Method for forming a pre-laminated inlay body for a smart card, method for forming a smart card, pre-laminated inlay body, and smart card

Abstract

The present disclosure provides a method for forming a pre-laminated inlay body (100) for a smart card and a pre-laminated inlay body (100) for a smart card in various embodiments. In some illustrative embodiments, the pre-laminated inlay body for a smart card includes at least one contact terminal patch (1), which includes a patch base layer (3) and a plurality of conductive pads (5) disposed on a surface of the patch base layer, wherein the plurality of conductive pads are configured on the patch base layer according to a predetermined interconnection design; and a pre-laminated inlay sheet (20) having a plurality of openings (22), each of which accommodates a specific conductive pad among the conductive pads, wherein at least one contact terminal patch is mounted to the pre-laminated inlay sheet.

Description

Technical Field

[0001] The present invention relates to a method of forming a prelaminated inlay body for a smart card and a method of forming a smart card. Furthermore, the present invention relates to a prelaminated inlay body for a smart card and a smart card. Background Art

[0002] In general, a smart card is a physical electronic authorization device used to control access to resources. Typically, a smart card is provided as a credit card-sized plastic card formed by a card body in which one or more electrical and electronic components, such as a chip, an antenna, contact elements, etc., are integrated, wherein the card body after integration is referred to as a smart card. Many smart cards include a pattern of metal contacts for electrical connection with an integrated chip and / or are configured to allow contactless or wireless communication with the smart card. In the case of a contactless smart card, one or more antenna components are integrated into the body of the smart card to enable contactless or wireless interaction with the chip integrated into the smart card.

[0003] In order to improve the functionality of smart cards, efforts are increasingly being made to include more and more features into a single smart card. For example, one or more security feature modules are integrated into the card body of the smart card to improve the security of the smart card and / or one or more memory modules are integrated into the smart card to store sensitive personal data. Another application of smart cards aims to use the smart card as a key, which includes a key device for accessing personal belongings such as a house, a car, a room in a hotel, etc. There are many possible functional modules that need to be integrated into the smart card, such as a fingerprint sensor for implementing a biometric card and / or a dynamic CVV to implement a dynamic CVV function, one or more chip modules, a display, a battery module, an antenna module, etc.

[0004] As more and more features are added to smart cards, more and more interconnects will be integrated into the card body of the smart card. For example, when implementing a contactless smart card with biometric security features, up to twenty interconnects may be required between the printed circuit board and the feature module implementing the contactless and biometric features.

[0005] The dimensions of current smart cards are generally similar to those of credit cards. The typical size of a smart card is given by ID-1 of the ISO / IEC 7810 standard, which defines the card as nominally 85.60 mm × 53.98 mm (3.37 in × 2.13 in). Another common size is ID-000, which is nominally 25 mm × 15 mm (0.98 in × 0.59 in), which is commonly used in SIM cards. In each case, a thickness of approximately 0.76 mm (0.030 in) is given. Therefore, the size of smart cards is considered standardized and therefore will not change even if more and more features are to be integrated into the smart card. Therefore, when the number of contacts and interconnects is increased, the size of the interconnects must be adjusted proportionally to enable more and more contacts and interconnects to be integrated into the card body. It becomes a problem to provide high-quality electrical interconnects between the integrated features and the integrated circuit in the card body and to ensure reliable interconnections during the long-term use of the smart card.

[0006] When the size of contacts and interconnects, such as copper pads, is adjusted proportionally in the card body of a smart card, several problems may occur. For example, a large number of copper pads may increase the complexity of integrating the copper pads into the card body. In addition, the placement of copper pads in conventional pick-and-place processes has been shown to be less accurate when considering dimensional changes. On the one hand, this affects the tolerances of the processes used during various stages in the smart card manufacturing process, such as lamination, card cutting, card milling, and embedding one or more modules into the body. On the other hand, misplaced copper pads may impair the reliable function of any module to be connected to the copper pads. For example, the thermocompression bonding (TCB) used to equip the card body with an antenna module by bonding the copper wiring of the antenna to the copper pads in the card body may result in the milling of the copper wires (as is usually required by the TCB process), because it is difficult to control with the copper pads adjusted proportionally. These copper pads are currently considered to be reliable, easy and cost-effective interconnects in the application of smart cards.

[0007] As a clear embodiment of a smart card, a dual interface card is known in the prior art. A dual interface card is a smart card comprising two interfaces for sending and receiving information, one interface being an electrical contact for a galvanic connection and the other interface being configured for contactless sending or receiving of data, usually by means of an RF antenna. Several specific connection terminal designs are known in dual interface cards, which are designed taking into account different technical and application-related constraints. As described above, when more features are integrated into a dual interface card, the number of interconnections increases, which requires a change in the known specific connection terminal design, or even a completely new design of the connection terminal design.

[0008] In particular, when more functions are integrated into the dual interface card, the number of pads to be positioned in the same available space provided by the body of the card increases greatly. For example, a typical dual interface card without other functions has two connections, and integrating one or more other electronic modules into the card increases the number of connections to up to eight or ten or even more connections. The limited space of the card body makes it necessary to adjust the pad size proportionally, thus making it more difficult to assemble the pad into the pre-laminated inlay body or the card body. The problem involved is the positional accuracy of the pad, which becomes even more important when the pad size is proportionally adjusted to a smaller size. However, the smaller pad size also results in a smaller tolerance relative to the position of the pad to avoid possible mismatches between the terminals in the card body and the contacts of the electronic modules that are later integrated into the card. This means that during the manufacture of the pre-laminated inlay body, the conductive pads need to be properly kept in place. In the current process, the adhesive tape of the pre-laminated inlay body temporarily fixes the two large pads of each dual interface card. This technique is not efficient for applications configured with multiple smaller conductive pads.

[0009] Therefore, it is generally important to efficiently design an interconnection layout that is capable of accommodating the various electronic modules associated with the functions to be integrated into the dual-interface card, and to configure the interconnections and connection terminals in the confined space of the body of the smart card so as to provide high-quality electrical contacts and interconnections between the integrated features and the integrated circuit in the card body and ensure reliable interconnections during long-term use of the smart card.

[0010] An object of the present disclosure is to provide a pre-laminated inlay body with multiple conductive pads configured in an efficient and cost-effective manner.Herein, the size and design of the copper pads and routing will be designed to efficiently use the space provided by the body of the smart card. Summary of the invention

[0011] The above problems are solved and the above objects are achieved in various aspects of the present disclosure. Some aspects relate to a method of forming a pre-laminated inlay body for a smart card according to independent claim 1, a method of forming a smart card as defined in claim 15, a pre-laminated inlay body for a smart card according to independent claim 16 and a smart card according to claim 28. More advantageous embodiments are defined in dependent claims 2 to 14 and 17 to 27.

[0012] With regard to the expression "pre-laminated inlay body" as used herein, it is understood that it is a pre-laminated body having multiple layers of insulating material, such as PVC, pre-laminated together. The pre-laminated body is an intermediate product obtained during the manufacture of a smart card. For example, an illustrative pre-laminated inlay body can be obtained by fusing together different layers of thermoplastic material into a single homogeneous sheet body, thereby embedding a substrate having at least one contact and / or interconnection in the pre-laminated inlay body.

[0013] Regarding the expression "body of the smart card", the expression mentioned in this specification refers to the physical body of the smart card. For example, depending on the stage during the manufacture of the smart card, the body of the smart card at a given stage during the manufacture is the physical body of the smart card at a given stage during the manufacture, which only includes the physical elements that physically constitute the smart card at the given stage during the manufacture. In another embodiment, the body of the finally completed smart card can be understood to include a pre-laminated inlay body and at least one feature module integrated therein.

[0014] With regard to the expression "card body", the expression refers to a pre-laminated inlay body having a top layer and / or a bottom layer and one or more optional compensation layers mounted thereto. In particular, the card body is the body of the smart card in the manufacture of the smart card at a stage after the preparation of the pre-laminated inlay body and before the integration of at least one electronic module into the body of the smart card. In other words, the card body is the body of the smart card at a manufacturing stage, at which the geometrical dimensions of the body comply with the geometrical dimensions defined according to the ISO standard for smart cards.

[0015] In a first aspect, a method for forming a pre-laminated inlay body of a smart card is provided. According to an illustrative embodiment of the present invention, the method includes: preparing at least one contact terminal patch, which is formed by a patch base layer and a plurality of conductive pads disposed on a surface of the patch base layer, wherein the plurality of conductive pads are configured on the patch base layer according to a predetermined interconnection design; preparing a pre-laminated inlay sheet having a plurality of openings formed therein, each opening being formed so as to accommodate a specific conductive pad among the conductive pads; and mounting the at least one contact terminal patch to the pre-laminated inlay sheet.

[0016] When preparing at least one contact terminal patch, a predetermined interconnection design of the conductive gasket can be easily provided in an automated manufacturing process. In this context, the size of the conductive gasket can be proportionally adjusted to be smaller on the contact terminal patch with high precision, and the predetermined interconnection design of the conductive gasket can be provided independently of any assembly or lamination process performed during the manufacture of the pre-laminated inlay body. In addition, the patch base layer can be selected based on the material used to manufacture the pre-laminated inlay body, such as PVC, PC or similar thermoplastic materials used in the field of manufacturing pre-laminated inlay bodies, so that at least one contact terminal patch can be reliably integrated into the manufacture of the pre-laminated inlay body. Therefore, a pre-laminated inlay body with a predetermined interconnection design of a conductive gasket integrated therein can be provided for automated manufacturing of the pre-laminated inlay body in a cost-effective manner.

