Integrated circuit repair method, apparatus, electronic device, and storage medium

Abstract

Embodiments of the present application disclose an integrated circuit repairing method and device, electronic equipment and storage medium. The integrated circuit repairing method comprises: in the production process of an integrated circuit product, detecting a failed unit of the integrated circuit product based on a predetermined period; according to a detection result of the failed unit, counting failure position data of the failed unit in the production process; adding a repairing scheme according to a data difference between the failure position data and predetermined failure position data corresponding to an existing repairing rule; verifying the repairing scheme according to product quality data after the repairing scheme is added, to obtain a verification result; and determining whether to update the repairing rule according to the added repairing scheme according to the verification result.

Description

TECHNICAL FIELD

[0001] Embodiments of the present application relate to the technical field of computer technology, and relate to but are not limited to an integrated circuit repair method and device, an electronic device and a storage medium. BACKGROUND

[0002] In the process of semiconductor product manufacturing, it is often necessary to test and repair the product online. The occurrence of product failure may have strong device correlation and location correlation. For example, due to the performance of a certain process equipment, abnormality is prone to occur at a fixed position on a wafer, thereby generating fixed-position failure units in the later process.

[0003] Based on this characteristic in the production process, the positions of possible failure units in the later stage can be repaired according to the existing correlation of failure units or empirical data in the wafer test stage, thereby increasing the yield of the product in the later stage. This method is called predictive repair (PR).

[0004] However, predictive repair requires a large number of evaluation tests, has low accuracy and takes a long time, and is difficult to meet the production capacity demand of complex process products. SUMMARY

[0005] Therefore, embodiments of the present application provide an integrated circuit repair method and device, an electronic device and a storage medium.

[0006] In a first aspect, embodiments of the present application provide an integrated circuit repair method, which comprises:

[0007] In the production process of an integrated circuit product, based on a predetermined period, detecting failure units of the integrated circuit product;

[0008] According to the detection result of the failure units, counting failure position data of the failure units appearing in the production process;

[0009] According to the data difference between the failure position data and the predetermined failure position data corresponding to the existing repair rule, adding a repair scheme;

[0010] According to the product quality data after adding the repair scheme, verifying the repair scheme to obtain a verification result;

[0011] According to the verification result, determining whether to update the repair rule according to the added repair scheme.

[0012] In some embodiments, the method further comprises:

[0013] Determining whether the added repair scheme is included in the existing repair rule;

[0014] If the repair solution is included in the existing repair rule, then the repair solution is added again according to the data difference.

[0015] In some embodiments, the method further comprises:

[0016] If the repair solution is not included in the existing repair rule, then product repair is performed according to the added repair solution.

[0017] Product quality data after product repair is obtained.

[0018] In some embodiments, verifying the repair solution according to the product quality data after adding the repair solution to obtain a verification result comprises:

[0019] According to the product quality data, a change value of product yield caused by the repair solution is determined.

[0020] If the change value of product yield is reduced to below a predetermined threshold, a verification failure result is obtained.

[0021] In some embodiments, verifying the repair solution according to the product quality data after adding the repair solution to obtain a verification result further comprises:

[0022] If the change value of product yield is not reduced to below the predetermined threshold, whether a repair success rate of the repair solution meets a predetermined requirement is determined according to the product quality data.

[0023] If the repair success rate does not meet the predetermined requirement, a verification failure result is obtained.

[0024] If the repair success rate meets the predetermined requirement, a verification success result is obtained.

[0025] In some embodiments, determining whether to update the repair rule according to the added repair solution according to the verification result comprises:

[0026] If the verification result is a verification success, the repair rule is updated according to the repair solution.

[0027] If the verification result is a verification failure, a repair solution is added again according to a data difference between the failure location data and predetermined failure location data corresponding to the repair rule.

[0028] In some embodiments, adding a repair solution according to a data difference between the failure location data and predetermined failure location data corresponding to the existing repair rule comprises:

[0029] According to a data difference between the failure position data and the predetermined failure position data, a plurality of repair schemes are added.

[0030] In some embodiments, the product quality data after adding the repair scheme is used to verify the repair scheme, and a verification result is obtained.

[0031] The product quality data after repairing according to each added repair scheme is obtained in sequence.

[0032] Each repair scheme is verified according to the product quality data in sequence, and the verification result is obtained.

[0033] In a second aspect, the embodiments of the present application further provide an integrated circuit repairing device, which comprises:

[0034] A detection module is configured to detect a failed unit of an integrated circuit product based on a predetermined period during production of the integrated circuit product.

[0035] A processing module is configured to count failure position data of the failed unit in the production process according to a detection result of the failed unit.

[0036] A first adding module is configured to add a repair scheme according to a data difference between the failure position data and predetermined failure position data corresponding to an existing repair rule.

