Unit for supplying a liquid, apparatus and method for processing a substrate with said unit

Abstract

The present inventive concept provides a substrate processing apparatus. The substrate processing apparatus includes a support unit configured to support a substrate, and a liquid supply unit configured to supply a processing liquid onto the substrate supported on the support unit, and wherein the liquid supply unit includes a tank configured to have a storage space for storing the processing liquid therein, a circulation line configured to circulate the processing liquid stored in the storage space, a replenishment line configured to supply the processing liquid to the storage space, and a valve installed at the replenishment line, a heater installed at the circulation line and for heating the processing liquid, and a controller for controlling the valve.

Description

Background Technology

[0001] Embodiments of the inventive concept described herein relate to a liquid supply unit, and a substrate processing apparatus and method having said liquid supply unit, and more specifically, to a substrate processing apparatus and method for supplying liquid to a substrate, and a liquid supply unit used therein.

[0002] Contaminants remaining on substrate surfaces, such as particles, organic contaminants, or metallic contaminants, significantly impact the characteristics and production yield of semiconductor devices. Therefore, cleaning processes to remove various contaminants adhering to substrate surfaces are crucial in semiconductor manufacturing. Cleaning processes are performed before and after each unit process in semiconductor manufacturing. These cleaning processes include cleaning solution treatment processes to remove contaminants remaining on the substrate using cleaning solutions, rinsing processes to remove cleaning solution residues using pure water, and drying processes to dry the substrate using organic solvents, supercritical fluids, or nitrogen.

[0003] Various processing fluids used in cleaning processes require specific temperature ranges. For this purpose, inline heating technology is commonly used to heat the processing fluid within the pipes through which it flows. Inline heating is a method of heating the processing fluid to maintain its temperature within a certain range, allowing it to be discharged onto the substrate when necessary. However, with inline heating, after a certain amount of processing fluid is discharged onto the substrate, a problem arises: if the processing fluid is replenished, the previously maintained temperature of the fluid changes rapidly. This problem leads to the processing fluid not being supplied to the substrate at the set temperature, resulting in a decrease in the substrate's processing efficiency. Summary of the Invention

[0004] Embodiments of the present invention provide a liquid supply unit and a substrate processing apparatus and method having said liquid supply unit for efficiently processing substrates.

[0005] Embodiments of the present invention provide a liquid supply unit and a substrate processing apparatus and method having said liquid supply unit for minimizing rapid temperature changes in pre-stored processing liquid caused by replenishment of the processing liquid while the processing liquid is being replenished.

[0006] Embodiments of the present invention provide a liquid supply unit and a substrate processing apparatus and method having said liquid supply unit for maintaining the temperature of the processing liquid within a certain range.

[0007] The technical objectives of this invention are not limited to those described above, and other unmentioned technical objectives will become apparent to those skilled in the art from the following description.

[0008] The present invention provides a substrate processing apparatus. The substrate processing apparatus includes: a support unit configured to support a substrate; and a liquid supply unit configured to supply a processing liquid to the substrate supported on the support unit, wherein the liquid supply unit includes: a tank configured to have a receiving space for storing the processing liquid therein; a circulation line configured to circulate the processing liquid stored in the receiving space; a replenishment line configured to supply the processing liquid to the receiving space, and a valve is installed at the replenishment line; a heater installed at the circulation line for heating the processing liquid; and a controller for controlling the valve, wherein... If it is determined that the processing fluid stored in the containment space needs to be replenished, the controller controls the valve to perform a replenishment operation by supplying the processing fluid to the containment space through the replenishment line, controls the valve to supply the processing fluid to the containment space at a first supply amount per unit time during a first period of performing the replenishment operation, controls the valve to supply the processing fluid to the containment space at a second supply amount per unit time during a second period of performing the replenishment operation, and wherein the first supply amount of the processing fluid per unit time is the average supply amount for the entire first period, the second supply amount of the processing fluid per unit time is the average supply amount for the entire second period, and the first period occurs before the second period.

[0009] In one embodiment, the average supply of the processing fluid per unit time during the first time period is lower than the average supply of the processing fluid per unit time during the second time period.

[0010] In one embodiment, the controller controls the valve to perform a pulsating operation of repeatedly opening and closing operations during a first time period.

[0011] In one embodiment, the controller controls the valve to perform a pulsating operation of repeatedly opening during a first time period.

[0012] In one embodiment, supplemental pipeline branches are provided to allow the treatment fluid to flow to a first supply member and a second supply member, each having valves and pipes, and the valves or pipes provided at the first and second supply members are of different sizes.

[0013] In one embodiment, the dimensions of the first valve and the first pipe disposed at the first supply component are relatively smaller than the dimensions of the second valve and the second pipe disposed at the second supply component.

[0014] In one embodiment, the controller controls the first valve to open and the second valve to close, so as to supply the processing fluid to the containment space through the first supply member during a first time period, and controls the second valve to open during a second time period.

[0015] In one embodiment, the valve is a flow regulating valve.

[0016] In one embodiment, the substrate processing apparatus further includes a measuring unit for measuring the level of the processing liquid stored in the containment space, and wherein the controller determines the replenishment section for performing the replenishment operation by detecting the level of the processing liquid stored in the containment space as measured by the measuring unit.

[0017] In one embodiment, during replenishment operations, the treatment fluid stored in the containment space is continuously heated by a heater.

[0018] This invention provides a liquid supply unit for supplying a processing liquid to a substrate. The liquid supply unit includes: a tank configured to have a receiving space for storing the processing liquid therein; a circulation line configured to circulate the processing liquid stored in the receiving space; a replenishment line configured to supply the processing liquid to the receiving space, and a valve installed at the replenishment line; a heater installed at the circulation line and used to heat the processing liquid; and a controller for controlling the valve, wherein if it is determined that replenishment of the processing liquid stored in the receiving space is needed, the controller controls the valve to perform a flow... The replenishment operation involves supplying the treatment fluid to the containment space via the replenishment line, controlling the valve to supply the treatment fluid to the containment space at a first supply rate per unit time during a first period of the replenishment operation, controlling the valve to supply the treatment fluid to the containment space at a second supply rate per unit time during a second period of the replenishment operation, wherein the first supply rate of the treatment fluid per unit time is the average supply rate for the entire first period, the second supply rate of the treatment fluid per unit time is the average supply rate for the entire second period, and the first period occurs before the second period.

[0019] In one embodiment, the average supply of the processing fluid per unit time during the first time period is lower than the average supply of the processing fluid per unit time during the second time period.

[0020] In one embodiment, the controller controls the valve to perform a pulsating operation of repeatedly opening and closing operations during a first time period, and the control valve performs a pulsating operation of repeatedly opening operations during the first time period.

[0021] In one embodiment, supplemental pipeline branches are provided to allow the treatment fluid to flow to a first supply member and a second supply member, each having a valve and a pipe, and the size of the first valve and the first pipe provided at the first supply member is relatively smaller than the size of the second valve and the second pipe provided at the second supply member.

[0022] In one embodiment, the controller controls the first valve to open and the second valve to close, so as to supply the processing fluid to the containment space through the first supply member during a first time period, and controls the second valve to open during a second time period.

[0023] In one embodiment, the valve is a flow regulating valve.

[0024] This invention provides a substrate processing method. The substrate processing method includes storing a processing liquid in a containment space inside a tank; heating the processing liquid stored in the containment space to a set temperature in a circulation line to allow the processing liquid to flow within the circulation line; discharging the processing liquid heated to the set temperature onto a substrate to process the substrate; and performing a replenishment operation by supplying the processing liquid to the containment space if it is necessary to replenish the processing liquid stored in the containment space. During a first time period of the replenishment operation, the processing liquid is supplied to the containment space at a first supply amount per unit time; and during a second time period of the replenishment operation, the processing liquid is supplied to the containment space at a second supply amount per unit time. The first supply amount of the processing liquid per unit time is the average supply amount for the entire first time period, and the second supply amount of the processing liquid per unit time is the average supply amount for the entire second time period.

