Infrared thermopile sensor temperature compensation, correction method, compensation device and electronic equipment

Abstract

The application relates to the field of temperature calibration, and discloses an infrared thermocouple sensor temperature compensation and correction method, a compensation device and electronic equipment, wherein a compensation function of an environmental temperature of an infrared thermocouple sensor in a measurement process and a working temperature of the infrared thermocouple sensor under different temperature environments is acquired in advance, and is applied to corresponding products (such as a processor in a sensor system), so that the purpose of quickly and accurately measuring the temperature of an object can be achieved.

Description

Technical Field

[0001] This invention relates to the field of temperature calibration, and more particularly to a method, device and electronic equipment for temperature compensation and calibration of an infrared thermopile sensor. Background Technology

[0002] At room temperature, all black bodies in nature emit infrared radiation at different wavelengths, and the energy of the radiation varies with temperature. Thermopile technology, based on the Seebeck effect, measures the energy of the radiation to detect the temperature of the black body's surface, and therefore has been widely used in the field of infrared thermal imaging.

[0003] In recent years, with the development of AI technology, facial recognition combined with non-contact temperature measurement has experienced explosive growth. Human body temperature detection is affected by ambient temperature, and infrared sensors are also affected by operating temperature. Therefore, achieving fast, stable, and accurate temperature measurement places extremely high demands on temperature measurement products.

[0004] However, in current temperature measurement technology, due to the large amount of heat generated by chips, the internal temperature of related products is much higher than the ambient temperature. This situation requires a long stabilization time for the temperature measurement thermopile module inside the product that uses the chip to complete a relatively accurate temperature measurement, which greatly increases the temperature measurement time. Summary of the Invention

[0005] This invention provides a method, device, and electronic equipment for temperature compensation and calibration of an infrared thermopile sensor, so as to achieve rapid, stable, and accurate temperature measurement of objects.

[0006] According to a first aspect of the present invention, a method for temperature compensation of an infrared thermopile sensor is provided, comprising:

[0007] S1: Let T be the compensation function for the ambient temperature during the measurement process of the infrared thermopile sensor. 补 The relationship between T and the operating temperature of the infrared thermopile sensor is: 补 = k*△T+b; where △T represents the difference between the operating temperature of the infrared thermopile sensor and the ambient temperature;

[0008] S2: Place a blackbody in a constant temperature environment, and set the initial temperature of the blackbody to the first initial temperature T1, and set the initial temperature of the constant temperature environment to the second initial temperature T2.

[0009] S3: Acquire several first temperature signals and second temperature signals through an infrared thermopile sensor; wherein, the first temperature signal represents the operating temperature data of the infrared thermopile sensor; the second temperature signal represents the ambient temperature data, and the first temperature signal is numerical data; the second temperature signal is matrix data.

[0010] S4: Obtain the average temperature T of the infrared thermopile sensor during operation based on the aforementioned first temperature signals. 平 The average minimum temperature T of the ambient temperature is obtained based on the aforementioned second temperature signals. min And the maximum temperature T at which the ambient temperature is obtained. max ;

[0011] S5: According to the T 平 T min And T max Calculate △T and T 补 Where: △T=T 平 -T min ;T 补 =T1-T max ;

[0012] S6: Change the value of the first initial temperature T1 at least once and repeat steps S1 to S5 to obtain k and b, so as to obtain the compensation function T at the ambient temperature of the second initial temperature T2. 补 ;

[0013] S7: Change the temperature of the constant temperature environment, and repeat steps S1 to S6 to obtain the compensation function T under different temperature environments. 补 .

[0014] Optionally, the second temperature signal is denoised before step S4.

[0015] Optionally, the denoising method includes: median filtering.

[0016] Optionally, in step S4, the average minimum temperature T of the ambient temperature is obtained. min include:

[0017] S411: Determine the minimum temperature data in each of the plurality of second temperature signals to obtain a plurality of minimum temperature data;

[0018] S412: Calculate the average value of the minimum temperature data corresponding to the plurality of second temperature signals to obtain the average minimum temperature T. min .

