A detection apparatus, method and system

Abstract

The embodiment of the present application provides a detection device, method and system, the detection device comprises a light source module, an imaging module and an analysis module; the light source module is used for emitting detection light to a to-be-detected object; the imaging module is used for receiving reflected light reflected by the surface of the to-be-detected object and imaging to obtain imaging data of the surface of the to-be-detected object; and the analysis module is used for analyzing the imaging data of the surface of the to-be-detected object and obtaining height information of the surface of the to-be-detected object, so that the detection of the three-dimensional features of the chip surface is realized.

Description

Technical Field

[0001] The embodiments of the present invention relate to the field of optical detection technology, specifically to a detection device, method, and system. Background Technology

[0002] As semiconductor chips evolve towards miniaturization, multifunctionality, and high integration, their feature areas are becoming increasingly smaller, making processing more difficult and increasing the likelihood of errors during manufacturing. Since an error in any processing step can lead to the failure of the entire chip, it is necessary to introduce a chip inspection process after critical processing steps. By inspecting information such as the chip's surface morphology and film thickness, defective chips can be promptly eliminated, thereby improving the yield rate of chip products.

[0003] Optical inspection is one of the main methods for inspecting semiconductor chips. It involves illuminating the surface of the chip with light emitted from a light source and then obtaining the surface topography information of the chip by analyzing the image formed on the probe surface by the reflected light. However, this method can usually only obtain a two-dimensional image of the chip surface, and it cannot be used in scenarios requiring three-dimensional inspection, such as detecting via depth or bump height.

[0004] Therefore, how to detect the three-dimensional features of the chip surface is a problem that urgently needs to be solved by those skilled in the art. Summary of the Invention

[0005] In view of this, embodiments of the present invention provide a detection device, method and system to detect three-dimensional features on the surface of a chip.

[0006] To address the above problems, embodiments of the present invention provide the following technical solutions:

[0007] A detection device includes a light source module, an imaging module, and an analysis module;

[0008] The light source module is used to emit detection light toward the object to be tested;

[0009] The imaging module is used to receive reflected light reflected from the surface of the object under test and to perform imaging to obtain imaging data of the surface of the object under test.

[0010] The analysis module is used to analyze the imaging data of the surface of the object under test and obtain the height information of the surface of the object under test.

[0011] Optionally, the imaging module includes an imaging component and an angle adjustment component. The imaging component is used to receive reflected light reflected from the surface of the object under test and to form an image. The angle adjustment component is used to adjust the angle between the reflected light and the imaging component so as to feed back the height information on the surface of the object under test to different positions of the image formed by the imaging component.

[0012] Optionally, the analysis module is used to analyze the imaging data of the surface of the object under test, take the position of the light intensity peak in the imaging data as the position of the image formed by the imaging component, and calculate the height information of the surface of the object under test according to the correspondence between the height information of the surface under test and the position of the image formed by the imaging component.

[0013] Optionally, the imaging component includes a detection surface for receiving the reflected light, and the angle adjustment component includes a first angle adjustment element for adjusting the reflected light and / or a second angle adjustment element for adjusting the detection surface.

[0014] Optionally, the first angle adjustment component includes a reflective device and a first rotation axis disposed on the reflective device. The reflective device is used to reflect the reflected light to the detection surface, and the first rotation axis is used to rotate the reflective device so that images of the surface of the object under test at different heights are formed at different positions on the detection surface.

[0015] Optionally, the first rotation axis is perpendicular to the optical axis of the imaging component and intersects with the optical axis of the imaging component; the detection surface is not perpendicular to the optical axis of the imaging component.

[0016] Optionally, the first angle adjustment element is a galvanometer, and the rotation axis of the galvanometer is perpendicular to the optical axis of the imaging component.

[0017] Optionally, the second angle adjustment component includes a second rotation shaft disposed on the detection surface. The second rotation shaft is used to rotate the detection surface so that images of the surface of the object under test at different heights are formed at different positions on the detection surface, or to control the detection surface to receive the reflected light at a preset angle.

