A charging device and a charging system

Abstract

This application provides a charging device and a charging system, relating to the field of energy technology, to solve problems such as complex heat dissipation structures and high costs in charging devices. The charging device provided by this application includes a composite heat exchanger, a first electronic device, a second electronic device, and a housing. The composite heat exchanger includes a first heat exchanger body and a second heat exchanger body. The first heat exchanger body has a heat-conducting part and a heat-dissipating part. The second heat exchanger body has an evaporation end and a condensation end, and has a chamber containing a cooling medium that can flow between the evaporation end and the condensation end. The first electronic device is thermally connected to the heat-conducting part; the second electronic device is thermally connected to the evaporation end; the housing is connected to the heat-conducting part and the evaporation end, forming a sealed receiving cavity; both the first and second electronic devices are located within the receiving cavity. The charging device provided by this application has advantages such as simple structure and good heat dissipation effect, and can ensure the airtightness of the first and second electronic devices.

Description

Technical Field

[0001] This application relates to the field of energy technology, and in particular to a charging device and a charging system. Background Technology

[0002] With the continuous development and popularization of new energy vehicles, the number of charging facilities deployed is also gradually increasing. Charging facilities typically include various types of electrical components, some of which generate a significant amount of heat during operation. To ensure the charging facilities operate within their normal temperature range, heat dissipation is usually required for these electronic components. Currently, air cooling and liquid cooling are commonly used for heat dissipation. Air cooling typically uses fans to generate airflow, which quickly passes over the surface of the heat-generating components, carrying away the heat. However, this method easily leads to the accumulation of dust and other impurities on the surface of the electronic components, affecting their reliability and lifespan. Liquid cooling places high demands on the airtightness and reliability of the liquid cooling pipes, resulting in complex structures, high construction difficulty, and high costs. Summary of the Invention

[0003] This application provides a charging device and charging system that is simple in structure, low in cost, and can achieve a high level of protection.

[0004] In a first aspect, this application provides a charging device, which may include a composite heat exchanger, a first electronic device, a second electronic device, and a housing. The composite heat exchanger includes a first heat exchanger body and a second heat exchanger body fixedly connected. The first heat exchanger body has a heat-conducting part and a heat-dissipating part. The first electronic device is thermally connected to the heat-conducting part; therefore, the heat generated by the first electronic device can be transferred to the heat-dissipating part for heat dissipation, thereby cooling the first electronic device. The second heat exchanger body has an evaporation end and a condensation end, and a chamber is provided within the second heat exchanger body. A cooling medium is disposed within the chamber, and the cooling medium can circulate between the evaporation end and the condensation end. The second electronic device is thermally connected to the evaporation end. After the heat generated by the second electronic device is transferred to the evaporation end, the cooling medium located near the evaporation end in the chamber is heated and evaporates, and then releases heat and condenses at the condensation end. That is, the second heat exchanger mainly relies on the circulation of the cooling medium between the evaporation end and the condensation end to achieve its heat dissipation function. The housing is connected to the heat-conducting part and the evaporation end, forming a sealed cavity. The first electronic device and the second electronic device are both located in the cavity, thereby ensuring the airtightness of the first electronic device and the second electronic device.

[0005] In one example, the heat-conducting part and the evaporating end can be thermally connected to improve the heat dissipation efficiency of the composite heat exchanger. For instance, in some cases, the heat from the first electronic device can be dissipated not only through the first heat exchanger but also through the second heat exchanger. Similarly, the heat from the second electronic device can be dissipated not only through the second heat exchanger but also through the first heat exchanger. This effectively utilizes the heat dissipation capacity of the composite heat exchanger, thus improving its overall heat dissipation efficiency.

[0006] In a specific configuration, the heat-conducting part has a first contact surface, and the evaporation end has a second contact surface. The first electronic device is thermally connected to the first contact surface, and the second electronic device is thermally connected to the second contact surface.

[0007] The first contact surface can be a plane or a curved surface. For example, the first contact surface can have a protrusion or a groove, and the first electronic device can be thermally connected to the protrusion or groove to ensure good fit for first electronic devices of different sizes.

