Heating assembly, heating vessel and cooking appliance

Abstract

The application discloses a heating assembly, a heating container and a cooking appliance. The heating assembly comprises a heating layer, a first inorganic layer and a second inorganic layer, wherein one side of the heating layer is connected with the first inorganic layer, the other side of the heating layer is connected with the second inorganic layer, the heat generated by the heating layer is transmitted through the first inorganic layer and the second inorganic layer, and the absolute value of the difference between the absolute value of the thermal expansion coefficient of the first inorganic layer and the absolute value of the thermal expansion coefficient of the second inorganic layer is less than 4x10 ‑6 / ℃ in the temperature range of 0℃-350℃. The difference between the thermal expansion coefficients of the first inorganic layer and the second inorganic layer is small, which is not easy to cause the heating assembly to crack during the heating process, can effectively prolong the service life of the heating assembly, can improve the safety factor, and the heating assembly can be used at a higher power, can be quickly heated, and thus the user experience effect is improved.

Description

Technical Field

[0001] This invention relates to the field of electromagnetic heating technology, specifically to heating elements, heating containers, and cooking appliances. Background Technology

[0002] With the improvement of living standards, people are paying more and more attention to clothing, food, housing, and transportation. Their demands for daily household appliances, the quality of their living environment, and hygiene are constantly increasing, and healthy eating has become an important issue closely related to human health. In terms of healthy eating, inorganic materials such as glass, ceramics, and quartz are highly trusted by consumers due to their excellent health properties. Products such as ceramic stew pots, ceramic inner pots, all-glass kettles, and quartz teapots are very popular in the market.

[0003] To integrate electromagnetic heating technology with products made of glass, ceramics, and other materials, current mature technologies involve applying a silver film or printing a silver paste layer onto the glass or ceramic surface, or spraying an electromagnetic heating layer onto the bottom outer surface of substrates such as glass kettles. However, materials like glass, ceramics, and quartz have low thermal conductivity. Applying these materials to everyday products results in slow heat transfer, a significant portion of the heat generated by electromagnetic heating is wasted, leading to low thermal efficiency, high energy consumption, relatively low power output, slow heating speed, and a poor user experience.

[0004] Current heating elements and heating appliances have certain defects and shortcomings and still need to be improved. Summary of the Invention

[0005] This invention is based on the inventor's discoveries and understanding of the following facts and problems:

[0006] Materials such as glass, ceramics, and quartz have low thermal conductivity. When these materials are used in everyday products, heat transfer is slow, and a large portion of the heat generated by electromagnetic heating is wasted, resulting in low thermal efficiency, high energy consumption, and a poor user experience. The inventors discovered that by setting up a multi-layered heating element and ensuring that the difference in the coefficients of thermal expansion between the inorganic layers on both sides of the heating element is within a certain range, product performance can be improved and the user experience enhanced.

[0007] In view of this, in one aspect of the present invention, a heating component is provided. The heating component includes: a heating layer, a first inorganic layer, and a second inorganic layer, wherein one side of the heating layer is connected to the first inorganic layer, and the other side of the heating layer is connected to the second inorganic layer. The heat generated by the heating layer is transferred through the first inorganic layer and the second inorganic layer. Furthermore, within a temperature range of 0℃ to 350℃, the absolute value of the difference between the absolute values ​​of the thermal expansion coefficients of the first and second inorganic layers is less than 4 × 10⁻⁶. -6 / ℃. The difference in thermal expansion coefficients between the first and second inorganic layers is small, which reduces the likelihood of cracking of the heating element during heating, effectively extending its service life and improving safety. Furthermore, the heating element can operate at higher power and heat up quickly, thus enhancing the user experience.

[0008] According to an embodiment of the present invention, the coefficient of thermal expansion of the second inorganic layer is greater than that of the first inorganic layer, wherein the first inorganic layer and the second inorganic layer satisfy at least one of the following conditions: the rate at which heat generated by the heating layer is transferred to the first inorganic layer is greater than the rate at which it is transferred to the second inorganic layer; the heating component includes a heating surface, and the second inorganic layer is disposed away from the heating surface; the vertical heat transfer distance of heat generated by the heating layer in the first inorganic layer is less than the vertical heat transfer distance in the second inorganic layer. Therefore, the risk of cracking of the first and second inorganic layers due to internal stress can be reduced.

[0009] According to an embodiment of the present invention, the first surface of the first inorganic layer facing away from the heating layer is the heating surface, wherein the first inorganic layer and the second inorganic layer satisfy at least one of the following conditions: the thickness of the first inorganic layer is less than or equal to the thickness of the second inorganic layer; the thermal conductivity of the second inorganic layer is less than the thermal conductivity of the first inorganic layer. This improves the heat transfer efficiency from the heating layer to the heating surface, reduces noise during operation of the heating assembly, increases the thermal resistance of the second inorganic layer, and reduces the heat transfer efficiency from the heating layer to the second inorganic layer.

[0010] According to an embodiment of the present invention, the first inorganic layer and the second inorganic layer are arranged substantially parallel to each other, and the opposing surfaces of the first inorganic layer and the second inorganic layer are spaced apart. The heating layer is disposed in the interval defined by the first inorganic layer and the second inorganic layer, and the heating layer is connected to the first inorganic layer and the second inorganic layer.

[0011] According to an embodiment of the present invention, the heating component satisfies at least one of the following conditions: the thermal conductivity of the first inorganic layer and the second inorganic layer is 1-2 W; and the coefficient of thermal expansion of the first inorganic layer is -1 × 10⁻⁶ W / m² within a temperature range of 0°C to 350°C. -6 / ℃~5×10 -6 / ℃, the thermal expansion coefficient of the second inorganic layer ranges from -1×10⁻¹⁰. -6 / ℃~5×10 -6 / ℃.

[0012] According to an embodiment of the present invention, both the first inorganic layer and the second inorganic layer are separately prepared flat plates, wherein the flatness tolerance of both the first inorganic layer and the second inorganic layer is less than or equal to 2 mm, and the first inorganic layer and the second inorganic layer are connected through the heating layer. Compared with coating structures obtained by spraying, sintering glazes, etc., the use of flat plates for the first and second inorganic layers can obtain a structural component with a dense structure and high mechanical strength, thereby improving mechanical strength and reducing noise during the operation of the heating component.

[0013] According to an embodiment of the present invention, the heating layer is connected to the first inorganic layer and / or the second inorganic layer by sintering and curing, wherein the sintering and curing temperature of the heating layer is lower than the softening temperature of the first inorganic layer and / or the second inorganic layer. This reduces the deformation of the first and second inorganic layers during the sintering and curing process.

[0014] According to an embodiment of the present invention, the heating layer is connected to the first inorganic layer and / or the second inorganic layer via a heat-curable adhesive layer, wherein the heat-curing temperature of the adhesive layer is lower than the softening temperature of the first inorganic layer and / or the second inorganic layer.

[0015] According to an embodiment of the present invention, the heating layer is connected to one of the first inorganic layer and the second inorganic layer by the sintering and curing, and the heating layer is connected to the other of the first inorganic layer and the second inorganic layer by the adhesive layer. This improves the bonding strength between the heating layer and the first and second inorganic layers.

