Display device and method of manufacturing the same

Abstract

A display device and a manufacturing method thereof, the display device includes a circuit substrate, a first light emitting diode, an anisotropic conductive adhesive structure, and a conductive connecting member. The first light emitting diode is located on the circuit substrate. The anisotropic conductive adhesive structure is located between the circuit substrate and the first light emitting diode, and electrically connects the circuit substrate to a lower electrode of the first light emitting diode. The conductive connecting member electrically connects an upper electrode of the first light emitting diode to the circuit substrate. Part of the conductive connecting member is located on the anisotropic conductive adhesive structure.

Description

Technical Field

[0001] This invention relates to a display device and a method for manufacturing the same. Background Technology

[0002] Light-emitting diodes (LEDs) are electroluminescent semiconductor devices with advantages such as high efficiency, long lifespan, durability, fast response, and high reliability. Generally, the key technology in manufacturing micro-LED displays lies in transferring a large number of micro-LEDs onto a pixel array substrate. Micro-LEDs are typically electrically connected to the pixel array substrate using solder. However, solder-fixed micro-LEDs are prone to detachment during subsequent processes (such as conductive connection processes) due to heat or impact, rendering them unusable. Summary of the Invention

[0003] The present invention provides a display device and a method for manufacturing the same, which can reduce the probability of light-emitting diodes falling off and reduce the manufacturing difficulty of conductive connectors.

[0004] At least one embodiment of the present invention provides a display device. The display device includes a circuit board, a first light-emitting diode (LED), an anisotropic conductive adhesive structure, and conductive connectors. The first LED is located on the circuit board. The anisotropic conductive adhesive structure is located between the circuit board and the first LED, and electrically connects the circuit board to the lower electrode of the first LED. With the top surface of the circuit board as a reference, the top surface of the anisotropic conductive adhesive structure is higher than or equal to the top surface of the light-emitting layer of the first LED, and the top surface of the anisotropic conductive adhesive structure is lower than the upper electrode of the first LED. The conductive connectors electrically connect the upper electrode of the first LED to the circuit board. A portion of the conductive connectors is located on the anisotropic conductive adhesive structure.

[0005] At least one embodiment of the present invention provides a method for manufacturing a display device, comprising the following steps: Placing an anisotropic conductive adhesive structure on a circuit board. Depositing a first light-emitting diode (LED) on the circuit board, wherein the anisotropic conductive adhesive structure is located between the circuit board and the first LED. Applying pressure to the first LED, causing the first LED to be embedded in the anisotropic conductive adhesive structure, wherein, with the top surface of the circuit board as a reference, the top surface of the anisotropic conductive adhesive structure is higher than or equal to the top surface of the light-emitting layer of the first LED, and the top surface of the anisotropic conductive adhesive structure is lower than the upper electrode of the first LED, wherein the anisotropic conductive adhesive structure is electrically connected from the circuit board to the lower electrode of the first LED. Forming a conductive connector on the upper electrode of the first LED, the anisotropic conductive adhesive structure, and the circuit board, wherein the conductive connector is electrically connected from the upper electrode of the first LED to the circuit board. Attached Figure Description

[0006] Figures 1A to 1GThis is a cross-sectional schematic diagram of a method for manufacturing a display device according to an embodiment of the present invention.

[0007] Figures 2A to 2G This is a cross-sectional schematic diagram of a method for manufacturing a display device according to an embodiment of the present invention.

[0008] Figure 3 This is a cross-sectional schematic diagram of a method for manufacturing a display device according to an embodiment of the present invention.

[0009] Figure 4 This is a cross-sectional schematic diagram of a method for manufacturing a display device according to an embodiment of the present invention.

[0010] Figure 5 This is a cross-sectional schematic diagram of an anisotropic conductive adhesive structure before being subjected to pressure, according to an embodiment of the present invention.