[0008] Of course, in specific configurations, the second contact surface can be either flat or curved. Alternatively, the second contact surface can also have protrusions or grooves.

[0009] The first contact surface and the second contact surface can be arranged adjacent to each other, and the first contact surface and the second contact surface have the same orientation, so that the first contact surface and the second contact surface can form a generally flat surface.

[0010] Alternatively, in some examples, the first contact surface and the second contact surface may be set opposite to each other or at an angle.

[0011] In addition, in some examples, the heat dissipation part of the first heat exchanger may have a first recess, and the condensation end of the second heat exchanger is located in the first recess, so as to reduce the volume of the entire composite heat exchanger and facilitate the miniaturization of the composite heat exchanger.

[0012] In some examples, the condenser end of the second heat exchanger may have a second recess, and the heat dissipation portion of the first heat exchanger is located within the second recess.

[0013] Alternatively, it can be understood that, when setting up, the first heat exchanger and the second heat exchanger can be arranged side by side or stacked.

[0014] In addition, the heat dissipation section has a first airflow channel, and the condensation end has a second airflow channel. The charging device may also include a fan, which can make air flow more quickly through the first and second airflow channels, thereby improving the heat exchange efficiency of the composite heat exchanger.

[0015] In specific configurations, the first airflow channel and the second airflow channel can be connected, or the first airflow channel and the second airflow channel can be configured in parallel.

[0016] When the first airflow channel and the second airflow channel are connected, the first airflow channel can be located downstream of the second airflow channel. That is, the cooling airflow can pass through the second airflow channel first and then through the first airflow channel to prioritize the heat dissipation effect of the second electronic device.

[0017] In some examples, the first and second electronic devices can also be thermally connected to the housing. That is, the heat generated by the first and second electronic devices can be dissipated through the housing.

[0018] Secondly, this application also provides a charging system, which may include the aforementioned charging device and charging terminal. The charging device may have an output port, and the charging terminal may be connected to the output port. The electrical energy processed by the charging device may be provided to the charging terminal to replenish the electrical energy of the powered device (such as a vehicle).

[0019] In specific installations, the charging device can be installed on the ground or on a wall, etc. This application does not limit the specific installation location and form of the charging device. Attached Figure Description

[0020] Figure 1 This is a schematic diagram illustrating an application scenario of a charging device provided in an embodiment of this application;

[0021] Figure 2 A simplified structural diagram of the side of a charging device provided in an embodiment of this application;

[0022] Figure 3 A simplified side view of another charging device provided in an embodiment of this application;

[0023] Figure 4 for Figure 3 Top view;

[0024] Figure 5 A simplified side view of another charging device provided in the embodiments of this application;

[0025] Figure 6 for Figure 5 Top view;

[0026] Figure 7 A simplified side view of another charging device provided in the embodiments of this application;

[0027] Figure 8 This application provides a schematic diagram of the layout of the heat dissipation end and the condensation end positions in an embodiment of the present application.

[0028] Figure 9 This is an exploded structural diagram of a composite heat exchanger provided in an embodiment of this application;

[0029] Figure 10 This is a simplified structural diagram of a charging system provided in an embodiment of this application. Detailed Implementation

[0030] To make the objectives, technical solutions, and advantages of this application clearer, the application will now be described in further detail with reference to the accompanying drawings.

[0031] To facilitate understanding of the charging device provided in the embodiments of this application, its application scenarios will be introduced first below.

[0032] like Figure 1 As shown, in one example provided in this application, the charging device 10 can be used to charge the vehicle 20. Specifically, the charging device 10 can be a charging pile, and it can be installed near a parking space. In practical applications, the input end of the charging device 10 can be connected to the power grid 30, and the output end of the charging device 10 can be connected to the charging gun 50 via a cable 40 to charge the vehicle 20. The electrical energy in the power grid 30 can be industrial electricity (e.g., AC voltage of 380V) or residential electricity (e.g., AC voltage of 22V), etc.

