Method for manufacturing a three-dimensionally reconstructed carrier and three-dimensionally reconstructed carrier

Abstract

The present disclosure relates to a three-dimensional reconstruction vehicle manufacturing method and a three-dimensional reconstruction vehicle. The three-dimensional reconstruction vehicle manufacturing method comprises: providing a needle tip carrier, a fixing position for supporting a sample to be tested is formed at the center of the top surface of the needle tip carrier; forming a shielding layer covering at least the fixing position on the fixing position, and the material of the shielding layer is a photosensitive curing material. The present disclosure separates the sample to be tested from the needle tip carrier through the shielding layer, reduces the degree of participation of the needle tip carrier in the process of removing the sample after detection, protects the integrity of the needle tip carrier, so that the needle tip carrier after removing the sample can still remain intact and can be directly applied to install a new sample to be tested and detect, reduces the consumption of the needle tip carrier, reduces the cost, and at the same time, the recycling of the needle tip carrier does not affect the result of the three-dimensional reconstruction.

Description

Technical Field

[0001] This disclosure relates to the field of semiconductor technology, and in particular to a method for manufacturing a three-dimensional reconstruction carrier, a three-dimensional reconstruction carrier, a method for fixing a three-dimensional reconstruction sample, and a method for removing a three-dimensional reconstruction sample. Background Technology

[0002] In 3D Atom Probe Testing, the sample must be made into a cone shape. The sample is used as the anode and connected to a positive high voltage, so that the atoms at the sample tip are in a state of ionization. A pulsed voltage or pulsed laser is superimposed on the sample tip, and the atoms on the sample surface will ionize and evaporate. The mass-to-charge ratio of the evaporated ions is measured by time-of-flight mass spectrometry to obtain the mass spectrum peak of the ion to determine its elemental species. The two-dimensional coordinates of the flying ions on the sample tip surface are recorded by a position-sensitive probe. By the layer-by-layer accumulation of ions in the longitudinal direction, the longitudinal coordinates of the ion are determined, thus providing a three-dimensional spatial distribution image of atoms of different elements.

[0003] When preparing a 3D reconstructed sample, the region containing the target address needs to be extracted and placed on a dedicated tip stage. Existing tip stages are damaged after the sample is removed, and can only be used once, resulting in low utilization. Summary of the Invention

[0004] The following is an overview of the subject matter described in detail in this disclosure. This overview is not intended to limit the scope of the claims.

[0005] To overcome the problems existing in related technologies, this disclosure provides a method for manufacturing a three-dimensional reconstruction vehicle and a three-dimensional reconstruction vehicle.

[0006] This disclosure provides a method for manufacturing a three-dimensional reconstruction carrier, the method comprising: providing a needle tip stage, wherein a fixing position for supporting a sample to be tested is formed at the center of the top surface of the needle tip stage; and forming a shielding layer at least covering the fixing position, wherein the material of the shielding layer is a photosensitive curable material.

[0007] According to some embodiments of this disclosure, forming a shielding layer at least covering the fixing position includes: forming an initial layer on the top surface of the needle tip stage; retaining the initial layer above the fixing position, removing the initial layer around the fixing position, and forming a shielding layer with the remaining initial layer covering the fixing position.

[0008] According to some embodiments of this disclosure, retaining the initial layer above the fixed position and removing the initial layer around the fixed position includes: patterning the initial layer, removing the initial layer around the fixed position, and the remaining initial layer covering the fixed position forming a masking layer.

[0009] According to some embodiments of this disclosure, patterning the initial layer and removing the initial layer around the fixed position includes: patterning the initial layer, removing the initial layer in the annular region around the fixed position, and the remaining disk-shaped initial layer covering the fixed position forming a masking layer.

[0010] A second aspect of this disclosure provides a three-dimensional reconstruction carrier, the three-dimensional reconstruction carrier including a needle tip stage, a fixing position for supporting a sample to be tested is formed at the center of the top surface of the needle tip stage, and a shielding layer for shielding the fixing position is fixed on the needle tip stage.

[0011] According to some embodiments of this disclosure, the edge of the shielding layer is flush with the edge of the fixing position.

[0012] According to some embodiments of this disclosure, the material of the masking layer includes negative photoresist.

[0013] According to some embodiments of this disclosure, the top surface of the shielding layer is a horizontal plane.

[0014] According to some embodiments of this disclosure, the shielding layer is in the shape of a disc.

[0015] According to some embodiments of this disclosure, the diameter of the shielding layer is 5-30 μm.

[0016] According to some embodiments of this disclosure, the thickness-to-diameter ratio of the shielding layer is 1:300-1:50.

[0017] A third aspect of this disclosure provides a method for fixing a three-dimensional reconstructed sample, the method comprising: providing a sample to be tested; depositing an adhesive layer on the sample, the adhesive layer being located at the bottom edge of the sample; and bonding the adhesive layer to the aforementioned masking layer.

