Smart card fingerprint recognition module package structure and manufacturing method thereof

Abstract

This invention discloses a smart card fingerprint recognition module packaging structure, including a flexible first insulating layer, a first patterned circuit layer, a second patterned circuit layer, at least one first conductive post, a flexible second insulating layer, a shielding layer, at least one second conductive post, and a flexible insulating protective layer. A portion of the first patterned circuit layer serves as a first sensing circuit, and a portion of the second patterned circuit layer serves as a second sensing circuit and an external pad. The first and second sensing circuits are staggered and do not overlap in their longitudinal projection. Furthermore, the area of ​​the shielding layer corresponding to the first and second sensing circuits is designed as a hollow structure to serve as a fingerprint sensing area. Additionally, this invention also discloses a method for manufacturing the smart card fingerprint recognition module packaging structure.

Description

Technical Field

[0001] This invention relates to a capacitive fingerprint sensing and identification module structure, and more particularly to a smart card fingerprint identification module packaging structure and its manufacturing method. Background Technology

[0002] The use of contact and contactless IC cards is a widespread global trend. Embedding various contact card chips into different types of contactless cards enables widespread application and convenient consumption. Applications include credit cards, debit cards, campus cards, community resident cards, access control cards, and public transportation cards. The latest IC fingerprint chip debit cards or IC fingerprint chip credit cards even have fingerprint recognition capabilities; the card senses and transmits fingerprint verification information to the bank as proof of transfer or payment approval.

[0003] Current IC fingerprint chip cards combine the fingerprint recognition module directly with the fingerprint recognition sensing chip in a single package. This results in an excessively large fingerprint recognition sensing chip, high manufacturing costs, and significant limitations on its placement, leading to poor anti-static capabilities. Summary of the Invention

[0004] In view of the problems of the prior art, the purpose of the present invention is to provide a smart card fingerprint recognition module packaging structure and manufacturing method thereof, so as to enable the capacitive fingerprint sensing recognition module to be packaged separately on a substrate, so as to be separately packaged on a printed circuit board from the fingerprint recognition sensing chip, thereby significantly reducing production costs and meeting the requirements of flexible layout to increase anti-static capability. Furthermore, the invention effectively utilizes soft and flexible dielectric or insulating materials, so that it can withstand appropriate bending to ensure that no functional failure occurs.

[0005] To achieve the above objectives, this invention provides a smart card fingerprint recognition module packaging structure, which includes a flexible first insulating layer having opposing first and second surfaces; a first patterned circuit layer embedded in the first insulating layer with one side exposed on the first surface; at least one first conductive post embedded in the first insulating layer with one end electrically connected to the first patterned circuit layer and the other end exposed on the first insulating layer; a second patterned circuit layer disposed on the second surface of the first insulating layer and electrically connected to the exposed end of the first conductive post; and a portion of the second surface of the first insulating layer covered by the first patterned circuit layer. The second patterned circuit layer and the second sensing circuit, and the insulating protective layer exposing the outer pad, a second insulating layer having opposing third and fourth surfaces, disposed on the first surface of the first insulating layer to cover the first patterned circuit layer and the first surface of the first insulating layer, at least one second conductive post embedded in the second insulating layer, with one end face of the second conductive post electrically connected to the first patterned circuit layer and the other end face exposed on the third surface of the second insulating layer, and a shielding layer composed of a patterned metal layer disposed on the third surface of the second insulating layer and electrically connected to the exposed end face of the second conductive post. A portion of the first patterned circuit layer serves as the first sensing circuit, and a portion of the second patterned circuit layer serves as the second sensing circuit and the outer pad; the fourth surface of the second insulating layer is coplanar with the first surface of the first insulating layer; and the shielding layer, corresponding to the first and second sensing circuits, is designed with a hollow structure in the longitudinal projection area to serve as a fingerprint sensing area.

