Process parameter determination method and device based on thermistor, equipment and medium

Abstract

The application provides a process parameter determination method and device based on a thermistor, equipment and a medium. The method comprises the following steps: determining the correlation information between the process parameter of the thermistor and the preset performance parameter; wherein the process parameter is used to represent the parameter of the preparation process when the thermistor is produced, the performance parameter comprises the resistivity, the resistance temperature coefficient and the noise parameter of the thermistor, and the correlation information is used to represent the size relationship between the process parameter and the performance parameter; determining the target value of the process parameter according to the correlation information between the process parameter and each performance parameter and the parameter value condition of the preset performance parameter; wherein the target value is used to represent that the performance parameter satisfies the parameter value condition when the process parameter takes the target value; and the process parameter and the target value are associated and stored. The method provided by the application improves the determination accuracy of the process parameter.

Description

Technical Field

[0001] This application relates to computer technology, and in particular to a method, apparatus, equipment and medium for determining process parameters based on a thermistor. Background Technology

[0002] A thermistor is a type of sensor resistor whose resistance changes with temperature. Thermistors have applications in various technical fields; for example, in infrared detection technology, thermal infrared detectors are an important tool.

[0003] The production of thermistors involves various process parameters, such as temperature, doping concentration, annealing time, deposition temperature, and gas dilution. Different values ​​of these process parameters affect the thermistor's performance. Therefore, accurately determining the optimal values ​​of these process parameters to ensure the thermistor meets application requirements is a pressing issue. Summary of the Invention

[0004] This application provides a method, apparatus, equipment, and medium for determining process parameters based on thermistors, in order to improve the accuracy of process parameter determination.

[0005] In a first aspect, this application provides a method for determining process parameters based on a thermistor, comprising:

[0006] The correlation information between the process parameters of the thermistor and the preset performance parameters is determined; wherein, the process parameters are used to represent the parameters of the manufacturing process when producing the thermistor, and the performance parameters include the resistivity, temperature coefficient of resistance and noise parameters of the thermistor, and the correlation information is used to represent the magnitude relationship between the process parameters and the performance parameters;

[0007] Based on the correlation information between the process parameters and each performance parameter, and the preset parameter value conditions between the performance parameters, the target value of the process parameter is determined; wherein, the target value is used to indicate that when the process parameter takes the target value, the performance parameter satisfies the parameter value conditions;

[0008] The process parameters are associated with and stored with the target value.

[0009] Secondly, this application provides a process parameter determination device based on a thermistor, comprising:

[0010] An information determination module is used to determine the correlation information between the process parameters of the thermistor and the preset performance parameters; wherein, the process parameters are used to represent the parameters of the manufacturing process when producing the thermistor, the performance parameters include the resistivity, temperature coefficient of resistance and noise parameters of the thermistor, and the correlation information is used to represent the magnitude relationship between the process parameters and the performance parameters;

[0011] The target value determination module is used to determine the target value of the process parameter based on the correlation information between the process parameter and each performance parameter, as well as the preset parameter value conditions between the performance parameters; wherein, the target value is used to indicate that when the process parameter takes the target value, the performance parameter satisfies the parameter value conditions;

[0012] A storage module is used to associate and store the process parameters with the target value.

[0013] Thirdly, this application provides an electronic device, including: a processor, and a memory communicatively connected to the processor;

[0014] The memory stores computer-executed instructions;

[0015] The processor executes computer execution instructions stored in the memory to implement the thermistor-based process parameter determination method as described in the first aspect of this application.

[0016] Fourthly, this application provides a computer-readable storage medium storing computer-executable instructions, which, when executed by a processor, are used to implement the thermistor-based process parameter determination method as described in the first aspect of this application.

[0017] Fifthly, this application provides a computer program product, including a computer program that, when executed by a processor, implements the thermistor-based process parameter determination method as described in the first aspect of this application.

[0018] This application provides a method, apparatus, equipment, and medium for determining process parameters based on a thermistor. By determining the correlation information between the thermistor's process parameters and three performance parameters, and combining the parameter value conditions among the three performance parameters, the optimal solution of the process parameters is obtained as the target value. The performance parameters include the thermistor's resistivity, temperature coefficient of resistance, and noise parameter. Resistivity, temperature coefficient of resistance, and noise parameter have a very strong correlation. Determining the process parameters by comprehensively considering these three performance parameters improves the accuracy of the process parameter determination and ensures that the thermistor's performance is simultaneously met when using the process parameters to manufacture the thermistor, thus guaranteeing the thermistor's performance. Attached Figure Description

[0019] The accompanying drawings, which are incorporated in and form part of this specification, illustrate embodiments consistent with this application and, together with the description, serve to explain the principles of this application.

[0020] Figure 1A flowchart illustrating a method for determining process parameters based on a thermistor, provided in an embodiment of this application;

[0021] Figure 2 A flowchart illustrating a method for determining process parameters based on a thermistor, provided in an embodiment of this application;

[0022] Figure 3 A structural block diagram of a process parameter determination device based on a thermistor provided in an embodiment of this application;

[0023] Figure 4 A structural block diagram of a process parameter determination device based on a thermistor provided in an embodiment of this application;

[0024] Figure 5 A structural block diagram of an electronic device provided in an embodiment of this application;

[0025] Figure 6 This is a structural block diagram of an electronic device provided in an embodiment of this application.

[0026] The accompanying drawings illustrate specific embodiments of this application, which will be described in more detail below. These drawings and descriptions are not intended to limit the scope of the concept in any way, but rather to illustrate the concept of this application to those skilled in the art through reference to particular embodiments. Detailed Implementation

[0027] To make the objectives, technical solutions, and advantages of this application clearer, the embodiments of this application will be described in further detail below with reference to the accompanying drawings.

