Low-contamination wafer transfer system and method
By using a transfer robot and calibration device in a silicon carbide epitaxial furnace to precisely calibrate the wafer and wafer tray, the problems of dust contamination and inaccurate positioning during wafer transport are solved, achieving efficient and low-pollution wafer transport.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Patents(China)
- Current Assignee / Owner
- 48TH RES INST OF CHINA ELECTRONICS TECH GROUP CORP
- Filing Date
- 2022-11-29
- Publication Date
- 2026-05-22
AI Technical Summary
Existing silicon carbide epitaxial furnaces are prone to dust contamination during wafer transport, and the positioning of the wafer carrier and wafer is inaccurate, leading to loading difficulties and unsuccessful transport.
The system employs a transfer robot in conjunction with a wafer calibration device and a wafer tray calibration mechanism. Through visual positioning and correction components, the center position and oblique orientation of the wafer and wafer tray are precisely calibrated to ensure that the assembly and disassembly process is completed within a clean chamber, reducing dust contamination. Automatic transfer is achieved through a wafer tray storage device.
It effectively reduces wafer contamination, ensures smooth wafer transfer, improves transfer efficiency and reliability, reduces interference from human factors, and is suitable for mass production.
Smart Images
Figure CN115939003B_ABST
Abstract
Description
Technical Field
[0001] This invention relates to the field of semiconductor fabrication technology, and more specifically to a low-pollution wafer transport system and transport method. Background Technology
[0002] Silicon carbide (SiC) epitaxial growth furnaces are specialized equipment that uses the principle of chemical vapor deposition and a step growth mode to obtain high-quality homogeneous epitaxial materials of a certain thickness and doping concentration on single-crystal substrates under high temperature and low pressure conditions. The technology involves multiple disciplines such as vacuum technology, heating technology, flow field technology, high temperature technology, automatic conveying technology, mechanics, electrical control, software, and materials physics. It is a large-scale equipment with high integration and complex technology.
[0003] like Figure 1 As shown, the silicon carbide epitaxial furnace wafer carrier 1 mainly comprises three parts: from bottom to top, a wafer base 11, a wafer ring 12, and a wafer 13. The wafer base 11 and the wafer ring 12 are referred to as wafer trays 14. After the wafer carrier 1 is processed, the wafer 13 that has been processed needs to be sent out and a new wafer 13 needs to be sent in. When replacing the new wafer 13, the wafer 13 that has been processed needs to be separated from the original wafer tray 14. Since the wafer base 11, the wafer ring 12, and the wafer 13 are all designed with beveled edges, the beveled edges are aligned and locked when the three are loaded. Therefore, when separating the wafer carrier 1, the wafer base 11 needs to be separated first and sent to another location for temporary storage before the wafer 13 can be ejected. When installing the wafer carrier 1, after the new wafer 13 is placed, the wafer base 11 is sent back. However, when the wafer carrier 1 reacts in the furnace, dust particles are generated on the wafer tray 14. The wafer carrier base 11 vibrates during separation, transportation and loading, which can easily shake the dust particles on the wafer tray 14 onto the wafer 13, causing contamination to the wafer 13. Secondly, the wafer carrier 1 rotates during the reaction in the epitaxial growth furnace. When exiting the cavity, the direction of the entire wafer carrier 1's inclined edge relative to the initial position is random. If the wafer 13 is directly separated from the wafer tray 14 and the wafer 13 is replaced, it is impossible to ensure that the center position and inclined edge orientation of the two are aligned, which will result in the wafer carrier not being able to complete the wafer loading and affect the transfer of the wafer 13. Summary of the Invention
[0004] The technical problem to be solved by the present invention is to overcome the shortcomings of the prior art and provide a low-contamination wafer transport system that reduces wafer contamination, can calibrate and position the wafer carrier and wafer, and ensures smooth loading.
[0005] The present invention also provides an ingenious transfer method for wafer and wafer disk calibration.
[0006] The present invention further provides a simple and highly reliable transmission method for calibrating wafers and wafer carrier disks.
