Liquid-cooled cabinet and liquid cooling system

Abstract

This disclosure provides a liquid-cooled server rack and a liquid cooling system, relating to the field of computer technology, specifically to cloud computing, data centers, and other related technologies. The liquid-cooled server rack includes: a rack body; a circulation system and a heat-generating device disposed inside the rack body; the circulation system is used to transport coolant; the heat-generating device is immersed in the coolant; the heat-generating device includes: a rack-mount server, a centralized power supply module, and a centralized power supply bus; the rack-mount server is connected to the centralized power supply module via the centralized power supply bus. This disclosure can improve the performance of the liquid-cooled server rack.

Description

Technical Field

[0001] This disclosure relates to the field of computer technology, specifically to cloud computing, data centers and other technical fields, and in particular to a liquid-cooled cabinet and a liquid cooling system. Background Technology

[0002] With technological advancements, liquid cooling is becoming a trend in data centers. Data center liquid cooling technologies are mainly divided into cold plate liquid cooling and immersion liquid cooling. Cold plate liquid cooling primarily uses liquid cooling to dissipate heat from high-power heat sources in the system, and electronic components do not directly contact the coolant; other components use air cooling. Immersion liquid cooling uses liquid as the heat transfer medium, directly immersing heat-generating electronic components in the coolant. Heat is removed through direct contact between the coolant and the electronic components, effectively improving heat dissipation. Summary of the Invention

[0003] This disclosure provides a liquid-cooled cabinet and a liquid-cooling system.

[0004] According to one aspect of this disclosure, a liquid-cooled server rack is provided, comprising: a rack body; a circulation system and a heating element disposed inside the rack body; the circulation system is used to transport coolant; the heating element is immersed in the coolant; the heating element includes: a rack server, a centralized power supply module and a centralized power supply bus; the rack server is connected to the centralized power supply module via the centralized power supply bus.

[0005] According to another aspect of this disclosure, a liquid cooling system is provided, comprising: a liquid-cooled cabinet as described in any of the preceding claims; and a CDU for controlling the liquid-cooled cabinet.

[0006] According to the technical solution disclosed herein, the performance of liquid-cooled cabinets can be improved.

[0007] It should be understood that the description in this section is not intended to identify key or essential features of the embodiments of this disclosure, nor is it intended to limit the scope of this disclosure. Other features of this disclosure will become readily apparent from the following description. Attached Figure Description

[0008] The accompanying drawings are provided to better understand this solution and do not constitute a limitation of this disclosure. Wherein:

[0009] Figure 1 This is a schematic diagram based on the first embodiment of the present disclosure;

[0010] Figure 2 This is a schematic diagram based on the first embodiment of the present disclosure;

[0011] Figure 3This is a comparative diagram of a rack-mount liquid-cooled server and a rack-mount air-cooled server provided according to embodiments of this disclosure;

[0012] Figure 4 This is a schematic diagram of a sensor inside a cabinet according to an embodiment of this disclosure;

[0013] Figure 5 This is a schematic diagram according to the third embodiment of the present disclosure;

[0014] Figure 6 This is a schematic diagram according to the fourth embodiment of the present disclosure. Detailed Implementation

[0015] The exemplary embodiments of this disclosure are described below with reference to the accompanying drawings, including various details of the embodiments to aid understanding, and should be considered merely exemplary. Therefore, those skilled in the art will recognize that various changes and modifications can be made to the embodiments described herein without departing from the scope and spirit of this disclosure. Similarly, for clarity and brevity, descriptions of well-known functions and structures are omitted in the following description.

[0016] Among related technologies, immersion liquid cooling is usually based on standard server architecture, but its effectiveness needs to be improved.

[0017] Figure 1 This is a schematic diagram based on the first embodiment of the present disclosure, which provides a liquid-cooled cabinet. For example... Figure 1 As shown, the liquid-cooled cabinet 100 of this embodiment includes: a cabinet 101, a circulation system and a heating device disposed inside the cabinet 101.

[0018] The circulation system is used to transport coolant. The coolant may be, for example, a fluorinated liquid or mineral oil. Specifically, the circulation system may include a piping loop for transporting the coolant.