[0018] Optionally, the second angle adjustment member is used to rotate the detection surface so that when images of the object surface at different heights are formed at different positions on the detection surface, the second rotation axis is perpendicular to the optical axis of the imaging component and does not intersect with the optical axis of the imaging component; the detection surface is not perpendicular to the optical axis of the imaging component.

[0019] Optionally, the light source module includes a light source, a beam expanding and collimating lens, and a beam splitter. The beam expanding and collimating lens is used to expand and collimate the light emitted from the light source to form the detection light, and the beam splitter is used to reflect the detection light onto the surface to be tested.

[0020] Optionally, the light source is a point light source, a line light source, or a dot matrix lighting source;

[0021] When the light source is a dot matrix illumination source, there are multiple beam expanding and collimating lenses, each corresponding to a point light source in the dot matrix illumination source.

[0022] Optionally, the imaging assembly further includes a first lens and a second lens. The first lens is used to converge the detection light onto the surface of the object under test and to diverge the reflected light reflected from the surface of the object under test to the second lens. The second lens is used to converge the reflected light diverged and transmitted by the first lens to form an image.

[0023] Optionally, the angle adjustment component completes one angle adjustment within one exposure cycle of the imaging module.

[0024] A detection method, applied to the above-mentioned detection equipment, comprising:

[0025] Emit detection light toward the object to be tested;

[0026] The device receives reflected light from the surface of the object under test and performs imaging to obtain imaging data of the surface of the object under test.

[0027] The imaging data of the surface of the object under test is analyzed to obtain the height information of the surface of the object under test.

[0028] Optionally, receiving the reflected light from the surface of the object under test and performing imaging to obtain imaging data of the surface of the object under test includes:

[0029] Receive the reflected light reflected from the surface of the object under test;

[0030] The angle between the reflected light and the imaging component is adjusted to feed back the height information on the surface of the object under test to different positions of the image formed by the imaging component.

[0031] Optionally, adjusting the angle between the reflected light and the imaging component includes:

[0032] The reflected light is rotated and reflected so that images of the object at different heights are formed at different positions on the detection surface.

[0033] Optionally, adjusting the angle between the reflected light and the imaging component includes:

[0034] The detection surface for detecting the reflected light is rotated so that images of the object at different heights are formed at different positions on the detection surface.

[0035] Optionally, analyzing the imaging data of the surface of the object under test and obtaining the height information of the surface of the object under test includes:

[0036] Analyze the imaging data on the surface of the object under test, and take the position of the light intensity peak in the imaging data as the position of the image formed by the imaging component;

[0037] The height information of the surface of the object under test is calculated based on the correspondence between the height information of the surface under test and the position of the image formed by the imaging component.

[0038] Optionally, the step of adjusting the angle between the reflected light and the imaging component is completed within one exposure cycle of the light source module.

[0039] A detection system configured to perform the detection method described above.

[0040] The detection device, method, and system provided in this invention include: a light source module, an imaging module, and an analysis module. The light source module emits detection light towards the object under test. The imaging module receives reflected light from the surface of the object under test and performs imaging to obtain imaging data of the object's surface. The analysis module analyzes the imaging data of the object's surface and obtains the height information of the object's surface. Based on the imaging principles of objects, objects at different positions form images at different locations. In the imaging data of the object under test, images of objects at different heights correspond to light intensity peak points at different heights. Therefore, by analyzing the imaging data of the object's surface, the height information of the object can be obtained, thereby enabling the detection of three-dimensional features of the chip surface. Attached Figure Description

[0041] To more clearly illustrate the technical solutions in the embodiments of this application or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only embodiments of this application. For those skilled in the art, other drawings can be obtained based on the provided drawings without creative effort.

