Electroplating equipment

Abstract

The present invention belongs to the technical field of electroplating equipment, and discloses an electroplating device, which includes an upper tank body and a plurality of electroplating components, wherein the upper tank body is used to accommodate a plurality of electroplating components and liquid medicine, wherein the plurality of electroplating components are arranged at intervals along a first direction, and the electroplating components include two anode boxes that are opposite and arranged at intervals along a second direction, wherein a workpiece to be plated is arranged between the two anode boxes, and an ion membrane is arranged on the side of the anode box facing the workpiece to be plated, wherein the ion membrane can pass ionic substances, and an anode is arranged in the anode box, wherein each anode box has an anode region, and a cathode region is formed between the two anode boxes, wherein the two anode regions and the cathode region are independent of each other, and the liquid medicine in each anode region and the liquid medicine in the cathode region are interconnected through the ion membrane. The above structure can realize the separation of the three regions between the upper anode region, the lower anode region and the cathode region, and realize that the electrolytes in each region do not interfere with each other, thereby improving the uniformity of electroplating.

Description

Technical Field

[0001] The present invention relates to the technical field of electroplating equipment, and in particular to an electroplating device. Background Art

[0002] In the existing horizontal electroplating line, the workpiece to be plated runs horizontally in the electroplating tank. There are multiple anode boxes in the electroplating tank. The anode box includes an upper anode area, a lower anode area and a cathode located between the two anode areas. The cathode is the workpiece to be plated. The anode material is placed in the anode box. By filling the electroplating tank with electroplating solution and electrically connecting the anode and the cathode, the cations in the electroplating solution can be attached to the cathode to form a coating. At present, the anode material uses an insoluble anode, which increases the service life of the anode. However, during the electroplating process, due to the use of an insoluble anode, the electrolyte in the anode area electrolyzes oxygen, forming oxygen bubbles in the electroplating solution. As time goes by, the bubbles gradually grow larger, and the oxygen bubbles flow to the cathode area with the electrolyte. If they are attached to the surface of the workpiece to be plated, the cations in the electroplating solution will be blocked and cannot be deposited on the corresponding parts of the surface of the workpiece to be plated, resulting in holes in the surface coating of the workpiece to be plated, thereby causing uneven electroplating.

[0003] In the prior art, an early patent such as CN115094500A discloses a device for horizontal copper electroplating, in which an ion membrane with a set tilt angle that can prevent bubbles from passing through is set between the object to be plated and the electroplating anode, thereby accelerating the discharge of oxygen bubbles, avoiding the influence of bubbles on the deposited copper during the horizontal copper electroplating process, and further avoiding the generation of electroplating voids, thereby improving the uniformity of electroplating. However, although the device isolates most of the oxygen in the upper and lower anode regions from entering the cathode region through the ion membrane, since the anode and cathode are in the same electrolytic cell for reaction and the electrolyte in the electrolytic cell circulates, oxygen still enters the cathode region from the side, causing voids in the surface coating of the object to be plated, that is, the structure cannot completely solve the problem of uniformity during electroplating of the object to be plated.

[0004] Therefore, it is urgent to design an electroplating device to solve the above technical problems. Summary of the invention

[0005] The object of the present invention is to provide an electroplating device that can achieve three-zone separation between an upper anode zone, a lower anode zone and a cathode zone, so that electrolytes in each zone do not interfere with each other, thereby improving the uniformity of electroplating.

[0006] To achieve this object, the present invention adopts the following technical solutions:

[0007] The electroplating device comprises an upper tank body and a plurality of electroplating components, wherein the upper tank body is used to accommodate the plurality of electroplating components and chemical solutions, the plurality of electroplating components are spaced apart along a first direction, the electroplating components comprise two anode boxes that are opposite and spaced apart along a second direction, a workpiece to be plated is arranged between the two anode boxes, an ion membrane is arranged on the side of the anode box facing the workpiece to be plated, the ion membrane is permeable to ionic substances, an anode is arranged in the anode box, each of the anode boxes contains an anode region, a cathode region is formed between the two anode boxes, the two anode regions and the cathode region are independent of each other, the chemical solutions in each anode region and the chemical solutions in the cathode region are isolated from each other by the ion membrane, and the second direction is perpendicular to the first direction.

[0008] Optionally, the anode box comprises a frame structure and an isolation plate, the isolation plate is sealingly arranged on the side of the frame structure facing the workpiece to be plated, a plurality of through holes are opened on the isolation plate, and the ion membrane is attached to the isolation plate and covers each of the through holes.

