Multiple-output multiple-input antenna system and electronic device

Abstract

A multi-output multi-input antenna system and electronic device, the antenna system capable of being positioned within an electronic device, comprising a set of low-band antenna groups and a set of high-band antenna groups, wherein the low-band antenna groups comprise a plurality of low-band antennas, each of the low-band antennas being separated from each other by a distance; the high-band antenna groups comprise a plurality of high-band antennas, each of the high-band antennas being separated from each other by a distance, and wherein one of the high-band antennas is a low-profile dish antenna architecture and is positioned in the distance between each of the low-band antennas. In this way, the antenna system of the present application has a small placement space and height, and has good isolation and field pattern characteristics.

Description

Technical Field

[0001] This application relates to an antenna system and electronic device, and more particularly to an antenna system having a set of low-frequency antenna groups and a set of high-frequency antenna groups, wherein the high-frequency antenna groups include a first high-frequency antenna with a low-profile dish antenna architecture, and the cavity of the first high-frequency antenna is located between the two low-frequency antennas of the low-frequency antenna groups. Background Technology

[0002] With the rapid development of the wireless communication industry, various wireless communication devices are constantly being innovated. The market requirements for these wireless communication devices, in addition to their slim and compact appearance, also emphasize whether they can ensure stable signal transmission and communication quality. Among them, the "antenna" is an indispensable key component in these wireless communication devices, used to send and receive wireless signals and transmit data. The research and development of related technologies has also become the focus of attention in related technical fields along with the rapid development of the wireless communication industry.

[0003] As mentioned above, an "antenna" is a conductor or conductive system that can transmit electromagnetic energy into or receive electromagnetic energy from space. To improve data rate and channel capacity, "multi-input multi-output (MIMO) systems" have become a widely used architecture. This results in a multiple increase in the number of antennas required on the same electronic device. While this can increase throughput within the existing bandwidth, it also means that the distance between multiple antennas in a limited space becomes shorter and shorter. Therefore, the mutual coupling effect between antennas will worsen the antenna isolation, leading to a decrease in radiation quality.

[0004] Generally, existing technologies mostly employ polarization diversity and spatial diversity to optimize antenna pattern and isolation. However, these methods often face challenges such as large antenna size or a relative distance between two antennas exceeding one wavelength, resulting in excessive circuit board space occupied by the antennas. This not only complicates the design of other circuitry on the board but also contradicts the design principles of thinner and lighter products. Therefore, effectively addressing the aforementioned problems of MIMO systems to provide users with better antenna products has become a major challenge of this application. Summary of the Invention

[0005] Given that the antenna systems in existing MIMO systems are not perfect and occupy too much space, after long-term research and experimentation, a multi-output multi-input antenna system and an electronic device equipped with the antenna system have been developed and designed in accordance with this application, in the hope that the advent of this application can effectively solve the aforementioned problems.

[0006] To address the aforementioned technical problems, this application provides a multi-output (MIMO) antenna system that can be housed within an electronic device. The antenna system includes a low-frequency antenna group and a high-frequency antenna group. The low-frequency antenna group includes a first low-frequency antenna and a second low-frequency antenna spaced a distance from the first low-frequency antenna. The high-frequency antenna group operates at a higher frequency than the low-frequency antenna group and includes a first high-frequency antenna and a second high-frequency antenna. The first high-frequency antenna is a low-profile dish antenna structure located between the first and second low-frequency antennas. The first high-frequency antenna, also a low-profile dish antenna structure, includes a metal ground plane and a metal disk. The metal ground plane can be fixed to a circuit board within the electronic device, and a cavity is recessed on the top surface of the metal ground plane. The metal disk corresponds to the cavity, and a signal feed terminal is located in the middle region of the metal disk. This signal feed terminal is not electrically connected to the metal ground plane. The second high-frequency antenna is located between the first low-frequency antenna and the second low-frequency antenna, and is separated from the first high-frequency antenna by a gap. Thus, the antenna system of this application can have a smaller placement space and height, while possessing good isolation and field characteristics.

