Missile-borne phased array antenna near-field phasing device and method of use thereof

Abstract

The present disclosure relates to a kind of missile-borne phased array antenna near-field phase matching device and its use method.The device includes: phase matching box, including box, phase matching array surface, fixing frame and wave-absorbing embryo, box is the hexahedron of by main panel, back panel, upper panel, lower panel and two side panels;Clamp is set on the outer wall of main panel;Heat dissipation mechanism includes the first radiator and second radiator of movable setting on the outer wall of main panel;Adjustable lock buckle component is connected with the first radiator and second radiator.The present disclosure realizes the constraint of missile-borne antenna circumferential degree of freedom by positioning block, utilizes clamp and the shell back cover of antenna, realizes the constraint of missile-borne antenna axial degree of freedom, to realize the quick positioning of missile-borne antenna clamping and installation.The first radiator and second radiator are tightly adhered to the surface of the shell of missile-borne antenna by adjustable lock buckle, to realize the increase of heat dissipation area, to realize the heat dissipation of missile-borne antenna.

Description

Technical Field

[0001] This disclosure relates to the field of antenna phasing technology, and in particular to a near-field phasing device for a missile-borne phased array antenna and its usage method. Background Technology

[0002] To ensure consistent radiation characteristics across all elements of a phased array antenna, phase matching is required during its development to optimize performance. Different phase matching methods exist, including far-field matching, near-field matching, and others. Furthermore, phased array antennas are often matched in a microwave anechoic chamber. However, due to the massive production volume of missile-borne phased array antennas, and the time-consuming installation and leveling processes, sequential near-field matching in an anechoic chamber undoubtedly limits the utilization rate of the chamber and reduces production efficiency.

[0003] In related technologies, missile-borne phased array antennas differ from large phased array antennas. They are consumables, produced in large quantities, and a single anechoic chamber cannot meet the simultaneous near-field phasing requirements of multiple antennas. Furthermore, during phasing of missile-borne antennas, cylindrical antennas are mostly secured with screws, which is cumbersome and time-consuming to level with.

[0004] Therefore, it is necessary to improve one or more of the problems existing in the above-mentioned related technical solutions.

[0005] It should be noted that this section is intended to provide background or context for the technical solutions of this disclosure as set forth in the claims. The description herein does not constitute an admission that it is prior art simply because it is included in this section. Summary of the Invention

[0006] The purpose of this disclosure is to provide a near-field phasing device for a missile-borne phased array antenna and a method for using the same, thereby overcoming, to at least some extent, one or more problems caused by limitations and defects in related technologies.

[0007] According to a first aspect of the present disclosure, a near-field phasing device for a missile-borne phased array antenna is provided, the device comprising:

[0008] Phase matching box, including box body, phase matching array, fixing frame and absorbing blank;

[0009] The housing is a hexahedron consisting of a main panel, a rear panel, a top panel, a bottom panel, and two side panels. The main panel has mounting holes for mounting the missile-borne antenna. The inner wall of the mounting holes has four evenly distributed positioning blocks to prevent the mounted missile-borne antenna from shifting along its circumference.

[0010] The phase array is fixed to the inner wall of the rear panel by the mounting bracket, and the position of the phase array is matched with the mounting hole so that the missile-borne antenna can pass through the mounting hole and connect to the phase array.

[0011] The microwave absorbing embryo is wedge-shaped and disposed inside the box to create an electromagnetic interference-free environment;

[0012] A clamp is provided on the outer wall of the main panel to hold the rear cover of the shell of the missile-borne antenna so that the missile-borne antenna is in close contact with the phase array surface;

[0013] The heat dissipation mechanism includes a first heat sink and a second heat sink that are movably disposed on the outer wall of the main panel;

[0014] The first heat sink and the second heat sink are respectively disposed on both sides of the mounting hole so that both the first heat sink and the second heat sink can be connected to the housing of the missile-borne antenna and dissipate heat.

[0015] At least one adjustable locking assembly is connected to the first heat sink and the second heat sink to adjust the spacing between the first heat sink and the second heat sink.

