Heat dissipation device and terminal device

Abstract

The present disclosure relates to a heat dissipation device and a terminal device. The heat dissipation device comprises a heated part, a heat exchange part, and a backflow part. The heated part is attached to a heat source. The heat exchange part is arranged in a spaced manner with the heated part, and a phase change space with vacuum is formed between the heated part and the heat exchange part. The backflow part is connected to the heated part and the heat exchange part. The heated part is provided with a first vibrating body which vibrates in a direction perpendicular to the heated part. The heat exchange part is provided with a second vibrating body which vibrates in a direction perpendicular to the heat exchange part. The first vibrating body and the second vibrating body accelerate the process of liquid vaporization of the heated part, increase the adsorption capacity of the capillary structure of the heat exchange part, accelerate the backflow speed of the heat dissipation medium of the heat exchange part to the heated part, and effectively increase the heat exchange speed, thereby achieving energy saving.

Description

Technical Field

[0001] This disclosure relates to the field of heat dissipation in terminal devices, and more particularly to a heat dissipation device and a terminal device. Background Technology

[0002] As terminal devices evolve towards higher frequencies and smaller sizes, the power of electronic components increases, leading to a continuous increase in heat generation per unit area. During user operation, as temperatures rise, the performance of these electronic components significantly degrades, causing instability and severely impacting system reliability, resulting in a drastically reduced user experience. This necessitates more advanced heat dissipation technologies to ensure optimal performance. Summary of the Invention

[0003] To overcome the problems existing in the related technologies, this disclosure provides a heat dissipation device and a terminal device.

[0004] According to a first aspect of the present disclosure, a heat dissipation device is provided, characterized in that the heat dissipation device includes: a heat receiving part, which is in contact with a heat source; a heat exchange part, which is spaced apart from the heat receiving part, and a vacuum phase change space is formed between the heat receiving part and the heat exchange part; and a reflux part, which connects the heat receiving part and the heat exchange part; wherein the heat receiving part is provided with a first vibrating body, which vibrates in a direction perpendicular to the heat receiving part; and / or the heat exchange part is provided with a second vibrating body, which vibrates in a direction perpendicular to the heat exchange part.

[0005] In some embodiments, the first vibrator and / or the second vibrator comprises a piezoelectric material; the piezoelectric material receives a driving signal, and the first vibrator and / or the second vibrator vibrates based on the driving signal.

[0006] In some embodiments, the heated portion and the heat exchange portion are plate-shaped structures and are parallel to each other; the reflux portion is disposed at the edge of the heated portion and the edge of the heat exchange portion and is perpendicularly connected to the heated portion and the heat exchange portion.

[0007] In some embodiments, the first vibrator is disposed on the side of the heated portion close to the heat source; and / or the second vibrator is disposed on the side of the heat exchange portion away from the heat source.

[0008] In some embodiments, the vibration directions of the first vibrator and the second vibrator are the same.

[0009] In some embodiments, the heat dissipation device has a cross-section in the shape of a U-shape; and / or the longitudinal section of the heat dissipation device has a U-shape.

[0010] In some embodiments, the heated portion, the heat exchange portion, and the reflux portion are composed of capillary structures filled with a heat dissipation medium.

[0011] In some embodiments, the heat source is in the form of a panel.

[0012] According to a second aspect of the present disclosure, a terminal device is provided, comprising: a heat dissipation device as described in the first aspect; and a driving device electrically connected to the first vibrator and the second vibrator, and driving the first vibrator and the second vibrator to vibrate simultaneously.

[0013] In some embodiments, the driving device includes a signal generating device for emitting a periodic excitation signal; the first vibrator and the second vibrator determine the frequency and direction of vibration based on the frequency of the excitation signal.

[0014] In some embodiments, the excitation signal includes a first excitation signal and a second excitation signal; the signal generating device emits the first excitation signal and the second excitation signal; the driving device further includes: a first excitation line electrically connected to the signal generating device and the first vibrating body, for transmitting the first excitation signal to the first vibrating body; and a second excitation line electrically connected to the signal generating device and the second vibrating body, for transmitting the second excitation signal to the second vibrating body; wherein the first excitation signal and the second excitation signal have the same frequency but opposite phase.

[0015] In some embodiments, the driving device further includes a manual setting device for manually setting the frequency of the excitation signal and adjusting the frequency of the excitation signal emitted by the signal generating device.

[0016] In some embodiments, the driving device further includes a temperature sensor placed at the heat source and electrically connected to the signal generating device; wherein the temperature sensor acquires a temperature signal and transmits it to the signal generating device, and the signal generating device adjusts the frequency of the excitation signal based on the temperature signal.

[0017] The technical solutions provided by the embodiments of this disclosure can include the following beneficial effects: By respectively providing a first vibrating body and a second vibrating body at the heated part and the heat exchange part of the heat dissipation device, the first vibrating body and the second vibrating body vibrate in a direction perpendicular to the heated part and the heat exchange part during the operation of the heat dissipation device. When the heated part moves upward, the heat exchange part also moves upward, which not only accelerates the vaporization process of the liquid in the heated part, but also increases the adsorption capacity of the capillary structure of the heat exchange part; when the heated part moves downward, the heat exchange part also moves downward, which accelerates the return flow rate of the heat dissipation medium from the heat exchange part to the heated part, thus effectively increasing the heat exchange speed and achieving energy saving.

[0018] It should be understood that the above general description and the following detailed description are exemplary and explanatory only, and are not intended to limit this disclosure. Attached Figure Description

[0019] The accompanying drawings, which are incorporated in and form a part of this specification, illustrate embodiments consistent with this disclosure and, together with the description, serve to explain the principles of this disclosure.

[0020] Figure 1 This is a schematic diagram of a heat dissipation device according to an exemplary embodiment 1.

[0021] Figure 2 This is a schematic diagram of a heat dissipation device according to an exemplary embodiment 2.