[0037] A verification module is configured to verify the repair scheme according to product quality data after adding the repair scheme, and obtain a verification result.

[0038] A first determining module is configured to determine whether to update the repair rule according to the added repair scheme according to the verification result.

[0039] In some embodiments, the device further comprises:

[0040] A second determining module is configured to determine whether the added repair scheme is included in the existing repair rule.

[0041] A second adding module is configured to add a repair scheme according to the data difference again if the added repair scheme is included in the existing repair rule.

[0042] In some embodiments, the device further comprises:

[0043] A repairing module is configured to perform product repairing according to the added repair scheme if the added repair scheme is not included in the existing repair rule.

[0044] An obtaining module is configured to obtain product quality data after product repairing.

[0045] In some embodiments, the verification module comprises:

[0046] a first determining sub-module, configured to determine a change value of product yield caused by the repair scheme according to the product quality data;

[0047] a first verification sub-module, configured to obtain a verification failure result if the change value of product yield is reduced to below a predetermined threshold.

[0048] In some embodiments, the verification module further comprises:

[0049] a second determining sub-module, configured to determine whether a repair success rate of the repair scheme meets a predetermined requirement according to the product quality data if the change value of product yield is not reduced to below the predetermined threshold;

[0050] a second verification sub-module, configured to obtain a verification failure result if the repair success rate does not meet the predetermined requirement;

[0051] a third verification sub-module, configured to obtain a verification success result if the repair success rate meets the predetermined requirement.

[0052] In some embodiments, the first determining module comprises:

[0053] an updating sub-module, configured to update the repair rule according to the repair scheme if the verification result is a verification success;

[0054] a first adding sub-module, configured to add a repair scheme according to a data difference between the failure location data and predetermined failure location data corresponding to the repair rule if the verification result is a verification failure.

[0055] In some embodiments, the first adding module comprises:

[0056] a second adding sub-module, configured to add a plurality of repair schemes according to the data difference between the failure location data and the predetermined failure location data.

[0057] In some embodiments, the verification module comprises:

[0058] a third determining sub-module, configured to obtain product quality data after repair according to each added repair scheme in sequence;

[0059] a fourth verification sub-module, configured to verify each repair scheme in sequence according to the product quality data to obtain the verification result.

[0060] In a third aspect, the embodiments of the present application further provide an electronic device, comprising at least a processor and a memory for storing executable instructions capable of running on the processor, wherein:

[0061] The processor is configured to run the executable instructions, and the executable instructions perform the steps in any of the integrated circuit repair methods.

[0062] In a fourth aspect, the embodiments of the present application further provide a non-transitory computer-readable storage medium, wherein the computer-readable storage medium stores computer executable instructions, and the computer executable instructions are executed by a processor to implement the steps in any of the integrated circuit repair methods.

[0063] Through the technical solutions of the embodiments of the present application, not only can the real-time monitoring and repair of failed units be performed in the production process, but also the repair rules can be dynamically optimized, the repair scheme can be verified, and the production capacity and the repair efficiency can be improved. Moreover, the process is fully automated, and sampling and manual detection and verification of the product are not required, thereby effectively reducing the labor cost and the verification cost. BRIEF DESCRIPTION OF DRAWINGS

[0064] Figure 1 Flowchart of an integrated circuit repair method provided by the embodiments of the present application Figure 1

[0065] Figure 2 Flowchart of an integrated circuit repair method provided by the embodiments of the present application Figure 2

[0066] Figure 3 Flowchart of an integrated circuit repair method provided by the embodiments of the present application Figure 3

[0067] Figure 4 Structure diagram of a data block used in an integrated circuit repair method provided by the embodiments of the present application

[0068] Figure 5 Flowchart of an integrated circuit repair method provided by the embodiments of the present application Figure 4

[0069] Figure 6A Position diagram of a front-stage failed unit of an integrated circuit product in the embodiments of the present application

[0070] Figure 6B Position diagram of a rear-stage failed unit of an integrated circuit product in the embodiments of the present application

[0071] Figure 7 Diagram of a repair scheme provided by the embodiments of the present application​​​​

[0072] Figure 8 This is a schematic diagram showing the location where the repair scheme is used in the embodiments of this application;

[0073] Figure 9 This application provides a data graph illustrating the yield loss caused by verifying the repair scheme in an integrated circuit repair method according to an embodiment of the present application.

[0074] Figure 10 A structural block diagram of an integrated circuit repair device provided in an embodiment of this application;

[0075] Figure 11 This is a block diagram of the physical structure of an electronic device provided in an embodiment of this application. Detailed Implementation

[0076] To facilitate understanding of this application, a more complete description will be provided below with reference to the accompanying drawings, which illustrate preferred embodiments of the application. However, this application may be implemented in many different forms and is not limited to the embodiments described herein. Rather, these embodiments are provided so that the disclosure of this application will be thorough and complete.

