A device and method for pressure maintaining feeding and discharging in chip automatic assembly

Abstract

The application relates to a device and a method for pressure maintaining, feeding and discharging in chip automatic assembly, which comprises a pressure maintaining machine, a feeding machine and a discharging machine. The pressure maintaining machine comprises a chip fixture conveying track, a chip fixture detector, a pressure maintaining mechanism and a pressure maintaining automatic force measuring mechanism, which are electrically connected to a controller. The feeding machine comprises a chip fixture feeding track, a chip fixture feeding buffer platform, a chip fixture feeding detector and a feeding grabbing manipulator, which are electrically connected to the controller. The discharging machine comprises a chip fixture discharging track, a chip fixture discharging buffer platform and a discharging grabbing manipulator, which are electrically connected to the controller. The application realizes a simple, efficient, fast and accurate pressure maintaining, feeding and discharging scheme in chip automatic assembly.

Description

Technical Field

[0001] This invention relates to the technical field of smart chip fixture mounting and dismounting, specifically to a device and method for pressure holding and loading / unloading in automatic chip assembly. Background Technology

[0002] SMT, short for Surface Mount Technology, is currently the most popular technology and process in the electronics assembly industry. SMT refers to a series of processes performed on a PCB (Printed Circuit Board). Surface mount technology, also known as surface mounting or surface mount assembly technology, is a circuit assembly technology that mounts leadless or short-lead surface mount components onto the surface of a printed circuit board or other substrate, and then assembles them through methods such as reflow soldering or dip soldering.

[0003] With the development of production technology and the improvement of production efficiency, traditional manual chip placement technology cannot guarantee the accuracy and consistency of chip placement, and also greatly hinders the improvement of PCB placement efficiency. While placement fixtures can effectively solve the problems of accuracy and consistency, they do not completely solve the efficiency improvement issues inherent in manual placement. In this process, the accurate loading, unloading, positioning, and data recording calibration of the fixture are crucial to the automated chip placement process. Any deviation in fixture placement or data recording will lead to inconsistencies throughout the entire circuit. Therefore, providing a precise and data-accurate solution for pressure-holding loading and unloading in automated chip assembly is a pressing technical problem that needs to be solved in this field. Summary of the Invention

[0004] (1) Technical problems to be solved

[0005] The purpose of this invention is to overcome the shortcomings of the prior art, adapt to practical needs, and provide a precise and accurate solution for pressure holding and unloading in the automatic chip assembly process, so as to solve the above-mentioned technical problems.

[0006] (2) Technical solution

[0007] To achieve the objectives of this invention, the technical solution adopted is as follows:

[0008] A device for pressure holding and unloading in automated chip assembly includes: a pressure holding machine, a loading machine, an unloading machine, and a controller; wherein,

[0009] The pressure holding machine includes: a chip fixture conveying track, a chip fixture detector, a pressure holding mechanism, and a pressure holding automatic force measuring mechanism, all electrically connected to the controller; the chip fixture conveying track extends from the loading machine that feeds the chip fixture towards the loading machine, and chip fixture detection recording points and pressure holding points are set at preset positions on the chip fixture conveying track; the chip fixture detector is set above / below the chip fixture detection recording point and transmits the detection recording data of the chip fixture to the controller; the pressure holding mechanism is set above / below the pressure holding point and performs pressure holding on the chip fixture conveyed thereto; the pressure holding automatic force measuring mechanism is set on both sides of the pressure holding point to ensure that a constant pressure is applied to the chip in the chip fixture;

[0010] The loading machine includes: a chip fixture feeding track, a chip fixture loading buffer platform, a chip fixture loading detector, and a loading gripper, all electrically connected to the controller; the chip fixture feeding track is connected to the chip fixture conveying track and the pick-and-place machine, and a chip fixture loading detection point is set at a preset position on the chip fixture feeding track; the chip fixture loading detector is located above / below the chip fixture loading detection point, and transmits the loading detection record data of the chip fixture to the controller; the chip fixture loading buffer platform is a chip fixture buffer area located at a preset interval next to the chip fixture feeding track; the loading gripper is located above the chip fixture feeding track, and grips the inspected chip fixture and places it on the chip fixture loading buffer platform;

[0011] The unloading machine includes: a chip fixture ejection track, a chip fixture unloading buffer platform, and an unloading gripping robot, all electrically connected to the controller; the chip fixture ejection track is connected to the pick-and-place machine to receive the chip fixtures after placement; the chip fixture unloading buffer platform is a chip fixture buffer area located at a preset interval next to the chip fixture ejection track; the unloading gripping robot is located above the chip fixture ejection track and picks up the chip fixtures after placement and places them on the chip fixture unloading buffer platform.

