Microcrystalline material cover plate polishing apparatus and method, and microcrystalline material cover plate re-polishing method

Abstract

The application provides a polishing device for a microcrystalline material cover plate, a polishing device and a polishing method for a microcrystalline material cover plate, and the polishing device comprises a brush disc formed with a mounting side; a plurality of bristles formed with a connecting end and a working end, the connecting end is arranged on the mounting side, and the material of the bristles comprises polyurethane; and the cross-sectional area of the bristles decreases in the direction from the connecting end to the working end. The polishing device for the microcrystalline material cover plate can polish a workpiece to be polished through the bristles, the working end of the bristles is more slender, can adapt to the shape of the workpiece to be polished, and is beneficial to improving the polishing efficiency and polishing effect of the polishing device, the material of the bristles comprises polyurethane, which is beneficial to improving the polishing amount per unit time, further improving the polishing efficiency and production efficiency, and reducing the possibility of scratching the workpiece to be polished.

Description

Technical Field

[0001] This invention relates to the field of glass product processing technology, and in particular to a polishing tool, equipment and method for polishing microcrystalline material cover plates. Background Technology

[0002] In the glass cover plate processing industry, polishing is typically required to ensure the surface quality of the product. Furthermore, after tempering, the cover plate also needs to be re-polished to remove the oxide layer on its surface. However, polishing tools in related technologies are often inefficient when polishing cover plates made of microcrystalline materials, failing to meet polishing requirements in a short time. This limits further improvements in production efficiency, results in a relatively low yield rate after polishing, and makes the cover plate surface prone to scratches, which is also detrimental to controlling production costs. Summary of the Invention

[0003] The present invention aims to solve at least one of the technical problems existing in the prior art or related art.

[0004] Therefore, a first aspect of the present invention provides a polishing tool for a cover plate made of microcrystalline material.

[0005] A second aspect of the present invention provides a polishing device for microcrystalline material cover plates.

[0006] A third aspect of the present invention provides a method for repolishing a microcrystalline material cover plate.

[0007] In view of this, a polishing tool for a microcrystalline material cover plate is provided according to a first aspect of the embodiments of this application, comprising:

[0008] The brush plate forms an installation side;

[0009] Multiple bristles are formed with a connecting end and a working end, the connecting end being disposed on the mounting side, and the material of the bristles including polyurethane.

[0010] In particular, along the direction from the aforementioned connecting end to the aforementioned working end, the cross-sectional area of ​​the aforementioned bristles decreases.

[0011] In one feasible implementation, the aforementioned bristles include:

[0012] The main body segment, wherein the aforementioned connecting end is formed in the aforementioned main body segment;

[0013] The working section is connected to the end of the aforementioned main section that is furthest from the aforementioned brush plate, and the aforementioned working end is formed in the aforementioned working section;

[0014] The aforementioned work section has a sharp-angled structure, and the sharp angle of the aforementioned work section is far away from the aforementioned main body section.

[0015] In one feasible implementation, the aforementioned bristles further include:

[0016] The transition section is connected to the end of the aforementioned main section away from the aforementioned brush disk. The aforementioned working section is connected to the aforementioned main section through the aforementioned transition section. Both the aforementioned main section and the aforementioned working section smoothly transition to the aforementioned transition section.

[0017] In one feasible implementation, a plurality of the aforementioned bristles are arranged in a circular array around the axis of the aforementioned brush disc.

[0018] In one feasible implementation, the aforementioned annular array has multiple rings, with the aforementioned bristles in the same ring arranged adjacent to each other, and the aforementioned bristles in two adjacent rings arranged adjacent to each other.

[0019] In one feasible implementation, the material of the aforementioned bristles also includes cotton.

[0020] In one feasible implementation, the Shore hardness of the aforementioned bristles is greater than or equal to 60HC and less than or equal to 64HC.

[0021] In one feasible implementation, the length of the aforementioned bristles is greater than or equal to 20 mm and less than or equal to 30 mm; and / or

[0022] The width and thickness of the aforementioned bristles are both greater than or equal to 2 mm and less than or equal to 5 mm.

[0023] In one feasible implementation, the diameter of the aforementioned brush disk is greater than or equal to 600 mm and less than or equal to 900 mm.

[0024] In one feasible implementation, the aforementioned brush pad is made of plastic material.

[0025] According to a second aspect of the embodiments of this application, a polishing device for microcrystalline material cover plates is provided, comprising:

[0026] frame;

[0027] The base is rotatably mounted on the aforementioned frame;

[0028] Multiple loading devices are disposed on the aforementioned base, and the aforementioned loading devices are used to load the workpieces to be polished;

[0029] The microcrystalline material cover plate polishing tool proposed in any of the first aspects above is movably mounted on the aforementioned frame, with the aforementioned working end facing the aforementioned loading device.

[0030] A first driving device is connected to the aforementioned polishing tool and is used to drive the aforementioned polishing tool to move along a first direction so that the aforementioned polishing tool moves closer to or away from the aforementioned loading device.

[0031] The second driving device is connected to the aforementioned polishing tool and is used to drive the aforementioned polishing tool to rotate.

[0032] In one feasible implementation, the polishing apparatus further includes:

[0033] A liquid storage device for storing polishing agent;

[0034] The infusion device has a brush plate with multiple infusion holes. One end of each infusion hole is located on the mounting side. One end of the infusion device is connected to the liquid storage device, and the other end is connected to the infusion hole.

[0035] In one feasible implementation, the polishing apparatus further includes:

[0036] A third driving device is connected to the aforementioned polishing tool and is used to drive the aforementioned polishing tool to move along a second direction, which is perpendicular to the aforementioned first direction.

[0037] A third aspect of the embodiments of this application provides a method for back polishing a microcrystalline material cover plate, used in the microcrystalline material cover plate polishing equipment as described in any of the second aspects above, comprising:

[0038] When the aforementioned loading device is loaded with the aforementioned workpiece to be polished, the aforementioned polishing tool is controlled to move closer to the aforementioned loading device so that the aforementioned working end abuts against the aforementioned workpiece to be polished, the aforementioned workpiece to be polished being a tempered microcrystalline material cover plate.

[0039] The aforementioned polishing tool is rotated to polish the aforementioned workpiece.