[0022] Figure 3 This is a schematic diagram of a heat dissipation device according to Exemplary Example 3.

[0023] Figure 4 This is a schematic diagram of a tubular structure of a reflux section in a heat dissipation device according to an exemplary embodiment.

[0024] Figure 5 This is a diagram illustrating the driving device and the excitation signals of the upper and lower piezoelectric materials according to an exemplary embodiment.

[0025] Figure 6 This is a schematic diagram of the frequency and phase of the first excitation signal.

[0026] Figure 7 This is a schematic diagram showing the frequency and phase of the second excitation signal.

[0027] Figure 8 This is a schematic diagram illustrating the connection of a heat dissipation device to a drive power supply signal according to an exemplary embodiment.

[0028] Figure 9 This is a block diagram illustrating an apparatus according to an exemplary embodiment. Detailed Implementation

[0029] Exemplary embodiments will now be described in detail, examples of which are illustrated in the accompanying drawings. When the following description relates to the drawings, unless otherwise indicated, the same numerals in different drawings denote the same or similar elements. The embodiments described in the following exemplary embodiments do not represent all embodiments consistent with this disclosure. Rather, they are merely examples of apparatuses and methods consistent with some aspects of this disclosure as detailed in the appended claims.

[0030] To address the increasing heat generation per unit area caused by the ever-growing frequency and miniaturization of electronic components in terminal devices, VC (Vapor Chambers) are employed. The bottom surface of a VC vapor chamber needs to be larger than the heat source. This allows the VC vapor chamber to distribute heat evenly across the entire surface, which is then dissipated through the heat sink. Furthermore, the VC vapor chamber utilizes a vacuum chamber structure, leveraging the principles of phase change and capillary adhesion for heat dissipation. The VC vapor chamber rapidly disperses heat concentrated at the heat source onto the vapor chamber, reducing the temperature at the heat source through thermal radiation.

[0031] However, in related technologies, VC vapor chamber heat exchangers primarily rely on three driving forces for heat transfer: liquid vaporization, capillary action, and gravity. All of these are passive heat dissipation methods. Evaporative heat transfer has small capillary and boiling limits, and the condensation and reflux rate of the phase change heat exchange medium relies solely on capillary force and gravity, resulting in a slow reflux rate. This leads to a low number of phase change cycles and a relatively simple circulation pattern, thus affecting the actual heat transfer performance of the vapor chamber heat exchanger and making it difficult to meet the current heat dissipation requirements of terminal equipment.

[0032] Therefore, to solve the above-mentioned technical problems, this disclosure provides a novel vacuum cavity heat dissipation device 100, which is applied to a terminal device. The terminal device can be a mobile phone, computer, digital broadcasting terminal, messaging device, game console, tablet device, medical device, fitness equipment, personal digital assistant, translator, watch, bracelet, or other wearable device. In this disclosure, a mobile phone will be used as an example for illustration.

[0033] like Figures 1 to 3 As shown, the heat dissipation device 100 includes a heating section 10, a heat exchange section 20, and a return section 30. Furthermore, the heat dissipation device 100 is provided with a housing, which includes an upper housing 61 and a lower housing 62.

[0034] The upper housing 61 is located at the heat exchange section 20, and the lower housing 62 is located at the heat receiving section 10. The outer shell of the heat dissipation device 100 is made of a metal material with good heat dissipation performance and high thermal conductivity, such as copper. In addition, the heat receiving section 10, the heat exchange section 20, and the return section 30 are composed of capillary structures 50, which are filled with a vacuum condensation heat dissipation medium. The vacuum condensation heat dissipation medium has a higher heat dissipation efficiency.

[0035] In this embodiment, the capillary structure 50 of the heat receiving part 10 and the capillary structure 50 of the heat exchange part 20 of the heat dissipation device 100 can be made of sintered copper powder. Its structure is a porous microstructure formed by sintering copper powder into a uniformly distributed porous medium on a copper plate, and the average particle size of the copper powder is about 50 μm.

[0036] The sealed cavity formed by the heating section 10, heat exchange section 20, and reflux section 30 in the heat dissipation device 100 is a low-vacuum environment, and the phase change heat dissipation medium is generally a self-wetting fluid. The phase change heat dissipation medium is divided into monolithic fluids or multi-component fluids; monolithic fluids are deionized water, acetone, methanol, or ethanol, etc., while multi-component fluids are mixtures of deionized water and ethanol, mixtures of deionized water and propylene glycol, or mixtures of deionized water, ethylene glycol, and octanol, etc.; the content of each component in a multi-component fluid is different.

[0037] A self-wetting fluid, acting as a phase change heat dissipation medium, is adsorbed onto the inner surface of the capillary structure 50, which possesses superhydrophilic properties. When the phase change heat dissipation medium absorbs energy from the heat source and undergoes a phase change, the medium within the vacuum chamber of the heat dissipation device 100 changes from liquid to vapor. The vapor condenses upon contact with the condenser, forming condensate droplets, which then flow back to the heated portion 10 through the capillary structure 50 or a tubular structure. In this embodiment, the heat dissipation medium can be vacuum-sealed pure water. The filling rate of the heat dissipation medium within the capillary structure 50 is 30%–50%.

[0038] A heat sink can be installed between a heat-generating electronic component (heat source) and a heat sink. Utilizing the phase change of the heat dissipation medium within the heat dissipation device 100, rapid heat transfer is achieved. The heat dissipation device 100 enables the heat from the electronic component to be evenly distributed before being transferred to the heat sink, maximizing the performance of the heat sink and improving the stability and reliability of the electronic component.

[0039] Specifically, in this embodiment, the heat source 200 is the part of the electronic components in the terminal device that generates heat. The heat source 200 can be in the form of a panel, so the heated part 10 can be in contact with the heat source of the terminal device, that is, the lower housing 62 of the heated part 10 is in contact with the heat source 200 of the terminal device. The thermal conductivity of the heat dissipation device 100 increases with the increase of the area of ​​the heated part 10.