[0009] Optionally, the isolation plate is inclined at a preset angle.

[0010] Optionally, the side of the anode box away from the workpiece to be plated is an opening, and the anode can be loaded into the anode box through the opening.

[0011] Optionally, a baffle is further provided in the upper tank body, and the baffle is arranged on one side of the electroplating assembly along a third direction and is spaced apart from the electroplating assembly, the third direction is respectively perpendicular to the first direction and the second direction, the isolation plate of the anode box near the bottom of the upper tank body extends along the third direction and is sealedly connected to one end of the baffle, the frame structure in the anode box near the bottom of the upper tank body is provided with a through hole on one side facing the baffle, an exhaust channel is formed between the baffle and the side wall of the upper tank body, and bubbles in the anode box can enter the exhaust channel from the through hole and be discharged from the exhaust channel.

[0012] Optionally, a cathode channel is formed between the anode box away from the bottom of the upper trough body and the baffle, and the electroplating device also includes a clamp, which can be passed through the cathode channel along the first direction, and the clamp clamps the workpiece to be plated and can drive the workpiece to be plated to pass through the cathode area along the first direction.

[0013] Optionally, the anode box further comprises a shielding member, and the shielding member is movably disposed between the anode and the cathode along a third direction, and the third direction is respectively perpendicular to the first direction and the second direction.

[0014] Optionally, the electroplating device further comprises two liquid circulation components and a spray system, wherein the two liquid circulation components are respectively arranged in the two anode regions, and the spray system is arranged in the cathode region.

[0015] Optionally, the spray system comprises two spray assemblies arranged opposite to each other and spaced apart along the second direction, each of the spray assemblies comprises a plurality of spray heads, and the spray heads in the two spray assemblies arranged opposite to each other and spaced apart along the second direction are staggered.

[0016] Optionally, at least two of the spray systems are provided in each of the cathode regions, and the at least two spray systems are spaced apart along the first direction.

[0017] Beneficial effects of the present invention:

[0018] The present invention provides an electroplating device, which makes two anode regions and cathode regions independent of each other, and isolates the liquid medicine in each anode region and the liquid medicine in the cathode region through an ion membrane, so that the two anode regions and the cathode region are not connected to each other, and only the ionic substances in the liquid medicine can be exchanged through the ion membrane. Therefore, only the ionic substances can be exchanged between the three regions, and the oxygen bubbles and impurities generated by the cycle cannot enter the cathode region through the anode box, thereby avoiding the oxygen in the anode region from being attached to the workpiece to be plated, thereby avoiding the risks of cavities, copper exposure and unevenness of the surface coating of the workpiece to be plated, improving the coating quality of the workpiece to be plated, improving the uniformity of electroplating of the workpiece to be plated, and also improving the reliability and yield of electroplating; at the same time, oxygen bubbles are prevented from causing the decomposition and consumption of electroplating additives, thereby reducing the generation of decomposition byproducts, improving the electroplating quality and the life of the liquid medicine, and thereby reducing the production cost. In addition, the anode is separated from the workpiece to be plated, and the electroplating efficiency and quality control can be more effectively improved in the management and control of the liquid medicine. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] Figure 1 is a schematic structural diagram of an electroplating device provided in a specific embodiment of the present invention;

[0020] Figure 2 The structure of the electroplating assembly provided by the specific embodiment of the present invention is schematically shown. Figure 1 ;

[0021] Figure 3 The structure of the electroplating assembly provided by the specific embodiment of the present invention is schematically shown. Figure 2 ;

[0022] Figure 4 It is a schematic diagram of the structure of the isolation plate and the ion membrane provided in a specific embodiment of the present invention.

[0023] In the figure:

[0024] 10. Upper tank body;

[0025] 20. Electroplating assembly; 21. Anode box; 211. Frame structure; 212. Isolation plate; 2121. Through hole; 213. Shielding member; 214. Titanium mesh; 22. Part to be plated; 23. Ion membrane; 24. Anode; 25. Baffle; 26. Fixture;

[0026] 30. Sprinkler system; 31. Sprinkler assembly; 311. Sprinkler head;

[0027] 40. Lower tank body. DETAILED DESCRIPTION

[0028] The present invention will be further described in detail below in conjunction with the accompanying drawings and embodiments. It is to be understood that the specific embodiments described herein are only used to explain the present invention, rather than to limit the present invention. It should also be noted that, for ease of description, only parts related to the present invention, rather than all structures, are shown in the accompanying drawings.