[0016] In one embodiment of this disclosure, the clamp includes:

[0017] Support rods, handles, and pressure rods;

[0018] One end of the support rod is fixedly connected to the outer wall of the main panel, and the first end of the handle is connected to the other end of the support rod and can rotate up and down along its longitudinal direction. The first end of the handle is connected to the pressure rod so that rotating the handle can cause the pressure rod to press or release the missile-borne antenna.

[0019] In one embodiment of this disclosure, the heat dissipation mechanism further includes:

[0020] A pair of parallel sliding guide rails;

[0021] Both sides of the first heat sink and both sides of the second heat sink are slidably mounted on the sliding guide rail, so that the first heat sink and the second heat sink can move on the sliding guide rail.

[0022] In one embodiment of this disclosure, both the first radiator and the second radiator are equipped with fans to dissipate heat from the first radiator and the second radiator.

[0023] In one embodiment of this disclosure, the lower panel is provided with support frames on both sides connected to the main panel and the rear panel, and a shelf is also provided on the support frame at one end of the main panel.

[0024] In one embodiment of this disclosure, handles are provided on the outer walls of the two side panels.

[0025] In one embodiment of this disclosure, a wiring board is further provided on the outer wall of the rear panel.

[0026] In one embodiment of this disclosure, the adjustable locking assembly includes:

[0027] First locking group and second locking group;

[0028] The locking group is disposed on the first heat sink, and the second locking group is disposed on the second heat sink. The first locking group and the second locking group can be locked or released so that the first heat sink and the second heat sink can clamp or release the shell of the missile-borne antenna.

[0029] According to a second aspect of the present disclosure, a method for using a phasing device is also provided, applied to the above-described near-field phasing device for a missile-borne phased array antenna, the method comprising:

[0030] By matching the pre-reserved notch on the shell of the missile-borne antenna with the positioning block, the missile-borne antenna is fixedly installed in the mounting hole;

[0031] The rear cover of the missile-borne antenna housing is held in place by a clamp;

[0032] The adjustable locking assembly is then adjusted so that the first heat sink and the second heat sink clamp the shell of the missile-borne antenna.

[0033] In one embodiment of this disclosure, the step of fixing the missile-borne antenna in the mounting hole further includes:

[0034] Select the corresponding main panel according to the positioning block that matches the pre-reserved notch on the shell of the missile-borne antenna, and install the main panel.

[0035] The technical solutions provided by the embodiments of this disclosure may include the following beneficial effects:

[0036] In the embodiments disclosed herein, the aforementioned near-field phasing device and method for using the missile-borne phased array antenna achieve the following: First, the housing and the absorbing blank form an electromagnetic interference-free environment, replacing the microwave anechoic chamber environment. This allows the device to meet the phasing requirements of large-scale missile-borne antennas and matches the missile-borne antenna with the phasing array, achieving point-to-point phasing. Second, positioning blocks constrain the circumferential degrees of freedom of the missile-borne antenna, while clamps hold the rear cover of the antenna housing to constrain the axial degrees of freedom. This ensures that the array and phasing array of the missile-borne antenna are parallel, and that the positions of each channel correspond, thereby enabling rapid positioning and clamping of the missile-borne antenna. Furthermore, adjustable latches tightly attach the first and second heat sinks to the surface of the missile-borne antenna housing, increasing the heat dissipation area and thus achieving heat dissipation for the missile-borne antenna. Attached Figure Description

[0037] The accompanying drawings, which are incorporated in and form part of this specification, illustrate embodiments consistent with this disclosure and, together with the description, serve to explain the principles of this disclosure. It is obvious that the drawings described below are merely some embodiments of this disclosure, and those skilled in the art can obtain other drawings based on these drawings without any inventive effort.

[0038] Figure 1 This diagram illustrates the structure of the near-field phasing device for a missile-borne phased array antenna in an exemplary embodiment of this disclosure.

[0039] Figure 2 Show Figure 1 Schematic diagram of the internal structure of the phase-matching box;

[0040] Figure 3 Show Figure 1 A schematic diagram of the structure of the main panel;

[0041] Figure 4 Show Figure 1 A schematic diagram showing the release of the missile-borne antenna by the clamp.

