Fingerprint identification module, manufacturing method thereof and display device
By setting a microlens in the fingerprint recognition module to cover multiple photosensitive devices, and by utilizing the design of collimating optical layer and light guide layer, the problem of weak reflected light signal from photosensitive devices is solved, thereby achieving higher fingerprint recognition accuracy and imaging quality.
Patent Information
- Application Number
- CN202080002117.7
- Authority / Receiving Office
- CN · China
- Patent Type
- Patents(China)
- Current Assignee / Owner
- Filing Date
- 2020-09-25
- Publication Date
- 2025-10-24
- Estimated Expiration
- 2040-09-25
AI Technical Summary
In existing fingerprint recognition schemes where a microlens corresponds to a single photosensitive device, the reflected light signal received by the photosensitive device is weak, which affects the accuracy of fingerprint recognition.
The design employs a microlens covering multiple photosensitive devices. The microlens focuses the light reflected from the finger onto one of the photosensitive devices, and the intensity of reflected light from the photosensitive devices is increased by setting a collimating optical layer and a light guide layer, including multiple light-transmitting holes and microlenses.
This increases the intensity of reflected light received by the photosensitive device, thereby improving the accuracy and imaging quality of fingerprint recognition.
Smart Images

Figure CN116075869B_ABST
Abstract
Description
TECHNICAL FIELD
[0001] The present disclosure relates to the technical field of display, and in particular, to a fingerprint identification module, a manufacturing method thereof, and a display device. BACKGROUND
[0002] With the rapid development of the information industry, biometric technology has been more and more widely applied. In particular, since the fingerprints of different users are different, it is convenient to confirm the identity of the user, and therefore, the fingerprint identification technology has been widely applied in mobile terminals, smart homes and other fields to provide security protection for user information.
[0003] Optical fingerprint identification is one of the means to realize fingerprint identification. The principle of optical fingerprint identification is as follows: when a finger is placed above a display product, the emitted light of the light source contained in the display product is incident on the positions of the valleys and ridges of the finger, and then is reflected by the valleys and ridges of the finger and is incident on the optical fingerprint identification device contained in the display product. Since the light intensities reflected by the valleys and ridges are different, the photosensitive devices generate different electrical signals according to the difference in the reflected light intensities, thereby realizing fingerprint identification. SUMMARY
[0004] In one aspect, the present disclosure provides a fingerprint identification module, comprising:
[0005] a substrate substrate;
[0006] an image sensing layer comprising a plurality of photosensitive devices located above the substrate substrate;
[0007] a collimating optical layer located on the light-incident side of the plurality of photosensitive devices; the collimating optical layer comprises a plurality of light-transmitting holes, the plurality of light-transmitting holes are one-to-one correspondingly arranged with part of the photosensitive devices, and the orthographic projection of the light-transmitting hole on the substrate substrate is located within the orthographic projection of the correspondingly arranged photosensitive device;
[0008] a light guide layer located on the side of the collimating optical layer away from the plurality of photosensitive devices; the light guide layer comprises a plurality of microlenses, the orthographic projection of each microlens on the substrate substrate completely covers the orthographic projection of one light-transmitting hole and at least two photosensitive devices, and each microlens is configured to converge the light reflected by the finger and then transmit the light through the light-transmitting hole covered thereby to the photosensitive device covered thereby.
[0009] Optionally, in the above-mentioned fingerprint identification module provided by the present disclosure, the center of the orthographic projection of the microlens on the substrate substrate coincides with the center of the orthographic projection of the light-transmitting hole completely covered thereby.
[0010] Optionally, in the fingerprint identification module provided in the embodiments of the present disclosure, the collimating optical layer comprises a first light-shielding layer, a first light-transmitting layer, a second light-shielding layer and a second light-transmitting layer arranged in layers, the first light-shielding layer is adjacent to the plurality of photosensitive devices, and the second light-transmitting layer is adjacent to the plurality of microlenses; wherein,
[0011] In a direction perpendicular to the substrate, a distance between the second light-shielding layer and a layer where the plurality of microlenses are located is less than or equal to a focal length of the microlenses, and a ratio of a thickness of the second light-transmitting layer to a thickness of the first light-transmitting layer is greater than or equal to 1 and less than or equal to 10.
[0012] Optionally, in the fingerprint identification module provided in the embodiments of the present disclosure, the light-transmitting hole comprises a first light-transmitting hole in the first light-shielding layer and a second light-transmitting hole in the second light-shielding layer; wherein,
[0013] A normal projection of the first light-transmitting hole on the substrate is completely coincident with a normal projection of the second light-transmitting hole.
[0014] Optionally, in the fingerprint identification module provided in the embodiments of the present disclosure, the collimating optical layer further comprises a third light-shielding layer between the second light-transmitting layer and a layer where the plurality of microlenses are located;
[0015] A normal projection of the third light-shielding layer on the substrate covers a gap between the microlenses and is mutually overlapped with a normal projection edge area of the plurality of microlenses.
[0016] Optionally, in the fingerprint identification module provided in the embodiments of the present disclosure, the light-transmitting hole comprises a first light-transmitting hole in the first light-shielding layer and a second light-transmitting hole in the second light-shielding layer; wherein,
[0017] A normal projection of the second light-transmitting hole on the substrate is located within a normal projection of the first light-transmitting hole.
[0018] Optionally, in the fingerprint identification module provided in the embodiments of the present disclosure, in a direction perpendicular to the substrate, thicknesses of the first light-shielding layer, the second light-shielding layer and the third light-shielding layer are greater than 0 μm and less than or equal to 3 μm.
[0019] Optionally, in the fingerprint identification module provided in the embodiments of the present disclosure, materials of the first light-shielding layer, the second light-shielding layer and the third light-shielding layer are black matrix materials, molybdenum oxide, aluminum oxide or chromium metal.
[0020] Optionally, in the fingerprint identification module provided in the embodiments of the present disclosure, the first light-transmitting layer and / or the second light-transmitting layer are multiplexed as a filter layer.
[0021] Optionally, in the fingerprint identification module provided by the embodiment of the present disclosure, the filter layer is arranged between the layer where the plurality of microlenses are located and the collimating optical layer, or between the collimating optical layer and the layer where the plurality of photosensitive devices are located, or between the adjacent light-shielding layer and the light-transmitting layer.
[0022] Optionally, in the fingerprint identification module provided by the embodiment of the present disclosure, the filter layer is configured to filter out ambient light of 600 mm or more.
[0023] Optionally, in the fingerprint identification module provided by the embodiment of the present disclosure, the image sensing layer, the collimating optical layer, the light guide layer and the filter layer are film layers arranged in a stack on the substrate.
[0024] Optionally, in the fingerprint identification module provided by the embodiment of the present disclosure, further comprising an optical adhesive layer in contact with the surface of the plurality of photosensitive devices away from the substrate.
