A black high heat dissipation insulation board

Abstract

The present invention discloses a black insulating board with high heat dissipation, comprising a metal substrate, oxide layers stacked in sequence on the metal substrate, and a black heat-conducting layer. The preparation process of the black heat-conducting layer comprises the following steps: pouring the prepared black heat-conducting material into a preheated mold, and then uniformly coating it on the surface of the oxide layer. The present invention utilizes the good chemical stability and excellent thermal conductivity of boron nitride nanosheets, and the large aspect ratio and flaky structure make it easier for it to form a heat conduction path in a polymer matrix. In addition, tea polyphenols have excellent antioxidant properties, so that the prepared insulating board not only has good antioxidant properties, but also has good thermal conductivity and heat dissipation properties.

Description

Technical Field

[0001] The invention relates to the technical field of insulation boards, and in particular to a black insulation board with high heat dissipation. Background Art

[0002] Chinese patent CN113801354B discloses a high-temperature resistant transparent glass fiber insulation board and its preparation method. The solution uses epoxy resin as the main material, benzoxazine resin, and flame-retardant prepolymer as auxiliary materials to prepare the insulation board glue. The prepreg is then impregnated on the surface of the glass fiber cloth to obtain a prepreg. The prepreg is hot-pressed and laminated. The resulting insulation board not only has excellent high-temperature resistance but also excellent flame retardancy. The surface is hydrophobic and can effectively prevent the ingress of aqueous media. At the same time, due to the parameter restrictions of the flame-retardant prepolymer, the cross-linking density of the glue is excellent, its water absorption rate is greatly reduced, and its water resistance is even better.

[0003] In the prior art, most of the time, an organic polymer or resin coating is applied on the substrate of the insulating board to provide protection. However, the coating will seriously reduce the thermal conductivity of the substrate during the operation of the insulating board. Moreover, the organic polymer or resin coating will age after working for a long time in a hot environment, causing a serious reduction in thermal conductivity, thereby further reducing the performance of the insulating board. Summary of the Invention

[0004] The purpose of the present invention is to solve the problem that the coating will seriously reduce the thermal conductivity of the substrate during the operation of the insulation board, and to provide a black insulation board with high heat dissipation.

[0005] The purpose of the present invention can be achieved through the following technical solutions:

[0006] A black high-heat dissipation insulating plate comprises a metal substrate, oxide layers stacked in sequence on the metal substrate, and a black heat-conducting layer;

[0007] The preparation process of the black thermal conductive layer includes the following steps:

[0008] The prepared black thermal conductive material is poured into a preheated mold and then evenly coated on the surface of the oxide layer.

[0009] As a further solution of the present invention: a process for preparing a black thermally conductive material comprises the following steps:

[0010] Step 1: After mixing boron nitride nanosheets with modified tea polyphenols, add PBS buffer to adjust the pH to 7.4 and ferric chloride aqueous solution, stir, filter, wash, and dry to obtain boron nitride nanosheets modified with tea polyphenol complexed with iron ions;

[0011] Step 2: After mixing the epoxy resin with the boron nitride nanosheets modified with tea polyphenol complexed iron ions, a curing agent is added, and the mixture is stirred and dried to obtain a thermal conductive material.

[0012] As a further solution of the present invention: the mass ratio of boron nitride nanosheets, modified tea polyphenols and ferric chloride aqueous solution is 1-10:400-1200:1-10.

[0013] As a further embodiment of the present invention, the concentration of the ferric chloride aqueous solution is 6 mg / mL.

[0014] As a further solution of the present invention: the mass ratio of epoxy resin, boron nitride nanosheets modified by tea polyphenol complexed iron ions and curing agent is 20-50:80-160:5-10.

[0015] As a further solution of the present invention: the preparation process of modified tea polyphenols comprises the following steps:

[0016] Step 1: Stir the carbon black slurry and pour it into a colloid mill for grinding to obtain a carbon black slurry;

[0017] Step 2: Ultrasonic mixing of carbon black slurry and tea polyphenols to obtain modified tea polyphenols.

[0018] As a further solution of the present invention: the mass ratio of carbon black slurry to tea polyphenols is controlled to be 10-20:80-180.