[0017] In a first embodiment of the first aspect, the method may further include: preparing a covering layer having at least one recess formed therein, the at least one recess being formed to accommodate at least one contact terminal patch. In this article, the preparation of the pre-laminated inlay sheet also includes: installing the covering layer to the pre-laminated inlay sheet in a manner aligned with the plurality of openings, so that at least one contact terminal patch accommodated in the at least one recess in the covering layer is also aligned with the plurality of openings in the pre-laminated inlay sheet, so that a plurality of conductive pads of the at least one contact terminal patch are accommodated in the plurality of openings of the pre-laminated inlay sheet. The at least one recess in the pre-laminated inlay sheet is at least one location where the at least one contact terminal patch is located in the pre-laminated inlay body. The recess in the covering layer positions the contact terminal patch with reference to the pre-laminated inlay sheet. In the case where more contact terminal patches are prepared to be accommodated in the pre-laminated inlay sheet, a recess is formed for each of the contact terminal patches so that each contact terminal patch is accommodated in a specific one of the recesses, and the conductive pad of each contact terminal patch is also accommodated in a corresponding opening in the opening in the pre-laminated inlay sheet. In this way, the recess in the cover layer is aligned with the corresponding opening in the pre-laminated inlay sheet. The conductive pad and the contact terminal patch can be embedded in the pre-laminated inlay sheet and in the cover layer so that the position of the conductive pad and the contact terminal patch remains fixed accordingly during the subsequent processing during the manufacture of the pre-laminated inlay body and the smart card.

[0018] According to some illustrative examples of the first embodiment, the thickness of the cover layer is substantially equal to the thickness of the patch base layer of at least one contact terminal patch. Thus, the pre-laminated inlay body may be provided with a smooth surface on one side of the contact terminal patch and the cover layer.

[0019] According to a second embodiment of the first aspect, the thickness of the pre-laminated inlay sheet is equal to the height of the conductive pad on the patch base layer of at least one contact terminal patch. Therefore, the patch can be accommodated in the pre-laminated inlay sheet so that the upper exposed surface of the pad embedded in the pre-laminated inlay sheet is flush with the surface of the pre-laminated inlay sheet where the conductive pad is exposed.

[0020] In a third embodiment of the first aspect, preparing at least one contact terminal patch may include: preparing a base patch layer having a plurality of bonding holes aligned with a predetermined interconnection design, and then forming a plurality of conductive pads on the base patch layer, so that each bonding hole is directly configured below one of the plurality of conductive pads. The corresponding configuration of the base patch layer can be bonded to the conductive pad from below the base patch layer. Therefore, the conductive pad of the at least one contact terminal patch can be approached to be bonded from one side of the patch base layer.

[0021] In a fourth embodiment of the first aspect, at least one contact terminal patch is prepared in a reel-to-reel process, comprising: combining a roll of patch base material tape on a roll of conductive pad material tape in a stacked configuration, such that one of the tapes extends on top of another of the tapes, and cutting a plurality of conductive pads from the tape of conductive pad material extending in a stacked configuration with the tape of patch base material, and equipping the tape of patch base material with a plurality of conductive pads. Thus, the contact terminal patch can be manufactured in an automated process.

[0022] According to some illustrative embodiments of the fourth embodiment of the first aspect, the method may further include: winding a cutting strip of conductive pad material, and cutting at least one contact terminal patch from the strip of conductive pad material equipped with a plurality of conductive pads. In the case of manufacturing a plurality of contact terminal patches, cutting out individual contact terminal patches from the plurality of contact terminal patches. This embodiment of the reel-to-reel process enables the preparation of at least one contact terminal patch in an easy and automated manner, while collecting the cutting strip of conductive pad material for possible recycling of the material. Therefore, the amount of waste material can be reduced.

[0023] According to some other illustrative embodiments of the fourth embodiment, the method may further include: applying an adhesive coating to the tape of the conductive pad material before combining the two tapes, wherein the plurality of conductive pads are fixed to the tape of the patch base layer by means of the adhesive coating. Therefore, an efficient online preparation process of the patch base layer material with conductive pads is provided for the automated process. In some specific embodiments of the present invention, the adhesive coating may be one of the following: a curable adhesive that can be thermally cured or UV-curable or a curable adhesive of a chemically bonded type or a pressure-sensitive adhesive, wherein the method further includes: curing the adhesive layer after equipping the tape of the patch base layer material with a plurality of conductive pads; and curing one component of the two-component adhesive, wherein the other component of the two-component adhesive is applied to the tape of the conductive pad material before equipping the tape of the patch base layer material. This adhesive coating can achieve selective bonding, so that the conductive pads of the tape of the conductive pad material extending in the second configuration formed with the tape of the patch base layer material are fixed to the tape of the patch base layer material, whereby the cut tape of the remaining conductive pad material after cutting out the conductive pads does not adhere to the tape of the patch base layer material.

[0024] In a fifth embodiment of the first aspect, preparing at least one contact terminal patch may include providing at least one contact terminal patch with an edge mark that can be used as an alignment and orientation mark so that the contact terminal patch can be correctly aligned and oriented when mounted to the pre-laminated inlay sheet.

[0025] In a sixth embodiment of the first aspect, the method may further include: preparing a wiring layer by providing a wiring base layer, the wiring base layer having a wiring pattern formed on one surface of the wiring base layer; and installing the wiring layer to a pre-laminated inlay sheet on which at least one contact terminal patch is installed, wherein the wiring pattern faces the at least one contact terminal patch. Therefore, in addition to the interconnection structure provided by the at least one contact terminal patch, a wiring pattern may also be provided in the pre-laminated inlay body. According to some illustrative embodiments of the present invention, the wiring pattern may include an antenna coil pattern (a partial antenna coil pattern or a complete antenna coil pattern), an interconnection wiring pattern for interconnecting at least two modules that are later integrated into the card body, and the like.

[0026] According to some illustrative embodiments of the present invention, the patch base layer of at least one contact terminal patch may have a bonding hole formed therein, and the wiring layer may have a bonding hole formed therein, the wiring layer is mounted to the patch base layer of the at least one contact terminal patch so that the bonding hole of the wiring layer and the bonding hole of the patch base layer are aligned to be roughly aligned, wherein mounting the wiring layer to the pre-laminated inlay sheet includes bonding the wires of the wiring pattern exposed by the bonding hole of the wiring layer to the conductive pad exposed by the bonding hole in the patch base layer. Therefore, the wiring pattern can be bonded to the conductive pad from below the patch base layer.

[0027] In some alternative illustrative embodiments, the wiring layer may face a plurality of conductive pads of at least one terminal patch, and the wires of the wiring pattern may be connected to the plurality of conductive pads to mount the wiring layer to the pre-laminated inlay sheet. Thus, the conductive pads may be easily bonded to the wiring pattern.

[0028] In some illustrative examples of the sixth implementation of the first aspect, the wiring pattern alone or in combination with at least a subset of the plurality of conductive pads may implement the antenna pattern. Thus, the contact terminal patch may provide the antenna pattern in a repeating manner together with the wiring pattern.

[0029] In a second aspect, a method of forming a smart card is provided. According to an illustrative embodiment of the present invention, the method includes: forming a pre-laminated inlay body according to the first aspect; forming one or more shielding layers on the pre-laminated inlay sheet or on the cover layer, wherein the card body is formed; and integrating at least one electronic module into the card body. In the present invention, at least one contact terminal patch is at least partially coupled to the electronic module and the wiring pattern.

[0030] In a third aspect, a pre-laminated inlay body of a smart card is provided. According to an illustrative embodiment of the present invention, the pre-laminated inlay body includes: at least one contact terminal patch, which includes a patch base layer and a plurality of conductive pads arranged on a surface of the patch base layer, wherein the plurality of conductive pads are arranged on the patch base layer according to a predetermined interconnection design; and a pre-laminated inlay sheet having a plurality of openings, each of which accommodates a specific conductive pad among the conductive pads, wherein the at least one contact terminal patch is mounted to the pre-laminated inlay sheet.

[0031] At least one contact terminal patch provides a predetermined interconnection design of the conductive gasket in an easy manner. In the present invention, the size of the conductive gasket can be proportionally adjusted to be smaller on the contact terminal patch with high precision, and a predetermined interconnection design of the conductive gasket can be provided. In addition, the patch base layer can be selected according to the material used to manufacture the pre-laminated inlay body, such as PVC, PC or similar thermoplastic materials used in the field of manufacturing pre-laminated inlay bodies, so that at least one contact terminal patch can be reliably integrated into the manufacture of the pre-laminated inlay body. Therefore, a pre-laminated inlay body with a predetermined interconnection design of the conductive gasket integrated therein can be provided, wherein precise and accurate positioning of the conductive gasket in the pre-laminated inlay body according to the predetermined interconnection design is provided by means of at least one contact terminal patch.

[0032] In a first embodiment of the third aspect, the pre-laminated inlay body may further include a covering layer having at least one recess formed therein, the at least one recess accommodating at least one contact terminal patch, wherein the covering layer is mounted to the pre-laminated inlay sheet in a manner aligned with a plurality of openings, so that the at least one contact terminal patch accommodated in the at least one recess in the covering layer is aligned with the plurality of openings in the pre-laminated inlay sheet, and wherein a plurality of conductive pads of the at least one contact terminal patch are accommodated in the plurality of openings of the pre-laminated inlay sheet.

[0033] In some illustrative embodiments herein, the thickness of the cover layer may be substantially equal to the thickness of the patch base layer of at least one contact terminal patch. Thus, the pre-laminated inlay body may be provided with a smooth surface on one side of the contact terminal patch and the cover layer.

[0034] In a second embodiment of the third aspect, the thickness of the pre-laminated inlay sheet can be equal to the height of the conductive pad on the patch base layer of at least one contact terminal patch. Therefore, the patch can be accommodated in the pre-laminated inlay sheet so that the upper exposed surface of the pad embedded in the pre-laminated inlay sheet is flush with the surface of the pre-laminated inlay sheet where the conductive pad is exposed.

[0035] In a third embodiment of the third aspect, at least one contact terminal patch may include a plurality of bonding holes formed in the base patch layer, the bonding holes being aligned with a predetermined interconnection design, wherein each bonding hole is configured directly below one of the plurality of conductive pads.

