Circuit board for camera module and corresponding camera module

Abstract

The present invention provides a camera module, wherein the photosensitive component comprises a photosensitive chip, a circuit board, and a reinforcement plate attached to the bottom surface of the circuit board body. Side connecting strips extend from the side of the circuit board body. Each side connecting strip extends from a side of the circuit board body and bends upward. After bending, it extends to the side of the optical lens and / or the photosensitive component to form a side connecting strip body. The side connecting strip is suspended from the actuator fixing portion. The portion where the connecting strip soft board connects to the circuit board body forms an upwardly bent soft board bend portion. The edge area of ​​the reinforcement plate comprises an upwardly bent reinforcement plate bend portion and a reinforcement plate side portion formed by continuing to extend upward from the reinforcement plate bend portion. The reinforcement plate bend portion wraps around the outside of the soft board bend portion, and the reinforcement plate side portion contacts the side connecting strip but is not connected to each other. The present invention can reduce the movement resistance of the circuit board body and the photosensitive chip, and has a high yield rate and high production efficiency.

Description

Technical Field

[0001] The present invention relates to the technical field of camera modules, and in particular to a circuit board for a camera module and a corresponding camera module. Background Art

[0002] Mobile phone camera modules are a crucial component of smart devices, and their application scope and volume continue to grow. Technological advancements are driving the shift to smart technology in both work and life. A crucial prerequisite for achieving this intelligence is the ability to interact effectively with the external environment. Visual perception is a crucial component of this interaction, and camera modules are crucial for this. It can be said that camera modules have evolved from obscure accessories to become a crucial component in smart devices.

[0003] As the imaging quality requirements of mobile phone camera modules become higher and higher, the size and weight of the lenses are getting larger and larger, and the driving force requirements for motors (i.e., optical actuators) are also getting higher and higher. However, current electronic devices (such as mobile phones) also have great restrictions on the size of camera modules, and the volume occupied by the motor increases accordingly with the increase of the lens. In other words, as the lens develops towards larger size and heavier weight, the driving force that the motor can provide is difficult to increase accordingly. Under the premise of limited driving force, the heavier the lens, the shorter the stroke that the motor can drive the lens to move, affecting the anti-shake ability. On the other hand, the heavier the lens, the slower the speed at which the motor can drive the lens to move, and the longer the time it takes for the lens to reach the predetermined compensation position, which will also affect the anti-shake effect.

[0004] In order to overcome the above-mentioned defects, the applicant has proposed a dual OIS motor (OIS is the abbreviation of optical image stabilization, sometimes also called optical image stabilization). The motor has two parts, one of which is used to drive the movement of the optical lens, and the other is used to drive the movement of the photosensitive chip. By driving the optical lens and the photosensitive chip to move at the same time, a better anti-shake effect can be achieved. However, in the traditional solution, the photosensitive chip is attached to the circuit board, and the connecting belt on the circuit board will cause greater resistance to the movement of the photosensitive chip. Specifically, in the traditional solution, the circuit board is usually a soft-hard combination board, in which the hard board part is the main part of the circuit board, and the soft board part is led out from the side of the main part to form a connecting belt. The end of the connecting belt (i.e., the free end) can be provided with a connector for plugging with the mobile phone motherboard. For example, the connector at the end of the connecting belt can be in the shape of a pin array, and a corresponding socket-shaped connector is provided on the mobile phone motherboard. The electrical connection between the circuit board of the camera module and the mobile phone motherboard is achieved by plugging the pins and the socket. One end of the connecting belt of the above-mentioned traditional circuit board is fixed to the mainboard of the mobile phone. When the photosensitive chip moves, the main body of the circuit board will move accordingly, while the connecting belt on its side will be pulled by its connector end, thereby forming a large resistance. During the anti-shake movement, the resistance of the connecting belt will cause the optical actuator to provide a greater driving force, which is not conducive to the miniaturization of the camera module. On the other hand, the resistance of the connecting belt is irregular, and it may also cause the accuracy of the anti-shake movement to decrease. Furthermore, the dual OIS motor has a more complex motor structure, which increases the wiring area required for the circuit board. If the traditional solution of stacking more PCB board layers is adopted to increase the wiring area, the height of the camera module will increase.

[0005] Furthermore, the applicant has proposed a solution that overcomes the aforementioned drawbacks by extending side connecting straps from two symmetrical sides of the circuit board body. The surfaces of these two side connecting straps are approximately perpendicular to the surface of the circuit board body. A curved portion is formed between the side connecting straps and the circuit board body by an upwardly bent flexible board. These side connecting straps can be suspended from the fixed portion of the optical actuator. This novel circuit board design reduces the resistance to movement of the circuit board body caused by the connecting straps used to connect to the mobile phone motherboard. However, this novel circuit board structure still presents numerous challenges during actual assembly, such as low yield and insufficient production efficiency. Therefore, further optimization of the circuit board structure is necessary to reduce the resistance of the connecting straps while improving the yield and production efficiency of the camera module. For example, this could be achieved by designing the circuit board structure to be more suitable for automated production, thereby improving production efficiency through automated production. Another example is that by analyzing and identifying the main factors affecting the camera module's yield, the camera module and its circuit board structure can be improved, ultimately increasing the yield of the finished camera module. Summary of the Invention

[0006] The purpose of the present invention is to overcome the shortcomings of the prior art and provide a camera module solution that can reduce the movement resistance of the circuit board body and the photosensitive chip, has a high yield rate and high production efficiency.

[0007] In order to solve the above technical problems, the present invention provides a camera module, which includes an optical lens, a photosensitive component and an optical actuator, and the optical actuator includes an actuator fixed part and an actuator movable part. The photosensitive component has a photosensitive chip, a circuit board and a reinforcement plate, and the circuit board includes a circuit board body and at least two side connection belts, and the reinforcement plate is attached to the bottom surface of the circuit board body. The circuit board body has a surface perpendicular to the optical axis of the camera module and multiple side surfaces parallel to the optical axis; for each of the side connection belts, it is led out from a side surface of the circuit board body and bent upward, and after bending, it extends to the side of the optical lens and / or the photosensitive component to form a side connection belt body. The side connecting strip includes a connecting strip soft board and a connecting strip hard board that are connected to each other, and the connecting strip hard board is suspended on the actuator fixing part; the part where the connecting strip soft board is connected to the circuit board body forms an upwardly bent soft board bent portion, and the edge area of ​​the reinforcing plate has an upwardly bent reinforcing plate bent portion and a reinforcing plate side portion formed by continuing to extend upward from the reinforcing plate bent portion, the reinforcing plate bent portion is wrapped around the outside of the soft board bent portion, and the reinforcing plate side portion is in contact with the side connecting strip but not connected to each other.

[0008] Among them, among the at least two side connecting strips of the circuit board, the outer surface of the hard board of one of the side connecting strips has multiple solder pads, and the hard board of the other side connecting strip has multiple conductive through-holes, and the hard boards of the two side connecting strips are arranged overlappingly; the welding medium is attached to the side walls of the conductive through-holes and passes through the conductive through-holes to contact the solder pads.

[0009] The plurality of side surfaces include a first side surface, a second side surface opposite to the first side surface, a third side surface adjacent to the first side surface, and a fourth side surface opposite to the third side surface. The side connecting strips include: a first connecting strip, comprising a first connecting strip soft board and a first connecting strip hard board, the first connecting strip soft board extending from the first side surface of the circuit board body, bending upward, extending along the first side surface, and then bending to the third side surface, the first connecting strip hard board being located on the third side surface and having a side surface connected to the first connecting strip soft board, the surface of the first connecting strip hard board being parallel to the optical axis; and a second connecting strip, comprising a second connecting strip soft board and a second connecting strip hard board, the second connecting strip soft board extending from the second side surface of the circuit board body, bending upward, extending along the second side surface, and then bending to the third side surface, the second connecting strip hard board being located on the third side surface and having a side surface connected to the second connecting strip soft board, the surface of the second connecting strip hard board being parallel to the optical axis. Among them, the first connecting strip hard board is located on the outside of the second connecting strip hard board, the first connecting strip hard board has a plurality of conductive through-holes, the outer surface of the second connecting strip hard board has a plurality of soldering pads, the conductive through-holes and the soldering pads are connected by a welding medium, the welding medium is sprayed into and through the conductive through-holes in a molten state, and after cooling, it adheres to the soldering pads and the conductive through-holes to electrically connect the conductive through-holes and the soldering pads.

[0010] The first connection belt hard plate and the second connection belt hard plate are bonded together by an adhesive medium; and a gap of no more than 100 μm is provided between the inner surface of the first connection belt hard plate and the outer surface of the second connection belt hard plate.

[0011] The molten soldering medium enters the conductive via in the form of a jet stream and adheres to the sidewall of the conductive via. The soldering medium then passes through the conductive via and contacts the pad. After solidification, the soldering medium forms a connector that spans the gap between the inner surface of the first connecting strip rigid board and the outer surface of the second connecting strip rigid board. A gap remains between the soldering medium and a portion of the conductive via wall.

[0012] Wherein, the reinforcement plate is a metal plate.

[0013] Wherein, the thickness of the reinforcing plate is smaller than the thickness of the circuit board body.

[0014] Among them, there is a central through hole in the center of the circuit board body, the photosensitive chip is attached to the upper surface of the reinforcement plate and the photosensitive chip is placed in the central through hole; an annular base is provided on the upper surface of the circuit board body, the annular base surrounds the photosensitive chip, and the top surface of the annular base is installed on the filter, the filter, the annular base, the circuit board body and the reinforcement plate form a closed cavity, and the photosensitive chip is encapsulated in the closed cavity.

[0015] Among them, the movable part of the actuator includes a chip anti-shake movable part, and the photosensitive package composed of the circuit board body, the filter, the annular base, the reinforcement plate and the photosensitive chip is fixed to the chip anti-shake movable part, and the photosensitive package is suitable for moving relative to the actuator fixed part under the drive of the chip anti-shake movable part.

[0016] The outer side surface of the actuator fixing portion has a boss protruding outward, the hard plate of the side connecting belt has a hanging hole, and the boss passes through the hanging hole to hang the side connecting belt on the actuator fixing portion.

[0017] Among them, the circuit board also includes a third connecting belt formed by extending from the lower side of the first connecting belt hard board and bending outward, the surface of the third connecting belt is perpendicular to the optical axis, and the free end of the third connecting belt has a connector, and the connector is suitable for plugging into the mainboard of the electronic device equipped with the camera module.

[0018] The actuator movable part further includes a lens driving movable part, the optical lens is mounted on the lens driving movable part, and is adapted to move relative to the actuator fixed part under the drive of the lens driving movable part.