[0016] According to an embodiment of the present invention, the thickness of the first inorganic layer is less than or equal to the thickness of the second inorganic layer, and the heating layer is disposed on the first inorganic layer by sintering and curing, and the heating layer is connected to the second inorganic layer by the adhesive layer. This increases the thermal resistance between the heating layer and the second inorganic layer, reduces heat transfer to the second inorganic layer, improves the heat transfer efficiency to the heating surface, and thus improves heat utilization.

[0017] According to an embodiment of the present invention, the heating layer includes a transition sublayer and a heating sublayer, wherein the heating sublayer is connected to the first inorganic layer and / or the second inorganic layer through the transition sublayer. This improves the bonding strength between the heating layer and the first inorganic layer and / or the second inorganic layer; the transition sublayer between the heating sublayer and the first inorganic layer and / or the second inorganic layer increases thermal resistance, reduces heat conduction velocity, and reduces noise; furthermore, it improves the heating efficiency of the heating sublayer.

[0018] According to an embodiment of the present invention, the thickness of the first inorganic layer is less than or equal to the thickness of the second inorganic layer, the heating sublayer is connected to the first inorganic layer through the transition sublayer, and the heating sublayer is connected to the second inorganic layer through an adhesive layer, wherein the thickness of the transition sublayer is less than the thickness of the adhesive layer, and the thickness of the adhesive layer is greater than the thickness of the heating layer.

[0019] According to an embodiment of the present invention, the heating component satisfies at least one of the following conditions: the transition sublayer and the heating sublayer are inter-embedded and connected at the contact interface; the transition sublayer is inter-embedded and connected to the first inorganic layer and / or the second inorganic layer at the contact interface.

[0020] According to an embodiment of the present invention, the heating component satisfies at least one of the following conditions: the thickness of the transition sublayer is less than the thickness of the heating sublayer; the heating layer comprises inorganic non-metals and metals, wherein in at least one region of the heating layer, the content of the inorganic non-metals in the transition sublayer per unit cross-sectional area is higher than the content of the inorganic non-metals in the heating sublayer per unit cross-sectional area; the heating layer comprises inorganic non-metals and metals, wherein in at least one region of the heating layer, the content of the metals in the transition sublayer per unit cross-sectional area is less than the content of the metals in the heating sublayer per unit cross-sectional area.

[0021] According to an embodiment of the present invention, the metal is a weakly magnetic metal material, the relative permeability of the weakly magnetic metal material is less than 1, wherein the weakly magnetic metal material includes at least one of silver, copper, and aluminum.

[0022] According to an embodiment of the present invention, the inorganic non-metal includes at least one of silicon oxide, aluminum oxide, bismuth oxide, magnesium oxide, and potassium oxide; in the heating layer, the content of the inorganic non-metal is 10-30% by mass percentage, and the content of the weakly magnetic metal material is 60-90%.

[0023] According to an embodiment of the present invention, the materials of the first inorganic layer and the second inorganic layer each independently include at least one of glass, ceramic and quartz, wherein the glass includes at least one of borosilicate glass, microcrystalline glass and alkali-free glass.

[0024] In another aspect of the invention, a heating container is provided, the heating container including a bottom and a sidewall, the bottom being connected to the sidewall and forming a receiving space, wherein the bottom includes the heating component described above, and a first inorganic layer of the heating component is located on the side facing the receiving space.

[0025] According to an embodiment of the present invention, there is a certain distance between the heating layer of the heating component and the sidewall.

[0026] According to an embodiment of the present invention, the bottom is composed of the heating element described above, or the bottom includes an annular first portion and the heating element described above, wherein the first portion is connected to the sidewall, the heating element is disposed in the area defined by the first portion, and the first portion is connected to the heating element. Thus, the heating container possesses all the features and advantages of the heating element described above, which will not be repeated here. In summary, the bottom of the heating container includes the heating element described above, and the difference in the coefficients of thermal expansion between the first inorganic layer and the second inorganic layer is small. During heating, the heating container is less prone to cracking, effectively extending its service life. Furthermore, it can be used with high heating power, effectively reducing heating time, and offers a high safety factor and high thermal efficiency.

[0027] In another aspect, the present invention provides a cooking appliance that includes the heating container described above, which will not be repeated here.

[0028] According to an embodiment of the present invention, the cooking appliance further includes a heating base, the heating base including a functional module that enables the heating element to generate heat. Thus, the cooking appliance possesses all the features and advantages of the heating container described above, which will not be repeated here. In summary, the cooking appliance exhibits excellent performance. Attached Figure Description

[0029] Figure 1 A schematic diagram of the structure of a heating component according to an embodiment of the present invention is shown;

[0030] Figure 2 A schematic diagram of the structure of a heating component according to an embodiment of the present invention is shown;

[0031] Figure 3 A schematic diagram of the structure of a heating component according to an embodiment of the present invention is shown;

[0032] Figure 4 A schematic diagram of the structure of a heating component according to an embodiment of the present invention is shown;

[0033] Figure 5 A schematic diagram of the structure of a heating container in the prior art is shown;

[0034] Figure 6 A schematic diagram of the structure of a heating container according to an embodiment of the present invention is shown;

[0035] Figure 7 A schematic diagram of the structure of a heating container according to an embodiment of the present invention is shown;

[0036] Figure 8 A schematic diagram of the structure of a cooking appliance according to an embodiment of the present invention is shown. Detailed Implementation

[0037] Embodiments of the present invention are described in detail below. Examples of these embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals denote the same or similar elements or elements having the same or similar functions throughout. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain the present invention, and should not be construed as limiting the present invention.

[0038] As mentioned earlier, when using materials such as glass, ceramics, and quartz in daily-use products, an electromagnetic heating layer is typically formed at the bottom of the product to integrate these materials with electromagnetic heating technology. To maintain the strength of products like ceramic stew pots, all-glass kettles, and quartz teapots, the bottom is usually made relatively thick. After the electromagnetic heating layer is formed, the heat generated needs to be conducted through the thick bottom to the internal space of the product. Because glass, ceramics, and quartz have low thermal conductivity, and the bottom formed by these materials is thick, heat transfer is slow, resulting in significant waste of the heat generated by electromagnetic heating, high energy consumption, and low thermal efficiency. Furthermore, due to the thick bottom, using high heating power can easily cause heat to accumulate at the bottom, and if the bottom temperature exceeds the tolerance temperature, it can lead to cracking and other defects. Therefore, only relatively low power can be used, resulting in slower heating speeds, longer heating times, and a poor user experience. Optimizing the heating process by reducing the thickness of materials like glass and ceramics is difficult to achieve in daily-use products. On the one hand, strength is an important parameter to consider in daily consumer products. On the other hand, simply reducing the thickness of the bottom of glass and other utensils will lead to a decrease in product strength and ultimately affect the product's service life.

[0039] The present invention aims to at least alleviate or even solve at least one of the above-mentioned technical problems to some extent.

