Method for determining cause of image display abnormality, verification test platform, and storage medium

Abstract

This invention discloses a method, a verification test platform, and a storage medium for determining the cause of image display anomalies, in order to solve the technical problem in the prior art that the cause of image display anomalies in flat panel detectors cannot be quickly determined. The method includes: during the generation of detection image data on the flat panel detector panel, acquiring a first key parameter of the flat panel detector and a second key parameter of the image transmission part of the verification test platform; when the image display corresponding to the detection image data is abnormal, determining the cause of the image display anomaly based on whether the first key parameter and the second key parameter are within their respective normal ranges.

Description

Technical Field

[0001] This invention relates to the field of detection, and in particular to a method for determining the cause of abnormal image display, a verification test platform, and a storage medium. Background Technology

[0002] In the field of inspection, X-ray panels are widely used in medical diagnosis, industrial flaw detection, security inspection and other industries due to the penetrating power, differential absorption, photosensitive effect and fluorescence effect of X-rays.

[0003] The panel of an X-ray flat panel detector mainly consists of a scintillation material or fluorescent material layer, an amorphous silicon layer with photodiodes, and a thin film transistor (TFT) array structure. The photosensitive imaging principle of the X-ray flat panel detector is that after the scintillation material or fluorescent material layer is exposed to X-rays, the X-ray photons are converted into visible light, and then the amorphous silicon layer with photodiodes converts them into image electrical signals, outputting the corresponding image data.

[0004] In the existing technology, the process of mass shipping of X-ray flat panel detector panels requires shipment testing of each X-ray flat panel detector panel. This mainly involves using an X-ray verification platform to test whether the leakage current, afterimage, and other characteristics of the X-ray flat panel detector panel meet customer requirements. However, during the testing process, it is impossible to determine the cause of image anomalies in the X-ray flat panel detector panel, requiring testers to investigate the causes of image anomalies one by one, which greatly increases the workload of testers.

[0005] Therefore, how to quickly determine the cause of image anomalies in X-ray flat panel detectors during testing has become a pressing technical problem. Summary of the Invention

[0006] This invention provides a method for determining the cause of image display anomalies, a verification test platform, and a storage medium to solve the aforementioned technical problems existing in the prior art.

[0007] Firstly, to address the aforementioned technical problems, this invention provides a method for determining image display anomalies, applied to a verification and testing platform for a flat panel detector panel. The detection image data acquired by the flat panel detector panel is transmitted through the image transmission section of the verification and testing platform. The technical solution of this method is as follows:

[0008] During the generation of detection image data by the flat panel detector, the first key parameter of the flat panel detector and the second key parameter of the image transmission part of the verification test platform are acquired.

[0009] When the image corresponding to the detected image data is displayed abnormally, the cause of the abnormal image display is determined based on whether the first key parameter and the second key parameter are within their respective normal ranges.

[0010] One possible implementation involves acquiring a first key parameter of the flat panel detector and a second key parameter of the image transmission section of the verification test platform, including:

[0011] The relevant parameters of each readout chip and the exposure parameters of the X-rays corresponding to the detected image data are collected from the flat panel detector; the relevant parameters and the exposure parameters are determined as the first key parameters;

[0012] The working status of the image transmission section is collected to obtain the second key parameter.

[0013] One possible implementation involves determining the cause of the image display abnormality based on whether the first key parameter and the second key parameter are within their respective normal ranges, including:

[0014] Determine whether each parameter in the first key parameter is within its corresponding normal range;

[0015] If any of the first key parameters is outside the corresponding normal range, then the cause of the abnormal image display is determined to include a malfunction of the flat panel detector panel.

[0016] Determine whether the second key parameter is consistent with the preset working state;

[0017] If the second key parameter is inconsistent with the preset working state, then the cause of the image abnormality is determined to include a program abnormality of the verification test platform.

[0018] One possible implementation includes the following parameters:

[0019] The actual operating voltage, the actual operating current, and the actual operating temperature of the read chip.

[0020] One possible implementation involves determining whether each parameter in the first key parameter is within its corresponding normal range, including:

[0021] When the parameters in the first key parameters are the relevant parameters of the reading chip, determine whether the actual operating voltage is greater than the maximum value of the rated voltage of the reading chip, whether the actual operating current is greater than the maximum value of the rated current of the reading chip, and whether the actual operating temperature is greater than the maximum operating temperature of the reading chip.

[0022] If the actual operating voltage is greater than the maximum value of the rated current, then the reading chip is determined to be short-circuited, and the fault of the flat panel detector includes abnormal connection of the flip-chip thin film in the flat panel detector.

