Buffer plate, display device including the same, and display apparatus

Abstract

A buffer plate, a display device including the same, and a display apparatus are disclosed. The display device includes a cover member, a display panel disposed on one surface of the cover member, and a buffer plate disposed on one surface of the display panel, wherein the buffer plate includes a buffer layer and a heat dissipation layer, wherein the heat dissipation layer includes a first body vertically overlapping the buffer layer and at least one first extension portion extending from the first body and outward from the buffer layer so as not to vertically overlap the buffer layer, wherein the first extension portion is disposed on one surface of the cover member so as not to vertically overlap the display panel.

Description

TECHNICAL FIELD

[0001] The disclosure relates to a buffer plate, a display device including the same, and a display apparatus, and more particularly, to a buffer plate capable of constituting a new charge movement path to reduce occurrence of a brighter phenomenon and a green emission phenomenon at an end of a display panel, a display device including the same, and a display apparatus. BACKGROUND

[0002] Display devices are implemented in various forms such as televisions, monitors, smartphones, tablet PCs, laptop computers, and wearable devices.

[0003] In general, a display device includes a display area for displaying a screen and a non-display area formed along an outer edge of the display area.

[0004] In a display device, the non-display area is also referred to as a bezel area. When the bezel area is thick, a user's line of sight is scattered. When the bezel area is thin, a user's line of sight can be fixed on a screen of the display area, and thus immersion can be increased.

[0005] In other words, when the bezel area is thinned, the overall size of the display device can be reduced while increasing the user's immersion. Accordingly, there is an increasing demand for display devices having a bezel area that is as small as possible. SUMMARY

[0006] Due to physical friction or the like, charges can be generated on the surface of a display device.

[0007] When the charges generated in this way are not released to the outside through a grounding path, the charges can be accumulated on a side surface of an end of a display panel located in a bezel area of the display panel.

[0008] When the charges are accumulated in a specific area, an electric field proportional to the amount of the accumulated charges can be generated.

[0009] Accordingly, when the charges generated on the surface of the display device are not effectively released to the outside, a strong electric field can be generated on the side surface of the end of the display panel.

[0010] When a strong electric field is generated on the side surface of the end of the display panel, a brighter phenomenon in which the side surface area of the end becomes brighter than the display area of the display panel and a green emission phenomenon in which a partial area becomes green can occur.

[0011] When the brighter phenomenon and the green emission phenomenon occur at the end of the display panel, a quality defect of the display panel can occur.

[0012] In one example, a charging solution can be applied to form a charge movement path to release charges of a display apparatus to the outside.

[0013] However, since the charging solution is in a liquid state, it is difficult to achieve uniform coating length and width, making process management difficult. The resistance fluctuation range based on the amount of the charging solution applied can be very large.

[0014] In addition, since a separate process of applying the charging solution is required to form the charge movement path, the efficiency of the manufacturing process of the display apparatus can be reduced.

[0015] In addition, the charging solution is applied to be exposed outside the display device. Thus, the charging solution can be damaged during the handling process in the manufacturing process, or be easily damaged by external impacts such as thermal shock, thereby causing a lack of charging function.

[0016] In addition, it can be difficult to apply a small amount of the charging solution. Thus, when the shape of each of the set parts incorporated into the display device becomes complex, the space of the set part accommodating the charging solution is thus increased. Thus, it can be difficult to match the set part having a complex shape with the charging solution.

[0017] Therefore, the inventors of the present disclosure invented a buffer plate that can constitute a new charge movement path, thereby reducing the occurrence of a brighter phenomenon and a green phenomenon at the distal end of a display panel, a display device including the same, and a display apparatus including the same.

[0018] An object of one embodiment of the present disclosure is to provide a buffer plate that can constitute a new charge movement path, a display device including the same, and a display apparatus including the same.

[0019] An object of the solution according to an embodiment of the present disclosure is to provide a buffer plate that can reduce the occurrence of a brighter phenomenon and a green phenomenon at the distal end of a display panel, and a display device including the same and a display apparatus including the same.

[0020] An object of one embodiment of the present disclosure is to provide a buffer plate that can reduce the overall thickness of a display apparatus, a display device including the same, and a display apparatus including the same.

[0021] An object of one embodiment of the present disclosure is to provide a buffer plate that can improve the efficiency of a process for forming a charge movement path, a display device including the same, and a display apparatus including the same.

[0022] An object of one embodiment of the present disclosure is to provide a buffer plate that can reduce a lack of charging function due to damage to a charge movement path by external factors such as physical contact or impact, and a display device including the same and a display apparatus including the same.

[0023] An object according to one embodiment of the disclosure is to provide a buffer plate which can achieve stable resistance management and can stably form a charge movement path having a minimum width, a display device including the same, and a display apparatus including the same.

[0024] Objects of the disclosure are not limited to the above-mentioned objects. Other unmentioned objects and advantages of the disclosure can be understood based on the following description, and can be more clearly understood from the embodiments of the disclosure. Further, it is readily understood that the objects and advantages of the disclosure can be realized by the means shown in the claims and combinations thereof.

[0025] A display device according to one embodiment of the disclosure includes a cover member, a display panel disposed on one surface of the cover member, and a buffer plate disposed on one surface of the display panel, wherein the buffer plate includes a buffer layer and a heat dissipation layer, wherein the heat dissipation layer includes a first body vertically overlapping the buffer layer and at least one first extension portion extending from the first body and outward from the buffer layer so as not to vertically overlap the buffer layer, wherein the first extension portion is disposed on one surface of the cover member so as not to vertically overlap the display panel.

[0026] A display device according to one embodiment of the disclosure includes a cover member, a display panel disposed below the cover member, and a buffer plate disposed below the display panel, wherein the buffer plate includes a buffer layer and a heat dissipation layer, wherein the heat dissipation layer includes a first body and a first extension portion extending from the first body and outward from the buffer layer so as not to vertically overlap the buffer layer, a conductive adhesive layer disposed between the first extension portion and the cover member, wherein the conductive adhesive layer includes a second body and a second extension portion extending from the second body and outward from the first extension portion so as not to vertically overlap the first extension portion, and a middle frame disposed on one surface of the buffer plate and electrically connected to the conductive adhesive layer.

[0027] A buffer plate according to one embodiment of the disclosure includes a buffer layer, a heat dissipation layer, wherein the heat dissipation layer includes a first body disposed on an upper surface of the buffer layer and a first extension portion extending from the first body and outward from the buffer layer so as not to vertically overlap the buffer pad, and a conductive adhesive layer disposed on a bottom surface of the first extension portion.

[0028] According to an embodiment of the disclosure, the buffer plate includes the heat dissipation layer having the first extension portion extending outward from the buffer layer so as not to vertically overlap the buffer layer. The first extension portion is disposed on one surface of the cover member. Accordingly, a new charge movement path through which the charge of the cover member can directly move to the buffer plate can be formed.

[0029] Further, the conductive adhesive layer disposed between the first extension of the heat dissipation layer and the cover member and including the second extension is electrically connected to the middle frame. Thus, the heat dissipation layer of the buffer plate and the middle frame can be electrically connected to each other through the conductive adhesive layer.

[0030] Accordingly, a new charge movement path can be formed through which the charges of the display device and the cover member can move to the buffer plate and the middle frame.

[0031] Accordingly, the concentration of charges on the side surface of the display panel can be reduced, thereby reducing the bright phenomenon and the green phenomenon that can be concentrated in the partial area of the side surface of the display panel.

[0032] Further, the heat dissipation layer of the buffer plate and the middle frame can be electrically connected to each other through the conductive adhesive layer. Thus, a separate fixing tape for forming a charge movement path between the buffer plate and the middle frame is not needed, so that the overall thickness of the display device can be reduced as the thickness of the fixing tape is reduced.