[0036] In a fourth embodiment of the third aspect, the plurality of conductive pads may be fixed to the patch base layer by means of an adhesive.

[0037] In a fifth embodiment of the third aspect, at least one of the contact terminal patches may be provided with edge markings serving as alignment and orientation marks.

[0038] In a sixth embodiment of the third aspect, the pre-laminated inlay body may further include a wiring layer provided by a wiring pattern formed on one surface of the wiring substrate layer, wherein the wiring layer may be mounted to the pre-laminated inlay sheet facing at least one contact terminal patch. Thus, the pre-laminated inlay body may have a wiring pattern.

[0039] In some illustrative embodiments herein, the patch base layer of at least one contact terminal patch may have a bonding hole formed therein, and the wiring layer may further have a bonding hole formed therein, the wiring layer is mounted to the patch base layer of at least one contact terminal patch, so that the bonding hole of the wiring layer and the bonding hole of the patch base layer are aligned to be roughly aligned, wherein the wires of the wiring pattern pass through the bonding hole to be bonded to the conductive pad. Therefore, the conductive pad can be bonded to the wiring pattern from below the patch base layer.

[0040] In an alternative illustrative embodiment, the wiring layer may face the plurality of conductive pads of the at least one contact terminal patch, and the conductive lines of the wiring pattern may be connected to the plurality of conductive pads of the at least one contact terminal patch.

[0041] In some illustrative examples of the fifth embodiment, the wiring pattern alone or in combination with at least a subset of the plurality of conductive pads may implement an antenna pattern.

[0042] In a seventh embodiment of the third aspect, when viewed in a top view, the conductive pad may be a copper pad in at least one of a linear shape, an L-shape, a square shape, a rectangular shape, a circular shape, etc.

[0043] In a fourth aspect, a smart card may be provided. According to an illustrative embodiment of the present invention, the smart card may include a card body having a pre-laminated inlay body according to the third aspect, one or more electronic modules integrated into the card body, wherein the one or more electronic modules and the wiring pattern are at least partially coupled to at least one contact terminal patch.

[0044] In some illustrative embodiments of the first aspect, a plurality of conductive pads may be subjected to pressure to form the conductive pads into a planar shape and / or to mount the conductive pads to a strip of patch substrate material and / or to deform at least a portion of each of the conductive pads. Thus, a possible curved shape of the conductive pads that may be caused by a rotating tool may be made planar and / or the conductive pads may be fixed to the patch substrate by pressure.

[0045] According to some illustrative embodiments of the third aspect, each of the conductive pads may be a 3D shaped conductive pad structure, such as a substantially Z-shaped or substantially L-shaped or substantially U-shaped shape. This may enable advantageous contact of the conductive pad mounted to the patch base layer. For example, the patch base layer may have a plurality of recesses or holes into which the conductive pad is partially inserted. This may expose a portion of the conductive pad for being contacted from two opposite sides of the patch base layer. BRIEF DESCRIPTION OF THE DRAWINGS

[0046] Other aspects and illustrative embodiments of the disclosure will be described in greater detail in the following detailed description in conjunction with the accompanying drawings, which are not drawn to scale.

[0047] Figure 1a and Figure 1b A contact terminal patch according to an illustrative embodiment of the invention is schematically shown in a perspective view.

[0048] Figure 2 Contact terminal patches according to some other illustrative embodiments of the present disclosure are schematically shown in perspective views.

[0049] Figure 3 A pre-laminated inlay body according to some illustrative embodiments of the invention is schematically shown in an exploded cross-sectional view.

[0050] Figures 4a to 4c The fabrication of a card body according to some illustrative embodiments of the present disclosure is schematically illustrated.

[0051] Figure 5a to Figure 5c The manufacture of a card body according to some other illustrative embodiments of the present disclosure is schematically illustrated.

[0052] Figures 6a to 6c The fabrication of a contact terminal patch according to some illustrative embodiments of the present disclosure is schematically illustrated.

[0053] Figures 7a to 7c The fabrication of a contact terminal patch according to some other illustrative embodiments of the present disclosure is schematically illustrated.

[0054] Figure 8 Different layouts for contacting terminal patches according to some illustrative embodiments of the present disclosure are schematically shown.

[0055] Fig. 9 A smart card according to some illustrative embodiments of the present disclosure is schematically shown.

[0056] Fig.10 A card body according to some illustrative embodiments of the present disclosure is schematically illustrated.

[0057] Fig.11 The fabrication of a strip of patch substrate material according to some illustrative embodiments of the present disclosure is schematically illustrated.

[0058] Fig.12 Optional process steps according to some illustrative embodiments of the present disclosure are schematically illustrated.

[0059] Fig.13a The fabrication of a strip of patch substrate material according to some illustrative embodiments of the present disclosure is schematically illustrated.

[0060] Fig.13b Conductive shim structures according to some illustrative embodiments of the present disclosure are schematically shown.

[0061] Fig.14 The fabrication of a strip of patch substrate material according to some other illustrative embodiments of the present disclosure is schematically illustrated. DETAILED DESCRIPTION

[0062] Reference Figure 1a , Figure 1b and Figure 2 , contact terminal patches according to various illustrative embodiments of the present disclosure will be described. In this document, Figure 1a and Figure 2 Two possible implementations of the contact terminal patches are shown without limiting the present disclosure.

[0063] Reference Figure 1a , shows a contact terminal patch 1, which includes a patch base layer 3 and a plurality of conductive pads 5 arranged on the patch base layer 3. Figure 1a As shown, the patch base layer 3 can have a quadrilateral shape when viewed in a top view. However, this does not constitute any limitation to the present disclosure, and any other shape of the patch base layer 3 in a top view, such as a rectangle, a polygon, a circle or any other shape, can be realized for the patch base layer 3.

[0064] refer to Figure 2 , an alternative embodiment is shown with a contact terminal patch 1', which has a patch base layer 3' and a plurality of conductive pads 5'. Figure 1a The icons are different. Figure 2The contact terminal patch 1' also has an edge mark 9', such as another edge indicated by the reference numeral 9'. However, this does not constitute any limitation to the present disclosure, and the mark 9' may have any other shape, such as a flat angle, and one or more notches, concave shapes (such as indentations) or convex shapes (protrusions or peaks) of the edge may be formed to provide a mark that can distinguish a specific orientation of the contact terminal patch 1' and help align the contact terminal patch 1' when the contact terminal patch 1' is integrated into a pre-laminated inlay body (not shown). For example, a pre-laminated inlay sheet (not shown) on which the contact terminal patch 1' is installed may have a recess, the shape of which is a complementary shape (negative) of the contact terminal patch 1', so that the contact terminal patch 1' can fit snugly into the recess of the pre-laminated inlay sheet (not shown).

[0065] Reference Figure 1b , shows a bottom view of the contact terminal patch 1 as viewed from below, showing the lower surface or bottom surface of the patch base layer 3, that is, the surface of the patch base layer 3 opposite to the upper surface or front surface of the contact terminal patch 1. In this context, the upper surface or front surface of the contact terminal patch 1 is the surface of the contact terminal patch 1 on which a plurality of conductive pads 3 are arranged. Figure 1b As shown, a plurality of bonding holes 7 are formed in the patch base layer 3, and the bonding holes 7 extend through the patch base layer 3 as through holes, so that at least some of the plurality of conductive pads 5 on the front surface of the patch base layer 3 can be accessed from the side at the bottom surface of the patch base layer 3. Although a single bonding hole is formed in the patch base layer 3 with respect to each conductive pad 5, this does not constitute any limitation to the present disclosure, and more than one bonding hole 7 may be provided in a manner associated with each conductive pad 5. It is also possible that only a subset of the conductive pads 5 are associated with the bonding holes 7, so that at least one of the conductive pads 5 is not associated with the bonding hole 7, while one or more other conductive pads may be associated with at least one bonding hole 7.

[0066] According to some illustrative embodiments of the present disclosure, the patch base layer 3, 3' may be a layer of PVC, PC or similar thermoplastic material.

[0067] According to some demonstrative embodiments of the present disclosure, the conductive pad may be formed of at least one of copper, aluminum, gold, silver, and an alloy including at least one of these materials.

[0068] According to some illustrative embodiments of the present disclosure, when in a top view (i.e., along the Figure 1a and Figure 2When viewed in a normal direction of the upper surface of the contact terminal patch 1, 1' in FIG. 1 , the conductive pads 5, 5' may be provided in a linear, L-shaped, square, rectangular, circular, etc. shape. In addition, a plurality of conductive pads 5 (see FIG. 1 ) may be provided on each of the patch base layers 3 according to a predetermined interconnection design. Figure 1a and 1b ) and a plurality of conductive pads 5' on the patch base layer 3' (see Figure 2 ). A predetermined interconnection design may be determined when designing a smart card, wherein the predetermined interconnection design is an implementation of an interconnection layout used in the smart card for establishing electrical connections between different modules and / or wirings and / or contacts in the smart card to be developed.

[0069] As in this application Figure 1a , Figure 1b and Figure 2 The exact configuration of the conductive pads shown is not limiting and is Figure 8 a to Figure 8 The configuration of the conductive pads shown in FIG. 1 is illustrative but not limiting. However, it should be understood that Figure 8 The number and / or orientation of conductive pads shown is not an exhaustive list of possible configurations of conductive pads and is therefore not limiting.

[0070] refer to Figure 8 The conductive pad can be arranged on the patch base layer of the contact terminal patch so that the conductive pad is not constrained to be completely located within the surface of the patch base layer in a top view. Figure 8 As shown in FIG. 5 , at least one of the configurations of the conductive pads may be configured on the patch base layer such that the conductive pad partially extends beyond the surface of the patch base layer. Thus, the conductive pad protrudes away from the patch base layer in a direction that is not parallel to the normal direction of the upper surface of the patch base layer on which the conductive pad is configured.

