Internal circulation heat dissipation structure for closed LCD optical system and LCD projector

Abstract

This invention provides an internal circulation heat dissipation structure for a sealed LCD optical system and an LCD projector, belonging to the field of heat dissipation technology. It includes: a main body, a chip disposed inside the main body, a wind guide plate and heat dissipation mechanism I, a heat dissipation mechanism II disposed on a first side of the main body, and a heat dissipation mechanism III disposed on a second side of the main body. The first and second sides are opposite each other, and the wind guide plate is located below the chip, forming a wind channel between them. Heat dissipation mechanism I includes a wind guide bracket, an internal circulation heat dissipation fan, and a fan pressure plate. The internal circulation heat dissipation fan is fixed to the fan pressure plate and disposed inside the wind guide bracket. The upper edge of the wind guide bracket bends and extends to the side of the chip, forming an air outlet channel between the upper edge of the wind guide bracket and the upper edge of the fan pressure plate, and the air outlet channel communicates with the wind guide channel. This internal circulation heat dissipation structure of the present invention, while preventing dust, makes chip heat dissipation more uniform and improves the heat dissipation effect.

Description

Technical Field

[0001] This invention belongs to the field of heat dissipation structure technology, specifically relating to an internal circulation heat dissipation structure for a sealed LCD optical system and an LCD projector. Background Technology

[0002] With the continuous development of technology and the advancement of projection technology, projectors have been widely used in conferences, teaching, and entertainment venues. As the application of projectors becomes more widespread and their usage frequency increases, higher requirements are being placed on the heat dissipation of projectors.

[0003] Existing single LCD projectors typically use cooling fans for heat dissipation, which results in uneven heat dissipation of the large-size LCD optical system, poor heat dissipation effect, heat accumulation, localized heating during use, and ultimately reduced light efficiency and shortened lifespan.

[0004] In the prior art, patent document CN101986202A provides a liquid cooling system for an LCD projector, including an optical body and a sealing body that seals the optical body and conducts heat generated by the optical body. The sealing body includes a sealing box, a heat conduction device, and a liquid cooling device connected to the heat conduction device. The liquid cooling device includes a liquid cooler, a coolant pump, and cooling pipes connecting the liquid cooler and the coolant pump. The liquid cooling system for the LCD projector lowers the temperature of the optical body to the optimal operating temperature of the LCD projector through the combined heat dissipation effect of the heat conduction device and the liquid cooling device. Furthermore, the sealing box houses the optical body and has good sealing properties, further preventing dust and dirt from contaminating the optical body, achieving both dust prevention and temperature reduction. However, water-cooled radiators are more complex, and due to the cooling medium, there is a certain risk of leakage, and the overall cost is higher than other cooling methods.

[0005] For example, patent document CN114839830A discloses an internal and external air exchange heat circulation system for a single-chip LCD projector, comprising: a housing, wherein a projection device and a heat circulation device are disposed within the housing, and both the projection device and the heat circulation device are electrically connected to a controller; wherein the heat circulation device comprises: a first air chamber, which is disposed within the housing and located on the side of the first projection chamber away from the second projection chamber, and a blower is disposed within the first air chamber and electrically connected to the controller; a second air chamber, which is disposed within the housing and located between the first projection chamber and the second projection chamber; a first flow channel, and a second air chamber. A first flow channel is located between the rear focal length lens and the LCD screen, and the first flow channel communicates with the second air chamber; a second flow channel is located between the front focal length lens and the LCD screen, and the second flow channel communicates with the second air chamber; a first air pipe is connected at one end to the air outlet of the blower, and the first air pipe communicates with the first flow channel; a second air pipe is connected at one end to the second flow channel, and the other end of the second air pipe communicates with the first air chamber; a heat exchange radiator is connected on one side to the side wall of the second air pipe, and the other end of the heat exchange radiator passes through the housing. This technology dissipates the heat generated by the projection device within a sealed housing through a heat circulation device, avoiding dust entering the projector's interior due to the need for ventilation and heat dissipation, and solving the problem of requiring regular dust removal and maintenance. However, in this technology, the high-heat gas flow and dissipation path is singular, resulting in unsatisfactory heat dissipation.