[0011] Figure 6 This is a cross-sectional schematic diagram of an anisotropic conductive adhesive structure before being subjected to pressure, according to an embodiment of the present invention.

[0012] Explanation of reference numerals in the attached figures:

[0013] 10,20: Display device

[0014] 100: Circuit board

[0015] 100t, 212t, 300t, 330t, 600t: Top surface

[0016] 102: First bonding pad

[0017] 104: Second pad

[0018] 210: Anisotropic conductive adhesive material layer

[0019] 212, 212a, 212b: Anisotropic conductive adhesive structure

[0020] 212s: Sidewall

[0021] 300: First light-emitting diode

[0022] 310: Lower electrode

[0023] 320: First semiconductor layer

[0024] 330: Emissive layer

[0025] 340: Second semiconductor layer

[0026] 350: Upper electrode

[0027] 400: Transfer substrate

[0028] 410: Adhesive layer

[0029] 500: Pressure component

[0030] 510: Buffer layer

[0031] 600: Second LED

[0032] 610: First electrode

[0033] 650: Second electrode

[0034] 710: Solder layer

[0035] 800: Conductive connector

[0036] CC: Conductive core

[0037] CP: Conductive particles

[0038] H, F: Direction

[0039] I: Insulating layer

[0040] LS: Laser

[0041] M: Base material

[0042] T1, T2: Thickness

[0043] W1, W2: Width Detailed Implementation

[0044] Figures 1A to 1G This is a cross-sectional schematic diagram of a method for manufacturing a display device according to an embodiment of the present invention. Please refer to... Figures 1A to 1C Multiple anisotropic conductive adhesive structures 212, separated from each other, are placed on the circuit board 100. For example, the anisotropic conductive adhesive material layer 210 is first attached to the entire surface of the carrier board 200, such as... Figure 1A As shown. Please refer to the following. Figure 1B The carrier board 200 and the anisotropic conductive adhesive material layer 210 are moved above the circuit board 100, and a portion of the anisotropic conductive adhesive material layer 210 is irradiated using a laser LS. After irradiation by the laser LS, a portion of the anisotropic conductive adhesive material layer 210 is transferred onto the circuit board 100 to form an anisotropic conductive adhesive structure 212, such as... Figures 1B to 1C As shown. In this embodiment, the size and shape of the anisotropic conductive adhesive structure 212 to be transferred to the circuit board 100 are controlled by laser LS, and after the anisotropic conductive adhesive structure 212 is transferred to the circuit board 100, a portion of the anisotropic conductive adhesive material layer 210 remains on the carrier plate 200.

[0045] In some embodiments, the anisotropic conductive adhesive structure 212 is transparent. In other embodiments, carbon black material may be added to the anisotropic conductive adhesive structure 212 to make it, for example, gray or black. When carbon black material is added to the anisotropic conductive adhesive structure 212, the anisotropic conductive adhesive structure 212 can be used as an anti-reflective layer to reduce the reflectivity of the display area of ​​the display device.

[0046] In this embodiment, the surface of the circuit board 100 includes a plurality of first pads 102 and a plurality of second pads 104. The interior of the circuit board 100 also includes other circuit structures (not shown), and the layout of these circuit structures can be adjusted as needed. In this embodiment, each first pad 102 is provided with a corresponding anisotropic conductive adhesive structure 212.

[0047] Please refer to the following: Figure 1D Multiple first light-emitting diodes 300 are disposed on the circuit board 100, wherein the anisotropic conductive adhesive structure 212 is located between the circuit board 100 and the first light-emitting diodes 300.

[0048] For example, a plurality of first light-emitting diodes 300 are first formed on a growth substrate (not shown). In this embodiment, the first light-emitting diodes 300 are vertical light-emitting diodes, and each first light-emitting diode 300 includes a lower electrode 310, a first semiconductor layer 320, a light-emitting layer 330, a second semiconductor layer 340, and an upper electrode 350 stacked in sequence, wherein one of the first semiconductor layer 320 and the second semiconductor layer 340 is an N-type semiconductor, and the other is a P-type semiconductor.

