Method for detecting state of charging gun temperature sensor, charging device and charging system

Abstract

The present application provides a state detection method of a charging gun temperature sensor, a charging device and a charging system. The charging device includes a charging gun, a temperature sensor, a semiconductor refrigeration plate, a semiconductor refrigeration plate cold source, a power module and a control module. The power module includes a DC power supply and a power polarity conversion device, and the power polarity conversion device is respectively connected to the DC power supply and the semiconductor refrigeration plate, and is used to convert the polarity of the DC power supply to the semiconductor refrigeration plate. The control module is used to control the power polarity conversion device to convert the polarity of the DC power supply to the semiconductor refrigeration plate; when the semiconductor refrigeration plate is reversely connected to the DC power supply, the control module is also used to obtain the temperature value detected by the temperature sensor, and judge the state of the temperature sensor based on the obtained temperature value detected by the temperature sensor; when the state of the temperature sensor is judged to be a fault, the control module is also used to control the charging device to disconnect the charging connection.

Description

Technical Field

[0001] The present application relates to the field of new energy technology, and in particular to a state detection method for a charging gun temperature sensor, a charging device, and a charging system. Background Art

[0002] With the rapid development of new energy vehicle battery technology, the battery life has been significantly improved, but the problem of slow charging still plagues the entire industry. To solve this problem, the industry usually increases the output power of the charging gun to increase the charging rate. However, when the charging gun is charging at high power and high current, the heat generated at the connection between the gun head and the vehicle socket is large, which can easily cause safety accidents. How to ensure the working safety of the charging gun has been the focus of the industry's exploration. Summary of the invention

[0003] The present application provides a state detection method of a charging gun temperature sensor, a charging device and a charging system.

[0004] In a first aspect, the present application provides a charging device, which includes a charging gun, a temperature sensor, a semiconductor refrigeration plate, a semiconductor refrigeration plate cold source, a power module and a control module.

[0005] Among them, the charging gun includes a charging terminal and a terminal connector, the charging terminal is used to be plugged into the charging socket of the electric vehicle; the temperature sensor is used to detect the temperature of the charging terminal; the semiconductor refrigeration plate is divided into a first end and a second end, the first end of the semiconductor refrigeration plate is thermally connected to the terminal connector, and the second end of the semiconductor refrigeration plate is thermally connected to the cold source of the semiconductor refrigeration plate; the power supply module includes a DC power supply and a power supply polarity conversion device, the DC power supply is used to power the semiconductor refrigeration plate, the power supply polarity conversion device is connected to the DC power supply and the semiconductor refrigeration plate, and is used to convert the polarity of the DC power supply to the semiconductor refrigeration plate; the control module is used to control the power supply polarity conversion device to convert the polarity of the DC power supply to the semiconductor refrigeration plate; the control module is also used to obtain the temperature value of the charging terminal detected by the temperature sensor, and judge the state of the temperature sensor based on the obtained temperature value of the charging terminal detected by the temperature sensor.

[0006] It should be noted that the first end of the semiconductor refrigeration sheet is the end for cooling when the DC power supply is positively connected to the semiconductor refrigeration sheet; the second end of the semiconductor refrigeration sheet is the end for heating when the DC power supply is positively connected to the semiconductor refrigeration sheet. The positive connection of the DC power supply to the semiconductor refrigeration sheet is: the positive pole of the DC power supply is connected to the positive pole of the external lead of the semiconductor refrigeration sheet, and the negative pole of the DC power supply is connected to the negative pole of the external lead of the semiconductor refrigeration sheet; the reverse connection of the DC power supply to the semiconductor refrigeration sheet is: the positive pole of the DC power supply is connected to the negative pole of the external lead of the semiconductor refrigeration sheet, and the negative pole of the DC power supply is connected to the positive pole of the external lead of the semiconductor refrigeration sheet.

[0007] In one possible implementation, when the control module detects that the charging terminal is successfully plugged into the socket of the electric vehicle, the control module controls the power polarity conversion device to reverse the connection between the semiconductor refrigeration plate and the DC power supply, thereby heating the first end of the semiconductor refrigeration plate and heating the terminal connector.

[0008] In a possible implementation, within a preset heating time, the control module controls the DC power supply to output a preset power so that the first end of the semiconductor refrigeration plate heats the terminal connector. When the first end of the semiconductor refrigeration plate heats the terminal connector, the temperature sensor detects the temperature of the terminal connector, and the control module obtains the temperature value detected by the temperature sensor, calculates the temperature rise rate, and compares the calculated temperature rise rate with the pre-calibrated temperature rise rate:

[0009] When the calculated temperature rise rate is within a pre-calibrated temperature rise rate threshold range, the control module determines that the state of the temperature sensor is normal;

[0010] When the calculated temperature rise rate is not within a pre-calibrated temperature rise rate threshold range, the control module determines that the state of the temperature sensor is a fault.

[0011] In a possible implementation, within a preset heating time, the control module controls the DC power supply to output a preset power, so that the first end of the semiconductor refrigeration plate heats the terminal connector. When the first end of the semiconductor refrigeration plate heats the terminal connector, the temperature sensor detects the temperature of the terminal connector, and the control module obtains the temperature value detected by the temperature sensor, and compares the obtained temperature value with the pre-calibrated temperature value:

[0012] When the acquired temperature value is within the pre-calibrated temperature value threshold range, the control module determines that the state of the temperature sensor is normal;

[0013] When the acquired temperature value is not within a pre-calibrated temperature value threshold range, the control module determines that the state of the temperature sensor is a fault.

[0014] When the temperature sensor is in a fault state, the charging terminal does not output current to charge the electric vehicle, thereby disconnecting the charging device.

[0015] In one possible implementation, the charging device also includes a power module, which is connected to the power grid and can convert the alternating current input from the power grid into a current that matches the charging power of the electric vehicle. The power module is connected to the charging terminal via a cable and can transmit the current to the charging terminal through the cable, so that the charging terminal can charge the electric vehicle.

[0016] In a specific implementation, the control module controls the power module so that it does not output current, so that the charging terminal cannot output current to charge the electric vehicle, thereby disconnecting the charging device from the electric vehicle.

[0017] By adopting the above scheme, before the charging terminal outputs current to charge the car, the charging device can detect the state of the temperature sensor. When the temperature sensor is faulty, the charging terminal cannot output current to charge the electric car, thereby improving the safety of the charging device charging the electric car.

[0018] When the state of the temperature sensor is normal, the control module controls the power module to output current, so that the charging terminal starts to output current to charge the electric vehicle, and the control module controls the power polarity conversion device to connect the DC power supply to the semiconductor refrigeration plate positively, so that the first end of the semiconductor refrigeration plate is cooled to dissipate heat for the charging terminal.

[0019] Specifically, when the charging terminal outputs current to charge the electric vehicle, the heat generated by the charging terminal is transferred to the first end of the semiconductor refrigeration plate through the terminal connector. The first end of the semiconductor refrigeration plate is cooled and the temperature is reduced, so that it can absorb the heat from the terminal connector. The heat is transferred to the second end of the semiconductor refrigeration plate through the inside of the semiconductor refrigeration plate. The heat concentrated on the second end of the semiconductor refrigeration plate is dissipated through the semiconductor refrigeration plate cold source, thereby realizing the function of heat dissipation for the charging terminal.

[0020] Generally speaking, the cooling source of the semiconductor refrigeration plate can be a liquid cooling source or an air cooling source.

[0021] In a second aspect, the present application also provides a method for a charging device to detect the state of a charging gun temperature sensor, which is applied to the charging device and executed by a control module in the charging device. The structure of the charging device can refer to the description in the aforementioned embodiment, and the method for the charging device to detect the state of the charging gun temperature sensor may include the following steps:

[0022] Control the power polarity conversion device to reverse the connection between the semiconductor cooling chip and the DC power supply;

[0023] A value detected by the temperature sensor is obtained, and a state of the temperature sensor is determined based on the obtained value detected by the temperature sensor.

[0024] In one possible implementation, after the control module detects that the charging terminal is successfully plugged into the socket of the electric vehicle, it controls the power polarity conversion device to reverse the connection between the semiconductor refrigeration plate and the DC power supply, thereby heating the first end of the semiconductor refrigeration plate and heating the terminal connector.

[0025] In a possible implementation, within a preset heating time, the control module controls the DC power supply to output a preset power, so that the first end of the semiconductor cooling sheet heats the terminal connector, the temperature sensor detects the temperature of the terminal connector, the control module obtains the temperature value detected by the temperature sensor, calculates the temperature rise rate based on the obtained temperature value, and compares the calculated temperature rise rate with the pre-calibrated temperature rise rate to determine the state of the temperature sensor:

[0026] When the calculated temperature rise rate is within the pre-calibrated temperature rise rate threshold range, the control module determines that the state of the temperature sensor is normal; when the calculated temperature rise rate is not within the pre-calibrated temperature rise rate threshold range, the control module determines that the state of the temperature sensor is faulty.

