, which is embedded or partially embedded in the base.

9. The photosensitive component according to claim 2, characterized in that, The photosensitive component also includes elastic support elements connecting the base and the circuit board, and the plurality of elastic support elements provide distributed elastic support at multiple locations on the circuit board.

10. The photosensitive component according to claim 9, characterized in that, The elastic support element includes multiple springs, with the two ends of each spring connected to the bottom surface of the circuit board and the top surface of the base, respectively.

11. The photosensitive component according to claim 3, characterized in that, The sub-lift drive module is also adapted to synchronously drive the circuit board to rise or fall, so as to adjust the height of the circuit board relative to the base.

12. The photosensitive component according to claim 2, characterized in that, The driving module further includes a second driving module, which includes a shape memory alloy push rod, a push rod block, a bottom extension block, and a base extension block; the base extension block extends upward from the top surface of the base, the two ends of the shape memory alloy push rod are respectively connected to the base extension block and the push rod block, the bottom extension block extends from the bottom surface of the circuit board, and the push rod block and the side surface of the bottom extension block are arranged opposite to each other.

13. The photosensitive component according to claim 12, characterized in that, When the shape memory alloy push rod is at room temperature, the push rod block and the side of the bottom extension block are spaced apart; the shape memory alloy push rod is adapted to extend after the temperature rises, so that the push rod block contacts and pushes the bottom extension block to move in the horizontal direction.

14. The photosensitive component according to claim 1, characterized in that, The driving module further includes a second driving module, which includes a bottom extension block and a shape memory alloy wire; one end of the shape memory alloy wire is connected to the bottom extension block, and the other end is connected to the support base; the bottom extension block is formed by extending downward from the bottom surface of the circuit board.

15. The photosensitive component according to claim 1, characterized in that, The driving module further includes a second driving module, which includes a bottom extension block and a shape memory alloy wire; one end of the shape memory alloy wire is connected to the bottom extension block, and the other end is connected to the base extension block; the base extension block is formed by extending upward from the top surface of the base, and the bottom extension block is formed by extending downward from the bottom surface of the circuit board.

16. The photosensitive component according to claim 1, characterized in that, The driving module further includes a second driving module, which includes a bottom extension block, a shape memory alloy push rod, and a push rod block. The two ends of the shape memory alloy push rod are respectively connected to the support base and the push rod block. The bottom extension block extends downward from the bottom surface of the circuit board, and the push rod block is arranged opposite to the side surface of the bottom extension block.

17. The photosensitive component according to claim 14, 15 or 16, characterized in that, The drive module includes at least one x-axis drive module and at least one y-axis drive module, wherein the x-axis drive module is the second drive module arranged along the x-axis direction and is adapted to drive the circuit board to move along the x-axis, and the y-axis drive module is the second drive module arranged along the y-axis direction and is adapted to drive the circuit board to move along the y-axis.

18. The photosensitive component according to claim 17, characterized in that, The x-axis drive module is arranged on the x-axis of the circuit board, wherein the x-axis is the central axis of the circuit board that is parallel to the x-axis.

19. The photosensitive component according to claim 18, characterized in that, The y-axis drive module is arranged on the circuit board along the y-axis, where the y-axis is the central axis of the circuit board parallel to the y-axis.

20. The photosensitive component according to claim 17, characterized in that, The x-axis drive modules are an even number, and the even number of x-axis drive modules are symmetrically arranged on both sides of the x-axis of the circuit board; wherein, the circuit board is driven to translate along the x-axis by the synchronous application of driving force by the x-axis drive modules on both sides of the x-axis; and the circuit board is driven to rotate about the z-axis by the torque generated by the driving force applied by the x-axis drive module located on one side of the x-axis; wherein the x-axis is the central axis of the circuit board that is parallel to the x-axis.

21. The photosensitive component according to claim 20, characterized in that, The y-axis drive modules are an even number, and the even number of y-axis drive modules are symmetrically arranged on both sides of the y-axis centerline of the circuit board. The circuit board is driven to translate along the y-axis by the synchronous application of driving force by the y-axis drive modules on both sides of the y-axis centerline. A torque is generated by the joint application of driving force by the x-axis drive module located on one side of the x-axis centerline and the y-axis drive module located on one side of the y-axis centerline, thereby driving the circuit board to rotate around the z-axis. The y-axis centerline is the centerline of the circuit board that is parallel to the y-axis.

22. The photosensitive component according to claim 1, characterized in that, The photosensitive component also includes: A metal wire, the two ends of which are electrically connected to the circuit board and the photosensitive chip, respectively; A filter, located above the photosensitive chip; and A filter holder is formed on the upper surface of the circuit board and surrounds the photosensitive chip, and the filter is mounted on the filter holder.

23. The photosensitive component according to claim 22, characterized in that, The filter holder is a molded part on the upper surface of the circuit board, which is manufactured by a molding process, and the metal wire is covered by the molded part.

24. The photosensitive component according to claim 1, characterized in that, The support base and the base are integrally formed.

25. A camera module, characterized in that, include: Optical lens; The photosensitive assembly according to any one of claims 1-24, wherein the optical lens is mounted on the support of the photosensitive assembly.

26. The camera module according to claim 25, characterized in that, The optical lens has a motor, the bottom of which is mounted on the top surface of the support of the photosensitive component.

Images