Alignment mechanism and bonder using the same

Abstract

The present application is an alignment mechanism, which mainly comprises a carrier, a plurality of supporting pins, a first alignment pin and a plurality of second alignment pins. The supporting pins are arranged around the carrier to support a first substrate and to lift the first substrate relative to the carrier. The first and second alignment pins are arranged around the carrier and can be lifted relative to the carrier and away from or close to the carrier. The first alignment pin is lifted and displaced towards the supporting pins to contact the first substrate on the supporting pins, so that the first substrate is aligned with an alignment area on the carrier. The second alignment pins are evenly distributed around the carrier and are used to support and align a second substrate carried by the carrier, so that the second substrate is aligned with the first substrate and the bonding alignment is completed.

Description

Technical Field

[0001] This invention relates to an alignment mechanism, and more particularly to an alignment mechanism used in a bonding machine, which mainly has a plurality of pins arranged around the stage to quickly and accurately align a plurality of substrates for bonding the aligned substrates. Background Technology

[0002] Integrated circuit technology has matured, and electronic products are currently trending towards thinner, smaller, higher-performance, more reliable, and smarter designs. Chips within electronic products significantly impact their performance, with some of these performance characteristics related to chip thickness. For example, thinner chips can improve heat dissipation efficiency, enhance mechanical properties, improve electrical performance, and reduce package size and weight.

[0003] In semiconductor manufacturing, substrate thinning, via etching, and back metallization are typically performed on the back side (bottom surface) of the chip. However, during substrate thinning, if the substrate thickness is too thin (e.g., less than or equal to 150 micrometers), it may cause wafer breakage or bending deformation, rendering the chip unusable and reducing chip yield.

[0004] Therefore, a bonding process is performed before the substrate thinning process, which mainly uses an adhesive layer to bond the wafer to the carrier (e.g., sapphire glass). After the substrate thinning process is completed, a debonding process is performed to separate the wafer from the carrier.

[0005] In the bonding process, a bonding machine is used to align the wafer and carrier before bonding the stacked wafer and carrier. However, most existing bonding machines are only suitable for wafers of specific sizes, and during the bonding process, improper pressing force, non-horizontal pressing plate, or other factors may lead to bonding bubbles in the adhesive layer between the substrate and carrier, resulting in poor total thickness variation (TTV) of the bonded wafer. Summary of the Invention

[0006] To address the problems faced by prior art, the present invention provides a novel bonding machine that allows for the replacement of different sized carrier pins according to the size of the substrate. This enables the bonding machine to be used to align substrates of various sizes and to perform substrate bonding after the alignment step is completed.

[0007] One object of the present invention is to provide an alignment mechanism, which mainly includes a platform, a plurality of support pins and a first alignment pin, wherein the plurality of support pins and the first alignment pin are arranged around the platform and extend to the support surface of the platform.

[0008] The carrier pins are movable relative to the carrier surface of the stage and are used to carry a first substrate. A first alignment pin faces a plurality of carrier pins, wherein the first alignment pin and the plurality of alignment pins are located on opposite sides of the centerline of the stage. The first alignment pin is movable relative to the carrier surface of the stage, moving closer to or further away from the alignment area on the carrier surface. When the first alignment pin moves toward the plurality of carrier pins, it contacts and pushes against the first substrate carried by the carrier pins, aligning the first substrate with the alignment area of ​​the carrier surface.

[0009] A plurality of second alignment pins are evenly distributed around the stage and can move up and down relative to the stage's bearing surface, approaching or moving away from the alignment area on the bearing surface. After the second alignment pins have moved a certain distance toward the alignment area, a second substrate can be placed on the second alignment pins. The second alignment pins then continue to move toward the alignment area and contact and abut against the bearing second substrate, so that the second substrate is aligned with the first substrate and the alignment area.

[0010] After the alignment of the first and second substrates is completed, the second alignment pin descends relative to the bearing surface of the stage and gradually moves away from the alignment area of ​​the bearing surface to place the second substrate on the first substrate. The alignment mechanism described in this invention allows for rapid and accurate alignment of the first and second substrates, and enables bonding of the aligned first and second substrates.