[0027] In a possible implementation, within a preset heating time, the control module controls the DC power supply to output a preset power, so that the first end of the semiconductor cooling sheet heats the terminal connector, the temperature sensor detects the temperature of the terminal connector, the control module obtains the temperature value detected by the temperature sensor, and the control module compares the obtained temperature value with a pre-calibrated temperature value:

[0028] When the acquired temperature value is within the pre-calibrated temperature value threshold range, the control module determines that the state of the temperature sensor is normal; when the acquired temperature value is not within the pre-calibrated temperature value threshold range, the control module determines that the state of the temperature sensor is faulty.

[0029] When the control module determines that the state of the temperature sensor is faulty, the control module controls the power conversion module to prevent it from outputting current, so that the charging terminal cannot output current to charge the electric vehicle, thereby disconnecting the charging device from the electric vehicle and ensuring the safety of charging.

[0030] When the control module determines that the state of the temperature sensor is normal, the control module controls the power conversion module to output current, so that the charging terminal outputs current to charge the electric vehicle, and the control module also controls the power polarity conversion device to connect the semiconductor refrigeration plate positively to the DC power supply to cool the first end of the semiconductor refrigeration plate, so that the semiconductor refrigeration plate dissipates heat for the charging terminal.

[0031] In a third aspect, the present application further provides a charging system, the charging system comprising the aforementioned charging device and an electric vehicle, wherein the electric vehicle comprises a charging socket, and the charging terminal can be plugged and unplugged into the charging socket, thereby realizing the function of the charging device charging the electric vehicle.

[0032] In a fourth aspect, the present application also provides a temperature sensor state detection device, including a device to be cooled, a temperature sensor, a semiconductor refrigeration plate, a semiconductor refrigeration plate cold source, a power module and a control module.

[0033] The device to be cooled is a device that can generate heat when powered on, and the temperature sensor is used to detect the temperature of the device to be cooled; the semiconductor refrigeration sheet is used to cool and dissipate heat for the device to be cooled, and includes a first end of the semiconductor refrigeration sheet and a second end of the semiconductor refrigeration sheet, the first end of the semiconductor refrigeration sheet is arranged toward the device to be cooled and is thermally connected to the device to be cooled, the second end of the semiconductor refrigeration sheet is thermally connected to a semiconductor refrigeration sheet cold source, and the semiconductor refrigeration sheet cold source is used to dissipate heat for the second end of the semiconductor refrigeration sheet. The power supply module includes a DC power supply and a power supply polarity conversion device, the DC power supply is used to supply power to the semiconductor refrigeration sheet, and the power supply polarity conversion device is used to convert the polarity of the DC power supply to the semiconductor refrigeration sheet; the control module is used to control the power supply polarity conversion device to convert the polarity of the DC power supply to the semiconductor refrigeration sheet, and the control module is also used to obtain the temperature value detected by the temperature sensor.

[0034] It should be noted that when the DC power supply and the semiconductor refrigeration plate are connected in the positive direction, the first end of the semiconductor refrigeration plate cools and the second end of the semiconductor refrigeration plate heats; when the DC power supply and the semiconductor refrigeration plate are connected in reverse direction, the first end of the semiconductor refrigeration plate heats and the second end of the semiconductor refrigeration plate cools.

[0035] The temperature sensor state detection device provided in the present application has two working modes: a heating calibration mode and a cooling mode. When the temperature sensor state detection device works in the heating calibration mode, the temperature sensor state detection device can detect the state of the temperature sensor; when the temperature sensor state detection device works in the cooling mode, the temperature sensor state detection device can dissipate heat for the device to be cooled.

[0036] When the temperature sensor state detection device works in the heating verification mode, the control module controls the power polarity conversion device to reverse the DC power supply and the semiconductor refrigeration plate, so that the first end of the semiconductor refrigeration plate generates heat to heat the device to be cooled. The temperature sensor detects the temperature of the device to be cooled, and the control module obtains the temperature value detected by the temperature sensor and determines whether the state of the temperature sensor is normal.

[0037] In a possible implementation, within a preset heating time, the control module controls the DC power supply to output a preset power, so that the first end of the semiconductor refrigeration plate heats the device to be cooled, the temperature sensor detects the temperature of the device to be cooled, the control module obtains the temperature value detected by the temperature sensor, calculates the temperature rise rate, and compares the calculated temperature rise rate with the pre-calibrated temperature rise rate:

[0038] When the calculated temperature rise rate is within the pre-calibrated temperature rise rate threshold range, the control module determines that the state of the temperature sensor is normal; when the calculated temperature rise rate is not within the pre-calibrated temperature rise rate threshold range, the control module determines that the state of the temperature sensor is faulty.

[0039] In a possible implementation, within a preset heating time, the control module controls the DC power supply to output a preset power, so that the first end of the semiconductor refrigeration plate heats the device to be cooled, the temperature sensor detects the temperature of the device to be cooled, and the control module obtains the temperature value detected by the temperature sensor, and compares the obtained temperature value with the pre-calibrated temperature value:

[0040] When the acquired temperature value is within the pre-calibrated temperature value threshold range, the control module determines that the state of the temperature sensor is normal; when the acquired temperature value is not within the pre-calibrated temperature value threshold range, the control module determines that the state of the temperature sensor is faulty.

[0041] When the temperature monitoring device works in the cooling mode, the control module controls the power polarity conversion device to connect the DC power supply to the semiconductor refrigeration plate, thereby cooling the first end of the semiconductor refrigeration plate to dissipate heat for the device to be cooled.

[0042] In a fifth aspect, the present application also provides a detection method of a temperature sensor state detection device, which is applied to the temperature sensor state detection device and executed by a control module in the temperature sensor state detection device. The structure of the temperature sensor state detection device can refer to the description in the above embodiment, and the detection method of the temperature sensor state detection device can include the following steps:

[0043] Control the power polarity conversion device to reverse the connection between the semiconductor cooling chip and the DC power supply;

[0044] A value detected by the temperature sensor is obtained, and a state of the temperature sensor is determined based on the obtained value detected by the temperature sensor.

[0045] Specifically, the controller can connect the DC power supply to the semiconductor refrigeration piece in a positive or reverse manner by controlling the power polarity conversion device, wherein the DC power supply to the semiconductor refrigeration piece is positively connected as follows: the positive pole of the DC power supply is connected to the positive pole of the external lead of the semiconductor refrigeration piece, and the negative pole of the DC power supply is connected to the negative pole of the external lead of the semiconductor refrigeration piece; the DC power supply to the semiconductor refrigeration piece is reversely connected as follows: the positive pole of the DC power supply is connected to the negative pole of the external lead of the semiconductor refrigeration piece, and the negative pole of the DC power supply is connected to the positive pole of the external lead of the semiconductor refrigeration piece.

[0046] When the control module controls the power polarity conversion device to reversely connect the semiconductor refrigeration plate to the DC power supply, the first end of the semiconductor refrigeration plate generates heat to heat the device to be cooled.

[0047] In a possible implementation, within a preset heating time, the control module controls the DC power supply to output a preset power, so that the first end of the semiconductor refrigeration plate heats the device to be cooled, the temperature sensor detects the temperature of the device to be cooled, the control module obtains the temperature value detected by the temperature sensor, calculates the temperature rise rate based on the obtained temperature value, and compares the calculated temperature rise rate with the pre-calibrated temperature rise rate to determine the state of the temperature sensor:

[0048] When the calculated temperature rise rate is within the pre-calibrated temperature rise rate threshold range, the control module determines that the state of the temperature sensor is normal; when the calculated temperature rise rate is not within the pre-calibrated temperature rise rate threshold range, the control module determines that the state of the temperature sensor is faulty.

[0049] In a possible implementation, within a preset heating time, the control module controls the DC power supply to output a preset power, so that the first end of the semiconductor refrigeration plate heats the device to be cooled, the temperature sensor detects the temperature of the device to be cooled, the control module obtains the temperature value detected by the temperature sensor, and compares the obtained temperature value with the pre-calibrated temperature value:

[0050] When the acquired temperature value is within the pre-calibrated temperature value threshold range, the control module determines that the state of the temperature sensor is normal; when the acquired temperature value is not within the pre-calibrated temperature value threshold range, the control module determines that the state of the temperature sensor is faulty. BRIEF DESCRIPTION OF THE DRAWINGS

[0051] Figure 1 is a schematic diagram of the structure of a charging device provided in an embodiment of the present application;

[0052] Figure 2 This is a schematic diagram of a connection structure of a power polarity conversion device provided in an embodiment of the present application;

[0053] Figure 3 This is another schematic diagram of a connection structure of a power polarity conversion device provided in an embodiment of the present application;

[0054] Figure 4 It is a schematic diagram of the structure of the air-cooled cooling source provided in the embodiment of the present application;

[0055] Figure 5 It is a schematic diagram of the structure of the liquid cooling source provided in the embodiment of the present application;

[0056] Figure 6 The following is a flow chart of a method for detecting the state of a temperature sensor of a charging device provided in an embodiment of the present application. Figure 1 ;

[0057] Figure 7 The following is a flow chart of a method for detecting the state of a temperature sensor of a charging device provided in an embodiment of the present application. Figure 2 ;

[0058] Figure 8 is a schematic diagram of the structure of a charging system provided in an embodiment of the present application;

[0059] Fig. 9 is a structural schematic diagram of a temperature sensor state detection device provided in an embodiment of the present application;

[0060] Fig.10 It is a flow chart of a detection method of a temperature sensor state detection device provided in an embodiment of the present application; DETAILED DESCRIPTION

[0061] For ease of understanding, the terms involved in the embodiments of the present application are first explained.