[0049] Next, the first light-emitting diode 300 on the growth substrate is transferred to the transfer substrate 400. The first light-emitting diode 300 is, for example, attached to the adhesive layer 410 of the transfer substrate 400.

[0050] Next, the first light-emitting diode 300 is transferred to the circuit board 100 using the transfer substrate 400, and the anisotropic conductive adhesive structure 212 is used to bond the first light-emitting diode 300. The adhesion between the first light-emitting diode 300 and the anisotropic conductive adhesive structure 212 is greater than the adhesion between the first light-emitting diode 300 and the adhesive layer 410. Therefore, after the transfer substrate 400 is removed, the first light-emitting diode 300 will remain on the anisotropic conductive adhesive structure 212, wherein each anisotropic conductive adhesive structure 212 is located between the circuit board 100 and the corresponding first light-emitting diode 300.

[0051] Please refer to the following: Figures 1E to 1FPressure is applied to the first light-emitting diode 300, causing it to be embedded in the anisotropic conductive adhesive structure 212. For example, pressure is applied to multiple first light-emitting diodes 300 simultaneously using a pressure-applying member 500. In some embodiments, the surface of the pressure-applying member 500 includes a buffer layer 510, and the buffer layer 510 simultaneously contacts multiple first light-emitting diodes 300.

[0052] After applying voltage to the first light-emitting diode 300, with the top surface 100t of the circuit substrate 100 as a reference, the top surface 212t of the anisotropic conductive adhesive structure 212 is higher than or equal to the top surface 330t of the light-emitting layer 330 of the first light-emitting diode 300, and the top surface 212t of the anisotropic conductive adhesive structure 212 is lower than the upper electrode 350 of the first light-emitting diode 300. Therefore, the anisotropic conductive adhesive structure 212 covers the sidewalls of the lower electrode 310, the sidewalls of the first semiconductor layer 320, and the sidewalls of the light-emitting layer 330. Based on the foregoing, short circuits between the subsequently formed conductive connectors and the lower electrode 310 or the first semiconductor layer 320 can be avoided.

[0053] In some embodiments, the thickness T1 and width W1 of the anisotropic conductive adhesive structure 212 before pressure are adjusted (see reference). Figure 1E This allows the anisotropic conductive adhesive structure 212 to cover the lower electrode 310, the first semiconductor layer 320, and the light-emitting layer 330 after being subjected to pressure. For example, in some embodiments, the thickness T1 of the anisotropic conductive adhesive structure 212 before being subjected to pressure is greater than the thickness T2 of the lower electrode 310 of the first light-emitting diode 300. In some embodiments, the width W1 of the anisotropic conductive adhesive structure 212 is greater than the width W2 of the first light-emitting diode 300.

[0054] After pressure is applied to the first light-emitting diode 300, the anisotropic conductive adhesive structure 212 electrically connects the first pad 102 of the circuit board 100 to the lower electrode 310 of the first light-emitting diode 300. In this embodiment, the anisotropic conductive adhesive structure 212 can conduct electricity in the direction of pressure F after being pressed, such as... Figure 1F The direction F is perpendicular to the top surface 100t of the circuit board 100.

[0055] In this embodiment, using anisotropic conductive adhesive structure 212 to bond the first light-emitting diode 300 to the circuit board 100 can reduce the probability of the first light-emitting diode 300 falling off.

[0056] In some embodiments, while applying pressure to the first light-emitting diode 300, the anisotropic conductive adhesive structure 212 is heated to cure the anisotropic conductive adhesive structure 212. In some embodiments, the anisotropic conductive adhesive structure 212 is heated to 100 degrees Celsius to 180 degrees Celsius to cure the anisotropic conductive adhesive structure 212.