[0011] One objective of this invention is to provide an alignment mechanism that allows for the replacement of carrier pins of different lengths according to the dimensions of the first and second substrates, and the adjustment of the lifting and moving range of the first and second alignment pins. Therefore, the alignment mechanism described in this invention can be widely used on first and second substrates of various sizes to achieve the alignment of the first and second substrates.

[0012] One object of the present invention is to provide an alignment mechanism in which a first alignment pin and a second alignment pin are respectively connected to a drive unit. The drive unit includes a guide rail, a base, and a drive rod, wherein the base is disposed on the guide rail, and the drive rod is located below the base and in contact with the base. When the drive rod extends, it pushes the base and causes the base to move along the guide rail.

[0013] In addition, a limiting unit can be provided above the base to limit the maximum height of the base, and to limit the maximum height of the first and second alignment pins connected to the base, as well as the maximum distance they can move toward the alignment area of ​​the bearing surface, so that the first and second alignment pins can be used to align substrates of various sizes.

[0014] One object of the present invention is to provide a bonding machine, comprising a first cavity, a second cavity, a pressing unit, and an alignment mechanism, wherein the pressing unit is disposed on the first cavity, and the alignment mechanism is disposed on the second cavity. The first cavity faces the second cavity. When the first cavity is connected to the second cavity, a sealed space can be formed between the first cavity and the second cavity, and the gas in the sealed space can be extracted, so that the sealed space is in a low-pressure or vacuum state.

[0015] The bonding unit faces the alignment mechanism and can move toward the stage of the alignment mechanism to bond the first substrate and the second substrate stacked on the stage, thereby completing the bonding of the first substrate and the second substrate.

[0016] To achieve the above objectives, the present invention provides an alignment mechanism, comprising: a stage including a bearing surface and defining an alignment area on the bearing surface; a plurality of lifting units disposed around the stage; a plurality of bearing pins respectively connected to the plurality of lifting units, and driving the plurality of bearing pins to rise and fall relative to the bearing surface of the stage through the plurality of lifting units, wherein the plurality of bearing pins are used to support a first substrate; a first driving unit disposed around the stage; and a first alignment pin connected to the first driving unit, driving the first alignment pin to rise and fall relative to the bearing surface of the stage through the first driving unit. The platform is raised and lowered, and a first alignment pin is driven to move closer to or away from the alignment area of ​​the support surface, wherein the first alignment pin is used to push against a first substrate placed on the support pin, so that the first substrate is aligned with the alignment area; a plurality of second driving units are disposed around the platform; and a plurality of second alignment pins are connected to the second driving units, wherein the second alignment pins are used to support a second substrate, and the second driving units are used to drive the second alignment pins to rise and fall relative to the support surface of the platform, and drive the second alignment pins to move closer to or away from the alignment area of ​​the support surface, so as to push against the second substrate, so that the second substrate is aligned with the first substrate.

[0017] This invention provides a bonding machine, comprising: a first cavity; a second cavity facing the first cavity, wherein when the first cavity is connected to the second cavity, a sealed space is formed between the first cavity and the second cavity; a pressing unit connected to the first cavity; and an alignment mechanism disposed in the second cavity and facing the pressing unit, comprising: a stage including a bearing surface and defining an alignment area on the bearing surface; a plurality of lifting units disposed around the stage; a plurality of bearing pins respectively connected to the plurality of lifting units, and driving the plurality of bearing pins to rise and fall relative to the bearing surface of the stage through the plurality of lifting units, wherein the plurality of bearing pins are used to support a first substrate; and a first driving unit disposed on the stage. The stage is surrounded by: a first alignment pin connected to a first driving unit, wherein the first driving unit drives the first alignment pin to move up and down relative to the bearing surface of the stage, and drives the first alignment pin to move closer to or away from the alignment area of ​​the bearing surface, so as to push against the first substrate carried by the bearing pin, thereby aligning the first substrate with the alignment area; a plurality of second driving units are disposed around the stage; and a plurality of second alignment pins are connected to the second driving units, wherein the second alignment pins are used to carry a second substrate, and the driving units drive the second alignment pins to move up and down relative to the bearing surface of the stage, and drive the second alignment pins to move closer to or away from the alignment area of ​​the bearing surface, so as to push against the second substrate, thereby aligning the second substrate with the first substrate.

