Edge ring position bias calibration adjustment method
By generating a laser line tangent to the edge ring within the reaction chamber and calculating the absolute difference at the intersection point, the problem of low accuracy in detecting the center position of the edge ring is solved, and a stable distribution of the Rs value for high-temperature annealing of wafers is achieved.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Patents(China)
- Current Assignee / Owner
- GUANGZHOU CANSEMI TECH INC
- Filing Date
- 2022-12-09
- Publication Date
- 2026-06-26
AI Technical Summary
In existing technologies, the detection accuracy of the edge ring center position is low, resulting in unstable Rs value distribution during high-temperature annealing of wafers. Traditional methods rely on human observation, which has large errors and cannot effectively adjust the sigma value.
By setting the test state of the edge ring in the annular groove of the reaction chamber, placing reference coordinates and generating a laser line tangent to the inner contour line of the annular groove and the outer contour line of the edge ring, calculating the absolute difference between the intersection point of the laser line and the reference coordinates, and calibrating and adjusting the position deviation.
It improves the accuracy of edge ring center position detection, ensures stable Rs value distribution during wafer high-temperature annealing, and reduces sigma value deviation.
Smart Images
Figure CN115831820B_ABST
Abstract
Description
Technical Field
[0001] This application relates to the field of semiconductor technology, specifically to a method for calibrating and adjusting the position deviation of an edge ring. Background Technology
[0002] In semiconductor manufacturing, semiconductor chips require annealing after ion implantation to restore the crystal structure and eliminate defects. Annealing also activates donor and acceptor impurities, allowing impurity atoms in interstitial positions to move to their replacement sites. Current technology uses high-temperature annealing machines to perform wafer thermal annealing and verifies the annealing effect by detecting the wafer's Rs value. Generally, the mean and sigma values of Rs are controlled to ensure the degree and uniformity of high-temperature annealing. However, the sigma value of Rs can become excessively high because the center of the edge ring supporting the wafer is not located at the center of the chamber (reaction chamber). Even adjusting the power of the bulbs in different areas cannot bring the sigma value of Rs, which deviates from the wafer's normal range, back to the normal range. (Reference) Figure 1a and 1b , Figure 1a The Rs map of a normal wafer is located at the center of the reaction chamber, where the center of the edge ring is also at the center. Therefore, the Rs map is symmetrical about the center. Even if its sigma value is relatively large, it can still be adjusted by changing the power of different groups of heating bulbs until it falls within the range controlled by the process. Figure 1b It is the wafer Rs map where the center position of the edge ring is deviated. Its positional deviation is large, and even adjusting the power of different groups of heating bulbs cannot reduce its sigma value to the range of process control.
[0003] Traditional edge ring center position detection involves rotating the edge ring after PM (preventive maintenance) and visually observing the positional changes of its edge portion to determine whether its center position is at the center of the reaction chamber. However, relying solely on human visual observation, even for the same person, different observations will result in errors due to changes in the angle, lighting, and other environmental factors. In other words, the accuracy of human visual observation is very low, and the error is too large. This situation needs to be changed. Summary of the Invention
[0004] This application provides a method for calibrating and adjusting the position deviation of an edge ring to improve the accuracy of edge ring center position detection, thereby maintaining a stable Rs value distribution during high-temperature annealing of the wafer.
[0005] To achieve the above-mentioned objectives, according to the first aspect, the technical solution adopted is as follows:
[0006] A method for calibrating and adjusting the position deviation of an edge ring includes: setting a test state for the edge ring within an annular groove of a reaction chamber; placing reference coordinates within the reaction chamber according to the test state, with the reference coordinates maintaining a certain distance from the annular groove; generating a first target laser line perpendicular to the reference coordinates and tangent to the inner contour line of the annular groove; generating a second target laser line perpendicular to the reference coordinates and tangent to the outer contour line of the edge ring; obtaining the absolute difference between the intersection point value of the first target laser line and the reference coordinates and the intersection point value of the second target laser line and the reference coordinates; and calibrating and adjusting the position deviation of the edge ring based on the absolute difference.
