A non-contact zoom three-dimensional vibration sensor system

Abstract

The present invention discloses a non-contact zoom three-dimensional vibration measurement sensor system. The present invention uses a fourth optical chip measurement module to emit a laser that coincides with the central axis to the vibrating object being measured to measure the distance between the vibrating object being measured and the target surface. A driving mechanism is used to drive the first optical chip measurement module, the second optical chip measurement module, and the third optical chip measurement module to move synchronously, so that the lasers emitted by the four optical chip measurement modules converge at the same point on the vibrating object being measured to achieve zoom measurement, and calculate the three-dimensional vibration value of the vibrating object being measured based on the laser reflected by the vibrating object being measured. The present invention can be adjusted according to the distance of the vibrating object being measured to achieve measurement of vibrating objects at different distances, thereby widening its measurement range and making the measurement range unconstrained by distance. At the same time, it has the advantages of simple structure, easy operation, low cost, and effectively guarantees measurement accuracy.

Description

Technical Field

[0001] The present invention relates to the field of vibration measurement technology, in particular to a non-contact zoom three-dimensional vibration measurement sensor system. Background Art

[0002] The principle of the frequency modulated continuous wave (FMCW) ranging method is to send a continuous signal with a certain bandwidth and linear frequency variation, then perform a fast Fourier transform on the received continuous signal, calculate the time difference between the two signals by the frequency difference between the transmitted and received signals, and finally obtain the corresponding distance value from the time difference. The FMCW method is based on the coherence principle and has strong anti-interference and high signal-to-noise ratio advantages, which has attracted widespread attention. Due to its high-precision measurement, it has begun to be widely used to measure the vibration of vibrating objects, thereby obtaining the acceleration value of the measured object. However, most existing three-dimensional vibration measurement systems based on the FMCW method have complex structures and high costs. Summary of the Invention

[0003] Therefore, the technical problem to be solved by the present invention is to provide a non-contact zoom three-dimensional vibration measurement sensor system with reasonable structure, simple operation and low cost.

[0004] To solve the above technical problems, the present invention provides a non-contact zoom three-dimensional vibration measurement sensor system, which includes:

[0005] a first optical chip measurement module, a second optical chip measurement module, a third optical chip measurement module, and a fourth optical chip measurement module, wherein the first optical chip measurement module, the second optical chip measurement module, and the third optical chip measurement module are arranged in a triangle; a circle determined by the first optical chip measurement module, the second optical chip measurement module, and the third optical chip measurement module is recorded as a target circle; a surface on which the target circle is located is recorded as a target surface; and an axis passing through the center of the target circle and perpendicular to the target surface is recorded as a central axis;

[0006] The fourth optical chip measurement module is used to emit a laser that coincides with the central axis toward the vibrating object to be measured so as to measure the distance from the vibrating object to the target surface;

[0007] A drive assembly is connected to the first optical chip measurement module, the second optical chip measurement module, and the third optical chip measurement module. The drive assembly is used to drive the first optical chip measurement module, the second optical chip measurement module, and the third optical chip measurement module to move synchronously according to the distance between the vibrating object under measurement and the target surface, so that the lasers emitted by the first optical chip measurement module, the second optical chip measurement module, and the third optical chip measurement module and the laser emitted by the fourth optical chip measurement module converge at the same point on the vibrating object under measurement at different distances, thereby realizing variable focus measurement. The first optical chip measurement module, the second optical chip measurement module, and the third optical chip measurement module are used to calculate the three-dimensional vibration value of the vibrating object under measurement based on the laser reflected by the vibrating object under measurement.

[0008] In one embodiment of the present invention, the first optical chip measurement module, the second optical chip measurement module, and the third optical chip measurement module are arranged in an equilateral triangle, and the fourth optical chip measurement module is located at the center of the target circle.

