Micro-LED laser processing system

Abstract

The application discloses a Micro-LED laser processing system. The Micro-LED laser processing system comprises a fixed platform, a pressing mechanism, a laser head and a CCD camera. The fixed platform comprises a first bearing and an adjusting device, the first bearing is used for bearing a substrate, and the adjusting device is used for adjusting the flatness of the first bearing. The pressing mechanism comprises a pressing piece and a suction accessory, the pressing piece is used for pressing a carrier plate, and the suction accessory is used for adsorbing the carrier plate. The pressing mechanism can adsorb the carrier plate and press the carrier plate to the substrate. The laser head and the CCD camera are both arranged above the first bearing, the laser head can emit laser to the fixed platform. The CCD camera can identify the position of the substrate on the fixed platform. After the suction accessory adsorbs the carrier plate, the carrier plate is attached to the substrate under the assistance of the CCD camera. Then, the pressing piece presses the carrier plate to the substrate, which can reduce the deformation of the carrier plate caused by high temperature during welding, and make the chip welding position accurate.

Description

Technical Field

[0001] This invention relates to the field of chip manufacturing technology, and in particular to a Micro-LED laser processing system. Background Technology

[0002] In related technologies, the fabrication process of Micro-LEDs generally involves bonding chips onto a substrate. Before bonding, the substrate is mounted on a stage, and the chip is mounted on the stage. After the stage is positioned and attached to the substrate, the chip is bonded to the substrate. However, in the above process, deviations can easily occur in the bonding and positioning of the stage and the substrate, or the substrate can deform due to excessively high bonding temperature when the chip is bonded to the substrate. This can lead to incorrect chip bonding positions, making it difficult to meet the bonding precision requirements of Micro-LEDs and resulting in a reduction in the processing quality of Micro-LEDs. Summary of the Invention

[0003] This invention aims to at least solve one of the technical problems existing in the prior art. To this end, this invention proposes a Micro-LED laser processing system that enables accurate bonding between the carrier and the substrate, ensuring the correct soldering position of the chip on the substrate.

[0004] A Micro-LED laser processing system according to a first aspect of the present invention includes:

[0005] Machine tool body;

[0006] A fixed platform is connected to the machine tool body. The fixed platform includes a first bearing member and an adjustment device. The first bearing member is provided with a first bearing surface, which is used to support a base plate. The adjustment device is used to adjust the flatness of the first bearing surface.

[0007] A pressing mechanism is connected to the machine tool body. The pressing mechanism is movable along the X-axis and Z-axis. The pressing mechanism includes a pressing component, an adsorption component, and a connecting assembly. The pressing component and the adsorption component are both connected to the connecting assembly. The pressing component is used to press the carrier plate, and the adsorption component is used to adsorb the carrier plate. The pressing mechanism can adsorb the carrier plate and press the carrier plate onto the substrate.

[0008] A laser head is connected to the machine tool body and positioned above the first support member. The laser head can move along the X-axis and emit laser light towards the fixed platform.

[0009] A CCD camera is connected to the machine tool body and positioned above the first support member. The CCD camera is capable of moving along the X-axis.

[0010] The Micro-LED laser processing system according to embodiments of the present invention has at least the following beneficial effects: the fixed platform can support the substrate and adjust the flatness of the first support surface; the CCD camera is positioned above the first support member and can identify the position of the substrate on the fixed platform; the pressing mechanism includes a pressing member and an adsorption member; the adsorption member adsorbs the carrier plate and moves it above the first support member; with the assistance of the CCD camera, the carrier plate is lowered and adhered to the substrate, ensuring the correct adhesion position between the carrier plate and the substrate; subsequently, the pressing member of the pressing mechanism presses the carrier plate onto the substrate and maintains pressure during the welding process, which can reduce the deformation of the carrier plate caused by the high temperature during welding to a certain extent, ensure the accurate chip welding position, and improve the chip welding quality.

[0011] According to some embodiments of the present invention, the fixing platform further includes a base, the first support member is connected to the base, the first support member is provided with a first support surface for supporting the substrate, the first support surface is provided with a plurality of adsorption holes for adsorbing the substrate, the adjustment device is disposed between the base and the first support member, the adjustment device includes a movable member and an adjustment member, the movable member is connected to the first support member, and the adjustment member can drive the movable member to move so that the first support member moves closer to or further away from the adjustment member.

[0012] According to some embodiments of the present invention, the first support member is further provided with a heating cavity, and the fixed platform further includes a heating element, which is housed in the heating cavity and is used to heat the first support surface.

[0013] According to some embodiments of the present invention, the first support member is provided with a plurality of adsorption chambers, the plurality of adsorption chambers are spaced apart along the Y-axis direction, the adsorption chambers correspond to and communicate with the plurality of adsorption holes, the first support member is also provided with a connecting cavity, the connecting cavity communicates with each of the adsorption chambers and forms an exhaust port on the outer wall of the first support member, the exhaust port is used to discharge the air in the adsorption chamber to form a negative pressure at the adsorption hole.

