Apparatus for processing a substrate and method for processing a substrate

Abstract

The present inventive concept provides a substrate processing apparatus and a method of substrate processing. The substrate processing apparatus comprises a first process processing unit configured to process a substrate in a single method, a second process processing unit configured to process a substrate in a batch method, and a posture changing unit provided between the first process processing unit and the second process processing unit and configured to change a posture of the substrate between a vertical posture and a horizontal posture, and wherein the substrate is loaded to and unloaded from the first process processing unit.

Description

[0001] Cross-reference to related applications

[0002] This application claims priority and benefit to Korean Patent Application No. 10-2021-0150990, filed with the Korean Intellectual Property Office on November 5, 2021, the entire contents of which are incorporated herein by reference. Technical Field

[0003] The embodiments of the inventive concept described herein relate to a substrate processing apparatus and a substrate processing method. Background Technology

[0004] To manufacture semiconductor devices, desired patterns are formed on a substrate (e.g., a wafer) through various processes such as photolithography, etching, ashing, ion implantation, and thin-film deposition. Various processing liquids and gases are used in each process, and particles and process byproducts are generated during the process. To remove the thin films, particles, and process byproducts from the substrate, liquid processing processes are performed before and after each process. In a general liquid processing process, the substrate is treated with chemicals and rinsing solutions before drying. In liquid processing, SiN on the substrate can be stripped.

[0005] Furthermore, substrate treatment methods using treatment solutions such as chemicals and / or rinsing solutions can be divided into batch-type treating methods, which process multiple substrates in batches, and single-type treating methods, which process substrates one by one.

[0006] In batch processing methods that collectively process multiple substrates, substrate processing is performed by immersing multiple substrates in a vertical orientation into a treatment bath containing chemicals or rinsing solution. This results in excellent mass productivity and uniform processing quality across each substrate. However, in batch processing methods, multiple substrates with patterns formed on their top surfaces are immersed vertically. Therefore, if the patterns formed on the substrates have a high aspect ratio, pattern tilting may occur during processes such as lifting the substrates. Furthermore, if a rapid drying process is not performed while the multiple substrates are exposed to air for a short period, watermarks may appear on some of the exposed substrates.

[0007] On the other hand, in a single-processing method that processes substrates one by one, substrate processing is performed by supplying chemicals or rinsing solutions to individual substrates rotating in a horizontal orientation. Furthermore, in this single-processing method, the risk of pattern tilting is reduced because the transported substrates are kept horizontal, and the risk of watermarking is reduced because the substrates are processed individually and then immediately dried or liquid-treated. However, in the case of a single-processing method, the mass production capability of substrate processing is poor, and the processing quality between individual substrates is relatively uneven compared to batch processing methods.

[0008] Furthermore, if the substrate is spin-dried, there is a concern that if the pattern formed on the substrate has a high aspect ratio, tilting may occur, in which the pattern formed on the substrate may collapse. Summary of the Invention

[0009] The present invention provides a substrate processing apparatus and method for effectively processing a substrate.

[0010] The present invention provides a substrate processing apparatus and method for improving the mass productionability of substrate processing.

[0011] The embodiments of the present invention provide a substrate processing apparatus and method for improving the uniformity of processing quality between each substrate.

[0012] The present invention provides a substrate processing apparatus and method for minimizing the risk of watermarking on a substrate.

[0013] The present invention provides a substrate processing apparatus and method for minimizing the occurrence of tilting phenomena in patterns formed on a substrate.

[0014] The present invention provides a substrate processing apparatus and method for efficiently processing a substrate on which a high aspect ratio pattern is formed.

[0015] The present invention provides a substrate processing apparatus and method for minimizing the generation of fume and reducing the size of the device to increase space utilization.

[0016] The technical objectives of this invention are not limited to those described above, and other unmentioned technical objectives will become apparent to those skilled in the art from the following description.

[0017] The present invention provides a substrate processing apparatus. The substrate processing apparatus includes: a first process unit configured to process a substrate using a single-process method; a second process unit configured to process substrates using a batch-process method; and a posture changing unit disposed between the first process unit and the second process unit and configured to change the posture of the substrate between a vertical posture and a horizontal posture, wherein the substrate is loaded into and unloaded from the first process unit.

[0018] In one embodiment, the attitude change unit includes: an attitude change manipulator for changing the attitude of a substrate between a vertical attitude and a horizontal attitude; an attitude change processing bath having a storage space for storing the substrate; and a support member positioned within the storage space of the attitude change processing bath and supporting the substrate whose attitude has been changed to a vertical attitude by the attitude change manipulator.

[0019] In one embodiment, the first process unit includes: a liquid processing unit configured to process the substrate in a single manner by supplying a first processing liquid to the substrate in a horizontal orientation; and a buffer unit configured to store the substrate in a horizontal orientation that has already been processed in the liquid processing unit.

[0020] In the implementation, the attitude change robot moves between the buffer unit and the attitude change processing bath, and the attitude change robot changes the substrate with a horizontal attitude stored in the buffer unit to a vertical attitude for transfer to the attitude change processing bath, and changes the substrate with a vertical attitude stored in the attitude change processing bath to a horizontal attitude for transfer to the buffer unit.

[0021] In one embodiment, the second process unit includes: a plurality of batch processing baths for batch processing of substrates; and a transfer unit configured to transfer substrates between the orientation change processing bath and the plurality of batch processing baths.

[0022] In one embodiment, the multiple batch processing baths include: a first batch processing bath for batch processing the substrate by supplying a second processing liquid to the substrate; and a second batch processing bath for batch processing the substrate by supplying a third processing liquid to the substrate.

[0023] In the implementation scheme, the first process unit includes: an organic solvent processing unit configured to perform a single-processing of the substrate by supplying an organic solvent to the substrate; a supercritical processing unit configured to perform a single-processing of the substrate by supplying a drying fluid to the substrate; and a transfer processing unit configured to transfer the substrate between the buffer unit, the liquid processing unit, the organic solvent processing unit, and the drying processing unit.

[0024] In one embodiment, the first process unit includes a loading port unit configured to include a plurality of loading ports, wherein a portion of the plurality of loading ports is configured as a first loading port unit for loading a horizontally oriented substrate, and the remaining portion of the plurality of loading ports is configured as a second loading port unit for unloading a horizontally oriented substrate.

[0025] In one embodiment, the posture-changing manipulator includes: a hand configured to hold a substrate; and an arm that moves the hand.

[0026] In one embodiment, the substrate processing apparatus further includes a controller, wherein the controller controls the substrate to sequentially perform: a substrate loading step for loading a horizontally oriented substrate into a loading port of a first process unit; a first single-processing step for processing the horizontally oriented substrate in a liquid processing unit of the first process unit; a first orientation changing step for changing the orientation of the substrate from horizontal to vertical; a batch processing step for processing a vertically oriented substrate in a second process unit; a second orientation changing step for changing the orientation of the substrate from vertical to horizontal; a second single-processing step for processing the horizontally oriented substrate in the first process unit; and a substrate unloading step for unloading the horizontally oriented substrate into the loading port of the first process unit.

[0027] The present invention provides a substrate processing apparatus. The substrate processing apparatus includes: a first process unit configured to process a substrate using a single-process method; a second process unit configured to process substrates using a batch-process method; a third process unit configured to process substrates using a single-process method; a first orientation changing unit disposed between the first and second process units and configured to change the orientation of the substrate between a vertical and a horizontal orientation; and a second orientation changing unit disposed between the second and third process units and configured to change the orientation of the substrate between a vertical and a horizontal orientation, wherein the second process unit is disposed between the first and third process units, and the substrate is configured to be loaded and unloaded using a single-process method.

[0028] In one embodiment, the substrate is loaded into a first process unit and unloaded by a second process unit.

[0029] In one embodiment, the first process unit includes: a first loading port unit configured to include a plurality of loading ports for loading a horizontally oriented substrate at the plurality of loading ports; a liquid processing unit configured to perform a single-processing of the horizontally oriented substrate by supplying a first processing liquid to the substrate; and a first buffer unit configured to store the horizontally oriented substrate that has been processed in the liquid processing unit. The third process unit includes: an organic solvent processing unit configured to perform a single-processing of the horizontally oriented substrate by supplying an organic solvent to the substrate; a drying processing unit configured to perform a single-processing of the horizontally oriented substrate by supplying a drying liquid to the substrate; and a second buffer unit configured to store the horizontally oriented substrate that has been single-processed in both the organic solvent processing unit and the drying processing unit.

[0030] In one embodiment, the first attitude change unit includes: a first attitude change manipulator for changing the attitude of a substrate between a vertical attitude and a horizontal attitude; a first attitude change processing bath having a storage space for storing the substrate; and a first support member positioned within the storage space of the first attitude change processing bath, and supporting the substrate whose attitude has been changed to a vertical attitude by the first attitude change manipulator, wherein the first attitude change manipulator changes the substrate in a horizontal attitude stored in a first buffer unit to a vertical attitude for transfer to the first attitude change processing bath.

[0031] In one embodiment, the second attitude change unit includes: a second attitude change manipulator for changing the attitude of a substrate between a vertical attitude and a horizontal attitude; a second attitude change processing bath having a storage space for storing the substrate; and a second support member positioned within the storage space of the second attitude change processing bath, supporting the substrate whose attitude has been changed to a vertical attitude by the second attitude change manipulator, wherein the second attitude change manipulator changes the substrate stored in the second attitude change processing bath from a vertical attitude to a horizontal attitude for transfer to the second buffer unit.

[0032] In one embodiment, the second process unit includes: a plurality of batch processing baths for batch processing of substrates; and a transfer unit configured to transfer substrates between a first attitude change processing bath, a second attitude change processing bath, and the plurality of batch processing baths, wherein the plurality of batch processing baths includes: a first batch processing bath for batch processing of substrates by supplying a second processing liquid to the substrates; and a second batch processing bath for batch processing of substrates by supplying a third processing liquid to the substrates.

[0033] In one embodiment, the first posture changing unit includes a first posture changing robot that changes the posture of the substrate from a horizontal posture to a vertical posture, and the second posture changing unit includes a second posture changing robot that changes the posture of the substrate from a vertical posture to a horizontal posture, wherein each of the first posture changing robot and the second posture changing robot includes: a hand configured to hold the substrate; and an arm that moves the hand.

[0034] In one embodiment, the substrate processing apparatus further includes a controller, wherein the controller controls the substrate to sequentially perform: a substrate loading step for loading a horizontally oriented substrate into a loading port of a first process unit; a first single-processing step for processing the horizontally oriented substrate in the first process unit; a first orientation changing step for changing the orientation of the substrate from horizontal to vertical; a batch processing step for processing the vertically oriented substrate in a second process unit; a second orientation changing step for changing the orientation of the substrate from vertical to horizontal; a second single-processing step for processing the horizontally oriented substrate in a third process unit; and a substrate unloading step for unloading the horizontally oriented substrate into a loading port of the third process unit.

[0035] In the implementation scheme, vertical orientation refers to the orientation of the top or bottom surface of the substrate being parallel to a direction perpendicular to the ground, and horizontal orientation refers to the orientation of the top or bottom surface of the substrate being parallel to the ground.

[0036] In the implementation scheme, the first treatment liquid is a removal liquid for removing oxide film on the substrate, the second treatment liquid is a chemical for removing contaminants remaining on the substrate, and the third treatment liquid is pure water.

[0037] According to the embodiments of the present invention, the substrate can be processed effectively.

[0038] According to the embodiments conceived in this invention, the mass productionability of substrate processing can be improved.

[0039] According to the embodiments of the present invention, the uniformity of processing quality among individual substrates can be improved.

[0040] According to the embodiments of the present invention, the risk of watermarks being generated on the substrate can be minimized.

[0041] According to the embodiments of the present invention, the tilting phenomenon of the pattern formed on the substrate can be minimized.

[0042] According to the embodiments of the present invention, substrates with patterns having a high aspect ratio can be processed effectively.

[0043] According to the embodiments of the present invention, the generation of flue gas can be minimized, and the size of the device can be reduced to increase the space utilization of the device.

[0044] The effects of this invention are not limited to those described above, and other effects not mentioned will become apparent to those skilled in the art from the following description. Attached Figure Description

[0045] Referring to the following figures, the above and other objects and features will become apparent from the following description, wherein, unless otherwise stated, the same reference numerals refer to the same parts throughout the figures, and wherein: Figure 1 This is a schematic top view illustrating a substrate processing apparatus according to an embodiment of the present invention.

[0046] Figure 2 It shows Figure 1 A substrate processing device installed in a single liquid processing chamber.

[0047] Figure 3 It shows Figure 1 A substrate processing device installed in a single-stage drying chamber.

[0048] Figure 4 It shows Figure 1 The state of the buffer unit.

[0049] Figure 5 It shows Figure 1 The state of the treatment bath is changed by the posture.

[0050] Figure 6 schematically shown Figure 1 The robotic arm that changes posture.

[0051] Figure 7 It shows Figure 6 The hands.

[0052] Figure 8 It shows Figure 1 Any of the batch processing baths.

[0053] Figure 9 This is a schematic top view illustrating a substrate processing apparatus according to an embodiment of the present invention.

[0054] Figure 10 It shows the use of Figure 1 substrate processing device or Figure 2 A flowchart of a substrate processing method for a substrate processing apparatus.

[0055] Figure 11 and Figure 12 It shows in Figure 10 In the second attitude change step, the attitude change robot changes the attitude of the substrate to a horizontal state.

[0056] Figure 13 The execution was shown Figure 10 The posture change of the robotic arm during the wetting step.

[0057] Figure 14 It is shown in Figure 9 A top view of the state of the wetting fluid supplied by the liquid supply component during the wetting process.

[0058] Figure 15 It is shown in Figure 10 A side view of the state of the wetting liquid supplied by the liquid supply component during the wetting process.

[0059] Figure 16 The hand is shown according to another embodiment of the concept of the present invention.

[0060] Figure 17 It shows Figure 15 A top view of the liquid supply component supplying wetting fluid to the substrate.

[0061] Figure 18 An attitude-changing robotic arm according to another embodiment of the present invention is shown.

[0062] Figure 19 This is a top view showing a hand according to another embodiment of the concept of the present invention.

[0063] Figure 20 yes Figure 18 Side view of the middle hand.

[0064] Figure 21 This is a top view showing a hand according to another embodiment of the concept of the present invention.