[0029] In the description of the present invention, unless otherwise clearly specified and limited, the terms "connected", "connected", and "fixed" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium, it can be the internal connection of two elements or the interaction relationship between two elements. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0030] In the present invention, unless otherwise clearly specified and limited, a first feature being "above" or "below" a second feature may include that the first and second features are in direct contact, or may include that the first and second features are not in direct contact but are in contact through another feature between them. Moreover, a first feature being "above", "above" and "above" a second feature includes that the first feature is directly above and obliquely above the second feature, or simply indicates that the first feature is higher in level than the second feature. A first feature being "below", "below" and "below" a second feature includes that the first feature is directly below and obliquely below the second feature, or simply indicates that the first feature is lower in level than the second feature.

[0031] In the description of this embodiment, the terms "upper", "lower", "right", etc., directions or positional relationships are based on the directions or positional relationships shown in the drawings, and are only for the convenience of description and simplification of operation, rather than indicating or implying that the device or element referred to must have a specific direction, be constructed and operated in a specific direction, and therefore cannot be understood as limiting the present invention. In addition, the terms "first" and "second" are only used to distinguish in the description and have no special meaning.

[0032] At present, when the electroplating device is electroplating, since the anode is an insoluble anode, only water will be electrolyzed near the anode during electroplating to generate oxygen bubbles. The oxygen bubbles will adhere to the workpiece to be plated (i.e., the cathode) during the electrolysis process, which will cause risks such as voids, copper exposure, and unevenness in the plating layer on the surface of the workpiece to be plated, resulting in poor uniformity during electrolysis of the workpiece to be plated, affecting the electroplating quality of the workpiece to be plated.

[0033] In order to solve the above technical problems, this embodiment provides an electroplating device for electroplating a PCB to be plated 22, which can prevent bubbles generated in the anode area from reaching the to-be-plated part 22, thereby improving the uniformity of electroplating. Figure 1 The Y direction in the second direction is Figure 1 The Z direction in the middle, the third direction is Figure 1 The X direction in the figure; the X direction, the Y direction and the Z direction are arranged perpendicular to each other, and the following description will be made based on the X direction, the Y direction and the Z direction.

[0034] Specifically, Figures 1 to 3 As shown, the electroplating device includes an upper tank body 10 and a plurality of electroplating components 20. The upper tank body 10 is used to accommodate a plurality of electroplating components 20 and chemical solutions. The plurality of electroplating components 20 are spaced apart along the Y direction, that is, the upper tank body 10 is an area for electroplating, and the upper tank body 10 can accommodate a plurality of electroplating components 20, so that electroplating of a plurality of parts 22 to be plated can be achieved at the same time.

[0035] Furthermore, the electroplating assembly 20 includes two anode boxes 21 that are opposite to each other and spaced apart in the Z direction, a workpiece 22 to be plated is provided between the two anode boxes 21, and an anode 24 is provided in the anode box 21. The anode 24 in this embodiment is an insoluble anode, and each anode box 21 has an anode region. A cathode region is formed between the two anode boxes 21, so that the workpiece 22 to be plated is provided as a cathode between the two anode regions. When electroplating is performed, it can be ensured that both sides of the workpiece 22 to be plated are plated more evenly.

[0036] In addition, an ion membrane 23 is provided on the side of the anode box 21 facing the workpiece 22 to be plated. The ion membrane 23 is permeable to ionic substances. The two anode regions and the cathode region are independent of each other. The drug solution in each anode region and the drug solution in the cathode region are isolated from each other by the ion membrane 23, so that the two anode regions and the cathode region are not connected to each other, and the drug solution can only be exchanged through the ion membrane 23. The ion membrane 23 is permeable only to ionic substances. Therefore, only ions can be exchanged between the three regions, and oxygen bubbles and impurities generated by the cycle cannot enter the cathode region through the anode box 21, thereby avoiding the oxygen in the anode region from adhering to the workpiece 22 to be plated, thereby improving the uniformity of electroplating of the workpiece 22 to be plated.