[0028] It should be understood that the described embodiments are merely some, not all, of the embodiments in this application. All other embodiments obtained by those skilled in the art based on the embodiments in this application without inventive effort are within the scope of protection of this application.

[0029] In the following description, when referring to the accompanying drawings, the same numbers in different drawings denote the same or similar elements unless otherwise indicated. The embodiments described in the following exemplary embodiments do not represent all embodiments consistent with this application. Rather, they are merely examples of apparatuses and methods consistent with some aspects of this application as detailed in the appended claims.

[0030] In the description of this application, it should be understood that the terms "first," "second," "third," etc., are used only to distinguish similar objects and are not necessarily used to describe a specific order or sequence, nor should they be construed as indicating or implying relative importance. Those skilled in the art can understand the specific meaning of the above terms in this application according to the specific circumstances. Furthermore, in the description of this application, unless otherwise stated, "multiple" refers to two or more. "And / or" describes the relationship between related objects, indicating that three relationships can exist. For example, A and / or B can represent: A existing alone, A and B existing simultaneously, or B existing alone. The character " / " generally indicates that the preceding and following related objects have an "or" relationship.

[0031] It should be noted that, due to space limitations, this application specification does not exhaustively list all possible implementation methods. Those skilled in the art, after reading this application specification, should be able to deduce that, as long as the technical features do not contradict each other, any combination of technical features can constitute an optional implementation method. The following provides a detailed description of each embodiment.

[0032] A thermistor is a type of sensor resistor that can be used in a variety of technical fields. For example, a thermal infrared detector is a core component of infrared detection technology.

[0033] The production of thermistors involves various process parameters, such as temperature, doping concentration, annealing time, deposition temperature, and gas dilution. Different values ​​of these process parameters affect the thermistor's performance, and these parameters can interact with each other, leading to unstable performance. Therefore, it is necessary to determine optimal process parameter values ​​before fabricating thermistors.

[0034] This application provides a method, apparatus, equipment, and medium for determining process parameters based on a thermistor, which aims to solve the above-mentioned technical problems in the prior art.

[0035] The technical solution of this application and how the technical solution of this application solves the above-mentioned technical problems are described in detail below with specific embodiments. These specific embodiments can be combined with each other, and the same or similar concepts or processes may not be described again in some embodiments. The embodiments of this application will now be described with reference to the accompanying drawings.

[0036] Figure 1 This is a schematic flowchart illustrating a method for determining process parameters based on a thermistor, according to an embodiment of this application. The method is executed by a process parameter determination device based on a thermistor. Figure 1 As shown, the method includes the following steps:

[0037] S101. Determine the correlation information between the process parameters and preset performance parameters of the thermistor; wherein, the process parameters are used to represent the parameters of the manufacturing process when producing the thermistor, and the performance parameters include the resistivity, temperature coefficient of resistance and noise parameters of the thermistor, and the correlation information is used to represent the magnitude relationship between the process parameters and the performance parameters.

[0038] For example, the production of thermistors involves various process parameters, and different values ​​for these parameters will affect the performance of the thermistor. That is, different process parameter values ​​correspond to different performance parameter values. Process parameters refer to the parameters of the fabrication process during the production of thermistors, and these parameters may include temperature, doping amount, annealing time, annealing temperature, deposition temperature, gas dilution degree, etc. For example, the doping amount can be the percentage of materials such as boron or phosphorus doped during the production of the thermistor.

[0039] Performance parameters of a thermistor can include its resistivity, temperature coefficient of resistance (TCR), and noise parameters. Thermistors themselves need to have high sensitivity, i.e., a high TCR, and devices used in infrared detectors cannot have excessively high resistivity. Therefore, TCR and resistivity are important performance parameters for thermistors. Both resistivity and TCR are closely related to the microstructure of the material. The more disordered the microstructure, the higher the resistivity and TCR tend to be, because such a disordered microstructure is not conducive to carrier migration, naturally resulting in higher resistivity. At the same time, disordered and unstable structures are more prone to change under temperature, which leads to a higher TCR.

[0040] Noise is also a key factor limiting the performance, quality, and reliability of thermistors. The noise of thermistor materials mainly manifests as random fluctuations in resistivity, which are related to random fluctuations in the number and mobility of charge carriers. The main factor affecting these fluctuations in carrier mobility is the stability and order of the material's internal microstructure. The more chaotic and unstable the internal microstructure, the more likely charge carriers are to undergo random collisions during their directional movement under the influence of an electric field, thus affecting mobility and ultimately manifesting as random fluctuations in resistivity—the noise of the thermistor material. A relatively low resistivity in thermistor material can help avoid introducing excessive noise.

[0041] Therefore, resistivity, temperature coefficient of resistance, and noise, as key parameters affecting the performance of thermosensitive materials, are all related to the microstructure of the material. When processing thermosensitive materials, the resistivity is often reduced while the temperature coefficient of resistance is also reduced. When the temperature coefficient of resistance is high, the noise performance is often poor. That is, all three often increase or decrease simultaneously.

[0042] The process parameters to be confirmed are determined. For example, to determine the doping amount, the process parameter to be confirmed is the doping amount. The correlation information between the process parameter to be confirmed and each performance parameter is determined; that is, the correlation information between the process parameter and resistivity, the temperature coefficient of resistance, and the noise parameter is determined. Correlation information can be used to represent the magnitude relationship between the process parameter and the performance parameter. For example, the process parameter can be directly proportional to the performance parameter, or the value of a certain process parameter can be determined to be typically twice the value of the performance parameter. The correlation information between each process parameter and each performance parameter can be obtained based on prior experimental experience.

[0043] In this embodiment, determining the correlation information between the process parameters of the thermistor and the preset performance parameters includes: taking values ​​for the process parameters within the preset range of process parameter values ​​to obtain the parameter values ​​of the process parameters, which are the first parameter values; obtaining the parameter values ​​of the performance parameters of the thermistor based on the first parameter values, which are the second parameter values; and obtaining the functional relationship between the process parameters and each performance parameter based on the first parameter values ​​and the second parameter values, which is the correlation information.