[0071] refer to Figure 3 , schematically showing an exploded cross-sectional view of a pre-laminated inlay body 100 according to some illustrative embodiments of the present disclosure. The pre-laminated inlay body 100 includes a plurality of contact terminal patches 10, a pre-laminated inlay sheet 20 and at least one insulating layer, such as a first laminate layer 50 and a second laminate layer 40b, such as a bottom shielding sheet. The plurality of contact terminal patches 10 include contact terminal patches 1a and contact terminal patches 1b. This does not constitute any limitation to the present disclosure, and there may be any number of terminal patches, such as at least one contact terminal patch.

[0072] According to some illustrative embodiments of the present disclosure, the size of the pre-laminated inlay sheet 20 is larger than each of the contact terminal patches 1a and 1b. Figure 3 The illustrated pre-laminated inlay sheet 20 may be one layer of PVC or may be comprised of a plurality of sub-layers (not shown) which collectively represent the pre-laminated inlay sheet 20 .

[0073] The contact terminal patch 1a is formed by a patch base layer 3a and a plurality of conductive pads 5 formed on the surface of the patch base layer 3a. Hereinafter, the surface of the patch base layer 3a on which the conductive patch 5a is disposed is referred to as the upper surface or the front surface, and the opposite surface of the patch base layer 3a is referred to as the lower surface or the bottom surface. Similarly, the contact terminal patch 1b includes a patch base layer 3b and a plurality of conductive pads 5b disposed on the front surface of the patch base layer 3b. Figure 1a , Figure 1b and Figure 8 The contact terminal patches described are provided for each of the contact terminal patches 1a and 1b.

[0074] With respect to the contact terminal patches 1a and 1b, the upper surface or front surface of the pre-laminated inlay body 20 is determined as the surface of the pre-laminated inlay body 20 close to the conductive pads 5a, 5b of the contact terminal patches 1a and 1b. Therefore, the surface opposite to the upper surface or front surface of the pre-laminated inlay body 20 is determined as the lower surface or bottom surface of the pre-laminated inlay body 20. Figure 3 , openings 22a and 22b are formed in the pre-laminated inlay sheet 20, each of the openings 22a, 22b extending at least partially through the pre-laminated inlay sheet 20 along the thickness direction of the pre-laminated inlay sheet 20. Figure 3 The openings 22a and 22b are schematically shown as through holes extending completely through the pre-laminated inlay sheet 20 along the thickness direction of the pre-laminated inlay sheet 20, which does not constitute any limitation to the present disclosure, and the openings 22a and 22b may extend only partially into the pre-laminated inlay sheet 20 along the thickness direction of the pre-laminated inlay sheet 20. The lateral size of the openings 22a and 22b may be such that the contact terminal patches 1a and 1b are accommodated into the openings 22a and 22b with respect to the length and width dimensions perpendicular to the thickness direction of the pre-laminated inlay sheet 20. In particular, the inner diameters of the openings 22a and 22b may be selected such that the contact terminal patches 1a and 1b fit snugly into the openings 22a and 22b with reference to the length and width dimensions of the contact terminal patches 1a and 1b.

[0075] According to some illustrative embodiments of the present disclosure, the thickness of the pre-laminated inlay sheet 20 may correspond to the total height of each of the contact terminal patches 1a and 1b, so that when the contact terminal patches 1a and 1b are inserted into the openings 22a and 22b, the upper surfaces of the conductive pads 5a and 5b are substantially flush with the upper surface of the pre-laminated inlay sheet 20. In the case where the openings 22a and 22b are through holes, such as Figure 3 As shown, when the thickness of the pre-laminated inlay sheet 20 is appropriately matched to the total height of the contact terminal patches 1a, 1b, the lower surface of the contact terminal patches 1a and 1b can be substantially flush with the lower surface of the pre-laminated inlay sheet 20. Therefore, the contact terminal patches 1a and 1b can be accommodated in the openings 22a and 22b without the raised portions of the contact terminal patches 1a and 1b extending beyond the surface of the pre-laminated inlay sheet 20. In this way, reliable lamination of the layers in the pre-laminated inlay body being manufactured is ensured.

[0076] On the front surface of the pre-laminated inlay sheet 20, after the contact terminal patches 1a and 1b are accommodated in the openings, a top covering shielding sheet 40t may be provided. Thus, the pre-laminated inlay body 100 may be formed by the pre-laminated inlay sheet 20 having the accommodated contact terminal patches 1a and 1b together with the layers 50, 40b and 40t on the upper and lower surfaces of the pre-laminated inlay sheet 20, as shown in FIG. Figure 3 shown.

[0077] According to some illustrative embodiments of the present disclosure and as Figure 3 As shown, an optional wiring layer 30 may be provided, the wiring layer 30 including a wiring substrate layer 31 and a wiring pattern 32 formed in and / or on a surface of the wiring substrate layer 31. According to some illustrative embodiments of the present disclosure, the wiring pattern 32 may implement an antenna coil pattern, or partially implement an antenna coil pattern.

[0078] According to some illustrative embodiments of the present disclosure, Figure 3 As shown, the wiring layer 30 may be disposed on the front surface of the pre-laminated inlay sheet 20. However, this does not constitute any limitation to the present disclosure, and the wiring layer 30 may alternatively be formed between the pre-laminated inlay sheet 20 and the layer 50.

[0079] According to some specific illustrative but non-limiting embodiments herein, it can be provided as follows Figure 3A pre-laminated inlay body 100. The top shielding sheet may be provided by a layer 40t having a thickness in a range of about 30 μm to about 60 μm (e.g., 50 μm) and may be formed of PVC or the like. The inlay sheet may be provided by a wiring layer 30 having a thickness in a range of about 100 μm to about 150 μm (e.g., 130 μm) and may be formed of PVC or the like. An additional sheet may be provided by a pre-laminated inlay sheet 20 having a thickness in a range of about 50 μm to about 150 μm (e.g., 100 μm) and may be formed of PVC or the like. Another additional sheet may be provided by a layer 50 having a thickness in a range of about 50 μm to about 150 μm (e.g., 100 μm) and may be formed of PVC or the like. The bottom shielding sheet may be provided by a layer 40b having a thickness in a range of about 30 μm to about 60 μm (e.g., 50 μm) and may be formed of PVC or the like.

[0080] Reference Figures 4a to 4c , the manufacture of a card body of a smart card will be described according to some illustrative embodiments of the present disclosure.

[0081] refer to Figure 4a , schematically shows a contact terminal patch 14a in a cross-sectional view. The contact terminal patch 14a includes a patch base layer 14a-3 and a plurality of conductive pads 14a-5. In the patch base layer 14a-3, according to the above reference Figure 1b The described bonding hole 7 forms at least one bonding hole 14a-7, the disclosure of which is incorporated herein by reference in its entirety.

[0082] refer to Figure 4b , Figure 4a The contact terminal patch 14a is mounted to the pre-laminated inlay sheet 20a-1. The pre-laminated inlay sheet 20a-1 has a plurality of openings (not shown) formed therein, and the plurality of openings (not shown) are arranged so that when the contact terminal patch 14a is mounted to the pre-laminated inlay sheet 20a-1, as shown in FIG. Figure 4b As shown, a plurality of conductive pads 14a-5 contacting the terminal patch 14a are received by a plurality of openings into the pre-laminated inlay sheet 20a-1.

[0083] Continue to refer Figure 4b , the cover layer 20a-2 can be arranged on the surface of the pre-laminated inlay sheet 20a-1 aligned with the contact terminal patch 14a. In particular, the cover layer 20a-2 can have a recess (not shown) whose size is set so that the patch base layer 14a-3 of the contact terminal patch 14a is completely accommodated in the recess.

[0084] According to some illustrative embodiments of the present invention, the pre-laminated inlay sheet 20a-1 can be provided with a covering layer 20a-2. Herein, a plurality of openings (not shown) in the pre-laminated inlay sheet 20a-1 and recesses (not shown) in the covering layer 20a-2 are aligned relative to each other so that the contact terminal patch 14a can be accommodated in the pre-laminated inlay sheet 20a-1 in the correct orientation of the contact terminal patch 14a. According to some illustrative embodiments, the contact terminal patch 14a can be installed to the pre-laminated inlay sheet 20a-1 before the covering layer 20a-2 is installed to the pre-laminated inlay sheet 20a-1, or vice versa.

[0085] According to some illustrative embodiments of the present disclosure, the thickness of the cover layer 20a-2 may be substantially equal to the thickness of the patch base layer 14a-3 contacting the terminal patch 14a.

[0086] According to some illustrative embodiments of the present disclosure, the thickness of the pre-laminated inlay sheet 20a-1 may be equal to the height of the conductive pad 14a-5 on the patch base layer 14a-3 of the contact terminal patch 14a.

[0087] According to some illustrative embodiments of the present disclosure, a wiring layer 30a including a wiring substrate layer 31a and a wiring pattern 32a may be prepared. The wiring pattern 32a may be formed on a surface and / or in the wiring substrate layer 31a.

[0088] The prepared wiring layer 30a can be mounted to the pre-laminated inlay sheets 20a-1, 20a-2 mounted with a plurality of contact terminal patches. Herein, when the wiring layer 30a is mounted to the pre-laminated inlay sheet 20a-1 together with the cover layer 20a-2, the wiring pattern 32a of the wiring layer 30a faces the contact terminal patch 14a.

[0089] Reference Figure 4b , the bonding hole 14a-7 is aligned with the bonding hole 35a formed in the wiring base layer 31a, so that the bonding hole of the patch base layer 14a-3 and the bonding hole of the wiring base layer 31a are aligned. When the wiring layer 30a is mounted on the pre-laminated inlay sheet 20a-1 and the cover layer 20a-2, the bonding of the wire 33a of the wiring pattern 32a is performed, and the wire is exposed to the conductive pad 14a-5 of the contact terminal patch 14a through the bonding hole 35a of the wiring layer 30a.