[0007] Optionally, the second high-frequency antenna is a horizontally polarized antenna architecture, which can be located above the top surface of the first high-frequency antenna, separated from the first high-frequency antenna by the distance stated above.

[0008] Optionally, the antenna system further includes a mechanism made of insulating material, to which the second high-frequency antenna is assembled, so as to pass through the mechanism and be separated from the first high-frequency antenna by the distance.

[0009] Optionally, the mechanism is fixed to the metal ground plane.

[0010] Optionally, the mechanism further includes an additional circuit board and at least one support post. The additional circuit board is used for assembling the second high-frequency antenna onto the top surface of the additional circuit board. The top end of each support post is connected to the additional circuit board, and the bottom end of each support post is connected to the metal ground plane.

[0011] Optionally, the mechanism can be fixed to an inner side of a housing of the electronic device, and the circuit board will be positioned relative to the inner side of the housing.

[0012] Optionally, the top surface of the mechanism can be connected to the inner side of the housing, and one side of it is provided with an insertion space for the second high-frequency antenna to extend into the insertion space, thereby assembling the second high-frequency antenna into the mechanism.

[0013] Optionally, the second high-frequency antenna includes an insulating substrate, a first antenna element, and a second antenna element. The first antenna element is located on the top surface of the insulating substrate. The second antenna element is located on the bottom surface of the insulating substrate.

[0014] Optionally, the antenna system further includes an extended metal plate, which extends outward from one side of the metal ground plane, for the second high-frequency antenna to be disposed on the top surface of the extended metal plate and electrically connected to the metal ground plane. The second high-frequency antenna is a planar inverted F-shaped antenna structure, which is separated from the cavity of the first high-frequency antenna by the specified distance. The extended metal plate has a slot formed between the second high-frequency antenna and the cavity.

[0015] Optionally, the first low-frequency antenna and the second low-frequency antenna are in a planar inverted F-shaped antenna architecture.

[0016] Optionally, the first high-frequency antenna includes at least one support column, with the top end of each support column connected to the metal disk and the bottom end of each support column connected to the bottom surface of the cavity.

[0017] Optionally, the signal feed end of the first high-frequency antenna passes through the bottom surface of the cavity but does not contact the inner wall of the cavity, and the metal disk is suspended above the cavity.

[0018] Optionally, the low-frequency antenna group is disposed at a position on the top surface of the metal ground plane where the cavity is not recessed, and is electrically connected to the metal ground plane.

[0019] Optionally, the low-frequency antenna group is disposed at a position on the top surface of the metal ground plane where the cavity is not recessed, and is electrically connected to the metal ground plane.

[0020] Another technical solution adopted in this application is to provide an electronic device, which includes a housing, a circuit board and any of the antenna systems described above, wherein the circuit board and the antenna system can be located inside the housing, and the antenna system is electrically connected to the circuit board.

[0021] To further illustrate the purpose, technical features, and effects of this application, specific embodiments are described in detail below with reference to the accompanying drawings. However, the drawings provided are for reference and illustration only and are not intended to limit this application. Attached Figure Description

[0022] Figure 1 This is a perspective view of the antenna system according to the first embodiment of this application;

[0023] Figure 2 This is a side view of the antenna system according to the first embodiment of this application;

[0024] Figure 3A This is a cross-sectional view of the first high-frequency antenna according to the first embodiment of this application;

[0025] Figure 3B This is a cross-sectional view of the first high-frequency antenna according to the second embodiment of this application;

[0026] Figures 4A to 4C This is a radiation pattern diagram of the antenna system in the XY plane according to the first embodiment of this application;

[0027] Figure 5 This is a perspective view of the antenna system according to the third embodiment of this application;

[0028] Figure 6 This is an exploded view of the antenna system according to the third embodiment of this application;

[0029] Figure 7 This is a cross-sectional view of the antenna system according to the fourth embodiment of this application;

[0030] Figure 8 This is a perspective view of the second high-frequency antenna and its components according to the fourth embodiment of this application;