[0018] The alignment mechanism and bonding machine stage, wherein the stage includes a plurality of grooves facing the center of the bearing surface or alignment area, and the bearing pin, the first alignment pin and the second alignment pin are respectively located in the plurality of grooves.

[0019] The alignment mechanism and bonding machine described herein include a support portion and a first alignment portion for carrying pins. The support portion is used to carry the first substrate, while the first alignment portion protrudes from the support portion and is used to contact and align the first substrate.

[0020] The alignment mechanism and bonding machine described herein include a protrusion at the end of the second alignment pin that is not connected to the second driving unit, for supporting the second substrate.

[0021] The alignment mechanism and bonding machine, wherein the first drive unit and the second drive unit include: a guide rail inclined relative to the bearing surface of the stage; a base connected to the guide rail, wherein the base is connected to the first alignment pin or the second alignment pin; and a drive rod connected to the base and the first alignment pin or the second alignment pin, the drive rod being used to drive the base to move along the guide rail, so that the first alignment pin or the second alignment pin moves up and down relative to the bearing surface of the stage, and moves closer to or away from the alignment area.

[0022] The bonding machine includes: a first driving device connected to a first cavity and used to drive the first cavity to move closer to or away from a second cavity; and a second driving device connected to a pressing unit and used to drive the pressing unit to move closer to or away from the stage, such that the pressing unit presses the first substrate and the second substrate stacked on the stage.

[0023] The bonding machine and bonding machine include a picking device for clamping a first substrate and a second substrate and placing the first substrate and the second substrate on an alignment mechanism, wherein the picking device includes a plurality of first alignment units, and the alignment mechanism includes a plurality of second alignment units located around the stage, and aligns the picking device and the stage through the first alignment units and the second alignment units.

[0024] The beneficial effects of the present invention are: to provide an alignment mechanism, particularly an alignment mechanism applied to a bonding machine, which mainly provides a plurality of pins around the stage, enabling rapid and accurate alignment of a plurality of substrates for bonding the aligned substrates. Attached Figure Description

[0025] Figure 1 This is a three-dimensional schematic diagram of an embodiment of the alignment mechanism of the present invention.

[0026] Figure 2 This is a three-dimensional schematic diagram of an embodiment of the lifting unit and bearing pins of the alignment mechanism of the present invention.

[0027] Figure 3 This is a perspective schematic diagram of an embodiment of the second drive unit and the second alignment pin of the alignment mechanism of the present invention.

[0028] Figure 4 This is a perspective schematic diagram of an embodiment of the first drive unit and the first alignment pin of the alignment mechanism of the present invention.

[0029] Figure 5 A cross-sectional schematic diagram of an embodiment of the alignment mechanism of the present invention, in which the carrier pins carry the first substrate.

[0030] Figure 6 This is a cross-sectional schematic diagram of an embodiment of the alignment mechanism of the present invention, in which the second alignment pin carries the second substrate.

[0031] Figure 7 This is a perspective view of an embodiment of the bonding machine of the present invention.

[0032] Figure 8 This is a perspective view of an embodiment of the picking device of the alignment mechanism of the present invention.

[0033] Explanation of reference numerals in the attached drawings: 10-Alignment mechanism; 11-Stage; 111-Bearing surface; 113-Alignment area; 115-Groove; 121-First substrate; 123-Second substrate; 13-Lifting unit; 131-Guide rail; 133-Base; 135-Drive rod; 14-Bearing pin; 141-Bearing part; 142-Notch; 143-First alignment part; 15-First drive unit; 16-First alignment pin; 17-Second drive unit; 171-Guide rail; 173-Base; 175 - Drive rod body; 1751 Roller; 177 Fixing frame; 1771 Bottom; 1773 Top; 1775 Inclined part; 179 Limiting unit; 18 Second alignment pin; 181 Protrusion; 183 First notch; 185 Second notch; 19 Second alignment unit; 20 Bonding machine; 21 First cavity; 23 Second cavity; 25 Pressing unit; 271 First drive device; 273 Second drive device; 30 Picking device; 31 First alignment unit. Detailed Implementation

[0034] Please see Figure 1 This is a perspective view of an embodiment of the alignment mechanism of the present invention. As shown in the figure, the alignment mechanism 10 includes a platform 11, a plurality of lifting units 13, a plurality of bearing pins 14, a first drive unit 15, a first alignment pin 16, a plurality of second drive units 17, and a plurality of second alignment pins 18. The lifting units 13, the first drive units 15, and the second drive units 17 are disposed around the platform 11 and are respectively connected to the bearing pins 14, the first alignment pins 16, and the second alignment pins 18.