[0040] In one aspect, the present invention provides a heating component. (See reference...) Figure 1 The heating element includes a heating layer 200, a first inorganic layer 100, and a second inorganic layer 300. One side of the heating layer 200 is connected to the first inorganic layer 100, and the other side of the heating layer 200 is connected to the second inorganic layer 300. The heat generated by the heating layer 200 is transferred through the first inorganic layer 100 and the second inorganic layer 300. Furthermore, within a temperature range of 0°C to 350°C, the absolute value of the difference between the absolute values ​​of the thermal expansion coefficients of the first inorganic layer 100 and the second inorganic layer 300 is less than 4 × 10⁻⁶. -6 / ℃. Therefore, within a temperature range of 0 to 350 degrees Celsius, the difference between the thermal expansion coefficients of the first and second inorganic layers is small. When the heat generated by the heating layer is transferred through the first and second inorganic layers, cracking is less likely to occur, which can effectively extend the service life of the heating component and improve the safety factor. Furthermore, the heating component can be used at higher power and can heat up quickly, thereby improving the user experience.

[0041] It should be noted that, according to some embodiments of the present invention, the area of ​​the heating layer in the present invention can be the same as (or approximately the same as) the area of ​​the first inorganic layer or the second inorganic layer; however, in actual manufacturing, it is difficult to ensure that the area of ​​the heating layer is exactly the same as the area of ​​the first inorganic layer and the second inorganic layer. Figure 1 As shown. According to other embodiments of the present invention, refer to... Figures 2 to 4 The area of ​​the heating layer can also be smaller than the area of ​​the first inorganic layer, and the area of ​​the heating layer can be smaller than the area of ​​the second inorganic layer. Therefore, when the heating element and the heating container are combined by welding (fusion welding), the area of ​​the heating layer is smaller than the areas of the first and second inorganic layers. After the first and second inorganic layers and the heating container soften, it will not adversely affect the heating layer, and thus will not affect the use of the final product. Those skilled in the art should understand that regardless of how the heating element is combined with the heating container, after combination, the heating element and the heating container form a sealed space. Specifically, the combination can be... Figure 6 or Figure 7 The example shown can also be other cases. Those skilled in the art can set it up according to the actual situation, as long as it can form a closed space.

[0042] According to some specific embodiments of the present invention, the coefficient of thermal expansion of the second inorganic layer 300 is greater than that of the first inorganic layer 100. Therefore, the first inorganic layer has a smaller coefficient of thermal expansion, allowing it to apply a certain compressive stress to the heating layer and the second inorganic layer during the fabrication or operation of the heating element. This reduces the degree of expansion and deformation of the second inorganic layer, thereby lowering the risk of cracking and reducing production costs. Furthermore, according to some specific embodiments of the present invention, the heat generated by the heating layer 200 is transferred to the first inorganic layer 100 at a greater rate than it is transferred to the second inorganic layer 300. Alternatively, according to other specific embodiments of the present invention, the heating element includes a heating surface, with the second inorganic layer 300 disposed away from the heating surface. Or, according to yet another specific embodiment of the present invention, the vertical heat transfer distance of the heat generated by the heating layer 200 in the first inorganic layer 100 is less than that in the second inorganic layer 300. Therefore, the first inorganic layer, as the primary heat transfer layer, has a smaller coefficient of thermal expansion, which reduces the risk of cracking due to internal stress during heating.

[0043] According to some embodiments of the present invention, the thermal conductivity of the first inorganic layer 100 and the second inorganic layer 300 can each be independently 1-2W, such as 1W, 1.2W, 1.5W, 1.8W, 2W, etc., which is beneficial to improving the heat transfer rate of the heating element.

[0044] According to other embodiments of the present invention, the coefficient of thermal expansion of the first inorganic layer 100 is in the range of -1 × 10⁻⁶. -6 / ℃~5×10 -6 The coefficient of thermal expansion of the second inorganic layer 300 is -1×10⁻¹℃. -6 / ℃~5×10 -6 / ℃. This further reduces the risk of the first and second inorganic layers cracking due to internal stress.

[0045] According to specific embodiments of the present invention, the materials of the first inorganic layer 100 and the second inorganic layer 300 can each independently include at least one of glass, ceramic, and quartz. Therefore, these materials are widely available and can be used in food processing. The first inorganic layer 100 and the second inorganic layer 300 can be composed of the same material. According to some specific embodiments of the present invention, the first inorganic layer 100 and the second inorganic layer 300 can both be ceramic, both be glass (including microcrystalline glass, high borosilicate glass, alkali-free glass, etc.), or both be quartz. The first inorganic layer 100 and the second inorganic layer 300 can also be composed of different materials. According to other embodiments of the present invention, the material of the first inorganic layer 100 is glass (including microcrystalline glass, high borosilicate glass, alkali-free glass, etc.), and the material of the second inorganic layer 300 is ceramic. The above only provides some specific embodiments of the materials of the first and second inorganic layers of the present invention and is not intended to limit the present invention. It should be noted that microcrystalline glass, high borosilicate glass, and alkali-free glass have good high-temperature resistance. Using these glass materials to form the first inorganic layer and / or the second inorganic layer is beneficial to improving the stability of the heating component and has a higher safety factor during use.

[0046] As mentioned earlier, within the temperature range of 0 degrees Celsius to 350 degrees Celsius, the absolute value of the difference between the absolute value of the thermal expansion coefficient of the first inorganic layer 100 and the absolute value of the thermal expansion coefficient of the second inorganic layer 300 is less than 4 × 10⁻⁶. -6 / ℃. When the first and second inorganic layers are made of the same material, their coefficients of thermal expansion are the same, with a difference of zero. However, when the first and second inorganic layers are made of different materials, the absolute value of the difference between their coefficients of thermal expansion is set to be less than 4 × 10⁻⁶. -6 At a temperature of / ℃, the difference in the coefficients of thermal expansion between the first and second inorganic layers is relatively small. This reduces the likelihood of cracking of the heating element during heating, effectively extending its lifespan, improving safety, and enhancing the user experience. The inventors discovered that if the difference in the coefficients of thermal expansion between the first and second inorganic layers is too large, thermal stress in the first and second inorganic layers during use may cause the heating element to crack and fail. According to an embodiment of the present invention, the absolute value of the difference between the absolute value of the coefficient of thermal expansion of the first inorganic layer 100 and the absolute value of the coefficient of thermal expansion of the second inorganic layer 300 can be less than 2 × 10⁻⁶. -6 / ℃, which helps to further extend the service life of the heating components, further improve the safety factor, and make the user experience better.

[0047] According to embodiments of the present invention, when the heating element is applied to a heating container, the heating element can be directly used as the bottom or part of the bottom of the heating container. Therefore, the inorganic layer on the outer side (away from the interior of the heating container and not in contact with the medium to be heated) can be selected according to the appearance requirements of the heating container. For example, when the heating container is a glass pot, one of the first inorganic layer 100 and the second inorganic layer 300 can be made of glass to achieve overall consistency in the appearance of the heating container. The other inorganic layer can be formed of a material with a thermal conductivity slightly greater than that of glass, thereby further improving the heating efficiency of the heating element. In some embodiments of the present invention, the other inorganic layer can be made of a ceramic material.

[0048] According to some specific embodiments of the present invention, reference is made to Figure 1 The first surface 110 of the first inorganic layer 100 facing away from the heating layer 200 is the heating surface, wherein the thickness d1 of the first inorganic layer 100 is less than or equal to the thickness d2 of the second inorganic layer 300. This improves the heat transfer efficiency from the heating layer to the heating surface and reduces noise during the operation of the heating component. It also increases the thermal resistance of the second inorganic layer and reduces the heat transfer efficiency to the second inorganic layer.