[0023] If the actual operating voltage is greater than the maximum value of the rated current, then the reading chip is determined to be short-circuited, and the fault of the flat panel detector includes an abnormality in the pin bonding area corresponding to the reading chip in the flat panel detector.

[0024] If the actual operating temperature is greater than the maximum operating temperature, then the operating mode of the read chip is determined to be abnormal.

[0025] One possible implementation, after determining whether the actual operating voltage is greater than the maximum value of the rated voltage of the read chip, further includes:

[0026] After determining that the rated voltage of each read chip is less than or equal to the maximum value of the rated voltage, calculate the voltage difference between the actual operating voltages of any two read chips in the flat panel detector panel;

[0027] Determine whether the voltage difference is less than a set threshold;

[0028] If not, the operating voltage of each read chip is corrected until the voltage difference is less than the set threshold.

[0029] One possible implementation includes the exposure parameters:

[0030] The time difference between the start of X-ray exposure and the start of acquiring the detection image data.

[0031] One possible implementation involves determining whether each parameter in the first key parameter is within its corresponding normal range, including:

[0032] When the parameter in the first key parameter is the exposure parameter of the reading chip, the time is started from the time when the exposure begins and stopped when the detection image data is started to be collected, so as to obtain the time difference;

[0033] Determine whether the time difference is within the set range corresponding to the preset X-ray dose;

[0034] If the time difference is outside the set range, it is determined that the actual X-ray illumination dose is inconsistent with the preset illumination dose, and the malfunction of the flat panel detector includes the X-ray illumination position deviation.

[0035] Secondly, embodiments of the present invention provide a verification and testing platform for a flat panel detector panel, comprising:

[0036] The data acquisition section is used to acquire the first key parameters of the flat panel detector panel during the generation of detection image data.

[0037] The image transmission section is used to acquire the detection image data, the first key parameter, and the second key parameter from the flat panel detector panel, and transmit them to the host computer; wherein, the second key parameter is used to characterize the working status of the image transmission section.

[0038] The host computer performs the method described in the first aspect.

[0039] One possible implementation includes the data acquisition section comprising:

[0040] A voltage sensor is used to acquire the actual operating voltage of the readout chip in the flat panel detector panel;

[0041] A current sensor is used to collect the actual operating current of the readout chip;

[0042] A temperature sensor is disposed on the surface of the read chip to collect the actual operating temperature of the read chip.

[0043] In one possible implementation, the data acquisition section further includes:

[0044] An X-ray sensor for detecting the X-rays is disposed at both ends of the X-plate and Y-plate in the image transmission section, near the side of the flat panel detector panel, and is used to determine the exposure parameters of the flat panel detector panel.

[0045] Thirdly, embodiments of the present invention also provide a readable storage medium, comprising:

[0046] memory,

[0047] The memory is used to store instructions that, when executed by a processor, cause the apparatus including the readable storage medium to perform the method described in the first aspect above. Attached Figure Description

[0048] Figure 1 A flowchart illustrating a method for determining the cause of image display abnormalities provided in an embodiment of the present invention;

[0049] Figure 2 A schematic diagram of the structure of a verification test platform for a flat panel detector panel provided in an embodiment of the present invention;

[0050] Figure 3 This is a schematic diagram showing the relative positions of the readout chip, the current sensor, and the voltage sensor provided in an embodiment of the present invention.

[0051] Figure 4The diagram shown is a connection diagram of the current sensor and voltage sensor provided in an embodiment of the present invention;

[0052] Figure 5 This is a schematic diagram showing the location of the temperature sensor provided in an embodiment of the present invention;

[0053] Figure 6 A graph showing the relationship between voltage offset and operating temperature of the read chip provided in an embodiment of the present invention;

[0054] Figure 7 This is a schematic diagram showing the position of the X-ray sensor provided in an embodiment of the present invention;

[0055] Figure 8 This is a schematic diagram of the program interface in the host computer provided in an embodiment of the present invention;

[0056] Figure 9 This is a schematic diagram illustrating the actual grayscale value differences of images corresponding to different readout chips in a flat panel detector provided in an embodiment of the present invention;

[0057] Figure 10 This is a schematic diagram of the structure of another verification test platform for a flat panel detector panel provided in an embodiment of the present invention. Detailed Implementation

[0058] The present invention provides a method for determining the cause of image display anomalies, a verification test platform, and a storage medium to solve the aforementioned technical problems existing in the prior art.

