A transparent LED display

Abstract

In order to overcome the problem that it is difficult to realize printing lamp bead welding area on a transparent substrate and the lamp bead welding area is easy to fall off in the prior art, the present application provides a transparent LED display screen, comprising a transparent substrate and LED lamp beads; a circuit pattern is arranged on the transparent substrate; the LED lamp beads are flip-chip pasted on the transparent substrate; the surface of the LED lamp bead emitting light is the front surface, and the front surface of the LED lamp bead is pasted on the transparent substrate; the transparent LED display screen disclosed by the present application adopts a flip-chip pasting mode to flip-fix the LED lamp beads on the transparent substrate, then directly or indirectly electrically connects each LED lamp bead to the power supply circuit by a power jumper, realizes the series connection of the LED lamp beads by a signal jumper, and replaces the mode of welding the LED lamp beads on the lamp bead welding area by the above mode. It is easy to implement, and the LED lamp bead is fixed firmly and is not easy to fall off.

Description

Technical Field

[0001] This invention relates to the field of LED displays, and more particularly to the field of transparent LED displays. Background Technology

[0002] Transparent LED displays are increasingly widely used in the market and have evolved into various product forms. A technology for transparent LED displays, which involves arraying LED chips on a transparent substrate, has begun to emerge. Existing technologies include... Figure 1 , Figure 2 The transparent LED display shown includes a transparent substrate 1', on which a printed circuit layer 3' is provided, and an array of LED beads 2' encapsulating driver chips is mounted on the transparent substrate 1'; then, a potting layer 5' is formed by potting adhesive on the surface of the transparent substrate 1' where the LED beads 2' are arranged; then, a protective cover plate 4' is covered on the surface of the potting layer 5'.

[0003] like Figure 2 As shown, specifically, the printed circuit layer 3' includes LED chip soldering areas 31', power pads 32', and signal pads 33'. Each LED chip soldering area 31' has two signal pin pads and two electrode pin pads. The signal pin pads are connected in series through printed signal lines, while the two electrode pin pads with opposite polarities are connected to the power pads 32' through metal meshes 30' printed on the transparent substrate 1' for power supply. The pins of the LED chip 2' are soldered to the aforementioned signal pin pads and electrode pin pads.

[0004] This method has certain advantages, namely that the power supply metal grid 30' can be directly formed on the transparent substrate 1' as a power supply circuit through printing technology. However, it requires printing LED chip soldering areas on the substrate, and then soldering the LED chips 2' onto the soldering areas 31' for electrical connection. However, forming the LED chip soldering areas 31' on the transparent substrate 1' is technically difficult, and these areas are prone to detachment. If the transparent substrate 1' is made of PET (polyethylene terephthalate), existing technologies require finding a way to electrically connect the pins of the LED chips 2' to the pads on the soldering areas 31'. Common methods include high-temperature soldering or using silver paste, both of which require high-temperature processing, which can cause the PET to deform or even melt. Summary of the Invention

[0005] To overcome the difficulties in printing LED chip soldering areas on transparent substrates in existing technologies, and the fact that LED chip soldering areas are prone to detachment, this invention provides a transparent LED display screen.

[0006] This application discloses a transparent LED display screen, including a transparent substrate and LED beads; the transparent substrate is provided with circuit patterns; the LED beads include a base bracket, a driver chip and a light-emitting chip; the side of the LED beads that emits light is the front side, and the front side of the LED beads is attached to the transparent substrate;

[0007] A chip mounting surface is formed on the base support, the driving chip is mounted on the chip mounting surface, and the light-emitting chip is mounted on the driving chip or the chip mounting surface and is controlled by the driving chip.

[0008] The chip mounting surface includes an isolation channel and bonding pads that are isolated from each other by the isolation channel. The back of the base bracket is provided with bonding pins, which are electrically connected to the bonding pads. The bonding pins include electrode pins; the electrode pins include a first electrode pin and a second electrode pin with opposite polarities.

[0009] The circuit pattern includes power pads and power lines; the power lines include several first power lines and second power lines with opposite polarities; the power pads connect the first power lines and the second power lines.

[0010] The first electrode pin is directly or indirectly connected to the first power supply line via a power jumper, and the second electrode pin is directly or indirectly connected to the second power supply line via a power jumper.

