Flexible display module and electronic device

Abstract

Embodiments of the present application provide a flexible display module and an electronic device. The flexible display module comprises at least a back plate, a flexible display component, a driving chip and a flexible circuit board. The back plate comprises a first surface, a second surface and a second recess. The first surface and the second surface are oppositely arranged along the thickness direction of the back plate. The second recess is recessed from the second surface to the first surface. The flexible display component comprises a display part, a bending part and a binding part. The bending part connects the display part and the binding part. The display part is located on one side of the first surface. The binding part is located on one side of the second surface. The driving chip is arranged on the binding part. The flexible circuit board is located on the side of the driving chip away from the bending part. The flexible circuit board is connected with the binding part. Along the thickness direction, the orthographic projection of at least part of the flexible circuit board overlaps with the orthographic projection of the second recess. The flexible display module of the present application can reduce the thickness of the flexible display module.

Description

[0001] This application is a divisional application based on the invention with application number 202111246620.X, application date October 26, 2021, applicant Honor Terminal Co., Ltd., and invention title "Flexible Display Module and Electronic Device". Technical Field

[0002] This application relates to the field of terminal technology, and in particular to a flexible display module and an electronic device. Background Technology

[0003] Organic Light Emitting Display (OLED) modules possess advantages such as self-illumination, low driving voltage, high luminous efficiency, and high clarity and contrast. OLED display modules enable flexible displays and large-area full-color displays. OLED display modules are flexible display modules. Full-screen or foldable screens typically use OLED display modules. Flexible display modules are bendable and portable, and their applications are becoming increasingly widespread. An OLED display module includes a display unit and a driver IC. The driver IC transmits driving signals to the display unit to display the corresponding image. To reduce the bezel of the display module and achieve full-screen display, the driver IC and its mounting portion are typically bent to the back of the display unit. A flexible circuit board is connected to the mounting portion. However, the flexible circuit board occupies space in the thickness direction, increasing the thickness of the display module and hindering the design of a thinner and lighter display module. Summary of the Invention

[0004] This application provides a flexible display module and an electronic device, which can reduce the thickness of the flexible display module and facilitate the thinner and lighter design of the flexible display module.

[0005] The first aspect of this application provides a flexible display module for use in electronic devices. The flexible display module includes a backplane, a flexible display component, a driver chip, and a flexible circuit board.

[0006] The backplate includes a first surface, a second surface, and a second recess. The first surface and the second surface are disposed opposite each other along the thickness direction of the backplate. The second recess is recessed from the second surface toward the first surface. The flexible display component includes a display portion, a bending portion, and a bonding portion. The bending portion connects the display portion and the bonding portion. The display portion is located on one side of the first surface. The bonding portion is located on one side of the second surface. A driver chip is disposed on the bonding portion. A flexible circuit board is located on the side of the driver chip facing away from the bending portion. The flexible circuit board is connected to the bonding portion. Along the thickness direction, at least a portion of the orthographic projection of the flexible circuit board overlaps with the orthographic projection of the second recess.

[0007] In the flexible display module of this application embodiment, the flexible circuit board, back plate, and display unit are stacked along the thickness direction of the back plate. A second recess is provided on the back plate. At least a portion of the orthographic projection of the flexible circuit board overlaps with the orthographic projection of the second recess, thereby reducing the thickness of the area on the back plate where the second recess is provided. This helps to reduce the space occupied by the back plate and the flexible circuit board in the thickness direction, and thus effectively reduces the thickness of the area corresponding to the flexible circuit board on the flexible display module, which is beneficial to achieving a thinner and lighter design for the flexible display module.

[0008] In one possible implementation, the second recess includes a second bottom wall and a second side wall. The flexible circuit board is connected to the second bottom wall.

[0009] In one possible implementation, the flexible circuit board is bonded to the second bottom wall.

[0010] In one possible implementation, the flexible circuit board is bonded to the second bottom wall by an adhesive layer, at least a portion of which is located within the second recess.

[0011] In one possible implementation, at least a portion of the flexible circuit board is located within the second recess.

[0012] In one possible implementation, the flexible display module further includes a shielding component. The shielding component is disposed on the side of the bonding portion facing away from the display portion. The shielding component covers at least a portion of the flexible circuit board.

[0013] In one possible implementation, the flexible display module further includes a support assembly. The support assembly is disposed on the side of the bonding portion facing the backplate. The support assembly includes a receiving space. At least a portion of the bonding portion is located within the receiving space. The bonding portion is connected to the base. Along the thickness direction, the driving chip is correspondingly disposed with respect to the receiving space.

[0014] In one possible implementation, the support assembly includes a first support member and a connector. The connector connects the first support member and the back plate. The first support member includes a base and a protrusion. The protrusion is located on the side of the base facing away from the first surface. The base and the protrusion form the receiving space, and the binding portion is connected to the base.

[0015] In one possible implementation, the protrusion is disposed in a region of the base away from the bend. The protrusion is located on the side of the driver chip opposite to the bend.

[0016] In one possible implementation, the protrusion is disposed on the base near the bent portion. The protrusion is located on the side of the driver chip facing the bent portion.

[0017] In one possible implementation, the length of the drive chip along the axial direction of the bend is less than or equal to the length of the protrusion.

[0018] In one possible implementation, along the thickness direction, the surface of the driving chip facing away from the backplate is higher than the surface of the protrusion facing away from the backplate.

[0019] In one possible implementation, the flexible display component is a flexible screen. Alternatively, the flexible display component includes a connected flexible screen and a flexible adapter circuit board. The adapter circuit board is located at the bonding portion. The driver chip is disposed on the adapter circuit board. The flexible circuit board is connected to the adapter circuit board.

[0020] In one possible implementation, both the first surface and the second surface are planar.

[0021] In one possible implementation, the back panel includes a first support portion, a middle support portion, and a second support portion. A second recessed portion is disposed on the first support portion. The back panel has a folded state and an unfolded state. The back panel is used to fold or unfold the display unit. In the folded state, the first support portion, the middle support portion, and the second support portion are flush with each other. In the unfolded state, both the first support portion and the second support portion are bent relative to the middle support portion.

[0022] A second aspect of this application provides an electronic device that includes at least the flexible display module described above. Attached Figure Description

[0023] Figure 1 This is a schematic diagram of the unfolded state of an electronic device;

[0024] Figure 2 for Figure 1The diagram shows the electronic device in a semi-folded state.