[0006] In view of this, the present invention is hereby proposed. Summary of the Invention

[0007] The technical problem to be solved by the present invention is to provide an internal circulation heat dissipation structure for a sealed LCD optical system, which, in order to address the shortcomings of the prior art, makes the heat dissipation of the chip more uniform and improves the heat dissipation effect while preventing dust.

[0008] To solve the above-mentioned technical problems, the technical solution adopted by the present invention is as follows:

[0009] An internal circulation heat dissipation structure for a sealed LCD optical system includes:

[0010] The main body, a chip disposed inside the main body, a heat dissipation plate and heat dissipation mechanism I, a heat dissipation mechanism II disposed on a first side of the main body, and a heat dissipation mechanism III disposed on a second side of the main body, wherein the first side and the second side are opposite to each other.

[0011] The air guide plate is located below the chip, forming an air guide channel between them.

[0012] The heat dissipation mechanism I includes an air guide bracket, an internal circulation cooling fan, and a fan pressure plate. The internal circulation cooling fan is fixed to the fan pressure plate and is disposed inside the air guide bracket.

[0013] The upper edge of the air guide bracket bends and extends to the side of the chip.

[0014] An air outlet channel is formed between the upper edge of the air guide bracket and the upper edge of the fan pressure plate.

[0015] The air outlet channel is connected to the air guide channel.

[0016] Preferably, both the air guide bracket and the fan pressure plate have air inlets, and the air inlets are connected to the space below the air guide plate.

[0017] Preferably, the heat dissipation mechanism I is inclined relative to the second side of the main body, with an inclination angle of 4-15°.

[0018] Preferably, the fan pressure plate and the internal circulation cooling fan are inclined relative to the upper edge of the air guide bracket, with an inclination angle of 4-15°.

[0019] Preferably, the air guide plate is arranged parallel to the chip, and the flow cross section between them is approximately equal to the area between the upper edge of the air guide bracket and the upper edge of the fan pressure plate.

[0020] Preferably, the air guide plate is connected to at least the first side of the main body, and the connection point is located below the heat dissipation mechanism II. The height of the heat dissipation channel formed by the heat dissipation mechanism II is greater than the distance between the air guide plate and the chip on the side closer to the heat dissipation mechanism II.

[0021] Preferably, the heat dissipation mechanism II includes heat dissipation fins, the outer side of which is rectangular and the inner side is an outwardly convex arc shape. The heat dissipation fins are of the same size and are arranged at equal intervals along the width direction of the heat dissipation channel formed by the heat dissipation mechanism II.

[0022] Preferably, the heat dissipation mechanism III includes a heat dissipation fin assembly, and an external heat dissipation fan is provided on the outer side of the heat dissipation fin assembly.

[0023] Preferably, the heat dissipation fin assembly includes rectangular heat dissipation fins, which are of the same size and are arranged at equal intervals along the height direction of the heat dissipation channel formed by the heat dissipation mechanism III.

[0024] Preferably, the heat dissipation fin assembly further includes arc-shaped heat dissipation fins located inside the rectangular heat dissipation fins. The arc-shaped heat dissipation fins are of the same size and are arranged at equal intervals along the width direction of the heat dissipation channel formed by the heat dissipation mechanism III.

[0025] Preferably, the inner surface of the rectangular heat dissipation fin is adapted to the outer surface of the arc-shaped heat dissipation fin, the inner surface of the arc-shaped heat dissipation fin has at least one concave surface, and the tangent of the highest point of the upper edge of the air guide bracket passes through the center of the concave surface.

[0026] The present invention also provides an LCD projector, including the above-described internal circulation heat dissipation structure.

[0027] A projector, also known as a projector, is a device that projects images or flat surfaces onto a screen. It can be connected to various interfaces to play corresponding video signals. Projectors are widely used in offices, homes, schools, and entertainment venues. Depending on their operating method, projectors are divided into different models such as CRT, LCD, and OLP. During the use of a projector, the DMD chip, as a key internal component, plays a crucial role in its operation.