[0059] To better understand the above technical solutions, the technical solutions of the present invention will be described in detail below with reference to the accompanying drawings and specific embodiments. It should be understood that the embodiments of the present invention and the specific features in the embodiments are detailed descriptions of the technical solutions of the present invention, rather than limitations on the technical solutions of the present invention. In the absence of conflict, the embodiments of the present invention and the technical features in the embodiments can be combined with each other.

[0060] Please refer to Figure 1 This invention provides a method for determining the cause of image display anomalies, applied to a verification test platform for a flat panel detector panel. The detection image data acquired by the flat panel detector panel is transmitted through the image transmission part of the verification test platform. The processing procedure of this detection method is as follows.

[0061] Step 101: During the generation of detection image data on the flat panel detector panel, the first key parameter of the flat panel detector panel and the second key parameter of the image transmission part of the verification test platform are collected.

[0062] Step 102: When the image data corresponds to an abnormal image display, determine the cause of the abnormal image display based on whether the first key parameter and the second key parameter are within their respective normal ranges.

[0063] Please see Figure 2 This is a schematic diagram of the structure of a verification and testing system for a flat panel detector panel provided in an embodiment of the present invention.

[0064] The verification and testing system for flat panel detectors includes a data acquisition section ( Figure 2 (Not shown in the image) The image transmission section and the host computer, when the flat panel detector panel is inspected for shipment, the flat panel detector panel transmits the generated detection image data to the host computer through the data transmission section. At the same time, the data acquisition section collects the first key parameter and the second key parameter during the process of the flat panel detector panel generating detection image data and transmits them to the host computer for analysis, so that the host computer executes steps 101 and 102.

[0065] The aforementioned flat panel detector panel includes a panel (i.e., the X-ray detection area), a gate circuit chip, and a readout chip.

[0066] The panel of the flat panel detector is composed of a scintillating material or fluorescent material layer, an amorphous silicon layer with photodiodes, and a TFT array structure. The principle of photosensitive imaging is that after the scintillating material or fluorescent material layer is exposed to X-rays, the X-ray photons are converted into visible light, and then the amorphous silicon layer with photodiodes converts the visible light into image charge signals.

[0067] The Read Out Integrated Circuit (ROIC) chip converts the image charge signal output from the panel into a digital signal (i.e., image data, which this invention refers to as detection image data).

[0068] Gate ICs are used to control the charge output of each row of pixels in the control panel.

[0069] The data transmission component of the verification test platform includes the X board, Y board, and transmission lines.

[0070] The Y-board is used to bind the interface of the read chip. It transmits the control signals received from the X-board to the read chip, thereby enabling control of each row of pixels in the flat panel detector panel.

[0071] The X-board is used to control the reading chip and gate circuit chips, and transmit the detection image data obtained from the reading chip to the host computer for display.

[0072] For example, during the shipment inspection of an X-ray flat panel detector, after the X-ray flat panel detector receives the instruction from the host computer to start exposure, the panel in the X-ray flat panel detector performs image acquisition (that is, the pixels in the control panel convert the light signal into the charge signal line by line, and the reading chip converts the charge signal into detection image data). During the above-mentioned image acquisition process (that is, during the generation of detection image data), the data acquisition part in the verification test platform also needs to simultaneously acquire the first key parameter of the X-ray detector panel and the second key parameter of the image transmission part, so that the host computer can simultaneously obtain the detection image data acquired by the flat panel detector panel, as well as the first key parameter and the second key parameter.

[0073] After the host computer obtains the first and second key parameters, when the image display corresponding to the above detection image data is abnormal, it can determine whether the cause of the abnormal image display is due to factors of the flat panel detector panel itself, based on whether the first and second key parameters are within their respective normal ranges. This helps inspection and maintenance personnel to quickly find and discover problems, and reduce the inspection and maintenance costs of the flat panel detector panel.

[0074] In step 101 above, acquiring the first key parameters of the flat panel detector and the second key parameters of the image transmission section of the verification test platform can be achieved in the following ways:

[0075] The relevant parameters of each readout chip and the X-ray exposure parameters corresponding to the detected image data are collected from the flat panel detector panel; the relevant parameters and exposure parameters are determined as the first key parameters; the working status of the image transmission section is collected to obtain the second key parameters.

[0076] The relevant parameters of the aforementioned readout chip include its actual operating voltage, actual operating current, and actual operating temperature. The aforementioned exposure parameters represent the time difference between the start of X-ray exposure on the flat panel detector and the start of image data acquisition by the readout chip.