[0025] In another aspect, the embodiment of the present disclosure also provides a display device, comprising a display module, a fingerprint identification module located at the opposite side of the display surface of the display module, and an adhesive layer located between the display module and the fingerprint identification module; wherein,
[0026] The fingerprint identification module is the fingerprint identification module described above.
[0027] The normal projection of the adhesive layer on the display module is located in the frame area of the display module.
[0028] In another aspect, the embodiment of the present disclosure provides a method for manufacturing a fingerprint identification module, comprising:
[0029] Providing a substrate;
[0030] Manufacturing an image sensing layer comprising a plurality of photosensitive devices, a collimating optical layer and a light guide layer comprising a plurality of microlenses on the substrate in sequence; wherein,
[0031] The collimating optical layer comprises a plurality of light-transmitting holes, the plurality of light-transmitting holes are arranged one-to-one corresponding to part of the photosensitive devices, and the normal projection of the light-transmitting hole on the substrate is located within the normal projection of the corresponding photosensitive device.
[0032] The normal projection of each microlens on the substrate completely covers the normal projection of one light-transmitting hole and at least two photosensitive devices, and each microlens is configured to converge the light reflected by the finger and then transmit it to one of the photosensitive devices through the light-transmitting hole covered thereby.
[0033] In another aspect, the present disclosure provides a method for manufacturing a fingerprint identification module, comprising:
[0034] providing a first substrate;
[0035] manufacturing an image sensing layer comprising a plurality of photosensitive devices on the first substrate;
[0036] providing a second substrate;
[0037] manufacturing a light filtering layer, a collimating optical layer, and a light guiding layer comprising a plurality of microlenses on the second substrate; wherein the collimating optical layer comprises a plurality of light transmission holes, and a normal projection of each of the microlenses on the substrate completely covers one of the light transmission holes;
[0038] adhering the second substrate with the light filtering layer, the collimating optical layer, and the plurality of microlenses to the light-incident side of the plurality of photosensitive devices using optical adhesive, so that after the adhering, the plurality of light transmission holes are arranged one-to-one corresponding to part of the photosensitive devices, and a normal projection of the light transmission holes on the substrate is located within a normal projection of the corresponding photosensitive devices, while a normal projection of each of the microlenses on the substrate completely covers normal projections of at least two of the photosensitive devices, and each of the microlenses is configured to converge light reflected by a finger and transmit the light through the light transmission hole covered thereby to one of the photosensitive devices covered thereby.
[0039] Optionally, in the above method for manufacturing a fingerprint identification module, manufacturing the light filtering layer, the collimating optical layer, and the plurality of microlenses on the second substrate specifically comprises:
[0040] sequentially manufacturing a first light transmission layer, a second light shielding layer, and a second light transmission layer on the second substrate; wherein the first light transmission layer is multiplexed as the light filtering layer, a thickness of the second light transmission layer in a direction perpendicular to the second substrate is less than or equal to a focal length of the microlens to be manufactured, and the second light shielding layer comprises a plurality of second light transmission holes;
[0041] manufacturing the plurality of microlenses on the second light transmission layer, and a normal projection of each of the microlenses on the second substrate completely covers a normal projection of at least two of the photosensitive devices and one of the second light transmission holes;
[0042] manufacturing a first light shielding layer on a side of the second substrate away from the first light transmission layer, the first light shielding layer comprises a plurality of first light transmission holes completely coinciding with the plurality of second light transmission holes in a direction perpendicular to the second substrate, and the first light shielding layer, the first light transmission layer, the second light shielding layer, and the second light transmission layer constitute the collimating optical layer.
[0043] Optionally, in the manufacturing method provided in the embodiments of the present disclosure, the manufacturing of the light filtering layer, the collimating optical layer and the plurality of microlenses on the second substrate specifically comprises:
[0044] The light filtering layer and the second light transmission layer are manufactured on the second substrate in sequence, and the sum of the thicknesses of the second substrate, the light filtering layer and the second light transmission layer in the direction perpendicular to the second substrate is less than or equal to the focal length of the microlens to be manufactured;
[0045] The plurality of microlenses are manufactured on the second light transmission layer, and the orthographic projection of each microlens on the second substrate completely covers the orthographic projection of the light transmission hole and at least two photosensitive devices contained in the light shielding layer to be manufactured;
[0046] The second light shielding layer, the first light transmission layer and the first light shielding layer are manufactured on the side of the second substrate away from the light filtering layer in sequence; wherein the first light shielding layer and the second light shielding layer comprise a plurality of light transmission holes completely coinciding in the direction perpendicular to the second substrate, and the first light shielding layer, the first light transmission layer, the second light shielding layer and the second light transmission layer constitute the collimating optical layer.
[0047] Optionally, in the manufacturing method provided in the embodiments of the present disclosure, the manufacturing of the light filtering layer, the collimating optical layer and the plurality of microlenses on the second substrate specifically comprises:
[0048] The light filtering layer, the first light shielding layer, the first light transmission layer, the second light shielding layer, the second light transmission layer and the plurality of prisms are manufactured on the second substrate in sequence; wherein,
[0049] The first light shielding layer and the second light shielding layer comprise a plurality of light transmission holes in the direction perpendicular to the second substrate, and the first light shielding layer, the first light transmission layer, the second light shielding layer and the second light transmission layer constitute the collimating optical layer;
[0050] The orthographic projection of each microlens on the second substrate completely covers the orthographic projection of the light transmission hole and at least two photosensitive devices.