[0042] Figure 1 A structural block diagram of a detection device provided in an embodiment of the present invention;

[0043] Figure 2 This is a schematic diagram of the structure of a detection device provided in an embodiment of the present invention;

[0044] Figure 3 for Figure 2 A partial schematic diagram of a testing device;

[0045] Figure 4 for Figure 2 Another partial schematic diagram of a testing device;

[0046] Figure 5 for Figure 2 A schematic diagram of the optical axis of the reflected light when the galvanometer rotates;

[0047] Figure 6 This is a schematic diagram of another detection device provided in an embodiment of the present invention;

[0048] Figure 7 This is a flowchart of a detection method provided in an embodiment of the present invention. Detailed Implementation

[0049] As described in the background section, existing methods can typically only obtain two-dimensional images of the chip surface, which cannot be achieved in scenarios with three-dimensional detection requirements, such as detecting via depth and bump height.

[0050] The inventors discovered that in the imaging principles of objects, objects at different positions on the optical axis will have images at different positions on the imaging side. When this principle is applied to height detection, it manifests as objects at different heights forming images at different heights.

[0051] Based on this, embodiments of the present invention provide a detection device, method, and system. The detection device includes a light source module, an imaging module, and an analysis module. The light source module is used to emit detection light towards the object to be tested. The imaging module is used to receive reflected light reflected from the surface of the object to be tested and to perform imaging to obtain imaging data of the surface of the object to be tested. The analysis module is used to analyze the imaging data of the surface of the object to be tested and to obtain the height information of the surface of the object to be tested.

[0052] According to the imaging law of objects, the image positions formed by objects at different positions are different. In the imaging data of the object under test, the images formed by the object under test at different heights correspond to the light intensity peak points at different heights. Therefore, by analyzing the imaging data of the surface of the object under test, the height information of the object under test can be obtained, thereby realizing the detection of the three-dimensional features of the chip surface.

[0053] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the scope of protection of the present invention.

[0054] This invention provides a detection device, with reference to... Figure 1 The diagram shows the structural block diagram of the detection device, which includes: a light source module 1, an imaging module 2, and an analysis module 3.

[0055] The light source module 1 is used to emit detection light toward the object to be tested;

[0056] The light source module 1 can be a point light source, a line light source, or a dot matrix illumination light source. The detection light emitted by the light source module can be visible light, for example, white light in the visible light spectrum, so that the object under test can be imaged based on the imaging rules under visible light.

[0057] The object to be tested can be a chip, a wafer, or a raised or recessed structure on the surface of a wafer, such as a via or film layer on a wafer, which have three-dimensional feature detection requirements.

[0058] The imaging module 2 is used to receive reflected light reflected from the surface of the object under test and to perform imaging to obtain imaging data of the surface of the object under test.

[0059] In the imaging module 2, during the process of receiving reflected light from the surface of the object under test and forming an image, the positions of the reflected light at different heights on the surface of the object under test along the optical axis are different, resulting in different positions of the image formed. Accordingly, the different positions of the image formed by the imaging module 2 can provide feedback on the height information of the surface of the object under test. Furthermore, by analyzing the imaging data of the surface of the object under test, the height information of the object can be obtained, thereby enabling the detection of three-dimensional features of the chip surface.

[0060] In an optional example, imaging data of images formed by reflected light at different heights on the surface of the object under test can be acquired by adjusting the angle. Specifically, the imaging module 2 may include an imaging component 21 and an angle adjustment component 22. The imaging component 21 is used to receive and image the reflected light from the surface of the object under test. The angle adjustment component 22 is used to adjust the angle between the reflected light and the imaging component to feed back the height information on the surface of the object under test to different positions of the image formed by the imaging component. This allows the imaging data acquired by the imaging module to characterize the images formed by reflected light at different heights on the surface of the object under test. The angle adjustment component 22 completes one angle adjustment within one exposure cycle of the imaging module 2, allowing the feedback of height information on the surface of the object under test to be completed within one exposure cycle.

[0061] It is understood that the angle adjustment component can adjust the reflected light to achieve adjustment of the corresponding angle; it can also adjust the angle of the detection surface in the imaging component used to receive the reflected light to achieve adjustment of the corresponding angle; or, it can simultaneously adjust the emitted light or the detection surface to achieve angle adjustment. Accordingly, in one example, the imaging component may include a detection surface for receiving the reflected light, and the angle adjustment component may include a first angle adjustment element for adjusting the reflected light and / or a second angle adjustment element for adjusting the detection surface.

