A distributed flexible sensor, a distributed sensing system and an electronic device

Abstract

The application discloses a distributed flexible sensor, a distributed sensing system and electronic equipment, wherein the distributed flexible sensor comprises at least one sensing body; the sensing body comprises a flexible base layer, a flexible conductive layer and a flexible encapsulation layer; the flexible conductive layer is arranged on the flexible base layer in a patterned form and is deformed along with the deformation of the flexible base layer; the electrical property of the flexible conductive layer changes along with the deformation of the flexible conductive layer, so that the electrical property of the flexible conductive layer can map the deformation direction and the deformation degree of multiple regions on the sensing body; and the flexible encapsulation layer covers the flexible conductive layer and the flexible base layer, so that the flexible conductive layer is located between the flexible base layer and the flexible encapsulation layer. The distributed flexible sensor and the distributed sensing system provided by the scheme can cover a larger detection area, can be better connected to multiple positions of an irregular object to be detected, and can simultaneously acquire signals of multiple positions of the object to be detected.

Description

Technical Field

[0001] This application relates to the field of sensor technology, and in particular to a distributed flexible sensor, a distributed sensing system, and an electronic device. Background Technology

[0002] With the development of modern technology and the popularization of smart terminals, applications in fields such as virtual reality, augmented reality, digital twins, and robotics are becoming increasingly widespread, and flexible sensors that can be applied to these fields are attracting more and more attention. For example, flexible sensors can be used in wearable human-computer interaction interfaces, wearable health monitoring devices, soft robots, and flexible skin. In applications, flexible sensors can reflect their own deformation state through the collected electrical signal data. Therefore, they can be used as wearable human-computer interaction interfaces, such as data gloves, to collect users' human motion data. They can also be used as wearable health monitoring devices, such as those installed at the knee and elbow joints, to collect and monitor the wearer's joint angle data and estimate the wearer's limb movement health status. They can also be embedded in the body of a soft robot or cover the surface of the robot to monitor the driving state of the soft robot in real time, such as the bending state of a crawling soft robot driven by feedback positive pressure, to control the crawling of the soft robot.

[0003] However, due to the conductivity of their flexible sensitive areas, existing flexible sensors can only detect relatively small areas. Forcibly increasing the coverage area to enlarge the detection region can lead to a sharp increase in resistance rendering them unusable, or require external conductive lines to mitigate the effects of increased resistance. Furthermore, due to their mechanical limitations, they are prone to damage during stretching and / or compression, resulting in poor sensor stability. Moreover, for these reasons, flexible sensors in related technologies cannot adaptively adjust to the spatial shape characteristics of the object under test. Therefore, they cannot be effectively connected to different locations on objects with irregular spatial shapes, nor can they adequately cover areas prone to deformation and / or compression. In other words, they cannot acquire signals from multiple key locations on the object based on its strain and / or pressure distribution characteristics.

[0004] Therefore, the existing flexible sensors can only cover a small detection area and are difficult to connect well to multiple locations of irregular objects to acquire signals from multiple locations simultaneously. This results in the existing flexible sensors having limited functionality and low accuracy, failing to meet market demands. Summary of the Invention

[0005] In view of this, the purpose of this application is to provide a distributed flexible sensor, a distributed sensing system and an electronic device to solve the problem that existing flexible sensors have a small detection area and are difficult to adapt to irregular objects to be measured.

[0006] To achieve the above-mentioned technical objectives, the first aspect of this application provides a distributed flexible sensor, comprising: at least one sensing element;

[0007] The sensor comprises: a flexible substrate layer, a flexible conductive layer, and a flexible encapsulation layer;

[0008] The flexible conductive layer is patterned on the flexible substrate layer and is used to deform in accordance with the deformation of the flexible substrate layer.

[0009] The electrical properties of the flexible conductive layer change with its own deformation, so that the electrical properties of the flexible conductive layer can map the deformation direction and degree of deformation of multiple regions on the sensor.

[0010] The flexible encapsulation layer covers the flexible conductive layer and the flexible substrate layer, such that the flexible conductive layer is located between the flexible substrate layer and the flexible encapsulation layer.

[0011] Furthermore, the flexible conductive layer includes a highly sensitive portion and a low-sensitive portion;

[0012] Both the highly sensitive portion and the low-sensitive portion are patterned on the flexible substrate, and the sensitivity of the highly sensitive portion is greater than that of the low-sensitive portion. The sensitivity is used to characterize the degree of change in electrical performance of different parts of the sensor under the same deformation.

[0013] Furthermore, the flexible conductive layer includes multiple highly sensitive portions located at different positions.

[0014] Furthermore, the electrical properties are resistive and / or capacitive characteristics.

[0015] Furthermore, both the highly sensitive part and the low sensitive part are composed of flexible conductive lines arranged in a patterned manner;

[0016] The highly sensitive part is provided with multiple flexible conductive lines, and at least two of the flexible conductive lines of the highly sensitive part are arranged side by side to form a sensing array;

[0017] The resistance and / or capacitance characteristics of the sensing array are used to reflect the direction and degree of deformation at the location of the sensing array.

[0018] Furthermore, at least two of the flexible conductive lines of the highly sensitive part are arranged parallel to each other according to a preset sensitive direction, and the two parallel and adjacent flexible conductive lines are electrically connected to form the sensing array.

[0019] The sensing array has a higher degree of sensitivity in the sensitive direction than it has in other directions besides the sensitive direction.

[0020] Furthermore, the flexible conductive circuit of the highly sensitive part includes a first conductive circuit;

[0021] Multiple first conductive lines are provided, wherein at least two first conductive lines are arranged parallel to each other and connected in series along the sensitive direction.

[0022] The resistance characteristics of the first conductive lines connected in series are used to map the direction and degree of deformation at the induction array.

[0023] Furthermore, the flexible conductive circuit of the highly sensitive part includes multiple third conductive circuits;

[0024] Multiple of the aforementioned third conductive lines constitute at least one capacitor unit;

[0025] The capacitance characteristics of the capacitor unit are used to map the deformation direction and degree at the induction array.

[0026] Furthermore, each highly sensitive part is provided with multiple sensing arrays, and the sensing directions of each sensing array are different, so that each highly sensitive part has multiple sensing directions. The sensitivity in the sensing direction can be adjusted by adjusting the number of flexible conductive lines corresponding to the same sensing direction in the single highly sensitive part.

[0027] Furthermore, the cross-sectional area of ​​the flexible conductive line in the highly sensitive part is smaller than that in the low-sensitivity part, and the sensitivity of the highly sensitive part or the low-sensitivity part can be adjusted by adjusting the cross-sectional area of ​​the highly sensitive part or the low-sensitivity part.

[0028] Furthermore, the cross-sectional area of ​​the flexible conductive line in the highly sensitive part is equal to the cross-sectional area of ​​the flexible conductive line in the low-sensitive part, and the sensitivity of the highly sensitive part or the low-sensitive part can be adjusted by adjusting the cross-sectional area of ​​the highly sensitive part or the low-sensitive part.

[0029] Furthermore, the highly sensitive portion and the low-sensitive portion are electrically connected in a patterned manner to form a sensing unit consisting of at least one highly sensitive portion and at least two low-sensitive portions.

[0030] Furthermore, the sensing unit includes a minimum sensing unit consisting of one highly sensitive part and two low-sensitive parts;

[0031] In the minimum sensing unit, the highly sensitive part is provided with two access terminals, and the two low-sensitive parts are respectively connected to the two access terminals.

[0032] Furthermore, the cross-sectional area of ​​the flexible conductive line in the highly sensitive part is equal to the cross-sectional area of ​​the flexible conductive line in the low-sensitive part, and the sensitivity of the highly sensitive part or the low-sensitive part can be adjusted by adjusting the cross-sectional area of ​​the highly sensitive part or the low-sensitive part.

[0033] Furthermore, in the minimum sensing unit, one of the low-sensitivity parts includes a first circuit, and the other low-sensitivity part includes a second circuit and a third circuit;

[0034] The first line and the second line are respectively connected to the two access terminals of the highly sensitive part;

[0035] The third line is short-circuited with the first line or the second line;

[0036] The first, second, and third lines are arranged in parallel side by side.

[0037] Furthermore, the two access terminals of the highly sensitive part are respectively disposed on opposite sides of the highly sensitive part to increase the spacing between the two low-sensitive parts in the minimum sensing unit.

[0038] Furthermore, both access terminals of the highly sensitive portion are located on the same side of the highly sensitive portion to reduce the spacing between the two low-sensitive portions in the minimum sensing unit.

[0039] Furthermore, the sensing unit includes a composite sensing unit composed of a plurality of highly sensitive parts and a plurality of low-sensitive parts.

[0040] Furthermore, each of the highly sensitive parts of the composite sensing unit is connected to two of the low-sensitive parts, and two adjacent highly sensitive parts are connected to the same low-sensitive part on an adjacent side.

[0041] Furthermore, a plurality of sensing units are provided on a single sensor.

[0042] Furthermore, the sensor is provided with a hollowed-out portion;

[0043] The hollowed-out portion is used to improve the tensile properties of the sensor.

[0044] Furthermore, it also includes a signal connector electrically connected to the flexible conductive layer of each of the sensors to collect electrical signals from each of the sensors.

[0045] Furthermore, the signal connector includes electrodes;

[0046] One end of the electrode is embedded inside the sensor and electrically connected to the flexible conductive layer, while the other end of the electrode is disposed outside the sensor.

[0047] Furthermore, the flexible encapsulation layer is provided with a first through hole, which is used for electrical connection between the flexible conductive layer and the signal connector.

[0048] Furthermore, the signal connector includes a flexible circuit board;

[0049] The flexible circuit board is provided with signal acquisition contacts, which are electrically connected to the flexible conductive layer through the first through hole, and at least a portion of the flexible encapsulation layer of each of the sensors is connected to the flexible circuit board.

[0050] Furthermore, the flexible conductive layer is provided with multiple layers;

[0051] A flexible isolation layer is provided between two adjacent flexible conductive layers.

[0052] Furthermore, the flexible isolation layer is provided with a second through hole, and adjacent flexible conductive layers are electrically connected through the second through hole.

[0053] Furthermore, the flexible isolation layer is provided with a third through hole;

[0054] The third through holes on the multiple adjacent flexible isolation layers are interconnected to form connection holes, so that two non-adjacent flexible conductive layers can be electrically connected through the connection holes.

[0055] Furthermore, the flexible encapsulation layer is provided with a first through-hole;

[0056] The first through hole and the connecting hole are connected so that the flexible conductive layer, which is not adjacent to the flexible encapsulation layer, can be connected to the signal connector through the first through hole and the connecting hole.

[0057] Furthermore, the flexible conductive layer comprises a stretchable conductor material;

[0058] The stretchable conductor material is selected from one or more of the following: liquid metal stretchable conductor, silver nanowire stretchable conductor, carbon nanomaterial stretchable conductor, and sheet silver stretchable conductor;

[0059] The materials of the flexible substrate layer and the flexible encapsulation layer are selected from one or more of the following: polydimethylsiloxane, natural rubber, polyurethane, polyethylene, polyvinyl alcohol, polytetrafluoroethylene, polyimide, polystyrene, polyethylene terephthalate, polylactic acid, polyglycolic acid, polylactic acid-glycolic acid copolymer, polylactic acid-caprolactone, poly-L-lactide-caprolactone, polyvinyl chloride, and polycaprolactone.

[0060] Furthermore, the liquid metal stretchable conductor includes any one or a combination of at least two of gallium indium alloy, gallium indium tin alloy, gallium indium tin zinc alloy, or gallium zinc alloy.

[0061] Furthermore, the flexible conductive layer also includes an organic polymer material for adjusting the permittivity and / or magnetic permeability;

[0062] The organic polymer material is selected from one or more of the following: hydroxyl-terminated polydimethylsiloxane, amino-terminated polydimethylsiloxane, alkoxy-terminated polydimethylsiloxane, and carboxyl-terminated polydimethylsiloxane.

[0063] A second aspect of this application provides a distributed sensing system, including a distributed flexible sensor as described in any of the preceding claims;

[0064] The distributed flexible sensor is used to connect to the object under test to detect the strain distribution characteristics of the object under test.

[0065] The distributed flexible sensor also includes a main module;

[0066] The main module includes: a data acquisition component, a processing component, and a communication component;

[0067] The acquisition component is electrically connected to the flexible conductive layer of the distributed flexible sensor and is used to acquire electrical signals from the flexible conductive layer.

[0068] The processing component is electrically connected to the acquisition component and is used to obtain the strain distribution characteristic information of the object under test based on the electrical signal acquired by the acquisition component.

[0069] The communication component is electrically connected to the processing component and is used to send the strain distribution characteristic information from the processing component to the terminal.

[0070] Furthermore, the main module is provided in multiple forms;

[0071] The acquisition components of each of the main modules are electrically connected to the flexible conductive layer on one or more sensors.

[0072] Furthermore, the flexible conductive layer of the distributed flexible sensor includes a high-sensitivity portion and a low-sensitivity portion;

[0073] Both the highly sensitive portion and the low sensitive portion are distributed in a patterned form on the flexible substrate layer of the distributed flexible sensor;

[0074] The highly sensitive part and the low-sensitive part are electrically connected in a patterned manner to form a sensing unit consisting of at least one highly sensitive part and at least two low-sensitive parts.

[0075] The main module is provided in multiple ways, and the acquisition component of each main module is electrically connected to different sensing units on one or more of the sensors.

[0076] Furthermore, it also includes a space sensing component for acquiring spatial positioning information;

[0077] The space sensing component is electrically connected to the processing component;

[0078] The processing component is also used to determine the spatial location of the object under test based on the spatial positioning information and control the communication component to send the spatial location of the object under test to the outside, or to control the communication component to forward the spatial positioning information to the outside.

