An in-mold transfer printing production process for IMT and IMR products

Abstract

The application discloses a kind of for IMT product and IMR product in-mold transfer printing production process, including printing layer on transfer printing substrate;Printed transfer printing substrate is cut into sheet;Sheet hot stamping forming, hot forming sheet includes front side sheet part, front side sheet part two sides are respectively provided with the vertical side sheet part of upward bending, vertical side sheet part upper end is provided with the horizontal top sheet part of inward bending, front side sheet part two ends are respectively provided with the vertical end surface sheet part of upward bending;Hot forming sheet is placed into injection mold and injection, and hot forming sheet is adhered on injection panel;Injection panel demolding, and hot forming sheet is respectively covered on the outside of injection panel front side, two sides vertical face panel, vertical face panel upper end panel upside, two ends vertical end surface outside;Transfer printing substrate outside hot forming sheet is stripped, and printing layer is adhered on injection panel, and the full edge transfer printing layer coverage of beautiful line and bottom reverse package is realized.

Description

[Technical Field]

[0001] This invention relates to an in-mold transfer printing process for IMT and IMR products. [Background Technology]

[0002] In existing in-mold transfer (IMT) and in-mold reflow (IMR) product manufacturing processes, the transfer substrate film, after hot stamping, generally only covers the front of the injection-molded panel during in-mold injection molding. It cannot cover the outer sides of the two vertical plates of the injection-molded panel with side edging or the top side with reverse edging. Therefore, after peeling off the transfer substrate film, the transfer layer cannot adhere to and cover the outer and top sides of the two vertical plates of the injection-molded panel. Furthermore, the bottom of the product, which is aesthetically pleasing, and the bottom of the reverse edging cannot be covered. This results in the outer right-angled surfaces and top sides of the two vertical plates of the molded panel still being exposed with the base color of the injection-molded substrate, affecting the overall appearance and failing to highlight the high-end characteristics of IMT and IMR products. [Summary of the Invention]

[0003] This invention overcomes the shortcomings of the prior art and provides an in-mold transfer printing production process for IMT and IMR products, which allows the transfer layer to be adhered to the front right-angled surface, the outer surface of the two side vertical plates, the upper surface of the two side vertical plates, and the outer surface of the end vertical plate of the IMT and IMR injection molded panels after the transfer substrate is peeled off, achieving full edge coverage of the transfer layer with aesthetic lines and bottom wrapping.

[0004] To achieve the above objectives, the present invention adopts the following technical solution:

[0005] An in-mold transfer printing manufacturing process for IMT and IMR products comprises the following steps:

[0006] S1. Print a layer on the transfer substrate;

[0007] S2. Cut the printed transfer substrate into sheets;

[0008] S3. Sheet hot stamping forming, the hot-formed sheet includes a front side sheet portion, vertical side sheet portions that bend upward on both sides of the front side sheet portion, a horizontal top sheet portion that bends inward at the upper end of the vertical side sheet portion, and vertical end sheet portions that bend upward at both ends of the front side sheet portion.

[0009] S4. Place the thermoformed sheet into the injection mold and inject it. The thermoformed sheet is then bonded to the injection panel.

[0010] S5. Demolding of injection molded panel: The front side sheet, two vertical side sheet, horizontal top sheet, and vertical end sheet of thermoformed sheet cover the front side, the outer sides of the two vertical panels, the upper side of the upper panel of the vertical panel, and the outer sides of the two vertical end faces of the injection molded panel, respectively.

[0011] S6. Peel off the transfer substrate from the outside of the thermoformed sheet and adhere the printed layer to the injection-molded panel.

[0012] The in-mold transfer production process for IMT and IMR products described above is characterized by: S7, spraying a UV varnish layer onto the printed layer of the injection molded panel.

[0013] The in-mold transfer production process for IMT and IMR products described above is characterized by: further comprising S8, CNC machining of the injection molded panel.

[0014] The in-mold transfer printing process for IMT and IMR products described above is characterized in that: S1 includes...

[0015] S11, screen printing release agent layer;

[0016] S12, Silkscreened character / logo layer;

[0017] S13, Screen printing base color ink layer;

[0018] S14, screen-printed varnish anti-shock layer;

[0019] S15, Printed adhesive layer.