[0012] Optionally, the chip fixture detector includes: a bottom automatic scanning mechanism and a detection CCD moving module;

[0013] The bottom automatic scanning mechanism is located below the chip fixture loading and detection point and is electrically connected to the controller; it scans the QR code on the bottom surface of the chip fixture, records the data of the chip fixture, and transmits it to the controller.

[0014] The detection CCD moving module is located above the chip fixture loading detection point and is electrically connected to the controller; it automatically takes pictures of the chip fixture and compares the data transmitted to the controller to determine whether the chip fixture is qualified.

[0015] Optionally, the feeding machine further includes: a non-qualified chip fixture buffer platform, which is a non-qualified chip fixture buffer area located at a preset interval position next to the chip fixture feeding track; the gripper of the feeding gripper is equipped with a test CCD moving module, which automatically takes pictures of the chip fixture, compares them with preset chip fixture data, and places the chip fixture on the chip fixture feeding buffer platform when it is determined to be qualified, and places it on the non-qualified chip fixture buffer platform when it is determined to be unqualified.

[0016] Optionally, the device for automatic chip assembly with pressure holding and loading / unloading further includes an ion air bar, located at a preset position next to or above the chip fixture conveying track, chip fixture feeding track and chip fixture discharging track, electrically connected to the controller, to eliminate static electricity of the chip in the chip fixture during operation.

[0017] Optionally, the device for automatic chip assembly with pressure holding and loading / unloading further includes: a cap removal machine, located between the loading machine and the unloading machine, electrically connected to the controller, comprising: a cap removal mechanism, a cap removal robot, a cap detector, a cap hopper, and a chip unloading conveyor track; the cap removal mechanism is coupled to the chip fixture feeding track and removes the caps from the chip products on the chip fixture feeding track; the cap removal robot is positioned at a preset corresponding position of the cap removal mechanism and picks up the caps removed from the chip products to the cap detector; the cap detector is positioned at a preset corresponding position of the cap removal robot, detects the caps, transmits the data to the controller, and controls the pushing of the caps into the cap hopper; the cap hopper is positioned at a preset corresponding position of the cap removal robot and stores the caps; the chip unloading conveyor track is positioned at a preset corresponding position of the cap removal robot, receives the chip products for detection, transmits the data to the controller, and controls the conveying of the chip products to the unloading machine.

[0018] On the other hand, the present invention also provides a method for pressure holding and unloading in automated chip assembly, implemented in an apparatus for pressure holding and unloading in automated chip assembly, the apparatus comprising: a pressure holding machine, a loading machine, an unloading machine, and a controller; wherein,

[0019] The pressure holding machine includes: a chip fixture conveying track, a chip fixture detector, a pressure holding mechanism, and a pressure holding automatic force measuring mechanism, all electrically connected to the controller; the chip fixture conveying track extends from the loading machine that feeds the chip fixture towards the loading machine, and chip fixture detection recording points and pressure holding points are set at preset positions on the chip fixture conveying track; the chip fixture detector is set above / below the chip fixture detection recording point and transmits the detection recording data of the chip fixture to the controller; the pressure holding mechanism is set above / below the pressure holding point and performs pressure holding on the chip fixture conveyed thereto; the pressure holding automatic force measuring mechanism is set on both sides of the pressure holding point to ensure that a constant pressure is applied to the chip in the chip fixture;

[0020] The loading machine includes: a chip fixture feeding track, a chip fixture loading buffer platform, a chip fixture loading detector, and a loading gripper, all electrically connected to the controller; the chip fixture feeding track is connected to the chip fixture conveying track and the pick-and-place machine, and a chip fixture loading detection point is set at a preset position on the chip fixture feeding track; the chip fixture loading detector is located above / below the chip fixture loading detection point, and transmits the loading detection record data of the chip fixture to the controller; the chip fixture loading buffer platform is a chip fixture buffer area located at a preset interval next to the chip fixture feeding track; the loading gripper is located above the chip fixture feeding track, and grips the inspected chip fixture and places it on the chip fixture loading buffer platform;

[0021] The unloading machine includes: a chip fixture ejection track, a chip fixture unloading buffer platform, and an unloading gripping robot, all electrically connected to the controller; the chip fixture ejection track is connected to the pick-and-place machine to receive the chip fixtures after placement; the chip fixture unloading buffer platform is a chip fixture buffer area located at a preset interval next to the chip fixture ejection track; the unloading gripping robot is located above the chip fixture ejection track and picks up the chip fixtures after placement and places them on the chip fixture unloading buffer platform.