[0079] Furthermore, the space sensing components include a gyroscope, an accelerometer, and a magnetometer;

[0080] The gyroscope, the accelerometer, and the magnetometer are all electrically connected to the processing component.

[0081] Furthermore, the main module is provided in multiple forms;

[0082] The communication component is also used to receive a time synchronization signal from an external source, so as to send the corresponding spatial positioning information or the spatial location of the object to be measured based on the spatial positioning information to the external source.

[0083] Furthermore, it also includes an optical identification component connected to the main module;

[0084] The optical identification component is used to provide a light signal that can characterize the spatial position of the object under test.

[0085] A third aspect of this application provides an electronic device including any of the distributed flexible sensors or distributed sensing systems described above.

[0086] As can be seen from the above technical solutions, this application provides a distributed flexible sensor, a distributed sensing system, and an electronic device. The distributed flexible sensor includes at least one sensing element; the sensing element includes a flexible substrate layer, a flexible conductive layer, and a flexible encapsulation layer; the flexible conductive layer is patterned on the flexible substrate layer and deforms in accordance with the deformation of the flexible substrate layer; the electrical properties of the flexible conductive layer change with its own deformation, so that the electrical properties of the flexible conductive layer can map the deformation direction and degree of deformation of multiple regions on the sensing element; the flexible encapsulation layer covers the flexible conductive layer and the flexible substrate layer, such that the flexible conductive layer is located between the flexible substrate layer and the flexible encapsulation layer.

[0087] The flexible substrate, flexible conductive layer, and flexible encapsulation layer in this solution all possess excellent tensile properties. Therefore, the sensor can adapt to the spatial shape characteristics of the object under test and connect well to the object. Furthermore, since a single distributed flexible sensor can contain multiple sensors, the distributed flexible sensor in this solution can better connect to multiple locations on the object under test with irregular spatial shapes, and can reduce the contact area with the object under test to avoid significantly affecting the deformation performance of the object under test due to excessive contact area between the sensor and the object.

[0088] Furthermore, since the flexible conductive layer can deform with the deformation of the flexible substrate, and its electrical properties can change with the deformation, the electrical properties exhibited by the flexible conductive layer can map the deformation direction and degree of the sensor. Also, since the flexible conductive layer is patterned on the flexible substrate, its distribution can be adjusted to suit locations on the test object that are prone to deformation and / or pressure. Moreover, since multiple sensors can be used, the distributed flexible sensor provided in this solution can selectively acquire signals from multiple key locations on the test object based on its strain and / or pressure distribution characteristics, resulting in more accurate spatial shape characteristics of the test object obtained from the signals of the distributed flexible sensor. Additionally, it can reduce the number of sensor locations that need to be connected to the test object while maintaining detection accuracy, thus avoiding the influence of sensors connected to the test object on its deformation.

[0089] Meanwhile, since the flexible conductive layer can map the deformation direction of multiple locations on the sensor, as well as the degree of deformation in different deformation directions, the spatial shape characteristics of the object under test obtained from the signals of the distributed flexible sensor can be more accurate. Furthermore, since the flexible conductive layer is patterned on the flexible substrate, different patterns of the flexible substrate can be adjusted for one or more locations on the object under test. Thus, the signals obtained through the flexible conductive layer can map the deformation direction and degree of deformation at a single location on the object under test, or they can map the set of deformation directions and degrees of deformation at multiple locations on the object under test, thereby enabling more flexible detection while ensuring accuracy.

[0090] In summary, the distributed flexible sensor and distributed sensing system provided by this solution can cover a large detection area and can be well connected to multiple locations of irregular objects under test, and can simultaneously acquire signals from multiple locations of the objects under test. Therefore, it has high detection accuracy and a wide range of application scenarios, and can effectively solve the problem that the detection area covered by existing flexible sensors is small and difficult to adapt to irregular objects under test. Attached Figure Description

[0091] To more clearly illustrate the technical solutions in the embodiments of this application or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0092] Figure 1 This is a schematic diagram of the unfolded structure of a distributed flexible sensor provided in one embodiment of this application;

[0093] Figure 2 This is a schematic diagram of the patterned shape of a flexible conductive layer provided in one embodiment of this application;

[0094] Figure 3 This is a schematic diagram of the patterned shape of a flexible conductive layer provided in another embodiment of this application;

[0095] Figure 4A This is a partial structural diagram of a plurality of sensors provided in one embodiment of this application;

[0096] Figure 4B This is a partial structural schematic diagram of a plurality of sensors provided in another embodiment of this application;

[0097] Figure 5 This is a schematic diagram of the patterned shape of a flexible conductive layer provided in one embodiment of this application;

[0098] Figure 6A This is a schematic diagram of a flexible conductive layer with an induction array provided in one embodiment of this application;

[0099] Figure 6B This is a schematic diagram of a flexible conductive layer with an induction array provided in another embodiment of this application;

[0100] Figure 7A This is a partial structural diagram of a distributed flexible sensor provided in one embodiment of this application;

[0101] Figure 7B yes Figure 7A A schematic diagram of the distributed flexible sensors installed on the sphere.

[0102] Figure 7C This is a partial structural diagram of a distributed flexible sensor provided in another embodiment of this application;

[0103] Figure 7D yes Figure 7C A schematic diagram of the distributed flexible sensors installed on the sphere.

[0104] Figure 8A This is a schematic diagram of the structure of a sensing array provided in one embodiment of this application;

[0105] Figure 8B This is a schematic diagram of the structure of a sensing array provided in another embodiment of this application;

[0106] Figure 9A This is a partial structural schematic diagram of a sensor provided in one embodiment of this application;

[0107] Figure 9B This is a partial structural schematic diagram of a sensor provided in another embodiment of this application;

[0108] Figure 10 This is a schematic diagram of a resistive flexible conductive layer provided in one embodiment of this application;

[0109] Figure 11 This is a schematic diagram of a highly sensitive part provided in one embodiment of this application;

[0110] Figure 12 This is a schematic diagram of the connection of the smallest sensing unit provided in one embodiment of this application;

[0111] Figure 13 This is a schematic diagram of the structure of the smallest sensing unit provided in one embodiment of this application;

[0112] Figure 14 This is a schematic diagram of a distributed flexible sensor application with a composite sensing unit provided in one embodiment of this application;

[0113] Figure 15A This is a schematic diagram of a distributed flexible sensor application with a minimum sensing unit provided in one embodiment of this application;

[0114] Figure 15B This is an example diagram of a distributed flexible sensor with a composite sensing unit provided in another embodiment of this application;

[0115] Figure 16 This is a schematic diagram illustrating the application of a distributed flexible sensor provided in one embodiment of this application;

[0116] Figure 17 This is a cross-sectional view of the sensor and electrode connection provided in one embodiment of this application;

[0117] Figure 18A This is an exploded view of a sensor structure provided in one embodiment of this application, which has a first through hole and a second through hole.

[0118] Figure 18B This is an exploded view of a sensor structure provided in one embodiment of this application, which has a first through hole and a second through hole.

[0119] Figure 19 This is a cross-sectional view of a flexible circuit board connected to a sensor according to an embodiment of this application;

[0120] Figure 20 This is a cross-sectional view of a sensor with multiple flexible conductive layers provided in one embodiment of this application;

[0121] Figure 21A This is an exploded schematic diagram of a sensor with a multilayer flexible conductive layer using different patterning methods, provided in one embodiment of this application.

[0122] Figure 21B This is an exploded schematic diagram of a sensor with a multilayer flexible conductive layer using different patterning methods, provided in one embodiment of this application.

[0123] Figure 22 This is a schematic diagram of a sensor with different flexible conductive layers provided in one embodiment of this application;

[0124] Figure 23 This is a schematic diagram showing the connection between a distributed flexible sensor and a main module in a distributed sensing system provided in one embodiment of this application;

[0125] Figure 24 This is a schematic diagram of a distributed sensing system provided in one embodiment of this application;

[0126] Figure 25 This is a schematic diagram of a distributed sensing system provided in another embodiment of this application;

[0127] Figure 26A This is a schematic diagram of a distributed sensing system provided in one embodiment of this application applied to the human body;

[0128] Figure 26B This is a schematic diagram of a distributed sensing system provided in another embodiment of this application applied to the human body;

[0129] Figure 27 This is a schematic diagram of the main module including a space sensing component provided in one embodiment of this application. Detailed Implementation

[0130] The technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some, not all, of the embodiments of this application. Based on the embodiments of this application, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection claimed in this application.

[0131] In the description of the embodiments of this application, it should be noted that the terms "center," "upper," "lower," "left," "right," "vertical," "horizontal," "inner," and "outer," etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing the embodiments of this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on the embodiments of this application. In addition, the terms "first," "second," and "third" are used for descriptive purposes only and should not be construed as indicating or implying relative importance.

[0132] In the description of the embodiments of this application, it should be noted that, unless otherwise explicitly specified and limited, the terms "installation," "connection," and "linking" should be interpreted broadly. For example, they can refer to a fixed connection, a replaceable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal connection of two components. Those skilled in the art can understand the specific meaning of the above terms in the embodiments of this application based on the specific circumstances.

[0133] Please see Figure 1The first aspect of this application provides a distributed flexible sensor, including at least one sensor 100. The sensor 100 includes a flexible substrate layer 130, a flexible conductive layer 120, and a flexible encapsulation layer 110. The flexible conductive layer 120 is patterned on the flexible substrate layer 130 and is used to deform in accordance with the deformation of the flexible substrate layer 130. The electrical properties of the flexible conductive layer 120 change with its own deformation, so that the electrical properties of the flexible conductive layer 120 can map the deformation direction and degree of deformation of multiple regions on the sensor 100. The flexible encapsulation layer 110 covers the flexible conductive layer 120 and the flexible substrate layer 130, such that the flexible conductive layer 120 is located between the flexible substrate layer 130 and the flexible encapsulation layer 110.

[0134] In this embodiment, the flexible substrate layer 130, the flexible conductive layer 120, and the flexible encapsulation layer 110 all possess excellent tensile properties capable of elastic deformation. Therefore, the sensor 100 can be adapted to the spatial shape characteristics of different test objects and laid on the test object. Furthermore, since a single distributed flexible sensor can contain multiple sensors 100, the distributed flexible sensor can be connected to multiple locations on test objects with irregular spatial shapes. At the same time, by placing the sensor 100 at locations on the test object that are prone to deformation and / or pressure, compared to the method of the distributed flexible sensor fully covering the test object, the contact area between the distributed flexible sensor and the test object can be reduced to avoid significantly affecting the tensile properties of the test object due to an excessively large contact area between the sensor 100 and the test object.

[0135] Furthermore, since the flexible conductive layer 120 can deform with the deformation of the flexible substrate 130, and the electrical properties of the flexible conductive layer 120 can change with the deformation of the flexible conductive layer 120, the electrical properties exhibited by the flexible conductive layer 120 can map the deformation direction and degree of the sensor 100. Also, since the flexible conductive layer 120 is patterned on the flexible substrate 130, the distribution of the flexible conductive layer 120 on the flexible substrate 130 can be adjusted to adapt to locations on the object under test that are prone to deformation and / or pressure. Since multiple sensors 100 can be provided, the distributed flexible sensor provided in this embodiment can acquire signals from multiple key locations on the test object based on the strain distribution characteristics and / or pressure distribution characteristics of the test object. This makes the spatial shape characteristics of the test object obtained from the signals of the distributed flexible sensor more accurate. In addition, it can reduce the number of locations where the sensors 100 need to be connected to the test object while ensuring detection accuracy, thereby avoiding the sensor 100 connected to the test object from affecting the deformation performance of the test object.

[0136] Meanwhile, since the flexible conductive layer 120 can map the deformation direction and the degree of deformation at multiple locations on the sensor, the spatial shape characteristics of the object under test obtained from the signals of the distributed flexible sensor can be more accurate. In application, different patterns of the flexible substrate layer 130 can be adjusted for one or more locations on the object under test. The signals obtained through the flexible conductive layer 120 can map the deformation direction and degree of deformation at a single location on the object under test, or they can map the set of deformation directions and degrees of deformation at multiple locations on the object under test, thereby enabling more flexible detection while ensuring accuracy.

[0137] In summary, the distributed flexible sensor provided in this embodiment can cover a large detection area and can be well connected to multiple locations of an irregular object to be measured, and can simultaneously acquire signals from multiple locations of the object to be measured, thus having high detection accuracy and a wide range of application scenarios.

[0138] For more specific details, please refer to Figure 1 , Figure 1 This embodiment provides a distributed flexible sensor's unfolded structure diagram. The flexible conductive layer 120 is patterned on the flexible substrate layer 130, meaning that the flexible conductive layer 120 does not completely cover the flexible substrate layer 130 as a single unit, but is arranged on the flexible substrate layer 130 in a preset pattern. Therefore, a portion of the upper surface of the flexible substrate layer 130 is covered by the flexible conductive layer 120, while another portion is not covered. The flexible encapsulation layer 110 covering the flexible substrate layer 130 and the flexible conductive layer 120 serves both to protect the flexible conductive layer 120 and to fix it in place to maintain the pattern presented by the flexible conductive layer 120. Furthermore, the pattern formed by the flexible conductive layer 120 can be a connected whole or multiple unconnected parts. The methods for drawing the flexible conductive layer 120 on the flexible substrate layer 130 include, but are not limited to, one or more of drawing, spraying, screen printing, inkjet printing, and microfluidic patterning, and are not limited to these methods.

[0139] In applications, the distributed flexible sensor 200 can be connected to the object under test by attaching the flexible substrate layer 130 of the sensor 100 to the surface of the object under test.