[0011] The transparent LED display screen disclosed in this invention only requires the power supply circuit to be formed on the transparent substrate, eliminating the need for printing LED chip soldering areas as in existing technologies. It uses an adhesive method to flip-chip fix the LED chips onto the transparent substrate, and then uses power jumpers to directly or indirectly connect each LED chip to the power supply line. This method replaces the existing method of soldering LED chips onto the chip soldering areas. Using this flip-chip adhesive method, there is no need to consider the electrical connection between the LED chips and the transparent substrate; it can be achieved using only adhesive. This is easy to implement in actual production, and the LED chips are firmly fixed and not easily detached. Using power jumpers to power each chip is also easy to implement in terms of process. At the same time, this method greatly improves the transparency of the transparent LED display screen. This method provides a variety of choices for the transparent substrate material, including glass, plastic, and thin film materials, and the processing conditions are simple, all of which can easily achieve the desired effect.

[0012] Furthermore, the bonding pin also includes input / output pins, which include signal input pins and signal output pins;

[0013] The circuit pattern also includes signal pads; each of the LED beads is connected by signal jumpers to form a string of LED beads, wherein the signal input pin of each LED bead in the string of LED beads is connected to the signal pad or the signal output pin of the previous LED bead by a signal jumper; the signal output pin of each LED bead is connected to the signal input pin of the next LED bead by a signal jumper.

[0014] Furthermore, the first electrode pin on each of the LED beads is connected to the first power supply line or the first electrode pin on a neighboring LED bead via the power jumper; the second electrode pin on each of the LED beads is connected to the second power supply line or the second electrode pin on a neighboring LED bead via the power jumper; so that each LED bead can directly draw power from the power supply line or from a neighboring LED bead.

[0015] Furthermore, the LED bead is a CHIP-type LED bead, and the base bracket of the CHIP-type LED bead is a circuit board. The copper foil on the front side of the circuit board is etched to form the chip mounting surface, and the copper foil on the back side of the circuit board is etched to form the bonding pins. The bonding pins are electrically connected to the chip mounting surface.

[0016] Furthermore, a driver chip is provided on the chip mounting surface of the CHIP-type LED bead, and the light-emitting wafer is mounted on the driver chip; the driver chip is encapsulated in a transparent encapsulating layer.

[0017] Furthermore, the LED bead is a TOP type LED bead; the TOP type LED bead includes a base bracket using a plastic bracket; the chip mounting surface is formed on the surface of the plastic bracket by a metal strip, and bonding pins extend from the chip mounting surface and bend towards the bottom of the plastic bracket.

[0018] Furthermore, the light-emitting chip is mounted on the driver chip via CSP or COC.

[0019] Furthermore, the power supply line includes a plurality of first power supply lines and second power supply lines arranged in rows or columns; a plurality of rows or columns of LED beads are provided between the first power supply lines and the second power supply lines; the LED beads share the first power supply line and the second power supply line.

[0020] Furthermore, the power supply line is a conductive mesh, an ITO conductive film, or a nano-silver thin film.

[0021] Furthermore, a potting layer is provided on the transparent substrate on which the LED beads are arranged, and the potting layer encapsulates each of the LED beads therein; a protective cover plate is provided on the upper surface of the potting layer.

[0022] Furthermore, the transparent substrate is provided with a plurality of transparent unit boards; the front of the LED beads is attached to the transparent unit boards; metal strips are provided on both sides of each transparent unit board as power supply lines; the LED beads on each transparent unit board are connected to the power supply lines. Attached Figure Description

[0023] Figure 1 This is a cross-sectional schematic diagram of a transparent LED display screen disclosed in the prior art;

[0024] Figure 2 This is a top view schematic diagram of a transparent LED display screen disclosed in the prior art;

[0025] Figure 3 This is a partial cross-sectional schematic diagram of a transparent LED display screen using CHIP-type LED beads provided in a specific embodiment of this application;

[0026] Figure 4 This is a top view schematic diagram of a transparent LED display screen using CHIP-type LED beads provided in a specific embodiment of this application;

[0027] Figure 5a yes Figure 3 , Figure 4 Cross-sectional view of a CHIP-type LED bead;

[0028] Figure 5b This is a three-dimensional schematic diagram of a CHIP-type LED bead provided in the specific method of this application;

[0029] Figure 5c yes Figure 5b A three-dimensional schematic diagram of a CHIP-type LED bead after further transparent encapsulation;