[0031] Figure 9 This is a perspective view of the antenna system according to the fifth embodiment of this application;

[0032] Figure 10 This is a perspective view of the antenna system according to the sixth embodiment of this application;

[0033] Figure 11 This is a perspective view of the antenna system according to the seventh embodiment of this application;

[0034] Figure 12 A perspective view of the antenna system according to the eighth embodiment of this application; and

[0035] Figure 13 This is a perspective view of the antenna system according to the ninth embodiment of this application. Detailed Implementation

[0036] To make the objectives, technical solutions, and advantages of this application clearer, the following detailed description of the embodiments of the "multiple-output multiple-input antenna system and electronic device equipped with said antenna system" disclosed in this application is provided in conjunction with specific embodiments and with reference to the accompanying drawings. Those skilled in the art can understand the advantages and effects of this application from the content disclosed in this specification. This application can be implemented or applied through other different specific embodiments, and various details in this specification can also be modified and changed based on different viewpoints and applications without departing from the concept of this application. Furthermore, it should be stated in advance that the accompanying drawings of this application are only simple schematic illustrations and are not depictions based on actual dimensions. Although this document provides examples of parameters containing specific values, it should be understood that the parameters do not need to be exactly equal to the corresponding values, but can approximate the corresponding values ​​within acceptable error tolerances or design constraints. In addition, unless the context clearly indicates or defines otherwise, the meanings of "a," "the," and "said" in this application include the plural.

[0037] It should be understood that although terms such as "first," "second," etc., may be used herein to describe various components or signals, each described component or signal should not be limited by the foregoing terms, which are primarily used to distinguish one component from another or one signal from another. Furthermore, directional terms mentioned in subsequent embodiments, such as "up," "down," "front," "back," "left," and "right," are only for reference to the accompanying drawings. Therefore, the directional terms used are for illustrative purposes and not for limiting the scope of protection of this application. Additionally, the term "or" as used herein may, depending on the specific circumstances, include any combination of one or more of the associated listed items.

[0038] Furthermore, the terms "substantially" or "approximately" as used herein can refer to the average of a numerical or complex numerical value within a range of deviations from a particular value that can be recognized or determined by those skilled in the art, including taking into account certain specific errors that may occur when measuring the particular value due to limitations of the measurement system or equipment. For example, the numerical value referred to "substantially" can include ±5%, ±3%, ±1%, ±0.5%, ±0.1%, or one or more standard deviations of the particular value.

[0039] This application discloses a multiple-input multiple-output (MIMO) antenna system and its electronic device. The antenna system S can be integrated into an electronic device R with wireless communication capabilities, such as a wireless router, wireless access point, personal computer, or laptop. In other words, any electronic device R that supports MIMO communication technology falls within the application scope of the antenna system S. The antenna system S is electrically connected to a circuit board E and to a wireless communication module on the circuit board E, enabling it to provide received wireless signals to the wireless communication module for processing, or to transmit wireless signals from the wireless communication module. The antenna system S includes a low-frequency antenna group 1 and a high-frequency antenna group 2. The low-frequency antenna group 1 comprises a plurality of low-frequency antennas, and the high-frequency antenna group 2 comprises a plurality of high-frequency antennas. It is hereby specifically stated that the aforementioned "low frequency band" and "high frequency band" are relative to each other, meaning that the operating frequency band of the low frequency band antenna group 1 (e.g., 2GHz, 5GHz) is lower than the operating frequency band of the high frequency band antenna group 2 (e.g., 6GHz).