[0006] In another embodiment of the present invention, a method for manufacturing a smart card fingerprint recognition module packaging structure is provided, comprising the following steps: providing a first carrier plate; forming a first patterned circuit layer and a first conductive pillar on the first carrier plate using photolithography and electroplating techniques, wherein the first conductive pillar is erected on the first patterned circuit layer, and a portion of the first patterned circuit layer serves as a first sensing circuit; forming a first insulating layer on the first carrier plate to cover the first patterned circuit layer and the first conductive pillar, and removing a portion of the first insulating layer to expose one end face of the first conductive pillar; forming a second patterned circuit layer on the first insulating layer using photolithography and electroplating techniques, and electrically connecting it to the exposed end face of the first conductive pillar, wherein a portion of the second patterned circuit layer serves as a second sensing circuit, and a portion of the second patterned circuit layer serves as an external pad; forming an insulating protective layer on the first insulating layer to cover a portion of the second patterned circuit layer. The system comprises: a patterned circuit layer and a second sensing circuit, exposing an external pad; providing a second carrier plate to be bonded to an insulating protective layer, and completely removing the first carrier plate to expose one side surface of the first patterned circuit layer and one side surface of the first insulating layer; forming a second conductive pillar on the exposed surface of the first patterned circuit layer using photolithography and electroplating techniques; forming a second insulating layer on the surface of the first insulating layer to cover the exposed first patterned circuit layer and the second conductive pillar, and removing a portion of the second insulating layer to expose one end face of the second conductive pillar; forming a patterned metal layer on the second insulating layer using photolithography and electroplating techniques as a shielding layer, and electrically connecting it to the exposed end face of the second conductive pillar, wherein the shielding layer is formed as a hollow structure corresponding to the area of ​​the first sensing circuit and the second sensing circuit in the longitudinal projection, serving as a fingerprint sensing area; and removing the second carrier plate to expose the insulating protective layer and the external pad.

[0007] In another embodiment of the present invention, an IC fingerprint chip card structure is provided, which includes a smart card fingerprint recognition module packaging structure, an interposer, a fingerprint recognition sensing chip, and a printed circuit board. The smart card fingerprint recognition module packaging structure can be electrically connected to the printed circuit board via external bump pads and solder balls, and can be separately packaged with the fingerprint recognition sensing chip (via the interposer) on the printed circuit board.

[0008] Compared with the prior art, the smart card fingerprint recognition module packaging structure provided by this invention integrates the capacitive fingerprint sensing recognition module into a flexible and flexible packaging substrate and packages it separately from the sensing chip. Therefore, in addition to the effective reduction in the size of the packaged sensing chip to reduce costs, it can also avoid functional failure due to electrostatic discharge generated by the recognition module. Thus, it can effectively improve the anti-static capability and ensure that the card products made with this invention can still retain the fingerprint recognition function when subjected to external bending. Attached Figure Description

[0009] Figure 1 This is a cross-sectional schematic diagram of the packaging structure of the smart card fingerprint recognition module of the present invention.

[0010] Figure 2 This is a schematic diagram of the IC fingerprint chip card structure of the present invention.

[0011] Figure 3 This is a flowchart illustrating the manufacturing method of the smart card fingerprint recognition module packaging structure of the present invention.

[0012] Figures 4A to 4H This is a schematic diagram of an embodiment of the manufacturing method of the smart card fingerprint recognition module packaging structure of the present invention.

[0013] Explanation of reference numerals in the attached figures: 100 - Smart card fingerprint recognition module packaging structure; 119 - First surface; 121 - Second surface; 120 - First insulating layer; 130 - Insulating protective layer; 140 - Shielding layer; 142 - Patterned metal layer; 150 - Second insulating layer; 151 - Third surface; 152 - Fourth surface; 160 - Fingerprint sensing area; 134 - External pad; 122 - First patterned circuit layer; 123 - First sensing circuit; 124 - First conductive pillar; 126 - Second conductive pillar; 132 - Second patterned circuit layer; 133 - Second sensing circuit; 110 - First carrier plate; 112 - Second carrier plate; 300 - IC fingerprint chip card; 210 - Encapsulation solder ball; 220 - Intermediate plate; 230 - Fingerprint recognition sensing chip; 240 - Printed circuit board; S10 to S100 - Steps. Detailed Implementation

[0014] The following specific embodiments illustrate the implementation of the present invention. Those skilled in the art can easily understand other advantages and effects of the present invention from the content disclosed in this specification.