[0077] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this application belongs. The terminology used herein in the specification of this application is for the purpose of describing particular embodiments only and is not intended to be limiting of the application. The term "and / or" as used herein includes any and all combinations of one or more of the associated listed items.

[0078] This application provides an integrated circuit repair method, such as... Figure 1 As shown, the method includes:

[0079] Step S101: During the production process of integrated circuit products, detect the faulty units of the integrated circuit products based on a predetermined cycle;

[0080] Step S102: Based on the detection results of the failed units, statistically analyze the failure location data of the failed units that occurred during the production process;

[0081] Step S103: Based on the data difference between the failure location data and the predetermined failure location data corresponding to the existing repair rules, add a repair scheme;

[0082] Step S104: Verify the repair scheme based on the product quality data after adding the repair scheme, and obtain the verification results;

[0083] Step S105, determining whether to update the repair rule according to the added repair scheme according to the verification result.

[0084] In mass production of integrated circuit products, failed units can be generated after each process. Therefore, product testing can also be performed multiple times during the production process to monitor the generation of failed units in real time. Of course, final testing can also be performed on the products after each process to determine the location of the failed units through optical observation, image comparison, probe detection, or signal testing after power-on.

[0085] In the embodiments of the present application, the failed units of the integrated circuit products can be detected based on a predetermined period. The predetermined period can be a time period for the production process of the same batch of products, for example, the production time of a batch of products is T, and a detection is performed every t time during the process, and t is less than T. The detection period can also be for different stages in the production process of the same batch of products, for example, a detection is performed after a predetermined first process, a second process, and a third process. The detection period can also be for different batches of products, for example, a detection is performed every three batches of products. In actual applications, the product type and actual requirements can be set, which is not limited here.

[0086] In the existing database, the detected failure location data or experimental data, i.e., the predetermined failure location data, can be saved, and the predetermined repair rule developed according to the predetermined failure location data is included.

[0087] In the above step S102, the coordinates of the location of the failed unit and other information, i.e., the above failure location data, can be obtained after detection. These failure location data are obtained in real time during the production process, and thus can include failed units that have not been recorded and are not covered by the above predetermined repair rule.

[0088] Therefore, in the embodiments of the present application, the repair scheme can be added according to the data difference between the newly detected failure location data and the predetermined failure location data corresponding to the predetermined repair rule, and the added repair scheme can be added to the repair rule, that is, the existing repair rule is updated to cover the new failure location.

[0089] However, the added repair scheme can have poor repair effect or can cause other damage, and thus the added repair scheme needs to be verified, that is, the verification result is obtained through the above step S104, and then it is determined whether to update the added repair scheme to the repair rule.

[0090] It should be noted that the above repair rules can be stored in the hard disk of the repair device, or stored in a predetermined database and provided to the repair device, and used for real-time repair during product production. The added repair scheme can be temporarily stored only, and after verification, it can be updated to the repair rule; and the repair scheme that does not pass the verification can be deleted. In another embodiment, the repair scheme that does not pass the verification can also be marked as a failed repair scheme for subsequent addition of a new repair scheme, so as to prevent repeated addition of the failed repair scheme.

[0091] Through the above method, not only real-time monitoring and repair of the failed unit during production can be performed, but also the repair rules can be dynamically optimized, the repair scheme can be verified, which is beneficial to improve the production capacity and improve the repair efficiency. And the whole process is automatically performed, without sampling detection of the product, effectively reducing the labor cost and verification cost.

[0092] In some embodiments, as shown in Figure 2 the method further comprises:

[0093] Step S201, determining whether the added repair scheme is included in the existing repair rules;

[0094] Step S202, if the repair scheme is included in the existing repair rules, then re-add a repair scheme according to the data difference.

[0095] Since a repair scheme can include a repair position, a repair method, a device or a tool to be used for repair, a material to be used for repair, and a parameter required for repair, etc., for the data difference between the detected failure position data and the predetermined time-consuming position data in the existing repair rules, a plurality of different repair schemes can be obtained.

[0096] In the embodiments of the present application, the repair rules can include a plurality of repair schemes, and the repair schemes can include a repairable repair scheme, a repair scheme to be verified, and a repair scheme that fails verification, etc. That is, the repair scheme to be added can still exist in the existing repair rules.

[0097] Therefore, before adding the repair scheme, it can be confirmed whether the repair scheme is already included in the existing repair rules. If it is already included, the repair scheme does not need to be added again, and therefore another repair scheme can be added according to the data difference.

[0098] In some embodiments, as shown in Figure 3 the method further comprises:

[0099] If the repair plan is not included in the existing repair rule, the product is repaired according to the added repair plan in step S301.