[0042] Figure 5 Show Figure 1 A schematic diagram showing the middle clamp holding the missile-borne antenna;

[0043] Figure 6 Show Figure 1 A schematic diagram showing the first and second heat sinks when they are close to the missile-borne antenna.

[0044] Figure 7 Show Figure 1 A schematic diagram showing the first and second heat sinks when they are far from the missile-borne antenna.

[0045] Figure 8 Show Figure 1 Schematic diagram of the central shelf structure;

[0046] Figure 9 Show Figure 1 Enlarged view of the connection between the central shelf and the support frame;

[0047] Figure 10 Show Figure 1 Schematic diagram of the middle and rear panel;

[0048] Figure 11 A diagram illustrating the steps of using the phasing apparatus in an exemplary embodiment of this disclosure is shown.

[0049] In the diagram: 100, Phase matching box; 110, Box body; 111, Main panel; 112, Rear panel; 113, Top panel; 114, Bottom panel; 115, Side panel; 120, Phase matching array; 130, Fixing bracket; 140, Wave-absorbing blank; 150, Mounting hole; 160, Positioning block; 170, Support frame; 171, Shelf; 180, Handle; 190, Wiring board; 200, Clamp; 210, Support rod; 220, Handle; 230, Pressure rod; 300, Heat dissipation mechanism; 310, First radiator; 320, Second radiator; 330, Metal sheet; 340, Fan; 400, Adjustable locking assembly. Detailed Implementation

[0050] Exemplary embodiments will now be described more fully with reference to the accompanying drawings. However, these exemplary embodiments can be implemented in many forms and should not be construed as limited to the examples set forth herein; rather, they are provided so that this disclosure will be more comprehensive and complete, and will fully convey the concept of the exemplary embodiments to those skilled in the art. The described features, structures, or characteristics may be combined in any suitable manner in one or more embodiments.

[0051] Furthermore, the accompanying drawings are merely illustrative diagrams of embodiments of this disclosure and are not necessarily drawn to scale. The same reference numerals in the drawings denote the same or similar parts, and therefore repeated descriptions of them will be omitted. Some block diagrams shown in the drawings are functional entities and do not necessarily correspond to physically or logically independent entities.

[0052] This example embodiment first provides a near-field phasing device for a missile-borne phased array antenna. (Reference) Figure 1 and Figure 2As shown, the missile-borne phased array antenna near-field phasing device may include: a phasing box 100, a clamp 200, a heat dissipation mechanism 300, and an adjustable locking assembly 400. The phase-coordinated array 100 includes a housing 110, a phase-coordinated array 120, a mounting bracket 130, and an absorbing embryo 140. The housing 110 is a hexahedron composed of a main panel 111, a rear panel 112, a top panel 113, a lower panel 114, and two side panels 115. The main panel 111 has mounting holes 150 for mounting the missile-borne antenna. The inner wall of the mounting holes 150 has four evenly distributed positioning blocks 160 to prevent the mounted missile-borne antenna from shifting circumferentially. The phase-coordinated array 120 is fixed to the inner wall of the rear panel 112 by the mounting bracket 130, and the positions of the phase-coordinated array 120 and the mounting holes 150 are matched so that the missile-borne antenna can pass through the mounting holes 150 and connect to the phase-coordinated array 120. The absorbing embryo 140 is wedge-shaped. The antenna is placed inside the housing 110 to create an electromagnetic interference-free environment; a clamp 200 is set on the outer wall of the main panel 111 to hold the rear cover of the missile-borne antenna housing so that the missile-borne antenna is in close contact with the phase array 120; a heat dissipation mechanism 300 includes a first heat sink 310 and a second heat sink 320 movably set on the outer wall of the main panel 111, the first heat sink 310 and the second heat sink 320 are respectively set on both sides of the mounting hole 150 so that the first heat sink 310 and the second heat sink 320 can be connected to the housing of the missile-borne antenna and dissipate heat; at least one adjustable locking assembly 400 is connected to the first heat sink 310 and the second heat sink 320 so that the distance between the first heat sink 310 and the second heat sink 320 can be adjusted.