[0019] As a further solution of the present invention: the mass fraction of the carbon black slurry is 5%.

[0020] Beneficial effects of the present invention:

[0021] The present invention utilizes the abundant phenolic hydroxyl groups on tea polyphenols to chelate with metal ions, forming a stable complex. Leveraging the strong adhesion of the complex, an ultrathin coating containing hydroxyl groups is formed on the surface of the boron nitride nanosheets. The phenolic hydroxyl groups on the coating undergo a ring-opening reaction with the epoxy groups in the epoxy resin, enhancing the interfacial compatibility between the boron nitride nanosheets and the epoxy resin and improving the dispersibility of the boron nitride nanosheets in the epoxy resin. This results in a black thermally conductive material for the surface of the insulating board.

[0022] It utilizes the good chemical stability and excellent thermal conductivity of boron nitride nanosheets, and the ultra-large aspect ratio and sheet structure make it easier for it to form a thermal conduction path in the polymer matrix; and tea polyphenols have excellent antioxidant properties, so that the prepared insulating board not only has good antioxidant properties, but also has good thermal conductivity and heat dissipation properties. DETAILED DESCRIPTION

[0023] The following will be combined with the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the embodiments described are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making any creative efforts shall fall within the scope of protection of the present invention.

[0024] Example 1

[0025] The present invention is a black high-heat dissipation insulating plate, comprising a metal substrate, oxide layers stacked in sequence on the metal substrate, and a black heat-conducting layer;

[0026] The preparation process of the black thermal conductive layer includes the following steps:

[0027] The prepared black thermal conductive material is poured into a preheated mold and then evenly coated on the surface of the oxide layer;

[0028] Specifically, the preparation process of the black thermal conductive material includes the following steps:

[0029] Step 1: Boron nitride nanosheets are dispersed in modified tea polyphenols, stirred at 300 rpm for 20 minutes, and then ultrasonically treated (frequency 25 kHz, power 100 W) for 30 minutes in an ultrasonic cleaner (KQ3200DA, power 135 W); PBS buffer is added to adjust the pH to about 7.4, and an aqueous solution of ferric chloride is added and stirred for 45 seconds. The above solution is centrifuged in a high-speed centrifuge (speed 3000 rpm) for 8 minutes, and then the substrate is filtered and washed with polytetrafluoroethylene filter paper. The filter cake is dried at 60°C for 18 hours to obtain boron nitride nanosheets modified with tea polyphenol complexed iron ions;

[0030] The mass ratio of boron nitride nanosheets, modified tea polyphenols and ferric chloride aqueous solution is 1:400:1; the concentration of ferric chloride aqueous solution is 6 mg / mL;

[0031] Step 2: Weigh epoxy resin and preheat it at 60°C for 15 minutes, add a certain amount of boron nitride nanosheets modified with tea polyphenol complexed iron ions, treat it with ultrasound (KQ3200DA, power of 135W) at 28°C for 15 minutes, then stir it at 60°C and 300 rpm for 2 hours, then add curing agent, magnetically stir it at 300 rpm for 5 minutes, and degas the resulting mixture in a vacuum drying oven for 30 minutes; thus, a thermal conductive material can be obtained;

[0032] The mass ratio of epoxy resin, boron nitride nanosheets modified with tea polyphenol-complexed iron ions, and curing agent is 20:80:5;

[0033] Preferably, the preparation process of modified tea polyphenols comprises the following steps:

[0034] Step 1: Stir 5% carbon black slurry for 1 hour, pour it into a colloid mill and grind it to obtain a carbon black slurry;

[0035] Step 2: ultrasonically clean the carbon black slurry and tea polyphenols in an ultrasonic cleaner for half an hour to obtain modified tea polyphenols;

[0036] The mass ratio of the carbon black slurry with a mass fraction of 5% to the tea polyphenols is controlled to be 10:80.

