Test loop operation temperature control method, device, equipment and readable storage medium

Abstract

The present invention provides a test loop operating temperature control method, device, equipment and readable storage medium, which include: obtaining the current operating temperature of the test loop; calculating the temperature deviation between the operating temperature and the set temperature, and judging whether the temperature deviation is within the set deviation range; if the temperature deviation is within the deviation range, keeping the heating power in the test loop unchanged; if the temperature deviation is outside the deviation range and meets the preset adjustment conditions, according to the changing trend of the operating temperature and the temperature deviation, calculating a power correction value that is positively correlated with the temperature deviation, and adjusting the heating power in the test loop to a new heating power according to the power correction value. The present application can adaptively adjust the heating power according to the actual size of the temperature deviation when adjusting the operating temperature of the test loop, so as to keep the operating temperature of the test loop in a stable state as much as possible and avoid its more frequent fluctuations.

Description

Technical Field

[0001] The present invention relates to the field of test loop operation control, and in particular to a test loop operation temperature control method, device, equipment and readable storage medium. Background Art

[0002] High temperature and high pressure test loops are mainly used to carry out hot performance tests on equipment such as pumps and valves. Since the loop temperature is much higher than the ambient temperature, it will emit a certain amount of heat to the environment. If there are no temperature control measures, the loop temperature will gradually drop. In order to maintain the constant loop temperature, an electric heater is generally installed on the loop pipeline, and the loop temperature is kept constant by adjusting the electric heating amount.

[0003] The traditional temperature control method is logic control. When the temperature is higher than the upper temperature limit setting value, the heating is stopped, and when the temperature is lower than the lower temperature limit setting value, the electric heater is started. Although the logic of this control method is relatively simple, it will cause the temperature of the test loop to fluctuate frequently within the set range, and the temperature change rate is relatively fast, which may cause fatigue damage to the test loop system equipment and pipelines due to the frequent alternating stress, affecting the safety of the high temperature and high pressure test loop operation, and also reducing the service life of the high temperature and high pressure test loop and the quality of loop temperature control. Summary of the invention

[0004] The main purpose of the present invention is to provide a test loop operating temperature control method, device, equipment and readable storage medium, aiming to solve the problem in the related art that the test loop temperature fluctuates frequently within a certain range.

[0005] In a first aspect, the present invention provides a test loop operating temperature control method.

[0006] A test loop operating temperature control method, comprising:

[0007] Get the current operating temperature of the test circuit;

[0008] Calculating a temperature deviation between the operating temperature and a set temperature, and determining whether the temperature deviation is within a set deviation range;

[0009] If the temperature deviation is within the deviation range, the heating power in the test circuit is kept unchanged;

[0010] If the temperature deviation is outside the deviation range and the changing trend of the operating temperature meets the preset adjustment conditions, a power correction value positively correlated with the temperature deviation is calculated based on the temperature deviation, and the heating power in the test circuit is adjusted to a new heating power based on the power correction value, so that the operating temperature approaches the set temperature at a speed positively correlated with the temperature deviation.

[0011] In some embodiments, the adjustment condition includes that the change trend of the operating temperature gradually moves away from the set temperature;

[0012] If the temperature deviation is outside the deviation range and the change trend of the operating temperature is gradually approaching the set temperature, the heating power in the test circuit is kept unchanged.

[0013] In some embodiments, the calculating, according to the change trend of the operating temperature and the temperature deviation, a power correction value that is positively correlated with the temperature deviation comprises:

[0014] Calculate the target correction value of the heating power in the test circuit according to the temperature deviation;

[0015] Determining whether the target correction value is within a set limited correction range;

[0016] If so, the power correction value is the target correction value;

[0017] If not, the power correction value is the parameter value closest to the target correction value within the limited correction range.

[0018] In some embodiments, the limited correction range is obtained according to the temperature deviation, the set temperature, a set temperature deviation limit, a set circuit heat dissipation power, and a set ambient temperature.

