Electronic control device and manufacturing method

Abstract

The electronic control device (1) has a cover plate 30 (housing). The cover plate (30) (housing) is composed of at least a metal layer (32), a plating layer (33), an exposed portion (32a), and a sealing band (70) (cover portion). That is, the cover plate 30 (housing) includes a metal layer (32) composed of metal, a plating layer (33) covering the outer surface of the metal layer (32), an exposed portion (32a) exposing the metal layer (32) from a portion of the plating layer (33), and a sealing band (70) (cover portion) covering the metal layer (32) exposed by the exposed portion (32a).

Description

TECHNICAL FIELD

[0001] The present application relates to an electronic control device and a manufacturing method. BACKGROUND

[0002] As an electronic control device mounted in an engine compartment, a strict environmental resistance specification condition and a high life are required, which are resistant to corrosion and aging. In particular, a high life resistant to salt water and the like, that is, salt damage is required. A completely airtight sealing structure is required in which a printed wiring board on which electronic components and the like are mounted is protected with a case, and a positive or negative pressure inside the vehicle-mounted electronic control device is not caused to the vehicle harness side via a connector. In consideration of air transportation and the like in which there is a pressure change, a very high pressure resistance of 50 kPa to 85 kPa is also required.

[0003] In addition, due to the high functionality of the electronic control device, the large size of the case and the multipolarization of the number of poles of the connector exceed the miniaturization of electronic components mounted on the board, the miniaturization of the mounting structure. The decentralization of the electronic control device and the reduction in the number of poles of the connector terminal are still in a state that cannot be easily achieved by the engine electronic control device and the transmission electronic control device mounted in the engine compartment.

[0004] A high-life sealing adhesive material used in the engine compartment is different from a general product, and is generally high in cost. It is necessary to ensure the sealing length while reducing the amount of use of the sealing material including the deviation of the work and assembly, and to ensure the adhesive force capable of withstanding the complete airtightness and high pressure resistance.

[0005] The case of the electronic control device also requires noise resistance that suppresses electromagnetic noise radiated from electronic components, printed wiring boards, and the like, and protects against external electromagnetic noise.

[0006] A higher mounting freedom is required without being limited by the mounting position on the vehicle. The fixing method to the vehicle is generally to provide a flange or the like on the electronic control device, to provide a through hole in the flange or the like, and to be fixed to a fixing member on the vehicle side with a bolt, but in recent years, as a method for simplifying the work and reducing the cost without using the bolt fixation, the case of the vehicle-mounted electronic control device is fixed by clamping by a resin bracket or the like provided on the vehicle side.

[0007] In the past, as an electronic control device, Patent Documents 1 to 4 are known.

[0008] Patent Document 1 is a high-function vehicle-mounted electronic control device mounted in an engine compartment, characterized in that a sealing adhesive material is filled in a gap between a case and a cover plate, and the sealing adhesive material must be filled in an outer peripheral side gap and an inner peripheral side gap.

[0009] Patent Literature 2 is a control device sealed with a silicon gel, which is coated with a silicon gel and heated and cured. It is characterized in that, for the release gas generated when the silicon material is cured, a pressure guide hole is provided to discharge the gas and make the pressure constant.

[0010] In Patent Literature 3, the cover plate is fastened and fixed to the housing main body by a stop screw. It is characterized in that a protrusion is provided at the upper end of the fastening and fixing portion of the housing main body, and a cutout groove for discharging gas is provided at the protrusion to discharge the release gas of the waterproof adhesive cured by heating to 100°C for about 1 hour.

[0011] In Patent Literature 4, on the inner side of the cover plate that protects a printed wiring board on which electronic components and the like are mounted, plating is partially peeled off, and the base material of the steel plate is exposed, and a sealing material is immersed in the exposed portion. The cover plate is an iron-based material that is rolled, and the base material is coated with a molten zinc plating layer of several tens of μm in thickness, and in addition, the surface of the plating layer is subjected to a chemical conversion treatment of several μm in thickness. In addition, it is characterized in that a release gas discharge portion is provided to discharge the release gas generated when the sealing material hardens.

[0012] Prior Art Documents

[0013] Patent Literature

[0014] Patent Literature 1: Japanese Patent No. 6488391

[0015] Patent Literature 2: Japanese Patent Application Laid-Open No. 2002-76205

[0016] Patent Literature 3: Japanese Patent Application Laid-Open No. 2008-8210

[0017] Patent Literature 4: International Publication No. 2020 / 050093

[0018] Patent Literature 5: International Publication No. 2017 / 199569 SUMMARY

[0019] PROBLEMS TO BE SOLVED BY THE INVENTION

[0020] The problem to be solved is that, in the above-described prior structure of Patent Literature 1 or Patent Literature 4, the gap between the housing and the cover plate is filled with a sealing material to achieve complete airtightness. Before the cover plate is assembled, the cover plate is stored for a long time, and there is no assumption that the surface of the cover plate is oxidized. In addition, after assembly, even if the surface of the cover plate starts to oxidize, it is possible to ensure the adhesive force that can withstand a pressure change of 65 kPa to 85 kPa, but when moisture and temperature are applied to the sealing portion, the adhesive force at the interface of the cover plate surface and the sealing material decreases, and the sealing material peels off.