[0040] In one feasible implementation, the aforementioned control of the polishing tool to rotate in order to polish the workpiece to be polished includes:

[0041] The aforementioned polishing tool is controlled to rotate at a preset speed, which is greater than or equal to 80 rpm and less than or equal to 90 rpm.

[0042] When the aforementioned polishing tool rotates at the aforementioned preset speed for a preset duration, the aforementioned polishing tool is controlled to stop rotating, and the aforementioned preset duration is greater than or equal to 3 minutes and less than or equal to 6 minutes.

[0043] Compared with the prior art, the present invention has at least the following beneficial effects: The microcrystalline material cover plate polishing tool provided in the embodiments of this application includes a brush plate and multiple brush bristles, wherein the brush plate has a mounting side, the brush bristles have a connecting end and a working end, and the connecting ends of the multiple aforementioned brush bristles are all disposed on the aforementioned mounting side. In practical applications, the polishing tool provided in the embodiments of this application can be used as a component of a polishing device. During use, the aforementioned working end can be used to contact the microcrystalline material workpiece to be polished to perform polishing treatment on the aforementioned workpiece. The material of the brush bristles includes polyurethane, which can ensure that the brush bristles have good strength, elasticity and wear resistance, thereby facilitating the generation of a relatively high contact force between the brush bristles and the workpiece to be polished during the polishing process, which is beneficial to increasing the grinding amount per unit time during polishing, thereby improving polishing efficiency and production efficiency. Furthermore, the brush bristles containing polyurethane material and... Microcrystalline materials allow for good contact between workpieces to be polished, reducing the risk of surface scratches, improving yield, and lowering production costs. Simultaneously, reducing the cross-sectional area of ​​the bristles along the direction from the connecting end to the working end allows for finer bristles near the working end. This enhances the bristles' deformation capability during polishing, enabling them to adapt to the shape of the workpiece and increasing the contact area between the polishing tool and the workpiece, thus improving polishing efficiency. Furthermore, when the workpiece has a complex structure, the working end of the bristles can easily contact the fine structures on the workpiece, reducing the possibility of unpolished areas and ensuring the polishing process's effectiveness, thereby improving both polishing and production efficiency. Attached Figure Description

[0044] Various other advantages and benefits will become apparent to those skilled in the art upon reading the following detailed description of exemplary embodiments. The accompanying drawings are for illustrative purposes only and are not intended to limit the scope of this application. Furthermore, the same reference numerals denote the same parts throughout the drawings. In the drawings:

[0045] Figure 1 A schematic structural diagram from a first perspective of a microcrystalline material cover plate polishing tool provided in this application;

[0046] Figure 2 A schematic structural diagram from a second perspective of a microcrystalline material cover plate polishing tool provided in this application;

[0047] Figure 3 for Figure 2 A schematic enlarged view of a portion of region A in the middle;

[0048] Figure 4A schematic structural diagram of a microcrystalline material cover plate polishing device according to an embodiment of this application;

[0049] Figure 5 A schematic flowchart illustrating a method for polishing a microcrystalline material cover plate according to one embodiment of the application.

[0050] in, Figures 1 to 4 The correspondence between the reference numerals and component names in the attached drawings is as follows:

[0051] 100 Polishing tool; 200 Frame; 300 Base; 400 First drive unit; 500 Second drive unit; 600 Liquid storage device; 700 Liquid delivery device; 800 Separation device;

[0052] 110 brush plate; 120 brush bristles;

[0053] 121 Main Section; 122 Transition Section; 123 Operational Section;

[0054] 1211 First straight line segment; 1221 Arc segment; 1231 Second straight line segment;

[0055] 1101 Infusion port; 1201 Connection end; 1202 Working end. Detailed Implementation

[0056] Exemplary embodiments of the present application will now be described in more detail with reference to the accompanying drawings. While exemplary embodiments of the present application are shown in the drawings, it should be understood that the present application may be implemented in various forms and should not be limited to the embodiments set forth herein. Rather, these embodiments are provided so that this application will be thorough and complete, and will fully convey the scope of the present application to those skilled in the art.

[0057] like Figures 1 to 4 As shown, a microcrystalline material cover plate polishing tool 100 is provided according to a first aspect of the present application, comprising: a brush plate 110 having an installation side; a plurality of bristles 120 having a connecting end 1201 and a working end 1202, wherein the connecting end 1201 is disposed on the installation side, and the material of the bristles 120 includes polyurethane; wherein, along the direction from the connecting end 1201 to the working end 1202, the cross-sectional area of ​​the bristles 120 decreases.

[0058] The microcrystalline material cover plate polishing tool 100 provided in this application embodiment includes a brush plate 110 and a plurality of brush bristles 120. The brush plate 110 has an installation side, and the brush bristles 120 have a connecting end 1201 and a working end 1202. The connecting ends 1201 of the plurality of brush bristles 120 are all disposed on the installation side. In practical applications, the polishing tool 100 provided in this application embodiment can be used as a component of a polishing device. When in use, the working end 1202 can be used to contact the microcrystalline material workpiece to be polished in order to polish the workpiece.

[0059] It is understood that the workpiece to be polished from the aforementioned microcrystalline material can include, but is not limited to, workpieces such as glass covers made of microcrystalline material. In practical applications, the brush 110 of the polishing tool 100 provided in this application embodiment can be connected to the drive device of the polishing equipment so that the polishing tool 100 can receive power and realize the polishing process of the workpiece to be polished.

[0060] It should be noted that microcrystalline material is a relatively new material in the cover glass industry. The forming process of microcrystalline glass is typically casting, and it is composed of a glass phase and crystals. Under a microscope, the internal structure of microcrystalline material appears honeycomb-like. During the tempering process, Li is released... + There is a large amount of Li in the boiler water, requiring the use of additives to absorb it. + As a result, the surface of the finished product often forms a compound oxide layer of additives and tempering salts. This oxide layer typically requires a re-polishing process to remove it and maintain the product's properties. It is understood that the aforementioned re-polishing process refers to the polishing process following tempering.

[0061] The bristles 120 of the polishing tool 100 provided in this application embodiment are made of polyurethane, which ensures that the bristles 120 have good strength, elasticity and wear resistance. In the polishing process, this facilitates the generation of a relatively high contact force between the bristles 120 and the workpiece to be polished, which is beneficial to increasing the amount of grinding per unit time during polishing, thereby improving polishing efficiency and production efficiency. Furthermore, the bristles 120 made of polyurethane material can form good contact characteristics with the microcrystalline material workpiece to be polished, which helps to reduce the risk of surface scratches on the workpiece to be polished, thereby improving the yield rate and reducing production costs.

