Methods for setting the dimensions of a frame for an integrated frame mask, methods for reducing deformation, and the frame itself.

Abstract

This invention relates to a method for setting the dimensions of a frame for an integral frame mask, a method for reducing deformation, and a frame. More specifically, it relates to a method for setting the dimensions of a frame, a method for reducing deformation, and a frame that can accurately align individual masks by reducing the deformation of the mask unit sheet portion caused by the tensile force applied to the mask during mask attachment.

Description

Technical Field

[0001] This invention relates to a method for setting the dimensions of a frame for an integral frame mask, a method for reducing deformation, and a frame. More specifically, it relates to a method for setting the dimensions of a frame, a method for reducing deformation, and a frame that enables accurate alignment of each mask unit sheet by reducing the deformation of the mask unit sheet portion caused by the tensile force applied to the mask during mask attachment. Background Technology

[0002] As a technique for forming pixels in OLED manufacturing, the FMM (Fine Metal Mask) method is mainly used. This method involves attaching a thin-film metal mask (Shadow Mask) tightly to the substrate and depositing organic matter at the desired location.

[0003] In existing OLED manufacturing processes, masks are fabricated into strips, plates, etc., and then welded and fixed to the OLED pixel deposition frame. A single mask can contain multiple cells corresponding to a single display. Furthermore, to manufacture large-area OLEDs, multiple masks can be fixed to the OLED pixel deposition frame. During the fixing process, each mask is stretched to flatten it. Adjusting the stretching force to flatten the entire mask is a very difficult operation. In particular, to simultaneously flatten each cell and align mask patterns with dimensions ranging from several to tens of μm, the following highly complex operation is required: finely adjusting the stretching force applied to each side of the mask while simultaneously checking the alignment status in real time.

[0004] Nevertheless, during the process of fixing multiple masks to a frame, there are still problems with misalignment between masks and between mask units. In addition, during the process of welding and fixing the masks to the frame, if the mask film is too thin and has a large area, there are problems such as the mask sagging or twisting due to the load; wrinkles, burrs and other defects generated in the welded parts during the welding process also cause problems with the misalignment of mask units.

[0005] In ultra-high-definition OLEDs, existing QHD resolution has a pixel density of 500-600 PPI (pixels per inch), with pixel sizes reaching approximately 30-50 μm. 4K UHD and 8K UHD resolutions, on the other hand, boast even higher resolutions of -860 PPI and -1600 PPI, respectively. Therefore, considering the pixel size of ultra-high-definition OLEDs, the alignment error between individual units needs to be reduced to around a few μm. Exceeding this error will lead to product defects, potentially resulting in extremely low yields. Thus, it is necessary to develop technologies that prevent mask sagging or twisting and ensure precise alignment, as well as technologies for fixing the mask to the frame. Summary of the Invention

[0006] Technical Problem

[0007] Therefore, the present invention is proposed to solve the above-mentioned problems in the prior art, and aims to provide a method for setting the size of a frame, a method for reducing the deformation amount, and a frame. By reducing the deformation amount of the mask unit sheet portion caused by the tensile force applied by the mask when attaching the mask, the position of the mask can be accurately aligned.

[0008] However, the above technical problem is only exemplary, and the scope of the present invention is not limited thereto.

[0009] Technical Solution

[0010] The above object of the present invention is achieved by a method for setting the size of a frame, which is used for a frame-integrated mask formed by integrating a plurality of masks and a frame for supporting the masks. The frame-integrated mask includes a plurality of masks and a frame. The frame has a plurality of mask unit regions, and a mask unit sheet portion is connected to the edge frame portion. The frame includes an edge frame portion and a mask unit sheet portion. The edge frame portion includes a hollow region; the mask unit sheet portion has a plurality of mask unit regions along a first direction and a second direction perpendicular to the first direction, and is connected to the edge frame portion. The mask unit sheet portion includes a pair of first edge sheet portions, a pair of second edge sheet portions, at least one first grid sheet portion, and at least one second grid sheet portion. The pair of first edge sheet portions extend in the first direction and are spaced apart; the pair of second edge sheet portions extend in the second direction, and the two ends are respectively connected to the respective ends of the first edge sheet portions and are spaced apart; the at least one first grid sheet portion extends in the first direction, and the two ends are connected to the second edge sheet portions; the at least one second grid sheet portion extends in the second direction and intersects with the first grid sheet portion, and the two ends are connected to the first edge sheet portions. When the lengths of the mask unit sheet portion along the first direction and the second direction are DX and DY, and the lengths of a unit mask unit region along the first direction and the second direction are MX and MY, the method includes the following steps: (a) calculating NX that satisfies NX×MX < DX ≤ (NX + 1)×MX and NY that satisfies NY×MY < DY ≤ (NY + 1)×MY (NX, NY are natural numbers); (b) setting [DX - (NX×MX)] / (NX + 1) as the width TX of the second grid sheet portion, and setting [DY - (NY×MY)] / (NY + 1) as the width TY of the first grid sheet portion.

[0011] The width of the first edge sheet portion and the width of the first grid sheet portion can be set to be the same, and the width of the second edge sheet portion and the width of the second grid sheet portion can be set to be the same.

[0012] When DX and DY are preset fixed values, TX and TY can change based on changes in MX and MY.

[0013] DX can have a fixed value of at least 1500 mm, DY can have a fixed value of at least 900 mm, and at least one of TX and TY can be set to greater than 8 mm.

[0014] Satisfy DX 2 +DY 2 =D 2 The diameter (D) can be at least greater than 1750 mm.

[0015] When the thickness of the first grid sheet is TZ1, the thickness of the second grid sheet is TZ2, the number of solder beads in the unit mask unit area along the first direction is WX, and the number of solder beads along the second direction is WY, the number of solder beads per unit volume of the first grid sheet can be WV1=(WX×NX) / (TX×TZ1×DX), and the number of solder beads per unit volume of the second grid sheet can be WV2=(WX×NY) / (TY×TZ2×DY).

[0016] The deformation caused by the sheet metal of the welding mask unit can be reduced by increasing the TZ1 value to decrease the WV1 value, or by increasing the TZ2 value to decrease the WV2 value.

[0017] When one end of width TX and width TY is set to 0% and the other end is set to 100%, the welding between the mask unit sheet and the mask can be performed in the portion corresponding to 25% to 75% of width TX and width TY.

[0018] In addition, the above object of the present invention is achieved by a method for reducing the deformation amount of a frame, which is used for a frame-integrated mask formed by integrating a plurality of masks and a frame for supporting the masks. The frame-integrated mask includes a plurality of masks and a frame. The frame has a plurality of mask unit regions, and a mask unit sheet portion is connected to the edge frame portion. The frame includes an edge frame portion and a mask unit sheet portion. The edge frame portion includes a hollow region. The mask unit sheet portion has a plurality of mask unit regions along a first direction and a second direction perpendicular to the first direction, and is connected to the edge frame portion. The mask unit sheet portion includes a pair of first edge sheet portions, a pair of second edge sheet portions, at least one first grid sheet portion, and at least one second grid sheet portion. The pair of first edge sheet portions extend in the first direction and are spaced apart. The pair of second edge sheet portions extend in the second direction, and both ends are respectively connected to the respective ends of the first edge sheet portions and are spaced apart. The at least one first grid sheet portion extends in the first direction, and both ends are connected to the second edge sheet portions. The at least one second grid sheet portion extends in the second direction and intersects with the first grid sheet portion, and both ends are connected to the first edge sheet portions. When the lengths of the mask unit sheet portion along the first direction and the second direction are DX and DY, the lengths of a unit mask unit region along the first direction and the second direction are MX and MY, the thickness of the first grid sheet portion is TZ1, the thickness of the second grid sheet portion is TZ2, the number of solder beads of a unit mask unit region along the first direction is WX, and the number of solder beads along the second direction is WY, (a) calculate NX that satisfies NX×MX < DX ≤ (NX + 1)×MX and NY that satisfies NY×MY < DY ≤ (NY + 1)×MY (NX and NY are natural numbers); (b) set the width TX of the second grid sheet portion and the width TY of the first grid sheet portion to be at least greater than 5 mm; (c) set the number of solder beads per unit volume of the first grid sheet portion to WV1 = (WX×NX) / (TX×TZ1×DX), and set the number of solder beads per unit volume of the second grid sheet portion to WV2 = (WX×NY) / (TY×TZ2×DY). By increasing the value of TZ1 to reduce the value of WV1, or by increasing the value of TZ2 to reduce the value of WV2, the deformation amount generated based on welding the mask unit sheet portion is reduced.