[0007] This application is further configured such that: the calibration and adjustment of the position deviation of the edge ring based on the absolute difference specifically includes: determining whether the absolute difference is within a preset specification value, wherein the specification value is 17-20mm; if the absolute difference is within the specification value, then the position deviation of the edge ring is determined to be normal; if the absolute difference is not within the specification value, then the test state of the edge ring in the annular groove of the reaction chamber is reset.
[0008] This application further specifies that: the test state of the edge ring in the annular groove of the reaction chamber specifically includes: setting the test position of the edge ring in the annular groove of the reaction chamber; and setting the test speed of the edge ring in the annular groove of the reaction chamber based on the test position.
[0009] This application further specifies that the test speed is 240 r / min.
[0010] This application further specifies that: setting the test position of the edge ring in the annular groove of the reaction chamber specifically includes: selecting the edge ring after PM and placing it in the annular groove; using the coordinates of the horizontal / vertical markers that are tangent to the outer contour line of the edge ring as coordinate references for adjusting the test position.
[0011] To achieve the above-mentioned objectives, according to the second aspect, the technical solution adopted is as follows:
[0012] A method for calibrating and adjusting the position deviation of an edge ring includes: setting a test state for the edge ring within an annular groove of a reaction chamber; placing mutually perpendicular first and second measurement coordinates within the reaction chamber according to the test state; generating a first reference laser line tangent to the inner contour line of the annular groove and a first measurement laser line tangent to the outer contour line of the edge ring, perpendicular to the first measurement coordinates; generating a second reference laser line tangent to the inner contour line of the annular groove and a second measurement laser line tangent to the outer contour line of the edge ring, perpendicular to the second measurement coordinates; obtaining a first measurement difference value at the intersection points of the first measurement laser line and the first reference laser line with the first measurement coordinates; obtaining a second measurement difference value at the intersection points of the second measurement laser line and the second reference laser line with the second measurement coordinates; and calibrating and adjusting the position deviation of the edge ring based on the first measurement difference value and the second measurement difference value.
[0013] This application is further configured such that: the calibration and adjustment of the position deviation of the edge ring based on the first measurement difference and the second measurement difference specifically includes: determining whether the first measurement difference and the second measurement difference are within a preset specification value, wherein the specification value is 18±0.5mm; if the first measurement difference and the second measurement difference are within the specification value, then the position deviation of the edge ring is determined to be normal; if the first measurement difference and the second measurement difference are not within the specification value, then the test state of the edge ring in the annular groove of the reaction chamber is reset.
[0014] This application further specifies that: the test state of the edge ring in the annular groove of the reaction chamber specifically includes: setting the test position of the edge ring in the annular groove of the reaction chamber; and setting the test speed of the edge ring in the annular groove of the reaction chamber based on the test position.
[0015] This application further specifies that the test speed is 230-260 r / min.
[0016] This application further specifies that: setting the test position of the edge ring within the annular groove of the reaction chamber specifically includes: selecting the edge ring after PM and placing it within the annular groove; using the coordinates of the horizontal / vertical markers tangent to the outer contour line of the edge ring as coordinate references for adjusting the test position.
[0017] In summary, compared with the prior art, this application discloses a method for calibrating and adjusting the position deviation of an edge ring. A reference coordinate is placed based on the test state of the edge ring. A first target laser line tangent to the inner contour line of the annular groove and a second target laser line tangent to the outer contour line of the edge ring are generated perpendicular to the reference coordinate. The absolute difference between the intersection points of the first and second target laser lines on the reference coordinate is then calculated. This absolute difference is used as a benchmark to calibrate and adjust the position deviation of the edge ring. This setup improves the accuracy of edge ring center position detection, thereby maintaining a stable Rs value distribution during high-temperature wafer annealing. Attached Figure Description
[0018] To more clearly illustrate the technical solutions in the embodiments of this application, the accompanying drawings used in the description of the embodiments will be briefly introduced below. Obviously, the accompanying drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.
[0019] Figure 1a This is a wafer Rs distribution diagram where the edge ring and reaction chamber are concentric in existing technology.