[0035] The stage 11 includes a bearing surface 111 for bearing a substrate. Furthermore, an alignment region 113 can be defined on the bearing surface 111, wherein the alignment region 113 can be the central region of the bearing surface 111. For example, the bearing surface 111 can be circular, and the alignment region 113 is a smaller circle located within the bearing surface 111, with the centers of the bearing surface 111 and the alignment region 113 overlapping. During the alignment step, a first substrate 121 and a second substrate 123 can be aligned with or overlapped with the alignment region 113, such that the second substrate 123 aligns with and overlaps the first substrate 121.

[0036] Each lifting unit 13 is connected to a respective bearing pin 14 and is used to drive each bearing pin 14 to move up and down relative to the bearing surface 111 of the platform 11. Specifically, the bearing pin 14 may be elongated, with one end of the bearing pin 14 connected to the lifting unit 13.

[0037] In one embodiment of the present invention, such as Figure 2 and Figure 5As shown, the carrier pin 14 includes a carrier portion 141 and a first alignment portion 143. The carrier portion 141 is located at the end of the carrier pin 14 that is not connected to the lifting unit 13, and the first alignment portion 143 protrudes from the carrier portion 141. The carrier pin 14 carries the first substrate 121 through the carrier portion 141 and aligns the carried first substrate 121 through the first alignment portion 143. The detailed alignment method will be described in subsequent embodiments.

[0038] Specifically, a notch 142 is provided at the end of the support pin 14 that is not connected to the lifting unit 13, forming a support portion 141 at one end of the support pin 14. The support pin 14 without the notch 142 serves as the first alignment portion 143, wherein the height of the first alignment portion 143 is greater than that of the support portion 141. Furthermore, a chamfer or rounded corner may be provided at the end of the first alignment portion 143 facing the support portion 141, so that the first substrate 121 that is not accurately placed on the support portion 141 may slide from the first alignment portion 143 to the support portion 141. In another embodiment of the present invention, a protrusion may also be provided on the upper surface of the support pin 14, and this protrusion may serve as the first alignment portion 143.

[0039] In one embodiment of the present invention, such as Figure 2 As shown, the lifting unit 13 includes a guide rail 131, a base 133, and a drive rod 135, wherein the guide rail 131 is perpendicular to the bearing surface 111 of the platform 11. The base 133 is connected to the guide rail 131, and the drive rod 135 is located below the base 133 and contacts the base 133.

[0040] When the drive rod 135 extends or retracts, it will drive or push the base 133 to move along the guide rail 131, so that the bearing pin 14 connected to the base 133 rises or falls relative to the bearing surface 111 of the platform 11. For example, the drive rod 135 can be a pneumatic cylinder, and the pneumatic cylinder is driven to rise or fall by a motor.

[0041] The first drive unit 15 is connected to the first alignment pin 16 and is used to drive the first alignment pin 16 to move up and down relative to the bearing surface 111 of the stage 11, and to drive the first alignment pin 16 to move closer to or away from the alignment area 113 of the bearing surface 111, wherein the first alignment pin 16 is elongated.

[0042] In one embodiment of the present invention, the bearing surface 111 of the platform 11 may be circular, wherein a plurality of lifting units 13 and a first driving unit 15 are respectively located on both sides of the diameter or center line of the bearing surface 111, and a plurality of bearing pins 14 and a first alignment pin 16 are respectively located on both sides of the diameter center line of the bearing surface 111.

[0043] In practical applications, the lifting unit 13 can drive the carrier pin 14 to rise and place the first substrate 121 on the carrier portion 141 of the carrier pin 14. Then, the first driving unit 15 drives the first alignment pin 16 to rise relative to the carrier surface 111 of the stage 11 and approach the alignment area 113 of the carrier surface 111. The first alignment pin 16 contacts and pushes against the first substrate 121 placed on the carrier portion 141 of the carrier pin 14, and pushes the first substrate 121 towards the first alignment portions 143 of the plurality of carrier pins 14. The first alignment portions 143 of the carrier pin 14 and the first alignment pin 16 will contact the outer edge of the first substrate 121, so that the first substrate 121 is aligned with the alignment area 113 of the carrier surface 111.