[0019] In addition, the above object of the present invention is achieved by a frame for a frame-integrated mask formed integrally by a plurality of masks and a frame for supporting the masks. The frame-integrated mask includes a plurality of masks and a frame. The frame has a plurality of mask unit regions and mask unit sheet portions are connected to the edge frame portion. The frame includes an edge frame portion and mask unit sheet portions. The edge frame portion includes a hollow region. The mask unit sheet portions have a plurality of mask unit regions along a first direction and a second direction perpendicular to the first direction, and are connected to the edge frame portion. The mask unit sheet portions include a pair of first edge sheet portions, a pair of second edge sheet portions, at least one first grid sheet portion, and at least one second grid sheet portion. The pair of first edge sheet portions extend in the first direction and are spaced apart. The pair of second edge sheet portions extend in the second direction, and both ends are respectively connected to the respective ends of the first edge sheet portions and are spaced apart. The at least one first grid sheet portion extends in the first direction, and both ends are connected to the second edge sheet portions. The at least one second grid sheet portion extends in the second direction and intersects with the first grid sheet portion, and both ends are connected to the first edge sheet portions. When the lengths of the mask unit sheet portions along the first direction and the second direction are DX and DY, and the lengths of the unit mask unit regions along the first direction and the second direction are MX and MY, after calculating NX that satisfies NX×MX < DX ≤ (NX + 1)×MX and NY that satisfies NY×MY < DY ≤ (NY + 1)×MY (NX and NY are natural numbers), calculate TX = [DX - (NX×MX)] / (NX + 1), TY = [DY - (NY×MY)] / (NY + 1), and set the width of the second grid sheet portion to TX and the width of the first grid sheet portion to TY.

[0020] Advantageous Effects

[0021] According to the above configuration of the present invention, by reducing the deformation of the mask unit sheet portions caused by the tensile force applied by the masks when attaching the masks, there is an effect of being able to accurately align the positions of the masks.

[0022] Of course, the scope of the present invention is not limited by the above effects. Description of the Drawings

[0023] Figure 1 is a schematic diagram of the process of attaching a mask to a frame in the prior art.

[0024] Figure 2 is a front view and a side cross-sectional view of a frame-integrated mask according to an embodiment of the present invention.

[0025] Figure 3 is a front view and a side cross-sectional view of a frame used in a frame-integrated mask according to an embodiment of the present invention.

[0026] Figure 4 This is a schematic diagram of a mask according to an embodiment of the present invention.

[0027] Figure 5 This is a schematic diagram of a mask support template on a template with a mask adhered to it, according to an embodiment of the present invention.

[0028] Figure 6 This is a schematic diagram of the process of mounting a mask support template onto a frame according to an embodiment of the present invention.

[0029] Figure 7 This is a schematic diagram of the state in which the template is carried on the frame and the mask is mapped to the unit area of ​​the frame according to an embodiment of the present invention.

[0030] Figure 8 This is a schematic diagram illustrating the process of separating the mask from the template after attaching the mask to the frame, according to an embodiment of the present invention.

[0031] Figure 9 This is a schematic diagram of the state of attaching a mask to a frame according to an embodiment of the present invention.

[0032] Figure 10 and Figure 11 This is a schematic diagram illustrating a method for setting the size of the mask unit sheet portion of a frame according to several embodiments of the present invention.

[0033] Figure 12 This is a schematic diagram of the welding position of the mask unit sheet portion according to several embodiments of the present invention.

[0034] Figure 13 This is a schematic diagram illustrating the heat-affected zone when solder beads are generated on the mask unit sheet portion of a partial embodiment of the present invention.

[0035] Figure 14 This is a schematic diagram of a method for reducing frame deformation based on welding position according to an embodiment of the present invention.

[0036] Figure label:

[0037] 50: Template

[0038] 100: Mask

[0039] 110: Mask film, mask metal film

[0040] 200: Framework

[0041] 210: Edge frame section

[0042] 220: Mask Unit Sheet Section

[0043] 221: Edge Sheet Section

[0044] 223: First grid sheet section

[0045] 225: Second grid sheet section

[0046] C: Unit, mask unit

[0047] CR: Mask unit area

[0048] DM: Virtual Department, Mask Virtual Department

[0049] L: Laser

[0050] P: Mask pattern

[0051] WB: solder ball

[0052] TX: Width of the second grid sheet section and the second edge sheet section

[0053] TY: Width of the first grid sheet section and the first edge sheet section

[0054] TZ1: Width of the first grid sheet section and the first edge sheet section

[0055] TZ2: Width of the second grid sheet section and the second edge sheet section Detailed Implementation

[0056] The detailed description of the invention described below can be referenced to the accompanying drawings, which illustrate specific embodiments in which the invention can be implemented. These embodiments are described in detail below to enable those skilled in the art to implement the invention. These embodiments are described in sufficient detail to enable those skilled in the art to implement the invention. Various embodiments of the invention should be understood to be different from each other but not mutually exclusive. For example, specific shapes, structures, and characteristics described herein may be implemented as other embodiments without departing from the spirit and scope of the invention. Furthermore, the position or arrangement of individual components in each disclosed embodiment should be understood to be subject to change without departing from the spirit and scope of the invention. Therefore, the following detailed description is not intended to limit the invention; the scope of the invention is defined only by the appended claims and all their equivalents, provided that it can be properly explained. Similar reference numerals in the drawings denote the same or similar functions in various respects, and for convenience, lengths, areas, thicknesses, etc., and their shapes may be exaggerated.

[0057] Hereinafter, in order to enable those skilled in the art to readily implement the present invention, preferred embodiments of the present invention will be described in detail with reference to the accompanying drawings.

[0058] Figure 1 This is a schematic diagram of the existing process of attaching the mask 10 to the frame 20.

[0059] The existing mask 10 is either stick-type or plate-type. Figure 1 The strip-shaped mask 10 can be welded and fixed to the OLED pixel deposition frame on both sides for use. The body (or mask film 11) of the mask 10 has multiple display units C. One unit C corresponds to a display such as a smartphone. Pixel patterns P are formed in the unit C to correspond to the individual pixels of the display.

[0060] Reference Figure 1 (a) A tensile force F is applied along the long axis of the strip mask 10, and the strip mask 10 is loaded onto the rectangular frame 20 in the unfolded state. The units C1 to C6 of the strip mask 10 are located in the blank area inside the frame 20.

[0061] Reference Figure 1 (b) Alignment is performed while fine-tuning the tension F applied to each side of the strip mask 10, and then the strip mask 10 and the frame 20 are connected to each other by welding a portion of the side of the strip mask 10. Figure 1 (c) shows the side cross-section of the strip mask 10 and the frame that are connected to each other.

[0062] Despite fine-tuning the tensile force F applied to each side of the strip mask 10, misalignment between mask units C1 to C3 still occurs. For example, the distances between the patterns P of units C1 to C6 are different, or the patterns P are skewed. Because the strip mask 10 has a large area comprising multiple units C1 to C6 and a very thin thickness of tens of μm, it is prone to sagging or twisting under load. Furthermore, it is very difficult to adjust the tensile force F to make all units C1-C6 flat while simultaneously checking the alignment status between units C1 to C6 in real time using a microscope. However, to avoid the mask patterns P, with sizes ranging from several μm to tens of μm, negatively impacting the pixel process of ultra-high-definition OLEDs, the alignment error is preferably no greater than 3 μm. Such alignment error between adjacent units is called pixel position accuracy (PPA).