[0140] Specifically, since the flexible substrate 130, flexible conductive layer 120, and flexible encapsulation layer 110 are interconnected, when the object under test deforms, the flexible substrate 130 connected to the object under test will deform along with the deformation of the object under test, thereby causing the flexible conductive layer 120 and flexible encapsulation layer 110 connected to the flexible substrate 130 to deform accordingly. Furthermore, since the electrical properties of the flexible conductive layer 120 can change with the deformation direction and degree of the flexible conductive layer 120 itself, the electrical properties of the flexible conductive layer 120 can map the deformation direction and degree of the flexible conductive layer 120, and thus can map the deformation direction and degree of the sensor 100 at the position of the object under test corresponding to the flexible conductive layer 120. Moreover, since the sensor 100 is connected to the object under test, when the object under test deforms and causes the sensor 100 to also deform, the change in the electrical properties of the flexible conductive layer 120 of the sensor 100 can map the deformation of the object under test itself. Therefore, the flexible distributed flexible sensor in this embodiment can be used as a strain sensor to detect the strain generated by an object, or as a strain-type pressure sensor to detect the pressure it receives, or it can detect the size of the object by detecting the degree of change in electrical properties caused by the deformation it undergoes after attaching to the object.

[0141] In one embodiment, the flexible conductive layer 120 includes a stretchable conductor material; the stretchable conductor material may be selected from one or more of the following: liquid metal stretchable conductor, silver nanowire stretchable conductor, carbon nanomaterial stretchable conductor, and sheet silver stretchable conductor;

[0142] The materials of the flexible substrate layer 130 and the flexible encapsulation layer 110 may be selected from one or more of the following: polydimethylsiloxane, natural rubber, polyurethane, polyethylene, polyvinyl alcohol, polytetrafluoroethylene, polyimide, polystyrene, polyethylene terephthalate, polylactic acid, polyglycolic acid, polylactic acid-glycolic acid copolymer, polylactic acid-caprolactone, poly-L-lactide-caprolactone, polyvinyl chloride, and polycaprolactone.

[0143] Specifically, the liquid metal stretchable conductor used in the stretchable conductor material includes any one or a combination of at least two of gallium indium alloy, gallium indium tin alloy, or gallium zinc alloy. Using any one or a combination of at least two of gallium indium alloy, gallium indium tin alloy, gallium indium tin zinc alloy, or gallium zinc alloy as the material for the liquid metal stretchable conductor enables the flexible conductive layer 120 to possess excellent stretchability and conductivity. For example, compared with DuPont elastic conductive ink (DuPont Intexar PE874), both the liquid metal stretchable conductor material used in this embodiment and the DuPont elastic conductive ink have a conductivity of less than 50 mΩ / sq / mil. Furthermore, after stretching tests on the liquid metal stretchable material and the DuPont elastic conductive ink used in this embodiment under the same initial conditions, it was found that the DuPont elastic conductive ink lost its conductivity when stretched to 200% of its original length, while the liquid metal stretchable material of this embodiment maintained good conductivity even at the same stretching rate. Therefore, the distributed flexible sensor of this embodiment has a larger detection area compared with similar sensors in related technologies. Furthermore, the liquid metal stretchable material of this embodiment supports the distributed detection characteristics of the distributed flexible sensor 200 of this invention, so that it can simultaneously detect strain at multiple different locations.

[0144] In one embodiment, the electrical properties of the flexible conductive layer 120 that can change with its own deformation can be resistive and / or capacitive properties.

[0145] Taking the electrical property of the flexible conductive layer 120 that changes with its own deformation, namely the resistance of the flexible conductive layer 120, as an example, please refer to... Figure 2 , Figure 2 This is a schematic diagram of the patterned shape of the flexible conductive layer provided in this embodiment. Figure 2 In this structure, the flexible conductive layer 120, after patterning, presents a resistive strain detection structure; the flexible conductive layer 120 includes two endpoints 121; the flexible conductive layer 120 extends along... Figure 2 When stretched in the vertical direction, the stretchable conductors constituting the flexible conductive layer 120 grow due to the stretching, increasing the resistance between the two endpoints 121 of the flexible conductive layer 120; when the flexible conductive layer 120 is stretched along the vertical direction... Figure 2 When stretched in the left-right direction, the stretchable conductors constituting the flexible conductive layer 120 shorten due to the stretching, resulting in a decrease in resistance between the two endpoints 121 of the flexible conductive layer 120. Therefore, Figure 2 The magnitude of the increase or decrease in resistance between the two endpoints 121 of the flexible conductive layer 120 shown can map the deformation direction and degree of the flexible conductive layer 120.

[0146] Taking the electrical property of the flexible conductive layer 120 that changes with its own deformation, namely the resistance of the flexible conductive layer 120, as an example, please refer to... Figure 3 , Figure 3 This is a schematic diagram of the patterned shape of another flexible conductive layer 120 provided in this embodiment. Figure 3 In the process, the flexible conductive layer 120, after patterning, presents a capacitive strain detection structure; wherein, the flexible conductive layer 120 includes two endpoints 121 and multiple capacitor units 122; along the flexible conductive layer 120... Figure 3 When the flexible conductive layer 120 is stretched vertically, the area between the capacitor units 122 formed by the patterning process of the flexible conductive layer 120 decreases and the distance between them increases, thus causing a decrease in the capacitance between the two endpoints 121 of the flexible conductive layer 120; when the flexible conductive layer 120 is stretched along the vertical direction, the area between the capacitor units 122 formed by the patterning process of the flexible conductive layer 120 decreases and the distance between them increases. Figure 3 When stretched in the left-right direction, the facing area between the capacitor units 122 formed by the patterning process of the flexible conductive layer 120 increases and the distance between them decreases, thus increasing the capacitance between the two endpoints 121 of the flexible conductive layer 120; therefore, Figure 3 The magnitude of the increase or decrease in capacitance between the two endpoints 121 of the flexible conductive layer 120 shown can map the deformation direction and degree of the flexible conductive layer 120. In applications, the flexible conductive layer 120 may contain multiple capacitor units 122, and the multiple capacitor units 122 are arranged in an interdigitated capacitor manner.

[0147] It should be noted that, Figure 2 and Figure 3 The endpoint 121 shown is intended to illustrate the... Figure 2 and Figure 3 The flexible conductive layer 120 shown in the diagram represents the locations where electrical connections are required to obtain electrical signals; therefore, Figure 2 and Figure 3 The endpoint 121 shown is merely an example of the electrical connection location of the flexible conductive layer 120, and not a specific structural limitation of the flexible conductive layer 120; similarly, the endpoint 121 in the following embodiments is also merely an example of the electrical connection location, and not a specific structural limitation.

[0148] Furthermore, in this embodiment, the flexible conductive layer 120 disposed on a single sensor 100 can be a connected whole or multiple separate parts, for example, in Figure 4A In the example, the flexible conductive layer 120 on the same sensor 100 is a single piece, while... Figure 4B In the example, the flexible conductive layer 120 on the same sensor 100 presents multiple separate parts.

[0149] Furthermore, the flexible conductive layer 120, in addition to having the following properties... Figure 2 or Figure 3 The resistive strain gauge or capacitive strain gauge structure shown can also be as follows: Figure 5 As shown, it simultaneously possesses a combination of the two structures described above, and, due to Figure 5 Both the resistive strain structure and the capacitive strain structure are presented as a whole by a flexible conductive layer 120 connected together and sharing two endpoints 121. Therefore, through... Figure 5 The electrical signals obtained from the two endpoints 121 combine the electrical signals provided by the two different structures described above. Since the electrical signals provided by the two structures have different characteristics, therefore, by... Figure 5 The electrical signals obtained from the two endpoints 121 can directly map the strain generated by the two different structures as a connected whole region, and can also be analyzed from... Figure 5 The electrical signals obtained from the two endpoints 121 in the flexible conductive layer 120 are two electrical signals corresponding to the resistive strain detection structure and the capacitive strain detection structure, respectively. These two signals can map the strain corresponding to the two regions where the two different structures are located. Therefore, the multiple signals obtained through the flexible conductive layer 120 can individually map the deformation direction and degree of deformation of multiple different regions on the test object, or they can map the set of deformation direction and degree of deformation of multiple locations on the test object.

[0150] In one embodiment, see Figure 6A and Figure 6B The flexible conductive layer 120 includes a highly sensitive portion 500 and a low-sensitive portion 501. Both the highly sensitive portion 500 and the low-sensitive portion 501 are patterned on the flexible substrate layer 130, and the sensitivity of the highly sensitive portion 500 is greater than that of the low-sensitive portion 501. The sensitivity is used to characterize the degree of change in electrical performance of different parts of the sensor 100 under the same deformation.

[0151] Specifically, although the electrical signal obtained through the flexible conductive layer 120 can map the set of strains in all regions distributed across the flexible conductive layer 120, the strain generated at the location of the highly sensitive portion 500 has a significant influence on the signal obtained through the flexible conductive layer 120. Therefore, it can be considered that the electrical signal obtained through the flexible conductive layer 120 maps to the strain generated at the location of the highly sensitive portion 500 of the flexible conductive layer 120. For example, Figure 6A and Figure 6B The flexible conductive layer 120 shown has a high-sensitivity portion and a low-sensitivity portion, both of which can change their resistance with the deformation that occurs at their location. However, when the same deformation occurs, the resistance change of the high-sensitivity portion is greater than that of the low-sensitivity portion.

[0152] It should be noted that although the electrical signal obtained through the flexible conductive layer 120 can map the sum of strains in all regions distributed across the flexible conductive layer 120, the highly sensitive portion 500 has a greater sensitivity. Therefore, the electrical signal obtained through the flexible conductive layer 120 can also map the strain in the region where the highly sensitive portion 500 is located. For example, through... Figure 2 The electrical signals obtained from the two endpoints 121 of the flexible conductive layer 120 can actually map the common deformation of the high-sensitivity part 500 and the low-sensitivity part 501. However, since the high-sensitivity part 500 has a greater sensitivity, the mapping relationship between the high-sensitivity part 500 and the deformation of the region where the high-sensitivity part 500 is located can also be established directly through the electrical signal.

[0153] In one embodiment, the flexible conductive layer 120 includes a plurality of highly sensitive portions 500 located at different positions.

[0154] Specifically, the distributed flexible sensor can have multiple sensors 100, thereby possessing multiple highly sensitive parts 500. In the case of the distributed flexible sensor of the present invention having multiple sensors 100, by setting multiple sensors 100 and adjusting the shape of each different sensor 100, the pattern of the flexible conductive layer 120, and the position attached to the object under test, it is possible to better connect to multiple positions of the object under test with irregular spatial shapes. Furthermore, it can reduce the contact area with the object under test to avoid significantly affecting the deformation performance of the object under test due to an excessively large contact area between the sensor 100 and the object under test, while also increasing the detection area of ​​the distributed flexible sensor 200.

[0155] In this embodiment, by providing multiple highly sensitive parts 500, on the one hand, each sensor 100 can be distributed at different positions on the object to be measured, so that the distributed flexible sensor can simultaneously measure the strain of different regions; on the other hand, the highly sensitive parts 500 of the flexible conductive layer 120 on a single sensor 100 are distributed in different regions on the sensor 100, so the strain of different regions on the sensor 100 can also be simultaneously measured through the flexible conductive layer 120 on a single sensor 100.

[0156] Reference Figure 7A , Figure 7AThis is a partial structural schematic diagram of a distributed flexible sensor provided in this embodiment. The distributed flexible sensor 200, composed of sensor elements 100, can be used to attach to a spherical object to detect the strain of the spherical object. The distributed flexible sensor 200 has only one sensor element 100. The sensor element 100 has multiple protrusions 124 for detecting the strain of different areas of the spherical object and a concentrator 123. Each protrusion 124 is connected to the concentrator 123. The concentrator 123 can be connected to a signal connector 700. The signal connector 700 is disposed in the interface area 210 of the concentrator 123 so that the signal connector 700 can simultaneously connect to the flexible conductive layer 120 distributed on each protrusion 124.

[0157] like Figure 7B As shown, Figure 7B yes Figure 7A A schematic diagram showing a distributed flexible sensor installed on a sphere such as a hollow rubber sphere. Figure 7B As shown, the tensile properties of the rubber material covered by the concentrated part 123 are greatly affected; therefore, after the distributed flexible sensor 200 is installed, the deformation of the hollow sphere after being subjected to force at a certain position can cause the distributed flexible sensor 200 to deform, and the deformation of the hollow sphere after being subjected to force at a certain position is significantly different from that before the distributed flexible sensor 200 was installed.

[0158] Reference Figure 7C , Figure 7C This is a partial structural schematic diagram of a distributed flexible sensor provided in another embodiment of this application. Figure 7C In the example, the distributed flexible sensor 200 can be used to attach to a spherical object to detect the strain of the spherical object, and the distributed flexible sensor 200 has a plurality of sensors 100, each sensor 100 is used to detect the strain in different regions of the spherical object, and at least a portion of each sensor 100 is disposed in the interface region 210 so that the signal connector 700 can connect to the flexible conductive layer 120 of each sensor 100.

[0159] like Figure 7D As shown. Figure 7D yes Figure 7C A schematic diagram showing a distributed flexible sensor installed on a sphere such as a hollow rubber sphere. Figure 7D In the example, compared to Figure 7B , Figure 7D The distributed flexible sensor 200 in the middle has multiple sensors 100, therefore... Figure 7B The hollow sphere surface covered by the entire concentrated part 123 Figure 7D The middle part is covered with multiple sensors 100 that are separated from each other; therefore Figure 7DCompared to the distributed flexible sensor 200 Figure 7B The distributed flexible sensor 200 in the middle can reduce the contact area with the hollow sphere to avoid significantly affecting the deformation performance of the hollow sphere due to the excessive contact area between the sensor 100 and the hollow sphere.