[0020] Figure 1b This is a wafer Rs distribution diagram where the edge ring and reaction chamber are not concentric in the existing technology.
[0021] Figure 2 This is the first flowchart of the edge ring position deviation calibration and adjustment method in this embodiment;
[0022] Figure 3 This is a structural diagram of the first application of the edge ring position deviation calibration and adjustment method in this embodiment;
[0023] Figure 4 This is a second flowchart of the edge ring position deviation calibration and adjustment method in this embodiment;
[0024] Figure 5 This is a second application structure diagram of the edge ring position deviation calibration and adjustment method in this embodiment. Detailed Implementation
[0025] Exemplary embodiments will now be described in detail, examples of which are illustrated in the accompanying drawings. When the following description relates to the drawings, unless otherwise indicated, the same numbers in different drawings denote the same or similar elements. The embodiments described in the following exemplary embodiments do not represent all embodiments consistent with this application. Rather, they are merely examples of apparatuses and methods consistent with some aspects of this application as detailed in the appended claims.
[0026] It should be noted that, in this document, the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such a process, method, article, or apparatus. Without further limitations, an element defined by the phrase "comprising one..." does not exclude the presence of other identical elements in the process, method, article, or apparatus that includes that element. Furthermore, components, features, and elements with the same names in different embodiments of this application may have the same meaning or different meanings, the specific meaning of which must be determined by its interpretation in that specific embodiment or further in conjunction with the context of that specific embodiment.
[0027] It should be understood that the specific embodiments described herein are merely illustrative of this application and are not intended to limit this application.
[0028] In the following description, the use of suffixes such as "module," "part," or "unit" to denote elements is solely for the purpose of illustrative purposes and has no specific meaning in itself. Therefore, "module," "part," or "unit" may be used interchangeably.
[0029] In the description of this application, it should be noted that the terms "upper," "lower," "left," "right," "inner," and "outer," etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings, and are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation on this application. Furthermore, the terms "first," "second," and "third" are used for descriptive purposes only and should not be construed as indicating or implying relative importance.
[0030] The technical solutions shown in this application will be described in detail below through specific embodiments. It should be noted that the order of description of the following embodiments is not intended to limit the priority of the embodiments.
[0031] Example 1
[0032] A method for calibrating and adjusting the position deviation of an edge ring; please refer to [reference needed]. Figure 2 and Figure 4 , Figure 2 This is a flowchart of the edge ring position deviation calibration and adjustment method in this embodiment. Figure 4 This is an application structure diagram of the edge ring position deviation calibration and adjustment method in this embodiment. The position deviation calibration method includes:
[0033] S101, Set the test state of the edge ring 11 in the annular groove 13 of the reaction chamber 12.
[0034] In this step, the test status includes the test position and test speed of the edge ring 11. Specifically, the test position of the edge ring 11 in the annular groove 13 of the reaction chamber 12 is set, and the test speed of the edge ring 11 in the annular groove 13 of the reaction chamber 12 is set based on the test position.
[0035] In the specific implementation process, the test speed is 240 r / min. The test position of the edge ring 11 is determined by selecting the edge ring 11 after PM (preventive maintenance) and placing it in the annular groove 13. After the edge ring 11 rotates at the set test speed, the coordinates 16 of the horizontal / vertical mark tangent to the outer contour line mark of the edge ring 11 are used as coordinate references for adjusting the test position to improve the position adjustment accuracy, thereby improving the subsequent position deviation adjustment accuracy and facilitating the calibration of the edge ring position deviation.
[0036] It should be noted that the horizontal / vertical coordinate 16 is the X / Y axis extension of the tangent line of the outer contour line of the edge ring 11.
[0037] In this embodiment, the ideal assembly method is that the edge ring 11 matches the annular groove 13 of the reaction chamber 12. However, in actual application, dimensional errors due to different centers are unavoidable.
[0038] S102, according to the test status, place the reference coordinate 14 into the reaction chamber 12, and keep the reference coordinate 14 at a certain distance from the annular groove 13.