[0022] The method includes:

[0023] Receive the chip fixture fed in by the upper board machine, and control its transport to the chip fixture transport track;

[0024] When the chip fixture moves to the chip fixture detection recording position, the chip fixture detector is controlled to record the chip fixture detection recording data and transmit it to the controller;

[0025] When the chip fixture moves to the pressure holding point, the pressure holding head of the pressure holding mechanism is controlled to press the chip on the chip fixture according to a preset orientation and a preset pressure.

[0026] The chip fixture is transported to the chip fixture feeding track by the control chip fixture conveyor track. After positioning, the loading and gripping robot is controlled to inspect the chip fixture and place it on the chip fixture loading buffer platform. When a placement instruction is received, the loading and gripping robot is controlled to transfer the corresponding chip fixture from the chip fixture loading buffer platform to the placement machine.

[0027] Upon receiving the instruction that the chip mounting is complete, the robot arm is controlled to transfer the completed chip fixture to the chip fixture unloading buffer platform; the robot arm is then controlled to transfer the chip fixture from the chip fixture unloading buffer platform to the chip fixture discharge track.

[0028] Optionally, controlling the chip fixture detector to record the detection data of the chip fixture and transmit it to the controller is as follows:

[0029] The bottom automatic scanning mechanism in the chip fixture detector is controlled to scan the QR code on the bottom surface of the chip fixture, record the data of the chip fixture, and transmit it to the controller;

[0030] The detection CCD moving module in the chip fixture detector is controlled to automatically take pictures of the chip fixture, and the controller compares the data during transmission to determine whether the chip fixture is qualified.

[0031] Optionally, the method for automatically assembling the chip and then loading / unloading it under pressure further includes:

[0032] The gripper of the feeding and grasping robot of the feeding machine is equipped with a test CCD moving module to automatically take pictures of the chip fixture and compare them with the preset chip fixture data for judgment.

[0033] When the chip fixture is determined to be qualified, it is placed on the chip fixture loading buffer platform;

[0034] If the chip fixture is determined to be unqualified, it is placed in the unqualified chip fixture cache platform.

[0035] Optionally, the method for automatically assembling the chip and then loading / unloading it under pressure further includes:

[0036] A cap removal machine is installed between the feeding machine and the unloading machine;

[0037] Control the cap removal mechanism docked to the chip fixture feeding track to remove the caps from the chip products that are covered on the chip fixture feeding track;

[0038] The uncapping robot of the uncapping machine is controlled to inspect the chip product, transmit the data to the controller, and control the chip product to be transported to the chip unloading conveyor track of the unloading machine.

[0039] Optionally, the method for automatically assembling the chip and then loading / unloading it under pressure further includes:

[0040] Control the cap removal robot to pick up the capped plate and place it into the cap plate detector;

[0041] The cover plate detector is controlled to be in a preset corresponding position of the cover removal robot, the detection of the cover plate transmits the data to the controller, and the controller pushes the cover plate into the cover plate hopper.

[0042] (3) Beneficial effects:

[0043] The device and method for pressure holding and loading / unloading in automated chip assembly of this invention, through programmed control of the controller, combined with the pressure holding machine, loading machine, placement machine, and unloading machine, programsically places the chip components, placement components, and loading fixtures into corresponding positions. Through an automated process track and gripping robot, each object is accurately and efficiently attached to the chip component. The device also automatically detects the accuracy of chip fixture positions and placement, and places qualified and unqualified chip fixtures or products into corresponding placement bins. This achieves a precise and data-accurate solution for pressure holding and loading / unloading in automated chip assembly. Attached Figure Description

[0044] Figure 1 This is a schematic diagram of the structure of a device for pressure holding and unloading in automatic chip assembly according to the present invention;

[0045] Figure 2 This is a schematic diagram of the pressure holding machine in a chip automatic assembly device for pressure holding and unloading in this invention;

[0046] Figure 3 This is a schematic diagram of the other side of the pressure holding machine in the automatic chip assembly device of the present invention;

[0047] Figure 4 This is a schematic diagram of the feeding machine in a pressure-holding and feeding device for automatic chip assembly according to the present invention;

[0048] Figure 5 This is a schematic diagram of the other side of the loading machine in a pressure-holding loading and unloading device for automatic chip assembly according to the present invention;

[0049] Figure 6 This is a schematic diagram of the unloading machine in a pressure-holding unloading device for automatic chip assembly according to the present invention;

[0050] Figure 7 This is a schematic diagram of the other side of the unloading machine in a chip automatic assembly pressure holding and unloading device of the present invention;

[0051] Figure 8 This is a flowchart illustrating a method for pressure holding and unloading in automated chip assembly according to the present invention.