[0018] According to some embodiments of this disclosure, the adhesive layer is made of platinum.

[0019] According to some embodiments of this disclosure, the edge of the adhesive layer is located inside the area enclosed by the edge of the shielding layer; or, the edge of the adhesive layer is flush with the edge of the shielding layer.

[0020] A fourth aspect of this disclosure provides a method for removing a three-dimensional reconstructed sample, the method comprising: focusing a focused ion beam on the position on the aforementioned shielding layer where the sample to be tested is connected, and maintaining the focused ion beam until the sample to be tested is disconnected from the shielding layer.

[0021] The technical solutions provided by the embodiments of this disclosure may include the following beneficial effects: by separating the sample to be tested from the tip stage through a shielding layer, the involvement of the tip stage in the process of removing the sample after the test is completed is reduced, the integrity of the tip stage is protected, and the tip stage can still remain intact after the sample is removed. It can be directly used to install new samples to be tested and perform tests, reducing the consumption of the tip stage, lowering costs, and recycling the tip stage without affecting the results of three-dimensional reconstruction.

[0022] It should be understood that the foregoing general description and the following detailed description are exemplary and explanatory only, and are not intended to limit this disclosure. Other aspects will become apparent upon reading and understanding the accompanying drawings and detailed description. Attached Figure Description

[0023] The accompanying drawings, which are incorporated in and form part of this specification, illustrate embodiments consistent with the invention and, together with the description, serve to explain the principles of the invention.

[0024] Figure 1 This is a flowchart illustrating a method for manufacturing a three-dimensional reconstructed vehicle according to an exemplary embodiment.

[0025] Figure 2 This is a flowchart illustrating a method for manufacturing a three-dimensional reconstructed vehicle according to an exemplary embodiment.

[0026] Figure 3 This is a schematic diagram of the structure of a needle tip stage according to an exemplary embodiment.

[0027] Figure 4 This is a schematic diagram illustrating an initial layer covering a needle tip stage according to an exemplary embodiment.

[0028] Figure 5 This is a flowchart illustrating a method for creating a three-dimensional reconstructed financial chart according to an exemplary embodiment.

[0029] Figure 6 This is a schematic diagram of a patterned initial layer according to an exemplary embodiment.

[0030] Figure 7 This is a schematic diagram illustrating the mask position according to an exemplary embodiment.

[0031] Figure 8 This is a schematic diagram illustrating a shielding layer structure according to an exemplary embodiment.

[0032] Figure 9 This is a schematic diagram illustrating the location of the shielding layer according to an exemplary embodiment.

[0033] Figure 10This is a schematic diagram illustrating the shape of a shielding layer according to an exemplary embodiment.

[0034] Figure 13 This is a flowchart illustrating a method for fixing a three-dimensional reconstructed sample according to an exemplary embodiment.

[0035] Figure 11 This is a schematic diagram illustrating a sample attached to a shielding layer according to an exemplary embodiment.

[0036] Figure 12 This is a schematic diagram of an adhesive layer structure according to another exemplary embodiment.

[0037] Figure 14 This is a flowchart illustrating a method for removing a three-dimensional reconstructed sample according to an exemplary embodiment.

[0038] Figure Labels

[0039] 1. Needle tip stage; 11. Fixing position; 2. Initial layer; 22. Masking layer; 3. Mask; 31. Light transmission hole; 4. Sample to be tested; 41. Adhesive layer. Detailed Implementation

[0040] To make the objectives, technical solutions, and advantages of the embodiments of this disclosure clearer, the technical solutions in the disclosed embodiments will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some, not all, of the embodiments of this disclosure. All other embodiments obtained by those skilled in the art based on the embodiments of this disclosure without creative effort are within the scope of protection of this disclosure. It should be noted that, unless otherwise specified, the embodiments and features in the embodiments of this disclosure can be arbitrarily combined with each other.

[0041] As mentioned in the background section, when preparing a 3D reconstructed sample, it is necessary to extract the region containing the target address and place it on a dedicated tip stage. Existing tip stages require separating the sample from the tip stage during the disassembly of the sample to be tested, which inevitably causes physical defects at the position on the tip stage used to connect the sample to be tested. If the tip stage with physical defects continues to be used, it will be difficult to fix the subsequent sample to the center position on the top surface of the tip stage. The inconvenience of the sample position will cause difficulties in the processing of detection data. Therefore, existing tip stages can only support single use and have low utilization.