[0020] The in-mold transfer production process for IMT and IMR products described above is characterized in that: in S3, the sheet is hot-stamped into shape using a sheet hot stamping die.

[0021] The in-mold transfer printing process for IMT and IMR products described above is characterized in that: the sheet hot stamping die includes a lower die and an upper die; the top surface of the lower die is provided with a lower die stamping groove; a movable carrier plate for placing the transfer substrate is provided in the lower die stamping groove; a return spring is provided in the lower die stamping groove, with one end in contact with the bottom of the lower die stamping groove and the other end in contact with the carrier plate; horizontally arranged sliding grooves are provided on the left and right sides of the lower die stamping groove on the upper die; a slider is provided in the sliding groove; the slider is connected to a side pressure plate; a sliding guide groove is provided on the top surface of the slider; a punch pressure plate is provided on the bottom surface of the upper die, which cooperates with the carrier plate and presses the carrier plate and the transfer substrate into the lower die stamping groove; sliding guide protrusions are provided on both sides of the bottom surface of the upper die for inserting into the sliding guide groove to drive the slider to slide the side pressure plate into the lower die stamping groove; and punch pressure plate side pressure grooves are provided on both sides of the punch pressure plate for inserting the side pressure plate to push and bend the side of the transfer substrate with the side pressure plate.

[0022] The in-mold transfer production process for IMT and IMR products described above is characterized by: groove guide slopes that are inclined from top to bottom outward on the left and right sides of the sliding guide groove, and protrusion guide slopes that are inclined from top to bottom outward on the lower sides of the left and right sides of the sliding guide protrusion and cooperate with the groove guide slopes.

[0023] The in-mold transfer production process for IMT and IMR products described above is characterized in that: a lower mold positioning groove is provided on the top surface of the lower mold outside the lower mold stamping groove, and an upper mold positioning post is provided on the bottom surface of the upper mold corresponding to the lower mold positioning groove.

[0024] The in-mold transfer production process for IMT and IMR products described above is characterized in that: a carrier plate guide slide is provided at the bottom of the stamping groove of the lower mold, and a carrier plate recess is provided at the bottom of the carrier plate for the carrier plate guide slide to be inserted.

[0025] The in-mold transfer production process for IMT and IMR products described above is characterized in that: a spring mounting groove is provided at the bottom of the lower mold stamping groove, and a reset spring is disposed in the spring mounting groove.

[0026] The beneficial effects of this invention are:

[0027] In the sheet hot stamping process of this invention, the thermoformed sheet after hot stamping includes a front side sheet portion, two vertical side sheets bent upwards on both sides of the front side sheet portion, a horizontal top sheet bent inwards at the upper end of the vertical side sheet portion, and vertical end sheet portions bent upwards at both ends of the front side sheet portion. This allows the front side sheet portion, two vertical side sheets, a horizontal top sheet portion, and vertical end sheet portions of the formed sheet to respectively cover the front side of the injection-molded panel, the outer sides of the two vertical panels, the upper side of the upper panel of the vertical panel, and the outer sides of the two vertical end sheets after in-mold injection molding. Thus, after peeling off the transfer substrate from the outside of the formed sheet, the transfer layer adheres to the corresponding side of the injection-molded panel, achieving full coverage of the transfer pattern on the front edge, side edge, and side reverse edge of IMT and IMR products. This eliminates the defective in-mold film edge covering of IMT and IMR products, making the products more aesthetically pleasing and durable. [Image Description]

[0028] Figure 1 This is a process flow diagram of the present invention;

[0029] Figure 2 This is a schematic diagram of the sheet material structure of the present invention;

[0030] Figure 3 for Figure 2 Enlarged view of section A in the middle;

[0031] Figure 4 This is a schematic diagram of the structure of the injection-molded panel after the transfer layer has been bonded.