[0052] Figure 9 This is a flowchart illustrating the second type of automatic chip assembly method for pressure holding and unloading in this invention.

[0053] Figure 10 This is a flowchart illustrating the third type of automated chip assembly method for pressure holding and unloading in this invention.

[0054] Figure 11 This is a flowchart illustrating the fourth type of automatic chip assembly method for pressure holding and unloading in this invention.

[0055] Figure 12 This is a flowchart illustrating the fifth type of automatic chip assembly method for pressure holding and unloading in this invention. Detailed Implementation

[0056] The following is in conjunction with the appendix Figure 1-12 The present invention is further illustrated by the embodiments:

[0057] Specifically, such as Figure 1-12 As shown, Figure 1 This is a schematic diagram of a device for holding pressure and loading / unloading chips in an automated chip assembly process according to this embodiment. Figure 2 This is a schematic diagram of the pressure holding machine in a chip automatic assembly device for pressure holding and unloading in this embodiment; Figure 3 This is a schematic diagram of the other side of the pressure holding machine in a chip automatic assembly pressure holding and unloading device according to this embodiment; Figure 4 This is a schematic diagram of the feeding machine in a pressure-holding and feeding device for automatic chip assembly in this embodiment; Figure 5 This is a schematic diagram of the other side of the loading machine in a chip automatic assembly pressure holding and loading device in this embodiment; Figure 6 This is a schematic diagram of the unloading machine in a pressure-holding unloading device for automatic chip assembly in this embodiment; Figure 7 This is a schematic diagram of the other side of the unloading machine in a chip automatic assembly pressure holding and unloading device in this embodiment; Figure 8 This is a flowchart illustrating a method for pressure holding and unloading in automated chip assembly according to this embodiment. Figure 9 This is a flowchart illustrating the second type of automated chip assembly method for pressure holding and unloading in this embodiment. Figure 10This is a flowchart illustrating the third type of automated chip assembly method for pressure holding and unloading in this embodiment. Figure 11 This is a flowchart illustrating the fourth method for automatic chip assembly with pressure holding during loading and unloading in this embodiment. Figure 12 This is a flowchart illustrating the fifth type of automatic chip assembly method for pressure holding and unloading in this embodiment.

[0058] Specifically, this embodiment provides a device for holding pressure and loading / unloading chips in automatic assembly, including: a holding pressure machine 101, a loading machine 102, a unloading machine 103, and a controller (the controller is not shown in the figure, but is a control device that connects to and controls the entire system).

[0059] The pressure holding machine 101 includes: a chip fixture conveying track 111, a chip fixture detector 112, a pressure holding mechanism 113, and a pressure holding automatic force measuring mechanism 114, all electrically connected to the controller. The chip fixture conveying track extends from the loading machine that feeds the chip fixture 100 into the loading machine, and chip fixture detection recording points and pressure holding points are set at preset positions on the chip fixture conveying track. The chip fixture detector is set above / below the fixture detection recording point and transmits the detection recording data of the chip fixture to the controller. The pressure holding mechanism is set above / below the pressure holding point and performs pressure holding on the chip fixture conveyed there. The pressure holding automatic force measuring mechanism is set on both sides of the pressure holding point to ensure that the chip in the chip fixture is pressed with a constant pressure.

[0060] The chip fixture can be fed into the board feeder and sent to the pressure holding machine fixture conveyor belt. The fixture is automatically transported to the CCD station, where the CCD moving module automatically takes a picture of the fixture, and simultaneously scans the fixture's QR code below to record this fixture. When the fixture is transported to the pressure holding station, the pressure holding head presses down, once to the left, once to the right, once to the front, and once to the back. During the pressing process, the weights maintain a constant pressure on the chip.

[0061] The loading machine 102 includes: a chip fixture feeding track 121, a chip fixture loading buffer platform 122, a chip fixture loading detector 123, and a loading gripper robot 124, all electrically connected to the controller; the chip fixture feeding track is connected to the chip fixture conveying track and the pick-and-place machine, and a chip fixture loading detection point is set at a preset position on the chip fixture feeding track; the chip fixture loading detector is located above / below the chip fixture loading detection point and transmits the chip fixture loading detection record data to the controller; the chip fixture loading buffer platform is a chip fixture buffer area located at a preset interval next to the chip fixture feeding track; the loading gripper robot is located above the chip fixture feeding track and picks up the inspected chip fixture and places it on the chip fixture loading buffer platform.