[0100] In step S302, the product quality data after product repair is obtained.

[0101] After the repair plan is added, the repair plan can not be updated to the repair rule, but a series of verifications are performed. Since the detection and verification of the repair plan in the embodiments of the present application are performed online and automatically, the new repair plan can be directly used for product repair in the production process after the new repair plan is obtained.

[0102] Exemplarily, after the new repair plan is obtained, the parameters corresponding to the repair plan can be transmitted to the repair equipment and the automation equipment of the production line as a whole, so that the repair can be performed in real time.

[0103] Since the repair effect is verified after the repair, including the verification of the repair equipment itself and the detection and verification of the related equipment after the repair, a series of product quality data after product repair can be obtained. In this way, the verification of the repair plan can be realized according to the above product quality data, and it is further determined whether the plan can be updated to the repair rule.

[0104] Of course, since the repair plan is still in the stage of not being verified, in order to prevent the repair from bringing adverse effects, the new repair plan can be used only for repairing the products in a specified batch or a specified period. In this way, on the one hand, the required data for verification can be quickly obtained, and on the other hand, the adverse effects caused by the repair can be reduced.

[0105] In some embodiments, the verification of the repair plan according to the product quality data after the repair plan is added includes:

[0106] According to the product quality data, the change value of the product yield caused by the repair plan is determined.

[0107] If the change value of the product yield is reduced to below a predetermined threshold, a verification failure result is obtained.

[0108] The product quality data obtained by using the newly added repair plan for product repair can be used for verification of the repair plan. The verification can be realized by monitoring the product yield after repair.

[0109] In the embodiments of the present application, the product quality data can include evaluation data of whether the product is a good product, and then the product yield can be obtained. In addition, the product yield of the product which is not repaired by using the repair scheme can also be obtained. By comparing the yield data of the two, the change value of the product yield caused by the repair scheme can be obtained.

[0110] If the product yield after repair is improved, it means that the repair scheme brings a beneficial result, i.e., the failed unit can be successfully reduced and the yield is improved. If the product yield after repair is significantly reduced, it means that the repair scheme can not only not reduce the failed unit, but also can cause further damage. Of course, if there is no significant difference in the product yield, further verification can be needed.

[0111] Therefore, if it is determined by verification that the change value of the product yield caused by the repair scheme is to reduce the product yield below a predetermined threshold, it means that the repair scheme cannot be used, and thus a verification failure result is obtained. The repair scheme can be marked as a repair scheme with verification failure and stored for reference. Of course, in order to save storage space, the repair scheme can also be deleted.

[0112] Since the method of counting the product yield is easy to perform and does not need additional observation or power-on verification, it can be used for preliminary screening. For the repair scheme which does not bring significant reduction of the yield, other methods can be used for further verification.

[0113] In some embodiments, the method of verifying the repair scheme according to the product quality data after adding the repair scheme to obtain a verification result further includes:

[0114] If the change value of the product yield is not reduced below the predetermined threshold, it is determined whether the repair success rate of the repair scheme meets a predetermined requirement according to the product quality data;

[0115] If the repair success rate does not meet the predetermined requirement, a verification failure result is obtained;

[0116] If the repair success rate meets the predetermined requirement, a verification success result is obtained.

[0117] In the above embodiments, only the predetermined threshold is used as a standard for judging whether the repair scheme is verified to fail, but when the change value of the product yield is not reduced below the predetermined threshold, it cannot be considered that the repair scheme is effective. Therefore, further verification is needed at this time.

[0118] In the embodiments of the present application, the success rate of the repair scheme can be further determined according to the product quality data. Since the success of the repair can be verified after the repair of the product in the production process, for example, by optical observation, image comparison, probe detection or signal test after power-on, it is determined whether the repair scheme can be successfully repaired.

[0119] Since there are cases of repair success and repair failure in the process of automatic repair, when the repair success rate meets the predetermined requirement, it can be determined that the repair scheme verification is successful, and it can be updated to the repair rule for large-scale use of subsequent products. For the repair scheme whose repair success rate does not meet the predetermined requirement, large-scale use may not have a high improvement on product quality, but it may cause resource waste, so the verification result of this repair scheme can be determined as verification failure. For the repair scheme with verification failure, it can also be stored in a predetermined storage space for backup or reference, and of course it can also be deleted according to actual requirements.

[0120] In some embodiments, the determining whether to update the repair rule according to the added repair scheme according to the verification result comprises:

[0121] If the verification result is verification success, the repair rule is updated according to the repair scheme;

[0122] If the verification result is verification failure, the repair scheme is added again according to the data difference between the failure position data and the predetermined failure position data corresponding to the repair rule.