[0019] In some embodiments, the heating power in the test circuit is adjusted to a new heating power based on the power correction value, and the heating power in the test circuit is adjusted to a new heating power based on the power correction value, the temperature deviation and the set maximum heating power, and the new heating power is satisfied to be within the range between zero and the maximum heating power.

[0020] In some embodiments, adjusting the heating power in the test circuit to a new heating power according to the power correction value, the temperature deviation and the set maximum heating power, and satisfying that the new heating power is within a range between zero and the maximum heating power, includes:

[0021] If the operating temperature is lower than the deviation range, a heating power adjustment value is obtained according to the preset first algorithm, the power correction value and the set maximum heating power, and the heating power in the test circuit is adjusted to the smaller value between the heating power adjustment value and the maximum heating power;

[0022] If the operating temperature is higher than the deviation range, a heating power adjustment value is obtained according to the preset second algorithm, the power correction value and the set maximum heating power, and the heating power in the test loop is adjusted to the larger value between the heating power adjustment value and zero.

[0023] In some embodiments, the initial heating power of the test loop is obtained by the set temperature, set pressure and set volume flow.

[0024] In a second aspect, the present invention also provides a test loop operation temperature control device.

[0025] A test loop operation temperature control device, comprising:

[0026] An acquisition module, which is configured to acquire a current operating temperature of the test loop;

[0027] a determination module configured to calculate a temperature deviation between the operating temperature and a set temperature, and determine whether the temperature deviation is within a set deviation range;

[0028] A control module is configured to keep the heating power in the test circuit unchanged if the temperature deviation is within the deviation range; and to calculate a power correction value positively correlated with the temperature deviation based on the temperature deviation if the temperature deviation is outside the deviation range and the change trend of the operating temperature meets the preset adjustment conditions, and to adjust the heating power in the test circuit to a new heating power based on the power correction value, so that the operating temperature approaches the set temperature at a speed positively correlated with the temperature deviation.

[0029] In a third aspect, the present invention also provides a test loop operation temperature control device.

[0030] A test loop operation temperature control device, the test loop operation temperature control device comprising a processor, a memory, and a test loop operation temperature control program stored in the memory and executable by the processor, wherein when the test loop operation temperature control program is executed by the processor, the steps of the test loop operation temperature control method as described above are implemented.

[0031] In a fourth aspect, the present invention also provides a readable storage medium.

[0032] A readable storage medium, characterized in that a test loop operation temperature control program is stored on the readable storage medium, wherein when the test loop operation temperature control program is executed by a processor, the steps of the test loop operation temperature control method as described above are implemented.

[0033] The present invention determines whether the test circuit needs to adjust the heating power according to preset adjustment conditions when the operating temperature of the test circuit changes greatly and the temperature deviation between the test circuit and the set temperature is outside the set deviation range. When the adjustment conditions are met, the power correction value positively correlated with the temperature deviation is calculated, and the heating power in the test circuit is adjusted to the new heating power. Finally, under the gradually changing heating power, the operating temperature is made to approach the set temperature at a speed positively correlated with the temperature deviation. This achieves that the present application can adaptively adjust the heating power according to the actual size of the temperature deviation when adjusting the operating temperature of the test circuit. When the temperature difference deviation is large, the operating temperature can be changed faster to return to the normal temperature range faster. When the temperature difference deviation is small, the operating temperature can be changed slower to enter the normal temperature range more stably. When the operating temperature is within the normal temperature range, the heating power of the test circuit can be kept unchanged to keep the operating temperature of the test circuit as stable as possible to avoid frequent fluctuations. BRIEF DESCRIPTION OF THE DRAWINGS

[0034] Figure 1 It is a hardware structure diagram of the test loop operation temperature control device involved in the embodiment of the present invention;

[0035] Figure 2 It is a flow chart of the first embodiment of the test loop operating temperature control method of the present invention;

[0036] Figure 3 This is a functional module diagram of the first embodiment of the test loop operating temperature control device of the present invention.