[0025] In one embodiment, the average supply of the processing fluid per unit time during the first time period is lower than the average supply of the processing fluid per unit time during the second time period.

[0026] In one embodiment, the processing fluid is supplied to the containment space during the first time period by a pulsating operation of repeatedly supplying the processing fluid to the containment space and stopping the supply of the processing fluid, and the processing fluid is continuously supplied to the containment space during the second time period.

[0027] In one embodiment, a supplemental pipeline supplying the treatment fluid to the containment space directs the treatment fluid to a first supply member and a second supply member, each having a valve and a conduit. The size of the first valve and the first conduit located at the first supply member is relatively smaller than the size of the second valve and the second conduit located at the second supply member. The treatment fluid is supplied to the containment space through the first supply member during a first time period and through the second supply member during a second time period.

[0028] According to embodiments of the present invention, substrates can be processed efficiently.

[0029] According to an embodiment of the invention, the rapid temperature change of the pre-stored treatment fluid caused by the replenishment of the treatment fluid can be minimized while the treatment fluid is being replenished.

[0030] According to an embodiment of the present invention, the temperature of the treatment liquid can be maintained within a certain range.

[0031] The effects of this invention are not limited to those described above, and other unmentioned effects will become apparent to those skilled in the art from the following description. Attached Figure Description

[0032] The above and other objects and features will become apparent from the following description with reference to the accompanying drawings, wherein, unless otherwise stated, the same reference numerals in the various drawings refer to the same parts, and wherein:

[0033] Figure 1 An embodiment of a substrate processing apparatus according to the present invention is illustrated schematically.

[0034] Figure 2 Schematic illustration Figure 1 An example of a process room.

[0035] Figure 3 Schematic illustration Figure 1 An embodiment of the liquid supply unit.

[0036] Figure 4 This illustration shows the process of performing supplementary operations. Figure 3 The opening and closing of the supply valve.

[0037] Figure 5 Schematic illustration Figure 3 The liquid supply unit supplies the processing liquid to the tank during the first time period.

[0038] Figure 6 Schematic illustration Figure 3The liquid supply unit supplies the processing liquid to the tank during the second time period.

[0039] Figure 7 Schematic illustration Figure 1 Another embodiment of the liquid supply unit.

[0040] Figure 8 and Figure 9 Schematic illustration Figure 7 The flow rate of the supply valve during supplementary operation.

[0041] Figure 10 Schematic illustration Figure 1 Another embodiment of the liquid supply unit.

[0042] Figure 11 This illustration shows the process of performing supplementary operations from... Figure 10 The flow rate supplied by the first and second supply components.

[0043] Figure 12 Schematic illustration Figure 10 The liquid supply unit supplies the processing liquid to the tank during the first time period.

[0044] Figure 13 Schematic illustration Figure 10 The liquid supply unit supplies the processing liquid to the tank during the second time period. Detailed Implementation

[0045] The inventive concept can be modified and taken in various forms, and specific embodiments of the inventive concept will be shown and described in detail in the accompanying drawings. However, the embodiments of the inventive concept are not intended to limit the specific forms disclosed, and it should be understood that the inventive concept includes all variations, equivalents, and substitutions included within the spirit and scope of the inventive concept. Embodiments are provided to more fully explain the inventive concept to those skilled in the art. Therefore, the shapes of the components in the drawings are enlarged to emphasize a clearer description.

[0046] It should be understood that when an element or layer is referred to as "on another element or layer," "connected to," "attached to," or "covering" another element or layer, it may be directly on, connected to, attached to, or cover the other element or layer, or there may be intermediate elements or layers. Conversely, when an element is referred to as "directly on another element or layer," "directly connected to," or "directly attached to" another element or layer, there are no intermediate elements or layers. In this specification, the same numbers refer to the same elements. As used herein, the term "and / or" includes any and all combinations of one or more of the associated listed items.

[0047] To facilitate description of the relationship between one element or feature and another element or feature as shown in the figures, spatially relative terms (e.g., "beneath," "below," "lower," "above," "upper," etc.) may be used herein. It should be understood that spatially relative terms are intended to cover different orientations of the device in use or operation, in addition to those depicted in the figures. For example, if the device in the figures is flipped, an element described as "beneath" or "below" other elements or features would be oriented "above" other elements or features. Thus, the term "below" can encompass both upper and lower orientations. The device may be oriented in other ways (rotated 90 degrees or rotated in other orientations), and the spatially relative descriptors used herein are interpreted accordingly.

[0048] In the following text, reference will be made to Figures 1 to 3 Embodiments of the inventive concept are described in detail. In this embodiment, a process for liquid treatment of a substrate by supplying a liquid, such as a cleaning solution, onto the substrate will be described as an example. However, this embodiment is not limited to a cleaning process and can be applied to various types of equipment for treating substrates by supplying liquid. For example, this embodiment can be applied to equipment performing a process of coating a photoresist onto a substrate and then developing the substrate after exposure, as well as equipment performing a process of removing a thin film from a substrate by supplying chemicals onto the substrate.

[0049] Figure 1 A substrate processing apparatus according to an embodiment of the present invention is illustrated schematically. Reference Figure 1 The substrate processing apparatus 1 includes a transposition module 10 and a processing module 20. According to an embodiment, the transposition module 10 and the processing module 20 are arranged in one direction. Hereinafter, the arrangement direction of the transposition module 10 and the processing module 20 is referred to as the first direction 2, the direction perpendicular to the first direction 2 when viewed from above is referred to as the second direction 4, and the direction perpendicular to the plane including both the first direction 2 and the second direction 4 is defined as the third direction 6.

[0050] The transposition module 10 transfers the substrate W from the container F storing the substrate W to the processing module 20 that processes the substrate W. The transposition module 10 receives the substrate W that has been processed by the processing module 20 and stores the substrate W in the container F. The longitudinal direction of the transposition module 10 is arranged in the second direction 4. The transposition module 10 has a loading port 120 and a transposition frame 140.

[0051] A container F storing the substrate W is mounted on the loading port 120. The loading port 110 and the processing module are located on two opposite sides of the indexing frame 140. Multiple loading ports 120 can be provided, and the multiple loading ports 120 can be arranged in the direction along the second direction 4. The number of loading ports 120 can be increased or decreased according to the process efficiency and area occupied by the processing module 20.

[0052] Multiple slots (not shown) are formed at container F to store substrate W in a horizontally arranged state relative to the ground. Container F can be a sealed container, such as a front-opening unified pod (FOUP). Container F can be placed on loading port 120 by a conveying device (not shown) (such as an overhead conveyor, overhead transport, or automated guided vehicle) or by an operator.

[0053] An indexing track 142 and an indexing robot 144 are provided within the indexing frame 140. The indexing track 142 is arranged longitudinally along the second direction 4 within the indexing frame 140. The indexing robot 144 can transport substrate W. The indexing robot 144 can transport substrate W between the indexing module 10 and the buffer chamber 240, which will be described later.

[0054] The indexing robot 144 may include an indexing hand 1440. A substrate W may be placed on the indexing hand 1440. The indexing hand 1440 may include an indexing base 1442 in the form of an annulus symmetrically cut off a portion of its circumference, and an indexing support unit 1444 for moving the indexing base 1442. The construction of the indexing hand 1440 is the same as or similar to that of the transfer hand 2240, which will be described later. The indexing hand 1440 may be configured to be movable along the indexing track 142 in a second direction 4. Therefore, the indexing hand 1440 can move forward and backward along the indexing track 142. Furthermore, the indexing hand 1440 may be configured to be rotatable along a third direction 6, which is an axis, and movable along that third direction 6.

[0055] The controller can control the substrate processing equipment. The controller 30 may include a process controller comprising a microprocessor (computer) that performs control of the substrate processing equipment, a user interface such as a keyboard through which an operator inputs commands to manage the substrate processing equipment, a display showing the operating status of the substrate processing equipment, and a storage unit that stores processing plans (i.e., control programs that execute the processing technology of the substrate processing equipment by controlling the process controller, or programs that execute components of the substrate processing equipment according to data and processing conditions). Furthermore, the user interface and the storage unit may be connected to the process controller. The processing plans may be stored in a storage medium in the storage unit, and the storage medium may be a hard disk, a portable disk (such as a CD-ROM or DVD), or a semiconductor memory (such as flash memory).