[0030] Figure 5d yes Figure 5c A bottom-view diagram of a CHIP-type LED bead; Figure 6 This is a top view of a further extended transparent LED display screen using CHIP-type LED beads provided in a specific embodiment of this application;

[0031] Figure 7 This is a top view schematic diagram of another transparent LED display screen using CHIP-type LED beads provided in a specific embodiment of this application;

[0032] Figure 8 yes Figure 7A schematic diagram illustrating further deformation of a transparent LED display screen;

[0033] Figure 9 yes Figure 8 A partial cross-sectional view of a transparent LED display screen;

[0034] Figure 10 This is a further extension of the transparent LED display provided in the specific embodiments of this application;

[0035] Figure 11 This is a cross-sectional schematic diagram of a transparent display screen using TOP type LED beads in a specific embodiment of this application;

[0036] Figure 12a yes Figure 11 Partial sectional three-dimensional schematic diagram of a TOP-type LED bead;

[0037] Figure 12b yes Figure 12a A bottom-view diagram of a top-type LED bead;

[0038] Figure 12c yes Figure 12a A cross-sectional view of a TOP-type LED bead.

[0039] In the background art, the reference numerals are as follows: 1', transparent substrate; 2', LED chip; 3', printed circuit layer; 4', protective cover; 5', potting layer; 31', chip solder area; 32', power pad; 33', signal pad; 30', metal mesh;

[0040] In the detailed embodiments, the reference numerals are as follows: 1. Transparent substrate; 2. LED bead; 3. Circuit pattern; 4. Protective cover plate; 5. Encapsulation layer; 6. Transparent unit board; 20. Light-emitting chip; 21. Driver chip; 22. Base bracket; 23. Chip mounting surface; 24. Transparent encapsulation layer; 231. Bonding pad; 232. Isolation channel; 31. Power supply line; 31a. First power supply line; 31b. Second power supply line; 32. Signal jumper; 33. Signal pad; 311. Power jumper; 2311. Bonding pin. Detailed Implementation

[0041] To make the technical problems solved, the technical solutions, and the beneficial effects of this invention clearer, the invention will be further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the invention and are not intended to limit the invention.

[0042] In the description of this invention, it should be understood that the terms "longitudinal," "radial," "length," "width," "thickness," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," and "outer," etc., indicating orientation or positional relationships, are based on the orientation or positional relationships shown in the accompanying drawings and are only for the convenience of describing the invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of the invention. In the description of this invention, unless otherwise stated, "a plurality of" means two or more.

[0043] In the description of this invention, it should be noted that, unless otherwise explicitly specified and limited, the terms "installation," "connection," and "linking" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal connection of two components. Those skilled in the art can understand the specific meaning of the above terms in this invention based on the specific circumstances.

[0044] Example

[0045] This example will specifically explain the transparent LED display screen disclosed in this application as follows: Figure 3 As shown, it includes a transparent substrate 1 and LED beads 2; the transparent substrate 1 is provided with circuit patterns 3; the LED beads 2 are attached to the transparent substrate 1; the so-called attachment refers to fixing with glue, and the glue can be various glues known to those skilled in the art, such as instant glue, epoxy resin adhesives, anaerobic glues, UV glues, hot melt glues, pressure-sensitive glues, etc.

[0046] Generally, a potting layer 5 is also provided on the transparent substrate 1 on which the LED beads 2 are arranged, and the potting layer 5 encapsulates each of the LED beads 2 therein; a protective cover plate 4 is provided on the upper surface of the potting layer 5. This is known to those skilled in the art.

[0047] Depend on Figure 1 It can be seen that the surface of the existing LED lamp bead 2' that emits light is the front side. The existing LED lamp bead 2' is mounted on the transparent substrate 1', that is, the back side of the LED lamp bead 2' is pasted on the transparent substrate 1', and the front side of the LED lamp bead 2' faces the protective cover plate 4'. The light emitted by the LED lamp bead 2' is emitted through the protective cover plate 4'.