[0077] For example, with Figure 2 For example, during the generation of detection image data, the actual operating voltage, actual operating current, and actual operating temperature of the reading chip can be collected by voltage sensors, current sensors, and temperature sensors set on the reading chip.

[0078] The aforementioned voltage sensors are typically positioned between the reference voltage (Vref) and ground voltage (V) of the readout chip. GND Between 0.5 and 4.5V, the voltage sensor mentioned above is a common voltage sensor. The voltage range is selected according to the signal range of the reading chip. For example, if the signal range of the reading chip is 0.5~4.5V, then the voltage range of the voltage sensor is ±5V.

[0079] The aforementioned current sensors are typically located on the high-power integrating power supply pin (AVDDI) and common pin (such as AVDDI) of the readout chip. 2 AVSSI 2 Between 0 and 313 mA, the current sensor can be a standard current sensor. The current range of the current sensor can be selected based on the relevant data in the technical specifications of the read chip. For example, if the current requirement for the AVDDI pin of the read chip is less than 80mA, the measurement range of the current sensor is set in the milliampere range. If the current sensor has a maximum measurable range, but a portion of that maximum range is used in actual application, this selected portion is the measurement range of the current sensor. For example, if the current sensor chip is LTC3991, its maximum measurable range is ±5A, and the current requirement for the AVDDI pin of the read chip is less than 80mA, in order to measure such a small current, the measurement accuracy of the LTC3991 can be set to 1.223mA, making its actual measurement range 0~313mA. This is the measurement range for the current sensor to measure the current of the AVDDI pin of the read chip.

[0080] Please see Figure 3 This is a schematic diagram showing the relative positions of the readout chip, current sensor, and voltage sensor provided in an embodiment of the present invention. Figure 3 The diagram illustrates current and voltage sensors, but they should not be considered the same sensor; in fact, they are different sensors. Figure 4 The diagram shows the connection of the current sensor and voltage sensor provided in an embodiment of the present invention.

[0081] Please see Figure 5 This is a schematic diagram showing the location of a temperature sensor provided in an embodiment of the present invention. Figure 5 The readout chip is mounted on the corresponding board in the flat panel detector panel, while the temperature sensor is mounted on the surface of the readout chip, belonging to the data acquisition section of the verification test flat panel. The measurement range of this temperature sensor can be selected based on the maximum operating temperature of the readout chip. For example, if the maximum operating temperature of the readout chip is 70℃, then the measurement range of the temperature sensor can be selected as 0~120℃. The aforementioned temperature sensor can be a thermistor sensor.

[0082] like Figure 6 The figure shown is a graph illustrating the relationship between the voltage offset and operating temperature of the read chip provided in an embodiment of the present invention. Figure 6 The horizontal axis represents the operating temperature (range 0~120℃), and the vertical axis represents the offset voltage (range -250uV~1250uV). Assuming the chip's operating temperature range is 0~70℃, from... Figure 6It can be seen that when the reading chip exceeds its maximum operating temperature, the excessively high temperature has a significant impact on the voltage deviation of the reading chip, which in turn affects the chip's output results and lifespan. Therefore, by detecting the actual operating temperature of the reading chip, abnormal image display caused by this can be detected in a timely manner.

[0083] The aforementioned sensors can be used to collect data on the chip's actual operating temperature, actual operating current, and actual operating voltage, thereby obtaining relevant parameter data for the chip.

[0084] Please see Figure 7 This is a schematic diagram showing the position of the X-ray sensor provided in an embodiment of the present invention. To detect when X-ray exposure begins, an X-ray sensor needs to be installed on the X-plate and Y-plate. Specifically, it can be installed at both ends of the X-plate / Y-plate near the flat panel detector panel. By obtaining the time difference between the start of image data acquisition and the start of X-ray exposure, exposure parameters can be obtained. These exposure parameters, along with relevant parameters from the readout chip, are then used as the first key parameters.

[0085] The voltage sensor, current sensor, temperature sensor, and X-ray sensor mentioned above constitute the data acquisition part of the verification test platform.