[0053] Through the aforementioned near-field phasing device for the missile-borne phased array antenna, on the one hand, the housing 110 and the absorbing blank form an electromagnetic interference-free environment, replacing the microwave anechoic chamber environment, thus meeting the phasing requirements of large-scale missile-borne antennas and matching the missile-borne antenna with the phasing array 120, achieving point-to-point phasing. On the other hand, the clamp 200 abuts against the rear cover of the missile-borne antenna housing, ensuring that the missile-borne antenna array and the phasing array 120 are tightly attached, ensuring that the missile-borne antenna array and the phasing array 120 are parallel, and that the positional relationship of each channel corresponds, thereby constraining the axial degree of freedom of the missile-borne antenna and achieving rapid positioning and clamping of the missile-borne antenna. At the same time, the first heat sink 310 and the second heat sink 320 are tightly attached to the surface of the missile-borne antenna housing by adjustable latches to increase the heat dissipation area, thereby achieving heat dissipation of the missile-borne antenna.

[0054] Below, we will refer to Figures 1 to 11 The various parts of the near-field phasing device for the missile-borne phased array antenna described in this example embodiment will be explained in more detail.

[0055] In one embodiment, when installing the missile-borne antenna, the missile-borne antenna array and the phase array 120 must be parallel, have the same polarization direction, and be precisely positioned. Therefore, to ensure these requirements, the missile-borne antenna housing has four notches that engage with four positioning blocks 160 on the main panel 111 of the housing 110 to guarantee positional accuracy. Figure 3 As shown, four axially symmetrically distributed positioning blocks 160 on the inner wall of the mounting holes 150 on the main panel 111 of the housing 110 match the pre-reserved notches on the shell of the missile-borne antenna, thereby constraining the radial degree of freedom of the shell of the missile-borne antenna. That is, the positioning blocks 160 and the notches on the shell of the missile-borne antenna are used to hold the missile-borne antenna in place, preventing it from rotating around its circumference, so as to ensure that the antenna array and the radiator of the phase array 120 are aligned in direction and position.

[0056] It is understandable that the size of the shell will be different when using different missile-borne antennas. Therefore, the main panel 111 can be replaced with one that matches the notch on the shell of the missile-borne antenna to ensure the constraint of the circumferential degree of freedom of the missile-borne antenna.

[0057] It should be understood that if the shape of the notch on the shell of the missile-borne antenna is different, the main panel 111 that matches the notch on the shell of the missile-borne antenna can also be replaced.

[0058] In one embodiment, the clamp 200 includes a support rod 210, a handle 220, and a pressure rod 230; one end of the support rod 210 is fixedly connected to the outer wall of the main panel 111, the first end of the handle 220 is connected to the other end of the support rod 210 and can rotate up and down along its longitudinal direction, the first end of the handle 220 is connected to the pressure rod 230, so that rotating the handle 220 can cause the pressure rod 230 to press or release the missile-borne antenna.

[0059] Specifically, Figure 4 The image shows the state when the clamp 200 is released from the missile-borne antenna. When the handle 220 is pulled upwards, because the handle 220 is hinged to the pressure rod 230, the pressure rod 230 presses against the missile-borne antenna, thus clamping the clamp 200. Figure 5 As shown. When the clamp 200 needs to release the missile-borne antenna, the handle 220 is pulled down, and the lever 230 is used to release the missile-borne antenna.

[0060] In one embodiment, the heat dissipation mechanism 300 further includes: a pair of parallel sliding guide rails; both sides of the first heat sink 310 and both sides of the second heat sink 320 are slidably disposed on the sliding guide rails, so that the first heat sink 310 and the second heat sink 320 can move on the sliding guide rails.

