An electrically conductive elastic connector and an electronic device

Abstract

In order to solve the problem of narrow working range and high harmonic of the existing conductive elastic connector, the conductive elastic connector with an inner hole and nanowires attached to the inner hole is provided. The conductive elastic connector is used to connect a first element and a second element, and comprises a bubble body and nanowires. The bubble body has a first surface and a second surface oppositely arranged in a first direction. The first surface is used to be electrically connected with the first element, and the second surface is electrically connected with the second element. The bubble body comprises an inner hole, and the nanowires are attached to the hole wall of the inner hole. The conductive elastic connector of the present application adopts the bubble body with an inner hole and nanowires attached to the inner hole. Since the nanowires are attached to the inner hole, the grounding impedance can be kept stable and low. Secondly, since the inner hole is formed in the bubble body, when the conductive elastic connector is compressed, the pressure (or rebound force) increases slowly, and the working range of the conductive elastic connector is widened. In addition, since a uniform nanowire layer is formed on the hole wall of the bubble body as a conductive layer, the conductive layer has better stability than the electroplated layer formed by the traditional process, and the nanowire conductive layer is not easy to break and fall off, which can avoid high harmonic. Therefore, the conductive elastic connector of the present application has the advantage of low harmonic.

Description

Technical Field

[0001] This application relates to the field of conductive connectors, and more particularly to a conductive elastic connector and an electronic device incorporating the same. Background Technology

[0002] To improve the performance of electronic devices, reduce radio frequency interference between components, increase isolation between components, and reduce the risk of electrostatic discharge (ESD), electronic devices typically require grounding, and the components within them also need to be grounded. For example, camera modules need to be grounded to avoid interference from radio frequency signals from the antenna. Display modules also need to be grounded to prevent electromagnetic noise from affecting their normal operation. Typically, conductive elastic connectors are used to ground antennas, display modules, or camera modules. These conductive elastic connectors have compression-rebound characteristics, generating pressure (rebound force) to securely connect the components. Furthermore, these conductive elastic connectors are conductive, enabling electromagnetic shielding or electrical connection.

[0003] With the diversification of electronic device functions, the components included in electronic devices are also diverse and numerous. However, the space inside electronic devices is very limited. Therefore, a conductive elastic connector is needed to realize the electrical connection between different components or to ground different components. Summary of the Invention

[0004] To address the issues of narrow operating range and high harmonic generation in existing conductive elastic connectors, this application proposes a conductive elastic connector structure with an inner hole and nanowires attached to that inner hole. This conductive elastic connector exhibits low harmonic characteristics and a wide operating range, and can be used to achieve electrical connections between different devices or to ground different devices.

[0005] In a first aspect, embodiments of this application provide a conductive elastic connector having an inner hole and nanowires attached to the wall of the inner hole. The conductive elastic connector is used to connect a first element and a second element. The conductive elastic connector includes a bubble and nanowires, wherein the bubble has a first surface and a second surface disposed opposite to each other in a first direction, wherein the first surface is used to be electrically connected to the first element, and the second surface is electrically connected to the second element. The bubble includes an inner hole, wherein the nanowires are attached to the wall of the inner hole.

[0006] The conductive elastic connector in this embodiment employs a bubble with an inner hole and nanowires attached to the inner hole (e.g., formed by a coating process). Because the inner hole is attached with conductive nanowires, the grounding impedance can be maintained at a stable low impedance. Secondly, because there is an inner hole in the bubble, the pressure (or rebound force) increases slowly when the conductive elastic connector is compressed, thus widening the operating range of the conductive elastic connector.

[0007] In addition, since a uniform nanowire layer is formed on the pore wall of the bubble body as a conductive layer, the conductive layer has better stability than the electroplated layer formed by conventional processes. The nanowire conductive layer is not easy to break and fall off, which can avoid the generation of high harmonics. Therefore, the conductive elastic connector of the present application embodiment has the advantage of low harmonics.

[0008] In conjunction with the first aspect, in one possible implementation, the inner hole includes a closed hole.

[0009] Because the closed-cell structure is surrounded by a pore wall, air and moisture cannot enter the interior of the pore. The closed-cell structure enhances the rigidity and stability of the conductive elastic connector, preventing damage from pressure.

[0010] In conjunction with the first aspect, in one possible implementation, the inner hole includes an opening.

[0011] The openings are not connected by the bubble body, and the inner holes are not interconnected, allowing gas to flow between the holes. This makes the conductive elastic connector a softer, more flexible material, enhancing its bending ability and expanding its compression range.

[0012] In conjunction with the first aspect, in one possible implementation, the inner hole includes an open hole and a closed hole.

[0013] The conductive elastic connector of this application embodiment includes both open and closed holes, which can combine the advantages of both open and closed holes. While having rigidity and stability, it can also have softness and flexibility.

[0014] In conjunction with the first aspect, in one possible implementation, the inner hole includes an open hole and a closed hole, wherein the closed hole is located in two side regions along the width direction, and the open hole is located between the two side regions.

[0015] By providing closed-hole regions on both sides along the width W direction and providing open-hole regions between the closed-hole regions along the width W direction, rigidity and stability can be achieved on both sides along the width W direction, ensuring that the connector is firmly connected to the first and second components and does not fall off. At the same time, the connector can have sufficient flexibility in the main connection area (e.g., the middle area of ​​the cross-section of the conductive elastic connector along the width W direction), ensuring that the conductive elastic connector has a wide working range.

[0016] In conjunction with the first aspect, in one possible implementation, the inner hole comprises an inner hole structure of at least two sizes;

[0017] Since the size of the inner hole affects the compressibility range of the bubble, by opening inner holes of different sizes in the bubble, the conductive elastic connector can have different compressibility ranges in different regions.

[0018] In conjunction with the first aspect, in one possible implementation, the diameter of the inner hole is 20um-500um.

[0019] With an inner diameter of 20µm-500µm, the conductive elastomer can have a low density. The pressure (or rebound force) generated when the bubble is compressed increases slowly, ensuring that the bubble reaches a greater compression limit, thereby expanding the compressible range of the bubble to meet pressure requirements (e.g., Figure 3C (The compression range of the second region in the middle) expands the working range of the conductive elastic connector.

[0020] In conjunction with the first aspect, in one possible implementation, the diameter of the bubble after the opening is 100 μm.

[0021] Setting the inner diameter to 100µm allows the bubble to have a wide range of elastic working capacity while also possessing rigidity and stability, preventing damage under pressure.

[0022] In conjunction with the first aspect, in one possible implementation, the density of the conductive elastic connector with the inner hole is less than or equal to 200 kg / m³. 3 .

[0023] By creating an inner hole, the density of the conductive elastic connector after the inner hole is created is less than or equal to 200 kg / m³. 3 The pressure (or rebound force) generated by the bubble after compression increases slowly. This ensures that the bubble reaches a larger compression amount corresponding to the upper limit force, thereby expanding the compressible range of the bubble to meet pressure requirements (e.g., Figure 3B (The compression range of the second region in the middle) expands the working range of the conductive elastic connector.

[0024] In conjunction with the first aspect, in one possible implementation, the diameter of the nanowire is between 10 nm and 100 nm.

[0025] By controlling the diameter of the nanowires to be between 10nm and 100nm, the nanowires can be firmly attached to the inner hole wall and are not easy to fall off, thus avoiding the generation of high harmonics caused by the nanowires falling off under pressure. In addition, by setting the diameter range to be between 10nm and 100nm, a lower grounding impedance can be obtained.

[0026] In conjunction with the first aspect, in one possible implementation, the diameter of the nanowire is less than or equal to 70 nm.

[0027] By making the diameter of the nanowire less than or equal to 70 nm, the conductivity of the conductive elastic connector can be enhanced, the nanowire can be prevented from falling off due to pressure on the bubble, and the generation of high harmonics can be avoided.

[0028] In conjunction with the first aspect, in one possible implementation, the ratio of the length to the diameter of the nanowire is between 1000:1 and 5000:1.

[0029] By setting the length-to-diameter ratio of the nanowires between 1000:1 and 5000:1, the nanowires attached to the pore walls can be prevented from breaking under pressure, thus giving the nanowires rigidity and stability and preventing the generation of high harmonics.

[0030] In conjunction with the first aspect, in one possible implementation, the nanowire is at least one of silver nanowire, copper nanowire, carbon nanowire, and gold nanowire.

[0031] By employing nano-silver, nano-copper, carbon nanowires, and nano-gold, it is possible to ensure that the conductive elastomer has good conductivity and low impedance.

[0032] In conjunction with the first aspect, in one possible implementation, the conductive elastic connector further includes a conductive fabric that covers the surface of the bubble, the surface of the bubble including a first surface and a second surface disposed opposite to each other in a first direction of the bubble.

[0033] Wrapping conductive fabric around the bubble of a conductive elastic connector enhances conductivity and reduces grounding impedance. Furthermore, it mitigates the risk of increased grounding impedance due to nanowire breakage. For example, if the compression exceeds a certain value, the nanowire may break or even detach. Coating the surface with a conductive layer can prevent grounding impedance instability caused by potential nanowire breakage or detachment.

[0034] In conjunction with the first aspect, in one possible implementation, the first and second surfaces are electrically connected through a through-hole, the walls of which are covered with a conductive metal layer or nanowires.

[0035] The conductive elastic connector is electrically connected to the first and second surfaces along the height H direction through through holes 704. The through holes 704 are coated with a metal conductive layer by electroplating or chemical plating, or the through holes are coated with nanowires, which can enhance the conductivity of the conductive elastic connector and avoid the problem of unstable grounding impedance caused by the breakage and detachment of nanowires on the hole wall.

[0036] In conjunction with the first aspect, in one possible implementation, the bubble is a mesh structure with a conductive metal layer attached.

[0037] The bubble of the conductive elastic connector is a metallized bubble, which is formed by electroplating or chemical plating. This can enhance the conductivity of the conductive elastic connector and avoid the problem of unstable grounding impedance caused by the breakage and detachment of nanowires on the inner hole wall.

[0038] Secondly, embodiments of this application provide an electronic device, the electronic device including a first element, a second element, and a conductive elastic connector as described in any one of the first aspects and any possible manner of the first aspect.

[0039] In conjunction with the second aspect, in one possible implementation, the electronic device further includes a conductive adhesive, wherein the conductive adhesive is disposed between the first surface and the first element, and / or between the second surface and the second element.

[0040] Optionally, the conductive adhesive can be a pressure-sensitive adhesive.

[0041] Optionally, the conductive adhesive is doped with conductive particles, wherein the conductive particles are one or more combinations of gold, silver, copper, aluminum, zinc, iron, and nickel.

[0042] Optionally, the conductive adhesive may also be doped with nanowires, wherein the nanowires may be one or more combinations of gold, silver, copper, aluminum, zinc, iron and nickel.

[0043] By doping conductive adhesives with nanowires, the adhesives can be made sticky while reducing grounding impedance.

[0044] In conjunction with the second aspect, in one possible implementation, the first element includes a mid-frame that is grounded, the electronic device includes the conductive elastic connector provided in the first aspect, and the second element is grounded through an electrical connection to the second element via the conductive elastic connector.

[0045] The conductive elastic connector provided in this application can reduce the grounding impedance when connecting the conductive elastic connector to the device, improve the stability of low grounding impedance, and avoid nonlinearly introducing other radiated spurious emissions. For example, in antenna grounding scenarios, it can ensure the performance of the antenna, improve the anti-interference performance between the antenna and other devices, and improve the reliability of electronic equipment.

[0046] In conjunction with the second aspect, in one possible implementation, the second element includes a display module, wherein the conductive elastic connector is disposed between the display module and the mid-frame, and the second surface of the conductive elastic connector is electrically connected to the display module, and the first surface of the conductive elastic connector is fixed to and electrically connected to the mid-frame, so that the display module is grounded through the conductive elastic connector.