[0056] The controller 30 can control the substrate processing equipment 1 to perform the substrate processing method described below. For example, the controller can control components provided at the liquid supply unit described below to perform the substrate processing method described below.

[0057] Processing module 20 includes a buffer unit 220, a transfer chamber 240, and a process chamber 260. The buffer unit 220 provides space for the substrate W placed into and removed from the processing module 20 to temporarily rest. The transfer chamber 240 provides space for transferring the substrate W between the buffer unit 220 and the process chamber 260, and between the process chambers 260. The process chamber 260 can perform a liquid processing process to treat the substrate W by supplying liquid onto it. For example, the liquid processing process can be a cleaning process of cleaning the substrate with a cleaning solution. Chemical treatment, rinsing treatment, and drying treatment can all be performed on the substrate within the process chamber 260. Optionally, the process chamber 260 for drying the substrate can be separate from the process chamber 260 for performing liquid processing.

[0058] A buffer unit 220 can be disposed between the indexing frame 140 and the transfer chamber 240. The buffer unit 220 can be positioned at one end of the transfer chamber 240. A slot (not shown) for placing the substrate W is provided inside the buffer unit 220. Multiple slots (not shown) are spaced apart from each other along a third direction 6. The front and rear of the buffer unit 220 are open. The front is the surface facing the indexing module 10, and the rear can be the surface facing the transfer chamber 240. The indexing robot 144 can access the buffer unit 220 through the front, and the transfer robot 244, which will be described later, can access the buffer unit 220 through the rear.

[0059] The longitudinal direction of the transfer chamber 240 can be arranged in the first direction 2. Each of the process chambers 260 can be arranged on both sides of the transfer chamber 240. The process chamber 260 can be arranged on one side of the transfer chamber 240. The process chamber 260 and the transfer chamber 240 can be arranged along the second direction 4.

[0060] According to one embodiment, process chambers 260 can be disposed on both sides of transfer chamber 240, and the process chambers 260 can be arranged in an AXB pattern (A and B are natural numbers greater than 1 or 1) along a first direction 2 and a third direction 6, respectively. Here, "A" is the number of process chambers 260 arranged in a row along the first direction 2, and "B" is the number of process chambers 260 arranged in a row along the third direction 6. When four or six process chambers 260 are disposed on one side of transfer chamber 240, the process chambers 260 can be arranged in a 2×2 or 3×2 pattern. The number of process chambers 260 can be increased or decreased. Unlike the above, process chambers 260 can be disposed only on one side of transfer chamber 240. In addition, process chambers 260 can be configured as a single layer on one and both sides of transfer chamber 240.

[0061] The transfer chamber 240 includes a guide rail 242 and a transfer robot 244. The guide rail 242 is arranged in a first direction 2 within the transfer chamber 240. The transfer robot 244 can be configured to move linearly along the first direction 2 on the guide rail 242. The transfer robot 244 transfers substrate W between the buffer unit 220 and the process chamber 260, and between the process chambers 260.

[0062] The transfer robot 2440 includes a base 2442, a body 2444, and an arm 2446. The base 2442 is mounted and movable along a guide rail 242 in a first direction 2. The body 2444 is coupled to the base 2442. The body 2444 is configured to move on the base 2442 in a third direction 6. Additionally, the body 2444 is configured to rotate on the base 2442. The arm 2446 is coupled to the body 2444 and is configured to move forward and backward relative to the body 2444. Multiple arms 2446 are provided so that each can be driven individually. The arms 2446 are arranged stacked on top of each other and spaced apart along the third direction 6.

[0063] Process chamber 260 performs liquid processing processes on substrate W. For example, process chamber 260 may be a chamber that performs a cleaning process by supplying a cleaning solution to substrate W. Conversely, process chamber 260 may be a chamber that performs a wet etching process by supplying liquid plasma to remove thin films from the substrate. Depending on the type of process used to process substrate W, process chamber 260 may have different structures. Alternatively, each process chamber 260 may have the same structure. Optionally, process chambers 260 may be divided into multiple groups, and process chambers 260 belonging to one group may be process chambers 260 performing either a cleaning process or a wet etching process, while process chambers 260 belonging to another group may be process chambers 260 performing the other of a cleaning process and a wet etching process.

[0064] In embodiments of the present invention, a liquid processing process in which a substrate W is treated by supplying a processing solution to the substrate W in process chamber 260 will be described as an example. The processing solution according to embodiments of the present invention can be any of chemicals, rinsing solutions, and organic solvents. Chemicals may include diluted peroxide sulfate (H₂SO₄), phosphoric acid (P₂O₅), hydrofluoric acid (HF), and ammonium hydroxide (NH₄OH). For example, rinsing solutions may include water or deionized water (DIW). For example, organic solvents may include alcohols, such as isopropanol (IPA). Hereinafter, for ease of description, a case in which the processing solution supplied to the substrate W is a chemical will be described as an example.

[0065] Figure 2 Schematic illustration Figure 1 An example of a process chamber. See reference. Figure 2 The process chamber 260 includes a housing 2610, a processing container 2820, and a support unit 2830.

[0066] The housing 2610 has an internal space. The housing 2610 is typically in the form of a rectangular parallelepiped. Openings may be formed on the sides of the housing 2610. These openings can serve as inlets through which the substrate W is placed into or removed from the internal space. A processing container 2620 and a support unit 2630 are disposed within the housing 2610.

[0067] The processing container 2620 has a processing space with an open top. The processing container 2620 can be a bowl-shaped portion with a processing space. The processing container 2620 can be configured to surround the processing space. The processing space of the processing container 2620 can be a space in which a support unit 2630 (described later) supports and rotates the substrate W. The processing space can be a space in which the substrate W is processed by supplying processing liquid to the substrate W through a liquid supply unit described later.

[0068] According to one embodiment, the processing container 2620 may have a guide wall 2621 and a plurality of recovery containers 2623, 2625, and 2627. Each recovery container 2623, 2625, and 2627 separates and recovers a different processing liquid from the processing liquid used for substrate processing. Each recovery container 2623, 2625, and 2627 has a recovery space for recovering the processing liquid used for substrate processing. The guide wall 2621 and each recovery container 2623, 2625, and 2627 are arranged in the form of an annular ring surrounding the support unit 2630. When the liquid processing process is performed, the processing liquid dispersed by the rotation of the substrate W is introduced into the recovery space through the inlets 2623a, 2625a, and 2627a of the recovery containers 2623, 2625, and 2627, which are described later respectively. Different types of processing liquid can flow into each recovery container.

[0069] According to one embodiment, the processing container 2620 has a guide wall 2621, a first recovery container 2623, a second recovery container 2625, and a third recovery container 2627. The guide wall 2621 is arranged in the form of an annular ring surrounding a support unit 2630, and the first recovery container 2623 is arranged in the form of an annular ring surrounding the guide wall 2621. The second recovery container 2625 is arranged in the form of an annular ring surrounding the first recovery container 2623, and the third recovery container 2627 is arranged in the form of an annular ring surrounding the second recovery container 2625. The space between the first recovery container 2623 and the guide wall 2621 serves as a first inlet 2623a, through which liquid is introduced for processing. The space between the first recovery container 2623 and the second recovery container 2625 serves as a second inlet 2625a, through which processed liquid is introduced. The space between the second recovery container 2625 and the third recovery container 2627 serves as a third inlet 2627a, through which processed liquid is introduced. The second entrance 2625a is positioned above the first entrance 2623a, and the third entrance 2627a can be positioned above the second entrance 2625a.