[0033] In practical applications, the charging device 10 may have functions such as overload protection and power conversion. The charging device 10 typically includes electronic components such as transistors, transformers, inductors, capacitors, or relays. Some of these electronic components generate heat during normal operation; therefore, heat dissipation is necessary to keep the charging device 10 within its normal operating temperature range.

[0034] Currently, charging devices generally use either air cooling or liquid cooling to dissipate heat.

[0035] For example, in air-cooled charging devices, a fan typically generates airflow that quickly passes over the surface of electronic components, thus carrying away heat. However, this method can easily cause dust and other impurities to accumulate on the surface of electronic components, affecting their reliability and lifespan.

[0036] In charging equipment that uses liquid cooling, there are high requirements for the airtightness and reliability of the liquid cooling pipelines, which presents problems such as complex structure, high construction difficulty and high cost.

[0037] In view of this, embodiments of this application provide a charging device 10 with a simple structure, low cost, and high protection level, as well as a charging system using the charging device 10.

[0038] To make the objectives, technical solutions, and advantages of this application clearer, the application will be further described in detail below with reference to the accompanying drawings and specific embodiments.

[0039] The terminology used in the following embodiments is for the purpose of describing particular embodiments only and is not intended to be limiting of this application. As used in the specification and appended claims of this application, the singular expressions “a,” “an,” and “the” are intended to also include expressions such as “one or more,” unless the context clearly indicates otherwise. It should also be understood that in the following embodiments of this application, “at least one” means one, two, or more.

[0040] References to "one embodiment" and similar terms used in this specification mean that one or more embodiments of this application include a particular feature, structure, or characteristic described in connection with that embodiment. Therefore, phrases such as "in one embodiment," "in some embodiments," and "in other embodiments" appearing in different parts of this specification do not necessarily refer to the same embodiment, but rather mean "one or more, but not all, embodiments," unless otherwise specifically emphasized. The terms "comprising," "having," and variations thereof mean "including, but not limited to," unless otherwise specifically emphasized.

[0041] like Figure 2 As shown, in one example provided in this application, the charging device 10 may include a composite heat exchanger 11, a first electronic device 12, a second electronic device 13, and a housing 14. The composite heat exchanger 11 includes a first heat exchanger 111 and a second heat exchanger 112 fixedly connected. The first heat exchanger 111 has a heat-conducting portion 1111 and a heat-dissipating portion 1112. The first electronic device 12 is thermally connected to the heat-conducting portion 1111; therefore, the heat generated by the first electronic device 12 can be transferred to the heat-dissipating portion 1112 through the heat-conducting portion 1111 for heat dissipation, thereby cooling the first electronic device 12. Additionally, the second heat exchanger 112 has an evaporation end 1121 and a condensation end 1122. The second heat exchanger 112 has a chamber 1123, and the chamber 1123 contains a cooling medium (…). Figure 2(Not shown in the diagram), and the cooling medium can flow between the evaporation end 1121 and the condensation end 1122. The second electronic device 13 is thermally connected to the evaporation end 1121. The heat generated by the second electronic device 13 is transferred to the evaporation end 1121, and the cooling medium located near the evaporation end 1121 in the chamber 1123 is heated and evaporates, then releases heat and condenses at the condensation end 1122. That is, the second heat exchanger 112 mainly relies on the circulation of the cooling medium between the evaporation end 1121 and the condensation end 1122 to achieve its heat dissipation function. The shell 14 is connected to the heat-conducting part 1111 and the evaporation end 1121, forming a sealed receiving cavity 110. The first electronic device 12 and the second electronic device 13 are both located within the receiving cavity 110, thereby ensuring the airtightness of the first electronic device 12 and the second electronic device 13. Alternatively, in a specific configuration, the first electronic device 12 and the second electronic device 13 can also be thermally connected to the shell 14. That is, the heat from the first electronic device 12 and the second electronic device 13 can also be dissipated through the shell 14.

