Modular mainboard test fixture

Abstract

The application relates to a modular mainboard test fixture, belonging to the technical field of server detection, which comprises an upper die and a lower die connected together, the upper die comprises an upper frame, a probe mounting plate is arranged in the upper frame, a plurality of probe mounting holes in a matrix distribution are arranged on the probe mounting plate, a test probe module is detachably arranged in the probe mounting hole, the test probe module comprises a plurality of test probes, a die closing probe is arranged at each corner of the probe mounting plate, the lower die comprises a lower frame, a carrier plate is arranged in the lower frame, a probe penetrating hole is arranged at each corner of the carrier plate, and the position of the probe penetrating hole corresponds to that of the die closing probe. The application can adjust the type and position of the test probe of the fixture according to the use requirement, simultaneously sets the die closing probe, makes the accuracy of die closing and detection of the die closing position through the die closing probe, and improves the safety, flexibility and compatibility of the fixture test.

Description

Technical Field

[0001] This invention relates to a modular motherboard testing fixture, belonging to the field of server testing technology. Background Technology

[0002] There are many types of jigs, but in layman's terms, they are a general term for tooling fixtures and gauges. Jigs are mainly used as tools to assist in controlling position or movement.

[0003] Specifically, tooling fixtures are mainly used for positioning and clamping; inspection fixtures are generally used for dimensional inspection of target objects, and for testing the continuity, withstand voltage, current, etc. of PCB circuit boards.

[0004] The motherboard, also called the mainboard, system board, or motherboard, is one of the most basic and crucial components of a computer. It is generally a rectangular circuit board on which the main circuitry of the computer is installed. This typically includes the BIOS chip, I / O chip, keyboard and control switch interfaces, indicator light connectors, expansion slots, and DC power supply connectors for the motherboard and expansion cards. The motherboard is one of the most fundamental and important components of a computer; its manufacturing quality determines the stability of the hardware system.

[0005] Many jigs are created out of commercial necessity, as many types are customized, mostly to improve productivity, repeat specific actions, or make work more precise. Correspondingly, to test the manufacturing quality of motherboards, motherboard test jigs are needed, allowing the motherboards to undergo corresponding inspections at a fixed station. However, due to differences in size and circuit component configuration, the tooling fixtures and gauges of the jigs differ between different motherboard models, requiring interchangeability between models. Summary of the Invention

[0006] The purpose of this invention is to address the aforementioned problems by providing a modular motherboard test fixture that offers greater flexibility and compatibility.

[0007] This invention is achieved through the following technical solution: A modular motherboard test fixture includes an upper mold and a lower mold connected together. The upper mold includes an upper frame, and a probe mounting plate is provided inside the upper frame. The probe mounting plate has a number of probe mounting holes arranged in a matrix. Test probe modules are detachably installed in the probe mounting holes. The test probe modules include multiple test probes. Mold closing probes are provided at the four corners of the probe mounting plate. The lower mold includes a lower frame, inside which is a carrier plate. The carrier plate has probe penetration holes at its four corners, and the positions of the probe penetration holes correspond to the positions of the mold closing probes.

[0008] Before use, select the required test probe module according to the motherboard under test and install it onto the probe mounting plate using a quick-plug method. Then, place the carrier plate on the lower mold and place the motherboard under test on the carrier plate. At this time, the probes on the lower mold test and mate with the A-side interface of the motherboard. After the lower mold and upper mold are closed, the upper mold probes mate with the B-side interface of the motherboard. At this time, the closing probes contact the lower mold through the probe penetration holes on the carrier plate. After successful mating, the closing probes are exposed and mated as they are inserted, sending a closing signal, indicating that the closing position is accurate and the interface connection is successful, and controlling the fixture to start testing the motherboard. This invention can adjust the type and position of the test probes of the fixture according to the usage requirements. At the same time, the setting of the closing probes improves the accuracy of the closing position detection during closing and improves the safety, flexibility and compatibility of the fixture testing.

[0009] A further improvement of the present invention is that the upper mold and the lower mold are connected by a hinge, making it convenient to open and close the upper mold and the lower mold.

[0010] A further improvement of this invention is that hinge columns are fixedly provided on both the side of the upper frame and the side of the lower frame, and an electrically controlled lever arm is installed between two hinge columns on the same side. The opening and closing of the upper and lower molds is controlled by the electrically controlled lever arm, thereby improving the degree of automation.