[0019] The reinforcing plate bend is integrally formed with the main body of the reinforcing plate, is located outside the side of the main body of the reinforcing plate, and has a width smaller than the side of the main body of the reinforcing plate.

[0020] Wherein, the bent portion of the reinforcement plate has a through hole.

[0021] Compared with the prior art, this application has at least one of the following technical effects:

[0022] 1. In the present application, the camera module has a suspended circuit board structure, which includes a circuit board body and a side connecting belt. The side connecting belt is led out from the side of the circuit board body and bent upward to form a side state (i.e., a state parallel to the optical axis), and the side connecting belt can be suspended on the actuator fixing part, thereby greatly reducing the movement resistance of the circuit board body, reducing the driving force required to move the photosensitive component, and improving the driving accuracy.

[0023] 2. In this application, based on the suspended circuit board structure, a reinforcement plate is attached to the bottom surface of the circuit board body, and the bent portion of the reinforcement plate in the edge area of ​​the reinforcement plate is used to support the bent portion of the soft board of the side connecting belt, thereby further reducing the movement resistance of the circuit board body, further reducing the driving force required for the movement of the photosensitive component, and improving the driving accuracy.

[0024] 3. In some embodiments of the present application, the circuit board body of the camera module has multiple side connection belts extending from different sides, and these side connection belts are connected at the side of the camera module. The hard plate of the side connection belt can be hung on the actuator fixing part (the actuator fixing part can include a chip anti-shake fixing part and a lens drive fixing part fixed together). This design can significantly reduce the resistance caused by the connection belt to the movement of the circuit board body, and is particularly suitable for camera modules with chip anti-shake function. Furthermore, in the present application, an innovative non-plug-in method is used to achieve electrical connection at the juncture of the side connection belts, thereby preventing lateral extrusion of the optical actuator or optical element during the plug-in process, which may lead to a decrease in the imaging quality of the camera module.

[0025] 4. In this application, for the two side connecting strips that need to be electrically connected, the welding medium can be injected from the outside in the form of a high-temperature jet stream and pass through the conductive through-hole. After cooling, the welding medium can adhere to the side wall of the conductive through-hole and pass through the conductive through-hole to contact the solder pad, thereby achieving an electrical connection between the two side connecting strips in a non-plug-in manner. In this article, for various plate-shaped components arranged on the side of the camera module, the side close to the optical axis of the camera module is the inner side, and the side away from the optical axis is the outer side. BRIEF DESCRIPTION OF THE DRAWINGS

[0026] Figure 1 A three-dimensional exploded view of a camera module according to an embodiment of the present application is shown;

[0027] Figure 2 A three-dimensional schematic diagram of a camera module according to an embodiment of the present application is shown;

[0028] Figure 3 A schematic perspective view of a chip driving portion of an optical actuator in one embodiment of the present application is shown;

[0029] Figure 4 A perspective schematic diagram of a lens driving portion of an optical actuator in one embodiment of the present application is shown;

[0030] Figure 5 shows a perspective schematic diagram of an optical actuator in one embodiment of the present application;

[0031] Figure 6FIG1 shows a schematic diagram of an optical actuator in one embodiment of the present application when viewed from above;

[0032] Figure 7 A three-dimensional schematic diagram of a suspended circuit board and a photosensitive chip carried thereon in one embodiment of the present application is shown;

[0033] Figure 8 A three-dimensional cross-sectional view of a suspended circuit board and a photosensitive chip mounted thereon in one embodiment of the present application is shown;

[0034] Figure 9 A schematic top view of a suspended circuit board and a photosensitive chip mounted thereon in one embodiment of the present application is shown;

[0035] Figure 10 A schematic top view of a suspended circuit board in a flattened state according to an embodiment of the present application is shown;

[0036] Figure 11 A perspective schematic diagram of a camera module in one embodiment of the present application is shown with the outer frame removed; the positional relationship between the suspended circuit board and the optical actuator located inside the outer frame is revealed in this figure;

[0037] Figure 12a A schematic diagram showing the electrical connection between the inner and outer rigid boards with a conductive through hole having a ring-shaped metal layer in one embodiment of the present application is shown;

[0038] Figure 12b A schematic diagram showing the electrical connection between inner and outer rigid boards with conductive through holes having an unenclosed metal layer in another embodiment of the present application is shown;

[0039] Figure 12c A schematic diagram of a rigid board having conductive through holes without enclosing a metal layer in another embodiment of the present application is shown;

[0040] Figure 13 A schematic top view of a suspended circuit board with a reinforcement plate attached in a flattened state according to an embodiment of the present application is shown;

[0041] Figure 14 A schematic side view of a reinforcing plate and a suspended circuit board in a bent state in one embodiment of the present application is shown;

[0042] Figure 15 A three-dimensional schematic diagram of a reinforcing plate and a suspended circuit board in an embodiment of the present application in a bent state is shown;

[0043] Figure 16 A perspective schematic diagram of a camera module having a circuit board with a side recess in one embodiment of the present application is shown;

[0044] Figure 17A partial schematic diagram showing the electrical connection between the undercut portion of the circuit board and the conductive pins of the optical actuator in one embodiment of the present application is shown;

[0045] Figure 18 A three-dimensional schematic diagram of a camera module with an outer frame in one embodiment of the present application is shown;

[0046] Figure 19 A three-dimensional schematic diagram of a camera module with a frame cover added in one embodiment of the present application is shown;

[0047] Figure 20 The figure shows the positional relationship between the frame base plate and the suspended circuit board in one embodiment of the present application;

[0048] Figure 21 The figure shows the positional relationship among the conductive cloth, the frame base plate and the suspended circuit board in one embodiment of the present application. DETAILED DESCRIPTION

[0049] For a better understanding of the present application, various aspects of the present application will be described in more detail with reference to the accompanying drawings. It should be understood that these detailed descriptions are merely descriptions of exemplary embodiments of the present application and are not intended to limit the scope of the present application in any way. Throughout the specification, the same reference numerals refer to the same elements. The expression "and / or" includes any and all combinations of one or more of the associated listed items.

[0050] It should be noted that in this specification, the expressions of first, second, etc. are only used to distinguish one feature from another feature, and do not represent any limitation on the features. Therefore, without departing from the teaching of this application, the first subject discussed below can also be referred to as the second subject.

[0051] In the accompanying drawings, the thickness, size and shape of objects have been slightly exaggerated for ease of explanation. The accompanying drawings are only examples and are not drawn strictly to scale.

[0052] It should also be understood that the terms "comprises," "including," "having," "includes," and / or "comprising," when used in this specification, indicate the presence of the stated features, integers, steps, operations, elements, and / or parts, but do not preclude the presence or addition of one or more other features, integers, steps, operations, elements, parts, and / or combinations thereof. In addition, when expressions such as "at least one of..." appear after a list of listed features, they modify the entire listed features rather than modifying the individual elements in the list. In addition, when describing embodiments of the present application, "may" is used to mean "one or more embodiments of the present application." And, the term "exemplary" is intended to refer to an example or illustration.

[0053] As used herein, the terms "substantially," "approximately," and similar terms are used as terms of approximation, not degree, and are intended to account for the inherent variations in measurements or calculations that would be recognized by those having ordinary skill in the art.

[0054] Unless otherwise defined, all terms used herein (including technical and scientific terms) have the same meaning as commonly understood by those skilled in the art to which this application belongs. It should also be understood that terms (such as those defined in commonly used dictionaries) should be interpreted as having a meaning consistent with their meaning in the context of the relevant technology and will not be interpreted in an idealized or overly formal sense unless expressly defined as such herein.

[0055] It should be noted that, unless there is any conflict, the embodiments and features in the embodiments of this application can be combined with each other.

[0056] The present invention will be further described below with reference to the accompanying drawings and specific embodiments.

[0057] like Figure 1-21 As shown, the camera module 1 according to the embodiment of the present application is illustrated, which includes a photosensitive component 30, an optical lens 10 held on the photosensitive path of the photosensitive component 30, a driving component 20 for driving the photosensitive component 30 to move, and an outer frame 40 for packaging. The bottom surface of the driving component 20 is fixedly connected to the photosensitive component 30 to drive the photosensitive component 30 to move. The driving component 20 has a through hole in the middle. The through hole of the driving component 20 is used to accommodate and fix the optical lens 10, and provide a light passage for the optical lens 10 so that the light refracted by the optical lens 10 passes through and is incident on the photosensitive component 30. The outer frame 40 encapsulates the driving component 20 and the photosensitive component 30 therein, and provides a fixing position for the driving component 20 to fix the driving component 20, so that the photosensitive component 30 is suspended in the outer frame 40.

[0058] The optical lens 10 is held in the light-sensing path of the photosensitive component 30 to collect external imaging light. Accordingly, the optical lens 10 includes a lens barrel 11 and a lens group 12 installed in the lens barrel 11. The lens group 12 includes at least one optical lens, and the number of the at least one optical lens is not limited.

[0059] The driving component 20 includes a chip driving part 21, and the chip driving part 21 includes a chip anti-shake unit 211. The chip anti-shake unit 211 is suitable for driving the photosensitive component 30 to translate in the X-axis and Y-axis directions and / or rotate around the Z-axis direction to achieve translational anti-shake and / or rotational anti-shake of the photosensitive component 30; or, the chip anti-shake unit 211 is suitable for driving the photosensitive component 30 to rotate around the X-axis direction and the Y-axis direction to achieve tilt anti-shake of the photosensitive component 30. In this application, the X-axis direction and the Y-axis direction are perpendicular to each other, and the Z-axis direction is perpendicular to the plane where the X-axis direction and the Y-axis direction are located. In other words, the X-axis, Y-axis and Z-axis constitute a three-dimensional coordinate system.

[0060] The chip anti-shake unit 211 includes a chip anti-shake fixed portion 2111, a chip anti-shake movable portion 2112, and a driving element for driving the chip anti-shake movable portion 2112 to move relative to the chip anti-shake fixed portion 2111. The driving element is respectively connected to the chip anti-shake movable portion 2112 and the chip anti-shake fixed portion 2111. The chip anti-shake movable portion 2112 is fixed to the photosensitive component 30, so that the driving element drives the photosensitive component 30 fixed to the chip anti-shake movable portion 2112 to move. Furthermore, the chip anti-shake unit 211 may also include a suspension system, by which the chip anti-shake movable portion 2112 is suspended in the chip anti-shake fixed portion 2111. The suspension system can be implemented as a spring, a suspension wire, a ball bearing, etc., and the embodiments of the present application are not limited by the type of suspension system.