[0042] In the example provided in this application, the composite heat exchanger 11 includes two different types of heat exchangers, thereby achieving different heat dissipation characteristics and effects. Specifically, the first heat exchanger 111 mainly relies on the heat transfer of the material itself for heat dissipation and can be made of materials with good thermal conductivity, such as steel, copper, or aluminum. The first heat exchanger 111 has the advantages of easy deployment, simple structure, low cost, and high reliability. The second heat exchanger 112 mainly relies on the vapor-liquid conversion of the cooling medium and the circulation between the evaporation end 1121 and the condensation end 1122 for heat dissipation. The second heat exchanger 112 has the advantages of high heat dissipation efficiency, and therefore can be used to dissipate heat from electronic devices with large heat generation.

[0043] For example, in the charging device 10 provided in this application, the heat flux density of the first electronic device 12 is less than that of the second electronic device 13. Heat flux density refers to the thermal energy passing through a unit area per unit time. That is, under the same time and unit area, the heat generated by the first electronic device 12 is less than the heat generated by the second electronic device 13. Therefore, in practical applications, the heat-conducting part 1111 of the first heat exchanger 111 can be thermally connected to the first electronic device 12 to dissipate heat from the first electronic device 12, thereby reducing the application cost of the composite heat exchanger 11. The evaporation end 1121 of the second heat exchanger 112 can be thermally connected to the second electronic device 13 to dissipate heat from the second electronic device 13, ensuring that the second electronic device 13 remains within its normal operating temperature range.

[0044] In summary, the charging device 10 provided in this application can effectively reduce the deployment difficulty and application cost of the heat dissipation structure by using the composite heat exchanger 11. At the same time, it can also have high heat dissipation efficiency and meet the heat dissipation needs of electronic devices with large heat output.

[0045] In addition, by applying the composite heat exchanger 11, the first electronic device 12 and the second electronic device 13 can be placed in the sealed receiving cavity 110, which can play a good protective role for the first electronic device 12 and the second electronic device 13, preventing the first electronic device 12 and the second electronic device 13 from being affected by impurities such as dust and water vapor in the air.

[0046] It should be noted that the first electronic device 12 and the second electronic device 13 described above are for ease of distinction. The types of the first electronic device 12 and the second electronic device 13 may be the same or different, and this application does not limit this. In addition, in practical applications, the charging device 10 may include various different types of electronic devices to realize its charging function.

[0047] For example, such as Figure 3 As shown, the charging device 10 may include a first circuit board 113 and a plurality of first electronic devices disposed on the first circuit board 113. Specifically, the plurality of first electronic devices may be inductors 12a and 12b, capacitors 12c and 12d, transformers 12e and 12f. In addition, the charging device 10 also includes a second circuit board 114 and a second electronic device 13 disposed on the second circuit board 114. The second electronic device 13 may be a power device such as an insulated gate bipolar transistor (IGBT). This application does not limit the specific type of the second electronic device 13.

[0048] The first circuit board 113 can be a printed circuit board (PCB) or a flexible printed circuit (FPC). The second circuit board 114 can be of the same or different type as the first circuit board 113; this application does not limit the specific types of the first circuit board 113 and the second circuit board 114. In practical applications, the first circuit board 113 and the second circuit board 114 can be electrically connected via a copper busbar 115 or cables.

[0049] In the example provided in this application, a first circuit board 113 and a second circuit board 114 that are independent of each other are used. Furthermore, all first electronic devices that dissipate heat through the first heat exchanger 111 are mounted on the first circuit board 113. This facilitates the adaptation between the first heat exchanger 111 and multiple first electronic devices, and makes installation and positioning easier. Correspondingly, all second electronic devices 13 that dissipate heat through the second heat exchanger 112 are mounted on the second circuit board 114. This facilitates the adaptation between the second heat exchanger 112 and the second electronic devices 13, and makes installation and positioning easier.

[0050] Of course, in other examples, the first circuit board 113 and the second circuit board 114 can also be an integral structure, which will not be elaborated here. In addition, the charging device 10 may also include two or more second electronic devices 13. This application does not impose a specific limitation on the number of first electronic devices and second electronic devices 13.

[0051] In specific configurations, the structural types of the first heat exchanger 111 and the second heat exchanger 112 can vary.