[0049] According to some specific embodiments of the present invention, the thickness d1 of the first inorganic layer 100 is no more than 1.5 mm, and can be 0.7 mm, 0.8 mm, 0.9 mm, 1.0 mm, 1.1 mm, 1.2 mm, 1.3 mm, 1.4 mm, 1.5 mm, etc. The thickness of the first inorganic layer is relatively thin, and the heat generated by the heating layer can be quickly conducted to the water, food, etc. being heated through the first inorganic layer. Even if the first inorganic layer is made of glass, ceramic, quartz, etc. with low thermal conductivity, the heat can still be conducted quickly, which is beneficial to improving the heat utilization rate and reducing unnecessary waste. According to other specific embodiments of the present invention, the thickness d1 of the first inorganic layer is 0.01–0.8 mm, and can be 0.01 mm, 0.02 mm, 0.03 mm, 0.04 mm, 0.05 mm, 0.06 mm, 0.07 mm, 0.08 mm, 0.09 mm, 0.1 mm, 0.2 mm, 0.3 mm, 0.4 mm, 0.5 mm, 0.6 mm, 0.7 mm, 0.8 mm, etc., which is beneficial to further improve the heat utilization rate of the heating element and provide a better user experience. The specific thickness of the second inorganic layer is not particularly limited in the present invention; those skilled in the art can design it according to actual conditions, as long as the second inorganic layer can provide a certain strength to the heating element.

[0050] According to other specific embodiments of the present invention, the first surface 110 of the first inorganic layer 100 facing away from the heating layer 200 is the heating surface, and the thermal conductivity of the second inorganic layer 300 is less than that of the first inorganic layer 100. This improves the heat transfer efficiency from the heating layer to the heating surface, reduces noise during the operation of the heating component, and increases the thermal resistance of the second inorganic layer, thereby reducing the heat transfer efficiency from the heating layer to the second inorganic layer.

[0051] refer to Figure 1 The first inorganic layer 100 and the second inorganic layer 300 are arranged substantially parallel to each other, and their opposing surfaces are spaced apart. The heating layer 200 is disposed within the interval defined by the first inorganic layer 100 and the second inorganic layer 300, and is connected to the first inorganic layer 100 and the second inorganic layer 300. It should be noted that "the first and second inorganic layers are substantially parallel" means that during the manufacturing process, it is difficult to ensure that the first and second inorganic layers are absolutely parallel; substantial parallelism is sufficient. This facilitates directional control of heat transfer from the heating layer to the first and second inorganic layers, that is, it facilitates the vertical conduction of heat generated by the heating layer to either the first or second inorganic layer.

[0052] According to an embodiment of the present invention, the first inorganic layer 100 and the second inorganic layer 300 are both separately prepared flat plates, wherein the flatness tolerance of the first inorganic layer 100 and the second inorganic layer 300 is less than or equal to 2 mm, and the first inorganic layer 100 and the second inorganic layer 300 are connected by the heating layer 200. Compared with coating structures obtained by spraying, sintering glazes, etc., the first and second inorganic layers of the present invention, using flat plates, have a dense structure and high mechanical strength. On the one hand, this can improve mechanical strength; on the other hand, it can reduce noise during the operation of the heating component.

[0053] In this invention, the first inorganic layer 100 and the second inorganic layer 300 can be in direct contact with the heating layer 200, such as... Figure 1 As shown. When the bonding force between the first inorganic layer 100, the second inorganic layer 300, and the heating layer 200 in direct contact is relatively poor, a layer structure for improving the bonding force can be provided between the inorganic layer (first inorganic layer 100 and / or second inorganic layer 300) and the heating layer 200. According to an embodiment of the present invention, refer to... Figure 2The heating layer 200 can be connected to the first inorganic layer 100 and / or the second inorganic layer 300 via a heat-curable adhesive layer 400, wherein the heat-curing temperature of the adhesive layer 400 is lower than the softening temperature of the first inorganic layer 100 and / or the second inorganic layer 300. Therefore, the heating layer can be more firmly bonded to the first inorganic layer and / or the second inorganic layer, which is beneficial to improving the stability of the heating component and also improves the uniformity of heat conduction generated by the heating layer. According to some embodiments of the present invention, the adhesive layer 400 is disposed between the first inorganic layer 100 and the heating layer 200, such as... Figure 2 As shown in (a); according to other embodiments of the present invention, the adhesive layer 400 is disposed between the second inorganic layer 300 and the heating layer 200, as shown in (a). Figure 2 As shown in (b); according to some embodiments of the present invention, the adhesive layer 400 may be disposed between the first inorganic layer 100 and the heating layer 200 and between the second inorganic layer 300 and the heating layer 200, as shown in (b); Figure 2 As shown in (c).

[0054] According to other embodiments of the present invention, the heating layer 200 can also be joined with the first inorganic layer 100 and / or the second inorganic layer 300 by sintering and curing, wherein the sintering and curing temperature of the heating layer 200 is lower than the softening temperature of the first inorganic layer 100 and / or the second inorganic layer 300. Thus, the heating layer can be firmly bonded to the first inorganic layer and / or the second inorganic layer, and since the sintering and curing temperature of the heating layer is lower than the softening temperature of the first inorganic layer and / or the second inorganic layer, the first inorganic layer and / or the second inorganic layer will not deform during sintering and curing. It should be noted that when the heating layer is joined with the first inorganic layer and / or the second inorganic layer by sintering and curing, the interface where the heating layer contacts the first inorganic layer and / or the second inorganic layer can be interlocked, rather than a flat interface.

[0055] According to some embodiments of the present invention, the heating layer 200 can be bonded to one of the first inorganic layer 100 and the second inorganic layer 300 by sintering and curing, while the heating layer 200 is bonded to the other of the first inorganic layer 100 and the second inorganic layer 300 by an adhesive layer 400. Specifically, according to some embodiments of the present invention, the heating layer 200 is bonded to the first inorganic layer 100 by the adhesive layer 400, and the heating layer 200 is bonded to the second inorganic layer 300 by sintering and curing; according to other embodiments of the present invention, the heating layer 200 is bonded to the first inorganic layer 100 by sintering and curing, and the heating layer 200 is bonded to the second inorganic layer 300 by the adhesive layer 400. This improves the bonding strength between the heating layer and the first and second inorganic layers, thereby enhancing the stability of the heating component. According to a specific embodiment of the present invention, the first surface 110 of the first inorganic layer 100 is a heating surface, the thickness of the first inorganic layer 100 is less than or equal to the thickness of the second inorganic layer 300, and the heating layer 200 is sintered and solidified on the second surface 120 of the first inorganic layer 100 near the heating layer 200 (i.e., the heating layer 200 is sintered and solidified on the first inorganic layer 100). The heating layer 200 is connected to the second inorganic layer 300 through an adhesive layer 400. This improves the bonding force between the heating layer and the first and second inorganic layers, thereby improving the stability of the heating component; furthermore, it increases the thermal resistance between the heating layer and the second inorganic layer, reduces heat transfer to the second inorganic layer, improves the efficiency of heat transfer to the heating surface, and thus improves heat utilization.