[0037] The realization of the purpose, functional features and advantages of the present invention will be further explained in conjunction with embodiments and with reference to the accompanying drawings. DETAILED DESCRIPTION

[0038] It should be understood that the specific embodiments described herein are only used to explain the present invention, and are not used to limit the present invention.

[0039] High temperature and high pressure test loops are mainly used to carry out hot performance tests of equipment such as pumps and valves. Since the loop temperature is much higher than the ambient temperature, it will emit a certain amount of heat to the environment. If there is no temperature control measure, the temperature of the loop will gradually drop. In order to maintain the constant temperature of the loop, an electric heater is generally set on the loop pipeline, and the loop temperature is kept constant by adjusting the electric heating amount. The traditional temperature control method is logic control. When the temperature is higher than the upper temperature limit setting value, the heating is stopped, and when the temperature is lower than the lower temperature limit setting value, the electric heater is started. Although the logic of this control method is relatively simple, it will cause the temperature of the test loop to fluctuate frequently within the set range, and the temperature changes at a faster rate, which may cause fatigue damage to the test loop system equipment and pipelines due to the action of frequent alternating stress, which not only affects the safety of the high temperature and high pressure test loop operation, but also reduces the service life of the high temperature and high pressure test loop and the quality of loop temperature control. Based on the above problems, the present application proposes a test loop operation temperature control method, device, equipment and readable storage medium.

[0040] The present application proposes a test loop operating temperature control method, device, equipment and readable storage medium. The main point of the invention is that when the operating temperature of the test loop changes significantly, that is, when the temperature deviation between it and the set temperature is outside the set deviation range, it can be determined whether the test loop needs to adjust the heating power according to the preset adjustment conditions. When the adjustment conditions are met, the power correction value positively correlated with the temperature deviation is calculated, and the heating power in the test loop is adjusted to the new heating power. Finally, under the gradually changing heating power, the operating temperature is made to approach the set temperature at a speed positively correlated with the temperature deviation. The present application can adaptively adjust the heating power according to the actual size of the temperature deviation when adjusting the operating temperature of the test loop. When the temperature difference deviation is large, the operating temperature can be changed faster to return to the normal temperature range faster. When the temperature difference deviation is small, the operating temperature can be changed slower to enter the normal temperature range more stably. When the operating temperature is within the normal temperature range, the heating power of the test loop can be kept unchanged to keep the operating temperature of the test loop as stable as possible to avoid its more frequent fluctuations.

[0041] In a first aspect, an embodiment of the present invention provides a test loop operation temperature control device, which can be a device with data processing function such as a personal computer (PC), a notebook computer, or a server.

[0042] Reference Figure 1 , Figure 1It is a hardware structure diagram of the test loop operation temperature control device involved in the embodiment of the present invention. In the embodiment of the present invention, the test loop operation temperature control device may include a processor 1001 (such as a central processing unit, CPU), a communication bus 1002, a user interface 1003, a network interface 1004, and a memory 1005. Among them, the communication bus 1002 is used to realize the connection and communication between these components; the user interface 1003 may include a display screen (Display), an input unit such as a keyboard (Keyboard); the network interface 1004 may optionally include a standard wired interface, a wireless interface (such as wireless fidelity WIreless-FIdelity, WI-FI interface); the memory 1005 may be a high-speed random access memory (random access memory, RAM), or a stable memory (non-volatile memory), such as a disk storage, and the memory 1005 may optionally be a storage device independent of the aforementioned processor 1001. Those skilled in the art will understand that Figure 1 The hardware structure shown in the figure does not constitute a limitation of the present invention, and may include more or less components than those shown in the figure, or combine certain components, or arrange the components differently.

[0043] Continue to refer to Figure 1 , Figure 1 The memory 1005 as a computer storage medium may include an operating system, a network communication module, a user interface module, and a test loop operation temperature control program. The processor 1001 may call the test loop operation temperature control program stored in the memory 1005 and execute the test loop operation temperature control method provided in the embodiment of the present invention.