[0025] Figure 3 for Figure 1 A schematic diagram of an electronic device in a folded state;

[0026] Figure 4 for Figure 1 A partial exploded view of the electronic device;

[0027] Figure 5 This is a partial structural diagram of the back of a flexible display module in related technologies;

[0028] Figure 6 for Figure 5 A schematic diagram of the cross-sectional structure along the AA direction;

[0029] Figure 7 This is a partial structural diagram of the back of a flexible display module according to an embodiment of this application;

[0030] Figure 8 for Figure 7 A schematic diagram of the cross-sectional structure along the BB direction;

[0031] Figure 9 for Figure 8 Enlarged view of point C in the middle;

[0032] Figure 10 A schematic diagram of the back structure of a backplate provided in an embodiment of this application;

[0033] Figure 11 This is a partial structural diagram of the back of a flexible display module according to an embodiment of this application;

[0034] Figure 12 for Figure 11 A schematic diagram of the cross-sectional structure along the DD direction;

[0035] Figure 13 for Figure 12 Enlarged view of point E in the middle;

[0036] Figure 14 This is a partial cross-sectional view of a flexible display module provided in an embodiment of this application;

[0037] Figure 15 This is a partial cross-sectional view of a flexible display module provided in another embodiment of this application;

[0038] Figure 16 This is a partial cross-sectional view of a flexible display module provided in another embodiment of this application;

[0039] Figure 17This is a partial cross-sectional view of a flexible display module provided in another embodiment of this application;

[0040] Figure 18 This is a partial cross-sectional view of a flexible display module provided in another embodiment of this application;

[0041] Figure 19 This is a partial cross-sectional view of a flexible display module provided in another embodiment of this application;

[0042] Figure 20 This is a partial cross-sectional view of a flexible display module provided in another embodiment of this application.

[0043] Marker explanation:

[0044] 10. Electronic device; 11. First housing; 12. Second housing; 13. Hinge;

[0045] 20. Flexible display module; 201. First display area; 202. Second display area; 203. Third display area;

[0046] 30. Driver chip;

[0047] 40. Support structure;

[0048] 50. Back panel; 501. First surface; 502. Second surface; 503. First recess; 5031. First bottom wall; 5032. First side wall; 5032a. First wall surface; 5032b. Second wall surface; 5032c. Third wall surface; 5032d. Fourth wall surface; 5032e. Fifth wall surface; 504. Side surface; 505. Second recess; 5051. Second bottom wall; 5052. Second side wall; 51. First support portion; 52. Second support portion; 53. Intermediate support portion; 531. Gap;

[0049] 60. Flexible display component; 601. Display section; 602. Bending section; 603. Bonding section; 61. Flexible screen; 62. Adapter circuit board;

[0050] 70. Support assembly; 71. First support member; 71a. Accommodating space; 711. Base; 712. Protrusion; 72. Connector;

[0051] 80. Second support component;

[0052] 90. Flexible circuit board;

[0053] 100. Shielding components;

[0054] 200. Adhesive layer;

[0055] X, thickness direction;

[0056] Y, axial direction. Detailed Implementation

[0057] The electronic devices in this application embodiment can be referred to as user equipment (UE) or terminals, etc. For example, electronic devices can be portable Android devices (PADs), personal digital assistants (PDAs), handheld devices with wireless communication capabilities, computing devices, in-vehicle devices, wearable devices, virtual reality (VR) terminal devices, augmented reality (AR) terminal devices, wireless terminals in industrial control, wireless terminals in self-driving, wireless terminals in remote medical care, wireless terminals in smart grids, wireless terminals in transportation safety, wireless terminals in smart cities, wireless terminals in smart homes, and other mobile or fixed terminals. This application embodiment does not specifically limit the form of the terminal device.

[0058] In the embodiments of this application, Figure 1 The structure of an electronic device is illustrated schematically. See also Figure 1 As shown, the example described is a handheld device with wireless communication capabilities, specifically electronic device 10. A handheld device with wireless communication capabilities can be, for example, a mobile phone. For instance, a mobile phone can be a foldable phone that includes a flexible display module.

[0059] Figure 2 The structure of the electronic device 10 in a semi-folded state is schematically shown. Figure 3 The diagram schematically illustrates the structure of the electronic device in its folded state. See also... Figure 2 and Figure 3As shown, the electronic device 10 includes a first housing 11, a second housing 12, and a hinge 13. The first housing 11 and the second housing 12 are located on opposite sides of the hinge 13. The first housing 11 and the second housing 12 are connected to the hinge 13. For example, the first housing 11 and the second housing 12 can be connected to the hinge 13 by welding or fasteners. The first housing 11 and the second housing 12 can rotate and fold relative to the hinge 13. When the first housing 11 and the second housing 12 are close to each other and stacked on top of each other, the electronic device 10 is in a folded state. When the first housing 11 and the second housing 12 move away from each other from the stacked state and rotate until they can no longer rotate, the electronic device 10 is in an unfolded state. The process of the first housing 11 and the second housing 12 moving from the folded state to the unfolded state is the unfolding process, and the process of moving from the unfolded state to the folded state is the folding process. Exemplarily, the number of the first housing 11 and the second housing 12 can both be one. When the electronic device 10 is in the folded state, the first housing 11 and the second housing 12 are stacked to form a two-layer structure.

[0060] Figure 4 A partial exploded view of an electronic device 10 according to one embodiment is schematically shown. See also Figure 4 As shown, the electronic device 10 also includes a flexible display module 20. The flexible display module 20 has a display area for displaying image information. The flexible display module 20 can be disposed on the first housing 11, the hinge 13, and the second housing 12, and the display area of ​​the flexible display module 20 is exposed to facilitate the presentation of image information to the user. The flexible display module 20 includes a first display area 201, a second display area 202, and a third display area 203. The first display area 201 is disposed corresponding to the first housing 11. The second display area 202 is disposed corresponding to the second housing 12. The third display area 203 is disposed corresponding to the hinge 13. The flexible display module 20 itself has bendable properties and can deform under external force. When the first housing 11 and the second housing 12 are in a folded state, the flexible display module 20 is in a bent state. The first display area 201 and the third display area 203 of the flexible display module 20 are close to each other, and the third display area 203 can be bent into an arc shape. When the first housing 11 and the second housing 12 are in the unfolded state, the flexible display module 20 is in the unfolded state, while the first display area 201, the second display area 202 and the third display area 203 are in a flat state.