[0062] The unloading machine 103 includes: a chip fixture unloading track 131, a chip fixture unloading buffer platform 132, and an unloading gripping robot 133, all of which are electrically connected to the controller; the chip fixture unloading track is connected to the pick and place machine to receive chip fixtures that have been placed; the chip fixture unloading buffer platform is a chip fixture buffer area located at a preset interval next to the chip fixture unloading track; the unloading gripping robot is located above the chip fixture unloading track and picks up the chip fixtures that have been placed and places them on the chip fixture unloading buffer platform 134.

[0063] In some optional embodiments, the chip fixture loading detector 112 includes: a bottom automatic scanning mechanism and a detection CCD moving module. A CCD (Charge Coupled Device) is a detection element that uses the amount of charge to represent the signal magnitude and transmits signals via coupling. It has a series of advantages such as self-scanning, wide sensing spectrum range, low distortion, small size, light weight, low system noise, low power consumption, long lifespan, and high reliability, and can be made into a highly integrated assembly. It can convert light into electrical charge and store and transfer the charge, and can also retrieve the stored charge to change the voltage. Therefore, it is an ideal CCD camera element, and CCD cameras constructed with it are widely used due to their small size, light weight, insensitivity to magnetic fields, and resistance to vibration and impact.

[0064] The bottom automatic scanning mechanism is located below the chip fixture loading and detection point and is electrically connected to the controller; it scans the QR code on the bottom surface of the chip fixture, records the data of the chip fixture, and transmits it to the controller.

[0065] The detection CCD moving module is set above the chip fixture loading and detection point and is electrically connected to the controller; it automatically takes pictures of the chip fixture and compares the data with the controller to determine whether the chip fixture is qualified.

[0066] In some optional embodiments, the loading machine 102 further includes: a non-qualified chip fixture buffer platform 301, which is a non-qualified chip fixture buffer area located at a preset interval position next to the chip fixture feeding track; the gripper of the loading gripper is equipped with a test CCD moving module, which automatically takes pictures of the chip fixture, compares them with preset chip fixture data, and places the chip fixture on the chip fixture loading buffer platform when it is determined to be qualified, and places it on the non-qualified chip fixture buffer platform when it is determined to be unqualified.

[0067] In some optional embodiments, the device for automatic chip assembly with pressure holding and loading / unloading further includes an ion bar 401, located at a preset position next to or above the chip fixture conveying track, chip fixture feeding track, and chip fixture discharging track, electrically connected to the controller, to eliminate static electricity on the chips in the chip fixture during operation. The ion bar is a dedicated fixed static electricity elimination device, belonging to the category of bar-type static eliminators. It features easy installation, safe and stable operation, and rapid static electricity elimination.

[0068] In some optional embodiments, the device for automatic chip assembly with pressure holding and loading / unloading further includes: a cap removal machine, located between the loading machine and the unloading machine, electrically connected to the controller, comprising: a cap removal mechanism, a cap removal robot, a cap detector, a cap hopper, and a chip unloading conveyor track; the cap removal mechanism is coupled to the chip fixture feeding track and removes the caps from the chip products on the chip fixture feeding track; the cap removal robot is positioned at a preset corresponding position of the cap removal mechanism and picks up the caps to the cap detector; the cap detector is positioned at a preset corresponding position of the cap removal robot, detects the caps, transmits the data to the controller, and controls the push of the caps into the cap hopper; the cap hopper is positioned at a preset corresponding position of the cap removal robot and stores the caps; the chip unloading conveyor track is positioned at a preset corresponding position of the cap removal robot, receives chip products for detection, transmits the data to the controller, and controls the conveying of the chip products to the unloading machine.

[0069] Optionally, the loading fixture is conveyed to the loading machine conveyor belt by the pressure holding machine. After the fixture is positioned, the loading robot automatically picks up the fixture and places it on the loading fixture buffer platform. Once the buffer platform is full, the robot automatically transfers fixtures that are photographed as NG (not working) to the NG area for storage. When a large reflow fixture appears on the electroplating platform, the robot photographs the large reflow fixture, the system calculates the origin of the large reflow fixture, and the robot automatically picks up the loading fixture from the loading buffer platform and transfers it to the large reflow fixture. After the large reflow fixture has been electroplated, the unloading robot's CCD photographs the large reflow fixture, the system automatically calculates the origin, and the robot automatically picks up the fixture and places it on the unloading fixture buffer platform. When the robot is idle, it picks up the fixture from the unloading buffer platform and places it on the unloading conveyor belt, where it is collected by the unloading machine.