[0011] A further improvement of the present invention is that the cylinder of the electrically controlled lever arm is sleeved on the hinge post on the side of the lower frame, and the piston rod of the electrically controlled lever arm is sleeved on the hinge post on the side of the upper frame. The extension and retraction of the piston rod of the electrically controlled lever arm controls the rotation of the upper mold, resulting in better stability.

[0012] A further improvement of the present invention is that the test probe module includes a stud, a connecting plate fixedly mounted at the end of the stud, a test probe mounted on the connecting plate, and a threaded hole for mounting the probe, with the stud installed inside the probe mounting hole. The test probe module is mounted on the probe mounting hole via threads, facilitating easy assembly and disassembly.

[0013] A further improvement of the present invention is that the test probe module includes a connecting post, a connecting plate II fixedly mounted at the end of the connecting post, and a test probe mounted on the connecting plate II. Multiple springs II are accommodated within the inner wall of the probe mounting hole. The test probe module can be directly inserted into the probe mounting hole, making assembly and disassembly convenient and quick.

[0014] A further improvement of this invention is that ball bearings are fixedly mounted at both ends of the spring, and an annular groove is provided on the connecting post. This makes the insertion of the test probe module into the probe mounting hole smoother and more stable.

[0015] A further improvement of the present invention is that the mold closing probe includes a protective shell, a mandrel fixedly provided at one end of the protective shell, a disc sleeved on the mandrel, and a spring sleeved on the mandrel. One end of the spring is fixedly connected to the end face of the protective shell, and the other end of the spring is fixedly connected to the end face of the disc.

[0016] A further improvement of the present invention is that the mold closing probe includes a protective shell II, a spindle II fixedly provided at the end of the protective shell II, a disc II sleeved on the spindle II, and a plurality of elastic flaps connected between the end face of the protective shell II and the end face of the spindle II.

[0017] A further improvement of the present invention is that the carrier plate is provided with a groove for placing the motherboard.

[0018] Compared with the prior art, the beneficial effects of this invention are: Before use, select the required test probe module according to the motherboard under test and install it onto the probe mounting plate using a quick-plug method. Then, place the carrier plate on the lower mold and place the motherboard under test on the carrier plate. At this time, the probes on the lower mold test and mate with the A-side interface of the motherboard. After the lower mold and upper mold are closed, the upper mold probes mate with the B-side interface of the motherboard. At this time, the closing probes contact the lower mold through the probe penetration holes on the carrier plate. After successful mating, the closing probes are exposed and mated as they are inserted, sending a closing signal, indicating that the closing position is accurate and the interface connection is successful, and controlling the fixture to start testing the motherboard. This invention can adjust the type and position of the test probes of the fixture according to the usage requirements. At the same time, the setting of the closing probes improves the accuracy of the closing position detection during closing and improves the safety, flexibility and compatibility of the fixture testing. Attached Figure Description

[0019] To more clearly illustrate the technical solution of the present invention, the accompanying drawings used in the description will be briefly introduced below. Obviously, the accompanying drawings described below are only some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0020] Figure 1 This is a structural schematic diagram of a specific embodiment of the present invention.

[0021] Figure 2 This is a schematic diagram of the test probe module in Embodiment 2 of the present invention.

[0022] Figure 3 This is a schematic diagram of the mold-closing probe in Embodiment 2 of the present invention.

[0023] Figure 4 This is a schematic diagram of the test probe module in Embodiment 3 of the present invention.

[0024] Figure 5 This is a schematic diagram of the mold-closing probe in Embodiment 3 of the present invention.

[0025] In the diagram: 1. Upper frame; 2. Probe mounting plate; 3. Lower frame; 4. Carrier plate; 5. Hinge post; 6. Electrically controlled lever arm; 7. Probe mounting hole; 8. Test probe module; 9. Mold closing probe; 10. Probe penetration hole; 11. Protective shell one; 12. Mandrel one; 13. Disc one; 14. Spring one; 15. Protective shell two; 16. Mandrel two; 17. Disc two; 18. Elastic flap; 19. Stud; 20. Connecting disc one; 21. Test probe; 22. Connecting post; 23. Connecting disc two; 24. Annular groove; 25. Spring two; 26. Ball bearing. Detailed Implementation

[0026] The specific embodiments of the present invention will be described in further detail below with reference to the accompanying drawings.