[0044] Specifically, different process parameters correspond to different value ranges. Values ​​are taken within a preset range; for example, if the doping amount ranges from 0% to 30%, multiple values ​​can be obtained within this range. The process parameter values ​​can be discretized, for example, with doping amounts of 5%, 10%, 15%, and 20%. Appropriate variable value ranges and intervals can be selected based on needs and actual conditions. The obtained process parameter values ​​are determined as the first parameter values. The resistivity, temperature coefficient of resistance, and noise parameters of the thermistor are tested under different first parameter values, and the values ​​of each performance parameter are determined as the second parameter values.

[0045] Based on multiple first parameter values ​​of the process parameters and the corresponding second parameter values, the functional relationship between the first parameter values ​​and the second parameter values ​​is determined, which serves as the functional relationship between the process parameters and performance parameters. That is, the functional relationships between the process parameters and resistivity, the temperature coefficient of resistance, and the noise parameters are obtained, and these functional relationships are identified as correlation information.

[0046] The advantage of this setup is that by determining multiple first parameter values ​​of the process parameters, the corresponding second parameter values ​​can be obtained, and the functional relationship between the first parameter values ​​and the second parameter values ​​can be found. This facilitates the automatic determination of the process parameter values ​​required for optimal performance, thereby improving the accuracy and efficiency of process parameter determination.

[0047] In this embodiment, obtaining the performance parameter value of the thermistor as the second parameter value based on the first parameter value includes: determining the performance parameter value as the second parameter value when the process parameter is the first parameter value based on a preset thermistor parameter test model.

[0048] Specifically, parameter test models are pre-set for different types of process parameters. These models are used to simulate the performance parameters of the produced thermistors under different values ​​of the process parameters. In this embodiment, the parameter test model is not specifically limited. Alternatively, a parameter test model may not be set up, and thermistors can be produced on the thermistor production line using the selected process parameters to obtain the performance parameters of the produced thermistors.

[0049] A parameter testing model is set up to simulate the process parameters to be studied. The process parameters are discretized and the selected values ​​are determined to be experimental values, which are the first parameter values. For example, the doping amount x% is set to 5%, 10%, 15%, and 20%, and the resistivity, temperature coefficient of resistance, and noise parameters of the thermistor are tested under process parameters with different x% values, which are then used as the second parameter values.

[0050] The advantage of this setup is that, through simulation experiments, performance parameters under different process parameter values ​​can be quickly determined. The process of determining performance parameters is simple, saves manpower and time, and improves the efficiency of determining process parameters.

[0051] In this embodiment, the functional relationship between the process parameters and each performance parameter is obtained based on the first parameter value and the second parameter value, including: fitting the first parameter value and the second parameter value according to a preset fitting algorithm to obtain the functional relationship between the process parameters and the performance parameters.

[0052] Specifically, multiple first parameter values ​​are determined for each process parameter. For each performance parameter, each first parameter value corresponds to a second parameter value. For each performance parameter, the functional relationship between the process parameter and the performance parameter is determined based on the multiple first parameter values ​​and the corresponding second parameter values. A preset fitting algorithm can be used to fit the first and second parameter values ​​to obtain the functional relationship. For example, regarding the relationship between doping amount and resistivity, resistivity first decreases and then increases with increasing doping amount, showing an inflection point. Therefore, the preset fitting method could be to use a quadratic or higher polynomial for fitting. In this embodiment, the preset fitting algorithm is not specifically limited; the specific fitting function can be determined based on the trend of the experimental results.

[0053] The advantage of this setting is that it can automatically perform fitting to obtain the functional relationship between process parameters and performance parameters, which is beneficial for automatically determining the target values ​​of process parameters and improving the efficiency and accuracy of process parameter determination.

[0054] S102. Based on the correlation information between process parameters and various performance parameters, and the preset parameter value conditions between performance parameters, determine the target value of the process parameters; wherein, the target value is used to indicate that when the process parameters take the target value, the performance parameters meet the parameter value conditions.

[0055] For example, parameter value conditions are pre-defined between performance parameters. These conditions refer to the conditions for the values ​​of the three performance parameters. That is, the values ​​are determined based on the coupling relationship between the three performance parameters. For instance, the parameter value conditions could be the range of values ​​for the three performance parameters; that is, the values ​​of all three performance parameters must satisfy the range of values ​​specified in the parameter value conditions.

[0056] After obtaining the correlation information between process parameters and various performance parameters, the target values ​​of the process parameters are determined based on the preset parameter value conditions between the performance parameters. The target values ​​can be used to indicate that when the process parameters take target values, the three performance parameters meet the preset parameter value conditions. For example, the values ​​of the performance parameters are determined based on the parameter value conditions, and these values ​​are substituted into the correlation information to obtain the target values ​​of the process parameters.

[0057] In this embodiment, the target value of the process parameter is determined based on the correlation information between the process parameter and each performance parameter, as well as the preset parameter value conditions between the performance parameters. This includes: determining the value range of each performance parameter based on the preset parameter value conditions between the performance parameters; and determining the value of the process parameter within the value range of each performance parameter based on the correlation information between the process parameter and each performance parameter, which is the target value of the process parameter.

[0058] Specifically, the preset parameter value conditions can be functional relationships between various performance parameters. For example, parameter value conditions can be expressed as a functional expression between resistivity and temperature coefficient of resistance, indicating the magnitude relationship between resistivity and temperature coefficient of resistance. By pre-setting the value range of one performance parameter, the value ranges of the other two performance parameters can be obtained based on the functional expression between this performance parameter and the other two performance parameters. In other words, the value range of each performance parameter can be determined based on the preset parameter value conditions between performance parameters.