[0057] Finally, please refer to... Figure 1G Multiple conductive connectors 800 are formed on the upper electrode 350 of the first light-emitting diode 300, the anisotropic conductive adhesive structure 212, and the second pad 104 of the circuit board 100. Some of the conductive connectors 800 are located on the anisotropic conductive adhesive structure 212. The conductive connectors 800 are electrically connected from the upper electrode 350 of the first light-emitting diode 300 to the second pad 104 of the circuit board 100. The conductive connectors 800 contact the upper electrode 350, the second semiconductor layer 340, the conductive connector 800, and the second pad 104, and a portion of the anisotropic conductive adhesive structure 212 is sandwiched between the conductive connector 800 and the light-emitting layer 330, between the conductive connector 800 and the first semiconductor layer 320, between the conductive connector 800 and the lower electrode 310, and between the conductive connector 800 and the first pad 102. In some embodiments, the conductive connector 800 includes a metal, a metal oxide (e.g., indium tin oxide), a metal nitride, or other suitable material. In this embodiment, since the anisotropic conductive adhesive structure 212 does not conduct electricity in the horizontal direction H, even if the conductive connector 800 contacts the sidewall 212s of the anisotropic conductive adhesive structure 212, the conductive connector 800 will not short-circuit with the first semiconductor layer 320 or the first pad 102.

[0058] In this embodiment, the anisotropic conductive adhesive structure 212 can be used as a step, making it less likely for the conductive connector 800 to break due to excessive step difference between the upper electrode 350 and the second pad 104, thereby reducing the manufacturing difficulty of the conductive connector 800.

[0059] In this embodiment, the display device 10 includes a circuit board 100, a first light-emitting diode 300, an anisotropic conductive adhesive structure 212, and a conductive connector 800. In some embodiments, since the display device 10 includes a plurality of anisotropic conductive adhesive structures 212 that are separated from each other, a transparent area without anisotropic conductive adhesive structures 212 can be provided in the display device 10, making the display device 10 a transparent display device. Compared to forming an anisotropic conductive film on the entire surface of the circuit board 100, forming a plurality of anisotropic conductive adhesive structures 212 that are separated from each other can increase the area of ​​the transparent area of ​​the transparent display device.

[0060] Figures 2A to 2G This is a cross-sectional schematic diagram of a method for manufacturing a display device according to an embodiment of the present invention. It must be noted that... Figures 2A to 2G The embodiments follow Figures 1A to 1G The component designations and partial contents of the embodiments are described below, wherein the same or similar designations are used to represent the same or similar components, and descriptions of identical technical content are omitted. For explanations of the omitted parts, please refer to the foregoing embodiments, which will not be repeated here. Please refer to... Figure 2AThe second light-emitting diode 600 is bonded to the circuit board 100 via a solder layer 710. In this embodiment, the second light-emitting diode 600 is a flip-chip light-emitting diode, having a first electrode 610 and a second electrode 650 located on the same side of the second light-emitting diode 600. The first electrode 610 of the second light-emitting diode 600 is bonded to the first pad 102 via the solder layer 710, and the second electrode 650 is bonded to the second pad 104 via the solder layer 710. In some embodiments, the melting point of the solder layer 710 is higher than 180 degrees Celsius, thereby reducing the probability of the solder layer 710 melting in subsequent processes.

[0061] Please refer to Figures 2B to 2C Multiple anisotropic conductive adhesive structures 212, separated from each other, are placed on the circuit board 100. For example, the anisotropic conductive adhesive material layer 210 is first attached to the entire surface of the carrier board 200, such as... Figure 1A As shown. Please refer to the following. Figure 2B The carrier board 200 and the anisotropic conductive adhesive material layer 210 are moved above the circuit board 100, and a portion of the anisotropic conductive adhesive material layer 210 is irradiated using a laser LS. After irradiation by the laser LS, a portion of the anisotropic conductive adhesive material layer 210 is transferred onto the circuit board 100 to form an anisotropic conductive adhesive structure 212, such as... Figures 2B to 2C As shown.