[0027] Example 1: like Figures 1 to 5 The modular motherboard test fixture shown includes an upper mold and a lower mold connected together. The upper mold includes an upper frame 1, and a probe mounting plate 2 is provided inside the upper frame 1. The probe mounting plate 2 has a plurality of probe mounting holes 7 arranged in a matrix. A test probe module 8 is detachably installed in the probe mounting holes 7. The test probe module 8 includes a plurality of test probes 21. Mold closing probes 9 are provided at the four corners of the probe mounting plate 2. The lower mold includes a lower frame 3, and a carrier plate 4 is provided inside the lower frame 3. The carrier plate 4 has a groove for placing the main board. The four corners of the carrier plate 4 are provided with probe penetration holes 10, and the positions of the probe penetration holes 10 and the mold closing probes 9 are corresponding.

[0028] Before use, select the required test probe module 8 according to the motherboard under test, and install it onto the probe mounting plate 2 via quick-plug method. Then, place the carrier plate 4 on the lower mold and place the motherboard under test on the carrier plate 4. At this time, the probes on the lower mold test and connect to the A-side interface of the motherboard. After the lower mold and upper mold are closed, the upper mold probes connect to the B-side interface of the motherboard. At this time, the closing probe 9 contacts the lower mold through the probe penetration hole 10 on the carrier plate 4. After the closing probe 9 is successfully connected, with the insertion of the closing probe 9, the closing probe 9 is exposed and achieves connection, and sends a closing signal, indicating that the closing position is accurate and the interface connection is successful, and the control fixture starts testing the motherboard. This invention can adjust the type and position of the test probe 21 of the fixture according to the usage requirements, and at the same time, the setting of the closing probe 9 improves the accuracy of the closing position detection during the closing and through the closing probe 9, thereby improving the safety, flexibility and compatibility of the fixture test.

[0029] Example 2: like Figures 1 to 5The modular motherboard test fixture shown includes an upper mold and a lower mold connected together. The upper mold includes an upper frame 1, and a probe mounting plate 2 is provided inside the upper frame 1. The probe mounting plate 2 has a plurality of probe mounting holes 7 arranged in a matrix. A test probe module 8 is detachably installed in the probe mounting holes 7. The test probe module 8 includes a plurality of test probes 21. Mold closing probes 9 are provided at the four corners of the probe mounting plate 2. The lower mold includes a lower frame 3, and a carrier plate 4 is provided inside the lower frame 3. The carrier plate 4 has a groove for placing the main board. The four corners of the carrier plate 4 are provided with probe penetration holes 10, and the positions of the probe penetration holes 10 and the mold closing probes 9 are corresponding.

[0030] Before use, select the required test probe module 8 according to the motherboard under test, and install it onto the probe mounting plate 2 via quick-plug method. Then, place the carrier plate 4 on the lower mold and place the motherboard under test on the carrier plate 4. At this time, the probes on the lower mold test and connect to the A-side interface of the motherboard. After the lower mold and upper mold are closed, the upper mold probes connect to the B-side interface of the motherboard. At this time, the closing probe 9 contacts the lower mold through the probe penetration hole 10 on the carrier plate 4. After the closing probe 9 is successfully connected, with the insertion of the closing probe 9, the closing probe 9 is exposed and achieves connection, and sends a closing signal, indicating that the closing position is accurate and the interface connection is successful, and the control fixture starts testing the motherboard. This invention can adjust the type and position of the test probe 21 of the fixture according to the usage requirements, and at the same time, the setting of the closing probe 9 improves the accuracy of the closing position detection during the closing and through the closing probe 9, thereby improving the safety, flexibility and compatibility of the fixture test.

[0031] The upper and lower molds are connected by hinges, facilitating easy opening and closing. Hinge columns 5 are fixedly installed on the sides of both the upper frame 1 and the lower frame 3, with an electrically controlled lever 6 installed between two hinge columns 5 on the same side. The opening and closing of the upper and lower molds is controlled by the electrically controlled lever 6, improving automation. The cylinder of the electrically controlled lever 6 is fitted onto the hinge column 5 on the side of the lower frame 3, and the piston rod of the electrically controlled lever 6 is fitted onto the hinge column 5 on the side of the upper frame 1. The extension and retraction of the piston rod of the electrically controlled lever 6 controls the rotation of the upper mold, resulting in better stability.

[0032] The test probe module 8 includes a stud 19, with a connecting plate 20 fixedly attached to the end of the stud 19. The test probe 21 is mounted on the connecting plate 20. The probe mounting hole 7 is a threaded hole, and the stud 19 is installed inside the probe mounting hole 7. The test probe module 8 is installed on the probe mounting hole 7 by means of threads, which makes assembly and disassembly convenient.