[0051] Optionally, in the manufacturing method provided in the embodiments of the present disclosure, after the manufacturing of the second light transmission layer and before the manufacturing of the plurality of microlenses, the method further comprises:
[0052] A third light shielding layer is manufactured on the second light transmission layer, and the orthographic projection of the third light shielding layer on the second substrate covers the gap between the microlenses and overlaps with the orthographic projection edge area of the plurality of microlenses. BRIEF DESCRIPTION OF DRAWINGS
[0053] Figure 1A schematic diagram of a planar structure of a fingerprint identification module provided by an embodiment of the present disclosure;
[0054] Figure 2 A schematic diagram of a cross-sectional structure along Figure 1 line I-II in FIG. 1;
[0055] Figure 3 A schematic diagram of a cross-sectional structure along Figure 2 line III-IV in FIG. 1;
[0056] Figure 4 A schematic diagram of another planar structure of a fingerprint identification module provided by an embodiment of the present disclosure;
[0057] Figure 5 A schematic diagram of a cross-sectional structure along Figure 4 line I-II in FIG. 2;
[0058] Figure 6 A schematic diagram of another cross-sectional structure along Figure 1 line I-II in FIG. 2;
[0059] Figure 7 A schematic diagram of another cross-sectional structure along Figure 4 line III-IV in FIG. 2;
[0060] Figure 8 A schematic diagram of another cross-sectional structure along Figure 1 line I-II in FIG. 3;
[0061] Figure 9 A schematic diagram of another cross-sectional structure along Figure 4 line III-IV in FIG. 3;
[0062] Figure 10 A schematic diagram of another cross-sectional structure along Figure 1 line I-II in FIG. 4;
[0063] Figure 11 A schematic diagram of another cross-sectional structure along Figure 4 line III-IV in FIG. 4;
[0064] Figure 12 A schematic diagram of another cross-sectional structure along Figure 1 line I-II in FIG. 5;
[0065] Figure 13 A schematic diagram of another cross-sectional structure along Figure 4 line III-IV in FIG. 5;
[0066] Figure 14 A schematic diagram of another cross-sectional structure along Figure 1 line I-II in FIG. 6;
[0067] Figure 15 A schematic diagram of another cross-sectional structure alongFigure 4 Another cross-sectional structure schematic diagram of a middle III-IV line;
[0068] Figure 16 A fingerprint image of a fingerprint identification module in the related art;
[0069] Figure 17 A fingerprint image of a fingerprint identification module provided by an embodiment of the present disclosure;
[0070] Figure 18 A Figure 2 Flowchart of a manufacturing method of the fingerprint identification module;
[0071] Figure 19 A Figure 5 Flowchart of a manufacturing method of the fingerprint identification module;
[0072] Figure 20 A Figure 6 Flowchart of a manufacturing method of the fingerprint identification module;
[0073] Figure 21 A Figure 7 Flowchart of a manufacturing method of the fingerprint identification module;
[0074] Figure 22 A Figure 8 Flowchart of a manufacturing method of the fingerprint identification module;
[0075] Figure 23 A Figure 9 Flowchart of a manufacturing method of the fingerprint identification module;
[0076] Figure 24 A Figure 10 Flowchart of a manufacturing method of the fingerprint identification module;
[0077] Figure 25 A Figure 11 Flowchart of a manufacturing method of the fingerprint identification module;
[0078] Figure 26 A Figure 12 Flowchart of a manufacturing method of the fingerprint identification module;
[0079] Figure 27 A Figure 13 Flowchart of a manufacturing method of the fingerprint identification module;
[0080] Figure 28 A Figure 14 Flowchart of a manufacturing method of the fingerprint identification module;
[0081] Figure 29 A Figure 15 Flowchart of a manufacturing method of the fingerprint identification module;
[0082] Figure 30 A structural schematic diagram of a display device provided by an embodiment of the present disclosure. DETAILED DESCRIPTION
[0083] In order to make the objects, technical solutions and advantages of the embodiments of the present disclosure clearer, the technical solutions of the embodiments of the present disclosure will be described clearly and completely below with reference to the drawings of the embodiments of the present disclosure. It should be noted that the sizes and shapes of the figures in the drawings do not reflect the true proportions, and the purpose is only to illustrate the present disclosure. And the same or similar reference numerals represent the same or similar elements or elements with the same or similar functions throughout. Obviously, the described embodiments are part of the embodiments of the present disclosure, rather than all the embodiments. Based on the described embodiments of the present disclosure, all other embodiments obtained by those of ordinary skill in the art without creative labor fall within the scope of protection of the present disclosure.
[0084] Unless otherwise defined, technical terms or scientific terms used herein should be understood as having the same meaning as commonly understood by one of ordinary skill in the art to which this disclosure belongs. The use of "first", "second" and similar words in the specification and claims of the present disclosure does not indicate any order, number or importance, but is only used to distinguish different components. "Include" or "contain" and similar words mean that the elements or objects before the word cover the elements or objects listed after the word and their equivalents, and do not exclude other elements or objects. "In", "out", "up", "down" and the like are only used to represent relative positional relationships, which may change accordingly when the absolute position of the described object changes.
[0085] In the current scheme for realizing fingerprint recognition by focusing the reflected light of the fingerprint to the photosensitive device (Sensor) by using microlenses (Microlens), one microlens corresponds to one photosensitive device. In the fingerprint recognition process, the reflected light of the valley or ridge is converged by the microlens and then irradiated onto the corresponding photosensitive device. However, the reflected light signal received by the photosensitive device in the above scheme is weak, which affects the accuracy of fingerprint recognition.
[0086] In view of the above problems existing in the related art, the present embodiment provides a fingerprint recognition module, as shown in Figure 1 and Figure 2 comprises:
[0087] a first substrate 01;
[0088] an image sensing layer 02 comprising a plurality of photosensitive devices 201 located above the first substrate 01;
[0089] A collimating optical layer 03 is located on the light-in side of the plurality of photosensitive devices 201; the collimating optical layer 03 comprises a plurality of light-transmitting holes H, the plurality of light-transmitting holes H are arranged in one-to-one correspondence with the partial photosensitive devices 201, and the orthographic projection of the light-transmitting hole H on the first substrate 01 is located within the orthographic projection of the corresponding photosensitive device 201;
[0090] A light guide layer 04 is located on the side of the collimating optical layer 03 away from the plurality of photosensitive devices 201; the light guide layer 04 comprises a plurality of microlenses 401, each microlens 401 completely covers the orthographic projection of one light-transmitting hole H and at least two photosensitive devices 201 on the first substrate 01, and each microlens 401 is configured to converge the light reflected by the finger and then transmit the light through the light-transmitting hole H covered thereby to one photosensitive device 201 covered thereby;
[0091] In the above-described fingerprint identification module provided by the embodiments of the present disclosure, one microlens 401 is arranged to correspondingly cover a plurality of photosensitive devices 201, so that the microlens 401 converges the reflected light that should be transmitted to the plurality of photosensitive devices 201 to one photosensitive device 201, thereby effectively improving the intensity of the reflected light received by the photosensitive device 201 and improving the accuracy of the fingerprint identification.
[0092] Specifically, polycarbonate (PC), liquid crystal polymer (LCP) or other materials with good light-transmitting property and stable properties can be used to manufacture the microlens 401. In addition, as shown in Figure 3 each photosensitive device 201 can comprise a metal electrode 2011, a photoelectric conversion layer 2012 and a light-transmitting electrode 2013 arranged in layers; the metal electrode 2011 is electrically connected with the drain or source of the first transistor 204 through a via hole penetrating through the first insulating layer 203, the light-transmitting electrode 2013 is electrically connected with the bias voltage line 208 through a via hole penetrating through the first planar layer 206 and the second insulating layer 207, and the photoelectric conversion layer 2012 is composed of a P-type semiconductor layer, an intrinsic semiconductor layer and an N-type semiconductor layer arranged in layers. Generally, the present disclosure can also comprise a first gate insulating layer 202 between the gate and the active layer of the first transistor 204, and a third insulating layer 209 and a scintillator layer 210 arranged in sequence on the side of the bias voltage line 208 away from the substrate. Optionally, the first transistor 204 can be a semiconductor (a-Si) transistor, a low-temperature polysilicon (LTPS) transistor or an oxide (Oxide) transistor; the first substrate 01 can be a silicon-based substrate or a glass-based substrate, which is not limited here.