[0007] To solve the above-mentioned technical problems, the present invention adopts the following technical solution:
[0008] A low-pollution wafer transport system includes a transfer robot, a wafer loading device for storing wafers with incomplete processes, a wafer unloading device for storing wafers with completed processes, a wafer calibration device for calibrating the center position and oblique edge orientation of the wafers, and a wafer loading / unloading device for loading and unloading wafers. The wafer loading device, wafer unloading device, wafer calibration device, and wafer loading / unloading device are all located outside the transfer robot, and the transfer robot is used to transfer materials. The wafer loading / unloading device includes a clean chamber, a lifting mechanism, a support base for carrying a wafer carrier, and a wafer carrier calibration mechanism for calibrating the center position and oblique edge orientation of the wafer carrier. The support base is located inside the clean chamber, and the lifting mechanism passes through the support base. The wafer carrier includes a base body and a cover plate. The base body has an opening, and the cover plate covers the opening. The oblique edge of the wafer carrier is located on the base body. A wafer delivery robot is located outside the wafer loading / unloading device.
[0009] As a further improvement to the above technical solution:
[0010] The wafer calibration device includes a first visual positioning component and a correction component. The first visual positioning component is used to visually position the wafer center and the orientation of the bevel. The correction component has degrees of freedom to move along the X-axis, move along the Y-axis, and rotate around the Z-axis to correct the wafer center and the orientation of the bevel.
[0011] The slide tray calibration mechanism includes a second vision positioning component and a rotation correction component. The second vision positioning component is used to visually position the center position and the orientation of the oblique edge of the slide tray. The second vision positioning component is connected to the transfer robot and sends the center position signal of the slide tray to the transfer robot. The rotation correction component is used to drive the carrier to rotate in order to correct the orientation of the oblique edge of the slide tray.
[0012] The slide plate calibration mechanism includes a second visual positioning component for visually locating the center position and the orientation of the oblique edge of the slide plate. The second visual positioning component is connected to the first visual positioning component and sends the center position and oblique edge orientation signals of the slide plate to the first visual positioning component. The first visual positioning component is connected to the correction component.
[0013] The clean chamber is equipped with a purging assembly.
[0014] The low-pollution wafer transport system also includes a wafer tray storage device for storing new wafer trays. The wafer tray storage device is located outside the transfer robot, and the transfer robot is used to transfer materials.
[0015] The low-pollution wafer transport system also includes a test wafer storage device for storing test wafers. The test wafer storage device is located outside the transfer robot, and the transfer robot is used to transfer the materials.
[0016] A transmission method for the aforementioned low-pollution wafer transmission system includes the following steps:
[0017] S1. The transfer robot places the wafer carrier base that has completed the process into the carrier seat of the disassembly and assembly device. The lifting mechanism rises, which drives the cover plate and the wafer that has completed the process to rise and separate. The transfer robot picks up the wafer on the cover plate and transfers it to the wafer unloading device.
[0018] S2. The slide plate calibration mechanism in the disassembly and assembly device locates the center position and the orientation of the inclined edge of the slide plate through the second vision positioning component, and drives the carrier to rotate through the rotation correction component to correct the orientation of the inclined edge of the slide plate to the preset orientation.
[0019] S3. The transfer robot takes a new wafer from the wafer loading device and transfers it to the wafer calibration device. The first vision positioning component locates the center position and the orientation of the oblique edge of the new wafer. The correction component corrects the center position and the orientation of the oblique edge of the new wafer to the preset position. The preset orientation of the oblique edge of the new wafer is consistent with the preset orientation of the oblique edge of the wafer carrier in S2.
[0020] S4. The second vision positioning component sends the center position information of the wafer tray to the transfer robot. The transfer robot picks up the calibrated new wafer and moves the new wafer in the X and Y axis directions according to the received center position signal to dynamically correct the center position of the new wafer to match the center position of the wafer tray. Then, the wafer is placed on the cover plate of the lifting mechanism. The lifting mechanism descends, driving the cover plate and the wafer to descend, forming the wafer carrier base.
[0021] S5. The wafer delivery robot will deliver the wafer carrier base carrying the new wafer.
[0022] A transmission method for the aforementioned low-pollution wafer transmission system includes the following steps:
[0023] Y1. The transfer robot places the wafer carrier base that has completed the process into the carrier seat of the disassembly and assembly device. The lifting mechanism rises, which drives the cover plate and the wafer that has completed the process to rise and separate. The transfer robot picks up the wafer on the cover plate and transfers it to the wafer unloading device.