[0123] Since multiple different repair schemes can be generated for the same set of failure position data. When a new repair scheme is verified successfully, it means that there is already a repair scheme corresponding to this set of failure position data in the repair scheme that can be used for automatic repair in large-scale production. At this time, the repair scheme can be updated to the repair rule for subsequent use.

[0124] When the repair scheme verification fails, other repair schemes added according to this set of failure position data need to be verified.

[0125] In some embodiments, the adding of the repair scheme according to the data difference between the failure position data and the predetermined failure position data corresponding to the existing repair rule comprises:

[0126] According to the data difference between the failure position data and the predetermined failure position data, multiple repair schemes are added.

[0127] According to the data difference corresponding to the obtained group of failure position data, a plurality of repair schemes can be generated. In the embodiments of the present application, the plurality of repair schemes can be added synchronously, and the repair schemes are verified one by one.

[0128] In another embodiment, the repair schemes can also be added and verified one by one, and a new repair scheme is added after verification fails.

[0129] In some embodiments, the verification of the repair scheme according to the product quality data after the repair scheme is added, to obtain a verification result, comprises:

[0130] The product quality data after repair is obtained according to each added repair scheme in turn;

[0131] Each repair scheme is verified according to the product quality data in turn, to obtain the verification result.

[0132] After a plurality of repair schemes are added synchronously based on the detection data, the repair schemes can be cached, and then the repair schemes are verified one by one. Then the repair schemes are used to obtain the product quality data after repair, and the data is analyzed and processed to verify each repair scheme.

[0133] Since this way can verify a plurality of repair schemes added to the same group of data, the best repair scheme can be selected according to the verification result obtained by each repair scheme.

[0134] The embodiments of the present application also provide the following examples,

[0135] In the embodiments of the present application, the structure of the database 400 as shown in Figure 4 The database 400 can be used to store repair rules 401, predetermined failure position data 402. In addition, the database can also be used to store failure position data 403 of new failure units generated in the later stage.

[0136] The predetermined failure position data 402 is obtained according to historical data and failure position data obtained in the previous stage, for example, the position data of wafer failure units obtained by the detection method of CP (Circuit Probe / Chip Probe).

[0137] The repair rules 401 are historical data of existing PR rules, which can be used for direct repair in mass production process.

[0138] The failure position data 403 can be obtained by detection during production process, or can be obtained by testing and repairing the packaged product after packaging.

[0139] AsFigure 5 As shown, the repairing method provided by the embodiments of the present application can include the following steps:

[0140] Step S11, selecting a device category, periodically performing product detection to obtain failure location data, and determining whether a new failure unit appears; if yes, evaluating a PR scheme generated based on the failure location data once, and if no, checking products of other categories;

[0141] Step S12, evaluating all new PR schemes in sequence, comparing with existing PR rules, if the existing PR rules include the new nth PR scheme, executing verification of the next PR scheme n+1, if the PR scheme n is not in the existing PR rules, verifying the rationality of the PR scheme n;

[0142] Step S13, taking existing CP failure unit locations as data support, calculating the yield reduction due to the PR scheme n, and determining whether the reduced yield is greater than an expected value m% (the expected value m can be given by a CP test expert), if > m%, it is indicated that the PR scheme n can achieve the ability of predicted repairing, but affects the yield of the CP section, and therefore cannot be used, and another method (such as enhanced testing) needs to be found, and the process returns to step S12 to evaluate the next PR scheme, if ≤ m%, the rationality of the PR scheme n is continuously executed;

[0143] Step S14, taking the newly appeared failure unit locations in the later section as data support, calculating whether the PR scheme n can repair the newly appeared failure unit, if no, the process returns to step S12 to evaluate the next PR scheme, if yes, it is indicated that the PR scheme n neither affects the yield of the CP section nor can repair the newly appeared failure unit in the later section, and therefore improves the yield of the later section, proving that the PR scheme n is reasonable, and the PR scheme n is added to the existing PR rules;

[0144] Step S15, determining whether it is the last PR scheme of the current product, if no, the process returns to step S12 to evaluate the next PR scheme, if yes, the PR scheme evaluation of the product is ended.

[0145] Exemplarily, the distribution locations of the failure units in the front section are as shown in FIG. 1 (failure points), and the distribution locations of the failure units in the later section are as shown in FIG. 2 (failure points and failure lines). A plurality of PR schemes can be generated for the newly appeared failure units in the later section, one of which includes repairing the failure data generated for the following conditions (such as the case shown in FIG. 3): Figure 6A Figure 6B Figure 7

[0146] 1. Each 8 WLs (Word Line) is a group (such as: 0-7, 8-15);

[0147] ​​​2. At least two WLs have failed units (use redundant WLs to repair the failed units; redundant WLs include two WLs and can repair two WLs at the same time).