[0062] It is understood that the aforementioned bristles 120 are made of polyurethane, meaning that the bristles 120 can be made of polyurethane material or polyurethane-based composite material to ensure that the bristles 120 have good strength, elasticity, and wear resistance, and to extend the service life of the bristles 120, thereby reducing polishing and production costs. In practical applications, the connecting end 1201 of the aforementioned bristles 120 can be bonded to the aforementioned mounting side with an adhesive to prevent the bristles 120 from falling off, which helps to extend the service life of the polishing tool 100 and ensure the polishing effect.

[0063] Meanwhile, by reducing the cross-sectional area of ​​the bristles 120 along the direction from the connecting end 1201 to the working end 1202, the portion of the bristles 120 near the working end 1202 becomes finer. This improves the deformation capability of the bristles 120 during polishing, allowing them to adapt to the shape of the workpiece and increase the contact area between the polishing tool 100 and the workpiece, thus improving polishing efficiency. Furthermore, when the workpiece has a relatively complex structure, the working end 1202 of the bristles 120 can easily contact the fine structures on the workpiece, reducing the possibility of missed polishing areas and ensuring the effectiveness of the polishing process, thereby improving polishing and production efficiency.

[0064] It should be noted that in some examples, polishing tools include sponge pads or polishing leather pads to polish microcrystalline workpieces during the polishing process. However, in practical applications, sponge pads or polishing leather pads have several drawbacks. First, their polishing efficiency is low, making it difficult to achieve the expected grinding amount in a short time, which hinders further shortening of the production cycle. Second, sponge pads or polishing leather pads are usually one-piece structures, resulting in interference between the deformation of different parts. Consequently, during the polishing process, sponge pads or polishing leather pads are less adaptable to 3D workpieces with relatively complex shapes, sometimes failing to cover rounded corners, folded edges, and other structures, thus affecting the polishing effect. Third, sponge pads or polishing leather pads are prone to attracting impurities, debris, and other particles during use, which are difficult to clean and remove. This can easily scratch the workpiece when polishing with a polishing stone, negatively impacting the production yield.

[0065] Compared to the aforementioned polishing tools, the polishing tool 100 provided in this application embodiment can form a brush-like structure based on the aforementioned arrangement of the brush plate 110 and brush bristles 120, with each brush bristle 120 being relatively independent. On the one hand, this helps to reduce the probability of the aforementioned particles being mixed in, and when the aforementioned particles are mixed between the brush bristles 120, the aforementioned particles can be easily shaken off when the brush bristles 120 deform, thereby greatly reducing the risk of scratching the workpiece to be polished, which is conducive to ensuring the production yield and reducing the cleaning difficulty of the polishing tool 100. On the other hand, compared to an integrated sponge pad or polishing leather pad, the deformation effect between each brush bristle 120 is relatively low, making it easier to use each brush bristle 120 to contact different parts of the workpiece to be polished. Therefore, the polishing tool 100 has good adaptability to 3D workpieces to be polished or other workpieces with more complex structural shapes, which is conducive to ensuring polishing effect and polishing efficiency. Meanwhile, since the material of the bristles 120 includes polyurethane, it can ensure that the bristles 120 have good strength, elasticity and wear resistance, which is conducive to increasing the amount of grinding per unit time during polishing, thereby improving polishing efficiency and production efficiency, and further improving production yield and reducing production costs.

[0066] It is understood that the cross-sectional area of ​​the aforementioned bristles 120 refers to the cross-sectional area of ​​the bristles 120 perpendicular to its length direction; the aforementioned decrease in the cross-sectional area of ​​the aforementioned bristles 120 along the direction from the aforementioned connecting end 1201 to the aforementioned working end 1202 can be that the cross-sectional area gradually decreases along the direction from the aforementioned connecting end 1201 to the aforementioned working end 1202, that is, the bristles 120 can have a conical structure or a frustum structure; or, the cross-sectional area can decrease in stages along the direction from the aforementioned connecting end 1201 to the aforementioned working end 1202, that is, the bristles 120 along the direction from the aforementioned connecting end 1201 to the aforementioned working end 1202 can include multiple sequentially connected bristle segments, the cross-sectional area of ​​each bristle segment can be constant or decrease along the direction from the aforementioned connecting end 1201 to the aforementioned working end 1202, and the cross-sectional area of ​​the bristle segment closer to the aforementioned working end 1202 is smaller than the cross-sectional area of ​​the bristle segment closer to the aforementioned connecting end 1201.

[0067] like Figure 3 As shown, in some examples, the aforementioned bristles 120 include: a main body segment 121, with the aforementioned connecting end 1201 formed in the aforementioned main body segment 121; and a working segment 123 connected to the end of the aforementioned main body segment 121 away from the aforementioned brush disk 110, with the aforementioned working end 1202 formed in the aforementioned working segment 123; wherein the aforementioned working segment 123 has a pointed structure, and the pointed corner of the aforementioned working segment 123 is away from the aforementioned main body segment 121.

[0068] In this technical solution, the brush bristles 120 may include a main body section 121 and a working section 123. The aforementioned working end 1202 is formed in the working section 123, and the connecting end 1201 is formed in the main body section 121. That is, during use, the main body section 121 is used to connect to the mounting side of the brush disc 110, and the working section 123 is used to contact the workpiece to be polished. The working section 123 has a sharp angle structure, and the sharp angle of the working section 123 is far away from the aforementioned main body section 121. This ensures that the cross-sectional area of ​​the part of the brush bristles 120 near the aforementioned working end 1202 is small, thereby making the part of the brush bristles 120 near the aforementioned working end 1202 more slender and sharp. This can improve the deformation capability of the brush bristles 120, making it easier for the brush bristles 120 to adapt to the shape of the workpiece to be polished through deformation. This is beneficial to increasing the contact area between the polishing tool 100 and the workpiece to be polished, further improving the polishing efficiency, and making it easier for the working end 1202 of the brush bristles 120 to contact the small structures on the workpiece to be polished, ensuring the execution effect of the polishing process, and thus improving polishing efficiency and production efficiency.