[0044] After the alignment of the first substrate 121 is completed, the first driving unit 15 drives the first alignment pin 16 to descend relative to the bearing surface 111 of the stage 11 and move away from the alignment area 113 of the bearing surface 111. Then the lifting unit 13 drives the bearing pin 14 to descend relative to the bearing surface 111 of the stage 11 and places the first substrate 121 on the bearing surface 111 and / or the alignment area 113 of the stage 11.

[0045] In one embodiment of the present invention, a plurality of lifting units 13 can synchronously drive each carrier pin 14 to descend, placing the first substrate 121 flat on the carrier surface 111 and / or alignment area 113 of the stage 11. In another embodiment, one lifting unit 13 can first drive the connected carrier pin 14 to descend, so that the first substrate 121 is placed obliquely on the carrier surface 111 of the stage 11. After the first substrate 121 contacts the carrier surface 111 of the stage 11, the other lifting units 13 will then drive the connected carrier pin 14 to descend, so as to place the first substrate 121 on the carrier surface 111 and / or alignment area 113 of the stage 11.

[0046] The second drive unit 17 is connected to the second alignment pin 18 and is used to drive the second alignment pin 18 to move up and down relative to the bearing surface 111 of the stage 11, and to move closer to or further away from the alignment area 113 of the bearing surface 111. In one embodiment of the present invention, the bearing surface 111 of the stage 11 may be circular, and a plurality of second drive units 17 are evenly distributed around the bearing surface 111 of the stage 11. For example, the distance and / or angle between adjacent second drive units 17 and / or second alignment pins 18 are the same, and they are used to support and align the second substrate 123.

[0047] like Figure 3 and Figure 6As shown, one end of the second alignment pin 18, which is not connected to the second drive unit 17, has a protrusion 181, which protrudes from one end of the second alignment pin 18 and is used to support a second substrate 123. Specifically, the protrusion 181 may be disposed in the middle region of one end of the second alignment pin 18, and a first notch 183 is formed above the protrusion 181, while a second notch 185 is formed below the protrusion 181.

[0048] The second substrate 123 is located within the first notch 183 and is supported by the protrusion 181. The first substrate 121 is located within the second notch 185, wherein the second substrate 123 and the first substrate 121 are located on the upper and lower sides of the protrusion 181, respectively. For example, the first substrate 121 is a wafer, and the second substrate 123 is a carrier plate.

[0049] In practical applications, the second driving unit 17 is used to drive the second alignment pin 18 to rise relative to the bearing surface 111 of the stage 11 and approach the alignment area 113 of the bearing surface 111, so that the first substrate 121 is located below the protrusion 181 of the second alignment pin 18.

[0050] The second substrate 123 is placed on the protrusion 181 of the second alignment pin 18, and the protrusion 181 supports the second substrate 123. The second driving unit 17 continues to drive the second alignment pins 18 to move toward the alignment area 113, so that one end of each second alignment pin 18 contacts and aligns with the second substrate 123, for example, the first alignment pin 18 in the first notch 183 above the protrusion 181 contacts and pushes against the second substrate 123, so that the second substrate 123 is aligned with the alignment area 113 of the bearing surface 111 and / or the first substrate 121.

[0051] In one embodiment of the present invention, a chamfer or rounded corner may be provided on the second alignment pin 18 above the protrusion 181, so that the second substrate 123 that is not accurately placed on the protrusion 181 slides down to the protrusion 181. In addition, the bottom of the protrusion 181 may be a slope, for example, the angle between the slope of the bottom of the protrusion 181 and the bearing surface 111 of the stage 11 is less than 90 degrees, so as to avoid the second alignment pin 18 from touching the first substrate 121 that has been aligned when it approaches or moves away from the alignment area 113 of the bearing surface 111.

[0052] When the second substrate 123 is aligned with the alignment area 113 of the bearing surface 111 and / or the first substrate 121, the second driving unit 17 drives the second alignment pin 18 to descend relative to the bearing surface 111 of the stage 11 and move away from the alignment area 113 of the bearing surface 111, so as to place the second substrate 123 on the first substrate 121.