[0059] Based on the value range of each performance parameter, values ​​are assigned to each performance parameter. Based on the correlation information between the process parameters and each performance parameter, the process parameters are calculated, and the calculation results are the target values ​​for the process parameters. For example, based on the value range of the performance parameters, the corresponding value range of the process parameters can be obtained, and the values ​​within the process parameter value range can be used as the target values ​​for the process parameters.

[0060] The advantage of this setup is that it allows for the rapid determination of target values ​​for process parameters, ensuring that the performance requirements of the thermistor are met, and obtaining the values ​​of process parameters needed for optimal thermistor performance. Fabricating the thermistors according to these target values ​​yields the optimal thermistor, improving production efficiency and guaranteeing its high-efficiency use.

[0061] S103. Link and store the process parameters with the target values.

[0062] For example, after obtaining the target value of the process parameter, the target value is associated with the corresponding type of process parameter and stored in a preset table. It is also possible to associate and store the values ​​of other types of process parameters under the target value. For instance, if another type of process parameter is temperature, at a temperature of 450°C, multiple first parameter values ​​are taken for the doping amount, and a second parameter value for the performance parameter is obtained, thus obtaining a target doping amount of 15%. That is, it is determined that at a temperature of 450°C, the target doping amount is 15%, at which point the thermistor exhibits optimal performance. Different target values ​​for the doping amount can be determined at different temperatures and associated and stored.

[0063] After determining the target value of one process parameter, target values ​​for other process parameters can be determined, enabling the determination of different process parameters. A table of process parameters and their corresponding target values ​​can be established, which can more conveniently guide the selection or improvement of process parameters. This embodiment is applicable to various types of thermistors, such as a-Si (amorphous silicon) resistors and poly-SiGe (polycrystalline silicon germanium) resistors.

[0064] After associative storage, if a user needs to query the optimal value of a certain process parameter for achieving the thermistor's best performance, the query is retrieved from the stored table. Responding to a process parameter query command, the system identifies the desired process parameter, finds its corresponding target value in the pre-stored table, and then manufactures the thermistor based on that target value. This effectively improves the thermistor manufacturing efficiency and ensures the thermistor's quality.

[0065] This application provides a method for determining process parameters based on a thermistor. By determining the correlation information between the thermistor's process parameters and three performance parameters, and combining the parameter value conditions among the three performance parameters, the optimal solution of the process parameters is obtained as the target value. The performance parameters include the thermistor's resistivity, temperature coefficient of resistance, and noise parameter. Resistivity, temperature coefficient of resistance, and noise parameter have a very strong correlation. Determining the process parameters by comprehensively considering these three performance parameters improves the accuracy of the process parameter determination and ensures that the thermistor's performance is met when using the process parameters to manufacture the thermistor.

[0066] Figure 2 This is a schematic flowchart of a method for determining process parameters based on a thermistor, which is an optional embodiment based on the above embodiments.

[0067] In this embodiment, the preset parameter value conditions between performance parameters are preset performance parameter merit functions. The performance parameter merit function is used to indicate that when the function value of the performance parameter merit function is an extreme value, the corresponding performance parameter value is the optimal value. Based on the correlation information between process parameters and each performance parameter, as well as the preset parameter value conditions between performance parameters, the target value of the process parameter is determined. This can be further refined as follows: Based on the functional relationship between process parameters and each performance parameter, as well as the performance parameter merit function, the target value of the process parameter is determined.

[0068] like Figure 2 As shown, the method includes the following steps:

[0069] S201. Determine the correlation information between the process parameters and preset performance parameters of the thermistor; wherein, the process parameters are used to represent the parameters of the manufacturing process when producing the thermistor, and the performance parameters include the resistivity, temperature coefficient of resistance and noise parameters of the thermistor, and the correlation information is used to represent the magnitude relationship between the process parameters and the performance parameters.

[0070] For example, this step can refer to step S101 above, and will not be repeated here.

[0071] S202. Determine the target values ​​of the process parameters based on the functional relationship between the process parameters and each performance parameter, as well as the merit function of the performance parameters.

[0072] For example, the correlation information between process parameters and various performance parameters can be a functional relationship; that is, a functional expression can be used to represent the magnitude relationship between process parameters and various performance parameters. The magnitude relationship between process parameters and different types of performance parameters can all be represented by functional expressions. The correlation information between process parameters and various performance parameters can be represented by the following function:

[0073] ρ=f ρ (x);

[0074] TCR = f TCR (x);

[0075] α H =f αH (x);

[0076] Where x is the process parameter, ρ is the resistivity, TCR is the temperature coefficient of resistance, and α H This is a noise parameter.

[0077] There are complex relationships between the various performance parameters. By synthesizing these relationships, a performance parameter merit function M can be constructed, which can be expressed as follows:

[0078] M = F(ρ, TCR, αH);

[0079] Based on current research on the relationship between the temperature coefficient of resistance (TCR) and resistivity, it can be determined that the TCR increases monotonically with increasing resistivity, and the higher the resistivity, the greater the thermal noise introduced. Therefore, considering resistivity, thermal noise, and the TCR, a performance parameter figure function for the thermistor can be defined. When the performance parameter figure function reaches its maximum value, the values ​​of each performance parameter are optimal. Therefore, the values ​​of the process parameters corresponding to the maximum value of the performance parameter figure function can be determined as target values, enabling rapid and automatic determination of target values, reducing manual calculations, and improving the efficiency and accuracy of process parameter determination.

[0080] In this embodiment, the formula for the performance parameter figure function is as follows:

[0081]

[0082] β = |TCR|;

[0083]

[0084] Where M represents the performance parameter figure function, TCR represents the temperature coefficient of resistance, ρ represents the resistivity, αH represents the noise parameter, N represents the number of charge carriers, β2 represents the square of the absolute value of the temperature coefficient of resistance, and B represents the noise parameter per unit number of charge carriers.