[0037] Through the above structure, when the workpiece 22 to be plated is electroplated using the electroplating device of this embodiment, the chemical solution in the cathode area electrolyzes the plating ions, so that the plating ions are electroplated on the workpiece 22 to be plated. In the anode area, since an insoluble anode is used, the anode 24 does not undergo a chemical reaction, and only water molecules in its chemical solution are electrolyzed to form oxygen bubbles. The oxygen bubbles are in the anode area. Since the two anode areas and the cathode area can only be exchanged through the ion membrane 23, the oxygen bubbles will not reach the cathode area, so that a large number of oxygen bubbles will not adhere to the surface of the workpiece 22 to be plated, thereby avoiding the risks of plating cavities, copper exposure and unevenness on the surface of the workpiece 22 to be plated, improving the plating quality of the workpiece 22 to be plated, improving the electroplating uniformity of the electroplating device, and also improving the reliability and yield of electroplating; at the same time, the oxygen bubbles are prevented from causing the decomposition and consumption of the chemical solution, thereby reducing the generation of decomposition by-products, improving the electroplating quality and the life of the chemical solution, and thereby reducing the production cost. Furthermore, by separating the anode 24 from the workpiece 22 to be plated, the electroplating efficiency and quality control can be more effectively improved in terms of management and control of the chemical solution.

[0038] In this embodiment, if Figure 3 As shown, the anode box 21 includes a frame structure 211 and an isolation plate 212. The isolation plate 212 is sealed on the side of the frame structure 211 facing the workpiece 22 to be plated, that is, the outer periphery of the isolation plate 212 is sealed and connected to the side of the frame structure 211 facing the workpiece 22 to be plated, so that the anode box 21 forms a closed structure facing the workpiece 22 to be plated.

[0039] Furthermore, if Figure 3 and Figure 4 As shown, the isolation plate 212 is provided with a plurality of through holes 2121, and the ion membrane 23 is arranged on the isolation plate 212 and covers each through hole 2121, so that the medicine solution in the anode box 21 can only pass through the ion membrane 23 and then pass through a plurality of through holes 2121 to be connected with the cathode area. The setting of the isolation plate 212 gives the ion membrane 23 a certain structural strength, and when used in conjunction with the ion membrane 23, the oxygen blocking effect is better.

[0040] Optionally, the isolation plate 212 is tilted at a preset angle, that is, the ion membrane 23 is also tilted along with the isolation plate 212. The tilted setting allows the bubbles in the anode area to be discharged upward along with the inclination, thereby accelerating the discharge of oxygen bubbles and preventing the bubbles from adhering to the ion membrane 23 and causing blockage of the ion membrane 23.

[0041] Furthermore, if Figure 3As shown, the anode box 21 further includes a titanium mesh 214, which is disposed in the frame structure 211 and connected to the frame structure 211. The anode 24 is disposed on the titanium mesh 214. The titanium mesh 214 can be used to support the anode 24. The titanium mesh 214 is made of titanium material, which is an inert material and will not chemically react with other substances, thereby not interfering with the electroplating performance of the electroplating device.

[0042] Furthermore, a side of the anode box 21 away from the workpiece 22 to be plated is open, which is used to place the anode 24 and other structures in the anode box 21 and is conducive to the discharge of bubbles in the anode box 21.

[0043] However, the anode box 21 near the bottom of the upper tank body 10 is in direct contact with the bottom of the upper tank body 10, that is, its opening is abutted by the bottom of the upper tank body 10, so that the bubbles in the anode box 21 cannot be better released. Specifically, in this embodiment, the anode box 21 near the bottom of the upper tank body 10 is the lower anode box, and the anode box 21 far from the bottom of the upper tank body 10 is the upper anode box.

[0044] To solve this problem, Figure 2 and Figure 3 As shown, in the present embodiment, a baffle 25 is further provided in the upper tank body 10, and the baffle 25 is arranged on one side of the electroplating assembly 20 along the X direction and is spaced apart from the electroplating assembly 20. The isolation plate 212 of the lower anode box extends along the X direction and is sealed and connected to one end of the baffle 25. A through hole is provided on the side of the frame structure 211 in the lower anode box facing the baffle 25, and an exhaust channel is formed between the baffle 25 and the side wall of the upper tank body 10. The bubbles in the lower anode box can flow from the through hole into the exhaust channel and be discharged from the exhaust channel, thereby preventing the bubbles from being unable to be discharged in the lower anode box, causing a high internal air pressure and damaging the equipment.

[0045] Furthermore, a cathode channel is formed between the upper anode box and the baffle 25, and the electroplating device also includes a clamp 26, which can be inserted into the cathode channel along the Y direction. The clamp 26 clamps the workpiece 22 to be plated and can drive the workpiece 22 to be plated to be inserted into the cathode area along the X direction, that is, after the workpiece 22 to be plated is clamped by the clamp 26, it is placed in the cathode area following the clamp 26, and can be taken out with the clamp 26 after the electroplating is completed, which is convenient and quick.