[0033] Further, since the heat dissipation layer extends outward and is then disposed on the cover member, the buffer plate and the cover member are directly connected to each other to constitute a charge movement path, a separate additional process for forming the charge movement path after the buffer plate is formed is not needed, so that the efficiency of the manufacturing process can be improved.

[0034] In addition, since the conductive adhesive layer is disposed between the first extension of the heat dissipation layer and the cover member, the charges of the cover member can move to the rear surface of the display device through the charge movement path connected to the heat dissipation layer of the buffer plate through the conductive adhesive layer.

[0035] Since the buffer plate is electrically connected to the ground electrode, the charges moved to the rear surface of the display device can be released to the outside through the ground electrode.

[0036] Since the conductive adhesive layer is disposed between the first extension of the heat dissipation layer and the cover member, the adhesion between the cover member and the first extension can be improved, so that the occurrence of the cocking phenomenon can be reduced.

[0037] In addition, the conductive adhesive layer is formed between the heat dissipation layer of the buffer plate and the cover member to constitute a charge movement path. In this way, the conductive adhesive layer is not exposed to the outside, so that the loss of the charging function due to the damage to the charge movement path by external factors such as physical contact or impact is reduced.

[0038] In addition, the conductive adhesive layer is formed between the heat dissipation layer of the buffer plate and the cover member to constitute a charge movement path. Thus, compared to the case where the charge movement path is formed using a charging solution, stable resistance management can be achieved, and a charge movement path having a minimum width can be stably formed.

[0039] Further, the heat dissipation layer can be an electrically conductive layer having electrical conductivity.

[0040] Further, a portion of the middle frame can simultaneously contact the first extension portion and the second extension portion.

[0041] The middle frame can have a step so that the middle frame simultaneously contacts the first extension portion, the second extension portion, and the first body.

[0042] Further, the buffer plate further includes an anti-peeling layer disposed on the heat dissipation layer.

[0043] Further, the buffer plate further includes an anti-peeling layer, and the buffer layer is disposed on the anti-peeling layer.

[0044] Effects of the present disclosure are not limited to the above-mentioned effects, and other effects not mentioned will become apparent to those skilled in the art from the following description. BRIEF DESCRIPTION OF DRAWINGS

[0045] FIGS. 1A and 1C respectively illustrate front and rear surfaces of a display apparatus according to an embodiment of the present disclosure, and FIG. 1B illustrates a rear surface of the display apparatus in a state in which a case is removed.

[0046] Figure 2 is a cross-sectional view of the display apparatus according to an embodiment of the present disclosure in the I-I' direction.

[0047] Figure 3 is a cross-sectional view of the display apparatus according to an embodiment of the present disclosure in the II-II' direction.

[0048] Figures 4A to 4C are respectively a plan view, a cross-sectional view in the III-III' direction, and a cross-sectional view in the IV-IV' direction of a buffer plate according to an embodiment of the present disclosure.

[0049] Figure 5 is an exploded perspective view of a display device including a cover member, a display apparatus, and a middle frame according to an embodiment of the present disclosure.

[0050] Figure 6 is a rear view of the display device according to an embodiment of the present disclosure.

[0051] Figure 7 is a perspective view of the display device according to an embodiment of the present disclosure and an enlarged view of a partial area of each of a buffer plate and a cover member thereof.

[0052] Figure 8 is a cross-sectional view of the display device according to an embodiment of the present disclosure in the V-V' direction.

[0053] Figure 9 is a cross-sectional view of the display apparatus according to another embodiment of the disclosure in the VI-VI' direction.

[0054] Figure 10 is an enlarged view of a partial region of each of the buffer plate and the cover member of the display apparatus according to another embodiment of the disclosure.

[0055] Figure 11 is a cross-sectional view of the display apparatus according to an embodiment of the disclosure in the VII-VII' direction. DETAILED DESCRIPTION

[0056] Advantages and features of the disclosure, and methods of achieving the advantages and features will become apparent from reference to the following detailed description of embodiments, taken in conjunction with the accompanying drawings. The disclosure, however, is not limited to the embodiments disclosed but is intended to cover all changes, modifications and equivalents thereof which fall within the scope of the disclosure as defined by the appended claims. The disclosure is now described with reference to the drawing, wherein:

[0057] The shapes, sizes, proportions, angles, numbers, and the like disclosed in the drawings for describing the embodiments of the disclosure are exemplary, and the disclosure is not limited thereto. The same reference numerals refer to the same elements here. Also, for simplicity of description, the description and details of well-known steps and elements are omitted. Also, in the following detailed description of the disclosure, numerous specific details are set forth in order to provide a thorough understanding of the disclosure. However, it will be recognized by persons of ordinary skill in the art that the disclosure can be practiced without these specific details. In other instances, well-known methods, procedures, components, and circuits have not been described in detail so as not to unnecessarily obscure aspects of the disclosure.

[0058] The terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the disclosure. As used herein, the singular forms "a", "an" and "the" are intended to include the plural forms as well, unless the context clearly indicates otherwise. It will be further understood that the terms "comprises" and "comprising", when used in this specification, specify the presence of stated features, integers, operations, elements, and / or components, but do not preclude the presence or addition of one or more other features, integers, operations, elements, components, and / or groups thereof. As used herein the term "and / or" includes any and all combinations of one or more of the associated listed items. Expressions such as "at least one of," when preceding a list of elements, modify the entire list of elements and do not modify the individual elements of the list. In the interpretation of the specification and of the claims, errors or tolerances in the numerical expressions are possible even if not explicitly described.

[0059] Furthermore, it will be understood that when a first element or layer is referred to as being "on" or "connected to" a second element or layer, it can be directly on or connected to the second element or layer or intervening elements or layers can be present. In addition, it will also be understood that when an element or layer is referred to as being "between" two elements or layers, it can be the only element or layer between the two elements or layers or one or more intervening elements or layers can also be present.

[0060] Furthermore, as used herein, when a layer, film, region, plate, etc. can be "on" or "on top of" another layer, film, region, plate, etc., the former can be in direct contact with the latter or another layer, film, region, plate, etc. can be disposed between the former and the latter. As used herein, when a layer, film, region, plate, etc. is disposed "on" or "on top of" another layer, film, region, plate, etc. directly, the former is in direct contact with the latter and no other layer, film, region, plate, etc. is disposed between the former and the latter. Furthermore, as used herein, when a layer, film, region, plate, etc. can be "under" or "below" another layer, film, region, plate, etc., the former can be in direct contact with the latter or another layer, film, region, plate, etc. can be disposed between the former and the latter. As used herein, when a layer, film, region, plate, etc. is disposed "under" or "below" another layer, film, region, plate, etc. directly, the former is in direct contact with the latter and no other layer, film, region, plate, etc. is disposed between the former and the latter.

[0061] In descriptions of temporal relationships, such as "after," "subsequently," "before," etc., between two events, another event can occur in between unless "immediately after," "immediately following" or "immediately before" is indicated.

[0062] It will be understood that, although the terms "first," "second," "third," etc. can be used herein to describe various elements, components, regions, layers and / or sections, these elements, components, regions, layers and / or sections should not be limited by these terms. These terms are used to distinguish one element, component, region, layer or section from another element, component, region, layer or section. Thus, a first element, component, region, layer or section described below could be termed a second element, component, region, layer or section without departing from the spirit and scope of the present disclosure.

[0063] Features of various embodiments of the present disclosure can be partially or wholly combined with each other, and can be technically interrelated or interoperative with each other. These embodiments can be implemented independently from each other, or together in a related manner.

[0064] In explaining numerical values, unless separately and explicitly described, the value is interpreted to include an error range.

[0065] It should be understood that when an element or layer is referred to as being "connected to" or "combined to" another element or layer, it can be directly located, connected to, or combined to the other element or layer, or one or more intervening elements or layers can exist. In addition, it should also be understood that when an element or layer is referred to as being "between" two elements or layers, it can be the only element or layer between the two elements or layers, or one or more intervening elements or layers can also exist.