[0014] According to some embodiments of the present invention, the fixing platform further includes a positioning member connected to the first bearing member. The positioning member is provided with a first positioning surface and a second positioning surface. The first positioning surface and the second positioning surface are connected and perpendicular to each other. The first positioning surface is parallel to the X-axis direction, and the second positioning surface is parallel to the Y-axis direction. The positioning member is used to position the substrate on the first bearing surface.

[0015] According to some embodiments of the present invention, the pressing mechanism further includes a connecting component and a mounting component. The connecting component is used to connect the machine tool body. The mounting component has a first end face and a second end face disposed opposite to each other along the Z-axis direction, and a second side face connecting the first end face and the second end face. The first end face is connected to the connecting component, and the adsorption member is connected to the second end face. The mounting component is provided with a first opening that communicates the first end face and the second end face. The pressing member is connected to the mounting component and corresponds to the first opening, and the pressing member protrudes from the second end face.

[0016] According to some embodiments of the present invention, the mounting assembly includes a second mounting member and a third mounting member. The second mounting member is provided with a second opening and a plurality of first mounting slots, the first mounting slots communicating with the second opening. The third mounting member is provided with a main body and a plurality of mounting portions. The main body connects to each of the mounting portions and defines the first opening. The second opening is larger than the first opening. Each mounting portion corresponds one-to-one with each of the first mounting slots and is accommodated in the corresponding first mounting slot.

[0017] According to some embodiments of the present invention, along the Z-axis direction, the cross-sectional area of ​​the first opening gradually decreases from the first end face to the second end face, or the cross-sectional area of ​​the second opening gradually decreases from the first end face to the second end face. The pressing member has a third end face and a fourth end face disposed opposite to each other along the Z-axis direction. Along the Z-axis direction, the cross-sectional area of ​​the pressing member gradually decreases from the third end face to the fourth end face. The pressing member can be snapped onto the mounting assembly.

[0018] According to some embodiments of the present invention, a connecting platform is further included, which is connected to the machine tool body. The connecting platform and the fixed platform are spaced apart along the X-axis direction. The connecting platform is provided with a second carrier member, which is provided with a second carrier surface for supporting a carrier plate. The pressing mechanism and the CCD camera can both move along the X-axis direction to the position corresponding to the second carrier member.

[0019] According to some embodiments of the present invention, an optical fiber is also included, which is connected to the laser head and is capable of transmitting a flat-top laser to and being emitted by the laser head.

[0020] Additional aspects and advantages of the invention will be set forth in part in the description which follows, and in part will be obvious from the description, or may be learned by practice of the invention. Attached Figure Description

[0021] The present invention will be further described below with reference to the accompanying drawings and embodiments, wherein:

[0022] Figure 1 This is a schematic diagram of the Micro-LED laser processing system according to an embodiment of the present invention;

[0023] Figure 2 This is a schematic diagram of the fixed platform according to an embodiment of the present invention;

[0024] Figure 3 This is an assembly diagram of the first driving component and the base in an embodiment of the present invention;

[0025] Figure 4 This is an assembly diagram of the first bearing member, positioning member, and heating member according to an embodiment of the present invention;

[0026] Figure 5 This is a cross-sectional view of the first support member according to an embodiment of the present invention;

[0027] Figure 6 This is a cross-sectional view of another location of the first support member in an embodiment of the present invention;

[0028] Figure 7 This is a cross-sectional view of another location of the first support member according to another embodiment of the present invention;

[0029] Figure 8 This is a cross-sectional view of the adjusting device according to an embodiment of the present invention;

[0030] Figure 9 This is an exploded view of the pressing mechanism according to an embodiment of the present invention;

[0031] Figure 10 This is a schematic diagram of the pressing mechanism according to an embodiment of the present invention;

[0032] Figure 11 This is a schematic diagram of another angle pressing mechanism according to an embodiment of the present invention;

[0033] Figure 12 A cross-sectional view of the installation components according to an embodiment of the present invention;

[0034] Figure 13 This is a cross-sectional view of the mounting components and pressing parts according to an embodiment of the present invention;

[0035] Figure 14 This is a schematic diagram of the connection platform according to an embodiment of the present invention.

[0036] Figure label:

[0037] Machine tool body 100;

[0038] Fixed platform 200, base 210, first bearing member 220, first bearing surface 221, adsorption hole 222, adsorption cavity 223, connecting cavity 224, heating cavity 225, first side surface 226, heating port 2261, exhaust port 2262;

[0039] Adjustment device 230, movable part 231, adjustment part 232, guide surface 233, first mounting part 234, mounting cavity 235, mounting hole 236;

[0040] Connector 241, first drive component 242;

[0041] Sensor 251, sensing element 252;

[0042] First positioning component 260, first positioning surface 261, second positioning surface 262;

[0043] First connector 270, heating element 280, extension 281, bending part 282;

[0044] Pressing mechanism 300, connecting assembly 310, mounting plate 311, side connecting plate 312, second mounting groove 313, horizontal connecting plate 314;

[0045] Mounting component 320, first end face 321, second end face 322, second mounting part 323, second opening 324, first mounting groove 325, channel 326, third mounting part 327, main body 3271, mounting part 3272, first opening 328, second side 329;

[0046] Adsorption element 330, adsorption port 331, second connector 332, airflow hole 333;

[0047] Press-fit part 340, third end face 341, fourth end face 342;

[0048] Connecting platform 400, second positioning component 410, second bearing component 420, second bearing surface 421;

[0049] Substrate 500, carrier plate 600, laser head 700, optical fiber 710, CCD camera 800. Detailed Implementation

[0050] Embodiments of the present invention are described in detail below. Examples of these embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals denote the same or similar elements or elements having the same or similar functions throughout. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain the present invention, and should not be construed as limiting the present invention.