[0061] In the embodiment of the present application, the chip anti-shake unit 211 can be a driving motor of the type of a voice coil motor, a piezoelectric motor, an SMA (Shape Memory Alloy) motor, etc.

[0062] When the chip anti-shake unit 211 is implemented as a voice coil motor, the driving element is implemented as a coil-magnet pair. That is, the driving force that drives the chip anti-shake movable unit 2112 is generated by the electromagnetic interaction between the coil and the magnet. The coil and magnet in the coil-magnet pair are respectively suitable for being arranged on the chip anti-shake movable unit 2112 and the chip anti-shake fixed unit 2111. In other words, the coil in the coil-magnet pair can be fixedly arranged on the chip anti-shake movable unit 2112, and the magnet in the coil-magnet pair can be fixedly arranged on the chip anti-shake fixed unit 2111. This can reduce the driving force required by the driving element. Alternatively, the magnet in the coil-magnet pair can be fixedly arranged on the chip anti-shake movable unit 2112, and the coil in the coil-magnet pair can be fixedly arranged on the chip anti-shake fixed unit 2111. This can simplify the way the coils are energized. The number of the coil-magnet pairs can be one or more, which are arranged around the chip anti-shake movable part 2112. Preferably, the number of the coil-magnet pairs can be two, three or four, which are located on the side adjacent to the chip anti-shake movable part 2112.

[0063] When the chip stabilization unit 211 is implemented as an SMA motor, the driving element is implemented as an SMA (shape memory alloy) wire. Shape memory alloy is an alloy material that can completely eliminate deformation caused at lower temperatures and restore its original shape after being heated. For example, after a limited degree of plastic deformation below the phase transition temperature, the shape memory alloy can be restored to its original shape by heating. The heating of the SMA wire can be achieved by energizing the SMA wire.

[0064] like Figure 3As shown, in the embodiment of the present application, a group of SMA wires 2113 are respectively provided on the four sides of the chip anti-shake part 211, and each group of SMA wires 2113 includes at least one SMA wire. The adjacent two sides of the four sides of the chip anti-shake part 211 are arranged vertically (approximately vertically), and the opposite two sides of the four sides of the chip anti-shake part 211 are arranged in parallel (approximately parallel). Specifically, on each of the four sides of the chip anti-shake part 211, the chip anti-shake fixed part 2111 has a first fixed end 21111, and the chip anti-shake movable part 2112 has a second fixed end 21121. The two ends of the group of SMA wires 2113 are respectively fixed to the chip anti-shake fixed part 2111 through the first fixed end 21111 and fixed to the chip anti-shake movable part 2112 through the second fixed end 21121, so that the group of SMA wires 2113 drives the chip anti-shake movable part 2112 relative to the chip anti-shake fixed part 2111 moves, thereby the four groups of SMA wires 2113 located on the four sides of the chip anti-shake part 211 drive the chip anti-shake movable part 2112 to translate in the X-axis and Y-axis directions relative to the chip anti-shake fixed part 2111, or can also drive the chip anti-shake movable part 2112 to rotate about the Z-axis perpendicular to the plane of the X-axis and Y-axis relative to the chip anti-shake fixed part 2111, so that the chip anti-shake part 2111 can drive the photosensitive component 30 connected and fixed to the chip anti-shake movable part 2112 to translate in the X-axis and Y-axis directions and / or rotate about the Z-axis direction. Furthermore, the first fixed end 21111 and the second fixed end 21121 can also have a conductive function to provide current to the SMA wire 2113 to achieve heating of the SMA wire and cause the SMA wire to deform.

[0065] The chip anti-shake unit 211 also includes a chip anti-shake electrical connection portion 2114. The chip electrical connection point is electrically connected to the driving element, namely the SMA wire 2113, so that the chip anti-shake unit 211 is provided with driving power through the chip anti-shake electrical connection portion 2114. The chip anti-shake electrical connection portion 2114 is located on one side of the chip anti-shake unit 211 and further includes a plurality of pins 21141. For example, the chip anti-shake electrical connection portion 2114 includes five pins 21141 located on one side of the chip anti-shake unit 211. The plurality of pins 21141 are spaced apart from each other and are fixed in an inverted "L" shape on one side of the chip anti-shake fixing portion 2111 of the chip anti-shake unit 211.

[0066] The drive assembly 20 also includes a lens drive portion 22, which is suitable for driving the optical lens 10 to move. The lens drive portion 22 includes a lens focusing portion 221, which is suitable for driving the optical lens 10 to translate in the Z-axis direction to adjust the distance of the optical lens 10 relative to the photosensitive component 30, thereby achieving the focusing function of the optical lens 10. Furthermore, the lens drive portion 22 may also include a lens anti-shake portion 222, which is suitable for driving the optical lens 10 to translate in the X-axis and Y-axis directions and / or rotate around the Z-axis direction to achieve translational anti-shake and / or rotational anti-shake of the optical lens 10; alternatively, the lens anti-shake portion 222 is suitable for driving the optical lens 10 to rotate around the X-axis direction and around the Y-axis direction to achieve tilt anti-shake of the optical lens 10. It should be noted that the lens driving part 22 may only include the lens focusing part 221 or the lens anti-shake part 222; the lens driving part 22 may also include the lens focusing part 221 and the lens anti-shake part 222 at the same time, so that the lens driving part 22 can not only realize the lens focusing function but also realize the lens anti-shake function.

[0067] In the embodiment of the present application, the lens focusing unit 221 and the lens anti-shake unit 222 can be driving motors of the type of voice coil motor, piezoelectric motor, SMA (Shape Memory Alloy) motor, etc.

[0068] like Figure 4 As shown, in this embodiment of the present application, the lens driving section 22 includes a fixed lens driving portion 2201, a movable lens driving portion 2202, and a driving element (not shown) for driving the movable lens driving portion 2202 to move relative to the fixed lens driving portion 2201. The driving element is respectively connected to the movable lens driving portion 2202 and the fixed lens driving portion 2201. The movable lens driving portion 2202 is fixed to the optical lens 10, so that the driving element drives the optical lens 10 fixed to the movable lens driving portion 2202 to move. Furthermore, the lens driving section 22 may also include a suspension system (not shown), by which the movable lens driving portion 2202 is suspended from the fixed lens driving portion 2201. The suspension system can be implemented as one or more of a spring, a suspension wire, a ball bearing, etc., and this embodiment of the present application is not limited by the type of suspension system.

[0069] In the embodiment of the present application, the driving element drives the movable lens driving portion 2202 to move relative to the fixed lens driving portion 2201 to achieve lens focus or lens anti-shake function, so that the driving element, the movable lens driving portion 2202, and the fixed lens driving portion 2201 constitute the aforementioned lens focus portion 221 or the lens anti-shake portion 222. Alternatively, the movable lens driving portion 2202 may further include a first movable lens driving portion, a second movable lens driving portion located inside the first movable lens driving portion, and a driving element for driving the second movable lens driving portion to move relative to the first movable lens driving portion. Thus, the driving element located between the lens driving fixed part 2201 and the lens driving movable part 2202 drives the lens driving movable part 2202 to move to realize the lens anti-shake function, and the driving element located between the first lens driving movable part and the second lens driving movable part drives the second lens driving movable part to move to realize the lens focusing function; or, the driving element located between the lens driving fixed part 2201 and the lens driving movable part 2202 drives the lens driving movable part 2202 to move to realize the lens focusing function, and the driving element located between the first lens driving movable part and the second lens driving movable part drives the second lens driving movable part to move to realize the lens anti-shake function.

[0070] The lens drive section 22 includes a lens drive electrical connection portion 2203 located on the side. The lens drive electrical connection portion 2203 is electrically connected to the drive components of the lens drive section 22 and provides power to the lens drive section 22. The lens drive electrical connection portion 2203 includes a plurality of lens drive pads 22031 arranged in two rows to reduce the length of the lens drive electrical connection portion 2203. For example, the number of lens drive pads 22031 in the upper row is four, and the number of lens drive pads 22031 in the lower row is also four.

[0071] The lens drive fixing portion 2201 of the lens drive section 22 further includes at least two suspension portions, located on the sides of the lens drive fixing portion 2201. In one embodiment of the present application, the at least two suspension portions are located on the same side of the lens drive fixing portion 2201 and the lens drive electrical connection portion 2203. The at least two suspension portions can be two in number, namely a first suspension portion 22011 and a second suspension portion 22012, extending outward from the lens drive fixing portion 2201 on either side of the lens drive electrical connection portion 2203. The function of the at least two suspension portions will be discussed in the subsequent description of the photosensitive assembly 30 and will not be elaborated here.

[0072] In the present application, the lens driving part 22 and the chip driving part 21 can be separated from each other or fixed to each other. The lens driving part 22 can be fixed to the chip driving part 21 by bonding the lens driving fixing part 2201 with the chip driving fixing part of the chip driving part 21 (for example, the chip anti-shake fixing part 2111) or by integrally forming them.

[0073] Figure 5-6 The driving assembly 20 of the present application is shown, which includes the lens driving part 22 and the chip driving part 21. The four corner areas of the chip driving part 21 are concave inward to form four recesses, so that the four corner areas of the lens driving part 22 protrude downward to form four convex parts, which extend into the four recesses of the chip driving part 21, wherein three of the four convex parts of the lens driving part 22 are respectively fixed with a sensing magnet 2311, that is, the four corner areas of the lens driving part 22 are fixed with three sensing magnets 2311, and the sensing magnets 2311 are used to provide Figure 7 The position sensor 2312 on the photosensitive component 30 shown in FIG. 1 detects the displacement of the photosensitive component 30. The position sensor 2312 is adapted to determine the direction and distance of movement by sensing changes in the magnetic field. In other embodiments of the present application, the number of the sensing magnets 2311 may be one, two, four, or other numbers.

[0074] Figure 5 It is further shown that the chip anti-shake electrical connection portion 2114 of the chip driving part 21 and the lens driving electrical connection portion 2203 of the lens driving part 22 are respectively located on two opposite sides of the driving assembly 20. Figure 6It is further shown that the lens focusing part 221 of the lens driving part 22 is located on the inner side of the lens anti-shake part 222, and the through hole size in the middle of the chip driving part 21 is larger than the through hole size in the middle of the lens driving part 22, thereby providing an unobstructed light path for the optical lens 10, thereby reducing the occurrence of vignetting problems.

[0075] like Figure 7-1 As shown in FIG. 2 , in the embodiment of the present application, the photosensitive component 30 includes a circuit board 31 , a photosensitive chip 32 , a base 34 and a filter element 35 .