[0070] The space between the lower end of the guide wall 2621 and the first recovery container 2623 serves as a first outlet 2623b, through which the flue gas and gas flow generated from the processed liquid are discharged. The space between the lower end of the first recovery container 2623 and the second recovery container 2625 serves as a second outlet 2625b, through which the flue gas and gas flow generated from the processed liquid are discharged. The space between the lower end of the second recovery container 2625 and the third recovery container 2627 serves as a third outlet 2627b, through which the flue gas and gas flow generated from the processed liquid are discharged. The flue gas and gas flow discharged from the first outlet 2623b, the second outlet 2625b, and the third outlet 2627b are discharged through the exhaust unit 2650, which will be described later.

[0071] A vertically extending recycling line (not shown) on the bottom surface is connected to each recycling container 2623, 2625, 2627.

[0072] The support unit supports and rotates the substrate W in the processing space. The support unit 2630 may have a rotary chuck 2631, a support pin 2633, a chuck pin 2635, a rotation shaft 2637, and a first driver 2639.

[0073] The rotary chuck 2631 has a top surface, which is typically circular when viewed from above. The top surface of the rotary chuck 2631 may have a diameter larger than that of the substrate W.

[0074] Multiple support pins 2633 can be provided. The support pins 2633 are disposed at the edge portion of the top surface of the rotary chuck 2631, spaced apart from each other at predetermined intervals, defining annular rings and protruding upwards from the rotary chuck 2631. The support pins 2633 support the edge of the rear surface of the substrate W, such that the substrate W is spaced apart from the top surface of the rotary chuck 2631 by a predetermined distance.

[0075] Multiple chuck pins 2635 can be provided. The chuck pins 2635 are positioned further away from the center of the rotary chuck 2631 than the support pins 2633. The chuck pins 2635 protrude from the top surface of the rotary chuck 2631. The chuck pins 2635 support the side of the substrate W, preventing lateral displacement or wobbling of the substrate W during rotation. The chuck pins 2635 are movable between a standby position and a support position along the radial direction of the rotary chuck 2631. The standby position is a position further away from the center of the rotary chuck 2631 than the support position. When the substrate W is loaded or unloaded on the support unit 2630, the chuck pins 2635 are positioned in the standby position, while when processing is performed on the substrate W, the chuck pins 2635 are positioned in the support position to support the substrate W and prevent lateral displacement or wobbling of the substrate W. In the support position, the chuck pins 2635 contact the side of the substrate W.

[0076] A rotating shaft 2637 is coupled to a rotating chuck 2631. The rotating shaft 2637 can be coupled to the bottom surface of the rotating chuck 2631. The rotating shaft 2637 is configured to be rotatable by receiving power from a driver 2639. The driver 2639 rotates the rotating shaft 2637, thereby rotating the rotating chuck 2631. The driver 2639 can change the rotational speed of the rotating shaft 2637. The driver 2639 can be a motor providing the driving force. However, the inventive concept is not limited thereto, and can be modified to varying degrees to use known devices for providing the driving force.

[0077] A lifting / lowering unit 2640 is disposed within the housing 2610. The lifting / lowering unit 2640 adjusts the relative height between the processing space 2620 and the support unit 2630. The lifting / lowering unit 2640 linearly moves the processing container 2620 in a third direction 6.

[0078] Exhaust line 2650 discharges fumes and gases generated in the processing space. Exhaust line 2650 discharges fumes and gases generated during liquid processing of substrate W. Exhaust line 2650 can be connected to the bottom surface of processing container 2620. In one embodiment, exhaust line 2650 can be positioned between the rotation axis 2637 of support unit 2630 and the inner wall of processing container 2620. A pressure reduction unit (not shown) is provided at exhaust line 2650. Fumes and gases generated during liquid processing of substrate W via the pressure reduction unit are discharged from the processing space to the outside of the processing space.

[0079] Airflow supply unit 2660 supplies airflow to the interior space of housing 2610. Airflow supply unit 2660 can supply downward airflow to the interior space. Airflow supply unit 2660 can be installed inside housing 2610. Airflow supply unit 2660 can be installed above processing container 2620 and support unit 2630. The gas supplied to the interior space of housing 2610 via airflow supply unit 2660 forms a downward airflow within the interior space. Gas byproducts generated by the processing within the processing space are discharged to the outside of housing 2610 via the downward airflow and exhaust line 2650. Airflow supply unit 2660 can be provided as a fan filter unit.

[0080] Figure 3 Schematic illustration Figure 1 An embodiment of the liquid supply unit. See reference. Figure 3 The liquid supply unit 300 can supply liquid to the substrate W positioned in the process chamber 260. The liquid supply unit 300 can supply processing liquid to the substrate W supported by the support unit 2630. In one embodiment, the liquid supplied to the substrate W by the liquid supply unit can be a chemical.

[0081] The liquid supply unit may include a replenishment unit, a circulation unit, a supply unit, and a discharge unit 380. The replenishment unit stores the processing liquid and supplies it to the circulation tank 3410, which will be described later. The circulation unit heats the processing liquid stored in the circulation tank 3410 and circulates the heated processing liquid to the circulation line 3430, which will be described later. The supply unit supplies the processing liquid flowing through the circulation line 3430 to the substrate W. The discharge unit 380 can discharge the processing liquid flowing through the circulation line 3430 to the outside of the liquid supply unit.

[0082] The replenishment unit may include a processing fluid supply source 3210, a replenishment line 3230, a pressure sensor 3250, a filter 3270, and a valve 3290. The processing fluid supply source 3210 may form a sealed internal space. In one embodiment, the processing fluid supply source 3210 may be configured as a tank for storing processing fluid. Alternatively, the processing fluid supply source 3210 may be provided as a reservoir. The processing fluid is stored in the internal space of the processing fluid supply source 3210. The replenishment line 3230 may be connected to the processing fluid supply source 3210.

[0083] A replenishment line 3230 can be connected to a processing fluid supply source 3210. In one embodiment, one end of the replenishment line 3230 can be connected to the supply source 3210, and the other end can be connected to a circulation tank 3410, which will be described later. The replenishment line 3230 can supply processing fluid from the processing fluid supply source 3210 to the circulation tank 3410. In one embodiment, the replenishment line 3230 can supply processing fluid to a containment space formed inside the circulation tank 3410. A pressure sensor 3250, a filter 3270, and a valve 3290 can be mounted on the replenishment line 3230.

[0084] Pressure sensor 3250 measures the pressure in replenishment line 3230. Pressure sensor 3250 measures the pressure of the processing fluid flowing within replenishment line 3230 in real time. The supply rate of the processing fluid flowing within replenishment line 3230 can be adjusted based on the pressure value measured by pressure sensor 3250.

[0085] Filter 3270 can filter the processing fluid supplied from replenishment line 3230. For example, filter 3270 can filter the processing fluid supplied from supply source 3210 to circulation tank 3410. Filter 3270 can filter out impurities that may be contained in the processing fluid.

[0086] Valve 3290 can regulate the amount of treated fluid supplied to circulation tank 3410 via replenishment line 3230. In one embodiment, valve 3290 can be configured as an on / off valve to open and close replenishment line 3230. Whether to supply treated fluid to the containment space can be determined by opening and closing valve 3290. In one embodiment, valve 3290 can be installed downstream of replenishment line 3230 instead of filter 3270. However, the inventive concept is not limited thereto, and valve 3290 can be installed upstream of replenishment line 3230 instead of filter 3270.

[0087] The circulation unit may include a circulation tank 3410, a circulation line 3430, a pump 3450, a heater 3470, and a circulation valve 3490. The circulation tank 3410 has a containment space in which the processed liquid is stored. The circulation tank 3410 may have a sealed containment space. The processed liquid is stored in the containment space of the circulation tank 3410. In one embodiment, the processed liquid supplied from a supply source 3210 may be stored in the containment space of the circulation tank 3410. The processed liquid stored in the circulation tank 3410 is a processed liquid heated to a set temperature by the heater 3470, which will be described later. A measuring unit may be installed in the circulation tank 3410.

[0088] The measuring unit can measure the level of the processed liquid stored in the containment space of the circulation tank 3410. In one embodiment, the measuring unit can be configured as a pair of optical sensors consisting of a light receiving unit and a light emitting unit to detect the level height of the processed liquid contained in the containment space.

