Method for manufacturing metal wiring and kit

By using a developer solution with a specific composition to treat coating residues during the developing process, the problems of difficult coating removal and damage to wiring by developing force are solved, achieving efficient and damage-free metal wiring manufacturing.

CN116034440BActive Publication Date: 2026-07-14ASAHI KASEI KOGYO KABUSHIKI KAISHA
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Patent Information

Application Number
CN202180054276.6
Authority / Receiving Office
CN · China
Patent Type
Patents(China)
Current Assignee / Owner
Priority Date
2021-04-30
Filing Date
2021-09-03
Publication Date
2026-07-14
Estimated Expiration
2041-09-03

AI Technical Summary

Technical Problem

In existing technologies, after laser irradiation forms wiring, coating residue is difficult to completely remove, and physical forces during the development process can damage the metal wiring, leading to problems such as short circuits or increased resistance.

Method used

The process involves coating, drying, laser irradiation, and developing a dispersion containing metal particles and metal oxide particles. Coating removal is performed using a developer with a specific composition, including first and second developers. The composition of the developer is controlled to improve the removal effect and reduce damage to wiring.

Benefits of technology

This technology enables thorough removal of coating during the developing process, avoiding wiring damage and improving production efficiency and product quality.

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Abstract

Provided is a method for manufacturing a metal wiring in which a coating film remaining between metal wirings can be sufficiently removed in a developing step, and a kit. In a method for manufacturing a metal wiring according to one embodiment, a developing step includes a first developing treatment in which a region other than a dried coating film of a metal wiring is removed by a first developing solution, the first developing solution containing a solvent and an additive (A), the solvent being an organic solvent or water or a mixture thereof, the organic solvent being one or more selected from the group consisting of an alcohol solvent, a ketone solvent, an ester solvent, an amine solvent, and an ether solvent, and the concentration of the additive (A) in the first developing solution being 0.01% by mass or more and 20% by mass or less.
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