[0019] Optionally, in step S4, the maximum temperature T of the ambient temperature is obtained. max include:

[0020] S21: Determine the maximum temperature data of each of the plurality of second temperature signals;

[0021] S22: Obtain the maximum temperature T from the maximum temperature data corresponding to the plurality of second temperature signals. max .

[0022] According to a second aspect of the present invention, a method for temperature calibration of an infrared thermopile sensor is provided, comprising:

[0023] S1: Place an object in an environment;

[0024] S2: The temperature of the object and the temperature of the environment are obtained through the infrared thermopile sensor;

[0025] S3: The infrared thermopile sensor temperature compensation method according to any one of claims 1 to 5, and the temperature of the environment, determining the compensation function T at that ambient temperature. 补 And the maximum temperature T at that ambient temperature. max ;

[0026] S4: Obtain the actual temperature T of the object. 实 :T 实 =T 补 +T max .

[0027] According to a third aspect of the present invention, an infrared thermopile sensor temperature compensation device is provided for implementing the infrared thermopile sensor temperature compensation method described in the first aspect of the present invention, comprising:

[0028] Blackbody, sensor system, temperature control chamber, and panel unit;

[0029] The blackbody, sensor system, and panel unit are all placed in the constant temperature chamber.

[0030] The constant temperature chamber is used to ensure that the blackbody, sensor system and panel are in a constant temperature environment;

[0031] A radiation source is installed inside the black body, and the radiation source is used to generate a set temperature.

[0032] The sensor system is used to implement steps S3 to S7 in claim 1;

[0033] The panel machine is used to: determine the actual temperature T obtained by the sensor system. 实 Presents thermal imaging.

[0034] Optionally, the sensor system includes: an infrared thermopile sensor, an interface, and a processor;

[0035] Among them, the infrared thermopile sensor is used to acquire the first temperature signal and the second temperature signal;

[0036] The first temperature signal and the second temperature signal are transmitted to the processor through the interface;

[0037] The processor is used to acquire several first temperature signals and second temperature signals, and to implement steps S3 to S7 in claim 1.

[0038] According to a fourth aspect of the present invention, an electronic device is provided, including a memory, a processor, and a program stored in the memory and executable on the processor, wherein the processor executes the program to implement the steps of the method described in the first aspect of the present invention.

[0039] According to a fifth aspect of the present invention, a storage medium is provided having a program stored thereon, which, when executed by a processor, implements the steps of the method described in the first aspect of the present invention.

[0040] The infrared thermopile sensor temperature compensation, calibration method, compensation device, and electronic device provided by this invention obtain the compensation function of the ambient temperature and the working temperature of the infrared thermopile sensor during the measurement process under different temperature environments in advance, and apply it to the corresponding product (such as the processor in the sensor system) to achieve rapid and accurate temperature measurement of objects. Attached Figure Description

[0041] To more clearly illustrate the technical solutions in the embodiments of the present invention or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0042] Figure 1 This is a schematic flowchart of an infrared thermopile sensor temperature compensation method in one embodiment of the present invention;

[0043] Figure 2 This is an embodiment of the present invention for obtaining the average minimum temperature T. min A flowchart;

[0044] Figure 3 This is an embodiment of the invention for obtaining the maximum temperature T. max A flowchart;

[0045] Figure 4 This is a schematic flowchart of an infrared thermopile sensor temperature correction method according to an embodiment of the present invention;

[0046] Figure 5 It is a temperature curve obtained without correction in the existing technology;

[0047] Figure 6 It is a temperature curve obtained after correction;

[0048] Figure 7 This is a block diagram of an infrared thermopile sensor temperature compensation device according to an embodiment of the present invention;

[0049] Figure 8 This is a schematic diagram illustrating the structure of an electronic device exemplified by the present invention. Detailed Implementation