[0086] Please see Figure 8 This is a schematic diagram of the program interface in the host computer provided in an embodiment of the present invention. In this program interface, the relevant settings of the aforementioned first key parameter and second key parameter can be completed, and the image corresponding to the detected image data, as well as the first key parameter and second key parameter, can be displayed. Figure 8 The program interface is divided into three parts: the left side is the host computer acquisition command area, where the specifications of the acquired image are selected, and the circuit board connection information is displayed; the middle is the display area, which scales down the acquired image to the software block diagram area for easy previewing by testers; the right side is the panel status monitoring area, where the relevant parameters and working modes of each reading chip on the panel are viewed, facilitating troubleshooting by testers. The working status of the program in the host computer can typically be divided into three parts: idle state, acquisition state, and window event (window_time). These states can be determined based on the data transmission status. By detecting and analyzing the working status of the program in the host computer, problems caused by program abnormalities can be ruled out. Based on the above data transmission status, the working status of the image transmission section (i.e., the second key parameter) can be determined. If the working status set in the host computer (the preset working status) is inconsistent with the working status of the image transmission section, it can be determined that there is an abnormality in the program, which will lead to abnormal image display.

[0087] After obtaining the first and second key parameters, the host computer determines the cause of the image display abnormality based on whether the first and second key parameters are within their respective normal ranges. This can be achieved through the following methods:

[0088] Determine whether each parameter in the first key parameter is within its corresponding normal range; if any parameter in the first key parameter is not within its corresponding normal range, the cause of the abnormal image display is determined to be a flat panel detector panel malfunction; determine whether the second key parameter is consistent with the preset working state; if the second key parameter is inconsistent with the preset working state, the cause of the abnormal image is determined to be a program malfunction of the verification test platform.

[0089] For example, taking the actual operating temperature in the first key parameter as an example, assuming the actual operating temperature is 80℃, while the normal operating temperature range of the chip is 0~70℃, it can be determined that the actual operating temperature is not within the corresponding normal range, thus determining that the cause of the image abnormality includes a malfunction of the flat panel detector. Further, it is determined whether the second key parameter (i.e., the working state of the image transmission part) is consistent with the preset working state (i.e., the working state set by the host computer). If they are inconsistent, it is determined that the cause of the image display abnormality also includes a program abnormality in the verification test platform. If the second key parameter is consistent with the preset working state, it is determined that the cause of the image abnormality only includes a malfunction of the flat panel detector.

[0090] One possible implementation method for determining whether each parameter in the first key parameter is within its corresponding normal range can be achieved in the following way:

[0091] When the parameters in the first key parameter are related to the read chip, determine whether the actual operating voltage is greater than the maximum value of the read chip's rated voltage, whether the actual operating current is greater than the maximum value of the read chip's rated current, and whether the actual operating temperature is greater than the maximum operating temperature of the read chip. If the actual operating voltage is greater than the maximum value of the rated current, it is determined that the read chip is short-circuited, and the fault in the flat panel detector panel includes abnormal chip-on-film (COF) connection in the flat panel detector panel. If the actual operating voltage is greater than the maximum value of the rated current, it is determined that the read chip is short-circuited, and the fault in the flat panel detector panel includes abnormal pin bonding area corresponding to the read chip in the flat panel detector panel. If the actual operating temperature is greater than the maximum operating temperature, it is determined that the read chip's operating mode is abnormal.

[0092] For example, if the actual operating voltage of the read chip is 6V and the maximum rated operating voltage is 5V, it can be determined that the actual operating voltage is greater than the maximum rated operating voltage, thus indicating that the read chip is short-circuited. The fault in the flat panel detector panel includes abnormalities in the pin bonding area corresponding to the read chip in the flat panel detector panel.

[0093] For example, if the actual operating current of the chip is 1A and the maximum rated operating current is 80mA, then it can be determined that the actual operating current is greater than the maximum rated operating current, thus indicating that the chip is short-circuited. The fault in the flat panel detector panel includes abnormal COF connection in the flat panel detector panel.

[0094] For example, if the actual operating temperature of the read chip is 100℃, while the normal operating temperature range of the read chip is 0~70℃, it is clear that the actual operating temperature of the read chip is greater than the maximum operating temperature. Therefore, it can be determined that the working mode of the read chip is abnormal.

[0095] In other words, by checking whether each parameter in the relevant parameters of the chip is within the corresponding normal range, the detailed cause of the abnormal image display can be further determined, enabling inspection and maintenance personnel to quickly and accurately find the fault and reduce the time for inspection and maintenance of the flat panel detector panel.

[0096] Furthermore, after determining whether the actual operating voltage is greater than the maximum value of the chip's rated voltage, the process also includes:

[0097] After confirming that the rated voltage of each reading chip is less than or equal to the maximum value of the rated voltage, calculate the voltage difference between the actual operating voltages of any two reading chips in the flat panel detector panel; determine whether the voltage difference is less than a set threshold; if not, correct the operating voltage of each reading chip until the voltage difference is less than the set threshold.

