Test method, device, electronic device, and storage medium

Abstract

The application provides a test method, a device, an electronic device and a storage medium. The test method is used for fault test and aging test of the electronic device, and the method comprises the following steps: obtaining an access state of an inducing module; when the inducing module accesses the electronic device, controlling a preset output interface of the electronic device to output a preset voltage, and controlling the electronic device to enter an aging test state; obtaining a no-load current of the electronic device in the aging test state; calculating a no-load power of the electronic device according to the no-load current and the preset voltage; if the no-load power is less than a preset power threshold, outputting a first fault type; the fault in the first fault type is a correctable fault; if the no-load power is greater than or equal to the preset power threshold, outputting a second fault type; the fault in the second fault type is an uncorrectable fault. The application can improve the efficiency of the aging test and the fault test as a whole.

Description

Technical Field

[0001] This application relates to the field of equipment testing technology, specifically to a testing method, apparatus, electronic device, and storage medium. Background Technology

[0002] To improve the quality of electronic devices, they need to be aged (burn in).

[0003] In related technologies, after aging, a separate fault test is required to detect whether the power displayed by the electronic device is faulty. This method results in a cumbersome overall testing process, reducing testing efficiency. Summary of the Invention

[0004] One objective of this application is to provide a test method, apparatus, electronic device, and storage medium designed to improve the overall efficiency of aging tests and failure tests.

[0005] According to one aspect of the embodiments of this application, a testing method is provided for performing fault testing and aging testing on electronic devices, the method comprising:

[0006] Obtain the access status of the induction module;

[0007] When the induction module is connected to the electronic device, the preset output interface of the electronic device is controlled to output a preset voltage, and the electronic device is controlled to enter the aging test state.

[0008] The no-load current of the electronic device under aging test conditions is obtained, wherein the no-load current is the current displayed by the electronic device when it is in standby mode;

[0009] Calculate the no-load power of the electronic device based on the no-load current and the preset voltage;

[0010] If the no-load power is less than a preset power threshold, then the first fault type is output; the fault in the first fault type is a correctable fault.

[0011] If the no-load power is greater than or equal to the preset power threshold, then a second fault type is output; the fault in the second fault type is an uncorrectable fault.

[0012] In one embodiment, the first fault type includes a display fault type, which is a fault type in which an abnormal zero bias current causes a deviation in the displayed power information;

[0013] The second fault type includes fault types other than the displayed fault type.

[0014] In one embodiment, after the step of outputting the first fault type, the method further includes:

[0015] When the electronic device is connected to a load, the output current of the electronic device is obtained;

[0016] The zero-bias current of the electronic device under the aging test state is collected, and the output current is corrected based on the zero-bias current to obtain the corrected current;

[0017] The output power of the electronic device is calculated and displayed based on the product of the corrected current and the preset voltage.

[0018] In one embodiment, the method further includes:

[0019] If the zero bias current is not collected, the second fault type is output.

[0020] In one embodiment, after the step of outputting the second fault type, the method further includes:

[0021] When the electronic device is connected to a load, the output current of the electronic device is obtained;

[0022] The output power of the electronic device is calculated and displayed based on the product of the output current and the preset voltage.

[0023] In one embodiment, the method further includes:

[0024] If the first fault type is output, then the first fault alarm signal is output.

[0025] If the second fault type is output, then a second fault alarm signal is output; the second fault alarm signal is different from the first fault alarm signal.

[0026] In one embodiment, the step of obtaining the access status of the induction module includes:

[0027] If the level of a preset pin of the electronic device is detected to be a preset level, it is determined that the induction module is connected to the electronic device.

[0028] According to one aspect of the embodiments of this application, a testing apparatus is provided, the testing apparatus including an induction module, a sampling module, and a control module;

[0029] The induction module is used to control the preset output interface of the electronic device to output a preset voltage when the electronic device is inserted;

[0030] The sampling module is used to sample the zero bias current and output current of the electronic device;

[0031] The control module is used to execute the above-mentioned test methods.

[0032] According to one aspect of the embodiments of this application, an electronic device is provided, including: one or more processors; and a storage device for storing one or more programs, which, when executed by the one or more processors, cause the electronic device to implement the methods provided in the various optional implementations described above.

[0033] According to one aspect of the embodiments of this application, a computer program medium is provided, on which computer-readable instructions are stored, which, when executed by a computer's processor, cause the computer to perform the methods provided in the various optional implementations described above.

[0034] According to one aspect of the embodiments of this application, a computer program product or computer program is provided, which includes computer instructions stored in a computer-readable storage medium. A processor of a computer device reads the computer instructions from the computer-readable storage medium and executes the computer instructions, causing the computer device to perform the methods provided in the various optional implementations described above.

[0035] In the technical solution provided in this application embodiment, the application obtains the access status of the induction module. When the induction module is connected to the electronic device, it controls the preset output interface of the electronic device to output a preset voltage and controls the electronic device to enter the aging test state. Thus, under the action of the induction module, the electronic device enters the aging test state, and the preset voltage output by the preset output interface of the electronic device is used for fault testing. For fault testing, the no-load current of the electronic device in the aging test state is obtained. Based on the no-load current and the preset voltage, the no-load power of the electronic device is calculated. If the no-load power is less than a preset power threshold, a first fault type is output; if the no-load power is greater than or equal to the preset power threshold, a second fault type is output. The fault in the first fault type is a correctable fault, and the fault in the second fault type is an uncorrectable fault. Therefore, when the electronic device is in the aging test state, the no-load power is calculated using the preset voltage and no-load current, and the fault type of the electronic device can be detected by comparing the no-load power with the preset power threshold. Using the above method, fault testing of the electronic device can be performed simultaneously with the aging test state test, without the need to deploy separate test procedures, thus improving the testing efficiency of aging and fault testing.

