Sound module for a head-mounted device

Abstract

A modular audio system includes a sound module configured to removably engage with a head-mounted peripheral. In some examples, the head-mounted peripheral is an eyeglass frame, and the sound module is configured to removably secure to a socket arranged on an inner side of a temple of the eyeglasses. The sound module is slidably, pivotably, and / or magnetically engageable with the socket such that, when secured, the sound module is configured to generate sound energy in the form of audible sound proximate to an ear of a user when the user wears the head-mounted peripheral. In other examples, the temple of the head-mounted peripheral is configured to slidably engage with a sleeve, where the sleeve includes a recess configured to slidably engage with the sound module.

Description

[0001] Cross-reference to related applications

[0002] This application claims priority to U.S. Patent Application Serial No. 16 / 862,909, entitled “Modular Acoustic Systems,” filed April 30, 2020, the entire contents of which are incorporated herein by reference. Technical Field

[0003] The embodiments disclosed herein generally relate to modular audio systems. Background Technology

[0004] The aspects and specific embodiments disclosed herein generally relate to modular audio systems, such as audio systems that include removable sound modules. Summary of the Invention

[0005] This disclosure relates to a modular audio system comprising a sound module configured to removably engage with a head-mounted peripheral device. In some examples, the head-mounted peripheral device is an eyeglass frame, and the sound module is configured to be removably attached to a socket disposed on the inner side of the temple of the eyeglasses. The sound module is slidably, pivotally, and / or magnetically engaged with the socket such that, when attached, the sound module is configured to generate sound energy in the form of audible sound near the user's ear when the user wears the head-mounted peripheral device. In some examples, the sound module is configured to be removably attached to any part of the head-mounted peripheral device, such as on the temple of the eyeglass frame. In other examples, the temple of the head-mounted peripheral device is configured to slidably engage with a sleeve, wherein the sleeve includes a recess configured to slidably engage with the sound module.

[0006] In one example, a removable sound module is provided, the sound module including a sound module housing configured to removably engage with a head-mounted peripheral device, wherein at least a portion of the head-mounted peripheral device is formed around a substantial portion of the sound module housing, such that when engaged with the head-mounted peripheral device, the removable sound module is arranged close to a user's ear to provide acoustic energy, and a first circuit is arranged within the sound module housing, the first circuit including an acoustic circuit and an acoustic transducer, the acoustic circuit being arranged to generate a first electrical signal, the first electrical signal being used by the acoustic transducer to generate acoustic energy close to the user's ear.

[0007] In one respect, the sound module housing is arranged to be pivotally or magnetically coupled to a head-mounted peripheral device.

[0008] In one aspect, if the sound module housing is arranged to be magnetically coupled to a removable sound module, the sound module further includes a magnet disposed on or within the sound module housing, and the head-mounted peripheral device includes a complementary magnet or magnetic plate disposed on or within the head-mounted peripheral device, such that the magnetic engagement between the magnet and the complementary magnet or magnetic plate allows the sound module housing to pivot relative to the head-mounted peripheral device.

[0009] In one aspect, the sound module housing also includes a metal component disposed within the sound module housing to magnetically insulate or shield the sound transducer from a first magnetic field generated by a first alignment magnet or a second alignment magnet.

[0010] In one aspect, the metal component is a first antenna electrically connected to a first circuit of the sound module, wherein the metal component is configured to transmit wireless data to or receive wireless data from a second antenna arranged within the head-mounted peripheral device.

[0011] In one respect, the metal component is configured to increase the magnitude of the first magnetic field of the first magnet or the second magnet.

[0012] In one respect, the housing of the sound module is arranged to slide or translate relative to the head-mounted peripheral device.

[0013] In one aspect, the removable sound module is configured to establish a connection with a head-mounted peripheral device, wherein the connection is a wireless data connection, a wireless power connection, a physical data connection, or a physical power connection.

[0014] In one aspect, the physical data connection or the physical power connection utilizes a two-pin connector interface.

[0015] In one aspect, the head-mounted peripheral device includes a wearable eyewear shape factor, the wearable eyewear shape factor including temples having an inner side, an outer side, a top surface and a bottom surface, and wherein the inner side is arranged to receive a removable sound module.

[0016] In one aspect, the inner side of the temple also includes a socket arranged to receive and removably engage with a removable sound module.

[0017] In one aspect, the socket is further configured to removably disengage from the socket by means of pivoting, rotating, up-and-down movement, spring-loaded hinge, sliding button release, sliding engagement, or frictional engagement.

[0018] In one aspect, the sound module housing is further configured to removably engage with a head-mounted peripheral device via at least one fastening arrangement, wherein the at least one fastening arrangement is selected from: friction fit, screw, bolt, hook-and-loop fastening arrangement, suction cup arrangement, press-fit fastening arrangement, press-seal fastening arrangement, slide button release mechanism, friction insertion arrangement, double friction insertion arrangement, enclosed friction protrusion arrangement, friction clamping arrangement, or conductive slide rail arrangement.

[0019] In one aspect, the first circuit is arranged to receive a first power signal from the battery, wherein the battery is arranged within a removable sound module housing or within a head-mounted peripheral device.

[0020] In one aspect, the first circuitry includes a first antenna disposed within a housing of a sound module, the first antenna being configured to receive wireless signals from a second antenna disposed on or in a head-mounted peripheral device or additional peripheral device.

[0021] In one aspect, the sound module also includes a sensor configured to communicate with a first circuitry of the removable sound module or a second circuitry of the head-mounted peripheral device, wherein the sensor is disposed on or within the housing of the sound module or on or within the head-mounted peripheral device.

[0022] In one aspect, the sensor is a microphone, and the microphone is disposed on or inside a sound module housing or disposed on or inside a head-mounted peripheral device.

[0023] In one aspect, the sensors are selected from: gyroscopes, accelerometers, magnetometers, force sensors, ultrasonic sensors, pressure sensors, proximity sensors, light detection and ranging (LIDAR) sensors, temperature sensors, humidity sensors, ambient light sensors, ultraviolet (UV) sensors, sunlight sensors, button or touch capacitive sensors.

[0024] In one aspect, the sound module housing also includes a first port and a second port, wherein the first port is disposed on a first surface of the sound module near the user's ear, and the second port is disposed on a second surface of the sound module housing.

[0025] In one respect, head-mounted peripherals are selected from: hats, face masks, helmets, ski helmets, ski goggles, or headbands.

[0026] In another example, a head-mounted peripheral device is provided, configured to receive a removable sound module housing such that the removable sound module is configured to provide acoustic energy near a user's ear via a first circuit disposed within the sound module housing. The first circuit includes sound circuitry and an acoustic transducer, the sound circuitry being arranged to generate a first electrical signal, which is utilized by the acoustic transducer to generate acoustic energy near the user's ear. The removable sound module includes a first protrusion configured to frictionally engage at least one side or surface of a temple; or the sound module includes a first protrusion configured to insert into at least one side or surface of the temple of the head-mounted peripheral device, wherein the first protrusion does not include electrical contacts.

[0027] In another example, a modular audio system is provided, including a head-mounted peripheral device configured to connect to a removable sound module. The head-mounted peripheral device includes a sleeve configured to receive the sound module and the removable sound module. The removable sound module includes a sound module housing configured to removably engage with a recess in the head-mounted peripheral device such that, when engaged with the head-mounted peripheral device, the removable sound module is positioned close to a user's ear to provide acoustic energy. A first circuit is disposed within the sound module housing, the first circuit including acoustic circuitry and an acoustic transducer. The acoustic circuitry is arranged to generate a first electrical signal, which is utilized by the acoustic transducer to generate acoustic energy close to the user's ear.

[0028] These and other aspects of the various implementation schemes will become apparent from the implementation schemes described below, and will be clarified with reference to the implementation schemes described below. Attached Figure Description

[0029] In the accompanying drawings, similar reference numerals generally refer to the same parts in all different views. Furthermore, the drawings are not necessarily drawn to scale, and the focus is usually on illustrating the principles of various embodiments.