[0037] Example 2

[0038] The present invention is a black high-heat dissipation insulating plate, a metal substrate, an oxide layer and a black heat-conducting layer formed on the metal substrate in sequence;

[0039] The preparation process of the black thermal conductive layer includes the following steps:

[0040] The prepared black thermal conductive material is poured into a preheated mold and then evenly coated on the surface of the oxide layer;

[0041] Specifically, the preparation process of the black thermal conductive material includes the following steps:

[0042] Step 1: Boron nitride nanosheets are dispersed in modified tea polyphenols, stirred at 300 rpm for 20 minutes, and then ultrasonically treated (frequency 25 kHz, power 100 W) for 30 minutes in an ultrasonic cleaner (KQ3200DA, power 135 W); PBS buffer is added to adjust the pH to about 7.4, and an aqueous solution of ferric chloride is added and stirred for 45 seconds. The above solution is centrifuged in a high-speed centrifuge (speed 3000 rpm) for 8 minutes, and then the substrate is filtered and washed with polytetrafluoroethylene filter paper. The filter cake is dried at 60°C for 18 hours to obtain boron nitride nanosheets modified with tea polyphenol complexed iron ions;

[0043] The mass ratio of boron nitride nanosheets, modified tea polyphenols and ferric chloride aqueous solution is 5:800:5; the concentration of ferric chloride aqueous solution is 6 mg / mL;

[0044] Step 2: Weigh epoxy resin and preheat it at 60°C for 15 minutes, add a certain amount of boron nitride nanosheets modified with tea polyphenol complexed iron ions, treat it with ultrasound (KQ3200DA, power of 135W) at 28°C for 15 minutes, then stir it at 60°C and 300 rpm for 2 hours, then add curing agent, magnetically stir it at 300 rpm for 5 minutes, and degas the resulting mixture in a vacuum drying oven for 30 minutes; thus, a thermal conductive material can be obtained;

[0045] Among them, the mass ratio of epoxy resin, boron nitride nanosheets modified by tea polyphenol complexed iron ions and curing agent is 35:120:8

[0046] Preferably, the preparation process of modified tea polyphenols comprises the following steps:

[0047] Step 1: Stir 5% carbon black slurry for 1 hour, pour it into a colloid mill and grind it to obtain a carbon black slurry;

[0048] Step 2: ultrasonically clean the carbon black slurry and tea polyphenols in an ultrasonic cleaner for half an hour to obtain modified tea polyphenols;

[0049] Among them, the mass ratio of carbon black slurry with a controlled mass fraction of 5% to tea polyphenols is 15:130.

[0050] Example 3

[0051] The present invention is a black high-heat dissipation insulating plate, a metal substrate, an oxide layer and a black heat-conducting layer formed on the metal substrate in sequence;

[0052] The preparation process of the black thermal conductive layer includes the following steps:

[0053] The prepared black thermal conductive material is poured into a preheated mold and then evenly coated on the surface of the oxide layer;

[0054] Specifically, the preparation process of the black thermal conductive material includes the following steps:

[0055] Step 1: Boron nitride nanosheets are dispersed in modified tea polyphenols, stirred at 300 rpm for 20 minutes, and then ultrasonically treated (frequency 25 kHz, power 100 W) for 30 minutes in an ultrasonic cleaner (KQ3200DA, power 135 W); PBS buffer is added to adjust the pH to about 7.4, and 0.5 mL of ferric chloride aqueous solution is added and stirred for 45 seconds. The above solution is centrifuged in a high-speed centrifuge (speed 3000 rpm) for 8 minutes, and then the substrate is filtered and washed with polytetrafluoroethylene filter paper. The filter cake is dried at 60°C for 18 hours to obtain boron nitride nanosheets modified with tea polyphenol complexed iron ions;

[0056] The mass ratio of boron nitride nanosheets, modified tea polyphenols and ferric chloride aqueous solution is 10:1200:10; the concentration of ferric chloride aqueous solution is 6 mg / mL;

[0057] Step 2: Weigh epoxy resin and preheat it at 60°C for 15 minutes, add a certain amount of boron nitride nanosheets modified with tea polyphenol complexed iron ions, treat it with ultrasound (KQ3200DA, power of 135W) at 28°C for 15 minutes, then stir it at 60°C and 300 rpm for 2 hours, then add curing agent, magnetically stir it at 300 rpm for 5 minutes, and degas the resulting mixture in a vacuum drying oven for 30 minutes; thus, a thermal conductive material can be obtained;