[0066] Features of various embodiments of the present disclosure can be partially or wholly combined with each other, and can be technically interrelated or interoperative with each other. These embodiments can be implemented independently from each other, or together in a related manner.

[0067] Unless otherwise defined, all terms used herein, including technical and scientific terms, have the same meaning as commonly understood by one of ordinary skill in the art to which the present disclosure belongs. It will be further understood that terms, such as those defined in commonly used dictionaries, should be interpreted as having a meaning that is consistent with their meaning in the context of the relevant art and will not be interpreted in an idealized or overly formal sense unless expressly so defined herein.

[0068] The display device according to the present disclosure can be applied to an organic light emitting display device. The present disclosure is not limited thereto. The display device according to the present disclosure can be applied to various display devices such as a display device of Micro LED or a quantum dot display device, etc.

[0069] Hereinafter, a display device according to an embodiment of the present disclosure will be described in detail with reference to the accompanying drawings.

[0070] FIGS. 1A and 1C respectively illustrate a front surface and a rear surface of a display device according to an embodiment of the present disclosure, and FIG. 1B illustrates a rear surface of the display device in a state in which an outer case is removed.

[0071] As used herein, each of the forward and upward directions can represent a Z-axis direction, and each of the rearward and downward directions can represent a -Z-axis direction.

[0072] The display apparatus 1 can include a display device 10 including a cover member 20 and a display panel 100 attached to a bottom of the cover member 20. A direction from a top of the cover member to the bottom can refer to a downward direction (-Z axis direction).

[0073] The cover member 20 can be disposed to constitute a front of the display apparatus 1 to protect the display apparatus 1 from external impact.

[0074] An edge portion of the cover member 20 can have a curved portion or an arc-shaped portion curved or arc-shaped toward a rear surface of the display device 10.

[0075] Since the cover member 20 can be disposed to cover side surfaces of the display device 10 of the display apparatus 1, the cover member 20 can protect the display panel 100 not only from external impact on a front surface of the display device 10 but also from external impact on the side surfaces of the display device 10.

[0076] The cover member 20 can vertically overlap a display area AA of a display panel displaying an image. For example, the cover member 20 can be made of a transparent plastic material through which an image is transparent, or can be made of a cover glass of a transparent glass material. The disclosure is not limited thereto.

[0077] A housing 40 for supporting the cover member 20 can be disposed on a rear surface of the display device 10.

[0078] The housing 40 can serve as a housing protecting a rear surface of the display apparatus 1, and can serve as a housing constituting an outermost case of the display apparatus 1.

[0079] The housing 40 can be made of various materials, such as plastic, metal, or glass.

[0080] A middle frame (not shown) can be additionally disposed between the cover member 20 and the housing 40.

[0081] The middle frame can be disposed on a rear surface of the display device 10 and can accommodate the display device 10 therein. The middle frame can contact the cover member 20 so that the middle frame supports the cover member 20.

[0082] The middle frame can serve as a housing protecting a rear surface of the display device 10.

[0083] The middle frame can have a structure in which the display device 1 is disposed on one surface of the display apparatus 10 and additional components such as a battery for supplying power to the display apparatus 1 are disposed on another surface of the middle frame.

[0084] A front portion FP of the display panel 100 can be disposed on a bottom surface of the cover member 20.

[0085] The front portion FP can include a pixel array including a plurality of pixels having a plurality of light emitting elements, a driving transistor, and a signal line transmitting a driving signal to the pixels, so that an image can be displayed from the front portion.

[0086] The front portion FP can include a display area AA (active area) displaying an image and a non-display area NA (non-active area) other than the display area AA. The non-display area NA can be formed as an edge area surrounding the display area AA.

[0087] The display area AA and the non-display area NA can be equally applied to the cover member 20.

[0088] The area of the cover member 20 through which an image is transmitted can be a display area AA thereof.

[0089] The area of the cover member 20 surrounding the display area AA and in which an image is not transmitted can be a non-display area NA thereof.

[0090] The non-display area NA can be defined as a bezel area.

[0091] The display panel 100 disposed below the cover member 20 can include a bending portion extending from one side of the front portion FP thereof and bending downward.

[0092] The bending portion can be located at the outermost portion of the display panel 100, and thus can be easily exposed to an external impact. When an impact is applied to the bending portion, the bending portion can be easily deformed or broken. Accordingly, a support member or a reinforcing member for protecting the bending portion can be added to absorb the impact.

[0093] Hereinafter, a structure of the display device 10 according to an embodiment of the disclosure will be described.

[0094] Figure 2 is a cross-sectional view taken along line I-I' of the display device 10 according to an embodiment of the disclosure.

[0095] The display device 10 can include a cover member 20 as a topmost portion thereof and a display panel 100 disposed below the cover member 20.

[0096] The display device 10 can include a display panel 100 having a front portion FP, a bending portion BND, and a pad portion PAD bent from the bending portion BND to be disposed on a rear surface of the front portion FP, a buffer plate 300 disposed between the front portion FP and the pad portion PAD and below the front portion FP, and a second connection member 400 fixing the pad portion PAD to the buffer plate 300.

[0097] The first back plate 210, the buffer plate 300, the second connection member 400, the second back plate 220, and the pad portion PAD can be sequentially disposed under the front portion FP of the display panel 100.

[0098] The first connection member 150 can be disposed between the cover member 20 and the display panel 100.

[0099] The first connection member 150 can connect or combine the cover member 20 and the display panel 100 to each other.

[0100] For example, the first connection member 150 can be a fixing member. The present disclosure is not limited to this term.

[0101] Since the first connection member 150 can be disposed to vertically overlap the display area AA, the member 150 can be made of a material that can transmit an image of the display panel 100.

[0102] For example, the first connection member 150 can be made of or can include a material such as OCA (optical clear adhesive), OCR (optically clear resin), or PSA (pressure sensitive adhesive). However, the present disclosure is not limited thereto.

[0103] The light shielding layer 21 can be disposed in an edge area of the non-display area NA including a bottom surface of the cover member 20.

[0104] The light shielding layer 21 can prevent various circuits and lines disposed in the non-display area NA of the display panel 100 and various structures that can be disposed in the non-display area NA of the display panel 100 from being seen by a user.

[0105] The light shielding layer 21 can be disposed in a manner corresponding to at least the non-display area NA of the display panel 120. The light shielding layer 21 can be made of a material capable of absorbing light. For example, the light shielding layer 21 can be made of a black matrix and can be formed by printing black ink. The present disclosure is not limited thereto.

[0106] The light shielding layer 21 can include a conductive material and be conductive. When the light shielding layer 21 is conductive, the light shielding layer 21 can make electrical connection. To this end, the light shielding layer 21 can constitute a charge movement path to move a charge of the cover member 20.

[0107] The display panel 100 disposed under the cover member 20 can include the front portion FP, the bending portion BND, and the pad portion PAD constituting the display substrate 110.

[0108] The front portion FP of the display panel 100 can be disposed under the first connection member 150. For example, the front portion FP can be a portion that displays an image. The front portion can include the display substrate 110, the pixel array 120, the encapsulation portion 130, and the polarizing plate 140.

[0109] The bending portion BND of the display panel 100 can extend from one side of the front portion FP and be bent downward (in the -Z axis direction) and then horizontally (in the Y axis direction). The bending portion BND can include the display substrate 110 and the signal line.

[0110] The pad portion PAD of the display panel 100 can extend from the bending portion BND and be disposed under the front portion FP.

[0111] The pad portion PAD can include the display substrate 110, the signal line, and a pad electrode connected to the signal line. The driver circuit 160 for driving the pixels or the flexible circuit board 500 can be mounted on the pad electrode.

[0112] The polarizing plate 140 can be disposed on a top surface of the front portion FP, and thus can be disposed on a top surface of the display panel 100. In addition, a functional layer for improving display performance of the display apparatus can be further disposed between the first connection member 150 and the polarizing plate 140.