[0044] In a second aspect, an embodiment of the present invention provides a test loop operating temperature control method.

[0045] Reference Figure 2 , a test loop operating temperature control method, comprising:

[0046] S100, obtaining the current operating temperature of the test circuit;

[0047] S200, calculating a temperature deviation between the operating temperature and a set temperature, and determining whether the temperature deviation is within a set deviation range;

[0048] S310, if the temperature deviation is within the deviation range, keeping the heating power in the test circuit unchanged;

[0049] S320. If the temperature deviation is outside the deviation range and the changing trend of the operating temperature meets the preset adjustment condition, a power correction value positively correlated with the temperature deviation is calculated based on the temperature deviation, and the heating power in the test circuit is adjusted to a new heating power based on the power correction value, so that the operating temperature approaches the set temperature at a speed positively correlated with the temperature deviation.

[0050] Among them, the set temperature in this embodiment is the temperature when the test circuit is running under set conditions such as ideal conditions or specific conditions, which is set in advance by the technical staff according to the needs; the set deviation range is obtained according to the acceptable temperature deviation limit when the test circuit is running under the set conditions, and the deviation range in this embodiment does not exceed the temperature deviation limit allowed by the test circuit under the set conditions, thereby avoiding the operating temperature of the test circuit being outside the temperature range allowed for normal operation under the set conditions, resulting in the test circuit being unable to reach or approach the set conditions. Specifically, the set deviation range is (-δT c ,δT c ), where (0<δT c <△T R ), ΔT R The temperature deviation limit allowed for the test circuit under set working conditions shall be determined by technical personnel based on needs.

[0051] Furthermore, the adjustment condition includes that the change trend of the operating temperature gradually moves away from the set temperature;

[0052] If the temperature deviation is outside the deviation range and the change trend of the operating temperature is gradually approaching the set temperature, the heating power in the test circuit is kept unchanged.

[0053] Specifically, when the change trend of the operating temperature gradually moves away from the set temperature, it includes the following two specific forms: (△T c,i >δT c And T c,i >T c,i-1 ) or (△T c,i <-δT c And T c,i <T c,i-1 );

[0054] Among them, △T c,i =T c,i -T R ; △T c,i-1 =T c,i-1 -T R ;

[0055] ΔT c,iis the temperature deviation calculated based on the operating temperature obtained this time;

[0056] ΔT c,i-1 is the temperature deviation calculated based on the last obtained operating temperature;

[0057] T c,i is the operating temperature obtained this time;

[0058] T c,i-1 is the operating temperature obtained last time;

[0059] T R It is the operating temperature of the test circuit under set working conditions, that is, the set temperature.

[0060] With this setting, when the operating temperature trend gradually moves away from the set temperature, it reflects that the heating power of the test circuit at this time is contrary to controlling the operating temperature within the deviation range, that is, the current heating power of the test circuit will make the operating temperature further away from the set temperature, resulting in an increase in the temperature deviation, and then the heating power needs to be adjusted. When the operating temperature trend gradually approaches the set temperature, it reflects that the heating power of the test circuit is bringing the operating temperature closer to the set temperature, and the heating power can be omitted to allow the operating temperature to continue to approach the set temperature. Adaptive adjustment is achieved based on the actual impact of the current heating power of the test circuit on the operating temperature, and the control logic of the heating power of the test circuit is optimized.

[0061] Furthermore, in step S320, according to the change trend of the operating temperature and the temperature deviation, a power correction value positively correlated with the temperature deviation is calculated, including:

[0062] S321, calculating a target correction value of the heating power in the test circuit according to the temperature deviation;

[0063] S322, determining whether the target correction value is within a set limited correction range;

[0064] If so, the power correction value is the target correction value;

[0065] If not, the power correction value is the parameter value closest to the target correction value within the limited correction range.