[0033] The mold closing probe 9 includes a protective shell 11, a spindle 12 fixedly mounted at the end of the protective shell 11, a disc 13 sleeved on the spindle 12, and a spring 14 sleeved on the spindle 12. One end of the spring 14 is fixedly connected to the end face of the protective shell 11, and the other end of the spring 14 is fixedly connected to the end face of the disc 13.

[0034] Example 3: like Figures 1 to 5 The modular motherboard test fixture shown includes an upper mold and a lower mold connected together. The upper mold includes an upper frame 1, and a probe mounting plate 2 is provided inside the upper frame 1. The probe mounting plate 2 has a plurality of probe mounting holes 7 arranged in a matrix. A test probe module 8 is detachably installed in the probe mounting holes 7. The test probe module 8 includes a plurality of test probes 21. Mold closing probes 9 are provided at the four corners of the probe mounting plate 2. The lower mold includes a lower frame 3, and a carrier plate 4 is provided inside the lower frame 3. The carrier plate 4 has a groove for placing the main board. The four corners of the carrier plate 4 are provided with probe penetration holes 10, and the positions of the probe penetration holes 10 and the mold closing probes 9 are corresponding.

[0035] Before use, select the required test probe module 8 according to the motherboard under test, and install it onto the probe mounting plate 2 via quick-plug method. Then, place the carrier plate 4 on the lower mold and place the motherboard under test on the carrier plate 4. At this time, the probes on the lower mold test and connect to the A-side interface of the motherboard. After the lower mold and upper mold are closed, the upper mold probes connect to the B-side interface of the motherboard. At this time, the closing probe 9 contacts the lower mold through the probe penetration hole 10 on the carrier plate 4. After the closing probe 9 is successfully connected, with the insertion of the closing probe 9, the closing probe 9 is exposed and achieves connection, and sends a closing signal, indicating that the closing position is accurate and the interface connection is successful, and the control fixture starts testing the motherboard. This invention can adjust the type and position of the test probe 21 of the fixture according to the usage requirements, and at the same time, the setting of the closing probe 9 improves the accuracy of the closing position detection during the closing and through the closing probe 9, thereby improving the safety, flexibility and compatibility of the fixture test.

[0036] The upper and lower molds are connected by hinges, facilitating easy opening and closing. Hinge columns 5 are fixedly installed on the sides of both the upper frame 1 and the lower frame 3, with an electrically controlled lever 6 installed between two hinge columns 5 on the same side. The opening and closing of the upper and lower molds is controlled by the electrically controlled lever 6, improving automation. The cylinder of the electrically controlled lever 6 is fitted onto the hinge column 5 on the side of the lower frame 3, and the piston rod of the electrically controlled lever 6 is fitted onto the hinge column 5 on the side of the upper frame 1. The extension and retraction of the piston rod of the electrically controlled lever 6 controls the rotation of the upper mold, resulting in better stability.

[0037] The test probe module 8 includes a connecting post 22, with a connecting plate 23 fixedly attached to the end of the connecting post 22. The test probe 21 is mounted on the connecting plate 23, and multiple springs 25 are accommodated in the inner wall of the probe mounting hole 7. The test probe module 8 can be directly inserted into the probe mounting hole 7, making assembly and disassembly convenient and quick. A ball bearing 26 is fixedly attached to the end of each spring 25, and an annular groove 24 is provided on the connecting post 22. The structure of the test probe module 8 being inserted into the probe mounting hole 7 is smoother and more stable.

[0038] The mold closing probe 9 includes a protective shell 2 15, a spindle 2 16 fixedly provided at the end of the protective shell 2 15, a disc 2 17 sleeved on the spindle 2 16, and a plurality of elastic flaps 18 connected between the end face of the protective shell 2 15 and the end face of the spindle 2 16.

[0039] Working principle: Before use, select the required test probe module 8 according to the motherboard under test, and install it onto the probe mounting plate 2 via quick-plug method. Then, place the carrier plate 4 on the lower mold and place the motherboard under test on the carrier plate 4. At this time, the probes on the lower mold test and connect to the A-side interface of the motherboard. After the lower mold and upper mold are closed, the upper mold probes connect to the B-side interface of the motherboard. At this time, the closing probe 9 contacts the lower mold through the probe penetration hole 10 on the carrier plate 4. After the closing probe 9 is successfully connected, with the insertion of the closing probe 9, the closing probe 9 is exposed and achieves connection, and sends a closing signal, indicating that the closing position is accurate and the interface connection is successful, and the control fixture starts testing the motherboard. This invention can adjust the type and position of the test probe 21 of the fixture according to the usage requirements, and at the same time, the setting of the closing probe 9 improves the accuracy of the closing position detection during the closing and through the closing probe 9, thereby improving the safety, flexibility and compatibility of the fixture test.