[0061] The electronic device 10 can change its overall size by folding or unfolding, and can also have a large display area when unfolded.

[0062] Figure 5 A partial structure of the back side of a flexible display module 20 according to one embodiment is schematically shown. See also Figure 5 and Figure 6 As shown, the flexible display module 20 includes a driver chip 30. The driver chip 30 is used to transmit driving signals to the flexible display module 20 so that the display area of ​​the flexible display module 20 displays the corresponding image. The driver chip 30 can be formed by wafer slicing. It should be noted that a wafer refers to a silicon wafer used to make silicon semiconductor circuits. The main material of the driver chip 30 is silicon, which makes the driver chip 30 itself relatively low in rigidity, brittle, and with weak resistance to deformation. Therefore, the driver chip 30 is prone to breakage and damage when subjected to external forces. The driver chip 30 is usually placed on the back of the flexible display module 20, which can reduce the area of ​​the black border at the edge of the flexible display module 20, which is beneficial to increasing the display area and realizing the full-screen display effect of the flexible display module 20.

[0063] The flexible display module 20 has touch functionality. Users can execute corresponding operation commands by touching the display area of ​​the flexible display module 20. Because the flexible display module 20 is relatively soft, the display area will deform and indent when the user's hand applies large compressive stress to it. If the user's hand applies large pressure to the display area above the driver chip 30, the indented display area will squeeze the driver chip 30. When the driver chip 30 is subjected to large compressive forces, there is a risk that the driver chip 30 may crack or be damaged.

[0064] The flexible display module 20 includes a support body 40. The support body 40 is disposed between the driver chip 30 and the display area. The support body 40 is a rigid structural component, thus possessing high rigidity and resistance to deformation. For example, the support body 40 can be an aluminum alloy with a thickness of 0.2 mm. The elastic modulus of the aluminum alloy can be 70 GPa. The support body 40 can protect the driver chip 30. When the display area is recessed, the support body 40 can apply a reaction force to the display area to effectively buffer external forces. Alternatively, the support body 40 can move downwards as a whole, thereby causing the driver chip 30 to move downwards as a whole, making it less prone to stress concentration and cracking damage on the driver chip 30. The support body 40 can effectively reduce the external forces acting on the driver chip 30 and ensure uniform stress distribution, effectively reducing the possibility of cracking damage to the driver chip 30. However, the area corresponding to the driver chip 30 is usually the area with the greatest thickness of the flexible display module 20. Therefore, setting the support body 40 will increase the thickness of this area, resulting in an increase in the overall thickness of the flexible display module 20, which affects the thin and light design of the flexible display module 20.

[0065] The flexible display module 20 provided in this application embodiment can reduce the possibility of the driver chip 30 breaking and being damaged, and at the same time can reduce the overall thickness of the flexible display module 20, which is beneficial to the thinner and lighter design of the flexible display module 20.

[0066] The implementation of the flexible display module 20 provided in the embodiments of this application will be described below.

[0067] Figure 7 A partial structure of the back side of a flexible display module 20 according to one embodiment is schematically shown. See also Figures 7 to 9 As shown, the flexible display module 20 of this embodiment includes a backplate 50, a flexible display component 60, a driving chip 30, and a support assembly 70. The backplate 50 includes a first surface 501, a second surface 502, and a first recess 503. The first surface 501 and the second surface 502 are disposed opposite each other along the thickness direction X of the backplate 50. The first recess 503 is recessed from the second surface 502 toward the first surface 501. The flexible display component 60 includes a display portion 601, a bending portion 602, and a bonding portion 603. The bending portion 602 connects the display portion 601 and the bonding portion 603. The display portion 601 is used to display image information. A portion of the flexible display component 60 extending beyond the display portion 601 folds toward the second surface 502 of the backplate 50. The portion of the flexible display component 60 extending beyond the display portion 601 forms the bending portion 602 and the bonding portion 603. The flexible display component 60 itself is easily deformed by external forces. The display portion 601 of the flexible display component 60 is located on one side of the first surface 501 of the back plate 50. The back plate 50 provides good support for the display portion 601, thereby ensuring that the display portion 601 has good flatness and is not prone to denting deformation when subjected to external forces, reducing the amount of denting deformation of the display portion 601. The bonding portion 603 is located on one side of the second surface 502. The driving chip 30 is disposed on the side of the bonding portion 603 facing away from the display portion 601, thereby the driving chip 30 is located on the back side of the flexible display module 20. The driving chip 30 is used to transmit driving signals to the flexible display component 60 so that the display portion 601 displays corresponding image information. The support component 70 is disposed on the side of the bonding portion 603 facing the back plate 50. At least a portion of the support component 70 is accommodated in the first recess 503. A portion of the support component 70 may be accommodated in the first recess 503, and another portion may be located outside the first recess 503. Alternatively, the entire support component 70 may be accommodated in the first recess 503. Along the thickness direction X of the backplate 50, the driving chip 30, the support component 70 and the first recess 503 are respectively arranged.

[0068] In this embodiment, the driver chip 30, support assembly 70, backplate 50, and display unit 601 are stacked along the thickness direction X of the backplate 50. The support assembly 70 is disposed between the driver chip 30 and the display unit 601. The support assembly 70 can protect the driver chip 30. When the display unit 601 is pressed and a depression occurs in the pressed area, the depressed portion of the display unit 601 will press against the backplate 50, and then the backplate 50 will transmit the external force to the support assembly 70. The support assembly 70 can apply a reaction force to the display unit 601 to effectively buffer the external force, or the support assembly 70 can be moved downward as a whole, thereby driving the driver chip 30 to move downward as a whole. Therefore, stress concentration and local bending deformation are less likely to occur on the driver chip 30. The support assembly 70 can reduce the external force on the driver chip 30 as a whole and make the driver chip 30 be subjected to uniform force, thereby effectively reducing the possibility of the driver chip 30 breaking and being damaged. The backplate 50 has a first recess 503, and the driver chip 30, the support component 70, and the first recess 503 are correspondingly arranged. At least a portion of the support component 70 is accommodated within the first recess 503, which reduces the space occupied by the support component 70 in the thickness direction X. Therefore, the thickness of the area corresponding to the flexible display module 20 and the driver chip 30 can be reduced, which is beneficial to realizing the thinner and lighter design of the flexible display module 20.