[0030] Figure 1 This is a schematic perspective view of a modular audio system according to this disclosure.

[0031] Figure 2 This is a right-side perspective view of the sound module according to this disclosure.

[0032] Figure 3 This is a left perspective view of the sound module according to this disclosure.

[0033] Figure 4A This is a right-side front view of the sound module according to this disclosure.

[0034] Figure 4BThis is a right-side front view of a sound module with a partially removed housing, according to this disclosure.

[0035] Figure 5A This is a left-side front view of the sound module according to this disclosure.

[0036] Figure 5B This is a left-side front view of a sound module with a partially removed housing, according to this disclosure.

[0037] Figure 6A This is a schematic diagram of the internal components of the sound module according to this disclosure.

[0038] Figure 6B This is a schematic diagram of the internal components of a head-mounted peripheral device according to the present disclosure.

[0039] Figure 7 This is a schematic partial exploded perspective view of a modular audio system according to this disclosure.

[0040] Figure 8A This is a schematic perspective view of the fastening arrangement according to this disclosure.

[0041] Figure 8B This is a schematic perspective view of the fastening arrangement according to this disclosure.

[0042] Figure 9A This is a schematic perspective view of the fastening arrangement according to this disclosure.

[0043] Figure 9B This is a schematic perspective view of the fastening arrangement according to this disclosure.

[0044] Figure 10A This is a schematic perspective view of the fastening arrangement according to this disclosure.

[0045] Figure 10B This is a schematic perspective view of the fastening arrangement according to this disclosure.

[0046] Figure 11A This is a schematic perspective view of the fastening arrangement according to this disclosure.

[0047] Figure 11B This is a schematic perspective view of the fastening arrangement according to this disclosure.

[0048] Figure 12A This is a schematic perspective view of the fastening arrangement according to this disclosure.

[0049] Figure 12B This is a schematic perspective view of the fastening arrangement according to this disclosure.

[0050] Figure 13A This is a schematic perspective view of the fastening arrangement according to this disclosure.

[0051] Figure 13B This is a schematic perspective view of the fastening arrangement according to this disclosure.

[0052] Figure 14A This is a schematic perspective view of the fastening arrangement according to this disclosure.

[0053] Figure 14B This is a schematic perspective view of the fastening arrangement according to this disclosure.

[0054] Figure 15 This is a schematic perspective view of the head-mounted peripheral device and fastening arrangement according to the present disclosure.

[0055] Figure 16 This is a schematic perspective view of the fastening arrangement according to this disclosure.

[0056] Figure 17 This is a schematic perspective view of the fastening arrangement according to this disclosure.

[0057] Figure 18 This is a schematic perspective view of the fastening arrangement according to this disclosure.

[0058] Figure 19 This is a schematic perspective view of the fastening arrangement according to this disclosure. Detailed Implementation

[0059] This disclosure relates to a modular audio system including a sound module configured to removably engage with a head-mounted peripheral device. In some examples, the head-mounted peripheral device is an eyeglass frame, and the sound module is configured to be removably attached to a socket disposed on the inner side of the temple of the eyeglasses. The sound module is slidably, pivotally, and / or magnetically engaged with the socket such that, when attached, the sound module is configured to generate sound energy in the form of audible sound near the user's ear when the user wears the head-mounted peripheral device. In some examples, the sound module is configured to be removably attached to any part of the head-mounted peripheral device, such as on the temple of the eyeglass frame. In other examples, the temple of the head-mounted peripheral device is configured to slidably engage with a sleeve, wherein the sleeve includes a recess configured to slidably engage with the sound module.

[0060] As used herein, the term "wearable audio device" is intended to refer to a device that is adapted around, on, in, or near the ear (including open-ear audio devices worn on a user's head or shoulder) and a device that radiates sound energy into or toward the ear. Wearable audio devices are sometimes referred to as headphones, earphones, earpieces, over-ear headphones, earbuds, or sports headphones, and may be wired or wireless. Wearable audio devices include acoustic circuitry for converting audio signals into acoustic energy. The acoustic circuitry may be housed in earcups. While some of the following figures and descriptions may illustrate a single wearable audio device having a pair of earcups (each including an acoustic transducer), it should be understood that a wearable audio device may be a single, independent unit having only one earcup. Each earcup of a wearable audio device may be mechanically connected to the other earcup or headphone, for example, via a headband and / or via leads that conduct audio signals to the acoustic transducer in the earcup or headphone. Wearable audio devices may include components for wirelessly receiving audio signals. Wearable audio devices may include components of an active noise cancellation (ANR) system. Wearable audio devices can also include other features, such as microphones, allowing them to be used as headphones. Although Figure 1 One example of the shape factor for audio glasses is shown, but in other examples, the headphones can be in-ear, on-ear, over-ear, or near-ear headphones. In some examples, the wearable audio device can be an open-ear device that includes a sound transducer to radiate sound energy toward the ear while keeping the ear open to its outside world and surrounding environment.

[0061] According to Figures 1 to 16 Read the following description. Figure 1 This is a schematic diagram of a modular audio system 100 according to the present disclosure. The modular audio system 100 includes a head-mounted peripheral device 102 and at least one removable sound module 104. The head-mounted peripheral device 102 is intended to be a device configured to attach to or contact a user's head and to contact or engage with the sound module 104 (discussed below). In one example, the head-mounted peripheral device 102 is a pair of glasses, i.e., a glasses shape factor, configured to receive at least one sound module 104. In other examples, the head-mounted peripheral device 104 is safety glasses, a hat, a headband, a hood, a helmet, a face shield, goggles (e.g., ski goggles), an open audio device worn on the head, shoulder, or neck, or any other device worn on or near the user's head or neck. Although some examples shown in the following figures only show one side or one perspective view of half of the head-mounted peripheral device 102, it should be understood that the other sides of each example shown may include a similar structure and a second sound module 104 (e.g., as shown in the figure). Figure 1 and Figure 7As shown), the acoustic energy AE generated by each sound module 104 can be provided to both the user's left and right ears. The following will explain... Figures 7 to 16 The head-mounted peripheral device 102 is described in more detail. The sound module 104 is designed to be positioned close to the user's ear E (…). Figure 15 As shown) Generate or present sound energy AE (i.e., audible sound) Figure 1 The device shown. In some examples, such as Figure 1 , Figure 7 and Figures 8A to 16 As shown, the sound module 104 is configured to generate sound energy AE near the user's ear E, but is not configured to contact the user's ear E when generating sound energy AE. In other words, the sound module 104 is an open-ear sound module, configured to generate sound energy AE outside the user's ear canal and guide sound energy AE toward the user's ear canal.

[0062] like Figures 2 to 5B As shown, the sound module 104 includes a sound module housing 106. The sound module housing 106 is configured to at least partially surround or enclose internal circuitry for operating the sound module 104, such as first circuitry 120 (discussed below). It should be understood that the sound module housing 106 may be made of plastic materials, such as polyethylene terephthalate (PET), high-density polyethylene (HDPE), low-density polyethylene (LDPE), polyvinyl chloride (PVC), polypropylene (PP), polystyrene (PS), or any other formable polymer. Additionally, in some examples, the sound module housing 106 is made of metal, such as steel, aluminum, or other ferrous metals. In some embodiments, as discussed below, the sound module housing 106 can be removably attached to a head-mounted peripheral device by magnetic attraction. In these examples, it should be understood that some or all of the sound module housing may be made of ferrous metal to shield the internal electronic components (discussed below) from interference from generated magnetic fields. The sound module housing 106 includes a top side 108, a bottom side 110, a first side surface 112, and a second side surface 114. Additionally, as... Figures 2 to 5B As shown, the sound module housing 106 also includes a first end FE and a second end SE.