[0047] In conjunction with the second aspect, in one possible implementation, the second element includes a camera module, wherein the conductive elastic connector is disposed between the camera module and the mid-frame, and the second surface of the conductive elastic connector is electrically connected to the camera module, and the first surface of the conductive elastic connector is fixed to and electrically connected to the mid-frame, so that the camera module is grounded through the conductive elastic connector.

[0048] In conjunction with the second aspect, in one possible implementation, the second element includes a shielding cover, with the conductive elastic connector disposed between the shielding cover and the middle frame, and the second surface of the conductive elastic connector being electrically connected to the shielding cover, and the first surface of the conductive elastic connector being fixed to and electrically connected to the middle frame, so that the shielding cover is grounded through the conductive elastic connector.

[0049] In conjunction with the second aspect, in one possible implementation, the second element includes an antenna bracket, with the conductive elastic connector disposed between the antenna bracket and the mid-frame, and a first surface of the conductive elastic connector being electrically connected to the antenna bracket, and the first surface of the conductive elastic connector being fixed and electrically connected to the mid-frame, so that the shielding cover is grounded through the conductive elastic connector.

[0050] Thirdly, embodiments of this application provide a method for preparing a conductive elastic connector, the method comprising the following steps:

[0051] Preparation of nanowire solutions;

[0052] Select a bubble with an internal hole;

[0053] The nanowire solution is drop-coated / coated onto a bubble with internal pores, or the bubble with internal pores is immersed in the nanowire solution.

[0054] The conductive elastic connector is dried and cured at a temperature of 50-70℃ for 2-20 minutes.

[0055] Bake the conductive elastic connector at 70℃ for 30 minutes.

[0056] Fourthly, embodiments of this application provide a method for preparing a surface-mountable conductive elastic connector, the method comprising the following steps:

[0057] Preparation of nanowire solutions;

[0058] Select a bubble with an internal hole;

[0059] The nanowire solution is drop-coated / coated onto a bubble with internal pores, or the bubble with internal pores is immersed in the nanowire solution.

[0060] Coating a solderable nanowire solution onto a conductive elastic connector;

[0061] The conductive elastic connectors coated with a weldable nanowire solution are dried and cured at a temperature of 50-70℃ for 2-20 minutes.

[0062] The conductive elastic connector coated with a solderable nanowire solution was baked at 70°C for 30 minutes.

[0063] By coating solderable nanowires onto a bubble, a conductive elastic connector is made surface-mountable and can be soldered onto a motherboard for use in the motherboard's grounding setup. Attached Figure Description

[0064] Figure 1 The diagram shown is a hardware architecture diagram of an electronic device provided in an embodiment of this application.

[0065] Figure 2 The diagram shown is a schematic diagram of the connection of the conductive elastic connector provided in an embodiment of this application.

[0066] Figures 3A-3B The figure shown is a schematic diagram of a conductive elastic connector provided in an embodiment of this application.

[0067] Figure 3C The figure shown is a curve showing the relationship between compression, impedance, and pressure of the conductive elastic connector provided in the embodiments of this application.

[0068] Figure 4 The image shown is a schematic cross-sectional view of a spring clip.

[0069] Figure 5 The image shown is a schematic cross-sectional view of a FOF foam.

[0070] Figure 6 The image shown is a schematic cross-sectional view of a perforated foam.

[0071] Figure 7A This is a schematic cross-sectional view of an all-around foam.

[0072] Figure 7B It is an electron microscope image of a part of a foam from all angles.

[0073] Figure 8 The figure shown is a schematic cross-sectional view of a conductive elastic connector provided in an embodiment of this application.

[0074] Figure 9 The diagram shown is a schematic diagram of the inner hole coated with nanowires in a conductive elastic connector provided in an embodiment of this application.

[0075] Figure 10 The figure shown is a schematic cross-sectional view of another conductive elastic connector provided in an embodiment of this application.

[0076] Figure 11 The figure shown is a schematic cross-sectional view of another conductive elastic connector provided in an embodiment of this application.

[0077] Figure 12 The figure shown is a schematic cross-sectional view of another conductive elastic connector provided in an embodiment of this application.

[0078] Figure 13 The figure shown is a schematic cross-sectional view of another conductive elastic connector provided in an embodiment of this application.

[0079] Figure 14 The figure shown is a schematic cross-sectional view of another conductive elastic connector provided in an embodiment of this application.

[0080] Figure 15 The image shown is a partial electron microscope photograph of a conductive elastic connector provided in an embodiment of this application.

[0081] Figure 16 The figure shown is a curve relating compression, impedance, and pressure of a conductive elastic connector provided in an embodiment of this application.

[0082] Figure 17 The figure shown is a graph showing the relationship between harmonics and compression of a conductive elastic connector provided in an embodiment of this application.

[0083] Figure 18 The figure shows a method for preparing a conductive elastic connector according to an embodiment of this application.

[0084] Figure 19 The figure shows another method for preparing a conductive elastic connector provided in an embodiment of this application. Detailed Implementation

[0085] To make the objectives, technical solutions, and advantages of this application clearer, the application will now be described in further detail with reference to the accompanying drawings.

[0086] The technical solutions of the embodiments of this application will be described below with reference to the accompanying drawings. In the description of the embodiments of this application, unless otherwise stated, " / " means "or," for example, A / B can mean A or B; "and / or" in this text is merely a description of the relationship between related objects, indicating that three relationships can exist. For example, A and / or B can represent: A existing alone, A and B existing simultaneously, and B existing alone. Furthermore, in the description of the embodiments of this application, "multiple" refers to two or more than two.

[0087] Hereinafter, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of this embodiment, unless otherwise stated, "a plurality of" means two or more.

[0088] The terminology used in the description of the invention herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention.

[0089] Furthermore, in this application, directional terms such as "upper," "lower," "front," and "rear" are defined relative to the orientation of the components shown in the accompanying drawings. It should be understood that these directional terms are relative concepts, used for relative description and clarification, and can change accordingly depending on the orientation of the components in the accompanying drawings.

[0090] It should be noted that the term "electrical connection" in the embodiments of this application should be interpreted broadly. It may include physical direct connection, coupling connection through capacitor, conductive fabric, or conductive adhesive (or other materials), or a combination of coupling connection and physical direct connection.

[0091] It should also be noted that the shape descriptions such as "rectangle" and "circle" in the embodiments of this application may include approximate shapes. Considering actual processing errors, the approximate shapes are also within the scope of the embodiments of this application.

[0092] This application relates to a conductive elastic connector, an electronic device, and a method for manufacturing the conductive elastic connector. The following is a brief explanation of the concepts involved in this application:

[0093] Foam: A material obtained by foaming plastic particles, silicone particles, or rubber particles. Foams include, but are not limited to, polyurethane (PU) foam, silicone foam, polyethylene (PE) foam, polypropylene (PP) foam, styrene-butadiene rubber foam, acrylic foam, vinyl acetate foam, vinylidene chloride foam, nitrile foam, silicone foam, acrylamide foam, natural rubber foam, polyvinyl chloride foam, polysulfide rubber foam, styrene-acrylate copolymer foam, vinyl acetate-acrylate copolymer foam, silicone-acrylate copolymer foam, and modified silicone-acrylate copolymer foam.

[0094] Foaming is the process of creating microporous structures in plastics, silicone, or rubber. In the foaming molding process or in foamed polymer materials, honeycomb or porous structures are formed through the addition and reaction of physical or chemical foaming agents.

[0095] Foaming agent: also known as foaming material, refers to a material that can vaporize inside plastics, silicone or rubber to produce bubbles, making it a porous material. Foaming agents include, but are not limited to, azo compounds, sulfonyl hydrazide compounds, nitroso compounds, sodium bicarbonate, sodium carbonate, n-pentane, n-hexane, n-heptane, petroleum ether (also known as naphtha), trichlorofluoromethane, dichlorodifluoromethane and dichlorotetrafluoroethane.

[0096] Devices: These refer to electronic components and small parts, typically consisting of several parts, and are interchangeable among similar products. Devices include, but are not limited to, camera modules, display modules, sensors, and earpieces. Some devices susceptible to electromagnetic interference (such as cameras and displays) have shielding covers that are connected to a reference ground via conductive elastic connectors, thus achieving signal shielding.

[0097] Static electricity: Static electricity is a common phenomenon in daily life, referring to the accumulation of electric charge on the surface of an object. The accumulation of static electricity can generate a higher potential on the surface of the object. As electronic devices become more and more functional, the internal circuits of these devices are getting closer and closer to their surfaces. Static electricity from the surface of electronic devices or from external objects can enter the electronic devices through gaps in the surface and affect the normal operation of electronic components.

[0098] Electromagnetic interference (EMI) can be categorized into conducted interference and radiated interference. Conducted interference refers to the coupling of a signal from one electrical network to another through a conductive medium. Radiated interference refers to the coupling of a signal from an interference source to another electrical network through space. The electromagnetic interference described in this application refers to radiated interference. In high-speed printed circuit board (PCB) and system design, high-frequency signal lines, integrated circuit pins, and various connectors can all become sources of radiated interference with antenna characteristics, emitting electromagnetic waves and affecting the normal operation of other systems or other subsystems within the same system.

[0099] Scope of work: such as Figure 3C As shown, the working range of the conductive elastic connector is the range of the horizontal axis (compression amount) corresponding to the third region. In this embodiment, the compression range of the conductive elastic connector corresponding to the third region that meets the impedance and pressure requirements is defined as the working range of the conductive elastic connector.

[0100] As mobile phone functions become increasingly sophisticated, the frequency bands covered by their antennas expand, while the overall thickness of the devices shrinks. This makes grounding requirements in the radio frequency (RF) field increasingly crucial. On one hand, it's necessary to address antenna clutter and improve antenna performance; on the other hand, it's essential to reduce electromagnetic interference between components or modules, enhance their anti-interference capabilities, and address EMC (Electro-magnetic Compatibility) issues. For example, during antenna signal transmission and reception, displays are susceptible to flickering due to RF signal interference, and camera modules are also vulnerable to RF interference. Furthermore, ESD (Electro-Static Discharge) is another issue that needs to be addressed. For instance, for antennas, it's necessary to avoid non-linearly introducing stray radiation to ensure optimal antenna radiation performance.

[0101] To reduce radio frequency interference between components, increase isolation between components, reduce the risk of ESD damage, and improve component performance (e.g., improve the performance of antennas and display modules), radio frequency terminal equipment needs to be grounded. For example, camera modules need to be grounded, antenna modules need to be grounded, and the back cover or mid-frame of electronic devices needs to be grounded.

[0102] In electronic devices such as mobile phones, televisions, monitors, laptops, PDAs, and in-vehicle navigation systems, conductive elastic connectors are typically used to ground devices that require grounding. Grounding includes connecting to a reference ground. It should be understood that the device includes a shielding cover or shielding shield on the electronic device used for grounding.

[0103] Figure 1 This diagram illustrates the structure of an electronic device 100 that includes a display module, a camera module, and an antenna.

[0104] Electronic device 100 may include at least one of the following: mobile phone, foldable electronic device, tablet computer, desktop computer, laptop computer, handheld computer, notebook computer, ultra-mobile personal computer (UMPC), netbook, cellular phone, personal digital assistant (PDA), augmented reality (AR) device, virtual reality (VR) device, artificial intelligence (AI) device, wearable device, in-vehicle device, smart home device, or smart city device. This application embodiment does not impose any special limitation on the specific type of electronic device 100.