[0085] Specifically, noise parameters can include thermal noise voltage. The thermal noise voltage of a resistor is proportional to the square root of its resistivity; the higher the resistivity, the greater the introduced thermal noise. Therefore, considering resistivity, thermal noise, and the temperature coefficient of resistance, the initial figure of merit function M of the thermistor can be defined as:

[0086]

[0087] Where β is the absolute value of TCR.

[0088] Besides thermal noise, low-frequency flicker noise is also a key factor affecting the performance of infrared detectors. Therefore, the noise parameters can also include the flicker noise parameter αH. Based on the pre-defined Hooge mobility fluctuation model, the flicker noise parameter αH can be determined as the Hooge noise parameter. The Hooge noise parameter per unit number of charge carriers is then defined as B.

[0089] The flicker noise originates from local temperature fluctuations. Based on the pre-defined Hooge mobility fluctuation model, it can be determined that B is proportional to the square of TCR, i.e., B∝TCR. 2 .

[0090] Based on the relationship between B and TCR, and the relationship between ρ and β, the three performance parameters are combined to construct an expression for the merit function M:

[0091]

[0092] The advantage of this setup is that it integrates three important performance parameters of the thermistor and introduces a crucial noise parameter. It can be seen that the merit function includes resistivity ρ, the absolute value of the temperature coefficient of resistance β, and the material's inherent noise parameter B, which is independent of the device volume. The larger the absolute value of the temperature coefficient of resistance and the smaller the resistivity and noise parameters, the larger the value of M. That is, a larger M value indicates that the thermistor material has lower resistivity, a higher temperature coefficient of resistance, and lower noise, resulting in higher sensitivity and a higher signal-to-noise ratio for the infrared detector. Therefore, when M reaches its maximum value, the performance parameters are optimal. This allows for the rapid determination of the process parameters corresponding to the optimal performance parameters by integrating the three key performance parameters affecting the thermistor material, thus improving the accuracy and efficiency of process parameter determination.

[0093] In this embodiment, the target value of the process parameter is determined based on the functional relationship between the process parameter and each performance parameter, as well as the performance parameter merit function. This includes: determining the expression of the performance parameter based on the functional relationship between the process parameter and each performance parameter; wherein the independent variable in the expression of the performance parameter is the process parameter; and substituting the expression of the performance parameter into the performance parameter merit function to determine the target value of the process parameter when the function value of the performance parameter merit function is at its maximum.

[0094] Specifically, based on the functional relationship between process parameters and various performance parameters, expressions for each performance parameter are obtained. The independent variable in these expressions is the process parameter, and the dependent variable is the performance parameter. Substituting these expressions into the performance parameter good value function, the maximum value of the good value function is calculated. The value of the process parameter corresponding to the maximum value is then determined as the target value. The performance parameter good value function after substitution is expressed as:

[0095] M=F(fρ ρ (x), fT TCR (x), fα αH (x));

[0096] The calculated x is the target value of the process parameter. When it is necessary to determine different types of process parameters, the functional expression between the corresponding process parameter and performance parameter is substituted into the merit function of M to determine the process parameter value corresponding to the maximum value.

[0097] The advantage of this setup is that the target values ​​of the process parameters can be calculated directly. The calculation process is simple, saves manpower and time, integrates the optimal values ​​of the three performance parameters, and has high calculation accuracy.

[0098] S203. Link and store the process parameters with the target values.

[0099] For example, this step can refer to step S103 above, and will not be repeated here.

[0100] This application provides a method for determining process parameters based on a thermistor. By determining the correlation information between the thermistor's process parameters and three performance parameters, and combining the parameter value conditions among the three performance parameters, the optimal solution of the process parameters is obtained as the target value. The performance parameters include the thermistor's resistivity, temperature coefficient of resistance, and noise parameter. Resistivity, temperature coefficient of resistance, and noise parameter have a very strong correlation. Determining the process parameters by comprehensively considering these three performance parameters improves the accuracy of the process parameter determination and ensures that the thermistor's performance is met when using the process parameters to manufacture the thermistor.

[0101] Figure 3 This is a structural block diagram of a process parameter determination device based on a thermistor, provided for embodiments of this application. For ease of explanation, only the parts relevant to the embodiments of this disclosure are shown. (Refer to...) Figure 3 The device includes: an information determination module 301, a target value determination module 302, and a storage module 303.

[0102] The information determination module 301 is used to determine the correlation information between the process parameters of the thermistor and the preset performance parameters; wherein, the process parameters are used to represent the parameters of the manufacturing process when producing the thermistor, the performance parameters include the resistivity, temperature coefficient of resistance and noise parameters of the thermistor, and the correlation information is used to represent the magnitude relationship between the process parameters and the performance parameters;

[0103] The target value determination module 302 is used to determine the target value of the process parameter based on the correlation information between the process parameter and each performance parameter, and the preset parameter value conditions between the performance parameters; wherein, the target value is used to indicate that when the process parameter takes the target value, the performance parameter satisfies the parameter value conditions;

[0104] The storage module 303 is used to associate and store the process parameters with the target value.

[0105] Figure 4 This application provides a structural block diagram of a process parameter determination device based on a thermistor, in accordance with an embodiment of the present application. Figure 3 Based on the illustrated embodiments, as Figure 4 As shown, the information determination module 301 includes a first determination unit 3011, a second determination unit 3012, and an information acquisition unit 3013.

[0106] The first determining unit 3011 is used to take values ​​for the process parameters within a preset range of process parameter values ​​to obtain the parameter values ​​of the process parameters, which are the first parameter values;

[0107] The second determining unit 3012 is used to obtain the parameter value of the performance parameter of the thermistor based on the first parameter value, which is the second parameter value;

[0108] The information acquisition unit 3013 is used to obtain the functional relationship between the process parameter and each performance parameter based on the first parameter value and the second parameter value, which is the correlation information.