[0062] Connection: should be understood in a broad sense. For example, A and B are connected, which can be either direct or indirect through an intermediary.

[0063] The terms "first", "second", etc. in the description are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Therefore, a feature defined as "first", "second", etc. may explicitly or implicitly include one or more of the features.

[0064] In the description of the present application, terms such as "center", "up", "down", "left", "right", "vertical", "straight", "horizontal", "inside", and "outside" indicating directions or positional relationships are based on the directions or positional relationships shown in the accompanying drawings. This is merely for the convenience of description and does not indicate or imply that the device or element must have a specific orientation, be constructed and operated in a specific orientation. Therefore, it should not be understood as a limitation on the present application.

[0065] The slow charging rate of charging piles is one of the important factors that hinder the rapid increase in the penetration rate of new energy vehicles. In order to solve this problem, increasing the output power of the charging gun has become a new trend in the evolution of energy replenishment technology. When the charging gun is charging at high power and high current, a large amount of heat will be generated at the joint between the gun head and the vehicle socket, causing the temperature of the joint to rise too quickly, which can easily cause safety accidents. In order to solve this problem, temperature sensors are arranged near the gun head of the charging gun for temperature detection. When the temperature near the gun head is detected to be too high, the charging pile will limit the output power of the charging gun or stop the charging gun from outputting current.

[0066] The current detection methods rely on the effectiveness of the temperature sensor. When the temperature sensor near the gun head fails, such as inaccurate temperature detection or abnormal temperature detection response speed, the charging pile cannot obtain accurate temperature information. If the charging gun is still charging at high power, it may cause the connection between the gun head and the vehicle socket to cause excessive temperature and cause fire and other safety accidents.

[0067] In order to solve the above problems, the embodiments of the present application provide a charging device, a charging system and a method for the charging device to detect the state of the charging gun temperature sensor. The charging device provided in the embodiments of the present application can detect the state of the charging gun temperature sensor. When the state of the temperature sensor is detected to be a fault, the charging device disconnects the charging connection, thereby improving the charging safety of the charging device. Among them, the charging device can be an integrated DC charging pile, a split DC charging pile, an AC charging pile or an AC / DC integrated charging pile, etc.; the electric vehicle can be a pure electric vehicle (pure electric vehicle / battery electric vehicle, pure EV / battery EV), a hybrid electric vehicle (hybrid electric vehicle, HEV), a range extended electric vehicle (range extended electric vehicle, REEV), a plug-in hybrid electric vehicle (plug-in hybrid electric vehicle, PHEV) or other new energy vehicles (new energy vehicle, NEV), etc., which are not limited here.

[0068] Taking an integrated DC charging pile as an example, the specific implementation of the present application will be clearly described below in conjunction with the accompanying drawings.

[0069] See also Figure 1 An embodiment of the present application provides a charging device 100 , which includes a charging cabinet 10 , a charging gun 20 and a thermal management module 30 .

[0070] It should be noted that Figure 1 The purpose is only to schematically describe the connection relationship between the charging cabinet 10, the charging gun 20 and the thermal management module 30, and it is not to specifically limit the connection position, specific structure and quantity of each device, and the structure illustrated in the embodiment of the present application does not constitute a specific limitation on the charging device 100. In other embodiments of the present application, the charging device 100 may include more or fewer components than shown in the figure, or combine some components, or split some components, or arrange the components differently. The illustrated components can be implemented in hardware, software, or a combination of software and hardware.

[0071] The charging cabinet 10 can accommodate and encapsulate some components of the charging device 100, so that the components located in the charging cabinet 10 are protected from external dust, water vapor, etc., and have good protection functions.

[0072] The charging cabinet 10 includes a power supply device 101 and a control module 102; the power supply device 101 includes a DC power supply 1011 and a power polarity conversion device 1012, the DC power supply 1011 is used to supply power to the semiconductor cooling sheet 302; the power polarity conversion device 1012 is connected to the DC power supply 1011 and the semiconductor cooling sheet 302 respectively, and is used to convert the polarity of the DC power supply 1011 supplying power to the semiconductor cooling sheet 302. The control module 102 is connected to the power polarity conversion device 1012, and is used to control the power polarity conversion device 1012, so as to convert the polarity of the DC power supply 1011 supplying power to the semiconductor cooling sheet 302; that is, the control module 102 controls the power polarity conversion device 1012, so as to change the direction of the current flowing out of the DC power supply 1011 flowing through the semiconductor cooling sheet 302.

[0073] The charging gun 20 includes a charging terminal 201 and a terminal connector 202. The charging terminal 201 is used to be plugged into the charging socket of the electric vehicle. The charging gun 20 also includes a cable sheath 203, and cables used to connect the charging terminal 201 and various devices inside the charging cabinet 10, such as communication cables, power cables, power cables, etc., can be placed inside the cable sheath 203. The terminal connector 202 is used to connect the charging terminal 201 and various cables.

[0074] The thermal management module 30 includes a temperature sensor 301, a semiconductor cooling sheet 302, and a semiconductor cooling sheet cold source 303. The semiconductor cooling sheet 302 is used to dissipate heat for the charging terminal 201 when the charging device 100 is charging the electric vehicle. The semiconductor cooling sheet 302 includes a first end 3021 of the semiconductor cooling sheet and a second end 3022 of the semiconductor cooling sheet; the first end 3021 of the semiconductor cooling sheet is arranged toward the terminal connector 202 and is thermally connected to the terminal connector 202; the second end 3022 of the semiconductor cooling sheet is thermally connected to the semiconductor cooling sheet cold source 303; the semiconductor cooling sheet cold source 303 is used to dissipate heat for the second end 302 of the semiconductor cooling sheet.

[0075] The temperature sensor 301 is used to detect the temperature of the charging terminal 201 when the charging device 100 is charging the electric vehicle; the control module 102 obtains the temperature value detected by the temperature sensor 301 and determines whether the temperature of the charging terminal 201 is too high. If the temperature is too high, the control module 102 controls the output power of the power module 103 to reduce the output power of the charging terminal 201 or the control module 102 controls the output power of the power module 103 so that the charging terminal 201 does not output current to charge the electric vehicle, thereby disconnecting the charging device 100. In specific applications, the temperature sensor 301 is located near the charging terminal 201, and can be located inside the terminal connector 202 or inside the charging terminal 201. The specific location is not limited.

[0076] The charging device 100 provided in the embodiment of the present application can determine the state of the temperature sensor 301 before the charging terminal 102 outputs current to charge the electric vehicle: if the state of the temperature sensor 301 is normal, the charging terminal 201 outputs current to charge the electric vehicle; and the control module 102 controls the power polarity conversion device 1012 to connect the semiconductor refrigeration plate 302 to the DC power supply 1011, so that the semiconductor refrigeration plate 302 dissipates heat for the charging terminal 201; if the state of the temperature sensor 301 is faulty, the charging terminal 201 does not output current to charge the electric vehicle, thereby ensuring the safety of charging.

[0077] In the embodiment of the present application, when the DC power supply 1011 is positively connected to the semiconductor refrigeration sheet 302, the first end 3021 of the semiconductor refrigeration sheet is cooling, and the second end 3022 of the semiconductor refrigeration sheet is heating; when the DC power supply 1011 is reversely connected to the semiconductor refrigeration sheet 302, the first end 3021 of the semiconductor refrigeration sheet is heating, and the second end 3022 of the semiconductor refrigeration sheet is cooling. Wherein, the DC power supply 1011 and the semiconductor refrigeration sheet 302 are positively connected as follows: the positive electrode of the DC power supply 1011 is connected to the positive electrode 3023 of the external lead of the semiconductor refrigeration sheet, and the negative electrode of the DC power supply 1012 is connected to the negative electrode 3024 of the external lead of the semiconductor refrigeration sheet; the DC power supply 1011 and the semiconductor refrigeration sheet 302 are reversely connected as follows: the negative electrode of the DC power supply 1011 is connected to the positive electrode 3023 of the external lead of the semiconductor refrigeration sheet, and the positive electrode of the DC power supply 1011 is connected to the negative electrode 3024 of the external lead of the semiconductor refrigeration sheet.