[0051] In the description of this invention, it should be understood that the orientation descriptions, such as up, down, front, back, left, right, etc., are based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing this invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limiting this invention.

[0052] In the description of this invention, "several" means one or more, "multiple" means two or more, "greater than," "less than," and "exceeding" are understood to exclude the stated number, while "above," "below," and "within" are understood to include the stated number. The use of "first" and "second" in the description is merely for distinguishing technical features and should not be construed as indicating or implying relative importance, or implicitly indicating the number of indicated technical features, or implicitly indicating the order of the indicated technical features.

[0053] In the description of this invention, unless otherwise explicitly defined, terms such as "set up," "install," and "connect" should be interpreted broadly, and those skilled in the art can reasonably determine the specific meaning of the above terms in this invention in conjunction with the specific content of the technical solution.

[0054] In the description of this invention, the terms "one embodiment," "some embodiments," "illustrative embodiment," "example," "specific example," or "some examples," etc., refer to specific features, structures, materials, or characteristics described in connection with that embodiment or example, which are included in at least one embodiment or example of the invention. In this specification, the illustrative expressions of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in one or more embodiments or examples.

[0055] Reference Figures 1 to 14 The first aspect of this invention provides a Micro-LED laser processing system, including a machine tool body 100, a fixed platform 200, a pressing mechanism 300, a laser head 700, and a CCD camera 800. The fixed platform 200 is connected to the machine tool body 100 and includes a first support member 220 and an adjustment device 230. The first support member 220 has a first support surface 221 for supporting a substrate 500, and the adjustment device 230 is used to adjust the flatness of the first support surface 221. A pressing mechanism 300 is connected to the machine tool body 100. The pressing mechanism 300 is movable along the X-axis and Z-axis. The pressing mechanism 300 includes a pressing component 340, an adsorption component 330, and a connecting assembly 310. Both the pressing component 340 and the adsorption component 330 are connected to the connecting assembly 310. The pressing component 340 is used to press the carrier plate 600, and the adsorption component 330 is used to adsorb the carrier plate 600. The pressing mechanism 300 can adsorb the carrier plate 600 and press it onto the substrate 500. A laser head 700 is connected to the machine tool body 100 and positioned above the first support component 220. The laser head 700 is movable along the X-axis and can emit laser light towards the fixed platform 200. A CCD camera 800 is connected to the machine tool body 100 and positioned above the first support component 220. The CCD camera 800 is movable along the X-axis.

[0056] The fixed platform 200 can support the substrate 500 and adjust the flatness of the first support surface 221. The CCD camera 800 is positioned above the first support 220 and can identify the position of the substrate 500 on the fixed platform 200. The pressing mechanism 300 includes a pressing member 340 and an adsorption member 330. After adsorbing the carrier plate 600, the adsorption member 330 moves above the first support 220. With the assistance of the CCD camera 800, the carrier plate 600 is lowered and attached to the substrate 500, ensuring the correct attachment position of the carrier plate 600 and the substrate 500. Subsequently, the pressing member 340 of the pressing mechanism 300 presses the carrier plate 600 onto the substrate 500 and keeps it pressed during the welding process. This can reduce the deformation of the carrier plate 600 caused by the high temperature during welding to a certain extent, ensure the accurate chip welding position, and improve the chip welding quality.

[0057] Specifically, each mechanism in the Micro-LED laser processing system is driven by a drive unit. When controlling the movement in the X and Y axes, the drive unit can be a linear motor module or a motor.

[0058] Reference Figure 2 , Figure 4 and Figure 8 In some embodiments, the fixed platform 200 further includes a base 210, a first support member 220 connected to the base 210, the first support member 220 having a first support surface 221 for supporting the substrate 500, a plurality of adsorption holes 222 for adsorbing the substrate 500, and an adjustment device 230 disposed between the base 210 and the first support member 220. The adjustment device 230 includes a movable member 231 and an adjustment member 232. The movable member 231 is connected to the first support member 220, and the adjustment member 232 can drive the movable member 231 to move so that the first support member 220 moves closer to or further away from the adjustment member 232. After the substrate 500 is placed on the first bearing surface 221, the moving part 231 is driven to move by the adjusting part 232 of the adjusting device 230 to level the substrate 500, so that the chip on the carrier 600 is tightly attached to the substrate 500, which enables the chip to be correctly soldered to the substrate 500 and ensures the processing quality of the product.