[0015] It should be understood that the structures, proportions, sizes, etc., illustrated in the accompanying drawings are merely for illustrative purposes to aid those skilled in the art and to facilitate understanding and reading. They are not intended to limit the scope of the invention and therefore have no substantial technical significance. Any modifications to the structure, changes in proportions, or adjustments to the size, without affecting the effectiveness and purpose of the invention, should still fall within the scope of the technical content disclosed in this invention. Furthermore, the terms such as "above," "first," "second," and "a" used in this specification are merely for clarity and not intended to limit the scope of the invention. Any related changes or adjustments, without substantially altering the technical content, should also be considered within the scope of the invention.

[0016] Please consider. Figure 1The diagram shown is a cross-sectional schematic of the smart card fingerprint recognition module packaging structure of the present invention. It can be seen that the smart card fingerprint recognition module packaging structure 100 of the present invention includes a first insulating layer 120, a first patterned circuit layer 122, at least one first conductive post 124, a second patterned circuit layer 134, an insulating protective layer 130, a second insulating layer 150, at least one second conductive post 126, and a shielding layer 140.

[0017] The first insulating layer 120 is made of a soft and flexible dielectric or insulating material and has a first surface 119 and a second surface 121 disposed opposite to each other.

[0018] The first patterned circuit layer 122 is embedded in the first insulating layer 120, and one side of it is exposed on the first surface 119 of the first insulating layer 120. A portion of the first patterned circuit layer 122 serves as the first sensing circuit 123.

[0019] The first conductive post 124 is embedded in the first insulating layer 120, and one end face of the first conductive post 124 is electrically connected to the first patterned circuit layer 122, while the other end face is exposed on the second surface 121 of the first insulating layer 120; wherein, the first conductive post 124 can be made into a metal column, such as a copper column.

[0020] The second patterned circuit layer 132 is disposed on the second surface 121 of the first insulating layer 120 and electrically connected to the exposed end face of the first conductive post 124. A portion of the second patterned circuit layer 132 serves as the second sensing circuit 133, while another portion serves as an external pad 134 to electrically connect the fingerprint recognition sensing chip 230 and the printed circuit board 240 (please refer to [reference]). Figure 2 (As shown). The second sensing line 133 and the first sensing line 123 are staggered and do not overlap in longitudinal projection, and the line width or line spacing is no greater than 30 micrometers (≤30 micrometers) to meet the signal sensitivity requirements.

[0021] The insulating protective layer 130 is made of a soft and flexible insulating or dielectric material and is disposed on the second surface 121 of the first insulating layer 120 to cover part of the second patterned circuit layer 132 and the second sensing circuit 133, and expose the external pad 134. Therefore, the external pad 134 is not covered by the insulating protective layer 130.

[0022] The second insulating layer 150 is made of a flexible dielectric or insulating material and has opposing third and fourth surfaces 151 and 152. It is disposed on the first surface 119 of the first insulating layer 120 to cover the exposed first patterned circuit layer 122 and the first surface 119 of the first insulating layer 120. The fourth surface 152 of the second insulating layer 150 is coplanar with the first surface 119 of the first insulating layer 120.

[0023] The second conductive post 126 is embedded in the second insulating layer 150, and one end face of the second conductive post 126 is electrically connected to the first patterned circuit layer 122, while the other end face is exposed on the third surface 151 of the second insulating layer 150.

[0024] The shielding layer 140 is composed of a patterned metal layer 142 disposed on the third surface 151 of the second insulating layer 150, and is electrically connected to the exposed end face of the second conductive post 126. The shielding layer 140 has a hollow structure in the longitudinal projection area corresponding to the first sensing line 123 and the second sensing line 133, serving as a fingerprint sensing area 160.

[0025] The first patterned circuit layer 122 and the second patterned circuit layer 132 are fabricated using photolithography and electroplating techniques to form fine-pitch circuits with a line width and spacing of no more than 30 micrometers (≤30 micrometers) to meet signal sensitivity requirements. More preferably, the first patterned circuit layer 122 can be fabricated as an embedded circuit, with a line width and spacing of no more than 15 micrometers (≤15 micrometers). Furthermore, the total thickness of the smart card fingerprint recognition module packaging structure 100 of the present invention can be no more than 150 micrometers (≤150 micrometers).