[0042] Based on this, this disclosure provides a method for fabricating a three-dimensional reconstruction carrier and a three-dimensional reconstruction carrier. After the sample to be tested is fixed to the top surface of the shielding layer by welding (or bonding or deposition processes), and three-dimensional reconstruction is performed, the sample to be tested after testing needs to be removed. Typically, a focused ion beam (FIB) process is used, in which the ion beam is accelerated by an ion gun and focused on the connection between the sample to be tested and the tip stage. A high-current ion beam is used to peel off the surface atoms at the connection between the sample to be tested and the shielding layer (or selectively peel off the metal layer by physical sputtering) to complete the micron-level (or nanon-level) morphology processing, so that the sample to be tested after testing is separated from the top surface of the shielding layer. Because the shielding layer is made of photosensitive curable material, such as negative photoresist, the electrons in the shielding layer do not react with the ion beam after being focused by the ion beam. The ion beam only loses energy at the bottom of the shielding layer on the sample and transfers the lost energy to the electrons in the sample after detection, generating excited electrons or ions. This allows the sample to detach from the shielding layer without loss and maintains the flatness of its top surface. This achieves the goal of separating the sample while preventing damage to the position on the tip stage used to connect to a new sample. The tip stage with the shielding layer can be directly used for the next connection of a sample for 3D reconstruction detection, reducing tip wear on the stage, lowering costs, and recycling the tip stage without affecting the 3D reconstruction results.

[0043] This disclosure provides a method for manufacturing a three-dimensional reconstruction vehicle and a three-dimensional reconstruction vehicle in exemplary embodiments, such as... Figure 1 As shown, Figure 1 and Figure 2 All of these are flowcharts illustrating a method for manufacturing a three-dimensional reconstructed vehicle according to an exemplary embodiment; Figure 3 This is a schematic diagram of the structure of a needle tip stage according to an exemplary embodiment; Figure 4 This is a schematic diagram illustrating an initial layer covering a needle tip stage according to an exemplary embodiment; Figure 5 This is a flowchart illustrating a method for creating a three-dimensional reconstructed financial chart according to an exemplary embodiment; Figure 6 This is a schematic diagram of a patterned initial layer according to an exemplary embodiment; Figure 7 This is a schematic diagram showing the mask position according to an exemplary embodiment; Figure 8 This is a schematic diagram illustrating a shielding layer structure according to an exemplary embodiment; Figure 9 This is a schematic diagram illustrating the location of the shielding layer according to an exemplary embodiment; Figure 10 This is a schematic diagram illustrating an adhesive layer structure according to an exemplary embodiment; Figure 11 This is a schematic diagram illustrating a sample attached to a shielding layer according to an exemplary embodiment; Figure 12 This is a schematic diagram of an adhesive layer structure according to another exemplary embodiment; Figure 13 This is a flowchart illustrating a method for fixing a three-dimensional reconstructed sample according to an exemplary embodiment; Figure 14 This is a flowchart illustrating a method for removing a three-dimensional reconstructed sample according to an exemplary embodiment. The following is in conjunction with... Figures 1 to 14 To explain.

[0044] The specific embodiments described below are intended to help those skilled in the art understand this embodiment, but this embodiment is not limited to the specific embodiments described below.

[0045] Reference Figure 1 This disclosure provides an exemplary embodiment of a method for manufacturing a three-dimensional reconstruction vehicle, the method comprising:

[0046] S100, Provides a needle tip stage, with a fixed position formed at the center of the top surface of the needle tip stage for supporting the sample to be tested.

[0047] For example, refer to Figure 1 and Figure 3 The needle tip stage 1 serves as a support component, used to support other components connected to the needle tip stage 1. The top surface of the needle tip stage 1 is circular, and the fixing position 11 is a circular area located in the center of the top surface of the needle tip stage 1. The area formed by the fixing position 11 is concentrically arranged with the top surface of the needle tip stage 1.

[0048] In this embodiment, the top surface of the needle tip stage 1 is planar, which is used to connect the sample to be tested 4 and stably connect the sample to be tested 4 to the area of ​​the fixed position 11.

[0049] S200. A shielding layer is formed at the fixed position to at least cover the fixed position, and the material of the shielding layer is a photosensitive curing material.

[0050] For example, refer to Figure 8 and Figure 9 The shielding layer 22 is disposed on the top surface of the needle tip stage 1. The shielding layer 22 is disc-shaped and the bottom surface of the shielding layer 22 is concentrically disposed with the area formed by the fixing position 11. The bottom edge of the shielding layer 22 is flush with the edge of the fixing position 11, that is, the bottom surface of the shielding layer 22 just covers the area formed by the fixing position 11. The top surface of the shielding layer 22 is also generally a plane like the top surface of the needle tip stage 1. It is used to connect the sample to be tested 4 and make the sample to be tested 4 stay stably on the top surface of the shielding layer 22.