[0098] Generally, the read chips used in flat panel detectors are of the same model. After ensuring that the rated voltage of each read chip in the panel is less than its maximum rated operating voltage, the voltage difference between any two read chips (i.e., the difference in their actual operating voltages) can be further reduced. If this voltage difference is less than a set threshold (e.g., 0.01V), it indicates that the actual operating voltages of the two read chips are almost the same. If the voltage difference is greater than or equal to the set threshold, it indicates that the actual operating voltages of the two read chips differ significantly, requiring correction until the voltage difference is less than the set threshold. Since there are many read chips in a flat panel detector, when the voltage difference between any two read chips is greater than or equal to the set threshold, the operating voltage of each read chip needs to be corrected until all voltage differences are less than the set threshold.

[0099] Assuming the datasheet of the read chip indicates that its reference voltage (Vref) ranges from 0.5V to 4.5V, corresponding to a maximum grayscale range of 0 to 65535 at full scale, a 0.01V voltage change would theoretically result in a grayscale value change of approximately 163. However, in practical applications, due to environmental factors (such as ambient light) and different parameter settings, the relationship between voltage variation and grayscale value change between read chips with different actual operating voltages is not a linear one as described above. (See [link to relevant documentation]). Figure 9 This is a schematic diagram illustrating the actual grayscale value differences of images corresponding to different readout chips in a flat panel detector provided in an embodiment of the present invention. Assume the flat panel detector has 8 readout chips, and they correspond to the displayed image as follows: Figure 9 As shown in the eight histograms, the three leftmost histograms correspond to reading chips 1 through 3, respectively. Taking reading chips 2 and 3 as examples, actual measurements show that the average grayscale value of the image corresponding to reading chip 2 is 7972.257, and the average grayscale value of the image corresponding to reading chip 3 is 8039.102. Therefore, the average grayscale values ​​of these two reading chips differ by 67. Although the mean square error of the corresponding images of the detection image data between each reading chip is around 5, the difference in the average grayscale value of each reading chip results in an overall mean square error of 22 for the corresponding images of different reading chips, affecting the uniformity of the corresponding images of the detection image data output by the flat panel detector panel.

[0100] The method provided by this invention determines whether the voltage difference between the actual operating voltages of any two reading chips in the flat panel detector panel is less than a set threshold. If not, the actual operating voltage of the reading chips in the flat panel detector panel is corrected until the voltage difference between the actual operating voltages of any two reading chips is less than the set threshold. This allows for the timely detection of large differences in the actual operating voltages of different reading chips and timely correction of the voltage difference. It also eliminates the influence of the actual operating voltage of the reading chips on the grayscale of the detected image data, thereby improving the uniformity of the detected image data.

[0101] Furthermore, when the parameters in the first key parameter are the exposure parameters read from the chip, determining whether each parameter in the first key parameter is within its corresponding normal range can be achieved in the following way:

[0102] The time difference is calculated from the start of the exposure until the acquisition of detection image data begins. It is then determined whether the time difference is within the preset range corresponding to the X-ray illumination dose. If the time difference is outside the preset range, it is determined that the actual X-ray illumination dose is inconsistent with the preset illumination dose. The flat panel detector panel malfunction includes X-ray illumination position deviation.

[0103] For example, a timer is started when X-ray exposure begins on the flat panel detector and stops when the chip begins acquiring image data. This allows us to obtain the time difference between the start of X-ray exposure and the start of image data acquisition. Assuming the host computer sets the X-ray illumination dose to 'a', the normal time difference range (i.e., the set range) between the start of X-ray exposure and the start of image data acquisition can be determined based on this dose 'a'. Then, it can be determined whether this time difference is within the set range. If not, it indicates that the actual X-ray illumination dose is inconsistent with the preset dose, and the flat panel detector malfunction may include X-ray illumination position deviation.

[0104] In the embodiments provided by the present invention, by determining whether the time difference between the start of X-ray exposure and the start of image data acquisition is within the set range corresponding to the preset X-ray illumination dose, it can be determined whether there is an image display abnormality caused by the X-ray illumination position deviation, thereby further improving the efficiency of determining the cause of the image display abnormality, avoiding the image display abnormality caused by different gray levels of the displayed image due to different X-ray doses, enabling inspection personnel and maintenance personnel to quickly locate the fault location and improve inspection and maintenance efficiency.

[0105] Based on the same inventive concept, one embodiment of the present invention provides a verification and testing platform for a flat panel detector panel. Please refer to [link / reference]. Figure 10 The verification and testing platform includes:

[0106] The data acquisition section 1001 is used to acquire the first key parameters of the flat panel detector panel during the generation of detection image data.