[0052] For example, such as Figure 3 and Figure 4 As shown, in one example provided in this application, the first heat exchanger 111 is a toothed heat exchanger. Specifically, the first heat exchanger 111 includes a plate-shaped heat-conducting portion 1111 and multiple fins located on one side of the heat-conducting portion 1111, wherein the multiple fins can be understood as heat dissipation portions 1112 of the first heat exchanger 111. The surface of the heat-conducting portion 1111 facing away from the fins can serve as a first contact surface 11110, and a first electronic device (such as an inductor 12a) can be thermally connected to the first contact surface 11110. In a specific configuration, the inductor 12a can be thermally connected to the first contact surface 11110 through a thermally conductive material (such as thermally conductive silicone), thereby ensuring the thermal conductivity between the inductor 12a and the first contact surface 11110.

[0053] The first heat exchanger 111 can be a single-piece structure or a split structure.

[0054] For example, the heat-conducting part 1111 and the heat-dissipating part 1112 can be integrally formed using processes such as die casting or CNC machine tool processing. Alternatively, the heat-conducting part 1111 and the heat-dissipating part 1112 can be manufactured separately, and then connected by processes such as welding.

[0055] Furthermore, the gaps between adjacent fins can form a first airflow channel 11120 for air circulation. When air flows through the first airflow channel 11120, it can carry away the heat from the fins. In specific configurations, the spacing and number of fins can be reasonably selected according to actual conditions, and this application does not impose any limitations on this.

[0056] In the example provided in this application, multiple first electronic devices are disposed on the same surface of the first circuit board 113 (e.g., Figure 3 (The upper plate surface in the middle), thus facilitating the thermal connection between multiple first electronic devices 12 and the first contact surface 11110.

[0057] In addition, in specific settings, since the height dimensions of different types of first electronic devices are different, the first contact surface 11110 can be reasonably set according to the height dimensions of different first electronic devices.

[0058] For example, in the example provided in this application, the first contact surface 11110 has multiple protrusions, and the first electronic device can be thermally connected to the heat-conducting part 1111 through the protrusions. Specifically, taking protrusions 11111 and 11112 as examples, the height dimension of the inductor 12b is greater than the height dimension of the capacitor 12c. Therefore, when setting it up, the height dimension of protrusion 11111 can be smaller than the height dimension of protrusion 11112 to ensure that the inductor 12b can have a good thermally conductive connection with protrusion 11111, and at the same time, the capacitor 12c can have a good thermally conductive connection with protrusion 11112.

[0059] In the example provided in this application, the structure of the first heat exchanger 111 is relatively simple and easy to manufacture. Therefore, in application, the shape of the first heat exchanger 111 can be made more complex. For example, the protrusion 11111 and other parts of the first heat exchanger 111 can be an integral structure, which can be manufactured using processes such as die casting and machining. Of course, in other examples, the protrusion 11111 can also be an independent structural component, and the protrusion 11111 can be fixed to the first contact surface by welding or other methods.

[0060] In other examples, the protrusions described above can be replaced with grooves to accommodate the different heights of different first electronic devices, which will not be elaborated further here.

[0061] In practical applications, the second heat exchanger 112 can specifically be a loop thermosiphon (LTS). Specifically, the second heat exchanger 112 has a hollow, thin-walled structure, with one end of the second heat exchanger 112 (e.g., Figure 3The lower end of the condenser 1122 can serve as the evaporator 1121, and the surface of the evaporator 1121 can serve as the second contact surface 11210 for thermally conductive connection with the second electronic device 13. In the example provided in this application, the condenser 1122 has a plurality of spaced-apart protrusions, and a second airflow channel 11220 for air circulation can be formed between adjacent protrusions. When airflow flows through the second airflow channel 11220, it can carry away the heat from the surface of the protrusions. In specific configurations, the spacing and number of protrusions can be reasonably selected according to actual conditions, and this application does not limit this.

[0062] In addition, in the example provided in this application, there are fins 11221 between the protruding structures. The fins 11221 can be used to increase the heat exchange area between the condenser end 1122 and the outside, thereby helping to improve the heat dissipation performance of the second heat exchanger 112.

