ceramic component

Abstract

A ceramic member has a base material made of ceramic and a cover layer made of ceramic provided on a surface of the base material. The ceramic member is provided on the surface of the base material with a plurality of protrusions protruding toward the cover layer. In addition, a space between adjacent protrusions is 100 μm or more and 2000 μm or less.

Description

Technical Field

[0001] This application claims priority to Japanese Patent Application No. 2020-144920, filed on August 28, 2020. The entire contents of that application are incorporated herein by reference. This specification discloses a technology related to ceramic components. Background Technology

[0002] Japanese Patent Application Publication No. 2001-278685 (hereinafter referred to as Patent Document 1) discloses a ceramic component in which a ceramic (silicon carbide) covering layer is provided on the surface of a ceramic (silicon carbide) substrate. In Patent Document 1, the surface roughness (Rz) of the substrate is adjusted to 20 μm or more by sandblasting, thereby suppressing the peeling of the covering layer from the substrate. Summary of the Invention

[0003] Regarding the ceramic component in Patent Document 1, roughening the surface of the substrate can suppress the peeling of the cover layer from the substrate to a certain extent. However, the inventors of this invention conducted research and found that if only the surface of the substrate is roughened, the cover layer peels off from the substrate due to the difference in thermal expansion coefficients between the substrate and the cover layer during repeated heating of the ceramic component. In other words, it can be determined that if only the surface of the substrate is roughened, it is difficult to obtain a ceramic component with high durability (long lifespan). The object of this specification is to provide a technique for achieving a ceramic component with high durability.

[0004] The ceramic component disclosed in this specification may have a ceramic substrate and a ceramic cover layer disposed on the surface of the substrate. The ceramic component may have multiple protrusions protruding toward the cover layer on the surface of the substrate, with the spacing between adjacent protrusions being 100 μm to 2000 μm.

[0005] Other ceramic components disclosed in this specification may have a ceramic substrate and a ceramic covering layer disposed on the surface of the substrate. The ceramic component may have multiple recesses on the surface of the substrate, with the spacing between adjacent recesses being 100 μm to 2000 μm. Attached Figure Description

[0006] Figure 1 A cross-sectional view of the ceramic component of the first embodiment is shown.

[0007] Figure 2 A cross-sectional view of the ceramic component of the second embodiment is shown.

[0008] Figure 3 Enlarged views of the substrate surface of the ceramic components of the first and second embodiments are shown.

[0009] Figure 4 An enlarged view of the substrate surface of the ceramic component according to the third embodiment is shown.

[0010] Figure 5 An enlarged view of the substrate surface of the ceramic component according to the fourth embodiment is shown.

[0011] Figure 6 An enlarged view of the substrate surface of the ceramic component according to the fifth embodiment is shown. Detailed Implementation

[0012] The ceramic component disclosed in this specification may include: a ceramic substrate; and a ceramic covering layer disposed on the surface of the substrate. The shape of the ceramic component is not particularly limited and may be plate-shaped, box-shaped, cylindrical, or columnar. For example, when the ceramic component is plate-shaped or box-shaped, it may be a firing support plate used to hold electronic components or other objects to be fired in a furnace. When the ceramic component is used as a firing support plate, the material of the covering layer must be a material that does not react with the object to be fired. In other words, the covering layer must be a material that inhibits the reaction between the substrate and the object to be fired and is formed of a material different from the substrate. When the ceramic component is used as a firing support plate, the substrate material may be SiC. By using a SiC substrate, ceramic components with high heat resistance and high strength can be obtained. Furthermore, when the substrate is SiC, the material of the covering layer may be monomers of oxides of Al, Si, Zr, Y, or Mg, or mixtures of these oxides. Using these oxides (monomers or mixtures) as the covering layer can inhibit the reaction between the substrate and the object to be fired.

[0013] For the ceramic components disclosed in this specification, multiple protrusions or recesses protruding toward the cover layer can be provided on the surface of the substrate. Furthermore, the spacing between adjacent protrusions and recesses can be 100 μm to 2000 μm. When such protrusions are provided on the surface of the substrate, if a cover layer is formed on the surface of the substrate, the protrusions are embedded in the cover layer, thereby achieving an effect of firmly fixing the cover layer to the substrate (anchoring effect). Similarly, when the aforementioned recesses are provided on the surface of the substrate, if a cover layer is formed on the surface of the substrate, the cover layer is embedded in the recesses, thereby achieving a strong anchoring effect. For the ceramic components disclosed in this specification, by providing the aforementioned protrusions or recesses on the surface of the substrate, compared to conventional ceramic components, it is possible to suppress the peeling of the cover layer from the substrate, thereby improving durability (extending lifespan).