[0059] Specifically, the adjusting device 230 further includes a first mounting member 234, which has a mounting cavity 235 and a mounting hole 236. The mounting cavity 235 is horizontally oriented, and the mounting hole 236 is vertically oriented and communicates with the mounting cavity 235. An adjusting member 232 passes through the mounting cavity 235 and has a guide surface 233. A movable member 231 passes through the mounting hole 236 and protrudes into the mounting cavity 235. The movable member 231 abuts against the guide surface 233 of the adjusting member 232. The guide surface 233 is inclined so that when the movable member 231 moves along the extension direction of the mounting cavity 235, the movable member 231 also moves up and down accordingly, thereby adjusting the position of the first bearing member 220 in the vertical direction. Alternatively, the adjusting device 230 can provide an elastic bearing in the mounting cavity 235, and adjust the compression of the elastic bearing by adjusting the adjusting member 232 to adjust the position of the first bearing member 220 in the vertical direction.

[0060] Reference Figure 4 , Figure 6 and Figure 7 In some embodiments, the first carrier 220 is further provided with a heating cavity 225, and the fixing platform 200 further includes a heating element 280, which is housed in the heating cavity 225 and is used to heat the first carrier surface 221. Specifically, before the substrate 500 is moved to the fixing platform 200, solder is pre-applied to the welding area of ​​the substrate 500. When the substrate 500 is adsorbed and fixed to the first carrier 220, the heating element 280 heats the first carrier surface 221 to transfer heat to the substrate 500, thereby melting the solder pre-applied on the substrate 500. Subsequently, the carrier plate 600 is attached to the substrate 500 so that the chip on the carrier plate 600 is in full contact with the solder. Then, the chip can be soldered and fixed to the substrate 500 through welding. Before the carrier plate 600 is pressed, the substrate 500 needs to be preheated for 30 to 90 seconds at a preheating temperature of 60°C to 90°C. In addition, for example, when using laser welding, the high welding temperature can easily cause the substrate 500 to deform. Preheating the substrate 500 to bring it closer to the welding temperature reduces the degree of deformation of the substrate 500 due to thermal expansion and contraction.

[0061] Reference Figure 7In some embodiments, the fixed platform 200 includes multiple heating elements 280, a first support member 220 is provided with multiple heating cavities 225, a first side surface 226 is provided with multiple heating ports 2261, each heating port 2261 corresponds to a heating cavity 225, and the multiple heating ports 2261 are spaced apart along the X-axis. One end of each heating cavity 225 is connected to a heating port 2261, and the other end of the heating cavity 225 extends towards the Y-axis. The heating elements pass through the corresponding heating ports 2261 and are housed in the heating cavities 225. The multiple heating elements housed in the corresponding heating cavities 225 are also spaced apart along the X-axis, thereby enabling uniform heating of the first support member 220 and controllable heating temperature. In addition, one end of the heating cavity 225 is connected to the heating port 2261, and the other end of the heating cavity 225 extends in the Y-axis direction, which makes the heating cavity 225 easy to process. Only a hole needs to be drilled in the Y-axis direction on the first side 226, which reduces the manufacturing difficulty.

[0062] Reference Figure 6 In some embodiments, the first support member 220 is provided with a first side surface 226, the first side surface 226 is provided with a heating port 2261, the heating cavity 225 is connected to the heating port 2261, and the heating member 280 is provided with multiple extensions 281 and multiple bends 282. The multiple extensions 281 are spaced apart along the X-axis, and the bends 282 connect adjacent extensions 281. By providing multiple extensions 281 and bends 282 connecting adjacent extensions 281, the heating member 280 can have a larger contact area with the first support member 220 when it is placed in the heating cavity 225, and the heating of the first support surface 221 will be more uniform. Compared with the above embodiments that use multiple heating members 280, this embodiment only requires one heating member 280 to heat the first support surface 221, which makes the temperature control more precise and easier.

[0063] Reference Figure 4 and Figure 5In some embodiments, the first bearing surface 221 is further provided with a plurality of adsorption holes 222. The adsorption holes 222 are used to adsorb the substrate 500 to prevent the substrate 500 from shifting during processing and affecting the processing accuracy. The first bearing member 220 is provided with a plurality of adsorption cavities 223. The plurality of adsorption cavities 223 are spaced apart along the Y-axis direction. The adsorption cavities 223 correspond to and communicate with the plurality of adsorption holes 222. The first bearing member 220 is also provided with a connecting cavity 224. The connecting cavity 224 communicates with each adsorption cavity 223 and forms an exhaust port 2262 on the outer wall of the first bearing member 220. The exhaust port 2262 is used to discharge the air in the adsorption cavity 223 to form a negative pressure at the adsorption hole 222 to adsorb the substrate 500. Specifically, the first bearing surface 221 is provided with a plurality of adsorption groups. The adsorption group includes a plurality of adsorption holes 222 spaced apart along the X-axis direction. The plurality of adsorption groups are spaced apart along the Y-axis direction. Each adsorption group corresponds one-to-one with each adsorption cavity 223. The above arrangement allows the adsorption holes 222 to be evenly distributed on the adsorption surface, thereby making the adsorption state of the substrate 500 on the adsorption surface more stable and ensuring that the substrate 500 does not become weaker than the adsorption surface during the welding process. An exhaust port 2262 is located on the first side surface 226, and a connecting cavity 224 extends from the first side surface 226 along the Y-axis and connects to each adsorption cavity 223, allowing air in each adsorption cavity 223 to be discharged through the connecting cavity 224 and the exhaust port 2262, thus generating adsorption force at the adsorption holes 222. The fixed platform 200 also includes a first connector 270, which is connected to the first support member 220 and located at the exhaust port 2262. The first connector 270 is connected to a vacuum source, thereby enabling the air in each adsorption cavity 223 to be discharged.