[0105] Electronic device 100 may include processor 110, external memory interface 120, internal memory 121, universal serial bus (USB) connector 130, charging management module 140, power management module 141, battery 142, antenna 1, antenna 2, mobile communication module 150, wireless communication module 160, audio module 170, speaker 170A, receiver 170B, microphone 170C, headphone jack 170D, sensor module 180, button 190, motor 191, indicator 192, camera 193, display screen 194, and subscriber identification module (SIM) card interface 195, etc. The sensor module 180 may include a pressure sensor 180A, a gyroscope sensor 180B, a barometric pressure sensor 180C, a magnetic sensor 180D, an accelerometer sensor 180E, a distance sensor 180F, a proximity sensor 180G, a fingerprint sensor 180H, a temperature sensor 180J, a touch sensor 180K, an ambient light sensor 180L, a bone conduction sensor 180M, etc.

[0106] It is understood that the structures illustrated in the embodiments of this application do not constitute a specific limitation on the electronic device 100. In other embodiments of this application, the electronic device 100 may include more or fewer components than illustrated, or combine some components, or split some components, or have different component arrangements. The illustrated components may be implemented in hardware, software, or a combination of software and hardware.

[0107] Processor 110 may include one or more processing units, such as an application processor (AP), a modem processor, a graphics processing unit (GPU), an image signal processor (ISP), a controller, a video codec, a digital signal processor (DSP), a baseband processor, and / or a neural network processing unit (NPU). Different processing units may be independent devices or integrated into one or more processors. In some embodiments, the processor may include a first processor 1101 (e.g., a coprocessor) and a second processor 1102 (e.g., an application processor).

[0108] The processor can generate operation control signals based on the instruction opcode and timing signals to control the instruction fetching and execution.

[0109] The processor 110 may also include a memory for storing instructions and data. In some embodiments, the memory in the processor 110 may be a cache memory. This memory can store instructions or data that the processor 110 has used or that are used frequently. If the processor 110 needs to use the instruction or data, it can directly retrieve it from this memory. This avoids repeated accesses, reduces the waiting time of the processor 110, and thus improves the efficiency of the system.

[0110] In some embodiments, the processor 110 may include one or more interfaces. These interfaces may include an inter-integrated circuit (I2C) interface, an inter-integrated circuit sound (I2S) interface, a pulse code modulation (PCM) interface, a universal asynchronous receiver / transmitter (UART) interface, a mobile industry processor interface (MIPI), a general-purpose input / output (GPIO) interface, a subscriber identity module (SIM) interface, and / or a universal serial bus (USB) interface, etc. The processor 110 can connect to modules such as touch sensors, audio modules, wireless communication modules, displays, and cameras through at least one of these interfaces.

[0111] It is understood that the interface connection relationships between the modules illustrated in the embodiments of this application are merely illustrative and do not constitute a structural limitation on the electronic device 100. In other embodiments of this application, the electronic device 100 may also employ different interface connection methods or combinations of multiple interface connection methods as described in the above embodiments.

[0112] USB connector 130 is a USB standard-compliant interface used to connect electronic device 100 to peripheral devices, specifically a Mini USB connector, Micro USB connector, USB Type-C connector, etc. USB connector 130 can be used to connect a charger to charge electronic device 100, or to connect other electronic devices to enable data transfer between them. It can also be used to connect headphones to output audio stored in the electronic device. This connector can also be used to connect other electronic devices, such as VR devices. In some embodiments, the Universal Serial Bus standard specification can be USB 1.x, USB 2.0, USB 3.x, and USB 4.

[0113] The charging management module 140 receives charging input from a charger, which can be either a wireless charger or a wired charger. In some wired charging embodiments, the charging management module 140 receives charging input from the wired charger via a USB interface 130. In some wireless charging embodiments, the charging management module 140 receives wireless charging input via the wireless charging coil of the electronic device 100. While charging the battery 142, the charging management module 140 can also supply power to the electronic device via the power management module 141. In some embodiments, the charging management module 140 needs to be grounded. Alternatively, the charging management module 140 needs to be shielded, wherein the shield is grounded, to prevent interference between the charging management module 140 and other modules (e.g., antennas or radio frequency devices).

[0114] The power management module 141 connects the battery 142, the charging management module 140, and the processor 110. The power management module 141 receives input from the battery 142 and / or the charging management module 140, providing power to the processor 110, internal memory 121, display screen 194, camera 193, and wireless communication module 160, etc. The power management module 141 can also monitor parameters such as battery capacity, battery cycle count, and battery health status (leakage current, impedance). In some other embodiments, the power management module 141 may also be located within the processor 110. In other embodiments, the power management module 141 and the charging management module 140 may be located in the same device.

[0115] The wireless communication function of electronic device 100 can be realized through antenna 1, antenna 2, mobile communication module 150, wireless communication module 160, modem processor and baseband processor, etc.

[0116] Antenna 1 and antenna 2 are used to transmit and receive electromagnetic wave signals. Each antenna in electronic device 100 can be used to cover one or more communication frequency bands. Different antennas can also be multiplexed to improve antenna utilization. For example, antenna 1 can be multiplexed as a diversity antenna for a wireless local area network. In some other embodiments, the antennas can be used in conjunction with tuning switches.

[0117] The mobile communication module 150 can provide solutions for wireless communication, including 2G / 3G / 4G / 5G, applied to the electronic device 100. The mobile communication module 150 may include at least one filter, switch, power amplifier, low noise amplifier (LNA), etc. The mobile communication module 150 can receive electromagnetic waves via antenna 1, and perform filtering, amplification, and other processing on the received electromagnetic waves before transmitting them to a modem processor for demodulation. The mobile communication module 150 can also amplify the signal modulated by the modem processor and convert it into electromagnetic waves for radiation via antenna 1. In some embodiments, at least some functional modules of the mobile communication module 150 may be housed in the processor 110. In some embodiments, at least some functional modules of the mobile communication module 150 and at least some modules of the processor 110 may be housed in the same device.

[0118] The modem processor may include a modulator and a demodulator. The modulator modulates the low-frequency baseband signal to be transmitted into a mid-to-high frequency signal. The demodulator demodulates the received electromagnetic wave signal into a low-frequency baseband signal. The demodulator then transmits the demodulated low-frequency baseband signal to the baseband processor for processing. After processing by the baseband processor, the low-frequency baseband signal is transmitted to the application processor. The application processor outputs sound signals through an audio device (not limited to speaker 170A, receiver 170B, etc.) or displays images or videos through the display screen 194. In some embodiments, the modem processor may be a separate device. In other embodiments, the modem processor may be independent of the processor 110 and may be housed in the same device as the mobile communication module 150 or other functional modules.

[0119] The wireless communication module 160 can provide solutions for wireless communication applications on the electronic device 100, including wireless local area networks (WLAN) (such as wireless fidelity (Wi-Fi) networks), Bluetooth (BT), Bluetooth Low Energy (BLE), ultra-wideband (UWB), global navigation satellite system (GNSS), frequency modulation (FM), near field communication (NFC), and infrared (IR) technologies. The wireless communication module 160 can be one or more devices integrating at least one communication processing module. The wireless communication module 160 receives electromagnetic waves via antenna 2, performs frequency modulation and filtering of the electromagnetic wave signals, and sends the processed signal to processor 110. The wireless communication module 160 can also receive signals to be transmitted from processor 110, perform frequency modulation and amplification, and convert them into electromagnetic waves for radiation via antenna 2.

[0120] In some embodiments, antenna 1 of electronic device 100 is coupled to mobile communication module 150, and antenna 2 is coupled to wireless communication module 160, enabling electronic device 100 to communicate with networks and other electronic devices via wireless communication technology. This wireless communication technology may include Global System for Mobile Communications (GSM), General Packet Radio Service (GPRS), Code Division Multiple Access (CDMA), Wideband Code Division Multiple Access (WCDMA), Time-Division Code Division Multiple Access (TD-SCDMA), Long Term Evolution (LTE), BT, GNSS, WLAN, NFC, FM, and / or IR technologies, etc. The GNSS may include the Global Positioning System (GPS), the Global Navigation Satellite System (GLONASS), the BeiDou Navigation Satellite System (BDS), the Quasi-Zenith Satellite System (QZSS), and / or satellite-based augmentation systems (SBAS).

[0121] In some embodiments, antenna 1 and antenna 2 need to be grounded. This serves two purposes: firstly, to ensure the antennas function correctly, and secondly, to prevent electromagnetic radiation generated by the antennas from coupling into other modules and causing interference. For example, electromagnetic radiation generated by the antennas can easily couple into the display screen or camera module, affecting its normal operation. It should be understood that in some embodiments, antenna 1 and / or antenna 2 can be installed in the electronic device as an antenna module, wherein the module includes an antenna and a radio frequency integrated circuit.

[0122] Electronic device 100 can implement display functions through a GPU, display screen 194, and application processor. The GPU is a microprocessor for image processing, connected to the display screen 194 and the application processor. The GPU is used to perform mathematical and geometric calculations and for graphics rendering. Processor 110 may include one or more GPUs, which execute program instructions to generate or modify display information.

[0123] Display screen 194 is used to display images, videos, etc. Display screen 194 includes a display panel. The display panel may be a liquid crystal display (LCD), an organic light-emitting diode (OLED), an active-matrix organic light-emitting diode (AMOLED), a flexible light-emitting diode (FLED), a miniature LED, a microLED, a quantum dot light-emitting diode (QLED), etc. In some embodiments, electronic device 100 may include one or more display screens 194.

[0124] In some embodiments, the display screen 194 needs to be grounded. Grounding enhances the anti-interference capability of the display screen 194 and prevents noise caused by electromagnetic interference from causing display abnormalities.

[0125] Electronic device 100 can realize camera function through camera module 193, ISP, video codec, GPU, display screen 194, application processor AP, neural network processor NPU, etc.

[0126] The camera module 193 can be used to acquire color image data and depth data of the subject. The Information Service Provider (ISP) can be used to process the color image data acquired by the camera module 193. For example, when taking a picture, the shutter is opened, and light is transmitted through the lens to the camera's photosensitive element. The light signal is converted into an electrical signal, and the camera's photosensitive element transmits this electrical signal to the ISP for processing, converting it into a visible image. The ISP can also optimize parameters such as exposure and color temperature of the shooting scene. In some embodiments, the ISP can be set within the camera module 193.

[0127] In some embodiments, the camera module 193 may consist of a color camera module and a 3D sensing module.

[0128] In some embodiments, the photosensitive element of the camera in the color camera module can be a charge-coupled device (CCD) or a complementary metal-oxide-semiconductor (CMOS) phototransistor. The photosensitive element converts the light signal into an electrical signal, which is then transmitted to the ISP for conversion into a digital image signal. The ISP outputs the digital image signal to the DSP for processing. The DSP converts the digital image signal into image signals in standard RGB, YUV, or other formats.

[0129] In some embodiments, the 3D sensing module can be a time-of-flight (TOF) 3D sensing module or a structured light 3D sensing module. Structured light 3D sensing is an active depth sensing technology, and its basic components may include an infrared emitter, an IR camera module, etc. The working principle of a structured light 3D sensing module is to first emit a specific pattern of light onto the object being photographed, then receive the light coding on the object's surface, compare it with the original projected light pattern, and calculate the object's three-dimensional coordinates using triangulation principles. These three-dimensional coordinates include the distance between the electronic device 100 and the object being photographed. Similarly, TOF 3D sensing can be an active depth sensing technology, and its basic components may include an infrared emitter, an IR camera module, etc. The working principle of a TOF 3D sensing module is to calculate the distance (i.e., depth) between the TOF 3D sensing module and the object being photographed by measuring the infrared reflection time to obtain a 3D depth map.

[0130] Structured light 3D sensing modules can also be applied to motion-sensing game consoles, industrial machine vision inspection, and other fields. Time-of-flight (TOF) 3D sensing modules can also be applied to game consoles, augmented reality (AR) / virtual reality (VR), and other fields.