[0065] Figure 22 yes Figure 19 Side view of the retainer. Detailed Implementation

[0066] The inventive concept can be modified in various ways and can take many forms, and specific embodiments thereof will be shown and described in detail in the accompanying drawings. However, embodiments of the inventive concept are not intended to limit the specific forms disclosed, and it should be understood that the inventive concept includes all variations, equivalents, and substitutions contained within its spirit and technical scope. In the description of the inventive concept, detailed descriptions of relevant known technologies will be omitted where such obscurity is unnecessarily made unclear.

[0067] The terminology used herein is for the purpose of describing particular embodiments only and is not intended to limit the inventive concept. As used herein, unless the context clearly indicates otherwise, the singular forms “a,” “an,” and “the” are intended to also include the plural forms. It should also be understood that, as used in this specification, the terms “comprise,” “comprising,” “include,” and / or “including” specify the presence of stated features, integers, steps, operations, elements, and / or components, but do not exclude the presence or addition of one or more other features, integers, steps, operations, elements, components, and / or groups thereof. As used herein, the term “and / or” includes any and all combinations of one or more of the associated listed items. Furthermore, the term “embodiment” is intended to refer to an embodiment or example.

[0068] It should be understood that although the terms "first," "second," "third," etc., may be used herein to describe various elements, components, regions, layers, and / or segments, these elements, components, regions, layers, and / or segments should not be limited by these terms unless otherwise stated. These terms are used only to distinguish one element, component, region, layer, and / or segment from another. Therefore, the first element, first component, first region, first layer, or first segment discussed below may be referred to as a second element, second component, second region, second layer, or second segment without departing from the teachings of the inventive concept.

[0069] It should be understood that when an element or layer is referred to as "on another element or layer," "connected to," "attached to," or "covering" another element or layer, the element or layer may be directly on, connected to, attached to, or cover another element or layer, or there may be intermediate elements or layers. Conversely, when an element is referred to as "directly on another element or layer," "directly connected to," or "directly attached to," there may be no intermediate elements or layers. Other terms such as "between," "adjacent," and "close to" should be interpreted in the same manner.

[0070] Unless otherwise defined, all terms used herein (including technical or scientific terms) have the same meaning as commonly accepted by one of ordinary skill in the art to which the inventive concept pertains. Unless expressly defined in this application, terms such as those defined in common dictionaries should be interpreted as consistent with the content of the relevant art, rather than as ideal or overly formal.

[0071] Furthermore, the components of the transfer substrate W described below (such as the transfer unit or transfer robot below) can be referred to as transfer modules.

[0072] In the following text, reference will be made to Figures 1 to 22 Describe an embodiment of the present invention.

[0073] Figure 1 This is a schematic top view illustrating a substrate processing apparatus according to an embodiment of the present invention.

[0074] refer to Figure 1According to an embodiment of the present invention, the substrate processing apparatus 1 may include a first process processing unit 10, an orientation changing unit 20, a second process processing unit 30, and a controller 900. When viewed from above, the first process processing unit 10 and the second process processing unit 30 may be arranged along a first direction X. Hereinafter, when viewed from above, the direction perpendicular to the first direction X is referred to as the second direction Y, and the direction perpendicular to both the first direction X and the second direction Y is referred to as the third direction Z.

[0075] The first process unit 10 can process the substrate W in a single method. The first process unit 10 can load or unload the horizontally oriented substrate W. The first process unit 10 can process the horizontally oriented substrate W. The first process unit 10 may include a loading port unit 110, an indexing unit 120, an organic solvent processing unit 140, a drying processing unit 150, a buffer unit 160, and a transfer processing unit 170. The loading port unit 110 and the indexing unit 120 may be referred to as indexing modules, and the liquid processing unit 130, the organic solvent processing unit 140, the drying processing unit 150, the buffer unit 160, and the transfer processing unit 170 are referred to as process modules.

[0076] Loading port unit 110 may include multiple loading ports. A transfer container F, which stores at least one substrate W, may be placed on a loading port of loading port unit 110. Multiple substrates W may be stored in transfer container F. For example, 25 substrates may be stored in transfer container F. Transfer container F may be referred to as a cassette, box, front-opening unified pod (FOUP), etc. Transfer container F may be loaded and unloaded on loading port unit 110 by a container transfer device.

[0077] The substrate W stored in the transfer container F, located in a portion of the multiple loading port unit 110, can be an unprocessed substrate W. An unprocessed substrate W can be, for example, a substrate W on which no processing has occurred, or a substrate W on which some processing has occurred but requires liquid treatment. The substrate W stored in the transfer container F, located in the remaining portion of the multiple loading ports, can be a substrate W processed by the first process unit 10 and the second process unit 30. In other words, a portion of the multiple loading ports can be used to load the substrate W to be processed, and the remaining portion of the multiple loading ports can be used to unload the processed substrate W from the substrate processing apparatus 1. For example, refer to... Figure 1The loading port unit 110 may include four loading ports. Two of the four loading ports may be configured as first loading port units in which untreated substrate W is loaded, and the other two loading ports may be configured as second loading port units in which treated substrate W is unloaded. Although the number of loading ports is shown as four in this specification, the number is not limited to this and may be provided in various numbers depending on conditions such as process efficiency or floor space requirements.

[0078] Furthermore, the container F containing the unprocessed substrate W can be placed solely in the loading port unit 110. In other words, the loading port unit 110 can perform only the task of loading the substrate W that needs to be processed.

[0079] Indexing unit 120 can be coupled to loading port unit 110. Indexing unit 120 and loading port unit 110 can be arranged along a second direction Y. First indexing unit 120 may include indexing robot 122. Indexing robot 122 can remove unprocessed substrate W or substrate requiring processing from container F mounted on loading port unit 110. Indexing robot 122 can remove substrate W from container F and feed the substrate into process module. Indexing robot 122 can remove substrate W from container F and transfer substrate W to liquid processing unit 130 or buffer unit 160 in process module, which will be described later. Indexing robot 122 can transfer processed substrate W to container F mounted on loading port unit 110. Indexing robot can transfer processed substrate W stored in buffer unit 160 to container F placed on loading port. Indexing robot 122 can deliver processed substrate W to container F, which is placed on loading port included in second loading port unit of loading port unit 110. The container can be transported to the outside of the substrate processing unit 1 via an item transfer device (e.g., an OHT (Overhead Hoist Transport)).

[0080] The indexing robot 122 may have hands capable of holding and transporting substrates W. The indexing robot 122 may have multiple hands, portions of which may be used solely for removing substrates W from the container F and transporting them to the process module, while other portions of the multiple hands may be used solely for transporting the processed substrates W from the process module to the container F. The hands of the indexing robot 122 may be a single hand used for transporting substrates W one by one. The hands of the indexing robot 122 may be configured to be movable along a first direction X, a second direction Y, and a third direction Z. Furthermore, the hands of the indexing robot 122 may be configured to be rotatable about the third direction Z as a rotation axis.

[0081] Figure 2 It shows Figure 1 The state of the substrate processing apparatus installed in a single liquid processing chamber.

[0082] refer to Figure 2 The liquid processing unit 130 can process the substrate in a single manner. Multiple liquid processing units 130 can be provided. Multiple liquid processing units 130 can be provided and stacked vertically. The liquid processing unit 130 can rotate the horizontally oriented substrate W, but it can also supply a first processing liquid to the rotating substrate W to process the substrate W. The liquid processing unit 130 can process the substrate W one by one. The first processing liquid supplied from the liquid processing unit 130 can be a processing liquid capable of etching an oxide film on the substrate W. For example, the first processing liquid supplied from the liquid processing unit 130 can be diluted hydrofluoric acid (DHF). The liquid processing unit 130 can supply the first processing liquid to the rotating substrate W and can rotate the substrate W to process the substrate W.

[0083] The substrate processing apparatus 400 can be configured to perform single liquid processing at the liquid processing unit 130. The substrate processing apparatus 400 may include a housing 410, a processing container 420, a support unit 440, a lifting / lowering unit 460, and a liquid supply unit 480.

[0084] The housing 410 has a processing space 412 therein. The housing 410 may have a cylindrical shape with a space therein. The internal space 412 of the housing 410 may house a processing container 420, a support unit 440, a lifting / lowering unit 460, and a liquid supply unit 480. When viewed from the top surface, the housing 410 may have a rectangular shape. However, the inventive concept is not limited thereto, and the housing 410 may be modified to have various shapes that can have the processing space 412.

[0085] Processing container 420 has a cylindrical shape with an open top. Processing container 420 has an inner recovery container 422 and an outer recovery container 426. Each of recovery containers 422 and 426 recovers different processing liquids from the processing fluid used in the process. The inner recovery container 422 is configured in an annular shape around a support unit 440, and the outer recovery container 426 is configured in an annular shape around the inner recovery container 422. The internal space 422a of the inner recovery container 422 and the inner recovery container 422 serve as a first inlet 422a through which the processing liquid flows into the inner recovery container 422. The space 426a between the inner recovery container 422 and the outer recovery container 426 serves as a second inlet 426a through which the processing liquid flows into the outer recovery container 426. According to an embodiment, each of inlets 422a and 426a can be positioned at a different height. Recovery lines 422b and 426b are connected below the bottom surface of each of the recovery containers 422 and 426. The treatment fluid drawn into each of the recovery containers 422 and 426 can be reused and supplied to an external treatment fluid regeneration system (not shown) via recovery lines 422b and 426b.

[0086] Support unit 440 supports substrate W in processing space 412. During the process, support unit 440 supports and rotates substrate W. Support unit 440 includes support plate 442, support pin 444, chuck pin 446, and rotation drive members 448 and 449.

[0087] The support plate 442 is configured as a generally circular plate and has a top surface and a bottom surface. The bottom surface has a smaller diameter than the top surface. That is, the support plate 442 can have a shape with a wide top and narrow bottom structure, having a wide top surface and a narrow bottom surface. The top and bottom surfaces are positioned such that their central axes coincide with each other. Furthermore, a heating device (not shown) can be disposed at the support plate 442. The heating device disposed at the support plate 442 can heat the substrate W placed on the support plate 442. The heating device can generate heat. The heat generated by the heating device can be hot or cold. The heat generated by the heating device can be transferred to the substrate W placed on the support plate 442. Furthermore, the heat transferred to the substrate W can heat the processing liquid supplied to the substrate W. The heating device can be a heater and / or a cooling coil. However, the inventive concept is not limited thereto, and the heating device can be modified in various ways using known devices.

[0088] Multiple support pins 444 are provided. The support pins 444 are spaced apart at a predetermined distance at the edge of the top surface of the support plate 442 and protrude upward from the support plate 442. The support pins 444 are arranged in a ring shape that is integrally formed by combining with each other. The support pins 444 support the edge of the bottom surface of the substrate W, such that the substrate W is spaced apart from the top surface of the support plate 442 at a predetermined distance.

[0089] Multiple chuck pins 446 are provided. The chuck pins 446 are positioned further away from the center of the support plate 442 than the support pins 444. The chuck pins 446 are configured to project upwards from the top surface of the support plate 442. The chuck pins 446 support the sides of the substrate W such that the substrate W does not separate from its correct position in the lateral direction when the support plate 442 rotates. The chuck pins 446 are configured to move linearly between an outer position and an inner position in the radial direction of the support plate 442. The outer position is a position further away from the center of the support plate 442 than the inner position. The chuck pins 446 are positioned at the outer position when the substrate W is loaded onto or unloaded from the support plate 442, and at the inner position when a process is performed on the substrate W. The inner position is the position where the chuck pins 446 and the sides of the substrate W contact each other, and the outer position is the position where the chuck pins 446 and the substrate W are spaced apart from each other.

[0090] Rotary drive members 448 and 449 rotate support plate 442. Support plate 442 can be rotated about a central axis by rotary drive members 448 and 449. Rotary drive members 448 and 449 include support shaft 448 and drive unit 449. Support shaft 448 has a cylindrical shape facing a fourth direction 16. The top end of support shaft 448 is fixedly connected to the bottom surface of support plate 442. According to an embodiment, support shaft 448 can be fixedly connected to the center of the bottom surface of support plate 442. Drive unit 449 provides driving force to rotate support shaft 448. Support shaft 448 can be rotated by drive unit 449, and support plate 442 can rotate together with support shaft 448.

[0091] The lifting / lowering unit 460 linearly moves the processing container 420 in the up / down direction. As the processing container 420 moves up and down, its relative height changes relative to the support plate 442. If the substrate W is loaded onto or unloaded from the support plate 442, the processing container 420 descends, causing the support plate 442 to protrude above it. Furthermore, if a process is being performed, the height of the processing container 420 is adjusted so that the processing liquid flows into predetermined recovery containers 422 and 426 depending on the type of processing liquid supplied to the substrate W. The lifting / lowering unit 460 has a support 462, a moving shaft 464, and a driver 466. The support 462 is fixedly mounted on the outer wall of the processing container 420 and is fixedly connected to the support 462 by the moving shaft 464, which moves in the up / down direction via the driver 466. Selectively, the lifting / lowering unit 460 linearly moves the support plate 442 in the up / down direction.

[0092] Liquid supply unit 480 can supply a first processing liquid to substrate W. The first processing liquid can be a chemical. In an embodiment, the first processing liquid can be a processing liquid capable of etching an oxide film on the substrate. In an embodiment, diluted hydrofluorocarbon (DHF) can be used.

[0093] The liquid supply unit 480 may include a moving member 481 and a nozzle 489. The moving member 481 moves the nozzle 489 between a process position and a standby position. The process position is the position where the nozzle 489 faces the substrate W supported by the support unit 440. According to an embodiment, the process position is the position where processing liquid is discharged to the top surface of the substrate W. The process position also includes a first supply position and a second supply position. The first supply position may be a position closer to the center of the substrate W than the second supply position, and the second supply position may be a position including an end of the substrate. Alternatively, the second supply position may be a region adjacent to the end of the substrate. The standby position is defined as the position where the nozzle 489 is deviated from the process position. According to an embodiment, the standby position may be a position where the nozzle 489 is idle before or after the processing on the substrate W is completed.