[0062] The analysis module 3 is used to analyze the imaging data of the surface of the object under test and obtain the height information of the surface of the object under test.

[0063] Based on the imaging data acquired by the imaging module 3, the images formed by reflected light at different heights on the surface of the object under test can be characterized. Furthermore, based on the analysis module 3, the imaging data of the surface of the object under test can be analyzed, and the height information of the surface of the object under test can be obtained.

[0064] The analysis module 3 can be a device with data processing capabilities, such as a computer or server, used to determine the position of the image based on the data characteristics of the image during the analysis of the imaging data, and then determine the height information of the surface of the object to be measured based on the corresponding position information.

[0065] In an optional example, the position of the image in the imaging data can be determined based on the characteristic that the image data is typically a light intensity peak. Specifically, the analysis module can analyze the imaging data of the surface of the object under test, take the position of the light intensity peak in the imaging data as the position of the image formed by the imaging component, and calculate the height information of the surface of the object under test based on the correspondence between the height information of the surface under test and the position of the image formed by the imaging component.

[0066] In this embodiment of the invention, imaging data of images formed by reflected light at different heights on the surface of the object under test can be obtained by adjusting the angle. Furthermore, based on the characteristic that the data of the formed image is usually the light intensity peak, the position of the image in the imaging data can be determined, and then the height information of the surface of the object under test can be calculated to realize the three-dimensional features of the surface of the detection chip.

[0067] An optional embodiment of the present invention provides a detection device, with reference to Figure 2 The diagram shows a structural schematic of a detection device, which can adjust the corresponding angle by adjusting the reflected light.

[0068] Specifically, in the detection device, the light source module includes a light source 11, a beam expanding and collimating lens 12, and a beam splitter 13. The beam expanding and collimating lens 12 is used to expand and collimate the light emitted from the light source to form the detection light, and the beam splitter 13 is used to reflect the detection light onto the surface to be tested.

[0069] To facilitate imaging of the object under test, the light source 11 can be a point light source, a line light source, or a dot matrix illumination source. When the light source is a dot matrix illumination source, there are multiple beam-expanding and collimating lenses, each corresponding to a point light source in the dot matrix illumination source, thereby expanding and collimating the light emitted from the point light sources in the dot matrix illumination source one by one.

[0070] The beam-expanding and collimating lens 12 is coaxial with the light emitted from the light source 11, thereby expanding and collimating the light emitted from the light source to form a detection beam. The beam splitter 13 has a first preset angle γ with the optical axis of the detection beam, thereby reflecting the detection beam onto the surface to be tested. The first preset angle γ matches the positional relationship between the beam splitter 13 and the surface to be tested. In this embodiment, the first preset angle γ can be 45°. The beam splitter ratio of the beam splitter 13 can be 50:50; in other examples, the beam splitter ratio can also be other values, which will not be elaborated here.

[0071] Of course, other dimming components can be set in the light source module according to actual needs in the embodiments of the present invention, which will not be elaborated here.

[0072] The imaging component may include a first lens 211 and a second lens 212. The first lens 211 is used to converge the detection light onto the surface of the object to be tested and to diverge the reflected light reflected from the surface of the object to be tested to the second lens 212. The second lens 212 is used to converge the reflected light diverged and transmitted by the first lens 211 to form an image.

[0073] The first lens 211 can be positioned between the object under test 100 and the beam splitter 13, and the second lens 212 can be positioned on the side of the beam splitter 13 away from the first lens 211. The first lens 211 and the second lens 212 are coaxially arranged so that the second lens 212 can converge the reflected light transmitted by the first lens 211 to form an image.

[0074] The imaging assembly further includes a detection surface 213 for receiving the reflected light. The detection surface is disposed on the side of the second lens 212 opposite to the first lens 211, so that the image formed by the reflected light is formed on the detection surface. The detection surface 213 can be the detection surface of a photodetector, which can be a photodetector with an array of photosensitive elements, such as a CCD sensor or a CMOS camera.