[0131] In other embodiments, the camera module 193 may also consist of two or more cameras. These two or more cameras may include a color camera, which can be used to acquire color image data of the object being photographed. These two or more cameras may employ stereo vision technology to acquire depth data of the object being photographed. Stereo vision technology is based on the principle of human parallax. Under natural light, two or more cameras capture images of the same object from different angles, and then triangulation and other calculations are performed to obtain the distance information, i.e., depth information, between the electronic device 100 and the object being photographed.

[0132] In some embodiments, the electronic device 100 may include one or more camera modules 193. Specifically, the electronic device 100 may include one front-facing camera module 193 and one rear-facing camera module 193. The front-facing camera module 193 is typically used to capture color image data and depth data of the photographer facing the display screen 194, while the rear-facing camera module is used to capture color image data and depth data of the subject (such as a person, landscape, etc.) being photographed by the photographer.

[0133] In some embodiments, the CPU, GPU, or NPU in the processor 110 can process the color image data and depth data acquired by the camera module 193. In some embodiments, the NPU can identify the skeletal points of the subject by using a neural network algorithm based on skeletal point recognition technology, such as a convolutional neural network algorithm (CNN). The CPU or GPU can also run a neural network algorithm to determine the skeletal points of the subject based on the color image data. In some embodiments, the CPU, GPU, or NPU can also be used to determine the body shape of the subject (such as body proportions and the degree of fatness or thinness of body parts between skeletal points) based on the depth data acquired by the camera module 193 (which may be a 3D sensing module) and the identified skeletal points. It can further determine body beautification parameters for the subject and finally process the captured image of the subject according to the body beautification parameters to beautify the body shape of the subject in the captured image.

[0134] Digital signal processors (DSPs) are used to process digital signals, and can also process other digital signals. For example, when electronic device 100 selects a frequency point, the DSP is used to perform Fourier transforms on the frequency energy, etc.

[0135] Video codecs are used to compress or decompress digital video. Electronic device 100 may support one or more video codecs. Thus, electronic device 100 can play or record videos in various encoding formats, such as Moving Picture Experts Group (MPEG) 1, MPEG2, MPEG3, MPEG4, etc.

[0136] An NPU (Neural Processing Unit) is a computational processor for neural networks (NNs). By borrowing the structure of biological neural networks, such as the transmission patterns between neurons in the human brain, it can rapidly process input information and continuously learn on its own. NPUs can enable intelligent cognitive applications in electronic devices, such as image recognition, facial recognition, speech recognition, and text understanding.

[0137] The external storage interface 120 can be used to connect an external memory card, such as a Micro SD card, to expand the storage capacity of the electronic device 100. The external memory card communicates with the processor 110 through the external storage interface 120 to perform data storage functions. For example, it can save music, video, and other files to the external memory card, or transfer music, video, and other files from the electronic device to the external memory card.

[0138] Internal memory 121 can be used to store computer executable program code, including instructions. Internal memory 121 may include a program storage area and a data storage area. The program storage area may store the operating system, application programs required for at least one function (such as sound playback function, image playback function, etc.), etc. The data storage area may store data created during the use of electronic device 100 (such as audio data, phone book, etc.). In addition, internal memory 121 may include high-speed random access memory, and may also include non-volatile memory, such as at least one disk storage device, flash memory device, universal flash storage (UFS), etc. Processor 110 executes various functional methods or data processing of electronic device 100 by running instructions stored in internal memory 121 and / or instructions stored in memory disposed in the processor.

[0139] Electronic device 100 can implement audio functions, such as music playback and recording, through audio module 170, speaker 170A, receiver 170B, microphone 170C, headphone jack 170D, and application processor.

[0140] The audio module 170 is used to convert digital audio information into analog audio signals for output, and also to convert analog audio input into digital audio signals. The audio module 170 can also be used for encoding and decoding audio signals. In some embodiments, the audio module 170 may be located in the processor 110, or some functional modules of the audio module 170 may be located in the processor 110.

[0141] The speaker 170A, also known as a "loudspeaker," is used to convert audio electrical signals into sound signals. The electronic device 100 can listen to music through the speaker 170A or output audio signals for hands-free calling.

[0142] The receiver 170B, also known as the "earpiece," is used to convert audio electrical signals into sound signals. When the electronic device 100 answers a telephone call or voice message, the receiver 170B can be brought close to the ear to listen to the voice.

[0143] Microphone 170C, also known as a "microphone" or "voice transducer," is used to convert sound signals into electrical signals. When making a phone call or sending a voice message, the user can speak by bringing their mouth close to microphone 170C, inputting the sound signal into microphone 170C. Electronic device 100 may have at least one microphone 170C. In some embodiments, electronic device 100 may have two microphones 170C, which, in addition to collecting sound signals, can also perform noise reduction. In other embodiments, electronic device 100 may also have three, four, or more microphones 170C, which can collect sound signals, reduce noise, identify the sound source, and perform directional recording, etc.

[0144] The 170D headphone jack is used to connect wired headphones. The 170D headphone jack can be a USB 130 interface or a 3.5mm Open Mobile Terminal Platform (OMTP) standard interface, a CTIA (Cellular Telecommunications Industry Association of the USA) standard interface.

[0145] Pressure sensor 180A is used to sense pressure signals and convert them into electrical signals. In some embodiments, pressure sensor 180A can be disposed on display screen 194. There are many types of pressure sensors 180A, such as resistive pressure sensors, inductive pressure sensors, and capacitive pressure sensors. A capacitive pressure sensor may include at least two parallel plates with conductive material. When force is applied to pressure sensor 180A, the capacitance between the electrodes changes. Electronic device 100 determines the pressure intensity based on the change in capacitance. When a touch operation is applied to display screen 194, electronic device 100 detects the intensity of the touch operation based on pressure sensor 180A. Electronic device 100 can also calculate the touch position based on the detection signal from pressure sensor 180A. In some embodiments, touch operations applied to the same touch position but with different touch operation intensities can correspond to different operation commands. For example, when a touch operation with an intensity less than a first pressure threshold is applied to the SMS application icon, a command to view an SMS is executed. When a touch operation with an intensity greater than or equal to the first pressure threshold is applied to the SMS application icon, a command to create a new SMS is executed.

[0146] The gyroscope sensor 180B can be used to determine the motion attitude of the electronic device 100. In some embodiments, the gyroscope sensor 180B can determine the angular velocity of the electronic device 100 around three axes (i.e., the x, y, and z axes). The gyroscope sensor 180B can be used for image stabilization. For example, when the shutter is pressed, the gyroscope sensor 180B detects the angle of the shake of the electronic device 100, calculates the distance that the lens module needs to compensate based on the angle, and controls the lens to move in the opposite direction to counteract the shake of the electronic device 100, thus achieving image stabilization. The gyroscope sensor 180B can also be used in navigation and motion-sensing game scenarios.

[0147] A barometric pressure sensor 180C is used to measure air pressure. In some embodiments, the electronic device 100 calculates altitude based on the air pressure value measured by the barometric pressure sensor 180C to assist in positioning and navigation.

[0148] The magnetic sensor 180D includes a Hall effect sensor. The electronic device 100 can use the magnetic sensor 180D to detect the opening and closing of the flip cover. When the electronic device is a foldable device, the magnetic sensor 180D can be used to detect the folding or unfolding of the electronic device, or the folding angle. In some embodiments, when the electronic device 100 is a flip phone, the electronic device 100 can detect the opening and closing of the flip cover based on the magnetic sensor 180D. Furthermore, based on the detected opening and closing state of the cover or the flip cover, features such as automatic flip unlocking can be set.

[0149] The 180E accelerometer can detect the magnitude of acceleration of electronic device 100 in various directions (typically three axes). When electronic device 100 is stationary, it can detect the magnitude and direction of gravity. It can also be used to identify the posture of electronic devices and applied to applications such as screen orientation switching and pedometers.

[0150] A distance sensor 180F is used to measure distance. Electronic device 100 can measure distance via infrared or laser. In some embodiments, during a shooting scene, electronic device 100 can utilize the distance sensor 180F to measure distance for rapid focusing.

[0151] The proximity sensor 180G may include, for example, a light-emitting diode (LED) and a light detector, such as a photodiode. The LED may be an infrared LED. The electronic device 100 emits infrared light outward through the LED. The electronic device 100 uses the photodiode to detect infrared reflected light from nearby objects. When the intensity of the detected reflected light is greater than a threshold, it can be determined that there is an object near the electronic device 100. When the intensity of the detected reflected light is less than the threshold, the electronic device 100 can determine that there is no object near the electronic device 100. The electronic device 100 may use the proximity sensor 180G to detect when a user holds the electronic device 100 close to their ear for a call, so as to automatically turn off the screen to save power. The proximity sensor 180G can also be used in holster mode and pocket mode for automatic unlocking and locking of the screen.

[0152] The ambient light sensor 180L can be used to sense ambient light brightness. The electronic device 100 can adaptively adjust the brightness of its display screen 194 based on the sensed ambient light brightness. The ambient light sensor 180L can also be used to automatically adjust the white balance when taking a picture. The ambient light sensor 180L can also work in conjunction with the proximity sensor 180G to detect whether the electronic device 100 is obstructed, such as when the electronic device is in a pocket. When obstruction or being in a pocket is detected, some functions (such as touch functionality) can be disabled to prevent accidental operation.

[0153] The fingerprint sensor 180H is used to collect fingerprints. The electronic device 100 can utilize the characteristics of the collected fingerprints to achieve fingerprint unlocking, accessing application locks, taking photos with fingerprints, answering calls with fingerprints, etc.

[0154] Temperature sensor 180J is used to detect temperature. In some embodiments, electronic device 100 uses the temperature detected by temperature sensor 180J to execute a temperature handling strategy. For example, when the temperature detected by temperature sensor 180J exceeds a threshold, electronic device 100 reduces processor performance to reduce power consumption and implement thermal protection. In other embodiments, when the temperature detected by temperature sensor 180J is below another threshold, electronic device 100 heats battery 142. In still other embodiments, when the temperature is below yet another threshold, electronic device 100 may boost the output voltage of battery 142.

[0155] Touch sensor 180K, also known as a "touch device," can be located on display screen 194. The touch sensor 180K and display screen 194 together form a touchscreen, also known as a "touchscreen." Touch sensor 180K detects touch operations applied to or near it. The touch sensor can transmit the detected touch operation to the application processor to determine the type of touch event. Visual output related to the touch operation can be provided through display screen 194. In other embodiments, touch sensor 180K may also be located on the surface of electronic device 100, in a different position than display screen 194.

[0156] The bone conduction sensor 180M can acquire vibration signals. In some embodiments, the bone conduction sensor 180M can acquire vibration signals from the vibrating bone segments of the human vocal cords. The bone conduction sensor 180M can also contact the human pulse to receive blood pressure signals. In some embodiments, the bone conduction sensor 180M can also be incorporated into headphones to form bone conduction headphones. The audio module 170 can parse the voice signals from the vibrating bone segments of the vocal cords acquired by the bone conduction sensor 180M to realize voice functionality. The application processor can parse heart rate information from the blood pressure signals acquired by the bone conduction sensor 180M to realize heart rate detection functionality.

[0157] Button 190 may include a power button, volume buttons, etc. Button 190 may be a mechanical button or a touch button. Electronic device 100 may receive button input and generate key signal inputs related to user settings and function control of electronic device 100.

[0158] Motor 191 can generate vibration alerts. Motor 191 can be used for incoming call vibration alerts or for touch vibration feedback. For example, different vibration feedback effects can correspond to touch operations performed on different applications (such as taking photos, playing audio, etc.). Motor 191 can also correspond to different vibration feedback effects for touch operations performed on different areas of the display screen 194. Different application scenarios (such as time reminders, receiving messages, alarm clocks, games, etc.) can also correspond to different vibration feedback effects. The touch vibration feedback effect can also be customized.