[0160] In one embodiment, see Figure 8A and Figure 8B Both the highly sensitive portion 500 and the low-sensitive portion 501 are composed of flexible conductive lines 600 arranged in a patterned manner. The highly sensitive portion 500 is provided with multiple flexible conductive lines 600, and at least two flexible conductive lines 600 of the highly sensitive portion 500 are arranged side by side to form an induction array 400. The resistance and / or capacitance characteristics of the induction array 400 are used to reflect the deformation direction and degree of deformation at the location of the induction array 400. Here, the flexible conductive lines 600 are arranged in a patterned manner, which means that the flexible conductive lines 600 can be continuous patterns or discontinuous patterns; similarly, the flexible conductive lines 600 can be winding and complex patterns or single straight-line patterns.

[0161] Specifically, multiple flexible conductive lines 600 arranged side by side form a resistive or capacitive sensing array 400. When the sensor 100 undergoes the same deformation, by arranging multiple flexible conductive lines 600 side by side, the resistance or capacitance change generated by the sensing array 400 can be made larger, thereby improving the sensitivity and accuracy of the distributed flexible sensor 200.

[0162] It should be noted that the deformation direction of the sensor 100 can be not only linear but also curved. Therefore, the sensing array 400, composed of multiple flexible conductive lines 600 arranged side-by-side with an arc, can sensitively detect deformations of specific shapes; specifically, such as... Figure 9A As shown, Figure 9A This is a partial structural diagram of a sensor provided in this embodiment. Figure 9A In the example, a sector-shaped resistive induction array 401 is provided on the sector-shaped sensor 100. When the sensor 100 undergoes sector-shaped deformation along the deformation direction shown in the figure, the stretching degree of its flexible conductive lines is greater than that of other arrangements. Therefore, Figure 9A The sensor array shown can detect sector deformation with relatively high sensitivity; similarly, as Figure 9B As shown, Figure 9B This is a partial structural schematic diagram of another sensor 100 provided in this embodiment. Figure 9BIn the example, a sector-shaped capacitive sensing array 402 is provided on the sector-shaped sensor 100. When the sensor 100 undergoes sector-shaped deformation along the deformation direction shown in the figure, the capacitance change of the sector-shaped capacitive sensing array 402 is greater than that of other arrangements. Figure 9B The sector-shaped capacitive sensing array 402 shown can detect sector-shaped deformation with relatively high sensitivity.

[0163] In addition, such as Figure 8A and Figure 8B As shown, the flexible conductive lines 600 that make up the induction array 400 can be arranged in a wavy pattern along one direction. Compared with setting the flexible conductive lines 600 as straight lines, this allows the flexible conductive lines 600 to have a more sensitive sensing intensity in multiple directions.

[0164] Furthermore, at least two flexible conductive lines 600 of the highly sensitive part 500 are arranged parallel to each other according to a preset sensitive direction, and the two parallel and adjacent flexible conductive lines 600 are electrically connected to form an induction array 400; the induction array 400 has a greater degree of sensitivity in the sensitive direction than in other directions.

[0165] Specifically, the sensing array 400, composed of multiple flexible conductive lines 600 arranged side by side with an arc, can detect deformation of a specific shape with relatively high sensitivity. However, it may not have a clear sensitive direction. In general, in order to improve the versatility of the distributed flexible sensor 200 so that it can be applied to different objects under test, arranging the multiple flexible conductive lines 600 in the sensing array 400 in parallel can make the sensing array 400 have a clear sensitive direction. This allows the user to estimate the main deformation direction of the object under test and align the sensitive direction of the sensing array with it when connecting the distributed flexible sensor 200 to the object under test, so as to maximize the sensitivity of the distributed flexible sensor 200 for the object under test.

[0166] It should be noted that a single sensing array 400 may have multiple sensing directions, and the sensing direction of the sensing array 400 does not necessarily refer to the direction with the highest sensitivity, but can refer to a set of one or more directions with significantly higher sensitivity than other directions.

[0167] In another embodiment, the flexible conductive layer 120, in addition to comprising patterned flexible conductive lines 600, can also be configured as a single sheet structure. This single sheet flexible conductive layer 120 includes insulating regions and conductive regions; wherein, the conductive regions can also be patterned within the insulating regions, specifically so that the flexible conductive layer 120 can change its electrical properties in response to the deformation of the flexible substrate.

[0168] In one embodiment, see Figure 8A The flexible conductive line 600 of the highly sensitive part 500 includes a first conductive line 601; multiple first conductive lines 601 are provided, wherein at least two first conductive lines 601 are arranged parallel to each other along the sensitive direction and connected in series; the resistance characteristics of the series-connected first conductive lines 601 are used to map the deformation direction and deformation degree at the sensing array 400.

[0169] Furthermore, the flexible conductive line 600 of the highly sensitive part 500 also includes a second conductive line 602; two parallel and adjacent first conductive lines 601 are connected in series through the second conductive line 602.

[0170] In this embodiment, the first conductive line 601 and the second conductive line 602 together form a resistive induction array 400.

[0171] In another embodiment, please refer to Figure 8B The flexible conductive line 600 of the highly sensitive part 500 includes multiple third conductive lines 603; the multiple third conductive lines 603 form at least one capacitor unit 122; wherein, each capacitor unit 122 may include two third conductive lines 603 arranged in parallel and spaced apart; the capacitance characteristics of the capacitor unit 122 are used to map the deformation direction and deformation degree at the sensing array 400.

[0172] Furthermore, the flexible conductive line 600 of the highly sensitive part 500 may also include a fourth conductive line 604; the fourth conductive line 604 may include two lines, and each fourth conductive line 604 may have multiple third conductive lines 603 arranged in parallel at intervals; the two fourth conductive lines 604 intersect each other to form multiple capacitor units 122 in the shape of interdigitated capacitors.

[0173] In one embodiment, see Figure 11 A single highly sensitive part 500 may be provided with multiple sensing arrays 400, and the sensing directions of each sensing array 400 are different, so that a single highly sensitive part 500 has multiple sensing directions. The sensitivity in the same sensing direction can be adjusted by adjusting the number of flexible conductive lines 600 in the same sensing direction of a single highly sensitive part 500.

[0174] In other embodiments, the cross-sectional area of ​​the flexible conductive line 600 of the highly sensitive part 500 is smaller than that of the flexible conductive line 600 of the low-sensitive part 501, and the sensitivity of the highly sensitive part 500 or the low-sensitive part 501 can be adjusted by adjusting the cross-sectional area of ​​the highly sensitive part 500 or the low-sensitive part 501.

[0175] Specifically, refer to Figure 6A , Figure 6A This is a schematic diagram of a flexible conductive layer with an induction array provided in an embodiment of this application; Figure 6A In the flexible conductive layer 120, a resistive sensing array 400 is incorporated. By increasing the cross-sectional area of ​​the flexible conductive lines in the low-sensitivity portion 501 and decreasing the cross-sectional area of ​​the flexible conductive lines in the high-sensitivity portion 500, more flexible conductive lines can be arranged side-by-side in a sensing array per unit area. This allows the flexible conductive lines in the sensing array to be stretched more than the flexible conductive lines in the low-sensitivity portion 501 under the same deformation, thus increasing the degree of resistance change of the sensing array under the same deformation and thereby improving the sensitivity of the sensing array. Furthermore, referring to… Figure 6B , Figure 6B This is a schematic diagram of another flexible conductive layer 120 with an induction array provided in an embodiment of this application; in Figure 6B In the flexible conductive layer 120, there is a capacitive sensing array 400. By increasing the cross-sectional area of ​​the flexible conductive lines in the low-sensitivity part 501 and decreasing the cross-sectional area of ​​the flexible conductive lines in the high-sensitivity part 500, more pairs of capacitor units 122 can be set in the sensing array per unit area. Therefore, the degree of capacitance change of the sensing array when the same deformation occurs can be increased, thereby improving the sensitivity of the sensing array.

[0176] It should be noted that although the electrical signal obtained through the flexible conductive layer 120 can map the sum of strains generated by the flexible conductive layer 120 in all areas distributed on the sensor 100, the strain generated at the location of the highly sensitive part 500 has a greater influence weight on the signal obtained through the flexible conductive layer 120. Therefore, the electrical signal obtained through the flexible conductive layer 120 can be regarded as mapping the strain generated at the location of the highly sensitive part 500 of the flexible conductive layer 120. Consequently, the highly sensitive part 500 needs to have a greater sensitivity than the low-sensitivity part 501 so that the electrical signal obtained through the flexible conductive layer 120 can be considered as mapping the strain of the region where the highly sensitive part 500 is located. To this end, the sensitivity of the sensor array can be improved by arranging multiple flexible conductive lines side by side and making the cross-sectional area of ​​the flexible conductive lines constituting the sensor array smaller than the cross-sectional area of ​​the flexible conductive lines in the low-sensitivity part 501.

[0177] Specifically, the sensitivity in a single highly sensitive part 500 can be adjusted by changing the number of flexible conductive lines 600 corresponding to the same sensitive direction; the more flexible conductive lines corresponding to the same sensitive direction, the greater the sensitivity of the highly sensitive part 500 in that sensitive direction.

[0178] In another embodiment, the cross-sectional area of ​​the flexible conductive line 600 of the highly sensitive part 500 is equal to the cross-sectional area of ​​the flexible conductive line 600 of the low-sensitive part 501, and the sensitivity of the highly sensitive part 500 or the low-sensitive part 501 can be adjusted by adjusting the cross-sectional area of ​​the highly sensitive part 500 or the low-sensitive part 501.

[0179] In one embodiment, please refer to Figure 6A and Figure 6B The high-sensitivity portion 500 and the low-sensitivity portion 501 are electrically connected in a patterned manner to form a sensing unit 101 consisting of at least one high-sensitivity portion 500 and at least two low-sensitivity portions 501.

[0180] Although the electrical signal obtained through the flexible conductive layer 120 can map the set of strains generated by the flexible conductive layer 120 in all areas distributed on the sensor 100, the strain generated at the location of the highly sensitive part 500 has a greater influence weight on the signal obtained through the flexible conductive layer 120. Therefore, the electrical signal obtained through the flexible conductive layer 120 can be regarded as mapping the strain generated at the location of the highly sensitive part 500 of the flexible conductive layer 120. Thus, the strain at the location of the highly sensitive part 500 of the sensing unit 101 can be calculated from the electrical signal obtained by the low-sensitivity part 501 of the sensing unit 101.

[0181] For details, please refer to Figure 12 , Figure 12 This is a connection diagram of the minimum sensing unit provided in the embodiment of this application. The sensing unit 101 includes a minimum sensing unit composed of a high-sensitivity part 500 and two low-sensitivity parts 501. In the minimum sensing unit, the high-sensitivity part 500 is provided with two access terminals 502, and the two low-sensitivity parts 501 are respectively connected to the two access terminals 502.

[0182] Since both the resistive sensing array 400 and the capacitive sensing array 400 that realize strain detection need to be connected to their two terminals 121 to work, the smallest sensing unit that can realize strain detection in a single area requires two low-sensitivity parts 501 to be connected to the two access terminals 502 of the sensing array of a single high-sensitivity part 500.

[0183] For example, regarding the resistance strain gauge structure, please refer to [link / reference]. Figure 10 , Figure 10 This is a schematic diagram of a resistive flexible conductive layer provided in an embodiment of this application. Figure 10In the minimum sensing unit, the flexible conductive lines 600 of the two low-sensitivity portions 501 respectively include a first line a1 and a second line a2, and in the minimum sensing unit, one low-sensitivity portion 501 includes a third line a3; the first line a1, the second line a2, and the third line a3 are all arranged in parallel side by side. The two ends of the flexible conductive line 600 of the high-sensitivity portion 500 are respectively connected to the first line a1 and the second line a2; the second line a2 or the first line a1 is short-circuited with the third line a3. The signal connector 700 can obtain the line resistance R of the first line a1 and the second line a2 by connecting the first line a1 and the second line a2. 线1 With the high-sensitivity part 500 resistor R 高 By connecting the signal connector 700 to the second line a2 and the third line a3, the line resistance R of the second line a2 and the third line a3 can be obtained. 线2 Since the first line a1, the second line a2, and the third line a3 are arranged in parallel, it can be assumed that the resistance of the first line a1, the second line a2, and the third line a3 is the same before and after deformation. Therefore, R can be obtained. 线1 =R 线2 Therefore, the resistance R can be solved. 高 The resistance value. That is, in this embodiment, the cross-sectional areas of the flexible conductive line 600 of the high-sensitivity part 500 and the flexible conductive line 600 of the low-sensitivity part 501 are equal, and the flexible conductive line 600 of the high-sensitivity part 500 needs to be connected to at least two sensing lines and auxiliary lines simultaneously. In this embodiment, the first line a1 and the second line a2 are connected to the two ends of the flexible conductive line 600 of the high-sensitivity part 500 as two sensing lines respectively, and the third line a3 is short-circuited to the first line a1 or the second line a2 as an auxiliary line. Thus, the resistance values ​​of the high-sensitivity part 500 and the low-sensitivity part 501 can be obtained by connecting the sensing lines and the auxiliary lines respectively, thereby obtaining the overall deformation of the flexible conductive layer 120 more accurately, and calculating the size change of the covered object through the deformation of the low-sensitivity part 501.

[0184] In one embodiment, such as Figure 6A and Figure 6B As shown, the two access terminals of the high-sensitivity part 500 are respectively disposed on opposite sides of the high-sensitivity part 500 to increase the spacing between the two low-sensitivity parts 501 in the minimum sensing unit.

[0185] In another embodiment, such as Figure 13 As shown, both access terminals of the high-sensitivity part 500 are located on the same side of the high-sensitivity part 500 to reduce the spacing between the two low-sensitivity parts 501 in the minimum sensing unit.

[0186] Specifically Figure 13 This is a schematic diagram of the structure of a minimum sensing unit provided in this embodiment. Figure 13 The smallest sensing unit shown has a high-sensitivity part 500 equipped with a resistive sensing array 400. Both access terminals 502 of the high-sensitivity part 500 are located on the same side of the high-sensitivity part 500. Therefore, the spacing between the two low-sensitivity parts 501 is small.