[0040] The lower housing 62 of the heat-receiving part 10 and the upper housing 61 of the heat exchange area of ​​the heat dissipation device 100 are made of a plate-like structure using a material with high thermal conductivity, allowing heat to be conducted horizontally (i.e., along the plane where the upper housing 61 or the lower housing 62 is located). The heat-receiving part 10 of the heat dissipation device 100 can directly contact the heat source without a substrate, further reducing thermal resistance. Direct contact means that when the heat-receiving part 10 is in contact with the heat source 200, there is no need to install or position a substrate, and the lower housing 62 of the heat-receiving part 10 directly contacts the heat-generating electronic components in the terminal device.

[0041] The heat exchange section 20 and the heat receiving section 10 are spaced apart, and the reflux section 30 connects the heat receiving section 10 and the heat exchange section 20. A vacuum phase change space 40 is formed between the heat receiving section 10 and the heat exchange section 20. Here, phase change refers to the form in which a substance exists in an aggregated state or structural form that adapts to external conditions under certain conditions (temperature, pressure, etc.).

[0042] Furthermore, the heat dissipation medium circulates between the heated part 10 and the heat exchange part 20. The heated part 10 is in close contact with the heat-generating electronic components (heat source). In this embodiment, the electronic components are mainly the CPU, battery, or WiFi chip of the mobile phone. The heat dissipation device 100 is disposed at the middle frame of the mobile phone, and is disposed on the side of the middle frame close to the display surface of the mobile phone. When the mobile phone is placed horizontally with the display surface facing upward, the heated part 10 faces downward, the heat exchange part 20 faces upward, the lower housing 62 of the heated part 10 is in contact with the middle frame, and the upper housing 61 of the heat exchange part 20 is in contact with the display panel of the mobile phone.

[0043] Furthermore, the heat dissipation medium at the heated part 10 is in a liquid state. The heat generated by electronic components such as the mobile phone CPU or battery is conducted through the lower shell 62 at the heated part 10 to the capillary structure 50 at the heated part 10. The liquid heat dissipation medium undergoes a phase change, evaporates into a gaseous state, and the gaseous heat dissipation medium enters the vacuum phase change space 40 and fills the phase change space 40.

[0044] The gaseous heat dissipation medium continues to move upwards and reaches the heat exchange section 20. Near the surface of the phase change space 40, the temperature of the heat exchange section 20 is lower than that of the heated section 10. Therefore, the gaseous heat dissipation medium undergoes a phase change upon reaching the heat exchange section 20, releasing heat and condensing into a liquid heat dissipation medium. The condensed liquid heat dissipation medium is then drawn back into the heat exchange section 20 by the capillary action of the capillary structure 50, and under the influence of gravity, returns to the heated section 10 through the return section 30. The heat dissipation medium within the heat dissipation device 100 operates in this cyclical manner.

[0045] In some embodiments, such as Figures 1 to 3As shown, the heating section 10 and the heat exchange section 20 have plate-like structures and are parallel to each other. Further, the cross-sections of the heating section 10 and the heat exchange section 20 are square. In some embodiments, the reflux section 30 is disposed at the edge of the heating section 10 and the edge of the heat exchange section 20. In other embodiments, such as... Figure 4 As shown, the return section 30 of the pipeline structure can be provided at the periphery of the heating section 10 and the heat exchange section 20, or it can be provided in the middle of the heating section 10 and the heat exchange section 20, etc. That is, the return section 30 is also provided in the phase change space 40. The return section 30 provided in the middle of the phase change space 40 can accelerate the return speed of the liquefied heat dissipation medium in the heat exchange section 20.

[0046] In one embodiment, the heated portion 10 and the heat exchange portion 20 are parallel and have a square structure. A side shell is formed at the edges of the heated portion 10 and the heat exchange portion 20. The side shell is formed by bending the lower shell 62 of the heated portion 10 upwards and the lower shell 62 of the heat exchange portion 20 downwards. In this embodiment, the side shell, the heated portion 10, and the heat exchange portion 20 form a phase change space 40.

[0047] The reflux section 30, located at the edge of the heated section 10 and the heat exchange section 20, can be tubular. The shell of the tubular reflux section 30 can be made of copper and connects the edges of the heated section 10 and the heat exchange section 20. When connecting the heated section 10 and the heat exchange section 20, the reflux section 30 can be located outside the edge shell, and the structure of the reflux section 30 and the edge shell is similar to that of a cup handle.

[0048] When the return flow section 30 is a tubular structure, it may include multiple tubular structures, which are spaced apart along the edge of the heat dissipation device 100. The return flow section 30 may be a square or circular tube, and no specific limitation is made here.

[0049] In this embodiment, the reflux section 30 is also plate-shaped. The cross-section of the reflux section 30 can be square and vertically connected to the heated section 10 and the heat exchange section 20. The cross-section of the reflux section 30 can also be arc-shaped and set at an angle to the connection between the heated section 10 and the heat exchange section 20.

[0050] In some embodiments, the heat dissipation device 100 has a cross-section in the shape of a U-shape; and / or the longitudinal section of the heat dissipation device 100 has a U-shape. Therefore, in this embodiment, the cross-section of the return flow section 30 is square and is perpendicularly connected to the heated section 10 and the heat exchange section 20. At this time, the heat dissipation device 100 is equivalent to a hollow plate structure. The middle is a square vacuum phase change space 40, and a negative pressure state is formed in the vacuum phase change space 40. In some implementations, it is sealed and formed in one go, and in others, it can be evacuated to a vacuum state later.

[0051] It should be noted that the cross-section and longitudinal section of the heat dissipation device 100 are both perpendicular to the direction of the heated part 10 and the heat exchange part 20.