[0058] The mass ratio of epoxy resin, boron nitride nanosheets modified with tea polyphenol complexed iron ions, and curing agent is 50:160:10;

[0059] Preferably, the preparation process of modified tea polyphenols comprises the following steps:

[0060] Step 1: Stir 5% carbon black slurry for 1 hour, pour it into a colloid mill and grind it to obtain a carbon black slurry;

[0061] Step 2: ultrasonically clean the carbon black slurry and tea polyphenols in an ultrasonic cleaner for half an hour to obtain modified tea polyphenols;

[0062] The mass ratio of the carbon black slurry with a mass fraction of 5% to the tea polyphenols is controlled to be 20:180.

[0063] Comparative Example 1

[0064] Comparative Example 1 uses the thermally conductive insulating plate of Chinese Patent No. CN107660064B;

[0065] Performance testing:

[0066] Thermal conductivity tests were performed on Examples 1-3 and Comparative Example 1:

[0067] This test method adopts the GB / T8722-2008 thermal conductivity determination method. The test principle is to place a sample of a certain thickness between two upper and lower plates, apply a certain heat flow and pressure to the sample, use a heat flow sensor to measure the heat flow through the sample, the thickness of the test sample, and the temperature gradient between the hot plate and the cold plate, and then obtain the corresponding thermal resistance data at different thicknesses for linear fitting to obtain the thermal conductivity of the sample. Specific data are shown in the table below:

[0068] Thermal conductivity W / m·K Example 1 40.52W / m·K Example 2 46.20W / m·K Example 3 51.04W / m·K Comparative Example 1 28.1WW / m·K

[0069] From the above table, it can be concluded that the thermal conductivity of the insulating board prepared by the present invention is in the range of 40.52-51.04 W / m·K, which is greater than 28.1 W / m·K of the thermally conductive insulating board of Comparative Example 1. Therefore, the insulating board prepared by the present invention has excellent heat conduction efficiency, thereby improving the heat dissipation efficiency of the insulating board during operation.

[0070] The above is a detailed description of an embodiment of the present invention. However, the content described is only a preferred embodiment of the present invention and should not be considered to limit the scope of the present invention. All equivalent changes and improvements made within the scope of the present invention should still fall within the scope of the patent coverage of the present invention.

Claims

1. A black high heat dissipation insulation board, characterized in that: The invention comprises a metal substrate, oxide layers stacked in sequence on the metal substrate and a black heat-conducting layer; The preparation process of the black thermal conductive layer includes the following steps: The prepared black thermal conductive material is poured into a preheated mold and then evenly coated on the surface of the oxide layer; The preparation process of black thermal conductive material includes the following steps: Step 1: After mixing boron nitride nanosheets with modified tea polyphenols, add PBS buffer and ferric chloride aqueous solution, stir, filter, wash, and dry to obtain boron nitride nanosheets modified with tea polyphenol complexed with iron ions; Step 2: mixing the epoxy resin with the boron nitride nanosheets modified with tea polyphenol complexed iron ions, adding a curing agent, stirring, and drying to obtain a thermal conductive material; The mass ratio of epoxy resin, boron nitride nanosheets modified by tea polyphenol complexed iron ions and curing agent is 20-50:80-160:5-10; The preparation process of modified tea polyphenols comprises the following steps: Step 1: Stir the carbon black slurry and pour it into a colloid mill for grinding to obtain a carbon black slurry; Step 2: Ultrasonic mixing of the carbon black slurry and tea polyphenols to obtain modified tea polyphenols; The mass ratio of carbon black slurry to tea polyphenols is controlled to be 10-20:80-180; The mass fraction of carbon black slurry is 5%.

2. A black high heat dissipation insulating board according to claim 1, characterized in that: The mass ratio of the boron nitride nanosheets, the modified tea polyphenols and the ferric chloride aqueous solution is 1-10:400-1200:1-10.

3. The black high heat dissipation insulating board according to claim 2, characterized in that: The concentration of the ferric chloride aqueous solution was 6 mg / mL.