[0078] Please continue to refer to Figure 1 Specifically, after the control module 102 detects that the charging terminal 201 is successfully plugged into the socket of the electric vehicle, the control module 102 controls the power polarity conversion device 1012 to reversely connect the DC power supply 1011 and the semiconductor cooling plate 302; at this time, the first end 3021 of the semiconductor cooling plate generates heat to heat the terminal connector 202.

[0079] In a possible implementation, within a preset heating time, the control module 102 controls the DC power supply 1011 to output a preset power, so that the first end 3021 of the semiconductor refrigeration plate heats the terminal connector 202. When the first end 3021 of the semiconductor refrigeration plate heats the terminal connector 202, the temperature sensor 301 detects the temperature of the terminal connector 202; the control module 102 obtains the temperature value detected by the temperature sensor 301, calculates the temperature rise rate based on the detected temperature value, and compares the calculated temperature rise rate with the pre-calibrated temperature rise rate:

[0080] When the calculated temperature rise rate is within the pre-calibrated temperature rise rate threshold range, the control module 102 determines that the state of the temperature sensor 301 is normal;

[0081] When the calculated temperature rise rate is not within the pre-calibrated temperature rise rate threshold range, the control module 102 determines that the state of the temperature sensor 301 is a fault.

[0082] In another possible implementation, within a preset heating time, the control module 102 controls the DC power supply 1011 to output a preset power, so that the first end 3021 of the semiconductor refrigeration plate heats the terminal connector 202. When the first end 3021 of the semiconductor refrigeration plate heats the terminal connector 202, the temperature sensor 301 detects the temperature of the terminal connector 202; the control module 102 obtains the temperature value detected by the temperature sensor 301, and compares the obtained temperature value with the pre-calibrated temperature value:

[0083] When the acquired temperature value is within the pre-calibrated temperature value threshold range, the control module 102 determines that the state of the temperature sensor 301 is normal;

[0084] When the acquired temperature value is not within the pre-calibrated temperature value threshold range, the control module 102 determines that the state of the temperature sensor 301 is faulty.

[0085] When the state of the temperature sensor 301 is faulty, the charging device 100 disconnects the charging connection; that is, when the state of the temperature sensor 301 is faulty, the charging terminal 201 does not output current to charge the electric vehicle.

[0086] In specific implementation, the power polarity conversion device 1012 can be implemented in different ways such as a three-state switch, a double-throw switch or a relay combination. Figure 2FIG. 1 is a schematic diagram of a power polarity conversion device 1012. The power polarity conversion device 1012 can use two three-state switches K1 and K2 to convert the polarity of the DC power supply 1011 supplying power to the semiconductor cooling plate 302. In other words, the control module 102 can change the direction of the current flowing through the semiconductor cooling plate 302 by controlling the connection position of the three-state switches K1 and K2 and the contacts 1 and 3.

[0087] like Figure 2 As shown in (a), when K1 and K2 are connected to contact 1 at the same time, the DC power supply 1011 is positively connected to the semiconductor refrigeration chip 302. That is, when K1 and K2 are connected to contact 1 at the same time, the positive electrode of the DC power supply 1011 is connected to the positive electrode 3023 of the external lead of the semiconductor refrigeration chip, and the negative electrode of the DC power supply 1011 is connected to the negative electrode 3024 of the external lead of the semiconductor refrigeration chip. At this time, the current flowing out of the DC power supply 1011 flows to the negative electrode 3024 of the external lead of the semiconductor refrigeration chip through the positive electrode 3023 of the external lead of the semiconductor refrigeration chip.

[0088] like Figure 2 As shown in (b), when K1 and K2 are connected to contact 3 at the same time, the DC power supply 1011 is reversely connected to the semiconductor refrigeration chip 302. That is, when K1 and K2 are connected to contact 3 at the same time, the positive electrode of the DC power supply 1011 is connected to the negative electrode 3024 of the external lead of the semiconductor refrigeration chip, and the negative electrode of the DC power supply 1011 is connected to the positive electrode 3023 of the external lead of the semiconductor refrigeration chip. At this time, the current flowing out of the DC power supply 1011 flows to the positive electrode 3023 of the external lead of the semiconductor refrigeration chip through the negative electrode 3024 of the external lead of the semiconductor refrigeration chip.

[0089] It can be understood that after the first end 3021 of the semiconductor refrigeration plate has been heated for a preset time, the control module 102 can control the power polarity conversion device 1012 to disconnect the DC power supply 1011 from the semiconductor refrigeration plate 302, thereby stopping the heating of the first end 3021 of the semiconductor refrigeration plate.

[0090] In a possible implementation, Figure 3 As shown, the control module 102 controls K1 and K2 so that both K1 and K2 are connected to the suspended contact 2. At this time, the DC power supply 1011 and the semiconductor cooling plate 302 do not form a complete power supply circuit, so that the first end 3021 of the semiconductor cooling plate stops heating.

[0091] In another possible implementation, the control module 102 controls the DC power supply 1011 to stop outputting current to power the semiconductor refrigerator 302, thereby stopping heating the first end 3021 of the semiconductor refrigerator.

[0092] Generally speaking, the charging cabinet 10 also includes a power module 103, which is connected to the power grid and can convert the alternating current input from the power grid into direct current that matches the charging power of the electric vehicle; and the power module 103 is connected to the charging terminal 201 through a power cable, and can transmit direct current to the charging terminal 201 through the power cable, so that the charging terminal 201 can charge the electric vehicle; at the same time, the power module 103 is also connected to the control module 102, and the control module 102 controls the output current of the power module 103, thereby controlling the magnitude of the output current of the charging terminal 201.

[0093] In actual application, when the temperature sensor 301 is in a fault state, the control module 102 controls the power module 103 to prevent it from outputting current, so that the charging terminal 201 cannot output current to charge the electric vehicle, thereby disconnecting the charging device 100 from the electric vehicle.

[0094] Exemplarily, the DC power supply 1011 can be but is not limited to a battery or an auxiliary power supply; if the DC power supply 1011 is an auxiliary power supply, the auxiliary power supply can be connected to the power module 103 to convert the current provided by the power module 103 into a low-voltage DC power for use by the semiconductor refrigerator 302; or the auxiliary power supply can be connected to the mains to convert the AC power input from the mains into a low-voltage DC power for use by the semiconductor refrigerator 302.

[0095] When the state of the temperature sensor 301 is normal, the control module 102 controls the power module 103 to output current, so that the charging terminal 201 starts to output current to charge the electric vehicle; and the control module 102 controls the power polarity conversion device 1012 to connect the semiconductor cooling sheet 302 to the DC power supply 1011, so that the first end 3021 of the semiconductor cooling sheet is cooled. Specifically, Figure 2 As shown in (a), the control module 102 controls the power polarity conversion device 1012 to activate the three-state switches K1 and K2, both of which are connected to contact 1, so that the semiconductor refrigeration plate 302 is positively connected to the DC power supply 1011, the first end 3021 of the semiconductor refrigeration plate is cooling, and the second end 3022 of the semiconductor refrigeration plate is heating.

[0096] When the charging terminal 201 outputs current to charge the electric vehicle, the heat generated by the charging terminal 201 is transferred to the first end 3021 of the semiconductor refrigeration plate through the terminal connector 202. When the semiconductor refrigeration plate 302 is positively connected to the DC power supply 1011, the first end 3021 of the semiconductor refrigeration plate is cooled and the temperature is reduced, so that the heat from the terminal connector 202 can be absorbed. The heat is transferred to the second end 3022 of the semiconductor refrigeration plate through the inside of the semiconductor refrigeration plate 302, and the heat concentrated at the second end 3022 of the semiconductor refrigeration plate is dissipated through the semiconductor refrigeration plate cold source 303, thereby realizing the function of heat dissipation for the charging terminal 201.

[0097] In some embodiments, a heat conducting layer may be provided between the semiconductor cooling sheet 302 and the terminal connector 202 to enhance the heat conduction efficiency between the two. For example, the material of the heat conducting layer may be thermal conductive silicone grease, or other materials with good heat conduction effect, which is not limited in this application.

[0098] It should be noted that when the state of the temperature sensor 301 is normal, the control module 102 can first control the power module 103 to output current, so that the charging terminal 201 starts to output current to charge the electric vehicle, and then control the power polarity conversion device 1012 to connect the semiconductor refrigeration plate 302 to the DC power supply 1011; or the control module 102 can also first control the power polarity conversion device 1012 to connect the semiconductor refrigeration plate 302 to the DC power supply 1012, and then control the power module 103 to output current, so that the charging terminal 201 starts to output current to charge the electric vehicle. The specific order is not limited.