[0046] Specifically, the electroplating device further includes a driving member, which is connected to the fixture 26, so that the workpiece 22 to be plated can enter the electroplating device along the Y direction, and after reaching the corresponding cathode area for electroplating, it can come out of the electroplating device along the Y direction to complete the electroplating, and the electroplating of the electroplating device can be realized. Optionally, the fixture 26 and the driving member are each provided with a plurality of corresponding ones, so that the electroplating device can electroplate multiple workpieces 22 to be plated at one time, saving electroplating time and improving the working efficiency of the electroplating device.

[0047] In this embodiment, if Figure 3 As shown, the anode box 21 further includes a shielding member 213, which is movably disposed along the X direction between the anode 24 and the workpiece 22 to be plated. Since the current density of the liquid in the upper tank 10 is different during the electroplating process of the electroplating device, it is easy to cause the thickness of the coating on the workpiece 22 to be plated to be different and the uniformity is poor. Therefore, the shielding member 213 is provided to reduce the current density at the place with high current density and improve the uniformity of electroplating; and the movability of the shielding member 213 allows the position of the shielding member 213 to be adjusted according to actual conditions during the use of the electroplating device.

[0048] Preferably, two shielding members 213 are provided, and the two shielding members 213 are arranged on both sides of the anode box 21 along the X direction; since the current density of the liquid on both sides of the upper tank body 10 along the X direction is larger than that in the middle part, therefore, setting two shielding members 213 can effectively improve the uniformity of electroplating.

[0049] In this embodiment, if Figure 1 and Figure 2 As shown, the electroplating device further includes two liquid medicine circulation components (not shown in the figure) and a spray system 30. The two liquid medicine circulation components are respectively arranged in the two anode regions, and the spray system 30 is arranged in the cathode region. Both the liquid medicine circulation component and the spray system 30 are liquid medicine supply devices, which can supply liquid medicine to the two anode regions and the cathode region respectively, thereby ensuring the independence of the three regions and avoiding the mixing of the liquid medicines in the three regions, which may damage the uniformity of the electroplating of the workpiece 22 in the cathode region.

[0050] Specifically, the spray system 30 includes two spray assemblies 31 that are arranged opposite to each other and spaced apart in the Z direction, each spray assembly 31 includes a plurality of spray heads 311, and the spray heads 311 in the two spray assemblies 31 that are arranged opposite to each other and spaced apart in the Z direction are staggered. The above arrangement can realize that when the workpiece 22 to be plated is electroplated, the spray heads 311 continuously spray the liquid medicine on both surfaces thereof, and the spraying of the liquid medicine also improves the circulation of the liquid medicine in the cathode region, avoiding the situation where the liquid medicine near the workpiece 22 to be plated has less cations, thereby improving the electroplating quality.

[0051] Optionally, a plurality of nozzles 311 are arranged at intervals along the X direction, so that the workpiece 22 to be plated can be in contact with the circulating chemical solution along the X direction, thereby improving the electroplating quality.

[0052] Further optionally, at least two spray systems 30 are provided in each cathode region, and at least two spray systems 30 are arranged at intervals along the Y direction. The above arrangement can spray the workpiece 22 in all directions, which can further improve the electroplating quality of the electroplating device.

[0053] Preferably, the nozzles 311 of two adjacent spray systems 30 arranged along the Y direction are staggered, so that the omnidirectional spraying of the circulating solution in the cathode region on the workpiece 22 can be further improved, thereby improving the electroplating quality. Optionally, the spray system 30 also includes a liquid inlet pipeline and a liquid outlet pipeline for the inlet and outlet of the solution.

[0054] Furthermore, the above-mentioned liquid medicine circulation component includes a liquid inlet pipe and a liquid outlet pipe, so that the liquid medicine can be circulated in the anode area. Specifically, the liquid outlet pipe is a circulating siphon, which can suck out the liquid medicine, thereby completing the liquid medicine circulation in the anode area. In addition, the setting of the liquid medicine circulation component also has the effect of draining and accelerating the flow of oxygen in the anode area, so that the oxygen can flow out with the flow of the liquid medicine.