[0051] In this embodiment, refer to Figure 12After fixing the sample 4 to be tested to the top surface of the shielding layer 22 by welding (or bonding or deposition, etc.) and performing three-dimensional reconstruction, the sample 4 to be tested needs to be removed. Typically, a focused ion beam (FIB) process is used, in which the ion beam is accelerated by an ion gun and focused on the connection between the sample 4 to be tested and the tip stage 1. A high-current ion beam is used to peel off the surface atoms at the connection between the sample 4 to be tested and the shielding layer 22 (or selectively peel off the metal layer by physical sputtering) to complete the micron-level (or nano-level) morphology processing, so that the sample 4 to be tested is separated from the top surface of the shielding layer 22. Since the material of the shielding layer 22 is a photosensitive curable material, such as a negative photoresist, after the shielding layer 22 is focused by the ion beam, the electrons in the shielding layer 22 do not react with the ion beam. The ion beam only loses energy at the bottom of the shielding layer 22 on the sample and transfers the lost energy to the electrons in the sample 4 after the detection is completed, generating excited electrons or ions. This allows the sample 4 to detach from the shielding layer 22 after the detection is completed, and the shielding layer 22 does not suffer any loss and can maintain the flatness of its top surface. This achieves the purpose of separating the sample 4 while keeping the position above the tip stage 1 used to connect the new sample 4 without damage. This allows the tip stage 1 with the shielding layer 22 to be directly used in the next connection of the sample 4 for three-dimensional reconstruction detection, reducing tip loss on the stage, lowering costs, and recycling the tip stage 1 without affecting the results of three-dimensional reconstruction.

[0052] In an exemplary embodiment of this disclosure, reference is made to Figure 2 Step S200, forming a shielding layer at least covering the fixed position, specifically includes:

[0053] S210, an initial layer is formed on the top surface of the needle tip stage.

[0054] For example, refer to Figure 4 The material of the initial layer 2 is the same as that of the masking layer 22, which is also a photosensitive curing material. The initial layer 2 is formed on the top surface of the needle tip stage 1, and the edge of the initial layer 2 is flush with the edge of the needle tip stage 1.

[0055] In this embodiment, the initial layer 2 is formed on the top surface of the needle tip stage 1 by direct spraying, and the initial layer 2 covers the top surface of the needle tip stage 1.

[0056] It should be understood that the above-described method of forming the initial layer 2 on the top surface of the needle tip stage 1 by direct spraying is only one specific embodiment. In other embodiments, depending on the actual working conditions, the initial layer 2 can also be formed on the top surface of the needle tip stage 1 by a spin coating process. (Refer to...) Figure 5 The initial layer formed on the top surface of the needle tip stage by spin coating specifically includes:

[0057] S211, Dropping. Fix the needle tip stage on the glue applicator using the suction method. When the needle tip stage is stationary or rotating very slowly, drop the photosensitive curing material onto the top surface of the needle tip stage.

[0058] S212, Rotation. By controlling the coating machine to drive the needle tip stage to rotate rapidly, the photosensitive curing material is extended to the entire top edge of the needle tip stage.

[0059] S213. Homogenization. Remove excess photocurable material to obtain a uniform initial layer on the needle tip stage.

[0060] S214. Drying. Continue rotating the needle tip stage coated with photocurable material at a fixed speed until the solvent in the photocurable material evaporates and the initial layer is dry. Stop rotating the needle tip stage and remove it. At this point, the photocurable material is laid on the needle tip stage and covers the top surface of the needle tip stage to form the initial layer.

[0061] Similarly, depending on the photosensitive curing material, the initial layer 2 can also be deposited on the tip stage 1 by chemical vapor deposition (CVD) or atomic layer deposition (ALD).

[0062] S220. Retain the initial layer above the fixed position, remove the initial layer around the fixed position, and the remaining initial layer covering the fixed position forms a masking layer.

[0063] For example, refer to Figure 8 and Figure 9 Remove the initial layer 2 in the area between the edge of the fixing position 11 and the edge of the needle tip stage 1, so that the initial layer 2 covering the fixing position 11 is retained and a shielding layer 22 is formed.

[0064] In this embodiment, the initial layer 2 in the area between the edge of the fixing position 11 and the edge of the needle tip stage 1 can be removed from above the needle tip stage 1 by chemical mechanical polishing (CMP), or the initial layer 2 in the area between the edge of the fixing position 11 and the edge of the needle tip stage 1 can be removed by patterning, and finally a masking layer 22 covering the fixing position 11 is formed.

[0065] By separating the sample 4 to be tested from the tip stage 1 through the shielding layer 22, the involvement of the tip stage 1 in the process of removing the sample 4 to be tested after the test is completed is reduced, thus protecting the integrity of the tip stage 1. This allows the tip stage 1 to remain intact after the sample is removed and can be directly used to install new samples 4 to be tested, reducing the consumption of the tip stage 1, lowering the cost, and recycling the tip stage 1 without affecting the results of the three-dimensional reconstruction.

[0066] In an exemplary embodiment of this disclosure, reference is made to Figure 6 and Figure 7 Step S220, retaining the initial layer above the fixed position and removing the initial layer around the fixed position, specifically includes:

[0067] The initial layer is patterned, the initial layer around the fixed position is removed, and the remaining initial layer covering the fixed position forms a masking layer.