[0094] The moving member 481 includes an arm 482, a support shaft 483, and a driver 484. The support shaft 483 is positioned on the side of the processing container 420. The support shaft 483 has a rod-like shape in the third direction Z along its length, and the support shaft 483 can be configured to be rotatable by the driver 484. The support shaft 483 is configured to be able to move up and down. The arm 482 is coupled to the top end of the support shaft 483. The arm 482 extends vertically from the support shaft 483. A nozzle 489 is coupled to the end of the arm 482. When the support shaft 483 rotates, the nozzle 489 can swing together with the arm 482. The nozzle 489 can swing to a process position and a standby position. Optionally, the arm 482 can be configured to be able to move forward and backward along its length. When viewed from above, the path through which the nozzle 489 moves can be aligned with the central axis of the substrate W at the process position.

[0095] The organic solvent processing unit 140 may be equipped with a substrate processing apparatus in which liquid processing is performed in a single method. The substrate processing apparatus provided to the organic solvent processing unit 140 may have the same characteristics as those provided to the organic solvent processing unit 140. Figure 1 The substrate processing device 400 on the liquid processing unit 130 shown has the same structure. Therefore, the same reference numerals are assigned to the same structures, and redundant descriptions are omitted.

[0096] Multiple organic solvent processing units 140 can be provided. These multiple organic solvent processing units 140 can be stacked vertically. Each organic solvent processing unit 140 can rotate a horizontally oriented substrate W, but it can also supply processing liquid to the rotating substrate W to process it. The organic solvent processing unit 140 can process the substrate W one by one. The processing liquid supplied from the organic solvent processing unit 140 can be replaced with a rinsing liquid (described later) and provided as a liquid capable of removing rinsing liquid residues on the surface of the substrate W. For example, the processing liquid supplied from the organic solvent processing unit 140 can be an organic solvent. For example, the processing liquid supplied from the organic solvent processing unit 140 can be isopropyl alcohol (IPA). The organic solvent processing unit 140 can supply organic solvent to the rotating substrate W, and the substrate W can be dried by rotating it. Conversely, the organic solvent processing unit 140 supplies organic solvent to the rotating substrate W, and, after wetting the substrate W with organic solvent, transfers the substrate to the drying processing unit 150 (described later) so that the substrate W can be dried in the drying processing unit 150.

[0097] Figure 3 It shows Figure 1 A substrate processing device installed in a single drying chamber.

[0098] refer to Figure 3 A substrate processing apparatus 500, in which a single substrate drying process is performed, can be provided in the drying processing unit 150. In the drying processing unit 150, processing liquid remaining on the substrate W can be removed using a drying fluid G in a supercritical state. The drying processing unit 500 can be a supercritical chamber that uses a supercritical fluid to remove processing liquid (e.g., rinsing liquid or organic solvent) remaining on the substrate W. For example, the substrate processing apparatus 500 provided in the drying processing unit 150 can perform a drying process to remove organic solvents remaining on the substrate W using carbon dioxide (CO2) in a supercritical state.

[0099] The substrate processing apparatus 500 disposed in the drying processing unit 150 may include a body 510, a heating member 520, a fluid supply unit 530, a fluid discharge unit 550, and a lifting / lowering member 560. The body 510 may have an internal space 518 in which the substrate W is processed. The body 510 may provide an internal space 518 in which the substrate W is processed. The body 510 may provide an internal space 518 in which the substrate W is dried by a drying fluid in a supercritical state.

[0100] The body 510 may include a top body 512 and a bottom body 514. The top body 512 and the bottom body 514 may be joined together to form an internal space 518. A substrate W may be supported in the internal space 518. For example, the substrate W may be supported in the internal space 518 by a support member (not shown). The support member may be configured to support the bottom surface of an edge region of the substrate W. Either the top body 512 or the bottom body 514 may be coupled to a lifting / lowering member 560 to be moved in the up / down direction. For example, the bottom body 514 may be coupled to the lifting / lowering member 560 and may be moved in the up / down direction via the lifting / lowering member 560. Therefore, the internal space 518 of the body 510 may be selectively sealed. Although, as an embodiment, the bottom body 514 is coupled to the lifting / lowering member 560 and moves in the up / down direction in the embodiments described above, the inventive concept is not limited thereto. For example, the top body 512 may be coupled to the lifting / lowering member 560 to move in the up / down direction.

[0101] The heating element 520 can heat the dry fluid supplied to the internal space 518. The heating element 520 can increase the temperature of the internal space 518 of the body 510 to transform the dry fluid supplied to the internal space 518 into a supercritical state. In addition, the heating element 520 can increase the temperature of the internal space 518 of the body 510, thereby maintaining the supercritical dry fluid supplied to the internal space 518 in a supercritical state.

[0102] Furthermore, the heating element 520 can be embedded in the body 510. For example, the heating element 520 can be embedded in either the top body 512 or the bottom body 514. For example, the heating element 520 can be disposed in the bottom body 514. However, the inventive concept is not limited thereto, and the heating element 520 can be disposed in various locations capable of increasing the temperature of the interior space 518. Furthermore, the heating element 520 can be a heater. However, the inventive concept is not limited thereto, and the heating element 520 can be modified from various known devices capable of increasing the temperature of the interior space 518.

[0103] The fluid supply unit 530 can supply dry fluid to the internal space 518 of the body 510. The dry fluid supplied by the fluid supply unit 530 may include carbon dioxide (CO2). The fluid supply unit 530 may include a fluid supply source 531, a first supply line 533, a first supply valve 535, a second supply line 537, and a second supply valve 539.

[0104] The fluid supply source 531 can store drying fluid and / or supply drying fluid to the internal space 518 of the body 510. The fluid supply source 531 can supply drying fluid to a first supply line 533 and / or a second supply line 537. For example, a first supply valve 535 can be installed on the first supply line 533. Furthermore, a second supply valve 539 can be installed on the second supply line 537. The first supply valve 535 and the second supply valve 539 can be on / off valves. Depending on the opening / closing of the first supply valve 535 and the second supply valve 539, the drying fluid can selectively flow through the first supply line 533 or the second supply line 537.

[0105] In the above embodiments, the first supply line 533 and the second supply line 537 are connected to a fluid supply source 531, but are not limited thereto. For example, multiple fluid supply sources 531 may be provided, the first supply line 533 may be connected to any one of the multiple fluid supply sources 531, and the second supply line 537 may be connected to another fluid supply source 531.

[0106] Additionally, the first supply line 533 can be a top supply line that supplies dry gas from above the interior space 518 of the body 510. For example, the first supply line 533 can supply dry gas into the interior space 518 of the body 510 in a top-to-bottom direction. For example, the first supply line 533 can be connected to the top body 512. Furthermore, the second supply line 537 can be a bottom supply line that supplies dry gas from below the interior space 518 of the body 510. For example, the second supply line 537 can supply dry gas into the interior space 518 of the body 510 in a bottom-to-top direction. For example, the second supply line 537 can be connected to the bottom body 514.

[0107] The fluid discharge unit 550 can discharge the dried fluid from the internal space 518 of the body 510.

[0108] Buffer unit 160 can provide storage space for temporarily storing substrate W. Buffer unit 160 can temporarily store substrate W processed by liquid processing unit 130, organic solvent processing unit 140, and drying processing unit 150. Furthermore, buffer unit 160 can store substrate W processed by batch-type second process processing unit 30 (described later). Buffer unit 160 may include a plurality of buffer units 160, each of which can store substrate W processed by liquid processing unit 130, substrate W processed by organic solvent processing unit 140, substrate W processed by drying processing unit 150, and substrate W processed by second process processing unit 30.

[0109] The buffer unit 160 can be disposed on one side of the transfer processing unit 170 (described later). When viewed from above, the buffer unit 160 can open toward the attitude change unit 20 (described later). Therefore, the attitude change robot 220 can change the attitude of the substrate W in the attitude change processing bath 210 and transfer the attitude-changed substrate W to the buffer unit 160. Furthermore, the substrate W transferred to the buffer unit 160 can be removed by the first transfer robot 172 of the transfer processing unit 170. The removed substrate W can be transferred to the single-function organic solvent processing unit 140 and / or the single-function drying processing unit 150.

[0110] Figure 4 It shows Figure 1 The state of the buffer unit.

[0111] refer to Figure 4The buffer unit 160 may have a structure that supplies wetting liquid to the storage space to prevent the substrate W sent into the storage space from drying out (in order to maintain the wettability of the substrate W). In addition, the substrate W stored in the buffer unit 160 may be stored in the corresponding storage space divided in the buffer unit 160.

[0112] The buffer unit 160 may include a support frame 161, a discharge baffle 162, a wetting nozzle 163, and a discharge line 164.

[0113] Multiple support frames 161, discharge baffles 162, and wetting nozzles 163 can be provided to correspond to each substrate W fed into the buffer unit 160. The support frame 161 can support the substrate W within the space provided in the buffer unit 160. Furthermore, a weight sensor 161a can be mounted on the support frame 161. The weight sensor senses the weight of the substrate W supported by the support frame 161, thereby determining the amount of wetting liquid W supplied to the substrate W.

[0114] The controller 900 can adjust the amount of wetting liquid WL sprayed from the wetting nozzle 163 per unit time based on the weight of the substrate W supported by the support frame 161. The support frame 161 can be configured to support the bottom surface of one side and the other side of the substrate W.

[0115] The wetting nozzle 163 can be configured to spray the wetting liquid in a flowing or spraying manner. Multiple wetting nozzles 163 can be provided. A pair of wetting nozzles 163 can spray the wetting liquid onto the substrate W to reach each substrate W. The wetting nozzle 163 may include chemicals or nozzles for supplying a mist, which can maintain the wettability of the substrate W returned to the storage space of the buffer unit 160. The chemicals or mist can be supplied as a wetting liquid selected from isopropyl alcohol (IPA), the aforementioned chemicals, and the aforementioned rinsing liquid.

[0116] A drain partition wall 162 can be disposed below the support frame 161. The drain partition wall 162 can be disposed below each substrate W supported on the support frame 161. The drain partition wall 162 can function as a liquid receiver to receive the wetting liquid sprayed by the wetting nozzle 163, and can divide the space in which the respective substrate W is disposed. The drain partition wall 162 has a square column shape with an open top to provide a liquid receiving space, and the liquid receiving space of the drain partition wall 162 can be connected to a drain line 164. Therefore, the wetting liquid sprayed by the wetting nozzle 163 can be discharged to the outside.

[0117] The transfer processing unit 170 may be disposed between the buffer unit 160 and the substrate processing unit for processing the substrate W in a single method. The liquid processing unit 130 and the buffer unit 160 may be disposed on one side of the transfer processing unit 170, and the organic solvent processing unit 140 and the drying processing unit 150 may be disposed on the other side of the transfer processing unit 170.

[0118] The transfer processing unit 170 may include a first transfer robot 172. The first transfer robot 172 may have a single transfer hand for transferring one substrate W at a time. The first transfer robot 172 can transfer substrates W between the liquid processing unit 130 and the buffer unit 160. The first transfer robot 172 can remove substrates W from the liquid processing unit 130 and transfer them to the buffer unit 160. In this case, the posture-changing robot 220 (described later) can transfer substrates W fed into the buffer unit 160 to the second process processing unit 30. The first transfer robot 172 can transfer substrates W between the buffer unit 160, the organic solvent processing unit 140, and the drying processing unit 150. The first transfer robot 172 can transfer substrates W fed into the buffer unit 160 to the organic solvent processing unit 140. The first transfer robot 172 can transfer substrates W processed by the organic solvent processing unit 140 to the drying processing unit 150. The first transfer robot 172 transfers the substrate W processed by the drying unit 150 to the buffer unit 160, and the indexing robot 122 can remove the substrate W from the buffer unit 160 and bring the substrate W into the container F placed in the loading port. That is, the transfer processing unit 170 can transfer the substrate W between the buffer unit 160 and the substrate processing unit that processes the substrate W in a single method.

[0119] Return to reference Figure 1The attitude change unit 20 can change the attitude of the substrate W. The attitude change unit 20 can be disposed between a first process unit 10 that processes the substrate W using a single-process method and a second process unit 30 that processes the substrate W using a batch-process method. The attitude change unit 20 can be disposed between the first process unit 10 that processes the substrate W in a horizontal orientation and the second process unit 30 that processes the substrate W in a vertical orientation. The attitude change unit 20 can change the attitude of the substrate W between a vertical orientation and a horizontal orientation. The attitude change unit 20 can change a substrate W with a vertical orientation to a horizontal orientation. The attitude change unit 20 can change a substrate W with a horizontal orientation that has been processed in the liquid processing unit 130 of the first process unit 10 or stored in the buffer unit 160 of the first process unit 10 to a vertical orientation. The orientation change unit 20 can change the orientation of the substrate W, so that the vertically oriented substrate W processed in the second process processing unit 30 can be post-processed in the organic solvent processing unit 140 and the drying processing unit 150 of the first process processing unit 10, relative to a substrate W in a horizontal orientation.

[0120] Figure 5 It shows Figure 1 The posture changes the state of the treatment bath.

[0121] refer to Figure 5 The attitude change treatment bath 210 may include a treatment bath 211, a support member 212, a supply line 213, and a recovery line 214.

[0122] The treatment bath 211 may have a cylindrical shape with an open top. The treatment bath 211 may also have a square columnar shape with an open top. The treatment bath 211 may have receiving spaces A and B therein for storing the treatment liquid L. The treatment liquid L stored in the treatment bath 211 may be an aqueous liquid. The type of the treatment liquid L stored in the treatment bath 211 may be the same type of wetting liquid sprayed from the buffer unit 160. For example, the treatment liquid L stored in the treatment bath 211 and the wetting liquid sprayed from the buffer unit 160 may both be aqueous liquids.

[0123] Support member 212 can be disposed in receiving spaces A and B to support substrate W. Support member 212 can be configured to support multiple substrates W. For example, support member 212 can be configured to support 50 substrates W. Support member 212 can be arranged such that a pair of rod-shaped bodies face each other, and a support groove (not shown) is formed in each body through which substrate W can be supported.

[0124] Supply line 213 can supply treatment fluid L to containment spaces A and B. Recovery line 214 can discharge treatment fluid L from containment spaces A and B. A valve is installed in each of supply line 213 and recovery line 214 and can adjust the amount of treatment fluid L stored in the containment spaces (i.e., containment spaces (A, B)) to a set level based on the level of treatment fluid L sensed by a level sensor (not shown).