[0063] In one example, the sound module housing 106 includes two sound ports, a first port 116 and a second port 118, configured to allow acoustic energy AE to propagate from the interior of the sound module housing 106 into the air and into the ear E of the user U. The first port 116 is acoustically coupled to the front side of a sound transducer inside the housing, and the second port 118 is acoustically coupled to the back side of the sound transducer. Figures 2 to 5BAs shown, a first port 116 is located near a first end FE of the sound module housing 106 and is configured such that when the sound module 104 is engaged with or in contact with the head-mounted peripheral device 102, the first port 116 is configured to direct acoustic energy AE directly to the ear E of the user U. In other words, the first port 116 is configured to direct acoustic energy AE from the first port 116 into the ear canal of the user U's ear E, where the acoustic energy AE can propagate unimpeded into the ear canal of the user U. Similarly, a second port 118 is located near a first end FE of the sound module housing 106 and is further configured such that when the sound module 104 is engaged with or in contact with the head-mounted peripheral device 102, the second port 118 is configured to direct acoustic energy AE away from the ear E of the user U. In one example, the size and positioning of each port (i.e., the first port 116 and the second port 118) can form two sources of acoustic energy AE outside the sound module housing 106. The two sources of acoustic energy AE are brought close together to form an acoustic dipole, which helps to generate the acoustic energy AE perceived by the user U's ear. Although two ports are shown, additional ports may exist (i.e., more than one port acoustically coupled to the front side of the acoustic transducer and / or more than one port acoustically coupled to the back side of the acoustic transducer). Proper acoustic tuning of the ports can be achieved by sizing the ports and / or using acoustic damping materials at the port openings. Furthermore, screens can be used to prevent particles such as dust or moisture from entering the ports.

[0064] like Figure 6AAs shown, a first circuit 120 is disposed within the sound module housing 106 of the sound module 104. The first circuit 120 includes a first processor 122 and a first memory 124, which are arranged to execute and store a first plurality of non-transitory computer-readable instructions 126, respectively, to perform various functions of the first circuit 120 and the sound module 104 as discussed herein. The first circuit 120 also includes sound circuitry 128 electrically connected to the acoustic transducer 130. Sound circuitry 128 is intended to be a circuit, a plurality of circuits, or a plurality of electronic components configured to receive electrical power (discussed below) from, for example, a battery or other power source, and to convert the electrical power into electrical signals, such as a first electrical signal 132 (discussed below), or a series of discrete electrical signals received by the acoustic transducer 130 and converted into mechanical energy. The acoustic transducer 130 is intended to be a component or a series of components that converts electrical signals (e.g., the first electrical signal 132) into mechanical energy, such that the mechanical energy disturbs the surrounding air to form a waveform, such as a sound wave. In one example, the first memory 124 includes multiple music or audio files. The sound circuitry 128 is capable of generating at least one electrical signal (i.e., a first electrical signal 132) and providing the first electrical signal 132 to the sound transducer 130, wherein the first electrical signal 132 corresponds to at least a portion of one of the multiple music or audio files stored in the first memory 124. The sound transducer 130 is then used to generate discrete sound waves within the sound housing 106, which are allowed to propagate outside the sound module housing 106 through a first port 116 and / or a second port 118, potentially forming an acoustic dipole such that the generated acoustic energy AE can propagate to the ear E of the user U.

[0065] The first circuit 120 may also include a first communication module 134 configured to transmit and / or receive data. The first communication module 134 may also include a first antenna 136 configured to transmit and / or receive wireless signals W1 (e.g., transmit and / or receive wireless data via a wireless protocol), wherein the wireless protocol is selected from at least one of the following: Bluetooth protocol, Bluetooth Low Energy (BLE) protocol, ZigBee protocol, Wi-Fi (IEEE 802.11) protocol, iPod Accessory Protocol (iAP), radio frequency communication (RFCOMM), near-field magnetic induction (NFMI), near-field electromagnetic induction (NFEMI), or any other wireless protocol used to establish a wireless communication connection between the sound module 104 and another wireless device (e.g., a personal computer (PC), smartphone, tablet, or smartwatch). In some examples, as will be described below, the first communication module 134 may utilize the first antenna 136 to establish a wireless data communication connection with the head-mounted peripheral device 102. It should also be understood that the first antenna 136 can also transmit and / or receive wireless signals using additional peripheral devices, such as personal computers (PCs), smartphones, tablets, smartwatches, etc.

[0066] The first communication module 134 may also be configured to send and / or receive data via a wired connection. For example, the first communication module 134 may include a data port configured to receive data via a cable or other physical data connection, such that, for example, before, during, or after the sound module 104 is engaged with the head-mounted peripheral device 102, the aforementioned plurality of music or audio files may be stored in the first memory 124 of the sound module 104.

[0067] In some examples, such as Figure 6B As shown, the head-mounted peripheral device 102 may include similar circuitry, such as a second circuit 138. The second circuit 138 includes a second processor 140 and a second memory 142, which are arranged to execute and store a second plurality of non-transitory computer-readable instructions 144, respectively, to perform various functions of the second circuit 138 and the head-mounted peripheral device 102 as discussed herein. The second circuit 138 may also include a second communication module 146 configured to transmit and / or receive data. The second communication module 146 may also include a second antenna 148 configured to transmit and / or receive wireless data via a wireless protocol, wherein the wireless protocol is selected from at least one of the following: Bluetooth protocol, Bluetooth Low Energy (BLE) protocol, ZigBee protocol, Wi-Fi (IEEE 802.11) protocol, iPod Accessory Protocol (iAP), radio frequency communication (RFCOMM), near-field magnetic induction (NFMI), near-field electromagnetic induction (NFEMI), or any other wireless protocol used to establish a wireless communication connection between the head-mounted peripheral device 102 and another wireless device (e.g., a personal computer (PC), smartphone, tablet, or smartwatch). In some examples, as will be described below, the second communication module 146 may utilize the second antenna 148 to establish a wireless data communication connection with the voice module 104.

[0068] The second communication module 146 may also be configured to send and / or receive data via a wired connection. For example, the second communication module 146 may include a data port configured to receive data via a cable or other physical data connection, such that, for example, before, during, or after engagement with the sound module 104, the aforementioned plurality of music or audio files may be stored in the second memory 142 of the head-mounted peripheral device 102.

[0069] The modular audio system 100 also includes at least one sensor 150. The at least one sensor 150 can be selected from: buttons, touch capacitive sensors or surfaces, gyroscopes, accelerometers, magnetometers, microphones, ultraviolet (UV) light sensors, infrared (IR) sensors, daylight sensors, or cameras. It should be understood that one or more of these types of sensors can be combined in any conceivable manner; for example, gyroscopes, accelerometers, and magnetometers can be configured as a single inertial measurement unit (IMU). This will be discussed in detail below, and as... Figures 6A to 6B As shown, sensor 150 can be positioned on either the head-mounted peripheral device 102 or the sound module 104, in either one, or positioned in communication with either one. Figures 6A to 6B As shown, dashed lines indicate optional components, such as sensor 150, that can be electrically connected to the first circuit 120 or the second circuit 138. It should be understood that sensor 150 can be configured to receive user input, such as mechanical input, gestures, voice commands, etc., and provide that user input to the first circuit 120 or the second circuit 138. Additionally, the modular audio system 100 includes at least one battery 152. Similar to sensor 150 discussed above, battery 152 can optionally be connected to the first circuit 120 and / or the second circuit 138. It should be understood that battery 152 can be a lithium-ion battery, a capacitor, a supercapacitor, or other power source, and can be located on, in, or in communication with either the head-mounted peripheral device 102 or the sound module 104. In other words, battery 152 is configured to provide a power signal (i.e., power signal 154) to the head-mounted peripheral device 102 or the sound module 104 during operation.