[0090] According to some illustrative embodiments of the present invention, when the wiring pattern 32a is bonded to the conductive pad 14a-5, a bonding front end (not shown) may be inserted into the bonding hole 35a. The bonding front end (not shown) may drive the wire 33a through the bonding hole 14a-7 to reach the conductive pad 14a-5, and then bonding may be performed to permanently bond the wire 33a to the conductive pad 14a-5. Therefore, with corresponding treatment of all wires 33a exposed through the bonding holes 35a, reliable bonding of these wires 33a to the corresponding conductive pads 14a-5 may be achieved. The bottom layer 40a and the optional top layer (not shown) may be mounted on the conductive pad 14a-5. Figure 4b The opposite side of the construction shown is used to finally complete the pre-laminated inlay body.

[0091] refer to Figure 4c , a card body CB-a is prepared by further disposing a printed foil 50a together with a shield 56a on the bottom and disposing a printed foil 52a together with a shield 54a on the front of the pre-laminated inlay body.

[0092] According to some illustrative embodiments of the present disclosure, layers 20a-1 and 20a-2 may be combined and correspond to Figure 3 The layer shown is 20. Therefore, Figure 3 The above description of the pre-laminated inlay body 100 can be applied in a corresponding manner to Figure 4b Public content in .

[0093] Reference Figure 5a to Figure 5c , the manufacture of a card body of a smart card will be described according to some illustrative embodiments of the present disclosure.

[0094] refer to Figure 5a , schematically showing the contact terminal patch 14b in a cross-sectional view. The contact terminal patch 14b includes a patch base layer 14b-3 and a plurality of conductive pads 14b-5. Figure 4a Unlike the illustration in FIG. 1 , no bonding hole is formed in the patch base layer 14 b - 3. Considering this, the above reference Figure 1a and Figure 2 The described contact terminal patches 1 , 1 ′ form the contact terminal patches 14 b , the corresponding disclosure content of which is hereby incorporated in its entirety by reference.

[0095] refer to Figure 5b , Figure 5aThe contact terminal patch 14b is mounted to the pre-laminated inlay sheet 20b-1. The pre-laminated inlay sheet 20b-1 has a plurality of openings (not shown) formed therein, and the plurality of openings (not shown) are arranged so that when the contact terminal patch 14b is mounted to the pre-laminated inlay sheet 20b-1, the plurality of conductive pads 14b-5 of the contact terminal patch 14b are accommodated in the pre-laminated inlay sheet 20b-1 by the plurality of openings, as shown in FIG. Figure 5b See Figure 5b , the contact terminal patch 14b is mounted to the pre-laminated inlay sheet 20b so that the patch base layer 14b-3 of the contact terminal patch 14b rests on the upper surface or front surface of the pre-laminated inlay sheet 20b-1. Therefore, when the contact terminal patch 14b is mounted to the pre-laminated inlay sheet 20b-1, the surface of the conductive pad 14b-5 is exposed at the lower surface or bottom surface of the pre-laminated inlay sheet 20b-1.

[0096] Continue to refer Figure 5b , the cover layer 20b-2 can be arranged on the upper surface of the pre-laminated inlay sheet 20b-1 aligned with the contact terminal patch 14b. In particular, the cover layer 20b-2 can have a recess (not shown) whose size is set so that the patch base layer 14b-3 of the contact terminal patch 14b is completely accommodated in the recess.

[0097] According to some illustrative embodiments of the present invention, the pre-laminated inlay sheet 20b-1 can be provided with a covering layer 20b-2. Herein, a plurality of openings (not shown) in the pre-laminated inlay sheet 20b-1 and recesses (not shown) in the covering layer 20b-2 are aligned relative to each other so that the contact terminal patch 14b can be accommodated in the pre-laminated inlay sheet 20b-1 in the correct orientation of the contact terminal patch 14b. According to some illustrative embodiments, the contact terminal patch 14b can be installed to the pre-laminated inlay sheet 20b-1 before the covering layer 20b-2 is installed to the pre-laminated inlay sheet 20b-1, or vice versa.

[0098] According to some illustrative embodiments of the present disclosure, the thickness of the cover layer 20b-2 may be substantially equal to the thickness of the patch base layer 14b-3 of the contact terminal patch 14b.

[0099] According to some illustrative embodiments of the present disclosure, the thickness of the pre-laminated inlay sheet 20b-1 may be equal to the height of the conductive pad 14b-5 on the patch base layer 14b-3 of the contact terminal patch 14b.

[0100] According to some illustrative embodiments of the present disclosure, a wiring layer 30b including a wiring substrate layer 31b and a wiring pattern 32b may be prepared. The wiring pattern 32b may be formed on a surface and / or in the wiring substrate layer 31b.

[0101] The prepared wiring layer 30b can be installed from below the pre-laminated inlay sheet 20b-1 to the pre-laminated inlay sheets 20b-1, 20b-2 installed with multiple contact terminal patches. For example, the wiring layer 30b is installed to the pre-laminated inlay sheet 20b-1 at the lower surface of the pre-laminated inlay sheet 20b-1 and at the surface of the pre-laminated inlay sheet 20b-1 opposite to the covering layer 20b-2. When the wiring layer 30b is installed to the pre-laminated inlay sheet 20b-1, the wiring pattern 32b of the wiring layer 30b faces the contact terminal patch 14b, in particular, the wiring pattern 32b faces the exposed surface of the conductive pad 14b-5 of the contact terminal patch 14b installed to the pre-laminated inlay sheet 20b-1. Therefore, the wire 33b can be directly bonded to the exposed surface of the conductive pad 14b-5 of the contact terminal patch 14b.

[0102] Reference Figure 5c , a card body CB-b is prepared by further disposing a printed foil 50b together with a mask 56b on the bottom and a printed foil 52b together with a mask 54b on the front of the pre-laminated inlay body.

[0103] According to some illustrative embodiments of the present disclosure, layers 20b-1 and 20b-2 may be combined and correspond to Figure 3 The layer shown is 20. Therefore, Figure 3 The above description of the pre-laminated inlay body 100 can be applied in a corresponding manner to Figure 5b Public content in .

[0104] refer to Figures 6a to 6c , presents a manufacturing process for forming a contact terminal patch according to some illustrative embodiments of the present disclosure.

[0105] refer to Figure 6a , shows a top view of a reel R1, the reel R1 of patch base material providing a strip B1 of patch base material. The patch base material of the strip B1 may be provided with a bonding hole BH. For example, the patch base material on the reel R1 may be unrolled to provide a strip, and according to some predetermined pattern, the bonding hole BH may be formed in the patch base material unrolled from the reel R1, so that Figure 6a As shown a strip B1 of patch base layer material is provided. In addition a reel R2 may be provided which provides a strip B2 of conductive pattern material.

[0106] refer to Figure 6b, a reel-to-reel process for manufacturing a plurality of contact terminal patches is shown. According to some illustrative embodiments of the present invention, a reel R2 of a conductive gasket material can be configured relative to a reel R1 of a patch base layer material so that a band B2 of reel R2 and a band B1 of reel R1 are combined in a stacked configuration, for example by biasing the two bands toward each other so that band B2 is configured above band B1 in a stacked configuration. Band B2 and band B1 can be combined so as to extend on top of each other in a stacked configuration and converge toward each other without physical contact before workstation C. At workstation C, band B2 and band B1 can be processed in the following manner. Band B2 can be exposed to a cutting piece to cut out a plurality of conductive gaskets in band B2, which extends in a stacked configuration formed with a band of patch base layer material B1. The cut conductive gaskets formed at workstation C can be provided to band B1 of base layer material, for example by pressing the conductive gaskets onto band B1 and fixing the conductive gaskets on band B1. For example, tape B1 may be fused with patterned tape B2, which is the conductive pad cut from tape B2 at workstation C. According to some optional embodiments herein, cut tape B2*, which is the remaining tape B2 (without the cut conductive pad), may be wound at reel R3 to collect the conductive pad material and provide an opportunity to recycle the waste material. Figure 6b As shown, after workstation C, the patch band BP is obtained.

[0107] refer to Figure 6c , showing the before and after Figure 6b A top view of the stacked structure of belt B2 and belt B1. Figure 6c In the top view of the embodiment of the present invention, the reel R2 and the belt B2 are directly visible. The coupling hole BH is not visible, but is shown for clarity. Figure 6c It is indicated in FIG. 1 that band B1 (uppercase letters) runs below band B2 in a stacked configuration.

[0108] refer to Figure 6c , shows the band BP after workstation C, where a conductive pad CP is present on the band B1 of patch base material, thereby producing a band BP of the patch. Figure 6c The same process is also shown in a cross-sectional view showing the stacked configuration of tapes B1 and B2 before and after workstation C, with a conductive pad CP being provided on tape B1 .

[0109] refer to Figure 6c, the adhesive layer A is disposed between the tape B2 and the tape B1. For example, before cutting and fixing the cut conductive gasket toward the tape B1, the adhesive layer A can be supplied to at least one of the tapes B1 and B2 at the workstation C. According to some illustrative but non-limiting embodiments of the present invention, a curable adhesive layer A can be used, which is heat-curable or UV-curable, wherein the curable adhesive layer A is supplied to one of the tapes B1 and B2, for example, the tape B1, and curing of the curable adhesive is performed after the tape B2 is cut and the conductive gasket CP is formed and the tape B2* of the cut material is separated from the stacked structure after the workstation C. In another illustrative embodiment, the adhesive layer A can be a two-component adhesive. In this case, one component of the two-component adhesive layer A is supplied to the tape B2, and the other component of the two-component adhesive is supplied to the tape B1. However, in this case, after the conductive gasket CP is formed and the waste material B2* is separated, the two are merged. In a particular illustrative embodiment, one of the components may be supplied to the corresponding tapes of tape B1 and tape B2 according to the pattern of the pads CP to be provided on tape B1. In this way, only the conductive pad material of tape B2 adheres to tape B1 at the locations of the components. For example, the adhesive layer A may be supplied in a pattern corresponding to the pattern of the conductive pads to be formed on tape B1.