[0125] Furthermore, the accommodating spaces A and B may include a support area A and a posture-changing area B. The support area A may be the area where the support member 212 supports the substrate W. The posture-changing area B may be the area where the posture of the substrate W is changed by the posture-changing robot 220 (described later).

[0126] Return to reference Figure 1 The attitude-changing robot 220 can be disposed on one side of the attitude-changing processing bath 210. The attitude-changing robot 220 can be disposed between the attitude-changing processing bath 210 and the transfer processing unit 170. The attitude-changing robot 220 can be disposed between the attitude-changing processing bath 210 and the buffer unit 160. The attitude-changing robot 220 can transfer the substrate W between the buffer unit 160 and the attitude-changing processing bath 210. The attitude-changing robot 220 may include a hand 230 and a joint unit 240. The hand 230 can be connected to the joint unit 240. The joint unit 240 can change the position of the hand 230.

[0127] Figure 6 schematically shown Figure 1 The robotic arm changes its posture. (Reference) Figure 6 In the attitude change processing bath 210, the attitude change robot 220 can change the attitude of the substrate W between a vertical attitude and a horizontal attitude. The attitude change robot 220 can transfer the substrate W stored in the buffer unit 160 to the attitude change processing bath 210, and change the horizontal attitude of the substrate W to a vertical attitude in the attitude change processing bath 210. Furthermore, the attitude change robot 220 can change the attitude of the substrate W from a vertical attitude to a horizontal attitude in the attitude change processing bath 210, and transfer the substrate W to the buffer unit 160 of the first process processing unit 10. The attitude change robot 220 can be a multi-joint robot. The attitude change robot 220 can be a six-axis multi-joint robot.

[0128] The joint unit 240 can be a multi-joint arm consisting of at least two or more axes. For example, the joint unit 240 can be a 6-axis multi-joint arm. The joint unit 240 can change the position of the hand 230 by moving the hand 230 in at least one of the first direction X, the second direction Y, and the third direction Z. Furthermore, the joint unit 240 can rotate the hand 230 based on one of the axes of the first direction X, the second direction Y, and the third direction Z.

[0129] The attitude change manipulator 220 may include a base 241, a rotating body 242, a first arm 243, a second arm 244, a third arm 245, and a fourth arm 246.

[0130] The base 241 can be connected to the rotating body 242. The rotating body 242 can rotate relative to the base 241. The rotating body 242 can rotate about a direction perpendicular to the ground as an axis of rotation. The first arm 243 can be connected to the rotating body 242. The first arm 243 can rotate about a horizontal direction as an axis of rotation relative to the rotating body. The second arm 244 can be connected to the first arm 243. The second arm 244 can rotate about a horizontal direction as an axis of rotation relative to the first arm 243. The third arm 245 can be connected to the second arm 244. The third arm 245 can rotate about a length direction of the second arm 244 (or the length direction of the third arm 245) as an axis of rotation. The fourth arm 246 can rotate about a length direction perpendicular to the third arm 245 as an axis of rotation. Furthermore, the fourth arm 246 can rotate the hand 230. For example, the fourth arm 246 can have a rotation axis (not shown) capable of rotating the hand 230. The hand 230 can rotate about a direction perpendicular to the rotation axis of the fourth arm 246 as an axis of rotation.

[0131] Figure 7 It shows Figure 6 Hands. (Reference) Figure 7 The hand 230 of the posture-changing manipulator 220 may include a support 231, a first guide 232, a second guide 233, a drive member 234, a clamping body 235, a fastening body 236, a vision member 237, and a liquid supply member 238.

[0132] The support body 231 can support the bottom surface of the substrate W. The support body 231 can support the top surface on which the pattern of the substrate W is formed, the bottom surface on which no pattern is formed, and the bottom surface of the substrate W. In other words, the substrate W can be placed on the support body 231.

[0133] The first guide portion 232 and the second guide portion 233 can be disposed in the support body 231. The first guide portion 232 can be a support pad close to the fastener 236 (described later). The second guide portion 233 can be a support pad away from the fastener 236 (described later). Each of the first guide portion 232 and the second guide portion 233 can be disposed in pairs. The first guide portion 232 and the second guide portion 233 can support the bottom surface and / or side surface of the substrate W. The first guide portion 232 and the second guide portion 233 can have a stepped shape on their top surfaces. For example, the height of the inner region of the bottom surface of the substrate W in the top surface of the first guide portion 232 can be lower than the height of the outer region of the bottom surface of the substrate W. Similarly, the height of the inner region of the bottom surface of the substrate W in the top surface of the second guide portion 233 can be lower than the height of the outer region of the bottom surface of the substrate W. That is, the substrate W can be placed on the support body 231 via the first guide portion 232 and the second guide portion 233 mounted on the support body 231. The substrate W placed on the support 231 should be interpreted as including not only the case where the support 231 and the substrate W are in direct contact, but also the case where the substrate W is placed on the first guide portion 232 and the second guide portion 233 mounted on the support 231.

[0134] The drive member 234 can be fastened to the fastener 236. The drive member 234 can be a driver capable of moving the clamping body 235 in the lateral direction. A pair of drive members 234 can be provided. For example, the drive member 234 can be configured to correspond to each of the paired clamping bodies 235. The pair of drive members 234 can move the pair of clamping bodies 235 in the lateral direction. The clamping bodies 235 can move in a direction close to the substrate W and in a direction away from the substrate W, thus clamping the substrate W placed on the support 231. In other words, the support 231 and the clamping bodies 235 can be the body that holds the substrate W.

[0135] The fastener 236 can be a body for connecting the clamping body 235 and the support body 231 to the joint 220-R. The fastener 236 can also be a body for connecting the clamping body 235 and the support body 231 to the fourth arm 246 of the joint 220-R. The fastener 236 can be fastened to the rotation axis of the fourth arm 246 of the joint 220-R.

[0136] A first guide portion 232 and a second guide portion 233 may be provided to each support 231. The first guide portion 232 may be a protrusion close to the fastener 236 (described later). The second guide portion 233 may be a protrusion away from the fastener 236 (described later). The second guide portion 233 may be positioned further away from the fastener 236 than the first guide portion 232. The first guide portion 232 and the second guide portion 233 may support one side of the substrate W, and the distance between the first guide portion 232 and the second guide portion 233 may be slightly smaller than the diameter of the substrate W.

[0137] The vision component 237 can acquire images by photographing the substrate W and / or the support 231. The acquired images can be sent to the controller 900 (described later). The controller 900 can generate control signals for driving the posture-changing manipulator 220 based on the images acquired by the vision component 237.

[0138] Liquid supply member 238 can supply wetting liquid WL to the substrate W placed on support 231. Wetting liquid WL may include water. The wetting liquid WL supplied by liquid supply member 238 may be a liquid of the same type as the processing liquid L stored in receiving spaces A and B. In addition, the wetting liquid WL supplied by liquid supply member 238 may be a liquid of the same type as the wetting liquid WL supplied by buffer unit 160 (described later).

[0139] The liquid supply component 238 may include a first nozzle 238a and a second nozzle 238b. At least one of the first nozzle 238a and the second nozzle 238b may be provided. Multiple first nozzles 238a and multiple second nozzles 238b may be provided. The first nozzle 238a may supply wetting liquid WL to a first region of the substrate W placed on the support 231. The second nozzle 238b may supply wetting liquid WL to a second region of the substrate W placed on the support 231. The first region and the second region may be different regions. The first region and the second region may be edge regions of the substrate W as described below. The first region may be adjacent to the first nozzle 238a, and the second region may be adjacent to the second nozzle 238b.

[0140] The distance between the first region and the first nozzle 238a can be shorter than the distance between the second region and the second nozzle 238b. That is, the spraying distance of the wetting liquid WL supplied from the first nozzle 238a can be different from the spraying distance of the wetting liquid WL supplied from the second nozzle 238b. For example, the spraying distance of the wetting liquid WL supplied from the first nozzle 238a can be shorter than the spraying distance of the wetting liquid WL supplied from the second nozzle 238b.

[0141] Additionally, when viewed from above, the first nozzle 238a can be positioned between the second nozzles 238b. The second nozzles 238b can be positioned relatively close to the clamping body 235 (i.e., on the outer side). The first nozzle 238a can be positioned relatively far from the clamping body 235 (i.e., on the inner side).

[0142] The spraying directions of the wetting liquid WL from the first nozzle 238a and the second nozzle 238b can be different from each other. For example, based on a virtual reference line that passes through the center of the substrate W and the center of the visual member 237 when viewed from above, the first nozzle 238a can supply the wetting liquid WL in a direction parallel to the reference line, and the second nozzle 238b can supply the wetting liquid WL in a direction inclined to the reference line.

[0143] The diameters of the spray orifices of the first nozzle 238a and the second nozzle 238b can be different from each other. For example, the diameter of the spray orifice of the first nozzle 238a can be larger than the diameter of the spray orifice of the second nozzle 238b. For example, the supply flow rate of the wetting liquid WL transmitted to the first nozzle 238a and the second nozzle 238b can be the same per unit time. Therefore, the spray distance of the wetting liquid WL sprayed from the first nozzle 238a can be shorter than the spray distance of the wetting liquid WL sprayed from the second nozzle 238b.

[0144] In addition, the first nozzle 238a and the second nozzle 238b can be mounted on the support 231.

[0145] Return to reference Figure 1 The second processing unit 30 can process the substrate W processed by the first processing unit 10. The second processing unit 30 can also process the substrate W that has undergone liquid treatment in the first processing unit 10. The second processing unit 30 can perform substrate liquid treatment on multiple substrates W in a batch manner. For example, the second processing unit 30 can also clean multiple substrates W in a batch manner. The second processing unit 30 can also simultaneously process multiple substrates W in a vertical orientation (where the top or bottom surface of the substrate W is parallel to a direction perpendicular to the ground).

[0146] The second process unit 30 may include a first batch processing bath 310, a second batch processing bath 320, and a transfer unit 330.

[0147] In the first batch processing bath 310, multiple substrates W can be simultaneously liquid-processed using a second processing solution. The second processing solution can be a chemical. It can be a chemical with strong acid or strong base properties. Chemicals may include, for example, ammonia-hydrogen peroxide mixtures (APM), hydrochloric acid-hydrogen peroxide mixtures (HPM), hydrofluoric acid-hydrogen peroxide mixtures (FPM), diluted sulfuric acid peroxide (DSP), chemicals containing SiN, chemicals containing phosphoric acid, and chemicals containing sulfuric acid.

[0148] In the second batch processing bath 320, multiple substrates W can be simultaneously liquid-processed using a third processing liquid. The second processing liquid can be a rinsing liquid. The rinsing liquid can be an aqueous liquid. For example, the rinsing liquid can be suitably selected from pure water or ozone water.

[0149] Since the first batch processing bath 310 and the second batch processing bath 320 have the same or similar structure except for the type of processing liquid used, only the first batch processing bath 310 will be described below, and the repeated description of the second batch processing bath 320 will be omitted.

[0150] Figure 8 It shows Figure 1 The state of any batch processing bath in a batch processing bath. For example, Figure 8 The first batch processing bath 310 is shown.

[0151] refer to Figure 8 The first batch processing bath 310 may include a processing bath 311, a heating element 313, a supply line 315, a recovery line 315, and a support element 316.

[0152] The processing bath 311 has a processing space 312 therein. The processing bath 311 has a cylindrical shape with an open top. The processing liquid L can be stored in the receiving space 312 of the processing bath 311. In order to regulate the temperature of the processing liquid L stored in the receiving space 312, a heating member 313 can be installed in the processing bath 311. The heating member 313 can heat the processing liquid L stored in the receiving space 312 of the processing bath 311 to a set temperature based on the temperature of the processing liquid L sensed by a temperature sensor (not shown).

[0153] Supply line 314 can supply processing fluid L to containment space 312. Recovery line 315 can discharge processing fluid L from containment space 312. Each of supply line 314 and recovery line 315 is equipped with a valve, and the liquid level can be adjusted to a set level based on the liquid level of processing fluid L sensed by a liquid level sensor (not shown) (i.e., the amount of liquid L stored in containment space 312).

[0154] A support member 316 may be disposed in the receiving space 312 to support the substrate W. The support member 316 may be configured to support multiple substrates W. For example, the support member 316 may be configured to support 50 substrates W. The support member 316 may be arranged such that a pair of rod-shaped bodies face each other and a support groove (not shown) is formed in each body through which the substrate W can be supported.

[0155] Return to reference Figure 1 The transfer unit 330 can transfer the substrate W between the attitude change unit 20, the first batch processing bath 310 and the second batch processing bath 320.

[0156] The transfer unit 330 may include a track extending along a first direction X and a hand configured to transfer multiple substrates W at a time. The transfer unit 330 may hold substrates W whose orientation has been changed in the orientation change processing bath 210 and transfer the held substrates W to the second process processing unit 30. The transfer unit 330 may hold substrates W whose orientation has been changed in the orientation change processing bath 210 and transfer the substrates W to the first process processing bath 310. The transfer unit 330 may hold substrates W that have undergone liquid treatment in the first batch processing bath 310 and transfer the substrates to the second batch processing bath 320. The transfer unit 330 may hold substrates W that have undergone liquid treatment in the second batch processing bath 320 and transfer the substrates to the orientation change processing bath 210.

[0157] Figure 9 This is a schematic diagram of a substrate processing apparatus according to another embodiment of the present invention, as viewed from above.

[0158] refer to Figure 9According to another embodiment of the present invention, the substrate processing apparatus 2 may include a first process processing unit 40, a first posture changing unit 50, a second process processing unit 60, a second posture changing unit 70, a third process processing unit 80, and a controller 900. Viewed from above, the first process processing unit 40, the first posture changing unit 50, the second process processing unit 60, the second posture changing unit 70, and the third process processing unit 80 may be arranged in a first direction X. Hereinafter, when viewed from above, the direction perpendicular to the first direction X is referred to as the second direction X12, and the direction perpendicular to both the first direction X12 and the second direction X14 is referred to as the third direction X16.

[0159] In the following description, a substrate processing apparatus 2 according to another embodiment of the present invention will be described focusing on the differences from the substrate processing apparatus 1 of the embodiment of the present invention, and the same reference numerals will be assigned to the same configuration, and repeated descriptions will be omitted.