[0021] In addition, the galvannealed steel sheet of the cover material is mainly composed of three layers, a plating layer of zinc, aluminum, magnesium or the like of several tens of μm (micrometers) is formed on an iron-based base material, and a chemical conversion treatment of inorganic or organic of several μm or so is performed on the most surface. If the cover is stored for a long time after the cover is formed, the chemical conversion treatment is lost, and an oxide film is formed on the plating layer. However, the surface of the galvannealed steel sheet is slightly changed in color from white rust to black rust, but the change cannot be visually determined by a microscope or the like. Since the oxidation affects the adhesion strength of the adherend and the sealing adhesive to be reduced, it is necessary to be able to identify the color of the cover.

[0022] Further, when checking whether the cover after oxidation can be assembled, it is necessary to confirm the pressure resistance. After assembly, if the pressure resistance is not qualified, it is difficult to repair the in-vehicle electronic control device, and it is necessary to discard it. Further, it is difficult to store the large cover of the in-vehicle electronic control device after high functionalization in a moisture-proof container such as a desiccator so as not to cause oxidation of the cover after formation.

[0023] In addition, in the existing structure of Patent Documents 1 to 4, it is necessary to discharge the outgassing in the silicon-based sealing adhesive which is raised in temperature and cured, and a pressure guide hole or an exhaust hole is provided in the in-vehicle electronic control device of Patent Document 1 or Patent Document 4 and the completely airtight one, and the outgassing is discharged after the sealing adhesive is cured. It is a general structure that the hole for discharging the outgassing is sealed with a cover portion, a sealing tape or a label or the like so as to be completely airtight, but the structure for sealing the portion for determining the oxidation state is not known.

[0024] Further, in the existing structure of Patent Document 4, the plating around the screw inside the cover is shaved to expose the base, and it is necessary to avoid the foreign matter from falling on the printed wiring board before assembly.

[0025] Patent Document 5 is a corrosion resistance diagnostic device for an outdoor unit of an air conditioner, and the structure is to diagnose the corrosion progress state by obtaining the thickness of the corrosion product generated on the metal film by using the fact that the color of the metal film and the generated corrosion product is different, and the oxidation detection portion is separated from the product, and the product is not provided with the detection portion.

[0026] An object of the present application is to provide an electronic control device in which the oxidation state of a housing can be easily confirmed.

[0027] Technical means for solving the technical problem

[0028] In order to achieve the above object, one example of the present application is an electronic control device having a housing including a metal layer composed of a metal, a plating layer covering an outer surface of the metal layer, an exposed portion for exposing the metal layer from a part of the plating layer, and a cover portion covering the metal layer exposed by the exposed portion.

[0029] Effect of the Invention

[0030] According to the present application, the oxidation state of the housing can be easily confirmed. The technical problems, configurations, and effects other than the above are further clarified by the following embodiments. BRIEF DESCRIPTION OF DRAWINGS

[0031] Figure 1 is a perspective view of an electronic control device according to the present embodiment.

[0032] Figure 2 is a perspective view of an electronic control device according to the present embodiment. Figure 1 is a main part cross-sectional view of the electronic control device shown in Fig. 1.

[0033] Figure 3 is a plan view of the electronic control device shown in Fig. 1. Figure 1

[0034] Figure 4 is a main part cross-sectional view (A-A) of the electronic control device shown in Fig. 1. Figure 3

[0035] Figure 5 is a main part cross-sectional view (B-B) of the cover shown in Fig. 1. Figure 3

[0036] Figure 6 is a main part cross-sectional view (B-B) of the electronic control device during assembly shown in Fig. 1. Figure 3

[0037] is a main part plan view of the cover according to the first modification. Figure 7

[0038] is a main part plan view of the cover according to the second modification. Figure 8

[0039] is a flowchart showing only the characteristic part of the manufacturing method of the electronic control device. Figure 9 DETAILED DESCRIPTION

[0040] Hereinafter, a mode for carrying out the present application will be specifically described according to the embodiments, but the present application is not limited to the following embodiments. The present embodiment relates to an electronic control device for a vehicle (an in-vehicle electronic control device) in which a metal material having excellent environmental resistance such as salt water resistance and pressure resistance is installed in an engine compartment in which oxidation can be visually confirmed before assembly and waterproofness ensuring complete airtightness is ensured without affecting the adhesion to a sealing adhesive, for an electronic control device in which a printed wiring board on which electronic components and the like are mounted is housed.

[0041] [EMBODIMENT]

[0042] Figure 1 ​​​​This is a perspective view showing the electronic control device involved in this embodiment. For ease of observation, electronic components mounted on the substrate have been omitted. Figure 2 This is a cross-sectional view showing the main parts of the electronic control device involved in this embodiment. Figure 3 This is a top view of the electronic control device involved in this embodiment. Figure 4 It means Figure 3 A cross-sectional view of the main AA section of the electronic control device shown. Figure 5 yes Figure 3 The BB section view of the cover plate shown. Figure 6 yes Figure 3 The BB main section view during the assembly of the cover plate (before labeling).