[0028] With the rapid development of projector technology, electronic devices are evolving towards integration, miniaturization, and high power. Therefore, how to effectively and reasonably dissipate heat from these high-power devices to improve their reliability is a key research focus in projector thermal design. Statistics show that electronic device failures often occur due to prolonged operation under overheating conditions. As the operating frequencies of various electronic components increase and their package sizes decrease, heat flux density continues to rise. If this heat cannot be quickly transferred to the environment through appropriate channels, the component temperature will become excessively high, affecting performance in mild cases and potentially causing component damage in severe cases.

[0029] During the use of projectors, traditional chip heat dissipation only uses heat sinks for conduction heat dissipation, which has poor heat dissipation effect and affects its service life. At the same time, it is impossible to remove dust from the chip surface during the heat dissipation process, resulting in dust accumulation, which can easily damage the chip and affect its heat dissipation and operation.

[0030] Currently, there are many methods for heat dissipation in projectors, mainly including water cooling, semiconductor cooling, and air cooling. Water cooling uses a water pump to transfer heat from a liquid cooler to the environment through pipes, thus achieving heat dissipation. This method reduces the number of fans, thereby reducing vibration and noise. Furthermore, due to the high specific heat capacity of water, water cooling is significantly more effective than air cooling. For example, patent document CN101986202A discloses a liquid cooling system for an LCD projector, and patent document CN115373201A discloses an indirect liquid-cooled sealed optical engine for an LCD projector. However, compared to air cooling, water coolers are more complex, and due to the cooling medium, there is a certain risk of leakage; the overall cost is also higher than other cooling methods. Semiconductor cooling utilizes the Peltier effect, a physical phenomenon, where heat is directly transferred between electrons (holes) during their movement. The advantages of this cooling method are its compact structure and quiet operation; the refrigerant has no mechanical parts, no vibration, and a long lifespan; the cooling capacity and cooling speed can be adjusted by changing the current. For example, the sealed LCD projection optical engine with liquid cooling heat dissipation provided in patent document CN114384746A has the disadvantages of low efficiency, high cost, immature process, and susceptibility to short circuits due to condensation on the CPU caused by excessively low temperatures.

[0031] Air cooling is currently the primary method for heat dissipation in projectors. Its principle involves conducting heat through heat sinks, then using a fan to enhance airflow and transfer the heat from the heat sink to the surrounding environment through forced convection. Air cooling relies on air as the heat transfer medium, resulting in low thermal efficiency. To enhance heat exchange, powerful fans generate noise. To improve heat dissipation, methods include increasing the heat dissipation area of ​​the heat sink; increasing airflow speed and improving airflow organization; increasing the convective heat transfer coefficient through convection or boiling heat transfer; and using low-temperature airflow or directly applying a cooling system to achieve a larger temperature difference. However, metal heat sinks relying solely on conduction and convection—the two conventional heat transfer principles—are gradually approaching their heat transfer limit as the heat flux density on the chip surface increases. Therefore, when using air cooling, a comprehensive consideration of the product's actual structure and airflow distribution is necessary. A single cooling method or an inappropriate airflow design will lead to decreased heat dissipation performance, failing to achieve ideal cooling results and affecting the lifespan of electronic components in the product.

[0032] For large-size LCD optical systems, the chip has little space for heat dissipation, heat accumulates more quickly, and localized overheating is likely to occur during use. Therefore, it is very important to design a heat dissipation structure with higher heat dissipation performance.

[0033] Compared with the prior art, the beneficial effects of the present invention are as follows:

[0034] The present invention provides an internal circulation heat dissipation structure for a sealed LCD optical system through the above technical solution, which makes the chip heat dissipation more uniform and improves the heat dissipation effect while preventing dust.