[0009] In one embodiment of the present invention, the angles between the first optical chip measurement module, the second optical chip measurement module, and the third optical chip measurement module and the central axis are θ, and the distance between the vibrating object to be measured and the target surface is d. The projection of the laser emitted by the first optical chip measurement module on the XY plane is aligned with the X axis, and the central axis is aligned with the Z axis. The angles between the laser emitted by the first optical chip measurement module, the second optical chip measurement module, and the third optical chip measurement module and the X, Y, and Z axes, respectively, are obtained as follows:

[0010] θ x1 =π / 2-θ,θ y1 =π / 2,θ z1 =θ,

[0011]

[0012]

[0013] θ=arctan(r / d)

[0014] Where r is the distance from the first optical chip measurement module, the second optical chip measurement module, and the third optical chip measurement module to the central axis, θ x1 ,θ y1 ,θ z1 are the angles between the laser emitted by the first optical chip measurement module and the X-axis, Y-axis, and Z-axis, θ x2 ,θ y2 ,θ z2 are the angles between the laser emitted by the second optical chip measurement module and the X-axis, Y-axis, and Z-axis, θ x3 ,θ y3 ,θz3 are the angles between the laser emitted by the third optical chip measurement module and the X-axis, Y-axis, and Z-axis respectively;

[0015] The three-dimensional vibration value of the vibrating object being measured is calculated using the following formula:

[0016] d1=v x cos(θ x1 )+v y cos(θ y1 )+v z cos(θ z1 )

[0017] d2=v x cos(θ x2 )+v y cos(θ y2 )+v z cos(θ z2 )

[0018] d3=v x cos(θ x3 )+v y cos(θ y3 )+v z cos(θ z3 )

[0019] Wherein, d1, d2, and d3 are the displacement values ​​of the vibrating object measured along their respective laser directions, respectively, obtained by the first optical chip measurement module, the second optical chip measurement module, and the third optical chip measurement module; v x 、v y 、v z They measure the three-dimensional vibration values ​​of the vibrating object along the X, Y, and Z axes respectively.

[0020] In one embodiment of the present invention, a retaining frame is further included, on which three mounting seats are provided. The first optical chip measurement module, the second optical chip measurement module, and the third optical chip measurement module are rotatably connected to corresponding mounting seats via rotating shafts, respectively. The driving assembly is used to drive the first optical chip measurement module, the second optical chip measurement module, and the third optical chip measurement module to rotate synchronously along the corresponding rotating shafts.

[0021] In one embodiment of the present invention, the driving assembly includes a motor, a screw, a slider, and three connecting rods. The motor is connected to the screw, and the slider is threadedly connected to the screw. The slider is respectively connected to the first optical chip measurement module, the second optical chip measurement module, and the third optical chip measurement module through the three connecting rods. The motor can drive the screw to rotate, and the rotation of the screw drives the slider to move axially along the screw. The slider drives the first optical chip measurement module, the second optical chip measurement module, and the third optical chip measurement module to rotate synchronously along the corresponding rotating shaft through the connecting rod.

[0022] In one embodiment of the present invention, the retaining frame is circular or equilateral triangle.

[0023] In one embodiment of the present invention, the first optical chip measurement module, the second optical chip measurement module, and the third optical chip measurement module have the same structure. The first optical chip measurement module, the second optical chip measurement module, and the third optical chip measurement module each include a measurement laser emission source and a guide laser emission source. The measurement laser emission source is used to emit invisible laser as the measurement laser, and the guide laser emission source is used to emit visible laser as the guide laser. The guide laser is used to focus the measurement laser.

[0024] In one embodiment of the present invention, the first optical chip measurement module, the second optical chip measurement module, and the third optical chip measurement module each further include a PLC chip, a wavelength division multiplexer, and a photodetector;

[0025] The wavelength division multiplexer is used to merge the lasers emitted by the measuring laser emission source and the guiding laser emission source through the PLC chip to form an optical carrier and emit them outward together, so as to achieve coaxiality of the measuring laser and the guiding laser;

[0026] The wavelength division multiplexer is used to separate the optical carriers of the reflected measurement laser and the guide laser. The separated measurement laser reaches the PLC chip and interferes with the measurement laser emitted by the measurement laser emission source and incident on the PLC chip, and then reaches the photoelectric detector to calculate the three-dimensional vibration value of the vibrating object being measured.

[0027] In one embodiment of the present invention, the first optical chip measurement module, the second optical chip measurement module, and the third optical chip measurement module all further include a collimating lens. The collimating lens is movable to guide the laser to focus on the vibrating object to be measured, thereby achieving focusing of the measurement laser.

[0028] In one embodiment of the present invention, the pilot laser emission source may be turned off after focusing the measurement laser.