[0032] Figure 5 for Figure 4 Enlarged view of section B;

[0033] Figure 6 This is a schematic diagram of the sheet stamping die structure of the present invention;

[0034] Figure 7 This is a schematic diagram of the lower die structure in the sheet stamping die of the present invention;

[0035] Figure 8 This is an exploded view of the lower die in the sheet stamping die of the present invention;

[0036] Figure 9 This is a back view of the carrier plate in the sheet stamping die of the present invention;

[0037] Figure 10 This is a schematic diagram of the upper die structure in the sheet stamping die of the present invention;

[0038] Figure 11 This is a schematic diagram of the lower die in the sheet stamping die of the present invention before stamping.

[0039] Figure 12 This is a schematic diagram of the state of the lower die after stamping in the sheet stamping die of the present invention. [Detailed Implementation]

[0040] The technical solutions in the embodiments of the present invention will now be clearly and completely described in conjunction with the accompanying drawings.

[0041] It should be noted that all directional indications (such as up, down, left, right, front, back, etc.) in the embodiments of the present invention are only used to explain the relative positional relationship and movement of the components in a specific posture (as shown in the accompanying drawings). If the specific posture changes, the directional indication will also change accordingly. Furthermore, descriptions involving "preferred," "second-best," etc., in this invention are for descriptive purposes only and should not be construed as indicating or implying their relative importance or implicitly specifying the number of technical features indicated. Therefore, a feature defined as "preferred" or "second-best" may explicitly or implicitly include at least one of those features.

[0042] like Figure 1 As shown, an in-mold transfer printing manufacturing process for IMT and IMR products comprises the following steps:

[0043] S1. Print a layer on the transfer substrate to generate a transfer layer that is transferred to the IMT injection molding panel.

[0044] S2. Cut the printed transfer substrate into sheets;

[0045] S3, sheet hot stamping forming, in which the stamping process is performed with the transfer pattern layer of the sheet facing upwards, the hot-formed sheet 13 includes as follows Figure 2-3 The front side sheet portion 131 has vertical side sheet portions 132 that bend upwards on both sides, a horizontal top sheet portion 133 that bends inwards at the upper end of the vertical side sheet portion 132, and vertical end sheet portions 134 that bend upwards at both ends of the front side sheet portion 131.

[0046] S4. Place the thermoformed sheet 13 into the injection mold with the transfer pattern facing upward. During the injection molding process of the injection mold to generate the injection panel, the thermoformed sheet 13 is bonded to the injection panel by heat melting.

[0047] S5. Demolding of the injection-molded panel: The front side sheet 131, the two vertical side sheet sections 132, the horizontal top sheet section 133, and the vertical end sheet section 134 of the thermoformed sheet 13 respectively cover the front side of the injection-molded panel, the outer sides of the two vertical panels, the upper side of the upper panel of the vertical panel, and the outer sides of the two vertical end faces, thereby achieving full coverage of the front edge, side edge, and side reverse edge of the thermoformed sheet 13 on the IMT injection-molded panel product and the IMR injection-molded panel product.

[0048] S6. Peel off the transfer substrate from the outer side of the thermoformed sheet 13, and adhere the printed layer to the injection-molded panel to achieve the desired effect. Figure 4-5 The transfer layer shown is fully covered on the injection-molded panel, achieving full coverage of the transfer pattern on the front edge, side edge, and side reverse edge of IMT injection-molded panel products and IMR injection-molded panel products, making the products more beautiful and sturdy, highlighting the high-end nature of IMT injection-molded panels.

[0049] Specifically, it also includes S7, spraying a UV varnish layer onto the printed layer of the injection-molded panel to protect the transfer layer and improve the gloss of the transfer layer.

[0050] Specifically, it also includes S8, which performs CNC machining on the injection-molded panel to remove burrs and improve the overall smoothness.

[0051] Specifically, step S1 includes the following steps:

[0052] S11, screen printing release agent layer, separates the transfer substrate from the transfer layer, making it easy to peel off the transfer substrate on the injection molded panel;

[0053] S12, Silkscreened character / logo layer;

[0054] S13, Screen printing base color ink layer;

[0055] S14, Screen printing varnish anti-reflective layer, prevents ink from being washed away, can be set as a layer;

[0056] S15. Printing adhesive layer: Steps S12-14 form a transfer layer. The adhesive layer facilitates the heat fusion bonding of the transfer layer onto the injection molded panel.