[0035] This invention incorporates an air guide plate and a heat dissipation mechanism I within the main body. The air guide plate is positioned below the chip, forming an airflow channel between them. The heat dissipation mechanism I includes an air guide bracket, an internal circulation cooling fan, and a fan pressure plate. The upper edge of the air guide bracket bends and extends to the side of the chip, forming an air outlet channel between the upper edge of the air guide bracket and the upper edge of the fan pressure plate. The air outlet channel communicates with the air guide channel, altering the flow path of heat emitted from the chip and allowing for more efficient heat dissipation. Furthermore, the air guide plate divides the internal space of the main body, facilitating the formation of relatively cooler air below it and preventing dust from being drawn in by the heat dissipation mechanism II, thus providing a dustproof effect. When the internal circulation cooling fan is operating, this cooler air below the air guide plate enters through the fan and flows through the air outlet channel into the air guide channel. This not only quickly removes heat from the air guide channel but also generates more efficient heat exchange, causing the chip temperature to drop even lower in a short time, resulting in higher cooling efficiency.

[0036] This invention provides a heat dissipation mechanism II on a first side of the main body and a heat dissipation mechanism III on a second side of the main body, with the first and second sides facing each other. Heat dissipation mechanisms II and III are connected above the chip, allowing heat dissipated from the chip to the upper space to be dissipated / exhausted to the outside through heat dissipation mechanism II on the first side and / or heat dissipation mechanism III on the second side. Simultaneously, a heat dissipation mechanism I is provided inside the main body, with an air outlet channel connected to an air guide channel. When the internal circulation cooling fan is working, its exhaust air flows out from the air outlet channel and through the air guide channel, carrying away the heat dissipated from the chip. This allows the heat to be dissipated to the outside through heat dissipation mechanism II and / or heat dissipation mechanism III, thereby specifically improving the internal gas circulation of the product and ensuring that the circulating gas effectively facilitates rapid heat dissipation.

[0037] Through the interconnection and cooperation of the above components, the heat generated inside the chip can be dissipated to the outside more effectively and quickly through the combination of internal and external circulation. At the same time, the structural design of heat dissipation mechanism II and heat dissipation mechanism III makes their effective heat dissipation surface area large and their heat dissipation performance better, thereby improving the heat dissipation efficiency of the chip, helping to improve the service life of electronic components, and also having a dustproof effect. Attached Figure Description

[0038] To more clearly illustrate the technical solutions in the embodiments of the present invention or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0039] Figure 1 : A three-dimensional structural diagram of the internal circulation heat dissipation structure for a sealed LCD optical system according to the present invention;

[0040] Figure 2 This invention Figure 1 The left view;

[0041] Figure 3 This invention Figure 1 The right view;

[0042] Figure 4 This invention Figure 1 The front view;

[0043] Figure 5 This invention Figure 1 Schematic diagram of the heat dissipation mechanism I;

[0044] Figure 6 : A schematic diagram of the structure of the rectangular heat dissipation fins and the arc-shaped heat dissipation fins in the heat dissipation mechanism III of the present invention;

[0045] Among them, 1-main body, 101-first side, 102-second side, 2-chip, 3-air guide plate, 4-air guide channel, 5-air guide bracket, 6-fan pressure plate, 7-air outlet channel, 8-heat dissipation mechanism II, 9-heat dissipation mechanism III, 10-heat dissipation fins, 11-external heat dissipation fan, 12-rectangular heat dissipation fins, 13-arc heat dissipation fins, 14-concave surface. Detailed Implementation

[0046] To better understand the present invention, the following embodiments further illustrate the content of the invention, but the scope of protection of the present invention is not limited to the following embodiments. Numerous specific details are set forth in the following description to provide a more thorough understanding of the invention. However, it will be apparent to those skilled in the art that the present invention can be practiced without one or more of these details.

[0047] Unless otherwise specifically stated, the relative arrangement, numerical expressions, and values ​​of the components and steps described in these embodiments do not limit the scope of the invention. It should also be understood that, for ease of description, the dimensions of the various parts shown in the accompanying drawings are not drawn to actual scale. Techniques, methods, and apparatus known to those skilled in the art may not be discussed in detail, but where appropriate, such techniques, methods, and apparatus should be considered part of the specification.

[0048] In all examples shown and discussed herein, any specific values ​​should be interpreted as merely exemplary and not as limitations. Therefore, other examples of exemplary embodiments may have different values.