[0099] In addition, when the semiconductor refrigeration sheet 302 is positively connected to the DC power supply 1011, a large temperature difference can be formed between the first end 3021 of the semiconductor refrigeration sheet and the second end 3022 of the semiconductor refrigeration sheet. Since the temperature of the first end 3021 of the semiconductor refrigeration sheet is much lower than the ambient temperature, a large temperature gradient is formed between the terminal connector 202 and the first end 3021 of the semiconductor refrigeration sheet, thereby improving the effect of heat conduction and increasing the heat dissipation performance of the charging terminal 201. On the other hand, a large temperature gradient is also formed between the second end 3022 of the semiconductor refrigeration sheet and the semiconductor refrigeration sheet cold source 303, so that the heat of the second end 3022 of the semiconductor refrigeration sheet can be quickly transferred to the semiconductor refrigeration sheet cold source 303 to achieve a good heat dissipation effect.

[0100] In a specific implementation, the semiconductor refrigeration plate cold source 303 can be a liquid cooling cold source or an air cooling cold source.

[0101] like Figure 4The figure is a schematic diagram of the structure of an air-cooled cold source. The second end 3022 of the semiconductor cooling sheet is attached to the heat sink 3032, and a heat dissipation fan 3031 is arranged on the heat sink 3032. When the heat of the second end 3022 of the semiconductor cooling sheet is transferred to the heat sink 3032, the heat dissipation fan 3031 transfers the heat of the heat sink 3032 to the surrounding air in a convection manner, thereby realizing the function of dissipating heat for the semiconductor cooling sheet 302.

[0102] It is understandable that a heat conducting layer may be provided between the second end 3022 of the semiconductor cooling plate and the heat sink 3032 to enhance the heat conduction efficiency between the two. For example, the material of the heat conducting layer may be thermal conductive silicone grease, or other materials with good heat conduction effect, which is not limited in the present application.

[0103] like Figure 5 The figure shows a schematic diagram of a liquid cooling source. The second end 3022 of the semiconductor cooling sheet is attached to the liquid cooling plate 3033, and the liquid cooling plate 3033 is connected to the external cooling source 3036 through the liquid inlet pipe 3034 and the liquid outlet pipe 3035. The external cooling source 3036 sends the low-temperature cooling medium into the liquid cooling plate 3033 through the liquid inlet pipe 3034. The low-temperature cooling medium in the liquid cooling plate 3033 absorbs the heat concentrated on the second end 3022 of the semiconductor cooling sheet through convection heat exchange. The cooling medium after absorbing the heat returns to the cooling source device 3036 through the liquid outlet pipe 3035, thereby completing a cooling cycle.

[0104] It is understandable that a heat conducting layer may be provided between the second end 3022 of the semiconductor cooling plate and the liquid cooling plate 3033 to enhance the heat conduction efficiency between the two. For example, the material of the heat conducting layer may be thermal conductive silicone grease, or other materials with good heat conduction effect, which is not limited in this application.

[0105] In the embodiment of the present application, the external cold source 3036 can be arranged inside the charging cabinet 10, and the liquid inlet pipe 3034 and the liquid outlet pipe 3035 can be arranged inside the cable sheath 203; such an arrangement can not only dissipate heat for the charging terminal 201, but also dissipate heat for the cable located in the cable sheath 203, so that the charging gun 20 as a whole has a better heat dissipation effect. As a result, while ensuring a good heat dissipation effect of the cable, a relatively large charging power can be achieved without increasing the diameter of the cable sheath 203, which is conducive to reducing the mass of the cable and improving the convenience of using the charging gun. In addition, with this design, the liquid cooling plate 3033 and the cable located inside the cable sheath 203 can share the external cold source 3036 for heat dissipation, which is conducive to further simplifying the structure of the charging device 100.

[0106] refer to Figure 6As shown, the embodiment of the present application also provides a method for a charging device to detect the state of a charging gun temperature sensor, which is applied to the charging device and executed by a control module 102 in the charging device. The structure of the charging device can refer to the description in the above embodiment, and will not be repeated here. The method for detecting the state of the charging gun temperature sensor by the charging device may include the following steps:

[0107] Step S601: Control the power polarity conversion device to reversely connect the semiconductor cooling plate to the DC power supply.

[0108] In the above scheme, the power polarity conversion device is connected to the semiconductor cooling chip and the DC power supply respectively, and is used to convert the polarity of the DC power supply to the semiconductor cooling chip. That is, the control module can make the DC power supply and the semiconductor cooling chip connected positively or reversely by controlling the power polarity conversion device.

[0109] The semiconductor refrigeration plate includes a first end of the semiconductor refrigeration plate and a second end of the semiconductor refrigeration plate. The first end of the semiconductor refrigeration plate is an end for cooling when the semiconductor refrigeration plate is positively connected to a DC power supply; the second end of the semiconductor refrigeration plate is an end for heating when the semiconductor refrigeration plate is positively connected to the DC power supply; in other words, the first end of the semiconductor refrigeration plate is an end for heating when the semiconductor refrigeration plate is reversely connected to the DC power supply; the second end of the semiconductor refrigeration plate is an end for cooling when the semiconductor refrigeration plate is reversely connected to the DC power supply.

[0110] When the control module controls the power polarity conversion device to reversely connect the semiconductor cooling sheet to the DC power supply, the first end of the semiconductor cooling sheet generates heat to heat the terminal connection piece. Exemplarily, within a preset heating time, the control module controls the DC power supply to output a preset power to enable the first end of the semiconductor cooling sheet to heat the terminal connection piece.

[0111] Generally speaking, when the control module detects that the charging terminal is successfully plugged into the socket of the electric vehicle, the control module controls the power polarity conversion device to reverse the connection between the semiconductor cooling plate and the DC power supply.

[0112] Step S602: Acquire the value of the temperature sensor, and determine the state of the temperature sensor based on the acquired value of the temperature sensor.

[0113] In a possible implementation, when the first end of the semiconductor cooling sheet heats the terminal connector, the temperature sensor detects the temperature of the terminal connector; the control module obtains the temperature value detected by the temperature sensor, calculates the temperature rise rate based on the obtained temperature value, compares the calculated temperature rise rate with the pre-calibrated temperature rise rate, and determines the state of the temperature sensor:

[0114] When the calculated temperature rise rate is within a pre-calibrated temperature rise rate threshold range, the control module determines that the state of the temperature sensor is normal;

[0115] When the calculated temperature rise rate is not within a pre-calibrated temperature rise rate threshold range, the control module determines that the state of the temperature sensor is a fault.

[0116] In another possible implementation, when the first end of the semiconductor cooling sheet heats the terminal connector, the temperature sensor detects the temperature of the terminal connector; the control module obtains the temperature value detected by the temperature sensor, and compares the obtained temperature value with a pre-calibrated temperature value:

[0117] When the acquired temperature value is within the pre-calibrated temperature value threshold range, the control module determines that the state of the temperature sensor is normal;

[0118] When the acquired temperature value is not within a pre-calibrated temperature value threshold range, the control module determines that the state of the temperature sensor is a fault.

[0119] When the state of the temperature sensor is faulty, the charging device disconnects the charging connection; that is, when the state of the temperature sensor is faulty, the charging terminal does not output current to charge the electric vehicle.

[0120] Based on the above description, Figure 7 As shown, the method for detecting the temperature sensor of a charging gun by a charging device provided in an embodiment of the present application includes:

[0121] Step S701: Detect that the charging terminal and the electric vehicle socket have been successfully plugged in, and execute step S702.

[0122] Step S702: Control the power polarity conversion device to reversely connect the semiconductor cooling plate to the DC power supply. Execute step S703.

[0123] It should be noted that when the control module controls the power polarity conversion device to reversely connect the semiconductor cooling sheet to the DC power supply, the first end of the semiconductor cooling sheet generates heat to heat the terminal connection piece. Exemplarily, within a preset heating time, the control module controls the DC power supply to output a preset power to cause the first end of the semiconductor cooling sheet to heat the terminal connection piece.

[0124] When the first end of the semiconductor cooling plate is heated, the control module further controls the power polarity conversion device to disconnect the DC power supply from the semiconductor cooling plate.

[0125] Step S703: Obtain the value of the temperature sensor and execute step S704.

[0126] When the terminal connector is heated at the first end of the semiconductor cooling plate, the temperature sensor detects the temperature of the terminal connector; and the control module obtains the temperature value of the terminal connector detected by the temperature sensor.

[0127] Step S704: Determine whether the state of the temperature sensor is normal, if so, execute step S705, otherwise, execute step S707.

[0128] In a possible implementation, the control module calculates the temperature rise rate based on the acquired temperature value, compares the calculated temperature rise rate with a pre-calibrated temperature rise rate, and determines the state of the temperature sensor:

[0129] When the calculated temperature rise rate is within a pre-calibrated temperature rise rate threshold range, the control module determines that the state of the temperature sensor is normal;

[0130] When the calculated temperature rise rate is not within a pre-calibrated temperature rise rate threshold range, the control module determines that the state of the temperature sensor is a fault.