[0036] Other features and advantages of this application will become apparent from the following detailed description, or may be learned in part from practice of this application.

[0037] It should be understood that the above general description and the following detailed description are merely exemplary and do not limit this application. Attached Figure Description

[0038] The above and other objectives, features and advantages of this application will become more apparent from a detailed description of exemplary embodiments thereof with reference to the accompanying drawings.

[0039] Figure 1 A flowchart illustrating a testing method according to an embodiment of this application is shown.

[0040] Figure 2 A flowchart illustrating a testing method according to an embodiment of this application is shown.

[0041] Figure 3 A flowchart illustrating a testing method according to an embodiment of this application is shown.

[0042] Figure 4 A flowchart illustrating a testing method according to an embodiment of this application is shown.

[0043] Figure 5 A flowchart illustrating a testing method according to an embodiment of this application is shown.

[0044] Figure 6 A flowchart illustrating a testing method according to an embodiment of this application is shown.

[0045] Figure 7 A flowchart illustrating a testing method according to an embodiment of this application is shown.

[0046] Figure 8 A schematic diagram of a test apparatus according to an embodiment of this application is shown.

[0047] Figure 9 A schematic diagram of the structure of an electronic device according to an embodiment of this application is shown. Detailed Implementation

[0048] Exemplary embodiments will now be described more fully with reference to the accompanying drawings. However, these exemplary embodiments can be implemented in many forms and should not be construed as limited to the examples set forth herein; rather, they are provided to make the description of this application more comprehensive and complete, and to fully convey the concept of the exemplary embodiments to those skilled in the art. The drawings are merely illustrative of this application and are not necessarily drawn to scale. The same reference numerals in the drawings denote the same or similar parts, and therefore repeated descriptions of them will be omitted.

[0049] Furthermore, the described features, structures, or characteristics can be combined in any suitable manner in one or more exemplary embodiments. Numerous specific details are provided in the following description to give a full understanding of exemplary embodiments of this application. However, those skilled in the art will recognize that the technical solutions of this application can be practiced with one or more specific details omitted, or other methods, components, steps, etc., can be employed. In other instances, well-known structures, methods, implementations, or operations are not shown or described in detail to avoid obscuring various aspects of this application.

[0050] Some of the block diagrams shown in the accompanying drawings are functional entities and do not necessarily correspond to physically or logically independent entities. These functional entities can be implemented in software, in one or more hardware modules or integrated circuits, or in different network and / or processor devices and / or microcontroller devices.

[0051] The testing process for electronic devices includes aging tests and fault tests. Because their purposes differ, these two types of tests require separate testing environments. Aging (burn-in) involves applying environmental stress to the product using high temperatures. The purpose of aging is to continuously improve the product's manufacturing process and component quality until aging is no longer necessary. Fault testing, on the other hand, requires detecting faults in specific functions of the electronic device. This process necessitates the deployment of corresponding testing environments based on the tested function. To test whether the circuitry of the electronic device is functioning correctly, a load needs to be connected to the device, and the circuitry must be tested under this load connection. Thus, in related technologies, aging and testing are performed separately. After aging, different testing environments need to be deployed, resulting in a cumbersome process, unnecessary waste of manpower and resources, and low testing efficiency. To address this, this application proposes the following embodiments to solve the problem of cumbersome testing processes leading to low testing efficiency.

[0052] Figure 1 A flowchart illustrating a testing method according to an embodiment of this application is shown. The method includes:

[0053] Step S110: Obtain the access status of the induction module.

[0054] In this embodiment, the executing entity is an electronic device. This electronic device may be, for example, an energy storage device. The induction module is a module used to induce a preset voltage to be output from a preset output interface of the electronic device.

[0055] In one embodiment, the induction module can be detachably plugged into the electronic device. The induction module can be plugged into the input interface of the electronic device and sends a signal to the electronic device through this input interface to induce the electronic device to output a preset voltage. The induction module can be detachably connected to the electronic device, and the microcontroller unit (MCU) of the electronic device can detect whether an induction module is connected. The preset output interface is used to output the preset voltage; the preset output interface is, for example, a Type-C interface, while the induction module is connected through the input interface of the electronic device.

[0056] Step S120: When the induction module is connected to the electronic device, the preset output interface of the electronic device is controlled to output a preset voltage, and the electronic device is controlled to enter the aging test state.

[0057] Aging testing refers to applying environmental stress to electronic devices to age them, thereby continuously improving the manufacturing process and quality of the products until aging is no longer necessary. This embodiment uses an induction module to induce the electronic device into an aging test state. When the induction module is connected, the electronic device is in an aging test state; when the induction module is not connected, the electronic device is in a non-aging test state.

[0058] In one embodiment, the induction module is a separate chip. By sending an induction signal to a preset pin of a preset output interface of the electronic device, the preset output interface can be induced to output a preset voltage. When the induction module is connected to the electronic device, the electronic device receives an instruction from the induction module and determines the required output voltage based on this instruction. Under the action of the induction module, the preset output interface of the electronic device is controlled to output the preset voltage, and simultaneously, the electronic device is controlled to enter the aging test state.

[0059] Step S130: Obtain the no-load current of the electronic device under aging test conditions.