[0026] The first insulating layer 120, the insulating protective layer 130, and the second insulating layer 150 are composed of soft and flexible dielectric or insulating materials, such as dielectric materials based on soft polyimide (PI) and soft epoxy resin, or photosensitive dielectric materials, or other soft insulating materials.

[0027] Please consider this further. Figure 2The diagram shows a schematic of the IC fingerprint chip card structure of the present invention. The IC fingerprint chip card 300 includes a smart card fingerprint recognition module packaging structure 100, an interposer 220, a fingerprint recognition sensing chip 230, and a printed circuit board 240. The smart card fingerprint recognition module packaging structure 100 is electrically connected to the printed circuit board 240 via a bump pad 134 and solder balls 210, and can be separately packaged with the fingerprint recognition sensing chip 230 (via the interposer 220) on the printed circuit board 240.

[0028] The smart card fingerprint recognition module packaging structure 100 of the present invention serves as the fingerprint sensing structure of the IC fingerprint chip card 300. That is, after a user inserts the IC fingerprint chip card 300 into a card reader, simply placing their finger on the sensing area 160 within the smart card fingerprint recognition module packaging structure 100 will cause the fingerprint recognition sensing chip 230 within the IC fingerprint chip card 300 to automatically process the relevant sensing information and transmit the fingerprint verification information to the bank as the basis for transfer or payment approval.

[0029] Please consider this further. Figure 3 The diagram shown is a flowchart of the manufacturing method of the smart card fingerprint recognition module packaging structure of the present invention (please refer to the diagram for further information). Figures 4A to 4H The diagram shown is a schematic diagram of the manufacturing method of the smart card fingerprint recognition module packaging structure of the present invention.

[0030] First, step S10 (please refer to the instructions) Figure 4A As shown, a first carrier plate 110 is provided. The first carrier plate 110 is a metal substrate used to carry and support subsequent processes of the smart card fingerprint recognition module packaging structure 100, such as fabricating the conductive lines and sensing lines of the smart card fingerprint recognition module packaging structure 100.

[0031] Step S20 (please refer to the instructions) Figure 4B As shown, a first patterned circuit layer 122 and at least one first conductive pillar 124 are formed on the first carrier plate 110 using photolithography and electroplating techniques. Part of the first patterned circuit layer 122 serves as a first sensing circuit 123.

[0032] Step S30 (please refer to the instructions) Figure 4C As shown, a first insulating layer 120 is formed on the first carrier plate 110 using a flexible dielectric or insulating material to cover the first patterned circuit layer 122 and the first conductive post 124. A portion of the first insulating layer 120 is removed to expose one end face of the first conductive post 124. The first insulating layer 120 has a first surface 119 and a second surface 121 that are disposed opposite to each other.

[0033] Step S40 (please refer to the instructions) Figure 4D As shown, a second patterned circuit layer 132 is formed on the second surface 121 of the first insulating layer 120 using photolithography and electroplating techniques, and is electrically connected to the exposed end face of the first conductive post 124. Part of the second patterned circuit layer 132 serves as the second sensing circuit 133 and the external pad 134.

[0034] Step S50 (please refer to the instructions) Figure 4E As shown, an insulating protective layer 130 is formed on the second surface 121 of the first insulating layer 120 using a soft, flexible insulating or dielectric material through a photolithography process. This layer covers a portion of the second patterned circuit layer 132 and the second sensing circuit 133, exposing the external pad 134. Alternatively, the external pad 134 may be selectively subjected to an anti-oxidation surface treatment. This surface treatment may be electroplating or electroless plating of nickel / gold (Ni / Au) or nickel / palladium / gold (Ni / Pd / Au).

[0035] Step S60 (please refer to the instructions) Figure 4F As shown, a second carrier plate 112 of another metal material is provided to be bonded to the insulating protective layer 130, and the first carrier plate 110 is completely removed to expose one side surface of the first patterned circuit layer 122 and the first surface 119 of the first insulating layer 120.

[0036] Step S70 (please refer to the instructions) Figure 4G As shown, at least one second conductive pillar 126 is formed on the exposed surface of the first patterned circuit layer 122 using photolithography and electroplating techniques; wherein, the second conductive pillar 126 can be made into a metal pillar, such as a copper pillar.