[0040] In a first embodiment, please refer to Figure 1 and Figure 2 As shown, the low-frequency antenna group 1 has a first low-frequency antenna 11 and a second low-frequency antenna 12. Both the first low-frequency antenna 11 and the second low-frequency antenna 12 are planar inverted-F antennas (PIFA) and are dual-band antennas of 2GHz / 5GHz. In this first embodiment, the first low-frequency antenna 11 and the second low-frequency antenna 12 have the same shape and structure. Taking the second low-frequency antenna 12 as an example, it includes an antenna radiating part 121 (e.g., Figure 2 (the diagonal area), grounding part 122 (such as) Figure 2 The dotted area) and the signal feed terminal 123 (feed line omitted). Furthermore, the first low-frequency antenna 11 and the second low-frequency antenna 12 are separated by a distance D, and the angle between them is 90 degrees (e.g., the dotted area) and the signal feed terminal 123 (feed line omitted). Figure 1 As shown in the figure, in this embodiment, the distance D is 150mm, which is approximately 1.2λ0 of the low-frequency 2.4GHz, where λ0 = C / fc, and C is the speed of light (3 × 10⁻⁶). 8m / s), where fc is the frequency of the electromagnetic wave (2.4 GHz). However, in other embodiments of this application, manufacturers can adjust the antenna architecture (e.g., changing the shape and position of the antenna radiating part 121, grounding part 122, and signal feed end 123), placement angle, and spacing distance D of the first / second low-frequency antennas 11, 12 according to actual product requirements, rather than being limited to... Figure 1 The style.

[0041] Additionally, the high-frequency antenna group 2 will be located within the low-frequency antenna group 1. Please refer to [link / reference]. Figures 1 to 3A As shown, in this first embodiment, the high-frequency antenna group 2 has a first high-frequency antenna 21 and a second high-frequency antenna 22, respectively. The first high-frequency antenna 21 is located between the first low-frequency antenna 11 and the second low-frequency antenna 12, and is a low-profile dish antenna structure. It is composed of at least a metal ground plane 211 and a metal disk 212. The metal ground plane 211 can be fixed to the circuit board E and used as an antenna carrier. It can be electrically connected to the ground line of the circuit board E and serves as the ground terminal of the antenna. Furthermore, a cavity 210 is recessed on the top surface of the metal ground plane 211 and is located between the distance D between the first low-frequency antenna 11 and the second low-frequency antenna 12. In this first embodiment, the first high-frequency antenna 21 operates in the 6GHz band. The cavity 210 is formed on the metal ground plane 211 by an embossing process, with a depth of 2.2mm (approximately 0.05λ0, where λ0 = C / fc, and fc is the frequency of the electromagnetic wave (6GHz)) to achieve a low profile (i.e., reduce space occupation). The diameter of the cavity 210 is 43mm (approximately 0.93λ0, where λ0 = C / fc, and fc is the frequency of the electromagnetic wave (6.5GHz)). Furthermore, since the metal ground plane 211 can serve as an antenna carrier, the first low-frequency antenna 11 and the second low-frequency antenna 12 can be electrically connected to the top surface of the metal ground plane 211 that is not provided with the cavity 210, and the distance between them and the cavity 210 is 17mm (approximately 0.31λ0, where λ0 = C / fc, and fc is the frequency of the electromagnetic wave (5GHz)).

[0042] Please refer to the above. Figures 1 to 3AAs shown, in this first embodiment, the metal disk 212 corresponds to the cavity 210, and a signal feed terminal 213 is provided in its central region. This signal feed terminal 213 is not electrically connected to the metal ground plane 211. In this first embodiment, the first high-frequency antenna 21 also includes at least one support post 215. The top end of each support post 215 is connected to the metal disk 212, and the bottom end of each support post 215 is connected to the bottom surface of the cavity 210, allowing the metal disk 212 to be suspended relative to the cavity 210 (i.e., the bottom surface of the metal disk 212 does not directly contact the bottom surface of the cavity 210). However, the first high-frequency antenna is not limited to... Figure 3A The drawn pattern can be found in the second embodiment of this application. Figure 3B As shown, a through hole 216' is provided on the bottom surface of the cavity 210' recessed in the metal ground plane 211'. The bottom end of the signal feed end 213' of the metal disk 212' passes through the through hole 216' and is fixed to the circuit board or other components, but does not contact the inner wall of the cavity 210', so that the metal disk 212' can be suspended in the cavity 210' to form the first high-frequency antenna 21'. In this way, the first high-frequency antenna 21' does not need to be provided with an additional support column.