[0024] Y2. The transfer robot takes a new wafer from the wafer loading device and transfers it to the wafer calibration device. The second vision positioning component positions the center position and the orientation of the oblique edge of the wafer carrier, and sends the position information to the first vision positioning component. The correction component corrects the center position and oblique edge orientation of the new wafer based on the position information received by the first vision positioning component, so that the center position and oblique edge orientation of the wafer are consistent with the wafer carrier.
[0025] Y3. The transfer robot picks up the calibrated new wafer and transfers it to the cover plate of the lifting mechanism. The lifting mechanism descends, causing the cover plate and wafer to descend and form a composite wafer carrier.
[0026] Y4. The wafer delivery robot will deliver the wafer carrier base containing the new wafer.
[0027] As a further improvement to the above technical solution:
[0028] If a fault occurs during transmission, the faulty component is repaired, and a test wafer is retrieved from the test wafer storage device for verification after the repair is completed.
[0029] Compared with the prior art, the beneficial effects of the present invention are as follows:
[0030] The low-pollution wafer transfer system disclosed in this invention involves a transfer robot that delivers the completed wafer carrier to the cleanroom of the disassembly and assembly device and places it on a support. The lifting mechanism rises, lifting the cover plate and the completed wafer to complete the disassembly. For loading, simply place the new wafer on the cover plate, and the lifting mechanism descends to complete the loading. By designing the wafer carrier as a separate unit with an inclined edge on the base body, the cover plate will not jam the wafer during wafer handling. There is no need to temporarily store the wafer carrier in another location; wafers can be picked up and placed on the cover plate directly. The entire disassembly and assembly process is completed within the cleanroom, reducing vibration when separating the wafer carrier and the wafer carrier ring, reducing the amount of particulate dust shaken onto the wafer, and thus reducing wafer contamination. The wafer calibration device calibrates and positions the center and bevel of the new wafer, while the wafer tray calibration mechanism calibrates and positions the center and bevel of the wafer tray. This ensures that the new wafer can be smoothly loaded onto the wafer tray, avoiding interference with wafer transfer. Furthermore, the wafer tray positioning is also completed within a cleanroom, further reducing wafer contamination while ensuring smooth loading. In addition, robotic arms are used to transfer materials between the various devices, achieving automated wafer transfer with high efficiency, minimal human interference, and benefits for mass production.
[0031] The present invention discloses a low-pollution wafer transfer system and a transfer method that corrects the bevel orientation of the new wafer and the wafer carrier disk by means of a correction component and a rotation correction component, respectively, to ensure that the bevel orientations of the two are consistent. At the same time, the transfer robot dynamically corrects the center position of the new wafer according to the center position of the wafer carrier disk to ensure that the center positions of the two are consistent. The calibration method is ingenious and ensures smooth loading and transfer.
[0032] Another transmission method of the low-pollution wafer transfer system disclosed in this invention involves a second vision positioning component sending the center position and oblique edge orientation information of the wafer carrier disk to a first vision positioning component. The correction component uses the position information received by the first vision positioning component to correct the center position and oblique edge orientation of the new wafer, so that the center position and oblique edge orientation of the new wafer are consistent with the wafer carrier disk. The calibration method is simple, highly reliable, and ensures smooth loading and transmission. Attached Figure Description
[0033] Figure 1 This is a schematic diagram of the structure of a substrate in the prior art (a is an overall view, b is a separate view).
[0034] Figure 2 This is a schematic diagram of the low-pollution wafer transport system of the present invention.
[0035] Figure 3 This is a schematic diagram of the structure of the substrate in this invention (a is an overall view, b is a separate view).
[0036] Figure 4 This is a three-dimensional structural diagram of the disassembly and assembly device in this invention.
[0037] The labels in the diagram represent: 1. Wafer carrier base; 11. Wafer carrier base; 111. Base body; 112. Cover plate; 113. Opening; 12. Wafer carrier ring; 13. Wafer; 14. Wafer carrier tray; 2. Transfer robot; 3. Wafer loading device; 4. Wafer unloading device; 5. Wafer calibration device; 6. Assembly / disassembly device; 61. Clean chamber; 62. Lifting mechanism; 63. Support seat; 64. Wafer carrier tray calibration mechanism; 65. Rotation correction assembly; 7. Wafer delivery robot; 8. Wafer carrier tray storage device; 9. Test wafer storage device. Detailed Implementation
[0038] The present invention will be further described in detail below with reference to the accompanying drawings and specific embodiments.