[0076] The photosensitive chip 32 includes a photosensitive area 321 and a non-photosensitive area 322321. The photosensitive chip 32 is electrically connected to the circuit board 31 via a photosensitive chip pad located in the non-photosensitive area 322321. For example, the photosensitive chip 32 can be electrically connected to the circuit board 31 by gold wire bonding, wire bonding, welding, FC process (chip flip-chip), RDL (rewiring layer technology), etc. The photosensitive chip 32 is suitable for being fixed to the upper surface of the circuit board 31 (the side of the circuit board 31 facing the lens is defined as the upper surface) through an adhesive medium, or the photosensitive chip 32 is disposed in the circuit board through hole 3111 of the circuit board 31, thereby reducing the influence of the thickness of the circuit board 31 on the thickness of the photosensitive component 30, thereby reducing the height of the camera module.

[0077] The base 34 is provided on the photosensitive portion of the chip on the circuit board 31 to support other components. In a specific example of the present application, the base 34 is implemented as a separately molded plastic bracket, which is attached to the surface of the circuit board 31 via an adhesive medium and is used to support other components. Of course, in other examples of the present application, the base 34 can also be formed on the circuit board 31 in other ways. For example, the base 34 is implemented as a molded base, which is integrally formed at a predetermined position on the circuit board 31 through a molding process. This is not limited to this application.

[0078] In an embodiment of the present application, the filter element 35 is maintained on the photosensitive path of the photosensitive chip 32, and is used to filter the imaging light entering the photosensitive chip 32. In a specific example, the filter element 35 is mounted on the base 34 and corresponds at least to the photosensitive area 321 of the photosensitive chip 32. It is worth mentioning that in other examples of the present application, the filter element 35 can be indirectly mounted on the base 34 through other supporting members. In addition, in other examples of the present application, the filter element 35 can also be installed at other positions of the camera module 1, for example, the filter element 35 is formed in the optical lens 10 (for example, as a layer of filter film attached to the surface of a certain optical lens of the optical lens 10), which is not limited to the present application.

[0079] The circuit board 31 includes a circuit board body 311, a connecting strip, and a connector portion 314. The circuit board body 311 is used to mount and electrically connect the photosensitive chip 32 and electronic components 33. The electronic components 33 include passive components such as capacitors and resistors, as well as active components such as driver chips. The connecting strip electrically connects and secures the circuit board body 311 and the connector portion 314. The connector portion 314 is used to electrically connect to a mobile electronic device to extract the image information output by the photosensitive chip 32.

[0080] The four corner areas of the circuit board body 311 of the circuit board 31 are also fixed with and electrically connected position sensors 2312 for sensing the movement of the photosensitive component 30. The number and position of the position sensors 2312 correspond to the sensing magnets 2311 located in the driving component 20. For example, when the triangles of the four corner areas of the driving component 20 are respectively provided with a sensing magnet 2311, a position sensor 2312 is respectively fixed and electrically connected to the position of the photosensitive chip 32 of the circuit board 31 corresponding to the triangles of the four corner areas of the driving component 20.

[0081] like Figure 7-8In a specific example of the present application, the base 34 is fixed to the circuit board body 311 of the circuit board 31 by an adhesive medium and encapsulates the photosensitive chip 32 therein. The photosensitive chip 32 is located on the inner side of the base 34 (meaning the side biased towards the photosensitive chip 32), and the electronic component 33 is located on the outer side of the base 34. In other words, the base 34 only encapsulates the photosensitive chip 32. Of course, in other examples of the present application, the base 34 can also encapsulate the photosensitive chip 32 and part of the electronic components 33 therein, and another part of the electronic components 33 is located on the outer side of the base 34; or, the base 34 can also encapsulate the photosensitive chip 32 and all of the electronic components 33 therein. When the base 34 only encapsulates the photosensitive chip 32 therein, the base 34 can prevent dust that may exist on the electronic component 33 from contaminating the photosensitive chip 32.

[0082] Furthermore, if Figure 7-9 As shown, there are multiple electronic components 33, and they are distributed around the photosensitive chip 32 and the base 34. The multiple electronic components 33 are distributed in a circular area, which is related to the shape of the chip anti-shake movable part 2112 of the chip anti-shake part 211. The chip anti-shake movable part 2112 has a cylindrical through hole. When the chip anti-shake movable part 2112 is fixed to the circuit board body 311, less space is reserved on the circuit board 31. Therefore, the base 34 is only used to encapsulate the photosensitive chip 32, and the multiple electronic components 33 are distributed around the base 34, and further, the electronic components 33 can be distributed in a circular area. This design eliminates the need to enclose the electronic components 33 in the base 34, thereby reducing the base's length, width, and height dimensions. This eliminates the need to further enlarge the cylindrical through-hole of the chip anti-shake movable portion 2112 due to the rectangular design of the base 34. Multiple electronic components 33 can be distributed between the base 34 and the cylindrical through-hole of the chip anti-shake movable portion 2112, thereby reducing the lateral dimensions of the camera module. The upper surface of the circuit board body 311 may also be provided with dust-catching glue to capture dust and other dirt in the camera module. For example, the dust-catching glue can be arranged in a ring shape around the circular area or cover the multiple electronic components 33.

[0083] Furthermore, a circuit board through hole 3111 is provided in the middle of the circuit board body 311. Preferably, the circuit board through hole 3111 is similar in shape to the photosensitive chip 32. For example, the circuit board through hole 3111 is rectangular and is used to accommodate the photosensitive chip 32 to reduce the height of the photosensitive component 30.

[0084] Furthermore, the photosensitive component 30 also includes a reinforcing plate 37, which is fixed to the back side of the circuit board body 311 of the circuit board 31 (referring to the side of the circuit board 31 away from the lens, opposite to the upper surface of the circuit board body) through an adhesive medium to provide support and reinforcement for the circuit board body 311. The reinforcing plate 37 can be a metal plate such as a steel plate or a copper plate, or a plastic plate, which is not limited to this application. In a specific example of the present application, the circuit board body 311 has a circuit board through hole 3111, the reinforcement plate 37 is fixed to the back of the circuit board body 311, the reinforcement plate 37 and the circuit board body 311 form a groove, the photosensitive chip 32 is fixed to the reinforcement plate 37 through an adhesive medium and accommodated in the circuit board through hole 3111 of the circuit board body 311, the thickness of the reinforcement plate 37 can be thinner than the circuit board body 311 to reduce the height of the photosensitive component 30, and the reinforcement plate 37 can provide the photosensitive chip 32 with a flatter surface for bonding and fixing than the circuit board body 311.

[0085] The circuit board body 311 can be a hard board or a soft board, and the connecting strip electrically connected to the photosensitive chip 32 is a hard-soft board. Specifically, the connecting strip includes a first connecting strip 312 and a second connecting strip 313, and the first connecting strip 312 and the second connecting strip 313 are respectively drawn out from two opposite sides of the circuit board body 311 (for ease of description, these two opposite sides can be referred to as the first side 301 and the second side 302, and the third side 303 and the fourth side 304 are adjacent to the first side 301 and the second side 302, and the third side 303 and the fourth side 304 are relatively distributed, and the first side 301, the third side 303, the second side 302 and the fourth side 304 are distributed in a clockwise direction) and bent upward (upward is pointing in the direction away from the circuit board body 311), and the first connecting strip 312 further extends along the first side 301 toward the third side 303. The first connecting strip 312 extends and bends toward the third side 303 along the second side 302, and the second connecting strip 313 further extends and bends toward the third side 303 along the second side 302, thereby securing the first connecting strip 312 and the second connecting strip 313 to the third side 303, forming a complete connecting strip. The connecting strip is arranged around the first side 301, the second side 302, and the third side 303 of the circuit board body 311. Furthermore, the first connecting strip 312 and the second connecting strip 313 are electrically connected to the third side 303. The first connecting strip 312 bends at the bottom of the third side 303 away from the circuit board body 311 and extends away from the circuit board body 311, electrically connecting to the connector portion 314. Due to the above-described connecting strip structure and arrangement, when the drive assembly 20 drives the circuit board body 311 to move, the connecting strip generates relatively little resistance, thereby resolving the problem in the prior art where the connecting strip deflects in the same plane relative to the circuit board body 311, generating significant resistance.

[0086] The connector portion 314 can be a hard board or a soft board, and a connector 36 is electrically connected to the upper surface or back surface of the connector portion 314. Through the connector 36, the camera module 1 is electrically connected to the mobile electronic device to extract the image information output by the photosensitive chip 32. In one example of the present application, the connector portion 314 can also be further electrically connected to other electronic components to reduce the number of electronic components 33 electrically connected to the circuit board body 311.

[0087] Specifically, the first connecting strip 312 includes a first connecting strip flexible board 3121, a first connecting strip rigid board 3122, and a third connecting strip flexible board 3123. The first connecting strip flexible board 3121 electrically connects the circuit board body 311 and the first connecting strip rigid board 3122, and the third connecting strip flexible board 3123 electrically connects the first connecting strip rigid board 3122 and the connector portion 314. The first connecting strip flexible board 3121 has a first bending portion 31211 and a second bending portion 31212. The first connecting strip flexible board 3121 is connected to the circuit board body 311 via the first bending portion 31211 and bends upward from the first side surface 301 of the circuit board body 311. The first connecting strip flexible board 3121 is bent from the first side surface 301 toward the third side surface 303 via the second bending portion 31212, thereby connecting the first connecting strip flexible board 3121 to the first connecting strip rigid board 3122 located on the third side surface 303. The third connecting strip soft board 3123 includes a third bending portion 31231. The third connecting strip soft board 3123 is connected to the bottom of the first connecting strip hard board 3122 through the third bending portion 31231 and bends from the bottom of the first connecting strip hard board 3122 away from the circuit board body 311, so that the third connecting strip soft board 3123 is connected to the connector part 314.

[0088] That is, the first bending portion 31211 is located near the intersection of the first side surface 301 and the bottom surface of the circuit board body 311, the second bending portion 31212 is located near the intersection of the first side surface 301 and the third side surface 303, and the third bending portion 31231 is located near the intersection of the third side surface 303 and the bottom surface of the circuit board body 311.

[0089] The second connecting strip 313 includes a second connecting strip flexible board 3131 and a second connecting strip hard board 3132. The second connecting strip flexible board 3131 electrically connects the circuit board body 311 and the second connecting strip hard board 3132. The second connecting strip flexible board 3131 has a fourth bending portion 31311 and a fifth bending portion 31312. The second connecting strip flexible board 3131 is connected to the circuit board body 311 via the fourth bending portion 31311 and bends upward from the second side surface 302 of the circuit board body 311. The second connecting strip flexible board 3131 is bent from the first side surface 301 toward the third side surface 303 via the fifth bending portion 31312, thereby connecting the second connecting strip flexible board 3131 to the second connecting strip hard board 3132 located on the third side surface 303.