[0131] In another possible implementation, the control module compares the acquired temperature value with a pre-calibrated temperature value:

[0132] When the acquired temperature value is within the pre-calibrated temperature value threshold range, the control module determines that the state of the temperature sensor is normal;

[0133] When the acquired temperature value is not within a pre-calibrated temperature value threshold range, the control module determines that the state of the temperature sensor is a fault.

[0134] Step S705: Control the power polarity conversion device to connect the semiconductor cooling plate to the DC power supply in a positive direction, and execute step S706.

[0135] When the control module determines that the state of the temperature sensor is normal, the control module controls the power polarity conversion device to connect the semiconductor refrigeration plate to the DC power supply so that the first end of the semiconductor refrigeration plate is cooled, thereby allowing the semiconductor refrigeration plate to dissipate heat for the charging terminal.

[0136] Step S706: Control the power conversion module to output current.

[0137] When the control module determines that the state of the temperature sensor is normal, the control module controls the power conversion module to output current, so that the charging terminal outputs current to charge the electric vehicle.

[0138] Step S707: Control the charging device to disconnect the charging connection.

[0139] When the control module determines that the state of the temperature sensor is faulty, the control module controls the power conversion module to prevent it from outputting current, so that the charging terminal cannot output current to charge the electric vehicle, thereby disconnecting the charging device from the electric vehicle and ensuring the safety of charging.

[0140] In actual application, the execution order of step S705 and step S706 is not particular.

[0141] Based on the same technical concept, the present application embodiment also provides a charging system 800. Figure 8 As shown, the charging system 800 includes the aforementioned charging device 100 and an electric car 500. The electric car 500 includes a charging socket 501, and the charging terminal 201 can be plugged and unplugged with the charging socket 501, so that the charging device 100 can charge the electric car 500.

[0142] like Fig. 9 As shown, an embodiment of the present application also provides a temperature sensor state detection device 900, including a device to be cooled 901, a temperature sensor 902, a semiconductor refrigeration plate 903, a semiconductor refrigeration plate cold source 904, a power module 905 and a control module 906.

[0143] The device to be cooled 901 is a device that can generate heat when powered on; the temperature sensor 902 is used to detect the temperature of the device to be cooled 901. The semiconductor cooling sheet 903 is used to cool and dissipate heat for the device to be cooled 901, and includes a first end 9031 of the semiconductor cooling sheet and a second end 9032 of the semiconductor cooling sheet; the first end 9031 of the semiconductor cooling sheet is arranged toward the device to be cooled 901 and is thermally connected to the device to be cooled 901, and the second end 9032 of the semiconductor cooling sheet is arranged toward the semiconductor cooling sheet cold source 904 and is thermally connected to the semiconductor cooling sheet cold source 904; the semiconductor cooling sheet cold source 904 is used to dissipate heat for the second end 9032 of the semiconductor cooling sheet. The power module 905 includes a DC power supply 9051 and a power polarity conversion device 9052, the DC power supply 9051 is used to supply power to the semiconductor cooling sheet 903; the power polarity conversion device 9052 is used to convert the polarity of the DC power supply 9051 supplying power to the semiconductor cooling sheet 903. The control module 906 is used to control the power polarity conversion device 9052 to convert the polarity of the DC power supply 9051 supplying power to the semiconductor cooling plate 903; the control module 906 is also used to obtain the temperature value of the device to be cooled 901 detected by the temperature sensor 902.

[0144] In specific applications, the temperature sensor 902 may be located inside the device to be cooled 901 or outside the device to be cooled 901 . The specific location is not limited, and the location shown in the figure is only an example.

[0145] In the embodiment of the present application, when the DC power supply 9051 is positively connected to the semiconductor cooling sheet 903, the first end 9031 of the semiconductor cooling sheet is cooling, and the second end 9032 of the semiconductor cooling sheet is heating; when the DC power supply 9051 is reversely connected to the semiconductor cooling sheet 903, the first end 9031 of the semiconductor cooling sheet is heating, and the second end 9032 of the semiconductor cooling sheet is cooling. Wherein, the DC power supply 9051 is positively connected to the semiconductor cooling sheet 903 as follows: the positive electrode of the DC power supply 9051 is connected to the positive electrode 9033 of the external lead of the semiconductor cooling sheet, and the negative electrode of the DC power supply 9051 is connected to the negative electrode 9034 of the external lead of the semiconductor cooling sheet; the DC power supply 9051 is reversely connected to the semiconductor cooling sheet 903 as follows: the positive electrode of the DC power supply 9051 is connected to the negative electrode 9034 of the external lead of the semiconductor cooling sheet, and the negative electrode of the DC power supply 9051 is connected to the positive electrode 9033 of the external lead of the semiconductor cooling sheet.

[0146] The power polarity conversion device 9052 is connected to the DC power supply 9051 and the semiconductor cooling sheet 903 respectively. In practical applications, the power polarity conversion device 9052 can be implemented in different ways such as a three-state switch, a double-throw switch or a relay combination. Figure 3 As shown, this is a schematic diagram of a power polarity conversion device, the working principle of which has been described in detail above and will not be repeated here.

[0147] The temperature sensor state detection device 900 provided in the embodiment of the present application has two working modes: heating verification mode and cooling mode. When the temperature sensor state detection device 900 works in the heating verification mode, the temperature sensor state detection device 900 can detect the state of the temperature sensor 902; when the temperature sensor state detection device 900 works in the cooling mode, the temperature sensor state detection device 900 can dissipate heat for the device to be cooled 901.

[0148] Specifically, when the temperature sensor state detection device 900 works in the heating verification mode, the control module 906 controls the power polarity conversion device 9052 to reversely connect the DC power supply 9051 to the semiconductor cooling plate 903, so that the first end 9031 of the semiconductor cooling plate generates heat to heat the device to be cooled 901. The temperature sensor 902 detects the temperature of the device to be cooled 901; the control module 906 obtains the temperature value of the device to be cooled 901 detected by the temperature sensor 902, and determines whether the state of the temperature sensor 902 is normal.

[0149] In a possible implementation, within a preset heating time, the control module 906 controls the DC power supply 9051 to output a preset power, so that the first end 9031 of the semiconductor refrigeration plate heats the device to be cooled 901. When the first end 9031 of the semiconductor refrigeration plate heats the device to be cooled 901, the temperature sensor 902 detects the temperature of the device to be cooled 901; the control module 906 obtains the temperature value detected by the temperature sensor 902, calculates the temperature rise rate, and compares the calculated temperature rise rate with the pre-calibrated temperature rise rate:

[0150] When the calculated temperature rise rate is within the pre-calibrated temperature rise rate threshold range, the control module 906 determines that the state of the temperature sensor 902 is normal;

[0151] When the calculated temperature rise rate is not within the pre-calibrated temperature rise rate threshold range, the control module 906 determines that the state of the temperature sensor 902 is a fault.

[0152] In another possible implementation, within a preset heating time, the control module 906 controls the DC power supply 9051 to output a preset power, so that the first end 9031 of the semiconductor refrigeration plate heats the device to be cooled 901. When the first end 9031 of the semiconductor refrigeration plate heats the device to be cooled 901, the temperature sensor 902 detects the temperature of the device to be cooled 901; the control module 906 obtains the temperature value detected by the temperature sensor 902, and compares the obtained temperature value with the pre-calibrated temperature value:

[0153] When the acquired temperature value is within the pre-calibrated temperature value threshold range, the control module 906 determines that the state of the temperature sensor 902 is normal;

[0154] When the acquired temperature value is not within the pre-calibrated temperature value threshold range, the control module 906 determines that the state of the temperature sensor 902 is a fault.

[0155] It can be understood that after the first end 9031 of the semiconductor refrigeration plate has completed heating within a preset time, the control module 906 can control the power polarity conversion device 9052 to disconnect the DC power supply 9051 from the semiconductor refrigeration plate 906, thereby stopping the heating of the first end 9031 of the semiconductor refrigeration plate.

[0156] When the temperature monitoring device 900 works in the cooling mode, the control module 906 controls the power polarity conversion device 9052 to connect the DC power supply 9051 to the semiconductor cooling plate 903, so that the first end 9031 of the semiconductor cooling plate is cooled to dissipate heat for the device to be cooled 901.

[0157] Specifically, when the semiconductor refrigeration plate 903 is connected to the DC power supply 9051, the first end 9031 of the semiconductor refrigeration plate is cooled and the temperature is reduced, so that it can absorb heat from the device to be cooled 901. The heat is transferred to the second end 9032 of the semiconductor refrigeration plate through the inside of the semiconductor refrigeration plate 903. The heat concentrated at the second end 9032 of the semiconductor refrigeration plate is dissipated through the semiconductor refrigeration plate cold source 904, thereby realizing the function of dissipating heat for the device to be cooled 901.

[0158] In some embodiments, a heat conducting layer may be provided between the semiconductor cooling sheet 903 and the device to be cooled 901 to enhance the heat conduction efficiency between the two. For example, the material of the heat conducting layer may be thermal conductive silicone grease, or other materials with good heat conduction effect, which is not limited in this application.