[0052] In some embodiments, the reflux section 30 of the heat dissipation device 100 is also provided with a capillary structure 50. The capillary structure 50 of the reflux section 30 may also be made of foamed copper with a porosity of 85% to 95%. The capillary structure 50 of the heating section 10, the heat exchange section 20 and the reflux section 30 work together to make the phase change heat dissipation medium flow and circulate longitudinally through the foamed copper.

[0053] In the tangential direction parallel to the heated part 10 and the heat exchange part 20, the outer contour and inner contour of the heat dissipation device 100 cross section have the same shape, but the contour shape of the heat dissipation device 100 cross section is not limited. The shape of the heat dissipation device 100 in the planar direction parallel to the heated part 10 and the heat exchange part 20 can be set according to the structural stacking of other electronic components inside the mobile phone, and is not specifically limited here.

[0054] Furthermore, the heated section 10 is provided with a first vibrating body 11, which vibrates in a direction perpendicular to the heated section 10; and / or the heat exchange section 20 is provided with a second vibrating body 21, which vibrates in a direction perpendicular to the heat exchange section 20. The first vibrating body 11 may be provided only at the heated section 10, the second vibrating body 21 may be provided only at the heat exchange section, or both the first vibrating body 11 and the second vibrating body 21 may be provided at both the heated section 10 and the heat exchange section 20.

[0055] By setting the first vibrator 11 and the second vibrator 21, an active driving force is added to the original VC heat exchange plate, which accelerates the return speed of the heat dissipation medium between the heated part 10 and the heat exchange part 20, thereby increasing the number of phase change cycles inside the vacuum phase change space 40, promoting and accelerating the heat circulation speed inside the heat dissipation device 100, strengthening the condensation and recovery capacity of the heat dissipation medium, improving the heat transfer efficiency inside the heat dissipation device 100, increasing the heat transfer limit of the heat dissipation device 100, and enhancing the heat dissipation effect of the heat dissipation device 100.

[0056] In some embodiments, the first vibrator 11 and the second vibrator 21 comprise piezoelectric materials; the piezoelectric materials receive a driving signal, and the first vibrator 11 and the second vibrator 21 vibrate based on the driving signal.

[0057] Piezoelectric materials are based on the piezoelectric effect. Piezoelectric crystals have low symmetry; when deformed under external force, the relative displacement of positive and negative ions in the unit cell causes the centers of positive and negative charges to no longer coincide, leading to macroscopic polarization of the crystal. Since the surface charge density of the crystal is equal to the projection of the polarization intensity onto the surface normal, opposite charges will appear on the two ends of a piezoelectric material when deformed under pressure. Conversely, when a piezoelectric material is polarized in an electric field, the displacement of the charge centers causes deformation. These properties of piezoelectric materials allow for the interconversion of mechanical vibrations (sound waves) and alternating current.

[0058] The vibration principle of the first vibrating body 11 and the second vibrating body 21, which are made of piezoelectric materials, is as follows: If pressure is applied to the piezoelectric material, it will generate a potential difference (called the direct piezoelectric effect); conversely, if a voltage is applied, it will generate mechanical stress (called the inverse piezoelectric effect). If the pressure is a high-frequency vibration, a high-frequency current will be generated. When a high-frequency electrical signal is applied to the piezoelectric material, a high-frequency acoustic signal (mechanical vibration) is generated, such as an ultrasonic signal. In other words, the piezoelectric material has the function of converting and inversely converting mechanical energy to electrical energy. The piezoelectric material can generate an electric field due to mechanical deformation, and it can also generate mechanical deformation due to the action of an electric field. In some embodiments, the piezoelectric material is a piezoelectric ceramic.

[0059] In some embodiments, the first vibrating body 11 and the second vibrating body 21 vibrate in the same direction. That is, when the first vibrating body 11 vibrates upward (i.e. towards the heat exchange section 20), the second vibrating body 21 also vibrates upward (i.e. away from the heat exchange section 20); when the second vibrating body 21 vibrates downward (i.e. away from the heated section 10), the second vibrating body 21 also vibrates downward (i.e. towards the heated section 10).

[0060] By using a first vibrator 11 and a second vibrator 21 with piezoelectric material, the upper and lower surfaces of the heat dissipation device 100 can vibrate in a direction perpendicular to the plane of the heated part 10 or the heat exchange part 20.

[0061] Specifically, a driving signal is generated by voltage control to drive the first vibrator 11 and the second vibrator 21 to vibrate. When the first vibrator 11 drives the heated part 10 to move upward, it accelerates the phase change rate of the liquid heat dissipation medium in the heated part 10 vaporizing into the phase change space 40. At the same time, the second vibrator 21 also drives the heat exchange part 20 to move upward, increasing the phase change rate of the gaseous heat dissipation medium in the phase change space 40, thereby enhancing the adsorption capacity of the capillary structure 50 at the heat exchange part 20. When the second vibrator 21 drives the heat exchange part 20 to move downward, the first vibrator 11 also drives the heated part 10 to move downward. This accelerates the return flow rate of the liquid heat dissipation medium in the heat exchange part 20 to the heated part 10, thereby effectively increasing the heat exchange speed within the heat dissipation device 100.

[0062] In some embodiments, the first vibrator 11 is disposed on the side of the heated portion 10 close to the heat source 200; and / or the second vibrator 21 is disposed on the side of the heat exchange portion 20 away from the heat source 200. In this embodiment, the positions of the first vibrator 11 and the second vibrator 21 in the heat dissipation device 100 will be described through the following embodiments.

[0063] Example 1

[0064] In Embodiment 1, a first vibrator 11 and a second vibrator 21, both made of piezoelectric material, are disposed outside the outer casing, such as... Figure 1 As shown, the first vibrator 11 is located at the lower part of the lower housing 62, and the second vibrator 21 is located at the upper part of the upper housing 61. The upper housing 61 and the lower housing 62 are welded and sealed together on both sides to form a hollow and vacuum-sealed chamber. A capillary structure 50 is provided in the sealed chamber, and the capillary structure 50 is filled with a heat dissipation medium, with a filling rate of 30% to 50% in the capillary structure 50.