[0089] In one embodiment, the measuring unit may include a first liquid level sensor LL, a second liquid level sensor L, a third liquid level sensor M, a first replenishing liquid level sensor MR-L, a second replenishing liquid level sensor MR-H, a fourth liquid level sensor H, and a limit liquid level sensor HH. The first liquid level sensor LL, the second liquid level sensor L, the third liquid level sensor M, the first replenishing liquid level sensor MR-L, the second replenishing liquid level sensor MR-H, the fourth liquid level sensor H, and the limit liquid level sensor HH may be arranged sequentially upwards from the bottom surface of the accommodating space. The provision of six pairs of measuring units according to an embodiment of the present invention has been described as an example, but the present invention is not limited thereto. The number and installation position of the measuring units according to embodiments of the present invention can be modified and configured in various ways according to process requirements.

[0090] The first replenishment level sensor MR-L and the second replenishment level sensor MR-H can be combined to form a replenishment section MR, which performs the replenishment operation described later. In one embodiment, if the level of the processed fluid stored in the containment space is within the replenishment section MR, the processed fluid can be supplied to the containment space. Conversely, if the level of the processed fluid stored in the containment space is below the height of the second replenishment level sensor MR-H, a replenishment operation of supplying processed fluid to the containment space can be performed. A detailed description of the replenishment operation will be described later.

[0091] A circulation line 3430 can be connected to a circulation tank 3410. For example, one end of the circulation line 3430 can be connected to the bottom of the circulation tank 3410, and the other end can be connected to the top of the circulation tank 3410. The circulation line 3430 circulates the processed liquid stored in the containment space of the circulation tank 3410. The processed liquid, heated to a set temperature by the heater 3470 (described later), can flow through the circulation line 3430. A pump 3450, a heater 3470, and a circulation valve 3490 can be installed at the circulation line 3430.

[0092] Pump 3450 applies pressure to circulate the treatment fluid in circulation line 3430 through circulation line 3430. Pump 3450 provides flow pressure such that the treatment fluid circulates from one end of circulation line 3430 to the other. According to one embodiment, pump 3450 may be an impeller-type pump. However, the inventive concept is not limited thereto, and it may be provided as a bellows-type pump, which provides pressure to circulate the treatment fluid in circulation line 3430. Unlike the embodiments described above, pump 3450 according to embodiments of the inventive concept may be provided as various known pumps capable of providing flow pressure.

[0093] A heater 3470 is installed in the circulation line 3430. The heater 3470 may be installed upstream of the circulation line 3430. The heater 3470 heats the processing fluid flowing within the circulation line 3430. The heater 3470 can heat the processing fluid to a set temperature. At least one heater 3470 may be provided. The heater 3470 heats the processing fluid such that the temperature of the processing fluid flowing through the circulation tank 3410 and the circulation line 3430 is maintained at the set temperature. In one embodiment, the heater 3470 can continuously heat the processing fluid supplied to the containment space in the replenishment section described later, such that the processing fluid is heated to the set temperature as it flows through the circulation line 3430.

[0094] A circulation valve 3490 is installed at the circulation line 3430. For example, the circulation valve 3490 can be configured as an on / off valve for opening and closing the circulation line 3430. The circulation valve 3490 can open the circulation line 3430 to allow the processed fluid to circulate within it. The circulation valve 3490 can close the circulation line 3430 to prevent the processed fluid from circulating within it.

[0095] The supply unit may include a branch line 3610, a branch valve 3630, and a supply nozzle 3650. The branch line 3610 may branch from the circulation line 3430. For example, one end of the branch line 3610 may branch from the circulation line 3430, while the other end of the branch line 3610 may be connected to the supply nozzle 3650. Processing fluid heated to a set temperature may flow in the branch line 3610.

[0096] Branch valve 3630 can be installed in branch line 3610. Branch valve 3630 can be configured as an on / off valve for opening and closing branch line 3610. Branch valve 3630 can open branch line 3610 to supply processing fluid to substrate W through supply nozzle 3650. Branch valve 3630 can close branch line 3610 to stop supplying processing fluid to substrate W.

[0097] The supply nozzle 3650 can supply a processing liquid to the substrate W. In one embodiment, the supply nozzle 3650 can supply a chemical heated to a set temperature to the substrate W. The supply nozzle 3650 can be moved by a driver (not shown).

[0098] The substrate processing method according to an embodiment of the present invention will be described in detail below. The substrate processing method described below can be performed by the liquid supply unit described above. Furthermore, the controller 30 described above can control the components of the liquid supply unit, enabling the liquid supply unit to perform the substrate processing method described below. For example, the controller 30 can generate control signals for controlling at least one of the valve 3290, the measuring unit, and the heater 3470, enabling the components of the liquid supply unit to perform the substrate processing method described below.

[0099] In the following text, for ease of description, if the level of the processing fluid injected into the containment space is higher than the height of the fourth level sensor H, it is defined as segment H. Furthermore, if the level of the processing fluid stored in the containment space is positioned below the height of the second replenishment level sensor MR-H, it is defined as replenishment segment MR. According to one embodiment, if the level of the processing fluid stored in the containment space is between the height of the second replenishment level sensor MR-H and the height of the first replenishment level sensor MR-L, it can be determined as replenishment segment MR for supplying processing fluid to the containment space.

[0100] In section H, the replenishment of the processing fluid in the containment space can be stopped, or the amount of processing fluid replenished in the containment space can be minimized compared to the replenishment section MR. In the replenishment section MR, processing fluid can be supplied to the containment space. The replenishment operation of supplying processing fluid to the containment space can be performed in the replenishment section MR. The replenishment operation can be divided into a first time period and a second time period.

[0101] The first time period can be the initial period during which the treatment fluid is supplied to the containment space. For example, the first time period can be the period from the initial replenishment of the treatment fluid to the containment space to a preset time.

[0102] The second time period can be executed after the first time period. The second time period can be the period from a preset time of the first time period to the time when the level of the processed liquid stored in the containment space is positioned above the height of the second replenishment level sensor MR-H. In one embodiment, the second time period can be the period from a preset time of the first time period to the time when the level of the processed liquid stored in the containment space is at a height corresponding to the height of the fourth level sensor H.

[0103] The first time period can serve as a buffer period. During the first time period, the amount of processed liquid supplied to the containment space can be relatively smaller than during the second time period, ensuring that the temperature of the processed liquid stored in the containment space does not change rapidly. In one embodiment, the amount of processed liquid supplied to the containment space per unit time during the first time period can be a first supply amount. The first supply amount can refer to the average supply amount of processed liquid supplied to the containment space throughout the entire first time period. During the second time period, the amount of processed liquid supplied to the containment space per unit time can be a second supply amount. The second supply amount can refer to the average supply amount of processed liquid supplied to the containment space throughout the entire second time period. The average supply amount of processed liquid supplied to the containment space per unit time during the first time period may be less than the average supply amount of processed liquid supplied to the containment space per unit time during the second time period.

[0104] Figure 4 This illustration shows the process of performing supplementary operations. Figure 3 The opening and closing of the supply valve. Figure 5 Schematic illustration Figure 3 The liquid supply unit supplies the processing liquid to the tank during the first time period. Figure 6 Schematic illustration Figure 3 The liquid supply unit supplies the processing liquid to the tank during the second time period.

[0105] refer to Figures 4 to 6 The processing fluid is supplied from the processing fluid supply source 3210 to the containment space inside the circulation tank 3410 via the replenishment line 3230. The processing fluid stored in the containment space inside the circulation tank 3410 circulates through the circulation line 3430. The processing fluid circulating through the circulation line 3430 is heated to a set temperature by the heater 3470. The processing fluid heated to the set temperature is then discharged onto the substrate W through the branch line 3610 and the supply nozzle 3650.

[0106] If the process of discharging the processing liquid onto the substrate W is repeated, the amount of processing liquid stored in the containment space inside the circulation tank 3410 can be reduced. If the processing liquid stored in the containment space of the circulation tank 3410 is located in the replenishment section MR, a replenishment operation of supplying processing liquid to the containment space can be performed.