[0014] The shape of the protrusions and recesses when viewed from above the substrate surface is not particularly limited and can be circular, polygonal (triangle, quadrilateral, etc.), or cross-shaped, etc. It should be noted that the interval between adjacent protrusions (recesses) refers to the length connecting the centers of adjacent protrusions (recesses) to each other, and does not imply the gap between protrusions (recesses) (i.e., the length of the portion where no protrusion (recess) is provided). Furthermore, protrusions and recesses can be formed in strip shapes. In this case, the interval between adjacent protrusions (recesses) refers to the shortest distance from any position on a specific protrusion (recess) to the adjacent protrusion (recess). It should be noted that the interval between adjacent protrusions (recesses) can be obtained by measuring the interval at 10 locations using images obtained using a scanning electron microscope (SEM) or similar instruments and calculating the average value.

[0015] It should be noted that when the protrusions (recesses) are strip-shaped, in addition to the strip-shaped first protrusion (first recess) extending along the first direction, a strip-shaped second protrusion (second recess) extending along a second direction intersecting the first direction is also provided on the substrate surface. The first protrusion (first recess) and the second protrusion (second recess) form a grid-like pattern of protrusions (recesses) on the substrate surface. In this case, all the protrusions (recesses) are connected, thus providing a grid-like continuous portion on the substrate surface, with the recesses (protrusions) existing independently between the continuous portions. Therefore, the situation where a grid-like continuous portion is provided on the substrate surface is referred to as having multiple recesses (multiple protrusions) on the substrate surface.

[0016] When a protrusion is provided on the surface of the substrate, the materials of the substrate and the protrusion can be the same or different. It should be noted that when the materials of the substrate and the protrusion are different, the difference in thermal expansion rates between the substrate and the protrusion can be 10% or less. That is, the absolute value of {(thermal expansion rate of the substrate) - (thermal expansion rate of the protrusion)} / (thermal expansion rate of the substrate) can be 0.1 or less. Accordingly, separation between the substrate and the protrusion is suppressed, and as a result, peeling of the cover layer from the substrate can be suppressed. Alternatively, the substrate and the protrusion can be made of the same material. If the substrate and the protrusion are made of the same material, it is easy to adjust the difference in their thermal expansion rates to 10% or less. It should be noted that "the substrate and the protrusion are made of the same material" means that the main material of the substrate (the material with the highest content in the substrate) and the main material of the protrusion are the same.

[0017] When a protrusion is provided on the substrate surface, the protrusion height can be 1 μm to 200 μm. If the protrusion height is 1 μm or more, the protrusion is fully embedded in the capping layer, thereby achieving a strong anchoring effect. If the protrusion height is 200 μm or less, it is possible to suppress local thinning of the capping layer or the formation of unevenness on the surface of the capping layer (the surface of the ceramic component). Furthermore, if the protrusion height is 10 μm to 200 μm, a more reliable and strong anchoring effect can be obtained; therefore, this method is particularly preferred. It should be noted that if only protrusions with a protrusion height of 1 μm to 200 μm are provided on the substrate surface, a strong anchoring effect cannot be obtained. To obtain a strong anchoring effect, the protrusion height of 1 μm to 200 μm needs to be set such that the interval between adjacent protrusions is 100 μm to 2000 μm. The protrusion height of 10 protrusions is obtained by measuring the protrusion height of 10 protrusions and calculating the average value based on cross-sectional images of ceramic parts obtained using scanning microscopes or similar instruments.