[0043] Please refer to the following: Figure 1 and Figure 2 As shown, the second high-frequency antenna 22 can be located above the top surface of the first high-frequency antenna 21 and separated from the first high-frequency antenna 21 by a distance H. In this first embodiment, the second high-frequency antenna 22 operates in the 6GHz frequency band and is positioned 15mm above the first high-frequency antenna 21 (approximately 0.33λ0, where λ0 = C / fc, and fc is the frequency of the electromagnetic wave (6.5GHz)). Furthermore, the second high-frequency antenna 22 is a horizontally polarized antenna architecture, including an insulating substrate 220, a first antenna element 221, and a second antenna element 222. The first antenna element 221 is located on the top surface of the insulating substrate 220, and the second antenna element 222 is located on the bottom surface of the insulating substrate 220. Furthermore, in this first embodiment, the first antenna unit 221 includes four first radiating ends 2211 and four first connecting lines 2212. Each first radiating end 2211 can be adjacent to the four sides of the insulating substrate 220, and one end of each first connecting line 2212 can be connected to each first radiating end 2211. The other ends of each first connecting line 2212 can be connected to each other, and a signal feed point 2210 is provided at their intersection. However, in other embodiments of this application, the position of the signal feed point 2210 is not limited to the aforementioned intersection, but can be any position that can be electrically connected to each first radiating end 2211.

[0044] Please refer to the above. Figure 1 and Figure 2 As shown, in this first embodiment, the second antenna unit 222 includes four second radiating ends 2221 and four second connecting lines 2222. Each second radiating end 2221 is adjacent to one of the four sides of the insulating substrate 220. One end of each second connecting line 2222 is connected to each second radiating end 2221, and the other end of each second connecting line 2222 is connected to each other. The position of each second connecting line 2222 on the insulating substrate 220 is relative to each first connecting line 2212. Thus, the first radiating ends 2211 and the second radiating ends 2221 can serve as transmitting antennas to receive radio frequency signals from the signal feed point 2210, thereby causing the second high-frequency antenna 22 to generate a radiation pattern; or, the first radiating ends 2211 and the second radiating ends 2221 can serve as receiving antennas to receive a wireless signal, thereby establishing a wireless signal channel. However, in other embodiments of this application, the form of the first radiating end 2211 and the second radiating end 2221 can be changed according to product requirements, and is not limited to... Figure 1 Any circuit component suitable for implementing a horizontally polarized antenna, as described in this application, falls under the category of the second high-frequency antenna.

[0045] In summary, in this first embodiment, the antenna system S is applied to the Wi-Fi 6E band. The low-frequency antenna group 1 operates in the 2GHz / 5GHz band, while the high-frequency antenna group 2 operates in the 6GHz band for backhaul. Since the high-frequency antenna group 2 is more susceptible to environmental influences, it is placed in the middle of the overall antenna placement space of the antenna system S, specifically between the first and second low-frequency antennas 11 and 12. This utilizes the first high-frequency antenna 21 and the second high-frequency antenna 22 to achieve polarization diversity, thereby improving the isolation between antennas. Furthermore, the first and second low-frequency antennas 11 and 12 are located on opposite sides of the metal ground plane 211 with an angle of 90 degrees to optimize isolation through space diversity. As a result, the space occupied by the antenna system S is significantly reduced, approximately 50% less than the placement area of ​​existing antenna systems. Furthermore, regarding the radiation pattern, experimental testing showed that the antenna pattern of the first / second low-frequency antennas 11 and 12 exhibits omnidirectional characteristics in the XY plane direction at the 2GHz frequency band (e.g., Figure 4A As shown, the thick lines represent the test results of the first low-frequency antenna 11, and the thin lines represent the test results of the second low-frequency antenna 12; the antenna field patterns of the first / second low-frequency antennas 11 and 12 in the 5GHz frequency band also exhibit omnidirectional characteristics in the XY plane (e.g., Figure 4B As shown, the thick lines represent the test results of the first low-frequency antenna 11, and the thin lines represent the test results of the second low-frequency antenna 12; the antenna field patterns of the first / second high-frequency antennas 21 and 22 in the 6GHz frequency band also exhibit omnidirectional characteristics in the XY plane (e.g., Figure 4C As shown in the table below, the thick lines represent the test results of the first high-frequency antenna 21, and the thin lines represent the test results of the second high-frequency antenna 22; and the isolation between the first / second high-frequency antennas 21 and 22 and the first / second low-frequency antennas 11 and 12 can reach more than 20dB, as shown in the table below:

[0046] Antenna frequency band 2GHz 5GHz 6GHz 2GHz 25dB 25dB 45dB 5GHz 25dB 25dB 23dB 6GHz 45dB 23dB 22dB

[0047] The structure in which the second high-frequency antenna 22 is separated from the first high-frequency antenna 21 by the distance H will be explained here. Please refer to [link to relevant documentation]. Figure 5 and Figure 6 As shown, in the third embodiment of this application, the second high-frequency antenna 22 is assembled onto a component 23. The portion of the component 23 that can contact the second high-frequency antenna 22 is made of insulating material. It consists of at least an additional circuit board 231 and at least one support post 233. The top end of each support post 233 is connected to the additional circuit board 231, and the bottom end of each support post 233 is connected to the metal ground plane 211. Figure 6 In the drawn pattern, the top of each of the supporting pillars 233 is integrally formed with the additional circuit board 231, and the bottom of each of the supporting pillars 233 can be inserted into the locking hole 214 opened in the metal ground plane 211. Furthermore, the second high-frequency antenna 22 can be assembled to the top surface of the additional circuit board 231, separated from the first high-frequency antenna 21 by the distance H. For example, the insulating substrate 220 can be glued or fixed to the additional circuit board 231 by other mechanisms.

[0048] Furthermore, the main function of the mechanism in this application is to fix the second high-frequency antenna 22 and prevent the second high-frequency antenna 22 from directly contacting the first high-frequency antenna 21. Therefore, the actual form of the mechanism is not limited to the embodiment disclosed in this application; any mechanism that meets the aforementioned effects is considered a mechanism in this application. The structure of another mechanism will be described below; please refer to [link to relevant documentation]. Figure 7 and Figure 8 As shown, in the fourth embodiment of this application, the mechanism 33 can be fixed to the inner side of a housing G of an electronic device R, and the circuit board E is relative to the inner side of the housing G, wherein the top surface of the mechanism 33 (with) Figure 7In terms of direction, it can be connected to the inner side of the housing G, and one side has an inwardly facing insertion space 330. The second high-frequency antenna 22 can extend into the insertion space 330 to be assembled into the mechanism 33. In this way, the second high-frequency antenna 22 can be separated from the first high-frequency antenna 21 by the distance H through the mechanism 33. Furthermore, please refer to Figure 7 As shown, in this fourth embodiment, the first high-frequency antenna can be a combination of the first and second embodiments. A through-hole 216 is formed on the bottom surface of its cavity 210 to allow the signal feed end 213 of the metal disk 212 to extend into it, but the signal feed end 213 will not contact the inner wall of the cavity 210. Simultaneously, a support post 215 is provided between the metal disk 212 and the bottom surface of the cavity 210 to ensure that the metal disk 212 can be stably positioned within the cavity 210. Furthermore, according to different product requirements, the styles of the first low-frequency antenna 11 and the second low-frequency antenna 12 of this application can be changed accordingly, such as... Figure 5 As shown, the first low-frequency antenna 11 and the second low-frequency antenna 12 have the same shape and structure. Taking the second low-frequency antenna 12 as an example, it includes an antenna radiating part 121 (such as...). Figure 5 (the diagonal area), grounding part 122 (such as) Figure 5 The dotted area) and signal feed terminal 123 (feed line omitted). Therefore, in some embodiments of this application, it is sufficient for the first / second low-frequency antennas 11 and 12 to have PIFA antenna architecture and characteristics.