[0107] According to one embodiment, if the level of the processing fluid stored in the containment space is between the height of the second replenishment level sensor MR-H and the height of the first replenishment level sensor MR-L, it can be determined as a replenishment section MR for supplying processing fluid to the containment space. If the processing fluid stored in the containment space is located in the replenishment section MR, a replenishment operation can be performed.

[0108] refer to Figure 4If the level of the processed fluid injected into the containment space drops from section H to section MR, a replenishment operation can be performed. The replenishment operation can be performed by opening or closing valve 3290. The replenishment operation can be divided into a first period and a second period. Valve 3290 can perform a pulsating operation of repeatedly opening and closing during the first period of the replenishment operation. Valve 3290 can perform an opening operation during the second period of the replenishment operation. In one embodiment, if the level of the processed fluid in the containment space rises to section H outside the replenishment section MR, valve 3290 can perform a closing operation. However, the inventive concept is not limited to this, and valve 3290 can perform an opening operation until the level of the processed fluid injected into the containment space reaches section HH.

[0109] refer to Figure 5 Valve 3290 can repeatedly perform opening and closing operations at predetermined time intervals during the first period of replenishment operation. That is, during the first period of replenishment operation, valve 3290 can perform pulsating operation. During the first period of replenishment operation, the average supply rate of processed liquid to the containment space per unit time can be relatively lower than in the second period. (Reference) Figure 6 During the second period of the replenishment operation, valve 3290 can be opened. During the second period of the replenishment operation, the average supply of processed liquid to the containment space per unit time can be relatively higher than in the first period.

[0110] According to an embodiment of the present invention, even if the temperature of the processed liquid supplied from the processed liquid source 3210 differs from the set temperature, the temperature of the processed liquid previously stored in the circulation tank 3410 can be maintained within the set temperature range. That is, since the processed liquid maintained at the set temperature is stored in the circulation tank 3410, if the temperature of the processed liquid replenished in the circulation tank 3410 deviates from the set temperature, the temperature of the processed liquid previously stored in the circulation tank 3410 may change rapidly. According to an embodiment of the present invention, a temperature buffer section can be formed such that by minimizing the amount of processed liquid initially supplied to the containment space of the circulation tank 3410, the temperature of the pre-stored processed liquid in the circulation tank 3410 does not change rapidly.

[0111] Furthermore, by adjusting the average supply per unit time during the first period of replenishment operation via the pulsating operation of valve 3290, the temperature of the pre-stored processing liquid in the circulation tank 3410 can be maintained within a set temperature range. Therefore, the time required for the processing liquid flowing through the circulation line 3430 to be preheated to the set temperature at heater 3470 can be reduced. Moreover, by maintaining a constant temperature of the processing liquid within the set temperature range, effective liquid processing of the substrate W can be achieved.

[0112] In the description of the liquid supply unit according to embodiments of the present invention, the liquid supply unit according to embodiments of the present invention will be similarly provided below, except for supplementary units. Therefore, to prevent overlap, descriptions of overlapping configurations will be omitted.

[0113] Figure 7 Schematic illustration Figure 1 Another embodiment of the liquid supply unit. See reference. Figure 7 The replenishment unit may include a processing fluid supply source 3210, a replenishment line 3230, a pressure sensor 3250, a filter 3270, and a valve 3290. The processing fluid supply source 3210 may form a sealed internal space. In one embodiment, the processing fluid supply source 3210 may be configured as a tank for storing processing fluid. Alternatively, the processing fluid supply source 3210 may be provided as a reservoir. The processing fluid is stored in the internal space of the processing fluid supply source 3210. The replenishment line 3230 may be connected to the processing fluid supply source 3210.

[0114] The replenishment line 3230 can be connected to the treatment fluid supply source 3210. For example, one end of the replenishment line 3230 can be connected to the supply source 3210, and the other end can be connected to the circulation tank 3410, which will be described later. The replenishment line 3230 can supply treatment fluid from the treatment fluid supply source 3210 to the circulation tank 3410. In one embodiment, the replenishment line 3230 can supply treatment fluid to a containment space formed inside the circulation tank 3410. A pressure sensor 3250, a filter 3270, and a valve 3290 can be mounted at the replenishment line 3230.

[0115] Pressure sensor 3250 measures the pressure in replenishment line 3230. Pressure sensor 3250 measures the pressure of the processing fluid flowing within replenishment line 3230 in real time. The supply rate of the processing fluid flowing within replenishment line 3230 can be adjusted based on the pressure value measured by pressure sensor 3250.

[0116] Filter 3270 can filter the processing fluid supplied from replenishment line 3230. For example, filter 3270 can filter the processing fluid supplied from supply source 3210 to circulation tank 3410. Filter 3270 can filter out impurities that may be contained in the processing fluid.

[0117] Valve 3290 can regulate the amount of treated fluid supplied to circulation tank 3410 via replenishment line 3230. Valve 3290 can be provided as a flow control valve. In one embodiment, valve 3290 can be provided as a static pressure valve based on an electric regulator. The electric regulator can adjust pneumatic pressure to control the pressure of the static pressure valve. However, the inventive concept is not limited thereto, and valve 3290 according to embodiments of the inventive concept can be provided as various known valves capable of regulating the flow rate of treated fluid through replenishment line 3230.

[0118] Figure 8 and Figure 9 Schematic illustration Figure 7 The flow rate of the supply valve during supplementary operation. (Refer to...) Figure 8 and Figure 9 A substrate processing method according to an embodiment of the present invention is described in detail.

[0119] refer to Figure 8 and Figure 9 The processing fluid is supplied from the processing fluid supply source 3210 to the containment space inside the circulation tank 3410 via the replenishment line 3230. The processing fluid stored in the containment space inside the circulation tank 3410 circulates through the circulation line 3430. The processing fluid circulating through the circulation line 3430 is heated to a set temperature by the heater 3470. The processing fluid heated to the set temperature is discharged onto the substrate W through the branch line 3610 and the supply nozzle 3650.

[0120] If the process of discharging the processing liquid onto the substrate W is repeated, the amount of processing liquid stored in the containment space inside the circulation tank 3410 can be reduced. If the processing liquid stored in the containment space of the circulation tank 3410 is located in the replenishment section MR, a replenishment operation of supplying processing liquid to the containment space can be performed.

[0121] According to one embodiment, if the level of the processing fluid stored in the containment space is between the height of the second replenishment level sensor MR-H and the height of the first replenishment level sensor MR-L, it can be determined as a replenishment section MR for supplying processing fluid to the containment space. If the processing fluid stored in the containment space is located in the replenishment section MR, a replenishment operation can be performed.

[0122] If the level of the treatment fluid injected into the containment space drops from section H to section MR, a replenishment operation can be performed. The replenishment operation can be divided into a first time period and a second time period. For example... Figure 8As shown, valve 3290 can supply the processing fluid to the containment space at a first flow rate during the first period of replenishment operation. During the second period of replenishment operation, valve 3290 can supply the processing fluid to the containment space at a second flow rate, the second flow rate having an average supply amount per unit time greater than the first flow rate. That is, valve 3290 can adjust the average flow rate of the processing fluid supplied to the containment space per unit time during the first and second periods.

[0123] Unlike the example described above, such as Figure 9 The valve 3290 shown can increase the average amount of processed fluid supplied to the containment space per unit time from the first time period to the second time period of the replenishment operation. In one embodiment, the average flow rate of processed fluid supplied to the containment space per unit time can be gradually increased over time from the first time period to the second time period of the replenishment operation.

[0124] If the level of the processed liquid in the containment space increases to section H, which is outside the replenishment section MR, valve 3290 can reduce the average supply of processed liquid to the containment space per unit time to a level lower than the average supply of processed liquid per unit time during the first time period. Alternatively, if the level of the processed liquid in the containment space increases to section H, outside the replenishment section MR, valve 3290 can close the replenishment line 3230, thereby stopping the supply of processed liquid to the containment space. Furthermore, it is not limited to the above example, and the above operation can be performed until the level of the processed liquid in the containment space reaches section HH.