[0069] At the same time, such as Figure 3 As shown, based on the aforementioned configuration, it is convenient to make the cross-sectional area of ​​the bristles 120 change in stages. That is, when making the bristles 120, the cross-sectional area of ​​the main body section 121 can remain unchanged and be larger than the cross-sectional area of ​​the working section 123. Correspondingly, the cross-sectional area of ​​the working section 123 can be reduced along the direction from the connecting end 1201 to the working end 1202, which helps to reduce the forming difficulty of the bristles 120. While ensuring that the working end 1202 of the bristles 120 is relatively thin and sharp, it can also ensure that the main body section 121 has a relatively large cross-section, increasing the contact area between the main body section 121 and the mounting side, and providing a guarantee for the connection reliability between the bristles 120 and the brush plate 110.

[0070] like Figure 3 As shown, in some examples, the aforementioned bristles 120 further include: a transition section 122 connected to the end of the aforementioned main body section 121 away from the aforementioned brush disk 110, and the aforementioned working section 123 connected to the aforementioned main body section 121 through the aforementioned transition section 122, wherein the aforementioned main body section 121 and the aforementioned working section 123 are both smoothly transitioned to the aforementioned transition section 122.

[0071] In this technical solution, the brush bristles 120 may also include a transition section 122 connecting the main body section 121 and the working section 123. That is, the working section 123 can be connected to the main body section 121 through the transition section 122. One end of the transition section 122 is smoothly connected to the main body section 121, and the other end is smoothly connected to the working section 123. This avoids abrupt changes in cross-sectional area between the main body section 121 and the transition section 122, which helps to improve the overall structural strength of the brush bristles 120. It also facilitates increasing the contact force applied by the brush bristles 120 to the workpiece to be polished during the polishing process, thereby further increasing the amount of grinding per unit time during polishing and achieving further improvement in polishing efficiency and production efficiency.

[0072] For example, such as Figure 3 As shown, in the longitudinal section of the bristle 120, the outline of the main body segment 121 may include a first straight line segment 1211, the outline of the working segment 123 may include a second straight line segment 1231, and the outline of the transition segment 122 may include an arc segment 1221, with the two ends of the arc segment 1221 being tangent to the aforementioned first straight line segment 1211 and the aforementioned second straight line segment 1231, thereby making the surfaces of the main body segment 121 and the working segment 123 smoothly transition to the surface of the transition segment 122.

[0073] In some feasible examples, the aforementioned arc can be an elliptical arc, which is beneficial to improve the extensibility of the transition section 122 in the length direction of the bristles 120, facilitates the connection between the main body section 121 and the working section 123 through the transition section 122, and improves the surface smoothness of the transition section 122.

[0074] In some examples, multiple of the aforementioned bristles 120 are arranged in a circular array around the axis of the aforementioned brush disk 110.

[0075] In this technical solution, multiple bristles 120 can be arranged in a circular array around the axis of the brush disk 110. It is understood that during polishing, the brush disk 110 can rotate to drive each bristle 120 to rotate synchronously, thereby achieving grinding of the workpiece surface. Based on the aforementioned arrangement of this technical solution, multiple bristles 120 can be distributed on a circumference concentric with the brush disk 110, making the arrangement of the bristles 120 more suitable for rotational movement. This helps to reduce the resistance of the polishing tool 100 during polishing, improving polishing efficiency and production efficiency. Simultaneously, arranging multiple bristles 120 in a circular array around the axis of the brush disk 110 also helps to improve the uniformity of the bristle distribution on the brush disk 110. During use, multiple bristles 120 can rotate with the brush disk 110 and pass sequentially over the surface of the workpiece to be polished, improving the continuity of the polishing process and further ensuring the polishing effect.

[0076] It is understandable that the aforementioned circular array has one or more rings.

[0077] In some examples, the aforementioned ring array has multiple rings, with the aforementioned bristles 120 in the same ring arranged adjacent to each other, and the aforementioned bristles 120 in two adjacent rings arranged adjacent to each other.

[0078] In this technical solution, the aforementioned annular array can have multiple rings, that is, the aforementioned multiple bristles 120 can be divided into multiple groups, each group containing more than one bristle 120. Each bristle 120 in the same group is located on the same circumference concentric with the brush disk 110. The circumferences corresponding to different groups are arranged at radial intervals along the brush disk 110, so that the aforementioned multiple bristles 120 are arranged in a multi-ring annular array around the axis of the aforementioned brush disk 110, which is beneficial to increasing the arrangement density and distribution range of the bristles 120 on the brush disk 110, which is beneficial to increasing the working area of ​​the polishing tool 100, and further improving polishing efficiency and production efficiency.

[0079] Meanwhile, the aforementioned bristles 120 located in the same circle can be arranged adjacently, and the aforementioned bristles 120 in two adjacent circles can be arranged adjacently, thereby further reducing the gap between the bristles 120 and further increasing the arrangement density of the bristles 120 on the brush plate 110, thereby further improving the polishing efficiency.

[0080] In some examples, the aforementioned bristles 120 are also made of cotton.

[0081] In this technical solution, the material of the aforementioned bristles 120 may also include cotton, that is, the bristles 120 may be made of polyurethane-cotton composite material, so that the bristles 120 may contain cotton fibers, so that a layer of fluff can be formed on the surface of the bristles 120. Then, during the polishing process, the bristles 120 can use the aforementioned fluff and polishing agent used during polishing to brush the surface of the workpiece to be polished and repair the fine scratches on the surface of the workpiece to be polished, which is conducive to further improving the surface quality of the workpiece, increasing the production yield, and further reducing the production cost.

[0082] It is understood that the aforementioned polishing agent can be a cerium oxide polishing agent.

[0083] In some examples, the aforementioned bristles 120 have a Shore hardness greater than or equal to 60HC and less than or equal to 64HC.

[0084] In this technical solution, the Shore hardness of the aforementioned bristles 120 is greater than or equal to 60HC and less than or equal to 64HC. This avoids the bristles 120 being too hard, preventing damage to the workpiece during polishing, which is beneficial for further improving the production yield and reducing production costs. On the other hand, it also avoids the bristles 120 being too hard, which facilitates increasing the contact force between the bristles 120 and the workpiece during polishing, thereby further increasing the amount of grinding per unit time and achieving further improvement in polishing efficiency and production efficiency.