[0048] like Figure 5a , Figure 5b , Figure 5c , Figure 5d and Figure 12a , Figure 12b , Figure 12c In two configurations, the LED bead 2 includes a base bracket 22, a driver chip 21, and a light-emitting chip 20. The side of the LED bead 2 that emits light (exposing the side of the light-emitting chip 20) is the front side, and the front side of the LED bead 2 is attached to the transparent substrate 1. In this example, the LED bead 2 is flip-chip mounted on the transparent substrate 1, with the front side of the LED bead 2 facing the transparent substrate 1 and the back side of the LED bead 2 facing the protective cover plate 4. The light emitted by the LED bead 2 passes through the transparent substrate 1. The LED bead 2 typically includes two types of structures: chip type and top type. Figure 5a , Figure 5b , Figure 5c and Figure 5d The LED bead 2 shown is a CHIP type LED bead. Figure 12a , Figure 12b and Figure 12c It is a TOP type LED lamp bead.

[0049] Taking CHIP-type LED beads as an example, such as Figure 5b and Figure 5c As shown, a chip mounting surface 23 is formed on the base support 22, the driving chip 21 is mounted on the chip mounting surface 23, and the light-emitting chip 20 is mounted on the driving chip 21 (or the light-emitting chip 20 can be mounted on the chip mounting surface 23) and is controlled by the driving chip 21.

[0050] The chip mounting surface 23 includes an isolation channel 232 and bonding pads 231 that are isolated from each other by the isolation channel 232. The bonding pads 231 include electrode pads (not marked in the figure) and input / output pads (not marked in the figure). The electrode pads include a first electrode pad (not marked in the figure) and a second electrode pad (not marked in the figure) with opposite polarities. The input / output pads include a signal input pad (not marked in the figure) and a signal output pad (not marked in the figure). The back of the base bracket 22 is provided with bonding pins 2311, which are electrically connected to the bonding pads 231. The bonding pins 2311 include electrode pins and input / output pins. The electrode pins include a first electrode pin and a second electrode pin with opposite polarities. The input / output pins include a signal input pin and a signal output pin.

[0051] like Figures 3-4 As shown, the circuit pattern 3 includes a power pad (not shown), a signal pad 33, and a power supply line 31; the power supply line 31 includes a plurality of first power supply lines 31a and second power supply lines 31b with opposite polarities; the power pad connects the first power supply lines 31a and the second power supply lines 31b.

[0052] The first electrode pin is directly or indirectly bound to the first power supply line 31a via power jumper 311, and the second electrode pin is directly or indirectly bound to the second power supply line 31b via power jumper 311.

[0053] The LED beads 2 are connected together via signal jumpers 32 to form a bead string. The signal input pins of each LED bead 2 in the bead string are connected to a signal pad 33 or the signal output pin of the preceding LED bead 2 via signal jumpers 32. The signal output pins of each LED bead 2 are connected to the signal input pin of the following LED bead 2 via signal jumpers 32. If there are no other LED beads 2 after the current LED bead 2, the signal output pin is either left unconnected or returned to the signal pad.

[0054] The direct or indirect connection between the bonding pin 2311 and the power supply line 31 is explained in detail below, as follows: Figure 3 , Figure 4 As shown, the first electrode pin on each of the LED beads 2 is connected to the first power supply line 31a or the first electrode pin on a neighboring LED bead 2 via a power jumper 311; the second electrode pin on each of the LED beads 2 is connected to the second power supply line 31b or the second electrode pin on a neighboring LED bead 2 via a power jumper 311; so that each LED bead 2 can directly draw power from the power supply line 31 or from a neighboring LED bead 2.

[0055] In this example, the power jumper 311 and signal jumper 32 are what those skilled in the art understand as bonding wires or bonding wires; they are simply named here to distinguish the components. The power jumper 311 and signal jumper 32 are preferably 15μm-70μm in diameter and made of gold, copper, or alloy wire. Because of their small diameter, they are almost invisible to the naked eye. Therefore, while ensuring sufficient operating current for the connected LED beads 2, they reduce obstruction of vision and improve product transparency.

[0056] Although the power jumper 311 and the signal jumper 32 cross each other in the schematic diagram, in the actual manufacturing process they are bonded at different heights and then fixed by potting glue, so there will be no collapse or short circuit.

[0057] The base bracket 22 of the CHIP-type LED bead is a circuit board. The copper foil on the front of the circuit board is etched to form the chip mounting surface 23. That is, after etching, the etched areas form isolation channels 232, and the unetched areas form bonding pads 231. The copper foil on the back of the circuit board is etched to form bonding pins 2311, which are electrically connected to the chip mounting surface 23. The bonding pins 2311 on the back of the circuit board are connected to the bonding pads 231 on the front of the circuit board (generally using vias for electrical connection), i.e., the first electrode pad is connected to the first electrode pin, the second electrode pad is connected to the second electrode pin, the signal input pad is connected to the signal input pin, and the signal output pad is connected to the signal output pin.