[0050] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0051] The terms “first,” “second,” “third,” “fourth,” etc. (if present) in the specification, claims, and accompanying drawings of this invention are used to distinguish similar objects and are not necessarily used to describe a specific order or sequence. It should be understood that such data can be interchanged where appropriate so that embodiments of the invention described herein can be implemented in orders other than those illustrated or described herein. Furthermore, the terms “comprising” and “having,” and any variations thereof, are intended to cover a non-exclusive inclusion; for example, a process, method, system, product, or apparatus that comprises a series of steps or units is not necessarily limited to those steps or units explicitly listed, but may include other steps or units not explicitly listed or inherent to such processes, methods, products, or apparatus.

[0052] In existing technologies, when measuring temperature using infrared thermopile sensors, it has been found that when measuring a blackbody at the same preset temperature under different internal temperatures, the temperature values ​​obtained by each pixel at the same location of the thermopile array are different. Furthermore, since existing chips generally generate heat, the internal temperature of products using these chips is higher than the ambient temperature. This results in a long stabilization time required to achieve accurate temperature measurement when using infrared thermopile sensors.

[0053] In view of this, the present invention proposes a method, a compensation device and an electronic device for temperature compensation and calibration of an infrared thermopile sensor, so as to achieve rapid and accurate temperature measurement of an object.

[0054] The technical solution of the present invention will be described in detail below with reference to specific embodiments. These specific embodiments can be combined with each other, and the same or similar concepts or processes may not be described again in some embodiments.

[0055] Please refer to Figure 1 A specific embodiment of the present invention provides a temperature compensation method for an infrared thermopile sensor, comprising:

[0056] S1: Let T be the compensation function for the ambient temperature during the measurement process of the infrared thermopile sensor. 补 The relationship between T and the operating temperature of the infrared thermopile sensor is: 补 = k*△T+b; where △T represents the difference between the operating temperature of the infrared thermopile sensor and the ambient temperature.

[0057] S2: Place a blackbody in a constant temperature environment, and set the initial temperature of the blackbody to the first initial temperature T1, and set the initial temperature of the constant temperature environment to the second initial temperature T2.

[0058] In this embodiment of the invention, a radiation source is provided in the black body, which is used to generate a predetermined first initial temperature.

[0059] In one example, the constant temperature environment in this embodiment of the invention is a constant temperature chamber.

[0060] S3: Acquire several first temperature signals and second temperature signals through an infrared thermopile sensor; wherein, the first temperature signal represents the operating temperature data of the infrared thermopile sensor; the second temperature signal represents the ambient temperature data, and the first temperature signal is numerical data; the second temperature signal is matrix data.

[0061] The first temperature signal is obtained through a thermistor within the infrared thermopile sensor. This thermistor changes with the operating temperature of the infrared thermopile sensor, thus generating a first temperature signal characterizing the operating temperature data of the infrared thermopile sensor. The second temperature signal is obtained by measuring the object temperature through each pixel unit of the infrared thermopile sensor. Therefore, based on the data obtained from each pixel unit, a second temperature signal consisting of matrix data is formed.

[0062] In a specific embodiment of the present invention, the infrared thermopile sensor is a 32*32 infrared thermopile sensor, that is, the resolution is 32*32, and the infrared thermopile sensor can acquire a first temperature signal characterizing the sensor's operating temperature and a second temperature signal characterizing the ambient temperature, wherein the first temperature signal is numerical data and the second temperature signal is 32*32 matrix data.

[0063] Of course, it is understood that this invention is not limited to the resolution of the infrared thermopile sensor. Infrared thermopile sensors with other resolutions, such as those with resolutions of 16*16, 80*64, and 160*128, are all within the protection scope of this invention.

[0064] S4: Obtain the average temperature T of the infrared thermopile sensor during operation based on the aforementioned first temperature signals.平 The average minimum temperature T of the ambient temperature is obtained based on the aforementioned second temperature signals. min And the maximum temperature T at which the ambient temperature is obtained. max .