[0107] The image transmission section 1002 is used to acquire the detection image data and the corresponding first key parameter and second key parameter from the flat panel detector panel, and transmit them to the host computer 1003; wherein, the second key parameter is used to characterize the working state of the image transmission section.

[0108] The host computer 1003 executes the method described above for determining the cause of image display abnormalities. Specific implementation details of this detection method can be found in the method embodiment section; repeated details will not be elaborated upon here.

[0109] One possible implementation includes the data acquisition section 1001, comprising:

[0110] A voltage sensor is used to acquire the actual operating voltage of the readout chip in the flat panel detector panel;

[0111] A current sensor is used to collect the actual operating current of the readout chip;

[0112] A temperature sensor is disposed on the surface of the read chip to collect the actual operating temperature of the read chip.

[0113] In one possible implementation, the data acquisition section 1001 further includes:

[0114] An X-ray sensor for detecting the X-rays is disposed at both ends of the X-plate and Y-plate in the image transmission section, near the side of the flat panel detector panel, and is used to determine the exposure parameters of the flat panel detector panel.

[0115] Based on the same inventive concept, embodiments of the present invention also provide a readable storage medium, comprising:

[0116] memory,

[0117] The memory is used to store instructions that, when executed by a processor, cause the apparatus including the readable storage medium to perform the method described above for determining the cause of an image display anomaly.

[0118] The readable storage medium can be any available medium or data storage device accessible to the processor, including volatile memory or non-volatile memory, or both. By way of example, and not limitation, non-volatile memory can include read-only memory (ROM), programmable read-only memory (PROM), electrically programmable read-only memory (EPROM), electrically erasable programmable read-only memory (EEPROM), flash memory, solid-state disk (SSD), magnetic storage (e.g., floppy disk, hard disk, magnetic tape, magneto-optical disc (MO), etc.), and optical storage (e.g., CD, DVD, BD, HVD, etc.). Volatile memory can include random access memory (RAM), which can act as an external cache memory. By way of example and not limitation, RAM can be obtained in various forms, such as Dynamic Random Access Memory (DRAM), Synchronous Dynamic Random-Access Memory (SDRAM), Double Data Rate SDRAM (DDR SDRAM), Enhanced Synchronous DRAM (ESDRAM), and Sync Link DRAM (SLDRAM). The storage devices disclosed herein are intended to include, but are not limited to, these and other suitable types of memory.

[0119] Those skilled in the art will understand that embodiments of the present invention can be provided as methods, systems, or program products. Therefore, embodiments of the present invention can take the form of entirely hardware embodiments, entirely software embodiments, or embodiments combining software and hardware aspects. Furthermore, embodiments of the present invention can take the form of machine program products implemented on one or more readable storage media (including but not limited to disk storage, CD-ROM, optical storage, etc.) containing computer / processor-usable program code.

[0120] Embodiments of the present invention are described with reference to flowchart illustrations and / or block diagrams of methods, apparatus (systems), and computer program products according to embodiments of the invention. It will be understood that each block of the flowchart illustrations and / or block diagrams, and combinations of blocks in the flowchart illustrations and / or block diagrams, can be implemented by computer program instructions. These program instructions can be provided to a processor of a general-purpose computer, special-purpose computer, embedded processor, or other programmable data processing apparatus to produce a machine, such that the instructions, which execute via the processor of the computer or other programmable data processing apparatus, generate instructions for implementing the flowchart illustrations. Figure 1 One or more processes and / or boxes Figure 1 A device that provides the functions specified in one or more boxes.

[0121] These program instructions may also be stored in a readable storage medium that can direct a computer or other programmable data processing device to operate in a particular manner, such that the instructions stored in the readable storage medium produce an article of manufacture including instruction means, which are implemented in a process Figure 1 One or more processes and / or boxes Figure 1 The function specified in one or more boxes.

[0122] These program instructions may also be loaded onto a computer or other programmable data processing apparatus to cause a series of operational steps to be performed on the computer or other programmable apparatus to produce a process implemented by the computer / processor, thereby providing instructions that execute on the computer / processor or other programmable apparatus for implementing the process. Figure 1 One or more processes and / or boxes Figure 1 The steps of the function specified in one or more boxes.

[0123] Obviously, those skilled in the art can make various modifications and variations to this invention without departing from its spirit and scope. Therefore, if these modifications and variations fall within the scope of the claims of this invention and their equivalents, this invention also intends to include these modifications and variations.