[0043] like Figure 1 As shown, the electronic control device 1 comprises a printed wiring board 10 on which electronic components (not shown) are mounted, a housing 20 for protecting the printed wiring board 10, and a pair of internal spaces 11 for sealing. Figure 2 The device comprises a cover plate 30, a connector 60 connected to the printed wiring substrate 10, a sealing material 40 for waterproofing between the housing and the cover plate, a sealing material 41 for waterproofing between the housing 61 of the connector 60 and the protrusions 21a around the plurality of openings through the housing 20, a heat-dissipating adhesive (not shown) disposed between the printed wiring substrate 10 and the housing 20, screws 50 for fixing the printed wiring substrate 10 to the housing 20, and screws 51 for fixing the housing 20 and the cover plate 30.

[0044] The housing 20, together with the cover plate 30, internally houses the printed wiring board 10 to protect the printed wiring board 10, on which electronic components are mounted, from water, foreign objects, etc. The housing 20 is preferably made of metal, and more preferably aluminum, to facilitate heat dissipation from the electronic components and to shield noise. In particular, the electronic control unit 1 for direct injection engines requires effective shielding.

[0045] The housing 20 is formed using an aluminum die-casting method with a mold. In the case of an electronic control device composed of electronic components that do not require heat dissipation or shielding, the housing 20 can be made of resin. When the housing material is resin, the housing 20 is formed using injection molding. The electronic control device has an external dimension of approximately 240mm × 160mm, which is larger than the electronic control device 1 located in the engine compartment, and is rectangular in shape. Patent Document 3 has a size of approximately 160mm × 160mm; this embodiment is more than 1.5 times the size of Patent Document 3.

[0046] The housing 20 is provided with a through opening 21 ( Figure 2The opening 21 functions as a through connector. Due to the pressure exerted inside the housing 20 under conditions such as altitude and temperature variations during vehicle transportation or use, the central portion of the housing 20 experiences the greatest deformation in the concave-convex direction. Therefore, the through opening 21 is preferably located on the outer side of the center of the housing. Heat dissipation fins 24, which increase heat capacity, are provided on the opposite side of the opening 21. That is, the opening 21 is located on one short side of the housing 20, and the heat dissipation fins 24 are located on the other short side of the housing 20. The orientation of the heat dissipation fins 24 is as follows: Figure 1 As shown, it is parallel to the long side of the shell 20, but it can also be parallel to the short side of the shell 20. Ideally, it should be parallel to the gate used in aluminum die casting.

[0047] Aluminum die casting requires fluid analysis and other methods to determine the forming process within the solidification time of the aluminum, including the pre-confirmation of the gate location, overflow configuration, air entrapment, and hot water flow. If the hot water flow is obstructed, or if the cavity or weld is poorly formed, it can lead to deterioration of heat conduction or cracking. Therefore, wall thickness does not affect airtightness or deformation, nor does it affect strength or appearance.

[0048] like Figure 4 As shown, the housing 20 has edge grooves 20a provided around the entire periphery of the cover plate 30, and a shape 22 on the inner space side of the sealing material 40 to prevent and suppress movement of the sealing material 40 towards the inner space side. The shape 22 is set higher than the edge grooves 20a. The shape 22 also needs to ensure a gap that does not contact the printed wiring substrate 10. In addition, the housing 20 is subjected to a surface roughening treatment such as sandblasting to suppress the movement of the sealing material 40. In particular, when the surface roughness around the edge grooves 20a and the shape 22 where the sealing material 40 is coated is increased, the movement of the sealing material 40 can be suppressed. Since the sealing material 40 is on the outside instead of the inner space side, crevice corrosion caused by electrolytic corrosion will not occur.

[0049] The housing 20 has multiple bases for fixing the printed wiring substrate 10, and is provided with screws 50 for tightening. Figure 1 The housing 20 includes a click-processed base (not shown) and a base with a surface finish coated with a heat-dissipating adhesive material (not shown). A screw 51 is also provided within the housing 20. Figure 4 The base is fixed to the cover plate 30.

[0050] The cover plate 30 has end 31 on its entire periphery, and a sealing material 40 is applied between the cover plate 30 and the edge groove 20a of the housing 20 to protect against foreign matter such as salt water as required by the environmental specifications of the engine compartment.

[0051] The material of the cover plate 30 is preferably a steel plate of iron or aluminum, but can also be a resin or an aluminum die cast. In the case of metal, the influence of electromagnetic waves is less than in other cases. Alternatively, the influence of electromagnetic waves is less than in other cases. The base material that is rolled is preferably iron.

[0052] Details will be described later, but in this embodiment, since the exposed portion 32a is provided as one of the features on the cover plate 30 (the housing), the material of the cover plate 30 is a steel plate of iron. However, the exposed portion 32a can also be provided on the housing 20 (the housing). In this case, the material of the cover plate 30 is not limited to iron, but can also be a resin.