[0061] Specifically, since the first heat sink 310 and the second heat sink 320 can move along the sliding guide rail, the distances between the first heat sink 310 and the missile-borne antenna housing, and between the second heat sink 320 and the missile-borne antenna housing, can be adjusted. When the missile-borne antenna array operates, it generates a large amount of heat. This heat is transferred to the housing and then further conducted to the heat sinks. Bringing the first heat sink 310 and the missile-borne antenna housing, and the second heat sink 320 and the missile-borne antenna housing closer together, enhances the heat dissipation of both heat sinks. For example... Figure 6 The diagram shown is a state diagram when the radiator is moved to the middle.

[0062] Meanwhile, when disassembling the missile-borne antenna, moving the first heat sink 310 and the second heat sink 320 to the sides facilitates the disassembly of the missile-borne antenna. For example... Figure 7 The diagram shown is a state diagram when the radiator is moved to both sides.

[0063] It is understood that the sliding guide rail can be a guide rail, a groove, a track formed by a metal sheet 330, etc., and is not limited to these. In this embodiment, the figure shows a track formed by a metal sheet 330.

[0064] In one embodiment, both the first radiator 310 and the second radiator 320 are provided with a fan 340 to dissipate heat from the first radiator 310 and the second radiator 320.

[0065] Specifically, while the first radiator 310 and the second radiator 320 dissipate heat, the fan 340 further dissipates heat from the first radiator 310 and the second radiator 320, thereby enhancing the heat dissipation and energy supply of the first radiator 310 and the second radiator 320.

[0066] In addition, the number of heat dissipation ducts of the heat sink can be adjusted according to the heat generated by the missile-borne antenna, as well as the wind speed of the fan 340 can be changed.

[0067] In one embodiment, the lower panel 114 is provided with support frames 170 on both sides connected to the main panel 111 and the rear panel 112, and a shelf 171 is also provided on the support frame 170 at one end of the main panel 111.

[0068] Specifically, the support frames 170 on both sides of the lower panel 114 can support the entire box 110, so that the box 110 can stand stably, and the shelf 171 on the support frame 170 can hold items.

[0069] Among them, such as Figure 8As shown, the connection between the shelf 171 and the support frame 170 is a threaded hole, connected to the support frame 170 by a screw as a shaft, allowing for conversion between horizontal and vertical states as needed. An enlarged view of the connection between the shelf 171 and the support frame 170 is shown below. Figure 9 As shown.

[0070] In addition, handles 180 are provided on the two side panels 115 to facilitate the movement of the missile-borne phased array antenna near-field phase coordination device.

[0071] like Figure 10 As shown, a junction box 190 is also provided on the rear panel 112.

[0072] In one embodiment, the adjustable locking assembly 400 includes: a first locking group and a second locking group; the locking group is disposed on the first heat sink 310, and the second locking group is disposed on the second heat sink 320; the first locking group and the second locking group can be locked or released so that the first heat sink 310 and the second heat sink 320 clamp or release the housing of the missile-borne antenna.

[0073] Specifically, when the first locking group and the second locking group are locked together, the housing of the missile-borne antenna can be clamped by the first heat sink 310 and the second heat sink 320 to achieve better heat dissipation.

[0074] According to a second aspect of the present disclosure, a method for using a phasing device is also provided, applied to the above-described near-field phasing device for a missile-borne phased array antenna, such as... Figure 11 As shown, the method includes steps S101 to S103.

[0075] Step S101: Using the notch reserved on the shell of the missile antenna to match the positioning block 160, the missile antenna is fixedly installed in the mounting hole 150.

[0076] Step S102: Use clamp 200 to hold the rear cover of the shell of the missile-borne antenna in place;

[0077] Step S103: Adjust the adjustable locking assembly 400 to clamp the housing of the missile-borne antenna between the first heat sink 310 and the second heat sink 320.