[0039] In this step, after determining the horizontal / vertical mark coordinates 16 based on the test position of the edge ring 11, the test speed of the edge ring 11 is maintained at 240 r / min. Then, a reference coordinate 14 parallel to the horizontal or vertical mark coordinates of the horizontal / vertical mark coordinates 16 is deployed. In order to avoid interference between the reference coordinate 14 and the edge ring 11, the reference coordinate 14 is kept at a certain distance from the annular groove 13.
[0040] In some embodiments, the reference coordinate 14 is kept at a distance of 3cm, 5cm, or 7cm from the annular groove 13.
[0041] In some embodiments, the reference coordinate 14 may be a ruler, square, or other measuring tool with graduations to simplify calibration conditions and improve measurement efficiency.
[0042] S103, a first target laser line is generated perpendicular to the reference coordinate 14 and tangent to the inner contour line of the annular groove 13.
[0043] In this embodiment, a measuring laser is emitted by a cross laser level 15 to generate a first target laser line that is tangent to the inner contour line of the annular groove 13, perpendicular to the reference coordinate 14.
[0044] S104, a second target laser line is generated perpendicular to the reference coordinate 14 and tangent to the outer contour line of the edge ring 11.
[0045] In this step, a measuring laser is emitted by a cross laser level 15 to generate a second target laser line that is tangent to the outer contour line of the edge ring 11, perpendicular to the reference coordinate 14.
[0046] It should be noted that when the reference coordinate 14 is parallel to the horizontal mark coordinate, the cross laser level 15 is parallel to the vertical mark coordinate. Similarly, when the reference coordinate 14 is parallel to the vertical mark coordinate, the cross laser level 15 is parallel to the horizontal mark coordinate. This ensures that the laser lines of the first and second marks are perpendicular to the reference coordinate 14, thereby improving measurement accuracy.
[0047] S105, obtain the absolute difference between the value of the intersection point of the first target laser line and the reference coordinate 14 and the value of the intersection point of the second target laser line and the reference coordinate 14.
[0048] In this step, the absolute difference is the absolute value of the difference between the intersection point of the first target laser line and the reference coordinate 14 and the intersection point of the second target laser line and the reference coordinate 14.
[0049] In some embodiments, the reference coordinate 14 can be selected as a photosensitive ruler, that is, by receiving laser illumination from the first and second target laser lines, sensing the illumination point and outputting the difference between the two points, so as to improve accuracy and intelligence.
[0050] S106, The positional deviation of the edge ring 11 is calibrated and adjusted based on the absolute difference.
[0051] In this step, the positional deviation of the edge ring 11 is detected by judging whether the absolute difference is within the preset specification value. If the absolute difference is within the specification value, the positional deviation of the edge ring 11 is normal. If the absolute difference is not within the specification value, the test state of the edge ring 11 in the annular groove 13 of the reaction chamber 12 is reset.
[0052] The preset specification value is 17-20mm.
[0053] In the specific implementation process, the test state of the edge ring 11 in the annular groove 13 of the reaction chamber 12 is reset, which includes stopping the rotation of the edge ring 11, and adjusting the test position of the edge ring 11 in the annular groove 13 of the reaction chamber 12 by combining the absolute difference and taking the horizontal / vertical marker coordinates 16 as a reference.
[0054] In some embodiments, adjusting the test position of the edge ring 11 within the annular groove 13 of the reaction chamber 12 specifically includes:
[0055] Keep edge ring 11 parallel to the vertical coordinate of the horizontal / vertical mark 16, and shift edge ring 11 along the horizontal mark. The displacement distance can be 1 / 2 of the absolute difference exceeding the specification value. Alternatively, keep edge ring 11 parallel to the horizontal mark 16, and shift edge ring 11 along the vertical mark. The displacement distance can be 1 / 2 of the absolute difference exceeding the specification value, until the absolute difference is within the specification value, then the calibration adjustment is complete.
[0056] It should be noted that the positional deviation of the edge ring 11 is the concentric deviation between it and the reaction chamber 12. When the positional deviation of the edge ring 11 is within the specified value, that is, the wafer carried by the edge ring 11 is concentric or nearly concentric with the reaction chamber 12, the Rs value distribution of the wafer undergoing high-temperature annealing in the reaction chamber 12 is stable.