[0018] When protrusions are provided on the surface of the substrate, the width of the protrusions depends on the spacing between adjacent protrusions and can be between 10 μm and 200 μm. If the width of the protrusion is 10 μm or more, even if force is applied from the cover layer to the protrusion due to the difference in thermal expansion coefficients between the substrate (or protrusion) and the cover layer, protrusion breakage can be suppressed, thereby suppressing the peeling of the cover layer from the substrate. If the width of the protrusion is 200 μm or less, the width of the recess in the cover layer (the protrusion sinks into the cover layer, resulting in a recess in the cover layer) is also 200 μm or less. When the cover layer expands due to heat, the size of the recess in the cover layer can be suppressed, thereby suppressing the peeling of the cover layer from the substrate (the protrusions of the substrate and the recesses of the cover layer are misaligned). The width of the protrusions can be obtained by measuring the width of 10 protrusions and calculating the average value based on cross-sectional images of ceramic parts obtained using scanning microscopes or the like.

[0019] It should be noted that when a recess is provided on the substrate surface, the cover layer fills the recess to achieve a strong anchoring effect. Conversely, the recess on the substrate surface can be viewed as a protrusion in the cover layer embedded within the substrate. Therefore, similar to the case of a protrusion on the substrate surface, the depth of the recess can be 1 μm to 200 μm, with a particularly preferred depth of 10 μm to 200 μm, and the width can be 10 μm to 200 μm. Furthermore, the depth and width of the recess can be obtained by measuring the depth and width of 10 recesses using a cross-sectional image of the ceramic component obtained using a scanning microscope or similar means, and calculating the average value.

[0020] The capping layer can have multiple cracks extending in the thickness direction. These cracks can extend from one end of the capping layer in the thickness direction to the other, or from one end to the middle portion in the thickness direction. The capping layer having cracks extending in the thickness direction mitigates the force exerted from the substrate to the capping layer due to the difference in thermal expansion coefficients between the substrate and the capping layer. This suppresses damage to the capping layer and improves the durability (lifespan) of the ceramic component. It should be noted that the spacing between adjacent cracks can be between 10 μm and 2000 μm. If the spacing between adjacent cracks is 10 μm or more, the strength of the capping layer can be ensured. Furthermore, if the spacing between adjacent cracks is 2000 μm or less, the effect of mitigating the force exerted from the substrate to the capping layer can be fully realized.

[0021] Example

[0022] (First Embodiment)

[0023] Reference Figure 1 The ceramic component 10 will now be described. The ceramic component 10 is flat and includes: a SiC substrate 2; and a ZrO2 capping layer 8 disposed on the surface 2S of the substrate 2. Protrusions 4 are provided on the surface 2S of the substrate 2, protruding toward the capping layer 8. It should be noted that the protrusions 4 are not exposed on the surface of the capping layer 8 (the side opposite to the substrate 2 side). A plurality of protrusions 4 extending in the X direction are provided in strips on the surface 2S of the substrate 2. It should be noted that the protrusions 4 are the remaining portions formed by forming a mask layer with openings on the surface of the substrate 2 and etching the opening portions of the substrate 2. Therefore, the protrusions 4 and the substrate 2 are made of the same material (SiC).

[0024] A ceramic component 10 is manufactured by sputtering ZrO2 onto a substrate 2 having protrusions 4, thereby forming a capping layer (ZrO2 film) 8 on the surface 2 of the substrate 2. Multiple cracks 12 extending from the back side (substrate 2 side) toward the surface are provided in the capping layer 8. The cracks 12 are located between the protrusions 4 and are not exposed on the surface of the capping layer 8. The thickness T2 of the substrate 2 is 500 μm, the thickness T8 of the capping layer 8 is 300 μm, and the thickness (protrusion height) T4 of the protrusions 4 is 100 μm. Therefore, the thickness of the capping layer 8 on the protrusions 4 is 200 μm.

[0025] (Second Embodiment)

[0026] Reference Figure 2 The ceramic component 10a will be described below. Ceramic component 10a is a variation of ceramic component 10. The reference numbers for features common to ceramic component 10 are the same as those for ceramic component 10, and therefore the description is sometimes omitted.

[0027] In the ceramic component 10a, a recess 40 is provided on the surface 2S of the substrate 2a. The cover layer 8 is recessed into the recess 40. A plurality of recesses 40 extend in a strip shape along the X direction. The recesses 40 are formed by forming a mask layer with openings on the surface of the substrate 2a and etching the opening portion of the substrate 2a.