[0093] Optionally, in the above-described fingerprint identification module provided by the embodiments of the present disclosure, as shown in Figure 1 and Figure 4 the center of the orthographic projection of the microlens 401 on the first substrate 01 coincides with the center of the orthographic projection of the light-transmitting hole H completely covered thereby.
[0094] The light transmission hole H in the collimating optical layer 03 has a collimating effect on the fingerprint reflected light, and in order to ensure good collimating effect, the light transmission hole H should not be too large. By setting the center of the orthographic projection of the microlens 401 on the first substrate 01 to coincide with the center of the orthographic projection of the light transmission hole H completely covered thereby, the light transmission hole H of smaller size can also completely transmit the converging light rays of the microlens 401 to the photosensitive device 201, thereby effectively ensuring the collimating effect on the fingerprint reflected light on the basis of improving the intensity of the fingerprint reflected light received by the photosensitive device 201.
[0095] It should be noted that, Figure 1 The shape of the light transmission hole H is only exemplarily shown as a circle, and in specific implementation, the shape of the light transmission hole H can also be a square, etc., which is not limited herein. In addition, Figure 1 The microlens 401 is specifically shown as being closely arranged, and one microlens 401 covers 3*3 photosensitive devices 201, of course, in specific implementation, the number of photosensitive devices 201 covered by one microlens 401 can be designed according to actual needs, which is not limited herein. However, in order to effectively ensure that the converging light rays of the microlens 401 can be transmitted to one photosensitive device 201 through the light transmission hole H, it is preferred that the microlens 401 covers X*X (X is an odd number greater than 1) photosensitive devices 201. At this time, the converging light rays of the microlens 401 are preferably transmitted to the (X+1) / 2th photosensitive device 201, and the aperture D of the microlens 401 and the length / width size P of the photosensitive device 201 satisfy the following relationship: D=X*P.
[0096] Optionally, in the above-mentioned fingerprint identification module provided by the embodiments of the present disclosure, as shown in Figure 2 The collimating optical layer 03 includes: a first light shielding layer 301, a first light transmission layer 302, a second light shielding layer 303 and a second light transmission layer 304 which are stacked, and the first light shielding layer 301 is adjacent to the plurality of photosensitive devices 201, and the second light transmission layer 304 is adjacent to the plurality of microlenses 401; wherein,
[0097] In the direction perpendicular to the first substrate 01, the distance L1 between the second light shielding layer 303 and the layer where the plurality of microlenses 401 are located is less than or equal to the focal length L2 of the microlens 401, and the ratio of the thickness of the first light transmission layer 302 to the thickness of the second light transmission layer 304 can be greater than or equal to 1 and less than or equal to 10, for example, specifically can be 1, 2, 3, 4, 5, 6, 7, 8, 9, 10, etc.; preferably greater than or equal to 3 and less than or equal to 5.
[0098] Since the fingerprint reflected light is diffused after being converged to the focal point by the microlens 401, in order to make the first light transmission hole H1 of the first light shielding layer 301 and the second light transmission hole H2 of the second light shielding layer 303 both small, the distance L1 between the second light shielding layer 303 and the layer where the plurality of microlenses 401 are located can be less than or equal to the focal length L2 of the microlens 401, and the ratio of the thickness of the second light transmission layer 304 to the thickness of the first light transmission layer 302 is greater than or equal to 1 and less than or equal to 10. In addition, the first light transmission layer 302 and the second light transmission layer 304 can be made of transparent resin such as polyimide (PI) to avoid as much as possible the loss of the fingerprint reflected light on the transmission path.
[0099] Optionally, in the fingerprint identification module provided in the embodiments of the present disclosure, as shown in Figure 2 , the orthographic projection of the first light transmission hole H1 on the first substrate 01 can be completely overlapped with the orthographic projection of the second light transmission hole H2, that is, the size of the first light transmission hole H1 is the same as that of the second light transmission hole H2.
[0100] The stray light transmitted through the gap between adjacent microlenses 401 can be irradiated to the adjacent first light transmission hole H1 through the second light transmission hole H2, which affects the fingerprint identification effect. By making the size of the first light transmission hole H1 the same as that of the second light transmission hole H2, the first light shielding layer 301 between the first light transmission holes H1 can be used to effectively shield the stray light, thereby improving the fingerprint imaging quality. In specific implementation, as shown in Figure 2 , the diameter d1 of the first light transmission hole H1 and the diameter d2 of the second light transmission hole H2 can be determined by the distance L1 between the second light shielding layer 303 and the layer where the plurality of microlenses 401 are located, the focal length L2 of the microlens 401, and the light collection angle θ to be achieved, specifically, d1 = d2 = 2*(L2-L1)*tanθ.
[0101] Optionally, in the fingerprint identification module provided in the embodiments of the present disclosure, as shown in Figure 4 and Figure 5 , the collimating optical layer 03 can further include a third light shielding layer 305 located between the second light transmission layer 304 and the layer where the plurality of microlenses 401 are located; wherein,
[0102] The orthographic projection of the third light shielding layer 305 on the first substrate 01 covers the gap between the microlenses 401 and overlaps with the edge area of the orthographic projection of the plurality of microlenses 401; for example, the edge area can account for 0.5%-20% of the area of the microlens 401 itself.
[0103] As shown in Figure 4It can be seen that although the microlenses 401 are closely arranged, the circular shape of the microlenses 401 still causes a gap between adjacent microlenses 401. During the fingerprint identification process, stray light passing through the gap can irradiate onto the photosensitive device 201, affecting the fingerprint identification. By arranging the third light shielding layer 305 to completely cover the gap, the stray light can be effectively shielded, thereby improving the accuracy of fingerprint identification.
[0104] Optionally, in the fingerprint identification module provided in the embodiments of the present disclosure, the thickness of the first light shielding layer 301, the second light shielding layer 303, and the third light shielding layer 305 can be greater than 0 μm and less than or equal to 3 μm, preferably 1 μm, and of course can also be 0.5 μm, 1.5 μm, 2 μm, 3 μm, etc. Optionally, in the fingerprint identification module provided in the embodiments of the present disclosure, the first light shielding layer 301, the second light shielding layer 303, and the third light shielding layer 305 can be made of a black matrix (BM) material, molybdenum oxide, aluminum oxide, or a light-absorbing or low-reflectivity material such as chromium metal, so as to reduce the degree of reflection of stray light at a large angle on the light shielding layer and improve the accuracy of fingerprint identification.
[0105] Optionally, in the fingerprint identification module provided in the embodiments of the present disclosure, as shown in Figure 5 , the light transmission hole H includes a first light transmission hole H1 located in the first light shielding layer 301 and a second light transmission hole H2 located in the second light shielding layer 303; wherein,
[0106] The orthogonal projection of the second light transmission hole H2 on the first substrate 01 is located within the orthogonal projection of the first light transmission hole H1.