[0060] No-load current is the current displayed by an electronic device when it is in standby mode. Specifically, no-load current can be the current displayed by an electronic device when it is not connected to a load but is still in the on state.

[0061] In one embodiment, when the electronic device samples the output power, due to the sampling deviation of the MCU chip, the electronic device may sample current even when the induction module is connected but no load is connected. This current is called zero bias current. In this case, the no-load current includes the zero bias current.

[0062] In one embodiment, some components of the electronic device may malfunction, resulting in additional current deviations in the electronic device product. In this case, the no-load current also includes current errors caused by various faults.

[0063] Step S140: Calculate the no-load power of the electronic device based on the no-load current and the preset voltage.

[0064] After sampling the no-load current, the electronic device can calculate the no-load power based on the no-load current and the preset voltage. Since the no-load current includes current deviations caused by zero-bias current or other faults, it is not the actual current of the electronic device. Therefore, the calculated no-load power is actually the power generated by these deviations. If the electronic device is completely fault-free, meaning that the MCU chip has no sampling deviation and some components of the electronic device are also functioning correctly, the no-load current will not be sampled.

[0065] However, sampling errors in MCU chips are difficult to avoid. Therefore, the no-load current often includes the zero-bias current caused by the sampling error. If other faults exist in the electronic device besides the MCU chip sampling error, then the no-load current includes not only the zero-bias current caused by the sampling error but also the current deviation caused by other faults. Therefore, in both cases, the no-load current will be sampled. In practice, based on the magnitude of the no-load current, this embodiment further distinguishes whether the fault in the electronic device is a correctable fault.

[0066] In one embodiment, the preset voltage may be the maximum voltage that the preset output interface of the electronic device can output.

[0067] When an electronic device has an induction module connected but no load is connected, the no-load current may be small when the device samples it, perhaps even a weak zero-bias current. In this case, by multiplying the maximum voltage by the no-load current, a larger no-load power can be calculated, such as nW, making fault detection easier. Furthermore, after a load is connected to the electronic device, the calculated power will deviate significantly from the actual power, further facilitating fault detection.

[0068] In one embodiment, the preset output interface of the electronic device can be a Type-C interface, and the preset voltage can be a maximum voltage of 20V. During aging test conditions, the Type-C interface of the electronic device will output the maximum voltage, i.e., 20V. In non-aging test conditions, when no load is connected, the Type-C interface of the electronic device outputs 0V. If a load is connected to the Type-C interface, the electronic device will control the Type-C interface to output a different voltage, typically a lower voltage of 5V, depending on the load. The induction process is completed by an induction module. When the induction module is connected to the electronic device, it can cause a level change in the pins of the Type-C output interface, resulting in a change in its output voltage.

[0069] In one embodiment, when an induction module is connected, the electronic device is in an aging test state, simultaneously performing fault testing and aging testing. The electronic device's MCU acquires the no-load current I0 and calculates the no-load power based on it. No-load power P0 = U * I0, where P0 is the no-load power and U is the preset voltage. For example, if the acquired no-load current I0 is 0.2A and the preset voltage is the maximum voltage of 20V, then the corresponding no-load power P0 is 4W.

[0070] In step S150, if the no-load power is less than the preset power threshold, the first fault type is output.

[0071] The faults in the first fault type are correctable faults. The preset power threshold is used to indicate the threshold of no-load power under the first fault type. This threshold can be obtained by measuring and comparing the no-load power data under the first fault type and the no-load power data under the second fault type.

[0072] If the no-load power is less than the preset power threshold, it indicates that the no-load power value is relatively small. This may be due to sampling deviation. Therefore, the power output of the electronic device can be corrected using the sampling information of the MCU to obtain the actual output power of the electronic device and complete the fault correction. Thus, if the no-load power is less than the preset power threshold, the fault in the first fault type output is a correctable fault.

[0073] In step S160, if the no-load power is greater than or equal to the preset power threshold, the second fault type is output.

[0074] The second type of fault is an uncorrectable fault. When the no-load power is greater than or equal to a preset power threshold, it indicates that the no-load power value is too high. In this case, not only is there a display fault, but other faults also exist. Furthermore, because the displayed no-load power is too large, it may no longer be due to sampling error; therefore, the actual power needs to be displayed. Since this type of fault cannot be corrected using sampling information, it is classified as an uncorrectable fault in the second fault type.

[0075] By employing the above method, the access status of the induction module is obtained. When the induction module is connected to the electronic device, the preset output interface of the electronic device is controlled to output a preset voltage, and the electronic device is controlled to enter the aging test state. Simultaneously, fault testing is performed on the electronic device during the aging test state. For fault testing, the no-load current of the electronic device in the aging test state is obtained. Based on the no-load current and the preset voltage, the no-load power of the electronic device is calculated. If the no-load power is less than a preset power threshold, a first fault type is output; if the no-load power is greater than or equal to the preset power threshold, a second fault type is output. Faults in the first fault type are correctable, and faults in the second fault type are uncorrectable. Thus, when the electronic device is in the aging test state, the no-load power is calculated using the preset voltage and no-load current, and the fault type of the electronic device can be detected by comparing the no-load power with the preset power threshold. This method allows for simultaneous aging test and fault testing of the electronic device without the need for separate test procedures, improving the efficiency of both aging and fault testing.