[0049] In the description of this invention, it should be understood that the orientation or positional relationship indicated by directional terms such as "front, back, up, down, left, right", "horizontal, vertical, horizontal" and "top, bottom" is generally based on the orientation or positional relationship shown in the accompanying drawings, and is only for the convenience of describing this invention and simplifying the description. Unless otherwise stated, these directional terms do not indicate or imply that the device or element referred to must have a specific orientation or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation on the scope of protection of this invention; the directional terms "inner" and "outer" refer to the inner and outer contours relative to the outline of each component itself.

[0050] For ease of description, spatial relative terms such as "above," "on top of," "on the upper surface of," "above," etc., are used herein to describe the spatial positional relationship of a device or feature as shown in the figures to other devices or features. It should be understood that spatial relative terms are intended to encompass different orientations in use or operation beyond the orientation of the device as described in the figures. For example, if the device in the figures were inverted, a device described as "above" or "on top of" other devices or structures would subsequently be positioned as "below" or "under" other devices or structures. Thus, the exemplary term "above" can include both "above" and "below." The device may also be positioned in other different ways (rotated 90 degrees or in other orientations), and the spatial relative descriptions used herein will be interpreted accordingly.

[0051] Furthermore, it should be noted that the use of terms such as "first" and "second" to define components is merely for the purpose of distinguishing the corresponding components. Unless otherwise stated, the above terms have no special meaning and therefore should not be construed as limiting the scope of protection of this invention.

[0052] Embodiments of the present invention are described in detail below. Examples of these embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals denote the same or similar elements or elements having the same or similar functions throughout. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain the present invention, and should not be construed as limiting the present invention.

[0053] like Figure 1 As shown, the internal circulation heat dissipation structure for a sealed LCD optical system includes: a main body 1, a chip 2 disposed inside the main body 1, a wind guide plate 3 and a heat dissipation mechanism I, a heat dissipation mechanism II 8 disposed on a first side 101 of the main body 1 and a heat dissipation mechanism III 9 disposed on a second side 102 of the main body 1. The first side 101 and the second side 102 are opposite to each other. The wind guide plate 3 is disposed below the chip 2, and a wind channel 4 is formed between the two. The heat dissipation mechanism I includes a wind guide bracket 5, an internal circulation heat dissipation fan (not shown) and a fan pressure plate 6. The internal circulation heat dissipation fan is fixed on the fan pressure plate 6 and disposed inside the wind guide bracket 5. The upper edge of the wind guide bracket 5 bends and extends to the side of the chip 2. An air outlet channel 7 is formed between the upper edge of the wind guide bracket 5 and the upper edge of the fan pressure plate 6. The air outlet channel 7 is connected to the wind channel 4.

[0054] In this invention, the main body 1 refers to the main structure of the sealed LCD optical system, which is an improved main body of the internal circulation heat dissipation structure of this invention; this invention improves the heat dissipation structure based on the main body structure of the product without changing the structure of the main body 1 itself.

[0055] Chip 2 refers to chip 2 in a closed-loop LCD optical system, meaning that chip 2 accounts for a relatively large proportion of the main body volume. Of course, it is not limited to chip 2 in a closed-loop LCD optical system. This invention does not involve structural improvements to chip 2.

[0056] The air guide plate 3 is preferably a plate-shaped structure, which is positioned below the chip 2, forming an air guide channel 4 between it and the chip 2. This alters the heat dissipation path, allowing the heat from the chip 2 to dissipate more effectively. Furthermore, the air guide plate 3 divides the internal space of the main body 1, facilitating the formation of relatively cooler air below it and preventing dust from being drawn in by the heat dissipation mechanism II 8, thus providing a dustproof effect. When the internal circulation cooling fan is operating, this cooler air below the air guide plate 3 enters through the fan and flows through the air guide channel 4 via the exhaust channel 7. This not only quickly removes heat from the air guide channel 4 but also generates more efficient heat exchange, causing the temperature of the chip 2 to drop even lower in a short time, resulting in higher cooling efficiency.