[0085] For example, the Shore hardness of the aforementioned bristles 120 can be equal to 60HC, 61HC, 63HC or 64HC, etc.

[0086] In some feasible examples, the Shore hardness of the aforementioned bristles 120 is greater than or equal to 61HC and less than or equal to 63HC, thereby making the hardness of the bristles 120 more suitable for the workpiece to be polished from microcrystalline materials, especially 3D type microcrystalline materials. When the Shore hardness of the aforementioned bristles 120 is greater than or equal to 61HC and less than or equal to 63HC, the possibility of 3D type microcrystalline materials being scratched during the polishing process can be greatly reduced, which is conducive to further improving the production yield and production efficiency of microcrystalline materials.

[0087] like Figure 3 As shown, in some examples, the length L of the aforementioned bristles 120 is greater than or equal to 20 mm and less than or equal to 30 mm; and / or the width W and thickness of the aforementioned bristles 120 are both greater than or equal to 2 mm and less than or equal to 5 mm.

[0088] In this technical solution, the length L of the aforementioned bristles 120 is greater than or equal to 20mm and less than or equal to 30mm. It can be understood that the length of the bristles 120 is also the length between the connecting end 1201 and the working end 1202. Based on the aforementioned setting, the length L of the bristles 120 can be constrained. On the one hand, it can prevent the length L of the bristles 120 from being too large, thus ensuring the structural rigidity of the bristles 120. In the polishing process, this helps to control the contact force between the bristles 120 and the workpiece to be polished, thereby improving polishing efficiency and production efficiency. On the other hand, it can also prevent the length L of the bristles 120 from being too small, thus ensuring that the bristles 120 can withstand more frictional wear, which helps to extend the service life of the bristles 120. It can also prevent the rigidity of the bristles 120 from being too large, which helps to ensure the deformation capacity of the bristles 120.

[0089] In this technical solution, the width W and thickness of the aforementioned bristles 120 are both greater than or equal to 2 mm and less than or equal to 5 mm. This avoids the cross-sectional area of ​​the bristles 120 being too large, thus preventing the bristles 120 from having excessive lateral stiffness. This helps to further ensure the deformation capacity of the bristles 120 and enhance the shape adaptability of the bristles 120 to the workpiece to be polished. At the same time, with a fixed area on the mounting side of the brush plate 110, it is easier to arrange more bristles 120 on the mounting side, increasing the arrangement density of the bristles 120 and improving the polishing effect and production yield. On the other hand, it also avoids the cross-sectional area of ​​the bristles 120 being too small, which helps to ensure the structural strength of the bristles 120, extend the service life of the bristles 120, and improve the connection strength between the bristles 120 and the brush plate 110, reducing the possibility of the bristles 120 falling off.

[0090] It is understood that the aforementioned width W and thickness refer to the width and thickness of the cross-section of the bristle 120. The bristle 120 can be manufactured by die-cutting, and correspondingly, the thickness of the bristle 120 is the thickness of the bristle 120 blank. The width of the bristle 120 can be obtained by controlling the die-cutting spacing. Furthermore, when multiple bristles 120 are arranged in a ring array around the axis of the brush disk 110, the aforementioned restrictions on the width and thickness of the bristles 120 can also constrain the dimensions of the bristles 120 in the circumferential and radial directions of the brush disk 110 to a certain extent. This is beneficial to improving the stiffness of the bristles 120 in the circumferential and radial directions of the brush disk 110, thereby further reducing the rotational resistance of the polishing tool 100 during use and ensuring polishing effect and efficiency. On the other hand, when there are multiple rings in the aforementioned ring array, it is also convenient to control the number of bristles 120 in each ring array, thereby ensuring the arrangement density of the bristles 120 on the brush disk 110, which is beneficial to further improve the polishing effect and efficiency.

[0091] It is understandable that, while setting the length of the aforementioned bristles 120 to be greater than or equal to 20mm and less than or equal to 30mm, the width and thickness of the aforementioned bristles 120 can be set to be greater than or equal to 2mm and less than or equal to 5mm, thereby further improving the performance of the bristles 120 and providing further assurance for the improvement of polishing efficiency and polishing effect.

[0092] For example, the length of the bristles 120 can be equal to 20mm, 21.5mm, 23mm, 25mm, 27.5mm or 30mm, etc.; and / or the width and thickness of the bristles 120 can be equal to 2mm, 2.5mm, 3mm, 3.5mm, 4mm, 4.5mm or 5mm, etc.

[0093] In some examples, the diameter of the aforementioned brush 110 is greater than or equal to 600 mm and less than or equal to 900 mm.

[0094] In this technical solution, the diameter of the brush plate 110 can be greater than or equal to 600 mm and less than or equal to 900 mm, which helps to increase the area on the mounting side, making it easier to set more bristles 120 on the brush plate 110, which helps to improve the continuity of the polishing process, thereby improving the polishing effect and production yield. In practical applications, it is also convenient to use the same brush plate 110 to process multiple workpieces to be polished at the same time, so as to further improve polishing efficiency and production efficiency.

[0095] For example, the diameter of the brush 110 can be 600mm, 650mm, 700mm, 800mm or 900mm, etc.

[0096] In some examples, the aforementioned brush 110 is made of plastic material.

[0097] In this technical solution, the aforementioned brush disc 110 can be made of plastic material. On the one hand, plastic material has a relatively low density, which helps to control the mass of the brush disc 110 to a relatively low level under the same structural dimensions, achieving lightweighting of the brush disc 110. This reduces the driving energy consumption of the polishing tool 100 during the polishing process and facilitates high-speed operation of the polishing tool 100, further improving polishing efficiency. On the other hand, plastic material has good machinability and is easy to mold. The comb bristles containing polyurethane material can be easily bonded to the plastic brush disc 110, which helps to reduce the manufacturing cost and difficulty of the polishing tool 100, thereby further reducing polishing and production costs. Furthermore, plastic material has relatively high strength, which reduces the possibility of structural damage to the brush disc 110, thereby extending the service life of the polishing tool 100 and further reducing the maintenance cost of the polishing tool 100.

[0098] In some feasible examples, the aforementioned brush disc 110 can be made of PVC (Polyvinyl Chloride) material, which enables the brush disc 110 to have good structural strength, wear resistance and corrosion resistance, which is conducive to further extending the service life of the brush disc 110.