[0125] According to an embodiment of the present invention, even if the temperature of the processing fluid supplied from the processing fluid supply source 3210 differs from the set temperature, the temperature of the processing fluid previously stored in the circulation tank 3410 can be maintained within the set temperature range. That is, since the processing fluid maintained at the set temperature is stored in the circulation tank 3410, if the temperature of the processing fluid replenished in the circulation tank 3410 deviates from the set temperature, the temperature of the processing fluid previously stored in the circulation tank 3410 may change rapidly. According to an embodiment of the present invention, a temperature buffer section can be formed such that by minimizing the amount of processing fluid initially supplied to the containment space of the circulation tank 3410, the temperature of the pre-stored processing fluid in the circulation tank 3410 does not change rapidly.

[0126] By adjusting the average flow rate of valve 3290 per unit time to be lower than the average supply amount of processed liquid supplied to the containment space per unit time during the first period of replenishment operation, the temperature of the processed liquid stored in circulation tank 3410 can be maintained within a set temperature range. Therefore, the time required for the processed liquid flowing through circulation line 3430 to be preheated to the set temperature can be reduced by heater 3470. Furthermore, by maintaining a constant temperature of the processed liquid within the set temperature range, effective liquid processing can be performed on substrate W.

[0127] In the description of the liquid supply unit according to embodiments of the present invention, the liquid supply unit according to embodiments of the present invention is provided in a similar manner, except for the replenishment unit. Therefore, in order to prevent overlap, descriptions of overlapping configurations will be omitted.

[0128] Figure 10 Schematic illustration Figure 1 Another embodiment of the liquid supply unit. See reference. Figure 10 The replenishment unit may include a processing fluid supply source 3210, a replenishment line 3230, a pressure sensor 3250, and a filter 3270. The processing fluid supply source 3210 may form a sealed internal space. In one embodiment, the processing fluid supply source 3210 may be configured as a tank for storing processing fluid. Alternatively, the processing fluid supply source 3210 may be provided as a reservoir. The processing fluid is stored in the internal space of the processing fluid supply source 3210. The replenishment line 3230 may be connected to the processing fluid supply source 3210.

[0129] The replenishment line 3230 can be connected to the processing fluid supply source 3210 and the circulation tank 3410. One end of the replenishment line 3230 can be connected to the processing fluid supply source 3210. The other end of the replenishment line 3230 can be branched. The other end of the replenishment line 3230 can branch into a first pipe 3231 and a second pipe 3235.

[0130] One end of the first pipe 3231 can be connected to the replenishment pipe 3230, and the other end of the first pipe 3231 can be connected to the circulation tank 3410. The first pipe 3231 may have a first diameter. A first valve 3233 may be installed at the first pipe 3231. The first valve 3233 may be provided as an on / off valve. However, the inventive concept is not limited thereto, and the first valve 3233 may be provided as a flow control valve. The diameter of the first valve 323 through which the treated liquid flows may be set to a third diameter. The flow coefficient of the first valve 323 may have a first flow coefficient. The first pipe 3231 and the first valve 3233 may constitute a first supply component. The treated liquid can be supplied from the treated liquid supply source 3210 to the containment space within the circulation tank 3410 via the replenishment pipe 3230 and the first supply component.

[0131] One end of the second pipe 3235 can be connected to the replenishment pipe 3230, and the other end of the second pipe 3235 can be connected to the circulation tank 3410. The second pipe 3235 may have a second diameter larger than the first diameter of the first pipe 3231. A second valve 3237 may be installed in the second pipe 3235. The second valve 3237 may be configured as an on / off valve. However, the inventive concept is not limited thereto, and the second valve 3237 may be provided as a flow control valve. The diameter of the second valve 3237 through which the treated fluid flows may be configured as a fourth diameter, said fourth diameter being larger than the third diameter of the first valve 3231. The second valve 3237 may have a second flow coefficient larger than the first flow coefficient of the first valve 3233. The second pipe 3235 and the second valve 3237 may constitute a second supply component. The treated fluid can be supplied from the treated fluid supply source 3210 to the containment space within the circulation tank 3410 via the replenishment pipe 3230 and the second supply component.

[0132] Pressure sensor 3250 can be installed in replenishment line 3230. Pressure sensor 3250 measures the pressure in replenishment line 3230. Pressure sensor 3250 measures the pressure of the treatment fluid flowing in replenishment line 3230 in real time. The supply of treatment fluid flowing in replenishment line 3230 can be adjusted based on the pressure value measured by pressure sensor 3250.

[0133] Filter 3270 can be installed at the replenishment line 3230. Filter 3270 can filter the treatment fluid supplied from the replenishment line 3230. For example, filter 3270 can filter the treatment fluid supplied from the supply source 3210 to the circulation tank 3410. Filter 3270 can filter out impurities that may be contained in the treatment fluid.

[0134] Figure 11 This illustration shows the process of performing supplementary operations from... Figure 10 The flow rate supplied by the first and second supply components. Figure 12 Schematic illustration Figure 10 The liquid supply unit supplies the processing liquid to the tank during the first time period. Figure 13 Schematic illustration Figure 10 The liquid supply unit supplies the processing liquid to the tank during the second time period. (Refer to...) Figures 11 to 13 A substrate processing method according to an embodiment of the present invention is described in detail.

[0135] refer to Figures 11 to 13The processing fluid is supplied from the processing fluid supply source 3210 to the containment space inside the circulation tank 3410 via a replenishment line 3230. In one embodiment, the processing fluid is supplied from the processing fluid supply source 3210 to the containment space inside the circulation tank 3410 via a first pipe 3231 and / or a second pipe 3235 branching from the replenishment line 3230. The processing fluid stored in the containment space inside the circulation tank 3410 is circulated via a circulation line 3430. The processing fluid circulated via the circulation line 3430 is heated to a set temperature by a heater 3470. The processing fluid heated to the set temperature is discharged onto the substrate W via a branch line 3610 and then a supply nozzle 3650.

[0136] If the process of discharging the processing liquid onto the substrate W is repeated, the amount of processing liquid stored in the containment space inside the circulation tank 3410 can be reduced. If the processing liquid stored in the containment space of the circulation tank 3410 is located in the replenishment section MR, a replenishment operation of supplying processing liquid to the containment space can be performed.

[0137] According to one embodiment, if the level of the processing fluid stored in the containment space is between the height of the second replenishment level sensor MR-H and the height of the first replenishment level sensor MR-L, it can be determined as a replenishment section MR for supplying processing fluid to the containment space. If the processing fluid stored in the containment space is located in the replenishment section MR, a replenishment operation can be performed.

[0138] If the level of the treatment fluid injected into the containment space drops from section H to section MR, a replenishment operation can be performed. The replenishment operation can be divided into a first time period and a second time period. For example... Figure 11 As shown, during the first period of the replenishment operation, the first valve 3233 can be opened and the second valve 3237 can be closed. Therefore, the treatment fluid is supplied to the containment space through the first conduit 3231. During the first period, the average supply amount of treatment fluid per unit time from the first valve 3233 to the containment space can be a first flow rate.

[0139] During the second phase of the supplementary operation, the first valve 323 can be closed and the second valve 3237 can be opened. Accordingly, during the second phase, the treatment fluid can flow to the containment space through the second conduit 3235. During the second phase, the average supply rate of treatment fluid per unit time from the second valve 3237 to the containment space can be a second flow rate higher than the first flow rate.

[0140] According to an embodiment of the present invention, even if the temperature of the processed liquid supplied from the processed liquid supply source 3210 differs from the set temperature, the temperature of the processed liquid previously stored in the circulation tank 3410 can be maintained within the set temperature range. That is, since the processed liquid maintained at the set temperature is stored in the circulation tank 3410, if the temperature of the processed liquid replenished in the circulation tank 3410 deviates from the set temperature, the temperature of the processed liquid previously stored in the circulation tank 3410 may change rapidly. According to an embodiment of the present invention, a temperature buffer section can be formed such that the temperature of the pre-stored processed liquid in the circulation tank 3410 does not change rapidly by minimizing the amount of processed liquid initially supplied to the containment space of the circulation tank 3410.