[0110] According to some illustrative embodiments, the strip B1 of conductive pad material may have perforations (not shown) formed on one side of the strip B1. The perforations (not shown) may allow for accurate positioning of the conductive pads on the strip B1. In particular, the perforations may serve as reference marks relative to the configuration of the conductive pads on the strip B1.

[0111] According to some illustrative embodiments, the adhesive may be based on a pressure sensitive adhesive, a heat reactive adhesive, a UV activated adhesive, or a chemically bonded adhesive. It may be applied in a specific pattern, or may be caused to cure according to a specific pattern.

[0112] According to some subsequent processing, the strip BP of patches can be cut to produce at least one contact terminal patch. Figure 1a , Figure 1b , Figure 2 , Figure 3 and Figure 4a-4c The patch in question can be referred to above. Figures 6a to 6c Produced by the process described.

[0113] refer to Figures 7a to 7c , presents another manufacturing process for forming a contact terminal patch according to some other illustrative embodiments of the present disclosure.

[0114] refer to Figure 7a, shows a top view of a reel R1', which provides a strip B1' of patch base layer material. In addition, a reel R2' can be provided, which provides a strip B2' of conductive pattern material.

[0115] refer to Figure 7b , a reel-to-reel process for manufacturing a plurality of contact terminal patches is shown. According to some illustrative embodiments of the present invention, a reel R2' of a conductive gasket material may be configured relative to a reel R1' of a patch base layer material so that a band B2' of reel R2' and a band B1' of reel R1' are combined in a stacked configuration, for example by biasing the two bands toward each other so that band B2' is configured above band B1' in a stacked configuration. Band B2' and band B1' may be combined so as to extend on top of each other in a stacked configuration and converge toward each other without physical contact prior to workstation C'. At workstation C', band B2' and band B1' may be processed in the following manner. Band B2' may be exposed to a cutting piece to cut a plurality of conductive gaskets in band B2', which extends in a stacked configuration with the band of patch base layer material B1'. The cut conductive gaskets formed at workstation C' can be provided to a tape B1' of base layer material, for example by pressing the conductive gaskets onto tape B1' and fixing the conductive gaskets on tape B1'. For example, tape B1' can be fused with a patterned tape B2', which is the conductive gasket cut from tape B2' at workstation C'. According to some optional embodiments of the present invention, the cut tape B2** as the remaining tape B2' (without the cut conductive gasket) can be wound at reel R3' to collect the conductive gasket material and provide an opportunity to recycle the waste material. Therefore, as Figure 7b As shown, after workstation C' a band BP' of the patch is obtained.

[0116] refer to Figure 7c , showing the before and after workstation C' Figure 7b A top view of the stacked structure of belt B2' and belt B1'. Figure 7c In the top view of the embodiment, the reel R2' and the belt B2' are directly visible. It should be understood that the belt B1' (capital letter) extends below the belt B2' in a stacked configuration, so that Figure 7c is not directly visible in the top view.

[0117] refer to Figure 7c , shows the strip BP after workstation C', wherein a conductive pad CP' is present on the strip B1' of patch base material, thereby producing a strip BP' of patches. Figure 7c The same process is also shown in a cross-sectional view showing the stacked configuration of the strips B1 ′ and B2 ′ before the workstation C′ and after the workstation C′, wherein the conductive pad CP′ is provided on the strip B1 ′.

[0118] refer to Figure 7c , the adhesive layer A' is disposed between the tape B2' and the tape B1'. For example, before cutting and fixing the cut conductive gasket toward the tape B1', the adhesive layer A' can be supplied to at least one of the tapes B1' and B2' at the workstation C'. According to some illustrative but non-limiting embodiments of the present invention, a curable adhesive layer A' can be used, which is heat-curable or UV-curable, wherein the curable adhesive layer A' is supplied to one of the tapes B1' and B2', for example, the tape B1', and curing of the curable adhesive is performed after the tape B2' is cut and the conductive gasket CP' is formed and the tape B2** of the cut material is separated from the stacked structure after the workstation C'. In another illustrative embodiment, the adhesive layer A' can be a two-component adhesive. In this case, one component of the two-component adhesive layer A' is supplied to the tape B2', and the other component of the two-component adhesive is supplied to the tape B1'. However, in this case, after the conductive gasket CP' is formed and the waste material B2** is separated, the two are merged. In a particular illustrative embodiment, one of the components may be supplied to the respective ones of the tapes B1' and B2' according to the pattern of the pads CP' to be provided on the tape B1'. In this way, only the conductive pad material of the tape B2' adheres to the tape B1' at the locations of the components. For example, the adhesive layer A' may be supplied in a pattern corresponding to the pattern of the conductive pads to be formed on the tape B1'.

[0119] According to some illustrative embodiments, the strip B1' of conductive gasket material may have perforations (not shown) formed on one side of the strip B1'. The perforations (not shown) may allow for accurate positioning of the conductive gasket on the strip B1'. In particular, the perforations may serve as reference marks relative to the configuration of the conductive gasket on the strip B1'.

[0120] According to some illustrative embodiments, the adhesive may be based on a pressure sensitive adhesive, a heat reactive adhesive, a UV activated adhesive, or a chemically bonded adhesive. It may be applied in a specific pattern, or may be caused to cure according to a specific pattern.

[0121] According to some subsequent processing, the strip BP' of patches can be cut to produce at least one contact terminal patch. Figure 1a , Figure 2 , Figure 3 and Figure 5a-5c The patch in question can be found in the above referenced Figures 7a to 7c Produced by the process described.

[0122] refer to Fig. 9, schematically showing a smart card SC in the form of a block diagram. The smart card SC is obtained from a card body (e.g., the card body CB in FIGS. 4 and 5 as described above) by integrating one or more electronic modules (e.g., M1, M2, M3, and M4) into the card body. For example, one or more electronic modules may be integrated into the card body by forming one or more cavities (not shown) in the surface of the card body and inserting one or more electronic modules into the one or more cavities (not shown) so that each electronic module is accommodated in a dedicated cavity (not shown). Illustrative embodiments of electronic modules are chips, LEDs, displays, fingerprint sensors, etc.

[0123] Furthermore, before the electronic modules M1 to M4 are integrated in the card body CB, the card body CB has at least one contact terminal patch integrated therein, such as Fig. 9 At least one of the contact terminal patches CP1, CP2, CP3 shown. The contact terminal patches may be as described above with reference to FIGS. 1 to 3. Figure 8 As described in any one of the above. The card body CB may also have a wiring pattern WP integrated therein. As described above, the wiring pattern WP may be composed of Figure 3 The wiring layers described up to Figure 5 are given.

[0124] According to an illustrative embodiment of the present disclosure, when forming the card body of the smart card, that is, before integrating the electronic modules M1 to M4 into the card body of the smart card, at least one contact terminal patch and the wiring pattern WP are integrated into the smart card. After the electronic modules are integrated into the card body CB, the card body CB is referred to as the "body CB of the smart card SC".

[0125] like Fig. 9As shown, electronic modules M1 to M4 can be interconnected through wiring pattern WP. For example, electronic modules M1 and M2 can be directly connected through wiring pattern WP. Additionally or alternatively, the electronic module can be indirectly connected through wiring pattern WP and at least one contact terminal patch, and / or the electronic module can be in direct contact with one or more contact terminal patches. For example, contact terminal patches CP1 to CP3 can provide an interconnection pattern for connecting wiring patterns and / or electronic modules. This means that electronic modules M1 and M2 can be coupled via wiring pattern WP and contact terminal patch CP1, for example, electronic modules M3 and M4 can be connected via wiring pattern WP and contact terminal patch CP3. The wiring pattern can be connected to contact terminal patches CP1 to CP3 to implement antenna coil patterns. In some illustrative embodiments, one or more electronic modules can be connected to one or more contact terminal patches via direct electrical contact between one or more back contacts (not shown) of the electronic module and one or more specific conductive pads (not shown) of the one or more contact terminal patches. In this document, a cavity (not shown) formed in a card body for accommodating an electronic module may expose one or more conductive pads (not shown) in the card body, and when the electronic module is accommodated in the cavity, the one or more conductive pads exposed in the cavity may form electrical contact with one or more back side contacts (not shown) of the electronic module.

[0126] After fully reading this disclosure, those skilled in the art will understand that the contact terminal patches can be configured together with the wiring patterns and / or electronic modules according to a predetermined interconnection pattern, so that the limited space of the card body CB in the smart card SC can be effectively used to optimize the number of modules and wiring patterns integrated into the smart card SC. The positions of the contact terminal patches CP1 to CP3 can be set with greater precision. Furthermore, the conductive pads (in Fig. 9 The conductive pads (not shown) can be arranged on each contact terminal patch CP1 to CP3 with high precision, regardless of the processing to which the smart card SC is subjected. Therefore, the conductive pads (in the embodiment of FIG. 1 ) can be adjusted proportionally without compromising the positioning accuracy of the contact terminal patches CP1 to CP3. Fig. 9 The size and quantity of (not shown) are not shown.

[0127] The interconnection between the conductive pads of the contact terminal patch, the conductive pads of the electronic module (not shown) and the wiring pattern is not limited and can be performed by using any known interconnection technology, such as anisotropic or isotropic adhesive bonding, soldering, micro welding, etc.

[0128] Reference Fig.10 , schematically shows a card body 200 according to some illustrative embodiments of the present disclosure. Fig.10As shown, the card body 200 may include a contact terminal patch 220a and a contact terminal patch 220b. Although two contact terminal patches 220a and 220b are explicitly shown, this does not constitute any limitation to the present disclosure, and any number of contact terminal patches may be provided, such as one contact terminal patch or more than two contact terminal patches.