[0037] Step S80 (please refer to the instructions) Figure 4G As shown, a second insulating layer 150 is formed on the first surface 119 of the first insulating layer 120 using a soft and flexible dielectric or insulating material to cover the second conductive post 126, the first patterned circuit layer 122, and the first surface 119 of the first insulating layer 120, and a portion of the second insulating layer 150 is removed to expose one end face of the second conductive post 126.

[0038] Step S90 (please refer to the instructions) Figure 4HAs shown, a patterned metal layer 142 is formed on the second insulating layer 150 using photolithography and electroplating techniques to serve as a shielding layer 140. This shielding layer 140 is electrically connected to the exposed end face of the second conductive post 126. Furthermore, the area of ​​the shielding layer 140 corresponding to the first sensing line 123 and the second sensing line 133 in the longitudinal projection is formed as a hollow structure to serve as a fingerprint sensing area 160. Alternatively, the shielding layer 140 can be selectively subjected to a surface treatment to prevent oxidation. This surface treatment can be electroplating or electroless plating of nickel / gold (Ni / Au) or nickel / palladium / gold (Ni / Pd / Au).

[0039] Finally, in step S100, the second carrier plate 112 is removed to expose the insulating protective layer 130 and the outer pad 134, thus obtaining the desired result. Figure 1 The smart card fingerprint recognition module packaging structure 100 shown is illustrated.

[0040] Furthermore, the manufacturing process described above in this invention can also be implemented using large-format packaging substrate technology, thus more effectively reducing the manufacturing cost of the smart card fingerprint recognition module packaging structure 100.

[0041] As described above, compared with existing fingerprint recognition smart cards, the present invention has the following advantages:

[0042] 1. The unique design of the present invention, in which the smart card fingerprint recognition module packaging structure 100 and the fingerprint recognition sensing chip 230 are separately packaged on the printed circuit board 240, can effectively increase the flexibility of fingerprint recognition product design and component layout.

[0043] 2. The unique design of this invention, in which the smart card fingerprint recognition module packaging structure 100 and the fingerprint recognition sensing chip 230 are separately packaged on the printed circuit board 240, can effectively avoid interference between the smart card fingerprint recognition module packaging structure 100 and the fingerprint recognition sensing chip 230. Therefore, it can prevent the fingerprint recognition sensing chip 230 from being damaged by electrostatic discharge generated by the smart card fingerprint recognition module packaging structure 100 and thus effectively improve the anti-static capability.

[0044] 3. The unique design of this invention, in which the smart card fingerprint recognition module packaging structure 100 and the fingerprint recognition sensing chip 230 are separately packaged on the printed circuit board 240, can effectively reduce the size and cost of the fingerprint recognition sensing chip 230.

[0045] 4. The present invention features a unique design in which the smart card fingerprint recognition module packaging structure 100 is manufactured as a packaging carrier board structure, which enables the use of large-format packaging carrier board technology, thereby effectively reducing the manufacturing cost of the smart card fingerprint recognition module packaging structure 100.

[0046] 5. The present invention features a unique design in which the smart card fingerprint recognition module packaging structure 100 is made into a flexible and foldable packaging substrate, thus ensuring that the IC fingerprint chip card can still maintain its functionality when subjected to external bending force.

[0047] The above embodiments are merely illustrative of the principles and effects of the present invention and are not intended to limit the invention. Any person skilled in the art can make modifications to the above embodiments without departing from the spirit and scope of the invention. Therefore, the scope of protection of the present invention should be as set forth in the claims.