[0090] That is, the fourth bending portion 31311 is located near the intersection of the second side surface 302 and the bottom surface of the circuit board body 311 , and the fifth bending portion 31312 is located near the intersection of the second side surface 302 and the third side surface 303 .

[0091] The direction perpendicular to the first side surface 301 or the second side surface 302 is defined as the X-axis direction, the direction perpendicular to the third side surface 303 and the fourth side surface 304 is defined as the Y-axis direction, the X-axis direction is perpendicular to the Y-axis direction, and the direction perpendicular to the plane containing the X-axis and Y-axis directions (i.e., the plane containing the circuit board body 311) is defined as the Z-axis direction. The first bending portion 31211 and the fourth bending portion 31311 are adapted to bend along the Y-axis direction to reduce the resistance of the connecting strip when the circuit board body 311 is driven by the driving assembly 20 to move in the X-axis direction. The second bending portion 31212 and the fifth bending portion 31312 are adapted to bend along the Z-axis direction to reduce the resistance of the connecting strip when the circuit board body 311 is driven by the driving assembly 20 to move in the Y-axis direction. The first bending portion 31211, the fourth bending portion 31311, the second bending portion 31212 and the fifth bending portion 31312 are also suitable for reducing the resistance of the connecting belt (including the first connecting belt 312 and the second connecting belt 313) when the circuit board body 311 is driven by the driving component 20 to rotate around the X-axis direction, the Y-axis direction or the Z-axis direction.

[0092] The first flexible connecting strip 3121 further includes two first horizontal portions 31213 and a first inclined portion 31214 between the first bend 31211 and the second bend 31212. The first inclined portion 31214 connects the two first horizontal portions 31213. The first inclined portion 31214 allows the first flexible connecting strip 3121 to extend from the first bend 31211 toward the second bend 31212 and upward, with a height difference between the two first horizontal portions 31213. Furthermore, the first inclined portion 31214 allows the first flexible connecting strip 3121 to extend from the first bend 31211 toward the second bend 31212 and outward (away from the circuit board body). A gap exists between the planes containing the two first horizontal portions 31213, and the planes containing the two first horizontal portions 31213 are parallel to or intersect with each other. The above structure provides an avoidance space to avoid the driving assembly 20 or the outer frame 40 to avoid interference with each other, and at the same time helps to reduce the resistance when the driving assembly 20 drives the circuit board body 311 to move.

[0093] The second flexible connecting strip 3131 further includes two second horizontal portions 31223 and a second inclined portion 31224 between the fourth bend 31311 and the fifth bend 31312. The second inclined portion 31224 connects the two second horizontal portions 31223. The second inclined portion 31224 allows the second flexible connecting strip 3131 to extend from the fourth bend 31311 toward the fifth bend 31312 and upward, with a height difference between the two second horizontal portions 31223. Furthermore, the second inclined portion 31224 allows the second flexible connecting strip 3131 to extend from the fourth bend 31311 toward the fifth bend 31312 and outward (away from the circuit board body). A gap exists between the planes containing the two second horizontal portions 31223, and the planes containing the two second horizontal portions 31223 are parallel to or intersect with each other. The above structure provides an avoidance space to avoid the driving assembly 20 or the outer frame 40 to avoid interference with each other, and at the same time helps to reduce the resistance when the driving assembly 20 drives the circuit board body 311 to move.

[0094] Furthermore, in one embodiment of the present application, a shaping layer is attached to the inner and / or outer sides of the first bending portion 31211 and the fourth bending portion 31311, so that the first connecting strip 312 can be kept bent at the first bending portion 31211 and the second connecting strip 313 can be kept bent at the fourth bending portion 31311; and a shaping layer is attached to the inner and / or outer sides of the second bending portion 31212 and the fifth bending portion 31312, so that the first connecting strip 312 can be kept bent at the second bending portion 31212 and the second connecting strip 313 can be kept bent at the fifth bending portion 31312. The shaping layer can be copper foil or other thin component with a shaping effect.

[0095] further, Figure 10 The bottom surface of a flattened circuit board 31 in one embodiment of the present application is shown. The circuit board 31 includes a circuit board body 311, a first connecting strip 312, a second connecting strip 313, and a connector portion 314. The circuit board body 311 has a rectangular circuit board through-hole 3111 for accommodating the photosensitive chip 32. The first side surface 301 of the circuit board body 311 is electrically connected to the first connecting strip 312, and the second side surface 302 of the circuit board body 311 is electrically connected to the second connecting strip 313.

[0096] The first connecting belt 312 includes the first connecting belt soft board 3121, the first connecting belt hard board 3122 and the third connecting belt soft board 3123. The first connecting belt soft board 3121 includes a first bending portion 31211 and a second bending portion 31212. The first connecting belt soft board 3121 is connected to the circuit board body 311 through the first bending portion 31211 and is connected to the first connecting belt hard board 3122 through the second bending portion 31212. The first connecting belt soft board 3121 is suitable for bending the first connecting belt soft board 3121 by bending the first bending portion 31211 and the second bending portion 31212; the third connecting belt soft board 3123 includes a third bending portion 31231. The third connecting belt soft board 3123 is connected to the first connecting belt hard board 3122 through the third bending portion 31231. The third connecting belt soft board 3123 is suitable for bending the third connecting belt soft board 3123 by bending the third bending portion 31231.

[0097] The second connecting strip 313 includes a second connecting strip flexible board 3131 and a second connecting strip hard board 3132. The second connecting strip flexible board 3131 includes a fourth bend 31311 and a fifth bend 31312. The second connecting strip flexible board 3131 is connected to the circuit board body 311 via the fourth bend 31311. The second connecting strip flexible board 3131 and the first connecting strip flexible board 3121 are located on opposite sides of the circuit board body 311. The second connecting strip flexible board 3131 is connected to the second connecting strip hard board 3132 via the fifth bend 31312. The second connecting strip flexible board 3131 is adapted to bend by bending the fourth bend 31311 and the fifth bend 31312.

[0098] By bending the first connection strip soft board 3121 and the second connection strip soft board 3131 , the first connection strip hard board 3122 and the second connection strip hard board 3132 are fixed and electrically connected on the third side surface 303 of the circuit board body 311 . Figure 11The structure of the first connecting strip soft board 3121 and the second connecting strip soft board 3131 of the circuit board 31 after being bent is shown. The first connecting strip hard board 3122 is located on the outside, that is, the second connecting strip hard board 3132 is located between the drive assembly 20 and the first connecting strip hard board 3122. The second connecting strip hard board 3132 is positioned on the side surface (i.e., the third side surface 303) of the drive assembly 20 through at least two through-holes of the second connecting strip hard board 3132 and at least two hanging portions on the drive assembly 20. The first connecting strip hard board 3122 is positioned on the outside of the second connecting strip hard board 3132 located on the side surface (i.e., the third side surface 303) of the drive assembly 20 through at least two through-holes of the first connecting strip hard board 3122 and at least two hanging portions on the drive assembly 20. The at least two suspension parts on the driving component 20 include a first suspension part 22011 and a second suspension part 22012 extending outward from the lens driving fixing part 2201 on both sides of the lens driving electrical connection part 2203, respectively. The first suspension part 22011 passes through the through hole on the second connecting belt hard plate 3132 and the through hole on the first connecting belt hard plate 3122, and the second suspension part 22012 passes through the through hole on the first connecting belt hard plate 3122 and the through hole on the first connecting belt hard plate 3122, so that the first connecting belt hard plate 3122 and the second connecting belt hard plate 3132 are positioned on the driving component 20.

[0099] The first connection belt hard plate 3122 and the second connection belt hard plate 3132 are suitable for being bonded and fixed by an adhesive medium, such as UV glue, UV thermosetting glue, thermosetting glue, double-sided tape, or other adhesive medium.

[0100] Furthermore, the second connection belt hard board 3132 is electrically connected to the first connection belt hard board 3122 , so that the second connection belt 313 is electrically connected to the third connection belt soft board 3123 through the first connection belt hard board 3122 , and further electrically connected to the connector part 314 . Figure 8-12c A specific example of the present application is shown, wherein the second connecting strip hard board 3132 includes a plurality of connecting strip pads 31321, and the connecting strip pads 31321 are located on a side of the second connecting strip hard board 3132 adjacent to the first connecting strip hard board 3122 after the circuit board 31 is bent. In other words, Figure 10In the flattened view of the circuit board 31 shown, the side of the second connecting strip hard board 3132 where the connecting strip pads 31321 are located is on the same side as the bottom surface of the circuit board body 311. The first circuit board 31 hard board includes a plurality of conductive vias, including a plurality of first conductive vias 31221 and a plurality of second conductive vias 31222. When the first connecting strip and the second connecting strip 313 of the circuit board 31 are bent, the plurality of first conductive vias 31221 of the first connecting strip hard board 3122 are respectively opposite the plurality of connecting strip pads 31321 of the second connecting strip hard board 3132. This allows the plurality of first conductive vias 31221 to be electrically connected to the plurality of connecting strip pads 31321 by disposing an electrical connection medium 31322 within the plurality of first conductive vias 31221, thereby achieving electrical conduction between the first connecting strip hard board 3122 and the second connecting strip hard board 3132. The electrical connection medium 31322 can be a solder material such as a tin ball, and is fixed to the first conductive via 31221 and the connecting strip pad 31321 by laser welding. This ensures electrical continuity between the first connecting strip hard board 3122 and the second connecting strip hard board 3132 by welding. This welding method, compared to traditional connector connection methods, avoids the need to press the connector, thereby preventing the driver assembly from being compressed and reducing driver assembly defects.

[0101] Specifically, Figure 12a-12b A schematic structural diagram is shown in which the first connection strip hard plate 3122 and the second connection strip hard plate 3132 are welded via an electrical connection medium 31322 .

[0102] like Figure 12a As shown, the connecting strap pad 31321 is located between the second connecting strap hard board 3132 and the first connecting strap hard board 3122, and the first conductive through hole 31221 of the first connecting strap hard board 3122 has an annular conductive side 312211, and the conductive side 312211 of the first conductive through hole 31221 is fixed and electrically connected to the connecting strap pad 31321 through the electrical connection medium 31322, thereby realizing electrical conduction between the first connecting strap hard board 3122 and the second connecting strap hard board 3132, wherein the annular conductive side 312211 can be realized by a metal plating layer arranged in the first conductive through hole 31221.