[0028] A ceramic component 10a is manufactured by sputtering ZrO2 onto a substrate 2a having recesses 40 and forming a capping layer (ZrO2 film) 8 on the surface 2S of the substrate 2a. Multiple cracks 12a are provided in the capping layer 8. The cracks 12a are located between the recesses 40. The thickness T2a of the substrate 2a is 500 μm, the thickness T8 of the capping layer 8 is 300 μm, and the depth T40 of the recesses 40 is 100 μm. In the ceramic component 10a, a capping layer 8 of at least 300 μm (400 μm thick for the portion corresponding to the recesses 40) is ensured across the entire surface 2S of the substrate 2a.

[0029] (Features of convex part 4 and concave part 40)

[0030] Reference Figure 3 The features of the protrusion 4 of the ceramic component 10 and the recess 40 of the ceramic component 10a will be described. Figure 3 This is a top view of the substrate 2 and substrate 2a. A plurality of protrusions 4 (recesses 40) extending in the X direction are provided on the surface 2S of the substrate 2 (2a). That is, the protrusions 4 (recesses 40) are formed in a strip shape on the surface 2S of the substrate 2 (2a). The width 4W (40W) of the protrusions 4 (recesses 40) is 100 μm. Furthermore, the interval 4L (40L) between adjacent protrusions 4 (recesses 40) is 400 μm. It should be noted that the interval 4L (40L) is the distance from any position 3 at the center of a particular protrusion 4 (recess 40) in the width direction to the position 5 where the distance between it and the center of the adjacent protrusion 4 (recess 40) in the width direction is the shortest. Additionally, as described above, cracks 12 are provided between the protrusions 4 and 4, and between the recesses 40 and 40. The interval between adjacent cracks 12 is adjusted to 300–500 μm.

[0031] As described above, the protrusion 4 and the recess 40 are formed by forming a mask layer with openings and etching the opening portions. Specifically, the protrusion 4 is formed only at the location where the protrusion 4 is to be formed, and the remaining portions are etched. Figure 3 The surface 2S is etched. On the other hand, the recess 40 is formed only at the location where the recess 40 is not formed. Figure 3 It is formed by forming a mask layer on the surface 2S and etching the rest (the part where the recess 40 is to be formed).

[0032] (Advantages of ceramic components 10 and 10a)

[0033] In ceramic component 10, the protrusion 4 is embedded in the cover layer 8, and in ceramic component 10a, the cover layer 8 is embedded in the recess 40, thereby achieving a strong anchoring effect between the substrate 2 (2a) and the cover layer 8. Therefore, the cover layer 8 is difficult to peel off from the substrate 2, and the durability of ceramic component 10 (10a) is improved.

[0034] Furthermore, in conventional ceramic components, when the difference in thermal expansion coefficients between the substrate and the capping layer is large (e.g., the substrate is SiC and the capping layer is ZrO2), an intermediate layer is required between the substrate and the capping layer to mitigate this difference. However, in the case of ceramic components 10 and 10a, since a strong anchoring effect can be achieved between the substrate 2 (2a) and the capping layer 8, the intermediate layer can be omitted even if the difference in thermal expansion coefficients between the substrate and the capping layer is large. It should be noted that by omitting the intermediate layer, the cost and weight of the ceramic component can be reduced. In addition, in ceramic components 10 and 10a, since the capping layer 8 has a crack 12, even if a force is applied from the substrate 2 (2a) to the capping layer 8 due to the difference in thermal expansion coefficients between the substrate 2 (2a) and the capping layer 8, the crack 12 will mitigate the force applied to the capping layer 8, thereby preventing damage to the capping layer 8.

[0035] (Third Embodiment)

[0036] Reference Figure 4 The ceramic component 10b will be described below. Ceramic component 10b is a variation of ceramic components 10 and 10a, but the shape of the surface 32S of the substrate 32 (32a) differs from that of ceramic components 10 and 10a. Other features of ceramic component 10b (features of the coating layer) are the same as those of ceramic components 10 and 10a; therefore, descriptions will be omitted below. It should be noted that... Figure 4 The diagram shows the morphology of the convex portions 4 formed on the surface 32S of the substrate 32, which form a lattice-like continuous portion 42, and the morphology of the concave portions 40 formed on the surface 32S of the substrate 32a, which form a lattice-like continuous portion 42, corresponding to the first embodiment and the second embodiment (ceramic components 10, 10a). Figure 3 .