[0053] The cover plate 30 is preferably a steel plate having a constant plate thickness, and is formed by a press forming method. In the case of a steel plate for the cover plate, plating is preferably performed on the metal layer 32. The plating layer 33 is formed mainly of molten zinc, and plating having high corrosion resistance is performed in an engine compartment environment containing zinc, aluminum, magnesium, and the like, and impurities.

[0054] The thickness of the plating layer 33 is about several tens of μm. When the plating layer 33 is thicker, the plating layer 33 is easily broken, but has higher corrosion resistance.

[0055] An inorganic or organic chemical conversion treatment is performed on the outermost surface of the plating layer 33 as a primary corrosion prevention for preventing oxidation of the plating. That is, the cover plate 30 (the housing) includes a chemical conversion treatment layer 34 that covers the outer surface of the plating layer 33. The thickness of the chemical conversion treatment layer 34 is several hundred nm.

[0056] In the case of a pre-plated steel plate (a steel plate on which plating is completed before forming), since the cut surface at the time of forming is not plated, the end portion 31 is filled in the sealing material 40 or the like to protect the end portion 31 from corrosion. The gap between the end portion 31 and the edge groove 20a is sufficiently ensured to maintain the adhesion of the sealing material 40. The sealing material 40 is adhered in parallel with the flat portion so as to be sandwiched by the housing 20 over the entire circumference. The longer the distance of the sealing material 40, the longer the creepage distance for corrosion can be ensured.

[0057] In the printed wiring board 10, electronic components and the like are mounted using a conductive alloy such as solder. They can be mounted on both surfaces. The electronic components are passive components such as resistors and capacitors, and active components such as semiconductors, and are mounted on the printed wiring board by a surface mounting method or a plug-in mounting method. Electronic components that can withstand high life in the engine compartment environment of a vehicle are preferably used.

[0058] As a package of electronic components, in order to increase mounting density, a high-density BGA (Ball Grid Array), a QFN (Quad Flat Non-Lead Package), and a QFP (Quad Flat Package) in which a lead terminal is stretched are mounted. The BGA has electrodes formed in a hemispherical shape on the surface tension of a conductive alloy on terminals arranged in a lattice on the bottom surface of the package, and is joined to the printed wiring board 10 by reflow. The terminals of the QFN are shorter than those of the QFP, and are connected to the printed wiring board 10 by a conductive alloy. When the amount of deformation of the printed wiring board 10 is large, this structure is easily subjected to stress at the joint, and thus, it is necessary to suppress the amount of deformation of the printed wiring board 10.

[0059] The printed wiring board 10 is fixed to the tapped base of the housing 20 together with the plurality of screws 50. At this time, the heat dissipation adhesive is sandwiched between the printed wiring board 10 and the base of the housing 20 having surface precision and is fixed, the heat generated by the electronic components is returned to the through hole of the printed wiring board and is thermally conducted to the base, and the heat is transferred from the surface of the housing 20 including the fins.

[0060] It is preferable that the height position of the printed wiring board 10 be located at the center of the housing 20 and the cover 30. If it is close to one side, the height of the mounted electronic components is limited, and high electronic components cannot be arranged on both sides. In addition, since the height position of the printed wiring board 10 is located at the center of the housing 20 and the cover 30, the electronic control device 1 can be configured to be low in height. By configuring the electronic control device 1 to be low in height, when it is mounted in the engine compartment, space can be easily secured, and air for cooling can be easily received.

[0061] Since the electronic control device 1 arranged in the engine compartment is relatively large in size, the screws 50 are fixed by 4 to 7. With regard to the positions of the screws 50, it is desirable to uniformly arrange the distances of the respective screws while considering the four corners of the printed wiring board 10 and the arrangement of the electronic components. In particular, since strain is generated in the printed wiring board 10 in the vicinity of the screws 50, it is preferable that the arrangement of the joint due to the conductive alloy of the connector 60, the BGA, and the QFN not be strained and that the vicinity not be arranged. In addition, the screws 50 have a function as a housing ground, and are in conduction with the housing 20 through the GND wiring pattern of the printed wiring board 10 and the screws 50. In order to trace the wiring pattern of the printed wiring board 10, it is desirable that the housing ground be located at the four corners of the printed wiring board 10.

[0062] The printed wiring substrate 10 is preferably a glass epoxy board impregnated with epoxy resin obtained by overlapping glass fiber cloth, and is a multilayer substrate obtained by stacking insulators and patterns. Due to the requirement of high-density mounting, it is a multilayer substrate with 4 to 8 layers. In addition, it is preferable to be a through board in which wiring is performed between layers through through-holes or a laminated board obtained by a lamination process.

[0063] The thermal adhesive conducts heat from the electronic components to the surface-precision base of the housing 20 through the through-holes in the printed wiring substrate 10. The thinner the thermal adhesive, the easier it is to conduct heat. When the housing 20 deforms on its side, the gap between it and the printed wiring substrate 10 widens, thus deteriorating heat dissipation performance. Therefore, deformation of the housing 20 is effectively suppressed. The heat-generating electronic components requiring heat dissipation are positioned below the heat sink fins 24.