[0065] Example 2

[0066] In Embodiment 2, a first vibrator 11 and a second vibrator 21, both made of piezoelectric material, are disposed inside the outer casing, such as... Figure 2 As shown, the first vibrator 11 is located on the upper part of the lower shell 62 and below the capillary structure 50 at the heated section 10; the second vibrator 21 is located on the lower part of the upper shell 61 and above the capillary structure 50 at the heat exchange section 20. The upper shell 61 and lower shell 62 are made of metals with excellent thermal conductivity, mostly copper. The two sides of the upper shell 61 and lower shell 62 are welded and sealed to form a hollow, vacuum-sealed chamber. A capillary structure 50 is installed inside the sealed chamber, and the capillary structure 50 is filled with a heat dissipation medium, with a filling rate of 30% to 50%.

[0067] Example 3

[0068] In Embodiment 3, the materials of the upper and lower contact surfaces of the heat dissipation device 100 were changed. Specifically, the first vibrator 11 and the second vibrator 21, both made of piezoelectric material, directly replaced the original outer shell of the heat dissipation device 100. For example... Figure 3 As shown, the first vibrator 11 is located below the capillary structure 50 of the heated part 10, and the first vibrator 11 is in direct contact with the heat-generating electronic components of the mobile phone; the second vibrator 21 is located above the capillary structure 50 of the heat exchange part 20. At this time, the first vibrator 11 and the second vibrator 21 are connected to the side shell to form a hollow and vacuum-sealed chamber. The capillary structure 50 is provided in the sealed chamber, and the capillary structure 50 is filled with a heat dissipation medium, with a filling rate of 30% to 50% in the capillary structure 50.

[0069] It should be noted that the above three embodiments are merely exemplary and are not intended to limit the scope of protection of this disclosure. In some embodiments, the first vibrator 11 may be disposed outside the heated portion 10, while the second vibrator 21 may be disposed inside the heat exchange portion 20, or the first vibrator 11 may be disposed inside the heated portion 10, and the second vibrator 21 may be disposed outside the heat exchange portion 20. Alternatively, the first vibrator 11 may replace the lower housing 62, and the second vibrator 21 may be disposed inside or outside the heat exchange portion 20; or the second vibrator 21 may replace the upper housing 61, and the second vibrator 21 may be disposed inside or outside the heat exchange portion 20.

[0070] In some embodiments, a superhydrophobic coating may be applied to the surface of the capillary structure 50 of the heat-receiving part 10 of the heat sink 100 near the vacuum phase change space 40. A superhydrophilic coating may be applied to the surface of the capillary structure 50 of the heat exchange part 20 of the heat sink 100 near the vacuum phase change space 40.

[0071] Specifically, materials are classified into superhydrophilic, hydrophilic, hydrophobic, and superhydrophobic materials based on the contact angle (WCA) formed when a water droplet comes into contact with a solid surface. The contact angle refers to the angle between the solid-liquid interface, through the liquid interior, and at the gas-liquid interface at the solid-liquid-gas three-phase junction. Specifically, materials with a contact angle less than 10° are superhydrophilic; those with a contact angle greater than 10° but less than 90° are hydrophilic; those with a contact angle greater than 90° but less than 150° are hydrophobic; and those with a contact angle greater than 150° are superhydrophobic.

[0072] For example, the contact angle between ordinary glass and water is 30° to 40°, so water droplets easily form on the glass and do not easily slide off; the contact angle between silica nanomaterials and water is greater than 150°, and water droplets easily roll off the surface of the material.

[0073] In some embodiments, as can be seen from the above, the return flow section 30 in the heat dissipation device 100 can be a pipe structure. The return flow section 30 of the pipe structure can be located at the periphery of the heated section 10 and the heat exchange section 20, or it can be located in the middle, etc. (e.g., Figure 4 (As shown). The upper end of the return section 30 of the pipe structure contacts the heat exchange section 20. The inner and outer surfaces of the pipe can also be treated with a superhydrophobic coating. The lower end of the return section 30 of the pipe structure contacts the heat receiving section 10, as shown. Figure 4 As shown, the pipe structure absorbs the condensation phase change heat dissipation medium formed in the heat exchange section 20 through capillary action.

[0074] It is understood that the heat dissipation device 100 provided in this disclosure embodiment includes hardware structures and / or software modules corresponding to each function in order to achieve the above-mentioned functions. In conjunction with the units and algorithm steps of the various examples disclosed in this disclosure embodiment, this disclosure embodiment can be implemented in hardware or a combination of hardware and computer software. Whether a certain function is executed by hardware or by computer software driving hardware depends on the specific application and design constraints of the technical solution. Those skilled in the art can use different methods to implement the described functions for each specific application, but such implementation should not be considered to exceed the scope of the technical solution of this disclosure embodiment.

[0075] Based on the same concept, this disclosure also provides a terminal device. The terminal device can be a mobile phone, computer, digital broadcasting terminal, messaging device, game console, tablet device, medical device, fitness equipment, personal digital assistant, translator, watch, bracelet, or other wearable device. As can be seen from the above, the terminal device described is based on a mobile phone as an example.

[0076] The terminal device includes the aforementioned heat dissipation device 100 and drive device 70. The drive device 70 is electrically connected to the first vibrating body 11 and the second vibrating body 21 in the heat dissipation device 100, and drives the first vibrating body 11 and the second vibrating body 21 to vibrate simultaneously and in the same direction.