[0068] For example, refer to Figure 6 and Figure 7 A mask 3 is provided, the shape of which is consistent with the shape of the needle tip stage 1. A light-transmitting hole 31 is formed at the center of the mask 3 corresponding to the fixing position 11, exposing the initial layer 2 above the fixing position 11. The edge of the light-transmitting hole 31 is flush with the edge of the fixing position 11. By illuminating the mask 3, some light is blocked by the mask 3 and cannot react with the initial layer 2 below the mask 3. Some light passes through the light-transmitting hole 31 and directly irradiates the initial layer 2 above the fixing position 11. The initial layer 2 above the fixing position 11 is cured under the action of light. Then the mask 3 is removed, and the uncured initial layer 2 around the cured initial layer 2 is removed, leaving only the portion of the initial layer 2 that has been cured by light, forming a shielding layer 22 covering the fixing position 11.

[0069] In this embodiment, refer to Figure 8 and Figure 9 The cured initial layer 2 retained on the tip stage 1 is the shielding layer 22. Since the edge of the light-transmitting hole 31 is flush with the edge of the fixing position 11, the edge of the shielding layer 22 formed after illumination is also flush with the edge of the fixing position 11. The shielding layer 22, whose edge is flush with the edge of the fixing position 11, not only separates the sample 4 under test from the tip stage 1, protecting the integrity of the tip stage 1 and reducing the consumption of the tip stage 1, but also provides an identification function during the installation of the sample 4 under test, indicating the installation position of the sample 4 under test and reducing the possibility of errors in the three-dimensional reconstruction test results caused by the installation position deviation of the sample 4 under test.

[0070] It should be understood that in the above-described method of removing the initial layer 2 around the fixing position 11 by means of mask 3 and light, the fact that the edge of the light-transmitting hole 31 is flush with the edge of the fixing position 11 is only one specific implementation. In other embodiments that also remove the initial layer 2 around the fixing position 11 by means of mask 3 and light, the edge of the light-transmitting hole 31 may be located outside the edge of the fixing position 11. Even if the final cured shielding layer 22 completely covers the fixing position 11, it also covers part of the top surface of the needle tip stage 1 around the fixing position 11.

[0071] The shielding layer 22, which completely covers the fixing position 11 and also covers the top surface of the tip stage 1 around the fixing position 11, provides a larger protective area for the tip stage 1. Since the sample 4 to be tested needs to be installed above the fixing position 11, when removing the sample 4 after testing, if the sample 4 is large and its bottom edge is close to the edge of the fixing position 11, the ion beam used to remove the sample 4 can easily focus on the top surface of the tip stage 1 around the fixing position 11, which will damage the top surface of the tip stage 1 and affect the recycling of the tip stage 1. The shielding layer 22, which completely covers the fixing position 11 and also covers part of the top surface of the tip stage 1 around the fixing position 11, reduces this possibility and improves the protection effect of the tip stage 1.

[0072] In an exemplary embodiment of this disclosure, reference is made to Figure 7 and Figure 8 The patterning of the initial layer and the removal of the initial layer around the fixed positions specifically include:

[0073] The initial layer is patterned, and the initial layer of the annular area around the fixed position is removed. The remaining disk-shaped initial layer covering the fixed position forms a masking layer.

[0074] For example, refer to Figure 3 The fixed position 11 on the needle tip stage 1 is a circular area located at the center of the top surface of the needle tip stage 1. The light-transmitting hole 31 of the grinding center is a circular hole, and the position of the light-transmitting hole 31 corresponds to the fixed position 11. The edge of the light-transmitting hole 31 is flush with the edge of the fixed position 11. The part of the initial layer 2 that is not covered by the mask 3 is cured after being exposed to light. After the part of the initial layer 2 around this cured initial layer 2 is removed, it is exposed in a disc shape on the top surface of the needle tip stage 1.

[0075] Since the masking layer 22 is formed by setting a mask 3 with a light-transmitting hole 31 and applying light, the light-transmitting hole 31 corresponding to the disc-shaped masking layer 22 is circular. The circular light-transmitting hole 31 has a regular shape, which is easy to process and facilitates the uniform and comprehensive passage of light, so that the negative photoresist can be cured to form the masking layer 22.

[0076] A second aspect of this disclosure provides a three-dimensional reconstruction vehicle, referring to... Figure 3 and Figure 8 The three-dimensional reconstruction carrier includes a needle tip stage 1, with a fixing position 11 formed at the center of the top surface of the needle tip stage 1 for supporting the sample 4 to be tested, and a shielding layer 22 is fixed on the needle tip stage 1 to shield the fixing position 11.

[0077] For example, refer to Figure 8 and Figure 9 The fixing position 11 is a circular area located at the center of the top surface of the needle tip stage 1. The shielding layer 22 covers the top surface of the needle tip stage 1 and covers the fixing position 11.