[0057] In summary, this application discloses a method for calibrating and adjusting the position deviation of an edge ring. A reference coordinate 14 is placed based on the test state of the edge ring 11. A first target laser line tangent to the inner contour line of the annular groove 13 and a second target laser line tangent to the outer contour line of the edge ring 11 are generated perpendicular to the reference coordinate 14. The absolute difference between the intersection points of the first and second target laser lines on the reference coordinate 14 is then calculated. This absolute difference is used as a benchmark to calibrate and adjust the position deviation of the edge ring 11. This setup improves the accuracy of detecting the concentric position of the edge ring 11 and the reaction chamber 12, thereby maintaining a stable Rs value distribution during high-temperature wafer annealing.
[0058] Example 2
[0059] A method for calibrating and adjusting the position deviation of an edge ring, referenced Figure 3 and Figure 5 , Figure 3 This is a flowchart of the edge ring position deviation calibration and adjustment method in this embodiment. Figure 5 This is an application structure diagram of the edge ring position deviation calibration and adjustment method in this embodiment. The position deviation calibration method includes:
[0060] S201, Set the test state of the edge ring 21 in the annular groove 23 of the reaction chamber 22.
[0061] In this step, the test status includes the test position and test speed of the edge ring 21. Specifically, the test position of the edge ring 21 in the annular groove 23 of the reaction chamber 22 is set, and the test speed of the edge ring 21 in the annular groove 23 of the reaction chamber 22 is set based on the test position.
[0062] In the specific implementation process, the test speed is 230-260 r / min. The test position of the edge ring 21 is determined by selecting the edge ring 21 after PM (preventive maintenance) and placing it in the annular groove 23. After the edge ring 21 rotates at the set test speed, the coordinates 26 of the horizontal / vertical marks tangent to the outer contour line mark of the edge ring 21 are used as coordinate references for adjusting the test position to improve the position adjustment accuracy, thereby improving the subsequent position deviation adjustment accuracy and facilitating the calibration of the edge ring position deviation.
[0063] It should be noted that the horizontal / vertical coordinate 26 is the X / Y axis extension of the tangent line of the outer contour line of the edge ring 21.
[0064] In this embodiment, the ideal assembly method is that the edge ring 21 matches the annular groove 23 of the reaction chamber 22. However, in actual application, dimensional errors due to different centers are unavoidable.
[0065] S202, according to the test status, place the first measurement coordinate 24 and the second measurement coordinate 25, which are perpendicular to each other, into the reaction chamber 22.
[0066] In this step, after determining the horizontal / vertical marker coordinates 26 based on the test position of the edge ring 21, the test speed of the edge ring 21 is maintained, and then the first measurement coordinate 24 and the second measurement coordinate 25, which are parallel to the horizontal and vertical marker coordinates of the horizontal / vertical marker coordinates 26, are deployed. In order to avoid interference between the first measurement coordinates 24 and the second measurement coordinates 25 and the edge ring 21, the first measurement coordinates 24 and the second measurement coordinates 25 are kept at a certain distance from the annular groove 23.
[0067] In some embodiments, the first measuring coordinate 24 and the second measuring coordinate 25 are kept at a distance of 3cm, 5cm or 7cm from the annular groove 23.
[0068] In some embodiments, the first measuring coordinate 24 and the second measuring coordinate 25 may be a ruler, square, or other measuring tool with graduations to simplify calibration conditions and improve measurement efficiency.
[0069] S203, a first reference laser line tangent to the inner contour line of the annular groove 23 and a first measurement laser line tangent to the outer contour line of the edge ring 21 are generated perpendicular to the first measurement coordinate 24.
[0070] In this step, a measuring laser is emitted by a longitudinal cross laser level 27 to generate a first reference laser line tangent to the inner contour line of the annular groove 23 and a first measuring laser line tangent to the outer contour line of the edge ring 21, perpendicular to the first measuring coordinate 24.