[0057] The present invention provides a heat dissipation mechanism II8 on the first side 101 of the main body 1 and a heat dissipation mechanism III9 on the second side 102 of the main body 1, with the first side 101 and the second side 102 facing each other. The heat dissipation mechanism II8 and the heat dissipation mechanism III9 are connected in the space above the chip 2, so that the heat dissipated by the chip 2 to the space above can be dissipated / released to the outside through the heat dissipation mechanism II8 on the first side 101 and / or the heat dissipation mechanism III9 on the second side 102.

[0058] The present invention also provides a heat dissipation mechanism I inside the main body 1. The air outlet channel 7 of the heat dissipation mechanism I is connected to the air guide channel 4. When the internal circulation heat dissipation fan is working, its air flows out from the air outlet channel 7 and passes through the air guide channel 4, carrying away the heat emitted by the chip 2. The heat is then dissipated to the outside through the heat dissipation mechanism II 8 and / or the heat dissipation mechanism III 9, thereby specifically improving the gas circulation inside the product and making the circulating gas fully assist in the rapid dissipation of heat.

[0059] Through the interconnection and cooperation of the above components, the heat generated by the chip 2 inside the main body 1 can be dissipated to the outside more effectively and quickly through the combination of internal and external circulation, thereby improving the heat dissipation efficiency of the chip 2, extending the service life of the product, and also providing a dustproof effect.

[0060] like Figure 1 As shown, in some specific embodiments, both the air guide bracket 5 and the fan pressure plate 6 have air inlets, which are connected to the space below the air guide plate 3. Due to the spatial separation of the air guide plate 3, the space below the air guide plate 3 is isolated from the chip 2, and the air temperature in the space below is lower. Thus, the air enters the internal circulation cooling fan and flows through the air guide channel 4 after exiting the air outlet channel 7, carrying away the heat emitted by the chip 2 and exchanging heat with it, causing the temperature of the chip 2 to drop more quickly.

[0061] In some specific embodiments, the air inlet on the air guide bracket 5 is opposite to a portion of the lower part of the heat dissipation channel formed by the heat dissipation mechanism Ⅲ9. This can enhance the air circulation in the space below the air guide plate 3; and when the external heat dissipation fan 11 of the heat dissipation mechanism Ⅲ9 is not turned on, the internal circulation heat dissipation fan can also draw air from below the heat dissipation mechanism Ⅲ9, so that the air inside and outside the main body 1 can circulate.

[0062] like Figure 4 As shown, in some specific embodiments, the heat dissipation mechanism I is inclined relative to the second side 102 of the main body 1, and the inclination angle α is 4-15°.

[0063] For example, the tilt angle α can be any value within the range mentioned above, and is not limited to 4°, 5°, 7°, 10°, 12° or 15°.

[0064] Based on the above technical solution, the increased space on the lower right side of the heat dissipation mechanism I is beneficial to improving the air intake efficiency of the internal circulation heat dissipation fan and the air circulation efficiency of the space below the air guide plate 3.

[0065] like Figure 5 As shown, in some specific embodiments, the fan pressure plate 6 and the internal circulation cooling fan are inclined relative to the upper edge of the air guide bracket 5, and the inclination angle β is 4-15°.

[0066] For example, the tilt angle β can be any value within the range mentioned above, and is not limited to 4°, 5°, 7°, 10°, 12° or 15°.

[0067] Based on the above technical solution, the air outlet channel 7 of the heat dissipation mechanism I has different widths and different air outlet speeds, which can further promote the convection circulation between air and improve the heat dissipation efficiency of chip 2.

[0068] like Figure 1 and Figure 4 As shown, in some specific embodiments, the air guide plate 3 and the chip 2 are arranged in parallel, and the flow cross section between them is approximately equal to the area between the upper edge of the air guide bracket 5 and the upper edge of the fan pressure plate 6.

[0069] Based on the above technical solution, the air outlet of the heat dissipation mechanism I can flow out more smoothly and quickly from the air guide channel 4, carrying away the heat of the chip 2; at the same time, since the fan pressure plate 6 and the internal circulation heat dissipation fan are inclined relative to the upper edge of the air guide bracket 5, the upper edge of the air guide bracket 5 and the upper edge of the fan pressure plate 6 are approximately trapezoidal. The area of ​​this trapezoid is approximately equal to the flow cross-sectional area between the air guide plate 3 and the chip 2, so as to accelerate the smooth flow of air.