[0099] For example, as shown in Table 1, Table 1 schematically lists the polishing test results of the polishing instrument 100 and the polishing test results of the sponge pad provided in the embodiments of this application. The measurement points are measurement points selected at different parts of the workpiece to be polished. The polishing time is used to indicate the duration of grinding and polishing of the workpiece to be polished. The rotation speed is used to indicate the rotation speed of the polishing instrument 100 and the sponge pad when performing grinding and polishing. It can be seen that when the rotation speeds of the polishing instrument 100 and the sponge pad are comparable, the polishing instrument 100 provided in the embodiments of this application can achieve the grinding amount of the sponge pad in 15 minutes in 4 minutes, thereby significantly shortening the polishing time and improving the polishing efficiency.

[0100]

[0101]

[0102] Table 1

[0103] like Figure 4 As shown, a microcrystalline material cover plate polishing device is provided according to a second aspect of the embodiments of this application, comprising: a frame 200; a base 300 rotatably disposed on the frame 200; a plurality of loading devices disposed on the base 300, the loading devices being used to load workpieces to be polished; a microcrystalline material cover plate polishing tool 100 as described in any of the first aspects above, movably disposed on the frame 200, the working end 1202 being arranged facing the loading devices; a first driving device 400 connected to the polishing tool 100, used to drive the polishing tool 100 to move along a first direction, so that the polishing tool 100 approaches or moves away from the loading devices; and a second driving device 500 connected to the polishing tool 100, used to drive the polishing tool 100 to rotate.

[0104] The microcrystalline material cover plate polishing equipment provided in this application includes a frame 200, a base 300, multiple loading devices, a first driving device 400, a second driving device 500, and a microcrystalline material cover plate polishing fixture 100 as described in any of the first aspects above. The base 300 is disposed on the frame 200, and the loading devices for loading the workpieces to be polished are disposed on the base 300. Thus, the polishing equipment can simultaneously load multiple workpieces to be polished using the base 300, facilitating simultaneous polishing of multiple workpieces. The polishing fixture 100 is movably disposed... The polishing tool 100 is positioned on the frame 200 and can move closer to or further away from the loading device under the drive of the first driving device 400. When the loading device is loaded with a workpiece to be polished, the first driving device 400 can be controlled to drive the polishing tool 100 closer to the loading device and into contact with the workpiece to be polished, so that a certain contact force is formed between the polishing tool 100 and the workpiece to be polished, which is beneficial to ensuring polishing efficiency and production efficiency. After polishing is completed, the first driving device 400 can be controlled to drive the polishing tool 100 further away from the loading device to facilitate the picking and placing of workpieces.

[0105] It is understood that, if the platform on the base 300 where the aforementioned loading device is installed is taken as the loading platform, the aforementioned first direction can be a direction perpendicular to the aforementioned loading platform. Furthermore, the aforementioned working end 1202 is arranged facing the aforementioned loading device, that is, the working end 1202 of the aforementioned bristles 120 is arranged facing the aforementioned loading platform.

[0106] The second drive device 500 is used to drive the aforementioned polishing tool 100 to rotate. When polishing is required, the second drive device 500 can be controlled to drive the aforementioned polishing tool 100 to operate, so as to grind and polish the surface of the workpiece. The base 300 can rotate relative to the frame 200. During the polishing process, the workpiece to be polished can be rotated synchronously by controlling the rotation of the machine table, thereby causing each workpiece to be polished to move relative to the polishing tool 100. This allows the workpieces at different positions on the machine table to contact the polishing tool 100 in sequence, thereby increasing the working range of the polishing tool 100 and further improving polishing efficiency and production efficiency.

[0107] It is understandable that the polishing tool 100 and the base 300 can be eccentrically arranged so that when the base 300 rotates, the sweeping range of the polishing tool 100 can be increased, thereby expanding the working range of the polishing tool 100 and further improving the polishing efficiency.

[0108] In some feasible examples, the aforementioned polishing fixtures 100 can be multiple, arranged at circumferential intervals along the base 300. This facilitates a further increase in the number of workpieces that the polishing equipment can polish simultaneously, thereby further improving polishing efficiency and production efficiency. For example, the number of polishing fixtures 100 can be four. It is understood that when there are multiple polishing fixtures 100, the number of both the first driving device 400 and the second driving device 500 can also be multiple, so that each polishing fixture 100 corresponds to one first driving device 400 and one second driving device 500.

[0109] In some feasible examples, the aforementioned first drive device 400 may include a cylinder; the aforementioned second drive device 500 may include a first motor.

[0110] In some feasible examples, the aforementioned second drive device 500 may further include a mounting plate, Velcro, and fasteners. The mounting plate is connected to the aforementioned first motor. The side of the brush disk 110 of the polishing tool 100 away from the bristles 120 is connected to the mounting plate via the aforementioned Velcro. The brush disk 110 may also have a connection hole. The aforementioned fastener passes through the aforementioned connection hole and is connected to the aforementioned mounting plate. Based on the aforementioned configuration, the reliability of the connection between the second drive device 500 and the polishing tool 100 can be guaranteed, which is conducive to enhancing the stability and reliability of the polishing equipment and providing further assurance for improving the polishing effect.

[0111] In some feasible examples, the aforementioned loading device may include a carrier body and a vacuum pump. The carrier body may have a vacuum hole for loading the workpiece to be polished. The vacuum pump is connected to the vacuum hole. When the loading device is loaded with the workpiece to be polished, the workpiece can cover the vacuum hole. Accordingly, the operation of the vacuum pump can be controlled to evacuate the vacuum hole, so that the loading device can adsorb the workpiece to be polished, avoiding the workpiece from moving around during the polishing process. This helps to ensure the smooth progress of the polishing process and further improves the polishing effect and production yield.

[0112] like Figure 1 and Figure 4 As shown, in some examples, the polishing equipment further includes: a liquid storage device 600 for storing polishing agent; and a liquid delivery device 700, wherein the aforementioned brush plate 110 has a plurality of liquid delivery holes 1101, one end of the aforementioned liquid delivery holes 1101 is located on the aforementioned mounting side, one end of the aforementioned liquid delivery device 700 is connected to the aforementioned liquid storage device 600, and the other end is connected to the aforementioned liquid delivery holes 1101.