[0159] Indicator 192 can be an indicator light, used to indicate charging status, power changes, or to indicate messages, missed calls, notifications, etc.

[0160] The SIM card interface 195 is used to connect a SIM card. The SIM card can be inserted into or removed from the SIM card interface 195 to make contact with and separate from the electronic device 100. The electronic device 100 can support one or more SIM card interfaces. The SIM card interface 195 can support Nano SIM cards, Micro SIM cards, SIM cards, etc. Multiple cards can be inserted into the same SIM card interface 195 simultaneously. The multiple cards can be of the same or different types. The SIM card interface 195 is also compatible with different types of SIM cards. The SIM card interface 195 is also compatible with external memory cards. The electronic device 100 interacts with the network through the SIM card to realize functions such as calls and data communication. In some embodiments, the electronic device 100 uses an eSIM, i.e., an embedded SIM card. The eSIM card can be embedded in the electronic device 100 and cannot be separated from the electronic device 100.

[0161] Figure 2 The illustration shows a schematic electronic device 100 using a conductive elastic connector for electrical connection, according to an embodiment of this application. The electronic device 100 may include a first element 10, a conductive elastic connector A, and a second element 20, wherein the conductive elastic connector A is disposed between the first element 10 and the second element 20, and the first element 10 and the second element 20 are electrically connected through the conductive elastic connector A. Specifically, the conductive elastic connector A has a first surface and a second surface disposed opposite to each other along a first direction (e.g., the height direction), the first surface being electrically connected to the first element, and the second surface being electrically connected to the second element. In some embodiments, the first element 10 may be the mid-frame of the electronic device, wherein the mid-frame is grounded.

[0162] In some embodiments, the second element 20 can be a display module, and the first element 10 is an electronic device frame. The display module can be grounded by connecting to the frame via a conductive elastic connector A. Specifically, the frame is electrically connected to the first surface of the conductive elastic connector A, and the display module is electrically connected to the second surface of the conductive elastic connector A.

[0163] In other embodiments, the second element 20 can be a shielding cover, and the first element 10 can be the frame of an electronic device. The two are electrically connected by a conductive elastic connector A to ground the shielding cover. It should be understood that the shielding cover can be used to ground the outer surface of devices (e.g., radio frequency front-end modules) located inside an electronic device.

[0164] In some other embodiments, the second element 20 is a camera module, the second element 10 is an electronic device frame, and the camera module is electrically connected to the frame through a conductive elastic connector A to achieve grounding of the camera module.

[0165] In some other embodiments, the second element 20 is an antenna support, the second element 10 is an electronic device frame, and the antenna support is grounded by being electrically connected to the frame through a conductive elastic connector A.

[0166] In some embodiments, the conductive elastic connector A can also be used to ground PCBs (Printed Circuit Boards), cables, etc.

[0167] Figure 3A The diagram shows a schematic cross-sectional view of a conductive elastic connector A. It should be understood that the conductive elastic connector A is a three-dimensional structure having length, width, and height. In some embodiments, the conductive elastic connector A can be conductive foam (e.g., FOF (Fabric over Foam) conductive foam, perforated foam, or omnidirectional foam). Figure 3AIn the schematic structure of the conductive elastic connector shown, the conductive elastic connector includes a first surface (the surface connected to the first element 10) and a second surface (the surface connected to the second element 20) disposed opposite each other in a first direction (e.g., the height direction H), two side surfaces (i.e., the left side and the right side, not shown in the figure) disposed opposite each other in a second direction (e.g., the width direction W), and two side surfaces (not shown in the figure) disposed opposite each other in a third direction (e.g., in the length direction L, wherein the length direction L is perpendicular to the width direction W and perpendicular to the plane of the paper). In some embodiments, the first surface and the second surface can be rectangular, circular, elliptical, trapezoidal, etc. It should be understood that the shapes of the first surface and the second surface can be different. That is, the contact surface of the conductive elastic connector A connected to the first element can be different from the contact surface of the conductive elastic connector A connected to the second element. For example, when using conductive foam to connect the display screen and the middle frame to achieve grounding, the contact area of ​​the first surface of the spring connecting to the display screen can be smaller than the contact area of ​​the second surface of the spring connecting to the middle frame.

[0168] Figure 3A The conductive elastic connector shown is elastic and has an initial height of h0. The height of the conductive elastic connector changes after compression, where the changed height is the amount of compression. For example, the amount of compression of the conductive elastic connector after being subjected to pressure can be h1. If further compressed, the amount of compression of the conductive elastic connector can reach h3, where h3 is greater than h1.

[0169] In this embodiment, the conductive elastic connector has rectangular shapes for both its cross-section along the first plane (i.e., the cross-section obtained by cutting along plane HW, where plane HW is the plane formed by the height direction H and the width direction W) and its cross-section along the second plane (i.e., the cross-section obtained by cutting along plane HL, where plane HL is the plane formed by the height direction H and the length direction L). Those skilled in the art will understand that in alternative embodiments, the shapes of the first and second plane cross-sections of the conductive elastic connector can also be other shapes, such as trapezoids. The specific shape can be reasonably set according to the actual usage environment and usage requirements, and this does not limit the scope of protection of this application. It should also be understood that when the conductive elastic connector is a spring sheet, the cross-section cut along the width direction W (or the length direction L) of the conductive elastic connector can be formed by the contour of the spring sheet.

[0170] Figure 3B The diagram shows another schematic cross-sectional view of the conductive elastic connector A. It should be understood that the conductive elastic connector A is a three-dimensional structure having length, width, and height. In some embodiments, the conductive elastic connector A may be a spring.

[0171] The description of how shrapnel changes height under pressure can be cited from... Figure 3A The relevant descriptions in the document will not be repeated here.

[0172] The quality of a grounding scheme using conductive elastic connector A can be measured using DFR (Deformation, Force, Resistance) curves, such as... Figure 3A As shown in the figure, the horizontal axis represents the compression (Deformation), and the vertical axes represent the grounding impedance (Resistance) and the pressure (Force), respectively.

[0173] exist Figure 3C In the diagram, curve a represents the relationship between the grounding impedance and compression amount of conductive elastic connector A when it connects the first and second elements, with the first element electrically connected to the reference ground. The grounding impedance of conductive elastic connector A decreases as the compression amount increases. To meet the requirement that the grounding impedance be less than the maximum grounding impedance, the first region where the grounding impedance is lower than the upper limit impedance is the working region where the impedance requirement is met. In other words, the compression amount of conductive elastic connector A needs to be within this first region (e.g., the compression amount is such that...). Figure 3A Only when the compression of the conductive elastic connector A reaches a minimum compression value (as shown between h1 and h2) can the grounding impedance requirements be met. Therefore, the compression value of the conductive elastic connector A needs to reach a minimum compression value, and the compression value greater than the minimum compression value is the compression range that meets the grounding requirements. It should be understood that... Figure 3A h2 can be infinitely close to the thickness of the conductive elastic connector A itself. In some embodiments, the upper limit grounding impedance is 0.2 ohms, and a grounding impedance less than 0.2 ohms is referred to as low impedance.

[0174] The relationship curves (curve a) between grounding impedance and compression amount differ for different conductive elastic connectors A. For example, as the compression amount increases, the rate at which the grounding impedance of the first conductive elastic connector A decreases with increasing compression amount can be greater than that of the first connector B. Therefore, to reduce the grounding impedance to the upper limit impedance, the minimum compression amount required for the first conductive elastic connector A is less than that required for the second conductive elastic connector A. Thus, it can be considered that the first conductive elastic connector A has a wider compression range to meet the impedance requirements. For example, if the height of both the first and second conductive elastic connectors A is 1.5mm, the first conductive elastic connector A meets the grounding impedance requirement with a compression amount of 0.2mm, while the second conductive elastic connector A needs to meet the grounding impedance requirement with a compression amount of 0.5mm. Therefore, the compression range for the first conductive elastic connector A to meet the impedance requirements is 0.2mm-1.5mm, and the compression range for the second conductive elastic connector A to meet the impedance requirements is 0.5mm-1.5mm. Thus, the first conductive elastic connector A has a wider compression range to meet the impedance requirements.

[0175] Curve b shows the relationship between the pressure (or the pressure on the first element 10 and / or the second element 20) and the compression amount when the conductive elastic connector A connects the first and second elements. It can be seen that the pressure on the conductive elastic connector A increases with the increase of the compression amount. It should be understood that to meet the pressure requirements, the pressure needs to be between a lower limit force and an upper limit force. The lower limit force is the pressure value experienced by the conductive elastic connector A when it is at the compression amount corresponding to meeting the impedance requirements. Setting an upper limit force ensures that the first element and / or the second element will not be damaged due to excessive pressure. For example, in applications where the display screen is grounded, excessive pressure can cause film marks on the flexible display screen, affecting its aesthetics.

[0176] In some embodiments, the grounding pressure is required to be no greater than 0.5 Newtons, or, for common conductive elastic connectors, the area of ​​the contact surfaces (first and second surfaces) with the first and / or second elements is 2.5 mm². For a 2.5mm thick conductive elastic connector, the pressure generated at maximum compression shall not exceed 0.08 MPa. It should be understood that the required upper limit pressure may vary for different grounding scenarios.

[0177] The compression range of the conductive elastic connector A to meet the pressure requirements is the second region. The pressure generated by the conductive elastic connector A needs to be greater than the minimum pressure value (the pressure value corresponding to the upper limit impedance) and less than the maximum pressure value. In other words, to meet the pressure requirements, the compression amount of the conductive elastic connector A has a range (e.g., between h1 and h3, where h1 is the compression amount to meet the maximum grounding impedance requirement, and h3 is the compression amount corresponding to the upper limit pressure value). It should be understood that the upper limit pressure value and / or lower limit pressure value are different for different conductive elastic connectors A.

[0178] The region within which the compression range of the conductive elastic connector A simultaneously satisfies both impedance and pressure requirements is designated as the third region. The overlapping area of ​​the compression amounts of the first and second regions constitutes the compression range of the third region (for example, as shown in Figure 3, the compression range of the first region is h1 to h2, and the compression range of the second region is h1 to h3, where h3 is less than h2; therefore, the compression range of the third region is h1 to h3). It should be noted that, in this embodiment, the compression range of the conductive elastic connector corresponding to the third region that satisfies both impedance and pressure requirements is defined as the working range of the conductive elastic connector.

[0179] The wider the compression range of the third region corresponding to the conductive elastic connector A, the larger the working range of the conductive elastic connector A that simultaneously meets the impedance and pressure requirements. It can be considered that the application scenarios of the conductive elastic connector A are wider and the grounding scheme is better.

[0180] Typically, grounding connections achieved through conductive elastic connector A must meet impedance requirements, meaning the grounding impedance must not exceed the maximum grounding impedance. Furthermore, with the increasing complexity and thinner design of electronic devices, coupled with their diverse functions and forms, grounding solutions must not only meet impedance requirements but also pressure requirements, ensuring the pressure does not exceed the maximum upper limit. For example, in grounding a display module, the maximum pressure the display module can withstand is 5 Newtons; therefore, the pressure generated by conductive elastic connector A must be less than 5 Newtons, otherwise, the display module will be damaged. Additionally, in certain scenarios, such as grounding a high-resolution camera, conductive elastic connector A must not only meet the requirements of low impedance and low pressure grounding but also low harmonic grounding to prevent harmonic noise from affecting the normal operation of the camera.

[0181] like Figure 4 As shown, an electronic device can use a spring contact 30 to electrically connect a first element 10 and a second element 20. In some embodiments, the first element 10 is a mid-frame, and the second element 20 is at least one device or module, such as a display screen, a camera module, an antenna, or a shielding cover. The spring contact connects the mid-frame and the second element 20 to ground the second element 20.