[0103] Figures 12b-12cAnother structure of the first conductive through hole 31221 is shown. The first conductive through hole 31221 is composed of a conductive side 312211 and an insulating side 312212. In other words, the metal plating layer provided in the first conductive through hole 31221 is only distributed on a part of the side surface of the first conductive through hole 31221 (such as Figure 12c As shown in the figure, when observing the hard board vertically along the first circuit board 31, the conductive side 312211 and the insulating side 312212 are respectively located on both sides), so that during welding, the electrical connection medium 31322 will be biased toward the conductive side 312211, and the electrical connection medium 31322 is only in contact with, fixed to and electrically connected to the conductive side 312211 of the first conductive through hole 31221, so that the connection contact between the electrical connection medium 31322 and the connecting strip pad 31321 can be observed from the insulating side 312212 of the first conductive through hole 31221 to the conductive side 312211, and whether there is a problem of cold soldering, so as to reduce the defect of the camera module. Preferably, in one of the first conductive through holes 31221, the ratio of the area occupied by the conductive side 312211 to the area occupied by the insulating side 312212 is between 0.8-1.25, for example, the areas occupied by the conductive side 312211 and the insulating side 312212 are equal, thereby ensuring the electrical connection between the first connecting strip hard board 3122 and the second connecting strip hard board 3132 while also facilitating the observation of cold solder joint problems.

[0104] Furthermore, in order to facilitate the observation of the welding conditions between the plurality of first conductive through-holes 31221 and the connecting strip pads 31321, preferably, the conductive sides 312211 in the plurality of first conductive through-holes 31221 of the present application are all located on the same side, and the insulating sides 312212 in the plurality of first conductive through-holes 31221 are all located on the other side. For example, the insulating sides 312212 in the plurality of first conductive through-holes 31221 are all located on the upper side (i.e., away from the side of the circuit board body 311), so as to facilitate the observation of the welding conditions from the upper side of the camera module. Of course, the insulating sides 312212 in the plurality of first conductive through-holes 31221 can also be located on the lower side, left side or right side of the camera module, or can also be located between the left side and the upper side, so that the welding conditions can be observed with the naked eye.

[0105] During the welding process, the electrical connection medium 31322, such as tin, needs to be heated to its melting point to react with the connecting strip pad 31321 and the first conductive via 31221. If the temperature is insufficient, the conductive connection medium 31322 will not be able to react with the connecting strip pad 31321 and the first conductive via 31221, thereby causing a cold solder joint. When the electrical connection medium 31322 is sprayed between the connecting strip pad 31321 and the first conductive via 31221 through a laser welding process, if the distance between the connecting strip pad 31321 and the first conductive via 31221 is too long, the electrical connection medium 31322 will cool down. Therefore, preferably, the gap between the connecting strip pad 31321 and the first conductive via 31221 is less than 100 μm, and the gap between the first connecting strip hard board 3122 and the second connecting strip hard board 3132 is less than 100 μm.

[0106] In order to reduce the aforementioned cold solder joint problem, secondary heating can be further performed to ensure that the electrical connection medium 31322 and the connecting strip pad 31321, and the electrical connection medium 31322 and the first conductive through hole 31221 can react with each other and then combine with each other to avoid the occurrence of cold solder joint problem.

[0107] Alternatively, the problem of cold solder joints can be reduced by pre-tinning. Pre-tinning involves first directly placing solder (or other electrical connection medium) on the connecting strip pads 31321 to allow the solder to react and bond with the pads, and then molten solder is placed between the connecting strip pads 31321 and the first conductive vias 31221 through the first conductive vias 31221 to achieve electrical conduction. The material of the connecting strip pad 31321 is usually different from that of the electrical connection medium 31322. During welding, the two need to react at the contact surface to ensure stable bonding, and the reaction process has high temperature requirements. The present application pre-tins the surface of the connecting strip pad 31321 with a layer of tin. Therefore, in the subsequent welding process, the solder is easy to combine with the tin on the surface of the connecting strip pad 31321, and the distance between the surface of the connecting strip pad 31321 and the first conductive through-hole 31221 is also shortened. The temperature of the solder can still maintain a high temperature when it is arranged on the surface of the connecting strip pad 31321, thereby having a better welding effect and reducing the requirements for the welding process. Preferably, the thickness of the solder is between 10-50μm to maintain a good welding effect.

[0108] Furthermore, in the present application, the electrical connection between the driving component 20 and the circuit board 31 can also be achieved by the above-mentioned first conductive through-hole-pad welding method. Figure 4-5As shown in Figures 10-11, the second connecting strip hard plate 3132 has a recessed portion. Thus, when the second connecting strip hard plate 3132 is bent and suspended on the first suspension portion 22011 and the second suspension portion 22012, it avoids the lens driving electrical connection portion 2203 of the driving assembly 20, leaving the lens driving electrical connection portion 2203 exposed, thereby being suitable for electrical connection with the first connecting strip hard plate 3122. Specifically, the plurality of lens driving pads 22031 on the lens driving electrical connection portion 2203 correspond to the plurality of second conductive through-holes 31222 on the first connecting strip hard plate 3122, and are electrically connected via the electrical connection medium 31322.

[0109] The multiple lens drive pads 22031 on the lens drive electrical connection portion 2203 are arranged in two rows to reduce the length of the lens drive electrical connection portion 2203. For example, the number of the lens drive pads 22031 located on the upper side is four, and the number of the lens drive pads 22031 located on the lower side is also four. Furthermore, to reduce the size of the lens drive electrical connection portion 2203 in the Z-axis direction, the lens drive pads 22031 in the upper and lower rows are staggered. To improve the utilization of the area of ​​the lens drive electrical connection portion 2203, the lens drive pads 22031 are shaped like a "gourd," with one side larger and the other smaller. The lens drive pads 22031 are relatively larger on the side closer to the edge of the lens drive electrical connection portion 2203.

[0110] The lens drive electrical connection portion 2203 is a rigid-flexible board. The flexible board portion of the lens drive electrical connection portion 2203 electrically connects the drive element of the lens drive portion 22 to the rigid board portion of the lens drive electrical connection portion 2203. The multiple lens drive pads 22031 are located on the rigid board portion of the lens drive electrical connection portion 2203, and the rigid board portion of the lens drive electrical connection portion 2203 is fixed to the side of the lens drive fixing portion 2201 of the lens drive portion 22 to maintain the stability of the electrical connection between the lens drive electrical connection portion 2203 and the external power supply. Furthermore, the outer surface of the lens drive pads 22031 is lower than the outer surface of the rigid board portion of the lens drive electrical connection portion 2203 to provide protection for the lens drive pads 22031 and prevent them from being scratched, which would affect the yield of the electrical connection.

[0111] In one embodiment of the present application, the plurality of second conductive vias 31222 on the first connecting strip hard board 3122 also consist of a conductive side 312211 and an insulating side 312212, thereby facilitating observation of the soldering between the second conductive vias 31222 and the lens drive pad 22031. Preferably, the conductive sides 312211 of the plurality of second conductive vias 31222 are all located on the same side, and the insulating sides 312212 of the plurality of second conductive vias are all located on the other side. For example, the conductive sides 312211 of the plurality of second conductive vias 31222 are all located on the bottom side (i.e., close to the side of the circuit board body 311), thereby facilitating observation of the soldering from the top side of the camera module. Of course, the conductive sides 312211 of the plurality of second conductive vias 31222 can also be located on the top side, left side, or right side of the camera module, or can also be located between the right side and the bottom side, all of which enable visual observation of the soldering.

[0112] To improve the soldering yield between the second conductive via 31222 and the lens drive pad 22031 and reduce the risk of cold soldering, the gap between the second conductive via 31222 and the lens drive pad 22031 is preferably less than 100 μm, that is, the gap between the first connecting strip hard plate 3122 and the lens drive connection portion is less than 100 μm. In addition, the second conductive via 31222 and the lens drive pad 22031 can also be soldered by secondary heating or pre-tinning. When pre-tinning is used, the thickness of the solder is set to between 10-50 μm to maintain a good soldering effect.

[0113] That is, the conductive through-hole-pad welding structure in the present application can also be applied to the electrical connection between the driving component 20 and the circuit board 31. The driving component 20 includes a driving electrical connection portion (e.g., a lens driving electrical connection portion 2203) located on the side of the driving component 20. The multiple pads on the driving electrical connection portion (e.g., a lens driving pad 22031) correspond to the multiple conductive through-holes on the hard board portion of the circuit board (e.g., the first connecting strip hard board 3122) and are electrically connected via an electrical connection medium provided in the conductive through-holes.

[0114] The conductive through-hole-pad welding structure in this application can be applied when the electrical connection part of the camera module is set on the side of the camera module to avoid the camera module being compressed when electrically connected, causing a defective camera module. The electrical connection part is set on the side of the camera module, and the electrical connection part of the driving component 20 can be set on the side, or the electrical connection part of the photosensitive component 30 can be set on the side. The circuit board 31 with a conductive through hole is welded to the electrical connection part, thereby electrically connecting the driving component 20 or the photosensitive component 30 to the mobile electronic device.

[0115] Furthermore, in order to maintain the shape of the circuit board 31 after bending, especially the bending of the first bending portion 31211 and the fourth bending portion 31311, the reinforcing plate 37 can also be bent to maintain the bending of the first connecting strip soft board 3121 at the first bending portion 31211 and maintain the bending of the second connecting strip soft board 3131 at the fourth bending portion 31311.

[0116] Specifically, Figure 13-15 A schematic diagram of the reinforcing plate 37 attached to the bottom surface of the circuit board body 311 is shown. The reinforcing plate 37 includes a reinforcing plate body 371, a first reinforcing plate side portion 372 and a second reinforcing plate side portion 373. The reinforcing plate body 371, the first reinforcing plate side portion 372 and the second reinforcing plate side portion 373 can be integrally formed. The first reinforcing plate side portion 372 further includes a first reinforcing plate bent portion 3721, and the second reinforcing plate side portion 373 further includes a second reinforcing plate bent portion 3731. The reinforcing plate is attached and fixed to the bottom surface of the circuit board main body 311 through the reinforcing plate main body 371, so that the reinforcing plate main body 371 and the circuit board main body 311 having the circuit board through hole 3111 form a groove for accommodating the photosensitive chip 32. The first reinforcing plate side portion 372 is fixedly connected to one side of the reinforcing plate main body 371 (located on the same side as the first connecting strip soft board 3121, that is, the first side surface 301) through the first reinforcing plate bent portion 3721, and the second reinforcing plate side portion 373 is fixedly connected to the other side of the reinforcing plate main body 371 opposite to the first reinforcing plate side portion 372 (located on the same side as the second connecting strip soft board 3131, that is, the second side surface 302) through the second reinforcing plate bent portion 3731. Preferably, the reinforcing plate 37 is made of metal materials such as stainless steel and copper that are suitable for bending.