[0160] The first process unit 40 can process the substrate W in a single method. The first process unit 40 can load the horizontally oriented substrate W. The first process unit 10 can process the horizontally oriented substrate W. The first process unit 40 may include a first loading port unit 110, a first indexing unit 120-1, a liquid processing unit 130, a first buffer unit 160-1, and a first transfer processing unit 170-1. The first loading port unit 110-1 and the first indexing unit 120-1 may be referred to as a first indexing module, and the liquid processing unit 130, the first buffering unit 160-1, and the first transfer processing unit 170-1 may be referred to as a first process module.

[0161] The first loading port unit 110-1 may include multiple loading ports. A transfer container F, in which at least one substrate W is stored, may be placed on a loading port of the first loading port unit 110-1. Multiple substrates W may be stored in the transfer container F. For example, 25 substrates may be stored in the transfer container F. The transfer container F may be referred to as a cassette, FOD, FOUP (front-opening wafer transfer cassette), etc. The transfer container F may be loaded onto the first loading port unit 110-1 by a container transfer device (OHT in this embodiment). Only the container F containing unprocessed substrates W may be placed in the first loading port unit 110-1. That is, the first loading port unit 110-1 may be used only for loading substrates W that need to be processed.

[0162] The first indexing unit 120-1 can be connected to the first loading port unit 110-1. The first indexing unit 120-1 and the first loading port unit 110-1 can be arranged along the second direction Y. The first indexing unit 120-1 can be disposed between the first loading port unit 110-1 and the first buffer unit 160-1. The first indexing unit 120-1 may include a first indexing robot 122-1. The first indexing robot 122-1 can remove an unprocessed substrate W or a substrate to be processed from a container F mounted on the first loading port unit 110. The first indexing robot 122-1 delivers the substrate W into the first process module by removing the substrate W from the container. The first indexing robot 122-1 can remove the substrate W from the container F and transfer the substrate W to the liquid processing unit 130 or the first buffer unit 160-1 (described later).

[0163] The first indexing robot 122-1 may have a hand capable of holding and transporting substrates W. The hand of the first indexing robot 122-1 may be a single hand for transporting substrates W one by one. The hand of the first indexing robot 122-1 may be configured to be movable along a first direction X, a second direction Y, and a third direction Z. Furthermore, the hand of the first indexing robot 122 may be configured to be rotatable about the third direction Z as a rotation axis.

[0164] The first processing unit 40 may be provided with a liquid processing unit 130 for processing the substrate in a single method. Multiple liquid processing units 130 may be provided. Multiple liquid processing units 130 may be provided and stacked in the vertical direction. The liquid processing unit 130 may be provided on the side surface of the first transfer processing unit 170-1 (described later). The liquid processing unit 130 may face the first buffer unit 160-1 relative to the first transfer processing unit 170-1. The liquid processing unit 130 processes the substrate W by rotating the horizontally oriented substrate W and supplying a first processing liquid to the rotating substrate W. The liquid processing unit 130 may process the substrate W one by one. The first processing liquid supplied from the liquid processing unit 130 may be configured to etch an oxide film on the substrate W. For example, the first processing liquid supplied from the liquid processing unit 130 may be configured to etch an oxide film on the substrate W. In an embodiment, diluted hydrofluoric acid (DHF) may be used as the first processing liquid. The liquid processing unit 130 can supply a first processing liquid to the rotating substrate W, and can rotate the substrate W to process the substrate W.

[0165] The liquid processing unit 130 may have the same structure as the liquid processing unit 130 provided in the first process unit 10 of the substrate processing apparatus 1 according to an embodiment of the present invention. The liquid processing unit 130 may be configured to be similar to... Figure 2 This is the same apparatus as the single-type substrate processing apparatus 400. In the following description, a repetition of the description of the liquid processing unit 130 of the substrate processing apparatus 2 in another embodiment will be omitted.

[0166] The first buffer unit 160-1 can provide storage space for temporarily storing substrates W. The first buffer unit 160-1 can temporarily store unprocessed substrates W or substrates W that need to be processed. Furthermore, the first buffer unit 160-1 can temporarily store substrates W processed by the liquid processing unit 130. The first buffer unit 160-1 may include a plurality of first buffer units 160-1, each of which can store substrates W processed by the liquid processing unit 130 or unprocessed substrates W transferred by the indexing robot 122.

[0167] The first buffer unit 160-1 may be disposed on either of the two side surfaces of the first transfer processing unit 170-1 (described later). The first buffer unit 160-1 may face the liquid processing unit 130 based on the first transfer processing unit 170-1. The first buffer unit 160-1 may include a plurality of first buffer units 160-1. When viewed from above, the plurality of first buffer units 160-1 may be arranged in a first direction X. Some of the plurality of first buffer units 160-1 may store unprocessed substrates W or substrates W to be processed that have been transferred from the first indexing robot 122-1 of the first indexing unit 120-1 (hereinafter referred to as 1-1 buffer unit 160-1a). Other portions of the plurality of first buffer units 160-1 may store substrates W that have been liquid processed in the liquid processing unit 130 in a single manner (hereinafter referred to as 1-2 buffer unit 160-1b). In the implementation, compared with the 1-2 buffer unit 160-1b which stores the untreated substrate W or the substrate W which needs to be processed, the 1-1 buffer unit (160-1a) which stores the liquid-processed substrate W in the liquid processing unit 130 can be set adjacent to the first attitude change unit 50 (described later).

[0168] The 1-1 buffer unit 160-1a can be opened toward the first transfer processing unit 170-1. Therefore, unprocessed substrates W or substrates W requiring processing that are being transferred to the 1-1 buffer unit 160-1a can be removed by the first transfer robot 172-1 of the first transfer processing unit 170-1. The substrates W removed from the 1-1 buffer unit 160-1a by the first transfer robot 172-1 can be transferred to the liquid processing unit 130, where liquid processing will be performed using a single-method approach.

[0169] The 1-2 buffer unit 160-1b can be opened toward the first attitude change unit 50. Therefore, the substrate W processed by the liquid processing unit 130 and stored in the 1-2 buffer unit 160-1b can be grasped by the first attitude change robot 220-1 and transferred to the first attitude change unit 50. Furthermore, the 1-2 buffer unit 160-1b can be opened toward the first transfer processing unit 170-1. Therefore, the substrate W processed by the liquid processing unit 130 can be transferred to the 1-2 buffer unit 160-1b by the first transfer robot 172-1. The substrate W, already processed by the liquid processing unit 130 and stored in the 1-2 buffer unit 160-1b, can have its attitude changed from horizontal to vertical by the first attitude change robot 220-1.

[0170] The first buffer unit 160-1 can be connected to the buffer unit 160 provided in the first process unit 10 of the substrate processing apparatus 1 according to an embodiment of the present invention (see...). Figure 4 The same structural arrangement is used. Furthermore, buffer units 1-1 (160-1a) and 1-2 (160-1b) may have the same structure. In the following description, a repeated description of the first buffer unit 160-1 of the substrate processing apparatus 2 according to another embodiment will be omitted.

[0171] The first transfer processing unit 170-1 can be disposed between the liquid processing unit 130 and the first buffer unit 160-1. The liquid processing unit 130 can be disposed on one side of the first transfer processing unit 170-1, and the first buffer unit 160-1 can be disposed on the other side. The first transfer processing unit 170-1 can have a first transfer robot 172-1. The first transfer robot 172-1 can have a single transfer hand for transferring substrates W one by one. The first transfer robot 172-1 can transfer substrates W between the liquid processing unit 130 and the first buffer unit 160-1. The first transfer robot 172-1 can take unprocessed substrates W or substrates W that need to be processed from the first buffer unit 160-1 and transfer the substrates to the liquid processing unit 130. The first transfer robot 172-1 can transfer unprocessed substrates W or substrates W that need to be processed into the buffer unit 160-1a to the liquid processing unit 130. The first transfer robot 172-1 can remove the substrate W processed by the liquid processing unit 130 and transfer the substrate W to the 1-1 buffer unit 160-1a. In this case, the first attitude change robot 220-1 can transfer the liquid-processed substrate W stored in the 1-2 buffer unit 160-1b to the first attitude change unit 50.

[0172] The first orientation changing unit 50 can change the orientation of the substrate W. The first orientation changing unit 50 can be positioned between a first process unit 40 that processes the substrate W in a single manner and a second process unit 60 that processes the substrate in batches. The first orientation changing unit 50 can be positioned between the first process unit 40 that processes the horizontally oriented substrate W and the second process unit 60 that processes the vertically oriented substrate W. The first orientation changing unit 50 can change the orientation of the substrate W from vertical to horizontal. The first orientation changing unit 50 can change the horizontally oriented substrate W processed in the first process unit 40 to a vertical orientation.

[0173] The first attitude change unit 50 may be configured with the same structure as the attitude change unit 20 provided in the substrate processing apparatus 1 according to the embodiment. The first attitude change unit 50 may include a first attitude change processing bath 210-1 and a first attitude change robot 220-1. The first attitude change processing bath 210-1 is configured to have the same structure as the attitude change processing bath 210 of the attitude change unit 20 according to the embodiment of the present invention. Furthermore, the first attitude change robot 220-1 is configured to have the same structure as the attitude change robot 220 of the attitude change unit 20 according to the embodiment of the present invention. Repeated descriptions will be omitted below.

[0174] The first attitude change robot 220-1 transfers the substrate W processed by the first process unit 40 to the first attitude change processing bath 210-1. The first attitude change robot 220-1 also transfers the substrate W stored in the first buffer unit 160-1 to the first attitude change processing bath 210-1. The first attitude change robot 220-1 further transfers the processed substrate W stored in the 1-2 buffer unit 160-1b to the first attitude change processing bath 210-1. The first attitude change robot 220-1 changes the attitude of the substrate W in the first attitude change processing bath 210-1 from a horizontal to a vertical position.

[0175] The first attitude change treatment bath 210-1 is in accordance with the attitude change treatment bath 210 of the embodiment of the present invention (see Figure 5 The same structural configuration. The first posture-changing manipulator 220-1 is configured to be the same as the posture-changing manipulator 220 according to the embodiment of the present invention (see...). Figure 6 The same structural settings apply. Repeated descriptions will be omitted in the following text.

[0176] The second processing unit 60 can process the substrate W processed by the first processing unit 40. The second processing unit 60 can also process the substrate W that has undergone liquid treatment in the first processing unit 40. The second processing unit 60 can perform collective liquid treatment on multiple substrates W in a batch manner. For example, the second processing unit 60 can also clean multiple substrates W in a batch manner. The second processing unit 60 can also simultaneously process multiple substrates W in a vertical orientation (where the top or bottom surface of the substrate W is parallel to a direction perpendicular to the ground).

[0177] The second process unit 60 may include a first batch processing bath 310, a second batch processing bath 320, and a transfer unit 340. In the first batch processing bath 310, multiple substrates W can be simultaneously liquid-processed using a second processing solution. The second processing solution may be a chemical. The second processing solution may be a chemical with strong acid or strong base properties. Chemicals may include, for example, ammonia-hydrogen peroxide mixtures (APM), hydrochloric acid-hydrogen peroxide mixtures (HPM), hydrofluoric acid-hydrogen peroxide mixtures (FPM), diluted sulfuric acid peroxide (DSP), SiN-containing chemicals, phosphoric acid-containing chemicals, and sulfuric acid-containing chemicals.

[0178] In the second batch processing bath 320, multiple substrates W can be simultaneously liquid-processed using a third processing liquid. The second processing liquid can be a rinsing liquid. The rinsing liquid can be an aqueous liquid. For example, the rinsing liquid can be suitably selected from pure water or ozone water.

[0179] Each of the first batch processing bath 310 and the second batch processing bath 320 is configured to have the same structure as the first batch processing bath 310 and the second batch processing bath 320 according to the embodiment of the present invention. Repeated descriptions will be omitted below.

[0180] The transfer unit 340 can transfer the substrate W between the first attitude change unit 50, the second process unit 60, and the second attitude change unit 70. The transfer unit 340 can also transfer the substrate W between the first attitude change processing bath 210-1, the first batch processing bath 310, the second batch processing bath 320, and the second attitude change processing bath 210-2.

[0181] refer to Figure 9The transfer unit 340 may include a track extending along a first direction X and a hand configured to carry multiple substrates W at a time. The transfer unit 340 can hold substrates W whose orientation has been changed in the first orientation change processing bath 210-1 and transfer the grasped substrates W to the second process processing unit 60. The transfer unit 340 can also hold multiple substrates W in a vertical orientation in the first orientation change processing bath 210-1 and transfer the multiple substrates W to the first batch processing bath 310.

[0182] The transfer unit 340 can hold the substrate W processed in the first batch processing bath 310 and transfer the substrate to the second batch processing bath 320. The transfer unit 340 can also hold the substrate W that has already been liquid-treated in the second batch processing bath 320 and transfer the substrate to the second posture-changing processing bath 210-2. When it is necessary to process the substrate W with the second processing liquid in the first batch processing bath 310 and the third processing liquid in the second batch processing bath 320, the transfer unit 340 can repeatedly transfer the substrate W between the first batch processing bath 310 and the second batch processing bath 320.

[0183] The second orientation changing unit 70 can change the orientation of the substrate W. The second orientation changing unit 70 can be disposed between a second process unit 60 that processes the substrate W in a batch manner and a third process unit 80 that processes the substrate W in a single manner. The second orientation changing unit 70 can be positioned between the second process unit 60 that processes the vertically oriented substrate W and the third process unit 80 that processes the horizontally oriented substrate W. The second orientation changing unit 70 can change the orientation of the substrate W from vertical to horizontal.

[0184] The second attitude change unit 70 may be configured with the same structure as the attitude change unit 20 provided in the substrate processing apparatus 1 according to the embodiment. The second attitude change unit 70 may include a second attitude change processing bath 210-2 and a second attitude change robot 220-2. The second attitude change processing bath 210-2 is configured to have the same structure as the attitude change processing bath 210 of the attitude change unit 20 according to the embodiment of the present invention. The second attitude change robot 220-2 is configured to have the same structure as the attitude change robot 220 of the attitude change unit 20 according to the embodiment of the present invention. Repeated descriptions will be omitted below.

[0185] The second attitude change robot 220-2 transfers the substrate W processed by the second process unit 60 to the second attitude change processing bath 210-2. The second attitude change robot 220-2 changes the attitude of the substrate W stored in the second attitude change processing bath 210-2. The second attitude change robot 220-2 changes the attitude of the substrate W stored in the second attitude change processing bath 210-2 from a vertical attitude to a horizontal attitude. The second attitude change robot 220-2 grasps multiple substrates W that have been converted to a horizontal attitude and transfers the multiple substrates W to the second buffer unit 160-2 of the third process unit 80.