[0078] In this embodiment, the shielding layer 22 separates the sample to be tested 4 from the tip stage 1, reducing the involvement of the tip stage 1 in the process of removing the sample after the test, protecting the integrity of the tip stage 1, so that the tip stage 1 can remain intact after the sample is removed, and can be directly used to install new samples to be tested 4 and perform tests, reducing the consumption of the tip stage 1, lowering the cost, and recycling the tip stage 1 without affecting the results of three-dimensional reconstruction.

[0079] In an exemplary embodiment of this disclosure, reference is made to Figure 8 and Figure 9 The edge of the shielding layer 22 is flush with the edge of the fixing position 11.

[0080] For example, refer to Figure 8 and Figure 9 The bottom surface of the shielding layer 22 is circular and is concentrically arranged with the circular area enclosed by the fixing position 11. The area of ​​the bottom surface of the shielding layer 22 is the same as the area enclosed by the fixing position 11.

[0081] In this embodiment, the shielding layer 22, whose edge is flush with the edge of the fixed position 11, can not only separate the sample to be tested 4 from the tip stage 1, protect the integrity of the tip stage 1, and reduce the consumption of the tip stage 1, but also provide an identification function during the installation stage of the sample to be tested 4, indicating the installation position of the sample to be tested 4, and reducing the possibility of errors in the three-dimensional reconstruction test results caused by the offset of the installation position of the sample to be tested 4.

[0082] In an exemplary embodiment of this disclosure, reference is made to Figure 8 and Figure 9 The material of the masking layer 22 includes negative photoresist.

[0083] For example, refer to Figure 6 and Figure 7After the negative photoresist is cured by light, a mask 3 is placed above the tip stage 1 to form the masking layer 22. The mask 3 has a light-transmitting hole 31 at the position corresponding to the fixing position 11. The masking layer 22 formed by the cured negative photoresist can provide stable support for the sample 4 under test. Since the sample 4 under test is usually removed by focused ion beam (FIB) process, the ion beam is accelerated by the ion gun and focused on the connection between the sample 4 under test and the tip stage 1. The surface atoms of the connection between the sample 4 under test and the masking layer 22 are stripped by a high current ion beam (or the metal layer is selectively stripped by physical sputtering) to complete the micron-level (or nanon-level) morphology processing, so that the sample 4 under test after testing is separated from the top surface of the masking layer 22. When the negative photoresist masking layer 22 is focused by the ion beam, the electrons in the masking layer 22 do not react with the ion beam. The ion beam loses energy only when it connects to the bottom of the masking layer 22 on the sample and transfers the lost energy to the electrons in the sample 4 after the detection is completed, generating excited electrons or ions. This causes the sample 4 to detach from the masking layer 22 after the detection is completed. The masking layer 22 does not suffer any loss and can maintain the flatness of its top surface. This achieves the purpose of separating the sample 4 while keeping the position above the tip stage 1 for connecting new samples 4 undamaged. This allows the tip stage 1 with the masking layer 22 to be directly used for the next connection of the sample 4 for three-dimensional reconstruction detection, reducing tip loss on the stage, lowering costs, and recycling the tip stage 1 without affecting the results of three-dimensional reconstruction.

[0084] In an exemplary embodiment of this disclosure, reference is made to Figure 9 and Figure 10 The top surface of the shielding layer 22 is a horizontal plane.

[0085] For example, refer to Figure 8 and Figure 9 The shielding layer 22 is used to support and connect the sample to be tested 4. The top surface of the shielding layer 22 is a horizontal plane, which can provide a stable support effect for the sample to be tested 4 on it and reduce the difficulty of connecting the sample to be tested 4 to the top surface of the shielding layer 22.

[0086] In an exemplary embodiment of this disclosure, reference is made to Figure 9 and Figure 10 The shielding layer 22 is disc-shaped.

[0087] For example, refer to Figure 8 and Figure 9Since the area enclosed by the fixing position 11 is circular, and the masking layer 22 shields the fixing position 11, the masking layer 22 is set in a disk shape. At the same time, since the masking layer 22 is formed by setting a mask 3 with a light-transmitting hole 31 and applying light, the light-transmitting hole 31 corresponding to the disk-shaped masking layer 22 is circular. The circular light-transmitting hole 31 has a regular shape, which is easy to process and facilitates the uniform and comprehensive passage of light, so that the negative photoresist can be cured to form the masking layer 22.

[0088] In an exemplary embodiment of this disclosure, reference is made to Figure 8 and Figure 9 The diameter of the shielding layer 22 is 5-30 μm.

[0089] For example, refer to Figure 8 and Figure 9 The diameter of the needle tip stage 1 is 100 μm, and the diameter of the disc-shaped shielding layer 22 is 20 μm. In other embodiments, depending on the sample 4 to be tested or other operating conditions, the diameter of the shielding layer 22 can also be 5 μm or 30 μm.