[0064] Reference Figure 2 and Figure 3 In some embodiments, the fixed platform 200 further includes a connector 241 and a first drive member 242. The connector 241 is connected to the end of the adjusting device 230 away from the first support member 220. The first drive member 242 is disposed between the connector 241 and the base 210 and is used to drive the connector 241 to rotate. Since the substrate 500 may be misaligned when placed on the first support member 220, the first drive member 242 is needed to drive the connector 241 to rotate so that the substrate 500 is aligned, facilitating the corresponding pressing of the carrier plate 600 and the substrate 500. The angle at which the first drive member 242 drives the connector 241 to rotate can be determined by the CCD camera 800.

[0065] Reference Figure 2 and Figure 3In some embodiments, the fixed platform 200 further includes two opposing sensors 251 and sensing elements 252. The sensors 251 are connected to the base 210, and the sensing elements 252 are connected to the connector 241 and positioned between the two sensors 251. The two opposing sensors 251 limit the rotation range of the connector 241 driven by the first drive element 242, preventing the rotating element from rotating without restriction and damaging the wiring connected to the heating element 280 and the pipe connected to the first connector 270. Specifically, the two sensors 251 limit the rotation angle of the connector 241 driven by the first drive element 242 to within 14°. The first drive element 242 can be selected as a DD motor.

[0066] Reference Figure 4 In some embodiments, the fixing platform 200 further includes a first positioning member 260, which is connected to the first support member 220. The first positioning member 260 is provided with a first positioning surface 261 and a second positioning surface 262. The first positioning surface 261 and the second positioning surface 262 are connected and perpendicular to each other. The first positioning surface 261 is parallel to the X-axis direction, and the second positioning surface 262 is parallel to the Y-axis direction. The first positioning member 260 is used to position the substrate 500 on the first support surface 221. Specifically, the substrate 500 is a cuboid, and its two perpendicular sidewalls abut against the first positioning surface 261 and the second positioning surface 262, thereby determining the position of the substrate 500 on the first support surface 221, which facilitates the pressing of the carrier plate 600.

[0067] Reference Figure 2 In some embodiments, the fixed platform 200 includes at least three adjustment devices 230, and these three adjustment devices 230 are not collinear, thereby enabling adjustment of the flatness of the substrate 500. Specifically, when three adjustment devices 230 are provided, their connection forms a triangle, allowing adjustment of the movable part 231 of the last adjustment device 230 after the movable parts 231 of the two leveling devices are at the same height. When four adjustment devices 230 are provided, each of the four adjustment devices corresponds to one of the four corners of the first support member 220, providing better load-bearing capacity and improved load-bearing stability compared to three adjustment devices 230. The adjustment accuracy in this embodiment can reach 2 micrometers.

[0068] Reference Figure 4In some embodiments, the fixed platform 200 further includes a first positioning member 260, which is connected to the first support member 220. The first positioning member 260 is provided with a first positioning surface 261 and a second positioning surface 262. The first positioning surface 261 and the second positioning surface 262 are connected and perpendicular to each other. The first positioning surface 261 is parallel to the X-axis direction, and the second positioning surface 262 is parallel to the Y-axis direction. The positioning member is used to position the substrate 500 on the first support surface 221.

[0069] Reference Figures 9 to 13 In some embodiments, the pressing mechanism 300 further includes a connecting component 310 and a mounting component 320. The connecting component 310 is used to connect the machine tool body 100. The mounting component 320 has a first end face 321 and a second end face 322 disposed opposite to each other along the Z-axis direction, and a side surface connecting the first end face 321 and the second end face 322. The first end face 321 is connected to the connecting component 310, and the adsorption member 330 is connected to the second end face 322. The mounting component 320 is provided with a first opening 328, which communicates with the first end face 321 and the second end face 322. The pressing member 340 is connected to the mounting component 320 and corresponds to the first opening 328. The pressing member 340 protrudes from the second end face 322.

[0070] The pressing mechanism 300 can adsorb the carrier plate 600 through the adsorption member 330. After the carrier plate 600 is placed on the substrate 500, since the pressing member 340 protrudes from the second end face 322, the pressing mechanism 300 can press the carrier plate 600 tightly onto the substrate 500 through the pressing member 340, so that the carrier plate 600 and the substrate 500 abut against each other and are subjected to uniform force. Then, the welding process is carried out to weld the chip on the carrier plate 600 to the substrate 500. The pressure applied by the pressing member 340 to the carrier plate 600 can reduce the deformation of the carrier plate 600 caused by the high temperature during welding to a certain extent, and ensure the welding quality of the chip.