[0075] In the detection device described in this embodiment of the invention, the angle adjustment component includes a first angle adjustment member 221 for adjusting the reflected light. The first angle adjustment member 221 may include a reflective device 221a and a first rotation axis 221b disposed on the reflective device 221a. The reflective device 221a is used to reflect the reflected light to the detection surface 213 of the imaging component. The first rotation axis 221b is used to rotate the reflective device 221a so that images of the surface of the object under test at different heights are formed at different positions on the detection surface 213.

[0076] In this embodiment, the first angle adjustment element 221 can be disposed on the side of the second lens 212 opposite to the first lens 211, and the detection surface 213 is disposed on the optical axis of the reflected light after adjustment by the first angle adjustment element 221. In other examples, the first angle adjustment element 221 can also be disposed between the second lens 212 and the first lens 211. In this embodiment, the initial angle between the reflecting surface of the reflecting device 221a of the first angle adjustment element 221 and the optical axis of the reflected light can be a second preset angle δ, thereby reflecting the reflected light onto the detection surface of the imaging component 21. The second preset angle δ matches the positional relationship between the reflecting surface of the reflecting device 221a and the detection surface. In this example, the second preset angle δ can be 45°.

[0077] The first rotation axis 221b is perpendicular to the optical axis of the imaging component and intersects with it. The detection surface intersects with the focal plane of the imaging component but is not perpendicular to its optical axis, allowing the distance of the reflected light to the detection surface to be calculated based on the rotation angle, thus simplifying the analysis and calculation process. In the initial state, the object under test at the focal point of the first lens 211 will be imaged at the focal point of the second lens 212. The first angle adjustment member 221 rotates to reflect the reflected light, causing the focal point of the second lens 212 to change position with the corresponding rotation angle. The focal plane refers to the set of positions where the focal point of the second lens 212 changes with the corresponding rotation angle; the focal plane can be a sphere, hemisphere, or ellipsoid.

[0078] The first rotating shaft 221b can rotate the reflective device 221a. Based on different angles, the distance at which the reflected light reaches the detection surface is different, so that images of the surface of the object under test at different heights can be formed at different positions on the detection surface.

[0079] In this embodiment of the invention, the first angle adjustment member 221 can be a galvanometer, so that the reflector on the galvanometer can be rotated at different angles and speeds under the control of an electrical signal.

[0080] In this embodiment of the invention, a second angle adjustment component may be further provided. The second angle adjustment component includes a second rotation shaft 222 disposed on the detection surface. The second rotation shaft 222 is used to rotate the detection surface so that images of the object surface at different heights are formed at different positions on the detection surface, or to control the detection surface to receive the reflected light at a preset angle. The second rotation shaft 222 may be parallel to the first rotation shaft 221b. Based on the galvanometer already configured for corresponding rotation operations in this embodiment of the invention, the second rotation shaft can control the detection surface to receive the reflected light at a preset angle, thereby adjusting the range and accuracy of the detection device.

[0081] In this embodiment, the imaging process of the object under test is as follows: light rays with a certain divergence angle emitted from the point light source 11 are collimated by the beam expander collimating lens 12, reflected by the beam splitter 13, and focused by the first lens 211 (which can be understood as the objective lens) and irradiate the surface of the object under test. The reflected light reflected from the surface of the object under test is collected by the first lens 211, transmitted through the beam splitter 13, and focused by the second lens 212 (which can be understood as the tube lens) onto the detection surface of the photodetector. The galvanometer 221 rotates at different angles based on the control of the electrical signal, so that the detection surface 213 detects reflected light at different distances from the detection surface at different positions.

[0082] Combination Figure 3 and Figure 4 Shown Figure 2 A partial schematic diagram, for reference. Figure 3 As shown, taking the detection of points (a, b, c) at different heights on the surface of the object under test as an example. When the galvanometer 221 is in its initial state (i.e., the optical axis is reflected 90 degrees to the detection surface 213), reference... Figure 4 As shown, the images of a, b, and c are focused at different positions on the optical axis, based on the fact that, in the initial state, the focal plane of the imaging component intersects with the detector surface 213. Therefore, in the initial state of the galvanometer 221, only the image of b can be focused onto the detector surface 213.