[0029] The above technical solution of the present invention has the following advantages over the prior art:

[0030] The non-contact variable-zoom three-dimensional vibration sensor system of the present invention utilizes a fourth optical chip measurement module to emit a laser beam that coincides with the central axis toward the vibrating object being measured to measure the distance from the vibrating object to the target surface. A driving mechanism is utilized to drive the first, second, and third optical chip measurement modules to move synchronously, so that the laser beams emitted by the first, second, and third optical chip measurement modules and the laser beam emitted by the fourth optical chip measurement module converge at the same point on the vibrating object being measured, thereby achieving variable-zoom measurement and calculating the three-dimensional vibration value of the vibrating object being measured based on the laser beam reflected by the vibrating object being measured. The non-contact variable-zoom three-dimensional vibration sensor system of the present invention can be adjusted according to the distance of the vibrating object being measured, enabling measurement of vibrating objects at different distances, thereby broadening its measurement range and making the measurement range unconstrained by distance. Furthermore, the system has the advantages of simple structure, convenient operation, and low cost, while effectively ensuring measurement accuracy.

[0031] The above description is only an overview of the technical solution of the present invention. In order to more clearly understand the technical means of the present invention, it can be implemented in accordance with the contents of the specification. In order to make the above and other purposes, features and advantages of the present invention more obvious and easy to understand, the following preferred embodiments are specifically cited and described in detail with reference to the accompanying drawings. BRIEF DESCRIPTION OF THE DRAWINGS

[0032] In order to make the contents of the present invention more clearly understood, the present invention is further described in detail below based on specific embodiments of the present invention in conjunction with the accompanying drawings.

[0033] Figure 1 1 is a structural diagram of a non-contact zoom three-dimensional vibration measurement sensor system according to an embodiment of the present invention;

[0034] Figure 2 2 is a vibration measurement principle diagram of a non-contact zoom three-dimensional vibration measurement sensor system according to an embodiment of the present invention;

[0035] Figure 3 4 is a schematic diagram of a first optical chip measurement module in an embodiment of the present invention.

[0036] Marking Description:

[0037] 1. Motor; 2. Screw; 3. Slider; 4. Connecting rod; 5. Mounting seat; 61. First optical chip measurement module; 62. Second optical chip measurement module; 63. Third optical chip measurement module; 64. Fourth optical chip measurement module; 7. Rotating shaft; 8. Retaining frame; 9. Measuring laser emission source; 10. Guiding laser emission source; 11. PLC chip; 12. Wavelength division multiplexer; 13. Collimating lens; 14. Photodetector. DETAILED DESCRIPTION

[0038] The present invention will be further described below with reference to the accompanying drawings and specific embodiments so that those skilled in the art can better understand the present invention and implement it. However, the embodiments are not intended to limit the present invention.

[0039] Example 1

[0040] Reference Figure 1-2 As shown, this embodiment discloses a non-contact zoom three-dimensional vibration measurement sensor system, which includes a first optical chip measurement module 61, a second optical chip measurement module 62, a third optical chip measurement module 63, a fourth optical chip measurement module 64 and a driving component.

[0041] The first optical chip measurement module 61, the second optical chip measurement module 62, and the third optical chip measurement module 63 are arranged in a triangle. The circle determined by the first optical chip measurement module 61, the second optical chip measurement module 62, and the third optical chip measurement module 63 is recorded as the target circle, the surface where the target circle is located is recorded as the target surface, and the axis passing through the center of the target circle and perpendicular to the target surface is recorded as the central axis.

[0042] The fourth optical chip measurement module 64 is used to emit a laser beam that coincides with the central axis toward the vibrating object to be measured so as to measure the distance between the vibrating object to be measured and the target surface.

[0043] The driving component is connected to the first optical chip measurement module 61, the second optical chip measurement module 62, and the third optical chip measurement module 63. The driving component is used to drive the first optical chip measurement module 61, the second optical chip measurement module 62, and the third optical chip measurement module 63 to move synchronously according to the distance between the vibrating object to be measured and the target surface, so that the lasers emitted by the first optical chip measurement module 61, the second optical chip measurement module 62, and the third optical chip measurement module 63 and the laser emitted by the fourth optical chip measurement module 64 converge at the same point on the vibrating object to be measured at different distances, so as to achieve variable focus measurement. The first optical chip measurement module 61, the second optical chip measurement module 62, and the third optical chip measurement module are used to calculate the three-dimensional vibration value of the vibrating object to be measured based on the laser reflected by the vibrating object to be measured.