[0076] By using the maximum output voltage of the electronic device as the preset voltage and inducing the preset output interface of the electronic device to the maximum voltage through the induction module, fault detection can be performed more easily and efficiently. Therefore, in the aging state, since the electronic device outputs the maximum voltage, it is possible to eliminate the need to build a high-voltage output test environment during the testing process. Thus, testing can be performed simultaneously with aging, improving the efficiency of aging and fault testing. For example, when the no-load current is 0.2A, in the aging test state, the preset output interface of the electronic device outputs the maximum voltage of 20V, and the calculated no-load power is relatively large, at 4W. However, in the non-aging state, the output voltage is zero, and the corresponding no-load power is also zero; while when the electronic device is under load, the output voltage is very low, for example, only 5V, and the corresponding output power is only 1W. For electronic devices, such small output power is often not effectively obtained or is ignored. Therefore, using the scheme of this application, the preset output interface outputs the maximum voltage of 20V during aging testing, which is more conducive to obtaining the no-load power and the output power of the electronic device under load.

[0077] In one embodiment, the first fault type includes a display fault type, which is a fault type in which the displayed power information is deviated due to an abnormal zero bias current, and the second fault type includes fault types other than the display fault type.

[0078] Electronic devices have a power display function, which allows personnel to check the status of the electronic device by displaying its output power. During testing, it is necessary to test whether this function is functioning correctly, that is, whether the displayed power is consistent with the actual output power. However, in the event of a malfunction, the displayed power may not reflect the actual output power, and the type of malfunction varies depending on the cause.

[0079] The fault may be caused by an abnormal zero-bias current in the electronic device, resulting in a deviation between the sampled current and the actual current. This leads to an incorrect power calculation based on the deviated current, and consequently, an incorrect power display. The corresponding fault type is a display fault. Since this type of fault can be corrected by calculation, this embodiment classifies it as the first fault type.

[0080] In addition, the fault may also be caused by the failure of other components in the circuit of the electronic device, resulting in additional current in the circuit, which makes the detected current inaccurate. In this case, the power calculated accordingly is abnormal. Since the displayed power cannot be corrected by calculation, this embodiment regards it as the second type of fault.

[0081] Using the above method, the specific fault type of electronic equipment can also be detected, further distinguishing whether the fault type is a display fault type or a fault type other than a display fault type, thus improving the richness of the fault test results and helping with subsequent fault troubleshooting.

[0082] In one embodiment, after outputting the second fault type, the method further includes: acquiring the status of a preset module in the electronic device; if a fault is detected in the preset module based on the status, then outputting information indicating that the preset module is faulty. The preset module may be, for example, a MOSFET, a POWER chip, or other component in the electronic device.

[0083] Using the above method, faulty components can be identified and located more accurately.

[0084] Figure 2 A flowchart illustrating a testing method according to an embodiment of this application is shown. The method includes:

[0085] Step S210: Obtain the access status of the induction module.

[0086] Step S220: When the induction module is connected to the electronic device, the preset output interface of the electronic device is controlled to output a preset voltage, and the electronic device is controlled to enter the aging test state.

[0087] Step S230: Obtain the no-load current of the electronic device under aging test conditions.

[0088] Step S240: Calculate the no-load power of the electronic device based on the no-load current and the preset voltage.

[0089] In step S250, if the no-load power is less than the preset power threshold, the first fault type is output.

[0090] In this embodiment, the first fault type includes the display fault type, which is a fault type in which the displayed power information is deviated due to an abnormal zero bias current.

[0091] In one embodiment, the MCU of the electronic device has a zero-bias current due to the zero-bias sampling of the chip. When the electronic device is under aging test conditions, even a small zero-bias current can lead to a large deviation in the displayed power due to the large output voltage. However, in non-aging test conditions, the output voltage is small or non-existent, thus preventing a significant deviation in the displayed power. Therefore, this can be used to detect whether the type of fault in the electronic device includes a display fault.

[0092] In one embodiment, after the step of outputting the first fault type, the method further includes: acquiring the output current of the electronic device when the electronic device is connected to a load; acquiring the zero bias current of the electronic device under aging test conditions, and correcting the output current based on the zero bias current to obtain a corrected current; calculating the output power of the electronic device based on the product of the corrected current and a preset voltage, and displaying the output power.

[0093] If the no-load power is less than a preset power threshold, it indicates that the electronic device has a zero-bias fault in current sampling. To avoid abnormal power display when a zero-bias fault exists in the electronic device, this embodiment also corrects the displayed output power of the electronic device.

[0094] Step S260: When the electronic device is connected to a load, obtain the output current of the electronic device.

[0095] The output current of an electronic device is the actual current output by the electronic device.

[0096] Step S270: Collect the zero bias current of the electronic device under aging test conditions, and correct the output current based on the zero bias current to obtain the corrected current.

[0097] In one embodiment, the output current is corrected based on the zero-bias current to obtain a corrected current, which includes subtracting the zero-bias current from the output current to obtain the corrected current. This corrects the output current.

[0098] Step S280: Calculate the output power of the electronic device based on the product of the corrected current and the preset voltage, and display the output power.

[0099] In one embodiment, the formula for calculating the corrected display power is P = U * (I1 - I0). Where I1 is the actual current sampled, U is the maximum voltage of the electronic device (e.g., 20V), and P is the power displayed by the display module of the electronic device.

[0100] When the induction module is connected to an electronic device, if no load is connected, the output voltage U of the Type-C output interface is 12V. When there is zero bias in the sampling, the power displayed by the electronic device has a large error. Therefore, the displayed power when no load is connected is P. Since no load is connected, the actual sampled current I0 = I1, and the displayed power calculated using the above formula is also 0, which matches the power value that should be displayed when no load is connected. This eliminates the influence of zero bias on the display deviation.