[0037] A plurality of protrusions 4a (recesses 40a) extending in the X direction and a plurality of protrusions 4b (recesses 40b) extending in the Y direction orthogonal to the X direction are provided on the surface 32S of the substrate 32 (32a). The protrusions 4a and 4b, and the recesses 40a and 40b are integrally formed into a grid-like continuous portion 42.

[0038] Specifically describing the substrate 32, the surface 32S of the substrate 32 is divided into multiple portions by means of a continuous portion 42 formed by protrusions 4a and 4b, and is recessed relative to the continuous portion 42. That is, the surface 32S of the substrate 32 forms recesses. In the substrate 32, the protrusions 4a and 4b have the same width 4W, which is 100 μm. In addition, in the substrate 32, the spacing 4L (the spacing between adjacent recesses) between the centers 7, 7 of adjacent surfaces 32S (i.e., recesses) divided by the continuous portion 42 is 400 μm. In the case of the substrate 32, a mask layer is formed at the position where the continuous portion 42 is to be formed, and the portion surrounded by the mask layer ( Figure 3 The surface 2S is etched to form a continuous portion 42 (protrusions 4a, 4b).

[0039] Similarly, the surface 32S of the substrate 32a is divided into multiple portions by a continuous portion 42 formed by recesses 40a and 40b, and protrudes relative to the continuous portion 42. That is, the surface 32S of the substrate 32a forms a protrusion. In the substrate 32a, the recesses 40a and 40b have the same width 4W, which is 100 μm. In addition, in the substrate 32a, the spacing 4L (the spacing between adjacent protrusions) between the centers 7, 7 of adjacent surfaces 32S (i.e., protrusions) divided by the continuous portion 42 is 400 μm. In the case of the substrate 32a, in the portion other than the continuous portion 42 to be formed ( Figure 3 A mask layer is formed on the surface 2S and the portion to be formed of the continuity 42 is etched, thereby forming the continuity 42.

[0040] (Fourth Embodiment)

[0041] Reference Figure 5 The ceramic component 10c will be described below. Ceramic component 10c is a variation of ceramic components 10, 10a, and 10b, and the shape of the surface 52S of the substrate 52 (52a) is different from that of ceramic components 10, 10a, and 10b. Regarding ceramic component 10c, the description is omitted for features common to ceramic components 10, 10a, and 10b (features of the coating layer). Figure 5 The images show a configuration where multiple independent protrusions 4 are formed on the surface 52S of the substrate 52, and multiple independent recesses 40 are formed on the surface 52S of the substrate 52a, corresponding to the first and second embodiments. Figure 3 The third embodiment Figure 4 .

[0042] The protrusion 4 (recess 40) is circular, and the width 4W (40W) of the protrusion 4 (recess 40) is the diameter of the circle. The spacing 4L (40L) between adjacent protrusions 4 (recesses 40) is the distance between the centers of the circles. In the substrate 52 (52a), the width 4W (40W) of the protrusion 4 (recess 40) is 100 μm, and the spacing 4L (40L) between adjacent protrusions 4 (recesses 40) is 400 μm. For the substrate 52 (52a), a mask layer with openings can also be formed on the surface 52S of the substrate 52 (52a) using an etching technique.

[0043] (Fifth Embodiment)

[0044] Reference Figure 6 The ceramic component 10d will be described below. The ceramic component 10d is a variation of the ceramic component 10c. The shape of the protrusion 4 (recess 40) provided on the surface 62S of the substrate 62 (62a) is different from the shape of the protrusion 4 (recess 40) provided on the surface 52S of the substrate 52 (52a). Figure 6 The images show a configuration in which multiple protrusions 4 are formed on the surface 62S of the substrate 62, and multiple recesses 40 are formed on the surface 62S of the substrate 62a.

[0045] The protrusion 4 (recess 40) is cross-shaped. In the case of the cross-shaped protrusion 4 (recess 40), the width 4W (40W) of the protrusion 4 (recess 40) is the length of the long side of the rectangle forming the cross shape, and is the diameter of the circle circumscribed around the protrusion 4 (recess 40). In addition, the interval 4L (40L) between adjacent protrusions 4 (recesses 40) is the distance between the centers of the cross (the centers of the circumscribed circles). In the substrate 62 (62a), the width 4W (40W) of the protrusion 4 (recess 40) is 100 μm, and the interval 4L (40L) between adjacent protrusions 4 (recesses 40) is 400 μm. For the substrate 62 (62a), a mask layer with an opening can also be formed on the surface 62S of the substrate 62 (62a) and formed using an etching technique.