[0109] In one example, the second determining unit 3012 is specifically used for:

[0110] Based on the preset parameter test model of the thermistor, the parameter value of the performance parameter is determined to be the second parameter value when the process parameter is the first parameter value.

[0111] In one example, information acquisition unit 3013 is specifically used for:

[0112] According to a preset fitting algorithm, the first parameter value and the second parameter value are fitted to obtain the functional relationship between the process parameter and the performance parameter.

[0113] In one example, the target value determination module 302 includes:

[0114] The range determination unit is used to determine the value range of each performance parameter based on the preset parameter value conditions between the performance parameters;

[0115] The parameter determination unit is used to determine the value of the process parameter within the range of values ​​of each performance parameter based on the correlation information between the process parameter and each performance parameter, and to determine the target value of the process parameter.

[0116] In one example, the parameter value condition between preset performance parameters is a preset performance parameter merit function, which indicates that when the function value of the performance parameter merit function is an extreme value, the corresponding performance parameter value is the optimal value.

[0117] The target value determination module 302 is specifically used for:

[0118] Based on the functional relationship between the process parameters and each performance parameter, and the figure of merit function of the performance parameters, the target values ​​of the process parameters are determined.

[0119] In one example, the formula for the performance parameter merit function is as follows:

[0120]

[0121] β = |TCR|;

[0122]

[0123] Where M represents the figure of merit function of the performance parameter, TCR represents the temperature coefficient of resistance, ρ represents the resistivity, and α H This represents the noise parameter, and N represents the number of charge carriers.

[0124] In one example, the target value determination module 302 is specifically used for:

[0125] Based on the functional relationship between the process parameters and each performance parameter, the expression for the performance parameter is determined; wherein, the independent variable in the expression for the performance parameter is the process parameter;

[0126] Substitute the expression for the performance parameter into the performance parameter merit function to determine the target value of the process parameter when the function value of the performance parameter merit function is at its maximum.

[0127] Figure 5 A structural block diagram of an electronic device provided in an embodiment of this application, such as... Figure 5 As shown, the electronic device includes: a memory 51 and a processor 52; the memory 51 is a memory used to store instructions executable by the processor 52.

[0128] The processor 52 is configured to perform the methods provided in the above embodiments.

[0129] The electronic device also includes a receiver 53 and a transmitter 54. The receiver 53 is used to receive instructions and data sent by other devices, and the transmitter 54 is used to send instructions and data to external devices.

[0130] Figure 6 This is a block diagram illustrating an electronic device according to an exemplary embodiment. The device may be a mobile phone, computer, digital broadcasting terminal, messaging device, game console, tablet device, medical device, fitness device, personal digital assistant, etc.

[0131] Device 600 may include one or more of the following components: processing component 602, memory 604, power supply component 606, multimedia component 608, audio component 610, input / output (I / O) interface 612, sensor component 614, and communication component 616.

[0132] Processing component 602 typically controls the overall operation of device 600, such as operations associated with display, telephone calls, data communication, camera operation, and recording. Processing component 602 may include one or more processors 620 to execute instructions to perform all or part of the steps of the methods described above. Furthermore, processing component 602 may include one or more modules to facilitate interaction between processing component 602 and other components. For example, processing component 602 may include a multimedia module to facilitate interaction between multimedia component 608 and processing component 602.

[0133] Memory 604 is configured to store various types of data to support the operation of device 600. Examples of this data include instructions for any application or method operating on device 600, contact data, phonebook data, messages, pictures, videos, etc. Memory 604 can be implemented by any type of volatile or non-volatile storage device or a combination thereof, such as static random access memory (SRAM), electrically erasable programmable read-only memory (EEPROM), erasable programmable read-only memory (EPROM), programmable read-only memory (PROM), read-only memory (ROM), magnetic storage, flash memory, magnetic disk, or optical disk.

[0134] Power supply component 606 provides power to various components of device 600. Power supply component 606 may include a power management system, one or more power supplies, and other components associated with generating, managing, and distributing power to device 600.

[0135] Multimedia component 608 includes a screen that provides an output interface between the device 600 and the user. In some embodiments, the screen may include a liquid crystal display (LCD) and a touch panel (TP). If the screen includes a touch panel, the screen may be implemented as a touchscreen to receive input signals from the user. The touch panel includes one or more touch sensors to sense touches, swipes, and gestures on the touch panel. The touch sensors may sense not only the boundaries of the touch or swipe action but also the duration and pressure associated with the touch or swipe operation. In some embodiments, multimedia component 608 includes a front-facing camera and / or a rear-facing camera. When the device 600 is in an operating mode, such as a shooting mode or a video mode, the front-facing camera and / or the rear-facing camera may receive external multimedia data. Each front-facing camera and rear-facing camera may be a fixed optical lens system or have focal length and optical zoom capabilities.

[0136] Audio component 610 is configured to output and / or input audio signals. For example, audio component 610 includes a microphone (MIC) configured to receive external audio signals when device 600 is in an operating mode, such as call mode, recording mode, and voice recognition mode. The received audio signals may be further stored in memory 604 or transmitted via communication component 616. In some embodiments, audio component 610 also includes a speaker for outputting audio signals.

[0137] I / O interface 612 provides an interface between processing component 602 and peripheral interface modules, such as keyboards, click wheels, buttons, etc. These buttons may include, but are not limited to, home buttons, volume buttons, power buttons, and lock buttons.