[0044] The non-contact variable-zoom three-dimensional vibration sensor system of the present invention utilizes a fourth optical chip measurement module to emit a laser beam that coincides with the central axis toward the vibrating object being measured to measure the distance from the vibrating object to the target surface. A driving mechanism is utilized to drive the first, second, and third optical chip measurement modules to move synchronously, so that the laser beams emitted by the first, second, and third optical chip measurement modules and the laser beam emitted by the fourth optical chip measurement module converge at the same point on the vibrating object being measured, thereby achieving variable-zoom measurement and calculating the three-dimensional vibration value of the vibrating object being measured based on the laser beam reflected by the vibrating object being measured. The non-contact variable-zoom three-dimensional vibration sensor system of the present invention can be adjusted according to the distance of the vibrating object being measured, enabling measurement of vibrating objects at different distances, thereby broadening its measurement range and making the measurement range unconstrained by distance. Furthermore, the system has the advantages of simple structure, convenient operation, and low cost, while effectively ensuring measurement accuracy.

[0045] To facilitate calculation, preferably, the first optical chip measurement module 61 , the second optical chip measurement module 62 and the third optical chip measurement module 63 are arranged in an equilateral triangle, and the fourth optical chip measurement module 64 is located at the center of the target circle.

[0046] Reference Figure 2 The angles between the first optical chip measurement module 61, the second optical chip measurement module 62, and the third optical chip measurement module 63 and the central axis are θ, and the distance between the measured vibrating object and the target surface is d. The projection of the laser emitted by the first optical chip measurement module 61 on the XY plane is aligned with the X axis, and the central axis is aligned with the Z axis. The angles between the laser emitted by the first optical chip measurement module 61, the second optical chip measurement module 62, and the third optical chip measurement module 63 and the X, Y, and Z axes are as follows:

[0047] θ x1 =π / 2-θ,θ y1 =π / 2,θ z1 =θ,

[0048]

[0049]

[0050] θ=arctan(r / d)

[0051] Wherein, r is the distance from the first optical chip measurement module 61, the second optical chip measurement module 62, and the third optical chip measurement module 63 to the central axis, θ x1 ,θ y1 ,θ z1 are the angles between the laser emitted by the first optical chip measurement module 61 and the X-axis, Y-axis, and Z-axis, θ x2 ,θ y2,θ z2 are the angles between the laser emitted by the second optical chip measurement module 62 and the X-axis, Y-axis, and Z-axis, θ x3 ,θ y3 ,θ z3 are the angles between the laser emitted by the third optical chip measurement module 63 and the X-axis, Y-axis, and Z-axis respectively;

[0052] The three-dimensional vibration value of the vibrating object being measured is calculated using the following formula:

[0053] d1=v x cos(θ x1 )+v y cos(θ y1 )+v z cos(θ z1 )

[0054] d2=v x cos(θ x2 )+v y cos(θ y2 )+v z cos(θ z2 )

[0055] d3=v x cos(θ x3 )+v y cos(θ y3 )+v z cos(θ z3 )

[0056] Wherein, d1, d2, and d3 are the displacement values ​​of the vibrating object measured along the respective laser directions obtained by the first optical chip measurement module 636, the second optical chip measurement module 62, and the third optical chip measurement module, respectively; v x 、v y 、v z They measure the three-dimensional vibration values ​​of the vibrating object along the X, Y, and Z axes respectively.

[0057] In some embodiments, the non-contact zoom three-dimensional vibration sensor system further includes a holder 8, on which three mounting seats 5 are provided. The first optical chip measurement module 61, the second optical chip measurement module 62, and the third optical chip measurement module 63 are respectively rotatably connected to the corresponding mounting seats 5 via a rotating shaft 7. The driving assembly is used to drive the first optical chip measurement module 61, the second optical chip measurement module 62, and the third optical chip measurement module 63 to rotate synchronously along the corresponding rotating shaft 7. Figure 1 Optionally, the holder 8 is in a circular or equilateral triangle shape, so that the first optical chip measurement module 61 , the second optical chip measurement module 62 , and the third optical chip measurement module 63 can form an equilateral triangle on the holder.