[0113] The polarizing plate 140 prevents reflection of external light and improves outdoor visibility and contrast of an image displayed on the display panel 100.

[0114] The display panel 100 can include the display substrate 110, the pixel array 120 disposed on the display substrate 110, and the encapsulation portion 130 disposed to cover the pixel array 120.

[0115] A portion of the display substrate 110 can constitute a bottom portion of the display panel 100.

[0116] The display substrate 110 can constitute each of the front portion FP, the bending portion BND, and the pad portion PAD.

[0117] The display substrate 110 can be made of a flexible plastic material and can have a flexible property.

[0118] The display substrate 110 can include polyimide, or can be made of a thin glass material having flexibility.

[0119] The pixel array 120 can be disposed on the display substrate 110. The pixel array 120 can display an image. An area in which the pixel array 120 can be disposed can be a display area AA.

[0120] Thus, an area of the cover member 20 corresponding to the pixel array 120 can be a display area AA of the cover member 20, and an area of the cover member 20 other than the display area AA of the cover member 20 can be a non-display area NA.

[0121] The pixel array 120 can include light emitting elements, thin film transistors for driving the light emitting elements, and signal lines such as gate lines, data lines, and pixel driving power lines on the display substrate 110.

[0122] The pixel array 120 can include pixels that display an image based on a signal provided to the signal lines. The pixels can include light emitting elements and thin film transistors.

[0123] The light emitting element can include an anode electrode electrically connected to the thin film transistor, a light emitting layer formed on the anode electrode, and a cathode electrode for providing a common voltage.

[0124] The thin film transistor can include a gate electrode, a semiconductor layer, a source electrode, and a drain electrode. The semiconductor layer of the thin film transistor can include silicon such as amorphous silicon, polysilicon, or low-temperature polysilicon, or an oxide such as IGZO (indium-gallium-zinc-oxide). The present disclosure is not limited thereto.

[0125] The anode electrode can be disposed in each pixel area and disposed in a manner corresponding to an opening area defined according to a pattern shape of the pixels, and can be electrically connected to the thin film transistor.

[0126] The light emitting element can include a light emitting layer formed between the anode electrode and the cathode electrode. The light emitting element can be implemented to emit light of the same color such as white light for each pixel, or to emit light of different colors such as red, green, or blue for each pixel.

[0127] The encapsulation part 130 can be disposed on the display substrate 110 to cover the pixel array 120.

[0128] The encapsulation part 130 can prevent oxygen, moisture, or foreign substances from invading the light emitting layer of the pixel array 120. For example, the encapsulation part 130 can be formed in a multi-layer structure in which organic material layers and inorganic material layers are alternately stacked. The present disclosure is not limited thereto.

[0129] The front part FP of the display panel 100 can include the display substrate 110, the pixel array 120, and the encapsulation part 130. The front part can be formed in a flat manner except for an edge portion of the front plate.

[0130] The first back plate 210 to be described later can be connected or bonded to a rear surface of the front part FP to maintain a flat state of the front part FP.

[0131] The bending part BND of the display panel 100 can be devoid of the pixel array 120, the encapsulation part 130, and the first back plate 210 to be described later, and can include the display substrate 110. The bending part BND can be a portion that can be easily bent in a direction desired by a user.

[0132] The pad portion PAD of the display panel 100 can be free of the pixel array 120 and the package portion 130.

[0133] The second back plate 220 can be connected or bonded to the rear surface of the pad portion PAD such that the pad portion PAD can be maintained in a flat state.

[0134] Accordingly, the front portion FP of the display panel 100 can be disposed in the area of the display screen, and the pad portion PAD can be bent horizontally inward from the bending portion BND and can be disposed under the front portion FP, i.e., on the rear surface of the front portion FP.

[0135] The first back plate 210 disposed under the front surface FP of the display panel 100 and the second back plate 220 disposed under the pad portion PAD can be disposed under the display substrate 110 to complement the rigidity of the display substrate 110 and maintain the front surface FP in a flat state.

[0136] Each of the first back plate 210 and the second back plate 220 can be formed to have a certain strength and thickness to complement the rigidity of the display substrate 110 and can not be formed in a bending portion area where the bending portion BND is located.

[0137] Based on the shape of the display panel 100 before being bent, the first back plate 210 and the second back plate 220 can be disposed under the display substrate 110 and spaced apart from each other.

[0138] Based on the shape of the display panel 100 after being bent, the first back plate 210 can be disposed under the front portion FP, and the second back plate 220 can be disposed on the top surface of the pad portion PAD.

[0139] Each of the first back plate 210 and the second back plate 220 can be a back plate disposed on the rear surface of the display substrate 110.

[0140] Each of the first back plate 210 and the second back plate 220 can be composed of a plastic film having rigidity.

[0141] For example, each of the first back plate 210 and the second back plate 220 can be made of polyethylene terephthalate (PET), polyimide (PI), polyethylene naphthalate (PEN), or the like. The present disclosure is not limited thereto.

[0142] The first back plate 210 and the second back plate 220 can be made of the same material and can have the same thickness. The present disclosure is not limited thereto.

[0143] Based on the shape of the display panel 100 after being bent, the buffer plate 300 can be disposed between the first back plate 210 and the second back plate 220.

[0144] The buffer plate 300 can be disposed under the first back plate 210.

[0145] The buffer plate 300 can include at least one of a heat dissipation layer 310, an anti-peeling layer 320, a buffer layer 330, and an adhesive layer 340. For example, the buffer plate 300 can have a structure in which the adhesive layer 340, the buffer layer 330, the anti-peeling layer 320, and the heat dissipation layer 310 are sequentially stacked downward.

[0146] The heat dissipation layer 310 can be disposed in a manner corresponding to a component that generates a high temperature and can include a material having a high thermal conductivity. Accordingly, a heat dissipation effect of the display panel 100 can be improved.

[0147] The heat dissipation layer 310 can be a conductive layer having electrical conductivity. Accordingly, the heat dissipation layer 310 can have a function of grounding and protecting a rear surface of the display substrate 110 as well as a heat dissipation function.

[0148] When the heat dissipation layer 310 is made of a metal layer, the heat dissipation layer 310 can effectively protect a distal end region of the display panel 100 in which a crack is likely to occur.

[0149] For example, the heat dissipation layer 310 can include a metal, such as copper (Cu) and aluminum (Al), or graphite, etc., having a high thermal conductivity. The present disclosure is not limited thereto.

[0150] In addition, the heat dissipation layer 310 can include SUS (stainless steel) and can be implemented as a SUS plate.

[0151] When the heat dissipation layer 310 includes SUS, the heat dissipation layer 310 can have a higher thermal conductivity and strength while having a smaller thickness, as compared to a case in which the heat dissipation layer 310 includes other metals.

[0152] The anti-peeling layer 320 can be disposed on the heat dissipation layer 310.

[0153] The anti-peeling layer 320 can be made of a flexible material, such as polyimide. The present disclosure is not limited thereto.

[0154] When the side surface of the cover member 20 is bent, the buffer plate 300 can have a cocking phenomenon. To this end, the anti-peeling layer 320 can be disposed to prevent the cocking phenomenon.

[0155] Since the anti-peeling layer 320 has flexibility, the anti-peeling layer 320 can minimize the cocking phenomenon that can occur when the cover member 20 is bent.

[0156] The buffer layer 330 can be disposed on the anti-peeling layer 320 and can include a foam tape or a foam pad.

[0157] The buffer layer 330 can reduce an impact on each portion that can come into contact with the buffer plate 300.

[0158] The cushion layer 330 having a shock-reducing function can enhance rigidity of the cushion plate 300.

[0159] The adhesive layer 340 can be disposed on the cushion layer 330, and can include an uneven structure formed on a surface of the adhesive layer 340.