[0071] Specifically, the chip is attached to one side of the carrier plate 600 via silicone, while the adsorption member 330 adsorbs the other side of the carrier plate 600. The pressing mechanism 300 can be connected to the machine tool and driven by a drive device provided on the machine tool. The drive device can be provided with two drive members to drive the pressing mechanism 300 to move in the X-axis and Z-axis directions respectively, moving the carrier plate 600 to contact the substrate 500. At the same time, a certain amount of force is applied to the carrier plate 600 to ensure that the chip and the solder pre-placed on the substrate 500 are in full contact and the force on the carrier plate 600 is uniform, and then welding is performed. When laser welding is used, both the pressing member 340 and the carrier plate 600 are made of transparent material, so that the laser beam can pass through the pressing member 340 through the first opening 328 and enter the carrier plate 600, acting on the position where the chip and the substrate 500 are in contact, melting the solder and fixing the chip and the substrate 500 together. Subsequently, the driving device drives the carrier plate 600 to move away from the substrate 500 along the Z-axis direction, so that the carrier plate 600 is separated from the chip to obtain the product.

[0072] Reference Figure 9 and Figure 10 In some embodiments, the mounting component 320 includes a second mounting member 323 and a third mounting member 327. The second mounting member 323 is provided with a second opening 324 and a plurality of first mounting slots 325. The first mounting slots 325 are connected to the second opening 324. The third mounting member 327 is provided with a main body portion 3271 and a plurality of mounting portions 3272. The main body portion 3271 connects to each mounting portion 3272. The main body portion 3271 defines a first opening 328. The second opening 324 is larger than the first opening 328. Each mounting portion 3272 corresponds one-to-one with each first mounting slot 325 and is accommodated in the corresponding first mounting slot 325.

[0073] Specifically, the second mounting member 323 and the third mounting member 327 are generally square. The mounting portions 3272 of the third mounting member 327 are located at the four corners of the main body 3271. Therefore, when each mounting portion 3272 is installed in its corresponding first mounting groove 325, a shim can be added between the corresponding mounting portion 3272 and the corresponding first mounting groove 325 to adjust the orientation of the pressing member 340 installed in the first opening 328. This ensures that the laser beam can pass through the pressing member 340 along the Z-axis direction during laser welding. Furthermore, the second mounting member 323 and the third mounting member 327 are detachably connected by threaded fasteners. After prolonged use, the third mounting member 327 can be replaced to ensure the installation accuracy of the pressing member 340.

[0074] Reference Figure 13In some embodiments, along the Z-axis direction, the cross-sectional area of ​​the first opening 328 gradually decreases from the first end face 321 to the second end face 322, or the cross-sectional area of ​​the second opening 324 gradually decreases from the first end face 321 to the second end face 322. The pressing member 340 has a third end face 341 and a fourth end face 342 disposed opposite each other along the Z-axis direction, and the cross-sectional area of ​​the pressing member 340 gradually decreases from the third end face 341 to the fourth end face 342 along the Z-axis direction. The pressing member 340 can be snapped onto the mounting assembly 320. It should be noted that the above-mentioned cross-sectional areas are all obtained by cutting the corresponding parts with a plane perpendicular to the Z-axis. The pressing member 340 can be snapped onto the second mounting member 323 or the third mounting member 327. When mounted on the third mounting member 327, the pressing member 340 is mounted on the first opening 328. When installed on the second mounting component 323, the pressing component 340 is installed in the second opening 324 and its third end face 341 abuts against the third mounting component 327. This prevents the pressing component 340 from moving relative to the second mounting component 323 during the pressing process, ensuring pressing accuracy. During installation, the pressing component 340 is connected to the mounting component 320 by wedging. That is, the pressing component 340 aligns its third end face 341 with the first opening 328 or the second opening 324, and then is placed downwards along the Z-axis until it cannot move. At this time, the pressing component 340 protrudes from the second end face 322 and its fourth end face 342 is flush with the suction port 331 of the suction component 330. The installation steps are simple and the pressing component 340 and the mounting component 320 are tightly connected and will not easily loosen.

[0075] Reference Figure 9 and Figure 10 In some embodiments, the connecting assembly 310 includes a mounting plate 311, a horizontal connecting plate 314, and two side connecting plates 312. The side connecting plates 312 connect the mounting plate 311 and the mounting assembly 320. A second mounting groove 313 is provided at one end of the side connecting plate 312 away from the mounting plate 311 along the Y-axis. The two side connecting plates 312 are spaced apart along the X-axis. The horizontal connecting plate 314 connects the two side connecting plates 312 and passes through the two second mounting grooves 313. Both the side connecting plates 312 and the horizontal connecting plate 314 are connected to the pressing member 340 via threaded fasteners, enabling the connecting assembly 310 to be stably connected to the mounting assembly 320. Specifically, the side connecting plates 312 are approximately triangular in shape, with both sides of the side connecting plate 312 connecting the mounting plate 311 and the mounting assembly 320 respectively, and both having a large contact area, thus improving connection stability. The horizontal connecting plate 314 connects the two side connecting plates 312 and passes through the two second mounting slots 313, so that the end of the side connecting plate 312 away from the mounting plate 311 along the Y-axis is fixed and more stable, avoiding shaking during movement or pressing, which would cause deviation in pressing and positioning and affect the welding quality.