[0070] like Figure 4 As shown, in some specific embodiments, the air guide plate 3 is at least connected to the first side 101 of the main body 1, and the connection is located below the heat dissipation mechanism II8. The height of the heat dissipation channel formed by the heat dissipation mechanism II8 is greater than the distance between the air guide plate 3 and the chip 2 on the side closer to the heat dissipation mechanism II8.

[0071] For example, the air guide plate 3 can also be connected to other sides of the main body 1 to stabilize the air guide plate 3. The side of the main body 1 can be provided with a connecting groove to facilitate the installation of the air guide plate 3.

[0072] When the air guide plate 3 is set parallel to the chip 2, the height of the heat dissipation channel formed by the heat dissipation mechanism II 8 is greater than the distance between the air guide plate 3 and the chip 2.

[0073] Based on the above technical solution, the air guide channel 4 is opposite to a part of the heat dissipation mechanism II 8, and the air coming out of the air guide channel 4 can be directly dissipated to the outside through the heat dissipation mechanism II 8.

[0074] like Figure 2 As shown, in some specific embodiments, the heat dissipation mechanism II8 includes heat dissipation fins 10. The outer side of the heat dissipation fins 10 is rectangular, and the inner side is an arc shape that protrudes outward. The heat dissipation fins 10 have the same specifications and are arranged at equal intervals along the width direction of the heat dissipation channel formed by the heat dissipation mechanism II8.

[0075] The above structural design gives the heat dissipation mechanism II8 a larger effective heat dissipation area and better heat dissipation performance. At the same time, it allows the heat flowing out through the air guide channel 4 to be more effectively dissipated to the outside by the heat dissipation mechanism II8, and also has a dustproof effect.

[0076] like Figure 1 , Figure 3 and Figure 4 As shown, in some specific embodiments, the heat dissipation mechanism Ⅲ9 includes a heat dissipation fin assembly, and an external heat dissipation fan 11 is provided on the outside of the heat dissipation fin assembly.

[0077] The external cooling fan 11 can further increase the air circulation between the inside and outside, so that the heat generated by the chip 2 can be dissipated directly by the heat dissipation mechanism II 8 or by the heat dissipation mechanism III 9, thereby improving the circulation and heat dissipation efficiency.

[0078] like Figure 6 As shown, in some specific embodiments, the heat dissipation fin assembly includes rectangular heat dissipation fins 12, which are of the same size and are arranged at equal intervals along the height direction of the heat dissipation channel formed by the heat dissipation mechanism Ⅲ9.

[0079] like Figure 6 As shown, in some specific embodiments, the heat dissipation fin assembly further includes arc-shaped heat dissipation fins 13, which are located inside the rectangular heat dissipation fins 12. The arc-shaped heat dissipation fins 13 have the same specifications and are arranged at equal intervals along the width direction of the heat dissipation channel formed by the heat dissipation mechanism Ⅲ9.

[0080] Based on the above scheme, the rectangular heat dissipation fins 12 and the arc-shaped heat dissipation fins 13 are arranged perpendicular to each other, which not only provides a larger heat dissipation surface area, but also has a better dust prevention effect, reducing the amount of dust entering the interior of the main body 1.

[0081] For example, the height and width of the heat dissipation channel are consistent with the height and width of the main body in the figure.

[0082] like Figure 6 As shown, in some specific embodiments, the inner surface of the rectangular heat dissipation fin 12 is adapted to the outer surface of the arc-shaped heat dissipation fin 13, and the inner surface of the arc-shaped heat dissipation fin 13 has at least one concave surface 14. The tangent of the highest point of the upper edge of the air guide bracket 5 passes through the center of at least one concave surface 14.

[0083] like Figure 6 As shown, in some specific embodiments, the inner surface of the arc-shaped heat sink fin 13 has a concave surface 14, which is located above the heat dissipation mechanism III 9. The design of this concave surface 14 changes the airflow area in this region, making it easier for the airflow in the vicinity to be discharged from the concave surface 14, i.e., above the heat dissipation mechanism III 9, thereby increasing the airflow circulation in the space above the chip 2. At the same time, combined with the structure of the heat dissipation mechanism I and its inclined setting, it can also prevent the airflow above the chip 2 from entering the internal circulating heat dissipation fan from the second side 102 of the main body 1 as much as possible. The internal circulating heat dissipation fan can be drawn in from the space below the air guide plate 3.