[0069] In some feasible implementations, the backplate 50 is a rigid structural component. The material of the backplate 50 can be copper, copper alloy, steel, titanium, or titanium alloy. For example, the material of the backplate 50 can be titanium or a titanium alloy. The backplate 50 has a relatively small thickness, allowing it to bend and deform, so that when the flexible display module 20 is applied to the foldable electronic device 10, the backplate 50 can be folded or unfolded synchronously with the flexible display module 20. The backplate 50 itself has high rigidity, so that when an external force is applied along the thickness direction X of the backplate 50, the first surface 501 of the backplate 50 is less prone to indentation or deformation.

[0070] See in some examples Figure 7As shown, the back plate 50 includes a first support portion 51, a second support portion 52, and a middle support portion 53. The display portion 601 of the flexible display module 20 can cover the first support portion 51, the second support portion 52, and the middle support portion 53. A first recessed portion 503 is provided on the first support portion 51. The back plate 50 has a folded state and an unfolded state. The back plate 50 is used to drive the display portion 601 of the flexible display module 20 to fold or unfold. In the folded state, the first support portion 51, the second support portion 52, and the middle support portion 53 are flush with each other. In the unfolded state, the first support portion 51 and the second support portion 52 are both bent relative to the middle support portion 53. For example, a plurality of gaps 531 are provided on the middle support portion 53 to reduce the rigidity of the middle support portion 53, so that the middle support portion 53 can be bent and deformed by a small force. The gaps 531 penetrate the first surface 501 and the second surface 502.

[0071] In some examples, both the first surface 501 and the second surface 502 of the backplate 50 are planar. When the flexible display module 20 is disposed on the first surface 501, the first surface 501 will not provide local support for the flexible display module 20, thus preventing localized stress concentration areas or localized bulges in the flexible display module 20. Exemplarily, the first surface 501 and the second surface 502 of the backplate 50 are parallel to each other.

[0072] Along the thickness direction X of the back plate 50, the vertical distance between the first bottom wall 5031 of the first recess 503 and the first surface 501 is less than the vertical distance between the second surface 502 and the first surface 501. In some examples, the first recess 503 can be formed by machining a predetermined area of ​​the back plate 50. For example, the machining method can be milling or cutting. Alternatively, the first recess 503 can be formed by etching a predetermined area of ​​the back plate 50.

[0073] See also some of the possible implementation methods. Figure 9As shown, along the thickness direction X of the backplate 50, the projected area of ​​the support assembly 70 is larger than that of the driver chip 30. The projected area of ​​the driver chip 30 is located within the projected area of ​​the support assembly 70. The support assembly 70 completely blocks the driver chip 30 on one side. When the display unit 601 is subjected to an external force and the force is transmitted to the support assembly 70 through the backplate 50, the support assembly 70 can move the driver chip 30 and the portion of the mounting part 603 surrounding the driver chip 30 downwards as a whole. This allows both the support assembly 70 and the portion of the mounting part 603 surrounding the driver chip 30 to buffer the external force, further reducing the possibility of the driver chip 30 breaking or being damaged by the external force. In some examples, the support assembly 70 includes a first support member 71 and a connector 72. The first support member 71 is a rigid structural member, thus possessing high rigidity and resistance to deformation. The connector 72 connects the first support member 71 and the first bottom wall 5031 of the first recess 503. Along the thickness direction X of the backplate 50, the projected area of ​​the first support member 71 is larger than the projected area of ​​the driver chip 30. The projected area of ​​the driver chip 30 is located within the projected area of ​​the first support member 71. The first support member 71 completely blocks the driver chip 30 on one side.

[0074] In some feasible ways, Figure 10 A partial structure of the back side of a backplate 50 according to one embodiment is schematically shown. See also Figure 9 and Figure 10As shown, the backplate 50 is located inside the bend 602, so that when viewed from the outside of the bend 602, the backplate 50 is obscured by the bend 602. The backplate 50 has a side surface 504 facing the bend 602. A first recess 503 extends along the thickness direction X and forms an opening on the second surface 502. Simultaneously, the first recess 503 penetrates the side surface 504 of the backplate 50 facing the bend 602, thus also forming an opening on that side surface 504. The wall of the first recess 503 facing the driver chip 30 is a first bottom wall 5031, and the wall intersecting with the first bottom wall 5031 is a first side wall 5032. In some examples, the support assembly 70 includes a first support member 71 and a connector 72. The connector 72 is disposed between the first support member 71 and the first bottom wall 5031 of the first recess 503. The connector 72 connects the first support member 71 and the first bottom wall 5031 of the first recess 503. Exemplarily, the connector 72 can be an adhesive, allowing the first support member 71 and the first bottom wall 5031 of the first recess 503 to be connected by adhesive. Similarly, the first support member 71 and the binding part 603 can also be connected by adhesive. This reduces the number of parts used, lowers assembly difficulty, and ensures the structural integrity of the first support member 71, the back plate 50, and the binding part 603. In some examples, along the axial direction Y of the bend 602, the back plate 50 has two opposing side surfaces 504, while the first recess 503 does not penetrate the two side surfaces 504 of the back plate 50. The axial direction Y of the bend 602 refers to the direction perpendicular to the bending direction of the bend 602. The axial direction Y of the bend 602 is perpendicular to the thickness direction X of the back plate 50.

[0075] In some possible implementations, the shape of the support component 70 matches the shape of the first recess 503, thereby facilitating accurate placement of the support component 70 within the first recess 503. In some examples, at least a portion of the first support member 71 is located within the first recess 503. The shape of the first support member 71 matches the shape of the first recess 503, thereby facilitating accurate placement of the first support member 71 within the first recess 503. The first sidewall 5032 of the first recess 503 can provide limiting constraints on the first support member 71 from different directions, reducing the possibility of positional displacement of the first support member 71 within the first recess 503, and facilitating the placement of the first support member 71 in a predetermined position and its connection with the first bottom wall 5031 of the first recess 503.