[0046] The above embodiments illustrate an example of forming a protrusion (recess) using etching technology. However, protrusions (recesses) can also be formed by sandblasting, stamping, or the like. Furthermore, the substrate and the protrusion (recess) can be formed from different materials. For example, a multilayer substrate composed of different materials can be prepared, and a portion of one of the layers can be etched to form the protrusion (recess).

[0047] Furthermore, the shape of the protrusions (recesses) is not limited to the shape described in the above embodiment. For example, when viewed from above, the protrusions (recesses) can be strips extending in three different directions. In this case, all the protrusions (recesses) are connected, thereby providing a grid-like continuous portion on the surface of the substrate, with the recesses (protrusions) existing independently between the continuous portions. Importantly, the protrusions (recesses) are provided on the surface of the substrate, and the spacing between adjacent protrusions (recesses) is adjusted to be more than 100 μm and less than 2000 μm, so that the cover layer is provided on the surface of the substrate in such a way that the protrusions are embedded in the cover layer or the cover layer is embedded in the recesses.

[0048] The specific examples of the present invention have been described in detail above; however, these examples are merely illustrative and do not limit the scope of the claims. The technology described in the claims includes solutions obtained by various modifications and alterations to the specific examples illustrated above. Furthermore, the technical elements described in this specification or drawings exert their technical usefulness individually or in various combinations, and are not limited to the combinations described in the claims at the time of application. Additionally, the technologies illustrated in this specification or drawings can achieve multiple objectives simultaneously, and the technology for achieving one of these objectives is itself technically useful.

[0049] Explanation of reference numerals in the attached figures

[0050] 2, 2a: Substrate

[0051] 4: convex part

[0052] 8: Covering layer

[0053] 10, 10a: Ceramic components

[0054] 40: concave part

Claims

1. A ceramic component comprising: a ceramic substrate; and a ceramic covering layer disposed on the surface of the substrate. The ceramic component is characterized in that... The surface of the substrate is provided with a plurality of protrusions that project toward the cover layer. The spacing between adjacent protrusions is between 100 μm and 2000 μm. The width of the protrusion is between 10 μm and 200 μm. The covering layer has multiple cracks extending in the thickness direction. The crack extends from the back of the cover layer toward the surface to the middle portion in the thickness direction.

2. The ceramic component according to claim 1, characterized in that, The difference in thermal expansion coefficient between the substrate and the protrusion is less than 10%.

3. The ceramic component according to claim 1, characterized in that, The substrate and the protrusion are made of the same material.

4. The ceramic component according to claim 1, characterized in that, The protrusion height of the protrusion is between 1 μm and 200 μm.

5. The ceramic component according to claim 1, characterized in that, The protrusion height of the protrusion is between 10 μm and 200 μm.

6. A ceramic component comprising: a ceramic substrate; and a ceramic covering layer disposed on the surface of the substrate. The ceramic component is characterized in that... Multiple recesses are provided on the surface of the substrate. The spacing between adjacent recesses is between 100 μm and 2000 μm. The covering layer has multiple cracks extending in the thickness direction. The crack extends from the back of the cover layer toward the surface to the middle portion in the thickness direction.

7. The ceramic component according to claim 6, characterized in that, The surface of the substrate is provided with a grid-like continuous portion formed by a plurality of first protrusions extending along a first direction and a plurality of second protrusions extending along a second direction intersecting the first direction. The plurality of recesses are recesses formed by dividing the continuous portion.

8. The ceramic component according to claim 7, characterized in that, The difference in thermal expansion coefficient between the substrate and the continuous portion is less than 10%.

9. The ceramic component according to claim 7, characterized in that, The substrate and the continuous portion are made of the same material.

10. The ceramic component according to claim 1 or 6, characterized in that, The interval between adjacent cracks is between 10 μm and 2000 μm.

11. The ceramic component according to claim 1 or 6, characterized in that, The substrate is SiC.

12. The ceramic component according to claim 1 or 6, characterized in that, The coating layer is composed of monomers or mixtures of oxides of Al, Si, Zr, Y or Mg.

13. A firing support plate for firing, characterized in that, The firing support plate is composed of the ceramic component described in claim 1 or 6.

Images