[0063] The size of the strip mask 10 increases with the size of the target substrate used to form OLED pixels. As the thickness of the strip mask 10 used to achieve high resolution gradually decreases, it becomes increasingly difficult to perform bonding by stretching the strip mask 10. Furthermore, connecting each strip mask 10 to a frame 20 while ensuring precise alignment between multiple strip masks 10 and between multiple units C to C6 of the strip mask 10 is a very difficult task and only increases the alignment-based process time, thus becoming a significant reason for reduced production efficiency.

[0064] Furthermore, after the strip mask 10 is connected and fixed to the frame 20, the tensile force F applied to the strip mask 10 will act in the opposite direction on the frame 20. This tension will cause slight deformation of the frame 20 and will cause the alignment state of multiple units C1 to C6 to be distorted.

[0065] In view of this, the present invention proposes a frame 200 and a frame-integrated mask that enable the mask 100 and the frame 200 to form an integral structure. The mask 100, which is integral with the frame 200, can not only prevent deformation such as sagging or twisting, but also can be accurately aligned with the frame 200.

[0066] Figure 2 This is a front view of a frame-integrated mask according to an embodiment of the present invention. Figure 2 [a] and side section view [ Figure 2 (b)]. Figure 3 This is a front view of the frame used in a frame-integrated mask according to an embodiment of the present invention. Figure 3 [a] and side section view [ Figure 3 (b)].

[0067] The following description explains the structure of the frame-integrated mask, but the structure and manufacturing process of the frame-integrated mask can be understood to include the entire contents of Korean Patent Application No. 2018-0016186.

[0068] Reference Figure 2 and Figure 3 A frame-integrated mask may include multiple masks 100 and a frame 200. In other words, it is a configuration in which multiple masks 100 are attached to the frame 200 respectively. For ease of explanation, the following description uses a four-cornered mask 100 as an example. However, before the mask 100 is attached to the frame 200, it may be a strip-shaped mask with protrusions on both sides for clamping. After being attached to the frame 200, the protrusions can be removed.

[0069] Multiple mask patterns P are formed on each mask 100, and one unit C can be formed on each mask 100. One mask unit C can correspond to a display such as a smartphone.

[0070] The mask 100 can also be made of materials such as invar, super invar, nickel (Ni), or nickel-cobalt (Ni-Co). The mask 100 can be made of metal sheet produced by rolling or electroforming.

[0071] The frame 200 can be formed by attaching multiple masks 100. Considering thermal deformation, the frame 200 is preferably formed of a material such as Invar alloy, super Invar alloy, nickel, or nickel-cobalt, which has the same coefficient of thermal expansion as the masks. The frame 200 may include an edge frame portion 210 that is generally square or rectangular. The interior of the edge frame portion 210 may be hollow.

[0072] Furthermore, the frame 200 has multiple mask unit regions CR and may include a mask unit sheet portion 220 connected to the edge frame portion 210. The mask unit sheet portion 220 may be composed of an edge sheet portion 221, a first grid sheet portion 223, and a second grid sheet portion 225. The edge sheet portion 221, the first grid sheet portion 223, and the second grid sheet portion 225 refer to portions divided on the same sheet, which are integrally formed with each other.

[0073] The thickness of the edge frame portion 210 can be greater than the thickness of the mask unit sheet portion 220, and can be formed with a thickness of several millimeters to tens of centimeters. Although the thickness of the mask unit sheet portion 220 is thinner than the thickness of the edge frame portion 210, it is thicker than the mask 100, and can be approximately 0.1 mm to 1 mm thick.

[0074] In the planar sheet, in addition to the areas occupied by the edge sheet portion 221, the first grid sheet portion 223, and the second grid sheet portion 225, multiple mask unit regions CR:CR11 to CR56 can be provided.

[0075] The mask 200 has multiple mask unit regions CR, and each mask 100 can be attached in such a way that each mask unit C corresponds to each mask unit region CR. The mask unit C corresponds to the mask unit region CR of the frame 200, and part or all of the dummy part can be attached to the frame 200 (mask unit sheet part 220). Therefore, the mask 100 and the frame 200 can form an integral structure.

[0076] Figure 4 This is a schematic diagram of a mask 100 according to an embodiment of the present invention.

[0077] The mask 100 may include mask units C having multiple mask patterns P formed thereon and dummy portions DM around the mask units C. The mask 100 may be manufactured using metal sheets produced by rolling, electroforming, or other processes, and one unit C may be formed in the mask 100. The dummy portions DM correspond to the mask film 110 [mask metal film 110] portion other than the unit C, and may include only the mask film 110, or may include the mask film 110 having a predetermined dummy portion pattern formed similar to the shape of the mask pattern P. The dummy portions DM correspond to the edge of the mask 100, and part or all of the dummy portions DM may be attached to the frame 200 [mask unit sheet portion 220].

[0078] The width of the mask pattern P can be less than 40 μm, and the thickness of the mask 100 can be approximately 5-20 μm. Since the frame 200 has multiple mask unit regions CR: CR11 to CR56, it can also have a mask 100, which has mask units C: C11 to C56 corresponding to each mask unit region CR: CR11 to CR56.

[0079] Multiple welding sections WP for welding can be arranged at predetermined intervals at the edge of the mask 100 or the dummy section DM.

[0080] Figure 5 This is a schematic diagram of a mask support template on a template with a mask adhered to it, according to an embodiment of the present invention.

[0081] The following description explains the structure of the mask support template, but the structure and manufacturing process of the mask support template can be understood to include all the contents of Korean Patent Application No. 10-2018-0122020.

[0082] Reference Figure 5 In (a) and (b), template 50 is a medium on one side of which mask 100 is attached and the mask 100 is moved in a supporting state. One side of template 50 is preferably a flat surface to support and transport the flat mask 100.

[0083] In order for the laser L irradiated from the upper part of the template 50 to reach the welding part WP (the area to be welded) of the mask 100; Figure 4 Laser through holes 51 can be formed on the template 50. As an example, since multiple welding portions WP are arranged at predetermined intervals on the dummy portions DM on both sides (left / right) of the mask 100, multiple laser through holes 51 can also be formed at predetermined intervals on both sides (left / right) of the template 50.

[0084] A temporary adhesive portion 55 may be formed on one side of the template 50. Before the mask 100 is attached to the frame 200, the temporary adhesive portion 55 allows the mask 100 [or the mask metal film 110] to be temporarily attached to one side of the template 50 and supported on the template 50.

[0085] The temporary adhesive portion 55 may use a heat-separable adhesive or a UV-separable adhesive.

[0086] As an example, the temporary adhesive portion 55 can be made of liquid wax. The temporary adhesive portion 55, which is made of liquid wax, has reduced viscosity at temperatures above 85°C to 100°C, and increased viscosity at temperatures below 85°C. A portion of it is cured into a solid, thereby fixing and bonding the mask metal film 110' to the template 50.

[0087] The mask metal film 110 can be bonded to the template 50 having a temporary adhesive portion 55. Alternatively, the mask 100 having multiple mask patterns P can be bonded to the template 50.

[0088] When bonding the mask metal film 110 or the mask 100 to the template 50, it can be bonded to the template 50 while applying a tensile force to the mask metal film 110 or the mask 100 in the lateral direction. Then, the mask metal film 110 is bonded to the template 50 while under tensile force, and a mask pattern P forming process is further performed. Thus, as... Figure 5 As shown in (b), when the mask metal films 110 and 110' maintain their own tensile force IT, if the template 50 is separated, the mask metal films 110 and 110' shrink as they return to their original size. Thus, by applying tension TS to the frame 200 [mask unit sheet portion 220], the mask 100 can be attached in a taut state.