[0062] In this embodiment, the anisotropic conductive adhesive structure 212 is formed on the first pad 102 that is not bonded to the second light-emitting diode 600.

[0063] Please refer to Figure 2D Multiple first light-emitting diodes 300 are disposed on the circuit board 100, wherein the anisotropic conductive adhesive structure 300 is located between the circuit board 100 and the first light-emitting diodes 300.

[0064] For example, a first light-emitting diode (LED) 300 is transferred to a circuit board 100 using a transfer substrate 400, and an anisotropic conductive adhesive structure 212 is used to bond the first LED 300. The adhesion between the first LED 300 and the anisotropic conductive adhesive structure 212 is greater than the adhesion between the first LED 300 and the adhesive layer 410. Therefore, after removing the transfer substrate 400, the first LED 300 remains on the anisotropic conductive adhesive structure 212, wherein each anisotropic conductive adhesive structure 212 is located between the circuit board 100 and the corresponding first LED 300.

[0065] In some embodiments, with the top surface 100t of the circuit board 100 as a reference, the height of the top surface 300t of the first light-emitting diode 300 is higher than the height of the top surface 600t of the second light-emitting diode 600. Therefore, when the first light-emitting diode 300 is transferred, the adhesive layer 410 will not contact the second light-emitting diode 600.

[0066] Please refer to the following: Figures 2E to 2F A pressure is applied to the first light-emitting diode 300, causing it to be embedded in the anisotropic conductive adhesive structure 212. For example, a pressure-applying member 500 can simultaneously apply pressure to multiple first light-emitting diodes 300. In some embodiments, the surface of the pressure-applying member 500 includes a buffer layer 510, and the buffer layer 510 simultaneously contacts multiple first light-emitting diodes 300. In some embodiments, after pressure is applied to the first light-emitting diodes 300, with the top surface 100t of the circuit board 100 as a reference, the height of the top surface 300t of the first light-emitting diode 300 is higher than or equal to the height of the top surface 600t of the second light-emitting diode 600. In other embodiments, the pressure-applying member 500 and the buffer layer 510 may avoid the location where the second light-emitting diode 600 is disposed. In this case, after pressure is applied to the first light-emitting diodes 300, the height of the top surface 300t of the first light-emitting diodes 300 may be lower than the height of the top surface 600t of the second light-emitting diode 600.

[0067] Finally, please refer to... Figure 2G Multiple conductive connectors 800 are formed on the upper electrode 350 of the first light-emitting diode 300, the anisotropic conductive adhesive structure 212, and the second pad 104 of the circuit board 100. Some of the conductive connectors 800 are located on the anisotropic conductive adhesive structure 212. The conductive connectors 800 are electrically connected from the upper electrode 350 of the first light-emitting diode 300 to the second pad 104 of the circuit board 100. The conductive connectors 800 contact the upper electrode 350, the second semiconductor layer 340, and the second pad 104, and a portion of the anisotropic conductive adhesive structure 212 is sandwiched between the conductive connector 800 and the light-emitting layer 330, between the conductive connector 800 and the first semiconductor layer 320, between the conductive connector 800 and the lower electrode 310, and between the conductive connector 800 and the first pad 102. In some embodiments, the conductive connector 800 includes a metal, a metal oxide (e.g., indium tin oxide), a metal nitride, or other suitable material.

[0068] In this embodiment, the anisotropic conductive adhesive structure 212 can be used as a step, making the conductive connector 800 less prone to wire breakage due to excessive step difference between the upper electrode 350 and the second pad 104, thereby reducing the manufacturing difficulty of the conductive connector 800.