[0056] According to an embodiment of the present invention, the adhesive layer 400 can be made of glass enamel. According to one embodiment of the present invention, the second inorganic layer 300 is connected to the heating layer 200 via the adhesive layer 400. The second inorganic layer is made of glass, the heating layer contains metal, and the adhesive layer can be a silica glass enamel with dispersed metal powder (the material of the metal powder in the adhesive layer can be the same as the metal material contained in the heating layer). This improves the bonding strength between the second inorganic layer and the heating layer; and when the heat generated by the heating layer is transferred to the second inorganic layer through the adhesive layer, the accumulation of heat in the adhesive layer can be reduced, thereby reducing the risk of the adhesive layer or the second inorganic layer detaching. According to another embodiment of the present invention, the adhesive layer can also be made of a high-temperature resistant inorganic adhesive, which can also improve the bonding strength between the inorganic layer and the heating layer.

[0057] According to an embodiment of the present invention, reference Figure 3The heating layer may include a transition sublayer 210 and a heating sublayer 220, wherein the heating sublayer 220 is connected to the first inorganic layer 100 and / or the second inorganic layer 300 through the transition sublayer 210. This improves the bonding strength between the heating sublayer and the first and / or second inorganic layers; the presence of a transition sublayer between the heating sublayer and the first and / or second inorganic layers increases thermal resistance, reduces heat conduction velocity, and lowers noise; furthermore, it improves the heating efficiency of the heating sublayer. According to some specific embodiments of the present invention, such as... Figure 3 As shown in (a), a transition sublayer 210 is provided on the side of the heating sublayer 220 near the first inorganic layer 100, and the heating sublayer can be connected to the first inorganic layer through the transition sublayer; according to other specific embodiments of the present invention, such as Figure 3 As shown in (b), a transition sublayer 210 is provided on the side of the heating sublayer 220 near the second inorganic layer 300, and the heating sublayer can be connected to the second inorganic layer through the transition sublayer; according to some other specific embodiments of the present invention, a transition sublayer 210 is provided between the heating sublayer 220 and the first inorganic layer 100, and a transition sublayer 210 is also provided between the heating sublayer 220 and the second inorganic layer 300, and the heating sublayer can be connected to the first inorganic layer and the second inorganic layer through the transition sublayer.

[0058] According to some specific embodiments of the present invention, the heating sublayer 220 and the transition sublayer 210 are inter-embedded and connected at the contact interface, that is, the interface between the heating sublayer 220 and the transition sublayer 210 is non-planar, thereby improving the bonding force between the heating sublayer and the transition sublayer. According to other specific embodiments of the present invention, the transition sublayer 210 is inter-embedded and connected to the first inorganic layer 100 and / or the second inorganic layer 300 at the contact interface, that is, the interface between the transition sublayer 210 and the first inorganic layer 100 and / or the second inorganic layer 300 is non-planar, thereby improving the bonding force between the transition sublayer and the first inorganic layer and / or the second inorganic layer, reducing the interfacial thermal resistance between the transition sublayer and the first inorganic layer and / or the second inorganic layer, and reducing the risk of cracking of the first inorganic layer and / or the second inorganic layer.

[0059] According to some specific embodiments of the present invention, reference is made to Figure 4 The thickness d3 of the transition sublayer 210 is smaller than the thickness d4 of the heating sublayer 220, thereby improving the heating efficiency. According to other specific embodiments of the present invention, see reference... Figure 4The thickness of the first inorganic layer 100 is less than or equal to the thickness of the second inorganic layer 300. A transition sublayer 210 is provided between the heating sublayer 220 and the first inorganic layer 100. An adhesive layer 400 is provided between the heating sublayer 220 and the second inorganic layer 300. The thickness d3 of the transition sublayer 210 is less than the thickness d5 of the adhesive layer 400, and the thickness d5 of the adhesive layer 400 is greater than the thickness d4 of the heating sublayer 220. This improves the thermal resistance between the heating layer and the second inorganic layer, reduces heat transfer to the second inorganic layer, increases the efficiency of heat transfer to the heating surface, and improves heat utilization.

[0060] According to embodiments of the present invention, the heating layer comprises inorganic non-metals and metals. In at least one region of the heating layer, the content of inorganic non-metals in the transition sublayer per unit cross-sectional area is higher than the content of inorganic non-metals in the heating sublayer per unit cross-sectional area, or the content of metals in the transition sublayer per unit cross-sectional area is lower than the content of metals in the heating sublayer per unit cross-sectional area. This allows thermal resistance to be formed in the transition sublayer, thereby reducing noise. It should be noted that the terms "transition sublayer per unit cross-sectional area" and "heating sublayer per unit cross-sectional area" refer to comparisons under the same cross-sectional area. That is, in at least one region of the heating layer, for transition sublayers and heating sublayers of the same cross-sectional area, the content of inorganic non-metals in the transition sublayer is higher than the content of inorganic non-metals in the heating sublayer, or for transition sublayers and heating sublayers of the same cross-sectional area, the content of metals in the transition sublayer is lower than the content of metals in the heating sublayer.

[0061] According to embodiments of the present invention, the metal in the heating layer is a weakly magnetic metal material with a relative permeability of less than 1. Therefore, the metal in the heating layer can induce a magnetic field to generate eddy currents for heating. According to some specific embodiments of the present invention, the weakly magnetic metal material in the heating layer may include at least one of silver, copper, and aluminum, thereby improving the overall performance of the heating component.

[0062] According to an embodiment of the present invention, the inorganic non-metallic material in the heating layer may include at least one of silicon oxide, aluminum oxide, bismuth oxide, magnesium oxide, and potassium oxide; the content of inorganic non-metallic material in the heating layer is 10-30% by mass percentage, and the content of weakly magnetic metal material is 60-90%, which is beneficial to further improve the overall performance of the heating component.

[0063] According to a specific embodiment of the present invention, the inorganic material in the heating layer includes bismuth oxide. The heating layer is connected to the first inorganic layer and / or the second inorganic layer via an adhesive layer. The adhesive layer is made of glass glaze, wherein the glass glaze includes bismuth oxide, and the content of bismuth oxide in the glass glaze is higher than the content of bismuth oxide in the heating layer. That is, the bismuth content in the glass glaze is higher than the bismuth content in the heating layer. On the one hand, this can reduce the sintering temperature of the glass glaze, reduce the impact of the glass glaze on the heating layer during the sintering process, and improve the heating efficiency; on the other hand, it can promote the bonding between the adhesive layer and the first inorganic layer. The surfaces corresponding to the inorganic layer and / or the second inorganic layer are colored, with a darker color for the adhesive layer with a higher bismuth content, and a lighter color for the heating layer side with a lower bismuth content when connected to the first and / or second inorganic layers. This difference in color between the heating layer / adhesive layer surfaces corresponding to the first and / or second inorganic layers results in less heat radiation absorption on the lighter side, allowing for faster heat dissipation, and more heat radiation absorption on the darker side, reducing heat transfer to the outside and improving heating efficiency on one side. When the surface of the inorganic layer connected to the heating layer forms a heating surface, the heat generated by the heating layer is mainly transferred through heat conduction. However, for the inorganic layer connected to the adhesive layer, the heat generated by the heating layer is mainly transferred to the outside through heat radiation on that side. The darker color on this side increases the absorption of heat radiation, reducing the impact of heat radiation energy on other external components and minimizing heat transfer to the outside. Furthermore, when heating stops, this side can dissipate heat more quickly, improving the lifespan of the heating assembly. When the inorganic layer connected to the adhesive layer is relatively thick, heat conduction within the inorganic layer can be further reduced, decreasing the rate of heat transfer to the outside. It should be noted that the sintering temperature of the glass enamel also needs to be lower than the softening temperature of the first and / or second inorganic layers to ensure that the heating layer does not cause deformation of the first and / or second inorganic layers when connected to them via the adhesive layer.