[0101] If a load is connected to an electronic device, the output voltage U of the Type-C output interface is the maximum 20V output voltage of the Type-C output interface. If there is a zero bias current, such as 0.1A, it will cause an error of 2W in the power displayed by the electronic device, resulting in a large error in the displayed power. In this case, the abnormal power display caused by this abnormal zero bias current can be eliminated by using the above calculation formula to avoid deviation in the displayed power.

[0102] By adopting the above method, the abnormal display power caused by zero bias can be corrected regardless of whether there is a load connected. It can also avoid the problem that it is difficult to detect display faults when the electronic device is in normal use without the induction module connected, thus making it easy to detect display faults.

[0103] In step S290, if the no-load power is greater than or equal to the preset power threshold, the second fault type is output.

[0104] The faults in the second fault type are uncorrectable faults. The second fault type includes fault types other than the displayed fault type.

[0105] For the MCU of electronic devices, the zero-bias current collected will be within a certain range. Therefore, the power error caused by the zero-bias current also has a certain range. If the no-load power exceeds a certain range, it indicates that the displayed power is incorrect and may not be caused by an abnormal zero-bias current. For example, the no-load current is generally no greater than 0.5A. Correspondingly, when the maximum output voltage of the Type-C output interface is 20V, the corresponding power is no greater than 10W. If the detected no-load power is greater than 10W, it indicates that the detected no-load current is too large, to the point that it includes current not caused by an abnormal zero-bias current, such as excessive no-load current caused by MOS damage or POWER chip malfunction. In this case, the no-load current cannot be corrected according to the zero-bias current, and the displayed power cannot be further corrected. Therefore, the output fault type at this time includes fault types other than the displayed fault type.

[0106] Using the above method, aging tests and fault tests can be performed on electronic devices simultaneously, improving the efficiency of both tests. Furthermore, it can detect and correct display faults, restoring normal display power. Additionally, it can detect faults other than display-related issues, facilitating subsequent troubleshooting.

[0107] Figure 3 A flowchart illustrating a testing method according to an embodiment of this application is shown. The method includes:

[0108] Step S310: Obtain the access status of the induction module.

[0109] Step S320: When the induction module is connected to the electronic device, the preset output interface of the electronic device is controlled to output a preset voltage, and the electronic device is controlled to enter the aging test state.

[0110] Step S330: Obtain the no-load current of the electronic device under aging test conditions.

[0111] Step S340: Calculate the no-load power of the electronic device based on the no-load current and the preset voltage.

[0112] In step S350, if the no-load power is less than the preset power threshold, the first fault type is output.

[0113] Step S360: When the electronic device is connected to a load, the output current of the electronic device is obtained.

[0114] Step S370: Collect the zero bias current of the electronic device under aging test conditions, and correct the output current based on the zero bias current to obtain the corrected current.

[0115] Step S380: Calculate the output power of the electronic device based on the product of the corrected current and the preset voltage, and display the output power.

[0116] Step S390: If the no-load power is greater than or equal to the preset power threshold, then output the second fault type.

[0117] Step S3100: If no zero bias current is collected, output the second fault type.

[0118] If no zero bias current is collected, it means that the sampling of the electronic device is accurate and there is no sampling current deviation. At this time, the type of fault in the electronic device is not the displayed fault type and cannot be corrected by calculation. Therefore, the second fault type is output to indicate that the fault in the electronic device is an uncorrectable fault.

[0119] By adopting the above method, it is possible to detect uncorrectable faults even when zero bias current is not collected, and it can adapt to the situation where the sampling current of electronic equipment has no deviation, thus making the detection results more comprehensive.

[0120] Figure 4 A flowchart illustrating a testing method according to an embodiment of this application is shown. The method includes:

[0121] Step S410: Obtain the access status of the induction module.

[0122] Step S420: When the induction module is connected to the electronic device, the preset output interface of the electronic device is controlled to output a preset voltage, and the electronic device is controlled to enter the aging test state.

[0123] Step S430: Obtain the no-load current of the electronic device under aging test conditions.

[0124] Step S440: Calculate the no-load power of the electronic device based on the no-load current and the preset voltage.

[0125] In step S450, if the no-load power is less than the preset power threshold, the first fault type is output.

[0126] In step S460, if the no-load power is greater than or equal to the preset power threshold, the second fault type is output.

[0127] Step S470: When the electronic device is connected to a load, the output current of the electronic device is obtained.

[0128] Step S480: Calculate the output power of the electronic device based on the product of the output current and the preset voltage, and display the output power.

[0129] When the fault type of the electronic device is the second fault type, since the fault is not only caused by sampling deviation, the actual power cannot be obtained by correction. At this time, the output power is calculated based on the output current detected by the electronic device and the output power is displayed to reflect the output power of the electronic device under this fault.

[0130] Using the above method, the output power of the electronic device can be displayed when the electronic device has an uncorrectable fault, so that relevant personnel can easily check the output power at this time.

[0131] Figure 5 A flowchart illustrating a testing method according to an embodiment of this application is shown. The method includes:

[0132] Step S510: Obtain the access status of the induction module.

[0133] Step S520: When the induction module is connected to the electronic device, the preset output interface of the electronic device is controlled to output a preset voltage, and the electronic device is controlled to enter the aging test state.

[0134] Step S530: Obtain the no-load current of the electronic device under aging test conditions.