[0069] In this embodiment, the display device 20 includes a circuit board 100, a first light-emitting diode 300, an anisotropic conductive adhesive structure 212, a conductive connector 800, a second light-emitting diode 600, and a solder layer 710. In some embodiments, since the display device 20 includes multiple anisotropic conductive adhesive structures 212 that are separated from each other, a transparent area without anisotropic conductive adhesive structures 212 can be provided in the display device 20, making the display device 20 a transparent display device. Compared to forming an anisotropic conductive film on the entire surface of the circuit board 100, forming multiple anisotropic conductive adhesive structures 212 that are separated from each other can increase the area of ​​the transparent area of ​​the transparent display device. In some embodiments, the second light-emitting diode 600 is a red light-emitting diode. A red light-emitting diode with a flip-chip structure has a preferred red light luminous efficiency compared to a red light-emitting diode with a vertical structure. Therefore, using a flip-chip structure for the red light-emitting diode in the display device 20 can improve the red light luminous efficiency of the display device 20.

[0070] Figure 3 This is a cross-sectional schematic diagram of a method for manufacturing a display device according to an embodiment of the present invention. It must be noted that... Figure 3 The embodiments follow Figures 2A to 2G The component reference numerals and partial contents of the embodiments are described below, wherein the same or similar reference numerals are used to represent the same or similar components, and descriptions of the same technical content are omitted. For explanations of the omitted parts, please refer to the foregoing embodiments, and will not be repeated here.

[0071] Please refer to Figure 3 In this embodiment, the method for placing the first light-emitting diode 300 on the circuit substrate 100 includes laser transfer. Specifically, a laser LS is used to irradiate the adhesive layer 410, causing the specific first light-emitting diode 300 to detach from the transfer substrate 400 and fall onto the anisotropic conductive adhesive structure 212. Subsequent steps are described in the following documentation. Figures 2E to 2G And related explanations.

[0072] Figure 4 This is a cross-sectional schematic diagram of a method for manufacturing a display device according to an embodiment of the present invention. It must be noted that... Figure 4 The embodiments follow Figures 1A to 1G The component reference numerals and partial contents of the embodiments are described below, wherein the same or similar reference numerals are used to represent the same or similar components, and descriptions of the same technical content are omitted. For explanations of the omitted parts, please refer to the foregoing embodiments, and will not be repeated here.

[0073] Please refer to Figure 4In this embodiment, the method of placing the anisotropic conductive adhesive structure 212 on the circuit board 100 includes the following steps. First, a plurality of anisotropic conductive adhesive structures 212, separated from each other, are formed on the carrier 200. Next, the anisotropic conductive adhesive structures 212 on the carrier 200 are separated from the carrier 200 by laser LS and fall onto the first pads 102 of the circuit board 100. In this embodiment, the anisotropic conductive adhesive structure 212 is removed from the carrier 200 by laser LS, but the present invention is not limited thereto. In other embodiments, the carrier 200 is directly pressed against the circuit board 100, so that the plurality of anisotropic conductive adhesive structures 212 on the carrier 200 adhere to the plurality of first pads 102 of the circuit board 100.

[0074] Figure 5 This is a schematic cross-sectional view of an anisotropic conductive adhesive structure before being subjected to pressure, according to an embodiment of the present invention. Please refer to... Figure 5 The anisotropic conductive adhesive structure 212a includes a base material M and multiple conductive particles CP dispersed in the base material M. Before the anisotropic conductive adhesive structure 212a is subjected to pressure (i.e., before pressure is applied to the first light-emitting diode (see reference...) Figure 1C and Figure 2C The conductive particles CP are arrayed in the parent material M, and the conductive particles CP do not form a conductive path. After the anisotropic conductive adhesive structure 212a is compressed (i.e., after the first light-emitting diode is subjected to pressure), please refer to... Figure 1F and Figure 2F In the direction of pressure, the conductive particles CP will come into contact with each other and form a conductive path in the direction of pressure.