[0187] In other embodiments, in addition to the minimum sensing unit having only one high-sensitivity part 500 and two low-sensitivity parts 501, the sensing unit 101 also includes a composite sensing unit composed of multiple high-sensitivity parts 500 and multiple low-sensitivity parts 501.

[0188] Specifically, refer to Figure 14 , Figure 14 This is a schematic diagram illustrating the application of a distributed flexible sensor with a composite sensing unit provided in an embodiment of this application. Figure 14 In the example, the sensor 100 attached to the hand is used to detect the opening action of the index and middle fingers of the hand by the strain generated during the movement of the hand. The sensor 100 is provided with a composite sensing unit. The two highly sensitive parts 500 of the composite sensing unit are connected in series through the low sensitive parts 501. The two low sensitive parts 501 are respectively connected to the two ends of the two highly sensitive parts 500 connected in series. Therefore, the electrical signal obtained through the two low sensitive parts 501 can be mapped to the sum of the strain generated at the location of the two highly sensitive parts 500 in the composite sensing unit. Taking the composite sensing unit including two highly sensitive parts 500 as an example, the two highly sensitive parts 500 can be respectively set at the position between the base of the index finger and the base of the middle finger, and the access terminals 502 on the near side of the two are connected in series through the low sensitive part 501; since the skin between the index finger and the middle finger of the human hand can be stretched more obviously when the index finger and the middle finger of the human hand make an opening movement, by setting the two highly sensitive parts 500 of the sensor 100 in a Y shape and attaching them between the index finger and the middle finger of the human hand, the opening movement of the index finger and the middle finger of the human hand can be effectively detected.

[0189] Specifically, refer to Figure 14 At least a portion of the low-sensitivity units 501 connected to both ends of the two series-connected high-sensitivity units 500 are deployed in the interface region 210 so that the two low-sensitivity units 501 can be connected to the data interface respectively, thereby enabling the acquisition of the electrical signals corresponding to the two series-connected high-sensitivity units 500 through the data interface.

[0190] In one embodiment, each highly sensitive part 500 of the composite sensing unit is connected to two low-sensitive parts 501, and two adjacent highly sensitive parts 500 are connected to the same low-sensitive part 501 on an adjacent side.

[0191] Specifically, since both the resistive sensing array 400 and the capacitive sensing array 400, which implement strain detection, need to be connected to their two terminals 121 to operate, similarly to the minimum sensing unit, to obtain the electrical signal of a single high-sensitivity part 500 in the composite sensing unit to calculate the strain at the location of that high-sensitivity part 500, it is necessary to connect the high-sensitivity part 500 to two low-sensitivity parts 501 respectively, and connect both low-sensitivity parts 501 to the data interface. This allows the electrical signal corresponding to the high-sensitivity part 500 to be obtained through the data interface. However, if an over-sensitivity part is set... If there are many highly sensitive parts 500, then a large number of low-sensitive parts 501 need to be set up accordingly, and the acquisition circuit used to acquire electrical signals for calculation will occupy a large number of detection channels. Therefore, by connecting two adjacent highly sensitive parts 500 to the same low-sensitive part 501 on an adjacent side, and connecting the sensitive part to the data interface, two adjacent highly sensitive parts 500 can share the same low-sensitive part 501 to connect to the data interface, thereby reducing the number of low-sensitive parts 501 required, reducing processing requirements and saving material costs, while also reducing the detection channels that need to be occupied.

[0192] Specifically, refer to Figure 15A and Figure 15B ; Figure 15A This is a schematic diagram of a distributed flexible sensor application with a minimum sensing unit provided in an embodiment of this application; Figure 15A In this design, a sensor 100 attached to the hand is used to detect the bending and straightening movements of the thumb's fingertip joint and the proximal fingertip joint of the index finger by measuring the strain generated during the hand's movement. Two minimum sensing units have highly sensitive portions 500 attached to the thumb's fingertip joint and the proximal fingertip joint of the index finger, respectively. Each of the two highly sensitive portions 500 is connected to two low-sensitive portions 501, resulting in a total of four low-sensitive portions 501. To detect the electrical signals from the two highly sensitive portions 500, at least a portion of the four low-sensitive portions 501 is deployed in the interface region 210 to connect each of the four low-sensitive portions 501 to a data interface. Therefore, the acquisition circuit used to connect to the low-sensitive portions 501 via the data interface to obtain electrical signals for calculation occupies four acquisition channels.

[0193] Reference Figure 15B , Figure 15B This is an example diagram of a distributed flexible sensor with a composite sensing unit provided in another embodiment of this application; in Figure 15BIn this design, a sensor 100 attached to the hand detects the bending and straightening movements of the thumb's fingertip joint and the proximal fingertip joint of the index finger by measuring the strain generated during hand movement. The composite sensing unit has two highly sensitive portions 500 attached to the thumb's fingertip joint and the proximal fingertip joint of the index finger, respectively. The two highly sensitive portions 500 share a low-sensitive portion 501 on adjacent sides, thus the composite sensing unit has a total of three low-sensitive portions 501. At least a portion of each of the three low-sensitive portions 501 is deployed in the interface region 210 to connect to the data interface. Therefore, it can be seen that... Figure 15B Compared with the technical solution shown in the figure Figure 15A The technical solution reduces the quantity requirement of the low-sensitivity part 501, reduces processing requirements and saves material costs, while also reducing the number of detection channels required.

[0194] It should be noted that multiple sensing units 101 can be provided on a single sensor 100. Specifically, multiple minimum sensing units, multiple composite sensing units, or multiple minimum sensing units and multiple composite sensing units can be provided on a single sensor 100. This embodiment of the invention does not impose specific limitations on this. By providing multiple sensing units 101, more locations on the object to be tested can be covered according to the detection requirements.

[0195] In one embodiment, please refer to Figure 16 The sensor 100 is provided with a hollow portion 125; the hollow portion 125 is used to improve the tensile properties of the sensor 100.

[0196] Specifically, Figure 16 This is a schematic diagram illustrating the application of a distributed flexible sensor provided in an embodiment of this application. Figure 16 In the sensor 100, a hollow portion 125 is provided in a patterned form. By setting the shape, number and position of the hollow portion 125 in a patterned form, the flexible conductive layer 120 can improve its tensile performance in a preset stretching direction, and the sensor 100 can improve its fit with the object to be measured.

[0197] In this embodiment, the distributed flexible sensor 200 can be used to adhere to a spherical object to detect the strain of the spherical object. The distributed flexible sensor 200 has only one sensor element 100, which has multiple protrusions 124 for detecting strain in different regions of the spherical object and a concentrator 123. The concentrator 123 can be connected to a signal connector 700. Each protrusion 124 is connected to the concentrator 123. Furthermore, the concentrator 123 is also provided with multiple centrally symmetrical cutouts 125, so that... Figure 16 Compared to the distributed flexible sensor 200 shown in the figure Figure 7AThe distributed flexible sensor 200 shown in the figure has a smaller impact on the tensile properties of the spherical object surface after it is attached to the spherical object.

[0198] As described in the above application embodiments, the distributed flexible strain sensor provided in this application further includes a signal connector 700, which is electrically connected to the flexible conductive layer 120 of each sensor 100 to collect electrical signals from each sensor 100.

[0199] Specifically, in order to acquire signals from the flexible conductive layer 120, it is necessary to set up an acquisition circuit that is electrically connected to the distributed flexible sensor 200, that is, it is necessary to set up an acquisition circuit that is electrically connected to the flexible conductive layer 120 of each sensor 100 of the distributed flexible sensor 200. Therefore, in order to realize the electrical connection between the flexible conductive layer 120 of each sensor 100 of the distributed flexible sensor 200 and the above-mentioned acquisition circuit, the distributed flexible sensor 200 of this embodiment also includes a signal connector 700 for collecting electrical signals from each sensor 100.

[0200] It should be noted that a single distributed flexible sensor 200 may be equipped with a single signal connector 700 or multiple signal connectors 700, without limitation.

[0201] Specifically, since the signal connector 700 needs to collect electrical signals from each sensor 100, when the distributed flexible sensor 200 is provided with only a single signal connector 700, at least a portion of all sensors 100 of the distributed flexible sensor 200 are distributed within the range where the signal connector 700 can achieve electrical connection with the sensor 100; when the distributed flexible sensor 200 is provided with multiple signal interfaces, at least a portion of each sensor of the distributed flexible sensor 200 is distributed within the range where its corresponding signal interface can achieve electrical connection with the sensor 100.

[0202] Specifically, although the electrical signal obtained through the flexible conductive layer 120 can map the set of strains generated by the flexible conductive layer 120 in all areas distributed on the sensor 100, the strain generated at the location of the high-sensitivity part 500 has a significant influence on the signal obtained through the flexible conductive layer 120. Therefore, the electrical signal obtained through the flexible conductive layer 120 can be regarded as mapping the strain generated at the location of the high-sensitivity part 500 of the flexible conductive layer 120. Thus, the strain at the location of the high-sensitivity part 500 of the sensing unit 101 can be calculated from the electrical signal obtained by the low-sensitivity part 501 of the sensing unit 101. Based on this, the sensor 100 of this embodiment can regard the low-sensitivity part 501 as a wire acting on the electrical signal transmitted from the high-sensitivity part 500. Furthermore, since the distributed flexible sensor 200 has only a single signal interface, at least a portion of all the sensors 100 of the distributed flexible sensor 200 are distributed within the range where the signal connector 700 can make an electrical connection with the sensor 100. And since the distributed flexible sensor 200 has multiple signal connectors 700, at least a portion of each sensor 100 of the distributed flexible sensor 200 is distributed within the range where its corresponding signal connector 700 can make an electrical connection with that sensor 100. Therefore, at least a portion of the low-sensitivity part 501 of each sensor 100 of the distributed flexible sensor 200 is distributed within the range where its corresponding signal interface can make an electrical connection with it.

[0203] In one embodiment, see Figure 17 The signal connector 700 includes an electrode 710; one end of the electrode 710 is embedded inside the sensor 100 and electrically connected to the flexible conductive layer 120, and the other end of the electrode 710 is disposed outside the sensor 100.

[0204] Specifically Figure 17 This is a cross-sectional view of the sensor and electrode connection provided in an embodiment of this application; as shown. Figure 17 As shown, one end of the motor 710 extends into the sensor 100 and abuts against the flexible conductive layer 120 to be electrically connected to it. The other end extends out of the sensor 100 and can be electrically connected to the signal acquisition device, so that the external signal acquisition device can obtain the changes in the electrical performance of the flexible conductive layer 120 through the electrode 710.

[0205] In a further improved embodiment, please refer to Figure 18A The flexible encapsulation layer 110 is provided with a first through hole 111, which is used to allow the flexible conductive layer 120 to be electrically connected to the signal connector 700.

[0206] Specifically Figure 18AThis is an exploded view of a sensor with a first through-hole and a second through-hole provided in an embodiment of this application. The position of the first through-hole 111 corresponds to the position where the flexible conductive layer 120 is disposed on the flexible substrate layer 130. By providing the first through-hole 111, the electrode 710 can pass through the flexible encapsulation layer 110 and be electrically connected to the flexible conductive layer 120.

[0207] In another embodiment, please refer to Figure 19 The signal connector 700 includes a flexible printed circuit (FPC) 720. The FPC 720 has signal acquisition contacts 721, which are electrically connected to the flexible conductive layer 120 through a first through-hole 111. At least a portion of the flexible encapsulation layer 110 of each sensor 100 is connected to the FPC 720. By using the flexible printed circuit 720 to connect to the flexible conductive layer 120, the overall flexibility of the distributed flexible sensor 200 can be maintained while achieving signal acquisition, thus avoiding significant impact on the bending performance of the distributed flexible sensor 200 at the signal interface.

[0208] Specifically Figure 19 This is a cross-sectional view of the flexible circuit board 720 after it is connected to the sensor according to an embodiment of this application. The board body of the flexible circuit board 720 is attached to the flexible encapsulation layer 110. The signal acquisition contact 721 of the flexible circuit board 720 is disposed in the first through hole 111, and the signal acquisition contact 721 is connected to the flexible conductive layer 120 located in the first through hole 111 to realize the electrical connection between the signal interface and the flexible conductive layer 120.

[0209] Specifically, the flexible circuit board 720 is also provided with signal output contacts that correspond one-to-one with the signal acquisition contacts 721. The signal output contacts are used for electrical connection with external signal acquisition equipment.

[0210] It should be noted that, by using the electrode 710 to extend into the flexible encapsulation layer 110 and connect with the flexible conductive layer 120, on the one hand, the contact area between the electrode 710 and the flexible conductive layer 120 is small, and on the other hand, the thickness of the electrode 710 itself can easily push up the flexible encapsulation layer 110, causing a protrusion to form on the surface of the flexible encapsulation layer 110. The protrusion is more likely to damage the flexible conductive layer 120 when under pressure. In this embodiment, by setting a flexible circuit board 720 to connect multiple stretchable conductor lines of the flexible conductive layer 120, the contact area between the flexible circuit board 720 and the flexible encapsulation layer 110 and the flexible base layer 130 can be increased. On the other hand, it is not necessary to use multiple different electrodes 710 to connect multiple stretchable conductive lines. This allows the flexible circuit board 720 to be more firmly fixed between the flexible encapsulation layer 110 and the flexible base layer 130 and is less likely to form protrusions. This makes it less likely for the flexible circuit board 720 to slide relative to the flexible conductive layer 120, resulting in poor contact, abnormal signals, and damage under pressure. At the same time, because the flexible circuit board 720 is more firmly fixed, the overall waterproof performance is also improved and more stable.