[0089] After the mask metal film 110 (or mask 100) is bonded to the template 50, one side of the mask metal film 110 can be planarized. The mask metal film 110, manufactured by a rolling process, can have its thickness reduced through a planarization process. Alternatively, the mask metal film 110, manufactured by an electroforming process, can also undergo a planarization process to control its surface properties and thickness. The planarization process of the mask metal film 110 can also be performed before bonding it to the template 50. The thickness of the mask metal film 110 can be approximately 5 μm to 20 μm.

[0090] Furthermore, a mask pattern P can be formed by etching the mask metal film 110. Known mask pattern P processes, such as photolithography, can be used.

[0091] Furthermore, when forming the mask metal film by etching the mask metal film 110, it is necessary to prevent the etching solution from entering the interface between the mask metal film 110 and the temporary adhesive portion 55, thereby damaging the temporary adhesive portion 55 / template 50 and causing etching errors in the mask pattern P. Therefore, with the insulating portion 23 formed on one side of the mask metal film 110, the mask metal film 110 can be bonded to the upper surface of the template 50. The insulating portion can be formed on the mask metal film 110 using photoresist materials such as curable negative photoresist etched by the etching solution or negative photoresist containing epoxy, through printing or other methods.

[0092] Based on the material properties of the insulating portion, the etching resistance is enhanced even after multiple subsequent etching processes. If the insulating portion is absent, the etching solution will enter the interface between the damaged temporary adhesive portion 55 and the mask metal film 110, further etching the lower part of the mask pattern P, thereby causing the pattern size to become too large or localized amorphous defects to form.

[0093] Since the frame 200 has multiple mask unit regions CR:CR11 to CR56, it may also have multiple masks 100, each including mask units C:C11 to 56 corresponding to each mask unit region CR:CR11 to CR56. Furthermore, it may have multiple templates 50 that support the multiple masks 100 respectively.

[0094] Figure 6 This is a schematic diagram of the process of loading a mask support template 50 onto a frame 200 according to an embodiment of the present invention.

[0095] Reference Figure 6 The template 50 can be transferred via a vacuum suction cup 90. The vacuum suction cup 90 is used to adhere to the opposite side of the template 50 to which the mask 100 is bonded, and then transfers it. The vacuum suction cup 90 can be connected to a movement means (not shown) that can move along the x, y, z, and θ axes. Furthermore, the vacuum suction cup 90 can adhere to the template 50 and be connected to a flipping means (not shown) that can be flipped. Figure 9 As shown in (b), even when the template 50 is adsorbed by the vacuum suction cup 90 and flipped over and then transferred to the frame 200, the adhesive state and alignment state of the mask 100 are not affected.

[0096] Figure 7 This is a schematic diagram of an embodiment of the present invention, showing the state in which the template 50 is loaded onto the frame 200 and the mask 100 is mapped to the unit region CR of the frame 200.

[0097] Reference Figure 7 The mask 100 can be mapped onto a mask unit region CR of the frame 200. This mapping can be achieved by mounting the template 50 onto the frame 200 (or the mask unit sheet portion 220). While controlling the position of the template 50 / vacuum chuck 90, the mapping of the mask 100 to the mask unit region CR can be observed under a microscope. Because the template 50 presses against the mask 100, the mask 100 and the frame 200 can be tightly abutted.

[0098] Templates 50 can be loaded onto the frame 200 (or mask unit sheet 220) sequentially or simultaneously, thereby mapping each mask 100 to a respective mask unit region CR. If the templates 50 and masks 100 have the same size, the template 50 corresponding to a specific mask unit region CR11 and the templates 50 corresponding to adjacent mask unit regions CR12 and CR21 do not interfere with or overlap each other and have a predetermined interval. This predetermined interval may be less than half the width of the first grid sheet 223 and the second grid sheet 225.

[0099] Furthermore, a lower support 70 can be further arranged at the lower part of the frame 200. The lower support 70 presses against the opposite side of the mask unit region CR that contacts the mask 100. At the same time, since the lower support 70 and the template 50 press against the edge of the mask 100 and the frame 200 (or the mask unit sheet portion 220) in opposite directions, the alignment of the mask 100 can be maintained and not disrupted.

[0100] Next, the mask 100 is irradiated with laser L and attached to the frame 200 by laser welding. The weld portion WP of the laser-welded mask will generate weld beads WB, which may have the same material as the mask 100 / frame 200 and be integrally connected to the mask 100 / frame 200.

[0101] By repeatedly mapping a mask 100 to a mask unit region CR and attaching the mask 100 to the frame 200 by irradiating with laser L, each mask 100 can be attached to all mask unit regions CR separately. Alternatively, all masks 100 can be mapped to and attached to all mask unit regions CR simultaneously.

[0102] Figure 8 This is a schematic diagram of the process of separating the mask 100 from the template 50 after attaching the mask 100 to the frame 200, according to an embodiment of the present invention.

[0103] Reference Figure 8 After the mask 100 is attached to the frame 200, the mask 100 can be debonded from the template 50. Debonding of the mask 100 from the template 50 can be performed by heating the temporary adhesive portion 55 (ET), chemically treating it (CM), applying ultrasound (US), or applying ultraviolet light (UV). Since the mask 100 remains attached to the frame 200, only the template 50 can be lifted. As an example, if heat (ET) at a temperature higher than 85°C-100°C is applied, the adhesiveness of the temporary adhesive portion 55 decreases, and the adhesive force between the mask 100 and the template 50 weakens, thereby allowing the mask 100 to be separated from the template 50. As another example, the mask 100 can be separated from the template 50 by immersing the temporary adhesive portion 55 (CM) in chemicals such as IPA, acetone, or ethanol to dissolve or remove the temporary adhesive portion 55. As another example, the adhesive force between the mask 100 and the template 50 can be weakened by applying ultrasound (US) or ultraviolet light (UV), thereby allowing the mask 100 to be separated from the template 50.

[0104] If the template 50 separates from the mask 100, the tensile force IT applied to the mask 100 is released and can be converted into a tension TS that tightens both sides of the mask 100. In other words, it is a state in which it is pulled to a length longer than the original length of the mask 100 and then bonded to the template 50. Since it is welded to the frame 200 intact in this state, it can maintain the pulled state [the state in which it applies tension TS to the surrounding mask unit sheet portion 220].

[0105] Figure 9 This is a schematic diagram of the state in which a mask 100 is attached to a frame 200 according to an embodiment of the present invention. Figure 9 The diagram shows the state in which all masks 100 are attached to the unit region CR of the frame 200. Although the masks 100 can be attached one by one and then the templates 50 can be separated, it is also possible to attach all masks 100 and then separate all templates 50.

[0106] Existing Figure 1 The mask 10 of the present invention includes six units C1 to C6, and therefore has a relatively long length, while the mask 100 of the present invention includes only one unit C, and therefore has a shorter length. Therefore, the degree of PPA (pixel position accuracy) distortion is reduced. Furthermore, since the present invention only requires corresponding to one unit C of the mask 100 and confirming the alignment, it can significantly shorten manufacturing time compared to existing methods that simultaneously correspond to multiple units C: C1 to C6 and require confirmation of the alignment of all units.

[0107] If each mask 100 is attached to its corresponding mask unit region CR before the template 50 and mask 100 are separated, the multiple masks 100 will apply a contraction tension TS to each mask unit region CR. Preferably, the multiple masks 100 that are adjacent to each other apply contraction tensions TS in opposite directions, thereby canceling each other out, so that no force is applied to the mask unit sheet portion 220. For example, on the first grid sheet portion 223 between the mask 100 attached to the CR11 unit region and the mask 100 attached to the CR12 unit region, preferably, the tension TS of the mask 100 attached to the CR11 unit region acting to the right and the tension TS of the mask 100 attached to the CR12 unit region acting to the left can cancel each other out.