[0159] Among them, the semiconductor refrigeration plate cold source 904 can be an air-cooled cold source or a liquid-cooled cold source, and its structure can refer to the above Figure 4 or Figure 5 , and its implementation principle has been described in detail above and will not be repeated here.

[0160] refer to Fig.10 As shown, the embodiment of the present application also provides a detection method of a temperature sensor state detection device, which is applied to the temperature sensor state detection device and executed by the control module 906 in the temperature sensor state detection device. The structure of the temperature sensor state detection device can refer to the description in the above embodiment, and will not be repeated here. The detection method of the temperature sensor state detection device may include the following steps:

[0161] Step S1001: Control the power polarity conversion device to reversely connect the semiconductor cooling plate to the DC power supply.

[0162] In the above scheme, the power polarity conversion device is connected to the semiconductor refrigeration chip and the DC power supply respectively, and is used to convert the polarity of the DC power supply to the semiconductor refrigeration chip. Specifically, the control module can make the DC power supply be positively connected or reversely connected to the semiconductor refrigeration chip by controlling the power polarity conversion device. When the DC power supply is positively connected to the semiconductor refrigeration chip, the positive pole of the DC power supply is connected to the positive pole of the external lead of the semiconductor refrigeration chip, and the negative pole of the DC power supply is connected to the negative pole of the external lead of the semiconductor refrigeration chip; when the DC power supply is reversely connected to the semiconductor refrigeration chip, the positive pole of the DC power supply is connected to the negative pole of the external lead of the semiconductor refrigeration chip, and the negative pole of the DC power supply is connected to the positive pole of the external lead of the semiconductor refrigeration chip.

[0163] In an embodiment of the present application, when the semiconductor refrigeration plate is positively connected to a DC power supply, the first end of the semiconductor refrigeration plate cools and the second end of the semiconductor refrigeration plate heats; when the semiconductor refrigeration plate is reversely connected to the DC power supply, the first end of the semiconductor refrigeration plate heats and the second end of the semiconductor refrigeration plate cools.

[0164] When the control module controls the power polarity conversion device to reversely connect the semiconductor refrigeration chip to the DC power supply, the first end of the semiconductor refrigeration chip generates heat to heat the device to be cooled. For example, within a preset heating time, the control module controls the DC power supply to output a preset power to enable the first end of the semiconductor refrigeration chip to heat the device to be cooled.

[0165] Step S1002: Acquire the value detected by the temperature sensor, and determine the state of the temperature sensor based on the acquired value detected by the temperature sensor.

[0166] In a possible implementation, when the first end of the semiconductor refrigeration sheet heats the device to be cooled, the temperature sensor detects the temperature of the device to be cooled; the control module obtains the temperature value of the device to be cooled detected by the temperature sensor, calculates the temperature rise rate, compares the calculated temperature rise rate with the pre-calibrated temperature rise rate, and determines the state of the temperature sensor:

[0167] When the calculated temperature rise rate is within a pre-calibrated temperature rise rate threshold range, the control module determines that the state of the temperature sensor is normal;

[0168] When the calculated temperature rise rate is not within a pre-calibrated temperature rise rate threshold range, the control module determines that the state of the temperature sensor is a fault.

[0169] In another possible implementation, when the first end of the semiconductor refrigeration sheet heats the device to be cooled, the temperature sensor detects the temperature of the device to be cooled; the control module obtains the temperature value of the device to be cooled detected by the temperature sensor, and compares the obtained temperature value with a pre-calibrated temperature value:

[0170] When the acquired temperature value is within the pre-calibrated temperature value threshold range, the control module determines that the state of the temperature sensor is normal;

[0171] When the acquired temperature value is not within a pre-calibrated temperature value threshold range, the control module determines that the state of the temperature sensor is a fault.

[0172] Generally, after the first end of the semiconductor refrigeration plate is heated for a preset time, the control module controls the power polarity conversion device to disconnect the DC power supply from the semiconductor refrigeration plate, thereby stopping the heating of the first end of the semiconductor refrigeration plate.

[0173] It should be noted that the control module in the above embodiments may be one or more controllers. When the control module includes multiple controllers, each controller may implement different control functions, and each controller may communicate with each other.

[0174] In specific implementation, the control module can be a general-purpose central processing unit (CPU), a general-purpose processor, a digital signal processing (DSP), an application specific integrated circuit (ASIC), a field programmable gate array (FPGA) or other programmable logic devices, transistor logic devices, hardware components or any combination thereof.

[0175] It should be noted that, for the sake of simplicity of description, the aforementioned method embodiments are all expressed as a series of action combinations, but those skilled in the art should know that the present application is not limited by the described order of actions, because according to the present application, some steps can be performed in other orders or simultaneously.

[0176] The steps in the method of the embodiment of the present application can be adjusted in order, combined and deleted according to actual needs.

[0177] The above are only specific implementations of the present application, but the protection scope of the present application is not limited thereto. Any technician familiar with the technical field can easily think of changes or substitutions within the technical scope disclosed in the present application, which should be included in the protection scope of the present application. Therefore, the protection scope of the present application should be based on the protection scope of the claims.

Claims

1. A charging device, characterized in that: The charging device includes a charging gun, a temperature sensor, a semiconductor refrigeration sheet, a semiconductor refrigeration sheet cold source, a power module and a control module: The charging gun comprises a charging terminal and a terminal connector, wherein the charging terminal is used to be plugged into a charging socket of an electric vehicle; The temperature sensor is used to detect the temperature of the charging terminal; The semiconductor refrigeration sheet comprises a first end and a second end, the first end of the semiconductor refrigeration sheet is thermally connected to the terminal connector, and the second end of the semiconductor refrigeration sheet is thermally connected to the semiconductor refrigeration sheet cold source; The semiconductor refrigeration plate cold source is used to dissipate heat for the second end of the semiconductor refrigeration plate; The power module includes a DC power supply and a power polarity conversion device, wherein the DC power supply is used to supply power to the semiconductor cooling sheet, and the power polarity conversion device is connected to the DC power supply and is used to convert the polarity of the DC power supply supplying power to the semiconductor cooling sheet; The control module is used to control the power polarity conversion device to convert the polarity of the DC power supply to the semiconductor cooling chip; The control module is further used to obtain the temperature value of the charging terminal detected by the temperature sensor, and determine the state of the temperature sensor based on the obtained temperature value of the charging terminal detected by the temperature sensor.

2. The charging device according to claim 1, characterized in that: The control module is used to control the power polarity conversion device so that the semiconductor cooling plate is positively connected or reversely connected to the DC power supply: In response to the semiconductor cooling sheet being positively connected to the DC power supply, the first end of the semiconductor cooling sheet is used for cooling; In response to the semiconductor cooling plate being reversely connected to the DC power supply, the first end of the semiconductor cooling plate is used for heating.

3. The charging device according to any one of claims 1 or 2, characterized in that: The control module is also used for: In response to a temperature rise rate of a temperature value of the charging terminal detected by the temperature sensor being within a preset temperature rise rate threshold range, determining that the state of the temperature sensor is normal; In response to a temperature rise rate of a temperature value of the charging terminal detected by the temperature sensor not being within a preset temperature rise rate threshold range, determining that the state of the temperature sensor is a fault; or In response to a temperature value of the charging terminal detected by the temperature sensor being within a preset temperature value range, determining that the state of the temperature sensor is normal; In response to the temperature value of the charging terminal detected by the temperature sensor being not within a preset temperature value range, it is determined that the state of the temperature sensor is a fault.

4. The charging device according to any one of claims 1 to 3, characterized in that: When the state of the temperature sensor is faulty, the control module is further used to control the charging device to disconnect the charging connection.

5. The charging device according to any one of claims 1 to 4, characterized in that: The charging device also includes a power module, which is connected to the charging terminal and is used to provide electrical energy to the charging terminal.

6. A method for detecting the state of a charging gun temperature sensor by a charging device, characterized in that: The charging device includes a charging gun, a temperature sensor, a semiconductor refrigeration sheet, a semiconductor refrigeration sheet cold source, a power module and a control module: The charging gun includes a charging terminal and a terminal connector; The temperature sensor is used to detect the temperature of the charging terminal; The semiconductor refrigeration sheet is divided into a first end and a second end, the first end of the semiconductor refrigeration sheet is thermally connected to the terminal connector, and the second end of the semiconductor refrigeration sheet is thermally connected to the semiconductor refrigeration sheet cold source; The semiconductor refrigeration plate cold source is used to dissipate heat for the second end of the semiconductor refrigeration plate; The power supply module includes a DC power supply and a power supply polarity conversion device, and the power supply polarity conversion device is connected to the DC power supply; The method is applicable to the control module, and the method comprises: Controlling the power polarity conversion device so that the semiconductor cooling plate is reversely connected to the DC power supply; A temperature value of the charging terminal detected by the temperature sensor is obtained, and a state of the temperature sensor is determined based on the obtained temperature value of the charging terminal.