[0160] When the cushion plate 300 is attached to the first back plate 210, the uneven structure of the adhesive layer 340 can prevent air bubbles from being generated between the first back plate 210 and the cushion plate 300. Accordingly, a degassing or debubbling process for removing air bubbles between the first back plate 210 and the cushion plate 300 can be omitted.

[0161] The adhesive layer 340 includes an adhesive component and is in direct contact with the first back plate 210 to fix the cushion plate 300 to the first back plate 210.

[0162] The adhesive layer 340 can be made of or include a material such as at least one of OCA (optical clear adhesive), OCR (optical clear resin), or PSA (pressure sensitive adhesive).

[0163] The second connection member 400 and the second back plate 220 can be disposed below the cushion plate 300.

[0164] The second connection member 400 can be disposed between the cushion plate 300 and the pad portion PAD.

[0165] When the pad portion PAD of the display panel 100 is bent from the bent portion BND to be disposed below the front portion FP of the display panel 100, a restoring force to restore the display panel 100 to a state before bending can be strong.

[0166] When the restoring force is strongly applied, a cocking phenomenon in which the bent pad portion PAD of the display panel 100 is not fixed but lifted up can occur.

[0167] The second connection member 400 can function as a fixing member to fix the bent display panel 100, so that the display panel 100 can maintain its bent shape.

[0168] The second connection member 400 can be formed to have a constant thickness in a thickness direction to maintain a constant curvature of the bent portion BND.

[0169] The second connection member 400 can be implemented as a double-sided tape having an adhesive strength by which the second connection member 400 can fix the second back plate 220 and the heat dissipation layer 310 to each other. The disclosure is not limited thereto.

[0170] Alternatively, the second connecting member 400 can be made of a foam tape or a foam pad having adhesive force to further have an effect of reducing impact.

[0171] The second back plate 220 can be disposed under the second connecting member 400.

[0172] To place the second back plate 220, the second back plate 220 can be attached to a bottom surface of the pad portion PAD, and then the bending portion BND can be bent, and the second back plate 220 can be attached and fixed to a bottom surface of the second connecting member 400.

[0173] The second back plate 220 can be disposed on a top surface of the pad portion PAD in a state in which the second back plate 220 is fixed to the second connecting member 400.

[0174] For example, the second connecting member 400 and the second back plate 220 can be disposed between the heat dissipation layer 310 of the buffer plate 300 and the pad portion PAD.

[0175] When the second back plate 220 is fixed to the second connecting member 400, an outer portion that is a top surface of the bending portion BND can be exposed to the outside, and a bottom surface that is an inner portion of the bending portion BND can face the side surfaces of the buffer plate 300 and the second connecting member 400.

[0176] The reinforcing member 600 can be disposed on a top surface of the bending portion BND of the display panel 100.

[0177] The reinforcing member 600 can extend to cover the bending portion BND, and cover at least a partial area of each of the front portion FP and the pad portion PAD.

[0178] The reinforcing member 600 can include a resin. For example, the reinforcing member 600 can include a UV-cured acrylic resin. The disclosure is not limited thereto.

[0179] Because the reinforcing member 600 can cover various signal lines disposed between the package portion 130 and the pad portion PAD of the display panel 100, the reinforcing member 600 can prevent moisture from invading the signal lines while protecting the signal lines from external impact.

[0180] To increase the flexibility of the display panel 100, the bending portion BND can have no other components other than the display substrate 110 and the signal lines. Accordingly, the reinforcing member 600 can supplement the rigidity of the bending portion BND in which no other components are present.

[0181] In one example, the driver circuit 160 can be disposed on another surface of the one surface on which the second back plate 220 can be disposed with respect to the pad portion PAD of the display panel 100.

[0182] The driver circuit 160 can be provided in the form of a chip on plastic (COP) mounted on the display substrate 110. However, the present disclosure is not limited thereto.

[0183] The driver circuit 160 can generate data signals and gate control signals based on image data and timing synchronization signals provided from an external host driving system.

[0184] The driver circuit 160 can provide data signals to data lines of each pixel through display pads, and can provide gate control signals to a gate driver circuit through the display pads.

[0185] The driver circuit 160 can be mounted in a chip mounting area defined in the display substrate 110, and can be electrically connected to the display pads, and can be connected to signal lines of the gate driver circuit and the pixel array 120 provided on the display substrate 110.

[0186] The display pads can be provided at a distal end of the display substrate 110 on which the driver circuit 160 is mounted.

[0187] The display pads can be provided on one surface of the display substrate 110 and electrically connected to the flexible circuit board 500 on which the circuit board is mounted.

[0188] The flexible circuit board 500 can be electrically connected to the display pads provided on the distal end of the display substrate 110 by using a film attachment process of a conductive adhesive layer, and can be positioned on the rear surface of the display panel 100.

[0189] One example of a material of the conductive adhesive layer can include an anisotropic conductive film (ACF).

[0190] The circuit board can provide image data and timing synchronization signals provided from the host driving system to the driver circuit 160, and can provide voltages required to drive each of the pixel array 120, the gate driver circuit, and the driver circuit 160.

[0191] Hereinafter, with reference to Figure 3 A display device according to another embodiment of the present disclosure will be described.

[0192] Figure 3 is a cross-sectional view of the display device 10 according to the embodiment of the present disclosure in the II-II' direction.

[0193] For convenience of explanation, the display device 10 is described as being divided into layers. Figure 3 The thickness or size of each layer of the display device 10 shown in Figure 2 may be different from the thickness or size of each layer of the display device 10 shown in

[0194] The display device 10 according to an embodiment of the disclosure can include a cover member 20, a display panel 100 disposed on one surface of the cover member 20, and a buffer plate 300 disposed on one surface of the display panel 100.

[0195] Referring to Figure 3 The display panel 100 and the buffer plate 300 can be sequentially stacked on the cover member 20.

[0196] The first back plate 210 can be disposed between the display panel 100 and the buffer plate 300.

[0197] The buffer plate 300 includes an adhesive layer 340, a buffer layer 330, and a heat dissipation layer 310. The adhesive layer 340, the buffer layer 330, and the heat dissipation layer 310 can be sequentially stacked on the display panel 100.

[0198] As used herein, the surfaces facing each other of a layer can be defined as one surface and the other surface, respectively.

[0199] Accordingly, the heat dissipation layer 310 can be disposed on one surface of the buffer layer 330, and the adhesive layer 340 can be formed on the other surface of the buffer layer 330.

[0200] Referring to Figures 4A to 4C The buffer plate 300 according to an embodiment of the disclosure will be described.

[0201] The heat dissipation layer 310 can include a first body 310a disposed to be vertically overlapped with the buffer layer 330, and at least one first extension 310b extending outward from the buffer layer 330.

[0202] The first body 310a of the heat dissipation layer 310 can have a shape substantially the same as a shape of the buffer layer 330.

[0203] The first body 310a and the first extension 310b can not be physically separated from each other and can be integrally formed with each other.

[0204] In one example, the buffer plate 300 can be formed in a flat plate shape. The first body 310a of the heat dissipation layer 310 can be formed in a flat plate shape.

[0205] When the first body 310a of the heat dissipation layer 310 is formed in a flat plate shape, the first body 310a of the heat dissipation layer 310 can have four side surfaces.

[0206] The first extension 310b can be formed to extend along at least one side surface of the first body 310a, thereby protruding outward from the first body 310a and the buffer layer 330.

[0207] Referring to Figure 4AThe first extension 310b is illustrated as being formed along three side surfaces of the first body 310a. However, the present disclosure is not limited thereto.

[0208] The first extension 310b can be formed to protrude outward and extend along the side surface of the first body 310a, and can be formed in an elongated bar shape along the length direction of the first body 310a.

[0209] Referring to FIG. 4B, the conductive adhesive layer 350 can be disposed on the other surface of the first extension 310b.