[0039] As shown in this disclosure and claims, unless the context clearly indicates otherwise, words such as "comprising" or "including" mean that the element or object preceding the word covers the element or object listed after the word and its equivalents, without excluding other elements or objects. Words such as "connected" or "linked" are not limited to physical or mechanical connections, but can include electrical connections, whether direct or indirect.
[0040] Example 1
[0041] Figures 2 to 4An embodiment of the present invention is shown. This embodiment's low-pollution wafer transport system includes a transfer robot 2, a wafer loading device 3 for storing wafers 13 with incomplete processes, a wafer unloading device 4 for storing wafers 13 with completed processes, a wafer calibration device 5 for calibrating the center position and oblique edge orientation of the wafers 13, and a wafer removal / removal device 6 for removing and removing the wafers 13. The wafer loading device 3, wafer unloading device 4, wafer calibration device 5, and wafer removal / removal device 6 are all located outside the transfer robot 2, and the transfer robot 2 enables the transfer and removal of materials. The device 6 includes a clean chamber 61, a lifting mechanism 62, a support 63 for supporting the slide base 1, and a slide plate calibration mechanism 64 for calibrating the center position and the orientation of the inclined side of the slide plate 14. The support 63 is located inside the clean chamber 61, and the lifting mechanism 62 passes through the support 63. The slide base 11 includes a base body 111 and a cover plate 112. The base body 111 has an opening 113, and the cover plate 112 covers the opening 113. The inclined side of the slide base 11 is located on the base body 111. A slide feeding robot 7 is provided on the outside of the disassembly and assembly device 6.
[0042] In this low-pollution wafer transfer system, the transfer robot 2 delivers the completed wafer carrier base 1 to the clean chamber 61 of the disassembly and assembly device 6 and places it on the support seat 63. The lifting mechanism 62 rises, driving the cover plate 112 and the completed wafer 13 to rise to complete the disassembly. During loading, simply place the new wafer 13 on the cover plate 112 and the lifting mechanism 62 descends to complete the loading. By designing the wafer carrier base 11 as a split type with the inclined edge set on the base body 111, the cover plate 112 will not jam the wafer 13 when picking up and placing the wafer 13. There is no need to send the wafer carrier base 11 to another location for temporary storage. The wafer 13 can be picked up and placed on the cover plate 112 without first sending it to another location for temporary storage. The disassembly and assembly process is completed within the clean chamber 61, reducing vibration when separating the wafer carrier base 11 and the wafer carrier ring 12, reducing the shaking of particulate dust onto the wafer 13, and thus reducing contamination of the wafer 13. The wafer calibration device 5 calibrates and positions the center and bevel of the new wafer 13, while the wafer tray calibration mechanism 64 calibrates and positions the center and bevel of the wafer tray 14. This ensures that the new wafer 13 can be smoothly loaded onto the wafer tray 14, avoiding any impact on the transfer of the wafer 13. Furthermore, the positioning of the wafer tray 14 is also completed within the cleanroom 61, further reducing contamination of the wafer 13 while ensuring smooth loading. In addition, transfer robots 2 are used between all devices for material transfer, achieving automated wafer transfer with high efficiency, minimal human interference, and facilitating mass production.
[0043] In this embodiment, the wafer calibration device 5 includes a first visual positioning component and a correction component. The first visual positioning component is used to visually position the center position and the orientation of the bevel of the wafer 13. The correction component has degrees of freedom to move along the X-axis, move along the Y-axis, and rotate around the Z-axis to correct the center position and the orientation of the bevel of the wafer 13. The first visual positioning component and the correction component are not shown in the figures.
[0044] In this embodiment, the wafer tray calibration mechanism 64 includes a second visual positioning component 66 and a rotation correction component 65. The second visual positioning component 66 is used to visually position the center position and the orientation of the oblique edge of the wafer tray 14. The second visual positioning component 66 is connected to the transfer robot 2 and sends the center position signal of the wafer tray 14 to the transfer robot 2. The transfer robot 2 drives the wafer 13 to move in the X-axis and Y-axis directions according to the received position signal to correct the center position of the wafer 13 to be consistent with the wafer tray 14. The rotation correction component 65 is used to drive the carrier 63 to rotate to correct the orientation of the oblique edge of the wafer tray 14.
[0045] In this embodiment, a blowing assembly is provided in the clean chamber 61. The blowing assembly (not shown in the figure) is used to blow away dust particles on the wafer tray 14 to reduce the vibration of dust particles onto the wafer 13 and prevent contamination of the wafer 13.