[0058] In one embodiment, the drive assembly includes a motor 1, a screw rod 2, a slider 3, and three connecting rods 4. The motor 1 is connected to the screw rod 2, and the slider 3 is threadedly connected to the screw rod 2. The slider 3 is respectively connected to the first optical chip measurement module 61, the second optical chip measurement module 62, and the third optical chip measurement module 63 via the three connecting rods 4. The motor 1 drives the screw rod 2 to rotate, and the rotation of the screw rod 2 drives the slider 3 to move axially along the screw rod 2. The slider 3 drives the first optical chip measurement module 61, the second optical chip measurement module 62, and the third optical chip measurement module 63 to rotate synchronously along the corresponding rotating shaft 7 via the connecting rods 4. In other embodiments, the screw-slider linear motion mechanism described above can be replaced with other linear motion mechanisms, such as a voice coil motor, a linear motor, a cylinder, a hydraulic rod, etc.

[0059] Optionally, the first optical chip measurement module 61, the second optical chip measurement module 62, and the third optical chip measurement module 63 have the same structure. The first optical chip measurement module 61, the second optical chip measurement module 62, and the third optical chip measurement module 63 all include a measurement laser emission source 9 and a guide laser emission source 10. The measurement laser emission source 9 is used to emit invisible laser light as the measurement laser, and the guide laser emission source 10 is used to emit visible laser light as the guide laser. The guide laser is used to focus the measurement laser. Figure 3 .

[0060] In one embodiment, the first optical chip measurement module 61 , the second optical chip measurement module 62 , and the third optical chip measurement module 63 all further include a PLC chip 11 , a wavelength division multiplexer 12 , and a photodetector 14 .

[0061] The wavelength division multiplexer 12 combines the laser beams emitted by the measurement laser source 9 and the guide laser source 10, passing through the PLC chip 11, into a combined optical carrier wave, which is then emitted outwards, ensuring coaxiality between the measurement laser and the guide laser. The optical carrier wave is focused into collimated light by the collimating lens 13 and then reaches the vibrating object being measured. Due to the coaxiality of the two laser beams, the guiding laser beam from the guide laser source 10 is located at the same position as the measuring laser beam from the measurement laser source 9.

[0062] The wavelength division multiplexer 12 is also used to separate the optical carriers of the reflected measurement laser and the guide laser. The separated measurement laser reaches the PLC chip 11 and interferes with the measurement laser emitted by the measurement laser emission source 9 and incident on the PLC chip 11, and then reaches the photodetector 14 to calculate the three-dimensional vibration value of the vibrating object being measured.

[0063] Furthermore, the first optical chip measurement module 61, the second optical chip measurement module 62, and the third optical chip measurement module 63 each include a collimating lens 13. This collimating lens 13 is movable to focus the guide laser on the vibrating object being measured, thereby adjusting the focus of the measurement laser. Furthermore, the brightness of the guide laser from the guide laser emission source 10 can be adjusted to facilitate observation for measurements at different distances.

[0064] Optionally, the guide laser emission source 10 may be turned off after focusing the measurement laser to avoid light pollution of the guide laser from the guide laser emission source 10 .

[0065] Obviously, the above embodiments are merely examples for clarity of explanation and are not intended to limit the implementation methods. Those skilled in the art will appreciate that other variations or modifications can be made based on the above description. It is not necessary and impossible to enumerate all implementation methods here. Obvious variations or modifications arising therefrom remain within the scope of protection of the present invention.