[0077] Specifically, the heat-receiving part 10 of the heat dissipation device 100 is provided with a first vibrating body 11, such as Figure 8 As shown, the piezoelectric material included in the first vibrating body 11 is connected to the driving device 70 via a circuit, and the first vibrating body 11 is disposed on the side of the heated part 10 near the heat source 200; the piezoelectric material included in the second vibrating body 21 is connected to the driving device 70 via a circuit, and the second vibrating body 21 is disposed on the side of the heated part 10 away from the heat source 200. The first vibrating body 11 receives the driving signal from the first excitation circuit and vibrates perpendicular to the surface direction of the first vibrating body 11; the second vibrating body 21 receives the driving signal from the second excitation circuit and vibrates perpendicular to the surface direction of the second vibrating body 21. To achieve a better vibration effect, the vibration directions of the first vibrating body 11 and the second vibrating body 21 are the same.

[0078] like Figure 5 As shown, the driving device 70 of the heat dissipation device 100 includes a signal generator 71. After being connected to a power source, the signal generator 71 can emit a periodic excitation signal, which can be a sine wave, a square wave, etc. The first vibrating body 11 and the second vibrating body 21 determine their own vibration frequency and direction based on the frequency of the excitation signal emitted by the signal generator 71.

[0079] Specifically, for example Figure 5As shown, the excitation signal includes a first excitation signal and a second excitation signal. The signal generating device 71 can emit the first excitation signal (e.g., Figure 6 (as shown) and the second excitation signal (such as) Figure 7 (As shown).

[0080] The signal generating device 71 can first emit a first excitation signal, which causes the first vibrator 11 to vibrate first. This allows the heated part 10, where heat is concentrated, to vibrate first, promoting the heat dissipation medium evaporated at the heated part 10 to enter the vacuum phase change space 40.

[0081] Alternatively, the signal generating device 71 can first emit a second excitation signal, which causes the second vibrator 21 to vibrate first. This allows the heat exchange section 20 to vibrate first. The vibration of the heat exchange section 20 then drives the flow of air or heat dissipation medium within the entire heat dissipation device 100, thereby promoting the heat dissipation effect of the heat dissipation device 100.

[0082] In addition, the signal generating device 71 can also simultaneously emit a first excitation signal and a second excitation signal. At this time, the first excitation signal causes the first vibrator 11 to vibrate, and the second excitation signal causes the second vibrator 21 to vibrate. The heated part 10 and the heat exchange part 20 vibrate simultaneously, promoting the flow of air or heat dissipation medium inside the entire heat dissipation device 100.

[0083] The signal generating device 71 is electrically connected to both the first vibrating body 11 and the second vibrating body 21. Specifically, the driving device 70 also includes a first excitation line 72 and a second excitation line 73. The first excitation line 72 is electrically connected to both the signal generating device 71 and the first vibrating body 11, and is used to transmit the first excitation signal emitted by the signal generating device 71. The second excitation line 73 is electrically connected to both the signal generating device 71 and the second vibrating body 21, and is used to transmit the second excitation signal emitted by the signal generating device 71.

[0084] For example, Figure 6 and Figure 7 As shown, the first excitation signal and the second excitation signal have the same frequency and amplitude, but opposite phases. Thus, the excitation signal emitted by the signal generating device 71 can drive the first vibrator 11 and the second vibrator 21 to vibrate in the same direction. Specifically, the frequencies of the first excitation signal and the second excitation signal generally need to be the same or integer multiples thereof. The phase difference of a sine wave should be an integer multiple of (2n+1)π (where n is a natural number); the phase difference of other waveforms such as square waves should be an integer multiple of the period plus half a period.

[0085] In one embodiment, the drive device 70 further includes a manual setting device 74 for manually setting the frequency of the excitation signal and adjusting the frequency of the excitation signal emitted by the signal generator 71.

[0086] Specifically, the signal generating device 71 can receive information such as the frequency, amplitude, and waveform of the first excitation signal and the second excitation signal set manually, thereby controlling the signal generating device 71 to generate the first excitation signal and the second excitation signal with corresponding frequency, amplitude, and waveform.

[0087] In another embodiment, the driving device 70 of the heat dissipation device 100 includes a temperature sensor 75, which is placed near the heat source 200. The specific installation position of the temperature sensor 75 is determined by the stacking of electronic components inside the terminal device, and it does not necessarily have to be in close contact with the heated part 10, or it can share other temperature sensors 75 in the electronic device. The signal generating device 71 receives the temperature signal fed back from the temperature sensor 75 and automatically adjusts the frequency, amplitude, and waveform of the first excitation signal or the second excitation signal.

[0088] The amplitude and frequency of the excitation signal can also be automatically adjusted according to the temperature sensor 75. The higher the temperature, the larger the amplitude and the faster the frequency of the excitation signal, and the faster the phase change heat dissipation medium inside the heat dissipation device 100 circulates, resulting in better heat dissipation. The lower the temperature, the smaller the amplitude and the slower the frequency of the excitation signal, and the slower the circulation of the phase change heat dissipation medium inside the heat dissipation device 100, resulting in lower energy consumption.

[0089] Therefore, it can be seen that whether it is manually set by the manual setting device 74 or automatically adjusted by the temperature sensor 75, the frequency of the excitation signal emitted by the signal generating device 71 can be changed. By changing the frequency of the excitation signal, the vibration frequency of the first vibrator 11 and the second vibrator 21 in the direction perpendicular to the heated part 10 and the heat exchange part 20 can be changed, thereby changing the speed of heat exchange.

[0090] The basic working process of the heat dissipation device 100 is as follows: The heat dissipation medium absorbs heat in the square heat dissipation device 100 near the heat source 200, changes from liquid to gas, and enters the phase change space 40. The gas fills the phase change space 40, and the gas pressure inside the phase change space 40 increases. The hot gas rises and comes into contact with the heat exchange section 20. Since the heat exchange surface is a low-temperature area, the gas condenses into droplets of liquid. The droplets of liquid are adsorbed by the capillary structure 50 located at the heat exchange section 20. The liquid flows back to the heated section 10 along the capillary structure 50 of the heat exchange section 20 and the capillary structure 50 or tubular structure of the return section 30 on both sides. Since the capillary force is relatively weak, the speed of this heat cycle is relatively slow.