[0090] In an exemplary embodiment of this disclosure, reference is made to Figure 8 and Figure 9 The thickness to diameter ratio of the shielding layer 22 is 1:300-1:50.

[0091] For example, refer to Figure 8 and Figure 9 The thickness of the shielding layer 22 is 100 nm, and the diameter of the shielding layer 22 is 20 μm, that is, the thickness-to-diameter ratio of the shielding layer 22 is 1:200. In other embodiments, depending on the different test samples 4 or other operating conditions, the thickness of the shielding layer 22 is 50 nm, the diameter of the shielding layer 22 is 15 μm, and the thickness-to-diameter ratio of the shielding layer 22 is 1:300; or the thickness of the shielding layer 22 is 150 nm, the diameter of the shielding layer 22 is 7.5 μm, and the thickness-to-diameter ratio of the shielding layer 22 is 1:50.

[0092] A third aspect of this disclosure provides a method for fixing a three-dimensional reconstruction sample, referring to... Figure 11 Methods for fixing three-dimensional reconstructed samples include:

[0093] S300, provide the sample to be tested.

[0094] S400. Deposit an adhesive layer on the sample, with the adhesive layer located at the bottom edge of the sample.

[0095] S500, The adhesive layer is bonded to the aforementioned masking layer.

[0096] For example, in this embodiment, an adhesive layer 41 is deposited on the sample to be tested 4 using an ALD (Atomic layer deposition) process, and the initial sample is bonded and fixed to the shielding layer 22 by bringing the sample to be tested 4 close to the shielding layer 22.

[0097] It should be understood that the above-described deposition of the adhesive layer 41 on the sample 4 to be tested is only one specific embodiment. In other embodiments, the adhesive layer 41 may be deposited on the shielding layer 22, and the sample 4 to be tested may be bonded and fixed to the shielding layer 22 by bringing the sample 4 to be tested close to the adhesive layer 41; alternatively, the adhesive layer 41 may be deposited on both the sample 4 to be tested and the shielding layer 22, and the sample 4 to be tested and the shielding layer 22 may be bonded and fixed by bringing the sample 4 to be tested and the shielding layer 22 close to each other. The adhesive layer 41 may be a platinum material layer, or it may be a silver material layer, a platinum material layer, a copper material layer, a gold material layer, an aluminum material layer, a tungsten material layer, or an iron material layer.

[0098] In other embodiments, the adhesive layer 41 can also be deposited using other methods, such as CVD (Chemical Vapor Deposition) processes. For example, high-density plasma chemical vapor deposition or plasma-enhanced chemical vapor deposition can be used. Similarly, the adhesive layer 41 can be formed by a single deposition or by multiple depositions.

[0099] In an exemplary embodiment of this disclosure, the adhesive layer 41 is made of platinum.

[0100] For example, the platinum-based adhesive layer 41 enhances the strength of the sample 4 under test and strengthens the connection between the sample 4 and the shielding layer 22, reducing the possibility of initial sample 4 breakage or breakage at the connection between the sample 4 and the shielding layer 22 during the 3D reconstruction test. Platinum has good thermal and electrical conductivity, enabling it to rapidly and uniformly transfer the current from the initial sample end to all parts of the sample 4 under test and the connection between the sample 4 and the shielding layer 22 during the 3D reconstruction test. This also makes the heating state of all parts of the sample 4 under test and the connection between the sample 4 and the shielding layer 22 more uniform, reducing the possibility of sample 4 breakage due to different heating levels at different parts of the sample 4 and the connection between the sample 4 and the shielding layer 22, and improving the stability of the 3D reconstruction test.

[0101] In an exemplary embodiment of this disclosure, reference is made to Figure 12 The edge of the adhesive layer 41 is located inside the area enclosed by the edge of the shielding layer 22.

[0102] For example, refer to Figure 12The bottom surface area of ​​the adhesive layer 41 is smaller than the top surface area of ​​the shielding layer 22, and the edge of the adhesive layer 41 is flush with the edge of the sample 4 to be tested. The adhesive layer 41 covers the bottom surface of the sample 4 to be tested and adheres the sample 4 to the shielding layer 22.

[0103] In this embodiment, the adhesive layer 41, which precisely covers the bottom surface of the sample 4 under test, provides a sufficient and stable connection for the sample 4 under test, while minimizing the impact of the adhesive layer 41 on the test results of the 3D reconstruction, thus reducing the error of the 3D reconstruction test. In addition, covering only the bottom surface of the sample 4 under test reduces the difficulty of removing the sample 4 under test after the 3D reconstruction test is completed, speeds up the removal of the sample 4 under test, and shortens the time required for the 3D reconstruction test.