[0063] When configuring the second heat exchanger 112, a capillary structure can also be provided within the chamber 1123 of the second heat exchanger 112. Figure 3 (not shown in the image), which can improve the flow efficiency of the cooling medium in the chamber 1123 and help improve the heat dissipation performance of the second heat exchanger 112.

[0064] When setting up the first heat exchanger 111 and the second heat exchanger 112, the relative positions between the first heat exchanger 111 and the second heat exchanger 112 can be varied.

[0065] For example, such as Figure 3 and Figure 4 As shown, in one example provided in this application, the first heat exchanger 111 and the second heat exchanger 112 can be arranged side by side.

[0066] Specifically, the first contact surface 11110 of the first heat exchanger 111 and the second contact surface 11210 of the second heat exchanger 112 can be arranged adjacent to each other, and the orientation of the first contact surface 11110 and the second contact surface 11210 can be approximately the same.

[0067] In practical applications, the housing 14 can be sealed to the first contact surface 11110 and the second contact surface 11210 to form a sealed receiving cavity 110, which helps to improve the convenience of connecting the housing 14 and the composite heat exchanger 11.

[0068] In addition, a turbulence fan 116a can be installed inside the receiving cavity 110 to allow the hot airflow inside the receiving cavity 110 to circulate, thus avoiding problems such as excessively high local temperatures.

[0069] In addition, such as Figure 3As shown, in one example provided in this application, the first heat exchanger 111 and the second heat exchanger 112 can also be thermally connected.

[0070] Specifically, the heat-conducting part 1111 of the first heat exchanger 111 and the evaporation end 1121 of the second heat exchanger 112 can be thermally connected, thereby improving the overall heat dissipation efficiency of the composite heat exchanger 11.

[0071] For example, when the temperature of the heat-conducting part 1111 is higher than the temperature of the evaporating end 1121, the heat of the first heat exchanger 111 (or the first electronic device) can be dissipated through the second heat exchanger 112. Alternatively, when the temperature of the evaporating end 1121 is higher than the temperature of the heat-conducting part 1111, the heat of the second heat exchanger 112 (or the second electronic device 13) can be dissipated through the first heat exchanger 111. It can also be understood that the heat of the first electronic device 12 can be dissipated not only through the first heat exchanger 111 but also through the second heat exchanger 112, thereby maximizing the heat dissipation function of the composite heat exchanger 11. Correspondingly, the heat of the second electronic device 13 can be dissipated not only through the second heat exchanger 112 but also through the first heat exchanger 111, thereby improving the heat dissipation efficiency of the composite heat exchanger 11.

[0072] In a specific configuration, the heat-conducting part 1111 can be welded to the evaporation end 1121 to achieve a fixed connection between the first heat exchanger 111 and the second heat exchanger 112, and at the same time, a heat-conducting connection between the heat-conducting part 1111 and the evaporation end 1121 can also be achieved.

[0073] Of course, in other examples, the first heat exchanger 111 and the second heat exchanger 112 can also be fixedly connected by screws or other connecting parts. This application does not limit the connection method between the first heat exchanger 111 and the second heat exchanger 112.

[0074] It is understandable that in other examples, the first heat exchanger 111 and the second heat exchanger 112 may not be thermally connected, which will not be elaborated here.

[0075] In addition, in specific configurations, the first airflow channel 11120 and the second airflow channel 11220 can be arranged side by side or connected.

[0076] For example, such as Figure 3 and Figure 4As shown, in one example provided in this application, the first airflow channel 11120 and the second airflow channel 11220 are arranged in parallel. Fans 116b and 116d can be respectively installed at both ends of the first airflow channel 11120, and fans 116c and 116e can be respectively installed at both ends of the second airflow channel 11220. Fans 116d and 116e are blowing type; that is, fan 116d can be used to blow air into the first airflow channel 11120, and fan 116e can be used to blow air into the second airflow channel 11220. Fans 116b and 116c are exhaust type; that is, fan 116b can be used to extract air from the first airflow channel 11120, and fan 116c can be used to extract air from the second airflow channel 11220.