[0055] Furthermore, if Figure 1 As shown, the electroplating device also includes a lower tank body 40, and the above-mentioned liquid circulation component and the spray system 30 are both connected to the lower tank body 40. The lower tank body 40 can be used for reflux collection and filtration of the liquid medicine, so that the liquid medicine can be circulated in a short time, thereby improving the utilization rate of the liquid medicine.

[0056] Obviously, the above embodiments of the present invention are merely examples for clearly illustrating the present invention, and are not intended to limit the embodiments of the present invention. For those skilled in the art, various obvious changes, readjustments and substitutions can be made without departing from the protection scope of the present invention. It is not necessary and impossible to list all the embodiments here. Any modifications, equivalent substitutions and improvements made within the spirit and principles of the present invention should be included in the protection scope of the claims of the present invention.

Claims

1. An electroplating device, characterized in that The invention comprises an upper tank body (10) and a plurality of electroplating components (20), wherein the upper tank body (10) is used to accommodate the plurality of electroplating components (20) and a liquid medicine, wherein the plurality of electroplating components (20) are arranged at intervals along a first direction, wherein the electroplating components (20) comprise two anode boxes (21) which are arranged opposite to each other and at intervals along a second direction, wherein a workpiece (22) to be plated is arranged between the two anode boxes (21), an ion membrane (23) is arranged on a side of the anode box (21) facing the workpiece (22) to be plated, wherein the ion membrane (23) is permeable to ionic substances, wherein an anode (24) is arranged in the anode box (21), wherein each anode box (21) has an anode region, and a cathode region is formed between the two anode boxes (21), wherein the two anode regions and the cathode region are independent of each other, wherein the liquid medicine in each anode region and the liquid medicine in the cathode region are isolated from each other by the ion membrane (23), and wherein the second direction is perpendicular to the first direction; The electroplating device further comprises two liquid medicine circulation components and a spray system (30), wherein the two liquid medicine circulation components are respectively arranged in the two anode regions, and the spray system (30) is arranged in the cathode region; The spray system (30) comprises two spray assemblies (31) arranged opposite to each other and spaced apart along the second direction, each of the spray assemblies (31) comprising a plurality of spray heads (311), and the spray heads (311) in the two spray assemblies (31) arranged opposite to each other and spaced apart along the second direction are staggered.

2. The electroplating device according to claim 1, characterized in that: The anode box (21) comprises a frame structure (211) and an isolation plate (212); the isolation plate (212) is sealed on a side of the frame structure (211) facing the workpiece (22) to be plated; a plurality of through holes (2121) are provided on the isolation plate (212); and the ion membrane (23) is attached to the isolation plate (212) and covers each of the through holes (2121).

3. The electroplating device according to claim 2, characterized in that: The isolation plate (212) is inclined at a preset angle.

4. The electroplating device according to claim 2, characterized in that: The side of the anode box (21) away from the workpiece (22) to be plated is an opening, and the anode (24) can be loaded into the anode box (21) through the opening.

5. The electroplating device according to claim 2, characterized in that: A baffle (25) is also provided in the upper tank body (10), and the baffle (25) is arranged on one side of the electroplating component (20) along a third direction and is spaced apart from the electroplating component (20), and the third direction is perpendicular to the first direction and the second direction respectively. The isolation plate (212) of the anode box (21) near the bottom of the upper tank body (10) extends along the third direction and is sealed with one end of the baffle (25). The frame structure (211) in the anode box (21) near the bottom of the upper tank body (10) is provided with a through hole on one side facing the baffle (25), and an exhaust channel is formed between the baffle (25) and the side wall of the upper tank body (10), and bubbles in the anode box (21) can enter the exhaust channel from the through hole and be discharged from the exhaust channel.

6. The electroplating device according to claim 5, characterized in that: A cathode channel is formed between the anode box (21) away from the bottom of the upper tank body (10) and the baffle (25), and the electroplating device also includes a clamp (26), and the clamp (26) can be inserted into the cathode channel along the first direction. The clamp (26) clamps the workpiece (22) to be plated and can drive the workpiece (22) to be plated to pass through the cathode area along the first direction.

7. The electroplating device according to any one of claims 1 to 6, characterized in that: The anode box (21) further comprises a shielding member (213), wherein the shielding member (213) is movably arranged between the anode (24) and the workpiece to be plated (22) along a third direction, wherein the third direction is respectively perpendicular to the first direction and the second direction.

8. The electroplating device according to claim 1, characterized in that: At least two spray systems (30) are provided in each cathode region, and at least two spray systems (30) are arranged at intervals along the first direction.

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