[0019] The heating element is immersed in the coolant. Through direct contact between the heating element and the coolant, the heat from the heating element is carried away by the flow of the coolant, achieving immersion liquid cooling.

[0020] In this embodiment, the heat-generating device includes: a rack server 102, a centralized power supply module 103, and a centralized power supply bus 104; the rack server 102 is connected to the centralized power supply module 103 through the centralized power supply bus 104.

[0021] There can be one or more rack servers, and multiple rack servers can be connected to a unified centralized power supply module through a unified centralized power supply bus.

[0022] The standard server is a 19-inch server, and the rack server is a 21-inch server.

[0023] In related technologies, racks based on standard server architecture cannot be compatible with full rack servers due to the small size of standard servers.

[0024] In this embodiment, the server is a rack-mount server. Since the size of a rack-mount server is larger than that of a standard server, it is compatible with standard servers.

[0025] Specifically, the rack in this embodiment can provide multiple server storage spaces, each of which can accommodate one rack-mount server. Since the size of a rack-mount server is larger than that of a standard server, each server storage space can also accommodate one standard server, thus making it compatible with both rack-mount servers and standard servers.

[0026] From a power supply perspective, server racks can be divided into centralized power supply and distributed power supply. Centralized power supply refers to pooling all power supplies in one place, while distributed power supply refers to distributing power supplies in multiple locations.

[0027] A power supply that is centralized in one place can be called a centralized power supply module, which can be a centralized power supply power shelf. In contrast, a distributed power supply module can be a power distribution unit (PDU).

[0028] In related technologies, in the architecture based on standard servers, a distributed power supply module (PDU) is usually used. The distributed power supply module is usually a socket, and the standard server is plugged into the power port of the PDU via a power cord.

[0029] However, it is not very convenient to use because it requires a power cord to be connected to the power port of the PDU.

[0030] In this embodiment, a centralized power supply module is used, and the rack server is connected to the centralized power supply module through a centralized power supply bus.

[0031] A centralized power supply busbar refers to a busbar with electrical conductivity, such as a copper busbar.

[0032] The rack servers are powered by a centralized power supply bus, eliminating the need for power cords and making them more convenient to use.

[0033] In this embodiment, a liquid-cooled rack is implemented based on rack-mount servers. Since the storage space of a rack-mount server is larger than that of a standard server, it can be compatible with both rack-mount servers and standard servers, making it more comprehensive and flexible in its application. Using a centralized power supply module and a centralized power supply bus to power the rack-mount server avoids the problems of complex cable deployment associated with power cords. Therefore, the performance of the liquid-cooled rack can be improved.

[0034] Figure 2 This is a schematic diagram based on a second embodiment of the present disclosure, which provides a liquid-cooled cabinet. For example... Figure 2 As shown, the liquid-cooled tank includes: a tank body 201, which is sealed during use. The tank body 201 is equipped with a liquid inlet 202 and a liquid return outlet 203. Coolant flows into the internal circulation system of the tank through the liquid inlet, and after heat exchange, the coolant flows out of the tank through the liquid return outlet. Valves are installed inside the liquid inlet 202 and the liquid return outlet 203, and the flow of coolant into or out of the tank can be controlled by opening and closing these valves.

[0035] In this embodiment, by installing valves inside the liquid inlet and return outlet, control of a single tank can be achieved.

[0036] like Figure 2 As shown, the cabinet 201 contains a circulation system (not shown) and a heating element.

[0037] The circulation system is used to transfer coolant, and the heating element is immersed in the coolant.

[0038] The heat-generating components include: a rack server 207, a centralized power supply module 204, and a centralized power supply bus. The rack server 207 is connected to the centralized power supply module 204 via the centralized power supply bus.

[0039] The rack server is provided with a first terminal block; the centralized power supply module is provided with a second terminal block; the first terminal block is interconnected with the centralized power supply bus, and the second terminal block is interconnected with the centralized power supply bus.

[0040] In this embodiment, the server rack is interconnected with the centralized power supply bus via a terminal block, eliminating the need for cable connections and providing convenient centralized power supply for the entire rack server.

[0041] Specifically, the centralized power supply bus is the centralized power supply copper bus 205.