[0058] As a preferred method, such as Figure 5c As shown, the light-emitting chip 20 is mounted on the driver chip 21; the driver chip 21 is encapsulated in a transparent encapsulating layer 24. This method uses the transparent encapsulating layer 24 to first encapsulate and protect the light-emitting chip 20 and the driver chip 21. The transparent encapsulating layer 24 completely covers the chip mounting surface 23.

[0059] In this example, regarding the mounting method of the light-emitting chip 20, it is preferred that the light-emitting chip 20 be mounted on the driver chip 21 using the CSP (Chip Scale Package) method. It can also be mounted on the driver chip 21 using the COC (Chip On Chip) method. The light-emitting chip 20 generally includes red, green, and blue light-emitting chips 20.

[0060] In a preferred embodiment, the power supply line 31 includes a plurality of first power supply lines 31a and second power supply lines 31b arranged in rows or columns; a plurality of rows or columns of LED beads 2 are provided between the first power supply lines 31a and second power supply lines 31b; the LED beads 2 share the first power supply lines 31a and second power supply lines 31b. Figure 6 As shown, a first power supply line 31a, a second power supply line 31b, and a third power supply line 31a are spaced apart. A 4x4 array of LED beads 2 is arranged between the first power supply line 31a and the second power supply line 31b on the left side; these 4x4 arrays of LED beads 2 share the first power supply line 31a and the second power supply line 31b. A 4x4 array of LED beads 2 is also arranged between the first power supply line 31a and the second power supply line 31b on the right side; these 4x4 arrays of LED beads 2 share the first power supply line 31a and the second power supply line 31b on the right side.

[0061] By using the above method, several columns or rows of LED beads 2 can share the same polarity power supply line 31. By arranging them in this cyclical manner, a large-area transparent LED display screen can be made. Sharing the power supply line 31 with several LED beads 2 can reduce the number of power supply lines 31, reduce obstruction of the view, and help improve the transparency of the display screen.

[0062] This application is not limited to the implementation of power supply line 31, which is not the core innovation of this application. It can be implemented in a manner known to those skilled in the art. The number of first power supply lines 31a and second power supply lines 31b can be one or more. The number of first power supply lines 31a and second power supply lines 31b can be the same or different. The specific number depends on the power supply capacity of power supply line 31 and the current demand of LED beads 2 between first power supply lines 31a and second power supply lines 31b. Generally, 3 to 8 rows of LED beads 2 is an ideal number.

[0063] The power supply line 31 can be in the form of a straight line, a curved line, or a serpentine line segment, etc. Preferably, each power supply line 31 is arranged in a row or column, and its implementation is not limited, as long as it can provide power. For example, it can be a metal layer etched on the transparent substrate 1, or a metal mesh, or a nano-silver coating or ITO coating, or it can be implemented in ways such as metal wires or metal sheets embedded in the transparent substrate 1 as described in the applicant's previous patent applications.

[0064] As a preferred method, such as Figure 7 As shown, the power supply line 31 is preferably a conductive mesh. The conductive mesh can be a metal mesh or ITO, and the dots in the figure represent the bonding points (electrical connection points) between the bonding line and the metal mesh or ITO. Metal mesh or ITO has a relatively high sheet resistance and low conductivity, so a large area is required to meet the current demand. In this figure, the conductive mesh is arranged on both sides of several rows of LED beads 2. The LED beads 2 between the first power supply line 31a and the second power supply line 31b, which are in the form of a conductive mesh, share the aforementioned first power supply line 31a and second power supply line 31b. At this point, it is only necessary to attach the LED beads 2 to the glass substrate.

[0065] like Figure 8 , Figure 9As shown, to enhance the conductivity of the conductive grid and expand its area, the LED beads 2 can be insulated and adhered to the conductive grid. For example, the two columns of LED beads 2 on the left side of the figure are arranged on the conductive grid of the first power supply line 31a, and the two columns of LED beads 2 on the right side of the figure are arranged on the conductive grid of the second power supply line 31b. Since the conductive grid material is transparent, it has minimal obstruction to the light emission of the LED beads, thus ensuring a good display effect.