[0076] Reference Figure 9In some embodiments, the pressing mechanism 300 includes a plurality of adsorption elements 330, which are arranged around the first opening 328. Specifically, the plurality of adsorption elements 330 are spaced apart around the first opening 328, and during the adsorption operation, the plurality of adsorption elements 330 can simultaneously adsorb the carrier plate 600, making the carrier plate 600 more stable during the process of transporting and positioning it to the substrate 500, and preventing the carrier plate 600 from loosening during transport.

[0077] Reference Figure 9 , Figure 11 and Figure 12 In some embodiments, the pressing mechanism 300 further includes a second connector 332 for connecting to a vacuum source. The second connector 332 is provided with an airflow hole 333, and the adsorption member 330 is provided with an adsorption port 331. The second connector 332 is connected to the second side surface 329. The mounting assembly 320 is provided with multiple channels 326, each channel 326 corresponding to each adsorption member 330. One end of the channel 326 is connected to the airflow hole 333, and the other end of the channel 326 is connected to the adsorption port 331. Specifically, the second mounting member 323 is provided with multiple channels 326, which are interconnected, so that the pressing mechanism 300 can simultaneously draw air from multiple adsorption ports 331 by connecting only one second connector 332, reducing the number of vacuum sources required. In addition, the second connector 332 is connected to the second side surface 329 of the mounting assembly 320, which facilitates the connection of pipelines and reduces the impact on the first end face 321 and the second end face 322, avoiding interference with the welding process.

[0078] In some embodiments, the pressing member 340 is made of quartz glass, allowing the laser to pass through it. This enables the pressing member 340 to simultaneously press the carrier plate 600 onto the substrate 500 and weld the chip, ensuring the welding quality of the chip. Quartz glass has excellent physical and chemical properties, able to withstand high temperatures without interfering with the laser beam during laser processing. Furthermore, quartz glass is low in cost and simple to process, ensuring the flatness of the fourth end face 342 of the pressing member 340 after processing, thereby improving the welding accuracy of the chip.

[0079] In some embodiments, the mounting assembly 320 is made of alloy steel and has high temperature resistance, which can effectively reduce the degree of deformation at the operating temperature of laser welding, thereby ensuring that the pressing mechanism 300 can be used for a long time.

[0080] Reference Figure 14In some embodiments, the Micro-LED laser processing system further includes a docking platform 400 connected to the machine tool body 100. The docking platform 400 and the fixed platform 200 are spaced apart along the X-axis. The docking platform 400 is provided with a second support member 420, which has a second support surface 421 for supporting the carrier plate 600. The pressing mechanism 300 and the CCD camera 800 can both move along the X-axis to the position corresponding to the second support member 420. The docking platform 400 is also provided with a second positioning member 410, which is configured the same as the first positioning member 260 and will not be described again here. The second positioning member 410 is used to position the carrier plate 600. Before the pressing mechanism 300 adsorbs the carrier plate 600, the CCD camera 800 first determines the position of the carrier plate 600 on the second bearing surface 421. Then the pressing mechanism 300 adsorbs the carrier plate 600 to ensure accurate adsorption position, which facilitates the subsequent pressing and positioning of the carrier plate 600 and the substrate 500.

[0081] In some embodiments, the Micro-LED laser processing system further includes an optical fiber 710 connected to a laser head 700. The optical fiber 710 transmits a flat-top laser beam to the laser head 700, which then emits it. The flat-top laser beam has the same energy density within its irradiation range, ensuring a uniform heat distribution when the laser acts on the substrate 500, resulting in consistent welding temperatures for each chip. Furthermore, by controlling the intensity of the flat-top laser beam, the welding temperature between the chip and the substrate 500 is sufficient to achieve welding without damaging the chip. Specifically, the laser beam emitted from the laser head 700 is rectangular in shape. During laser welding, the laser irradiates the processing start position, and then the chip is scanned and welded to the substrate 500 by moving the drive component along the X-axis.

[0082] The specific fabrication steps of the Micro-LED laser processing system are as follows:

[0083] S1: Provide the substrate 500 required for welding;

[0084] S2: Fix the substrate 500 to the first support member 220 and fix the carrier plate 600 to the second support member; (wherein, solder paste has been pre-applied to the substrate 500 and the chip is fixed on the carrier plate 600);

[0085] S3: According to the size of the substrate 500, set up multiple corresponding areas, and the pressing mechanism 300 will adsorb the carrier plate 600 and move it to the designated area of ​​the substrate 500.