[0138] Sensor assembly 614 includes one or more sensors for providing status assessments of various aspects of device 600. For example, sensor assembly 614 may detect the on / off state of device 600, the relative positioning of components such as the display and keypad of device 600, changes in the position of device 600 or a component of device 600, the presence or absence of user contact with device 600, the orientation or acceleration / deceleration of device 600, and temperature changes of device 600. Sensor assembly 614 may include a proximity sensor configured to detect the presence of nearby objects without any physical contact. Sensor assembly 614 may also include a light sensor, such as a CMOS or CCD image sensor, for use in imaging applications. In some embodiments, sensor assembly 614 may also include an accelerometer, a gyroscope, a magnetometer, a pressure sensor, or a temperature sensor.

[0139] Communication component 616 is configured to facilitate wired or wireless communication between device 600 and other devices. Device 600 can access wireless networks based on communication standards, such as WiFi, 2G, or 3G, or combinations thereof. In one exemplary embodiment, communication component 616 receives broadcast signals or broadcast-related information from an external broadcast management system via a broadcast channel. In one exemplary embodiment, communication component 616 also includes a near-field communication (NFC) module to facilitate short-range communication. For example, the NFC module may be implemented based on radio frequency identification (RFID) technology, Infrared Data Association (IrDA) technology, ultra-wideband (UWB) technology, Bluetooth (BT) technology, and other technologies.

[0140] In an exemplary embodiment, device 600 may be implemented by one or more application-specific integrated circuits (ASICs), digital signal processors (DSPs), digital signal processing devices (DSPDs), programmable logic devices (PLDs), field-programmable gate arrays (FPGAs), controllers, microcontrollers, microprocessors, or other electronic components to perform the methods described above.

[0141] In an exemplary embodiment, a non-transitory computer-readable storage medium including instructions is also provided, such as a memory 604 including instructions, which can be executed by a processor 620 of device 600 to perform the above-described method. For example, the non-transitory computer-readable storage medium may be a ROM, random access memory (RAM), CD-ROM, magnetic tape, floppy disk, and optical data storage device, etc.

[0142] A non-transitory computer-readable storage medium, when the instructions in the storage medium are executed by the processor of a terminal device, enables the terminal device to perform the aforementioned thermistor-based process parameter determination method of the terminal device.

[0143] This application also discloses a computer program product, including a computer program that, when executed by a processor, implements the method described in this embodiment.

[0144] Various embodiments of the systems and technologies described above in this application can be implemented in digital electronic circuit systems, integrated circuit systems, field-programmable gate arrays (FPGAs), application-specific integrated circuits (ASICs), application-specific standard products (ASSPs), systems-on-a-chip (SoCs), payload-programmable logic devices (CPLDs), computer hardware, firmware, software, and / or combinations thereof. These various embodiments may include: implementations in one or more computer programs that can be executed and / or interpreted on a programmable system including at least one programmable processor, which may be a dedicated or general-purpose programmable processor, capable of receiving data and instructions from a storage system, at least one input device, and at least one output device, and transmitting data and instructions to the storage system, the at least one input device, and the at least one output device.

[0145] The program code used to implement the methods of this application may be written in any combination of one or more programming languages. This program code may be provided to a processor or controller of a general-purpose computer, special-purpose computer, or other programmable data processing device, such that when executed by the processor or controller, the functions / operations specified in the flowcharts and / or block diagrams are implemented. The program code may be executed entirely on a machine, partially on a machine, as a standalone software package partially on a machine and partially on a remote machine, or entirely on a remote machine or electronic device.

[0146] In the context of this application, a machine-readable medium can be a tangible medium that may contain or store a program for use by or in conjunction with an instruction execution system, apparatus, or device. A machine-readable medium can be a machine-readable signal medium or a machine-readable storage medium. Machine-readable media can be, but is not limited to, electronic, magnetic, optical, electromagnetic, infrared, or semiconductor systems, apparatus, or devices, or any suitable combination of the foregoing. More specific examples of machine-readable storage media include electrical connections based on one or more wires, portable computer disks, hard disks, random access memory (RAM), read-only memory (ROM), erasable programmable read-only memory (EPROM or flash memory), optical fibers, portable compact disk read-only memory (CD-ROM), optical storage devices, magnetic storage devices, or any suitable combination of the foregoing.

[0147] To provide interaction with a user, the systems and techniques described herein can be implemented on a computer having: a display device for displaying information to the user (e.g., a CRT (cathode ray tube) or LCD (liquid crystal display) monitor); and a keyboard and pointing device (e.g., a mouse or trackball) through which the user provides input to the computer. Other types of devices can also be used to provide interaction with the user; for example, feedback provided to the user can be any form of sensory feedback (e.g., visual feedback, auditory feedback, or tactile feedback); and input from the user can be received in any form (including sound input, voice input, or tactile input).

[0148] The systems and technologies described herein can be implemented in computing systems that include back-end components (e.g., as data electronic devices), or computing systems that include middleware components (e.g., application electronic devices), or computing systems that include front-end components (e.g., a user computer with a graphical user interface or web browser through which a user can interact with implementations of the systems and technologies described herein), or any combination of such back-end, middleware, or front-end components. The components of the system can be interconnected via digital data communication of any form or medium (e.g., a communication network). Examples of communication networks include local area networks (LANs), wide area networks (WANs), and the Internet.

[0149] Computer systems can include client and electronic devices. Clients and electronic devices are generally geographically separated and typically interact via communication networks. The client-electronic device relationship is created by computer programs running on the respective computers and having a client-electronic device relationship with each other. The electronic device can be a cloud electronic device, also known as a cloud computing electronic device or cloud host, a host product within the cloud computing service system, addressing the shortcomings of traditional physical hosts and VPS services ("Virtual Private Server," or simply "VPS") in terms of management difficulty and weak business scalability. The electronic device can also be an electronic device in a distributed system or an electronic device incorporating blockchain technology. It should be understood that the various forms of processes shown above can be used, with steps reordered, added, or deleted. For example, the steps described in this application can be executed in parallel, sequentially, or in different orders, as long as the desired result of the technical solution disclosed in this application is achieved, and this is not limited herein.