[0066] Specifically, the target correction value By limiting it to (-△P h,R ,△P h,R ) to obtain the power correction value; (-△P h,R ,△P h,R ) h,R is the heating power variation limit;

[0067] Heating power change limit

[0068] Where K is a constant and can take values ​​between 1 and 2;

[0069] P cR It is the circuit heat dissipation power of the test circuit under the set working condition;

[0070] T R It is the operating temperature of the test circuit under the set working conditions, that is, the set temperature;

[0071] T aR is the ambient temperature under the set working condition;

[0072] That is, the limited correction range is obtained according to the temperature deviation, the set temperature, the set temperature deviation limit, the set circuit heat dissipation power and the set ambient temperature.

[0073] With this arrangement, through the various parameters of the test circuit under the set working conditions, it is possible to determine in advance the correction range of the test circuit heating power, thereby further ensuring that the adjustment range of the test circuit heating power will not be too large during a single adjustment, so as to ensure that the change range of the operating temperature of the test circuit is within a more appropriate range, avoid excessively rapid changes in the operating temperature, and effectively ensure that the test circuit is in a more stable operating state.

[0074] Furthermore, in the step S320, the heating power in the test circuit is adjusted to a new heating power according to the power correction value, specifically including adjusting the heating power in the test circuit to a new heating power according to the power correction value, the temperature deviation and the set maximum heating power, and satisfying that the new heating power is within the range between zero and the maximum heating power.

[0075] Among them, the maximum heating power P h,max The temperature rise limit is determined by technical personnel based on the specific structure of the test circuit under the set working conditions.

[0076] This setting further ensures that the heating power of the test circuit after adjustment is within the specified maximum heating power P h,max To avoid leakage of working fluid due to loose equipment sealing caused by the temperature rise and fall rate of the test circuit exceeding the limit.

[0077] Further, in step S320, adjusting the heating power in the test circuit to a new heating power according to the power correction value, the temperature deviation and the set maximum heating power, and satisfying that the new heating power is within the range between zero and the maximum heating power, specifically includes:

[0078] S323, if the operating temperature is lower than the deviation range, a heating power adjustment value is obtained according to the preset first algorithm, the power correction value and the set maximum heating power, and the heating power in the test circuit is adjusted to the smaller value between the heating power adjustment value and the maximum heating power;

[0079] S324. If the operating temperature is higher than the deviation range, a heating power adjustment value is obtained according to the preset second algorithm, the power correction value and the set maximum heating power, and the heating power in the test loop is adjusted to the larger value between the heating power adjustment value and zero.

[0080] Specifically, in this embodiment, the power target value P is first calculated by the power correction value. h_goal,i , and then calculate the heating power adjustment value P according to the power target value h,i , the calculation process is as follows:

[0081]

[0082]

[0083] It can be seen from the above calculation formula that after the operating temperature of the test circuit is obtained for the first time, that is, when i=1, the initial heating power of the test circuit (i=0) needs to be used, that is, P h_goal,0 In this embodiment, the initial heating power of the test circuit is obtained by the set temperature, set pressure and set volume flow.

[0084] Specifically, P h_goal,0 The calculation process is as follows:

[0085] F1, based on the set temperature T R , the pressure p set under design conditions R By looking up the water physical property parameter table, we can get the density value ρ of the corresponding fluid R ;

[0086] F2, based on pump head characteristic data (Q k ,h k ), by △P p,k =ρ R gh k , a set of data on the relationship between pump pressure head and flow rate can be calculated (Q k ,ΔP k ), using the least squares method, we get the second-order fitting expression △P p =k 10 +k 11 Q+k 12 Q 2 , where k 10 , k 11and k 12 For the fitting constant, it can be understood that in other embodiments, a multi-order fitting expression greater than two orders may also be used, which will not be described in detail here;

[0087] F3, based on pump shaft power characteristic data (Q k ,P ek ), using the least squares method, the second-order expression is P e =k 20 +k 21 Q+k 22 Q 2 , where k 20 , k 21 and k 22 is the fitting constant.