[0064] In this invention, the specific method for forming the heating layer 200 is not particularly limited, and those skilled in the art can select and set it according to the actual situation. In some specific embodiments of this invention, the heating layer can be formed by pasting a metal film layer, or by forming a silver film layer by water transfer printing, etc. In other specific embodiments of this invention, the heating layer can also be formed by thermal spraying. In this invention, the specific conditions for thermal spraying are not particularly limited, as long as a uniform and flat film layer can be formed.

[0065] Furthermore, according to an embodiment of the present invention, the resistivity of the heating layer 200 can be 0.01 to 0.1 Ω·mm. 2 / m, for example, can be 0.01Ω·mm 2 / m, 0.04Ω·mm 2 / m, 0.06Ω·mm 2 / m, 0.08Ω·mm 2 / m, 0.1Ω·mm 2 / m, etc. The resistivity of the heating layer of this heating component can be matched with the electromagnetic heating system, enabling the heating component to operate at higher power, with a high safety factor and high thermal efficiency. According to some specific embodiments of the present invention, the resistivity of the electromagnetic heating layer 200 is 0.01~0.03Ω·mm. 2 / m, which can be 0.01Ω·mm 2 / m, 0.02Ω·mm 2 / m, 0.03Ω·mm 2 The heating element, with its multi-layered structure, allows for improved power output. The heating element 200 is located between two inorganic layers, enabling heat dissipation from the heating layer 200 to be transferred to the heating medium (such as water or food) via only one inorganic layer (either the first or second inorganic layer 200). Therefore, compared to traditional methods that form the heating layer on the bottom of glass or ceramic, the heating element of this invention, with its two inorganic layers, can directly serve as the bottom (or part of the bottom) of a glass or ceramic heating container. This reduces heat loss from the heating layer, improves heating efficiency, and reduces noise during heating, while maintaining the overall thickness of the bottom of the heating container. Furthermore, by adjusting the thickness and material composition of the two inorganic layers and the heating layer, the resistivity of the entire heating element can be more flexibly controlled, ensuring it meets the aforementioned requirements. This allows for better matching with electromagnetic heating systems, further improving the performance of the heating element.

[0066] In another aspect of the invention, a heating container is provided, such as... Figure 6 As shown, the heating container 1000 includes a bottom and a sidewall 10. The bottom is connected to the sidewall 10 and forms a receiving space 30. The bottom includes the heating element described above, and the first inorganic layer 100 of the heating element is located on the side facing the receiving space. Thus, the heating container has all the features and advantages of the heating element described above, which will not be repeated here.

[0067] According to some embodiments of the present invention, such as Figure 6 As shown, in the heating container, there can be a certain gap between the heating layer 200 of the heating component and the side wall 10. This helps to further improve the overall performance of the heating container.

[0068] According to some specific embodiments of the present invention, such asFigure 6 As shown, the bottom of the heating container 1000 can be formed by the heating element described above; according to other specific embodiments of the present invention, such as Figure 7 As shown, the bottom of the heating container 1000 may include an annular first part 40 and the aforementioned heating component, wherein the annular first part 40 is connected to the side wall 10, the heating component is disposed in the area defined by the first part 40, and the first part 40 is connected to the heating component.

[0069] In this invention, the sidewall 10 and the annular first part 40 of the heating container 1000 can be made of glass (microcrystalline glass, high borosilicate glass, alkali-free glass, etc.), ceramic, quartz, etc. The specific structure of the heating element and the material, thickness, and other characteristics of each layer have been described and explained in detail above, and will not be repeated here. In this invention, a heating element is used to form the main structure of the bottom of the heating container. The difference in the coefficient of thermal expansion between the first inorganic layer 100 and the second inorganic layer 300 of the heating element is small, allowing the heating container to operate at higher power with a higher safety factor. Furthermore, the sidewall 10 and the heating element, and the annular first part 40 and the heating element, can be joined by welding (fusion welding) or bonding, or other methods. Those skilled in the art can configure the connection according to actual needs, as long as a good connection can be achieved.

[0070] Figure 5 A schematic diagram of a heating container 1000 in the prior art is shown. The side wall 10 and the bottom 20 of the heating container 1000 are integrally formed. The heating layer 200 is disposed on the side of the bottom 20 away from the receiving space 30. The heat generated by the heating layer 200 is conducted to the receiving space 30 through the bottom 20. The bottom 20 and the side wall 10 are made of the same material, such as inorganic materials like ceramic, glass, and quartz. To ensure the strength of the bottom 20, the thickness d6 of the bottom cannot be too thin. Therefore, a large portion of the heat generated by the heating layer 200 cannot be effectively utilized, resulting in low thermal efficiency. In this invention, an independent heating element is fabricated. This heating element has a multi-layered structure, including a first inorganic layer 100, a heating layer 200, and a second inorganic layer 300 stacked together. Because it is an independent heating element, the manufacturing process is no longer limited by the overall structure of the heating container. The thickness of the first inorganic layer near the containment space can be reduced to a certain extent; that is, the first inorganic layer can be relatively thin to conduct heat, while the second inorganic layer can be relatively thick to provide insulation and strength. The overall thickness is adjustable and can adapt to the sidewall or the annular first part, which is beneficial for better bonding between the heating element and the sidewall or the first part. Furthermore, the heating element of this invention forms the main structure of the bottom of the heating container (including but not limited to...). Figure 6 and Figure 7As shown in the example, the strength of the bottom can be provided by the second inorganic layer, while the first inorganic layer can be set to a thinner thickness, that is, the thickness d1 of the first inorganic layer can be less than the thickness d6 of the bottom of the container in the prior art, which is conducive to improving the utilization rate of heat and reducing unnecessary waste.

[0071] According to some specific embodiments of the present invention, the coefficient of thermal expansion of the first inorganic layer 100 of the heating element is less than that of the sidewall 10. The smaller coefficient of thermal expansion of the first inorganic layer allows it to exert a certain compressive stress on the sidewall during operation, thereby reducing the degree of thermal expansion and deformation of the sidewall and lowering the risk of sidewall rupture. According to other specific embodiments of the present invention, the coefficient of thermal expansion of the second inorganic layer 300 of the heating element is greater than or equal to that of the sidewall 10. During operation, the sidewall can exert a certain compressive stress on the second inorganic layer, further reducing the degree of thermal expansion and deformation of the second inorganic layer and lowering the risk of rupture.

[0072] In another aspect, the present invention provides a cooking utensil. (See reference) Figure 8 The cooking appliance includes the heating container 1000 described above. Therefore, the cooking appliance possesses all the features and advantages of the heating container described above, which will not be repeated here. In general, the cooking appliance has a high heat utilization rate and a high safety factor.