[0046] In this embodiment, the low-pollution wafer transport system also includes a wafer tray storage device 8 for storing new wafer trays 14. The wafer tray storage device 8 is located outside the transfer robot 2, and the transfer robot 2 is used to transfer materials. When a wafer tray 14 is damaged, the transfer robot 2 can directly take a new wafer tray 14 from the wafer tray storage device 8 without manual replacement, resulting in higher production efficiency.
[0047] In this embodiment, the low-pollution wafer transport system also includes a test wafer storage device 9 for storing test wafers. The test wafer storage device 9 is located outside the transfer robot 2, and the transfer robot 2 is used to transfer materials. If a fault occurs during transport, the faulty component needs to be maintained. After maintenance, a wafer 13 is needed to verify whether the transport system is working properly. However, using a new wafer 13 for verification is costly. Using a test wafer instead achieves the verification effect while saving costs.
[0048] The transmission method of this low-pollution wafer transport system includes the following steps:
[0049] S1. The transfer robot 2 places the completed wafer substrate 1 into the bearing seat 63 of the disassembly and assembly device 6. The lifting mechanism 62 rises, driving the cover plate 112 and the completed wafer 13 to rise and separate. The transfer robot 2 takes the wafer 13 on the cover plate 112 and transfers it to the wafer unloading device 4.
[0050] S2. The slide plate calibration mechanism 64 in the disassembly and assembly device 6 positions the center position and the orientation of the inclined edge of the slide plate 14 through the second vision positioning component 66, and drives the support seat 63 to rotate through the rotation correction component 65 to correct the orientation of the inclined edge of the slide plate 14 to the preset orientation.
[0051] S3. The transfer robot 2 takes a new wafer 13 from the wafer loading device 3 and transfers it to the wafer calibration device 5. The first vision positioning component positions the center position and the orientation of the oblique edge of the new wafer 13. The correction component corrects the center position and the orientation of the oblique edge of the new wafer 13 to a preset position. The preset orientation of the oblique edge of the new wafer 13 is consistent with the preset orientation of the oblique edge of the wafer carrier 14 in S2.
[0052] S4. The second vision positioning component 66 sends the center position information of the wafer tray 14 to the transfer robot 2. The transfer robot 2 picks up the calibrated new wafer 13 and moves the new wafer 13 in the X and Y axis directions according to the received center position signal to dynamically correct the center position of the new wafer 13 to be consistent with the center position of the wafer tray 14. Then, the wafer 13 is placed on the cover plate 112 of the lifting mechanism 62. The lifting mechanism 62 descends, driving the cover plate 112 and the wafer 13 to descend, forming the wafer carrier base 1.
[0053] S5, the wafer delivery robot 7 delivers the wafer carrier 1 carrying the new wafer 13.
[0054] This transfer method uses a correction component and a rotation correction component 65 to correct the bevel orientation of the new wafer 13 and the wafer carrier 14 respectively, so as to ensure that the bevel orientations of the two are consistent. At the same time, the transfer robot 2 dynamically corrects the center position of the new wafer 13 according to the center position of the wafer carrier 14, so as to ensure that the center positions of the two are consistent. The calibration method is ingenious and ensures smooth loading and transfer.
[0055] In this embodiment, if a fault occurs during transmission, the faulty component is maintained, and after maintenance, a test wafer is retrieved from the test wafer storage device 9 for verification, thus saving costs.
[0056] Example 2
[0057] Figures 2 to 4 Another embodiment of the present invention is shown. The low-pollution wafer transport system of this embodiment is generally the same as that of the first embodiment, except that: in this embodiment, the wafer tray calibration mechanism 64 includes a second visual positioning component 66 for visually positioning the center position and the orientation of the oblique edge of the wafer tray 14. The second visual positioning component 66 is connected to the first visual positioning component and sends the center position and oblique edge orientation signals of the wafer tray 14 to the first visual positioning component. The correction component then corrects the center position and oblique edge orientation of the wafer 13 to be consistent with the wafer tray 14 according to the signals received by the first visual positioning component.
[0058] The transmission method of this low-pollution wafer transport system includes the following steps:
[0059] Y1. The transfer robot 2 places the completed wafer substrate 1 into the bearing seat 63 of the disassembly and assembly device 6. The lifting mechanism 62 rises, driving the cover plate 112 and the completed wafer 13 to rise and separate. The transfer robot 2 takes the wafer 13 on the cover plate 112 and transfers it to the wafer unloading device 4.