[0064] like Figure 2 As shown, connector 60 comprises a housing 61, terminals 63, and potting material 64. Terminals 63 are stamped from copper with high thermal conductivity. Terminals 63 are straight-lined and have indentations at their tips to facilitate access to the connector or through-hole of the printed wiring board on the wire harness side. The housing 61 is molded from resin using injection molding, and terminals 63 are pressed into the housing 61. Alternatively, insertion molding can be performed simultaneously with terminals 63.

[0065] The housing 61 has a concave shape 61a for sealing the potting material 64. Since there is a gap between the housing 61 and the terminal 63 pressed into the housing 61, the potting material 64 is provided for the purpose of airtightness. The potting material 64 sealed in the concave shape 61a needs to have a thickness and adhesive strength that can withstand pressure of about 50 kPa to 85 kPa.

[0066] The size of connector 60 depends on the number of poles or the width of terminal 63. Due to differences in current capacity, the terminals 63 for signal systems and power systems are combined, totaling approximately 60 to 80 poles. The terminals for power systems are wider. Terminals 63 are connected to through-holes in the printed wiring board 10 using a conductive alloy such as solder (not shown). Alternatively, a mechanical electrical connection can be achieved by pressing terminals (not shown).

[0067] In this embodiment, the connector 60 is assembled and connected to the outside of the opening 21 of the housing 20 via a sealing material 41. However, after being connected to the printed wiring substrate 10, it is first connected to the inner surface of the opening 21 of the housing 20 via the sealing material 41. When the connector 60 is connected from the outside of the opening 21 of the housing 20, it has the advantage of being able to miniaturize the sealing structure of the connector 60.

[0068] In the detailed connection method between connector 60 and housing 20, a housing groove 62 filled with sealing material 41 is provided around the bottom edge of the housing of connector 60, which is embedded in the protrusion 21a of the housing opening, so that the sealing material 41 is cured and sealed. The depth of the housing groove 62 and the height of the protrusion 21a of the housing opening adopt a labyrinth structure to avoid the influence of foreign objects such as salt water required by the environmental specifications of the engine compartment.

[0069] Since the sealing material 41 fills the gap between the housing groove 62 and the protrusion 21a of the housing opening, the gap and the amount of sealing material 41 are determined taking into account assembly errors. For example, when the connector periphery of the housing 20 expands and deforms to the side under the influence of heat or pressure, the sealing material 41 functions as a buffer material, but due to the small gap, the connector 60 also deforms at the same time. The deformation of the connector 60 also affects the terminal 63, and the deformation is simultaneously transmitted to the printed wiring substrate 10 through the conductive adhesive.

[0070] The sealing material 41 is preferably a silicone adhesive with heat resistance, water resistance, chemical resistance, and flexibility to protect it from foreign matter such as salt water required by the environmental specifications of the engine compartment.

[0071] Like sealing material 41, sealing material 40 is preferably made of silicone adhesive. Pressure resistance requires a thickness and adhesive strength capable of withstanding pressures of approximately 50 kPa to 85 kPa. Specifically, along the long side of housing 20, due to pressure changes within housing 20 caused by temperature variations, housing 20 experiences internal pressure, resulting in a lateral bending deformation at the center of housing 20. Therefore, the deformation is greatest at the center of the long side. Thus, sealing material 40 possesses adhesive strength capable of withstanding this deformation.

[0072] like Figure 4 As shown, through holes 30a through which screws 51, which are fixed to the housing 20, pass in the cover plate 30 are provided at the four corners. The cover plate 30 and the housing 20 are fixed together with the sealing material 40 by screws 51. In order to avoid complicating the application path of the sealing material 40, it is preferable to place the screws 51 at the four corners. In this embodiment, the size is 1.5 times larger than that of conventional electronic control devices. Therefore, a thin-walled material was selected for the cover plate 30, but strength was ensured by providing ribs, recesses, steps, etc.

[0073] To fit the housing 20 and the cover plate 30 together, a screw 51 is passed through the through hole 23 on the housing side and the through hole 30a on the cover plate side, respectively. A tapping process is performed on the through hole 23 on the housing side. To prevent loosening, a spring washer and a flat washer can be clamped onto the screw 51.

[0074] The sealing material is preferably a silicone-based adhesive, but it can also be a heat-curing additive type or a moisture-curing condensation type. For heat-curing additive types, the curing temperature is preferably between 100°C and 110°C, and the curing time is at least 60 minutes.

[0075] The potting material 64 used to make the terminals 63 and housing 61 of the connector airtight, the sealing material 41 used to make the surrounding area of ​​the connector airtight, the sealing material 40 used to make the entire periphery of the housing and cover airtight, and the internal space 11 of the printed wiring board 10 on which the electronic control device 1 is disposed are completely sealed.

[0076] After the cover plate is installed, sealing materials 40 and 41 can cure simultaneously. However, in order to release the escaping gas generated during the simultaneous curing of sealing materials 40 and 41, for example, through holes 23, 30a, and 30b on the housing side ( Figure 5 As shown in the figure, it is equipped with multiple gas release and discharge sections.