[0113] In this technical solution, the polishing equipment may further include a liquid storage device 600 and a liquid delivery device 700. The brush disc 110 of the polishing tool 100 may also have a liquid delivery hole 1101. The liquid storage device 600 can be used to store polishing agent, and the liquid delivery device 700 can be used to deliver the polishing agent in the liquid storage device 600 to the aforementioned liquid delivery hole 1101. One end of the liquid delivery hole 1101 is located on the mounting side of the brush disc 110. Thus, during use, the polishing agent in the liquid delivery hole 1101 can flow to the brush bristles 120, which facilitates the addition of polishing agent during the polishing process and allows the polishing agent to act on the workpiece to be polished. This helps to shorten the grinding time and further improve the polishing effect and polishing efficiency. At the same time, after the polishing agent flows out of the liquid delivery hole 1101, it is easy for it to preferentially contact the brush bristles 120. Thus, under the action of the brush bristles 120, the polishing equipment can more evenly coat the workpiece to be polished, which helps to improve the utilization rate of the polishing liquid.

[0114] In some examples, the polishing equipment further includes a third driving device connected to the polishing tool 100 for driving the polishing tool 100 to move along a second direction, the second direction being perpendicular to the first direction.

[0115] In this technical solution, the polishing equipment may also include a third driving device, which is used to drive the aforementioned polishing tool 100 to move along the second direction. Thus, during the polishing process, the polishing tool 100 can be further translated relative to the workpiece to be polished, based on its rotation relative to the workpiece to be polished. This further expands the effective range of the polishing tool 100, making it easier to further improve polishing efficiency. It also facilitates the brush bristles 120 to contact different positions of the workpiece to be polished, thereby providing further assurance for the polishing effect.

[0116] It is understood that the aforementioned second direction can be a direction parallel to the aforementioned loading platform; the aforementioned third driving device may include a second motor, a lead screw and a slider. The aforementioned second motor is connected to the aforementioned lead screw and is used to drive the aforementioned lead screw to rotate. The lead screw is arranged along the aforementioned second direction. The aforementioned slider is movably connected to the aforementioned lead screw. The brush 110 of the polishing device 100 is connected to the aforementioned slider. Thus, when the second motor is running, the lead screw can drive the slider to move along the second direction, and the polishing device 100 can move along the second direction at the same time.

[0117] It is understandable that when there are multiple polishing tools 100, there can also be multiple third driving devices, so that each polishing tool 100 corresponds to one third driving device.

[0118] like Figure 4 As shown, in some feasible examples, the aforementioned polishing equipment may also include a separation device 800, which is disposed on the aforementioned frame 200 for absorbing the used polishing agent.

[0119] Furthermore, since the polishing apparatus provided in the second aspect of the present application includes the polishing tool 100 provided in any of the first aspects described above, it possesses all the beneficial effects of the polishing tool 100, which will not be elaborated here.

[0120] like Figure 5 As shown, a third aspect of the embodiments of this application provides a method for back-polishing a microcrystalline material cover plate, used in the microcrystalline material cover plate polishing equipment as described in any of the second aspects above, comprising:

[0121] Step S301: When the aforementioned loading device is loaded with the aforementioned workpiece to be polished, control the aforementioned polishing tool 100 to move closer to the aforementioned loading device so that the aforementioned working end 1202 abuts against the aforementioned workpiece to be polished, the aforementioned workpiece to be polished is a tempered microcrystalline material cover plate.

[0122] Specifically, the workpiece to be polished can be a tempered microcrystalline material cover plate. It is understood that after tempering, a layer of oxide typically forms on the surface of the microcrystalline material cover plate. This oxide layer can negatively affect the properties of the cover plate, such as causing it to turn white due to high temperature and humidity, or causing the coating to peel off. Therefore, the oxide layer can be removed by re-polishing the workpiece. Correspondingly, when the loading device is loaded with the workpiece, the polishing tool 100 can be controlled to move closer to the loading device so that the working end 1202 comes into contact with the workpiece. For example, the first driving device 400 can be controlled to move the polishing tool 100 closer to the loading device. When the working end 1202 of the polishing tool 100 contacts the workpiece, a contact force is formed between the bristles 120 and the workpiece. The contact force can be controlled by adjusting the output parameters of the first driving device 400, thereby ensuring the polishing effect and efficiency.

[0123] Step S302: Control the aforementioned polishing tool 100 to rotate in order to polish the aforementioned workpiece to be polished.

[0124] Specifically, when the aforementioned working end 1202 abuts against the aforementioned workpiece to be polished, the polishing tool 100 can be further controlled to rotate so as to use the bristles 120 to grind the surface of the workpiece to be polished. For example, the second drive device 500 can be controlled to run to drive the polishing tool 100 to rotate, thereby removing the oxide layer on the surface of the workpiece to be polished. This is beneficial to further improve the strength of the workpiece to be polished through polishing, improve product characteristics, and further improve the production yield.

[0125] In summary, the re-polishing method for microcrystalline material cover plates provided in this application embodiment can be used to re-polish tempered microcrystalline material cover plates using the aforementioned polishing tool 100 to remove the oxide layer on the surface of the workpiece, improve the strength and properties of the workpiece, and based on the aforementioned polishing tool 100, the possibility of workpiece scratches during the re-polishing process can also be reduced, and the re-polishing efficiency and effect can be improved, which is conducive to further improving production efficiency and reducing production costs.

[0126] In some examples, controlling the aforementioned polishing apparatus 100 to rotate in order to polish the aforementioned workpiece to be polished includes:

[0127] The aforementioned polishing tool 100 is controlled to rotate at a preset speed, which is greater than or equal to 80 rpm and less than or equal to 90 rpm.

[0128] When the aforementioned polishing instrument 100 rotates at the aforementioned preset speed for a preset duration, the aforementioned polishing instrument 100 is controlled to stop rotating, and the aforementioned preset duration is greater than or equal to 3 minutes and less than or equal to 6 minutes.