Claims

1. A smart card fingerprint recognition module package structure, characterized in that, include: A first insulating layer having a first surface and a second surface opposite to each other; A first patterned circuit layer is embedded in the first insulating layer, with one side exposed on the first surface of the first insulating layer, and a portion of the first patterned circuit layer serves as a first sensing circuit. At least one first conductive post is embedded in the first insulating layer, and one end face of the first conductive post is electrically connected to the first patterned circuit layer, while the other end face is exposed on the second surface of the first insulating layer. A second patterned circuit layer is disposed on the second surface of the first insulating layer and electrically connected to the exposed end face of the first conductive post, wherein a portion of the second patterned circuit layer serves as a second sensing circuit and a portion of the second patterned circuit layer serves as an external pad. An insulating protective layer is disposed on the second surface of the first insulating layer to cover a portion of the second patterned circuit layer and the second sensing circuit, and to expose the outer pad; A second insulating layer has a third surface and a fourth surface opposite to each other, and is disposed on the first surface of the first insulating layer to cover the first patterned circuit layer and the first surface of the first insulating layer, wherein the fourth surface of the second insulating layer is coplanar with the first surface of the first insulating layer; At least one second conductive post is embedded in the second insulating layer, and one end face of the second conductive post is electrically connected to the first patterned circuit layer, while the other end face is exposed on the third surface of the second insulating layer; and A shielding layer is formed by a patterned metal layer disposed on the third surface of the second insulating layer and electrically connected to the exposed end face of the second conductive post. The shielding layer is configured as a hollow structure in the longitudinal projection area corresponding to the first sensing line and the second sensing line, so as to serve as a fingerprint sensing area.

2. The smart card fingerprint recognition module packaging structure as described in claim 1, characterized in that, The first insulating layer, the second insulating layer, and the insulating protective layer are made of a soft, flexible dielectric material or an insulating material.

3. The smart card fingerprint recognition module packaging structure as described in claim 1, characterized in that, The first sensing line and the second sensing line are offset from each other and do not overlap in the longitudinal projection.

4. The smart card fingerprint recognition module packaging structure as described in claim 1, characterized in that, The linewidth and spacing of the first sensing line and / or the second sensing line are ≤30 micrometers.

5. The smart card fingerprint recognition module packaging structure as described in claim 1, characterized in that, The total thickness of the smart card fingerprint recognition module packaging structure is ≤150 micrometers.

6. A method for manufacturing a smart card fingerprint recognition module packaging structure, characterized in that, Includes the following steps: Provide a first load-bearing plate; A first patterned circuit layer and at least one first conductive pillar are formed on the first carrier plate using photolithography and electroplating techniques, wherein the first conductive pillar is erected on the first patterned circuit layer, and a portion of the first patterned circuit layer serves as a first sensing circuit. A first insulating layer is formed on the first carrier plate to cover the first patterned circuit layer and the first conductive post, and a portion of the first insulating layer is removed to expose one end face of the first conductive post; A second patterned circuit layer is formed on the first insulating layer using photolithography and electroplating techniques, and is electrically connected to the exposed end face of the first conductive post. Part of the second patterned circuit layer serves as a second sensing circuit, while part of the second patterned circuit layer serves as an external pad. An insulating protective layer is formed on the first insulating layer to cover a portion of the second patterned circuit layer and the second sensing circuit, and to expose the outer pad. A second carrier plate is provided to be bonded to the insulating protective layer, and the first carrier plate is completely removed to expose one side surface of the first patterned circuit layer and one side surface of the first insulating layer; At least one second conductive pillar is formed on the exposed surface of the first patterned circuit layer using photolithography and electroplating techniques. A second insulating layer is formed on the surface of the first insulating layer to cover the exposed first patterned circuit layer and the second conductive post, and a portion of the second insulating layer is removed to expose one end face of the second conductive post. A patterned metal layer is formed on the second insulating layer using photolithography and electroplating techniques to serve as a shielding layer, and is electrically connected to the exposed end face of the second conductive post. The shielding layer is formed into a hollow structure in the area of ​​the longitudinal projection of the first sensing line and the second sensing line to serve as a fingerprint sensing area. as well as Remove the second support plate to expose the insulating protective layer and the outer pad.

7. The manufacturing method of the smart card fingerprint recognition module packaging structure as described in claim 6, characterized in that, The first insulating layer, the second insulating layer, and the insulating protective layer are made of a soft, flexible dielectric material or an insulating material.

8. The manufacturing method of the smart card fingerprint recognition module packaging structure as described in claim 6, characterized in that, The first sensing line and the second sensing line are offset from each other and do not overlap in the longitudinal projection.

9. The manufacturing method of the smart card fingerprint recognition module packaging structure as described in claim 6, characterized in that, The linewidth and spacing of the first sensing line and / or the second sensing line are ≤30 micrometers.

10. The manufacturing method of the smart card fingerprint recognition module packaging structure as described in claim 6, characterized in that, The total thickness of the smart card fingerprint recognition module packaging structure is ≤150 micrometers.

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