[0135] Step S540: Calculate the no-load power of the electronic device based on the no-load current and the preset voltage.

[0136] In step S550, if the no-load power is less than the preset power threshold, the first fault type is output.

[0137] Step S560: If the first fault type is output, then the first fault alarm signal is output.

[0138] In step S570, if the no-load power is greater than or equal to the preset power threshold, the second fault type is output.

[0139] Step S580: If the second fault type is output, then the second fault alarm signal is output.

[0140] The second fault alarm signal is different from the first fault alarm signal.

[0141] The first fault alarm signal indicates that the electronic device has a correctable fault, while the second fault alarm signal indicates that the electronic device has an uncorrectable fault. To make the first and second fault alarm signals easier to distinguish and identify, they are different.

[0142] In one embodiment, the first fault alarm signal and the second fault alarm signal may differ in form or content. The first fault alarm signal may be an audio signal, while the second fault alarm signal may be a visual signal. Alternatively, the first fault alarm signal may contain a voice announcement stating "A correctable fault has been detected in the electronic device," while the second fault alarm signal may contain a voice announcement stating "An uncorrectable fault has been detected in the electronic device."

[0143] Using the above method, different types of faults can be easily distinguished by combining the output alarm signals.

[0144] Figure 6 A flowchart illustrating a testing method according to an embodiment of this application is shown. The method includes:

[0145] Step S610: If the level of the preset pin of the electronic device is detected to be the preset level, then it is determined that the induction module is connected to the electronic device.

[0146] Step S620: When the induction module is connected to the electronic device, the preset output interface of the electronic device is controlled to output a preset voltage, and the electronic device is controlled to enter the aging test state.

[0147] Step S630: Obtain the no-load current of the electronic device under aging test conditions.

[0148] Open-circuit current is the current displayed by an electronic device when it is in standby mode.

[0149] Step S640: Calculate the no-load power of the electronic device based on the no-load current and the preset voltage;

[0150] In step S650, if the no-load power is less than the preset power threshold, the first fault type is output.

[0151] The faults in the first fault type are correctable faults.

[0152] In step S660, if the no-load power is greater than or equal to the preset power threshold, the second fault type is output.

[0153] The second type of fault is an uncorrectable fault.

[0154] The preset pin is a pin in an electronic device used to indicate whether the induction module is connected. The preset level is the level of the preset pin when the induction module is connected to the electronic device. The preset level is, for example, a low level.

[0155] Furthermore, if the level of the preset pin of the electronic device is detected to be different from the preset level, it is determined that the induction module is not connected to the electronic device.

[0156] Using the above method, it is relatively convenient to detect the access of the induction module.

[0157] Figure 7 The diagram illustrates a test method according to an embodiment of this application, which uses an energy storage device as the execution subject and includes:

[0158] Step S710: Detect whether the energy storage device has an induction module connected.

[0159] If yes, proceed to step S720; otherwise, end the process.

[0160] In this embodiment, the induction module is used to induce the energy storage device to output its maximum voltage. When the induction module is connected to the energy storage device, the energy storage device outputs its maximum voltage and enters the aging test state.

[0161] Step S720: Obtain the no-load current and calculate the no-load power based on the no-load current and the maximum voltage.

[0162] Step S730: Detect whether the no-load power is greater than or equal to the preset power threshold.

[0163] If yes, proceed to step S740; otherwise, proceed to step S750.

[0164] Step S740: Issue other fault alarms.

[0165] Other faults refer to faults other than those displayed.

[0166] Step S750: Output indicates a display fault.

[0167] Step S760: Obtain the actual current, calculate the difference between the actual current and the no-load current, calculate the product of the difference and the maximum voltage, and obtain the corrected display power.

[0168] In this embodiment, the energy storage device is induced to enter the aging test state by the induction module, and fault testing is carried out at the same time. This improves the testing efficiency of the energy storage device, corrects existing display faults, and provides alarms for other faults.

[0169] Figure 8 A test apparatus 80 according to an embodiment of this application is shown. The test apparatus 80 includes an induction module 810, a sampling module 820, and a control module 830. The control module 830 is connected to both the induction module 810 and the sampling module 820. The induction module 810 is used to control the preset output interface of the electronic device to output a preset voltage when the electronic device is inserted. The sampling module 820 is used to sample the no-load current and output current of the electronic device. The control module 830 is used to obtain the access status of the induction module 810.

[0170] When the induction module 810 is connected to the electronic device, the control module 830 can control the preset output interface of the electronic device to output a preset voltage and control the electronic device to enter the aging test state; obtain the no-load current of the electronic device in the aging test state; calculate the no-load power of the electronic device based on the no-load current and the preset voltage; if the no-load power is less than the preset power threshold, output a first fault type; the fault in the first fault type is a correctable fault; if the no-load power is greater than or equal to the preset power threshold, output a second fault type; the fault in the second fault type is an uncorrectable fault.

[0171] Using the above method, the induction module in the test device can control the electronic device to output a preset voltage and control the electronic device to enter the aging test state. In the aging test state, the control module can use the no-load current and output current sampled by the sampling module to calculate the no-load power and determine the fault type based on the no-load power. Fault testing can be performed simultaneously with aging testing without the need to deploy different test environments, which can improve the efficiency of fault testing and aging testing.

[0172] In an exemplary embodiment of this application, the control module 830 is further configured to: acquire the output current of the electronic device when the electronic device is connected to a load; acquire the zero bias current of the electronic device under aging test conditions, and correct the output current according to the zero bias current to obtain a corrected current; calculate the output power of the electronic device according to the product of the corrected current and a preset voltage, and display the output power.