7. The method for detecting the state of a charging gun temperature sensor by a charging device according to claim 6, characterized in that: Before controlling the power polarity conversion device to reversely connect the semiconductor cooling plate to the DC power supply, the method further includes: the control module detecting that the charging terminal has been successfully plugged in.

8. The method for detecting the state of a charging gun temperature sensor by a charging device according to any one of claims 6 or 7, characterized in that: The control module controls the power polarity conversion device to make the semiconductor cooling plate positively or reversely connected to the DC power supply: In response to the semiconductor cooling sheet being positively connected to the DC power supply, the first end of the semiconductor cooling sheet is cooled; In response to the reverse connection between the semiconductor refrigeration plate and the DC power supply, the first end of the semiconductor refrigeration plate generates heat.

9. The method for detecting the state of a charging gun temperature sensor by a charging device according to any one of claims 6 to 8, characterized in that: In response to a temperature rise rate of a temperature value of the charging terminal detected by the temperature sensor being within a preset temperature rise rate threshold range, the control module determines that the state of the temperature sensor is normal; In response to the temperature rise rate of the temperature value of the charging terminal detected by the temperature sensor not being within a preset temperature rise rate threshold range, the control module determines that the state of the temperature sensor is a fault; or In response to the temperature value of the charging terminal detected by the temperature sensor being within a preset temperature value range, the control module determines that the state of the temperature sensor is normal; In response to the temperature value of the charging terminal detected by the temperature sensor being not within a preset temperature value range, the control module determines that the state of the temperature sensor is a fault.

10. The method for detecting the state of a charging gun temperature sensor by a charging device according to any one of claims 6 to 9, characterized in that: When the temperature sensor is in a fault state, the control module controls the charging device to disconnect the charging connection.

11. A charging system, characterized in that: The charging system includes a charging device and a device to be charged. The charging device is connected to the device to be charged through a charging gun for charging the device to be charged. The charging device includes: a charging gun, a temperature sensor, a semiconductor cooling sheet, a semiconductor cooling sheet cold source, a power module and a control module: The charging gun comprises a charging terminal and a terminal connector, wherein the charging terminal is used to be plugged into a charging socket of an electric vehicle; the temperature sensor is used to detect the temperature of the charging terminal; the semiconductor refrigeration sheet is divided into a first end and a second end, wherein the first end of the semiconductor refrigeration sheet is thermally connected to the terminal connector, and the second end of the semiconductor refrigeration sheet is thermally connected to a cold source of the semiconductor refrigeration sheet; the cold source of the semiconductor refrigeration sheet is used to dissipate heat for the second end of the semiconductor refrigeration sheet; the power module comprises a DC power supply and a power polarity conversion device, wherein the DC power supply is used to supply power to the semiconductor refrigeration sheet, and the power polarity conversion device is connected to the DC power supply and is used to convert the polarity of the DC power supply supplying power to the semiconductor refrigeration sheet; The control module is used to control the power polarity conversion device to convert the polarity of the DC power supply to the semiconductor cooling chip; The control module is further used to obtain the temperature value of the charging terminal detected by the temperature sensor, and determine the state of the temperature sensor based on the obtained temperature value of the charging terminal detected by the temperature sensor.

12. The charging system according to claim 11, characterized in that: The control module is used to control the power polarity conversion device so that the semiconductor cooling plate is positively connected or reversely connected to the DC power supply: In response to the semiconductor cooling sheet being positively connected to the DC power supply, the first end of the semiconductor cooling sheet is used for cooling; In response to the semiconductor cooling plate being reversely connected to the DC power supply, the first end of the semiconductor cooling plate is used for heating.

13. The charging system according to any one of claims 11 or 12, characterized in that: The control module is used for: In response to a temperature rise rate of a temperature value of the charging terminal detected by the temperature sensor being within a preset temperature rise rate threshold range, determining that the state of the temperature sensor is normal; In response to a temperature rise rate of a temperature value of the charging terminal detected by the temperature sensor not being within a preset temperature rise rate threshold range, determining that the state of the temperature sensor is a fault; or In response to a temperature value of the charging terminal detected by the temperature sensor being within a preset temperature value range, determining that the state of the temperature sensor is normal; In response to the temperature value of the charging terminal detected by the temperature sensor being not within a preset temperature value range, it is determined that the state of the temperature sensor is a fault.

14. The charging system according to any one of claims 11 to 13, characterized in that: When the temperature sensor is in a fault state, the control module is further configured to control the charging device to disconnect the charging connection.

15. A temperature sensor state detection device, characterized in that: The temperature sensor state detection device includes a temperature sensor, a device to be cooled, a semiconductor refrigeration sheet, a semiconductor refrigeration sheet cold source, a power module and a control module: The temperature sensor is used to detect the temperature of the device to be cooled; The semiconductor refrigeration sheet is divided into a first end and a second end, the first end of the semiconductor refrigeration sheet is thermally connected to the device to be cooled, and the second end of the semiconductor refrigeration sheet is thermally connected to the semiconductor refrigeration sheet cold source; The power module includes a DC power supply and a power polarity conversion device, wherein the DC power supply is used to supply power to the semiconductor cooling sheet, and the power polarity conversion device is connected to the DC power supply and is used to convert the polarity of the DC power supply supplying power to the semiconductor cooling sheet; The control module is used to control the power polarity conversion device to convert the polarity of the DC power supply to the semiconductor cooling chip; The control module is further used to obtain a temperature value of the cooling device detected by the temperature sensor, and determine a state of the temperature sensor based on the obtained temperature value of the cooling device detected by the temperature sensor.

16. The temperature sensor state detection device according to claim 15, characterized in that: The control module is used to control the power polarity conversion device so that the semiconductor cooling plate is positively connected or reversely connected to the DC power supply: In response to the semiconductor cooling sheet being positively connected to the DC power supply, the first end of the semiconductor cooling sheet is used for cooling; In response to the semiconductor cooling plate being reversely connected to the DC power supply, the first end of the semiconductor cooling plate is used for heating.

17. The temperature sensor state detection device according to any one of claims 15 or 16, characterized in that: The control module is used for: In response to the temperature rise rate of the temperature value of the device to be cooled detected by the temperature sensor being within a preset temperature rise rate threshold range, determining that the state of the temperature sensor is normal; In response to the temperature rise rate of the temperature value of the device to be cooled detected by the temperature sensor not being within a preset temperature rise rate threshold range, determining that the state of the temperature sensor is a fault; or In response to the temperature value of the device to be cooled detected by the temperature sensor being within a preset temperature value range, determining that the state of the temperature sensor is normal; In response to the temperature value of the device to be cooled detected by the temperature sensor not being within a preset temperature value range, it is determined that the state of the temperature sensor is a fault.

18. A detection method for a temperature sensor state detection device, characterized in that: The temperature sensor state detection device includes a temperature sensor, a device to be cooled, a semiconductor refrigeration sheet, a semiconductor refrigeration sheet cold source, a power module and a control module: The temperature sensor is used to detect the temperature of the device to be cooled; the semiconductor refrigeration sheet is divided into a first end and a second end, the first end of the semiconductor refrigeration sheet is thermally connected to the device to be cooled, and the second end of the semiconductor refrigeration sheet is thermally connected to the cold source of the semiconductor refrigeration sheet; The power supply module comprises a DC power supply and a power supply polarity conversion device, wherein the power supply polarity conversion device is connected to the DC power supply; The method is applicable to the control module, and the method comprises: Controlling the power polarity conversion device so that the semiconductor cooling plate is reversely connected to the DC power supply; A temperature value of the cooling device detected by the temperature sensor is obtained, and a state of the temperature sensor is determined based on the obtained temperature value of the cooling device detected by the temperature sensor.

19. The detection method of the temperature sensor state detection device according to claim 18, characterized in that: The control module controls the power polarity conversion device to make the semiconductor cooling plate positively or reversely connected to the DC power supply: In response to the semiconductor cooling sheet being positively connected to the DC power supply, the first end of the semiconductor cooling sheet is used for cooling; In response to the semiconductor cooling plate being reversely connected to the DC power supply, the first end of the semiconductor cooling plate is used for heating.

20. The detection method of the temperature sensor state detection device according to any one of claims 18 or 19, characterized in that: In response to the temperature rise rate of the temperature value of the device to be cooled detected by the temperature sensor being within a preset temperature rise rate threshold range, the control module determines that the state of the temperature sensor is normal; In response to the temperature rise rate of the temperature value of the device to be cooled detected by the temperature sensor not being within a preset temperature rise rate threshold range, the control module determines that the state of the temperature sensor is a fault; or In response to the temperature value of the device to be cooled detected by the temperature sensor being within a preset temperature value range, the control module determines that the state of the temperature sensor is normal; In response to the temperature value of the device to be cooled detected by the temperature sensor not being within a preset temperature value range, the control module determines that the state of the temperature sensor is a fault.

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