[0083] Combination Figure 5 The diagram shows the optical axis of the reflected light when the galvanometer 221 rotates. Figure 5As shown, the optical axis of the reflected light is rotated along a preset direction, and correspondingly, the images of points a, b, and c are formed at different positions on the detector surface 213. During one exposure cycle of the photodetector, the galvanometer 221 completes at least one rotational scan. At this time, the image of the light intensity distribution output by the detector surface 213 contains light intensity peaks corresponding to three points a, b, and c located at different heights. The distance from the peak position to the center position (the image position corresponding to point b) is proportional to the height difference between that point and the focal plane; thus, there is a one-to-one correspondence between the coordinate position of the light intensity peak and the height of the object surface, and this correspondence can be calibrated using a standard sheet with a defined height distribution.

[0084] Correspondingly, the analysis module 3 can calculate the height information of points a, b, and c based on the image of the light intensity distribution output by the detection surface 213.

[0085] In this embodiment, the process of adjusting the range and accuracy of the detection device using the second angle adjustment member is as follows:

[0086] The probe surface 213 is controlled to form a third preset angle θ with the optical axis of the reflected light when the galvanometer is rotated to its initial state, such as... Figure 4 As shown. In this state, the length of the detector surface 213 along the scanning direction is L, the number of photosensitive units along the scanning direction is N, the distance from the center of the galvanometer 221 to the detector surface 213 is D, and the magnification of the optical imaging system is β. Then, the range of the system for detecting the height of the wafer surface is...

[0087]

[0088] Meanwhile, its detection height resolution is

[0089]

[0090] It can be seen that the smaller the third preset angle θ of the detection surface 213, the larger the detection range of the system for the height of the object under test, but the smaller the height resolution. The detection device described in this embodiment of the invention can dynamically adjust the detection range and accuracy by adjusting the third preset angle θ according to the height range of the target.

[0091] Understandably, with the third preset angle θ unchanged, using a larger target surface and more photosensitive units on the detection surface 213 can effectively improve the system's height range and height resolution.

[0092] An alternative embodiment of the present invention also provides another detection device, see reference. Figure 6 The diagram shows another type of detection device, which can adjust the corresponding angle by adjusting the detection surface.

[0093] Unlike the previous embodiment, the detection device in this embodiment does not have the first angle adjustment component. Instead, it adjusts the angle of the detection surface solely based on the second angle adjustment component, so that images of the object at different heights are formed at different positions on the detection surface 213.

[0094] Specifically, in the detection device, the second angle adjustment component can be a second rotation axis 222 disposed on the detection surface 213 of the imaging component. The detection surface 213 of the imaging component is disposed on the side of the second lens 212 opposite to the first lens 211, and the detection surface 213 intersects the optical axis of the reflected light. To ensure that the rotating detection surface 213 can simultaneously detect imaging data at multiple optical axis heights, the detection surface 213 intersects the focal plane of the imaging component but is not perpendicular to the optical axis of the imaging component, and the second rotation axis 222 is perpendicular to the optical axis of the imaging component but does not intersect with the optical axis of the imaging component.

[0095] The second rotating shaft 222 can rotate the detection surface 213 so that the distance at which the reflected light reaches the detection surface is different at different angles, thereby forming images of the surface of the object under test at different heights at different positions on the detection surface 213.

[0096] In this embodiment of the invention, the second rotation axis 222 can rotate at different angles and speeds under the control of an electrical signal. The second rotation axis 222 can be perpendicular to the optical axis of the imaging component, so that the distance of the reflected light reaching the detection surface can be calculated based on the rotation angle, thereby simplifying the corresponding analysis and calculation process.

[0097] In this embodiment, the imaging process of the object under test is as follows: light rays with a certain divergence angle emitted from the point light source 11 are collimated by the beam expander collimating lens 12, reflected by the beam splitter 13, and focused by the first lens 211, and then irradiate the surface of the object under test. The reflected light reflected from the surface of the object under test is collected by the first lens 211, transmitted through the beam splitter 13, and focused on the detection surface 213 by the second lens 212. The second rotation axis 222 rotates at different angles based on the control of the electrical signal, so that the detection surface 213 detects reflected light at different distances from the detection surface at different positions.