[0077] Additionally, a flow equalization plate or similar structure can be installed between the fans 116b and 116d and the first airflow channel 11120. Figure 3 (not shown in the image) so that the airflow generated by the fans 116b and 116d can flow as evenly as possible through each first airflow channel 11120.

[0078] Correspondingly, a flow equalization plate or other structure can also be installed between the fans 116c and 116e and the second airflow channel 11220. Figure 3 (not shown in the image) so that the airflow generated by the fans 116c and 116e can flow as evenly as possible through each second airflow channel 11220.

[0079] In practical applications, the number and location of fans can be reasonably set according to different needs. For example, fans 116d and 116e can be omitted, and this application does not impose specific restrictions on the number and location of fans.

[0080] In addition, such as Figure 5 and Figure 6 As shown, in one example provided in this application, the first airflow channel 11120 and the second airflow channel 11220 can be connected. In a specific configuration, the first airflow channel 11120 can be located downstream of the second airflow channel 11220. The cooling airflow can first pass through the second airflow channel 11220 to ensure the heat exchange efficiency of the second heat exchanger 112, and then pass through the first airflow channel 11120 to dissipate heat from the first heat exchanger 111.

[0081] Understandably, in practical applications, the first heat exchanger 111 is typically used to dissipate heat from electronic devices with high heat flux densities; therefore, the first heat exchanger 111 needs to have good heat dissipation performance. Thus, in the example provided in this application, the second airflow channel 11220 is located upstream of the first airflow channel 11120.

[0082] Of course, in other examples, the second airflow channel 11220 can also be located downstream of the first airflow channel 11120. In practical applications, the relative positions of the first airflow channel 11120 and the second airflow channel 11220 can be reasonably set according to actual needs, which will not be elaborated here.

[0083] In addition, the first heat exchanger 111 and the second heat exchanger 112 can be arranged side by side or stacked.

[0084] For example, such as Figure 7 and Figure 8 As shown, in another example provided in this application, the first contact surface 11110 of the first heat exchanger 111 is disposed opposite to the second contact surface 11210 of the second heat exchanger 112.

[0085] In practical applications, the housing 14 can be hermetically connected to the first contact surface 11110 and the second contact surface 11210 respectively, so as to form two sealed spaces. Specifically, a receiving cavity 110a is formed between the housing 14 and the first contact surface 11110, and a receiving cavity 110b is formed between the housing 14 and the second contact surface 11210. Multiple first electronic devices, such as inductors 12a and 12b, capacitors 12c and 12d, transformers 12e and 12f, are all disposed in the receiving cavity 110a and are thermally connected to the first contact surface 11110. Multiple second electronic devices, such as transistors 13a, 13b, and 13c, are all disposed in the receiving cavity 110b and are thermally connected to the second contact surface 11210. Different electronic devices can be disposed in different receiving cavities, which is beneficial to improving the flexibility of deployment of different electronic devices.

[0086] Additionally, a turbulence fan 116a can be installed within the receiving cavity 110a to allow the hot airflow within the receiving cavity 110a to circulate, thus preventing problems such as excessively high local temperatures. Of course, in other examples, a turbulence fan can also be installed within the receiving cavity 110b, and this application does not specifically limit this.

[0087] like Figure 9 As shown in the example provided in this application, the heat dissipation part 1112 has a first recessed part 11121, and the condensing end 1122 is located within the first recessed part 11121. Additionally, the condensing end 1122 has a second recessed part 11222, and the heat dissipation part 1112 is located within the second recessed part 11222. Alternatively, it can be understood that the first heat exchanger 111 and the second heat exchanger 112 can be arranged in a cross configuration, which can reduce the overall volume of the composite heat exchanger 11 and facilitate the miniaturization of the composite heat exchanger 11.

[0088] In the example provided in this application, the first recess 11121 is located in the central region of the heat dissipation portion 1112, that is, the first recess 11121 is surrounded by the fin structure. The second recess 11222 is located in the peripheral region of the condensation end 1122. Therefore, when the condensation end 1122 is located within the first recess 11121 and the heat dissipation portion 1112 is located within the second recess 11222, the condensation end 1122 is surrounded by the fin structure of the heat dissipation portion 1112.