Claims

1. A method for determining the cause of image display anomalies, applied to a verification test platform for a flat panel detector panel, wherein the detection image data acquired by the flat panel detector panel is transmitted through the image transmission section of the verification test platform, characterized in that, include: During the generation of detection image data by the flat panel detector, relevant parameters of each readout chip and the exposure parameters of the X-rays corresponding to the detection image data are collected from the flat panel detector; the relevant parameters and the exposure parameters are determined as the first key parameters of the flat panel detector; the working status of the image transmission part of the verification test platform is collected to obtain the second key parameters of the image transmission part. When the image display corresponding to the detected image data is abnormal, determine whether each parameter in the first key parameter is within the corresponding normal range; If any of the first key parameters is outside the corresponding normal range, then the cause of the abnormal image display is determined to include a malfunction of the flat panel detector panel. Determine whether the second key parameter is consistent with the preset working state; If the second key parameter is inconsistent with the preset working state, then the cause of the image abnormality is determined to include a program abnormality of the verification test platform; The relevant parameters include: The actual operating voltage of the reading chip, the actual operating current of the reading chip, and the actual operating temperature of the reading chip; The determination of whether each parameter in the first key parameter is within its corresponding normal range includes: When the parameters in the first key parameters are the relevant parameters of the reading chip, determine whether the actual operating voltage is greater than the maximum value of the rated voltage of the reading chip, whether the actual operating current is greater than the maximum value of the rated current of the reading chip, and whether the actual operating temperature is greater than the maximum operating temperature of the reading chip. If the actual operating voltage is greater than the maximum value of the rated current, then the reading chip is determined to be short-circuited, and the fault of the flat panel detector includes abnormal connection of the flip-chip thin film in the flat panel detector. If the actual operating voltage is greater than the maximum value of the rated current, then the reading chip is determined to be short-circuited, and the fault of the flat panel detector includes an abnormality in the pin bonding area corresponding to the reading chip in the flat panel detector. If the actual operating temperature is greater than the maximum operating temperature, then the operating mode of the read chip is determined to be abnormal.

2. The method as described in claim 1, characterized in that, After determining whether the actual operating voltage is greater than the maximum value of the rated voltage of the reading chip, the method further includes: After determining that the rated voltage of each read chip is less than or equal to the maximum value of the rated voltage, calculate the voltage difference between the actual operating voltages of any two read chips in the flat panel detector panel; Determine whether the voltage difference is less than a set threshold; If not, the operating voltage of each read chip is corrected until the voltage difference is less than the set threshold.

3. The method as described in claim 1, characterized in that, The exposure parameters include: The time difference between the start of X-ray exposure and the start of acquiring the detection image data.

4. The method as described in claim 3, characterized in that, Determining whether each parameter in the first key parameter is within its corresponding normal range includes: When the parameter in the first key parameter is the exposure parameter of the reading chip, the time is started from the time when the exposure begins and stopped when the detection image data is started to be collected, so as to obtain the time difference; Determine whether the time difference is within the set range corresponding to the preset X-ray dose; If the time difference is outside the set range, it is determined that the actual X-ray illumination dose is inconsistent with the preset illumination dose, and the malfunction of the flat panel detector includes the X-ray illumination position deviation.

5. A verification and testing platform for a flat panel detector panel, characterized in that, include: The data acquisition section is used to acquire the first key parameters of the flat panel detector panel during the generation of detection image data. The image transmission section is used to acquire the detection image data, the first key parameter, and the second key parameter from the flat panel detector panel, and transmit them to the host computer; wherein, the second key parameter is used to characterize the working status of the image transmission section. The host computer performs the method as described in any one of claims 1-4.

6. The verification and testing platform as described in claim 5, characterized in that, The data acquisition section includes: A voltage sensor is used to acquire the actual operating voltage of the readout chip in the flat panel detector panel; A current sensor is used to collect the actual operating current of the readout chip; A temperature sensor is disposed on the surface of the read chip to collect the actual operating temperature of the read chip.

7. The verification and testing platform as described in claim 6, characterized in that, The data acquisition section also includes: An X-ray sensor for detecting the X-rays is disposed at both ends of the X-plate and Y-plate in the image transmission section, near the side of the flat panel detector panel, and is used to determine the exposure parameters of the flat panel detector panel.

8. A readable storage medium, characterized in that, Including memory, The memory is used to store instructions that, when executed by a processor, cause a device including the readable storage medium to perform the method as described in any one of claims 1 to 4.

Images