[0088] F4. According to Calculate the coefficient k c , where Q R is the volume flow rate of the test circuit under design conditions, Δp R is the test circuit under design conditions (T R 、p R and Q R ) resistance;

[0089] F5, by Calculate the actual flow value of the circuit And by Get the actual shaft power value of the pump.

[0090] F6. Calculate the electric heating power required for the design condition P h_goal,0 That is P h .

[0091] Finally, through the above-mentioned control method and calculation process, the accurate calculation of the heating power of the electric heater can be achieved, which can not only improve the accuracy of temperature control and the effectiveness of the test during the test, but also reduce the fluctuation period and change rate of the temperature of the high-temperature and high-pressure test loop, thereby reducing the impact of alternating stress on the loop system equipment and pipelines. While improving the temperature control accuracy of the high-temperature and high-pressure test loop, it can also improve the operating safety of the high-temperature and high-pressure test loop system and equipment and extend the service life of the loop system.

[0092] In a third aspect, an embodiment of the present invention further provides a test loop operation temperature control device.

[0093] Reference Figure 3 , a schematic diagram of the functional modules of the first embodiment of the test loop operation temperature control device.

[0094] In this embodiment, the test circuit operation temperature control device includes:

[0095] An acquisition module, which is configured to acquire a current operating temperature of the test loop;

[0096] a determination module configured to calculate a temperature deviation between the operating temperature and a set temperature, and determine whether the temperature deviation is within a set deviation range;

[0097] A control module is configured to keep the heating power in the test circuit unchanged if the temperature deviation is within the deviation range; and to calculate a power correction value positively correlated with the temperature deviation based on the temperature deviation if the temperature deviation is outside the deviation range and the change trend of the operating temperature meets the preset adjustment conditions, and to adjust the heating power in the test circuit to a new heating power based on the power correction value, so that the operating temperature approaches the set temperature at a speed positively correlated with the temperature deviation.

[0098] Among them, the functional implementation of each module in the above-mentioned test loop operation temperature control device corresponds to the various steps in the above-mentioned test loop operation temperature control method embodiment, and its functions and implementation processes will not be repeated here one by one.

[0099] In a fourth aspect, an embodiment of the present invention further provides a readable storage medium.

[0100] The readable storage medium of the present invention stores a test loop operation temperature control program, wherein when the test loop operation temperature control program is executed by a processor, the steps of the test loop operation temperature control method as described above are implemented.

[0101] Among them, the method implemented when the test loop operation temperature control program is executed can refer to the various embodiments of the test loop operation temperature control method of the present invention, and will not be repeated here.

[0102] It should be noted that, in this article, the terms "include", "comprises" or any other variations thereof are intended to cover non-exclusive inclusion, so that a process, method, article or system including a series of elements includes not only those elements, but also other elements not explicitly listed, or also includes elements inherent to such process, method, article or system. In the absence of further restrictions, an element defined by the sentence "comprises a ..." does not exclude the existence of other identical elements in the process, method, article or system including the element.

[0103] The serial numbers of the above embodiments of the present invention are only for description and do not represent the advantages or disadvantages of the embodiments.

[0104] Through the description of the above implementation methods, those skilled in the art can clearly understand that the above-mentioned embodiment methods can be implemented by means of software plus a necessary general hardware platform, and of course by hardware, but in many cases the former is a better implementation method. Based on such an understanding, the technical solution of the present invention is essentially or the part that contributes to the prior art can be embodied in the form of a software product, which is stored in a storage medium (such as ROM / RAM, magnetic disk, optical disk) as described above, and includes a number of instructions for a terminal device to execute the methods described in each embodiment of the present invention.

[0105] The above are only preferred embodiments of the present invention, and are not intended to limit the patent scope of the present invention. Any equivalent structure or equivalent process transformation made using the contents of the present invention specification and drawings, or directly or indirectly applied in other related technical fields, are also included in the patent protection scope of the present invention.