[0150] Other embodiments of this application will readily occur to those skilled in the art upon consideration of the specification and practice of the invention disclosed herein. This application is intended to cover any variations, uses, or adaptations of this application that follow the general principles of this application and include common knowledge or customary techniques in the art not disclosed herein. The specification and examples are to be considered exemplary only, and the true scope and spirit of this application are indicated by the following claims.

[0151] It should be understood that this application is not limited to the precise structure described above and shown in the accompanying drawings, and various modifications and changes can be made without departing from its scope. The scope of this application is limited only by the appended claims.

Claims

1. A method for determining process parameters based on a thermistor, characterized in that, include: The correlation information between the process parameters of the thermistor and the preset performance parameters is determined; wherein, the process parameters are used to represent the parameters of the manufacturing process when producing the thermistor, and the performance parameters include the resistivity, temperature coefficient of resistance and noise parameters of the thermistor, and the correlation information is used to represent the magnitude relationship between the process parameters and the performance parameters; Based on the correlation information between the process parameters and each performance parameter, and a preset performance parameter merit function, the target value of the process parameter is determined; wherein, the performance parameter merit function indicates that when the function value of the performance parameter merit function is an extreme value, the corresponding performance parameter value is the optimal value, and the formula of the performance parameter merit function is as follows: ； ； Where M represents the figure of merit function of the performance parameter, and TCR represents the temperature coefficient of resistance. Represents resistivity. The noise parameter is represented by N, which represents the number of charge carriers, and B represents the noise parameter per unit number of charge carriers. The target value is used to indicate that the performance parameter satisfies the parameter value condition when the process parameter takes the target value. The process parameters are associated with and stored with the target value; Based on the correlation information between the process parameters and each performance parameter, and the preset parameter value conditions between the performance parameters, the target values ​​of the process parameters are determined, including: Based on the preset parameter value conditions between performance parameters, determine the value range of each performance parameter; Based on the correlation information between the process parameters and each performance parameter, the value of the process parameter within the range of values ​​for each performance parameter is determined, and this value is the target value of the process parameter; or, Based on the functional relationship between the process parameters and each performance parameter, the expression for the performance parameter is determined; wherein, the independent variable in the expression for the performance parameter is the process parameter; Substitute the expression for the performance parameter into the performance parameter merit function to determine the target value of the process parameter when the function value of the performance parameter merit function is at its maximum.

2. The method according to claim 1, characterized in that, Determine the correlation information between the process parameters and preset performance parameters of the thermistor, including: The process parameters are selected within a preset range of values ​​to obtain the parameter values ​​of the process parameters, which are the first parameter values. Based on the first parameter value, the performance parameters of the thermistor are obtained as the second parameter value; Based on the first parameter value and the second parameter value, the functional relationship between the process parameter and each performance parameter is obtained, which is the correlation information.

3. The method according to claim 2, characterized in that, Based on the first parameter value, the performance parameters of the thermistor are obtained as the second parameter value, including: Based on the preset parameter test model of the thermistor, the parameter value of the performance parameter is determined to be the second parameter value when the process parameter is the first parameter value.

4. The method according to claim 2, characterized in that, Based on the first parameter value and the second parameter value, the functional relationship between the process parameter and each performance parameter is obtained, including: According to a preset fitting algorithm, the first parameter value and the second parameter value are fitted to obtain the functional relationship between the process parameter and the performance parameter.

5. A process parameter determination device based on a thermistor, characterized in that, include: An information determination module is used to determine the correlation information between the process parameters of the thermistor and the preset performance parameters; wherein, the process parameters are used to represent the parameters of the manufacturing process when producing the thermistor, the performance parameters include the resistivity, temperature coefficient of resistance and noise parameters of the thermistor, and the correlation information is used to represent the magnitude relationship between the process parameters and the performance parameters; The target value determination module is used to determine the target value of the process parameter based on the correlation information between the process parameter and each performance parameter, and a preset performance parameter merit function; wherein, the performance parameter merit function indicates that the value of the corresponding performance parameter is the optimal value when the function value of the performance parameter merit function is an extreme value, and the formula of the performance parameter merit function is as follows: ； ； Where M represents the figure of merit function of the performance parameter, and TCR represents the temperature coefficient of resistance. Represents resistivity. The noise parameter is represented by N, which represents the number of charge carriers, and B represents the noise parameter per unit number of charge carriers. The target value is used to indicate that the performance parameter satisfies the parameter value condition when the process parameter takes the target value. A storage module is used to associate and store the process parameters with the target values; The target value determination module is specifically used to determine the value range of each performance parameter based on the preset parameter value conditions between performance parameters. Based on the correlation information between the process parameters and each performance parameter, the value of the process parameter within the range of values ​​for each performance parameter is determined, and this value is the target value of the process parameter; or, Based on the functional relationship between the process parameters and each performance parameter, the expression for the performance parameter is determined; wherein, the independent variable in the expression for the performance parameter is the process parameter; Substitute the expression for the performance parameter into the performance parameter merit function to determine the target value of the process parameter when the function value of the performance parameter merit function is at its maximum.

6. An electronic device, characterized in that, include: A processor, and a memory communicatively connected to the processor; The memory stores computer-executed instructions; The processor executes computer execution instructions stored in the memory to implement the process parameter determination method based on thermistor as described in any one of claims 1-4.

7. A computer-readable storage medium, characterized in that, The computer-readable storage medium stores computer-executable instructions, which, when executed by a processor, are used to implement the process parameter determination method based on a thermistor as described in any one of claims 1-4.

8. A computer program product, characterized in that, It includes a computer program that, when executed by a processor, implements the method for determining process parameters based on a thermistor as described in any one of claims 1-4.

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