[0057] like Figure 6 As shown, in this case, in step S3, the sheet is hot-stamped into shape using a sheet hot stamping die.

[0058] like Figure 6-12 As shown, the sheet hot stamping die includes a lower die 1 and an upper die 2. The top surface of the lower die 1 is provided with a lower die stamping groove 101. A movable carrier plate 3 is provided in the lower die stamping groove 101 for placing the transfer substrate. A return spring is provided in the lower die stamping groove 101, with one end in contact with the bottom of the lower die stamping groove 101 and the other end in contact with the carrier plate 3. The lower die 1 is provided with horizontally arranged sliding grooves 102 on the left and right sides of the lower die stamping groove 101. A slider 4 is provided in the sliding groove 102, and the slider 4 is connected to a side pressure plate. 5. The top surface of the slider 4 is provided with a sliding guide groove 401. The bottom surface of the upper mold 2 is provided with a punch plate 6 that cooperates with the carrier plate 3 and presses the carrier plate 3 and the transfer substrate into the stamping groove 101 of the lower mold. The bottom surfaces of the upper mold 2 are respectively provided with sliding guide protrusions 7 for inserting into the sliding guide groove 401 to make the slider 4 drive the side pressure plate 5 to slide into the stamping groove 101 of the lower mold. The sides of the punch plate 6 are respectively provided with punch plate side pressure grooves 601 for the side pressure plate 5 to be inserted and for the side edge of the transfer substrate to be pushed and bent with the side pressure plate 5. The transfer substrate is a polyester film.

[0059] In actual use, the printed and cut transfer substrate is placed on the carrier plate 3 of the lower mold 1, and the lower mold 1 is positioned as follows: Figure 11 As shown in the pre-pressing state, the upper mold 2 is pressed down, and the punch plate 6 of the upper mold 2 presses onto the carrier plate 3 of the lower mold 1, pressing the carrier plate 3 and the transfer substrate together into the lower mold pressing groove 101. During the pressing down of the upper mold 2, the sliding guide protrusion 7 on the bottom surface of the upper mold 2 is inserted into the sliding guide groove 401 of the slider 4 of the lower mold 1. The sliders 4 on both sides drive the side pressure plates 5 to slide into the lower mold pressing groove 101 respectively. At this time, the two sides of the transfer substrate bend upward to form the two vertical side plates of the injection molded panel. When the upper mold 2 drives the punch plate 6 to press down to the maximum distance, the sliders 4 on both sides drive the side pressure plates 5 to push the vertical side plates of the transfer substrate into the side pressing groove 601 of the punch plate to bend and form the upper edge of the vertical plate of the injection molded panel. The lower mold 1 is in the position shown in the figure. Figure 12 The stamped state shown is formed by stamping as follows. Figure 8-9The transfer substrate 13 of the shape shown is pressed into the lower mold stamping groove 101 by the punch plate 6 along with the carrier plate 3. The front end of the transfer substrate is bent upward to form the end face panel edge. This allows the front side panel 131, the side vertical plate 132, the upper side plate 133 set on the side vertical plate, and the end face vertical plate 134 of the stamped transfer substrate to cover the front side of the injection panel, the outer side of the two side vertical plates, the upper side of the two vertical plates, and the outer side of the two end face vertical plates during in-mold injection molding. This eliminates the problem of in-mold coating edge defects and makes the product more beautiful and firm.

[0060] like Figure 7-8 and Figure 10 As shown, the sliding guide groove 401 has groove guide slopes that are inclined outward from top to bottom on both the left and right sides. The sliding guide protrusion 7 has protrusion guide slopes 701 that are inclined outward from top to bottom on the lower sides of both the left and right sides and cooperate with the groove guide slopes. During the process of the upper mold 2 driving the sliding guide protrusion 7 to move down and insert into the sliding guide groove 401 of the slider 4 of the lower mold 1, the sliding guide protrusion 7 drives the slider 4 to slide down the lower mold punching groove 101 through the cooperation of the protrusion guide slope 701 and the groove guide slope. This causes the side pressure plate 5 to be pressed into the side pressure groove 601 of the punch pressure plate 6 of the upper mold 2, and the stamping transfer substrate is used to generate the side vertical plate 132, the upper side plate 133 set at the upper end of the side vertical plate, and the end face vertical plate 134. Similarly, during the process of the upper mold 2 driving the sliding guide protrusion 7 to move up and disengage from the sliding guide groove 401 of the slider 4 of the mold 1, the sliding guide protrusion 7 drives the slider 4 to slide outward away from the lower mold punching groove 101.