[0040] The various embodiments in this specification are described in a progressive manner. Each embodiment focuses on the differences from other embodiments. The same or similar parts between the various embodiments can be referred to each other.

[0041] The terms "upper," "lower," "outer," "inner," etc., used in the specification, claims, and accompanying drawings of this invention are used to distinguish relative positional relationships and are not necessarily qualitative. It should be understood that such data can be interchanged where appropriate so that embodiments of the invention described herein can be implemented in orders other than those illustrated or described herein. Furthermore, the terms "comprising" and "having," and any variations thereof, are intended to cover non-exclusive inclusion.

[0042] The above description of the disclosed embodiments enables those skilled in the art to make or use the invention. Various modifications to these embodiments will be readily apparent to those skilled in the art, and the general principles defined herein may be implemented in other embodiments without departing from the spirit or scope of the invention. Therefore, the invention is not to be limited to the embodiments shown herein, but is to be accorded the widest scope consistent with the principles and novel features disclosed herein.

Claims

1. A modular motherboard test fixture, characterized in that, The upper mold and the lower mold are connected together. The upper mold includes an upper frame (1). The upper frame (1) is provided with a probe mounting plate (2). The probe mounting plate (2) is provided with a number of probe mounting holes (7) arranged in a matrix. A test probe module (8) is detachably installed in the probe mounting holes (7). The test probe module (8) includes multiple test probes (21). Mold closing probes (9) are provided at the four corners of the probe mounting plate (2). The lower mold includes a lower frame (3), and a carrier plate (4) is provided inside the lower frame (3). The four corners of the carrier plate (4) are provided with probe penetration holes (10), and the positions of the probe penetration holes (10) correspond to the mold closing probes (9). The test probe module (8) includes a connecting post (22), a connecting disk II (23) is fixedly provided at the end of the connecting post (22), the test probe (21) is set on the connecting disk II (23), and multiple springs II (25) are accommodated in the inner wall of the probe mounting hole (7). A ball (26) is fixedly provided at the end of the second spring (25), and an annular groove (24) is provided on the connecting post (22); The mold closing probe (9) includes a protective shell (11), a spindle (12) is fixedly provided at the end of the protective shell (11), a disc (13) is sleeved on the spindle (12), and a spring (14) is sleeved on the spindle (12). One end of the spring (14) is fixedly connected to the end face of the protective shell (11), and the other end of the spring (14) is fixedly connected to the end face of the disc (13).

2. The modular motherboard test fixture according to claim 1, characterized in that, The upper and lower molds are connected by hinges.

3. A modular motherboard test fixture according to claim 2, characterized in that, Hinged columns (5) are fixed on the side of the upper frame (1) and the side of the lower frame (3), and an electrically controlled lever (6) is installed between the two hinged columns (5) on the same side.

4. A modular motherboard test fixture according to claim 3, characterized in that, The cylinder of the electric control arm (6) is mounted on the hinge column (5) on the side of the lower frame (3), and the piston rod of the electric control arm (6) is mounted on the hinge column (5) on the side of the upper frame (1).

5. A modular motherboard test fixture according to claim 1, characterized in that, The test probe module (8) is replaced by: The test probe module (8) includes a stud (19), a connecting plate (20) is fixedly provided at the end of the stud (19), the test probe (21) is set on the connecting plate (20), the probe mounting hole (7) is a threaded hole, and the stud (19) is installed in the probe mounting hole (7).

6. A modular motherboard test fixture according to claim 1, characterized in that, The mold closing probe (9) is replaced by: The mold closing probe (9) includes a protective shell two (15), a mandrel two (16) is fixedly provided at the end of the protective shell two (15), a disc two (17) is sleeved on the mandrel two (16), and multiple elastic flaps (18) are connected between the end face of the protective shell two (15) and the end face of the mandrel two (16).

7. A modular motherboard test fixture according to claim 1, characterized in that, The carrier board (4) has a groove for placing the motherboard.

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