[0078] Specifically, the mounting holes 150 pre-drilled on the missile-borne antenna housing cooperate with the positioning blocks 160 on the main panel 111 of the housing 110 to constrain the circumferential degree of freedom of the missile-borne antenna housing, ensuring that the radiators of the missile-borne antenna array and the phase array 120 are aligned in direction and position. Then, the clamp 200 is used to hold the antenna rear cover, constraining the axial degree of freedom of the antenna, thus enabling rapid positioning and clamping of the antenna. The missile-borne antenna array generates a large amount of heat during operation. The missile-borne antenna, through its structural design, conducts this heat to the surface of the housing. Adjustable latches tightly attach the first heat sink 310 and the second heat sink 320 to the surface of the antenna housing to increase the heat dissipation area. A fan 340 blows air towards the heat sinks to dissipate heat. At this point, the clamping and heat dissipation work of the missile-borne antenna is completed, and the antenna can be powered on for the next step of operation.

[0079] When disassembling the antenna, after powering off, open the adjustable latch, pull the two heat sinks to the left and right sides respectively, then lift the clamp 200 and remove the antenna to complete the disassembly.

[0080] In one embodiment, before fixing the missile-borne antenna in the mounting hole 150, the method further includes: selecting the corresponding main panel 111 according to the positioning block 160 that matches the notch reserved on the housing of the missile-borne antenna, and installing the main panel 111.

[0081] Specifically, the size or shape of the mounting holes 150 reserved on the shell of different missile-borne antennas may be different. Before installing the missile-borne antenna, the positioning block 160 is matched with the mounting holes 150 reserved on the shell of the missile-borne antenna, and the corresponding main panel 111 is replaced to constrain the circumferential degree of freedom of the shell of the missile-borne antenna.

[0082] By using the above-described method for the near-field phasing device of the missile-borne phased array antenna, on the one hand, the housing 110 and the absorbing blank form an electromagnetic interference-free environment, replacing the microwave anechoic chamber environment, thus meeting the phasing requirements of large-scale missile-borne antennas and matching the missile-borne antenna with the phasing array 120, achieving point-to-point phasing. On the other hand, the clamp 200 is used to hold the rear cover of the missile-borne antenna housing, ensuring that the missile-borne antenna array and the phasing array 120 are tightly attached, ensuring that the missile-borne antenna array and the phasing array 120 are parallel, and that the positional relationship of each channel corresponds, thereby constraining the axial degree of freedom of the missile-borne antenna and achieving rapid positioning and clamping of the missile-borne antenna. At the same time, the first heat sink 310 and the second heat sink 320 are tightly attached to the surface of the missile-borne antenna housing by adjustable latches to increase the heat dissipation area, thereby achieving heat dissipation of the missile-borne antenna.

[0083] It should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", etc., in the above description indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing the embodiments of this disclosure and simplifying the description, and are not intended to indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on the embodiments of this disclosure.

[0084] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of embodiments of this disclosure, "a plurality of" means two or more, unless otherwise explicitly specified.

[0085] In the embodiments of this disclosure, unless otherwise expressly specified and limited, the terms "installation," "connection," "linking," "fixing," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components. Those skilled in the art can understand the specific meaning of the above terms in this disclosure according to the specific circumstances.

[0086] In embodiments of this disclosure, unless otherwise expressly specified and limited, "above" or "below" the second feature can include direct contact between the first and second features, or contact between the first and second features through another feature between them. Furthermore, "above," "over," and "on top" of the second feature includes the first feature being directly above or diagonally above the second feature, or simply indicates that the first feature is at a higher horizontal level than the second feature. "Below," "below," and "under" the second feature includes the first feature being directly below or diagonally below the second feature, or simply indicates that the first feature is at a lower horizontal level than the second feature.

[0087] In the description of this specification, the references to terms such as "one embodiment," "some embodiments," "example," "specific example," or "some examples," etc., indicate that a specific feature, structure, material, or characteristic described in connection with that embodiment or example is included in at least one embodiment or example of this disclosure. In this specification, the illustrative expressions of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in one or more embodiments or examples. In addition, those skilled in the art can combine and integrate the different embodiments or examples described in this specification.

[0088] Other embodiments of this disclosure will readily occur to those skilled in the art upon consideration of the specification and practice of the invention disclosed herein. This application is intended to cover any variations, uses, or adaptations of this disclosure that follow the general principles of this disclosure and include common knowledge or customary techniques in the art not disclosed herein. The specification and examples are to be considered exemplary only, and the true scope and spirit of this disclosure are indicated by the appended claims.