[0066] As for the design of power supply line 31, there can be other variations, such as... Figure 10 As shown, a plurality of transparent unit plates 6 are provided on the transparent substrate 1; the LED beads 2 are arranged on the transparent unit plates 6; metal strips are provided on both sides of each transparent unit plate 6 as power supply lines 31; the LED beads 2 on each transparent unit plate 6 are connected to the power supply lines 31. The power supply lines 31 on both sides are the first power supply line 31a and the second power supply line 31b, respectively. This method means that there are no power supply lines 31 on the surface of the transparent substrate 1, but they are embedded between two transparent unit plates 6. The transparent unit plates 6 are independent glass plates, and each transparent unit plate 6 is fixed on the whole transparent substrate 1 below. The advantage of this method is that the cross-section of the metal strip in the viewing direction of the screen is extremely small, which can ensure sufficient current supply to the plurality of LED beads 2 between the two power supply lines 31 with opposite polarities, greatly reducing the obstruction of the view by conductive materials and improving the transparency of the screen.

[0067] like Figure 11 As shown, as an alternative, TOP-type LED beads can also be glued onto the transparent substrate 1, such as... Figure 12a , 12bAs shown in Figure 12c, the so-called TOP-type structure refers to a structure that uses a PLCC (Plastic Leaded Chip Carrier) plastic bracket as the base bracket 22 (also called a housing, sometimes referred to as a base or bracket). Its process is publicly known and generally includes metal strip punching, electroplating, PPA (polyphthalamide) injection molding, bending, and five-sided inkjet printing. Its core is to form a chip mounting surface 23 on the surface of the plastic bracket using a metal strip; and bonding pins 2311 extend from the chip mounting surface 23. In this example, the bonding pins 2311 are no longer used for soldering, but rather for bonding connections. The bonding pins 2311 are bent towards the bottom of the plastic bracket. The bonding pad 231 is actually a metal sheet of the same material as the bonding pin 2311. The metal sheet is stamped and the empty spaces are filled by injection molding to form the isolation channel 232. The isolation channel 232 is actually an insulating plastic material that separates each bonding pin 2311 and also serves to fix the base bracket 22. Specifically, the bonding pad 231 includes electrode pads and input / output pads.

[0068] Among them, such as Figure 12a , 12b As shown in Figures 12c, the end of the bonding pin 2311 is bent and attached to the back of the base bracket 22, forming a U-shaped bonding pin 2311 as shown in the figure.

[0069] The driver chip 21 is publicly known. Generally, the driver chip 21 integrates a driver circuit and has a passivation layer, which is a surface insulating layer formed during the manufacturing process of the driver chip 21. The driver chip 21 has several pins (or terminals), which are electrically connected to the chip mounting surface 23 and the light-emitting wafer 20 via direct soldering or bonding wires. Pins (English name: PAD) are generally located on the passivation layer and are terminals inside the chip.

[0070] The transparent LED display screen disclosed in this invention only requires the power supply circuit to be formed on the transparent substrate 1, eliminating the need for printing lamp bead soldering areas as in existing technologies. Therefore, the fabrication of the power supply circuit is significantly simplified. Furthermore, when using transparent conductive materials (such as…),… Figure 8(Example) The circuit diagram is extremely simple, significantly reducing resistance and enhancing conductivity. It uses an adhesive bonding method to flip-chip fix the LED beads 2 onto the transparent substrate 1. Then, power jumpers 311 are used to directly or indirectly connect each LED bead 2 to the power supply line 31, and signal jumpers 32 are used to connect the LED beads 2 in series. This method replaces the existing method of soldering the LED beads 2 onto the LED bead soldering area. Using this flip-chip bonding method, there is no need to consider the electrical connection between the LED beads 2 and the transparent substrate 1; it can be achieved with just glue. This is easy to implement in actual production, avoiding the disadvantage of difficulty in fabricating the LED bead soldering area on the transparent substrate. Furthermore, the LED beads 2 are firmly fixed and not easily detached. The use of power jumpers 311 for powering each LED bead and signal jumpers 32 for signal transmission is also easy to implement in terms of process. Using this technology, the LED beads 2 can be firmly bonded at room temperature, and the bonding wires are also performed at room temperature, thus avoiding high-temperature environments. This provides an excellent technical means for manufacturing flexible transparent screens with PET as the substrate. At the same time, this method also greatly improves the transparency of the transparent LED display screen. This method offers diverse material options for the transparent substrate 1, allowing for the selection of glass, plastic, and thin film materials. The processing conditions are simple, and ideal results can be easily achieved in all cases.