[0070] In some examples, such as Figure 1 and Figures 7 to 16As shown, the head-mounted peripheral device 102 has an eyeglass shape factor that includes a plurality of temples 156A to 156B (collectively referred to as "temples 156"). Each temple 156 includes an inner side 158, an outer side 160, a top surface 162, and a bottom surface 164. Additionally, each temple 156 may also include a hinge that pivotally secures each temple to the front portion of the frame, i.e., the portion of the frame that includes the lens and bridge. As will be discussed in detail below, in some examples, the inner side 158 of each temple 156 may include a socket 166 configured to removably engage with the sound module 104. In some examples, the socket 166 is a recess within or beneath the flat surface of the inner side 158. In other examples, the connector 166 is a protrusion, such as a raised ridge, that protrudes away from the inner surface 158 and is configured to have a shape complementary to the shape of the sound module housing 106, such that when engaged, the ridge covers a substantial portion of the sound module housing 106 by frictional engagement. In some examples, at least a portion of each temple 156 is formed around a substantial portion of the sound module housing 106, such that when the head-mounted peripheral device 102 is positioned on the user's head, a space is formed between the side of the user's head and the inner surface 158, allowing the sound module 104 to be engaged without contacting or rubbing against the user's head. Figures 7 to 14B As shown, the temple 156A forms a recessed portion with an angled inclination, i.e., a portion angled away from the user's head, wherein the angled recessed portion is arranged between the hinge on each temple 156 and the portion of the temple that contacts and rests on the user's ear. Additionally, as... Figures 11A to 14B As shown, using any of the fastening arrangements FA described below, the sound module 104 can be removably secured to the outer side 160, top surface 162, and / or bottom surface 164 of the temple 156A. It should also be understood that in some examples, each temple 156 may include a flat surface, such as a substantially flat surface. In these examples, the sound module 104 can be removably secured to a flat surface in any of the fastening arrangements FA discussed below, thus extending the occupied area of ​​the temple 156.

[0071] As will be described in detail below, the modular audio system 100 includes multiple fastening arrangements FA that detail how the sound module 104 is removably secured, coupled, or otherwise attached to the temples 156A to 156B of the head-mounted peripheral device 102. Therefore, it should be based on... Figures 2 to 5B and Figures 7 to 14B Read the following exemplary description.

[0072] For example, such as Figure 2 , Figures 4A to 4B and Figure 7As shown, the exemplary fastening arrangement FA includes a magnetic fastening between the sound module housing 106 and the head-mounted peripheral device 102. Therefore, the sound module 104 can include multiple magnets, such as a first magnet 168A and a second magnet 168B, configured to magnetically secure the sound module housing 106 to one of the temples 156 of the head-mounted peripheral device 102. Figure 2 and Figures 4A to 4B As shown, the first magnet 168A is intended to be positioned near the first end FE of the sound module housing 106, and the second magnet 168B is intended to be positioned near the second end SE of the sound module housing 106. In one example, as... Figure 7 As shown, the inner surface 158 of each temple 156 of the head-mounted peripheral device 102 includes a plurality of complementary magnets 170A to 170B, such as a first complementary magnet 170A and a second complementary magnet 170B, which are configured to engage with each of the first magnets 168A and 168B of the sound module housing 106, respectively. Alternatively, the inner surface 158 of each temple 156 may include a plate or other object capable of magnetically engaging with the first magnets 168A and 168B of the sound module housing 106. In one example, only one magnetic pair is provided, such as a first magnet 168A positioned near a first end FE of the sound module housing 106 and a first complementary magnet 170A on the inner surface of the temple 156. In this arrangement, the user can bring the first end FE of the sound module housing 106 close to, for example, the first temple 156A, allowing the magnetic attraction between the first magnet 168A and the first complementary magnet 170A to engage the sound module housing 106 with the inner surface 158 of the temple 156A, and the user can pivot or rotate the second end SE of the sound module housing 106 to... Figure 1 In the position shown, the second end is secured by, for example, frictional engagement with the socket 166. It should be understood that in some examples, the first magnet 168A, in addition to providing a magnetic connection between the sound module housing 106 and the head-mounted peripheral device 102, may also be part of a component for generating acoustic energy AE using the acoustic transducer 130. For example, the acoustic transducer 130 may include a magnet and an electromagnetic coil configured to generate an alternating magnetic field that forms the acoustic energy AE. In these examples, the first magnet 168A may also serve as a magnet for the acoustic transducer 130, in addition to providing a magnetic connection between the sound module housing 106 and the head-mounted peripheral device 102. Additionally, in examples where the sensor 150 is a magnetometer, the presence of a first magnetic field M1 between, for example, the first magnet 168A and the first complementary magnet 170A can be used by the magnetometer to sense or otherwise determine that the sound module 104 has been successfully secured to the head-mounted peripheral device 102.

[0073] The magnets described above are configured to generate a corresponding magnetic field, which forms, for example, a magnetic attraction between the sound module housing 106 and the inner surface 158 of the temple 156A. In one example, a magnetic field is generated between the second magnet 168B and the second complementary magnet 170B, namely the first magnetic field M1. Figure 7 (As shown in the image). Figure 5B As shown, it should be understood that the sound module 104 may include a metal component 172 configured to provide magnetic shielding between magnets of the sound module housing 106 or between complementary magnets of the head-mounted peripheral device 102. Additionally, in some examples, the metal component 172 is also configured to function as an antenna for the first circuit 120, such as the first antenna 136 (discussed above). In other words, the metal component 172 not only provides magnetic shielding for the first circuit 120 with, for example, the second magnet 168B and / or the second complementary magnet 170B, but also functions as the first antenna 136. It should be understood that any magnetic shielding provided by the metal component 172 may be provided in addition to any magnetic shielding provided by the metal sound module housing 106. Furthermore, in some examples, the metal component 172 is made of a ferromagnetic material and is configured to increase, for example, the magnitude of the first magnetic field M1 between the second magnet 168B and the sound module housing 106.

[0074] Figure 7 The magnetic fastening arrangement FA as described above is shown. In addition to the magnetic fastening arrangement, Figure 7 Additionally, a socket 166 on the inner side 158 of the temple 156A may include a two-pin connection interface 174. The two-pin connection interface 174 may include a first pin and a second pin configured to electrically connect a first circuit 120 of the sound module 104 and a second circuit 138 of the head-mounted peripheral device 102. Across the two-pin connection interface 174, the modular audio system 100 may provide a power connection 176 and / or a data connection 178 between the sound module 104 and the head-mounted peripheral device 102. Figures 6A to 6B(As shown in the diagram). In some examples, battery 152 can be housed within head-mounted peripheral device 102 connected to second circuitry 138. Therefore, two-pin connector 174 provides an electrical connection between batteries 152 and supplies electrical power, such as a first power signal 154 (discussed above), to the first circuitry 120 of sound module 104. Conversely, if battery 152 is housed within sound module 104 connected to first circuitry 120, two-pin connector 174 can supply electrical power, such as the first power signal 154 (discussed above), from battery 152 to the second circuitry 138 of head-mounted peripheral device 102. In other exemplary embodiments, as will be described below, battery 152 can be housed in both head-mounted peripheral device 102 and sound module 104, and thus power generation and consumption can be distributed between the two devices; similarly, in examples where data needs to be transmitted between, for example, a first communication module 134 of first circuitry 120 and a second communication module 146 of second circuitry 138, two-pin connector 174 can provide a path for transmitting data between the communication modules. As described above, it should be understood that data can also be transmitted wirelessly between each communication module, for example, via the first antenna 136 and the second antenna 148. It should be understood that the various functions described above can be distributed between the first circuitry 120 of the sound module 104 and the second circuitry 138 of the head-mounted peripheral device 102 in any conceivable combination. For example, power distribution can be distributed between separate batteries located on or within the two devices, sensing by the sensor 150 can be distributed between sensors located on or within each device, and data processing and wired or wireless communication can be distributed between the first circuitry 120 and the second circuitry 138.