Claims

1. A near-field phasing device for a missile-borne phased array antenna, characterized in that, The device includes: Phase matching box, including box body, phase matching array, fixing frame and absorbing blank; The housing is a hexahedron consisting of a main panel, a rear panel, a top panel, a bottom panel, and two side panels. The main panel has mounting holes for mounting the missile-borne antenna. The inner wall of the mounting holes has four evenly distributed positioning blocks to prevent the mounted missile-borne antenna from shifting along its circumference. The phase array is fixed to the inner wall of the rear panel by the mounting bracket, and the position of the phase array is matched with the mounting hole so that the missile-borne antenna can pass through the mounting hole and connect to the phase array. Each of the microwave absorbing embryos is wedge-shaped, and multiple microwave absorbing embryos are arranged inside the box to form an electromagnetic interference-free environment; A clamp is provided on the outer wall of the main panel to hold the rear cover of the shell of the missile-borne antenna so that the missile-borne antenna is in close contact with the phase array surface; The heat dissipation mechanism includes a first heat sink and a second heat sink that are movably disposed on the outer wall of the main panel; The first heat sink and the second heat sink are respectively disposed on both sides of the mounting hole so that both the first heat sink and the second heat sink can be connected to the housing of the missile-borne antenna and dissipate heat. At least one adjustable locking assembly is connected to the first heat sink and the second heat sink to adjust the spacing between the first heat sink and the second heat sink.

2. The near-field phasing device for a missile-borne phased array antenna according to claim 1, characterized in that, The clamp includes: Support rods, handles, and pressure rods; One end of the support rod is fixedly connected to the outer wall of the main panel, and the first end of the handle is connected to the other end of the support rod and can rotate up and down along its longitudinal direction. The first end of the handle is connected to the pressure rod so that rotating the handle can cause the pressure rod to press or release the missile-borne antenna.

3. The near-field phasing device for a missile-borne phased array antenna according to claim 1, characterized in that, The heat dissipation mechanism also includes: A pair of parallel sliding guide rails; Both sides of the first heat sink and both sides of the second heat sink are slidably mounted on the sliding guide rail, so that the first heat sink and the second heat sink can move on the sliding guide rail.

4. The near-field phasing device for a missile-borne phased array antenna according to claim 1, characterized in that, Both the first radiator and the second radiator are equipped with fans to dissipate heat from the first radiator and the second radiator.

5. The near-field phasing device for a missile-borne phased array antenna according to claim 1, characterized in that, The lower panel is provided with support frames on both sides that are connected to the main panel and the rear panel, and a shelf is also provided on the support frame at one end of the main panel.

6. The near-field phasing device for a missile-borne phased array antenna according to claim 1, characterized in that, Handles are provided on the outer walls of the two side panels.

7. The near-field phasing device for a missile-borne phased array antenna according to claim 1, characterized in that, A wiring board is also provided on the outer wall of the rear panel.

8. The near-field phasing device for a missile-borne phased array antenna according to claim 1, characterized in that, The adjustable locking assembly includes: First locking group and second locking group; The locking group is disposed on the first heat sink, and the second locking group is disposed on the second heat sink. The first locking group and the second locking group can be locked or released so that the first heat sink and the second heat sink can clamp or release the shell of the missile-borne antenna.

9. A method of using a phase coordination device, characterized in that, The method, applied to the near-field phasing device for a missile-borne phased array antenna according to any one of claims 1 to 8, comprises: By matching the pre-reserved notch on the shell of the missile-borne antenna with the positioning block, the missile-borne antenna is fixedly installed in the mounting hole; The rear cover of the missile-borne antenna housing is held in place by a clamp; The adjustable locking assembly is then adjusted so that the first heat sink and the second heat sink clamp the shell of the missile-borne antenna.

10. The method of using the phase matching device according to claim 9, characterized in that, Before fixing the missile-borne antenna into the mounting hole, the process also includes: Select the corresponding main panel according to the positioning block that matches the pre-reserved notch on the shell of the missile-borne antenna, and install the main panel.

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