[0076] In some examples, the first recess 503 extends through the side surface 504 of the back plate 50 facing the bend 602. The first sidewall 5032 of the first recess 503 includes a first wall surface 5032a, a second wall surface 5032b, a third wall surface 5032c, a fourth wall surface 5032d, and a fifth wall surface 5032e, which are continuously disposed thereon. The third wall surface 5032c is located on the side of the first support member 71 facing away from the bend 602. The angle between the second wall surface 5032b and the third wall surface 5032c is equal to the angle between the fourth wall surface 5032d and the third wall surface 5032c. The angle between the first wall surface 5032a and the second wall surface 5032b is equal to the angle between the fifth wall surface 5032e and the fourth wall surface 5032d. The first support member 71 has five outer wall surfaces that correspond one-to-one with the first wall surface 5032a, the second wall surface 5032b, the third wall surface 5032c, the fourth wall surface 5032d, and the fifth wall surface 5032e.

[0077] In some feasible ways, Figure 11 A partial structure of the back side of a flexible display module 20 according to one embodiment is schematically shown. See also Figures 11 to 13 As shown, the first sidewall 5032 of the first recess 503 is spaced apart from the side surface 504 of the back plate 50 facing the bending portion 602. The first recess 503 does not penetrate the side surface 504 of the back plate 50 facing the bending portion 602. The size of the first support member 71 can be designed to be smaller, thereby reducing the weight of the first support member 71. Therefore, while reducing the overall thickness of the flexible display module 20, the weight of the flexible display module 20 can also be reduced. The size of the first recess 503 used to accommodate the first support member 71 is also designed to be smaller. When the size of the first recess 503 is designed to be smaller, the area occupied by the region on the back plate 50 whose thickness is reduced due to the formation of the first recess 503 is smaller, thereby helping to reduce the possibility of adverse effects on the overall rigidity of the back plate 50 due to the processing of the first recess 503, ensuring that the overall rigidity of the back plate 50 meets the requirements. In some examples, the first recess 503 does not penetrate the side surface 504 of the back plate 50 facing the bending portion 602. For example, the first recess 503 can be rectangular, and the first support 71 can also be rectangular. In some examples, the binding portion 603 and the area on the back plate 50 located between the first recess 503 and the side surface 504 are connected. Exemplarily, the binding portion 603 and the area on the back plate 50 located between the first recess 503 and the side surface 504 are connected by an adhesive method.

[0078] In some feasible ways, Figure 14 A partial cross-sectional view of a flexible display module 20 according to one embodiment is schematically shown. See also Figure 14As shown, the support assembly 70 includes a receiving space 71a. The first support member 71 also includes the receiving space 71a. The first support member 71 includes a base 711 and a protrusion 712. Along the thickness direction X, the protrusion 712 is located on the side of the base 711 facing away from the first surface 501. Since the protrusion 712 protrudes from the surface of the base 711, a receiving space 71a is formed between the base 711 and the protrusion 712. At least a portion of the binding portion 603 is located within the receiving space 71a. The binding portion 603 is connected to the base 711. Specifically, the binding portion 603 is connected to the surface of the base 711 facing the binding portion 603. For example, the binding portion 603 and the base 711 can be connected by adhesive bonding. Along the thickness direction X of the backplate 50, the driving chip 30 is correspondingly disposed with respect to the receiving space 71a. The first support member 71 can be a one-piece molded structure.

[0079] The thickness of the area on the first support member 71 corresponding to the protrusion 712 is greater than the thickness of other areas on the first support member 71. The first support member 71 forms a locally thickened structure at the location of the protrusion 712. This uneven thickness structure of the first support member 71 helps to improve its rigidity and further enhances its resistance to deformation. In some examples, along the thickness direction X of the backplate 50, the surface of the driving chip 30 facing away from the backplate 50 is higher than the surface of the protrusion 712 facing away from the backplate 50. This allows the first support member 71 to fully utilize the space to accommodate the protrusion 712, and the protrusion 712 improves the rigidity of the first support member 71 without affecting the overall thickness of the flexible display module 20. In some examples, the deformation resistance of the area on the first support member 71 corresponding to the protrusion 712 is higher than that of other areas on the first support member 71. Along the axial direction Y of the bend 602, the length of the drive chip 30 is less than or equal to the length of the protrusion 712, so that the protrusion 712 of the first support member 71 can be configured to correspond to the entire drive chip 30. When the area corresponding to the first support member 71 and the protrusion 712 is subjected to an external force, the deformation of the area corresponding to the first support member 71 and the protrusion 712 is small, thereby ensuring that the force transmitted to the drive chip 30 is small.

[0080] For example, the protrusion 712 is disposed in the region of the base 711 away from the bend 602. The protrusion 712 is located on the side of the driver chip 30 facing away from the bend 602. The wall surface of the protrusion 712 facing the receiving space 71a and the wall surface of the base 711 facing the receiving space 71a may be perpendicular to each other. A chamfer structure is provided at the corner of the top of the protrusion 712 away from the receiving space 71a, for example, it may be a rounded corner structure, to reduce the possibility of stress concentration areas appearing on adjacent structural members due to pressure at the corner.

[0081] For example, Figure 15A partial cross-sectional view of a flexible display module 20 according to one embodiment is schematically shown. See also Figure 15 As shown, the protrusion 712 is disposed in the region of the base 711 near the bending portion 602. The protrusion 712 is located on the side of the driver chip 30 facing the bending portion 602. The wall surface of the protrusion 712 facing the receiving space 71a is a slope. The included angle between the wall surface of the protrusion 712 facing the receiving space 71a and the wall surface of the base 711 facing the receiving space 71a can be an obtuse angle. A chamfer structure is provided at the corner of the top of the protrusion 712 near the receiving space 71a, for example, it can be a rounded corner structure, to reduce the possibility of stress concentration areas appearing on the bonding portion 603 due to pressure at the corner.

[0082] In some feasible implementations, the elastic modulus of the material of the first support member 71 is greater than 70 GPa. Because the thickness of the area on the backplate 50 where the first recess 503 is located is reduced, the stiffness of the area corresponding to the first recess 503 on the backplate 50 is reduced. Therefore, when the backplate 50 is subjected to the same external force, the area corresponding to the first recess 503 is more prone to depression and deformation compared to other thicker areas. Using a material with a high elastic modulus for the first support member 71 improves its resistance to deformation without increasing its thickness, thus providing stable support to the thinner area of ​​the backplate 50 and reducing the likelihood of depression and deformation in the area corresponding to the first recess 503. Simultaneously, when the first support member 71 is subjected to the same external force, its deformation is smaller, resulting in a smaller force transmitted to the drive chip 30.