[0148] 3. The failure element is determined by the predetermined test item A;

[0149] 4. The number of failed units in each WL is ≥ n;

[0150] 5. The spacing of the WL where the failed element appears is greater than 1 element.

[0151] The above PR scheme can be used to determine whether the repaired unit can cover the failed unit in the subsequent stage, such as... Figure 8 As shown, after repairing the failure point 81 in the previous stage, the PR solution can cover part of the failure line 82 generated in the later stage.

[0152] Then, the data can be verified through the product, as shown in Table 1 below:

[0153]

[0154]

[0155] Table 1

[0156] The yield loss obtained from Table 1 above is as follows: Figure 9 As shown, the loss yield corresponding to the latter few cases meets the requirements, so the corresponding PR solution is successfully verified and can be updated to the predetermined repair rules.

[0157] Using the above methods, on the one hand, a large number of products are used for data verification, resulting in more reasonable repair solutions; on the other hand, compared with manual verification, this method has a higher accuracy rate, reduces the possibility of errors, and is faster, as it can be performed in real time during the production process without waiting for verification.

[0158] like Figure 10 As shown in the illustration, this application also provides an integrated circuit repair device 1000, comprising:

[0159] The detection module 1001 is used to detect the failure units of the integrated circuit product during the integrated circuit product manufacturing process, based on a predetermined cycle.

[0160] The processing module 1002 is used to statistically analyze the failure location data of the failure units that occurred during the production process based on the detection results of the failure units.

[0161] The first adding module 1003 is used to add a repair scheme based on the data difference between the failure location data and the predetermined failure location data corresponding to the existing repair rules;

[0162] The verification module 1004 is configured to verify the repair scheme according to product quality data added after the repair scheme, to obtain a verification result.

[0163] The first determination module 1005 is configured to determine whether to update the repair rule according to the added repair scheme according to the verification result.

[0164] In some embodiments, the device further comprises:

[0165] The second determination module is configured to determine whether the added repair scheme is included in the existing repair rule.

[0166] The second adding module is configured to add a repair scheme according to the data difference again if the added repair scheme is included in the existing repair rule.

[0167] In some embodiments, the device further comprises:

[0168] The repair module is configured to perform product repair according to the added repair scheme if the added repair scheme is not included in the existing repair rule.

[0169] The acquisition module is configured to acquire product quality data after product repair.

[0170] In some embodiments, the verification module comprises:

[0171] The first determination submodule is configured to determine a change value of product yield caused by the repair scheme according to the product quality data.

[0172] The first verification submodule is configured to obtain a verification failure result if the change value of product yield is reduced to below a predetermined threshold.

[0173] In some embodiments, the verification module further comprises:

[0174] The second determination submodule is configured to determine whether a repair success rate of the repair scheme meets a predetermined requirement according to the product quality data if the change value of product yield is not reduced to below the predetermined threshold.

[0175] The second verification submodule is configured to obtain a verification failure result if the repair success rate does not meet the predetermined requirement.

[0176] The third verification submodule is configured to obtain a verification success result if the repair success rate meets the predetermined requirement.

[0177] In some embodiments, the first determination module comprises:

[0178] The updating sub-module is configured to update the repair rule according to the repair scheme if the verification result is a verification success.

[0179] The first adding sub-module is configured to add a repair scheme according to a data difference between the failure position data and predetermined failure position data corresponding to the repair rule if the verification result is a verification failure.

[0180] In some embodiments, the first adding module comprises:

[0181] The second adding sub-module is configured to add a plurality of repair schemes according to a data difference between the failure position data and the predetermined failure position data.

[0182] In some embodiments, the verification module comprises:

[0183] The third determining sub-module is configured to obtain repaired product quality data according to each added repair scheme in sequence.

[0184] The fourth verification sub-module is configured to verify each repair scheme in sequence according to the product quality data to obtain the verification result.

[0185] As to the device in the above-mentioned embodiments, the specific manners in which the modules perform operations have been described in detail in the embodiments of the method, and thus will not be described in detail here.

[0186] The above-mentioned device embodiments are similar to the above-mentioned method embodiments in description, and have similar beneficial effects to the method embodiments. For technical details not disclosed in the device embodiments of the present application, please refer to the description of the method embodiments of the present application for understanding.

[0187] It should be noted that, in the embodiments of the present application, if the method of changing the resource is realized in the form of a software function module and is sold or used as an independent product, it can also be stored in a computer-readable storage medium. Based on this understanding, the technical solutions of the embodiments of the present application can be embodied in the form of a software product, which is stored in a storage medium and includes a plurality of instructions for causing a resource changing device to execute all or part of the method described in the embodiments of the present application. The aforementioned storage medium includes: a U disk, a mobile hard disk, a read-only memory (ROM), a magnetic disk or an optical disk, and various media that can store program codes. Thus, the embodiments of the present application are not limited to any specific combination of hardware and software.