[0075] Figure 6 This is a schematic cross-sectional view of an anisotropic conductive adhesive structure before being subjected to pressure, according to an embodiment of the present invention. Please refer to... Figure 6 The anisotropic conductive adhesive structure 212b includes a base material M and a plurality of conductive particles CP dispersed in the base material M. In this embodiment, the conductive particles CP include a conductive core CC and an insulating layer I, wherein the insulating layer I is located on the surface of the conductive core CC. The insulating layer I can be used to reduce the probability of the anisotropic conductive adhesive structure 212b generating unintended conductive paths. Before the anisotropic conductive adhesive structure 212b is subjected to pressure (i.e., before pressure is applied to the first light-emitting diode (see reference...) Figure 1C and Figure 2C The insulating layer I covers the conductive core CC, therefore, even if the conductive particles CP come into contact with each other, the conductive cores CC are not easily interconnected to form a conductive path. After the anisotropic conductive adhesive structure 212b is compressed (i.e., after pressure is applied to the first light-emitting diode (see reference...) Figure 1F and Figure 2F In the direction of pressure, the conductive particles CP will come into contact with each other, causing the insulating layer I to break under pressure, so as to form a conductive core CC that is connected to each other in the direction of pressure to form a conductive path.

[0076] In summary, the first light-emitting diode of the present invention is electrically connected to the circuit board through an anisotropic conductive adhesive structure, thereby reducing the probability of the light-emitting diode detaching. Furthermore, by forming conductive connectors on the anisotropic conductive adhesive structure, the risk of breakage due to excessive step differences in the conductive connectors can be reduced, thereby reducing the manufacturing difficulty of the conductive connectors.

Claims

1. A display device, comprising: A circuit board; A first light-emitting diode is located on the circuit board; An anisotropic conductive adhesive structure is located between the circuit board and the first light-emitting diode (LED), and electrically connects the circuit board to a lower electrode of the first LED. With the top surface of the circuit board as a reference, the top surface of the anisotropic conductive adhesive structure is higher than or equal to the top surface of a light-emitting layer of the first LED, and the top surface of the anisotropic conductive adhesive structure is lower than an upper electrode of the first LED. A conductive connector electrically connects the upper electrode of the first light-emitting diode to the circuit board, wherein a portion of the conductive connector contacts the anisotropic conductive adhesive structure, wherein the conductive connector extends from the upper electrode of the first light-emitting diode to the top surface of the anisotropic conductive adhesive structure, and extends from the top surface of the anisotropic conductive adhesive structure along the side surface of the anisotropic conductive adhesive structure to the circuit board.

2. The display device of claim 1, wherein the anisotropic conductive adhesive structure comprises a carbon black material.

3. The display device of claim 1, wherein the anisotropic conductive adhesive structure comprises: One parent material; as well as Multiple conductive particles are dispersed in the parent material, wherein each conductive particle includes: A conductive core; as well as An insulating layer is located on the surface of the conductive core.

4. The display device as claimed in claim 1, further comprising: A second light-emitting diode is located on the circuit substrate and is electrically connected to the circuit substrate through a solder layer, wherein the solder layer has a melting point higher than 180 degrees Celsius.

5. The display device as claimed in claim 4, wherein the first light-emitting diode is a vertical light-emitting diode, and the second light-emitting diode is a flip-chip light-emitting diode.

6. The display device of claim 4, wherein, with the top surface of the circuit board as a reference, the height of the top surface of the first light-emitting diode is lower than or equal to the height of the top surface of the second light-emitting diode.

7. The display device as claimed in claim 1, further comprising: Multiple first light-emitting diodes are located on the circuit board; as well as Multiple anisotropic conductive adhesive structures are located between the circuit substrate and the first light-emitting diodes, and each anisotropic conductive adhesive structure is electrically connected to the circuit substrate to the corresponding first light-emitting diode, wherein the anisotropic conductive adhesive structures are separated from each other. Multiple conductive connectors, wherein each conductive connector is electrically connected to the corresponding first light-emitting diode to the circuit board.