[0083] In some examples, the elastic modulus of the material of the first support member 71 is greater than or equal to 105 GPa. The material of the first support member 71 is selected from silicon carbide, diamond, alumina, tungsten carbide, aluminum nitride, stainless steel, and tungsten steel.

[0084] In some feasible ways, Figure 16 A partial cross-sectional view of a flexible display module 20 according to one embodiment is schematically shown. See also Figure 16 As shown, the flexible display module 20 also includes a second support member 80. The second support member 80 is disposed on the side of the bonding portion 603 facing away from the display portion 601. In some examples, the second support member 80 and the bonding portion 603 are connected by adhesive bonding. The second support member 80 is a rigid structural component with good resistance to deformation. The second support member 80 is spaced apart from the driver chip 30. The second support member 80 can further improve the overall rigidity of the bonding portion 603, reducing the possibility of deformation of the bonding portion 603 and the transmission of force to the driver chip 30, which could lead to breakage or damage to the driver chip 30.

[0085] When the display portion 601 of the flexible display module 20 is subjected to a compressive force, the compressive force is transmitted to the back plate 50, the first support member 71, the bonding portion 603, and the second support member 80. Under the action of the compressive force, the areas of the first support member 71, the second support member 80, and the bonding portion 603 corresponding to the driving chip 30 can effectively buffer the compressive force or can move downward as a whole, thereby making the bonding portion 603 less prone to deformation and the compressive force less likely to be transmitted to the driving chip 30 through the bonding portion 603. This ensures that the driving chip 30 itself does not deform or the amount of deformation is small, thereby effectively reducing the possibility of the driving chip 30 breaking or being damaged due to a large external force. In some examples, the second support member 80 is located on the side of the driving chip 30 facing the bending portion 602. In some examples, the material of the second support member 80 is selected from any one of aluminum, aluminum alloy, silicon carbide, diamond, alumina, tungsten carbide, aluminum nitride, stainless steel, and tungsten steel.

[0086] Along the thickness direction X of the backplate 50, the thickness of the second support member 80 is less than the thickness of the driver chip 30. The surface of the driver chip 30 facing away from the backplate 50 is higher than the surface of the second support member 80 facing away from the backplate 50, thereby making full use of the space to set the second support member 80. Furthermore, the second support member 80, while increasing the rigidity of the bonding part 603, does not affect the overall thickness of the flexible display module 20.

[0087] Along the axial direction Y of the bending portion 602, the length of the drive chip 30 is less than or equal to the length of the second support member 80, so that the second support member 80 can be set to correspond to the entire drive chip 30. When the second support member 80 is subjected to an external force, the second support member 80 can drive the area on the binding portion 603 corresponding to the drive chip 30 to move downward, thereby reducing the force transmitted to the drive chip 30.

[0088] In some feasible implementations, the projected area of ​​the support component 70 is larger than the projected area of ​​the second support member 80 along the thickness direction X of the back plate 50. In one example, the projected area of ​​the first support member 71 is larger than the projected area of ​​the second support member 80 along the thickness direction X of the back plate 50. The smaller size of the second support member 80 helps to ensure the lightweight of the flexible display module 20 and reduces the space occupancy of the second support member 80. In some examples, the lengths of the first support member 71 and the second support member 80 are equal along the axial direction Y of the bend 602. The two opposite edges of the second support member 80 are aligned with the two opposite edges of the first support member 71.

[0089] In some feasible ways, Figure 17 A partial cross-sectional view of a flexible display module 20 according to one embodiment is schematically shown. See also Figure 17As shown, the backplate 50 also includes a second recess 505. The second recess 505 is recessed from the second surface 502 toward the first surface 501. The second recess 505 includes a second bottom wall 5051 and a second side wall 5052. The flexible display module 20 also includes a flexible printed circuit board 90 (FPC). The flexible printed circuit board 90 is located on the side of the driver chip 30 facing away from the bending portion 602. The flexible printed circuit board 90 is connected to the bonding portion 603. Along the thickness direction X of the backplate 50, at least a portion of the orthographic projection of the flexible printed circuit board 90 overlaps with the orthographic projection of the second recess 505. The flexible printed circuit board 90, the backplate 50, and the display portion 601 are stacked along the thickness direction X of the backplate 50. The second recess 505 is provided on the backplate 50. At least a portion of the orthographic projection of the flexible circuit board 90 overlaps with the orthographic projection of the second recess 505, thereby reducing the thickness of the area on the back plate 50 where the second recess 505 is located. This helps to reduce the space occupied by the back plate 50 and the flexible circuit board 90 in the thickness direction X, and thus effectively reduces the thickness of the area on the flexible display module 20 corresponding to the flexible circuit board 90, which is beneficial for achieving a thinner and lighter design of the flexible display module 20. When the flexible display module 20 is applied to the electronic device 10, more space can be saved below the flexible circuit board 90 to accommodate a larger number of other devices or other larger devices.

[0090] The flexible circuit board 90 can be electrically connected to the driver chip 30. The flexible circuit board 90 can also be electrically connected to the motherboard to enable electrical signal interaction between the driver chip 30 and the motherboard. The flexible circuit board 90 is flexible and easily bent and deformed. At least a portion of the flexible circuit board 90 can be located within the second recess 505, thereby reducing the space occupied by the flexible circuit board 90 in the thickness direction X, and thus effectively reducing the thickness of the area corresponding to the flexible circuit board 90 on the flexible display module 20.

[0091] The flexible circuit board 90 is connected to the second bottom wall 5051 of the second recess 505. In some examples, the flexible circuit board 90 and the second bottom wall 5051 of the second recess 505 can be connected by adhesive bonding, which helps to reduce the number of parts used. At the same time, it eliminates the need to set corresponding connection structures on the flexible circuit board 90 or the back plate 50 due to the use of additional connectors, reducing assembly difficulty and ensuring the structural integrity of the flexible circuit board 90 and the back plate 50.

[0092] In some examples, the flexible circuit board 90 is bonded to the second bottom wall 5051 via an adhesive layer 200. At least a portion of the adhesive layer 200 is located within the second recess 505. Exemplarily, the adhesive layer 200 is entirely located within the second recess 505.

[0093] In some examples, a second recess 505 is provided on the first support portion 51 of the back plate 50.