[0071] The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention. Any modifications, equivalent substitutions, and improvements made within the spirit and principles of the present invention should be included within the protection scope of the present invention.

Claims

1. A transparent LED display screen, characterized in that, It includes a transparent substrate and LED beads; the transparent substrate has a circuit pattern; the LED beads include a base bracket, a driver chip and a light-emitting chip; the side of the LED beads that emits light is the front side; the LED beads are flip-mounted and attached to the transparent substrate, with the front side of the LED beads facing the transparent substrate and the back side of the LED beads facing the protective cover. A chip mounting surface is formed on the base support, the driving chip is mounted on the chip mounting surface, and the light-emitting chip is mounted on the driving chip or the chip mounting surface and is controlled by the driving chip. The chip mounting surface includes an isolation channel and bonding pads that are isolated from each other by the isolation channel. The back of the base bracket is provided with bonding pins, which are electrically connected to the bonding pads. The bonding pins include electrode pins; the electrode pins include a first electrode pin and a second electrode pin with opposite polarities. The circuit pattern includes power pads and power lines; the power lines include several first power lines and second power lines with opposite polarities; the power pads connect the first power lines and the second power lines. The first electrode pin is directly or indirectly connected to the first power supply line via a power jumper, and the second electrode pin is directly or indirectly connected to the second power supply line via a power jumper.

2. The transparent LED display screen according to claim 1, characterized in that, The bonding pin also includes input / output pins, which include signal input pins and signal output pins. The circuit pattern also includes signal pads; each of the LED beads is connected by signal jumpers to form a string of LED beads, wherein the signal input pin of each LED bead in the string of LED beads is connected to the signal pad or the signal output pin of the previous LED bead by a signal jumper; the signal output pin of each LED bead is connected to the signal input pin of the next LED bead by a signal jumper.

3. The transparent LED display screen according to claim 1, characterized in that, The first electrode pin on each of the LED beads is connected to the first power supply line or the first electrode pin on a neighboring LED bead via the power jumper; the second electrode pin on each of the LED beads is connected to the second power supply line or the second electrode pin on a neighboring LED bead via the power jumper; so that each LED bead can draw power directly from the power supply line or from a neighboring LED bead.

4. The transparent LED display screen according to claim 1, characterized in that, The LED bead is a CHIP-type LED bead, and the base bracket of the CHIP-type LED bead is a circuit board. The copper foil on the front of the circuit board is etched to form the chip mounting surface, and the copper foil on the back of the circuit board is etched to form the bonding pins. The bonding pins are electrically connected to the chip mounting surface.

5. The transparent LED display screen according to claim 4, characterized in that, The CHIP-type LED bead has a driver chip on its chip mounting surface, and the light-emitting wafer is mounted on the driver chip; the driver chip is encapsulated in a transparent encapsulation layer.

6. The transparent LED display screen according to claim 1, characterized in that, The LED bead is a TOP type LED bead; the TOP type LED bead includes a base bracket with a plastic bracket; the chip mounting surface is formed on the surface of the plastic bracket by a metal strip, the bonding pin extends from the chip mounting surface and bends towards the bottom of the plastic bracket.

7. The transparent LED display screen according to claim 1, characterized in that, The light-emitting chip is mounted on the driver chip via CSP or COC.

8. The transparent LED display screen according to claim 1, characterized in that, The power supply line includes a plurality of first power supply lines and second power supply lines arranged in rows or columns; a plurality of rows or columns of LED beads are provided between the first power supply lines and the second power supply lines; The aforementioned LED beads share the first power supply line and the second power supply line.

9. The transparent LED display screen according to claim 1, characterized in that, The power supply line is a conductive mesh, an ITO conductive film, or a nano-silver thin film.

10. The transparent LED display screen according to claim 1, characterized in that, A potting layer is provided on a transparent substrate on which the LED beads are arranged, and the potting layer encapsulates each of the LED beads therein; The upper surface of the potting layer is provided with a protective cover plate.

11. The transparent LED display screen according to claim 10, characterized in that, The transparent substrate is provided with a plurality of transparent unit boards; the front of the LED beads is attached to the transparent unit boards; metal strips are provided on both sides of each transparent unit board as power supply lines; the LED beads on each transparent unit board are connected to the power supply lines.

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