[0188] Correspondingly, an electronic device is provided in an embodiment of the present application, comprising a memory and a processor, the memory storing a computer program capable of running on the processor, and the processor implements the steps in the method provided in the above embodiment when executing the program.

[0189] Correspondingly, a computer readable storage medium is provided in an embodiment of the present application, storing a computer program, which, when executed by a processor, implements the steps in the method provided in the above embodiment.

[0190] It should be noted that the description of the above storage medium and device embodiments is similar to that of the above method embodiments, and has similar beneficial effects to the method embodiments. For technical details not disclosed in the storage medium and device embodiments of the present application, please refer to the description of the method embodiments of the present application.

[0191] It should be noted that, Figure 11 A hardware entity of an electronic device in an embodiment of the present application is shown in FIG. 11, which comprises a processor 1101, a communication interface 1102 and a memory 1103. Figure 11 The hardware entity of the electronic device 1100 comprises a processor 1101, a communication interface 1102 and a memory 1103.

[0192] The processor 1101 generally controls the overall operation of the electronic device 1100.

[0193] The communication interface 1102 can enable the resource changing device to communicate with other terminals or servers through a network.

[0194] The memory 1103 is configured to store instructions and applications executable by the processor 1101, and can also cache data to be processed by the processor 1101 and modules in the resource changing device 1100 (for example, image data, audio data, voice communication data and video communication data) that have been processed, which can be realized by FLASH or RAM.

[0195] It should be understood that the "one embodiment" or "an embodiment" mentioned throughout the specification means that the specific features, structures or characteristics related to the embodiment are included in at least one embodiment of the present application. Therefore, "in one embodiment" or "in an embodiment" appearing throughout the specification does not necessarily refer to the same embodiment. In addition, these specific features, structures or characteristics can be combined in one or more embodiments in any suitable manner. It should be understood that in various embodiments of the present application, the size of the sequence number of each process does not mean the execution order, and the execution order of each process should be determined according to its function and inherent logic, and should not constitute any limitation on the implementation process of the embodiments of the present application. The above sequence number of the embodiments of the present application is only for description, not representing the advantages and disadvantages of the embodiments.

[0196] It should be noted that, in the present document, the terms "comprises", "comprising", or any other variations thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but can also include other elements not expressly listed or inherent to such process, method, article, or apparatus. An element proceeded by "comprises a", "comprising", or "includes a", does not, without more constraints, preclude the existence of additional identical elements in the process, method, article, or apparatus that comprises the element.

[0197] In several embodiments provided in the present application, it should be understood that the disclosed devices and methods can be implemented in other ways. The above-described device embodiments are merely illustrative, for example, the division of the units is only a logical function division, and actual implementation can have another division manner, such as: multiple units or components can be combined, or can be integrated into another system, or some features can be ignored or not executed. In addition, the coupling or direct coupling or communication connection between the displayed or discussed components can be through some interfaces, indirect coupling or communication connection between devices or units, which can be electrical, mechanical or other forms.

[0198] The units described above as separate components may or may not be physically separate, and the components shown as units may or may not be physical units; they can be located in one place or distributed on multiple network units; some or all of the units can be selected according to actual needs to achieve the purpose of the embodiment.

[0199] In addition, each functional unit in each embodiment of the present application can be integrated into one processing unit, or each unit can be a separate unit, or two or more units can be integrated into one unit; the integrated unit can be realized in the form of hardware or in the form of hardware plus software functional unit.

[0200] The above is only an implementation of the present application, but the protection scope of the present application is not limited thereto, any person skilled in the art can easily think of changes or replacements within the technical scope disclosed in the present application, which should be covered in the protection scope of the present application. Therefore, the protection scope of the present application should be subject to the protection scope of the claims.

Claims

1. A method for repairing integrated circuits, characterized in that, include: During the manufacturing process of integrated circuit products, faulty units of the integrated circuit products are detected based on a predetermined cycle. Based on the detection results of the failed units, statistical data on the failure locations of the failed units that occurred during the production process are compiled; Based on the data difference between the failure location data and the predetermined failure location data corresponding to the existing repair rules, a repair scheme is added; Based on the product quality data after adding the repair solution, the repair solution is verified, and the verification results are obtained. Based on the verification results, determine whether to update the patching rules according to the added patching scheme.

2. The method according to claim 1, characterized in that, The method further includes: Determine whether the existing patching rules include the added patching scheme; If the existing patching rules include the patching scheme, then a new patching scheme is added based on the data differences.

3. The method according to claim 2, characterized in that, The method further includes: If the existing repair rules do not include the repair solution, then the product is repaired according to the added repair solution; Obtain product quality data after product repair.