[0049] The first high-frequency antenna 21 mentioned in this application can be located between the first / second low-frequency antennas 11 and 12, mainly referring to the positions of the cavity 210 and the metal disk 212, and not limiting the cavity 210 and the metal disk 212 to be located within the opposite areas of the first / second low-frequency antennas 11 and 12 (e.g., Figure 1 As shown in the fifth embodiment of this application, please refer to... Figure 9 As shown, the chamber 210 and the metal disk 212 can be offset from the relative positions of the first / second low-frequency antennas 11 and 12. Therefore, as long as the first / second low-frequency antennas 11 and 12 are still separated on both sides of the chamber 210 and the metal disk 212, it falls within the scope of the claim in this application that "the high-frequency antenna group is located within the low-frequency antenna group" or "the first high-frequency antenna is located between the first / second low-frequency antennas".

[0050] Additionally, in the sixth embodiment of this application, the second high-frequency antenna 22 can be a PIFA antenna architecture; please refer to [link / reference]. Figure 10As shown, the antenna system further includes an extended metal plate 24, which extends outward from one side of the metal ground plane 211, for the second high-frequency antenna 22 to be disposed on the top surface of the extended metal plate 24 and electrically connected to the metal ground plane 211. The second high-frequency antenna 22 is separated from the cavity 210 of the first high-frequency antenna 21 by the distance H. Furthermore, the extended metal plate 24 also has a slot 240 between the cavity 210 of the first high-frequency antenna 21 and the second high-frequency antenna 22 (in the distance H), so as to increase the isolation between the antennas 21 and 22 by the design of the slot 240. In this second embodiment, the distance H is 18mm, approximately 0.39λ0, where λ0 = C / fc, and fc is the frequency of the electromagnetic wave (6.5GHz). Thus, the antenna system of the sixth embodiment, compared with the existing antenna system, also has a smaller placement space and height, and has good isolation and field characteristics.

[0051] Depending on the actual needs of the product, the antenna system of this application can also have other modified embodiments. Please refer to [link / reference]. Figure 11 As shown, in the seventh embodiment of this application, the low-frequency antenna group can have four low-frequency antennas, namely a first low-frequency antenna 11, a second low-frequency antenna 12, a third low-frequency antenna 13 and a fourth low-frequency antenna 14. These low-frequency antennas 11 to 14 can be located adjacent to the four sides of the metal ground plane 211, and the cavity 210 and the metal disk 212 will be located within the range surrounded by these low-frequency antennas 11 to 14. Furthermore, the second high-frequency antenna 22 is located above the metal disk 212.

[0052] In the eighth embodiment of this application, please refer to Figure 12 As shown, the antenna system can include two sets of low-frequency antenna groups and two sets of high-frequency antenna groups. The two sets of low-frequency antenna groups are respectively provided with a first low-frequency antenna 11 and a second low-frequency antenna 12, and the two sets of high-frequency antenna groups are respectively provided with a first high-frequency antenna 21 and a second high-frequency antenna 22. Furthermore, the metal ground planes 211 of the two first high-frequency antennas 21 are disposed on the circuit board E with mutual separation. However, in the ninth embodiment of this application, please refer to... Figure 13 As shown, the metal ground planes 211 of the two first high-frequency antennas 21 can also be connected to each other as a whole.

[0053] The above description is merely a preferred and feasible embodiment of this application and does not limit the scope of protection of the claims of this application. Therefore, any equivalent changes that can be conceived by those skilled in the art based on the technical content disclosed in this application without creative effort should be included within the scope of protection of the claims of this application.