[0075] Figures 8A to 8B The fastening arrangement FA is shown in the form of a sliding engagement mechanism. For example... Figure 8A As shown, the inner surface 158 of the temple 156A may include a plurality of receiving grooves 182A to 182B, which are configured to receive a plurality of protrusions 180A to 180B respectively. For example, the first protrusion 180A and the second protrusion 180B are configured to be inserted into the first receiving groove 182A and the second receiving groove 182B. Then, as... Figures 8A to 8BAs shown, user U can slide the sound module housing 106 in the first direction DR1 to frictionally secure the sound module housing 106 within the slot 166 on the inner side 158 of the temple 156A. It should be understood that a portion of each of the plurality of protrusions 180A to 180B may have a first diameter, and a portion of each of the plurality of protrusions 180A to 180B may have a second diameter smaller than the first diameter. Similarly, a portion of each of the plurality of receiving recesses 182A to 182B may have a third diameter, and a portion of each of the plurality of receiving recesses 182A to 182B may have a fourth diameter smaller than the third diameter. Upon initial insertion, the portion of each protrusion with the first diameter is configured to engage within the portion of each receiving recess with the third diameter. When the sound module housing 106 is slid in the first direction DR1, the portion of each protrusion with the second diameter is configured to frictionally engage with the portion of each receiving recess with the fourth diameter, securing the sound module 104 in place. In order to remove the sound module housing 106 from the inner side 158 of the temple 156A, the user can apply force in the second direction DR2, which is opposite to the first direction DR1, so that the portion of each protrusion with a second diameter disengages from the portion of each receiving groove with a fourth diameter, and then the sound module 104 can be removed.

[0076] Figures 9A to 9B The fastening arrangement FA is shown in the form of a sliding button release mechanism. As shown, the first end FE of the sound module housing 106 can contact the socket 166 on the inner side 158 of the temple 156A and can be secured by physical connection, such as by a lip or ridge that engages with the first end FE and moves in the first direction DR1, or by magnetic attraction (e.g., between the first magnet 168A and the first complementary magnet 170A). Figure 2 and Figure 7As shown in the diagram, this prevents the first end FE from moving in the first direction DR1. Additionally, the second end SE of the sound module housing 106 is configured to pivot into the socket 166 and is configured to engage with the interior of the socket 166. It should be understood that the second end SE may include a sliding latch 186 and a sliding button release 184. The sliding button release 184 may be a spring-loaded sliding button release, such as a button slidably engaged within the sound module housing 106 and spring-biased in a second direction DR2 opposite to the first direction DR1. Furthermore, the sliding button release 184 may be secured to the sliding latch 186, wherein the sliding latch 186 is arranged on a first side surface 112 near the second end SE of the sound module housing 106, such as the inner side surface 158 facing the temple 156A and within the socket 166. The sliding latch 186 may include a protrusion or tab (not shown) configured to translate relative to the sliding button release 184, and the protrusion or tab may be configured to engage with a ridge or lip of the socket 166 and / or with a cavity, recess, or orifice (not shown) within the inner surface 158. The user U may apply pressure to the sliding button release 184 in a first direction DR1 using a finger. Movement of the sliding button release 184 in direction DR1 corresponds to an equivalent or complementary translational movement of the sliding latch 186 in direction DR1, thereby releasing the second end SE from engagement with the socket 166. Subsequently, the first end FE of the sound module housing 106 may be pivotally disengaged from contact with the socket 166, and the entire housing may be removed.

[0077] Figures 10A to 10B A fastening arrangement FA in the form of a pivot locking and releasing mechanism is shown. As shown, the second end SE of the sound module housing 106 can include a first protrusion 180A configured to engage pivotally or rotatably with a receiving groove 182A within the inner surface 158 of the socket 166. For example, the protrusion 180A can be inserted into the receiving groove 182A, and the entire sound module housing 106 can pivot about the protrusion 180A toward the inner surface 158 until the first end FE contacts the socket 166, or the entire sound module housing 106 can be rotated, for example, where the first end FE begins below or above the socket 166 and is rotated upward or downward, respectively, until the first end FE is aligned with the socket 166. Once aligned, the first end FE can be secured to the socket 166 by friction engagement, magnetic connection, locking device, or latching.

[0078] Figures 11A to 11BA fastening arrangement FA in the form of a friction-insertion arrangement is shown. As shown, the second side surface 114 of the sound module housing 106 may include a protrusion 180A projecting outward from the second side surface 114. As shown, the first protrusion 180A is intended to be a longitudinal member arranged to span at least half the length of the sound module housing 106 from the first end FE to the second end SE. Furthermore, the outer side surface 160 of the temple 156A may include a complementary groove 182A configured to receive the first protrusion 180A, such that the sound module housing 106 is removably secured to the temple 156A via a frictional engagement between the first protrusion 180A and the first receiving groove 182A. It should be understood that the illustrated frictional engagement can be aided by adding a magnet between the second side surface 114 of the sound module housing 106 and the outer side surface 160 of the temple 156A.

[0079] Figures 12A to 12B A fastening arrangement FA in the form of a double friction insertion arrangement is shown. As shown, the top side 108 of the sound module housing 106 includes a first protrusion 180A and a second protrusion 180B projecting upward from the top side 108. Each protrusion is intended to be a longitudinal member arranged to span at least a portion of the length of the sound module housing 106, such that the combined length of the first protrusion 180A and the second protrusion 180B spans at least half the length of the sound module housing 106. Additionally, although not shown, the bottom surface 164 of the temple 156A includes complementary receiving recesses, namely a first receiving recess 182A and a second receiving recess 182B, which are configured to receive each protrusion (e.g., the first protrusion 180A and the second protrusion 180B), respectively. The shape and size of each protrusion are configured such that the sound module housing 106 is removably secured to the temple 156A via a frictional engagement between the first protrusion 180A and the first receiving groove 182A, and a frictional engagement between the second protrusion 180B and the second receiving groove 182B. It should be understood that the illustrated frictional engagement can be aided by adding magnets between the top side surface 108 of the sound module housing 106 and / or the bottom surface 164 of the temple 156A.

[0080] Figures 13A to 13BA fastening arrangement FA in the form of a wrap-around friction protrusion is shown. As shown, the top side 108 of the sound module housing 106 includes a first protrusion 180A having a first portion projecting upward from the top side 108 and a second portion projecting inward (i.e., toward the head-mounted peripheral device 102). The first protrusion 180A is configured to removably engage with the temple 156A via a friction fit, for example, wherein the inner surface of the second portion of the first protrusion 180A is configured to make frictional contact with the top surface 162 of the temple 156A, while the top side 108 of the sound module housing 106 is configured to make frictional contact with the bottom surface 164 of the temple 156A. Therefore, the protrusion 180A is configured to clamp the temple 156A between the protrusion 180A and the top side 108 of the sound module housing 106, thereby keeping the protrusion fixed to the head-mounted peripheral device 102.

[0081] Figures 14A to 14B A fastening arrangement FA in the form of a friction clamping arrangement is shown. As shown, the top side 108 of the sound module housing 106 includes a first protrusion 180A and a second protrusion 180B. The first protrusion 180A and the second protrusion 180B are essentially longitudinal members arranged to span at least half the length of the sound module housing 106 from the first end FE to the second end SE. When removably secured to the head-mounted peripheral device 102, the first protrusion 180A is configured to make frictional contact with the inner side 158 of the temple 156A, and the second protrusion 180B is configured to make frictional contact with the outer side 160 of the temple 156A, such that the first protrusion 180A and the second protrusion 180B engage with the temple 156A in a clamping friction arrangement.