[0071] S204, a second reference laser line tangent to the inner contour line of the annular groove 23 and a second measurement laser line tangent to the outer contour line of the edge ring 21 are generated perpendicular to the second measurement coordinate 25.
[0072] In this step, a measuring laser is emitted by a transverse cross laser level 28 to generate a second reference laser line tangent to the inner contour line of the annular groove 23 and a second measuring laser line tangent to the outer contour line of the edge ring 21, perpendicular to the second measuring coordinate 25.
[0073] S205, obtain the first measurement difference value of the intersection point of the first measurement laser line and the first reference laser line with the first measurement coordinate 24.
[0074] In some embodiments, the first measurement coordinate 24 can be selected as a photosensitive ruler, that is, by receiving laser illumination from the first reference laser line and the first measurement laser line, it senses the illumination point and outputs the difference between the two points to improve accuracy and intelligence.
[0075] S206, obtain the second measurement difference value of the intersection point of the second measurement laser line and the second reference laser line with the second measurement coordinate 25.
[0076] In some embodiments, the second measurement coordinate 25 can be selected as a photosensitive ruler, that is, by receiving laser irradiation from the second measurement laser line and the second reference laser line, it senses the irradiation point and outputs the difference between the two points to improve accuracy and intelligence.
[0077] It should be noted that the annular groove 23 is fixed and concentrically located in the reaction chamber 22. Therefore, in this embodiment, the outline tangent of the annular groove 23 is selected as the reference line to generate reference values.
[0078] S207, the positional deviation of the edge ring 21 is calibrated and adjusted based on the first measurement difference and the second measurement difference.
[0079] In this step, the positional deviation of the edge ring 21 is detected by judging whether the first measurement difference and the second measurement difference are within the preset specification value, where the specification value is 18±0.5mm. That is, if both the first measurement difference and the second measurement difference are within the specification value, the positional deviation of the edge ring 21 is normal. If the first measurement difference and the second measurement difference are not within the specification value, the test state of the edge ring 21 in the annular groove 23 of the reaction chamber 22 is reset.
[0080] In the specific implementation process, the test state of the edge ring 21 in the annular groove 23 of the reaction chamber 22 is reset, which includes stopping the rotation of the edge ring 21, combining the first measurement difference and the second measurement difference and taking the horizontal / vertical marker coordinate 26 as a reference, adjusting the test position of the edge ring 21 in the annular groove 23 of the reaction chamber 22 until the first measurement difference and the second measurement difference are within the specified values, then the calibration adjustment is completed.
[0081] In summary, this application discloses a method for calibrating and adjusting the position deviation of an edge ring. By placing a first measurement coordinate 24 and a second measurement coordinate 25 in the test state of the edge ring 21, and by perpendicularly connecting the first and second measurement coordinates 24 and 25, a first reference laser line tangent to the inner contour line of the annular groove 23 and a first measurement laser line tangent to the outer contour line of the edge ring 21 are generated. Similarly, a second reference laser line tangent to the inner contour line of the annular groove 23 and a second measurement laser line tangent to the outer contour line of the edge ring 21 are also generated. The first measurement difference between the intersection points of the first measurement laser line and the first reference laser line with the first measurement coordinate 24, and the second measurement difference between the intersection points of the second measurement laser line and the second reference laser line with the second measurement coordinate 25, are then calculated. The position deviation of the edge ring 21 is calibrated and adjusted based on these first and second measurement differences. This setup improves the accuracy of detecting the concentric position of the edge ring 21 and the reaction chamber 22, thereby maintaining a stable Rs value distribution during high-temperature wafer annealing.
[0082] The present application has been described in detail above. Specific examples have been used to illustrate the principles and implementation methods of the present application. The description of the above embodiments is only for the purpose of helping to understand the core ideas of the present application. At the same time, for those skilled in the art, there will be changes in the specific implementation methods and application scope based on the ideas of the present application. Therefore, the content of this specification should not be construed as a limitation of the present application.