[0186] The second attitude change treatment bath 210-2 is in accordance with the attitude change treatment bath 210 of the embodiment of the present invention (see Figure 5 The second posture-changing manipulator 220-2 has the same structural configuration as the posture-changing manipulator 220 according to the embodiment of the present invention (see...). Figure 6 The same structural settings apply. Repeated descriptions will be omitted in the following text.

[0187] The third process unit 80 can process the substrate W using a single method. The third process unit 80 can unload the horizontally oriented substrate W. The third process unit 80 can process the horizontally oriented substrate W. The third process unit 80 may include a second loading port unit 110-2, a second indexing unit 120-2, an organic solvent processing unit 140, a drying processing unit 150, a second buffer unit 160-2, and a second transfer processing unit 170-2. The second loading port unit 110-2 and the second indexing unit 120-2 may be referred to as a second indexing module, and the organic solvent processing unit 140, the drying processing unit 150, the second buffering unit 160-2, and the second transfer processing unit 170-2 may be referred to as a second process module.

[0188] The second loading port unit 110-2 may include multiple loading ports. A transfer container F storing at least one substrate W can be placed on a loading port of the second loading port unit 110-2. Multiple substrates W can be stored in the transfer container F. For example, 25 substrates can be stored in the transfer container F. The transfer container F may be referred to as a cassette, FOD, FOUP (front-opening wafer transfer cassette), etc. The transfer container F can be unloaded from the second loading port unit 110-2 by a container transfer device (e.g., OHT). The transfer container F placed in the second loading port unit 110-2 can store substrates W processed in the first process processing unit 40, the second process processing unit 60, and the third process processing unit 80. The transfer container F placed in the second loading port unit 110-2 may only store substrates W processed in the first process processing unit 40, the second process processing unit 60, and the third process processing unit 80. That is, the second loading port unit 110-2 can perform the function of unloading processed substrates W from the substrate processing device.

[0189] The second indexing unit 120-2 can be connected to the second loading port unit 110-2. The second indexing unit 120-2 and the second loading port unit 110-2 can be arranged along a second direction Y. The second indexing unit 120-2 can be disposed between the second loading port unit 110-2 and the second buffer section 160-2. The second indexing unit 120-2 may include a second indexing robot 122-2. The second indexing robot 122-2 can remove the processed substrate W placed in the second buffer unit 160-2 and transfer the substrate to a container F mounted on the second loading port unit (110-2). This container can be transferred to the outside of the substrate processing apparatus 2 via a transport device (e.g., OHT).

[0190] The second indexing robot 122-2 may have a hand capable of holding and transporting substrates W. The hand of the second indexing robot 122-2 may be a single hand for transporting substrates W one by one. The hand of the second indexing robot 122-2 may be configured to be movable along a first direction X, a second direction Y, and a third direction Z. Furthermore, the hand of the second indexing robot 122 may be configured to be rotatable about the third direction Z as a rotation axis.

[0191] The organic solvent processing unit 140 may be equipped with a substrate processing apparatus in which liquid processing is performed in a single method. The substrate processing apparatus provided to the organic solvent processing unit 140 may have the same characteristics as the substrate processing apparatus provided in the unit. Figure 1 The substrate processing device 400 on the liquid processing unit 130 shown has the same structure. Therefore, the same reference numerals are assigned to the same structures, and redundant descriptions are omitted.

[0192] Multiple organic solvent processing units 140 can be provided. These multiple organic solvent processing units 140 can be stacked vertically. The organic solvent processing units 140 can be located on one side of the first conveying processing unit 170-1. The organic solvent processing units 140 can face the second buffer unit 160-2 based on the first conveying processing unit 170-1. When viewed from above, the organic solvent processing units 140 can be arranged together with the drying processing unit 150 in the first direction X.

[0193] The organic solvent processing unit 140 can process substrates W one by one. The organic solvent processing unit 140 can process horizontally oriented substrates W one by one. The organic solvent processing unit 140 processes the substrates W by rotating the horizontally oriented substrates W and supplying processing liquid to the rotating substrates W. The processing liquid supplied from the organic solvent processing unit 140 can be replaced with a rinsing liquid to provide a liquid capable of removing rinsing liquid residues on the surface of the substrates W. For example, the processing liquid supplied from the organic solvent processing unit 140 can be an organic solvent. For example, the processing liquid supplied from the organic solvent processing unit 140 can be isopropanol (IPA).

[0194] The organic solvent processing unit 140 can supply organic solvent to the rotating horizontally oriented substrate W and can dry the substrate W by rotating the substrate W. Conversely, the organic solvent processing unit 140 supplies organic solvent to the rotating horizontally oriented substrate W and, after wetting the substrate W with organic solvent, transfers the substrate to the drying processing unit 150 (described later) so that the substrate W can be dried in the drying processing unit 150.

[0195] The drying unit 150 may include a substrate processing apparatus 500 in which a single substrate drying process is performed. The drying unit 150 may use a supercritical drying fluid to remove residual processing liquid from the substrate W. The drying unit 150 may be configured as a supercritical chamber, which uses a supercritical fluid to remove residual processing liquid (e.g., rinsing solution or organic solvent) from the substrate W. For example, the substrate processing apparatus 500 provided in the drying unit 150 may use supercritical carbon dioxide (CO2) to perform a drying process to remove residual organic solvent from the substrate W.

[0196] The drying unit 150 provided in the substrate processing apparatus 2 according to another embodiment of the present invention may have the same structure as the drying unit 150 provided in the first process unit 10 of the substrate processing apparatus 1 according to the embodiment of the present invention. That is, the substrate processing apparatus 500 provided in the drying unit 150 according to another embodiment may be provided in the same manner as the substrate processing apparatus 500 provided in the drying unit 150 according to the embodiment. Repeated descriptions will be omitted below.

[0197] The second buffer unit 160-2 can provide storage space for temporarily storing the substrate W. The second buffer unit 160-2 can temporarily store the substrate W processed by the second process unit 60. The second buffer unit 160-2 can store the substrate W whose orientation has been changed in the second orientation change unit 70. The second buffer unit 160-2 can temporarily store the substrate W processed by the organic solvent treatment unit 140 and / or the drying treatment unit 150.

[0198] The first buffer unit 160-1 may be disposed on one side of the second transfer processing unit 170-2. The first buffer unit 160-1 may face the organic solvent processing unit 140 and / or the drying processing unit 150 relative to the second transfer processing unit 170-2.

[0199] The second buffer unit 160-2 may include a plurality of second buffer units 160. Some of the plurality of second buffer units 160-2 may temporarily store the substrate W processed by the second process unit 60 and / or the substrate W that has been changed in the second attitude change unit 70 (hereinafter referred to as 2-1 buffer unit 160-2a). Other portions of the plurality of second buffer units 160-2 may temporarily store the substrate W processed by the organic solvent processing unit 140 and / or the drying processing unit 150 (hereinafter referred to as 2-2 buffer unit 160-2b). 2-1 buffer unit 160-2a may be configured to be closer to the second attitude change unit 70 than 2-2 buffer unit 160-2b.

[0200] When viewed from above, the 2-1 buffer unit 160-2a can be opened toward the second attitude change unit 70. Therefore, the 2-1 buffer unit 160-2a can be transferred together with the substrate W processed by the second process unit 60 or the substrate W whose attitude has been changed by the second attitude change unit 70 by the second transfer robot 172-2. Furthermore, when viewed from above, the 2-1 buffer unit 160-2a can be opened toward the transfer processing unit 170. Therefore, the substrate W stored in the 2-1 buffer unit 160-2a can be transferred to the organic solvent processing unit 140 and / or the drying processing unit 150 by the second transfer robot 172-2.

[0201] When viewed from above, buffer unit 160-2b can be opened toward the second transfer processing unit 170-2. Therefore, the substrate W processed by the organic solvent processing unit 140 and / or the drying processing unit 150 can be transferred to buffer unit 160-2a via the second transfer robot 172-2. The processed substrate W can then be transferred to the second loading port unit 110-2 via the indexing robot 122.

[0202] The second buffer unit 160-2 can be configured to be located in the first process unit 10 of the substrate processing apparatus 10 according to an embodiment of the present invention (see [reference]). Figure 4 The same structural settings apply. Repeated descriptions will be omitted in the following text.

[0203] The second transfer processing unit 170-2 can be disposed between the organic solvent processing unit 140 and the second buffer unit 160-2. The second transfer processing unit 170-2 can also be disposed between the drying processing unit 150 and the second buffer unit 160-2. The organic solvent processing unit 140 and the drying processing unit 150 can be disposed on one side of the transfer processing unit 170. The second buffer unit 160-2 can be disposed on the other side of the second transfer processing unit 170-2. The second transfer processing unit 170-2 can have a second transfer robot 172-2. The second transfer robot 172-2 can have a single transfer hand for transferring substrates W one by one. The second transfer robot 172-2 can transfer substrates W between the organic solvent processing unit 140, the drying processing unit 150, and the buffer unit 160.

[0204] The second transfer robot 172-2 can remove the substrate W from the 2-1 buffer unit 160-2a and transfer the substrate W to the organic solvent treatment unit 140. The second transfer robot 172-2 can then transfer the substrate W treated by the organic solvent treatment unit 140 to the drying unit 150. The second transfer robot 172-2 can supply organic solvent from the organic solvent treatment unit 140 to the 2-2 buffer unit 160-2b, meaning that the substrate W is dried by rotating it while it is wetted with organic solvent. The second transfer robot 172-2 can then transfer the substrate W treated by the drying unit 150 to the buffer unit 160-2b.

[0205] The controller 900 can control the substrate processing apparatuses 1 and 2. For example, the controller 900 can control the components of the substrate processing apparatuses 1 and 2. For example, the controller 900 can control the substrate processing apparatuses 1 and 2 so that the substrate processing apparatuses 1 and 2 can perform processes for processing substrate W.

[0206] The controller may include a process controller comprising: a microprocessor (computer) that controls the substrate processing apparatus; a user interface, such as a keyboard, through which an operator inputs commands to manage the substrate processing apparatus; a display showing the operation of the substrate processing apparatus; and a storage unit that stores a treatment recipe, i.e., a control program, for executing the processing technology of the substrate processing apparatus by controlling the process controller, or a program for executing components of the substrate processing apparatus based on data and processing conditions. Further, the user interface and the storage unit may be connected to the process controller. The treatment recipe may be stored in a storage medium of the storage unit, and the storage medium may be a hard disk, a portable disk (such as a CD-ROM or DVD), or a semiconductor memory (such as flash memory).

[0207] Figure 10 It shows the use of Figure 1 substrate processing device or Figure 2 A flowchart of a substrate processing method for a substrate processing apparatus. Figure 11 and Figure 12 It shows in Figure 10 In the second attitude change step, the attitude change robot changes the attitude of the substrate to a horizontal attitude. Figure 13 The execution was shown Figure 10 The posture change of the robotic arm during the wetting step. Figure 14 It is shown in Figure 10 A top view of the state of the wetting fluid supplied by the liquid supply component during the wetting process. Figure 15 It is shown in Figure 19 A side view of the state of the wetting liquid supplied by the liquid supply component during the wetting process. Figure 16 The hand is shown according to another embodiment of the concept of the present invention. Figure 17 It shows Figure 16 A top view of the liquid supply component supplying wetting fluid to the substrate.

[0208] refer to Figure 10 According to the embodiment of the present invention, the substrate processing method S100 may include a substrate loading step S110, a first single-processing step S120, a first posture changing step S130, a batch processing step S140, a second posture changing step S150, a second single-processing step S160, and a substrate unloading step S170.

[0209] In substrate loading step S110, the unprocessed substrate W that needs to be processed can be loaded onto substrate processing devices 1 and 2. In substrate loading step S110, the transfer container F can be placed on the first loading port unit 110-1.

[0210] exist Figure 1 In the substrate processing apparatus 1, the substrate W stored in the buffer container F is taken out by the indexing robot 122 and transferred to the buffer unit 160. Figure 9 In the substrate processing apparatus 2, the substrate W stored in the transfer container F can be taken out by the first indexing robot 122-1 and transferred to the first buffer unit 160-1. Figure 9 In the substrate processing apparatus 2, the substrate W stored in the transfer container F can be taken out by the first indexing robot 122-1 and transferred to the 1-1 buffer unit 160-1a.

[0211] In the first single-processing step S120, a substrate W with a horizontal orientation can be processed using a single method. In the first single-processing step S120, the substrate W can be processed by supplying a first processing solution capable of etching an oxide film to the substrate W. The first processing solution can be diluted hydrofluoric acid (DHF). In the first single-processing step S120, the first processing solution can be supplied to the substrate W, and the substrate W can be rotated to process it.

[0212] exist Figure 1 In the substrate processing apparatus 1, a first transfer robot 172-1 can remove a substrate W from a buffer unit 160 and transfer it to a liquid processing unit 130. The first transfer robot 172 can transfer the horizontally positioned substrate W removed from the buffer unit 160. The first transfer robot 172 can transfer the substrate W from the buffer unit 160 to the substrate processing unit 130 of the substrate processing apparatus 400, and can place the horizontally positioned substrate W on a support unit 440. The support unit 440 can rotate the substrate W. The liquid supply unit 480 can supply a first processing liquid to the rotating substrate W. The substrate W processed by the liquid processing unit 130 can be transferred to the buffer unit 160 by the first transfer robot 172.

[0213] exist Figure 2 In the substrate processing apparatus 1, a first transfer robot 172-1 can remove a substrate W from a 1-1 buffer unit 160-1a and transfer the substrate to a liquid processing unit 130. The first transfer robot 172-1 can transfer the horizontally positioned substrate W removed from the 1-1 buffer unit 160-1a. The first transfer robot 172-1 can transfer the substrate W removed from the 1-1 buffer unit 160-1a to the liquid processing unit 130 in the substrate processing apparatus 400, and can place the horizontally positioned substrate W on a support unit 440. The support unit 440 can rotate the substrate W. A liquid supply unit 480 can supply a first processing liquid to the rotating substrate W. The substrate W processed by the liquid processing unit 130 can be transferred by the first transfer robot 172-1 to a 1-2 buffer unit 160-1a.