[0173] Using the above method, the correct power can be displayed, and the display fault can be repaired automatically.

[0174] In an exemplary embodiment of this application, the control module 830 is further configured to output a second fault type when no zero bias current is detected.

[0175] Using the above method, the fault type can be detected when zero bias current is not collected, thus improving the applicability of fault testing.

[0176] In an exemplary embodiment of this application, the control module 830 is further configured to acquire the output current of the electronic device when the electronic device is connected to a load; calculate the output power of the electronic device based on the product of the output current and a preset voltage, and display the output power.

[0177] Using the above method, the output power of the electronic device can be displayed when the electronic device has an uncorrectable fault, so that relevant personnel can easily check the output power at this time.

[0178] In an exemplary embodiment of this application, the control module 830 is further configured to output a first fault alarm signal if a first fault type is output, and to output a second fault alarm signal if a second fault type is output, wherein the second fault alarm signal is different from the first fault alarm signal.

[0179] Using the above method, different types of faults can be easily distinguished by combining the output alarm signals.

[0180] In an exemplary embodiment of this application, the control module 830 is further configured to determine that the induction module 810 is connected to the electronic device if the level of a preset pin of the electronic device is detected to be a preset level.

[0181] Using the above method, it is relatively convenient to detect the access of the induction module.

[0182] The following is for reference. Figure 9 To describe an electronic device 90 according to an embodiment of this application. Figure 9 The electronic device 90 shown is merely an example and should not impose any limitations on the functionality and scope of use of the embodiments of this application.

[0183] like Figure 9 As shown, the electronic device 90 is presented in the form of a general-purpose computing device. The components of the electronic device 90 may include, but are not limited to: at least one processing unit 910, at least one storage unit 920, and a bus 930 connecting different system components (including the storage unit 920 and the processing unit 910).

[0184] The storage unit stores program code, which can be executed by the processing unit 910, causing the processing unit 910 to perform the steps described in the explanatory section of the exemplary methods described above, according to various exemplary embodiments of this application. For example, the processing unit 910 can perform, as follows: Figure 1 The steps shown are as follows.

[0185] Storage unit 920 may include readable media in the form of volatile storage units, such as random access memory (RAM) 9201 and / or cache memory 9202, and may further include read-only memory (ROM) 9203.

[0186] Storage unit 920 may also include a program / utility 9204 having a set (at least one) program module 9205, such program module 9205 including but not limited to: operating system, one or more application programs, other program modules and program data, each or some combination of these examples may include an implementation of a network environment.

[0187] Bus 930 can represent one or more of several types of bus structures, including a memory cell bus or memory cell controller, a peripheral bus, a graphics acceleration port, a processing unit, or a local bus using any of the various bus structures.

[0188] Electronic device 90 can also communicate with one or more external devices 1000 (e.g., keyboard, pointing device, Bluetooth device, etc.), and with one or more devices that enable a user to interact with electronic device 90, and / or with any device that enables electronic device 90 to communicate with one or more other computing devices (e.g., router, modem, etc.). This communication can be performed via input / output (I / O) interface 950. Input / output (I / O) interface 990 is connected to display unit 940. Furthermore, electronic device 90 can also communicate with one or more networks (e.g., local area network (LAN), wide area network (WAN), and / or public networks, such as the Internet) via network adapter 960. As shown, network adapter 960 communicates with other modules of electronic device 90 via bus 950.

[0189] In one embodiment, the external device is a guidance module.

[0190] It should be understood that, although not shown in the figure, other hardware and / or software modules may be used in conjunction with electronic device 90, including but not limited to: microcode, device drivers, redundant processing units, external disk drive arrays, RAID systems, tape drives, and data backup storage systems.

[0191] Through the above description of the embodiments, those skilled in the art will readily understand that the exemplary embodiments described herein can be implemented by software or by combining software with necessary hardware. Therefore, the technical solutions according to the embodiments of this application can be embodied in the form of a software product, which can be stored in a non-volatile storage medium (such as a CD-ROM, USB flash drive, portable hard drive, etc.) or on a network, including several instructions to cause an electronic device (such as an energy storage device, etc.) to execute the method according to the embodiments of this application.

[0192] In an exemplary embodiment of this application, a computer-readable storage medium is also provided, on which computer-readable instructions are stored, which, when executed by a computer's processor, cause the computer to perform the methods described in the above method embodiments.

[0193] According to one embodiment of this application, a program product for implementing the methods in the above-described method embodiments is also provided. This program product may employ a portable compact disc read-only memory (CD-ROM) and include program code, and may run on a terminal device, such as a personal computer. However, the program product of this application is not limited thereto. In this document, a readable storage medium may be any tangible medium containing or storing a program that may be used by or in conjunction with an instruction execution system, apparatus, or device.

[0194] The program product may employ any combination of one or more readable media. A readable medium may be a readable signal medium or a readable storage medium. A readable storage medium may be, for example, but not limited to, an electrical, magnetic, optical, electromagnetic, infrared, or semiconductor system, apparatus, or device, or any combination thereof. More specific examples (a non-exhaustive list) of readable storage media include: electrical connections having one or more wires, portable disks, hard disks, random access memory (RAM), read-only memory (ROM), erasable programmable read-only memory (EPROM or flash memory), optical fiber, portable compact disk read-only memory (CD-ROM), optical storage devices, magnetic storage devices, or any suitable combination thereof.