[0210] The other surface of the first extension 310b refers to the face of the first extension 310b on which the buffer layer 330 is disposed.

[0211] Accordingly, the buffer layer 330 and the conductive adhesive layer 350 can be disposed on the other surface of the first body 310a and the first extension 310b, respectively.

[0212] The buffer layer 330 and the conductive adhesive layer 350 can be disposed on the other surface of the heat dissipation layer 310.

[0213] The anti-peeling layer 320 can be disposed between the first body 310a and the buffer layer 330.

[0214] In this case, the anti-peeling layer 320 and the conductive adhesive layer 350 can be disposed in the same layer and on the other surface of the heat dissipation layer 310.

[0215] Referring to Figure 4A and Figure 4C The conductive adhesive layer 350 can include a second body 350a disposed to be perpendicularly overlapped with the first extension 310b of the heat dissipation layer 310, and a second extension 350b extending outward from the first extension 310b.

[0216] The second body 350a and the second extension 350b can not be physically separated from each other, and can be integrally formed with each other. That is, the second body 350a and the second extension 350b can be integral.

[0217] The second extension 350b of the conductive adhesive layer 350 can extend from the second body 350a along the length direction of the heat dissipation layer 310 and can have an elongated bar shape.

[0218] Accordingly, the first extension 310b of the heat dissipation layer 310 and the second extension 350b of the conductive adhesive layer 350 can extend in directions perpendicular to each other.

[0219] Referring to Figure 3The heat dissipation layer 310 of the buffer plate 300 includes a first extension 310b extending outward from the buffer layer 330. The first extension 310b can be disposed on one surface of the cover member 20 so as not to be vertically overlapped with the display panel 100.

[0220] The display panel 100 and the buffer layer 330 are disposed between the first body 310a of the heat dissipation layer 310 and the cover member 20, whereas the display panel 100 and the buffer layer 330 are not disposed between the first extension 310b of the heat dissipation layer 310 and the cover member 20. Accordingly, the first body 310a and the first extension 310b can be disposed in different layers. Accordingly, a step can be formed therebetween.

[0221] Accordingly, the first extension 310b extending from the first body 310a can include an inclined portion in the stepped region.

[0222] The electrically conductive first extension 310b of the heat dissipation layer 310 can be disposed on one surface of the cover member 20 such that the first extension 310b can be electrically connected to the cover member 20.

[0223] Since the first extension 310b of the heat dissipation layer 310 is electrically connected to the cover member 20, the electric charge of the cover member 20 can be moved to the buffer plate 300 through the electric charge movement path extending along the first extension 310b to the first body 310a of the heat dissipation layer 310.

[0224] Accordingly, according to the embodiment of the disclosure, the heat dissipation layer 310 of the buffer plate 300 can extend to the outside of the buffer layer 330 to constitute a new electric charge movement path in which the cover member 20 and the buffer plate 300 are electrically connected to each other.

[0225] Accordingly, the concentration of electric charge on the side surface of the display panel 100 can be reduced, thereby reducing the brighter phenomenon and the greenish phenomenon that can be concentratedly generated in a partial region of the side surface of the display panel 100.

[0226] Further, since the electric charge movement path in which the cover member 20 and the buffer plate 300 are electrically connected to each other is formed, and the display panel 100 can not constitute the electric charge movement path, the amount of electric charge that flows into the display panel 100 without being moved to the ground electrode through the buffer plate 300 of the cover member 20 can be greatly reduced.

[0227] Further, since the heat dissipation layer 310 extends outward and is then disposed on the cover member 20 such that the buffer plate 300 and the cover member 20 are directly connected to each other so as to constitute the electric charge movement path, a separate additional process for forming the electric charge movement path after the buffer plate 300 is formed is not required, and thus the efficiency of the manufacturing process can be improved.

[0228] The conductive adhesive layer 350 can be disposed between the first extension 310b of the heat dissipation layer 310 and the cover member 20.

[0229] Since the conductive adhesive layer 350 is disposed between the first extension 310b of the heat dissipation layer 310 and the cover member 20, the electric charge of the cover member 20 can move to the rear surface of the display device 10 through the electric charge moving path connected to the heat dissipation layer 310 of the buffer plate 300 via the conductive adhesive layer 350.

[0230] Since the buffer plate 300 is electrically connected to the ground electrode, the electric charge moved to the rear surface of the display device 10 can be discharged to the outside through the ground electrode.

[0231] Since the conductive adhesive layer 350 is disposed between the first extension 310b of the heat dissipation layer 310 and the cover member 20, the adhesion between the cover member 20 and the first extension 310b can be improved, and thus the occurrence of the warping phenomenon can be reduced.

[0232] The conductive adhesive layer 350 can be implemented as a conductive tape. However, the present disclosure is not limited thereto.

[0233] In this way, the conductive adhesive layer 350 is formed between the heat dissipation layer 310 of the buffer plate 300 and the cover member 20 to constitute the electric charge moving path. Thus, the conductive adhesive layer 350 is not exposed to the outside, thereby reducing the loss of the charging function due to the damage to the electric charge moving path by external factors such as physical contact or impact.

[0234] Further, the conductive adhesive layer 350 is formed between the heat dissipation layer 310 of the buffer plate 300 and the cover member 20 to constitute the electric charge moving path. Thus, compared to the case where the electric charge moving path is formed using a charging solution, stable resistance management can be achieved, and the electric charge moving path having a minimum width can be stably formed.

[0235] For example, when the electric charge moving path is formed using a charging solution, the electric charge moving path can be formed to have a width of at least about 20 mm. When the conductive adhesive layer 350 is implemented as a conductive tape, the path can be formed to have a very small width of about 1 mm.

[0236] Further, when the electric charge moving path is formed using a charging solution, it is difficult to form the charging solution to have a constant thickness over the entire area of the applied solution, and thus it is difficult to manage the path to have uniform resistance over the entire area.

[0237] However, when the electric charge moving path is formed using the conductive adhesive layer 350 instead of the charging solution as in the embodiment of the present disclosure, the conductive adhesive layer 350 can be manufactured to have a uniform thickness, and thus the conductive adhesive layer 350 has uniform resistance over the entire area.

[0238] The light-blocking layer 21 can be disposed between the conductive adhesive layer 350 and the cover member 20.

[0239] In this case, the light-blocking layer 21 can include a conductive material and thus have a conductive property.

[0240] When the light-blocking layer 21 has a conductive property, the electric charge of the cover member 20 can move to the first extension 310b of the heat dissipation layer 310 of the buffer plate 300 through the conductive light-blocking layer 21 and the conductive adhesive layer 350.

[0241] Accordingly, a new electric charge movement path including the light-blocking layer 21 can be formed.

[0242] Hereinafter, a display device according to an embodiment of the disclosure will be described with reference to the accompanying drawings. Figures 5 to 9

[0243] Referring to FIG. 1, Figure 5 The display device 1 according to an embodiment of the disclosure can include a cover member 20, a display apparatus 10, and a middle frame 30.

[0244] A housing 40 can be additionally disposed on the middle frame 30 to protect internal components of the display apparatus 1.

[0245] As used herein, the middle frame 30 and the housing 40, which are additionally disposed on the display apparatus 10, can each be defined as a disposed component.

[0246] Various additional components such as a battery and a storage device can be disposed in the disposed component, and the internal design of the disposed component can be modified in various forms based on the arrangement structure of the additional components.

[0247] Referring to FIG. 1, Figure 6 and Figure 7 When the display apparatus 10 is coupled to the cover member 20, the second extension 350b of the conductive adhesive layer 350 can be formed to extend along an edge portion of the cover member 20.

[0248] Further, since the second extension 350b of the conductive adhesive layer 350 is formed to extend outward from the first extension 310b of the heat dissipation layer 310, the second extension 350b can be exposed to the outside of the buffer plate 300 without being vertically overlapped with the buffer plate 300.