[0211] Further, please refer to Figure 20 The flexible conductive layer 120 has multiple layers; a flexible insulating layer 140 is provided between two adjacent flexible conductive layers 120. Figure 20 This is a cross-sectional view of a sensor with multiple flexible conductive layers provided in an embodiment of this application.

[0212] like Figure 18A As shown, the flexible isolation layer 140 is provided with a second through hole 141, and two adjacent flexible conductive layers 120 are electrically connected through the second through hole 141.

[0213] In one embodiment, the flexible isolation layer 140 is provided with a third through hole 142; the third through holes 142 on two adjacent flexible isolation layers 140 are interconnected to form a connection hole, so that two non-adjacent flexible conductive layers 120 can be electrically connected through the connection hole.

[0214] It should be noted that conductors are provided in the second through hole 141 and the third through hole 142 to achieve electrical connection; the conductors in the second through hole 141 and the third through hole 142 can be stretchable conductor materials consistent with the material of the flexible conductive layer 120, or they can be conductive adhesives or metal materials. The embodiments of the present invention do not specifically limit this.

[0215] In this embodiment, the flexible encapsulation layer 110 may also be provided with a first through hole 111; the first through hole 111 and the connection hole are connected so that the flexible conductive layer 120, which is not adjacent to the flexible encapsulation layer 110, can be connected to the signal connector 700 through the first through hole 111 and the connection hole.

[0216] In the above embodiments, the multilayer flexible conductive layer 120 can adopt the same patterning method to enhance the sensitivity of the distributed flexible sensor 200.

[0217] Specifically, refer to Figure 18A The distributed flexible sensor 200 has two flexible conductive layers 120 with the same patterning on the sensing element 100. Specifically, Figure 18A The distributed flexible sensor 200 shown in the figure has two flexible conductive layers 120 that are patterned as the smallest sensing units for resistive strain detection. The low-sensitivity portions 501 corresponding to the two smallest sensing units are electrically connected through a second through-hole 141. The flexible encapsulation layer 110 has two first through-holes 111 corresponding to the low-sensitivity portions 501, which are electrically connected to the signal connector 700 through the first through-holes 111. Therefore, the electrical signal obtained through the signal connector 700 is equivalent to the sum of the electrical signals obtained by the two high-sensitivity portions 500 for strain detection at the same location, thus improving the sensitivity of the distributed flexible sensor 200.

[0218] Specifically, refer to Figure 18B , Figure 18B An exploded view of the structure of another sensor provided in this application embodiment, which has a first through hole and a second through hole. Figure 18B In the example, the sensor 100 of the distributed flexible sensor 200 is provided with two flexible conductive layers 120 using the same patterning. Specifically, Figure 18B The distributed flexible sensor 200 shown in the figure has two flexible conductive layers 120 that are patterned as the smallest sensing units for capacitive strain detection. The low-sensitivity portions 501 corresponding to the two smallest sensing units are electrically connected through a second through-hole 141. The flexible encapsulation layer 110 has two first through-holes 111 corresponding to the low-sensitivity portions 501, which are electrically connected to the signal connector 700 through the first through-holes 111. Therefore, the electrical signal obtained through the signal connector 700 is equivalent to the sum of the electrical signals obtained by the two high-sensitivity portions 500 performing strain detection at the same location, thus improving the sensitivity of the distributed flexible sensor 200.

[0219] In another embodiment, the multilayer flexible conductive layer 120 can be patterned in different ways. By using different patterning methods on different flexible conductive layers 120, the distributed flexible sensor 200 can have more sensitive directions at the same position. It is also possible to combine highly sensitive parts 500 with different detection principles at the same position of the sensor 100. For example, the highly sensitive parts 500 of two flexible conductive layers 120 can be placed at the same position of the sensor 100, and the highly sensitive parts 500 of the two flexible conductive layers 120 can have resistive sensing arrays and capacitive sensing arrays, respectively. This allows the two flexible conductive layers 120 to obtain two electrical signals that can map the strain at the same position of the sensor 100. By combining the two electrical signals, the detection accuracy can be improved.

[0220] Specifically, refer to Figure 21A , Figure 21A This is an exploded schematic diagram of a sensor with a multilayer flexible conductive layer using different patterning methods, provided in an embodiment of this application. Figure 21A In the example, the sensor 100 of the distributed flexible sensor 200 is provided with two flexible conductive layers 120 using different patterning methods. Specifically, Figure 21A The two flexible conductive layers 120 of the distributed flexible sensor 200 shown are both patterned as the smallest sensing units for resistive strain detection. The two smallest sensing units have different sensitive directions of the highly sensitive parts 500. Therefore, by setting highly sensitive parts 500 with different sensitive directions at the same position in the multilayer flexible conductive layers 120, the distributed flexible sensor 200 can have more different sensitive directions at the same position, thereby improving the detection accuracy of the distributed flexible sensor 200.

[0221] Specifically, refer to Figure 21B , Figure 21B This application provides an exploded schematic diagram of another sensor with a multilayer flexible conductive layer using different patterning methods. Figure 21B In the example, the sensor 100 of the distributed flexible sensor 200 is provided with two flexible conductive layers 120 using different patterning methods. Specifically, Figure 21B The two flexible conductive layers 120 of the distributed flexible sensor 200 shown are respectively patterned as the smallest sensing unit for resistive strain detection and the smallest sensing unit for capacitive strain detection, so that two kinds of electrical signals that can map the strain at the same position of the sensor body 100 can be obtained through the two flexible conductive layers 120 respectively. By combining the two electrical signals, the detection accuracy can be improved.

[0222] In one embodiment, the multiple flexible conductive layers 120 are made of different stretchable conductor materials so that the different flexible conductive layers 120 exhibit different electrical properties. Thus, by combining flexible conductive layers 120 of different materials, the composite electrical properties exhibited by the sensor 100 can meet the detection requirements.

[0223] Specifically, refer to Figure 22 , Figure 22 This is a schematic diagram of a sensor with different flexible conductive layers provided in an embodiment of this application. Figure 22 In the example, the sensor 100 has three flexible conductive layers 120, namely a first flexible conductive layer 1201, a second flexible conductive layer 1202, and a third flexible conductive layer 1203; wherein a first flexible isolation layer 1401 is disposed between the first flexible conductive layer 1201 and the second flexible conductive layer 1202, and a second flexible isolation layer 1402 is disposed between the second conductive layer and the third flexible conductive layer 1203. The first flexible conductive layer 1201 is provided with a highly sensitive part 500 having a capacitive strain sensing array, the second flexible conductive layer 1202 is provided with a highly sensitive part 500 having a resistive strain sensing array, and the third flexible conductive layer 1203 is only provided with a low-sensitivity part 501 for transmitting electrical signals from the first flexible conductive layer 1201 and the second flexible conductive layer 1202 to the signal interface. To address the different functions of the three flexible conductive layers 120, the three flexible conductive layers 120 use different stretchable conductor materials. The stretchable conductor material used in the first flexible conductive layer 1201, when used to make a capacitive strain sensing array, enables the capacitive strain sensing array to have greater sensitivity. Similarly, the stretchable conductor material used in the second flexible conductive layer 1202, when used to make a resistive strain sensing array, enables the resistive strain sensing array to have greater sensitivity. The stretchable conductor material used in the third flexible conductive layer 1203 has lower resistance, which enables it to better transmit electrical signals and reduce power consumption.

[0224] Furthermore, referring to Figure 22 The first flexible isolation layer 1401 and the second flexible isolation layer 1402 are both provided with a third through hole 142; the two third through holes 142 are interconnected to form a connection hole, so that the first flexible conductive layer 1201 and the third flexible conductive layer 1203 can be electrically connected through the connection hole; the second flexible isolation layer 1402 is provided with a second through hole 141, so that the second flexible conductive layer 1202 and the third flexible conductive layer 1203 can be electrically connected through the second through hole 141.

[0225] Furthermore, referring to Figure 22The flexible encapsulation layer 110 is provided with a first through hole 111 corresponding to each bottom sensitive part 501 of the third flexible conductive layer 1203. Each bottom sensitive part 501 of the third flexible conductive layer 1203 is electrically connected to the signal connector 700 through the first through hole 111, so that the signal connector 700 can collect electrical signals from the high sensitive parts 500 of the first flexible conductive layer 1201 and the second flexible conductive layer 1202.

[0226] In one embodiment, the flexible conductive layer 120 further includes an organic polymer material for adjusting the permittivity and / or permeability; wherein the organic polymer material is selected from one or more of the following: hydroxyl-terminated polydimethylsiloxane, amino-terminated polydimethylsiloxane, alkoxy-terminated polydimethylsiloxane, and carboxyl-terminated polydimethylsiloxane. By adding the above-mentioned organic polymer material to a liquid metal stretchable conductor including one or more of gallium indium alloy, gallium indium tin alloy, or gallium zinc alloy, the liquid metal stretchable conductor in the embodiments of the present invention can exhibit excellent electromagnetic wave absorption characteristics and improve the permittivity of the liquid metal stretchable conductor, thereby improving the performance of capacitors and capacitive sensors prepared based on the liquid metal stretchable conductor.

[0227] In applications, for example, a material such as polydimethylsiloxane can be placed between two adjacent third conductive lines 603 on the capacitor unit 122, thereby increasing the capacitance value of the capacitor unit 122 by increasing the dielectric constant of the medium between the two third conductive lines 603.

[0228] The distributed flexible sensor 200 provided in this embodiment of the invention has excellent tensile properties in its flexible substrate layer 130, flexible conductive layer 120, and flexible encapsulation layer 110. Therefore, the sensor 100 can adapt to the spatial shape characteristics of the object under test, thus enabling it to connect well to the object. Furthermore, since a single distributed flexible sensor 200 can contain multiple sensors 100, the distributed flexible sensor 200 provided in this embodiment of the invention can better connect to multiple locations of an object with an irregular spatial shape, and can reduce the contact area with the object under test to avoid significant impact due to excessive contact area between the sensor 100 and the object under test. This affects the tensile properties of the object under test and also increases the detection area of ​​the distributed flexible sensor 200. Furthermore, since the flexible conductive layer 120 can deform with the deformation of the flexible substrate 130, and the electrical properties of the flexible conductive layer 120 can change with its deformation, the electrical properties exhibited by the flexible conductive layer 120 can map the deformation direction and degree of the sensor 100. Also, since the flexible conductive layer 120 is patterned on the flexible substrate 130, its distribution on the flexible substrate 130 can be adjusted to suit locations on the object under test that are prone to deformation and / or pressure. Since multiple sensors 100 can be provided, the distributed flexible sensor 200 provided in this embodiment of the invention can selectively acquire signals from multiple key locations on the test object based on the strain distribution characteristics and / or pressure distribution characteristics of the test object. This makes the spatial shape characteristics of the test object obtained from the signals of the distributed flexible sensor 200 more accurate. In addition, it can reduce the number of locations where the sensors 100 need to be connected to the test object while ensuring detection accuracy, thereby avoiding the influence of the sensors 100 connected to the test object on the deformation performance of the test object. Furthermore, since the flexible conductive layer 120 can map the shape of multiple locations on the sensors 100... The change in direction and the degree of deformation in different deformation directions enable more accurate spatial shape features of the object under test obtained from the signals of the distributed flexible sensor 200. Furthermore, since the flexible conductive layer 120 is patterned on the flexible substrate layer 130, by adjusting different patterns of the flexible substrate layer 130 to target one or more locations on the object under test, the signals obtained through the flexible conductive layer 120 can map the deformation direction and degree of deformation at a single location on the object under test, or the set of deformation directions and degrees of deformation at multiple locations on the object under test, thereby enabling more flexible detection while ensuring accuracy.In summary, the distributed flexible sensor 200 and distributed sensing system of this invention can cover a large detection area and can be effectively connected to multiple locations of an irregular object to be measured, simultaneously acquiring signals from multiple locations of the object. Therefore, they possess high detection accuracy and a wide range of application scenarios.

[0229] Those skilled in the art will understand that the topology of the flexible conductive layer 120 and the sensor 100 shown above does not constitute a limitation on the embodiments of the present invention, and may include more or fewer components than shown, or combine certain components, or have different component arrangements.

[0230] The patterned shape and application scenarios of the flexible conductive layer 120 described in the embodiments of the present invention are for the purpose of more clearly illustrating the technical solutions of the embodiments of the present invention, and do not constitute a limitation on the technical solutions provided in the embodiments of the present invention; those skilled in the art will know that with the evolution of the distributed flexible sensor 200 and the emergence of new application scenarios, the technical solutions provided in the embodiments of the present invention are also applicable to similar technical problems.

[0231] In addition to the distributed flexible strain sensors mentioned above, please refer to Figures 1 to 25 A second aspect of this application provides a distributed sensing system, including a distributed flexible sensor 200 as described in any of the above claims; the distributed flexible sensor 200 is used to connect to a test object to detect strain distribution characteristic information of the test object. The strain distribution characteristic information is used to characterize the location, direction, and magnitude of the strain generated by the test object.

[0232] Please see Figure 23 The distributed flexible sensor 200 also includes a main module 220; the main module 220 includes: a data acquisition component 221, a processing component 222, and a communication component 223; the data acquisition component 221 is electrically connected to the flexible conductive layer 120 of the distributed flexible sensor 200 and is used to acquire electrical signals from the flexible conductive layer 120; the processing component 222 is electrically connected to the data acquisition component 221 and is used to obtain strain distribution characteristic information of the object under test based on the electrical signals acquired by the data acquisition component 221; the communication component 223 is electrically connected to the processing component 222 and is used to send the strain distribution characteristic information from the processing component 222 to the terminal.

[0233] The acquisition component 221 can acquire the electrical signal of the flexible conductive layer 120 through electrical connection with the flexible conductive layer 120; the processing component 222, which is electrically connected to the acquisition component 221, can obtain the electrical signal from the flexible conductive layer 120 from the acquisition component 221 and obtain strain distribution characteristic information based on the electrical signal; the communication component 223 can send the strain distribution characteristic information to the outside so that the external device receiving the strain distribution characteristic information can calculate the spatial characteristics of the object under test and the deformation or pressure of the object under test based on the strain distribution characteristic information.