[0091] During this thermal cycle, the drive unit 70 receives signals from the temperature sensor 75 or the manual setting device 74, and the control signal generator 71 emits a first excitation signal and a second excitation signal with the same frequency but opposite phase. The first vibrator 11 and the second vibrator 21 begin to vibrate in the same direction and at the same frequency. This vibration, combined with the falling of the droplet liquid and the movement of the liquid within the capillary, accelerates the thermal cycle and improves the heat dissipation effect. When the temperature sensor 75 is at a high temperature, the drive unit 70 increases the vibration frequency and amplitude to accelerate heat dissipation; when the temperature sensor 75 is at a low temperature, the drive unit 70 decreases the vibration frequency and amplitude to save energy.

[0092] Regarding the terminal device in the above embodiments, the specific way in which each module performs operations has been described in detail in the embodiments related to the heat dissipation device 100, and will not be elaborated here.

[0093] Figure 9 This is a block diagram illustrating an apparatus 800 according to an exemplary embodiment. For example, apparatus 800 may be a mobile phone, computer, digital broadcasting terminal, messaging device, game console, tablet device, medical device, fitness equipment, personal digital assistant, etc.

[0094] Reference Figure 9 The device 800 may include one or more of the following components: a processing component 802, a memory 804, a power component 806, a multimedia component 808, an audio component 810, an input / output (I / O) interface 812, a sensor component 814, and a communication component 816.

[0095] Processing component 802 typically controls the overall operation of device 800, such as operations associated with display, telephone calls, data communication, camera operation, and recording. Processing component 802 may include one or more processors 820 to execute instructions to perform all or part of the steps of the methods described above. Furthermore, processing component 802 may include one or more modules to facilitate interaction between processing component 802 and other components. For example, processing component 802 may include a multimedia module to facilitate interaction between multimedia component 808 and processing component 802.

[0096] Memory 804 is configured to store various types of data to support the operation of device 800. Examples of such data include instructions for any application or method operating on device 800, contact data, phonebook data, messages, pictures, videos, etc. Memory 804 can be implemented by any type of volatile or non-volatile storage device or a combination thereof, such as static random access memory (SRAM), electrically erasable programmable read-only memory (EEPROM), erasable programmable read-only memory (EPROM), programmable read-only memory (PROM), read-only memory (ROM), magnetic storage, flash memory, magnetic disk, or optical disk.

[0097] The power supply component 806 provides power to the various components of the device 800. The power supply component 806 may include a power management system, one or more power sources, and other components associated with generating, managing, and distributing power to the device 800.

[0098] Multimedia component 808 includes a screen that provides an output interface between the device 800 and the user. In some embodiments, the screen may include a liquid crystal display (LCD) and a touch panel (TP). If the screen includes a touch panel, the screen may be implemented as a touchscreen to receive input signals from the user. The touch panel includes one or more touch sensors to sense touches, swipes, and gestures on the touch panel. The touch sensors may sense not only the boundaries of the touch or swipe action but also the duration and pressure associated with the touch or swipe operation. In some embodiments, multimedia component 808 includes a front-facing camera and / or a rear-facing camera. When the device 800 is in an operating mode, such as a shooting mode or a video mode, the front-facing camera and / or the rear-facing camera may receive external multimedia data. Each front-facing camera and rear-facing camera may be a fixed optical lens system or have focal length and optical zoom capabilities.

[0099] Audio component 810 is configured to output and / or input audio signals. For example, audio component 810 includes a microphone (MIC) configured to receive external audio signals when device 800 is in an operating mode, such as call mode, recording mode, and voice recognition mode. The received audio signals may be further stored in memory 804 or transmitted via communication component 816. In some embodiments, audio component 810 also includes a speaker for outputting audio signals.

[0100] I / O interface 812 provides an interface between processing component 802 and peripheral interface modules, such as keyboards, click wheels, buttons, etc. These buttons may include, but are not limited to, home buttons, volume buttons, power buttons, and lock buttons.

[0101] Sensor assembly 814 includes one or more sensors for providing status assessments of various aspects of device 800. For example, sensor assembly 814 may detect the on / off state of device 800, the relative positioning of components such as the display and keypad of device 800, changes in the position of device 800 or a component of device 800, the presence or absence of user contact with device 800, the orientation or acceleration / deceleration of device 800, and temperature changes of device 800. Sensor assembly 814 may include a proximity sensor configured to detect the presence of nearby objects without any physical contact. Sensor assembly 814 may also include a light sensor, such as a CMOS or CCD image sensor, for use in imaging applications. In some embodiments, sensor assembly 814 may also include an accelerometer, a gyroscope, a magnetometer, a pressure sensor, or a temperature sensor 75.

[0102] Communication component 816 is configured to facilitate wired or wireless communication between device 800 and other devices. Device 800 can access wireless networks based on communication standards, such as WiFi, 2G, or 3G, or combinations thereof. In one exemplary embodiment, communication component 816 receives broadcast signals or broadcast-related information from an external broadcast management system via a broadcast channel. In one exemplary embodiment, communication component 816 also includes a near-field communication (NFC) module to facilitate short-range communication. For example, the NFC module may be implemented based on radio frequency identification (RFID) technology, Infrared Data Association (IrDA) technology, ultra-wideband (UWB) technology, Bluetooth (BT) technology, and other technologies.

[0103] In an exemplary embodiment, the apparatus 800 may be implemented by one or more application-specific integrated circuits (ASICs), digital signal processors (DSPs), digital signal processing devices (DSPDs), programmable logic devices (PLDs), field-programmable gate arrays (FPGAs), controllers, microcontrollers, microprocessors, or other electronic components to perform the methods described above.