[0053] In another embodiment of the invention, one of the second driving units 17 can first drive the connected second alignment pin 18 to descend and move away from the alignment area 113, so that the second substrate 123 is tilted and placed on the first substrate 121. Then, other second driving units 17 will drive the connected second alignment pin 18 to descend and move away from the alignment area 113, placing the second substrate 123 on the first substrate 121, so as to avoid the second substrate 123 being placed in the adhesive layer between the first substrates 121 and generating residual gas.

[0054] In one embodiment of the present invention, such as Figure 3 and Figure 4 As shown, the first drive unit 15 and the second drive unit 17 may have the same structure. Taking the second drive unit 17 as an example, the second drive unit 17 includes a guide rail 171, a base 173, and a drive rod 175. The guide rail 171 is inclined relative to the bearing surface 111 of the platform 11, for example, the angle between the extension line of the guide rail 171 and the extension line of the bearing surface 111 of the platform 11 is less than 90 degrees. The base 173 is connected to the guide rail 171, and the drive rod 175 contacts the base 173, the first alignment pin 16, or the second alignment pin 18, for example, located below the base 173.

[0055] When the drive rod 175 extends or retracts, it will drive or push the base 173 to move along the guide rail 171. Since the guide rail 171 is inclined relative to the bearing surface 111 of the platform 11, the second alignment pin 18 connected to the base 173 will rise and fall relative to the bearing surface 111 of the platform 11, and move closer to or away from the alignment area 113 of the bearing surface 111. For example, the drive rod 175 can be a pneumatic cylinder, and the pneumatic cylinder is driven to rise and fall by a motor.

[0056] In one embodiment of the present invention, the second drive unit 17 may include a fixing frame 177, wherein the fixing frame 177 includes a bottom 1771, a top 1773 and an inclined portion 1775, the bottom 1771 and the top 1773 facing each other, and the inclined portion 1775 connecting the top 1773 and the bottom 1771. The inclined portion 1775 has an inclined surface that is inclined relative to the bearing surface 111 of the platform, and the guide rail 171 is disposed on the inclined surface of the inclined portion 1775.

[0057] Furthermore, a limiting unit 179 can be provided on the top 1773, wherein the limiting unit 179 is used to limit the displacement range of the base 173 and the second alignment pin 18. For example, the limiting unit 179 can be a screw, passing through a screw hole on the top 1773, and used to limit the highest position of the displacement of the base 173 and the second alignment pin 18. Specifically, when the base 173 contacts the limiting unit 179, the drive rod 175 can no longer drive the base 173 to move upward along the guide rail 171, so as to limit the displacement range of the base 173. When the length of the limiting unit 179 protruding from the lower surface of the top 1773 is large, the highest position of the displacement of the base 173 and the second alignment pin 18 will be lower.

[0058] In one embodiment of the present invention, a roller 1751 may be provided at one end of the drive rod 175 that contacts the base 173, while a guide rail or groove may be provided on the surface of the base 173 that contacts or faces the drive rod 175, wherein the roller 1751 is located within the guide rail or groove. The provision of the roller 1751 facilitates the relative displacement of the drive rod 175 and the base 173, allowing the base 173 and the second alignment pin 18 to move closer to or further away from the alignment area 113 of the bearing surface 11.

[0059] In one embodiment of the present invention, a plurality of grooves 115 may be provided on the bearing surface 111 of the stage 11, and the bearing pins 14, the first alignment pins 16, and the second alignment pins 18 are disposed in each groove 115, and can move up and down relative to the bearing surface 111 along the grooves 115, and can be displaced along the alignment area 113 of the grooves 115 relative to the bearing surface 111. In addition, the bearing surface 111 of the stage 11 is circular, and the grooves 115, the bearing pins 14, the first alignment pins 16, and the second alignment pins 18 are oriented towards the center of the bearing surface 111 or the center of the circle.

[0060] Please see Figure 7 This is a three-dimensional perspective view of an embodiment of the bonding machine of the present invention. Please refer to the accompanying diagram. Figure 1 The bonding machine 20 includes a first cavity 21, a second cavity 23, a pressing unit 25 and an alignment mechanism 10, wherein the pressing unit 25 is connected to the first cavity 21, and the alignment mechanism 10 is disposed on the second cavity 23, and the pressing unit 25 faces the alignment mechanism 10.