[0108] However, when the mask unit sheet portion 220 is connected to the edge frame portion 210, if the connection is made without tension or with weak tension, sagging may occur due to the load on the mask unit sheet portion 220. If this condition is as follows... Figure 9As shown, multiple masks 100 apply tension TS to the mask unit sheet portion 220. The tension TS between the multiple masks 100 cannot be completely canceled out, resulting in a portion of the force that is not canceled out acting on the mask unit sheet portion 220. From another perspective, since the masks 100 are attached to the relatively thin and weak mask unit sheet portion 220 instead of the edge frame portion 210, the mask unit sheet portion 220 is relatively prone to deformation based on the tension TS of the masks 100. If the mask unit sheet portion 220 undergoes twisting deformation, the alignment error of the masks 100 [or mask pattern P] will increase.

[0109] Therefore, the present invention is characterized by providing a mask unit sheet portion 220 that does not deform due to the tension TS of the mask 100 when the mask 100 is attached to the mask unit sheet portion 220. To this end, the widths of the edge sheet portion 221, the first grid sheet portion 223, and the second grid sheet portion 225 of the mask unit sheet portion 220 are adjusted according to the size of the mask unit region CR, or the rigidity is controlled by a thickness adjustment method to prevent deformation of the mask unit sheet portion 220. The details are described below:

[0110] Figure 10 and Figure 11 This is a schematic diagram illustrating a method for setting the dimensions of the mask unit sheet portion 220 of a frame 200 according to several embodiments of the present invention.

[0111] exist Figure 10 and Figure 11 For ease of explanation, the edge sheet portion 221 is specifically defined as consisting of a pair of first edge sheet portions 221a extending in a first direction (X-axis direction) and spaced apart from each other, and a pair of second edge sheet portions 221b extending in a second direction (Y-axis direction) and spaced apart from each other. However, the first edge sheet portions 221a and second edge sheet portions 221b are not separate components from the first grid sheet portions 223 and second grid sheet portions 225, but should be understood as parts of the mask unit sheet portion 220.

[0112] The lengths of the mask unit sheet portion 220 in the first direction (X-axis direction) and the second direction (Y-axis direction) are DX and DY, respectively. The lengths of the edge frame portion 210 connected to the mask unit sheet portion 220 in the X-axis direction and the Y-axis direction can be FX and FY, respectively. For example, the frame 200 for the sixth-generation half process includes the mask unit sheet portion 220 with a size of approximately 1500 × 925 mm, and the edge frame portion 210 can be at least 100 mm larger than the mask unit sheet portion 220 on all four sides, i.e., having a size of 1700 × 1125 mm or more. The frame for the sixth-generation full process is twice the size of the sixth-generation half process, and the frame for the eighth-generation process can include the mask unit sheet portion 220 with a size of approximately 2200 × 2500 mm.

[0113] like Figure 9 The deformation of the mask unit sheet portion 220 caused by the tension TS of the mask 100 is due to the small width and thickness of the mask unit sheet portion 220, specifically the edge sheet portion 221 or the first grid sheet portion 223 and the second grid sheet portion 225. The width of the mask unit sheet portion 220 is less than 5 mm and its thickness is approximately 100 to 150 μm, therefore it cannot withstand the tension TS of the mask 100 and deforms. Existing frame-integrated mask structures are mainly used in small to medium-sized smartphones under 5 inches, and improve chamfering efficiency by maximizing the formation of mask unit areas CR corresponding to each display. Therefore, although the chamfering efficiency is high, the small width of the mask unit sheet portion 220 results in low rigidity and makes the mask 100 prone to deformation after welding, making precise adjustment difficult.

[0114] Therefore, the present invention proposes a method for setting the width, thickness and other dimensions of the frame 200, especially the mask unit sheet portion 220, the frame 200 being used in display processes for relatively large screens compared to general smart devices such as foldable smart devices, tablet computers, and laptop computers.

[0115] Refer again Figure 10 The edge sheet portion 210 and the mask unit sheet portion 220 as a whole can have fixed values ​​FX×FY and DX×DY as the generation line dimensions. Here, after determining the size of the mask unit area CR corresponding to each display, the remaining size can be used as the width of the edge sheet portions 221a and 221b and the first grid sheet portion 223 and the second grid sheet portion 225.

[0116] The method for setting the width of the 220mm sheet portion of the mask unit is as follows:

[0117] First, (1) if the lengths of the X-axis and Y-axis of a mask unit region CR [unit mask unit region CR] are referred to as MX and MY, then NX that satisfies NX×MX < DX ≤ (NX + 1)×MX and NY that satisfies NY×MY < DY ≤ (NY + 1)×MY can be calculated. NX and NY are natural numbers.

[0118] For example, for a mask unit region CR or a foldable display with a screen aspect ratio of 1:1 and a screen size of 7.8 inches, MX can be about 140.1 mm and MY can be about 140.1 mm. Based on the sixth-generation and a half benchmark, DX is 1500 mm and DY is 925 mm. Therefore, NX can be calculated as 9 and NY as 5. That is, in the mask unit sheet portion 220, 9 mask unit regions CR can be arranged in the X-axis direction and 5 in the Y-axis direction.

[0119] As another example, for the case of a mask unit region CR or a display with a screen aspect ratio of 4:3 and a screen size of 9.7 inches, MX can be about 197.1 mm and MY can be about 147.9 mm. Based on the sixth-generation and a half benchmark, DX is 1500 mm and DY is 925 mm. Therefore, NX can be calculated as 7 and NY as 6. That is, as Figure 10 shown, in the mask unit sheet portion 220, 7 mask unit regions CR can be arranged in the X-axis direction and 6 in the Y-axis direction. In addition, the NX, NY, and the total number of mask unit regions CR for multiple display sizes with a screen aspect ratio of 4:3 are as shown in Table 1 below.

[0120]

Table 1

[0121]

[0122] When the X-axis direction of the mask unit region CR is not the long side and the Y-axis direction is the long side, that is, when the mask unit region CR is arranged vertically instead of horizontally, it is as shown in Table 2 below.

[0123]

Table 2

[0124]

[0125] As shown in Table 1 and Table 2, even for the same-sized mask unit sheet portion 220 and the same-sized display, if the arrangement form is different, the chamfering efficiency will be different. Therefore, it is preferable to make the arrangement considering the above content. For example, when it is 12.9 inches, arranging vertically can ensure that the total number of mask unit regions is 21.

[0126] Then, (2) [DX-(NX×MX)] / (NX+1) can be set as the width TX of the second grid sheet 225, and [DY-(NY×MY)] / (NY+1) can be set as the width TY of the first grid sheet 223. At this time, the first grid sheet 223 and the first edge sheet 221a, and the second grid sheet 225 and the second edge sheet 221b can also be set to have the same width TX and TY.

[0127] If we use the data in Table 1 above to set the widths TX and TY, then the result is shown in Table 3 below.

[0128] Table 3

[0129]

[0130] Furthermore, if the widths TX and TY are set using the data in Table 2 above, then the result is shown in Table 4 below.

[0131] Table 4

[0132]

[0133] That is, when the DX and DY of the mask unit sheet portion 220 are preset fixed values, the widths TY and TX of the first grid sheet portion 223 and the second grid sheet portion 225 can be changed according to the changes in the dimensions MX and MY of the mask unit region CR. At this time, based on the sixth generation and a half, DX is a fixed value that is at least greater than 1500 mm, DY is a fixed value that is at least greater than 900 mm, and at least one of TX and TY is greater than 8 mm, more preferably, it can be set to be greater than 10 mm. If at least one of TX and TY is greater than 8 mm, then the remaining one can be set to be greater than 5 mm.