[0141] Accordingly, the temperature of the processing liquid pre-stored in the circulation tank 3410 can be maintained within a set temperature range. The time required for the processing liquid flowing through the circulation line 3430 to be preheated to the set temperature can be reduced by the heater 3470. Furthermore, by maintaining the constant temperature of the processing liquid within the set temperature range, effective liquid processing can be performed on the substrate W.

[0142] In the above embodiments of the inventive concept, for ease of explanation, the case where the first valve 3233 and the second valve 3237 are provided as on / off valves is described as an example. However, the inventive concept is not limited thereto, and the first valve 3233 and the second valve 3237 are provided as flow control valves to form a temperature buffer section by forming a lower flow rate of the processed liquid supplied to the containment space through the first valve 3233 in a first time period than the flow rate of the processed liquid supplied to the containment space through the second valve 3237 in a second time period.

[0143] The effects of this invention are not limited to those described above, and those skilled in the art to which this invention pertains can clearly understand any effects not mentioned from the specification and drawings.

[0144] Although preferred embodiments of the inventive concept have been shown and described up to now, the inventive concept is not limited to the specific embodiments described above, and it should be noted that those skilled in the art to which the inventive concept relates can implement the inventive concept differently without departing from the essence of the inventive concept as claimed in the claims, and should not be interpreted or modified separately from the technical spirit or prospect of the inventive concept.

Claims

1. A substrate processing apparatus, comprising: Support unit, the support unit being configured to support a substrate; as well as A liquid supply unit, configured to supply processing liquid to the substrate supported on the support unit, and The liquid supply unit includes: A tank, the tank being configured to have a receiving space therein for storing the processing liquid; A circulation line configured to circulate the treatment fluid stored in the containment space; A replenishment line is configured to supply the treatment fluid to the containment space, and a valve is installed at the replenishment line; A heater, installed at the circulation line and used to heat the treatment fluid; and A controller, configured to control the valve, and If it is determined that the processed liquid stored in the containment space needs to be replenished, the controller controls the valve to perform a replenishment operation by supplying the processed liquid to the containment space through the replenishment line. The controller controls the valve to supply the processed liquid to the containment space at a first supply rate per unit time during a first period of the replenishment operation, and controls the valve to supply the processed liquid to the containment space at a second supply rate per unit time during a second period of the replenishment operation. The first supply rate per unit time is the supply rate per unit time for the entire first period, and the second supply rate per unit time is the supply rate per unit time for the entire second period. The first period occurs before the second period. The supplementary pipeline is branched to direct the treatment fluid to a first supply component and a second supply component, each having a valve and a pipe. The valves or pipes installed at the first supply component and the second supply component are of different sizes.

2. The substrate processing apparatus of claim 1, wherein the amount of processing liquid supplied per unit time during the first time period is lower than the amount of processing liquid supplied per unit time during the second time period.

3. The substrate processing apparatus of claim 2, wherein the controller controls the valve to perform a pulsating operation of repeatedly opening and closing operations during the first time period.

4. The substrate processing apparatus of claim 2, wherein the controller controls the valve to perform a pulsating operation of repeatedly opening during the first time period.

5. The substrate processing apparatus of claim 1, wherein the dimensions of the first valve and the first conduit disposed at the first supply member are relatively smaller than the dimensions of the second valve and the second conduit disposed at the second supply member.

6. The substrate processing apparatus of claim 5, wherein the controller controls the first valve to open and controls the second valve to close, so as to supply the processing liquid to the receiving space via the first supply member during the first time period, and During the second time period, the second valve is controlled to open.

7. The substrate processing apparatus of claim 2, wherein the valve is a flow regulating valve.

8. The substrate processing apparatus of claim 1 further includes a measuring unit for measuring the liquid level of the processing liquid stored in the receiving space, and The controller determines the replenishment section to perform the replenishment operation by detecting the level of the processing liquid stored in the containment space, as measured by the measuring unit.

9. The substrate processing apparatus according to any one of claims 1 to 8, wherein during supplementary operation, the processing liquid stored in the containment space is continuously heated by the heater.

10. A liquid supply unit for supplying processing liquid to a substrate, comprising: A tank, the tank being configured to have a receiving space therein for storing the processing liquid; A circulation line configured to circulate the treatment fluid stored in the containment space; A replenishment line is configured to supply the treatment fluid to the containment space, and a valve is installed at the replenishment line; A heater, which is installed at the circulation line and is used to heat the treatment liquid; as well as A controller, configured to control the valve, and If it is determined that the processed liquid stored in the containment space needs to be replenished, the controller controls the valve to perform a replenishment operation by supplying the processed liquid to the containment space through the replenishment line. The controller further controls the valve to supply the processed liquid to the containment space at a first supply rate per unit time during a first period of the replenishment operation, and controls the valve to supply the processed liquid to the containment space at a second supply rate per unit time during a second period of the replenishment operation. The first supply amount of the treatment fluid per unit time is the supply amount per unit time for the entire first time period, and the second supply amount of the treatment fluid per unit time is the supply amount per unit time for the entire second time period, wherein the first time period occurs before the second time period. The supplementary pipeline is branched to direct the treatment fluid to a first supply component and a second supply component, each having a valve and a pipe. The valves or pipes installed at the first supply component and the second supply component are of different sizes.

11. The liquid supply unit of claim 10, wherein the amount of the processing liquid supplied per unit time during the first time period is less than the amount of the processing liquid supplied per unit time during the second time period.

12. The liquid supply unit of claim 10, wherein the controller controls the valve to perform a pulsating operation of repeatedly opening and closing operations during the first time period, and controls the valve to perform a pulsating operation of repeatedly opening operations during the first time period.

13. The liquid supply unit as claimed in claim 11, wherein... The dimensions of the first valve and the first pipe provided at the first supply component are relatively smaller than the dimensions of the second valve and the second pipe provided at the second supply component.

14. The liquid supply unit of claim 13, wherein the controller controls the first valve to open and controls the second valve to close, to supply the processing liquid to the containment space via the first supply member during the first time period, and During the second time period, the second valve is controlled to open.

15. The liquid supply unit of claim 11, wherein the valve is a flow regulating valve.

16. A substrate processing method, comprising: The processing liquid is stored in a containment space inside the tank. The processing liquid stored in the containment space is heated to a set temperature in the circulation line so that it flows in the circulation line. The processing liquid heated to the set temperature is then discharged onto the substrate to process the substrate. If it is necessary to replenish the processing fluid stored in the containment space, a replenishment operation is performed to supply the processing fluid to the containment space. During the first period of the replenishment operation, the processing liquid is supplied to the containing space at a first supply rate per unit time, and during the second period of the replenishment operation, the processing liquid is supplied to the containing space at a second supply rate per unit time. The first supply amount of the treatment fluid per unit time is the supply amount per unit time for the entire first time period, and the second supply amount of the treatment fluid per unit time is the supply amount per unit time for the entire second time period, wherein the first time period occurs before the second time period. A branched replenishment line supplies the treatment fluid to the containment space, allowing the treatment fluid to flow through the branches to a first supply member and a second supply member, each having a valve and a conduit. The valves or pipes installed at the first supply component and the second supply component are of different sizes.

17. The substrate processing method of claim 16, wherein the amount of processing liquid supplied per unit time during the first time period is lower than the amount of processing liquid supplied per unit time during the second time period.

18. The substrate processing method of claim 17, wherein the processing liquid is supplied to the receiving space by a pulsating operation of repeatedly supplying the processing liquid to the receiving space and stopping the supply of the processing liquid during the first time period, and the processing liquid is continuously supplied to the receiving space during the second time period.

19. The substrate processing method as described in claim 17, wherein... The dimensions of the first valve and the first pipe provided at the first supply component are relatively smaller than the dimensions of the second valve and the second pipe provided at the second supply component, and The treatment liquid is supplied to the containing space through the first supply member during the first time period, and the treatment liquid is supplied to the containing space through the second supply member during the second time period.

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