[0104] It should be understood that the aforementioned arrangement of the edge of the adhesive layer 41 being located within the area enclosed by the edge of the shielding layer 22 is only one specific implementation. In other embodiments, the edge of the adhesive layer 41 is flush with the edge of the shielding layer 22, meaning the bottom surface area of ​​the adhesive layer 41 is the same as the top surface area of ​​the shielding layer 22. The function of the adhesive layer 41 is to connect the sample to be tested 4 to the shielding layer 22. The adhesive layer 41 is formed through a deposition process. A larger area adhesive layer 41 can provide more selectable fixing positions 11 for the sample to be tested 4, reducing the difficulty of fixing the sample to be tested 4 to the shielding layer 22. In addition, for samples with a large bottom area, the adhesive layer 41 with its edge flush with the edge of the shielding layer 22 can provide sufficient fixation for the sample to be tested 4, reducing the possibility of the sample to be tested 4 falling off the shielding layer 22 during the three-dimensional reconstruction process.

[0105] A fourth aspect of this disclosure provides a method for removing a three-dimensional reconstructed sample, referring to... Figure 14 The methods for removing 3D reconstructed samples include:

[0106] S600. Focus the focused ion beam on the aforementioned shielding layer at the position where the sample to be tested is connected, and keep the focused ion beam focused until the sample to be tested is disconnected from the shielding layer.

[0107] For example, since the disassembly of the test sample 4 is usually carried out using focused ion beam (FIB) technology, the ion beam is accelerated by the ion gun and focused on the connection between the test sample 4 and the shielding layer 22. The surface atoms at the connection between the test sample 4 and the shielding layer 22 are stripped by a high current ion beam (or the metal layer is selectively stripped by physical sputtering) to complete the micron-level (or nano-level) morphology processing, so that the test sample 4 after the test is completed is separated from the top surface of the shielding layer 22. When the negative photoresist masking layer 22 is focused by the ion beam, the electrons in the masking layer 22 do not react with the ion beam. The ion beam loses energy only when it connects to the bottom of the masking layer 22 on the sample and transfers the lost energy to the electrons in the sample 4 after the detection is completed, generating excited electrons or ions. This causes the sample 4 to detach from the masking layer 22 after the detection is completed. The masking layer 22 does not suffer any loss and can maintain the flatness of its top surface. This achieves the purpose of separating the sample 4 while keeping the position above the tip stage 1 for connecting new samples 4 undamaged. This allows the tip stage 1 with the masking layer 22 to be directly used for the next connection of the sample 4 for three-dimensional reconstruction detection, reducing tip loss on the stage, lowering costs, and recycling the tip stage 1 without affecting the results of three-dimensional reconstruction.

[0108] Other embodiments of this disclosure will readily occur to those skilled in the art upon consideration of the specification and practice of the invention disclosed herein. This disclosure is intended to cover any variations, uses, or adaptations of this disclosure that follow the general principles of this disclosure and include common knowledge or customary techniques in the art not disclosed herein. The specification and examples are to be considered exemplary only, and the true scope and spirit of this disclosure are indicated by the claims.

[0109] It should be understood that this disclosure is not limited to the precise structures described above and shown in the accompanying drawings, and various modifications and changes can be made without departing from its scope. The scope of this disclosure is limited only by the appended claims.

Claims

1. A method for removing a three-dimensional reconstructed sample, characterized in that, The method for removing the three-dimensional reconstructed sample includes: The focused ion beam is focused on the position on the shielding layer of the three-dimensional reconstruction vehicle where the sample to be tested is connected, and the focused ion beam is kept focused until the sample to be tested is disconnected from the shielding layer. Wherein, the electrons in the shielding layer do not react with the ion beam, and the ion beam loses energy only when it is connected to the bottom end of the shielding layer on the sample to be tested, and transfers the lost energy to the electrons in the sample to be tested after the test is completed, generating excited electrons or ions, so that the sample to be tested after the test is completed detaches from the shielding layer. The three-dimensional reconstruction carrier includes a needle tip stage, a fixed position for supporting the sample to be tested is formed at the center of the top surface of the needle tip stage, and a shielding layer is fixed on the needle tip stage to shield the fixed position. The material of the shielding layer includes negative photoresist.

2. The method for removing a three-dimensional reconstructed sample according to claim 1, characterized in that, The edge of the shielding layer is flush with the edge of the fixing position.

3. The method for removing a three-dimensional reconstructed sample according to claim 1, characterized in that, The top surface of the shielding layer is a horizontal plane.

4. The method for removing a three-dimensional reconstructed sample according to claim 1, characterized in that, The shielding layer is disc-shaped.

5. The method for removing a three-dimensional reconstructed sample according to claim 1, characterized in that, The diameter of the shielding layer is 5-30 μm.

6. The method for removing a three-dimensional reconstructed sample according to claim 5, characterized in that, The thickness to diameter ratio of the shielding layer is 1:300-1:50.

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