[0042] The terminal blocks are conductive clips. For distinction, the conductive clips on the rack server can be referred to as the first conductive clips, and the conductive clips on the centralized power supply module can be referred to as the second conductive clips. Both the first and second conductive clips hold the centralized power supply copper busbar.

[0043] In this embodiment, centralized power supply can be achieved by using a centralized power supply copper busbar and conductive clamps, utilizing existing resources.

[0044] In some embodiments, the heat-generating component further includes a standard server 208 and a distributed power supply module 206; the standard server 208 is connected to the distributed power supply module 206 via a power cord. The distributed power supply module 206 can be distributed in multiple locations. Figure 2 (Two locations are shown in the image), the distributed power supply module can be a PDU. The standard server 208 is 19 inches in size, and the rack server is 21 inches in size, therefore, it is compatible with the standard server 208.

[0045] In this embodiment, the heat-generating component may also include a standard server, thereby achieving compatibility with standard servers.

[0046] In some embodiments, the heat-generating device further includes: a switch 209; the switch 209 is connected to the centralized power supply module via the centralized power supply bus; or, the switch 209 is connected to the distributed power supply module via a power line.

[0047] For switches, centralized power supply or distributed power supply can be used to achieve a more flexible power supply solution.

[0048] In some embodiments, the location of the first terminal block on the rack server is the same as the location of the terminal block on the air-cooled server.

[0049] Taking a conductive clip as an example, such as... Figure 3 As shown, the rack-mount air-cooled server includes a conductive clip 301 and an air-cooling heat dissipation module 302, while the rack-mount liquid-cooled server includes a conductive clip 303 and a liquid-cooling heat dissipation module 304. The air-cooling heat dissipation module 302 can specifically be a fan module, and the heat dissipation module 304 can specifically be a filling module.

[0050] refer to Figure 3 The conductive clip 301 on the air-cooled server and the conductive clip 303 on the liquid-cooled server are positioned at the rear of the server.

[0051] In a standard server, the conductive parts are usually located at the front, which is different from the location of the conductive parts in an air-cooled server.

[0052] In this embodiment, the server form factor and materials can remain consistent for both air-cooled and liquid-cooled scenarios. The only difference is that the corresponding modules are replaced in different usage scenarios. For example, in an air-cooled scenario, the server can be configured with a fan module, while in an immersion liquid-cooled environment, the fan module is replaced with a filling module.

[0053] Standard server designs cannot maintain consistency between air cooling and liquid cooling. In other words, a standard server on the same platform has two design schemes: one for air cooling and one for immersion liquid cooling. However, immersion liquid-cooled servers based on rack architecture can unify air cooling and liquid cooling forms into one, share materials, and flexibly switch configurations according to different server usage scenarios.

[0054] In some embodiments, the liquid-cooled cabinet further includes: sensors and a rack monitor and management unit (RMMU) disposed inside the cabinet; the RMMU is used to monitor and manage the liquid-cooled cabinet based on the sensing data collected by the sensors.

[0055] like Figure 4 As shown, the sensors may include: a temperature sensor 401, a flow sensor 402, a leakage sensor 403, and a liquid level sensor 404.

[0056] Combination Figure 2 The cabinet may also include an RMMU210, which can acquire sensor data such as temperature, flow rate, leakage, and liquid level, and perform monitoring and management based on the sensor data.

[0057] In this embodiment, real-time monitoring and alarms can be achieved through the RMMU.

[0058] Figure 5 This is a schematic diagram based on a third embodiment of the present disclosure, which provides a liquid cooling system.

[0059] like Figure 5 As shown, the liquid cooling system 500 includes a liquid-cooled cabinet 501 and a cooling dispensing unit (CDU) 502, which is used to control the liquid-cooled cabinet 501.

[0060] The CDU and the liquid-cooled cabinet are connected via a circulation pipe. The CDU delivers coolant to the liquid-cooled cabinet through this pipe; the coolant interacts with the heat-generating components, cooling them and raising its temperature; the heated coolant then flows back to the CDU through the pipe between the CDU and the cabinet, where it is cooled by refrigeration equipment and can be returned to the cabinet, forming a closed-loop liquid cooling system.