[0107] Since Figure 5 the third light shielding layer 305 can effectively shield stray light, the size of the first light transmission hole H1 can be appropriately increased (for example, about 10% larger than the size of the second light transmission hole H2) to further increase the intensity of the fingerprint reflected light incident on the photosensitive device 201. Optionally, as shown in Figure 5 , the diameter d2 of the second light transmission hole H2 can be determined by the distance L1 between the second light shielding layer 303 and the layer where the microlenses 401 are located, the focal length L2 of the microlenses 401, and the desired light collection angle θ. Specifically, d2 = 2*(L2-L1)*tanθ, and correspondingly, the diameter d1 of the first light transmission hole H1 is approximately 2.2*(L2-L1)*tanθ. In addition, in Figure 5In the fingerprint identification module shown, if the first light shielding layer 301, the second light shielding layer 303 and the third light shielding layer 305 are planes (i.e. the thickness is ignored), the thickness M1 of the first light transmission layer 302 and the thickness M2 of the second light transmission layer 304 satisfy the following relationship: (d1-d2) / M1≤(M1+M2) / (N+d2 / 2), where N is the distance between the centers of adjacent microlenses 401. In specific implementation, 1≤M2 / M1≤10, preferably 3≤M2 / M1≤5 can be set.
[0108] Optionally, in the above fingerprint identification module provided by the embodiments of the present disclosure, at least one of the first light transmission layer 302 and the second light transmission layer 304 is multiplexed as a filter layer 05. Figure 2 And Figure 5 The first light transmission layer 302 is multiplexed as a filter layer 05 is specifically shown in. Since light above 600nm in the ambient light can be transmitted through the finger to irradiate on the microlens 401, multiplexing at least one of the first light transmission layer 302 and the second light transmission layer 304 as a filter layer 05 can effectively avoid the interference of ambient light and improve the fingerprint imaging effect. Moreover, multiplexing at least one of the first light transmission layer 302 and the second light transmission layer 304 as a filter layer 05 avoids adding a filter layer 05 in the fingerprint identification module, which is conducive to realizing thinness. Of course, in specific implementation, a filter layer 05 can also be separately provided. Specifically, the filter layer 05 can be provided between the layer where the plurality of photosensitive devices 201 are located and the collimating optical layer 03, or between the adjacent second light transmission layer 304 and the second light shielding layer 303, or between the collimating optical layer 03 and the layer where the plurality of microlenses 401 are located. Figure 6 And Figure 7 Figure 8 And Figure 9 Optionally, the filter layer 05 can be composed of a plurality of high refractive index film layers and a plurality of low refractive index film layers, and the thickness of the filter layer 05 can be 1 μm.
[0109] Optionally, in the above fingerprint identification module provided by the embodiments of the present disclosure, as shown in Figure 2 , Figures 5 to 9 The image sensing layer 02, the collimating optical layer 03, the light guiding layer 04 and the filter layer 05 are film layers stacked on the first substrate 01; or as shown in Figures 10 to 15 The collimating optical layer 03, the light guiding layer 04 and the filter layer 05 are film layers stacked on the second substrate 06, and the image sensing layer 02 is a film layer on the first substrate 01, and the plurality of photosensitive devices 201 and the above-mentioned second substrate 06 are bonded by an optical adhesive layer 07.
[0110] In addition, the present disclosure also provides a set of comparative data of the fingerprint identification module in the related art and the fingerprint identification module provided by the present disclosure. Specifically, the stacking relationship of each film layer in the structure of the fingerprint identification module in the related art is the same as that shown in Figure 2 The long / width dimension of the photosensitive device 201 is 3.5 μm, and the light collection angle θ of the light transmission hole H is ±4.5°. The difference lies in that one microlens 401 corresponds to one photosensitive device 201 in the related art, and the aperture of the microlens 401 is 3.5 μm, the arch height is 1 μm, the thickness of the first light transmission layer 302 is 6 μm, and the thickness of the second light transmission layer 304 is 3 μm. Figure 2 One microlens 401 corresponds to three photosensitive devices 201 in the related art, and the aperture of the microlens 401 is 10 μm, the arch height is 3.5 μm, the thickness of the first light transmission layer 302 is 10 μm, and the thickness of the second light transmission layer 304 is 2 μm. The results show that the transmittance of the reflected light of the fingerprint in the related art is 22%, and the total energy of the reflected light received by a single photosensitive device 201 is 0.023. Figure 2 The transmittance of the reflected light of the fingerprint in the related art is 19%, and the total energy of the reflected light received by a single photosensitive device 201 is 0.191. It can be seen that, under the condition that the thickness of the fingerprint identification module is similar, the fingerprint identification module provided by the present disclosure improves the intensity of the reflected light received by the photosensitive device 201, thereby improving the accuracy of fingerprint identification.
[0111] In addition, the present disclosure also provides comparative data of the fingerprint identification module in the foregoing related art and the fingerprint identification module provided by the present disclosure, in which the first light transmission layer 302 is multiplexed as a light filter 05. Specifically, the signal amount (Signal) of the fingerprint identification module in the foregoing related art is 28.87, the signal-to-noise ratio (SNR) is 15.68, and the fingerprint imaging is as shown in Figure 16 The signal amount (Signal) of the fingerprint identification module in the present disclosure, in which the first light transmission layer 302 is multiplexed as a light filter 05, is 38.19, the signal-to-noise ratio (SNR) is 26.83, and the fingerprint imaging is as shown in Figure 17 It can be seen that, after the light filtering function of the light filter 05 is added in the present disclosure, the signal amount and the signal-to-noise ratio are significantly improved, and the fingerprint image is clearer.
[0112] Correspondingly, the present disclosure also provides a manufacturing method for the above-mentioned fingerprint identification module. Since the principle of solving the problem of the manufacturing method is similar to that of the above-mentioned fingerprint identification module, the implementation of the manufacturing method can be referred to the implementation of the above-mentioned fingerprint identification module, and the repeated parts will not be described herein.
[0113] Specifically, for the manufacturing method of the fingerprint identification module as shown in Figure 2 , Figures 5 to 9 the manufacturing method is as shown in Figures 18 to 23As shown, the method can include the following steps:
[0114] providing a substrate;
[0115] sequentially fabricating, on the substrate, an image sensing layer comprising a plurality of photosensitive devices, a collimating optical layer, and a light guiding layer comprising a plurality of microlenses;
[0116] the collimating optical layer comprises a plurality of light transmission holes, the plurality of light transmission holes are arranged one-to-one corresponding to the photosensitive devices, and the orthographic projection of the light transmission hole on the substrate is located within the orthographic projection of the corresponding photosensitive device;
[0117] each microlens completely covers the orthographic projection of at least two photosensitive devices and one light transmission hole on the substrate, and the microlens is configured to converge the light reflected by the finger and transmit the light to the photosensitive device through the light transmission hole.