[0082] Figure 15 An alternative example of a head-mounted peripheral device 102 in the form of a pair of safety glasses is shown. As shown, the socket 166 is a sliding recess arranged to slidably engage with the sound module housing 106, allowing the sound module housing 106 to be positioned at multiple locations relative to the user U's ear E. Additionally, when the user wishes to remove the sound module 104, the user U simply slides the sound module housing 106 out of the rear of the sliding recess, i.e., toward the user's ear E. Within the sliding recess, it should be understood that the frictional engagement of the recess's sidewalls is sufficient to prevent movement of the sound module housing 106, such as sliding translation in a first direction DR1 or a second direction DR2.

[0083] Additionally, although not shown, it should be understood that other fastening arrangements FA can be used to removably attach the sound module 104 to the head-mounted peripheral device 102. For example, the sound module housing 106 can be removably attached to the head-mounted peripheral device 102 by arrangements such as screws, bolts, hook-and-loop fasteners (e.g., where the inner side 158 of the temple 156A includes a ring-shaped fastener and the first side surface 112 of the sound module housing 106 includes a hook-shaped fastener), suction cups (e.g., where the sound module housing 106 includes at least one suction cup located on the first side surface 112 configured to engage with the inner side 158 of the temple 156A), press-fit fastening arrangements (e.g., roller snaps or magnetic snaps used in cabinet hardware, where two complementary parts are pressed against each other to engage or latch them together, and additional pressing against each other releases or disengages them), or press-sealed fastening arrangements (e.g., sealing arrangements operating like resealable plastic bags). As another example, the fastening arrangement FA includes a spring-loaded hinge arrangement. For example, the hinge element may be pivotally secured to the inner surface 158 of the temple 156A and biased away from the inner surface 158 by a spring element. The sound module housing 106 may be secured to the hinge element and pivoted into the socket 166 and engaged by, for example, a friction fit, wherein the friction fit is not suppressed by a spring bias provided by the spring element. Also, and although not shown, it should be understood that the sound module housing 106 may be engaged within the socket 106 solely by a friction fit, and the socket 166 may be configured such that the sound module housing 106 may be removed by a pivoting movement of up and down. For example, a user may press, for example, a first end FE of the sound module housing 106, forcing the first end FE of the sound module housing inward. This inward movement causes a reciprocating movement of a second end SE about a pivot point near the center of the sound module housing 106, causing the second end SE to move outward, i.e., away from the inner surface 158. For example, the fastening arrangement FA can be an adhesive arrangement, such as in which the sound module housing 106 is configured to be secured to the socket 166 by a label or sticker with an adhesive backing or double-sided tape.

[0084] Figure 16 Another exemplary fastening arrangement FA is shown, wherein the temple 156A of the head-mounted peripheral device 102 is configured to slidably engage with a sleeve 188, wherein the sleeve 188 includes a recess configured to receive a sound module 104.

[0085] Figures 17 to 19 Another exemplary fastening arrangement FA is shown, in which the head-mounted peripheral device 102 is configured to slidably engage with the sound module 104. For example, Figure 17A schematic perspective view of a conductive slide rail arrangement 190 according to the present disclosure is shown. In the example shown, the temple 156A may be substantially hollow and includes a groove 191 configured to receive and slidably engage with a sliding carrier 192. Figure 18 and Figure 19 As shown, the sliding carrier 192 is configured to fit within a hollow slot and slidably engage with the temple 156A, for example, by translation in a first direction DR1 and a second direction DR2. The sliding carrier 192 is configured with a recess arranged to receive and engage with a guide plate 193 electrically coupled to a battery 152 or other power source within the head-mounted peripheral device 102. The guide plate 193 includes a plurality of conductive rails 194A to 194B integrated within the guide plate 193 and configured to span the length of the guide plate 193, as shown. Each of the plurality of conductive rails 194A to 194B is configured to be electrically connected to a plurality of conductive leaf springs 195A to 195B securely fixed within the interior of the temple 156A and within the slot 191. As discussed above, each of the plurality of leaf springs 195A to 195B is electrically connected to the battery 152 or other power sources within the head-mounted peripheral device 102. In one example, the plurality of leaf springs 195A to 195B are made of an electrically conductive material (e.g., copper); however, it should be understood that any conductive material, such as gold, tungsten, aluminum, etc., can be used. Thus, as the sliding carrier 192 slides within the slot 191 of the temple 156A of the head-mounted peripheral device 102, the first leaf spring 195A maintains electrical contact with the conductive rail 194A, and the second leaf spring 195B maintains electrical contact with the conductive rail 194B. The first conductive rail 194A and the second conductive rail 194B each include a through-hole having an electrical connection therethrough to provide an electrical connection to a sliding connector 196 configured to engage with the sound module 104. It should be understood that the sound module housing 106 of the sound module 104 can be configured to be electrically connected to the slide connector 196 via wire leads as shown, or can be directly connected to the slide connector 196, for example via a two-pin connector interface 174 disposed between the slide connector 196 and the first side surface 112 of the sound module housing 106, as discussed above. Advantageously, Figures 17 to 19The example shown allows for physical and / or electrical connections between the sound module 104 and the head-mounted peripheral device 102, such as physical data connection 176 and / or physical power connection 178 (as described above). Additionally, since the user's ear can be positioned at different locations on the user's head, it is desirable to allow the position of the sound module 104 to slide relative to the head-mounted peripheral device 102 and the user's ear E. Therefore, the conductive slide rail arrangement 190 allows the position of the sound module 104, and thus the position of the acoustic transducer 130, to slide relative to the user's ear along the temple 156A while maintaining the physical data connection 176 or the physical power connection 178. In one example, the provided arrangement allows for an adjustable range of translation between 0 mm and 30 mm, or more specifically, between 0 mm and 18 mm.

[0086] During an exemplary operation of the modular sound system 100, some functions of the system are provided by the head-mounted peripheral device 102, while some functions are provided by the sound module 104. For example, the sound module housing 106 can be engaged with the head-mounted peripheral device 102 using any of the fastening arrangements FA described above. When engaged, the sound module 104 is positioned near the user U's ear E, such that the acoustic energy AE generated by the sound module propagates into the user's ear. To generate the acoustic energy AE, the sound module 104 includes a first circuit 120 that electrically connects at least sound circuitry 128 to an acoustic transducer 130. Furthermore, the head-mounted peripheral device 102 can extend the functionality of the sound module 104 and / or contribute to the generation of the acoustic energy AE. For example, the head-mounted peripheral device 102 can include a second circuit 138 that includes a sensor 150 and / or a battery 152. Sensor 150 can provide sensor data to sound module 104 via a wireless data connection (e.g., between the first antenna 136 of the first circuit 120 and the second antenna 148 of the second circuit 138), or via a physical data connection 176 (e.g., via a two-pin connector 174). Similarly, battery 152 can be disposed on, in, or connected to the second circuit 138, such that stored electrical power can be provided from head-mounted peripheral device 102 to sound module 104, enabling sound module 104 to perform the various functions described above. It should also be understood that electrical power can be provided wirelessly or via physical power connection 178 through two-pin connector 174. In this way, any electronic components of the modular audio system 100 can be disposed in any conceivable combination or arrangement in the head-mounted peripheral device (connected to the second circuit 138) or sound module 104 (connected to the first circuit).

[0087] Alternatively, in another exemplary operation of the modular audio system 100, all functionality of the modular audio system 100 is provided by the sound module 104, and none of the system's functionality is provided by the head-mounted peripheral device 102. For example, the first circuitry 120 may include sound circuitry 128 and a sound transducer to generate acoustic energy AE near the user U's ear E, and may also include a sensor 150 and a battery 152. In other words, the sound module 104 is a self-contained module capable of providing all the functionality discussed above, regardless of how the sound module is removably coupled to the head-mounted peripheral device.

[0088] All definitions defined and used herein should be understood to encompass dictionary definitions, definitions incorporated by reference in documents, and / or the general meaning of the terms defined.