[0234] In a more specific embodiment, the flexible conductive layer 120 of the distributed flexible sensor 200 includes a high-sensitivity portion 500 and a low-sensitivity portion 501; the high-sensitivity portion 500 and the low-sensitivity portion 501 are both distributed in a patterned form on the flexible substrate layer 130 of the distributed flexible sensor 200; the high-sensitivity portion 500 and the low-sensitivity portion 501 are electrically connected in a patterned form to form a sensing unit composed of at least one high-sensitivity portion 500 and at least two low-sensitivity portions 501; multiple main modules 220 are provided, and the acquisition components 221 of each main module 220 are electrically connected to different sensing units 101 on one or more sensors 100.

[0235] Both the highly sensitive part 500 and the low-sensitive part 501 can change their resistance according to the deformation of their location, but under the same deformation, the resistance change of the highly sensitive part 500 is greater than that of the low-sensitive part 501. By setting multiple main modules 220, and connecting multiple main modules 220 to an external signal acquisition device, the changes in the electrical performance of multiple sensing units 101 on multiple sensors 100 can be acquired simultaneously. After setting multiple sensing units 101 at different positions on the human body and at different positions on the object to be measured, the changes in the electrical performance of the overall system composed of multiple sensing units 101 can be acquired. For example, multiple sensing units 101 can be set on the arm, wrist, back, knee, leg, and soccer ball, respectively, so that when the user kicks the ball, the muscle stretching, movement, and deformation of the ball from the user to the ball can be acquired.

[0236] In one embodiment, the acquisition component 221 of the distributed sensing system is connected to the signal connector 700 of the distributed flexible sensor 200 to realize the electrical connection between the acquisition component 221 and the flexible conductive layer 120, that is, between the acquisition component 221 and the sensing unit 101.

[0237] Specifically, the main module 220 and the distributed flexible sensor 200 are detachably connected, that is, the acquisition component 221 and the signal connector 700 are detachably connected, so as to install the main module 220 onto the distributed flexible sensor 200 or remove the main module 220 from the distributed flexible sensor 200.

[0238] In one embodiment, multiple main modules 220 are provided; the acquisition components 221 of each main module 220 are electrically connected to the flexible conductive layers 120 on one or more sensors 100. By providing multiple main modules 220 on a single distributed flexible sensor 200, on the one hand, the detection channels that the distributed sensing system can have can be expanded, thereby supporting a larger number of sensing units 101 on a single sensor 100. On the other hand, the distance between the sensing unit 101 and the corresponding main module 220 can be reduced, thereby reducing the size of the low-sensitivity part 501 in the sensing unit 101. Therefore, the resistance of each sensing unit 101 can be reduced, so that the sensor can support a larger size.

[0239] In one embodiment, the distributed flexible sensor is provided with multiple signal interfaces. The multiple signal interfaces can correspond to one or more different sensing units 101 on the same sensing body.

[0240] Specifically, refer to Figure 24 , Figure 24 This is a schematic diagram of a distributed sensing system provided in an embodiment of this application. Figure 24In the example, the distributed sensing system includes a single sensor 100 and two main modules 220, namely a first main module 2201 and a second main module 2202. The sensor 100 has three sensing units 101: a first sensing unit 1011, a second sensing unit 1012, and a third sensing unit 1013. The first sensing unit 1011 and the second sensing unit 1012 are electrically connected to the first main module 2201 via a first signal connector 701, and the third sensing unit 1013 is electrically connected to the second main module 2202 via a second signal connector 702. This allows the first main module 2201 to acquire and analyze the electrical signals from the first sensing unit 1011 and the second sensing unit 1012, and the second main module 2202... It can collect and analyze the electrical signal of the third sensing unit 1013. When the distance between the first sensing unit 1011, the second sensing unit 1012 and the third sensing unit 1013 is far, setting two main modules 220 compared to setting one main module 220 can shorten the length of the low-sensitivity part 501 side that needs to be set in the above three sensing units 101. That is, it reduces the distance between the sensing unit 101 and the corresponding main module 220, thereby reducing the size of the low-sensitivity part 501 in the sensing unit 101. Therefore, it can reduce the resistance of each sensing unit so that the sensor can support a larger size.

[0241] It should be noted that there is not a one-to-one correspondence between the main module 220 and the signal connector 700. A single main module 220 can be connected to one signal connector 700 or multiple signal connectors 700; a single signal connector 700 can be connected to one main module 220 or multiple main modules 220, without any limitation.

[0242] In one embodiment, multiple sensors 100 and main modules 220 are provided, and the acquisition components 221 of each main module 220 are electrically connected to the flexible conductive layers 120 on one or more different sensors 100. By setting multiple sensors 100 and adjusting the shape of each different sensor 100, the pattern of the flexible conductive layers 120, and the position of each sensor 100 attached to the object under test, it is possible to better connect to multiple positions of the object under test with irregular spatial shapes, and to reduce the contact area with the object under test to avoid significantly affecting the deformation performance of the object under test due to excessive contact area between the sensor 100 and the object under test. At the same time, it also allows the detection position of the distributed sensing system to be set more flexibly.

[0243] In one embodiment, a single signal connector 700 can be electrically connected to sensing units 101 on different sensors 100.

[0244] Specifically, refer to Figure 25 , Figure 25 This is a schematic diagram of a distributed sensing system provided in another specific example of the present invention. Figure 24 In the example, the distributed sensing system has two sensors 100 and two main modules 220, namely a third main module 2203 and a fourth main module 2204; one of the two sensors 100 is provided with a fourth sensing unit 1014, and the other is provided with a fifth sensing unit 1015 and a sixth sensing unit 1016; wherein, the third main module 2203 is electrically connected to the fourth sensing unit 1014 through a third signal connector 703, and the fourth main module 2204 is electrically connected to the fifth sensing unit 1015 and the sixth sensing unit 1016 through the fourth signal connector 704 respectively.

[0245] Specifically, refer to Figure 26A , Figure 26A This is a schematic diagram of a distributed sensing system applied to the human body, as provided in an embodiment of this application. Figure 26A The distributed sensing system shown has a sensor 100 and a main module 220; the sensor 100 is simultaneously attached to the knee joints of both legs to detect the bending angle of the knee joints by means of the strain of the sensor 100 in the knee joint area; since only one sensor 100 and one main module 220 are provided, the single sensor 100 needs to cover the knee joints of both legs at the same time, resulting in the sensor 100 having an excessively large area.

[0246] Reference Figure 26B , Figure 26B This is a schematic diagram illustrating another distributed sensing system provided in this application, applied to the human body. Figure 26B In the example, the distributed sensing system has two sensors 100 and two main modules 220. The two main modules 220 are connected to the two sensors 100 respectively. The two sensors 100 are respectively attached to the knee joints of a person's legs to detect the knee joint's motion angle. Figure 26B It can be seen that by setting two main modules 220 to connect two sensors 100 respectively to replace a single larger sensor 100, it is possible to better connect to multiple locations of the object under test with irregular spatial shape, and to reduce the contact area with the object under test to avoid significantly affecting the deformation performance of the object under test due to the excessive contact area between the sensor 100 and the object under test. At the same time, it also allows the detection position of the distributed sensing system to be set more flexibly.

[0247] In one embodiment, the distributed sensing system further includes a spatial sensing component 224 for acquiring spatial positioning information. The spatial sensing component is electrically connected to the processing component 222. The processing component 222 is further configured to determine the spatial location of the object under test based on the spatial positioning information and control the communication component to send the spatial location of the object under test to the outside, or to control the communication component to forward the spatial positioning information to the outside.

[0248] In a specific example, the distributed sensing system includes Figure 7A The distributed flexible sensor 200 shown, after being installed on a hollow rubber sphere 300, can not only detect the surface strain of the hollow rubber sphere 300 to confirm its deformation, but also determine its spatial position through the spatial sensing component 224 of the main module 220 of the distributed sensing system. For example, after installing the distributed sensing system on a soccer ball, the distributed sensing system can acquire the strain distribution characteristic information corresponding to the soccer ball, and then measure the position where the soccer ball was kicked through the strain distribution characteristic information. Based on the spatial positioning information obtained by the spatial sensing component 224 of the main module 220 of the distributed sensing system, the spatial position of the soccer ball can be confirmed.

[0249] like Figure 27 As shown, Figure 27 This is a schematic diagram of a main module including a space sensing component, provided in an embodiment of this application. Figure 27 In the example, the distributed sensing system also includes a spatial sensing component 224, which is electrically connected to a processing component 222. The processing component 222 is also configured to determine the spatial location of the object under test based on the spatial positioning information and control the communication component to send the spatial location of the object under test to the outside, or to control the communication component to forward the spatial positioning information to the outside.

[0250] In a further improved embodiment, the space sensing component 224 includes a gyroscope, an accelerometer, and a magnetometer; the gyroscope, accelerometer, and magnetometer are all electrically connected to the processing component 222.

[0251] The difference between the current spatial position of the main module and the initial spatial position of the main module 220, which has been pre-calibrated, can be calculated using a gyroscope and an accelerometer. Therefore, the spatial positioning information that can be obtained by the spatial sensing component 224, which includes a gyroscope and an accelerometer, is a relative value based on the pre-calibrated initial position.

[0252] Specifically, in one embodiment, the spatial sensing component includes a gyroscope, an accelerometer, and a magnetometer. By using the magnetometer, an absolute spatial position reference frame can be provided. Therefore, the position of the main module in the aforementioned spatial position reference frame can be calculated using the gyroscope, accelerometer, and magnetometer. Thus, the spatial positioning information obtainable by the spatial sensing component including the gyroscope, accelerometer, and magnetometer is an absolute value in the spatial position reference frame determined based on the magnetometer.

[0253] In one embodiment, the main module 220 is provided with multiple components; the communication component 223 is also used to receive time synchronization signals from the outside, so as to send corresponding spatial positioning information or the spatial position of the object to be measured to the outside based on the time synchronization signals.

[0254] It should be noted that the spatial positioning information is used to characterize the spatial position of the spatial sensing component 224, that is, to characterize the spatial position corresponding to at least a part of the object under test. The processing component 222 of the main module 220 can forward the spatial positioning information to an external device through the control communication component 223 so that the external device can calculate the spatial positioning information to obtain the spatial position of the object under test. Alternatively, the processing component 222 of the main module 220 can also directly calculate the spatial positioning information to obtain the spatial position of the object under test and control the communication component 223 to send the spatial position of the object under test to the outside.

[0255] It should be noted that since spatial positioning information represents the spatial position of at least a part of the object under test, multiple main modules 220 can be connected to the object under test to obtain the spatial positions of multiple different parts corresponding to the main modules 220. Thus, the motion and deformation of the object under test in space can be calculated more accurately based on the changes in the spatial positions of different parts of the object under test combined with strain distribution information.

[0256] Specifically, spatial positioning information includes quaternions defined based on the Attitude and Heading Reference System (AHRS), as well as the acceleration direction and the corresponding acceleration value.

[0257] In one embodiment, an optical marking component connected to the main module 220 is also included; the optical marking component is used to provide a light signal capable of characterizing the spatial position of the object under test.

[0258] Specifically, the optical marking component includes a reflective sphere for passively reflecting optical signals, enabling positioning of the optical marking component based on the optical signals reflected by the reflective sphere.

[0259] Furthermore, the optical tagging component includes a light-emitting device for actively transmitting optical signals, enabling positioning of the optical tagging component based on the optical signals emitted by the light-emitting device.

[0260] In summary, the distributed sensing system provided in this embodiment of the invention utilizes a distributed flexible sensor whose flexible substrate layer 130, flexible conductive layer 120, and flexible encapsulation layer 110 all possess excellent tensile properties. Therefore, the sensor 100 can adapt to the spatial shape characteristics of the object under test, thus enabling better connection to the object. Furthermore, since a single distributed flexible sensor can contain multiple sensors 100, the distributed flexible sensor provided in this embodiment of the invention can better connect to multiple locations on objects with irregular spatial shapes, and can reduce the contact area with the object to avoid significantly affecting the tensile properties of the object due to excessive contact area between the sensor and the object. This also increases the distributed flexible sensing capacity. The detection area of ​​the sensor; furthermore, since the flexible conductive layer 120 can deform with the deformation of the flexible substrate 130, and the electrical properties of the flexible conductive layer 120 can change with the deformation of the flexible conductive layer 120, the electrical properties exhibited by the flexible conductive layer 120 can map the deformation direction and degree of the sensor. Also, since the flexible conductive layer 120 is patterned on the flexible substrate 130, the distribution of the flexible conductive layer 120 on the flexible substrate 130 can be adjusted to adapt to the locations of the object under test that are prone to deformation and / or pressure. Furthermore, since multiple sensors 100 can be provided, the distributed flexible sensor 200 provided in this embodiment of the invention can adjust the distribution of the strain of the object under test according to the strain distribution of the object under test. By selectively acquiring signals from multiple key locations on the test object using features and / or pressure distribution characteristics, the spatial shape features of the test object obtained from the signals of the distributed flexible sensor 200 can be made more accurate. Furthermore, it can reduce the number of locations where the sensor 100 needs to be connected to the test object while maintaining detection accuracy, thereby avoiding the sensor 100 affecting the deformation performance of the test object. Moreover, since the flexible conductive layer 120 can map the deformation direction and the degree of deformation at multiple locations on the sensor 100, the spatial shape features of the test object obtained from the signals of the distributed flexible sensor 200 can be made more accurate. Furthermore, since the flexible conductive layer 120 can map the deformation direction at multiple locations on the sensor 100, as well as the degree of deformation in different deformation directions, the spatial shape features of the test object obtained from the signals of the distributed flexible sensor 200 can be made more accurate. The conductive layer 120 is patterned on the flexible substrate 130. Therefore, by adjusting different patterns of the flexible substrate 130 to target one or more locations on the object under test, the signal obtained through the flexible conductive layer 120 can map the deformation direction and degree of deformation at a single location on the object under test, or it can map the set of deformation directions and degrees of deformation at multiple locations on the object under test. This allows for more flexible detection while maintaining accuracy. In summary, the distributed sensing system of this embodiment can cover a large detection area and can be well connected to multiple locations on an irregular object under test, and can simultaneously acquire signals from multiple locations on the object under test, thus having high detection accuracy and a wide range of application scenarios.