[0061] The first cavity 21 faces the second cavity 23. When the first cavity 21 is connected to the second cavity 23, a sealed space is formed between the first cavity 21 and the second cavity 23. A vacuum device can then extract the gas from the sealed space, resulting in a low-pressure state in the sealed space between the first cavity 21 and the second cavity 23. Furthermore, when the first cavity 21 is connected to the second cavity 23, the pressing unit 25 also approaches the platform 11 of the alignment mechanism 10.

[0062] In one embodiment of the present invention, the bonding machine 20 may include a first driving device 271 and a second driving device 273, wherein the first driving device 271 is connected to the first cavity 21 and is used to drive the first cavity 21 to move closer to or away from the second cavity 23. The second driving device 273 is connected to the pressing unit 25. For example, the second driving device 273 may be disposed on the first cavity 21 and is connected to and drives the pressing unit 25 to move relative to the first cavity 21, so that the pressing unit 25 moves closer to or away from the stage 11 of the alignment mechanism 10.

[0063] Specifically, after the alignment mechanism 10 completes the alignment of the first substrate 121 and the second substrate 123, the second driving device 273 drives the pressing unit 25 to approach the stage 11 of the alignment mechanism 10, and the pressing unit 25 presses the first substrate 121 and the second substrate 123 stacked on the stage 11. In addition, a heating device may be provided in the stage 11 and / or the pressing unit 25, and the first substrate 121 and the second substrate 123 pressed by the stage 11 and the pressing unit 25 are heated by the heating device, so that the adhesive layer between the first substrate 121 and the second substrate 123 bonds the two substrates, thereby completing the bonding of the first substrate 121 and the second substrate 123.

[0064] In practical applications, it can be achieved through Figure 8 The shown picking device 30 is used to pick up the first substrate 121 and the second substrate 123 and place the first substrate 121 and the second substrate 123 on the alignment mechanism 10. Specifically, the picking device 30 may include at least one Benedictine suction cup and pick up the first substrate 121 or the second substrate 123 by adsorption.

[0065] Furthermore, the picking device 30 may include a plurality of first alignment units 31, and the alignment mechanism 10 may include a plurality of second alignment units 19, wherein the second alignment units 19 are located around the stage 11 and are aligned with the stage 11 of the picking device 30 and the alignment mechanism 10 by means of the first alignment units 31 and the second alignment units 19, so as to place the first substrate 121 and the second substrate 123 in a fixed position on the stage 11. For example, the first alignment unit 31 may be a protrusion, and the second alignment unit 19 may be a recess, wherein the first alignment unit 31 is used to insert the second alignment unit 19.

[0066] Advantages of this invention:

[0067] An alignment mechanism is provided, particularly an alignment mechanism used in a bonding machine, which mainly has a plurality of pins arranged around the stage to quickly and accurately align a plurality of substrates for bonding the aligned substrates.

[0068] The above description is merely a preferred embodiment of the present invention and is not intended to limit the scope of the present invention. All equivalent variations and modifications made in accordance with the shape, structure, features and spirit described in the claims of the present invention should be included within the scope of the claims of the present invention.

Claims

1. An alignment mechanism, characterized in that, include: A platform includes a bearing surface and defines an alignment area on the bearing surface; Multiple lifting units are arranged around the platform; A plurality of carrier pins are connected to the plurality of lifting units respectively, and the plurality of lifting units drive the plurality of carrier pins to rise and fall relative to the bearing surface of the platform, wherein the plurality of carrier pins are used to support a first substrate; A first drive unit is disposed around the platform; A first alignment pin is connected to the first drive unit. The first drive unit drives the first alignment pin to move up and down relative to the support surface of the stage, and drives the first alignment pin to move closer to or away from the alignment area of ​​the support surface. The first alignment pin is used to push against the first substrate placed on the support pin, so that the first substrate is aligned with the alignment area. A plurality of second drive units are arranged around the platform; and A plurality of second alignment pins are connected to the second drive unit, wherein the second alignment pins are used to support a second substrate, and the second drive unit is used to drive the second alignment pins to move up and down relative to the support surface of the stage, and to drive the second alignment pins to move closer to or away from the alignment area of ​​the support surface, so as to push against the second substrate, thereby aligning the second substrate with the first substrate.