[0065] Since the first temperature signal is numerical data, the average temperature T_flat when the infrared thermopile sensor is working is the average value of several first temperature signals.

[0066] Please refer to the following: Figure 2 In a specific embodiment of the present invention, the average minimum temperature T of the obtained ambient temperature is... min include:

[0067] S411: Determine the minimum temperature data for each of the plurality of second temperature signals.

[0068] Specifically, a second temperature signal includes 32*32 data points, and the smallest temperature data point is selected from the 32*32 data points by polling as the smallest temperature data point in the second temperature signal.

[0069] S412: Calculate the average value of the minimum temperature data corresponding to the plurality of second temperature signals to obtain the average minimum temperature T. min .

[0070] The minimum temperature data corresponding to several second temperature signals are obtained from several second temperature signals, and the average value of the obtained minimum temperature data is taken as the average minimum temperature T. min .

[0071] Please refer to the following: Figure 3 In a specific embodiment of the present invention, the maximum temperature T at which the ambient temperature is obtained is... max include:

[0072] S421: Determine the maximum temperature data of each of the plurality of second temperature signals.

[0073] Specifically, a second temperature signal includes 32*32 data points, and the largest temperature data point is selected from the 32*32 data points by polling as the largest temperature data point in the second temperature signal.

[0074] S422: Obtain the maximum temperature T from the maximum temperature data corresponding to the plurality of second temperature signals. max .

[0075] The maximum temperature T is obtained by obtaining several maximum temperature data corresponding to several second temperature signals, and then obtaining the maximum value among the obtained maximum temperature data by polling. max .

[0076] S5: According to the T 平 T min And T max Calculate △T and T 补 Where: △T=T 平 -T min ;T 补 =T1-T max .

[0077] S6: Change the value of the first initial temperature T1 at least once and repeat steps S1 to S6 to obtain k and b, so as to obtain the compensation function T at the ambient temperature of the second initial temperature T2. 补 .

[0078] S7: Change the temperature of the constant temperature environment, and repeat steps S1 to S7 to obtain the compensation function T under different temperature environments. 补 .

[0079] Before step S4 in this embodiment of the invention, the second temperature signal needs to be denoised to filter out a very small number of occasional glitch-type interference factors in the second temperature signal, thereby further improving the accuracy of object temperature measurement.

[0080] In one specific embodiment of the present invention, the second temperature signal is denoised by median filtering.

[0081] Of course, it is understood that the present invention is not limited to the method of denoising the second temperature signal. Other methods that can denoise the second temperature signal, such as mean filtering and Gaussian filtering, are all within the protection scope of the present invention.

[0082] Please refer to Figure 4 In one embodiment of the present invention, a temperature calibration method for an infrared thermopile sensor is also provided. This method enables rapid and accurate temperature measurement of objects. The calibration method includes...

[0083] S1: Place an object in an environment.

[0084] It is understood that this invention is not limited to measuring the temperature of objects, but can also achieve rapid and accurate temperature measurement of the human body.

[0085] S2: The temperature of the object and the temperature of the environment are obtained through the infrared thermopile sensor.

[0086] In the embodiments of this invention, the infrared thermopile sensors involved are all 32*32 infrared thermopile sensors.

[0087] S3: Determine the compensation function T at the ambient temperature based on the infrared thermopile sensor temperature compensation method and the ambient temperature. 补 And the maximum temperature T at that ambient temperature. max .

[0088] S4: Obtain the actual temperature T of the object. 实 :T 实 =T 补 +T max .

[0089] The infrared thermopile sensor temperature compensation, calibration method, compensation device, and electronic device provided by this invention obtain the compensation function of the ambient temperature and the working temperature of the infrared thermopile sensor during the measurement process under different temperature environments in advance, and apply it to the corresponding product (such as the processor in the sensor system) to achieve rapid and accurate temperature measurement of objects.

[0090] Please refer to Figure 5 and Figure 6 , Figure 5 This is a temperature curve obtained without correction in the existing technology. Figure 6 This is the temperature curve obtained after correction.