[0060] Y2. The transfer robot 2 takes a new wafer 13 from the wafer loading device 3 and transfers it to the wafer calibration device 5. The second vision positioning component 66 positions the center position and the orientation of the oblique edge of the wafer carrier 14 and sends the position information to the first vision positioning component. The correction component corrects the center position and the orientation of the oblique edge of the new wafer 13 based on the position information received by the first vision positioning component, so that the center position and the orientation of the oblique edge of the wafer 13 are consistent with the wafer carrier 14.
[0061] Y3. The transfer robot 2 picks up the calibrated new wafer 13 and transfers it to the cover plate 112 of the lifting mechanism 62. The lifting mechanism 62 descends, driving the cover plate 112 and the wafer 13 to descend, forming the wafer carrier 1.
[0062] Y4, the wafer delivery robot 7 delivers the wafer carrier 1 carrying the new wafer 13.
[0063] In this low-pollution wafer transfer system, the second visual positioning component 66 sends the center position and oblique edge orientation information of the wafer carrier 14 to the first visual positioning component. The correction component uses the position information received by the first visual positioning component to correct the center position and oblique edge orientation of the new wafer 13, making the center position and oblique edge orientation of the new wafer 13 consistent with the wafer carrier 14. Compared with Embodiment 1, in this embodiment, the first visual positioning component and the second visual positioning component 66 are connected. Therefore, the correction component can directly correct the center position and oblique edge orientation of the new wafer 13 according to the center position and oblique edge orientation of the wafer carrier 14. This allows the transfer robot 2 to directly transfer the new wafer 13 onto the wafer carrier 14 to complete the alignment. There is no need to set up a rotation correction component 65 to correct the oblique edge orientation of the wafer carrier 14, nor is there a need for the transfer robot 2 to dynamically correct the center position of the new wafer 13. The calibration method is simple, reliable, and can ensure smooth loading and transfer.
[0064] While the present invention has been disclosed above with reference to preferred embodiments, it is not intended to limit the invention. Any person skilled in the art can make many possible variations and modifications to the technical solutions of the present invention, or modify them into equivalent embodiments, without departing from the scope of the present invention. Therefore, any simple modifications, equivalent changes, and modifications made to the above embodiments based on the technical essence of the present invention, without departing from the scope of the present invention, should fall within the protection scope of the present invention.
Claims
1. A low-pollution wafer transport system, characterized in that: The system includes a transfer robot (2), a wafer loading device (3) for storing wafers (13) with incomplete processes, a wafer unloading device (4) for storing wafers (13) with completed processes, a wafer calibration device (5) for calibrating the center position and oblique direction of the wafers (13), and a disassembly and assembly device (6) for disassembling and assembling the wafers (13). The wafer loading device (3), wafer unloading device (4), wafer calibration device (5), and disassembly and assembly device (6) are all located outside the transfer robot (2) and the transfer robot (2) is used to transfer materials. The disassembly and assembly device (6) includes a cleanroom (61) and an elevator. The structure includes a support (62), a support (63) for supporting the slide base (1), and a slide plate calibration mechanism (64) for calibrating the center position and the orientation of the inclined side of the slide plate (14). The support (63) is located inside the clean chamber (61), and the lifting mechanism (62) passes through the support (63). The slide base (11) includes a base body (111) and a cover plate (112). The base body (111) has an opening (113), and the cover plate (112) covers the opening (113). The inclined side of the slide base (11) is located on the base body (111). The disassembly and assembly device (6) is located on the outside. The wafer feeding robot (7) is included. The wafer calibration device (5) includes a first vision positioning component and a correction component. The first vision positioning component is used to visually position the center position and the orientation of the bevel of the wafer (13). The correction component has degrees of freedom to move along the X-axis, move along the Y-axis, and rotate around the Z-axis to correct the center position and the orientation of the bevel of the wafer (13). The wafer tray calibration mechanism (64) includes a second vision positioning component (66) and a rotation correction component (65). The second vision positioning component (66) is used to visually position the center position and the orientation of the bevel of the wafer tray (14). 6) Connect to the transfer robot (2) and send the center position signal of the slide tray (14) to the transfer robot (2). The rotation correction component (65) is used to drive the carrier (63) to rotate in order to correct the orientation of the oblique side of the slide tray (14); or the slide tray calibration mechanism (64) includes a second visual positioning component (66) for visually positioning the center position and oblique side orientation of the slide tray (14). The second visual positioning component (66) is connected to the first visual positioning component and sends the center position and oblique side orientation signal of the slide tray (14) to the first visual positioning component. The first visual positioning component is connected to the correction component.