[0098] Correspondingly, the analysis module 3 can calculate the height information of the surface of the object under test based on the image of the light intensity distribution output by the detection surface 213.

[0099] As can be seen, in the imaging law of objects based on the embodiments of the present invention, the image positions formed by objects at different positions are different. In the imaging data of the object to be tested, the images formed by the object at different heights correspond to the light intensity peak points at different heights. Therefore, by analyzing the imaging data of the surface of the object to be tested, the height information of the object to be tested can be obtained, thereby realizing the detection of three-dimensional features of the chip surface.

[0100] The detection method provided in the embodiments of this application will be described below. The method described below can be considered as a method using the detection equipment provided in the above embodiments. The method described below can be referred to in correspondence with the detection equipment described above.

[0101] This invention provides a detection method, such as... Figure 7 As shown, the detection method includes:

[0102] S101: Emits detection light to the object under test;

[0103] S102: Receive the reflected light reflected from the surface of the object under test and perform imaging to obtain imaging data of the surface of the object under test;

[0104] S103: Analyze the imaging data of the surface of the object to be tested, and obtain the height information of the surface of the object to be tested.

[0105] In some embodiments of the present invention, receiving reflected light reflected from the surface of the object under test and performing imaging to obtain imaging data of the surface of the object under test includes: receiving reflected light reflected from the surface of the object under test; adjusting the angle between the reflected light and the imaging component to feed back height information on the surface of the object under test to different positions of the image formed by the imaging component.

[0106] In some embodiments of the present invention, adjusting the angle between the reflected light and the imaging component includes: rotating the reflected light so that images of different heights of the surface of the object under test are formed at different positions on the detection surface.

[0107] In some embodiments of the present invention, adjusting the angle between the reflected light and the imaging component includes: rotating the detection surface that detects the reflected light so that images of the object surface at different heights are formed at different positions on the detection surface.

[0108] In some embodiments of the present invention, the step of analyzing the imaging data of the surface of the object to be tested and obtaining the height information of the surface of the object to be tested includes: analyzing the imaging data of the surface of the object to be tested, taking the position of the light intensity peak in the imaging data as the position of the image formed by the imaging component; and calculating the height information of the surface of the object to be tested based on the correspondence between the height information of the surface of the object to be tested and the position of the image formed by the imaging component.

[0109] In some embodiments of the present invention, the step of adjusting the angle between the reflected light and the imaging component is completed within one exposure cycle of the light source module.

[0110] This application also provides a detection system, which in some embodiments can be configured to perform the detection method provided in this application.

[0111] The foregoing describes multiple embodiment schemes provided by the embodiments of this application. The optional methods described in each embodiment scheme can be combined and cross-referenced with each other without conflict, thereby extending to a variety of possible embodiment schemes. These can all be considered as the embodiment schemes disclosed and published by the embodiments of this application.

[0112] While the embodiments of the present invention have been disclosed above, the present invention is not limited thereto. Any person skilled in the art can make various modifications and alterations without departing from the spirit and scope of the present invention; therefore, the scope of protection of the present invention should be determined by the scope defined in the claims.

Claims

1. A detection device, characterized by The device comprises a light source module, an imaging module and an analysis module. The light source module is configured to emit detection light to a measured object. The imaging module comprises an imaging component and an angle adjusting component. The imaging component comprises a detection surface configured to receive reflected light.

2. The detection device of claim 1, wherein, The angle adjusting component is configured to adjust the angle between the reflected light reflected by the measured object and the imaging component, so that the height information of the measured object is reflected in different positions of the image formed by the imaging component on the detection surface.

3. The detection device of claim 2, wherein, The imaging component is configured to receive the reflected light reflected by the measured object and form an image, so as to obtain imaging data of the measured object.

4. The detection device of claim 3, wherein, The imaging data comprises the light intensity peak value of different positions of the detection surface.