[0086] S4: Use a machine vision system to align the Mark points on the substrate 500 to determine the starting position for laser welding;

[0087] S5: According to the set trajectory, the laser scans within a 600° range of the carrier plate to complete the welding;

[0088] S6: Repeat steps S1 to S5 until chips are soldered to all areas on the substrate 500.

[0089] The embodiments of the present invention have been described in detail above with reference to the accompanying drawings. However, the present invention is not limited to the above embodiments, and various changes can be made within the scope of knowledge possessed by those skilled in the art without departing from the spirit of the present invention. Furthermore, the embodiments of the present invention and the features thereof can be combined with each other unless otherwise specified.

Claims

1. A Micro-LED laser processing system, characterized in that, include: Machine tool body; A fixed platform is connected to the machine tool body. The fixed platform includes a first bearing member and an adjustment device. The first bearing member is provided with a first bearing surface, which is used to support a base plate. The adjustment device is used to adjust the flatness of the first bearing surface. A pressing mechanism is connected to the machine tool body. The pressing mechanism is movable along the X-axis and Z-axis. The pressing mechanism includes a pressing component, an adsorption component, a connecting component, and a mounting component. The pressing component and the adsorption component are both connected to the connecting component. The pressing component is used to press the carrier plate, and the adsorption component is used to adsorb the carrier plate. The pressing mechanism can adsorb the carrier plate and press the carrier plate onto the substrate. The connecting assembly is used to connect the machine tool body. The mounting assembly has a first end face and a second end face arranged opposite to each other along the Z-axis direction, and a second side face connecting the first end face and the second end face. The first end face is connected to the connecting assembly, and the suction member is connected to the second end face. The mounting assembly is provided with a first opening, which connects the first end face and the second end face. The pressing member is connected to the mounting assembly and corresponds to the first opening, and the pressing member protrudes from the second end face. The mounting assembly includes a second mounting member and a third mounting member. The second mounting member is provided with a second opening and a plurality of first mounting slots, which connect to the second opening. The third mounting member is provided with a main body and a plurality of mounting parts, which connect to each of the mounting parts. The main body defines the first opening, and the second opening is larger than the first opening. Each mounting part corresponds one-to-one with each of the first mounting slots and is accommodated in the corresponding first mounting slot. A laser head is connected to the machine tool body and positioned above the first support member. The laser head can move along the X-axis and emit laser light towards the fixed platform. A CCD camera is connected to the machine tool body and positioned above the first support member; the CCD camera is capable of moving along the X-axis. Wherein, along the Z-axis direction, the cross-sectional area of ​​the first opening gradually decreases from the first end face to the second end face, or the cross-sectional area of ​​the second opening gradually decreases from the first end face to the second end face; the pressing member has a third end face and a fourth end face arranged opposite to each other along the Z-axis direction, and along the Z-axis direction, the cross-sectional area of ​​the pressing member gradually decreases from the third end face to the fourth end face, and the pressing member can be snapped into the mounting assembly.

2. The Micro-LED laser processing system according to claim 1, characterized in that, The fixed platform further includes a base, the first support member is connected to the base, the first support member is provided with a first support surface for supporting the substrate, the first support surface is provided with a plurality of adsorption holes for adsorbing the substrate, the adjustment device is disposed between the base and the first support member, the adjustment device includes a movable member and an adjustment member, the movable member is connected to the first support member, and the adjustment member can drive the movable member to move so that the first support member moves closer to or further away from the adjustment member.

3. The Micro-LED laser processing system according to claim 1, characterized in that, The first support member is further provided with a heating cavity, and the fixed platform further includes a heating element, which is housed in the heating cavity and is used to heat the first support surface.

4. The Micro-LED laser processing system according to claim 2, characterized in that, The first support member is provided with a plurality of adsorption chambers, which are spaced apart along the Y-axis. The adsorption chambers correspond to and are connected to a plurality of adsorption holes. The first support member is also provided with a connecting chamber, which connects each of the adsorption chambers and forms an exhaust port on the outer wall of the first support member. The exhaust port is used to discharge the air in the adsorption chamber to form a negative pressure at the adsorption hole.

5. The Micro-LED laser processing system according to claim 1, characterized in that, The fixed platform further includes a positioning component connected to the first support component. The positioning component has a first positioning surface and a second positioning surface. The first positioning surface and the second positioning surface are connected and perpendicular to each other. The first positioning surface is parallel to the X-axis direction, and the second positioning surface is parallel to the Y-axis direction. The positioning component is used to position the substrate on the first support surface.

6. The Micro-LED laser processing system according to claim 1, characterized in that, It also includes a docking platform connected to the machine tool body. The docking platform and the fixed platform are spaced apart along the X-axis. The docking platform is provided with a second carrier member. The second carrier member is provided with a second carrier surface. The second carrier surface is used to support the carrier plate. The pressing mechanism and the CCD camera can both move along the X-axis to the position corresponding to the second carrier member.

7. The Micro-LED laser processing system according to claim 1, characterized in that, It also includes an optical fiber connected to the laser head, which is capable of transmitting a flat-top laser to the laser head and being emitted by the laser head.

Images