2. The low-pollution wafer transport system according to claim 1, characterized in that: The clean chamber (61) is equipped with a purging assembly.
3. The low-pollution wafer transport system according to claim 1, characterized in that: It also includes a tray storage device (8) for storing new trays (14), the tray storage device (8) being located outside the transfer robot (2), and the transfer of materials is achieved by the transfer robot (2).
4. The low-pollution wafer transport system according to claim 1, characterized in that: It also includes a test wafer storage device (9) for storing test wafers, the test wafer storage device (9) being located outside the transfer robot (2), and the transfer of materials is achieved through the transfer robot (2).
5. A transmission method for a low-pollution wafer transmission system according to any one of claims 1 to 4, characterized in that: Includes the following steps: S1. The transfer robot (2) places the completed wafer substrate (1) onto the carrier (63) of the disassembly and assembly device (6). The lifting mechanism (62) rises, causing the cover plate (112) and the completed wafer (13) to rise and separate. The transfer robot (2) takes the wafer (13) from the cover plate (112) and transfers it to the wafer unloading device (4). S2. The slide plate calibration mechanism (64) in the disassembly and assembly device (6) positions the center position and the orientation of the inclined side of the slide plate (14) through the second vision positioning component (66), and drives the carrier (63) to rotate through the rotation correction component (65) to correct the orientation of the inclined side of the slide plate (14) to the preset orientation. S3. The transfer robot (2) takes a new wafer (13) from the wafer loading device (3) and transfers it to the wafer calibration device (5). The first vision positioning component positions the center position and the oblique direction of the new wafer (13). The correction component corrects the center position and oblique direction of the new wafer (13) to the preset position. The preset direction of the oblique side of the new wafer (13) is consistent with the preset direction of the oblique side of the wafer carrier (14) in S2. S4. The second vision positioning component (66) sends the center position information of the wafer tray (14) to the transfer robot (2). The transfer robot (2) takes the new wafer (13) that has been calibrated and moves the new wafer (13) in the X-axis and Y-axis directions according to the received center position signal to dynamically correct the center position of the new wafer (13) to be consistent with the center position of the wafer tray (14). Then, the wafer (13) is placed on the cover plate (112) of the lifting mechanism (62). The lifting mechanism (62) descends, driving the cover plate (112) and the wafer (13) to descend, forming the wafer carrier base (1). S5. The wafer delivery robot (7) delivers the wafer carrier (1) carrying the new wafer (13).
6. A transmission method for a low-pollution wafer transmission system according to any one of claims 1 to 4, characterized in that: Includes the following steps: Y1. The transfer robot (2) places the completed wafer substrate (1) onto the carrier (63) of the disassembly and assembly device (6). The lifting mechanism (62) rises, causing the cover plate (112) and the completed wafer (13) to rise and separate. The transfer robot (2) takes the wafer (13) from the cover plate (112) and transfers it to the wafer unloading device (4). Y2. The transfer robot (2) takes a new wafer (13) from the wafer loading device (3) and transfers it to the wafer calibration device (5). The second vision positioning component (66) positions the center position and the oblique direction of the wafer carrier (14) and sends the position information to the first vision positioning component. The correction component corrects the center position and oblique direction of the new wafer (13) through the position information received by the first vision positioning component, so that the center position and oblique direction of the wafer (13) are consistent with the wafer carrier (14). Y3. The transfer robot (2) takes the calibrated new wafer (13) and transfers it to the cover plate (112) of the lifting mechanism (62). The lifting mechanism (62) descends, driving the cover plate (112) and the wafer (13) to descend, forming the substrate (1). Y4. The wafer delivery robot (7) delivers the wafer carrier (1) carrying the new wafer (13).
7. The transmission method of the low-pollution wafer transmission system according to claim 6, characterized in that: If a fault occurs during transmission, the faulty component is maintained, and after maintenance, a test wafer is retrieved from the test wafer storage device (9) for verification.