[0070] In some optional embodiments, a method for holding pressure and unloading chips in automated chip assembly is provided, implemented in the above-described apparatus for holding pressure and unloading chips in automated assembly. The method includes:

[0071] Step 801: Receive the chip fixture sent by the upper board machine and control its transport to the chip fixture transport track.

[0072] Step 802: When the chip fixture moves to the chip fixture detection and recording position, control the chip fixture detector to record the chip fixture detection and recording data and transmit it to the controller.

[0073] Step 803: When the chip fixture moves to the holding point, the holding head of the holding mechanism presses onto the chip on the chip fixture according to the preset orientation and preset pressure.

[0074] Step 804: Control the chip fixture conveying track to transport the chip fixture to the chip fixture feeding track. After positioning, control the loading and gripping robot to inspect the chip fixture and place it on the chip fixture loading buffer platform. When the chip placement instruction is received, control the loading and gripping robot to transfer the corresponding chip fixture from the chip fixture loading buffer platform to the chip placement machine.

[0075] Step 805: Upon receiving the instruction that chip mounting is complete, control the unloading gripper to transfer the completed chip fixture to the chip fixture unloading buffer platform; control the unloading gripper to transfer the chip fixture from the chip fixture unloading buffer platform to the chip fixture output track.

[0076] In some optional embodiments, the control chip fixture detector records the detection data of the chip fixture and transmits it to the controller, as follows:

[0077] Step 901: Control the bottom automatic scanning mechanism in the chip fixture detector to scan the QR code on the bottom surface of the chip fixture, record the data of the chip fixture, and transmit it to the controller.

[0078] Step 902: Control the detection CCD moving module in the chip fixture detector to automatically take pictures of the chip fixture, and compare the data with the controller in the data transmission to determine whether the chip fixture is qualified.

[0079] In some optional embodiments, the method for automatic chip assembly with pressure holding during loading and unloading further includes:

[0080] Step 1001: Control the gripper of the feeding machine to attach the test CCD moving module to automatically take pictures of the chip fixture and compare them with the preset chip fixture data for judgment.

[0081] Step 1002: If the chip fixture is deemed qualified, place it on the chip fixture loading buffer platform.

[0082] Step 1003: If the chip fixture is determined to be unqualified, place it in the unqualified chip fixture cache platform.

[0083] In some optional embodiments, the method for automatic chip assembly with pressure holding during loading and unloading further includes:

[0084] A cap removal machine is installed between the feeding machine and the unloading machine;

[0085] Step 1101: Control the cap removal mechanism docked with the chip fixture feeding track to remove the caps from the chip products that are already covered on the chip fixture feeding track.

[0086] Step 1102: Control the cap removal robot of the cap removal machine to inspect the chip product, transmit the data to the controller, and control the chip product to be transported to the chip unloading conveyor track of the unloading machine.

[0087] In some optional embodiments, the method for automatic chip assembly with pressure holding during loading and unloading further includes:

[0088] Step 1201: Control the cap removal robot to pick up the cap plate to be removed and place it in the cap plate detector;

[0089] Step 1202: Control the cover plate detector to be in the preset corresponding position of the cover removal robot, detect the cover plate, transmit the data to the controller, and control the push of the cover plate into the cover plate hopper.

[0090] Optionally, the chip fixture conveyor track connects to the loading machine to receive products that have already been covered. After the product arrives, the work platform removes the cover. After the work platform removes the cover, a robotic arm picks up the cover and places it into the cover conveyor track for barcode scanning. After scanning, it is pushed into the cover hopper. After the work platform removes the cover, a robotic arm picks up the PCBA and places it into the PCBA conveyor track for barcode scanning. After scanning, the conveyor track transports the PCBA to the unloading machine. After the work platform removes the cover, the chip fixture conveyor track transports the fixture to the barcode scanning area for barcode scanning. After scanning, it is pushed into the fixture hopper.

[0091] The embodiments disclosed herein are preferred embodiments, but are not limited thereto. Those skilled in the art can readily grasp the spirit of the present invention based on the above embodiments and make different extensions and variations, but as long as they do not depart from the spirit of the present invention, they are all within the protection scope of the present invention.