[0073] According to embodiments of the present invention, such as Figure 8 As shown, the cooking appliance may further include a heating base 50, which includes a functional module 60 that enables the heating element to generate heat. According to a specific embodiment of the present invention, the functional module 60 may be an electromagnetic induction coil, which can generate a magnetic field to induce eddy currents in the heating layer, thereby generating heat and heating water, food, etc., within the heating space.

[0074] The present invention will be described below through specific embodiments. Those skilled in the art will understand that the following specific embodiments are merely illustrative and do not limit the scope of the invention in any way. Furthermore, in the following embodiments, unless otherwise specified, the materials and equipment used are commercially available. If specific processing conditions and methods are not explicitly described in the later embodiments, conditions and methods known in the art can be used. It should be noted that the coefficients of thermal expansion in the embodiments and comparative examples of the present invention are measured within a temperature range of 0-350 degrees Celsius.

[0075] Example 1

[0076] The heating container comprises a borosilicate glass sidewall and a bottom consisting of a heating element. The first and second inorganic layers are made of the same glass material, with the first inorganic layer having a thickness of 0.5 mm and the second inorganic layer having a thickness of 2.0 mm. The heating layer is a silver film with a thickness of 15 micrometers. The sidewall and the heating element are assembled into a single unit by welding.

[0077] Example 2

[0078] Unlike Example 1, the first inorganic layer is formed of borosilicate glass with a thickness of 0.5 mm, and the coefficient of thermal expansion of the first inorganic layer is 3.3 × 10⁻⁶. -6 / ℃, the second inorganic layer is formed of high-temperature resistant ceramic with a thickness of 2.0 mm, and the coefficient of thermal expansion of the second inorganic layer is 2.5 × 10. -6 / ℃, the difference in the coefficients of thermal expansion between the first inorganic layer and the second inorganic layer is 0.8×10. -6 / ℃.

[0079] Example 3

[0080] Unlike Example 1, the first inorganic layer is formed of borosilicate glass with a thickness of 0.5 mm, and the coefficient of thermal expansion of the first inorganic layer is 3.8 × 10⁻⁶. -6 / ℃, the second inorganic layer is formed of high-temperature resistant ceramic with a thickness of 2.0 mm, and the coefficient of thermal expansion of the second inorganic layer is 2.3 × 10. -6 / ℃, the difference in the coefficients of thermal expansion between the first inorganic layer and the second inorganic layer is 1.5×10. -6 / ℃.

[0081] Example 4

[0082] Unlike Example 1, the first inorganic layer is formed of borosilicate glass with a thickness of 0.5 mm, and the coefficient of thermal expansion of the first inorganic layer is 4.1 × 10⁻⁶. -6 / ℃, the second inorganic layer is formed of high-temperature resistant ceramic with a thickness of 2.0 mm, and the coefficient of thermal expansion of the second inorganic layer is 2.0 × 10. -6 / ℃, the difference in the coefficients of thermal expansion between the first inorganic layer and the second inorganic layer is 2.1×10. -6 / ℃.

[0083] Example 5

[0084] Unlike Example 1, the first inorganic layer is formed of microcrystalline glass with a thickness of 0.5 mm, and the coefficient of thermal expansion of the first inorganic layer is -0.3 × 10⁻⁶. -6 / ℃, the second inorganic layer is formed of high borosilicate glass with a thickness of 2.0 mm, and the coefficient of thermal expansion of the second inorganic layer is 3.3 × 10. -6 / ℃, the absolute value of the difference between the absolute value of the thermal expansion coefficient of the first inorganic layer and the absolute value of the thermal expansion coefficient of the second inorganic layer is 3×10. -6 / ℃.

[0085] Example 6

[0086] Unlike Example 1, the first inorganic layer is formed of high borosilicate glass with a thickness of 2.0 mm, and the coefficient of thermal expansion of the first inorganic layer is 3.3 × 10⁻⁶. -6 / ℃, the second inorganic layer is formed of high-temperature resistant ceramic with a thickness of 1.5mm, and the coefficient of thermal expansion of the second inorganic layer is 2.5×10. -6 / ℃, the difference in the coefficients of thermal expansion between the first inorganic layer and the second inorganic layer is 0.8×10. -6 / ℃.

[0087] Comparative Example 1

[0088] The high borosilicate glass kettle is integrally molded. The bottom of the heating container is 2.0 mm thick. A heating layer is prepared on the side of the bottom away from the containing space. The material is silver film, and the thickness is consistent with that of Example 1.

[0089] Comparative Example 2

[0090] Unlike Example 2, the coefficient of thermal expansion of the second inorganic layer is 7.5 × 10⁻⁶. -6 / ℃, the difference in the coefficients of thermal expansion between the first inorganic layer and the second inorganic layer is 4.2×10. -6 / ℃.

[0091] Performance tests were conducted on each embodiment and comparative example. The water volume was 1 liter, and the temperature ranged from room temperature to 100°C. The boiling time of different samples under different power was measured and recorded. The test results are shown in Table 1 below.

[0092] Table 1. Boiling time of each sample under different power levels.

[0093] Power (W) 600 900 1500 Example 1 Boil time (min) 9 min 15 sec 6 min 2 sec 4 min 52 sec Example 2 Boil time (min) 9 min 26 sec 6 min 34 sec 5 min 5 sec Example 3 Boil time (min) 9 min 20 sec 6 min 24 sec 5 min 0 sec Example 4 Boil time (min) 9 min 30 sec 6 min 42 sec 4 min 10 sec Example 5 Boil time (min) 9 min 6 sec 5 min 54 sec 4 min 42 sec Example 6 Boil time (min) 12 min 10 sec 7 min 50 sec 6 min 20 sec Comparative Example 1 Boil time (min) 13 min 11 sec 9 min 26 sec Cracked Comparative Example 2 Boil time (min) 9 min 30 sec 6 min 28 sec Heating element cracked

[0094] As shown in the test data in the table, the samples in Examples 1-5 all had short boiling times at 600W, 900W, and 1500W, and did not crack under high power. This means that all the above samples can heat water in the container at different power levels, are safe to use, and have short heating times, especially at high power where they can quickly boil the water. Compared to the sample in Example 1, the sample in Example 6 has a thicker first inorganic layer (2mm), resulting in a relatively slower heating rate at the same power. Compared to Comparative Example 1, the sample in Example 6 also has a thicker first inorganic layer (2mm), while the bottom of the heating container in Comparative Example 1 is also 2mm thick. Although the heat generated by both layers needs to be conducted through the 2mm thick inorganic layer, the heating rate of the sample in Example 6 at 600W and 900W is significantly higher than that of Comparative Example 1. Furthermore, the sample in Example 6 does not crack under high power heating and is safe to use. Therefore, the heating component and heating container proposed in this application have excellent performance. The sample in Comparative Example 1 had significantly longer boiling times at 600W and 900W compared to the sample using the heating element of this invention combined with the sidewall at the same power. This is mainly because the heat generated by the heating layer in Comparative Example 1 needs to be conducted through the thicker bottom of the heating container, resulting in relatively low thermal efficiency. Furthermore, boiling water at 1500W led to cracking, also due to the thicker bottom of the heating container, lower heat transfer efficiency, and significant heat accumulation at the bottom, causing the temperature to exceed the tolerance value and resulting in cracking. Compared to Example 2 of this invention, Comparative Example 2 shows a smaller difference in the thermal expansion coefficients between the first and second inorganic layers, preventing significant stress during heating and allowing safe use at higher power. In contrast, the thermal expansion coefficients between the first and second inorganic layers in Comparative Example 2 differ by 4.2 × 10⁻⁶. -6 The difference of / ℃ is large, which generates significant stress at higher power levels, eventually leading to cracking of the heating element.