[0094] In some examples, the first sidewall 5032 of the first recess 503 and the second sidewall 5052 of the second recess 505 are spaced apart. The first recess 503 and the second recess 505 may not be connected to each other. The second recess 505 is located on the side of the first recess 503 away from the bending portion 602. Relative to the thickness of the area corresponding to the first recess 503 and the second recess 505, the area on the back plate 50 used to separate the first recess 503 and the second recess 505 is thicker, thereby ensuring that the area used to separate the first recess 503 and the second recess 505 has a higher resistance to deformation, reducing the possibility that the stiffness of the back plate 50 will decrease excessively due to the arrangement of the first recess 503 and the second recess 505.

[0095] In some implementations, the flexible display component 60 is a flexible screen. The portion of the flexible screen extending beyond the display section 601 forms the bending section 602 and the bonding section 603. The driver chip 30 is directly connected to the flexible screen. In other implementations, Figure 18 A partial cross-sectional view of a flexible display module 20 according to one embodiment is schematically shown. See also Figure 18 As shown, the flexible display component 60 includes a flexible screen 61 and a flexible adapter circuit board 62. The flexible adapter circuit board 62 is flexible and easily deformable. The adapter circuit board 62 and the flexible screen 61 are electrically connected. A driver chip 30 is disposed on the adapter circuit board 62. The driver chip 30 transmits drive signals to the flexible screen 61 through the adapter circuit board 62. In some examples, the connection between the flexible screen 61 and the adapter circuit board 62 is located at a bonding portion 603. A portion of the flexible screen 61 and the adapter circuit board 62 form the bonding portion 603. A flexible circuit board 90 is connected to the adapter circuit board 62.

[0096] In some feasible ways, Figure 19 A partial cross-sectional view of a flexible display module 20 according to one embodiment is schematically shown. See also Figure 19 As shown, the support assembly 70 includes a first support member 71 and a connector 72. The connector 72 is disposed between the first support member 71 and the first bottom wall 5031 of the first recess 503. The connector 72 connects the first support member 71 and the first bottom wall 5031 of the first recess 503. At least a portion of the connector 72 is disposed within the first recess 503.

[0097] In some feasible ways, Figure 20 A partial cross-sectional view of a flexible display module 20 according to one embodiment is schematically shown. See also Figure 20As shown, the flexible display module 20 also includes a shielding member 100. The shielding member 100 is disposed on the side of the bonding portion 603 facing away from the display portion 601. The shielding member 100 can cover the driver chip 30. The driver chip 30 is located within the space formed by the shielding member 100 and the bonding portion 603. The shielding member 100 is used to shield the driver chip 30, effectively reducing the possibility of external signal interference causing abnormal signals in the driver chip 30. The shielding member 100 can cover at least a portion of the flexible circuit board 90.

[0098] In the description of the embodiments of this application, it should be noted that, unless otherwise explicitly specified and limited, the terms "installation," "connection," and "linking" should be interpreted broadly. For example, they can refer to a fixed connection, an indirect connection through an intermediate medium, or the internal communication of two components or the interaction between two components. Those skilled in the art can understand the specific meaning of the above terms in the embodiments of this application according to the specific circumstances.

[0099] The devices or elements referred to in the embodiments of this application or implied herein must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be construed as limiting the embodiments of this application. In the description of the embodiments of this application, "a plurality of" means two or more, unless otherwise precisely specified.

[0100] The terms "first," "second," "third," "fourth," etc. (if present) in the specification, claims, and accompanying drawings of this application are used to distinguish similar objects and are not necessarily used to describe a specific order or sequence. It should be understood that such data can be interchanged where appropriate so that embodiments of the present application described herein can be implemented, for example, in orders other than those illustrated or described herein. Furthermore, the terms "comprising" and "having," and any variations thereof, are intended to cover non-exclusive inclusion; for example, a process, method, system, product, or apparatus that comprises a series of steps or units is not necessarily limited to those explicitly listed, but may include other steps or units not explicitly listed or inherent to such processes, methods, products, or apparatus.

[0101] The term "multiple" in this article refers to two or more. The term "and / or" in this article is merely a description of the relationship between related objects, indicating that three relationships can exist. For example, A and / or B can represent: A alone, A and B simultaneously, or B alone. Furthermore, the character " / " in this article generally indicates an "or" relationship between the preceding and following related objects; in formulas, the character " / " indicates a "division" relationship between the preceding and following related objects.

[0102] It is understood that the various numerical designations used in the embodiments of this application are merely for descriptive convenience and are not intended to limit the scope of the embodiments of this application. It is also understood that in the embodiments of this application, the sequence number of each process does not imply the order of execution; the execution order of each process should be determined by its function and internal logic, and should not constitute any limitation on the implementation process of the embodiments of this application.

Claims

1. A flexible display module for use in electronic devices, characterized in that, The flexible display module includes: The back plate includes a first surface, a second surface, a first recess, and a second recess. Along the thickness direction of the back plate, the first surface and the second surface are disposed opposite to each other, and both the first recess and the second recess are recessed from the second surface toward the first surface. A flexible display component includes a display portion, a bending portion, and a bonding portion, wherein the bending portion connects the display portion and the bonding portion, the display portion is located on one side of a first surface, and the bonding portion is located on one side of a second surface; The driver chip is disposed on the side of the bonding portion facing away from the display portion; A support component is disposed on the side of the bonding portion facing the back plate. At least a portion of the support component is accommodated within the first recess. Along the thickness direction, the driving chip, the support component, and the first recess are correspondingly disposed. A flexible circuit board is located on the side of the driving chip opposite to the bending portion. The flexible circuit board is connected to the bonding portion. Along the thickness direction, at least a portion of the orthographic projection of the flexible circuit board overlaps with the orthographic projection of the second recessed portion. The second recess includes a second bottom wall and a second side wall, and the flexible circuit board is bonded to the second bottom wall; At least a portion of the flexible circuit board is located within the second recess.

2. The flexible display module according to claim 1, characterized in that, The flexible circuit board is bonded to the second bottom wall by an adhesive layer, at least a portion of which is located within the second recess.

3. The flexible display module according to claim 1 or 2, characterized in that, The flexible display module further includes a shielding component, which is disposed on the side of the bonding portion facing away from the display portion, and the shielding component covers at least a portion of the flexible circuit board.