[0077] The vented gas is discharged to the internal space side and exits through the through-hole 30b provided on the cover plate. If the vented gas is not discharged, internal pressure will cause stress on the sealing material, making it impossible to maintain the airtightness of the internal space. The through-hole 30b is a tiny size that can be formed by a punching process, allowing the vented gas to be discharged.

[0078] The electronic control unit has a relatively large size of 240mm × 160mm, and within its low profile, approximately five through holes 30a and 30b are provided for easy venting during curing. The internal pressure is preferably the same as the atmospheric pressure during assembly.

[0079] like Figure 6 As shown, to prevent salt water from seeping in through the drainage hole 30b provided on the cover plate, a sealing strip 70 with high adhesion is affixed as a cover. Furthermore, a label 80 is affixed to the sealing strip 70 to protect it. That is, the cover plate 30 (housing) includes a label 80, which is affixed to the cover plate 30 (housing) to cover the sealing strip 70. The label 80 is affixed to identify the product model, production history, etc.

[0080] Label 80 is made of, for example, polyester film, and preferably of a material that is water-resistant, oil-resistant, and heat-resistant. The adhesive used for label 80 is, for example, an acrylic adhesive, but is not limited thereto. From a design perspective, label 80 not only conceals the sealing tape 70 but also enhances the functionality of the sealing tape 70 (waterproof, dustproof, etc.). Figure 6 The assembly process is shown before labeling 80 from top to bottom.

[0081] For the application of the sealing tape 70, after the sealing material 40 has cured by heating, the surface temperature of the cover plate is cooled from over 100°C to approximately 25°C. The tape is then applied by evenly pressing with rollers or similar means, ensuring that air is not trapped or the tape peels off. The pressing pressure is approximately 50 N. The sealing tape 70 is approximately 20 mm × 15 mm in size, which is large enough for the through hole 30b to prevent salt water or other substances from penetrating the metal layer 32 and plating 33 of the ferrous base material, and to completely seal the internal space 11. The adhesive strength of the sealing tape can withstand pressures ranging from approximately 50 kPa to 85 kPa. The shape of the sealing tape can be square, rectangular, circular, or elliptical, as long as it effectively blocks the through hole 30a and maintains adhesion.

[0082] The exposed portion 32a, which exposes the plating layer 33 and the metal layer 32, is provided around the through hole 30b. The exposure process can be milling, stamping to break up the plating, or repeated stretching. The exposed portion 32a (exposed part) is provided when the cover plate 30 is formed. Because the metal layer 32 of the ferrous base material is exposed, the surface turns red upon oxidation. Red rust 32b forms on the outermost surface of the machined portion.

[0083] In other words, the electronic control device 1 has a cover plate 30 (housing). The cover plate 30 (housing) includes at least a metal layer 32 made of metal, a plating layer 33 covering the outer surface of the metal layer 32, an exposed portion 32a that exposes a portion of the metal layer 32 from the plating layer 33, and a sealing strip 70 (cover) that covers the metal layer 32 exposed from the exposed portion 32a. The sealing strip 70 is configured to cover the metal layer 32 exposed from the exposed portion 32a by being adhered to the cover plate 30 (housing).

[0084] Therefore, for example, before assembling the electronic control device, the oxidation state of the cover 30 (housing) can be easily inspected through the exposed portion 32a. Furthermore, if the sealing strip is removed, the exposed portion 32a functions as a temperature and humidity indicator, allowing determination of the environment in which it has been stored.

[0085] In this embodiment, the cover plate 30 (housing) includes a through hole 30b, and the through hole 30b and the exposed portion 32a are covered by a sealing strip 70. This reduces the time required to apply the sealing strip 70. Figure 6 The through hole 30b shown is located in the area (central part) of the exposed portion 32a. Therefore, for example, when machining the exposed portion 32a and the through hole 30b using a machine tool, only one positioning is required.

[0086] Figure 5is a sectional view of the individual cover plate before assembly. When red rust 32b is generated, the storage condition of the cover plate 30 can be grasped, and before assembly, the worker can judge whether the cover plate 30 can be used or not by visual observation or image. The most surface layer of the cover plate 30 is the conversion treatment layer 34, and then the plating layer 33, and even if they are oxidized, they cannot be easily judged by visual observation. However, if the iron of the base material is oxidized, it can be judged by visual observation.

[0087] When red rust 32b is generated, it is not put into the assembly line. This is because both the conversion treatment layer 34 and the plating layer 33 are in a state of gradual oxidation. When the most surface conversion treatment layer 34 and the plating layer 33 are oxidized, the silicon-based sealing material 40 can mainly be bonded by hydrogen bonds, but after bonding, moisture or the like penetrates through the silicon-based sealing material 40, and at the interface of the bonding portion, the hydrogen bonds are broken and interface peeling occurs. This is a general case. When the surface is oxidized, the sealing material 40 is easily peeled off, and when moisture or heat is added, the adhesion easily decreases, and in an engine compartment environment where the internal pressure changes to 50 kPa to 85 kPa, and in an electronic control device where the size is large, the adhesion of the sealing portion decreases, which cannot be ignored. In addition, before assembly, it can be judged whether it can be used or not according to the oxidation degree of the plating layer under the conversion treatment layer.