[0214] In the first attitude change step S130, the attitude of the substrate W can be changed from a horizontal attitude to a vertical attitude. In the first attitude change step S130, the positions of multiple substrates W can be changed simultaneously.

[0215] exist Figure 1 In the substrate processing apparatus 1, the orientation of multiple substrates W placed on the buffer unit 160 can be changed together by the orientation change unit 20. The orientation change robot 220 can transfer multiple substrates W stored in horizontal positions to the buffer unit 160 and then to the orientation change processing bath 211. The orientation change robot 220 can change the orientation of multiple substrates W in the orientation change processing bath 211 from a horizontal orientation to a vertical orientation. The substrates W changed to a vertical orientation can be transferred to the first batch processing bath 310 of the second process processing unit 30 via the transfer unit 330.

[0216] exist Figure 9 In the substrate processing apparatus 2, the orientation of multiple substrates W placed on the 1-2 buffer unit 160-2a can be changed together by the first orientation changing unit 50. The first orientation changing robot 220-1 can transfer the multiple substrates W stored in the 1-2 buffer unit 160-1b at horizontal positions to the first orientation changing processing bath 210-1. The first orientation changing robot 220 can change the orientation of the multiple substrates W from horizontal to vertical in the first orientation changing processing bath 210-1. The substrates W changed to vertical orientation can be transferred to the first batch processing bath 310 of the second process processing unit 60 via the transfer unit 340.

[0217] In the batch processing step S140, liquid processing can be performed on multiple substrates W in a vertical orientation. In the batch processing step S140, multiple substrates W can be simultaneously liquid-processed with a second processing liquid, and then multiple substrates W can be simultaneously processed with a third processing liquid. The second processing liquid can be a chemical with strong acid or strong base properties. Chemicals may include, for example, ammonia-hydrogen peroxide mixtures (APM), hydrochloric acid-hydrogen peroxide mixtures (HPM), hydrofluoric acid-hydrogen peroxide mixtures (FPM), diluted sulfuric acid peroxide (DSP), SiN-containing chemicals, phosphoric acid-containing chemicals, and sulfuric acid-containing chemicals.

[0218] exist Figure 1 and 9In the substrate processing apparatuses 1 and 2, multiple substrates W can be processed simultaneously in a first batch processing bath 310 using a second processing liquid. If processing is completed in the first batch processing bath 310, transfer units 330 and 340 simultaneously transfer the multiple substrates W stored in the first batch processing bath 310 to a second batch processing bath 320. In the second batch processing bath 320, multiple substrates W can be liquid-processed simultaneously using a third processing liquid.

[0219] exist Figure 1 In the substrate processing apparatus 1, if processing is completed in the second batch processing bath 320, multiple substrates W that have been rinsed with the third processing liquid can be transferred to the attitude changing unit 20. The transfer unit 330 can transfer multiple rinsed substrates W together to the attitude changing processing bath 210.

[0220] exist Figure 9 In the substrate processing apparatus 2, if processing is completed in the second batch processing bath 320, multiple substrates W that have been rinsed with the third processing liquid can be transferred to the second attitude change unit 70 via the transfer unit 340. The transfer unit 340 can transfer multiple rinsed substrates W together to the second attitude change processing bath 210.

[0221] The second posture change step S150 can be performed in... Figure 1 The attitude change unit 20 in the substrate processing equipment 1 and in Figure 9 The second orientation change step S150 is performed in the second orientation change unit 70 of the substrate processing apparatus 2. The second orientation change step S150 may include a holding step for holding the substrate W and a rotation step for changing the orientation of the substrate W. In the second orientation change step S150, the orientation change of the substrate W can be performed by each sheet.

[0222] For example, such as Figure 11 As shown, in the holding step of the second posture change step S150, the hand 230 can approach any of the vertically positioned substrates W supported by the support member 212. The hand 230 can move such that the substrate W can be positioned between the first guide portion 232 and the second guide portion 233. If the substrate W is positioned between the first guide portion 232 and the second guide portion 233, the clamping body 235 can hold the substrate W.

[0223] If the hand 230 holds the substrate W, the substrate W can move upward so that the substrate W can detach from the support groove formed at the support member 212.

[0224] After that, as Figure 11As shown, in the rotation step of the second posture change step S150, when the substrate W is rotated based on the axis of the solid 236, the substrate W can move linearly in the direction that changes the position of the substrate W (e.g., the horizontal direction). That is, in the rotation step, the hand 230 can rotate relative to the axis, and the hand 230 can move linearly in the horizontal direction. In this case, the position of the end of the substrate W can be changed when drawing a virtual curve (e.g., cutting a parabola). That is, when drawing a cutting parabola, the posture of the substrate W can change from a vertical posture to a horizontal posture while immersed in the processing liquid L. In addition, the rotation of the substrate W can be performed in the direction that moves the end of the substrate W away from the hand 156-H.

[0225] Furthermore, the difference between the time when the rotation of substrate W ends and the time when the linear movement of substrate W ends can be less than or equal to a set time. For example, these two time points can be the same. That is, at the time when the linear movement of substrate W ends, the rotation of substrate W performed by the fastener 236 can be terminated simultaneously.

[0226] Furthermore, while holding and rotating the substrate W, the vision component 237 can be installed without being immersed in the processing liquid L. In other words, the vision component 237 can be mounted in a position where it is not immersed in the processing liquid L stored in the attitude change processing baths 211, 210-1, and 210-2. Therefore, the problem of damage to the vision component 237 from the processing liquid L can be minimized.

[0227] If the orientation of substrate W is changed to a state where substrate W is immersed in processing liquid L, substrate W may be damaged by the resistance of processing liquid L. However, as conceived in this invention, if the orientation is changed by simultaneous linear movement and rotation while substrate W is immersed in processing liquid L, the resistance caused by processing liquid L can be minimized from being transmitted to substrate W. Furthermore, if substrate W is removed from processing liquid L (i.e., exposed to air) and its orientation is changed, the wettability of substrate W may not be maintained, and watermarks may form on substrate W. This problem can be minimized by changing the orientation of substrate W while it is immersed in processing liquid L.

[0228] After performing the second attitude change step S150, a wetting step (not shown) may be performed. The wetting step S50 may be performed between the second attitude change step S150 and the second single-process step S160.

[0229] exist Figure 1 In the case of a substrate processing apparatus, the wetting step can be performed in the attitude-changing robot 220 and / or the buffer unit 160. Figure 9In the case of substrate processing apparatus 2, the wetting step can be performed by the second posture changing robot 220-2 and / or the 2-1 buffer unit 160-2a.

[0230] In the wetting step S50, by spraying the wetting liquid onto the substrate W, which is away from the processing liquid L and exposed to the outside, the natural drying of the substrate W can be prevented. The wetting liquid can be a liquid of the same type as the processing liquid L stored in the posture change processing baths 210, 210-1, and 210-2 described above. Conversely, the wetting liquid can be a liquid of a different type than the processing liquid L described above.

[0231] For example, such as Figure 13 As shown, the orientation change of the substrate W is completed, and the orientation change robots 220 and 220-2 can move the substrate W upwards to deviate from the processing liquid L stored in the orientation change processing baths 210 and 210-2. If the substrate W deviates from the processing liquid L, the liquid supply member 168 can supply wetting liquid WL. In this case, as... Figure 11 and Figure 15 As shown, a wetting liquid WL is supplied to a first region and a second region, which are the edge regions of a substrate W. The wetting liquid WL supplied to the edge regions of the substrate W can flow along the upper surface of the substrate W to form a liquid film on the upper surface of the substrate W. If the wetting liquid WL flows along the edge regions of the substrate W to form a liquid film, the splashing of the wetting liquid WL is suppressed to the greatest extent, thereby allowing the substrate W to be processed more effectively.

[0232] Additionally, the wetting step S50 can be performed in the first buffer unit 160 as described above. The attitude-changing robot 220 can transfer the substrate W, on which the second attitude-changing step S150 has been performed, to the first buffer unit 160. In the wetting step S30, if the substrate W is fed into the first buffer unit 160, the wetting nozzle 163 of the first buffer unit 160 can spray wetting liquid onto the substrate W.

[0233] When performing the wetting step S30, the natural drying of the substrate W can be minimized before the substrate W is sent into the single-process chamber.

[0234] The single processing step S60 may include a liquid processing step S61 and a drying step S162.

[0235] In the second single-processing step S160, processing can be performed on a single substrate W in a horizontal orientation. The second single-processing step S60 may include an organic solvent treatment step S61 and a drying step S162. In the organic solvent treatment step S161, an organic solvent such as IPA may be supplied to the substrate W.

[0236] The organic solvent treatment step S161 can perform liquid treatment on the substrate W in a single method.

[0237] exist Figure 1 In the case of the substrate processing apparatus 1, if the substrate temporarily stored in the buffer unit 160 is transferred to the organic solvent processing unit 140, the organic solvent processing step S161 can be performed in the organic solvent processing unit 140. Figure 9 In the case of the substrate processing apparatus 2, if the substrate W temporarily stored in the 2-2 buffer unit 160-2b is transferred to the organic solvent processing unit 140, the organic solvent processing step S161 can be performed in the organic solvent processing unit 140.

[0238] In drying step S162, the substrate W can be dried using a single method. If the substrate W, which has undergone liquid treatment in liquid treatment step S161, is transferred to drying chamber 150, drying step S162 can be performed in drying chamber 150. In drying step S162, a supercritical processing fluid (e.g., supercritical carbon dioxide) can be supplied to the substrate W to remove residual organic solvents, wetting liquid, or processing liquid L from the substrate.

[0239] In some cases, the drying step S162 may not be performed in the drying processing unit 150, but the substrate W can be dried by rotating the substrate W at high speed in the organic solvent processing unit 140 (so-called centrifugal drying).

[0240] If the drying step S162 is completed, the substrate unloading step S170 of unloading substrate W is performed.

[0241] exist Figure 1 In the case of a substrate processing apparatus, during the substrate unloading step S170, the substrate W on which the second single-process step S160 is performed can be transferred to the buffer unit 160, and then transferred by the first transfer robot 172 to the transfer container F placed on the second loading port unit. The transfer container F placed on the second loading port unit can be held by a transfer device (such as an OHT) to be unloaded from the substrate processing apparatus.

[0242] exist Figure 9 In the case of the substrate processing apparatus 2, during the substrate unloading step S170, the substrate W on which the second single-process step S160 is performed can be transferred to the 2-2 buffer unit 160-2b, and then transferred to the transfer container F placed on the second loading port unit 110-2. The transfer container F placed on the second loading port unit 110-2 can be held by the transfer device (such as OHT) to be unloaded from the substrate processing apparatus 2.

[0243] As described above, the substrate processing apparatuses 1 and 2 according to embodiments of the present invention may include a batch processing unit and a single liquid processing unit. Therefore, it can have all the advantages of both batch liquid processing methods and single liquid processing methods.

[0244] For example, since batch processing units 30 and 60 can process multiple substrates W at once, the mass production of substrate W is excellent, and the processing uniformity between substrates W is very high. In addition, if the pattern formed on the substrate W has a high aspect ratio, batch processing units 30 and 60 can supplement the parts that are not completely processed by single processing (e.g., parts that are not completely etched) by supplying chemicals, rinsing liquid, etc.

[0245] Furthermore, a substrate W (e.g., a wafer) wetted with organic solvent supplied from the organic solvent processing unit 140 can be transferred to a drying processing unit 150 for drying the substrate W by supplying supercritical fluid. The supercritical fluid can have high penetrating power relative to the spaces between patterns formed on the substrate W and can dry the substrate W without rotating it, thereby minimizing the aforementioned pattern tilting phenomenon. Furthermore, the substrate processing apparatuses 1 and 2 of the present invention can perform all single-stage liquid processing methods, batch liquid processing methods, and methods for drying substrate W using supercritical fluid, thereby improving defects caused by particles, drips, and flowability. Moreover, since the number of substrates W that can be processed in the batch processing units 30 and 60 is relatively large, a large number of liquid processing chambers are not required, thus reducing the footprint of the substrate processing apparatus 10.

[0246] Furthermore, similar to the substrate processing apparatuses 1 and 2 according to the embodiments conceived in this invention, if a second process processing unit 30 and 60 performing batch processing and a process processing unit 140 performing single processing are simultaneously provided (…), Figure 1 The middle is 10. Figure 9 If the values ​​are 40 and 80, then the orientation of the substrate W must be changed from a vertical to a horizontal orientation. Therefore, the substrate processing apparatuses 1 and 2 according to embodiments of the present invention include orientation-changing robots 220, 220-1, and 220-2 to change the orientation of the substrate W from a vertical to a horizontal orientation. In this case, the orientation change of the substrate W is performed while the substrate W is immersed in the processing liquid L to maintain the wettability of the substrate W as much as possible (otherwise, the substrate W may dry out and produce watermarks).

[0247] In the above embodiments, the mounting of the liquid supply component 238 on the support 231 has been described, but the inventive concept is not limited thereto. For example, as... Figure 16As shown, the liquid supply component 239 can be mounted on the fastener 236. The liquid supply component 239 can be a supply line on which a first nozzle 239a, a second nozzle 239b, and a third nozzle 239c are formed. The first nozzle 239a, the second nozzle 239b, and the third nozzle 239c can spray wetting liquid WL toward the substrate W in a downwardly inclined direction. At least one of the first nozzle 239a, the second nozzle 239b, and the third nozzle 239c can be formed. For example, multiple first nozzles 239a, multiple second nozzles 239b, and multiple third nozzles 239c can be formed. Multiple first nozzles 239a can be disposed between multiple second nozzles 239b, and multiple second nozzles 239b can be disposed between multiple third nozzles 239c. Multiple first nozzles 239a can be disposed relatively on the inner side, and multiple third nozzles 239c can be disposed relatively on the outer side. In addition, as Figure 17 As shown, the diameters of the spray orifices of the first nozzle 239a, the second nozzle 239b, and the third nozzle 239c can be different from each other. The diameter of the spray orifice of the first nozzle 239a can be larger than the diameter of the spray orifice of the second nozzle 239b, and the diameter of the spray orifice of the second nozzle 239b can be larger than the diameter of the spray orifice of the third nozzle 239c. Furthermore, the supply flow rate of the wetting liquid WL per unit time delivered to the first nozzle 239a, the second nozzle 239b, and the third nozzle 239c can be the same. Therefore, regarding the spray distance of the wetting liquid WL supplied from the first nozzle 239a, the second nozzle 239b, and the third nozzle 239c, the first nozzle 239a can have the shortest distance, and the third nozzle 239c can have the longest distance. Moreover, the first nozzle 239a, the second nozzle 239b, and the third nozzle 239c can supply the wetting liquid WL to the edge region of the substrate W.