[0195] Computer-readable signal media may include data signals propagated in baseband or as part of a carrier wave, carrying readable program code. Such propagated data signals may take various forms, including but not limited to electromagnetic signals, optical signals, or any suitable combination thereof. A readable signal medium may also be any readable medium other than a readable storage medium, capable of sending, propagating, or transmitting programs for use by or in conjunction with an instruction execution system, apparatus, or device.

[0196] The program code contained on the readable medium may be transmitted using any suitable medium, including but not limited to wireless, wired, optical fiber, RF, etc., or any suitable combination thereof.

[0197] Program code for performing the operations of this application can be written in any combination of one or more programming languages, including object-oriented programming languages ​​such as JAVA and C++, and conventional procedural programming languages ​​such as C or similar languages. The program code can execute entirely on the user's computing device, partially on the user's computing device, as a standalone software package, partially on the user's computing device and partially on a remote computing device, or entirely on a remote computing device or server. In cases involving remote computing devices, the remote computing device can be connected to the user's computing device via any type of network, including a local area network (LAN) or a wide area network (WAN), or it can be connected to an external computing device (e.g., via the Internet using an Internet service provider).

[0198] It should be noted that although several modules or units for the device used to perform actions have been mentioned in the detailed description above, this division is not mandatory. In fact, according to the embodiments of this application, the features and functions of two or more modules or units described above can be embodied in one module or unit. Conversely, the features and functions of one module or unit described above can be further divided and embodied by multiple modules or units.

[0199] Furthermore, although the steps of the method in this application are described in a specific order in the accompanying drawings, this does not require or imply that the steps must be performed in that specific order, or that all the steps shown must be performed to achieve the desired result. Additional or alternative steps may be omitted, multiple steps may be combined into one step, and / or a step may be broken down into multiple steps.

[0200] Through the above description of the embodiments, those skilled in the art will readily understand that the exemplary embodiments described herein can be implemented by software or by combining software with necessary hardware. Therefore, the technical solutions according to the embodiments of this application can be embodied in the form of a software product, which can be stored in a non-volatile storage medium (such as a CD-ROM, USB flash drive, portable hard drive, etc.) or on a network, including several instructions to cause an electronic device (such as an energy storage device, etc.) to execute the method according to the embodiments of this application.

[0201] Other embodiments of this application will readily occur to those skilled in the art upon consideration of the specification and practice of the invention disclosed herein. This application is intended to cover any variations, uses, or adaptations of this application that follow the general principles of this application and include common knowledge or customary techniques in the art not disclosed herein. The specification and examples are to be considered exemplary only, and the true scope and spirit of this application are indicated by the appended claims.

Claims

1. A testing method, characterized in that, The method for performing fault testing and aging testing on electronic devices includes: Obtain the access status of the induction module; the induction module is a module used to induce the preset output interface of the electronic device to output a preset voltage; When the induction module is connected to the electronic device, the preset output interface of the electronic device is controlled to output a preset voltage, and the electronic device is controlled to enter the aging test state. Obtain the no-load current of the electronic device under aging test conditions. The no-load current is the current displayed by the electronic device when it is turned on but not connected to a load. Calculate the no-load power of the electronic device based on the no-load current and the preset voltage; If the no-load power is less than a preset power threshold, a first fault type is output; the fault in the first fault type is a correctable fault; the first fault type includes a display fault type, which is a fault type in which the power information is deviated due to an abnormal zero bias current; wherein, the zero bias current is the current sampled by the electronic device when it is connected to the induction module but no load is connected. After outputting the first fault type, when the electronic device is connected to a load, the output current of the electronic device is acquired; the zero bias current of the electronic device under the aging test state is collected, and the output current is corrected according to the zero bias current to obtain the corrected current; the output power of the electronic device is calculated and displayed according to the product of the corrected current and the preset voltage. If the no-load power is greater than or equal to the preset power threshold, then a second fault type is output; the fault in the second fault type is an uncorrectable fault.

2. The method according to claim 1, characterized in that, The second fault type includes fault types other than the displayed fault type.

3. The method according to claim 1, characterized in that, The method further includes: If the zero bias current is not collected, the second fault type is output.

4. The method according to claim 1, characterized in that, After the step of outputting the second fault type, the method further includes: When the electronic device is connected to a load, the output current of the electronic device is obtained; The output power of the electronic device is calculated and displayed based on the product of the output current and the preset voltage.

5. The method according to claim 1, characterized in that, The method further includes: If the first fault type is output, then the first fault alarm signal is output. If the second fault type is output, then a second fault alarm signal is output; the second fault alarm signal is different from the first fault alarm signal.

6. The method according to claim 1, characterized in that, The steps for obtaining the access status of the induction module include: If the level of a preset pin of the electronic device is detected to be a preset level, it is determined that the induction module is connected to the electronic device.

7. A testing apparatus, characterized in that, The testing device includes an induction module, a sampling module, and a control module; The induction module is used to control the preset output interface of the electronic device to output a preset voltage when the electronic device is inserted; The sampling module is used to sample the no-load current and output current of the electronic device; The control module is used to execute the test method as described in any one of claims 1 to 6.

8. An electronic device, characterized in that, include: One or more processors; A storage device for storing one or more programs, which, when executed by one or more processors, cause the electronic device to perform the method as described in any one of claims 1 to 6.

9. A computer-readable storage medium, characterized in that, It stores computer-readable instructions that, when executed by the computer's processor, cause the computer to perform the method of any one of claims 1 to 6.

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