[0088] By exposing the base near the through hole for discharge on the outside of the cover plate, the base material of the metal layer is processed to be thin (for example, milled), the oxide film can be removed, and before assembly, it can be confirmed by visual observation or image whether red rust is generated, and when stored for a long time, it has the advantage that a drying device or the like storage box is not required, and the storage environment can be predicted by visual observation. The exposed portion 32a has the function of an indicator that grasps the temperature and humidity according to the generation state of the red rust 32b.

[0089] (First Modification)

[0090] Figure 7 is a main portion plan view of the cover plate 30 (housing) related to the first modification. In the present modification, the through hole 30b is provided outside the region of the exposed portion 32a. Thereby, the region of the exposed portion 32a is widened, and it is easy to confirm by visual observation. In addition, there is no risk that the dirt such as plating dross generated when the exposed portion 32a is processed falls off on the substrate.

[0091] (Second Modification)

[0092] Figure 8Fig. 2 is a plan view of a main portion of a cover 30 (housing) to which the second modification is applied. In this modification, the exposed portion 32a is circular ring-shaped and is provided around the through-hole 30b. Thus, the area of the exposed portion 32a is widened, and it is easy to confirm by visual observation. In addition, there is no risk that dirt such as plating dross generated when the exposed portion 32a is processed will fall off the substrate. Furthermore, when the exposed portion 32a and the through-hole 30b are processed using a machine tool, positioning is performed only once.

[0093] According to the present embodiment, compared with the conventional electronic control device, the electronic control device of the present application exposes the plating layer in the vicinity of the discharge hole, enables determination of the oxidation state before the cover is assembled, confirms the influence after long-term storage, and enables complete airtightness without reducing the adhesion of the sealing material in a humid environment.

[0094] (Method of manufacturing)

[0095] Next, the method of manufacturing the electronic control device 1 according to the present embodiment will be described. Figure 9 Only the characteristic portions of the method of manufacturing the electronic control device 1 according to the present embodiment will be described. The subject of each action is, for example, a machine tool, a robot, a human, or the like. The machine such as a machine tool or a robot includes, for example, a processor, a memory, an actuator, and the like. The processor controls the actuator according to a program stored in the memory to realize a prescribed function.

[0096] The machine tool exposes the metal layer 32 from a portion of the plating layer 33 of the cover 30 (housing) by milling processing (S10: exposure process).

[0097] The human confirms the oxidation state of the exposed portion 32a by visual observation or imaging and determines the oxidation of the metal layer 32 exposed by the exposed portion 32a (S20: oxidation determination process). In the present embodiment, as a simple method, the human confirms the oxidation state (red rust) of the exposed portion 32a by visual observation or imaging, but the processor can confirm (image recognition) the oxidation state (red rust) of the exposed portion 32a from an image captured by a camera and determine the oxidation of the metal layer 32 from a correspondence table or the like of the color of the exposed portion 32a and the degree of oxidation.

[0098] The robot covers the metal layer 32 exposed by the exposed portion 32a with the sealing tape 70 (cover portion) (S30: covering process). That is, after the oxidation determination process (S20), in order to cover the metal layer 32 exposed by the exposed portion 32a, the robot adheres the sealing tape 70 as a cover portion to the cover 30 (housing).

[0099] As described above, according to the present embodiment, it is easy to confirm the oxidation state of the housing.

[0100] The present application is not limited to the above-described embodiments, and includes various modifications. For example, the above-described embodiments are detailed descriptions made for the purpose of facilitating understanding and explanation of the present application, and the present application is not necessarily limited to including all the structures described. In addition, a part of the structure of one embodiment can be replaced with the structure of another embodiment (modification), and in addition, the structure of another embodiment can be added to the structure of one embodiment. In addition, as to a part of the structure of each embodiment, addition, deletion, or replacement of another structure can be made.

[0101] In the above-described embodiments, the exposed portion 32a for confirming the oxidation state, the through-hole 30b for discharging the outgassing, the sealing tape 7 for waterproofing, and the label 80 for displaying the product information are arranged near the short side of the rectangular cover plate 30 (housing) having a hollow space, but can be arranged near the long side. However, when the cover plate 30 (housing) is deformed by internal pressure, these structural elements are preferably arranged in a portion having a small curvature (a portion away from the central portion).

[0102] The embodiments of the present application can also be in the following manner.

[0103] (1). In an electronic control device provided with a housing and a cover plate covering the housing, the cover plate includes a metal layer composed of a metal, a plating layer covering an outer surface of the metal layer, an exposed portion for exposing the metal layer from a part of the plating layer, and a cover portion covering the metal layer exposed by the exposed portion.

[0104] (2). In the electronic control device of (1), the cover portion is composed of a sealing tape.

[0105] (3). In the electronic control device of (1) or (2), the plating layer is formed of Zn, Al, or Mg.

[0106] (4). In the electronic control device of any one of (1) to (3), a chemical conversion treatment layer covering an outer surface of the plating layer is included.

[0107] (5). In the electronic control device of any one of (1) to (5), the sealing tape is configured to cover the metal layer by being attached to a surface of the chemical conversion treatment layer or the plating layer.