[0091] Before compensation and calibration of the thermopile sensor, the measured object temperature gradually decreases as the chip temperature rises until the chip reaches a stable state. Therefore, it takes time to achieve stable temperature measurement. However, after compensation and calibration of the thermopile sensor, it is unaffected by chip temperature changes. This means that after compensation and calibration, stable temperature measurement is achieved much faster, reducing measurement time. Furthermore, the verification results (such as...) Figure 5 and Figure 6 From this perspective, the temperature fluctuation range of the measured object is not large (basically controlled at around 0.5 degrees Celsius), which further improves the accuracy of the temperature measurement results.

[0092] Please refer to Figure 7 In one embodiment of the present invention, an infrared thermopile sensor temperature compensation device is also provided. This device is used to implement the above-described infrared thermopile sensor temperature compensation method, comprising:

[0093] The system comprises a blackbody 100, a sensor system 200, a constant temperature chamber 300, and a panel display 400; wherein the blackbody 100, the sensor system 200, and the panel display 400 are all placed in the constant temperature chamber 300; the constant temperature chamber 300 is used to ensure that the blackbody 100, the sensor system 200, and the panel display 400 are in a constant temperature environment.

[0094] The blackbody 100 is equipped with a radiation source, which is used to generate a set temperature.

[0095] The sensor system 200 is used to implement steps S3 to S7 in the infrared thermopile sensor temperature compensation method.

[0096] Furthermore, the sensor system 200 in this embodiment of the invention includes: an infrared thermopile sensor 201, an interface 202, and a processor 203.

[0097] The infrared thermopile sensor 201 is used to acquire a first temperature signal and a second temperature signal; the first temperature signal and the second temperature signal are transmitted to the processor 203 through the interface 202; the interface 202 can be an I2C interface. Of course, it is understood that the present invention is not limited to the type of interface. Other interfaces, as long as they can transmit the signals from the infrared thermopile sensor to the processor, are within the protection scope of the present invention.

[0098] The processor is used to acquire several first temperature signals and second temperature signals, and to implement steps S3 to S7 in the infrared thermopile sensor temperature compensation method.

[0099] The panel camera is used to: present thermal images based on the actual temperature T obtained by the sensor system.

[0100] Please refer to Figure 8 This invention also provides an electronic device 1, comprising:

[0101] Processor 11; and

[0102] Memory 12 is used to store the executable instructions of the processor;

[0103] The processor 11 is configured to execute the infrared thermopile sensor temperature compensation method described above by executing the executable instructions.

[0104] The processor 11 can communicate with the memory 12 via the bus 13.

[0105] This invention also provides a computer-readable storage medium storing a computer program that, when executed by a processor, implements the above-mentioned infrared thermopile sensor temperature compensation method.

[0106] Those skilled in the art will understand that all or part of the steps of the above-described method embodiments can be implemented by hardware related to program instructions. The aforementioned program can be stored in a computer-readable storage medium. When executed, the program performs the steps of the above-described method embodiments; and the aforementioned storage medium includes various media capable of storing program code, such as ROM, RAM, magnetic disks, or optical disks.

[0107] In the description of this specification, the references to terms such as "an embodiment," "an example," "a specific implementation process," and "an example" indicate that a specific feature, structure, material, or characteristic described in connection with that embodiment or example is included in at least one embodiment or example of the present invention. In this specification, the illustrative expressions of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in one or more embodiments or examples.

[0108] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present invention, and not to limit them; although the present invention has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some or all of the technical features; and these modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the scope of the technical solutions of the embodiments of the present invention.