Claims

1. A multiple-output multiple-input antenna system, which can be housed within an electronic device, characterized in that, The antenna system comprises: a low-frequency antenna group, which at least comprises: a first low-frequency antenna; and a second low-frequency antenna, which is separated from the first low-frequency antenna by a distance; and a high-frequency antenna group, which has a higher operating frequency than the low-frequency antenna group, and which at least comprises: a first high-frequency antenna, which is a low-profile dish antenna architecture, and which is located between the first low-frequency antenna and the second low-frequency antenna, the first high-frequency antenna being a low-profile dish antenna architecture, and comprising: a metal ground plate, which can be fixed to a circuit board in the electronic device, and which has a cavity formed in a top surface thereof; and a metal disc, which corresponds to the cavity, and which has a signal feed-in end formed in a middle region thereof, the signal feed-in end not being electrically connected to the metal ground plate; and a second high-frequency antenna, which is located between the first low-frequency antenna and the second low-frequency antenna, and which is separated from the first high-frequency antenna by a distance.

2. The antenna system of claim 1, wherein, The second high-frequency antenna is a horizontal polarization antenna architecture, which can be located above a top surface of the first high-frequency antenna, so as to be separated from the first high-frequency antenna by the distance.

3. The antenna system of claim 2, wherein, The antenna system further comprises a mechanism member, which is made of an insulating material, and in which the second high-frequency antenna is assembled, so as to be separated from the first high-frequency antenna by the distance via the mechanism member.

4. The antenna system of claim 3, wherein, The mechanism member is fixed to the metal ground plate.

5. The antenna system of claim 4, wherein, The mechanism member further comprises: an additional circuit board, to which the second high-frequency antenna is assembled to a top surface thereof; and at least one supporting column, a top end of each of which is connected to the additional circuit board, and a bottom end of each of which is connected to the metal ground plate.

6. The antenna system of claim 3, wherein, The mechanism member can be fixed to an inner side surface of a housing of the electronic device, and the circuit board is relative to the inner side surface of the housing.

7. The antenna system of claim 6, wherein, A top surface of the mechanism member can be connected to the inner side surface of the housing, and one side thereof is provided with an insertion space, so that the second high-frequency antenna is inserted into the insertion space, and then the second high-frequency antenna is assembled into the mechanism member.

8. The antenna system of claim 3, wherein, The second high-frequency antenna comprises: an insulating substrate; a first antenna unit, which is located on a top surface of the insulating substrate; and 9. The antenna system of claim 8, wherein, a second antenna unit, which is located on a bottom surface of the insulating substrate.

10. The antenna system of claim 1, wherein, The first low-frequency antenna and the second low-frequency antenna are planar inverted-F antenna architectures. The antenna system further comprises an extended metal plate, which is formed by extending outwardly from one side of the metal ground plate, so that the second high-frequency antenna is arranged on a top surface of the extended metal plate and is electrically connected to the metal ground plate. The second high-frequency antenna is a planar inverted-F antenna architecture, which is separated from the cavity of the first high-frequency antenna by the distance.

11. The antenna system of claim 10, wherein, The extended metal plate is provided with a slot between the second high-frequency antenna and the cavity.

12. The antenna system of any of claims 1 to 11, wherein, The first low-frequency antenna and the second low-frequency antenna are planar inverted-F antenna architectures. The first high-frequency antenna comprises at least one supporting column, a top end of each of which is connected to the metal disc, and a bottom end of each of which is connected to a bottom surface of the cavity.

13. The antenna system of any of claims 1 to 11, wherein, The signal feeding end of the first high frequency antenna passes through the bottom surface of the cavity but does not contact the inner wall of the cavity, and the metal disc is suspended in the cavity.

14. The antenna system of claim 12, wherein, The low frequency antenna group is arranged at a position on the top surface of the metal ground plate where the cavity is not recessed, and is electrically connected to the metal ground plate.

15. The antenna system of claim 13, wherein, The low frequency antenna group is arranged at a position on the top surface of the metal ground plate where the cavity is not recessed, and is electrically connected to the metal ground plate.

16. An electronic device provided with the antenna system according to any one of claims 1 to 15, said electronic device comprising a housing, a circuit board and said antenna system, characterized in that The circuit board and the antenna system can be located in the shell, and the antenna system is electrically connected to the circuit board.

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