Claims

1. A non-contact zoom three-dimensional vibration sensor system, characterized in that: include: a first optical chip measurement module, a second optical chip measurement module, a third optical chip measurement module, and a fourth optical chip measurement module, wherein the first optical chip measurement module, the second optical chip measurement module, and the third optical chip measurement module are arranged in a triangle; a circle determined by the first optical chip measurement module, the second optical chip measurement module, and the third optical chip measurement module is recorded as a target circle; a surface on which the target circle is located is recorded as a target surface; and an axis passing through the center of the target circle and perpendicular to the target surface is recorded as a central axis; the first optical chip measurement module, the second optical chip measurement module, and the third optical chip measurement module are arranged in an equilateral triangle, and the fourth optical chip measurement module is located at the center of the target circle; The fourth optical chip measurement module is used to emit a laser that coincides with the central axis toward the vibrating object to be measured so as to measure the distance from the vibrating object to the target surface; a drive assembly connected to the first, second, and third optical chip measurement modules, configured to drive the first, second, and third optical chip measurement modules to move synchronously based on the distance between the vibrating object being measured and the target surface, so that lasers emitted by the first, second, and third optical chip measurement modules and the laser emitted by the fourth optical chip measurement module converge at the same point on the vibrating object being measured at different distances, thereby achieving variable-focus measurement; and the first, second, and third optical chip measurement modules are configured to calculate a three-dimensional vibration value of the vibrating object being measured based on the lasers reflected by the vibrating object; The angles between the first optical chip measurement module, the second optical chip measurement module, and the third optical chip measurement module and the central axis are θ, and the distance between the measured vibrating object and the target surface is measured as d. The projection of the laser emitted by the first optical chip measurement module on the XY plane is aligned with the X axis, and the central axis is aligned with the Z axis. The angles between the laser emitted by the first optical chip measurement module, the second optical chip measurement module, and the third optical chip measurement module and the X, Y, and Z axes are obtained as follows: ； Wherein, r is the distance from the first optical chip measurement module, the second optical chip measurement module, and the third optical chip measurement module to the central axis, 、 、 are the angles between the laser emitted by the first optical chip measurement module and the X-axis, Y-axis, and Z-axis respectively. 、 、 are the angles between the laser emitted by the second optical chip measurement module and the X-axis, Y-axis, and Z-axis respectively. 、 、 are the angles between the laser emitted by the third optical chip measurement module and the X-axis, Y-axis, and Z-axis respectively; The three-dimensional vibration value of the vibrating object being measured is calculated using the following formula: ； Wherein, d1, d2, and d3 are the displacement values ​​of the vibrating object being measured along their respective laser directions, measured by the first optical chip measurement module, the second optical chip measurement module, and the third optical chip measurement module, respectively; 、 、 They measure the three-dimensional vibration values ​​of the vibrating object along the X, Y, and Z axes respectively.

2. The non-contact zoom three-dimensional vibration sensor system according to claim 1, characterized in that: The optical chip measurement module further includes a retaining frame having three mounting seats provided thereon. The first optical chip measurement module, the second optical chip measurement module, and the third optical chip measurement module are rotatably connected to corresponding mounting seats via rotating shafts, respectively. The driving assembly is used to drive the first optical chip measurement module, the second optical chip measurement module, and the third optical chip measurement module to rotate synchronously along the corresponding rotating shafts.

3. The non-contact zoom three-dimensional vibration sensor system according to claim 2, characterized in that: The driving assembly includes a motor, a screw, a slider, and three connecting rods. The motor is connected to the screw, and the slider is threadedly connected to the screw. The slider is respectively connected to the first optical chip measurement module, the second optical chip measurement module, and the third optical chip measurement module through the three connecting rods. The motor can drive the screw to rotate, and the rotation of the screw drives the slider to move axially along the screw. The slider drives the first optical chip measurement module, the second optical chip measurement module, and the third optical chip measurement module to rotate synchronously along the corresponding rotating shaft through the connecting rod.

4. The non-contact zoom three-dimensional vibration sensor system according to claim 2, characterized in that: The retaining frame is circular or equilateral triangle.

5. The non-contact zoom three-dimensional vibration sensor system according to claim 1, characterized in that: The first optical chip measurement module, the second optical chip measurement module, and the third optical chip measurement module have the same structure. They all include a measurement laser emission source and a guide laser emission source. The measurement laser emission source is used to emit invisible laser as the measurement laser, and the guide laser emission source is used to emit visible laser as the guide laser. The guide laser is used to focus the measurement laser.

6. The non-contact zoom three-dimensional vibration sensor system according to claim 5, characterized in that: The first optical chip measurement module, the second optical chip measurement module, and the third optical chip measurement module each further include a PLC chip, a wavelength division multiplexer, and a photodetector; The wavelength division multiplexer is used to merge the lasers emitted by the measuring laser emission source and the guiding laser emission source through the PLC chip to form an optical carrier and emit them outward together, so as to achieve coaxiality of the measuring laser and the guiding laser; The wavelength division multiplexer is used to separate the optical carriers of the reflected measurement laser and the guide laser. The separated measurement laser reaches the PLC chip and interferes with the measurement laser emitted by the measurement laser emission source and incident on the PLC chip, and then reaches the photoelectric detector to calculate the three-dimensional vibration value of the vibrating object being measured.

7. The non-contact zoom three-dimensional vibration sensor system according to claim 6, characterized in that: The first optical chip measurement module, the second optical chip measurement module, and the third optical chip measurement module all further include a collimating lens. The collimating lens is movable to guide the laser to focus on the vibrating object to be measured, thereby achieving focusing of the measuring laser.

8. The non-contact zoom three-dimensional vibration sensor system according to claim 5, characterized in that: The pilot laser emission source may be turned off after focusing the measurement laser.

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