[0104] In an exemplary embodiment, a non-transitory computer-readable storage medium including instructions is also provided, such as a memory 804 including instructions, which can be executed by a processor 820 of the device 800 to perform the above-described method. For example, the non-transitory computer-readable storage medium may be a ROM, random access memory (RAM), CD-ROM, magnetic tape, floppy disk, and optical data storage device, etc.

[0105] It is understood that in this disclosure, "multiple" refers to two or more, and other quantifiers are similar. "And / or" describes the relationship between related objects, indicating that three relationships can exist. For example, A and / or B can represent: A alone, A and B simultaneously, and B alone. The character " / " generally indicates that the preceding and following related objects are in an "or" relationship. The singular forms "a," "the," and "the" are also intended to include the plural forms unless the context clearly indicates otherwise.

[0106] It is further understood that the terms "first," "second," etc., are used to describe various types of information, but this information should not be limited to these terms. These terms are only used to distinguish information of the same type from one another, and do not indicate a specific order or degree of importance. In fact, the expressions "first," "second," etc., are completely interchangeable. For example, without departing from the scope of this disclosure, first information can also be referred to as second information, and similarly, second information can also be referred to as first information.

[0107] It is further understood that the terms “center,” “longitudinal,” “lateral,” “front,” “rear,” “up,” “down,” “left,” “right,” “vertical,” “horizontal,” “top,” “bottom,” “inner,” and “outer,” etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing this embodiment and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation.

[0108] It can be further understood that, unless otherwise specified, "connection" includes both direct connections where no other components exist between the two parties and indirect connections where other components exist between them.

[0109] It is further understood that although operations are described in a specific order in the accompanying drawings in the embodiments of this disclosure, this should not be construed as requiring these operations to be performed in the specific order or serial order shown, or requiring all of the shown operations to be performed to obtain the desired result. In certain environments, multitasking and parallel processing may be advantageous.

[0110] Other embodiments of this disclosure will readily occur to those skilled in the art upon consideration of the specification and practice of the invention disclosed herein. This application is intended to cover any variations, uses, or adaptations of this disclosure that follow the general principles of this disclosure and include common knowledge or customary techniques in the art not disclosed herein. The specification and examples are to be considered exemplary only, and the true scope and spirit of this disclosure are indicated by the following scope of claims.

[0111] It should be understood that this disclosure is not limited to the precise structures described above and shown in the accompanying drawings, and various modifications and changes can be made without departing from its scope. The scope of this disclosure is limited only by the appended claims.

Claims

1. A heat dissipation device, characterized in that, The heat dissipation device includes: A heat-receiving part, which is in contact with the heat source; A heat exchange part, which is arranged at an interval from the heat-receiving part, and a vacuum phase change space is formed between the heat-receiving part and the heat exchange part; and A reflux part, which connects the heat-receiving part and the heat exchange part; Wherein, a first vibrating body is arranged on the heat-receiving part, and the first vibrating body vibrates in a direction perpendicular to the heat-receiving part; A second vibrating body is arranged on the heat exchange part, and the second vibrating body vibrates in a direction perpendicular to the heat exchange part; The vibration directions of the first vibrating body and the second vibrating body are the same, and the first vibrating body and the second vibrating body vibrate simultaneously.

2. The heat dissipation device according to claim 1, wherein The first vibrating body and the second vibrating body comprise piezoelectric materials; The piezoelectric materials receive driving signals, and based on the driving signals, the first vibrating body and / or the second vibrating body vibrates.

3. The heat dissipation device according to claim 1, wherein The heat-receiving part and the heat exchange part are in a plate-like structure, and the heat-receiving part and the heat exchange part are parallel; The reflux part is arranged at the edge parts of the heat-receiving part and the heat exchange part, and is vertically connected to the heat-receiving part and the heat exchange part.

4. The heat dissipation device according to claim 3, wherein The first vibrating body is arranged on the side of the heat-receiving part close to the heat source; and / or The second vibrating body is arranged on the side of the heat exchange part far from the heat source.

5. The heat dissipation device according to claim 3, wherein The cross-section of the heat dissipation device is in a shape of a Chinese character 'hui'; and / or The longitudinal section of the heat dissipation device is in a shape of a Chinese character 'hui'.

6. The heat dissipation device according to claim 1, wherein The heat-receiving part, the heat exchange part and the reflux part are composed of capillary structures, and a heat dissipation medium is filled in the capillary structures.

7. The heat dissipation device according to claim 1, characterized in that, The heat source is in a panel shape.

8. A terminal device, characterized in that, Including The heat dissipation device according to any one of claims 1-7; And A driving device, which is electrically connected to the first vibrating body and the second vibrating body, and drives the first vibrating body and the second vibrating body to vibrate simultaneously.

9. The terminal device according to claim 8, wherein The driving device includes a signal generating device for emitting periodic excitation signals; The first vibrating body and the second vibrating body determine the vibration frequency and direction based on the frequency of the excitation signal.

10. The terminal device according to claim 9, characterized in that, The excitation signal includes a first excitation signal and a second excitation signal; The signal generating device emits the first excitation signal and the second excitation signal; The driving device further includes: A first excitation circuit, which is electrically connected to the signal generating device and the first vibrating body, and is used for transmitting the first excitation signal to the first vibrating body; A second excitation circuit, which is electrically connected to the signal generating device and the second vibrating body, and is used for transmitting the second excitation signal to the second vibrating body; Wherein, the first excitation signal and the second excitation signal have the same frequency and opposite phases.

11. The terminal device according to claim 9, wherein The driving device also includes a manual setting device for manually setting the frequency of the excitation signal and adjusting the frequency of the excitation signal emitted by the signal generating device.

12. The terminal device according to claim 9, characterized in that, The driving device also includes a temperature sensor, which is placed at the heat source and electrically connected to the signal generating device; The temperature sensor acquires a temperature signal and transmits it to the signal generating device, which then adjusts the frequency of the excitation signal based on the temperature signal.

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