[0084] The above technical solution improves the thermal circulation efficiency inside and outside the main body 1, enabling heat dissipation mechanism I and heat dissipation mechanism III 9 to more fully exert their internal and external circulation and heat dissipation functions, and cool down the chip 2 more quickly.

[0085] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present invention and are not intended to limit it. Any other modifications or equivalent substitutions made by those skilled in the art to the technical solutions of the present invention, as long as they do not depart from the spirit and scope of the technical solutions of the present invention, should be covered within the scope of the claims of the present invention.

Claims

1. An internal circulation heat dissipation structure for a closed LCD optical system, characterized by: The application relates to an internal circulation heat dissipation structure for a sealed LCD optical system. The application relates to an internal circulation heat dissipation structure for a sealed LCD optical system.

2. The internal circulation heat dissipation structure for a closed LCD optical system according to claim 1, wherein: The application relates to an internal circulation heat dissipation structure for a sealed LCD optical system.

3. The internal circulation heat dissipation structure for a closed LCD optical system according to claim 1, wherein: The application relates to an internal circulation heat dissipation structure for a sealed LCD optical system.

4. The internal circulation heat dissipation structure for a closed LCD optical system according to claim 1, wherein: The application relates to an internal circulation heat dissipation structure for a sealed LCD optical system.

5. The internal circulation heat dissipation structure for a closed LCD optical system according to claim 1, wherein: The application relates to an internal circulation heat dissipation structure for a sealed LCD optical system.

6. The internal circulation heat dissipation structure for a closed LCD optical system according to claim 1, wherein: The application relates to an internal circulation heat dissipation structure for a sealed LCD optical system. The application relates to an internal circulation heat dissipation structure for a sealed LCD optical system.

7. An LCD projector characterized by comprising: The application relates to an internal circulation heat dissipation structure for a sealed LCD optical system. The application relates to an internal circulation heat dissipation structure for a sealed LCD optical system. The application relates to an internal circulation heat dissipation structure for a sealed LCD optical system. The application relates to an internal circulation heat dissipation structure for a sealed LCD optical system. The application relates to an internal circulation heat dissipation structure for a sealed LCD optical system. The application relates to an internal circulation heat dissipation structure for a sealed LCD optical system. The application relates to an internal circulation heat dissipation structure for a sealed LCD optical system. The application relates to an internal circulation heat dissipation structure for a sealed LCD optical system. The application relates to an internal circulation heat dissipation structure for a sealed LCD optical system. The application relates to an internal circulation heat dissipation structure for a sealed LCD optical system. The application relates to an internal circulation heat dissipation structure for a sealed LCD optical system. The application relates to an internal circulation heat dissipation structure for a sealed LCD optical system. The application relates to an internal circulation heat dissipation structure for a sealed LCD optical system. The application relates to an internal circulation heat dissipation structure for a sealed LCD optical system. The application relates to an internal circulation heat dissipation structure for a sealed LCD optical system. The application relates to an internal circulation heat dissipation structure for a sealed LCD optical system. The application relates to an internal circulation heat dissipation structure for a sealed LCD optical system. The application relates to an internal circulation heat dissipation structure for a sealed LCD optical system. The application relates to an internal circulation heat dissipation structure for a sealed LCD optical system. The application relates to an internal circulation heat dissipation structure for a sealed LCD optical system. The application relates to an internal circulation heat dissipation structure for a sealed LCD optical system. The application relates to an internal circulation heat dissipation structure for a sealed LCD optical system. The application relates to an internal circulation heat dissipation structure for a sealed LCD optical system. The application relates to an internal circulation heat dissipation structure for a sealed LCD optical system. The application relates to an internal circulation heat dissipation structure for a sealed LCD optical system. The application relates to an internal circulation heat dissipation structure for a sealed LCD optical system. 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