4. The flexible display module according to claim 1 or 2, characterized in that, The support component includes a receiving space, at least a portion of the binding part is located within the receiving space, and the driving chip is disposed correspondingly to the receiving space along the thickness direction; The support assembly includes a first support member and a connector. The connector connects the first support member and the back plate. The first support member includes a base and a protrusion. The protrusion is located on the side of the base facing away from the first surface. The base and the protrusion form the receiving space. The binding part is connected to the base.

5. The flexible display module according to claim 3, characterized in that, The support component includes a receiving space, at least a portion of the binding part is located within the receiving space, and the driving chip is disposed correspondingly to the receiving space along the thickness direction; The support assembly includes a first support member and a connector. The connector connects the first support member and the back plate. The first support member includes a base and a protrusion. The protrusion is located on the side of the base facing away from the first surface. The base and the protrusion form the receiving space. The binding part is connected to the base.

6. The flexible display module according to claim 4, characterized in that: The protrusion is disposed in the region of the base away from the bent portion, and the protrusion is located on the side of the driver chip opposite to the bent portion; or... The protrusion is disposed in the region of the base near the bending portion, and the protrusion is located on the side of the driver chip facing the bending portion.

7. The flexible display module according to claim 5, characterized in that: The protrusion is disposed in the region of the base away from the bent portion, and the protrusion is located on the side of the driver chip opposite to the bent portion; or... The protrusion is disposed in the region of the base near the bending portion, and the protrusion is located on the side of the driver chip facing the bending portion.

8. The flexible display module according to claim 4, characterized in that: Along the axial direction of the bend, the length of the driving chip is less than or equal to the length of the protrusion; or, Along the thickness direction, the surface of the driving chip facing away from the backplate is higher than the surface of the protrusion facing away from the backplate.

9. The flexible display module according to any one of claims 5 to 7, characterized in that: Along the axial direction of the bend, the length of the driving chip is less than or equal to the length of the protrusion; or, Along the thickness direction, the surface of the driving chip facing away from the backplate is higher than the surface of the protrusion facing away from the backplate.

10. The flexible display module according to any one of claims 1, 2, 5 to 8, characterized in that, The flexible display component is a flexible screen; or, the flexible display component includes a connected flexible screen and a flexible adapter circuit board, the adapter circuit board is located at the bonding part, the driving chip is disposed on the adapter circuit board, and the flexible circuit board is connected to the adapter circuit board.

11. The flexible display module according to claim 3, characterized in that, The flexible display component is a flexible screen; or, the flexible display component includes a connected flexible screen and a flexible adapter circuit board, the adapter circuit board is located at the bonding part, the driving chip is disposed on the adapter circuit board, and the flexible circuit board is connected to the adapter circuit board.

12. The flexible display module according to claim 4, characterized in that, The flexible display component is a flexible screen; or, the flexible display component includes a connected flexible screen and a flexible adapter circuit board, the adapter circuit board is located at the bonding part, the driving chip is disposed on the adapter circuit board, and the flexible circuit board is connected to the adapter circuit board.

13. The flexible display module according to claim 9, characterized in that, The flexible display component is a flexible screen; or, the flexible display component includes a connected flexible screen and a flexible adapter circuit board, the adapter circuit board is located at the bonding part, the driving chip is disposed on the adapter circuit board, and the flexible circuit board is connected to the adapter circuit board.

14. The flexible display module according to any one of claims 1, 2, 5 to 8, 11 to 13, characterized in that, Both the first surface and the second surface are planar.

15. The flexible display module according to claim 3, characterized in that, Both the first surface and the second surface are planar.

16. The flexible display module according to claim 4, characterized in that, Both the first surface and the second surface are planar.

17. The flexible display module according to claim 9, characterized in that, Both the first surface and the second surface are planar.

18. The flexible display module according to claim 10, characterized in that, Both the first surface and the second surface are planar.

19. The flexible display module according to any one of claims 1, 2, 5 to 8, 11 to 13, 15 to 18, characterized in that, The back panel includes a first support portion, a middle support portion, and a second support portion. The second recessed portion is disposed on the first support portion. The back panel has a folded state and an unfolded state. The back panel is used to drive the display portion to fold or unfold. In the folded state, the first support portion, the middle support portion, and the second support portion are flush with each other. In the unfolded state, the first support portion and the second support portion are both bent relative to the middle support portion.

20. The flexible display module according to claim 3, characterized in that, The back panel includes a first support portion, a middle support portion, and a second support portion. The second recessed portion is disposed on the first support portion. The back panel has a folded state and an unfolded state. The back panel is used to drive the display portion to fold or unfold. In the folded state, the first support portion, the middle support portion, and the second support portion are flush with each other. In the unfolded state, the first support portion and the second support portion are both bent relative to the middle support portion.

21. The flexible display module according to claim 4, characterized in that, The back panel includes a first support portion, a middle support portion, and a second support portion. The second recessed portion is disposed on the first support portion. The back panel has a folded state and an unfolded state. The back panel is used to drive the display portion to fold or unfold. In the folded state, the first support portion, the middle support portion, and the second support portion are flush with each other. In the unfolded state, the first support portion and the second support portion are both bent relative to the middle support portion.

22. The flexible display module according to claim 9, characterized in that, The back panel includes a first support portion, a middle support portion, and a second support portion. The second recessed portion is disposed on the first support portion. The back panel has a folded state and an unfolded state. The back panel is used to drive the display portion to fold or unfold. In the folded state, the first support portion, the middle support portion, and the second support portion are flush with each other. In the unfolded state, the first support portion and the second support portion are both bent relative to the middle support portion.

23. The flexible display module according to claim 10, characterized in that, The back panel includes a first support portion, a middle support portion, and a second support portion. The second recessed portion is disposed on the first support portion. The back panel has a folded state and an unfolded state. The back panel is used to drive the display portion to fold or unfold. In the folded state, the first support portion, the middle support portion, and the second support portion are flush with each other. In the unfolded state, the first support portion and the second support portion are both bent relative to the middle support portion.

24. The flexible display module according to claim 14, characterized in that, The back panel includes a first support portion, a middle support portion, and a second support portion. The second recessed portion is disposed on the first support portion. The back panel has a folded state and an unfolded state. The back panel is used to drive the display portion to fold or unfold. In the folded state, the first support portion, the middle support portion, and the second support portion are flush with each other. In the unfolded state, the first support portion and the second support portion are both bent relative to the middle support portion.

25. An electronic device, characterized in that, It includes at least the flexible display module as described in any one of claims 1 to 24.

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