[0118] In specific implementation, for the fingerprint identification module as shown in Figure 2 and Figure 5 , since the first light transmission layer 302 is multiplexed as the light filtering layer 05, the above specific steps can be used for fabrication, as shown in Figure 18 and Figure 19 . For the fingerprint identification module as shown in Figure 6 and Figure 7 , after the image sensing layer 02 comprising a plurality of photosensitive devices 201 is fabricated on the substrate, and before the collimating optical layer 03 is fabricated, a light filtering layer 05 needs to be fabricated on the image sensing layer 02 comprising a plurality of photosensitive devices 201, as shown in Figure 20 and Figure 21 . For the fingerprint identification module as shown in Figure 8 and Figure 9 , after the second light shielding layer 303 is fabricated, and before the second light transmission layer 304 is fabricated, a light filtering layer 05 needs to be fabricated on the second light filtering layer 303, as shown in Figure 22 and Figure 23 .
[0119] Specifically, for the method of fabricating the fingerprint identification module as shown in Figures 10 to 15 , the method can include the following steps, as shown in Figures 24 to 29 .
[0120] providing a first substrate;
[0121] fabricating, on the first substrate, an image sensing layer comprising a plurality of photosensitive devices;
[0122] providing a second substrate;
[0123] The light filtering layer, the collimating optical layer and the light guide layer comprising a plurality of microlenses are manufactured on the second substrate; wherein the collimating optical layer comprises a plurality of light transmission holes, and the orthographic projection of each microlens on the substrate completely covers one light transmission hole;
[0124] The second substrate with the light filtering layer, the collimating optical layer and the plurality of microlenses is bonded with the light-incident side of the plurality of photosensitive devices by using optical glue, so that after the bonding, the plurality of light transmission holes are arranged one-to-one with the partial photosensitive devices, and the orthographic projection of the light transmission hole on the substrate is located within the orthographic projection of the corresponding arranged photosensitive device, while the orthographic projection of each microlens on the substrate completely covers the orthographic projection of at least two photosensitive devices, and each microlens is configured to converge the light reflected by the finger and then transmit the light to one photosensitive device through the light transmission hole covered by the microlens.
[0125] In specific implementation, for the fingerprint identification module shown in Figure 10 The light filtering layer, the collimating optical layer and the plurality of microlenses are manufactured on the second substrate, which can be implemented by the following manner:
[0126] As shown in Figure 24 The first light transmission layer 302, the second light shielding layer 303 and the second light transmission layer 304 are sequentially manufactured on the second substrate 06; wherein the first light transmission layer 302 is multiplexed as the light filtering layer 05, the thickness of the second light transmission layer 304 perpendicular to the second substrate 06 is less than or equal to the focal length of the to-be-manufactured microlens 401, and the second light shielding layer 303 comprises a plurality of second light transmission holes.
[0127] The plurality of microlenses 401 are manufactured on the second light transmission layer 304, and the orthographic projection of each microlens 401 on the second substrate 06 completely covers the orthographic projection of at least two photosensitive devices 201 and one second light transmission hole.
[0128] The first light shielding layer 301 is manufactured on the side of the second substrate 06 away from the first light transmission layer 302, the first light shielding layer 301 comprises a plurality of first light transmission holes completely coinciding with the plurality of second light transmission holes in the direction perpendicular to the second substrate 06, and the first light shielding layer 301, the first light transmission layer 302, the second light shielding layer 303 and the second light transmission layer 304 constitute the collimating optical layer 03.
[0129] In specific implementation, Figure 11 The manufacturing method of the fingerprint identification module shown in Figure 10 is similar to the manufacturing method of the fingerprint identification module shown in Figure 25 After the second light transmission layer 304 is manufactured, and before the plurality of microlenses 401 are manufactured, a third light shielding layer 305 needs to be manufactured, wherein the third light shielding layer 304 covers the gap between the microlenses 401 and the edge region of the microlenses 401.
[0130] In a specific implementation, for the fingerprint identification module shown in Figure 12 The filter layer, the collimating optical layer and the plurality of microlenses are made on the second substrate, which can be implemented in the following manner:
[0131] As shown in Figure 26 The filter layer 05 and the second light-transmitting layer 304 are made on the second substrate 06 in sequence, and the sum of the thicknesses of the second substrate 06, the filter layer 05 and the second light-transmitting layer 304 in the direction perpendicular to the second substrate 06 is less than or equal to the focal length of the microlens 401 to be made;
[0132] The plurality of microlenses 401 are made on the second light-transmitting layer 304, and the orthographic projection of each microlens 401 on the second substrate 304 completely covers the orthographic projection of the light-blocking layer containing one light-transmitting hole and at least two photosensitive devices 201 to be made;
[0133] The second light-blocking layer 303, the first light-transmitting layer 302 and the first light-blocking layer 301 are made on the side of the second substrate 06 away from the filter layer 05 in sequence; wherein the first light-blocking layer 301 and the second light-blocking layer 302 comprise a plurality of light-transmitting holes completely coinciding in the direction perpendicular to the second substrate 06, and the first light-blocking layer 301, the first light-transmitting layer 302, the second light-blocking layer 303 and the second light-transmitting layer 304 constitute the collimating optical layer 03.
[0134] In a specific implementation, Figure 13 The method for making the fingerprint identification module shown in Figure 12 is similar to the method for making the fingerprint identification module shown in Figure 27 After the second light-transmitting layer 304 is made and before the plurality of microlenses 401 are made, a third light-blocking layer 305 needs to be made, wherein the third light-blocking layer 304 covers the gaps between the microlenses 401 and the edge regions of the microlenses 401.
[0135] In a specific implementation, for the fingerprint identification module shown in Figure 14 The filter layer, the collimating optical layer and the plurality of microlenses are made on the second substrate, which can be implemented in the following manner:
[0136] As shown in Figure 28 The filter layer 05, the first light-blocking layer 301, the first light-transmitting layer 302, the second light-blocking layer 303, the second light-transmitting layer 304 and the plurality of prisms 04 are made on the second substrate 06 in sequence; wherein,
[0137] The first light shielding layer 301 and the second light shielding layer 302 include a plurality of light-transmitting holes in a direction perpendicular to the second base substrate 06, and the first light shielding layer 301, the first light-transmitting layer 302, the second light shielding layer 303 and the second light-transmitting layer 304 constitute a collimating optical layer 03;
[0138] The orthographic projection of each microlens 401 on the second base substrate 06 completely covers one light-transmitting hole and the orthographic projections of at least two photosensitive devices 201 .