[0134] For example, when the widths TX and TY calculated by process (1) and process (2) are both no more than 10 mm, it is difficult to achieve the purpose of the present invention, namely, to prevent deformation caused by tension TS of mask 100 by increasing the rigidity of mask unit sheet portion 220. Figure 9 The existing first and second grid sheet sections used in small and medium-sized smart devices have a width of approximately 1 to 5 mm, which results in a relatively weak rigidity.

[0135] In this invention, DX is satisfied 2 +DY 2 =D 2Since the diameter (D) is at least greater than 175mm, meaning the display size can be larger than 7 inches, after arranging several large screen panels on a fixed frame size, the remaining space can be used to widen the mask unit sheet section 220. Therefore, the larger the screen, the less adverse the chamfering efficiency compared to small and medium-sized screens, and the advantage of not hindering production efficiency. Moreover, instead of simply using the remaining space to widen the mask unit sheet section 220, by setting at least one of TX and TY to be greater than 8mm, the rigidity of the mask unit sheet section 220 can be ensured.

[0136] Compared to Figure 10 In the case of a mask unit area CR or a display with a screen ratio of 4:3 and a screen size of 9.7 inches, Figure 11 The arrangement of multiple mask unit regions CR' is shown when the screen ratio is 4:3 and the screen size is 12.9 inches, and the widths TX' and TY' of the mask unit sheet portion 220 calculated by processes (1) and (2). Figure 10 and Figure 11 In this process, the frame maintains the same dimensions (DX=DX', DY=DY', FX=FX', FY=FY'), and only the widths TX' and TY' of the mask unit sheet 220 can be adjusted to correspond to the dimensions MX' and MY' of the mask unit area CR'.

[0137] As described above, in this invention, the edge frame portion 210, which is heavier and thicker than the mask unit sheet portion 220, can be reused without changing its size, since the same portion can be used. Furthermore, it can be immediately adapted to different display sizes simply by adjusting the width of the mask unit sheet portion 220, which is relatively lightweight and can be manufactured solely by forming the mask unit region CR. Therefore, the manufacturing process can be flexibly changed simply by adjusting the mask unit sheet portion 220.

[0138] Furthermore, the present invention employs a lighter mask unit sheet portion 220, and by controlling the width of the mask unit sheet portion 220, sufficient rigidity can be ensured. Therefore, compared to the existing large-area (sixth to eighth generation) process frame 20 with attached strip masks [ref], this invention achieves superior rigidity. Figure 1 This invention significantly reduces the width, thickness, and weight of the frame. Therefore, it significantly reduces the workload of the frame transfer robot due to the reduced frame weight. For example, the transfer robots used in existing sixth-generation and 8.5-generation full-process systems have workloads greater than 200kg and 350kg, respectively. In contrast, this invention allows the process to be performed by a transfer robot with a workload of approximately 150kg, thereby reducing equipment investment.

[0139] The following will explain the method for setting the width TX, TY, thickness, and volume of the mask unit sheet section 220.

[0140] Figure 12 This is a schematic diagram of the welding position of the mask unit sheet portion 200 in several embodiments of the present invention.

[0141] like Figure 7 As shown, considering the case where the mask 100 is welded to the mask unit sheet 220 by laser L to form a weld bead WB, the change in the mask unit sheet 220 is observed.

[0142] like Figure 12 As shown, when using the laser welding mask 100, not all welding portions WP are welded at once, but rather in half to prevent the pressure generated by the formation of weld beads WB from concentrating in one place. That is, after weld beads WB1 are formed, laser L is irradiated between weld beads WB1 to form weld beads WB2.

[0143] Table 5 below shows the variations when welding the various parts of the mask unit sheet 220 to form solder balls WB1, WB2, and WB3. On a 1500mm × 925mm sixth-generation half-size panel, the unit mask unit area CR is arranged in a 140mm × 140mm size, with 9 units arranged in the X-axis direction and 5 units arranged in the Y-axis direction. TX is set to 5mm, and TY is set to 12mm. The size of the unit mask unit area CR corresponds to a 7.8-inch foldable display, satisfying DX... 2 +DY 2 =D 2 The diameter (D) must be at least 175 mm.

[0144] Solder beads WB1 and WB2 are formed by welding as close as possible to the edge of the mask unit region CR, that is, as close as possible to the edge of the first grid sheet 223 and the second grid sheet 225. Solder bead WB3 is formed by welding in the center of the first grid sheet 223 and the second grid sheet 225. Table 5 shows the changes at each step compared to the initial state (step 1). Step 1 is the initial state of the mask unit sheet 220 upon warehousing. Step 2 is the state where no mask 100 is attached and only solder beads WB1 are formed on the mask unit sheet 220. Step 3 is the state where no mask 100 is attached and solder beads WB2 are also formed on the mask unit sheet 220. Step 4 is the state where no mask 100 is attached and only solder beads WB3 are formed on the mask unit sheet 220. Step 5 shows the state where the mask 100 is laser-welded onto the entire mask unit sheet 220, which has 45 mask unit regions CR. [The mask 100 is adhered to the template 50. See reference...] Figure 7Step 6 shows the change in the tensile force IT of the mask 100 when the template 50 is separated after all 45 masks are attached, so that the tensile force IT of the mask 100 is applied to the mask unit sheet 220.

[0145] Table 5

[0146]

[0147] Compared to the initial stage, the change in step 5 is greater than that in steps 2 to 4, with step 5 showing the largest change. In particular, although the X-axis length of the mask unit sheet 220 is longer, the change in the X-axis is 10.3 μm, which is half of the Y-axis change of 19.2 μm. The small change in the X-axis is because the width TY of the first grid sheet 223 is 12 mm, which is greater than the width TX of the second grid sheet 225, i.e., 5 mm, resulting in greater rigidity in the X-axis.

[0148] Compared to step 5, in step 6, where the template 50 is separated after the mask 100 is attached, the change in the X-axis decreases from 10.3 μm to 5.1 μm. Conversely, the change in the Y-axis remains almost unchanged from 19.2 μm to 18.0 μm. That is, the change in the X-axis is smaller than initially, at 5.1 μm, while the change in the Y-axis is larger than initially, at 18.0 μm. Therefore, it is necessary to consider a scheme to set the size of the second grid sheet portion 225 that can relatively reduce the change in the Y-axis.

[0149] Figure 13 This is a schematic diagram illustrating the heat-affected zone when solder beads are generated on the mask unit sheet portion of a partial embodiment of the present invention.

[0150] The dimensions of the mask unit sheet 220 are set to 1500mm × 925mm, corresponding to the sixth-generation half-size. The thickness of the mask unit sheet 220 is set to 150μm. The unit mask unit area CR is set to 140mm × 140mm. The width TY of the first grid sheet 223 is set to 12.0mm, and the width TX of the second grid sheet 225 is set to 5mm. When soldering the mask 100 in the unit mask unit area CR, the number of solder beads WB is 98 on the X-axis and 100 on the Y-axis.

[0151] Reference Figure 13In (a) and (b), the width TY of the first grid sheet portion 223 is set to 12.0 mm, which is greater than the width TX5 mm of the second grid sheet portion 225. Therefore, the spacing between solder beads WBX1 and WB2 between adjacent masks in the relatively wider first grid sheet portion 223 is greater than the spacing between solder beads WBY1 and WBY2 between adjacent masks in the second grid sheet portion 225. Solder beads WBX1 and WBX2 can be formed in the first grid sheet portion 223 within 2 to 3 mm of its width TY12 mm, and solder beads WBY1 and WBY2 can be formed in the second grid sheet portion 225 within 2 to 3 mm of its width TX5 mm. Therefore, when generating solder balls WBX1 and WBX2, the shrinkage concentrated in the heat-affected zone HA1 is recovered along the wider width TY of the first grid sheet portion 223, thus the change in length along the X-axis will be smaller (10.3 μm -> 5.1 μm) [refer to steps 5 and 6 in Table 5]. Conversely, when generating solder balls WBY1 and WBY2, the shrinkage concentrated in the heat-affected zone HA2 is not easily recovered along the narrower width TX of the second grid sheet portion 225, and the heat-affected zones HA2 overlap HA3, making the entire width TX equivalent to the heat-affected zone, so the change in length along the Y-axis hardly shrinks (19.2 μm -> 18.0 μm) [refer to steps 5 and 6 in Table 5].