[0061] In this embodiment, the liquid-cooled cabinet is controlled by the CDU, which can form a closed-loop liquid cooling system.

[0062] Figure 6 This is a schematic diagram based on the fourth embodiment of the present disclosure, which provides a liquid cooling system.

[0063] like Figure 6 As shown, the liquid cooling system 600 includes: a liquid-cooled cabinet 601, a CDU 602, and a refrigeration device 603. There are multiple liquid-cooled cabinets 601 (represented by cabinet-1 to cabinet-3), and one CDU. One CDU is used to uniformly control multiple liquid-cooled cabinets.

[0064] In related technologies, CDUs and cabinets are usually deployed in a 1:1 ratio. However, in this embodiment, one CDU can control multiple cabinets, which can effectively reduce the deployment cost of CDUs.

[0065] In addition, since valves are installed in the liquid inlet and outlet of the liquid-cooled cabinet, flow control and maintenance of a single cabinet can be achieved through the valves.

[0066] It is understood that the same or similar content in different embodiments of this disclosure can be referred to each other.

[0067] It is understood that the terms "first" and "second" in the embodiments of this disclosure are only used for distinction and do not indicate the degree of importance or the order of events.

[0068] It should be understood that the various forms of processes shown above can be used to rearrange, add, or delete steps. For example, the steps described in this disclosure can be executed in parallel, sequentially, or in different orders, as long as the desired result of the technical solution disclosed in this disclosure can be achieved, and this is not limited herein.

[0069] The specific embodiments described above do not constitute a limitation on the scope of protection of this disclosure. Those skilled in the art should understand that various modifications, combinations, sub-combinations, and substitutions can be made according to design requirements and other factors. Any modifications, equivalent substitutions, and improvements made within the spirit and principles of this disclosure should be included within the scope of protection of this disclosure.

Claims

1. A liquid-cooled server rack, comprising: Cabinet; A circulation system and heating element are installed inside the cabinet. The circulation system is used to transfer coolant; The heating element is immersed in the coolant; The heat-generating components include: a rack-mount server, a centralized power supply module, and a centralized power supply bus; The rack server is connected to the centralized power supply module via the centralized power supply bus; The heat-generating device further includes: a standard server and a distributed power supply module; the standard server is connected to the distributed power supply module via a power cord. The rack server and the standard server are placed in the server storage space, and each server storage space can accommodate one rack server. The size of the rack server is larger than the size of the standard server. The rack server is provided with a first terminal block, which is interconnected with the centralized power supply bus. The location of the first terminal block on the rack server is the same as the location of the terminal block on the air-cooled server, which is obtained by replacing the fan module on the air-cooled server with a filling module. The liquid-cooled cabinet also includes: The inlet and outlet are provided on the cabinet; and The valves installed in the inlet and outlet are used for single-cabinet control. The liquid-cooled cabinet is controlled by a CDU, and one CDU is used to uniformly control multiple liquid-cooled cabinets. The heating device also includes: a switch; The liquid-cooled cabinet also includes sensors and an RMMU disposed inside the cabinet. The RMMU is used to monitor and manage the liquid-cooled cabinet based on the sensing data collected by the sensors. The sensors include a temperature sensor, a flow sensor, a leakage sensor, and a liquid level sensor.

2. The cabinet according to claim 1, wherein, The centralized power supply module is equipped with a second terminal block; The second terminal is interconnected with the centralized power supply bus.

3. The cabinet according to claim 2, wherein, The centralized power supply bus is a centralized power supply copper bus; The first terminal is a first conductive clip, the second terminal is a second conductive clip, and both the first conductive clip and the second conductive clip hold the centralized power supply copper busbar.

4. The cabinet according to claim 1, wherein, The switch is connected to the centralized power supply module via the centralized power supply bus; or... The switch is connected to the distributed power supply module via a power cord.

5. A liquid cooling system, comprising: Liquid-cooled cabinet as described in any one of claims 1-4; as well as, A cooling capacity distribution unit (CDU) controls the liquid-cooled cabinet, and there is one CDU; there are multiple liquid-cooled cabinets; the one CDU is used to uniformly control the multiple liquid-cooled cabinets.

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