[0108] (6). A manufacturing method of an electronic control device including a housing, a metal layer composed of a metal, and a cover plate having a plating layer covering an outer surface of the metal layer and covering the housing, the metal layer being exposed from a part of the plating layer, and the metal layer exposed by the exposed portion being covered by a cover portion.

[0109] (7). In the electronic control device of (6), the oxidation of plating is determined by visually or image confirming the oxidation state of the processed part of the molded product after storage, and after the determination, a sealing tape is attached to the processed part.

[0110] In the above embodiment, for example, an exhaust hole for exhausting the released gas is provided on the cover plate, and the formation-treated layer and the plated layer near the exhaust hole are peeled off to the outside of the cover plate, thereby exposing the iron of the substrate. Since the thickness of the base material and the thickness of the plating have a deviation, not only the plated layer but also the surface of the base material is processed to be thin. After the iron without the oxidation film is oxidized, it becomes red, and it can be determined by visual and image, and the cover plate in which red rust does not occur after storage is put into assembly, and after the sealing adhesive is cured, the released gas is exhausted, and the cover member such as a sealing tape is attached and made airtight to plug the exhaust hole and the substrate exposure part.

[0111] In other words, the electronic control device of the present embodiment can process the base material to be thin by exposing the substrate near the exhaust hole on the outside of the cover plate, can remove the oxidation film, can confirm whether red rust is generated by visual or image before assembly, and has the advantage that the storage environment can be predicted by visual without providing a storage box such as a desiccator when stored for a long time. It functions as an indicator that grasps the temperature and humidity. In addition, the cover member such as a sealing tape is attached to plug the exhaust hole and the substrate exposure part, and corrosion of the cover plate material is prevented, and has the advantages that the environmental resistance of the engine compartment is not reduced, the sealing adhesive force is not reduced, and airtightness is achieved. Since the outside of the cover plate is processed, foreign matter such as plating dross does not fall off on the printed wiring board at the time of assembly. In addition, since it is not separated but integrated with the product unlike the known example, it has the advantage that the cost can be controlled.

[0112] Explanation of Reference Numerals

[0113] 1 Electronic control device

[0114] 10 Printed wiring board

[0115] 11 Internal space

[0116] 20 Housing

[0117] 21 Opening

[0118] 21a Protrusion

[0119] 23 Through-hole

[0120] 24 Radiating fin

[0121] 30 Cover plate

[0122] 30a Through-hole

[0123] 30b Through-hole

[0124] 31 end portion

[0125] 32 metal layer

[0126] 32a exposed portion

[0127] 32b red rust

[0128] 33 plating layer

[0129] 34 chemical conversion treatment layer

[0130] 40 sealing material

[0131] 41 sealing material

[0132] 50 screw

[0133] 51 screw

[0134] 60 connector

[0135] 61 housing

[0136] 61a concave shape

[0137] 62 housing groove

[0138] 63 terminal

[0139] 64 potting material

[0140] 70 sealing tape

[0141] 80 label

Claims

1. An electronic control device with a housing, characterized in that, The housing includes: A metal layer composed of metals; A plating layer covering the outer surface of the metal layer; The exposed portion that exposes the metal layer from a part of the plating; and A cover portion that covers the metal layer exposed at the exposed portion. The cover is attached to the housing, and the metal layer is directly exposed to the cover at the exposed portion.

2. The electronic control device as described in claim 1, characterized in that, The cover is made of a sealing strip.

3. The electronic control device as described in claim 1, characterized in that, The coating contains zinc, aluminum, or magnesium.

4. The electronic control device as described in claim 1, characterized in that, The housing includes a chemical formation layer covering the outer surface of the coating.

5. The electronic control device as described in claim 2, characterized in that, The sealing tape is configured to cover the metal layer exposed at the exposed portion by being adhered to the housing.

6. The electronic control device as described in claim 5, characterized in that, The housing includes a through hole, and the through hole and the exposed portion are covered by a sealing strip.

7. The electronic control device as described in claim 6, characterized in that, The through hole is located within the area of ​​the exposed portion.

8. The electronic control device as described in claim 6, characterized in that, The through hole is located outside the area of ​​the exposed portion.

9. The electronic control device as described in claim 8, characterized in that, The exposed portion is annular and is located around the through hole.

10. The electronic control device as claimed in claim 2, characterized in that, The housing includes a label that is affixed to the housing to cover the sealing tape.

11. A method for manufacturing an electronic control device as described in claim 1, characterized in that, include: An exposure process that exposes the metal layer from a portion of the plating layer; as well as A cover process in which the cover portion covers the metal layer exposed by the exposed portion.

12. The method for manufacturing the electronic control device as described in claim 11, characterized in that, include: An oxidation determination process is performed, in which the oxidation state of the exposed portion is confirmed visually or through images, and the oxidation of the metal layer exposed at the exposed portion is determined. The capping process is a process that, after the oxidation determination process, involves attaching a sealing tape, which serves as the cap, to the housing to cover the metal layer exposed by the exposed portion.

Images