[0095] In summary, the heating element proposed in this invention can be used safely at high power and has high heat conduction efficiency and low energy consumption; the heating container and cooking appliance using this heating element also have good performance.

[0096] In the description of this specification, the terms "embodiment," "one embodiment," "another embodiment," "yet another embodiment," "some specific embodiments," "other specific embodiments," etc., refer to specific features, structures, materials, or characteristics described in connection with that embodiment, which are included in at least one embodiment of the present invention. In this specification, the illustrative expressions of the above terms do not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in one or more embodiments or examples. Without contradiction, those skilled in the art can combine and integrate the different embodiments or examples described in this specification, as well as the features of different embodiments or examples. Furthermore, it should be noted that in this specification, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of indicated technical features.

[0097] Although embodiments of the present invention have been shown and described above, it is understood that the above embodiments are exemplary and should not be construed as limiting the present invention. Those skilled in the art can make changes, modifications, substitutions and variations to the above embodiments within the scope of the present invention.

Claims

1. A heating element, characterized in that, include: The heating layer comprises a first inorganic layer and a second inorganic layer, wherein one side of the heating layer is connected to the first inorganic layer, and the other side of the heating layer is connected to the second inorganic layer. The heat generated by the heating layer is transferred through the first and second inorganic layers. Furthermore, within a temperature range of 0℃ to 350℃, the absolute value of the difference between the absolute values ​​of the thermal expansion coefficients of the first and second inorganic layers is less than 4 × 10⁻⁶. -6 / ℃; The heating component includes a heating surface, and the second inorganic layer is disposed away from the heating surface. The coefficient of thermal expansion of the second inorganic layer is greater than that of the first inorganic layer. The heating layer includes a transition sublayer and a heating sublayer, wherein the heating sublayer is connected to the first inorganic layer and / or the second inorganic layer through the transition sublayer; The heating layer comprises inorganic non-metals and metals, wherein in at least one region of the heating layer, the content of inorganic non-metals in the transition sublayer per unit cross-sectional area is higher than the content of inorganic non-metals in the heating sublayer per unit cross-sectional area.

2. The heating component according to claim 1, characterized in that, The first inorganic layer and the second inorganic layer satisfy at least one of the following conditions: The heat generated by the heating layer is transferred to the first inorganic layer at a rate greater than that transferred to the second inorganic layer. The vertical heat transfer distance of the heat generated by the heating layer in the first inorganic layer is shorter than that in the second inorganic layer.

3. The heating component according to claim 1, characterized in that, The first surface of the first inorganic layer facing away from the heating layer is the heating surface, wherein the first inorganic layer and the second inorganic layer satisfy at least one of the following conditions: The thickness of the first inorganic layer is less than or equal to the thickness of the second inorganic layer; The thermal conductivity of the second inorganic layer is less than that of the first inorganic layer.

4. The heating component according to claim 1, characterized in that, The first inorganic layer and the second inorganic layer are arranged substantially parallel to each other, and the opposing surfaces of the first inorganic layer and the second inorganic layer are spaced apart. The heating layer is disposed in the space defined by the first inorganic layer and the second inorganic layer, and the heating layer is connected to the first inorganic layer and the second inorganic layer.

5. The heating component according to claim 1, characterized in that, At least one of the following conditions must be met: The thermal conductivity of the first inorganic layer and the second inorganic layer is 1-2 W. Within a temperature range of 0℃ to 350℃, the coefficient of thermal expansion of the first inorganic layer is -1×10⁻⁶. -6 / ℃~5×10 -6 / ℃, the thermal expansion coefficient of the second inorganic layer ranges from -1×10⁻¹⁰. -6 / ℃~5×10 -6 / ℃.

6. The heating component according to claim 1, characterized in that, Both the first inorganic layer and the second inorganic layer are separately manufactured flat plates, wherein the flatness tolerance of both the first inorganic layer and the second inorganic layer is less than or equal to 2 mm, and the first inorganic layer and the second inorganic layer are connected through the heating layer.

7. The heating component according to claim 1, characterized in that, The heating layer is connected to the first inorganic layer and / or the second inorganic layer by sintering and curing, wherein the sintering and curing temperature of the heating layer is lower than the softening temperature of the first inorganic layer and / or the second inorganic layer.

8. The heating component according to claim 1, characterized in that, The thickness of the first inorganic layer is less than or equal to the thickness of the second inorganic layer. The heating sublayer is connected to the first inorganic layer through the transition sublayer, and the heating sublayer is connected to the second inorganic layer through an adhesive layer, wherein the thickness of the transition sublayer is less than the thickness of the adhesive layer, and the thickness of the adhesive layer is greater than the thickness of the heating layer.

9. The heating component according to claim 1, characterized in that, At least one of the following conditions must be met: The transition sublayer and the heating sublayer are interlocked and connected at the contact interface; The transition sublayer is embedded and connected to the first inorganic layer and / or the second inorganic layer at the contact interface.

10. The heating component according to claim 1, characterized in that, At least one of the following conditions must be met: The thickness of the transition sublayer is less than the thickness of the heating sublayer; In at least one region of the heating layer, the content of the metal per unit cross-sectional area in the transition sublayer is less than the content of the metal per unit cross-sectional area in the heating sublayer.

11. The heating component according to claim 1, characterized in that, The metal is a weakly magnetic material, and the relative magnetic permeability of the weakly magnetic material is less than 1. The weakly magnetic metal material includes at least one of silver, copper, and aluminum.

12. The heating component according to claim 11, characterized in that, The inorganic non-metals include at least one of silicon oxide, aluminum oxide, bismuth oxide, magnesium oxide, and potassium oxide; In the heating layer, the content of inorganic non-metallic material is 10-30% by mass percentage, and the content of weakly magnetic metal material is 60-90%.

13. The heating component according to any one of claims 1-12, characterized in that, The materials of the first inorganic layer and the second inorganic layer each independently include at least one of glass, ceramic, and quartz. The glass includes at least one of borosilicate glass, microcrystalline glass, and alkali-free glass.

14. A heating container, characterized in that, The device includes a bottom and a sidewall, the bottom being connected to the sidewall and forming a receiving space, wherein the bottom includes a heating element as described in any one of claims 1-13, and a first inorganic layer of the heating element is located on the side facing the receiving space.

15. The heating container according to claim 14, characterized in that, There is a certain distance between the heating layer of the heating component and the sidewall.

16. The heating container according to claim 15, characterized in that, The bottom is composed of the heating element as described in any one of claims 1-13, or The bottom includes an annular first portion and a heating element according to any one of claims 1-13, wherein the first portion is connected to the sidewall, the heating element is disposed in the area defined by the first portion, and the first portion is connected to the heating element.

17. A cooking utensil, characterized in that, The heating container included in any one of claims 14-16.

18. The cooking utensil according to claim 17, characterized in that, Further includes: A heating base, the heating base including a functional module that enables the heating element to generate heat.

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