[0089] Unless explicitly stated to the contrary, the indefinite articles “a” and “an” as used herein in the specification and claims shall be understood to mean “at least one / an”.

[0090] As used herein in the specification and claims, the phrase “and / or” should be understood to mean “any one or both elements” of the elements so combined, that is, elements that exist together in some cases and separately in others. Multiple elements listed with “and / or” should be understood in the same way, that is, “one or more elements” of the elements so combined. Other elements may optionally be present, whether related to or unrelated to those explicitly identified by the “and / or” clause.

[0091] As used herein in the specification and claims, “or” should be understood to have the same meaning as “and / or” as defined above. For example, when items are separated in a list, “or” or “and / or” should be understood to be inclusive, i.e., including multiple elements or at least one and more than one element from a list of elements, as well as optional additional unlisted items. Terms that are explicitly stated to the contrary only (such as “only one of…” or “exact one of…” or “consisting of…” (when used in the claims)) will refer to multiple elements or exactly one element from a list of elements. In general, when followed by an exclusive term (such as “any one,” “one of…,” “only one of…” or “exact one of…”), the term “or” as used herein should be understood only to indicate an exclusive alternative (i.e., “one or another but not two”).

[0092] As used herein in the specification and claims, the phrase “at least one” (with regard to a list of one or more elements) should be understood to mean at least one element selected from any one or more elements in the list of elements, but not necessarily including at least one element from every element specifically listed in the list of elements, and does not exclude any combination of elements in the list of elements. This definition also allows for the optional presence of elements other than those explicitly identified in the list of elements referred to by the phrase “at least one,” whether related to or unrelated to those explicitly identified elements.

[0093] It should also be understood that, unless expressly stated to the contrary, in any method claimed herein that includes more than one step or action, the order of the steps or actions of the method is not necessarily limited to the order in which the steps or actions of the method are described.

[0094] In the claims and the foregoing description, all connecting phrases (such as “comprising,” “including,” “carrying,” “having,” “containing,” “involving,” “accommodating,” “constituting,” “made of,” etc.) shall be understood as open-ended, meaning including but not limited to. Only the connecting phrases “composed of” and “substantially composed of” shall be closed or semi-closed connecting phrases, respectively.

[0095] The above examples of the described subject matter can be implemented in any of a variety of ways. For example, some aspects can be implemented using hardware, software, or a combination thereof. When any aspect is implemented at least partially in software, the software code can be executed on any suitable processor or set of processors, whether it is provided in a single device or a single computer or distributed among multiple devices / computers.

[0096] This disclosure can be implemented as a system, method, and / or computer program product at any possible level of technical detail integration. A computer program product may include one or more computer-readable storage media having computer-readable program instructions thereon for causing a processor to perform aspects of this disclosure.

[0097] Computer-readable storage media can be tangible devices capable of holding and storing instructions for use by an instruction execution device. Computer-readable storage media can be, for example, but not limited to, electronic storage devices, magnetic storage devices, optical storage devices, electromagnetic storage devices, semiconductor storage devices, or any suitable combination of the foregoing. A less complete list of more specific examples of computer-readable storage media includes: portable computer disks, hard disks, random access memory (RAM), read-only memory (ROM), erasable programmable read-only memory (EPROM or Flash memory), static random access memory (SRAM), portable optical disc read-only memory (CD-ROM), digital versatile disc (DVD), memory sticks, floppy disks, mechanically encoded devices (such as punched cards or raised structures with recesses on which instructions are recorded), and any suitable combination of the foregoing. As used herein, computer-readable storage media should not be construed as transient signals themselves, such as radio waves or other freely propagating electromagnetic waves, electromagnetic waves propagating through waveguides or other transmission media (e.g., light pulses passing through fiber optic cables), or electrical signals transmitted through wires.

[0098] The computer-readable program instructions described herein can be downloaded from a computer-readable storage medium to a suitable computing / processing device via a network (e.g., the Internet, a local area network, a wide area network, and / or a wireless network), or downloaded to an external computer or external storage device. The network may include copper cables, optical fibers, wireless transmission, routers, firewalls, switches, gateway computers, and / or edge servers. A network adapter card or network interface in each computing / processing device receives and forwards the computer-readable program instructions from the network for storage in a computer-readable storage medium within the suitable computing / processing device.

[0099] Computer-readable program instructions used to perform the operations of this disclosure may be any of the following: assembly instructions, instruction set architecture (ISA) instructions, machine instructions, machine-dependent instructions, microcode, firmware instructions, status setting data, configuration data for integrated circuits, or source code or object code written in any combination of one or more programming languages, including: object-oriented programming languages ​​such as Smalltalk, C++, etc.; and procedural programming languages ​​such as the "C" programming language or similar programming languages. The computer-readable program instructions may execute entirely on the user's computer, partially on the user's computer, as a standalone software package, partially on the user's computer, partially on a remote computer, or entirely on a remote computer or server. In the latter scenario, the remote computer may be connected to the user's computer via any type of network, including a local area network (LAN) or a wide area network (WAN), or may be connected to an external computer (e.g., via the Internet using an Internet service provider). In some examples, electronic circuits, including, for example, programmable logic circuits, field-programmable gate arrays (FPGAs), or programmable logic arrays (PLAs), can execute computer-readable program instructions to perform aspects of this disclosure by using state information of the computer-readable program instructions to personalize the electronic circuits.

[0100] This document describes aspects of the disclosure with reference to flowchart illustrations and / or block diagrams of methods, apparatus (systems), and computer program products according to examples of the disclosure. It should be understood that each block in the flowchart illustrations and / or block diagrams, and combinations of blocks in the flowchart illustrations and / or block diagrams, can be implemented by computer-readable program instructions.

[0101] Computer-readable program instructions may be provided to a processor of a special-purpose computer or other programmable data processing apparatus to produce a machine, such that the instructions, which execute via the processor of the computer or other programmable data processing apparatus, create means for implementing the functions / actions specified in one or more blocks of a flowchart and / or block diagram. These computer-readable program instructions may also be stored in a computer-readable storage medium that can instruct a computer, programmable data processing apparatus, and / or other device to function in a particular manner, such that the computer-readable storage medium having the instructions stored therein includes an article of writing comprising instructions for implementing aspects of the functions / actions specified in the flowchart and / or block diagram or blocks.

[0102] Computer-readable program instructions may also be loaded onto a computer, other programmable data processing apparatus or other equipment to cause a series of operational steps to be performed on the computer, other programmable apparatus or other equipment to produce a computer-implemented process, such that the instructions, which execute on the computer, other programmable apparatus or other equipment, implement the functions / actions specified in one or more boxes of a flowchart and / or block diagram.

[0103] The flowcharts and block diagrams in the accompanying drawings illustrate the architecture, functionality, and operation of possible specific implementations of systems, methods, and computer program products according to various examples of this disclosure. In this regard, each block in a flowchart or block diagram may represent an instruction module, instruction fragment, or instruction section, comprising one or more executable instructions for implementing a specified logical function. In some alternative implementations, the functions described in the blocks may occur in a different order than those shown in the drawings. For example, depending on the function involved, two blocks shown consecutively may actually be executed substantially simultaneously, or the blocks may sometimes be executed in reverse order. Each block in the block diagrams and / or flowcharts, and combinations of blocks in the block diagrams and / or flowcharts, may be implemented by a dedicated hardware-based system that performs the specified function or action or executes a combination of dedicated hardware and computer instructions.

[0104] Other specific implementations are within the scope of the following claims and other claims that the applicant may enjoy.