[0089] Of course, in other examples, the positions of the first recess 11121 and the second recess 11222, as well as the relative positions between the heat dissipation part 1112 and the condensation end 1122, can be flexibly set according to different needs, which will not be elaborated here.

[0090] In addition, such as Figure 10 As shown in the illustration, this application also provides a charging system, including a charging terminal 60 and a charging device 10. The charging terminal 60 is connected to the output terminal of the charging device 10 via a cable. In specific applications, the charging device 10 can perform frequency conversion or other processing on the AC power from the power grid, or it can convert AC power into DC power before supplying it to the charging terminal 60. The charging terminal 60 can be connected to a powered device (such as a vehicle) to replenish the power to the powered device. The charging terminal 60 can be in the form of a charging gun or similar device. Furthermore, one charging device 10 can be connected to one charging terminal 60, or it can be connected to multiple charging terminals 60. This application does not limit the number of charging terminals 60 that can be installed.

[0091] In specific installations, the charging device 10 can be installed on the ground, on a wall, or in other locations. This application does not impose any restrictions on the specific installation location or form of the charging device 10.

[0092] The above are merely specific embodiments of this application, but the scope of protection of this application is not limited thereto. Any variations or substitutions that can be easily conceived by those skilled in the art within the scope of the technology disclosed in this application should be included within the scope of protection of this application. Therefore, the scope of protection of this application should be determined by the scope of the claims.

Claims

1. A charging device, characterized in that, include: A composite heat exchanger includes a first heat exchanger and a second heat exchanger that are fixedly connected. The first heat exchanger has a heat-conducting part and a heat-dissipating part; The second heat exchanger has an evaporation end and a condensation end, and the second heat exchanger has a chamber, in which a cooling medium is provided, and the cooling medium can flow between the evaporation end and the condensation end; The first electronic device is thermally connected to the heat-conducting part; The second electronic device is thermally connected to the evaporation end, and the heat flux density of the first electronic device is less than that of the second electronic device; The housing is connected to the heat-conducting part and the evaporation end, forming a sealed receiving cavity; Both the first electronic device and the second electronic device are located within the accommodating cavity; The heat-conducting part and the evaporation end are thermally connected.

2. The charging device according to claim 1, characterized in that, The heat-conducting part has a first contact surface, and the evaporation end has a second contact surface; The first electronic device is thermally connected to the first contact surface, and the second electronic device is thermally connected to the second contact surface.

3. The charging device according to claim 2, characterized in that, The first contact surface and the second contact surface are arranged adjacent to each other, and the first contact surface and the second contact surface have the same orientation.

4. The charging device according to claim 2, characterized in that, The first contact surface and the second contact surface are set opposite to each other.

5. The charging device according to claim 4, characterized in that, The heat dissipation part has a first recess, and the condensation end is located in the first recess.

6. The charging device according to claim 4 or 5, characterized in that, The condensation end has a second recess, and the heat dissipation part is located within the second recess.

7. The charging device according to any one of claims 2 to 6, characterized in that, The first contact surface has a groove or a protrusion, and the first electronic device is thermally connected to the groove or the protrusion.

8. The charging device according to any one of claims 1 to 7, characterized in that, The heat dissipation section has a first airflow channel, and the condensation end has a second airflow channel.

9. The charging device according to claim 8, characterized in that, It also includes fans; The first airflow channel and the second airflow channel are connected; The fan is used to accelerate the flow speed of gas in the first airflow channel and the second airflow channel; The first airflow channel is located downstream of the second airflow channel.

10. The charging device according to claim 8, characterized in that, It also includes a first fan and a second fan; The first airflow channel and the second airflow channel are arranged side by side; The first fan is used to accelerate the flow speed of gas in the first airflow channel; The second fan is used to accelerate the flow rate of gas in the second airflow channel.

11. The charging device according to any one of claims 1 to 10, characterized in that, The first electronic device and the second electronic device are thermally connected to the housing.

12. A charging system, characterized in that, The device includes a charging terminal and a charging device as described in any one of claims 1 to 11, wherein the charging device has an output port and the charging terminal is connected to the output port.

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