[0117] The first reinforcing plate bent portion 3721 bends the first reinforcing plate side portion 372 and extends upward along the first side surface 301 of the reinforcing plate body 371. The second reinforcing plate bent portion 3731 bends the second reinforcing plate side portion 373 and extends upward along the second side surface 302 of the reinforcing plate body 371. The shapes of the first and second reinforcing plate side portions 372 and 373 do not readily change after bending. Therefore, the first and second reinforcing plate side portions 372 and 373 are adapted to maintain the bending of the first and fourth bent portions 31211 and 31311, maintaining the bent shapes of the first and second connecting strap flexible boards 3121 and 3131. This reduces the resistance of the first and second connecting straps 312 and 313 when the drive assembly 20 drives the circuit board body 311 to move.

[0118] The width of the first reinforcing plate bent portion 3721 is smaller than the width of the first reinforcing plate side portion 372, thereby reducing the difficulty of bending the first reinforcing plate bent portion 3721. Furthermore, the first reinforcing plate bent portion 3721 has a through hole, further reducing the resistance to bending the first reinforcing plate bent portion 3721. The width of the second reinforcing plate bent portion 3731 is smaller than the width of the second reinforcing plate side portion 373, thereby reducing the difficulty of bending the second reinforcing plate bent portion 3731. Furthermore, the second reinforcing plate bent portion 3731 has a through hole, further reducing the resistance to bending the second reinforcing plate bent portion 3731.

[0119] like Figure 16-17 In one embodiment of the present application, the chip anti-shake electrical connection portion 2114 of the chip anti-shake portion 211 is electrically connected to the circuit board body 311 by pin welding.

[0120] Specifically, during the assembly of the camera module 1 , the optical lens 10 is assembled to the driving assembly 20 , and the driving assembly 20 is fixed to the circuit board body 311 and electrically connected to the circuit board body 311 , thereby reducing the height of the camera module. The driving component 20 can be fixed to the circuit board body 311 and assembled by the HA process or the AA process. The HA process refers to directly bonding the driving component 20 and the circuit board 31 through an adhesive medium after adjusting the parallelism. It usually requires that a gap of about 0.03mm be reserved between the driving component 20 and the circuit board body 311; and the AA process refers to an active calibration process, which first assembles the optical lens 10 to the driving component 20 to form a semi-finished camera module, and then adjusts the positional relationship between the semi-finished camera module and the circuit board body 311 according to the imaging quality of the image formed by the light of the semi-finished camera module received by the photosensitive component 30, and then fixes them by bonding with an adhesive medium. It usually requires that a gap of about 0.16mm be reserved between the driving component 20 and the circuit board body 311. Therefore, whether through the HA process or the AA process, when the driving component 20 and the circuit board body 311 are bonded and fixed in order to reduce the height of the camera module, the gap between the driving component 20 and the circuit board body 311 will be lower.

[0121] In the present application, the chip anti-shake electrical connection portion 2114 includes a plurality of pins 21141. Each pin 21141 includes a transverse portion 211411 fixedly connected to the chip anti-shake fixing portion 2111, and a vertical portion 211412 integrally formed with the transverse portion 211411 and perpendicular (substantially perpendicular) to the transverse portion 211411. The vertical portion 211412 of each pin 21141 determines its height. A typical pin size is 0.5 mm, far exceeding the gap between the driver assembly 20 and the circuit board body 311. In existing camera modules, the pins are typically soldered to the circuit board 31, leaving a 0.2 mm gap between the pins and the circuit board 31. This increases the gap between the driver assembly 20 and the circuit board body 311, thereby increasing the height of the camera module, which is inconsistent with the requirement for reducing the height of the camera module.

[0122] Therefore, in the present application, the circuit board body 311 has a plurality of side recesses 3112, and the plurality of side recesses 3112 are located on one side of the circuit board body 311 at positions corresponding to the plurality of pins 21141 of the chip anti-shake connection part. The pins 21141 pass through the circuit board body 311 through the side recesses 3112, and the pins 21141 and the side recesses 3112 are electrically connected by laying an electrical connection medium. Specifically, the surface of the side recesses 3112 has a metal plating layer, so that it can be welded and fixed with the electrical connection medium and electrically conductive. Through the above structure, the gap between the drive assembly 20 and the circuit board body 311 is not limited by the size of the pins 21141 and the welding process, thereby reducing the height of the camera module.

[0123] Figure 17 A schematic diagram illustrating the relative positional relationship between the pin 21141 and the circuit board body 311 according to one embodiment of the present application is shown. The vertical portion 211412 of the pin 21141 preferably protrudes from the bottom surface of the circuit board body 311 (i.e., the back surface of the circuit board body 311), i.e., the bottom surface of the vertical portion 211412 of the pin 21141 is lower than the bottom surface of the circuit board body 311. This allows the electrical connection medium to have a larger contact area with the side surface of the pin 21141, thereby improving the soldering yield and ensuring a good electrical connection. When a reinforcing plate is further attached to the bottom surface of the circuit board body 311, preferably, the reinforcing plate 37 is not attached to the bottom surface of the side recess 3112, and the bottom surface of the vertical portion 211412 of the pin 21141 does not protrude from the bottom surface of the reinforcing plate 37, that is, the bottom surface of the vertical portion 211412 of the pin 21141 is preferably between the bottom surface of the circuit board body 311 and the bottom surface of the reinforcing plate 37, so that the reinforcing plate 37 can protect the pin 21141 and reduce the risk of short circuit caused by contact between the pin 21141 and other components. It should be noted that in other embodiments of the present application, the bottom surface of the vertical portion 211412 of the pin 21141 may also protrude from the bottom surface of the reinforcement plate 37, or the bottom surface of the vertical portion 211412 of the pin 21141 may not protrude from the bottom surface of the circuit board body 311, that is, the bottom surface of the vertical portion 211412 of the pin 21141 may also be higher than the bottom surface of the circuit board body 311, and located between the upper surface and the bottom surface of the circuit board body 311.

[0124] Furthermore, the included angle between the vertical portion 211412 and the transverse portion 211411 is between 80° and 100°. When the vertical portion 211412 is perpendicular to the transverse portion 211411, the included angle between the vertical portion 211412 and the transverse portion 211411 is 90°. In a preferred embodiment of the present application, the vertical portion 211412 has an inclination angle greater than 0° and less than 10° relative to the perpendicular line of the transverse portion 211411, so that the vertical portion 211412 can be longer at the same height, reducing the difficulty of the pin manufacturing process.

[0125] From the overall perspective of the camera module, the first connecting strip soft board 3121 is located on the first side 301 of the camera module 1, the second connecting strip soft board 3131 is located on the second side 302 of the camera module 1, the lens driving electrical connection part 2203 of the lens driving part 22, the first connecting strip hard board 3122 and the second connecting strip hard board 3132 are located on the third side 303 of the camera module 1, and the chip anti-shake electrical connection part 2114 of the chip driving part 21 is located on the fourth side 304 of the camera module 1. Through the above layout, the above components do not interfere with each other, so that their influence on the chip anti-shake of the camera module is relatively low.

[0126] Figure 18-21 A schematic diagram of an outer frame 40 of the present application is shown, wherein the outer frame 40 includes a frame body 41 , a frame cover 42 and a frame bottom plate 43 .

[0127] The frame body 41 has a through hole to accommodate the driving assembly 20 . The driving assembly 20 is fixed to the frame body 41 by an adhesive medium, thereby providing a support position for the driving assembly 20 .

[0128] The frame base plate 43 is fixed to the bottom surface of the frame body 41 to protect the photosensitive component 30. In addition, a gap exists between the frame base plate 43 and the bottom surface of the photosensitive component 30, so that when the photosensitive component 30 is driven by the chip anti-shake unit 211 of the driving assembly 20, the frame base plate 43 does not interfere with the movement of the photosensitive component 30. Furthermore, the frame base plate 43 may also have a through hole, and the through hole of the frame base plate 43 corresponds to the chip anti-shake electrical connection portion 2114 of the chip anti-shake unit 211 of the driving assembly 20, thereby providing more space for the pins 21141, avoiding contact between the pins 21141 and the frame base plate 43, and reducing the risks of mutual interference and circuit short circuits.

[0129] The frame cover 42 is fixed to the top surface of the frame body 41, thereby enclosing the drive assembly 20 with the frame body 41 and reducing the risk of dust and other dirt falling between the drive assembly 20 and the frame body 41. The frame cover 42 has a through hole, which is suitable for providing incident light for the optical lens 10 and allowing the optical lens 10 to pass through, so that the optical lens 10 protrudes from the frame cover 42.

[0130] Furthermore, if Figure 20-21 As shown, the outer frame 40 also includes a conductive cloth 44, and the conductive cloth 44 is attached to the bottom surface of the frame base plate 43. The conductive cloth 44 can cover the through-holes of the frame base plate 43, so that dust and other dirt will not enter the camera module. The conductive cloth 44 can also include a conductive cloth side portion 441, and the conductive cloth 44 is further attached to the side of the frame body 41 through the conductive cloth side portion 441. When the frame body 41 is a metal such as aluminum or stainless steel, the conductive cloth 44 can be electrically connected to the frame body 41, and can achieve effects such as conduction and electromagnetic shielding. The conductive cloth 44 may include one or more conductive cloth side portions 441. In a specific example of the present application, the number of the conductive cloth side portions 441 is 4, and they are respectively distributed on the four sides of the frame body 41.

[0131] Furthermore, if Figure 18 As shown, the outer frame 40 also includes an insulating sheet 45, which is disposed between the first connecting strip hard plate 3122 and the frame body 41. When the frame body 41 is made of a conductive material, there is a risk of contact between the frame body 41 and the first hard plate, thereby causing a short circuit in the first hard plate. Therefore, arranging the insulating sheet 45 between the first connecting strip hard plate 3122 and the frame body 41 can reduce the above risk. Specifically, the insulating sheet 45 can be adhesively fixed to the inner side of the frame body 41, or adhesively fixed to the outer side of the first connecting strip hard plate 3122, or the insulating sheet 45 can be placed only between the first connecting strip hard plate 3122 and the frame body 41.