Claims
1. A method for calibrating and adjusting the position deviation of an edge ring, characterized in that, include: Set the test state of the edge ring within the annular groove of the reaction chamber; Place reference coordinates into the reaction chamber according to the test state, and keep the reference coordinates at a certain distance from the annular groove; A first target laser line is generated perpendicular to the reference coordinates and tangent to the inner contour line of the annular groove; A second target laser line is generated perpendicular to the reference coordinates and tangent to the outer contour line of the edge ring; Obtain the absolute difference between the value of the intersection point of the first target laser line and the reference coordinate and the value of the intersection point of the second target laser line and the reference coordinate; The positional deviation of the edge ring is calibrated and adjusted based on the absolute difference.
2. The edge ring position deviation calibration and adjustment method as described in claim 1, characterized in that, The calibration and adjustment of the positional deviation of the edge ring based on the absolute difference specifically includes: Determine whether the absolute difference is within a preset specification value, wherein the specification value is 17-20mm; If the absolute difference is within the specified value, then the edge ring position deviation is determined to be normal. If the absolute difference is not within the specified value, the test state of the edge ring in the annular groove of the reaction chamber is reset.
3. The edge ring position deviation calibration and adjustment method as described in claim 2, characterized in that, The test state of the set edge ring within the annular groove of the reaction chamber specifically includes: The test position of the edge ring within the annular groove of the reaction chamber is determined; The test speed of the edge ring within the annular groove of the reaction chamber is set based on the test location.
4. The edge ring position deviation calibration and adjustment method as described in claim 3, characterized in that, The test speed was 240 r / min.
5. The edge ring position deviation calibration and adjustment method as described in claim 3, characterized in that, Setting the test position of the edge ring within the annular groove of the reaction chamber specifically includes: The edge ring after PM is placed inside the annular groove; The coordinates of the horizontal / vertical markers that are tangent to the outer contour line of the edge ring are used as coordinate references for adjusting the test position.
6. A method for calibrating and adjusting the position deviation of an edge ring, characterized in that, include: Set the test state of the edge ring within the annular groove of the reaction chamber; According to the test state, place the first and second measurement coordinates, which are perpendicular to each other, into the reaction chamber; A first reference laser line tangent to the inner contour line of the annular groove and a first measurement laser line tangent to the outer contour line of the edge ring are generated perpendicular to the first measurement coordinate. A second reference laser line tangent to the inner contour line of the annular groove and a second measurement laser line tangent to the outer contour line of the edge ring are generated perpendicular to the second measurement coordinate. Obtain the first measurement difference value of the intersection point of the first measurement laser line and the first reference laser line with the first measurement coordinate; Obtain the second measurement difference value of the intersection point of the second measurement laser line and the second reference laser line with the second measurement coordinate; The positional deviation of the edge ring is calibrated and adjusted based on the first measurement difference and the second measurement difference.
7. The edge ring position deviation calibration and adjustment method as described in claim 6, characterized in that, The calibration and adjustment of the position deviation of the edge ring based on the first measurement difference and the second measurement difference specifically includes: Determine whether the first measurement difference and the second measurement difference are within a preset specification value, wherein the specification value is 18±0.5mm; If the first measurement difference and the second measurement difference are within the specified values, then the edge ring position deviation is determined to be normal. If the first measurement difference and the second measurement difference are not within the specified values, then the test state of the edge ring in the annular groove of the reaction chamber is reset.
8. The edge ring position deviation calibration and adjustment method as described in claim 7, characterized in that, The test state of the set edge ring within the annular groove of the reaction chamber specifically includes: The test position of the edge ring within the annular groove of the reaction chamber is determined; The test speed of the edge ring within the annular groove of the reaction chamber is set based on the test location.
9. The edge ring position deviation calibration and adjustment method as described in claim 8, characterized in that, The test speed is 230-260 r / min.
10. The edge ring position deviation calibration and adjustment method as described in claim 7, characterized in that, Setting the test position of the edge ring within the annular groove of the reaction chamber specifically includes: The edge ring after PM is placed inside the annular groove; The coordinates of the horizontal / vertical markers that are tangent to the outer contour line of the edge ring are used as coordinate references for adjusting the test position.