[0182] To address the yielding problem of spring sheets, high-modulus metals are typically used. The pressure exerted on a high-modulus elastic element increases dramatically with deformation, resulting in a small compression range for the spring sheet in the second region that meets the pressure requirements. This, in turn, leads to a reduction in the compression range in the third region, thus limiting the spring sheet's working range. In other words, the curve b corresponding to the spring sheet is steeper, and its compressible range is smaller.

[0183] Furthermore, during use, the pressure on the spring increases dramatically with deformation, easily exceeding the upper limit of the spring structure's load-bearing capacity, leading to spring failure. Additionally, if the spring is used to connect the mid-frame and the display module for grounding, the rapidly increasing pressure generated by the spring can easily cause film marks in the display module.

[0184] like Figure 5As shown, electronic devices can also use FOF foam 40 to connect a first element 10 and a second element 20. The FOF foam has a first surface and a second surface disposed opposite each other in the height H direction, wherein the first surface is electrically connected to the first element 10, and the second surface is electrically connected to the second element 20. It should be understood that the FOF foam includes at least a foam body 403, a hot melt adhesive layer 402 covering the surface of the foam body, and a conductive wrapping layer 401 covering the surface of the hot melt adhesive layer. The wrapping layer 401 can be a conductive fabric. It should be understood that conductive adhesive 404 can be added between the FOF foam and the first element 10 and / or the second element for bonding the FOF foam to the first element 10 and / or the second element. It should be understood that due to process limitations, the size of the wrapping layer 401 can only be down to the micrometer level.

[0185] FOF foam is characterized by the ability to use foams of different densities to achieve the required low rebound force. The conductivity between the first and second surfaces of the FOF foam is achieved by the rebound force of the foam 403 and the first element 10 (or the second element 20) compressing the wrapping layer. To meet impedance requirements, the FOF foam requires a greater amount of compression, resulting in higher resistance in the FOF foam. Figure 3C The limited compression range required to meet grounding impedance requirements results in a small compression range for the foam. Furthermore, because the FOF foam itself has an incompressible conductive wrapping layer 401 and a hot melt adhesive layer 402, excessive pressure can cause these layers to break, leading to FOF foam failure. Therefore, FOF foam... Figure 3C The compressible rebound range required to meet pressure is limited, resulting in a narrow compression range. Because the compression range required to meet both grounding and pressure requirements is restricted, the compression range of the foam in the third region becomes smaller, thus reducing its working range. For example, if the height of the FOF foam is 1mm, the compression range required to meet both impedance and pressure requirements is 0.7mm-0.75mm, and the working range of the FOF foam is approximately 0.25mm to 0.3mm. When the compression exceeds 0.75mm, due to the compression-limiting conductive wrapping layer 401 and hot melt adhesive layer 402, the FOF foam cannot achieve a working height below 0.25mm. Furthermore, the FOF foam is prone to breakage under pressure, leading to an increase in impedance.

[0186] like Figure 6As shown, the electronic device can also use perforated foam 50 to connect the first element 10 and the second element 20. The perforated foam 50 includes a foam body 501 and a metallized wrapping layer 503 covering the foam body 501. The first surface (the surface that is electrically connected to the first element 10) and the second surface (the surface that is electrically connected to the second element 20) arranged opposite each other in the height H direction are connected through conductive vias (or metal pillars) 502. The conductive vias can be formed by electroplating or chemical plating, and the electrical connection between the first surface and the second surface is achieved through the conductive vias.

[0187] However, when perforated foam is subjected to pressure, the metal layer formed by electroplating or chemical plating inside the conductive holes is prone to breakage, leading to unstable grounding impedance. This limits the application of perforated foam in... Figure 3B The compression range corresponding to the first region shown in the curve results in a reduction in the compression range corresponding to the third region, meaning the working range of the perforated foam is narrower. It should be understood that, due to process limitations, the dimensions of the metallized coating layer 503 and the metal layer within the through-hole 502 can only be as small as the micrometer level.

[0188] In addition, the metal inside the through hole 502 is prone to fracture under pressure, which can easily cause an increase in high harmonics and generate electromagnetic interference to device modules (such as display screens or camera modules).

[0189] like Figure 7A and Figure 7B As shown, electronic devices can also use omnidirectional foam 60 to connect the first element 10 and the second element 20. The omnidirectional foam is composed of metallized foam bodies 601. In terms of manufacturing process, similar to perforated foam 50, conductivity can be achieved by metallizing the foam bodies through chemical plating or electroplating. It should be understood that the internal structure of the foam body is a mesh structure 602, where the mesh lines are areas for electroplating or chemical plating. Electroplating can increase the conductivity of the mesh lines, metallizing the foam body and increasing its conductivity. Through the conductive foam body, the electrical connection between the first element 10 and the second element 20 can be achieved. It should be understood that the foam body has a three-dimensional structure. Figure 7A The diagram only shows a schematic mesh connection in a two-dimensional plane, and the mesh shape is schematic. For example... Figure 7B As shown, Figure 7B The partial image of the metallized bubble 601 under an electron microscope shows that the metallized bubble 601 has a three-dimensional network structure, and the nodes in the network are connected by lines. The lines achieve conductivity through an electroplating process. It should be understood that, due to the limitations of electroplating or electroless plating processes, the size of the metal coating on the network structure 602 can only be down to the micrometer level.

[0190] Similar to perforated foam 50, after compression, the omnidirectional foam 60's resilience is compromised due to the conductive process (e.g., electroplating) applied to the foam body 601, which damages the foam's elasticity. The metal plating within the metallized foam body 601 is prone to breakage and peeling. Furthermore, the metallized foam body 601 itself is easily broken, which limits the third area of ​​the omnidirectional foam (such as...). Figure 3A The compression range of the third area shown is relatively narrow, meaning the working range of the all-around foam is relatively narrow.

[0191] Secondly, the metal plating inside the metallized bubble 601 is prone to breakage, which can easily lead to an increase in high harmonics and interfere with the normal operation of other devices or modules (e.g., display modules or camera modules).

[0192] As electronic devices become more functional, the number of components (or modules) within them increases. Therefore, grounding solutions require the ability to be freely grounded at the desired locations. This necessitates that conductive elastic connector A have a wider compression range, or a larger operating range, to enable electrical connections between different components or to ground different components.

[0193] However, the existing grounding solutions use conductive elastic connectors with too narrow an operating range to simultaneously meet both impedance and pressure requirements, and these connectors are prone to generating high harmonics, making effective grounding impossible. High harmonics can cause electromagnetic interference to the normal display of the display module. It should be understood that harmonics can be measured using PIM (Passive Intermodulation), measured in dBm, and generally, the PIM value for grounding is required to be less than -80 dBm.

[0194] Therefore, to achieve free grounding in multiple scenarios, conductive elastic connectors need to have a wide operating range (i.e., a wide compressible range that simultaneously meets impedance and pressure requirements) and also need to meet low harmonic operation requirements. For example, in the scenario of display module grounding, the operating range of the conductive elastic connector is required to be the first compression range; in the scenario of camera module grounding, the operating range of the conductive elastic connector is required to be the second compression range; and in the scenario of antenna bracket grounding, the operating range of the conductive elastic connector is required to be the third compression range. The current working ranges of springs, FOF (Fabric over Foam) foam, perforated foam, and omnidirectional foam cannot include the first, second, and third compression ranges, and therefore cannot achieve grounding in multiple application scenarios.

[0195] This application provides a conductive elastic connector, as shown in the following embodiments. Figure 8 and Figure 9The conductive elastic connector has an internal opening 702, and nanowires 7021 are attached to the internal opening 702. The conductive elastic connector can meet impedance and pressure requirements over a wide operating range. Furthermore, because the conductive elastic connector uses nanowires as the conductive layer, the nanowires are less prone to detachment and breakage, thus offering the advantage of low harmonic distortion.

[0196] The conductive elastic connector provided in this application, when used in electronic devices, has a wide operating range and can be applied to various application scenarios, enabling free connection between electronic device components or free grounding of components. For example, it can be used for grounding display modules, camera modules, and antenna brackets. Furthermore, because the conductive elastic connector has low harmonic characteristics, electronic devices using it can avoid electromagnetic interference between components or modules, mitigating ESD phenomena, and can be used for free grounding of terminal devices, vehicle-mounted devices, etc.

[0197] Figure 8 The diagram shows a schematic cross-sectional view of a conductive elastic connector 70 provided in this application along the HW plane (a plane formed by the height H direction and the width W direction). The conductive elastic connector 70 includes a bubble 701. The bubble 701 has multiple internal holes 702 inside, and nanowires are attached to the walls of the internal holes 702.

[0198] The cross-sectional shape of the bubble 701 in different planes (e.g., along a first plane (the plane formed by the height H direction and the width W direction), along a second plane (the plane formed by the height H direction and the length L direction), and along a third direction (the plane formed by the length L direction and the width W direction)) can be referenced from the aforementioned... Figure 3B The relevant description of the cross-section of the conductive elastic connector will not be repeated here.

[0199] The conductive elastic connector 70 is electrically connected to the first element 10 via a first surface and to the second element 20 via a second surface, wherein the first surface and the second surface are disposed opposite each other along the height H direction.

[0200] In some embodiments, a conductive adhesive 404 may be included between the conductive elastic connector A and the second element 20. In some embodiments, a conductive adhesive (not shown) may also be included between the conductive elastic connector A and the first element 10. Optionally, the conductive adhesive may be a pressure-sensitive adhesive. Optionally, the conductive adhesive is doped with conductive particles, wherein the conductive particles are one or more combinations of gold, silver, copper, aluminum, zinc, iron, and nickel. Optionally, the conductive adhesive may also be coated with nanowires, wherein the nanowires are one or more combinations of gold, silver, copper, aluminum, zinc, iron, and nickel.

[0201] By using conductive adhesive, while achieving electrical connection between the conductive elastic connector A and the first and / or second components, the conductive adhesive can buffer pressure and firmly adhere to prevent detachment. By doping the conductive adhesive with nano-conductive particles, the adhesive can achieve its adhesive properties while reducing grounding impedance.

[0202] In some embodiments, the material of the foam 701 may be at least one of the following: PU (polyurethane), PP (polypropylene), PE (polyethylene), PI (polyimide), silicone, polypropylene (PP), styrene-butadiene rubber, acrylate, vinyl acetate, vinylidene chloride, nitrile, organosilicon, acrylamide, natural rubber, polyvinyl chloride, polysulfide rubber, styrene-acrylate copolymer, vinyl acetate-acrylate copolymer, organosilicon-acrylate copolymer and modified organosilicon-acrylate copolymer, and rubber.

[0203] The foam 701 has an inner hole 702, which can be formed by foaming. It should be understood that the inner hole is only a schematic name and does not represent a limitation on the size, position, shape, etc. of the hole in the foam 701.

[0204] Because the foam 701 has an inner hole 702, the density of the foam 701 can be reduced. After the foam is compressed, the rebound force increases slowly, which can increase the working range of the foam. The compressible space and working range of the foam are larger than those of existing foams (e.g., FOF foam, perforated foam, omnidirectional foam), and can be more than twice as large.