[0105] While various examples have been described and illustrated herein, those skilled in the art will readily conceive of a variety of other devices and / or structures for performing the functions described herein and / or obtaining one or more of the results and / or advantages described herein, and each of such variations and / or modifications is considered to be within the scope of the examples described herein. More generally, those skilled in the art will readily understand that all parameters, dimensions, materials, and configurations described herein are intended to be exemplary, and actual parameters, dimensions, materials, and / or configurations will depend on one or more specific applications using the teachings of this invention. Those skilled in the art will recognize, or be able to determine, many equivalents of the specific examples described herein using only conventional experimentation. Therefore, it should be understood that the above embodiments are presented by way of example only, and that the examples may be practiced in ways other than those specifically described and claimed within the scope of the appended claims and their equivalents. The examples of this disclosure relate to each individual feature, system, article of manufacture, material, tooling kit, and / or method described herein. Furthermore, any combination of two or more such features, systems, articles of manufacture, materials, tooling kits, and / or methods is included within the scope of this disclosure if such features, systems, articles of manufacture, materials, tooling kits, and / or methods do not contradict each other.

Claims

1. A removable sound module, the sound module comprising: A sound module housing configured to removably engage with and coupled only to the inner side of a head-mounted peripheral device, wherein at least a portion of the inner side of the head-mounted peripheral device is formed around a substantial portion of the sound module housing, such that when engaged with the head-mounted peripheral device, the removable sound module is arranged close to the user's ear to provide acoustic energy, and wherein the at least a portion of the inner side of the head-mounted peripheral device has a shape complementary to the shape of the sound module housing; and A first circuit, disposed within the housing of the sound module, includes a sound circuit and a sound transducer. The sound circuit is arranged to generate a first electrical signal, which is used by the sound transducer to generate sound energy near the user's ear. The removable sound module further includes a metal component disposed within the housing of the sound module. The metal component is a first antenna electrically connected to the first circuit of the sound module. The metal component is configured to magnetically insulate or shield the sound transducer from a first magnetic field generated by a first magnet or a second magnet.

2. The removable sound module of claim 1, wherein the sound module housing is arranged to be pivotally or magnetically coupled to the head-mounted peripheral device.

3. The removable sound module of claim 2, wherein if the sound module housing is arranged to be magnetically coupled to the removable sound module, the removable sound module further includes a magnet disposed on or within the sound module housing, and the head-mounted peripheral device includes a complementary magnet or magnetic plate disposed on or within the head-mounted peripheral device such that a magnetic engagement between the magnet and the complementary magnet or magnetic plate allows the sound module housing to pivot relative to the head-mounted peripheral device.

4. The removable sound module of claim 1, wherein the metal component is configured to transmit wireless data to or receive wireless data from the second antenna, the second antenna being disposed within the head-mounted peripheral device.

5. The removable sound module of claim 1, wherein the metal component is configured to increase the magnitude of the first magnetic field of the first magnet or the second magnet.

6. The removable sound module of claim 1, wherein the sound module housing is arranged to slide or translate relative to the head-mounted peripheral device.

7. The removable sound module of claim 1, wherein the removable sound module is configured to establish a connection with the head-mounted peripheral device, wherein the connection is a wireless data connection, a wireless power connection, a physical data connection, or a physical power connection.

8. The removable sound module of claim 7, wherein the physical data connection or the physical power connection utilizes a two-pin connector interface.

9. The removable sound module of claim 1, wherein the head-mounted peripheral device includes a wearable eyeglass shape factor, the wearable eyeglass shape factor including temples having an inner side, an outer side, a top surface, and a bottom surface, and wherein the inner side is arranged to receive the removable sound module.

10. The removable sound module of claim 9, wherein the inner side of the temple further includes a socket arranged to receive the removable sound module and to removably engage with the removable sound module.

11. The removable sound module of claim 10, wherein the jack is further configured to be removably disengaged from the removable sound module by means of pivoting, rotating, up-and-down movement, spring-loaded hinge, sliding button release, sliding engagement, or friction engagement.

12. The removable sound module of claim 1, wherein the sound module housing is further configured to be removably engaged with the head-mounted peripheral device via at least one fastening arrangement, wherein the at least one fastening arrangement is selected from: friction fit, screw, bolt, hook-and-loop fastening arrangement, suction cup arrangement, press fastening arrangement, press-and-seal fastening arrangement, sliding button release mechanism, friction insertion arrangement, double friction insertion arrangement, wrap-around friction protrusion arrangement, friction clamping arrangement, or conductive slide rail arrangement.

13. The removable sound module of claim 1, wherein the first circuit is arranged to receive a first power signal from a battery, wherein the battery is disposed within the housing of the removable sound module or disposed in the head-mounted peripheral device or the head-mounted peripheral device.

14. The removable audio module of claim 1, wherein the first antenna is configured to receive a wireless signal from a second antenna, and the second antenna is disposed on the head-mounted peripheral device or an additional peripheral device or in the head-mounted peripheral device or an additional peripheral device.

15. The removable sound module of claim 1, further comprising a sensor configured to communicate with the first circuitry of the removable sound module or the second circuitry of the head-mounted peripheral device, wherein the sensor is disposed on or in the housing of the sound module or in the head-mounted peripheral device.

16. The removable sound module of claim 15, wherein the sensor is a microphone, and wherein the microphone is disposed on or within the sound module housing or within the head-mounted peripheral device.

17. The removable sound module of claim 15, wherein the sensor is selected from: a gyroscope, an accelerometer, a magnetometer, a force sensor, an ultrasonic sensor, a pressure sensor, a proximity sensor, a light detection and ranging (LIDAR) sensor, a temperature sensor, a humidity sensor, an ambient light sensor, an ultraviolet (UV) sensor, an infrared (IR) sensor, a sunlight sensor, a button, or a touch capacitive sensor.

18. The removable sound module of claim 1, wherein the sound module housing further includes a first port and a second port, wherein the first port is disposed on a first surface of the sound module housing near the user's ear, and the second port is disposed on a second surface of the sound module housing.

19. The removable sound module of claim 1, wherein the head-mounted peripheral device is selected from: a hat, a face mask, a helmet, a ski helmet, ski goggles, or a headband.

20. A head-mounted peripheral device configured to receive a sound module housing of a removable sound module, such that the removable sound module is configured to provide acoustic energy near a user's ear via a first circuit disposed within the sound module housing, the first circuit including a sound circuit and a sound transducer, the sound circuit being arranged to generate a first electrical signal, the first electrical signal being utilized by the sound transducer to generate the acoustic energy near the user's ear, wherein the head-mounted peripheral device includes at least one side or surface of an inner side of a temple, the at least one side or surface being configured to frictionally engage a protrusion of the removable sound module; or wherein the head-mounted peripheral device includes at least one side or surface of an inner side of the temple. Receiving groove on or on at least one side or surface of the inner side, the receiving groove being configured to receive a protrusion of the removable sound module, wherein the protrusion of the removable sound module does not include an electrical contact portion and the protrusion has a length at least half the length of the sound module housing, wherein the removable sound module further includes a metal component disposed within the sound module housing, wherein the metal component is a first antenna electrically connected to the first circuit of the sound module, and wherein the metal component is configured to magnetically insulate or shield the acoustic transducer from a first magnetic field generated by a first magnet or a second magnet.

21. A modular audio system, the modular audio system comprising: A head-mounted peripheral device configured to connect to a removable audio module, the head-mounted peripheral device including a sliding sleeve configured to receive the removable audio module; and The removable sound module includes: A sound module housing configured to removably engage with a recess in the sliding sleeve, such that when the sound module housing is engaged with the head-mounted peripheral device, the removable sound module is positioned close to the user's ear to provide acoustic energy; and A first circuit, disposed within the housing of the sound module, includes a sound circuit and a sound transducer. The sound circuit is arranged to generate a first electrical signal, which is used by the sound transducer to generate sound energy near the user's ear. The removable sound module further includes a metal component disposed within the housing of the sound module. The metal component is a first antenna electrically connected to the first circuit of the sound module. The metal component is configured to magnetically insulate or shield the sound transducer from a first magnetic field generated by a first magnet or a second magnet.

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