[0249] When the middle frame 30 is disposed on the display apparatus 10, the middle frame 30 can be disposed on one surface of the buffer plate 300. The middle frame 30 and the conductive adhesive layer 350 of the buffer plate 300 can be electrically connected to each other.

[0250] Referring to FIG. 1, Figure 8 and Figure 9 ​A portion of the middle frame 30 can be electrically connected to the second extension 350b of the conductive adhesive layer 350.

[0251] Since the second extension 350b of the conductive adhesive layer 350 is exposed to the outside without being vertically overlapped with the first extension 310b of the heat dissipation layer 310, a partial area of the middle frame 30 disposed on the buffer plate 300 can directly contact and thus be electrically connected to the second extension 350b of the conductive adhesive layer 350.

[0252] Since the conductive adhesive layer 350 is electrically connected to the middle frame 30, the heat dissipation layer 310 of the buffer plate 300 and the middle frame 30 can be electrically connected to each other via the conductive adhesive layer 350.

[0253] Accordingly, a new charge movement path along which the charge of the cover member 20 can directly move to the middle frame 30 without passing through the heat dissipation layer of the buffer plate 300 can be formed.

[0254] In addition, a new charge movement path along which the charge of the cover member 20 can move to the buffer plate 300 via the middle frame 30 and the conductive adhesive layer 350 can be formed.

[0255] A portion of the middle frame 30 can directly contact the first body 310a of the heat dissipation layer 310 of the buffer plate 300.

[0256] Since the middle frame 30 can be fixed using the second extension 350b of the conductive adhesive layer 350, the first body 310a and the middle frame 30 can be fixed to and contact each other without a separate fixing device being disposed between the first body 310a of the heat dissipation layer 310 and the middle frame 30.

[0257] A portion of the middle frame 30 can directly contact the first extension 310b of the heat dissipation layer 310.

[0258] Referring to Figure 9 The middle frame 30 can simultaneously contact the first extension 310b and the second extension 350b.

[0259] For example, the conductive adhesive layer 350 can be implemented as an elastic conductive tape.

[0260] Accordingly, when pressure is applied to the buffer plate 300 to join the buffer plate 300 to the middle frame 30, the second body 350a of the conductive adhesive layer 350 that is vertically overlapped with the first extension 310b of the heat dissipation layer 310 is pressed by the middle frame 30, so that the thickness of the conductive adhesive layer 350 can be reduced.

[0261] Accordingly, the first extension 310b of the heat dissipation layer 310 and the second extension 350b of the conductive adhesive layer 350 can be formed to be substantially coplanar with each other. Accordingly, the first extension 310b of the heat dissipation layer 310 and the second extension 350b of the conductive adhesive layer 350 can simultaneously contact the middle frame 30.

[0262] Further, the middle frame 30 can have a step such that the middle frame 30 can simultaneously contact the first extension 310b of the heat dissipation layer 310, the second extension 350b of the conductive adhesive layer 350, and the first body 310a of the buffer plate 300.

[0263] Accordingly, the middle frame 30 can be electrically connected to the cover member 20 and the display device 10 connected to the buffer plate 300 at the same time, and thus can release the electric charge to the ground electrode.

[0264] Further, since the contact area in which the middle frame 30 directly contacts the heat dissipation layer 310 and the conductive adhesive layer 350 of the buffer plate 300 is increased, the electric charge movement path constituted by the cover member 20, the middle frame 30, and the buffer plate 300 can be firmly and stably formed and maintained.

[0265] Further, according to the embodiment of the disclosure, the overall thickness of the display device 1 can be reduced.

[0266] Referring to Figure 10 and Figure 11 In another embodiment of the disclosure, the first extension of the heat dissipation layer 310 of the buffer plate 300, which extends outward, can not be formed.

[0267] However, in this case, in order to secure the electrical connection between the middle frame 30 and the heat dissipation layer 310 of the buffer plate 300 and to fix the middle frame 30 and the heat dissipation layer 310 to each other, a separate fixing tape, for example, the first fixing tape 370a, can be required.

[0268] Further, in order to secure the electrical connection between the middle frame 30 and the cover member 20 and to fix the middle frame 30 and the cover member 20 to each other, a separate fixing tape, for example, the second fixing tape 370b, can be required.

[0269] Accordingly, the thickness of the display device 1 is increased by the thickness of the separate fixing tape added between the middle frame 30 and the heat dissipation layer 310 of the buffer plate 300.

[0270] However, according to the embodiment of the disclosure with reference to Figure 8 , the heat dissipation layer 310 of the buffer plate 300 and the middle frame 30 can be electrically connected to each other via the conductive adhesive layer 350. Accordingly, it is not necessary to provide a separate fixing tape to form the electric charge movement path between the buffer plate 300 and the middle frame 30.

[0271] Accordingly, according to an embodiment of the disclosure, the overall thickness of the display device 1 can be reduced as much as the thickness reduction of the fixing tape.

[0272] A first aspect of the disclosure provides a display device including a cover member, a display panel disposed on one surface of the cover member, and a buffer plate disposed on one surface of the display panel, wherein the buffer plate includes a buffer layer and a heat dissipation layer, wherein the heat dissipation layer includes a first body vertically overlapping the buffer layer and at least one first extension portion extending from the first body and outward from the buffer layer so as not to vertically overlap the buffer layer, wherein the first extension portion is disposed on one surface of the cover member so as not to vertically overlap the display panel.

[0273] In one embodiment of the display device, the first extension portion extends along at least one side surface of the first body.

[0274] In one embodiment of the display device, the first extension portion is electrically connected to the cover member.

[0275] In one embodiment of the display device, the display device further includes a conductive adhesive layer between the first extension portion and the cover member.

[0276] In one embodiment of the display device, the conductive adhesive layer includes a second body disposed to vertically overlap the first extension portion and a second extension portion extending from the second body to an outer side of the first extension portion so as not to vertically overlap the first extension portion.

[0277] In one embodiment of the display device, the second extension portion extends along an edge portion of the cover member.

[0278] In one embodiment of the display device, the second extension portion is disposed not to vertically overlap the buffer plate.

[0279] In one embodiment of the display device, the display device further includes a conductive light shielding layer disposed between the conductive adhesive layer and the cover member.

[0280] A second aspect of the disclosure provides a display device including a cover member, a display panel disposed on one surface of the cover member, a buffer plate disposed on one surface of the display panel, wherein the buffer plate includes a buffer layer and a heat dissipation layer, wherein the heat dissipation layer includes a first body and a first extension portion extending from the first body outward of the buffer layer so as not to vertically overlap the buffer layer, a conductive adhesive layer disposed between the first extension portion and the cover member, wherein the conductive adhesive layer includes a second body and a second extension portion extending from the second body to an outer side of the first extension portion so as not to vertically overlap the first extension portion, and a middle frame disposed on one surface of the buffer plate and electrically connected to the conductive adhesive layer.

[0281] In one embodiment of the display device, the second extension is exposed outside the buffer plate.

[0282] In one embodiment of the display device, the first extension and the second extension extend in perpendicular directions to each other.

[0283] In one embodiment of the display device, a portion of the middle frame is in contact with the second extension.

[0284] In one embodiment of the display device, a portion of the middle frame is in contact with the first extension.

[0285] In one embodiment of the display device, a portion of the middle frame is in contact with the first body.

[0286] A third aspect of the present disclosure provides a buffer plate, comprising: a heat dissipation layer; a buffer layer disposed on one surface of the heat dissipation layer; and a conductive adhesive layer disposed on one surface of the heat dissipation layer, wherein the heat dissipation layer comprises a first extension extending outward from the buffer layer, and the conductive adhesive layer is disposed to overlap the first extension.

[0287] In one embodiment of the buffer plate, the buffer layer and the conductive adhesive layer are disposed on the same layer based on the heat dissipation layer.