Claims

1. A device for pressure holding and unloading in automatic chip assembly, characterized in that, include: Pressure holding machine, feeding machine, unloading machine, and controller; among which, The pressure holding machine includes: a chip fixture conveying track, a chip fixture detector, a pressure holding mechanism, and a pressure holding automatic force measuring mechanism, all electrically connected to the controller; the chip fixture conveying track extends from the loading machine that feeds the chip fixture towards the loading machine, and chip fixture detection recording points and pressure holding points are set at preset positions on the chip fixture conveying track; the chip fixture detector is set above / below the chip fixture detection recording point and transmits the detection recording data of the chip fixture to the controller; the pressure holding mechanism is set above / below the pressure holding point and performs pressure holding on the chip fixture conveyed thereto; the pressure holding automatic force measuring mechanism is set on both sides of the pressure holding point to ensure that a constant pressure is applied to the chip in the chip fixture; The loading machine includes: a chip fixture feeding track, a chip fixture loading buffer platform, a chip fixture loading detector, and a loading gripper, all electrically connected to the controller; the chip fixture feeding track is connected to the chip fixture conveying track and the pick-and-place machine, and a chip fixture loading detection point is set at a preset position on the chip fixture feeding track; the chip fixture loading detector is located above / below the chip fixture loading detection point, and transmits the loading detection record data of the chip fixture to the controller; the chip fixture loading buffer platform is a chip fixture buffer area located at a preset interval next to the chip fixture feeding track; the loading gripper is located above the chip fixture feeding track, and grips the inspected chip fixture and places it on the chip fixture loading buffer platform; The unloading machine includes: a chip fixture ejection track, a chip fixture unloading buffer platform, and an unloading gripping robot, all electrically connected to the controller; the chip fixture ejection track is connected to the pick-and-place machine to receive the chip fixtures after placement; the chip fixture unloading buffer platform is a chip fixture buffer area located at a preset interval next to the chip fixture ejection track; the unloading gripping robot is located above the chip fixture ejection track and picks up the chip fixtures after placement and places them on the chip fixture unloading buffer platform.

2. The device for holding pressure and unloading chips in automatic assembly according to claim 1, characterized in that, The chip fixture detector includes: a bottom automatic scanning mechanism and a detection CCD moving module; The bottom automatic scanning mechanism is located below the chip fixture loading and detection point and is electrically connected to the controller; it scans the QR code on the bottom surface of the chip fixture, records the data of the chip fixture, and transmits it to the controller. The detection CCD moving module is located above the chip fixture loading detection point and is electrically connected to the controller; it automatically takes pictures of the chip fixture and compares the data transmitted to the controller to determine whether the chip fixture is qualified.

3. The device for holding pressure and unloading chips in automatic assembly according to claim 1, characterized in that, The feeding machine further includes: a non-qualified chip fixture buffer platform, which is a non-qualified chip fixture buffer area located at a preset interval next to the chip fixture feeding track; the gripper of the feeding gripper is equipped with a test CCD moving module, which automatically takes pictures of the chip fixture, compares them with preset chip fixture data, and places the chip fixture on the chip fixture feeding buffer platform when it is determined to be qualified, and places it on the non-qualified chip fixture buffer platform when it is determined to be unqualified.

4. The device for holding pressure and unloading chips in automatic assembly according to claim 1, characterized in that, Also includes: An ionizing air bar is located at a predetermined position next to or above the chip fixture conveying track, chip fixture feeding track and chip fixture discharging track, and is electrically connected to the controller to eliminate static electricity on the chips in the chip fixture during operation.

5. The device for holding pressure and unloading chips in automatic assembly according to claim 1, characterized in that, It also includes: a cap removal machine, located between the loading machine and the unloading machine, electrically connected to the controller, comprising: a cap removal mechanism, a cap removal robot, a cap detector, a cap hopper, and a chip unloading conveyor track; the cap removal mechanism is coupled to the chip fixture feeding track and removes the caps from the chip products on the chip fixture feeding track; the cap removal robot is positioned at a preset corresponding position of the cap removal mechanism and picks up the caps to the cap detector; the cap detector is positioned at a preset corresponding position of the cap removal robot, detects the caps, transmits the data to the controller, and controls the pushing of the caps into the cap hopper; the cap hopper is positioned at a preset corresponding position of the cap removal robot and stores the caps; the chip unloading conveyor track is positioned at a preset corresponding position of the cap removal robot, receives the chip products for detection, transmits the data to the controller, and controls the conveying of the chip products to the unloading machine.