[0061] like Figure 10 As shown, the lower outer side of the sliding guide protrusion 7 is provided with an inwardly inclined guide surface 702 that is inclined from top to bottom, so that the sliding guide protrusion 7 can be inserted into the sliding guide groove 401 of the slider 4.

[0062] like Figure 7 and Figure 10 As shown, a lower mold positioning groove 103 is provided on the top surface of the lower mold 1 outside the lower mold stamping groove 101, and an upper mold positioning post 8 is provided on the bottom surface of the upper mold 2, which is aligned with the lower mold positioning groove 103, so that the punch plate 6 of the upper mold 2 can be accurately pressed down onto the carrier plate 3 of the lower mold 1 to stamp and transfer the substrate.

[0063] like Figure 7 As shown, a limiting post 9 is provided on the top surface of the lower mold 1 outside the lower mold stamping groove 101 to press against the bottom surface of the upper mold 2 and limit the maximum downward distance of the upper mold 2. When the upper mold 2 is pressed down to the maximum distance, the bottom surface of the upper mold 2 and the limiting post 9 prevent the upper mold 2 from continuing to move down and damaging the lower mold 2 and the stamped transfer substrate.

[0064] like Figure 7-8 and Figure 12 As shown, the top surface of the lower die 1 is provided with inner limiting blocks 10 on both the front and rear sides of the lower die stamping groove 101 to limit the maximum inward sliding distance of the side pressure plate 5. Specifically, three sliding grooves 102 are provided on the left and right sides of the lower die stamping groove 101. A slider 4 is provided in the sliding groove 102 and the slider 4 is connected to the side pressure plate 5. The upper ends of the two side pressure plates 5 near the upper side of the lower die stamping groove 101 and the lower ends of the two side pressure plates 5 near the lower side of the lower die stamping groove 101 are respectively provided with side pressure plate limiting recesses 501 that cooperate with the inner limiting blocks 10, so as to protect the punch pressure plate 6 and the punch pressure plate side pressure groove 601 and prevent deformation and damage caused by excessive stamping.

[0065] like Figure 7-8 and Figure 11 As shown, the top surface of the lower mold 1 is provided with outer limit blocks 11 located behind the side pressure plate 5 to limit the maximum outward sliding distance of the side pressure plate 5, so as to prevent the slider 4 from disengaging from the slide groove 102 and causing errors during secondary stamping.

[0066] like Figure 8-9 As shown, the bottom of the lower die stamping groove 101 is provided with a carrier plate guide slide rod 12, and the bottom of the carrier plate 3 is provided with a carrier plate recess 301 for the carrier plate guide slide rod 12 to be inserted. During the process of the upper die 2 pressing down the lower die 1, the punch pressure plate 6 pushes the carrier plate 3 down into the lower die stamping groove 101. At this time, the carrier plate guide slide rod 12 is inserted into the carrier plate recess 301, so that the carrier plate 3 moves along the carrier plate guide slide rod 12, so that the carrier plate 3 is uniformly subjected to stamping force.

[0067] like Figure 9 As shown, the bottom of the lower die stamping groove 101 is provided with a spring mounting groove 104. The reset spring is set in the spring mounting groove 104. After the upper die 2 moves up and separates from the lower die 1, the reset spring pushes the carrier plate 3 to move upward and reset. The spring mounting groove 104 ensures that the reset spring provides an upward reset force and prevents the reset spring from moving, thereby improving the uniform reset force of the carrier plate 3.

[0068] The above are merely preferred embodiments of the present invention and do not limit the patent scope of the present invention. All equivalent structural transformations made using the contents of the present invention's specification and drawings under the inventive concept of the present invention, or direct or indirect applications in other related technical fields, are included within the patent protection scope of the present invention.