[0132] In the present application, the main parts of the first connecting belt and the second connecting belt are arranged on the peripheral side of the optical element of the camera module, so they can be called side connecting belts. In the side connecting belt, the part that bends upward from the side of the circuit board main body can be called a bending portion (or an upward bending portion, which can be regarded as a part of the side connecting belt). The part arranged on the peripheral side of the optical element of the camera module can be called the side connecting belt main body. The surface of the side connecting belt main body can be roughly perpendicular to the surface of the circuit board main body. In some embodiments, the side connecting belt and the circuit board main body can be integrally formed, for example, the side connecting belt and the circuit board main body can be integrally formed by the manufacturing process of a soft-hard combination board. The circuit board main body can be a hard board (such as a PCB board), the bending part of the side connecting belt can be a soft board (such as an FPC board), and the side connecting belt main body can include a soft board part and a hard board part. The hard board part can be used to suspend the side connecting belt on a static component of the optical actuator (such as an actuator fixing part).

[0133] In this application, an optical element refers to an element used to form an imaging optical system, generally including multiple lenses used for imaging and a photosensitive element (usually a photosensitive chip). Multiple lenses used for imaging and their supporting structure (such as a lens barrel) can constitute the optical lens. The photosensitive element is located in the photosensitive assembly.

[0134] In the aforementioned embodiment, the drive assembly 20 constitutes an optical actuator. This optical actuator can be a dual OIS optical actuator, that is, it has a lens drive portion and a chip drive portion. The optical actuator can include a fixed actuator portion and a movable actuator portion. The fixed actuator portion can include a lens drive fixed portion and a chip stabilization fixed portion, which can be fixed together. The movable actuator portion can include a movable lens drive portion and a movable chip stabilization portion.

[0135] In this application, the surface of a rigid board or connecting strip refers to a surface perpendicular to the thickness direction of the rigid board or connecting strip (i.e., the normal direction of the surface is consistent with the thickness direction of the rigid board). Each rigid board or connecting strip has two surfaces: the inner surface (i.e., the side facing the optical axis) is the inner surface, and the outer surface (i.e., the side facing away from the optical axis) is the outer surface.

[0136] In this application, the photosensitive chip and / or optical actuator of the camera module usually has circuits for power supply and / or realizing certain corresponding functions. These circuits can be arranged on one or more circuit boards. For the convenience of description, all various substrates in the camera module used for power supply and / or arrangement of functional circuits and the connecting components of these substrates are referred to as circuit board structures in this article.

[0137] In some embodiments of the present application, the camera module includes an optical actuator, an optical lens and a photosensitive component; wherein the optical actuator has a chip anti-shake part. At least one side surface of the chip anti-shake part has a plurality of conductive pins, and at least one side surface of the circuit board body has a plurality of side recesses. Each of the side recesses is formed by the side surface of the circuit board body being recessed inward, and the conductive pin extends into the side recess, and the conductive pin and the side recess are electrically connected by a welding medium. The chip anti-shake part includes a chip anti-shake fixed part and a chip anti-shake movable part. In a preferred embodiment, the plurality of conductive pins are led out from at least one side surface of the chip anti-shake movable part. In this preferred embodiment, the conductive pins are led out from the chip anti-shake movable part and electrically connected to the side recess of the circuit board body, which can well adapt to the chip anti-shake movement while realizing the electrical connection between the chip anti-shake part and the circuit board body. During the chip anti-shake movement process, the chip anti-shake movable part and the circuit board body move together, that is, the chip anti-shake movable part and the circuit board body are relatively stationary. It should be noted that the present application Figure 3 In order to make the drawing simple, some lines of the chip anti-shake fixed part and the chip anti-shake movable part are omitted. In fact, in the preferred embodiment of the present application, the conductive pin for electrical connection with the side recess is led out from the side of the chip anti-shake movable part (rather than the chip anti-shake fixed part).

[0138] Furthermore, in some embodiments of the present application, the frame base plate has a pin avoidance through-hole; the pin avoidance through-hole may be located directly below the undercut portion. When viewed from above, the pin avoidance through-hole is larger than the undercut portion, and the outline of the pin avoidance through-hole is at least 15 μm away from the outline of the undercut portion. The depth of the undercut portion is 15-25 μm. The depth of the undercut portion is the distance inward from the side surface of the circuit board body.

[0139] Finally, it should be noted that the above embodiments are intended only to illustrate the technical solutions of the present invention and are not intended to limit the present invention. Although the present invention has been described in detail with reference to the embodiments, it should be understood by those skilled in the art that modifications or equivalent substitutions to the technical solutions of the present invention do not depart from the spirit and scope of the technical solutions of the present invention and are intended to be encompassed by the claims of the present invention.

Claims

1. A camera module comprising an optical lens, a photosensitive component and an optical actuator, wherein the optical actuator comprises an actuator fixed portion and an actuator movable portion; characterized in that: The photosensitive component comprises a photosensitive chip, a circuit board and a reinforcement plate, wherein the circuit board comprises a circuit board body and at least two side connection strips; The circuit board body has a surface perpendicular to the optical axis of the camera module and multiple side surfaces parallel to the optical axis; each of the side connecting strips is extended from a side surface of the circuit board body and bent upward, and after bending, extends to the side surface of the optical lens and / or the photosensitive component to form a side connecting strip body; The side connecting strip includes a connecting strip soft board and a connecting strip hard board connected to each other, and the connecting strip hard board is suspended on the actuator fixing part; the part where the connecting strip soft board is connected to the circuit board body forms a soft board bent portion bent upward, and the reinforcing plate includes a reinforcing plate body, a reinforcing plate bent portion formed by bending upward from the edge area of ​​the reinforcing plate body, and a reinforcing plate side portion formed by continuing to extend upward from the reinforcing plate bent portion, the reinforcing plate body is attached and fixed to the bottom surface of the circuit board body, the reinforcing plate bent portion is wrapped around the outside of the soft board bent portion, and the reinforcing plate side portion is in contact with the side connecting strip but not connected to each other.

2. The camera module according to claim 1, wherein: Among the at least two side connecting strips of the circuit board, the outer surface of the hard board of one of the side connecting strips has multiple solder pads, and the hard board of the other side connecting strip has multiple conductive through-holes, and the hard boards of the two side connecting strips are arranged overlappingly; the soldering medium is attached to the side walls of the conductive through-holes and passes through the conductive through-holes to contact the solder pads.

3. The camera module according to claim 2, wherein: The plurality of side surfaces include a first side surface, a second side surface opposite to the first side surface, a third side surface adjacent to the first side surface, and a fourth side surface opposite to the third side surface; The side connecting belt comprises: a first connecting strip, comprising a first connecting strip flexible board and a first connecting strip hard board, wherein the first connecting strip flexible board is led out from the first side surface of the circuit board body and bent upward, then extends along the first side surface, and then bent to the third side surface, the first connecting strip hard board is located on the third side surface, and a side surface of the first connecting strip hard board is connected to the first connecting strip flexible board, and a surface of the first connecting strip hard board is parallel to the optical axis; and a second connecting strip, comprising a second connecting strip flexible board and a second connecting strip hard board, wherein the second connecting strip flexible board is led out from the second side surface of the circuit board body and bent upward, then extends along the second side surface and then bent to the third side surface, the second connecting strip hard board is located on the third side surface and a side surface of the second connecting strip hard board is connected to the second connecting strip flexible board, and a surface of the second connecting strip hard board is parallel to the optical axis; Among them, the first connecting strip hard board is located on the outside of the second connecting strip hard board, the first connecting strip hard board has a plurality of conductive through-holes, the outer surface of the second connecting strip hard board has a plurality of soldering pads, the conductive through-holes and the soldering pads are connected by a welding medium, the welding medium is sprayed into and through the conductive through-holes in a molten state, and after cooling, it adheres to the soldering pads and the conductive through-holes to electrically connect the conductive through-holes and the soldering pads.

4. The camera module according to claim 3, wherein: The first connection belt hard plate and the second connection belt hard plate are bonded together by an adhesive medium; a gap of no more than 100 μm is provided between the inner surface of the first connection belt hard plate and the outer surface of the second connection belt hard plate.

5. The camera module according to claim 4, wherein: The soldering medium, in a molten state, enters the conductive via in the form of a jet flow and adheres to the sidewall of the conductive via, and the soldering medium passes through the conductive via and contacts the solder pad; and after solidification, the soldering medium forms a connector spanning the gap between the inner surface of the first connecting strip hard board and the outer surface of the second connecting strip hard board; A gap is reserved between the welding medium and a portion of the hole wall of the conductive through hole.

6. The camera module according to claim 1, wherein: The reinforcing plate is a metal plate.

7. The camera module according to claim 6, wherein: The thickness of the reinforcing plate is smaller than the thickness of the circuit board body.

8. The camera module according to claim 1, wherein: There is a central through hole in the center of the circuit board body, the photosensitive chip is attached to the upper surface of the reinforcement plate and the photosensitive chip is placed in the central through hole; an annular base is provided on the upper surface of the circuit board body, the annular base surrounds the photosensitive chip, and the top surface of the annular base is installed on the filter. The filter, the annular base, the circuit board body and the reinforcement plate form a closed cavity, and the photosensitive chip is encapsulated in the closed cavity.

9. The camera module according to claim 8, wherein: The movable part of the actuator includes a chip anti-shake movable part, and the photosensitive package composed of the circuit board body, the filter, the annular base, the reinforcement plate and the photosensitive chip is fixed to the chip anti-shake movable part. The photosensitive package is suitable for moving relative to the actuator fixed part under the drive of the chip anti-shake movable part.

10. The camera module according to claim 9, wherein: The outer side surface of the actuator fixing portion has a convex column protruding outward, and the hard plate of the side connecting belt has a hanging hole. The convex column passes through the hanging hole to hang the side connecting belt on the actuator fixing portion.

11. The camera module according to claim 3, wherein: The circuit board also includes a third connecting strip formed by extending from the lower side of the first connecting strip hard board and bending outward, the surface of the third connecting strip is perpendicular to the optical axis, and the free end of the third connecting strip has a connector, which is suitable for plugging into the mainboard of the electronic device equipped with the camera module.

12. The camera module according to claim 9, wherein: The actuator movable part further includes a lens driving movable part. The optical lens is mounted on the lens driving movable part and is adapted to move relative to the actuator fixed part under the drive of the lens driving movable part.

13. The camera module according to claim 6, wherein: The reinforcing plate bent portion is integrally formed with the main body of the reinforcing plate, is located outside the side of the main body of the reinforcing plate, and has a width smaller than the side of the main body of the reinforcing plate.

14. The camera module according to claim 6, wherein: The reinforcing plate bent portion has a through hole.

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