[0129] like Fig.10 As shown, each of the contact terminal patches 220a, 220b may have a plurality of conductive pads 222a and 222b, respectively. At least one of the plurality of conductive pads 222a of the contact terminal patch 220a and / or at least one of the plurality of conductive pads 222b of the contact terminal patch 220b may be connected to the wiring pattern 210 and / or to an electronic module 230 integrated into the card body 200. According to some illustrative embodiments, the electronic module 230 may be one of an LED, a chip, and the like. For example, the electronic module 230 may be directly connected to at least one of the contact terminal patches 220a and 220b, or may be indirectly connected to at least one of the contact terminal patches 220a and 220b. In this regard, Fig.10 An illustrative but non-limiting embodiment is shown in which the electronic module 230 is connected to one conductive pad of the contact terminal patch 220a and one conductive pad of the contact terminal patch 220b.

[0130] Despite Fig.10 The illustrated contact terminal patches 220a and 220b are similar to the contact terminal patches 1 shown in FIG. 1 of the present disclosure, but this does not constitute any limitation to the present disclosure, and any configuration of the plurality of conductive pads 222a, 222b on each of the contact terminal patches 220a and 220b other than the configuration explicitly depicted may be provided instead. By way of example but not limitation, at least one of the contact terminal patches 220a and 220b may be formed by the present disclosure. Figure 8 The embodiment can be implemented by using one of the contact terminal patches shown in FIG.

[0131] Continue to refer Fig.10 , the wiring pattern 210 can be set in the card body to form an antenna structure and / or loop 240 of an RFID module (not shown) by appropriately connecting the wiring pattern 210 to the conductive pads of at least one of the contact terminal patches 220a and 220b.

[0132] According to some illustrative and non-limiting embodiments herein, some conductive pads of at least one of the contact terminal patches 220a and 220b may not have any other connection to the card body and may be present to provide better mechanical stability. Fig.10 As shown, two conductive pads can directly connect the contact terminal patches 220a and 220b. Additionally or alternatively, there can be an indirect connection between the contact terminal patches 220a, 220b and the electronic module 230 that has been integrated into the pre-pressed layer inlay layer, and the card body 200 is formed by the pre-pressed layer inlay layer. In addition, the contact terminal patch 220a can have two conductive pads 222a that are directly connected to each other. In the case where there are restrictions on the connection of components (not shown) directly performed on these modules (not shown), this can help to create an interconnection between two components (not shown) on a module that is later integrated into the card body 200.

[0133] refer to Fig.10 The card body 200 shown in FIG. 1 can be used to manufacture a smart card by integrating an electronic module (not shown) into the card body 200 at the location of each of the contact terminal patches 220a and 220b. Fig.10 The card body 200 is manufactured into a smart card (not shown) having a total of two electronic modules (not shown), wherein these electronic modules (not shown) will make contact with some conductive pads provided by the contact terminal patches 220a and 220b, which are in Fig.10 In the illustration, it is not connected.

[0134] Reference Fig.11 , schematically shows in top view an illustrative embodiment for manufacturing a tape 300 having a plurality of conductive pad assemblies 330 formed thereon. In the text, a plurality of contact terminal patches (not shown) can be produced from the tape 300 by appropriately cutting the tape 300 having the assemblies 330 into tape segments. Fig.11As shown, a strip of base patch material 310 may be provided. The strip of base patch material 310 may be provided with a layer of adhesive material (not shown) located on the upper surface of the strip of patch base material 310. A plurality of conductive pads 320 may be configured on the strip of patch base material 310. For example, a plurality of conductive pads 310 may be prefabricated in a desired shape, for example by stamping out conductive pads from a metal strip (not shown) or a sheet of metal (not shown) in a desired shape. After providing a plurality of conductive pads 310, each conductive pad may be mounted to the strip of patch base material 310 in a desired configuration using a pick and place technique. Each of the conductive pads placed may be fixed to the strip of patch base material 310 in a desired configuration by curing the adhesive at the placed conductive pads, for example by thermal curing or by UV curing or chemically curing the adhesive at each placed conductive pad. The tape 300 having the plurality of conductive pad assemblies 330 may be an intermediate tape wound into a reel, which may later be provided to a subsequent reel-to-reel process (e.g., as Figure 6a or 7a) and the gasket can be transferred from the belt 300 to the corresponding Figure 6a In the band B1 or Figure 7a In this embodiment, the wound tape 300 may be Figure 6a Scroll R2 or Figure 7a Scroll R2' in.

[0135] Reference Fig.12 , an optional additional process step is shown. This additional process step can be applied when a plurality of patches are produced in a reel-to-reel process, for example in the context of FIGS. 6 and 7 , wherein the conductive pads are cut or punched out of a strip of conductive pad material (see strip B2 in FIG. 6 and strip B2 in FIG. 7 ) by means of a rotary cutting or punching tool. When a rotary cutting or punching tool is used, the conductive pads are produced due to the cutting or punching geometry of the rotary cutting or punching tool as in Fig.12 The conductive pad 420a is a curved conductive pad shown in the figure. It should be noted that when the cutting or punching process is performed without using a rotating tool, such a curved conductive pad 420a is not obtained. Fig.12 In the process shown, a single conductive pad 420a is mounted on a reel 440 (see also Figure 6a-6c The tape B1 is provided by reel R1 and by Figure 7a-7c After being mounted on a base patch layer provided by a tape B1 ′ provided by a reel R1 ′ in FIG. 1 , it may happen that the conductive pad is mounted in a deformed shape due to the spin cutting process and therefore does not have a flat shape, which may impair the mechanical attachment of the conductive pad to the base patch layer.

[0136] like Fig.12As shown, a calendaring process 450 is applied to deform the pads into a generally flat shape 420b when mounted on the patch base by pressing each patch between two reels, so that the deformation of the conductive pad 420a is corrected.

[0137] Reference Fig.13a and Fig.13b , schematically shows another embodiment of a 3D-shaped conductive pad structure 520. The 3D-shaped conductive pad structure 520 may have a substantially Z-shaped shape, such as two planar portions connected by a stepped portion. When the 3D-shaped conductive pad structure 520 is integrated into the patch base layer 510, the upper planar portion is located on the top of the patch base layer 510, and the lower planar portion is accommodated in the concave portion of the patch base layer 510, as shown in FIG. Fig.13a For example, in an illustrative process flow, a strip of patch substrate material (not shown) may be provided, such as strip B1 in FIG. 6 or strip B1' in FIG. 7. The strip of patch substrate material (not shown) may be subjected to a process for forming at least one recess in the strip of patch substrate material (not shown), such as may correspond to Figure 6a In this embodiment, as shown in FIG. Figure 6a The shown coupling hole BH may be a corresponding recess. Alternatively, the size of the recess may be larger than the coupling hole, for example, a lengthy recess.

[0138] refer to Fig.13a, a strip of conductive gasket material (not shown) may be disposed over a strip of patch base material (not shown), and conductive gasket strips (not shown) may be cut or punched out by means of a rotary cutting or punching tool (not shown) and the conductive gasket strips (not shown) may be deformed under pressure of a pressing tool 540, so that each conductive gasket strip is deformed under pressure into a 3D-shaped conductive gasket structure 520, wherein the lower planar portion of the conductive gasket structure 520 is deformed into a recess in the patch base layer 510 using the pressing tool 540, and the upper planar portion is located on the upper surface of the patch base layer 510 and is located on top of the patch base layer 510. This process may be used in a reel-to-reel patch manufacturing process, in which a 3D-shaped conductive gasket structure 520 is formed by deforming a portion of the conductive gasket strip into a recess of the patch base layer 510. Advantageously, the upper planar portion of each conductive pad 520 on the patch base layer 510 can be positioned at different height levels depending on the thickness of the pre-laminated inlay / card body (not shown). When the lower planar portion of the conductive pad 520 is positioned in the recess of the patch base layer 510, easier access to the conductive pad 520 leading to the wiring inside the card can be provided. When the electronic module (not shown) is integrated into the card body, since the lower planar portion of the 3D-formed conductive pad structure 520 is accommodated at a lower level compared to the upper planar portion of the conductive pad structure 520 (which may be exposed to contact with the backside contacts (not shown) of the electronic module (not shown)), the contact with the internal wiring can be protected from damage when a milling process is performed.

[0139] refer to Fig.13a For mechanical stability reasons, a liner 530 may be provided below the patch base layer 510, at least temporarily until a contact terminal patch (not shown) is cut out from the patch base layer 510 after the conductive pads 520 are mounted to the patch base layer 510. For example, the liner 530 may be removed before laminating a contact terminal patch (not shown) having a plurality of conductive pads 520 into a pre-laminated inlay body.

[0140] Reference Fig.14 , some illustrative embodiments are shown, in which a 3D-shaped conductive pad 620 having a generally L-shaped or C-shaped (or U-shaped) shape is employed. Fig.14 In step S1 of the present invention, a conductive gasket 620 is provided. The conductive gasket 620 has a planar base portion 622 and at least one leg portion 624 extending perpendicularly to the base portion 622 and away from the base portion 622. When the conductive gasket 620 is mounted to the patch base layer 610, the base portion 622 is configured to lie flat on the patch base layer 610, and the leg portion 624 is oriented approximately perpendicularly to the base portion 622.

[0141] like Fig.14As shown in step S2, the legs 624 (one leg 624 (not shown) of the substantially L-shaped conductive pad and two legs 624 of the substantially C-shaped conductive pad) are inserted into the holes 612 (e.g., corresponding to the holes 612) formed in the patch base layer 610. Figures 6a to 6c For example, the pattern of the coupling holes 612 may be formed according to the conductive gasket 620 so that the conductive gasket 620 may be mounted to the patch base layer 610 by inserting the legs 624 into the holes 612 of the patch base layer 610.