2. The alignment mechanism according to claim 1, characterized in that, The platform includes a plurality of grooves facing the center of the bearing surface or the alignment area, and the bearing pin, the first alignment pin and the second alignment pin are respectively located in the plurality of grooves.

3. The alignment mechanism according to claim 1, characterized in that, The carrier pin includes a carrier portion and a first alignment portion. The carrier portion is used to carry the first substrate, while the first alignment portion protrudes from the carrier portion and is used to contact and align the first substrate.

4. The alignment mechanism according to claim 3, characterized in that, The end of the second alignment pin that is not connected to the second driving unit includes a protrusion for supporting the second substrate.

5. The alignment mechanism according to claim 1, characterized in that, The first driving unit and the second driving unit include: A guide rail is inclined relative to the bearing surface of the platform; A base, connected to the guide rail, wherein the base is connected to the first alignment pin or the second alignment pin; and A drive rod is connected to the base, the first alignment pin, or the second alignment pin. The drive rod is used to move the base along the guide rail, so that the first alignment pin or the second alignment pin moves up or down relative to the bearing surface of the platform and moves closer to or away from the alignment area.

6. A bonding machine, characterized in that, include: First cavity; A second cavity facing the first cavity, wherein when the first cavity is connected to the second cavity, a sealed space is formed between the first cavity and the second cavity; A pressing unit is connected to the first cavity; An alignment mechanism, disposed in the second cavity and facing the pressing unit, includes: A platform includes a bearing surface and defines an alignment area on the bearing surface; Multiple lifting units are arranged around the platform; A plurality of carrier pins are connected to the plurality of lifting units respectively, and the plurality of lifting units drive the plurality of carrier pins to rise and fall relative to the bearing surface of the platform, wherein the plurality of carrier pins are used to support a first substrate; A first drive unit is disposed around the platform; A first alignment pin is connected to the first driving unit, wherein the first driving unit is used to drive the first alignment pin to move up and down relative to the bearing surface of the stage, and to drive the first alignment pin to move closer to or away from the alignment area of ​​the bearing surface, so as to push against the first substrate carried by the bearing pin, so that the first substrate is aligned with the alignment area. A plurality of second drive units are arranged around the platform; and A plurality of second alignment pins are connected to the second drive unit, wherein the second alignment pins are used to support a second substrate, and the drive unit is used to drive the second alignment pins to move up and down relative to the support surface of the stage, and to drive the second alignment pins to move closer to or away from the alignment area of ​​the support surface, so as to push against the second substrate, thereby aligning the second substrate with the first substrate.

7. The bonding machine according to claim 6, characterized in that, include: A first driving device is connected to the first cavity and is used to drive the first cavity to move closer to or away from the second cavity; and A second driving device is connected to the pressing unit and is used to drive the pressing unit to move closer to or away from the stage, so that the pressing unit presses the first substrate and the second substrate placed on the stage.

8. The bonding machine according to claim 6, characterized in that, The device includes a picking device for holding the first substrate and the second substrate and placing the first substrate and the second substrate on the alignment mechanism. The picking device includes a plurality of first alignment units, and the alignment mechanism includes a plurality of second alignment units located around the stage and aligning the picking device and the stage through the first alignment units and the second alignment units.

9. The bonding machine according to claim 6, characterized in that, The carrier pin includes a carrier portion and a first alignment portion. The carrier portion is used to carry the first substrate, and the first alignment portion protrudes from the carrier portion and is used to contact and align the first substrate. One end of the second alignment pin includes a protrusion for carrying the second substrate.

10. The bonding machine according to claim 6, characterized in that, The first driving unit and the second driving unit include: A guide rail is inclined relative to the bearing surface of the platform; A base, connected to the guide rail, wherein the base is connected to the first alignment pin or the second alignment pin; and A drive rod is connected to the base, the first alignment pin, or the second alignment pin. The drive rod is used to move the base along the guide rail, so that the first alignment pin or the second alignment pin moves up or down relative to the bearing surface of the platform and moves closer to or away from the alignment area.

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