Claims

1. An in-mold transfer printing manufacturing process for IMT and IMR products, comprising the following steps: S1. Print a layer on the transfer substrate; S2. Cut the printed transfer substrate into sheets; S3. Sheet hot stamping forming, the hot stamping forming sheet (13) includes a front side sheet portion (131), the front side sheet portion (131) has vertical side sheet portions (132) bent upward on both sides, the vertical side sheet portion (132) has a horizontal top sheet portion (133) bent inward at the upper end, and the front side sheet portion (131) has vertical end sheet portions (134) bent upward at both ends. In S3, the sheet material is hot-stamped using a sheet hot stamping die; The sheet hot stamping die includes a lower die (1) and an upper die (2). The lower die (1) has a lower die stamping groove (101) on its top surface. The lower die stamping groove (101) has a movable carrier plate (3) for placing the transfer substrate. The lower die stamping groove (101) has a return spring with one end in contact with the bottom of the lower die stamping groove (101) and the other end in contact with the carrier plate (3). The lower die (1) has horizontally arranged sliding grooves (102) on the left and right sides of the lower die stamping groove (101). The sliding grooves (102) have sliders (4) in them. The sliders (4) are connected to side pressure plates (5). The top surface of the slider (4) is provided with a sliding guide groove (401), and the bottom surface of the upper mold (2) is provided with a punch plate (6) that cooperates with the carrier plate (3) and presses the carrier plate (3) and the transfer substrate into the stamping groove (101) of the lower mold. The bottom surfaces of the upper mold (2) are respectively provided with sliding guide protrusions (7) for inserting into the sliding guide groove (401) so that the slider (4) drives the side plate (5) to slide into the stamping groove (101) of the lower mold. The sides of the punch plate (6) are respectively provided with punch plate side grooves (601) for inserting the side plate (5) so that the side of the transfer substrate is pushed and bent by the side plate (5). The sliding guide groove (401) is provided with groove guide slopes that are inclined from top to bottom and outward on both the left and right sides. The sliding guide protrusion (7) is provided with protrusion guide slopes (701) that are inclined from top to bottom and outward on the lower side of both the left and right sides and cooperate with the groove guide slopes. The lower mold (1) has a lower mold positioning groove (103) on the top surface outside the lower mold stamping groove (101), and the upper mold (2) has an upper mold positioning post (8) on the bottom surface that cooperates with the lower mold positioning groove (103). The bottom of the lower die stamping groove (101) is provided with a carrier plate guide slide rod (12), and the bottom of the carrier plate (3) is provided with a carrier plate recess (301) for the carrier plate guide slide rod (12) to be inserted. S4. Place the hot stamping sheet (13) into the injection mold and inject it. The hot stamping sheet (13) is then bonded to the injection panel. S5. Demolding of injection molded panel: The front side sheet (131), two vertical side sheet (132), horizontal top sheet (133), and vertical end sheet (134) of hot stamping sheet (13) respectively cover the front side of injection molded panel, the outer side of the two vertical panels, the upper side of the upper panel of the vertical panel, and the outer side of the two vertical end faces. S6. Peel off the transfer substrate from the outside of the hot stamping sheet (13) and adhere the printed layer to the injection molding panel.

2. The in-mold transfer printing process for IMT and IMR products according to claim 1, characterized in that: It also includes S7, which involves spraying a UV varnish layer onto the printed layer of the injection-molded panel.

3. The in-mold transfer printing process for IMT and IMR products according to claim 1 or 2, characterized in that: It also includes S8, which performs CNC machining on injection molded panels.

4. The in-mold transfer printing process for IMT and IMR products according to claim 1, characterized in that: S1 includes S1-1, Screen printing release agent layer; S1-2, Silkscreened character / logo layer; S1-3, Screen printing base color ink layer; S1-4, Screen-printed varnish anti-shock layer; S1-5, Printed adhesive layer.

5. The in-mold transfer printing production process for IMT products and IMR products according to claim 1, characterized in that: The bottom of the lower die stamping groove (101) is provided with a spring mounting groove (104), and the reset spring is set in the spring mounting groove (104).

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