[0139] In specific implementation, Figure 15 The manufacturing method of the fingerprint recognition module shown is Figure 14 The manufacturing method of the fingerprint recognition module is similar to that shown in the figure, and the only difference is that: Figure 29 As shown, after forming the second light-transmitting layer 304 and before forming the plurality of microlenses 401 , a third light-shielding layer 305 needs to be formed, wherein the third light-shielding layer 304 covers the gaps between the microlenses 401 and the edge regions of the microlenses 401 .
[0140] Based on the same inventive concept, the present disclosure provides a display device, such as Figure 30 As shown, it includes a display module 08, a fingerprint recognition module located on the opposite side of the display surface of the display module 08, and an adhesive layer 09 located between the display module 08 and the fingerprint recognition module; wherein the fingerprint recognition module is the fingerprint recognition module described above, and the orthographic projection of the adhesive layer 09 on the display module 08 is located in the frame area of the display module 08 (i.e., the peripheral area of the display area AA), so that an air layer (air gap) surrounded by the adhesive layer 09 is provided between the multiple microlenses 401 and the display module 08. Optionally, the adhesive layer 09 can be an optical adhesive (OCA) or a photosensitive adhesive (OCR). The display module 08 can be an organic electroluminescent (OLED) display module, a quantum dot (QLED) light-emitting display module, or a micro-light-emitting diode (Micro-LED) display module.
[0141] Specifically, when the display module 08 can be an organic electroluminescent (OLED) display module, as shown in FIG. Figure 30As shown, the display module 08 can specifically include: a third substrate 801, a second gate insulating layer 802, an interlayer insulating layer 803, a second transistor 804, an anode 806, a pixel defining layer 807, a light-emitting functional layer R / G / B, a support layer 808, a cathode 809, an encapsulation layer 810, an adhesive layer 811 and a protective cover plate 812. In the fingerprint identification process, the reflected light of the fingerprint F is transmitted to the microlens 401 through the area between the anodes 806, and is transmitted to a photosensitive device 201 through the collimating optical layer 03 after being converged by the microlens 401. Since one microlens 401 corresponds to cover multiple photosensitive devices 201, the microlens 401 can converge the reflected light that should be transmitted to multiple photosensitive devices 201 to one of the photosensitive devices 201, thereby effectively improving the intensity of the reflected light received by the photosensitive device 201 and improving the accuracy of fingerprint identification.
[0142] Optionally, the display device can be: a mobile phone, a tablet computer, a television, a display, a notebook computer, a digital photo frame, a navigator, a smart watch, a fitness wristband, a personal digital assistant, etc. Any product or component with display function. Other essential components of the display device should be understood by those skilled in the art, and will not be described here. In addition, since the display device solves the problem by the same principle as the above-mentioned fingerprint identification module, the implementation of the display device can refer to the above-mentioned embodiments of the fingerprint identification module, and the repeated parts will not be described here.
[0143] Obviously, those skilled in the art can make various modifications and variations to the embodiments of the present application without departing from the spirit and scope of the embodiments of the present application. Thus, if these modifications and variations of the embodiments of the present application fall within the scope of the claims of the present application and their equivalent technologies, the present application also intends to include these modifications and variations.
Claims
1. A fingerprint identification module, wherein, The application relates to a fingerprint recognition device. The device comprises: a substrate; an image sensing layer comprising a plurality of photosensitive devices on the substrate; a collimating optical layer on the light-incident side of the plurality of photosensitive devices; the collimating optical layer comprises a first light-blocking layer, a first light-transmitting layer, a second light-blocking layer, a second light-transmitting layer, a third light-blocking layer between the second light-transmitting layer and a layer where a plurality of microlenses are located, and a plurality of light-transmitting holes; the third light-blocking layer covers the gaps between the microlenses and overlaps with the edge area of the microlenses in the substrate; the first light-blocking layer is adjacent to the plurality of photosensitive devices, the second light-transmitting layer is adjacent to the plurality of microlenses, the plurality of light-transmitting holes are arranged one-to-one with part of the photosensitive devices, and the light-transmitting holes are arranged in the photosensitive devices in the substrate; the light-transmitting holes comprise first light-transmitting holes in the first light-blocking layer and second light-transmitting holes in the second light-blocking layer; the second light-transmitting holes are arranged in the first light-transmitting holes in the substrate; the first light-transmitting layer and / or the second light-transmitting layer are multiplexed as a filter layer; the diameter d1 of the first light-transmitting hole and the diameter d2 of the second light-transmitting hole satisfy (d1-d2) / M1≤(M1+M2) / (N+d2 / 2), M1 is the thickness of the first light-transmitting layer, M2 is the thickness of the second light-transmitting layer, and N is the distance between the centers of adjacent microlenses; 2. The fingerprint identification module of claim 1, wherein, a light guide layer on the side of the collimating optical layer away from the plurality of photosensitive devices; the light guide layer comprises a plurality of microlenses; the microlenses are arranged one-to-one with the light-transmitting holes; each microlens covers the light-transmitting holes and the photosensitive devices in the substrate; and each microlens is configured to converge the light reflected by a finger and transmit the light to the photosensitive devices through the light-transmitting holes.
3. The fingerprint identification module of claim 1, wherein, The center of the microlens in the substrate coincides with the center of the light-transmitting hole covered by the microlens.
4. The fingerprint identification module of claim 1, wherein, In the direction perpendicular to the substrate, the distance between the second light-blocking layer and the layer where the plurality of microlenses are located is less than or equal to the focal length of the microlenses, and the ratio of the thickness of the second light-transmitting layer to the thickness of the first light-transmitting layer is greater than or equal to 1 and less than or equal to 10.
5. The fingerprint identification module of claim 1, wherein, In the direction perpendicular to the substrate, the thickness of the first light-blocking layer, the second light-blocking layer and the third light-blocking layer is greater than 0 mu m and less than or equal to 3 mu m.
6. The fingerprint identification module of claim 1, wherein, The material of the first light-blocking layer, the second light-blocking layer and the third light-blocking layer is black matrix material, molybdenum oxide, aluminum oxide or chromium metal. Further comprising:
7. The fingerprint identification module of claim 6, wherein, a filter layer between the layer where the plurality of microlenses are located and the collimating optical layer, or between the collimating optical layer and the layer where the plurality of photosensitive devices are located, or between the adjacent light-blocking layer and the light-transmitting layer.
8. The fingerprint identification module of claim 6, wherein, The filter layer is configured to filter out ambient light above 600 nm. The image sensing layer, the collimating optical layer, the light guide layer and the filter layer are film layers arranged in layers on the substrate.
9. The fingerprint identification module according to any one of claims 1-6, wherein, Also comprising: An optical adhesive layer in contact with the surface of the substrate away from the side of the plurality of photosensitive devices.
10. A display device, wherein, The display module, the fingerprint identification module located on the opposite side of the display surface of the display module, and the adhesive layer located between the display module and the fingerprint identification module; wherein, The fingerprint identification module is the fingerprint identification module according to any one of claims 1-9; The normal projection of the adhesive layer on the display module is located in the frame area of the display module.