[0152] To avoid the situation where the length of the heat-affected zone HA does not decrease after the template 50 is separated from the mask 100, the widths TX and TY can be expanded, but chamfering efficiency should also be taken into account. As a result, the thicknesses Z1 and Z2 of the first grid sheet portion 223 and the second grid sheet portion 225 are expanded by Z3, thereby reducing the number of solder beads WB per unit volume.

[0153] When the thickness of the first grid sheet 223 is TZ1, the thickness of the second grid sheet 225 is TZ2, the number of solder beads in the unit mask unit region CR along the X-axis is WX, and the number of solder beads along the Y-axis is WY,

[0154] The number of solder beads per unit volume of the first grid sheet (WV1) and the number of solder beads per unit volume of the second grid sheet (WV2) are as follows.

[0155] WV1=(WX×NX) / (TX×TZ1×DX)

[0156] WV2=(WX×NY) / (TY×TZ2×DY)

[0157] As an example, the number of weld beads (WB) per unit volume for each axis is calculated as follows.

[0158] X-axis [first grid sheet 223, first edge sheet 221a]: 98×9 / (12×0.15×1500)=0.327pts / mm 3

[0159] Y-axis [Second grid sheet 225, second edge sheet 221b]: 100×5 / (5×0.15×925)=0.721pts / mm 3

[0160] As welding progresses, each weld bead (WB) causes a reduction in volume along each axis of the mask unit sheet 220. The number of weld beads per unit volume is directly related to the reduction in length of the first grid sheet 223 and the second grid sheet 225 [and the first edge sheet 221a and the second edge sheet 221b]. For example... Figure 13 (c) By increasing the thickness of the Y-axis (TZ2->TZ3) to increase the unit volume, the number of solder beads (WB) per unit volume can be reduced to less than 0.721 pts / mm. 3 If this value is similar to that of the X-axis, the amount of variation can also be reduced similarly. By adjusting the thickness to control the number of solder beads per unit volume, the amount of deformation can also be reduced using a mask unit sheet 220 with a width of at least 5 mm greater than TX and TY.

[0161] As described above, the present invention reduces the deformation of the mask unit sheet portion 220 caused by the tensile force IT applied to the mask 100 when the mask 100 is attached to the frame 200 by adjusting the width TX and TY of the mask unit sheet portion 220 or adjusting the thickness TZ1 and TZ, thereby achieving the effect of accurately aligning the position of the mask 100.

[0162] Figure 14 This is a schematic diagram of a method for reducing frame deformation according to the welding position according to an embodiment of the present invention. For ease of explanation, only the first grid sheet portion 223 and the second grid sheet portion 225 are shown at the intersection of the mask 100. However, it is obvious that mask unit sheet portions 220, 221, 223, and 225 can be connected to all four sides of the mask 100.

[0163] Reference Figure 14(a) The mask 100 can be welded to the outermost positions of the edges 223a, 223b, 225a, 225b of the first grid sheet portion 223 and the second grid sheet portion 225. The overlap width between the mask 100 and each edge 223a, 223b, 225a, 225b of the first grid sheet portion 223 and the second grid sheet portion 225 is set to approximately 2 to 3 mm, and the mask 100 is welded close to each edge 223a, 223b, 225a, 225b of the first grid sheet portion 223 and the second grid sheet portion 225. That is, the overlap widths SX', SY' between the mask 100 and each edge 223a, 223b, 225a, 225b of the first grid sheet portion 223 and the second grid sheet portion 225 become very small. Therefore, as the distance from the solder ball WB' to the mask unit C becomes closer, the heat-affected zone around the solder ball WB' during its generation will penetrate into the mask unit C, causing a misalignment between the outer and inner portions of the mask unit C.

[0164] also, Figure 14 (a) shows that the width of the existing mask unit sheet 220 is relatively narrow, and the central regions 223c and 225c of the first grid sheet 223 and the second grid sheet 225 are about 1 mm, which is very narrow. Moreover, solder beads WB' are generated at the outermost position near each side, which will cause the mask unit sheet 220 to be twisted and deformed due to welding.

[0165] In addition, such as Figure 10 and Figure 11 As described above, the widths TX and TY of the mask unit sheet portion of the present invention are wider than those of the past, so it is not necessary to weld the W mask 100 at each position close to the first grid sheet portion 223 and the second grid sheet portion 225.

[0166] Reference Figure 14 (b) The W mask 100 can be welded to the inner center 223c, 225c of the first grid sheet portion 223 and the second grid sheet portion 225 without approaching the edges 223a, 223b, 225a, 225b. As long as the spacing between adjacent masks 100 can be maintained, the W mask 100 can be welded to the inner center 223c, 225c of the first grid sheet portion 223 and the second grid sheet portion 225. As an example, the spacing between adjacent masks 100 is maintained at 0.5 to 1 mm, and the W mask 100 is welded.

[0167] As an example, solder beads WB can be formed along a direction (vertical direction) parallel to the first side 101a [or right side] of the first mask 100a, and solder beads WB can be formed along a direction (vertical direction) parallel to the second side 101b opposite to the first side 101a of the second mask 100b most adjacent to the first mask 100a. Since the mask 100 is welded only to the extent that the distance between adjacent masks 100a and 100b is maintained near the inner center 223c and 225c of the first grid sheet portion 223 and the second grid sheet portion 225, a shortest distance SW is formed between the solder beads WB formed on the first side 101a and the second side 101b. Moreover, the formation of solder beads WB can satisfy the following condition: the shortest distance SW is less than the shortest distance SX and SY from the solder beads WB of the first side 101a [or the second side 101b] to the mask unit C of the first mask 100a [or the second mask 100b].

[0168] As another example, the solder ball WB can be formed in a direction (horizontal direction) parallel to the lower side of the first mask 100a, and the solder ball WB can be formed in a direction (horizontal direction) parallel to the upper side opposite to the lower side of the third mask 100c most adjacent to the first mask 100a.

[0169] As another perspective, taking the widths TX and TY of the first grid sheet portion 223 and the second grid sheet portion 225 as a reference, assuming the left ends 223a and 225a are 0% and the right ends 223b and 225b are 100%, then the solder ball WB can be formed within a width TX and TY range of 25% to 75%. When the widths TX and TY are 10mm, the solder ball WB can be formed within a range from the inner center 223c and 225c, which are 2.5mm away from the left ends 223a and 225a, to the inner center 223c and 225c, which are 7.5mm away.

[0170] Because the widths TX and TY of the mask unit sheet portions 220:221, 223, 225 are wider than before, the amount of shrinkage concentrated in the heat-affected zone during the formation of the weld bead WB, which is closer to the inner center 223c, 225c, can be recovered according to the widths TX and TY of the mask unit sheet portions 220:221, 223, 225. That is, the pressure generated in the heat-affected zone can be evenly distributed over a wider width, thus reducing the deformation of the mask unit sheet portion 220. From another perspective, since the welding W is performed at the inner center 223c, 225c, and the mask unit sheet portion 220 with the outer sides 223a, 223b, 225a, 225b of the weld bead WB supports the weld bead WB side at the inner center 223c, 225c, it is possible to prevent the overall twisting of the mask unit sheet portion 220.