8. The display device of claim 1, wherein the first light-emitting diode includes the lower electrode, a first semiconductor layer, the light-emitting layer, a second semiconductor layer and the upper electrode stacked in sequence, wherein the anisotropic conductive adhesive structure covers the sidewall of the first semiconductor layer.

9. The display device of claim 8, wherein the conductive connector contacts the upper electrode and the second semiconductor layer.

10. A method for manufacturing a display device, comprising: An anisotropic conductive adhesive structure is placed on a circuit board. A first light-emitting diode is disposed on the circuit substrate, wherein the anisotropic conductive adhesive structure is located between the circuit substrate and the first light-emitting diode; Pressure is applied to the first light-emitting diode, causing the first light-emitting diode to be embedded in the anisotropic conductive adhesive structure. With the top surface of the circuit substrate as a reference, the top surface of the anisotropic conductive adhesive structure is higher than or equal to the top surface of a light-emitting layer of the first light-emitting diode, and the top surface of the anisotropic conductive adhesive structure is lower than an upper electrode of the first light-emitting diode. The anisotropic conductive adhesive structure is electrically connected to the circuit substrate to a lower electrode of the first light-emitting diode. A conductive connector is formed on the upper electrode of the first light-emitting diode, the anisotropic conductive adhesive structure, and the circuit board, wherein the conductive connector electrically connects the upper electrode of the first light-emitting diode to the circuit board.

11. The method of manufacturing a display device as claimed in claim 10, wherein before applying pressure to the first light-emitting diode, the thickness of the anisotropic conductive adhesive structure is greater than the thickness of the lower electrode of the first light-emitting diode, and the width of the anisotropic conductive adhesive structure is greater than the width of the first light-emitting diode.

12. The method of manufacturing a display device as claimed in claim 10, wherein the anisotropic conductive adhesive structure comprises: One parent material; as well as Multiple conductive particles are dispersed in the parent material, wherein the conductive particles are arrayed in the parent material before the first light-emitting diode is pressure applied.

13. The method of manufacturing a display device as claimed in claim 10, wherein the method of placing the anisotropic conductive adhesive structure on the circuit board comprises: An anisotropic conductive adhesive material layer is applied to the entire surface of a carrier board. Move the carrier board and the anisotropic conductive adhesive material layer above the circuit board. The anisotropic conductive adhesive material layer is partially irradiated with a laser, causing a portion of the anisotropic conductive adhesive material layer to transfer onto the circuit board, thereby forming the anisotropic conductive adhesive structure.

14. The method of manufacturing a display device as claimed in claim 10, wherein before placing the anisotropic conductive adhesive structure on the circuit board, the method further comprises: A second light-emitting diode is bonded to the circuit board through a solder layer, wherein the solder layer has a melting point higher than 180 degrees Celsius.

15. The method of manufacturing a display device as claimed in claim 14, wherein the first light-emitting diode is a vertical light-emitting diode and the second light-emitting diode is a flip-chip light-emitting diode.

16. The method of manufacturing a display device as claimed in claim 10, further comprising: Multiple anisotropic conductive adhesive structures are placed on the circuit board. Multiple first light-emitting diodes are disposed on the circuit substrate, wherein each of the anisotropic conductive adhesive structures is located between the circuit substrate and the corresponding first light-emitting diode. Applying pressure to these first light-emitting diodes causes them to be embedded in the anisotropic conductive adhesive structure; Multiple conductive connectors are formed on the first light-emitting diodes, the anisotropic conductive adhesive structures, and the circuit board, wherein each conductive connector is electrically connected to the corresponding first light-emitting diode to the circuit board.

17. The method of manufacturing a display device as claimed in claim 16, wherein the method of applying voltage to the first light-emitting diodes comprises: The first light-emitting diodes are simultaneously pressurized using a pressurizing component.

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