11. A method for manufacturing a fingerprint identification module, wherein, Comprising: Providing a substrate; An image sensing layer comprising a plurality of photosensitive devices, a collimating optical layer, and a light guide layer comprising a plurality of microlenses are sequentially fabricated on the substrate; wherein, The collimating optical layer comprises a first light shielding layer, a first light transmission layer, a second light shielding layer, a second light transmission layer, a third light shielding layer located between the second light transmission layer and the layer where the plurality of microlenses are located, and a plurality of light transmission holes. The normal projection of the third light shielding layer on the substrate covers the gap between each microlens and overlaps with the normal projection edge area of the plurality of microlenses. The first light shielding layer is adjacent to the plurality of photosensitive devices, the second light transmission layer is adjacent to the plurality of microlenses, the plurality of light transmission holes are arranged one-to-one corresponding to part of the photosensitive devices, and the normal projection of the light transmission hole on the substrate is located within the normal projection of the corresponding photosensitive device. The light transmission hole comprises a first light transmission hole in the first light shielding layer and a second light transmission hole in the second light shielding layer, and the normal projection of the second light transmission hole on the substrate is located within the normal projection of the first light transmission hole. The first light transmission layer and / or the second light transmission layer are multiplexed as a filter layer. The diameter d1 of the first light transmission hole and the diameter d2 of the second light transmission hole satisfy (d1-d2) / M1≤(M1+M2) / (N+d2 / 2), M1 is the thickness of the first light transmission layer, M2 is the thickness of the second light transmission layer, and N is the distance between the centers of adjacent microlenses. Each microlens completely covers the normal projection of one light transmission hole and at least two photosensitive devices on the substrate, and each microlens is configured to converge the light reflected by the finger and transmit it to the covered photosensitive device through the covered light transmission hole.
12. A method for manufacturing a fingerprint identification module, wherein, Comprising: Providing a first substrate; Fabricating an image sensing layer comprising a plurality of photosensitive devices on the first substrate; Providing a second substrate; The filter layer, the collimating optical layer and the light guide layer comprising a plurality of microlenses are manufactured on the second substrate; wherein the collimating optical layer comprises a first light shielding layer, a first light transmission layer, a second light shielding layer, a second light transmission layer, a third light shielding layer between the second light transmission layer and the layer where the plurality of microlenses are located, and a plurality of light transmission holes, the third light shielding layer covers the gap between the microlenses in the orthographic projection on the substrate and overlaps with the orthographic projection edge area of the plurality of microlenses; the first light shielding layer is adjacent to the plurality of photosensitive devices, and the second light transmission layer is adjacent to the plurality of microlenses; the orthographic projection of each microlens on the substrate completely covers a light transmission hole; the light transmission hole comprises a first light transmission hole in the first light shielding layer and a second light transmission hole in the second light shielding layer, the orthographic projection of the second light transmission hole on the substrate is located in the orthographic projection of the first light transmission hole; the first light transmission layer and / or the second light transmission layer are multiplexed as a filter layer; the diameter d1 of the first light transmission hole and the diameter d2 of the second light transmission hole satisfy (d1-d2) / M1≤(M1+M2) / (N+d2 / 2), M1 is the thickness of the first light transmission layer, M2 is the thickness of the second light transmission layer, and N is the distance between the centers of adjacent microlenses; The second substrate with the filter layer, the collimating optical layer and the plurality of microlenses is bonded to the light entrance side of the plurality of photosensitive devices using optical glue, so that after bonding, the plurality of light transmission holes are arranged one-to-one with part of the photosensitive devices, and the orthographic projection of each light transmission hole on the substrate is located in the orthographic projection of the corresponding photosensitive device, while the orthographic projection of each microlens on the substrate completely covers the orthographic projection of at least two photosensitive devices, and each microlens is configured to converge the light reflected by the finger and transmit it to one of the photosensitive devices through the light transmission hole covered by it.
13. The production method according to claim 12, wherein The filter layer, the collimating optical layer and the plurality of microlenses are manufactured on the second substrate, specifically comprising: The first light transmission layer, the second light shielding layer and the second light transmission layer are sequentially manufactured on the second substrate; wherein the first light transmission layer is multiplexed as a filter layer, the thickness of the second light transmission layer perpendicular to the second substrate is less than or equal to the focal length of the to-be-manufactured microlens, and the second light shielding layer comprises a plurality of second light transmission holes; The third light shielding layer and a plurality of microlenses are manufactured on the second light transmission layer, and the orthographic projection of each microlens on the second substrate completely covers the orthographic projection of one second light transmission hole and at least two photosensitive devices; A first light shielding layer is manufactured on the side of the second substrate away from the first light transmission layer, the first light shielding layer comprises a plurality of first light transmission holes completely coinciding with the plurality of second light transmission holes in the direction perpendicular to the second substrate, and the first light shielding layer, the first light transmission layer, the second light shielding layer and the second light transmission layer constitute the collimating optical layer.
14. The production method according to claim 12, wherein Manufacturing a light filtering layer, a collimating optical layer and a plurality of microlenses on the second substrate, specifically comprising: Manufacturing the light filtering layer and the second light transmitting layer on the second substrate in sequence, and the sum of the thicknesses of the second substrate, the light filtering layer and the second light transmitting layer in the direction perpendicular to the second substrate is less than or equal to the focal length of the microlens to be manufactured; Manufacturing the third light shielding layer and a plurality of the microlenses on the second light transmitting layer, and the orthographic projection of each of the microlenses on the second substrate completely covers the orthographic projection of one light transmitting hole and at least two photosensitive devices contained in the light shielding layer to be manufactured; Manufacturing a second light shielding layer, a first light transmitting layer and a first light shielding layer on the side of the second substrate away from the light filtering layer in sequence; wherein the first light shielding layer and the second light shielding layer comprise a plurality of the light transmitting holes completely coinciding in the direction perpendicular to the second substrate, and the first light shielding layer, the first light transmitting layer, the second light shielding layer and the second light transmitting layer constitute the collimating optical layer.
15. The method of claim 12, wherein, Manufacturing a light filtering layer, a collimating optical layer and a plurality of microlenses on the second substrate, specifically comprising: Manufacturing the light filtering layer, the first light shielding layer, the first light transmitting layer, the second light shielding layer, the second light transmitting layer, the third light shielding layer and a plurality of prisms on the second substrate in sequence; wherein, The first light shielding layer and the second light shielding layer comprise a plurality of the light transmitting holes in the direction perpendicular to the second substrate, and the first light shielding layer, the first light transmitting layer, the second light shielding layer and the second light transmitting layer constitute the collimating optical layer; The orthographic projection of each of the microlenses on the second substrate completely covers the orthographic projection of one light transmitting hole and at least two photosensitive devices.
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