6. A method for pressure holding and unloading in automated chip assembly, characterized in that, A device for pressure holding and unloading in an automated chip assembly process includes: a pressure holding machine, a loading machine, an unloading machine, and a controller; wherein, The pressure holding machine includes: a chip fixture conveying track, a chip fixture detector, a pressure holding mechanism, and a pressure holding automatic force measuring mechanism, all electrically connected to the controller; the chip fixture conveying track extends from the loading machine that feeds the chip fixture towards the loading machine, and chip fixture detection recording points and pressure holding points are set at preset positions on the chip fixture conveying track; the chip fixture detector is set above / below the chip fixture detection recording point and transmits the detection recording data of the chip fixture to the controller; the pressure holding mechanism is set above / below the pressure holding point and performs pressure holding on the chip fixture conveyed thereto; the pressure holding automatic force measuring mechanism is set on both sides of the pressure holding point to ensure that a constant pressure is applied to the chip in the chip fixture; The loading machine includes: a chip fixture feeding track, a chip fixture loading buffer platform, a chip fixture loading detector, and a loading gripper, all electrically connected to the controller; the chip fixture feeding track is connected to the chip fixture conveying track and the pick-and-place machine, and a chip fixture loading detection point is set at a preset position on the chip fixture feeding track; the chip fixture loading detector is located above / below the chip fixture loading detection point, and transmits the loading detection record data of the chip fixture to the controller; the chip fixture loading buffer platform is a chip fixture buffer area located at a preset interval next to the chip fixture feeding track; the loading gripper is located above the chip fixture feeding track, and grips the inspected chip fixture and places it on the chip fixture loading buffer platform; The unloading machine includes: a chip fixture ejection track, a chip fixture unloading buffer platform, and an unloading gripper, all electrically connected to the controller; the chip fixture ejection track is connected to the pick-and-place machine and receives the chip fixtures after placement; the chip fixture unloading buffer platform is a chip fixture buffer area located at a preset interval next to the chip fixture ejection track; the unloading gripper is located above the chip fixture ejection track and grips the chip fixtures after placement and places them on the chip fixture unloading buffer platform. The method includes: Receive the chip fixture fed in by the upper board machine, and control its transport to the chip fixture transport track; When the chip fixture moves to the chip fixture detection recording position, the chip fixture detector is controlled to record the chip fixture detection recording data and transmit it to the controller; When the chip fixture moves to the pressure holding point, the pressure holding head of the pressure holding mechanism is controlled to press the chip on the chip fixture according to a preset orientation and a preset pressure. The chip fixture is transported to the chip fixture feeding track by the control chip fixture conveyor track. After positioning, the loading and gripping robot is controlled to inspect the chip fixture and place it on the chip fixture loading buffer platform. When a placement instruction is received, the loading and gripping robot is controlled to transfer the corresponding chip fixture from the chip fixture loading buffer platform to the placement machine. Upon receiving the instruction that the chip mounting is complete, the robot arm is controlled to transfer the completed chip fixture to the chip fixture unloading buffer platform; the robot arm is then controlled to transfer the chip fixture from the chip fixture unloading buffer platform to the chip fixture discharge track.

7. The method for holding pressure and unloading materials in automatic chip assembly according to claim 6, characterized in that, The chip fixture detector is controlled to record the detection data of the chip fixture and transmit it to the controller, as follows: The bottom automatic scanning mechanism in the chip fixture detector is controlled to scan the QR code on the bottom surface of the chip fixture, record the data of the chip fixture, and transmit it to the controller; The detection CCD moving module in the chip fixture detector is controlled to automatically take pictures of the chip fixture, and the controller compares the data during transmission to determine whether the chip fixture is qualified.

8. The method for holding pressure and unloading materials in automatic chip assembly according to claim 6, characterized in that, Also includes: The gripper of the feeding and grasping robot of the feeding machine is equipped with a test CCD moving module to automatically take pictures of the chip fixture and compare them with the preset chip fixture data for judgment. When the chip fixture is determined to be qualified, it is placed on the chip fixture loading buffer platform; If the chip fixture is determined to be unqualified, it is placed in the unqualified chip fixture cache platform.

9. The method for holding pressure and unloading materials in automatic chip assembly according to claim 6, characterized in that, Also includes: A cap removal machine is installed between the feeding machine and the unloading machine; Control the cap removal mechanism docked to the chip fixture feeding track to remove the caps from the chip products that are covered on the chip fixture feeding track; The uncapping robot of the uncapping machine is controlled to inspect the chip product, transmit the data to the controller, and control the chip product to be transported to the chip unloading conveyor track of the unloading machine.

10. The method for holding pressure and unloading materials in automatic chip assembly according to claim 9, characterized in that, Also includes: Control the cap removal robot to pick up the capped cover and place it into the cover detector; The cover plate detector is controlled to be in a preset corresponding position of the cover removal robot, the detection of the cover plate transmits the data to the controller, and the controller pushes the cover plate into the cover plate hopper.

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