[0288] In one embodiment of the buffer plate, the conductive adhesive layer comprises a second extension extending outward from the first extension.

[0289] In one embodiment of the buffer plate, the second extension extends in a length direction of the heat dissipation layer.

[0290] In one embodiment of the buffer plate, the buffer plate further comprises an adhesive layer disposed on an opposite surface of the buffer layer on which the heat dissipation layer is disposed.

[0291] Although the embodiments of the present disclosure have been described in more detail above with reference to the accompanying drawings, the present disclosure is not necessarily limited to these embodiments, and various modifications can be made without departing from the technical spirit of the present disclosure. The present disclosure. Therefore, the embodiments disclosed in the present disclosure are intended to illustrate the present disclosure, rather than limit the technical idea of the present disclosure, and the scope of the technical idea of the present disclosure is not limited to these embodiments. Therefore, it should be understood that the above-described embodiments are exemplary in all aspects, rather than limiting. The scope of protection of the present disclosure should be interpreted with reference to the claims, and any technical idea within the equivalent scope thereof should be understood as being included in the scope of the present disclosure.

Claims

1. A display apparatus comprising: a cover member; a display panel disposed below the cover member; and a buffer plate disposed below the display panel, wherein the buffer plate comprises a buffer layer and a heat dissipation layer, wherein the display panel comprises: a flexible display substrate comprising a bending portion in a non-display area; a pixel array disposed on the flexible display substrate; an encapsulation portion disposed to cover an upper surface and a side surface of the pixel array; a polarizing plate disposed on the encapsulation portion; a reinforcing member disposed on the bending portion; and a fixing member disposed on a portion of the polarizing plate and the reinforcing member, wherein the heat dissipation layer comprises: a first body vertically overlapping the buffer layer; and at least one first extension portion extending from the first body and outward from the buffer layer, wherein the first body and the first extension portion are not physically separated from each other and are integrally formed with each other, and wherein the first extension portion is disposed on one surface of the cover member so as not to vertically overlap the display panel, a conductive adhesive layer between the first extension portion and the cover member, wherein the conductive adhesive layer comprises: a second body disposed to vertically overlap the first extension portion; and a second extension portion extending from the second body and outward from the first extension portion so as not to vertically overlap the first extension portion, wherein the first extension portion of the heat dissipation layer and the second extension portion of the conductive adhesive layer are formed to be coplanar with each other. The first extension portion extends along at least one side surface of the first body.

2. The display device according to claim 1, wherein The first extension portion is electrically connected to the cover member.

3. The display device according to claim 1, wherein The second extension portion extends along an edge portion of the cover member.

4. The display device according to claim 1, wherein The second extension portion is disposed not to vertically overlap the buffer plate.

5. The display device according to claim 1, wherein The display apparatus further comprises a conductive light shielding layer disposed between the conductive adhesive layer and the cover member.

6. The display device of claim 1, wherein, 7.The display apparatus of claim 1, wherein the heat dissipation layer is a conductive layer having electrical conductivity. 8.The display apparatus of claim 1, wherein a portion of the reinforcing member and the polarizing plate are located on the same layer. 9.The display apparatus of claim 1, wherein one side of the polarizing plate and one side of a portion of the reinforcing member contact each other. 10.The display apparatus of claim 1, wherein the flexible display substrate comprises: a front portion extending from one side of the bending portion and configured to display an image; and a pad portion extending from the other side of the bending portion and bent below the front portion, wherein a connection member configured to fix the heat dissipation layer and the pad portion to each other is disposed between the heat dissipation layer and the pad portion. 11.The display apparatus of claim 10, wherein a back plate is further disposed between the connection member and the pad portion, and the connection member is configured to fix the heat dissipation layer and the back plate to each other. 12.The display apparatus of claim 10, wherein the connection member is a foam tape or a foam pad. 13.A display apparatus comprising: a cover member; a display panel disposed below the cover member; and ​ ​ a buffer plate disposed below the display panel, wherein the buffer plate includes a buffer layer and a heat dissipation layer, wherein the heat dissipation layer includes a first body and a first extension portion extending from the first body and outward from the buffer layer so as not to vertically overlap the buffer layer; a conductive adhesive layer disposed between the first extension portion and the cover member, wherein the conductive adhesive layer includes a second body and a second extension portion extending from the second body and outward from the first extension portion so as not to vertically overlap the first extension portion, and wherein the first body and the first extension portion are not physically separated from each other and are integrally formed with each other; and a middle frame disposed on one surface of the buffer plate and electrically connected to the conductive adhesive layer; wherein the first extension portion of the heat dissipation layer and the second extension portion of the conductive adhesive layer are formed to be coplanar with each other; and wherein the display panel includes: a flexible display substrate including a bending portion in a non-display area; a pixel array disposed on the flexible display substrate; an encapsulation portion disposed to cover an upper surface and a side surface of the pixel array; a polarizing plate disposed on the encapsulation portion; a reinforcing member disposed on the bending portion; and a fixing member disposed on a portion of the polarizing plate and the reinforcing member.

14. The display device of claim 13, wherein, the second extension portion is exposed outside the buffer plate.

15. The display device of claim 13, wherein, the first extension portion and the second extension portion extend in a perpendicular manner to each other.

16. The display device of claim 13, wherein, a portion of the middle frame is in contact with the second extension portion.

17. The display device of claim 13, wherein, a portion of the middle frame is in contact with the first extension portion.

18. The display device of claim 13, wherein, a portion of the middle frame is in contact with the first body. 19.The display apparatus of claim 13, wherein a portion of the middle frame is in contact with the first extension portion and the second extension portion at the same time. 20.The display apparatus of claim 13, wherein the middle frame has a step such that the middle frame is in contact with the first extension portion, the second extension portion, and the first body at the same time. 21.The display apparatus of claim 13, wherein a portion of the polarizing plate and the reinforcing member are on the same layer. 22.The display apparatus of claim 13, wherein one side of the polarizing plate and one side of a portion of the reinforcing member are in contact with each other. 23.The display apparatus of claim 13, wherein the flexible display substrate includes: a front portion extending from one side of the bending portion and configured to display an image; and a pad portion extending from the other side of the bending portion and bent below the front portion, wherein a connection member configured to fix the heat dissipation layer and the pad portion to each other is disposed between the heat dissipation layer and the pad portion. 24.The display apparatus of claim 23, wherein a back plate is further disposed between the connection member and the pad portion, and the connection member is configured to fix the heat dissipation layer and the back plate to each other. 25.The display apparatus of claim 23, wherein the connection member is a foam tape or a foam pad. 26.A buffer plate comprising: a heat dissipation layer; ​ a buffer layer disposed on one surface of the heat dissipation layer; and a conductive adhesive layer disposed on one surface of the heat dissipation layer; and a peel-off prevention layer disposed on the heat dissipation layer; wherein the heat dissipation layer includes a first body and a first extension extending from the first body and outward from the buffer layer, and the conductive adhesive layer is disposed to overlap the first extension, and wherein the first body and the first extension are not physically separated from each other and are integrally formed with each other, and wherein the conductive adhesive layer includes: a second body disposed to perpendicularly overlap the first extension; and a second extension extending from the second body and outward from the first extension so as not to perpendicularly overlap the first extension, and wherein the first extension of the heat dissipation layer and the second extension of the conductive adhesive layer are formed to be coplanar with each other.

27. The bumper plate of claim 26, wherein, The buffer layer and the conductive adhesive layer are disposed on the same layer based on the heat dissipation layer.

28. The bumper plate of claim 26, wherein, The second extension extends in a length direction of the heat dissipation layer.

29. The cushioning panel of claim 26, further comprising an adhesive layer disposed on the opposite surface of the buffer layer on which the heat dissipation layer is disposed.

30. The cushioning panel of claim 26, wherein the buffer layer is disposed on the peel-off prevention layer.

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