5. The detection device of claim 3, wherein, The analysis module is configured to analyze the imaging data of the measured object, and take the position of the light intensity peak value in the imaging data as the position of the image formed by the imaging component on the detection surface.

6. The detection device of claim 2, wherein, The analysis module is further configured to calculate the height information of the measured object according to the corresponding relationship between the height information of the measured object and the position of the image formed by the imaging component on the detection surface.

7. The detection device of claim 6, wherein, The angle adjusting component comprises a first angle adjusting member configured to adjust the reflected light and / or a second angle adjusting member configured to adjust the detection surface.

8. The detection device of claim 1, wherein, The first angle adjusting member comprises a reflector and a first rotating shaft arranged on the reflector.

9. The detection device of claim 8, wherein, The reflector is configured to reflect the reflected light to the detection surface. The first rotating shaft is configured to rotate the reflector, so that the images of different heights of the measured object are formed in different positions of the detection surface. The first rotating shaft is perpendicular to the optical axis of the imaging component and intersects with the optical axis of the imaging component. The detection surface is not perpendicular to the optical axis of the imaging component. The first angle adjusting member is a galvanometer. The rotating shaft of the galvanometer is perpendicular to the optical axis of the imaging component. The second angle adjusting member comprises a second rotating shaft arranged on the detection surface. The second rotating shaft is configured to rotate the detection surface, so that the images of different heights of the measured object are formed in different positions of the detection surface, or the detection surface is controlled to receive the reflected light at a preset angle. When the second rotating shaft is perpendicular to the optical axis of the imaging component and does not intersect with the optical axis of the imaging component, the detection surface is not perpendicular to the optical axis of the imaging component. The light source module comprises a light source, a beam expander collimator and a beam splitter. The beam expander collimator is configured to expand and collimate the light emitted by the light source, so as to form the detection light. The beam splitter is configured to reflect the detection light to the measured object surface. The light source is a point light source, a line light source or a dot array illumination light source. When the light source is a dot array illumination light source, the beam expander collimator is a plurality of beam expander collimators, and each beam expander collimator corresponds to a point light source in the dot array illumination light source.

10. The detection device of claim 1, wherein, The imaging assembly further comprises a first lens and a second lens, the first lens is used for converging the detection light to the surface of the object to be detected and diverging the reflected light reflected by the surface of the object to be detected to the second lens, and the second lens is used for converging the reflected light diverged by the first lens to form an image.

11. The detection device of claim 1, wherein, The angle adjusting assembly completes the angle adjustment once in one exposure cycle of the imaging module.

12. A method of detection, characterized in that, The detection device is applied to any one of claims 1-11, comprising: Emitting detection light to the object to be detected; Adjusting the angle between the reflected light reflected by the surface of the object to be detected and the imaging assembly, so as to feed back the height information of the surface of the object to be detected on different positions of the image formed by the imaging assembly on the detection surface, receiving the reflected light reflected by the surface of the object to be detected and imaging, so as to obtain the imaging data of the surface of the object to be detected, the imaging data comprising the light intensity peak value of different positions of the detection surface; Analyzing the imaging data of the surface of the object to be detected, taking the position of the light intensity peak value in the imaging data as the position of the image formed by the imaging assembly on the detection surface, and calculating the height information of the surface of the object to be detected according to the corresponding relationship between the height information of the surface of the object to be detected and the position of the image formed by the imaging assembly on the detection surface.

13. The detection method of claim 12, wherein, The adjusting the angle between the reflected light and the imaging assembly comprises: Rotating the reflected light to form the images of different heights of the surface of the object to be detected on different positions of the detection surface.

14. The detection method of claim 12, wherein, The adjusting the angle between the reflected light and the imaging assembly comprises: Rotating the detection surface for detecting the reflected light to form the images of different heights of the surface of the object to be detected on different positions of the detection surface.

15. The method of claim 12, wherein, The adjusting the angle between the reflected light and the imaging assembly is completed in one exposure cycle of the light source module.

16. A detection system characterized by, The detection system is configured to perform the detection method according to any one of claims 12-15.

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