[0171] Furthermore, as the widths TX and TY of the mask unit sheet portions 220:221, 223, and 225 increase, the overall size of the mask 100 also increases accordingly. Specifically, the dummy portion DM of the mask 100 increases in size, while the size of the mask unit C remains unchanged to correspond to the size of the mask unit region CR. In the dummy portion DM of the mask 100, the pressure during solder ball (WB) generation can be distributed over a wider area [the overlap width between the mask 100 and the mask unit sheet portion 220 corresponds to SX and SY], thereby reducing the pressure transmitted to the mask unit C and the mask pattern P portion during solder ball (WB) generation. This also has the effect of reducing the PPA of the mask 100.

[0172] As described above, although preferred embodiments of the present invention have been illustrated with reference to the accompanying drawings, the present invention is not limited to these embodiments. Various modifications and alterations can be made by those skilled in the art without departing from the spirit of the invention. Such modifications and alterations should be considered to fall within the scope of the present invention and the appended claims.

Claims

1. A method for setting the size of a frame, the frame being used for a frame-integrated mask formed integrally by a plurality of masks and a frame for supporting the masks, characterized in that the frame includes an edge frame portion and a mask unit sheet portion, the edge frame portion includes a hollow region; the mask unit sheet portion has a plurality of mask unit regions along a first direction and a second direction perpendicular to the first direction, and is connected to the edge frame portion, the mask unit sheet portion includes a pair of first edge sheet portions, a pair of second edge sheet portions, at least one first grid sheet portion and at least one second grid sheet portion, the pair of first edge sheet portions are formed to extend in the first direction and are spaced apart; the pair of second edge sheet portions are formed to extend in the second direction, and both ends are respectively connected to the respective ends of the first edge sheet portions and are spaced apart; the at least one first grid sheet portion is formed to extend in the first direction, and both ends are connected to the second edge sheet portions; the at least one second grid sheet portion is formed to extend in the second direction and intersects the first grid sheet portion, and both ends are connected to the first edge sheet portions, when the lengths of the mask unit sheet portion along the first direction and the second direction are DX and DY, and the lengths of the unit mask unit region along the first direction and the second direction are MX and MY, the method includes the following steps: (a) Calculate NX that satisfies NX×MX < DX ≤ (NX + 1)×MX and NY that satisfies NY×MY < DY ≤ (NY + 1)×MY, where NX and NY are natural numbers; (b) Set [DX - (NX×MX)] / (NX + 1) as the width TX of the second grid sheet portion, and set [DY - (NY×MY)] / (NY + 1) as the width TY of the first grid sheet portion.

2. The method for setting the size of a frame according to claim 1, characterized in that the width of the first edge sheet portion and the width of the first grid sheet portion are set to be the same, and the width of the second edge sheet portion and the width of the second grid sheet portion are set to be the same.

3. The method for setting the size of a frame according to claim 1, characterized in that when DX and DY are preset fixed values, TX and TY change based on the changes of MX and MY.

4. The method for setting the size of a frame according to claim 3, characterized in that DX has a fixed value of at least greater than 1500 mm, DY has a fixed value of at least greater than 900 mm, and at least one of TX and TY is set to be greater than 8 mm.

5. The method for setting the size of a frame according to claim 1, characterized in that Satisfy DX 2 +DY 2 =D 2 The diameter (D) must be at least 1750 mm.

6. The method for setting the size of a frame according to claim 1, characterized in that: when the thickness of the first grid sheet portion is TZ1, the thickness of the second grid sheet portion is TZ2, the number of beads along the first direction of the unit mask unit region is WX, and the number of beads along the second direction is WY, the number of beads per unit volume of the first grid sheet portion is WV1 = (WX×NX) / (TX×TZ1×DX), the number of beads per unit volume of the second grid sheet portion is WV2 = (WX×NY) / (TY×TZ2×DY).

7. The method for setting the size of the frame according to claim 6, wherein the WV1 value is reduced by increasing the TZ1 value, or the WV2 value is reduced by increasing the TZ2 value, thereby reducing the deformation amount generated based on the sheet portion of the welding mask unit.

8. The method for setting the size of the frame according to claim 1, wherein when one end of the width TX and the width TY is set to 0% and the other end is set to 100%, the welding between the sheet portion of the mask unit and the mask is performed at a portion corresponding to 25% to 75% of the width TX and the width TY.

9. A method for reducing the deformation amount of a frame, the frame being used for a frame-integrated mask formed integrally with a plurality of masks and a frame for supporting the masks, wherein the frame includes an edge frame portion and a sheet portion of a mask unit, the edge frame portion includes a hollow area; the sheet portion of the mask unit has a plurality of mask unit areas along a first direction and a second direction perpendicular to the first direction, and is connected to the edge frame portion, the sheet portion of the mask unit includes a pair of first edge sheet portions, a pair of second edge sheet portions, at least one first grid sheet portion, and at least one second grid sheet portion. The pair of first edge sheet portions are formed to extend in the first direction and are spaced apart; the pair of second edge sheet portions are formed to extend in the second direction, and both ends are respectively connected to the respective ends of the first edge sheet portions and are spaced apart; the at least one first grid sheet portion is formed to extend in the first direction, and both ends are connected to the second edge sheet portions; the at least one second grid sheet portion is formed to extend in the second direction and intersects with the first grid sheet portion, and both ends are connected to the first edge sheet portions, when the lengths of the sheet portion of the mask unit in the first direction and the second direction are DX and DY, the lengths of a unit mask unit area in the first direction and the second direction are MX and MY, the thickness of the first grid sheet portion is TZ1, the thickness of the second grid sheet portion is TZ2, the number of solder beads of a unit mask unit area in the first direction is WX, and the number of solder beads in the second direction is WY, (a) Calculate NX that satisfies NX×MX < DX ≤ (NX + 1)×MX and NY that satisfies NY×MY < DY ≤ (NY + 1)×MY, where NX and NY are natural numbers; (b) Set the width TX of the second grid sheet portion and the width TY of the first grid sheet portion to be at least greater than 5 mm; (c) Set the number of solder beads per unit volume of the first grid sheet portion to WV1 = (WX×NX) / (TX×TZ1×DX), and set the number of solder beads per unit volume of the second grid sheet portion to WV2 = (WX×NY) / (TY×TZ2×DY). The WV1 value is reduced by increasing the TZ1 value, or the WV2 value is reduced by increasing the TZ2 value, thereby reducing the deformation amount generated based on the sheet portion of the welding mask unit.

10. A frame, the frame being used for a frame-integrated mask formed integrally with a plurality of masks and a frame for supporting the masks, wherein The frame includes an edge frame portion and a mask unit sheet portion. The edge frame portion includes a hollow area; the mask unit sheet portion has a plurality of mask unit regions along a first direction and a second direction perpendicular to the first direction, and is connected to the edge frame portion. The mask unit sheet portion includes a pair of first edge sheet portions, a pair of second edge sheet portions, at least one first grid sheet portion, and at least one second grid sheet portion. The pair of first edge sheet portions are formed to extend in the first direction and are spaced apart; the pair of second edge sheet portions are formed to extend in the second direction, and the two ends are respectively connected to the respective ends of the first edge sheet portions and are spaced apart; the at least one first grid sheet portion is formed to extend in the first direction, and the two ends are connected to the second edge sheet portions; the at least one second grid sheet portion is formed to extend in the second direction and intersects with the first grid sheet portion, and the two ends are connected to the first edge sheet portions. When the lengths of the mask unit sheet portion along the first direction and the second direction are DX and DY, and the lengths of a unit mask unit region along the first direction and the second direction are MX and MY, calculate NX that satisfies NX×MX < DX ≤ (NX + 1)×MX and NY that satisfies NY×MY < DY ≤ (NY + 1)×MY, where NX and NY are natural numbers. Then, calculate TX = [DX - (NX×MX)] / (NX + 1) and TY = [DY - (NY×MY)] / (NY + 1), and set the width of the second grid sheet portion to TX and the width of the first grid sheet portion to TY.

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