[0261] A third aspect of this application also provides an electronic device, which includes the distributed flexible sensor or the distributed sensing system in any of the above embodiments. The electronic device can be a device with a transmission interface, which, after being connected to the transmission interface via a wired or wireless connection, can acquire the electrical signals of the flexible conductive layer 120. The electronic device may also include a display screen, which can visually display the changes in the electrical signals of the flexible conductive layer 120 and can display the deformation of the flexible substrate layer 130 and / or the object covered by the flexible substrate layer 130, simulated based on the changes in the electrical signals of the flexible conductive layer 120.

[0262] The device embodiments described above are merely illustrative. The modules, components, and units described as separate parts may or may not be physically separate; that is, they may be located in one place or distributed across multiple network units. Some or all of the modules can be selected to achieve the purpose of this embodiment according to actual needs.

[0263] It will be understood by those skilled in the art that all or part of the content disclosed above can be implemented as software, firmware, hardware, and suitable combinations thereof. Some or all of the physical components can be implemented as software executed by a processor, such as a central processing unit, digital signal processor, or microprocessor, or as hardware, or as an integrated circuit, such as an application-specific integrated circuit. Such software can be distributed on a computer-readable medium, which can include computer storage media (or non-transitory media) and communication media (or transient media). As is known to those skilled in the art, the term computer storage media includes volatile and non-volatile, removable and non-removable media implemented in any method or technology for storing information (such as computer-readable instructions, data structures, program modules, or other data). Computer storage media includes, but is not limited to, RAM, ROM, EEPROM, flash memory or other memory technologies, CD-ROM, digital versatile disc (DVD) or other optical disc storage, magnetic cartridges, magnetic tape, disk storage or other magnetic storage devices, or any other medium that can be used to store desired information and is accessible to a computer. Furthermore, as is known to those skilled in the art, communication media typically contain computer-readable instructions, data structures, program modules, or other data in modulated data signals such as carrier waves or other transmission mechanisms, and may include any information delivery medium.

[0264] The above are merely preferred embodiments of this application and are not intended to limit the present invention. Although this application has been described in detail with reference to examples, those skilled in the art can still modify the technical solutions described in the foregoing examples or make equivalent substitutions for some of the technical features. However, any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of this application should be included within the protection scope of this application.

Claims

1. A distributed flexible sensor, characterized in that, include: At least one sensor; The sensor comprises: a flexible substrate layer, a flexible conductive layer, and a flexible encapsulation layer; The flexible conductive layer is patterned on the flexible substrate layer and is used to deform in accordance with the deformation of the flexible substrate layer. The flexible conductive layer comprises a stretchable conductor material; The electrical properties of the flexible conductive layer change with its own deformation, so that the electrical properties of the flexible conductive layer can map the deformation direction and degree of deformation of multiple regions on the sensor. The flexible encapsulation layer covers the flexible conductive layer and the flexible substrate layer, such that the flexible conductive layer is located between the flexible substrate layer and the flexible encapsulation layer; The flexible conductive layer includes a highly sensitive portion and a low-sensitive portion; The electrical signals obtained at the two ends of the flexible conductive layer can map the common deformation of the highly sensitive part and the low-sensitive part; Both the highly sensitive portion and the low-sensitive portion are patterned on the flexible substrate layer, and the sensitivity of the highly sensitive portion is greater than that of the low-sensitive portion. The sensitivity is used to characterize the degree of change in electrical performance of different parts of the sensor under the same deformation. The cross-sectional area of ​​the flexible conductive line in the highly sensitive part is smaller than that of the flexible conductive line in the low-sensitive part, and the sensitivity of the highly sensitive part or the low-sensitive part can be adjusted by adjusting the cross-sectional area of ​​the highly sensitive part or the low-sensitive part.

2. The distributed flexible sensor according to claim 1, characterized in that, The flexible conductive layer includes multiple highly sensitive portions located at different positions.

3. The distributed flexible sensor according to claim 1, characterized in that, The electrical properties of the sensor are resistive and / or capacitive.

4. The distributed flexible sensor according to claim 3, characterized in that, Both the highly sensitive part and the low sensitive part are composed of flexible conductive lines arranged in a patterned manner. The highly sensitive part is provided with multiple flexible conductive lines, and at least two of the flexible conductive lines of the highly sensitive part are arranged side by side to form a sensing array; The resistance and / or capacitance characteristics of the sensing array are used to reflect the direction and degree of deformation at the location of the sensing array.

5. The distributed flexible sensor according to claim 4, characterized in that, At least two of the flexible conductive lines of the highly sensitive part are arranged parallel to each other according to a preset sensitive direction, and the two parallel and adjacent flexible conductive lines are electrically connected to form the sensing array. The sensing array has a higher degree of sensitivity in the sensitive direction than it has in other directions besides the sensitive direction.

6. The distributed flexible sensor according to claim 5, characterized in that, The flexible conductive circuit of the highly sensitive part includes a first conductive circuit. Multiple first conductive lines are provided, wherein at least two first conductive lines are arranged parallel to each other and connected in series along the sensitive direction. The resistance characteristics of the first conductive lines connected in series are used to map the direction and degree of deformation at the induction array.

7. The distributed flexible sensor according to claim 4, characterized in that, The flexible conductive circuit of the highly sensitive part includes multiple third conductive circuits; Multiple of the aforementioned third conductive lines constitute at least one capacitor unit; The capacitance characteristics of the capacitor unit are used to map the deformation direction and degree at the induction array.

8. The distributed flexible sensor according to claim 4, characterized in that, Each highly sensitive element is provided with multiple sensing arrays, and the sensing directions of each sensing array are different, so that each highly sensitive element has multiple sensing directions.

9. The distributed flexible sensor according to claim 4, characterized in that, The highly sensitive portion and the low-sensitive portion are electrically connected in a patterned manner to form a sensing unit consisting of at least one highly sensitive portion and at least two low-sensitive portions.

10. The distributed flexible sensor according to claim 9, characterized in that, The sensing unit includes a minimum sensing unit consisting of one highly sensitive part and two low-sensitive parts; In the minimum sensing unit, the highly sensitive part is provided with two access terminals, and the two low-sensitive parts are respectively connected to the two access terminals.

11. The distributed flexible sensor according to claim 10, characterized in that, In the minimum sensing unit, one of the low-sensitivity parts includes a first circuit, and the other low-sensitivity part includes a second circuit and a third circuit; The first line and the second line are respectively connected to the two access terminals of the highly sensitive part; The third line is short-circuited with the first line or the second line; The first, second, and third lines are arranged in parallel side by side.

12. The distributed flexible sensor according to claim 10, characterized in that, The two access terminals of the highly sensitive part are respectively disposed on opposite sides of the highly sensitive part to increase the spacing between the two low-sensitive parts in the minimum sensing unit.

13. The distributed flexible sensor according to claim 10, characterized in that, Both access terminals of the highly sensitive part are located on the same side of the highly sensitive part to reduce the distance between the two low-sensitive parts in the minimum sensing unit.

14. The distributed flexible sensor according to claim 9, characterized in that, The sensing unit includes a composite sensing unit composed of multiple highly sensitive parts and multiple low-sensitive parts.

15. The distributed flexible sensor according to claim 14, characterized in that, Each of the highly sensitive parts of the composite sensing unit is connected to two of the low-sensitive parts, and two adjacent highly sensitive parts are connected to the same low-sensitive part on an adjacent side.

16. The distributed flexible sensor according to claim 9, characterized in that, A plurality of sensing units are provided on a single sensor.

17. The distributed flexible sensor according to claim 1, characterized in that, The sensor has a hollowed-out section; The hollowed-out portion is used to improve the tensile properties of the sensor.

18. The distributed flexible sensor according to claim 1, characterized in that, It also includes a signal connector electrically connected to the flexible conductive layer of each of the sensors to collect electrical signals from each of the sensors.

19. The distributed flexible sensor according to claim 18, characterized in that, The signal connector includes electrodes; One end of the electrode is embedded inside the sensor and electrically connected to the flexible conductive layer, while the other end of the electrode is disposed outside the sensor.

20. The distributed flexible sensor according to claim 18, characterized in that, The flexible encapsulation layer is provided with a first through hole, which is used for electrical connection between the flexible conductive layer and the signal connector.

21. The distributed flexible sensor according to claim 20, characterized in that, The signal connector includes a flexible circuit board; The flexible circuit board is provided with signal acquisition contacts, which are electrically connected to the flexible conductive layer through the first through hole, and at least a portion of the flexible encapsulation layer of each of the sensors is connected to the flexible circuit board.

22. The distributed flexible sensor according to claim 18, characterized in that, The flexible conductive layer is provided with multiple layers; A flexible isolation layer is provided between two adjacent flexible conductive layers.

23. The distributed flexible sensor according to claim 22, characterized in that, The flexible isolation layer is provided with a second through hole, and adjacent flexible conductive layers are electrically connected through the second through hole.

24. The distributed flexible sensor according to claim 22, characterized in that, The flexible isolation layer is provided with a third through hole; The third through holes on the multiple adjacent flexible isolation layers are interconnected to form connection holes, so that two non-adjacent flexible conductive layers can be electrically connected through the connection holes.

25. The distributed flexible sensor according to claim 24, characterized in that, The flexible encapsulation layer is provided with a first through-hole; The first through hole and the connecting hole are connected so that the flexible conductive layer, which is not adjacent to the flexible encapsulation layer, can be connected to the signal connector through the first through hole and the connecting hole.

26. The distributed flexible sensor according to any one of claims 1 to 25, characterized in that, The stretchable conductor material is selected from one or more of the following: liquid metal stretchable conductor, silver nanowire stretchable conductor, carbon nanomaterial stretchable conductor, and sheet silver stretchable conductor; The materials of the flexible substrate layer and the flexible encapsulation layer are selected from one or more of the following: polydimethylsiloxane, natural rubber, polyurethane, polyethylene, polyvinyl alcohol, polytetrafluoroethylene, polyimide, polystyrene, polyethylene terephthalate, polylactic acid, polyglycolic acid, polylactic acid-glycolic acid copolymer, polylactic acid-caprolactone, poly-L-lactide-caprolactone, polyvinyl chloride, and polycaprolactone.

27. The distributed flexible sensor according to claim 26, characterized in that, The liquid metal stretchable conductor includes any one or a combination of at least two of gallium indium alloy, gallium indium tin alloy, gallium indium tin zinc alloy, or gallium zinc alloy.

28. The distributed flexible sensor according to claim 27, characterized in that, The flexible conductive layer also includes organic polymer materials for adjusting permittivity and / or magnetic permeability.

29. A distributed sensing system, characterized in that, Including the distributed flexible sensor as described in any one of claims 1 to 25; The distributed flexible sensor is used to connect to the object under test to detect the strain distribution characteristics of the object under test. The distributed flexible sensor also includes a main module; The main module includes: a data acquisition component, a processing component, and a communication component; The acquisition component is electrically connected to the flexible conductive layer of the distributed flexible sensor and is used to acquire electrical signals from the flexible conductive layer. The processing component is electrically connected to the acquisition component and is used to obtain the strain distribution characteristic information of the object under test based on the electrical signal acquired by the acquisition component. The communication component is electrically connected to the processing component and is used to send the strain distribution characteristic information from the processing component to the terminal.

30. The distributed sensing system according to claim 29, characterized in that, The main module is configured in multiple ways; The acquisition components of each of the main modules are electrically connected to the flexible conductive layer on one or more sensors.

31. The distributed sensing system according to claim 30, characterized in that, The flexible conductive layer of the distributed flexible sensor includes a high-sensitivity portion and a low-sensitivity portion; Both the highly sensitive portion and the low sensitive portion are distributed in a patterned form on the flexible substrate layer of the distributed flexible sensor; The highly sensitive part and the low-sensitive part are electrically connected in a patterned manner to form a sensing unit consisting of at least one highly sensitive part and at least two low-sensitive parts. The main module is provided in multiple ways, and the acquisition component of each main module is electrically connected to different sensing units on one or more of the sensors.

32. The distributed sensing system according to claim 29, characterized in that, It also includes space sensing components for acquiring spatial positioning information; The space sensing component is electrically connected to the processing component; The processing component is also used to determine the spatial location of the object under test based on the spatial positioning information and control the communication component to send the spatial location of the object under test to the outside, or to control the communication component to forward the spatial positioning information to the outside.

33. The distributed sensing system according to claim 32, characterized in that, The space sensing components include a gyroscope, an accelerometer, and a magnetometer; The gyroscope, the accelerometer, and the magnetometer are all electrically connected to the processing component.

34. The distributed sensing system according to claim 33, characterized in that, The main module is configured in multiple ways; The communication component is also used to receive a time synchronization signal from an external source, so as to send the corresponding spatial positioning information or the spatial location of the object to be measured based on the spatial positioning information to the external source.

35. The distributed sensing system according to claim 29, characterized in that, It also includes an optical marking component connected to the main module; The optical identification component is used to provide a light signal that can characterize the spatial position of the object under test.

36. An electronic device, characterized in that, This includes the distributed flexible sensor as described in any one of claims 1 to 25 or the distributed sensing system as described in any one of claims 29 to 35.

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