Claims

1. A test loop operating temperature control method, characterized in that: It includes: Get the current operating temperature of the test circuit; Calculating a temperature deviation between the operating temperature and a set temperature, and determining whether the temperature deviation is within a set deviation range; If the temperature deviation is within the deviation range, the heating power in the test circuit is kept unchanged; If the temperature deviation is outside the deviation range and the change trend of the operating temperature meets the preset adjustment condition, a power correction value positively correlated with the temperature deviation is calculated according to the temperature deviation, and the heating power in the test circuit is adjusted to a new heating power according to the power correction value, so that the operating temperature approaches the set temperature at a speed positively correlated with the temperature deviation; The adjustment condition includes that the change trend of the operating temperature gradually moves away from the set temperature; If the temperature deviation is outside the deviation range and the change trend of the operating temperature is gradually approaching the set temperature, the heating power in the test circuit is kept unchanged; The calculating, according to the change trend of the operating temperature and the temperature deviation, a power correction value that is positively correlated with the temperature deviation comprises: Calculate the target correction value of the heating power in the test circuit according to the temperature deviation; Determining whether the target correction value is within a set limited correction range; If so, the power correction value is the target correction value; If not, the power correction value is the parameter value closest to the target correction value within the limited correction range; The limited correction range is obtained according to the temperature deviation, the set temperature, the set temperature deviation limit, the set circuit heat dissipation power and the set ambient temperature.

2. The test circuit operating temperature control method according to claim 1, characterized in that: The heating power in the test circuit is adjusted to a new heating power according to the power correction value. The heating power in the test circuit is adjusted to a new heating power according to the power correction value, the temperature deviation and the set maximum heating power, and the new heating power is satisfied to be within the range between zero and the maximum heating power.

3. The test circuit operation temperature control method according to claim 2, characterized in that: The step of adjusting the heating power in the test circuit to a new heating power according to the power correction value, the temperature deviation and the set maximum heating power, and satisfying that the new heating power is within a range between zero and the maximum heating power, includes: If the operating temperature is lower than the deviation range, a heating power adjustment value is obtained according to the preset first algorithm, the power correction value and the set maximum heating power, and the heating power in the test circuit is adjusted to the smaller value between the heating power adjustment value and the maximum heating power; If the operating temperature is higher than the deviation range, a heating power adjustment value is obtained according to the preset second algorithm, the power correction value and the set maximum heating power, and the heating power in the test loop is adjusted to the larger value between the heating power adjustment value and zero.

4. The test loop operating temperature control method according to claim 1, characterized in that: The initial heating power of the test loop is obtained from the set temperature, set pressure and set volume flow.

5. A test loop operation temperature control device for implementing the test loop operation temperature control method according to claim 1, characterized in that: It includes: An acquisition module, which is configured to acquire a current operating temperature of the test loop; a determination module configured to calculate a temperature deviation between the operating temperature and a set temperature, and determine whether the temperature deviation is within a set deviation range; A control module, configured to keep the heating power in the test circuit unchanged if the temperature deviation is within the deviation range; If the temperature deviation is outside the deviation range and the changing trend of the operating temperature meets the preset adjustment conditions, a power correction value positively correlated with the temperature deviation is calculated based on the temperature deviation, and the heating power in the test circuit is adjusted to a new heating power based on the power correction value, so that the operating temperature approaches the set temperature at a speed positively correlated with the temperature deviation.

6. A test circuit operating temperature control device, characterized in that: The test loop operation temperature control device includes a processor, a memory, and a test loop operation temperature control program stored in the memory and executable by the processor, wherein when the test loop operation temperature control program is executed by the processor, the steps of the test loop operation temperature control method according to any one of claims 1 to 4 are implemented.

7. A readable storage medium, characterized in that: The readable storage medium stores a test loop operation temperature control program, wherein when the test loop operation temperature control program is executed by a processor, the steps of the test loop operation temperature control method according to any one of claims 1 to 4 are implemented.

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