4. The method according to any one of claims 1 to 3, characterized in that, The step of verifying the repair plan based on the product quality data after adding the repair plan, and obtaining the verification result, includes: Based on the product quality data, determine the change in product yield caused by the repair plan; If the change in product yield is such that the product yield drops below a predetermined threshold, then a verification failure result is obtained.

5. The method according to claim 4, characterized in that, The step of verifying the repair scheme based on the product quality data after adding the repair scheme and obtaining the verification result further includes: If the change in product yield does not decrease below the predetermined threshold, then based on the product quality data, it is determined whether the repair success rate of the repair plan meets the predetermined requirements. If the repair success rate does not meet the predetermined requirements, a verification failure result is obtained. If the repair success rate meets the predetermined requirements, a successful verification result is obtained.

6. The method according to claim 5, characterized in that, The step of determining whether to update the patching rule based on the added patching scheme according to the verification result includes: If the verification result is successful, then the patching rule is updated according to the patching scheme; If the verification result is a verification failure, then a repair scheme is added again based on the data difference between the failure location data and the predetermined failure location data corresponding to the repair rule.

7. The method according to claim 1, characterized in that, The step of adding a repair scheme based on the data difference between the failure location data and the predetermined failure location data corresponding to the existing repair rules includes: Based on the data differences between the failure location data and the predetermined failure location data, multiple repair schemes are added.

8. The method according to claim 7, characterized in that, The step of verifying the repair plan based on the product quality data after adding the repair plan, and obtaining the verification result, includes: The repaired product quality data is obtained sequentially based on each added repair scheme; Based on the product quality data, each of the repair solutions is verified sequentially to obtain the verification results.

9. An integrated circuit repair device, characterized in that, include: The detection module is used to detect the faulty units of the integrated circuit product during the production process of the integrated circuit product based on a predetermined cycle; The processing module is used to statistically analyze the failure location data of the failure units that occurred during the production process based on the detection results of the failure units. The first adding module is used to add a repair scheme based on the data difference between the failure location data and the predetermined failure location data corresponding to the existing repair rules; The verification module is used to verify the repair scheme based on the product quality data after adding the repair scheme, and obtain the verification result; The first determining module is used to determine, based on the verification result, whether to update the patching rule according to the added patching scheme.

10. The apparatus according to claim 9, characterized in that, The device further includes: The second determining module is used to determine whether the existing repair rules contain the added repair scheme; The second adding module, if the existing patching rules include the patching scheme, is used to add a patching scheme again based on the data differences.

11. The apparatus according to claim 10, characterized in that, The device further includes: The repair module is used to repair the product based on the added repair scheme if the existing repair rules do not include the repair scheme. The acquisition module is used to acquire product quality data after product repair.

12. The apparatus according to any one of claims 9 to 11, characterized in that, The verification module includes: The first determining submodule is used to determine the change in product yield caused by the repair plan based on the product quality data. The first verification submodule is used to obtain a verification result of verification failure if the change value of the product yield is that the product yield has decreased to below a predetermined threshold.

13. The apparatus according to claim 12, characterized in that, The verification module further includes: The second determining submodule is used to determine whether the repair success rate of the repair scheme meets the predetermined requirements based on the product quality data if the change value of the product yield does not decrease below the predetermined threshold. The second verification submodule is used to obtain the verification result of verification failure if the repair success rate does not meet the predetermined requirements. The third verification submodule is used to obtain a verification result of successful repair if the repair success rate meets the predetermined requirements.

14. The apparatus according to claim 13, characterized in that, The first determining module includes: The update submodule, if the verification result is successful, is used to update the patching rules according to the patching scheme; The first addition submodule, if the verification result is a verification failure, is used to add a repair scheme based on the data difference between the failure location data and the predetermined failure location data corresponding to the repair rule.

15. The apparatus according to claim 9, characterized in that, The first adding module includes: The second addition submodule is used to add multiple repair schemes based on the data differences between the failure location data and the predetermined failure location data.

16. The apparatus according to claim 15, characterized in that, The verification module includes: The third determining submodule is used to obtain the repaired product quality data in sequence according to each added repair scheme; The fourth verification submodule is used to verify each of the repair schemes sequentially based on the product quality data, and obtain the verification results.

17. An electronic device, characterized in that, The electronic device includes at least: a processor and a memory for storing executable instructions capable of running on the processor, wherein: When the processor is used to run the executable instructions, the executable instructions perform the steps in the integrated circuit repair method provided by any one of claims 1 to 8.

18. A non-transitory computer-readable storage medium, characterized in that, The computer-readable storage medium stores computer-executable instructions that, when executed by a processor, implement the steps in the integrated circuit repair method provided in any one of claims 1 to 8.

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