[0142] Subsequently, in step S3, the leg portion 624 may be deformed to lie flat on the side of the lower surface of the patch base layer 610, while the base portion 622 of the conductive pad 620 lies flat along the upper surface of the patch base layer 610. Therefore, the conductive pad 620 is mechanically fixed to the patch base layer 610, and the conductive pad 620 may be contacted from two opposite sides of the patch base layer 610. For example, contact with the conductive pad 620 may be achieved by contacting the base portion 622 at the upper surface of the patch base layer, while other contact may be achieved by contacting the leg portion 624 of the conductive pad 620 at the lower side of the patch base layer 610.

[0143] As Fig.14 The advantage of the embodiment is that the crimping of the conductive gasket 620 to the patch base layer 610 also achieves the fixation of the conductive gasket 620 to the patch base layer 610 without the need to use additional glue for fixation.

[0144] According to some illustrative embodiments, the process may include steps S1 to S3. The process may be integrated into any of the reel-to-reel processes described above. For example, the corresponding process may include:

[0145] During cutting or punching of the conductive pad from the strip of contact material, the conductive pad may be deformed into a 3D shape having a base portion and at least one leg extending substantially vertically away from the base portion.

[0146] - The 3D formed gasket may then be placed onto the patch base layer by positioning at least one leg into a hole in the patch base layer.

[0147] - Subsequently, in a crimping process, at least one leg may be folded to lie flat beside the patch substrate layer, thereby securing the conductive pad to the patch substrate layer.

Claims

1. A method of forming a pre-laminated inlay body for a smart card, the method comprising: preparing at least one contact terminal patch, the at least one contact terminal patch being formed by a patch base layer and a plurality of conductive pads disposed on a surface of the patch base layer, wherein the plurality of conductive pads are arranged on the patch base layer according to a predetermined interconnection design; preparing a pre-laminated inlay sheet having a plurality of openings formed therein, each opening being formed so that it receives a specific one of the conductive pads; mounting the at least one contact terminal patch to the pre-laminated inlay sheet; as well as preparing a cover layer having at least one recess formed therein, the at least one recess being formed to accommodate the at least one contact terminal patch, The preparation of the pre-laminated inlay sheet further comprises: The cover layer is mounted to the pre-laminated inlay sheet in a manner aligned with the plurality of openings so that the at least one contact terminal patch received in the at least one recess in the cover layer is aligned with the plurality of openings in the pre-laminated inlay sheet to receive the plurality of conductive pads of the at least one contact terminal patch into the plurality of openings of the pre-laminated inlay sheet. 2 . The method according to claim 1 , wherein the thickness of the cover layer is substantially equal to the thickness of the patch base layer of the at least one contact terminal patch. 3 . The method according to claim 1 , wherein the thickness of the pre-laminated inlay sheet is equal to the height of the conductive pads on the patch base layer of the at least one contact terminal patch.

4. The method according to claim 1, wherein preparing the at least one contact terminal patch comprises: preparing the patch base layer having a plurality of bonding holes aligned with the predetermined interconnection design, and then The plurality of conductive pads are formed on the patch base layer such that each of the coupling holes is directly disposed below one of the plurality of conductive pads.

5. The method according to claim 1, wherein the at least one contact terminal patch is prepared in a reel-to-reel process, comprising: combining a roll of tape of patch base material and a roll of tape of conductive spacer material in a stacked configuration such that one of the tapes extends on top of another of the tapes; as well as The plurality of conductive pads are cut from the strip of conductive pad material extending in the stacked configuration with the strip of patch base layer material and the strip of patch base layer material is provided with the plurality of conductive pads.

6. The method according to claim 5, further comprising: A plurality of conductive pads are subjected to pressure to form the conductive pads into a planar shape and / or to mount the conductive pads to the strip of patch base layer material and / or to deform at least a portion of each of the conductive pads.

7. The method according to claim 5, further comprising: Slit tapes of coiled conductive gasket material; as well as At least one contact terminal patch is cut from the strip of conductive pad material provided with the plurality of conductive pads.

8. The method according to claim 5, further comprising: applying an adhesive coating to the strip of conductive gasket material before combining the two strips, wherein the plurality of conductive pads are secured to the strip of patch base layer by means of the adhesive coating.

9. The method of claim 8, wherein the adhesive coating is one of: i) a curable adhesive, the curable adhesive being of a heat curable or UV curable or chemically bonded type, wherein the method further comprises: curing the adhesive after providing the strip of patch base material with the plurality of conductive pads, ii) one component of a two-component adhesive, wherein the other component of the two-component adhesive is applied to the strip of conductive spacer material prior to providing the strip of patch substrate material, and iii) Pressure sensitive adhesives.

10. The method according to claim 1, wherein preparing the at least one contact terminal patch comprises: The at least one contact terminal patch is provided with edge markings.

11. The method according to claim 1, further comprising: preparing a wiring layer by providing a wiring base layer having a wiring pattern formed on one surface of the wiring base layer; and mounting the wiring layer to the pre-laminated inlay sheet having the at least one contact terminal patch mounted thereon, wherein the wiring pattern faces the at least one contact terminal patch.

12. The method according to claim 11, wherein the patch base layer of the at least one contact terminal patch has a bonding hole formed therein, and the wiring layer has a bonding hole formed therein, the wiring layer being mounted to the patch base layer of the at least one contact terminal patch so that the bonding hole of the wiring layer and the bonding hole of the patch base layer are aligned to be approximately in line, Wherein mounting the wiring layer to the pre-laminated inlay sheet comprises: The conductive lines of the wiring pattern exposed by the bonding holes of the wiring layer are bonded to the conductive pads exposed by the bonding holes in the chip base layer.

13. The method of claim 11, wherein the wiring layer faces the plurality of conductive pads of the at least one contact terminal patch, and conductive lines of the wiring pattern are connected to the plurality of conductive pads to mount the wiring layer to the pre-laminated inlay sheet.

14. The method of claim 11, wherein the wiring pattern alone or in combination with at least a subset of the plurality of conductive pads implements an antenna pattern.

15. A method of forming a smart card, comprising: forming a pre-laminated inlay body, the pre-laminated inlay body being formed according to the method of claim 1; forming one or more covering layers on the pre-laminated inlay sheet or on the cover layer to form a card body; and Integrate one or more electronic modules into the card body, Wherein the one or more electronic modules and the wiring pattern are at least partially coupled to the at least one contact terminal patch.

16. A pre-laminated inlay body for a smart card, the pre-laminated inlay body comprising: at least one contact terminal patch, the at least one contact terminal patch comprising a patch base layer and a plurality of conductive pads disposed on a surface of the patch base layer, wherein the plurality of conductive pads are configured on the patch base layer according to a predetermined interconnection design; as well as a pre-laminated inlay sheet having a plurality of openings, each opening accommodating a specific one of said conductive pads, a cover layer having at least one recess formed therein, the at least one recess accommodating the at least one contact terminal patch, wherein the at least one contact terminal patch is mounted to the pre-laminated inlay sheet, wherein the cover layer is mounted to the pre-laminated inlay sheet in an aligned manner with the plurality of openings so that the at least one contact terminal patch received in the at least one recess in the cover layer is aligned with the plurality of openings in the pre-laminated inlay sheet, and wherein the plurality of conductive pads of the at least one contact terminal patch are received into the plurality of openings of the pre-laminated inlay sheet.

17. The pre-laminated inlay body according to claim 16, wherein the thickness of the cover layer is substantially equal to the thickness of the patch base layer of the at least one contact terminal patch.

18. The pre-laminated inlay body according to claim 16, wherein the thickness of the pre-laminated inlay sheet is equal to the height of the conductive pad on the patch base layer of the at least one contact terminal patch.

19. The pre-laminated inlay body of claim 16, wherein the at least one contact terminal patch comprises a plurality of bonding holes formed in the patch base layer, the bonding holes being aligned with the predetermined interconnection design, wherein each bonding hole is disposed directly below one of the plurality of conductive pads.

20. The pre-laminated inlay body of claim 16, wherein the plurality of conductive pads are secured to the patch base layer by an adhesive.

21. The pre-laminated inlay body according to claim 16, wherein the at least one contact terminal patch is provided with edge markings.

22. The pre-laminated inlay body according to claim 16, further comprising a wiring layer provided by a wiring pattern formed on one surface of a wiring base layer, wherein the wiring layer is mounted to the pre-laminated inlay sheet facing the at least one contact terminal patch.

23. A pre-laminated inlay body according to claim 22, wherein the patch base layer of the at least one contact terminal patch has a bonding hole formed therein, and the wiring layer also has a bonding hole formed therein, and the wiring layer is installed to the patch base layer of the at least one contact terminal patch so that the bonding holes of the wiring layer and the bonding holes of the patch base layer are aligned to be roughly in a line, wherein the wires of the wiring pattern pass through the bonding holes to be bonded to the conductive pad.

24. The pre-laminated inlay body according to claim 22, wherein the wiring layer faces the plurality of conductive pads of the at least one contact terminal patch, and conductive lines of the wiring pattern are connected to the plurality of conductive pads.

25. The pre-laminated inlay body of claim 22, wherein the wiring pattern alone or in combination with at least a subset of the plurality of conductive pads implements an antenna pattern.

26. The pre-laminated inlay body of claim 16, wherein the conductive pad is a copper pad of at least one of a linear, L-shaped, square, rectangular, and circular shape when viewed in a top view.

27. The pre-laminated inlay body of claim 16, wherein each of the conductive pads is a 3D formed conductive pad structure.

28. The pre-laminated inlay body of claim 27, wherein the patch base layer has a plurality of recesses or holes into which the conductive pads are partially inserted.

29. Smart cards, including: A card body having a pre-laminated inlay body according to claim 16 and one or more covering layers formed on the pre-laminated inlay sheet or on the cover layer, and one or more electronic modules integrated into the card body, Wherein the one or more electronic modules and the wiring pattern are at least partially coupled to the at least one contact terminal patch.

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