Claims

1. A method for temperature compensation of an infrared thermopile sensor, characterized in that, include: S1: Let T be the compensation function for the ambient temperature during the measurement process of the infrared thermopile sensor. 补 The relationship between T and the operating temperature of the infrared thermopile sensor is: 补 =k*△T+b; where △T represents the difference between the operating temperature of the infrared thermopile sensor and the ambient temperature; S2: Place a blackbody in a constant temperature environment, and set the initial temperature of the blackbody to the first initial temperature T1, and set the initial temperature of the constant temperature environment to the second initial temperature T2. S3: Acquire several first temperature signals and second temperature signals through an infrared thermopile sensor; wherein, the first temperature signal represents the operating temperature data of the infrared thermopile sensor; the second temperature signal represents the ambient temperature data, and the first temperature signal is numerical data; the second temperature signal is matrix data. S4: Obtain the average temperature T of the infrared thermopile sensor during operation based on the aforementioned first temperature signals. 平 The average minimum temperature T of the ambient temperature is obtained based on the aforementioned second temperature signals. min And the maximum temperature T at which the ambient temperature is obtained. max ; The average minimum temperature T of the obtained ambient temperature min Includes: S411: Determining the minimum temperature data in each of the plurality of second temperature signals to obtain a plurality of minimum temperature data; S412: Calculating the average value of the minimum temperature data corresponding to the plurality of second temperature signals to obtain the average minimum temperature T. min ; The maximum temperature T at which the ambient temperature is obtained. max Includes: S421: determining the maximum temperature data of each of the plurality of second temperature signals; S432: obtaining the maximum temperature T from the maximum temperature data corresponding to the plurality of second temperature signals. max ; S5: According to the T 平 T min And T max Calculate △T and T 补 Where: △T=T 平 -T min ;T 补 =T1-T max ; S6: Change the value of the first initial temperature T1 at least once and repeat steps S1 to S5 to obtain k and b, so as to obtain the compensation function T at the ambient temperature of the second initial temperature T2. 补 ; S7: Change the temperature of the constant temperature environment, and repeat steps S1 to S6 to obtain the compensation function T under different temperature environments. 补 .

2. The infrared thermopile sensor temperature compensation method according to claim 1, characterized in that, Before step S4, the second temperature signal is denoised.

3. The infrared thermopile sensor temperature compensation method according to claim 2, characterized in that, The noise reduction method includes: median filtering.

4. A method for temperature calibration of an infrared thermopile sensor, characterized in that, include: S1: Place an object in an environment; S2: The temperature of the object and the temperature of the environment are obtained through the infrared thermopile sensor; S3: The infrared thermopile sensor temperature compensation method according to any one of claims 1 to 3 and the temperature of the environment, determining the compensation function T at that ambient temperature. 补 And the maximum temperature T at that ambient temperature. max ; S4: Obtain the actual temperature T of the object. 实 :T 实 =T 补 +T max .

5. A temperature compensation device for an infrared thermopile sensor, used to implement the temperature compensation method for an infrared thermopile sensor according to any one of claims 1-3, characterized in that, include: Blackbody, sensor system, temperature control chamber, and panel unit; The blackbody, sensor system, and panel unit are all placed in the constant temperature chamber. The constant temperature chamber is used to ensure that the blackbody, sensor system and panel are in a constant temperature environment; A radiation source is installed inside the black body, and the radiation source is used to generate a set temperature. The sensor system is used to implement steps S3 to S7 in claim 1; The panel machine is used to: determine the actual temperature T obtained by the sensor system. 实 Presents thermal imaging.

6. The infrared thermopile sensor temperature compensation device according to claim 5, characterized in that, The sensor system includes: an infrared thermopile sensor, an interface, and a processor; Among them, the infrared thermopile sensor is used to acquire the first temperature signal and the second temperature signal; The first temperature signal and the second temperature signal are transmitted to the processor through the interface; The processor is used to acquire several first temperature signals and second temperature signals, and to implement steps S3 to S7 in claim 1.

7. An electronic device comprising a memory, a processor, and a program stored in the memory and executable on the processor, characterized in that, When the processor executes the program, it implements the steps of the method according to any one of claims 1-3.

8. A storage medium having a program stored thereon, characterized in that, When the program is executed by a processor, it implements the steps of the method according to any one of claims 1-3.

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