[0248] In the above embodiments, it has been described that the posture-changing manipulators 220, 220-1, and 220-2 supply wetting fluid WL to the edge region of the substrate W; however, the inventive concept is not limited thereto. For example, as... Figure 18 As shown, the liquid supply member 247 can be fastened to the third arm 245. Furthermore, the liquid supply member 247 can be configured to rotate about a direction parallel to the rotation axis of the fourth arm 246, and can be configured to supply wetting liquid WL to the central region of the substrate W placed on the hand 230.

[0249] Figure 19 This is a top view illustrating a hand according to another embodiment of the concept of the present invention, and Figure 20 yes Figure 19 Side view of the middle hand.

[0250] refer to Figure 19 and Figure 20According to another embodiment, the hand 250 of the posture-changing manipulators 220, 220-1 and 220-2 may include a support 251, a guide 252, a gripper 253, a drive member 254, a rotating member 255, a rotary motor 256, a connector 257 and a vision member 258.

[0251] The support body 251 may have a finger shape. The guide portion 252 may be provided at the distal end of the support body 251. The guide portion 252 may support the side of the substrate W, and the support body 251 may support the bottom surface of the substrate W.

[0252] The clamping body 253 can move in one direction via the driving member 254. The clamping body 253 can move between a clamping position for clamping the substrate W and a standby position for not clamping the substrate W via the driving member 254. The rotating member 255 can rotate the support body 251 and the substrate W based on an axis, and the rotating motor 255 can transmit driving force for rotating the rotating motor 256. The connecting body 257 can be connected to the joints 156-R of the attitude-changing manipulators 220, 220-1, and 220-2. The vision member 258 can perform the same or similar functions as the vision member 257 described above. Furthermore, similar to the vision member 257, the vision member 258 can be installed in a position where it is not immersed in the processing liquid L stored in the attitude-changing processing bath 210 when the attitude of the substrate W changes.

[0253] Figure 21 This is a top view illustrating a hand according to another embodiment of the concept of the present invention, and Figure 22 yes Figure 21 Side view of the retainer. (Reference) Figure 21 and Figure 22 According to another embodiment of the present invention, the hand 260 of the posture-changing manipulator may include a fastener 261, a rotating member 262, a gripper 263, and a retainer 264. The fastener 261 may be coupled to the joint 156-R of the posture-changing manipulators 220, 220-1, and 220-2. The rotating member 262 can rotate the gripper 263. A plurality of grippers 264 may be mounted on the gripper 263. A retaining groove 265 for retaining the side of the substrate W may be formed in the retainer 264.

[0254] In the above embodiments, the substrate processing apparatus 1 and 2 according to the present invention include a liquid processing unit 130, an organic solvent processing unit 140, and a drying processing chamber 150, but are not limited thereto. For example, the substrate processing apparatus 1 and 2 may include only one of the liquid processing unit 130, the organic solvent processing unit 140, and the drying processing chamber 150.

[0255] In the above embodiment, the substrate W taken from the batch processing units 30 and 60 is transferred to the organic solvent processing unit 140. After the organic solvent processing unit 140 completes the processing of the substrate W, the substrate W is transferred to the drying processing chamber 150. For example, if the particle level is good, the substrate W can be transferred directly from the batch liquid processing units 30 and 60 to the drying processing unit 150.

[0256] In the above-described embodiments, the liquid processing unit 130 can perform liquid processing on the substrate W using a first processing solution including hydrofluoric acid, and the first batch processing bath 310 can perform liquid processing on the substrate using a second processing solution including phosphoric acid. However, the present invention is not limited to this. For example, the liquid processing unit 130 can process the substrate using a second processing solution containing phosphoric acid, and the substrate W can be batch-processed in the first batch processing bath 310 using a first processing solution containing hydrofluoric acid.

[0257] According to embodiments of the present invention, substrate processing apparatuses 1 and 2 can minimize the number of batch processing baths included in substrate processing apparatuses 1 and 2 by configuring substrate processing according to a first processing liquid from a first processing liquid to a third processing liquid in a single-process method, and according to a second processing liquid and a third processing liquid in a batch-process method. The problem with batch processing baths is that the amount of flue gas generated by the processing liquid is higher than that of a single-process apparatus, and according to embodiments of the present invention, the number of batch processing baths can be minimized.

[0258] Furthermore, the substrate processing apparatus 1 and 2 according to embodiments of the present invention have the advantage of reducing the total length of the substrate processing apparatus 1 and 2 by reducing the number of batch processing baths.

[0259] The effects of this invention are not limited to those described above, and those skilled in the art to which this invention pertains can clearly understand the effects not mentioned from the specification and drawings.

[0260] Although preferred embodiments of the inventive concept have been illustrated and described so far, the inventive concept is not limited to the specific embodiments described above, and it should be noted that those skilled in the art to which the inventive concept pertains can implement the inventive concept in various ways without departing from the essence of the inventive concept claimed in the claims, and modifications should not be interpreted separately from the technical spirit or prospect of the inventive concept.

Claims

1. A substrate processing apparatus, the substrate processing apparatus comprising: A first process unit is configured to process a substrate using a single method. The second process unit is configured to process the substrate in a batch manner. as well as An attitude changing unit is disposed between the first process unit and the second process unit and configured to change the attitude of the substrate between a vertical attitude and a horizontal attitude. The substrate is loaded into the first process unit and unloaded from the first process unit. The attitude change unit includes: An attitude change processing bath, the attitude change processing bath having a storage space for storing the substrate; and A posture-changing robot is used to remove the substrates stored in the storage space one by one and change the substrates stored in the posture-changing treatment bath from the vertical posture to the horizontal posture for transfer to the buffer unit, wherein the substrates are immersed in liquid supplied to the storage space. The buffer unit is configured to store the substrate in the horizontal orientation; the surface of the substrate stored in the buffer unit is wetted.

2. The substrate processing apparatus according to claim 1, wherein The attitude change unit further includes: A support member is positioned within the storage space of the attitude change processing bath, and the support member supports the substrate whose attitude is changed to the vertical attitude by the attitude change manipulator.

3. The substrate processing apparatus according to claim 2, wherein, The first process unit includes: A liquid processing unit configured to process the substrate in a single-method manner by supplying a first processing liquid to the substrate in the horizontal orientation; and The buffer unit is configured to store the substrate in the horizontal orientation that has been processed in the liquid processing unit.

4. The substrate processing apparatus according to claim 3, wherein, The attitude-changing manipulator moves between the buffer unit and the attitude-changing processing bath, and The attitude-changing robot changes the substrate, which is in the horizontal orientation stored in the buffer unit, to the vertical orientation, and then transfers it to the attitude-changing processing bath.

5. The substrate processing apparatus according to claim 4, wherein, The second process unit includes: Multiple batch processing baths, the multiple batch processing baths being used to batch process the substrate; and A transfer unit configured to transfer the substrate between the attitude change processing bath and the plurality of batch processing baths.

6. The substrate processing apparatus according to claim 5, wherein, The plurality of batch processing baths include: A first batch processing bath, wherein the first batch processing bath performs batch processing on the substrate by supplying a second processing liquid to the substrate; and The second batch processing bath processes the substrate in batches by supplying a third processing solution to the substrate.

7. The substrate processing apparatus according to claim 4, wherein, The first process unit includes: An organic solvent processing unit is configured to perform a single-processing of the substrate by supplying an organic solvent to the substrate. A supercritical processing unit configured to perform a single-processing of the substrate by supplying a drying fluid to the substrate. A transfer processing unit configured to transfer the substrate between the buffer unit, the liquid processing unit, the organic solvent processing unit, and the supercritical processing unit.

8. The substrate processing apparatus according to claim 1, wherein, The first process unit includes a loading port unit, which is configured to include multiple loading ports. A portion of the plurality of loading ports is configured as a first loading port unit, at which the horizontally oriented substrate is loaded, and The remaining portion of the plurality of loading ports is configured as a second loading port unit, at which the substrate in the horizontal orientation is unloaded.

9. The substrate processing apparatus according to claim 2, wherein, The posture-changing robotic arm includes: Hand, the hand being configured to hold the substrate; and The arm moves the hand.

10. The substrate processing apparatus according to any one of claims 1 to 9, further comprising a controller, and in, The controller controls the substrate to perform the following sequentially: A substrate loading step, wherein the substrate loading step is used to load the horizontally oriented substrate into the loading port of the first process unit; A first single-processing step is used to process the horizontally oriented substrate in the liquid processing unit of the first process processing unit. The first posture change step is used to change the posture of the substrate from the horizontal posture to the vertical posture. A batch processing step, wherein the batch processing step is used to process the vertically oriented substrate in the second process processing unit; The second attitude change step is used to change the attitude of the substrate from the vertical attitude to the horizontal attitude. The second single-process step is used to process the substrate in the horizontal orientation in the first process unit. as well as The substrate unloading step is used to unload the horizontally oriented substrate into the loading port of the first process unit.

11. A substrate processing apparatus, the substrate processing apparatus comprising: A first process unit is configured to process a substrate using a single method. The second process unit is configured to process the substrate in a batch manner. The third process unit is configured to process the substrate using a single method. A first attitude change unit is disposed between the first process unit and the second process unit, and the first attitude change unit is configured to change the attitude of the substrate between a vertical attitude and a horizontal attitude. as well as A second attitude change unit is disposed between the second process unit and the third process unit, and the second attitude change unit is configured to change the attitude of the substrate between the vertical attitude and the horizontal attitude. The second process unit is disposed between the first process unit and the third process unit, and The substrate is configured to be loaded and unloaded in a single method; The second attitude change unit includes: A second attitude change processing bath, the second attitude change processing bath having a storage space for storing the substrate; and The second attitude change manipulator is used to take out the substrates stored in the storage space one by one and change the substrates in the vertical attitude stored in the second attitude change processing bath to the horizontal attitude for transfer to the second buffer unit, wherein the substrates are immersed in liquid supplied to the storage space. The second buffer unit is configured to store the substrate in the horizontal orientation; the surface of the substrate stored in the second buffer unit is wetted.

12. The substrate processing apparatus according to claim 11, wherein, The substrate is loaded into the first process unit, and the substrate is unloaded by the second process unit.

13. The substrate processing apparatus according to claim 11, wherein, The first process unit includes: A first loading port unit, comprising a plurality of loading ports, wherein the substrate in the horizontal orientation is loaded at the plurality of loading ports; A liquid processing unit configured to perform a single-processing operation on the horizontally oriented substrate by supplying a first processing liquid to the substrate; and A first buffer unit, configured to store the substrate in the horizontal orientation that has been processed in the liquid processing unit, and The third process unit includes: An organic solvent processing unit is configured to perform a single-processing of the substrate by supplying an organic solvent to the substrate. A drying unit configured to perform a single-step processing on the horizontally oriented substrate by supplying a drying liquid to the substrate; and The second buffer unit is configured to store the substrate in the horizontal orientation that has been individually processed at the organic solvent processing unit and the drying processing unit.

14. The substrate processing apparatus according to claim 13, wherein, The first attitude change unit includes: A first posture-changing manipulator is used to change the posture of the substrate between the vertical posture and the horizontal posture. A first attitude change processing bath, the first attitude change processing bath having a storage space for storing the substrate; and A first support member is positioned within the storage space of the first attitude change processing bath, and the first support member supports the substrate whose attitude has been changed to the vertical attitude by the first attitude change robot. Specifically, the first posture-changing robot arm changes the substrate, which is in the horizontal posture stored in the first buffer unit, to the vertical posture, and then transfers it to the first posture-changing processing bath.

15. The substrate processing apparatus according to claim 14, wherein, The second attitude change unit also includes: A second support member is positioned within the storage space of the second attitude change processing bath, and the second support member supports the substrate whose attitude is changed to the vertical attitude by the second attitude change robot.

16. The substrate processing apparatus according to claim 15, wherein, The second process unit includes: Multiple batch processing baths, the multiple batch processing baths being used to batch process the substrate; and A transfer unit is configured to transfer the substrate between the first attitude change processing bath, the second attitude change processing bath, and the plurality of batch processing baths. The plurality of batch processing baths include: A first batch processing bath, the first batch processing bath being used to batch process the substrate by supplying a second processing liquid to the substrate; and The second batch processing bath processes the substrate in batches by supplying a third processing solution to the substrate.

17. The substrate processing apparatus according to claim 11, wherein, The first posture changing unit includes a first posture changing manipulator, which changes the posture of the substrate from the horizontal posture to the vertical posture. Each of the first posture-changing manipulator and the second posture-changing manipulator includes: Hand, the hand being configured to hold the substrate; and The arm moves the hand.

18. The substrate processing apparatus according to any one of claims 11 to 17, wherein the substrate processing apparatus further comprises a controller, and in, The controller controls the substrate to perform the following sequentially: A substrate loading step, wherein the substrate loading step is used to load the horizontally oriented substrate into the loading port of the first process unit; A first single-process step is used to process the substrate in the horizontal orientation in the first process unit. as well as The first posture change step is used to change the posture of the substrate from the horizontal posture to the vertical posture. A batch processing step, wherein the batch processing step is used to process the vertically oriented substrate in the second process processing unit; The second attitude change step is used to change the attitude of the substrate from the vertical attitude to the horizontal attitude. The second single-process step is used to process the horizontally oriented substrate in the third process unit. as well as The substrate unloading step is used to unload the horizontally oriented substrate to the loading port of the third process unit.

19. The substrate processing apparatus according to claim 1 or 11, wherein, The vertical orientation refers to the orientation in which the top or bottom surface of the substrate is parallel to a direction perpendicular to the ground. The horizontal orientation refers to the orientation in which the top or bottom surface of the substrate is parallel to the ground.

20. The substrate processing apparatus according to claim 6 or 16, wherein, The first treatment solution is a removal solution for removing the oxide film on the substrate, the second treatment solution is a chemical for removing contaminants remaining on the substrate, and the third treatment solution is pure water.

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