[0205] In some embodiments, the density of the bubble with internal pores can be less than 200 kg / m³. 3 It should be understood that the embodiments in this application refer to densities less than 200 kg / m³. 3 It is called low density. Because... Figure 8 and Figure 9 The conductive elastic connector provided in this embodiment uses a bubble with an internal hole. The pressure (or rebound force) generated when the bubble is compressed increases slowly. This ensures that the bubble reaches a greater compression limit, thereby expanding the compressible range of the bubble to meet pressure requirements (e.g., Figure 3B The compression range of the second region (in the diagram) increases the working range of the conductive elastic connector. (Illustratively, in...) Figure 3BIn the embodiment of this application, the slope of curve b (pressure change with compression) of the conductive elastic connector is smaller, and the pressure changes more slowly with increasing compression. Before the pressure reaches the upper limit, the compression range corresponding to the second region is larger, resulting in a wider working range for the conductive elastic connector. In other words, for example, the initial height of a conventional conductive elastic connector before being subjected to pressure is 1 mm, and the height required to meet pressure and impedance requirements can only vary between 0.25 mm and 0.3 mm. However, the conductive elastic connector provided in this application can vary between 0.25 mm and 0.8 mm. Figure 3B In the DFR curve, the compressibility range of the second region can be more than twice that of conventional conductive elastic connectors. For example, for common conductive elastic connectors, the height is 1.2 mm or 1.5 mm, and the area of ​​the first or second surface is 2.5 mm². The bubble is 2.5mm thick, and its compression reaches 70%-75%. The pressure generated by the compression is less than 0.08 MPa. This means that the maximum compression of the bubble to meet pressure requirements can reach 70%-75%, and the rebound force generated by the bubble under pressure is less than 0.5 Newtons, still less than the upper limit force (e.g., ...). Figure 3B As shown, the conductive elastic connector has a wide operating range while meeting pressure requirements.

[0206] In some embodiments, such as Figure 8 As shown, the inner holes 702 are not interconnected, and all inner holes 702 in the conductive elastic connector 70 are completely closed pores. The inner holes 702 contain gas, forming bubbles, which are surrounded by the pore walls, preventing air and moisture from entering the interior of the inner holes 702. When the conductive elastic connector 70 is compressed, the gas in the inner holes generates a reaction force, allowing the conductive elastic connector 70 to rebound. It should be noted that in this embodiment, the non-interconnected inner holes within the bubbles are referred to as closed pores.

[0207] Conductive elastic connectors with internal closed pores possess rigidity and stability, and exhibit good resilience.

[0208] The shape of the inner hole 702 can be spherical, elliptical, etc., and the shape of the inner hole 702 is not limited in this embodiment. Considering actual processing errors, the shape of the inner hole 702 can be approximately spherical or approximately elliptical. In some embodiments, the shape of the inner hole 702 can include both spherical and elliptical shapes. In some embodiments, the shape of the inner hole 702 can also be other shapes, and this embodiment is not limited.

[0209] The inner hole 702 can be spherical, elliptical, etc. When the conductive elastic connector is compressed, it can be evenly stressed. The stress is released on the inner hole wall of the spherical or elliptical shape, which can avoid damage caused by uneven stress on the conductive elastic connector and also keep the grounding impedance stable.

[0210] In some embodiments, to obtain a slowly increasing pressure (or rebound force), the bubble is expanded in... Figure 3A The compression range corresponding to the second region shown can have an inner hole 702 size of 20µm-500µm, where the size can refer to the diameter of the inner hole 702 or the distance between the two farthest points on the inner hole wall. In some embodiments, in order to enable the bubble to have a wide range of elasticity while also having rigidity and stability to avoid damage under pressure, the inner hole size of the bubble can be 100µm.

[0211] In some embodiments, the inner hole 702 may also be a cylindrical through hole (similar to) connecting the first surface and the second surface. Figure 6 The through hole 502 of the perforated foam in the middle, wherein the first surface and the second surface are two surfaces of the conductive elastic connector arranged opposite to each other in the height H direction, the conductive elastic connector is electrically connected to the first element 10 through the first surface and to the second element 20 through the second surface.

[0212] Figure 9 As shown Figure 8 A schematic cross-sectional view of the inner hole 702 when it is spherical. The hole wall of the inner hole 702 may be covered with a conductive layer 7028, which is a nanowire. The nanowire may include, but is not limited to, at least one of carbon nanotubes, tin nanowires, copper nanowires, nickel nanowires, silver nanowires, and gold nanowires. The nanowires can be attached to the hole wall by coating or drop-coating. This embodiment illustrates the application of nanowire coating onto the inner hole as an example.

[0213] The conductive elastic connector provided in this application embodiment avoids the grounding impedance deterioration problem caused by the breakage of the electroplated layer on FOF foam and perforated foam because nanowires are coated on the inner hole wall. This allows for stable low impedance over a wide compression range. Figure 3C The compression range corresponding to the first region in the DFR curve is larger. Because nanowires are used as the conductive layer, the strength of the nanowires and their bonding force with the foam are higher than those of the electroplated layers commonly used in existing technologies, thus solving the problem of unstable grounding impedance caused by the peeling of electroplated layers in existing omnidirectional and perforated foams.

[0214] In some embodiments, the diameter of the nanowires coated on the pore walls is between 10 nm and 100 nm.

[0215] Controlling the diameter of the nanowires coated on the pore walls to between 10 nm and 100 nm allows for a more secure coating, preventing the nanowires from detaching under pressure and generating high harmonics. Furthermore, setting the diameter range to 10 nm to 100 nm results in a lower grounding impedance.

[0216] In some embodiments, the length-to-diameter ratio of the nanowire is between 1000:1 and 5000:1.

[0217] By setting the length-to-diameter ratio of the nanowires between 1000:1 and 5000:1, the breakage of the nanowires caused by pressure on the conductive elastic connector can be avoided, thus giving the nanowires rigidity and stability.

[0218] In some embodiments, to enhance conductivity, prevent nanowire detachment due to pressure on the bubble, and avoid the generation of high harmonics, the diameter of the nanowire is approximately 70 nm. It should be understood that in actual processing, the nanowire diameter and length-to-diameter ratio of the actual product may deviate slightly, but this is acceptable as long as it is within the allowable error range.

[0219] Therefore, the conductive elastic connector in this embodiment employs a bubble with an inner hole coated with nanowires. Because the inner hole is coated with nanowires, the grounding impedance remains stable and low. When the bubble is compressed by only 5%, the impedance can be less than 0.2 ohms, satisfying the grounding impedance requirement. Secondly, because of the inner hole in the bubble, the pressure (or rebound force) increases slowly when the conductive elastic connector is compressed, resulting in a wider compression range in the second region corresponding to the force below the upper limit. Therefore, the compression range in the third region of the conductive elastic connector is wide, meaning the conductive elastic connector has a wider operating range that simultaneously satisfies both impedance and pressure requirements.

[0220] Because a uniform nanowire layer is formed on the pore wall of the bubble body as a conductive layer, the conductive layer has better stability than the electroplated layer formed by traditional processes. The conductive layer is not easy to break or fall off, which can avoid the generation of high harmonics.

[0221] The conductive elastomer described in this application uses a composite of nanowires and foam to form a conductive elastic connector, which has a wide working range. Secondly, since nanowires are used as the conductive layer, the strength of the nanowires and their bonding force with the foam are higher than those of commonly used electroplating layers, which solves the problems of impedance instability and high harmonic generation caused by the peeling of the plating in omnidirectional foam and perforated foam in the prior art.

[0222] like Figure 10The diagram shown is a schematic cross-sectional view along the HW plane (the plane formed by the height H direction and the width W direction) of another conductive elastic connector 70 provided in an embodiment of this application. In some embodiments, the holes 702 may also be interconnected, such as... Figure 10 As shown. It should be noted that the interconnected holes are called openings. The holes 702 that constitute the openings are interconnected, allowing gas to flow between the holes, which makes the conductive elastic connector a more flexible and bendable material.

[0223] Figure 10 The conductive connector described in the embodiment and Figure 8 The difference between the conductive connectors described in the embodiments is as follows: Figure 10 The inner holes of the conductive connector described in the embodiment are interconnected, and the inner holes are open.

[0224] The description of the shape, size, and coated nanowires of the 702 inner hole, and their corresponding beneficial effects, can be found at [reference needed]. Figures 8-9 The relevant content in the embodiments will not be repeated here.

[0225] In some embodiments, the conductive elastic connector may include both open and closed pores (not shown in the figures), wherein both the open and closed pores are coated with nanowires. The inclusion of both open and closed pores in the conductive elastic connector structure allows it to possess both rigidity and stability, while also exhibiting flexibility and bendability by adjusting the position or area of ​​the open pores.

[0226] In some embodiments, the conductive elastic connector includes both open-cell and closed-cell regions, wherein the open-cell and closed-cell regions are located at different positions. For example, the closed-cell regions may be located on both sides along the width W direction, and the open-cell regions may be located between the closed-cell regions. By providing closed-cell regions on both sides along the width W direction and partially providing open-cell regions between the closed-cell regions along the width W direction, rigidity and stability can be achieved on both sides along the width W direction, ensuring that the connector connection does not detach. At the same time, the connector can have sufficient flexibility in the main connection area (e.g., the middle region of the conductive elastic connector's cross-section along the width W direction), ensuring that the conductive elastic connector has a wide operating range.

[0227] like Figure 11 The figure shown is a schematic cross-sectional view of another conductive elastic connector 70 provided in this application embodiment along the HW plane (the plane formed by the height H direction and the width W direction).

[0228] The description of the shape, size, and coated nanowires of the 702 inner hole, and their corresponding beneficial effects, can be found at [reference needed]. Figures 8-9 The relevant content in the embodiments will not be repeated here.

[0229] Figure 11 The conductive connector described in the embodiment and Figure 8 The difference between the conductive connectors described in the embodiments is as follows: Figure 11 The conductive connector described in the embodiments includes at least two different sizes of inner holes. For example, the bubble 701 includes an inner hole 7021 of a first size and an inner hole 7022 of a second size. It should be understood that size can refer to the diameter of the hole. It should be noted that inner holes of different sizes can form open holes (e.g., inner holes 7021 and 7022 are connected), and inner holes of different sizes can also be closed holes (e.g., inner holes 7021 and 7022 are not connected, inner holes 7021 are not connected to each other, and inner holes 7022 are not connected to each other). The embodiments of this application do not limit this.

[0230] By creating internal holes of different sizes within the foam, it is possible to ensure that the connector has good rigidity and stability while also possessing flexibility and bendability.

[0231] In some embodiments, the inner holes 7021 of the first size communicate with each other to form an open hole, while the inner holes 7022 of the second size do not communicate with each other to form a closed hole. By forming different structures (open holes or closed holes) with inner hole structures of different sizes, the conductive elastic connector can have both rigidity and stability, as well as flexibility and bendability.

[0232] Figure 12 The figure shown is a schematic cross-sectional view of another conductive elastic connector 70 provided in this application embodiment along the HW plane (the plane formed by the height H direction and the width W direction).

[0233] Figure 12 The conductive elastic connector shown is Figure 8 The difference between the conductive elastic connectors shown is that... Figure 10 The conductive elastic connector shown has a bubble surface coated with a conductive metal layer 703. It should be understood that in this embodiment, the coating and plating processes differ, and the size of the coated metal layer differs from the size of the coated nanowires.

[0234] In some embodiments, the conductive metal layer 703 is a conductive fabric, wherein the material of the conductive fabric can be nickel-plated fiber cloth, gold-plated fiber cloth, carbon-plated fiber cloth, or aluminum foil fiber cloth. It should be understood that conductive fabric is made by electroplating a metal coating onto a fiber cloth (generally polyester fiber cloth) to give it metallic conductive properties. For example, the aforementioned nickel-plated fiber cloth is made by electroplating nickel onto polyester fiber cloth to give it conductivity.

[0235] The description of the shape, size, and coated nanowires of the 702 inner hole, and their corresponding beneficial effects, can be found at [reference needed]. Figures 8-9The relevant details in the embodiments will not be repeated here. In some embodiments, with Figure 11 The embodiments are similar. Figure 12 The inner hole in the embodiments may also have different sizes, or the inner hole may include both an open hole and a closed hole, or the positions of the open hole and the closed hole may be different. Descriptions of setting inner holes of different sizes and setting different inner hole structures (open holes or closed holes) and their beneficial effects can be found at [reference needed]. Figure 11 The relevant content described in the embodiments will not be repeated here.