[0129] Specifically, during the process of controlling the rotation of the aforementioned polishing instrument 100 to polish the aforementioned workpiece, the polishing instrument 100 can be controlled to rotate at the aforementioned preset speed. This avoids excessively high rotation speed, which helps improve the grinding uniformity during repolishing, thereby ensuring the surface quality of the workpiece after repolishing and improving the removal effect of the aforementioned oxide layer. On the other hand, it also avoids excessively low rotation speed, which increases the grinding amount per unit time during repolishing and helps ensure repolishing efficiency. After the aforementioned polishing instrument 100 has rotated at the aforementioned preset speed for a preset time, the aforementioned polishing instrument 100 can be further controlled to stop rotating to complete the repolishing process of the workpiece. Based on the aforementioned preset time limit, while ensuring the oxide layer removal effect, it can avoid over-grinding of the workpiece, which helps to further ensure the strength and surface quality of the workpiece after repolishing, improve the production yield, and reduce the repolishing time, thereby further improving the repolishing efficiency.

[0130] For example, the aforementioned preset duration can be 3 min, 3.5 min, 4 min, 4.5 min, 5 min, 5.5 min, or 6 min, etc.

[0131] In this invention, the terms "first," "second," and "third" are used for descriptive purposes only and should not be construed as indicating or implying relative importance; the term "multiple" refers to two or more unless otherwise explicitly defined. The terms "install," "connect," "link," and "fix" should be interpreted broadly. For example, "connect" can be a fixed connection, a detachable connection, or an integral connection; "link" can be a direct connection or an indirect connection through an intermediate medium. Those skilled in the art can understand the specific meaning of the above terms in this invention according to the specific circumstances.

[0132] In the description of this invention, it should be understood that the terms "upper," "lower," "left," "right," "front," "rear," etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing this invention and simplifying the description, and do not indicate or imply that the device or unit referred to must have a specific orientation or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this invention.

[0133] In the description of this specification, the terms "one embodiment," "some embodiments," "specific embodiment," etc., refer to a specific feature, structure, material, or characteristic described in connection with that embodiment or example, which is included in at least one embodiment or example of the present invention. In this specification, the illustrative expressions of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in one or more embodiments or examples.

[0134] The above are merely preferred embodiments of the present invention and are not intended to limit the present invention. Various modifications and variations can be made to the present invention by those skilled in the art. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the present invention should be included within the scope of protection of the present invention.

Claims

1. A polishing tool for a microcrystalline material cover plate, characterized in that, include: The brush plate forms an installation side; Multiple bristles are formed with a connecting end and a working end, the connecting end being disposed on the mounting side, and the material of the bristles includes polyurethane; Wherein, along the direction from the connecting end to the working end, the cross-sectional area of ​​the bristles decreases; The bristles include: The main body segment, wherein the connecting end is formed in the main body segment; A working section is connected to the end of the main body section away from the brush plate, and the working end is formed in the working section; wherein, the working section has a pointed structure, and the pointed corner of the working section is away from the main body section; A transition section is connected to the end of the main body section away from the brush disk. The working section is connected to the main body section through the transition section. Both the main body section and the working section transition smoothly with the transition section. In the longitudinal section of the bristles, the outline of the main body segment includes a first straight line segment, the outline of the working segment includes a second straight line segment, and the outline of the transition segment includes an arc segment, the two ends of which are tangent to the first straight line segment and the second straight line segment, respectively. The first straight segments of the adjacent bristles are arranged adjacent to each other.

2. The microcrystalline material cover plate polishing tool according to claim 1, characterized in that, The bristles are arranged in a circular array around the axis of the brush disc.

3. The microcrystalline material cover plate polishing tool according to claim 2, characterized in that, The ring array has multiple rings, with the bristles in the same ring arranged adjacent to each other, and the bristles in two adjacent rings arranged adjacent to each other.

4. The polishing tool for microcrystalline material cover plates according to any one of claims 1 to 3, characterized in that, The material of the brush bristles also includes cotton.

5. The polishing tool for microcrystalline material cover plates according to any one of claims 1 to 3, characterized in that, The bristles have a Shore hardness greater than or equal to 60HC and less than or equal to 64HC.

6. The polishing tool for microcrystalline material cover plates according to any one of claims 1 to 3, characterized in that, The length of the bristles is greater than or equal to 20 mm and less than or equal to 30 mm; and / or The width and thickness of the bristles are both greater than or equal to 2 mm and less than or equal to 5 mm.

7. The polishing tool for microcrystalline material cover plates according to any one of claims 1 to 3, characterized in that, The diameter of the brush disk is greater than or equal to 600 mm and less than or equal to 900 mm.

8. The polishing tool for microcrystalline material cover plates according to any one of claims 1 to 3, characterized in that, The brush plate is made of plastic material.

9. A polishing device for microcrystalline material cover plates, characterized in that, include: frame; The base is rotatably mounted on the frame; Multiple loading devices are disposed on the base, and the loading devices are used to load the workpieces to be polished; The microcrystalline material cover plate polishing tool as described in any one of claims 1 to 8 is movably disposed on the frame, with the working end facing the loading device; A first driving device is connected to the polishing tool and is used to drive the polishing tool to move along a first direction so that the polishing tool moves closer to or away from the loading device. The second driving device is connected to the polishing tool and is used to drive the polishing tool to rotate.

10. The microcrystalline material cover plate polishing equipment according to claim 9, characterized in that, Also includes: A liquid storage device for storing polishing agent; An infusion device is provided, wherein the brush plate has multiple infusion holes, one end of each infusion hole is located on the mounting side, one end of the infusion device is connected to the liquid storage device, and the other end is connected to the infusion hole.

11. The microcrystalline material cover plate polishing equipment according to claim 9, characterized in that, Also includes: A third driving device is connected to the polishing tool and is used to drive the polishing tool to move along a second direction, which is perpendicular to the first direction.

12. A method for re-polishing a microcrystalline material cover plate, used in the microcrystalline material cover plate polishing equipment as described in any one of claims 9 to 11, comprising: When the loading device is loaded with the workpiece to be polished, the polishing tool is controlled to move closer to the loading device so that the working end abuts against the workpiece to be polished, wherein the workpiece to be polished is a tempered microcrystalline material cover plate. The polishing tool is controlled to rotate in order to polish the workpiece to be polished.

13. The method for re-polishing a microcrystalline material cover plate according to claim 12, characterized in that, The control of the polishing tool to rotate in order to polish the workpiece includes: The polishing tool is controlled to rotate at a preset speed, which is greater than or equal to 80 rpm and less than or equal to 90 rpm. When the polishing tool rotates at the preset speed for a preset time, the polishing tool is controlled to stop rotating. The preset time is greater than or equal to 3 minutes and less than or equal to 6 minutes.

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