[0236] It should be understood that the metal conductive layer 703 may cover a first surface and a second surface of the conductive elastic connector that are disposed opposite to each other along the height H direction, wherein the first surface is electrically connected to the first element 10 and the second surface is electrically connected to the second element 20. In some embodiments, the metal conductive layer may also cover at least one side of the conductive elastic connector, wherein the side includes two surfaces disposed opposite to each other along the width W direction and two surfaces disposed opposite to each other along the length L direction.

[0237] Coating the surface of a conductive elastic connector with a conductive metal layer can enhance conductivity and reduce grounding impedance. Furthermore, it can mitigate the risk of increased grounding impedance due to nanowire breakage. For example, if the compression exceeds a certain value, the nanowire may break or even detach. Coating the surface with a conductive layer can prevent grounding impedance instability caused by potential nanowire breakage or detachment.

[0238] Figure 13 The figure shown is a schematic cross-sectional view of another conductive elastic connector 70 provided in this application embodiment along the HW plane (the plane formed by the height H direction and the width W direction).

[0239] Figure 13 The conductive elastic connector shown is Figure 8 The difference between the conductive elastic connectors shown is that... Figure 13 The conductive elastic connector shown has a metal conductive layer 703 coated on the surface of the bubble, wherein the description of the metal conductive layer 703 can be found in [reference]. Figure 12 Related descriptions of the embodiments. Additionally, Figure 13 The conductive elastic connector shown has a first surface and a second surface arranged along the height H direction, which are electrically connected through a through-hole 704. The through-hole 704 is coated with a metal layer by electroplating or chemical plating, or it may be coated with nanowires. It should be understood that the size of the electroplated or chemically plated metal layer differs from that of the coated nanowires.

[0240] The description of the shape, size, and nanowire coating of the 702 inner bore, as well as its corresponding beneficial effects, can be found at [reference needed]. Figures 8-9 The relevant details in the embodiments will not be repeated here. In some embodiments, with Figure 11 The embodiments are similar. Figure 13 The inner hole in the embodiments may also have different sizes, or the inner hole may include both an open hole and a closed hole, or the positions of the open hole and the closed hole may be different. Descriptions of setting inner holes of different sizes and setting different inner hole structures (open holes or closed holes) and their beneficial effects can be found at [reference needed]. Figure 11 The relevant content described in the embodiments will not be repeated here.

[0241] The conductive elastic connector is electrically connected to the first and second surfaces along the height H direction through through holes 704. The through holes 704 are coated with a metal layer by electroplating or chemical plating, or the through holes are coated with nanowires, which can enhance the conductivity of the conductive elastic connector and avoid the problem of unstable grounding impedance caused by the breakage and detachment of nanowires on the hole wall.

[0242] Figure 14 The figure shows a schematic cross-sectional view of another conductive elastic connector 70 provided in this application embodiment along the HW plane (the plane formed by the height H direction and the width W direction).

[0243] Figure 14 The aforementioned conductive elastic connector and Figure 8 The difference between the conductive elastic connectors shown is that... Figure 14 The conductive elastic connector's bubble body is a metallized bubble body, wherein the metallized bubble body is formed by electroplating or chemical plating (and...). Figures 7A-7B The metallized bubble described in the examples is similar.

[0244] The description of the shape, size, and nanowire coating of the 702 inner bore, as well as its beneficial effects, can be found at [reference needed]. Figures 8-9 The relevant details in the embodiments will not be repeated here. In some embodiments, with Figure 11 The embodiments are similar. Figure 14 The inner hole in the embodiments may also have different sizes, or the inner hole may include both an open hole and a closed hole, or the positions of the open hole and the closed hole may be different. Descriptions of setting inner holes of different sizes and setting different inner hole structures (open holes or closed holes) and their beneficial effects can be found at [reference needed]. Figure 11 The relevant content described in the embodiments will not be repeated here.

[0245] The conductive elastic connector may further include a bubble 601 after electroplating or chemical plating, the bubble 601 including a mesh-like conductive structure 602 and an inner hole 702 coated with nanowires.

[0246] The bubble of the conductive elastic connector is a metallized bubble, which is formed by electroplating or chemical plating. This can enhance the conductivity of the conductive elastic connector and avoid the problem of unstable grounding impedance caused by the breakage and detachment of nanowires on the inner hole wall.

[0247] Figure 15 The illustration shows a partial electron microscope image of a bubble containing an inner hole coated with nanowires, according to an embodiment of this application. It can be seen that the bubble includes an inner hole 702, and the walls of the inner hole are coated with nanowires 7028.

[0248] Figure 16 An example is given Figure 15 The DFR curve of the conductive elastic connector with an inner hole coated with nanowires provided in the embodiment.

[0249] For the first region that meets the low impedance requirement (e.g., less than 0.2 ohms), the compression is approximately 0.1mm-1mm. For the second region that meets the pressure requirement (e.g., pressure less than 0.5 Newtons), the compression is 0.1mm-0.87mm. Therefore, the compression range that meets both impedance and pressure requirements is 0.1mm-0.87mm.

[0250] Figure 17 illustratively provided Figure 15 The harmonic curves of the conductive elastic connector with an inner hole coated with nanowires provided in the embodiment show that, over a wide range of compression (e.g., between 0.1 and 0.8 mm), the harmonic values ​​of the conductive elastic connector are all less than -80 dBm.

[0251] Conductive elastic connectors with internal holes coated with nanowires can have a wider operating range. In display module (e.g., flexible display) grounding scenarios, this can reduce pressure (or rebound force) on the display, mitigating bright spots, bright lines, and film marks, and also reducing the risk of screen failure. Furthermore, in antenna grounding scenarios, it can meet the low impedance conductivity requirements of antennas and radio frequencies, exhibiting low harmonic characteristics.

[0252] To improve the bonding force between the bubble and the nanowire, a suitable solvent can be used during the preparation process. This solvent causes the bubble volume to expand to more than twice its original size. After curing, the bubble volume returns to its initial size. Therefore, this can increase the density of the conductive layer of the cured bubble. In addition, it can also improve the bonding force between the conductive layer and the bubble, thereby further reducing the grounding impedance.

[0253] like Figure 18 As shown in the figure, this application provides a method for preparing a conductive elastic connector, the method comprising:

[0254] S1801: Preparation of nanowire solution.

[0255] In some embodiments, the diameter of the nanowire can be 10-100 nm, and the aspect ratio can be in the range of 1000:1-5000:1.

[0256] In some embodiments, the nanowires may be at least one of conductive materials such as nano-copper, nano-silver, nano-nickel, or nano-gold.

[0257] In some embodiments, in order to enhance conductivity, reduce the risk of nanowire detachment due to pressure, and avoid the generation of high harmonics, the diameter of the nanowire is 70 nm.

[0258] In some embodiments, a foam expanding agent can be used as a solvent for the nanowire solution, so that the foam expands in volume during the drop-coating / coating process and then is composited. After curing and molding, the volume shrinks to form a nanowire conductive layer with high density and stronger bonding force, which solves the problem of impedance instability and harmonics caused by coating peeling and breakage in the conductive elastic connectors in the prior art.

[0259] S1802: Select a bubble with an inner hole. The size of the inner hole can be selected from 20um to 500um, and the material of the bubble can be silicone foam, etc. In some embodiments, in order to improve the pressure rebound working range of the bubble, the inner hole size of the bubble can be 100um.

[0260] S1803: Drop-coating / coating the nanowire solution onto a porous bubble, or immersing the porous bubble in the nanowire solution.

[0261] S1804: Dry and cure the conductive elastic connector obtained from S1803 at a temperature of 50-70℃ for 2-20 minutes.

[0262] S1805: Repeat S1803 and S1804 multiple times, 6-10 times in total.

[0263] S1806: The conductive elastic connector obtained by baking S1805 is baked at a temperature of 70°C for 30 minutes.

[0264] To enable the conductive elastic connector to be surface mounted, i.e. to solve the SMT (Surface Mount Technology) problem, the conductive elastic connector provided in this application can be coated with solderable nanowires on the surface of the conductive elastic connector (including a first surface and a second surface that are arranged opposite each other along the height H direction) to form a solderable conductive layer, thereby solving the surface mounting problem of the conductive elastic connector.

[0265] like Figure 19 As shown in the figure, this application provides a method for preparing a surface-mountable conductive elastic connector, the method comprising:

[0266] S1901-S1905, of which S1901-S1905 can be cited Figure 18 The details of steps S1801 to S1805 of the conductive elastic connector preparation method described in the embodiments will not be repeated here.

[0267] S1906: Coating a solderable nanowire solution onto a conductive elastic connector. The nanowires may be nanomaterials with solderable properties, such as at least one of nano-copper, nano-tin, or nano-gold.

[0268] S1907: Dry and cure conductive elastic connectors coated with a weldable nanowire solution at a temperature of 50-70℃ for 2-20 minutes.

[0269] S1908: Bake the conductive elastic connector coated with a solderable nanowire solution at a temperature of 70°C for 30 minutes.

[0270] By coating solderable nanowires onto a bubble, a conductive elastic connector is made surface-mountable and can be soldered onto a motherboard for grounding.

[0271] Obviously, those skilled in the art can make various modifications and variations to this application without departing from the spirit and scope of this application. Therefore, if such modifications and variations fall within the scope of the claims of this application and their equivalents, this application also intends to include such modifications and variations.

Claims

1. A conductive elastic connector, characterized in that, The conductive elastic connector is used to connect the first element and the second element, and the conductive elastic connector includes: A bubble body having a first surface and a second surface disposed opposite each other in a first direction, wherein the first surface is for electrical connection with a first element, and the second surface is for electrical connection with a second element, the bubble body including an open hole and a closed hole; wherein the closed hole is located in two side regions along the width direction, and the open hole is located between the two side regions; Nanowires, wherein the nanowires are attached to the walls of the open and closed pores; the diameters of the open and closed pores are both 20µm-500µm; the diameter of the nanowires is 10nm-100nm, and the length-to-diameter ratio of the nanowires is between 1000:1 and 5000:

1. In this process, when the bubble is drop-coated / coated with a nanowire solution in which the solvent is a bubble expander, the volume of the bubble first expands, then it is composited and then solidified and shrinks, so that the nanowires are attached to the pore walls of the open pores and the closed pores.

2. The conductive elastic connector according to claim 1, characterized in that, The density of the conductive elastic connector is less than or equal to 200 kg / m³. 3 .

3. The conductive elastic connector according to claim 1 or 2, characterized in that, The nanowires are at least one of nano-silver, nano-copper, carbon nanowires, and nano-gold.

4. The conductive elastic connector according to claim 1 or 2, characterized in that, The conductive elastic connector further includes a conductive fabric, which covers the surface of the bubble, and the surface of the bubble includes a first surface and a second surface disposed opposite to each other in a first direction of the bubble.

5. The conductive elastic connector according to claim 4, characterized in that, The first and second surfaces are electrically connected through through holes, the walls of which are covered with a conductive metal layer or nanowires.

6. The conductive elastic connector according to claim 1 or 2, characterized in that, The bubble has a three-dimensional network structure with a conductive metal layer attached.

7. An electronic device, characterized in that, The electronic device includes a first element, a second element, and a conductive elastic connector as described in any one of claims 1-6.

8. The electronic device according to claim 7, characterized in that, The electronic device further includes a conductive adhesive, wherein a conductive adhesive is disposed between the first surface and the first element, and a conductive adhesive is disposed between the second surface and the second element.

9. The electronic device according to claim 7 or 8, wherein the first element is a mid-frame, and the second element is at least one of an antenna bracket, a display module, a shielding cover, or a camera module.

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